Microchip Technology SOT23-6, SC70-6, SOT23-8 User Manual

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SC70-6 and SOT23-6/8 to DIP-8

Evaluation Board

User’s Guide

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Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, K

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, PIC

logo, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

MCUs and dsPIC® DSCs, KEELOQ

code hopping

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SC70-6 AND SOT-23-6/8 TO DIP-8

EVALUATION BOARD USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 5

Chapter 1. Product Overview

1.1 Introduction ..................................................................................................... 9

1.2 What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board? ................. 9

1.3 What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Kit Includes . 10

Chapter 2. Installation and Operation

2.1 Introduction ................................................................................................... 11

2.2 Features ....................................................................................................... 11

2.3 Getting Started ............................................................................................. 12

2.4 SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Description ................. 15

Appendix A. Schematic and Layouts

A.1 Introduction .................................................................................................. 23

A.2 Schematics and PCB Layout ....................................................................... 23

Appendix B. Bill of Materials (BOM) Appendix C. Board Revision 1 Errata

C.1 Issue ............................................................................................................ 33

C.2 Solution ........................................................................................................ 33

C.3 How to Determine pCB Revision ................................................................. 33

C.4 Schematics and PCB Layout of Revision 1 ................................................. 33

Worldwide Sales and Service .................................................................................... 42

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NOTES:

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EVALUATION BOARD USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available on-line help files.

IDE on-line help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board as a development tool to emulate and debug firmware on a target board. The manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the SC70-6 and

SOT-23-6/8 to DIP-8 Evaluation Board.

• Chapter 2. “Installation and Operation” – Includes instructions on how to get

started with this evaluation board.

• Appendix A. “Schematic and Layouts” – Shows the schematic and layout

diagrams for the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board.

• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the SC70-6

and SOT-23-6/8 to DIP-8 Evaluation Board.

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe character: { | }

Ellipses... Replaces repeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the total number of digits, R is the radix and n is a digit.

Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’

Choice of mutually exclusive arguments; an OR selection

Represents code supplied by user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options] errorlevel {0|1}

var_name...] void main (void)

{ ... }

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THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line Customers should contact their distributor, representative or field application engineer

(FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://support.microchip.com In addition, there is a Development Systems Information Line which lists the latest

versions of Microchip's development systems software products. This line also provides information on how customers can receive currently available upgrade kits.

The Development Systems Information Line numbers are: 1-800-755-2345 – United States and most of Canada 1-480-792-7302 – Other International Locations

Preface

DOCUMENT REVISION HISTORY

Revision A (October 2009)

• Initial Release of this Document.

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NOTES:

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EVALUATION BOARD USER’S GUIDE

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board and covers the following topics:

• What is the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board?

• What the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board kit includes

1.2 WHAT IS THE SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD?

The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board allows the system designer to quickly evaluate the operation of Microchip Technology’s devices in any of the following packages:

•SC70-6

•SC70-5

•SC70-3

•SOT-23-8

•SOT-23-6

•SOT-23-5

•SOT-23-3

•DIP-8 The board has a 6-pin header (PICkit Serial, ICSP, etc.) that can be easily jumpered to

the device’s desired pins to communicate with the device (using PICkit Serial) or in the case of PIC microcontrollers or EEPROM, programmed (using ICSP).

Figure 1-1 shows the top view of the PCB. The board allows the devices to easily be jumpered into a desired circuit. Also, the SC70 and SOT-23 packages could be converted to a DIP footprint. Each pad has a passive component footprint that is connected to the VDD plane (RxU) and a second passive component footprint that is connected to the VSS plane (RxD).

FIGURE 1-1: PCB Top View.

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

Devices from the following Microchip product families can be installed into this PCB:

• A/D Converters (ADCs)

• Battery Management

•CAN

• Comparators

• D/A Converters (DACs)

• DC-to-DC Converters

• Digital Potentiometers (Digi-Pots)

• EEPROM Serial Memory

• Fan Controllers

•IrDA

•LIN

• Linear Regulators

• Operational Amplifiers (Op Amps)

• Piezoelectric Horn Driver

• Power MOSFET Drivers

• Programmable Gain Amplifiers (PGAs)

• Selectable Gain Amplifiers

• Smoke Detection Front End

• Switching Regulators

• Temperature Sensors

• Voltage References

• Voltage Supervisors and Detectors

•PICmicro

Microcontrollers

1.3 WHAT THE SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD KIT INCLUDES

This SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board kit includes:

• SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board, 102-00273

• Important Information Sheet

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Chapter 2. Installation and Operation

2.1 INTRODUCTION

The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board allows the system designer to quickly evaluate the operation of devices. This board is generic so that any device, of the appropriate footprint, may be installed. Refer to the device data sheet, however, for suitability of device evaluation (noise, lead length, signal integrity, etc).

