Note the following details of the code protection feature on Microchip devices:
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
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hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
K
rfPIC and UNI/O are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.
logo, REAL ICE, rfLAB, Select Mode, Total
Endurance, TSHARC, UniWinDriver, WiperLock and ZENA
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available on-line help files.
®
IDE on-line help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. Items discussed in this chapter
include:
• Document Layout
• Conventions Used in this Guide
• The Microchip Web Site
• The Microchip Web Site
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation
Board as a development tool to emulate and debug firmware on a target board. The
manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the SC70-6 and
SOT-23-6/8 to DIP-8 Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with this evaluation board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the SC70-6
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
In addition, there is a Development Systems Information Line which lists the latest
versions of Microchip's development systems software products. This line also
provides information on how customers can receive currently available upgrade kits.
The Development Systems Information Line numbers are:
1-800-755-2345 – United States and most of Canada
1-480-792-7302 – Other International Locations
This chapter provides an overview of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation
Board and covers the following topics:
• What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board?
• What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board kit includes
1.2WHAT IS THE SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD?
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board allows the system designer to
quickly evaluate the operation of Microchip Technology’s devices in any of the following
packages:
•SC70-6
•SC70-5
•SC70-3
•SOT-23-8
•SOT-23-6
•SOT-23-5
•SOT-23-3
•DIP-8
The board has a 6-pin header (PICkit Serial, ICSP, etc.) that can be easily jumpered to
the device’s desired pins to communicate with the device (using PICkit Serial) or in the
case of PIC microcontrollers or EEPROM, programmed (using ICSP).
Figure 1-1 shows the top view of the PCB. The board allows the devices to easily be
jumpered into a desired circuit. Also, the SC70 and SOT-23 packages could be
converted to a DIP footprint. Each pad has a passive component footprint that is
connected to the VDD plane (RxU) and a second passive component footprint that is
connected to the VSS plane (RxD).
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board allows the system designer to
quickly evaluate the operation of devices. This board is generic so that any device, of
the appropriate footprint, may be installed. Refer to the device data sheet, however, for
suitability of device evaluation (noise, lead length, signal integrity, etc).
As well as the device, other desired passive components (resistors and capacitors) and
connection posts may be installed. This allows the board to evaluate a minimum
configuration for the device. Also, this allows the device to be easily jumpered into an
existing system.
The board also has a 6-pin interface (PICkit Serial, ICSP, BFMP, etc.) whose signals
can easily be jumpered to any of the device’s pins.
2.2FEATURES
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board has the following features:
• Connection terminals may be either through-hole or surface-mount
• Three package type footprints supported:
-SC70-6
-SC70-5
-SC70-3
-SOT-23-8
-SOT-23-6
-SOT-23-5
-SOT-23-3
- DIP-8 (300 millimeter spacing)
• Footprints for optional passive components (SMT 805 footprint) for:
- Power supply filtering (C
- Device bypass capacitor (RxD footprint for device pin connected to V
- Output filtering (RxD footprint)
- Output pull-up resistor (RxU footprint)
- Output pull-down resistor (RxD footprint)
- Output loading resistor (RxD footprint)
• Silk-screen area to write specifics of implemented circuit (on back of PCB), such
as MCP4018 10 kΩ
• Can be used for SC70 or SOT-23 to DIP-8 converter
• PICkit Serial Analyzer / PICkit 2 Programming (ICSP) Header
SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide
2.3GETTING STARTED
The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board is a blank PCB that allows the
user to configure the circuit to the exact requirements. The passive components use
the surface-mount 805 package layout.
This evaluation board supports the following Microchip product device families:
• A/D Converters (ADCs)
• Battery Management
•CAN
• Comparators
• D/A Converters (DACs)
• DC-to-DC Converters
• Digital Potentiometers (Digi-Pots)
• EEPROM Serial Memory
• Fan Controllers
•IrDA
•LIN
• Linear Regulators
• Operational Amplifiers (Op Amps)
• Piezoelectric Horn Driver
• Power MOSFET Drivers
• Programmable Gain Amplifiers (PGAs)
• Selectable Gain Amplifiers
• Smoke Detection Front End
• Switching Regulators
• Temperature Sensors
• Voltage References
• Voltage Supervisors and Detectors
•PICmicro
Figure 2-1 shows the evaluation board circuit. The pins on the 8-pin SOT-23-8 and DIP
devices are tied together (pin number to pin number). The pins of the6-pin SC70 and
SOT-23 devices are tied as if the DIP was a 6-pin DIP. This circuit allows each pin to
individually have any of the following: a pull-up resistor, a pull-down resistor (or a
loading/filtering capacitor). Power supply filtering capacitors are connected between
the VDD and VSS pads (C1 and C2).
The circuit has a 6-pin header that can be used for PICkit Serial communication as well
as PIC ICSP. The signals of this header would need to be jumpered to the appropriate
device signal.
wire jumpering
to connect the
PICkit Interface
to the selected
device
TP8
TP7
TP6
TP5
TP1
TP2
TP3
TP4
C1C2
VDD
VSS
TP1
R1U
R1D
TP2
R2U
R2D
TP7
R7U
R7D
TP8
R8U
R8D
SOT-23-6
(1, 2)
1
2
3
6
5
4
TP1
TP2
TP3
TP8
TP7
TP6
Note 1:The SC70 VDD (SOT-23 VSS) signal is connected to the DIP-8 VDD/VSS signal, and the SC70 VSS
(SOT-23 VDD) signal is connected to the DIP-8 VSS/VDD signal.
2:Only one of the SC70 or SOT-23 footprints may be populated at a give time.
3:The SC70-6 and SOT-23-8 footprints will be superimposed on the PCB due to the similarity of the
package lead width and lead pitch dimensions.
Installation and Operation
FIGURE 2-1:SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Circuit.