As well as the device, other desired passive components (resistors and capacitors) and connection posts may be installed. This allows the board to evaluate a minimum configuration for the device. Also, this allows the device to be easily jumpered into an existing system.

The board also has a 6-pin interface (PICkit Serial, ICSP, BFMP, etc.) whose signals can easily be jumpered to any of the device’s pins.

2.2 FEATURES

The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board has the following features:

• Connection terminals may be either through-hole or surface-mount

• Three package type footprints supported:

-SC70-6

-SC70-5

-SC70-3

-SOT-23-8

-SOT-23-6

-SOT-23-5

-SOT-23-3

- DIP-8 (300 millimeter spacing)

• Footprints for optional passive components (SMT 805 footprint) for:

- Power supply filtering (C

- Device bypass capacitor (RxD footprint for device pin connected to V

- Output filtering (RxD footprint)

- Output pull-up resistor (RxU footprint)

- Output pull-down resistor (RxD footprint)

- Output loading resistor (RxD footprint)

• Silk-screen area to write specifics of implemented circuit (on back of PCB), such as MCP4018 10 kΩ

• Can be used for SC70 or SOT-23 to DIP-8 converter

• PICkit Serial Analyzer / PICkit 2 Programming (ICSP) Header

SC70-6 AND SOT-23-6/8 TO DIP-8

EVALUATION BOARD USER’S GUIDE

and C2 footprints)

)

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

2.3 GETTING STARTED

The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board is a blank PCB that allows the user to configure the circuit to the exact requirements. The passive components use the surface-mount 805 package layout.

This evaluation board supports the following Microchip product device families:

• A/D Converters (ADCs)

• Battery Management

•CAN

• Comparators

• D/A Converters (DACs)

• DC-to-DC Converters

• Digital Potentiometers (Digi-Pots)

• EEPROM Serial Memory

• Fan Controllers

•IrDA

•LIN

• Linear Regulators

• Operational Amplifiers (Op Amps)

• Piezoelectric Horn Driver

• Power MOSFET Drivers

• Programmable Gain Amplifiers (PGAs)

• Selectable Gain Amplifiers

• Smoke Detection Front End

• Switching Regulators

• Temperature Sensors

• Voltage References

• Voltage Supervisors and Detectors

•PICmicro Figure 2-1 shows the evaluation board circuit. The pins on the 8-pin SOT-23-8 and DIP

devices are tied together (pin number to pin number). The pins of the6-pin SC70 and SOT-23 devices are tied as if the DIP was a 6-pin DIP. This circuit allows each pin to individually have any of the following: a pull-up resistor, a pull-down resistor (or a loading/filtering capacitor). Power supply filtering capacitors are connected between the VDD and VSS pads (C1 and C2).

The circuit has a 6-pin header that can be used for PICkit Serial communication as well as PIC ICSP. The signals of this header would need to be jumpered to the appropriate device signal.

Microcontrollers

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SC70-6

(1, 2)

DIP-8

(1)

NC VDD V

SDA SCL NC

PICkit

SOT-23-8

(1, 2)

Requires blue

Serial

Interface

wire jumpering to connect the PICkit Interface to the selected device

TP8

TP7

TP6

TP5

TP1 TP2

TP3

TP4

C1 C2

VDD

VSS

TP1

R1U

R1D

TP2

R2U

R2D

TP7

R7U

R7D

TP8

R8U

R8D

SOT-23-6

(1, 2)

TP1

TP2

TP3

TP8

TP7

TP6

Note 1: The SC70 VDD (SOT-23 VSS) signal is connected to the DIP-8 VDD/VSS signal, and the SC70 VSS

(SOT-23 VDD) signal is connected to the DIP-8 VSS/VDD signal.

2: Only one of the SC70 or SOT-23 footprints may be populated at a give time. 3: The SC70-6 and SOT-23-8 footprints will be superimposed on the PCB due to the similarity of the

package lead width and lead pitch dimensions.

Installation and Operation

FIGURE 2-1: SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Circuit.

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

2.3.1 The Hardware

Figure 2-2 shows the component layout of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. This is a small four-layer board (1.43" x 1.255" (36.322 mm x

31.877 mm)). There are ten connection points/pads that can use either through-hole or surface-mount connector posts.

The pad labeled VDD is connected to the PCB power plane, while the pad labeled VSS is connected to the PCB ground plane. All the passive components that are connected to VDD or VSS are connected to either the power plane or ground plane.

The eight remaining PCB pads correspond to the device pins (i.e.; pad 1 connects to pin 1).

Each pad has two passive components associated with them: a pull-up resistor and a pull-down resistor. The pull-up resistor is always RXU and the pull-down resistor is RXD. The “X” is a numeric value that corresponds to a particular pad (1 to 8). As an example, Pad 5’s pull-up resistor is R5U. Capacitor C1 and C2 are the power supply filtering capacitors. For whichever pin is the device’s VDD, the RxD component footprint can be used for the device’s bypass capacitor. Table 2-1 describes the components.

A 6-pin header interface is available to support the PICkit Serial or the PICmicro In-Circuit Serial Programming (ICSP) interface. For additional information, refer to

Section 2.4.5 “PICkit Serial or In-Circuit Serial Programming (ICSP) Interface (Header J1)”.

FIGURE 2-2: SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board Layout.

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Installation and Operation

Jumpering to VSS

Jumpering to VDD

0 Ω

TABLE 2-1: OPTIONAL PASSIVE COMPONENTS

Component Comment

C1, C2 Power supply bypass capacitors R1U, R2U, R3U, R4U, R5U, R6U, R7U, R8U Pull-up resistor R1D, R2D, R3D, R4D, R5D, R6D, R7D, R8D Pull-down resistor Note 1: Whichever pin is the device’s VDD pin, that corresponding RXD footprint can be

used for the device’s bypass capacitor. So if Pin 8 is the device’s VDD pin, then install the bypass capacitor in the R8D footprint.

2: All passive components use the surface mount 805 footprint

(2)

(1)

2.4 SC70-6 AND SOT-23-6/8 TO DIP-8 EVALUATION BOARD DESCRIPTION

The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board PCB is designed to be flexible in the type of device evaluation that can be implemented.

The following sections describe each element of this evaluation board in further detail. Refer to Figure 2-3.

2.4.1 Power and Ground

The SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board has a VDD Pad and a VSS pad. These pads can have connection posts installed that allows easy connection to the power (V surface-mount connectors.

The power and ground planes are connected to the appropriate passive components on the PCB (such as power plane to RXU and ground plane to RXD components).

) and ground (VSS) planes. The layout allows either through-hole or

2.4.2 PCB PADs

For each package pin (pins 1 to 8), there is a PCB pad (pads 1 to 8). The device will have some power pins (V PCB, vias to the power and ground plane have been installed close to each PCB pad. This allows any pad to be connected to the power or ground plane (see Figure 2-3). So when power is connected to the VDD and VSS pads, the power is connected to the appropriate device pin.

) and some ground pins (VSS). To ease connections on the

FIGURE 2-3: Connecting the PCB pad to either VDD or VSS.

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

SOT-23-8 Footprint

SC70 Footprint

2.4.3 Passive Components (RXU, RXD, C1, and C2)

The footprints for these components are present to allow maximum flexibility in the use of this PCB to evaluate a wide range of devices. The purpose of these components may vary depending on the device under evaluation and how it is to be used in the desired circuit. Refer to the device data sheet for the recommended components that should be used when evaluating that device.

• Component RXU allows a pull-up resistor to be installed for the device pin

• Component RXD allows a pull-down resistor or a a capacitive load/filter to be installed for the device pin

• Component C1 and C2 allows power supply filtering capacitors to be installed

2.4.4 Device Footprints

This section describes the characteristics of the component footprints so that you are better able to determine if the desired component(s) will be compatible with the board.

2.4.4.1 SC70-6 AND SOT-23-8

The 6-pin SC70 footprint has been superimposed on the 8-pin SOT-23 footprint. Figure 2-4 shows how the SC70-6 and the SOT-23-8 footprint have been superimposed. This was done since the pin pitch and width are identical for these two packages. Only the body width is different (the SC70 is narrower).

The 6-pin SC70 and 8-pin SOT-23 footprint is laid out for packages that have a typical pitch of 0.65 mm (BSC), a maximum lead width of 0.30 mm.

The 6-pin SC70 footprint has a molded package width of 1.25 mm (BSC), while the 8-pin SOT-23 footprint has a maximum molded package width of 1.75 mm.

Packages that meet these characteristics should be able to be used with this board.

FIGURE 2-4: Superimposing of SC70-6 and SOT-23-8 Footprints.

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Installation and Operation

2.4.4.2 SOT-23-6

The 6-pin SOT-23 footprint is laid out for packages that have a typical pitch of 0.65 mm (BSC), a maximum lead width of 0.45 mm, and a maximum molded package width of

1.75 mm. Six lead SOT-23 packages that meet these characteristics should be able to be used with this board.

2.4.4.3 DIP-8

The 8-pin DIP footprint is laid out for packages that have a typical pitch of 100 mil (BSC), a maximum lead width of 22 mil, and a molded package width of 300 mil. 8-lead SOT-23 packages that meet these characteristics should be able to be used with this board.

2.4.4.4 PASSIVE COMPONENTS

All passive components (RXU, RXD, and CX) use a surface mount 805 footprint. Any component that has a compatible footprint could be used with this board.

2.4.4.5 HEADER (1X6)

The header has a typical pitch of 100 mil (BSC). This header is designed to be compatible with the PICkit Serial Analyzer and PICkit 2 Programmer.

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

Top-Layer Traces

Bottom-Layer Traces

Ground Plane

Power Plane

Note: Silk Screen on Top Layer

indicates PICkit Serial I

C signals, while Silk Screen on Bottom Layer indicates PICkit Serial SPI signals.

2.4.5 PICkit Serial or In-Circuit Serial Programming (ICSP) Interface (Header J1)

Figure 2-5 shows the interface connection of Header J1. The VDD and VSS signals are connected to the appropriate power or ground plane. The other four signals are open and can be easily jumpered to any of the eight P1 through P8 connection points.

FIGURE 2-5: PICkit Serial / ICSP Interface Connections.

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Installation and Operation

2.4.5.1 PICKIT SERIAL INTERFACE

Table 2-2 shows the pin number assignment for the different signals for each of the supported interface protocols (SPI, I

C, etc.)

TABLE 2-2: PICKIT SERIAL HEADER SIGNALS

Number

1 CS — TX CS TX 2 VDD VDD VDD VDD — 3 VSS VSS VSS VSS VSS 4 SDI SDA — SDI CS/WAKE 5 SCK SCL — SCK FAULT/TXE 6 SDO — RX SDO RX

SPI I

PICkit Serial Header Signal

CUSARTMicrowireLIN

Comments

2.4.5.2 ICSP INTERFACE

The ICSP interface allows a PICmicro MCU device to be programmed with programmers that support this interface, such as the PICkit 2 programmer (part number PG164120). Table 2-3 shows the pin number assignment for the ICSP signals.

TABLE 2-3: ICSP HEADER SIGNALS

Number

1 VPP High Voltage Signal 2VDD 3VSS 4 DT ICSP™ Data 5 CLK ICSP™ Clock 6—

ICSP Signal Comments

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

Required “Jumpers” for PICkit Serial operation.

2.4.6 Evaluating the MCP4018 Device (A Digital Potentiometer with

C interface)

The MCP4018 is a Digital Potentiometer that is in a 6-lead SC70 package with an I2C serial interface. This allows the device to be communicated to (Read and Write) by the PICkit Serial Analyzer. For this to occur, the PICkit Serial Analyzer signals must be connected to the correct MCP4018 signals. These connections are shown in Figure 2-6.

Other Digital Potentiometers that are supported by this evaluation board are shown in Ta bl e 2 -4 .

FIGURE 2-6: PICkit Serial / ICSP Header and Example Connections (for MCP4018 - I

C interface).

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Installation and Operation

Required “Jumpers” connections for PICkit Serial operation.

Top Layer View

Bottom Layer View

2.4.7 Evaluating the MCP41X2 Device (A Digital Potentiometer with SPI interface)

The MCP41X2 is a Digital Potentiometer that is in a 8-lead DIP package with an SPI serial interface. This allows the device to be communicated to (Read and Write) by the PICkit Serial Analyzer. For this to occur, the PICkit Serial Analyzer signals must be connected to the correct MCP41X2 signals. These connections are shown in Figure 2-7.

Other Digital Potentiometers that are supported by this evaluation board are shown in Ta bl e 2 -4 .

FIGURE 2-7: PICkit Serial / ICSP Header and Example Connections (for MCP41X2 - SPI Interface).

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

2.4.8 The PCB as a SC70, SOT-23 to DIP Socket Converter

There may be occasions when it is desirable to convert the footprint of the device to that of a DIP package. This allows the device to be installed into an existing DIP socket. Two 1x4 row pins need to be installed into the PCB’s DIP footprint (on the bottom) when the device is installed into the appropriate package footprint.

This allows the PCB to convert the SC70 and SOT-23 footprints to a 300-mil DIP-8 footprint.

TABLE 2-4: SUPPORTED DIGITAL POTENTIOMETERS

Device SC70 SOT-23 DIP Comment

MCP4012 — Yes — SOT-23-6, uses Up/Down interface MCP4013 — Yes — SOT-23-6, uses Up/Down interface MCP4014 — Yes — SOT-23-5, uses Up/Down interface MCP4017 Yes — — MCP40D17 Yes — — MCP4018 Yes — — MCP40D18 Yes — — MCP4019 Yes — — MCP40D19 Yes — — MCP4022 — Yes — SOT-23-6, uses Up/Down interface MCP4023 — Yes — SOT-23-6, uses Up/Down interface MCP4024 — Yes — SOT-23-5, uses Up/Down interface MCP4131 — — Yes Has multiplexed SDI/SDO MCP4132 ——Yes MCP4141 — — Yes Has multiplexed SDI/SDO MCP4142 ——Yes MCP4151 — — Yes Has multiplexed SDI/SDO MCP4152 ——Yes MCP4161 — — Yes Has multiplexed SDI/SDO MCP4162 ——Yes MCP41010 ——Yes MCP41050 ——Yes MCP41100 ——Yes

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SC70-6 AND SOT-23-6/8 TO DIP-8

Top Layer Ground Layer Power Layer Bottom Layer

EVALUATION BOARD USER’S GUIDE

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the schematics and layouts for the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. Diagrams included in this appendix:

• Board - Schematic

• Board - Top Trace, Silk and Pads

• Board - Bottom Trace & Pads

• Board - Layer 2 Ground Plane

• Board - Layer 3 Power Plane

• Board - Bottom Silk, Trace and Pads

A.2 SCHEMATICS AND PCB LAYOUT

Board - Schematic shows the schematic of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. The layer order is shown in Figure A-1.

FIGURE A-1: Layer Order.

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

A.2.1 Board - Schematic

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A.2.2 Board - Top Trace, Silk and Pads

Schematic and Layouts

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

A.2.3 Board - Bottom Trace & Pads

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A.2.4 Board - Layer 2 Ground Plane

Schematic and Layouts

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A.2.5 Board - Layer 3 Power Plane

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A.2.6 Board - Bottom Silk, Trace and Pads

Schematic and Layouts

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NOTES:

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SC70-6 AND SOT-23-6/8 TO DIP-8

EVALUATION BOARD USER’S GUIDE

Appendix B. Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS

Qty Reference Description Manufacturer Part Number

1 PCB RoHS Compliant Bare PCB, SC70-6 and-

SOT-23-6/8 to DIP-8 Evaluation Board

0 C1, C2 Device Power Supply inltering Capacitor

Surface-mount (805 package) (Optional - Application-dependent)

0 J1 PICkit Serial or BFMP Header

(6-pin, 100 mil spacing)

0 P1, P2, P3, P4,

P5, P6, P7, P8,

, VSS

0 P1, P2, P3, P4,

P5, P6, P7, P8, V

, VSS

0 R1U, R2U, R3U,

R4U, R5U, R6U, R7U, R8U

0 R3A, R3B, R3C,

R3D, R3E, R3F, R3G, R3H

0 U1 SC70-6 Device (supports SC70-5 and SC70-3

0 U2 SOT23-8 Device — User-specified 0 U3 DIP-8 Device — User-specified 0 U4 SOT23-6 Device (Supports SOT23-5 and

Note 1: These footprints could be used for pin signal filtering by using a capacitor.

2: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components

Through-hole connector(s) for P1, P2, P3, P4, P5, P6, P7, P8, VDD, VSS

Surface-mount connector(s) for P1, P2, P3, P4, P5, P6, P7, P8, VDD, VSS

Pin Pull-up resistor Surface-mount (805 package) (Optional - Application-dependent)

Pin Pull-down resistor Surface-mount (805 package) (Optional - Application-dependent)

devices)

SOT23-3 devices)

(1)

Microchip Technology Inc.

— User-specified

——

Keystone Electronics

— User-specified

104-00273

5012

5016

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NOTES:

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Top Layer Ground Layer Power Layer Bottom Layer

EVALUATION BOARD USER’S GUIDE

Appendix C. Board Revision 1 Errata

C.1 ISSUE

The Revision 1 of this PCB has an issue when the PICkit Serial / ICSP Interface Header (J1) pin 1 is incorrectly assigned to the PICkit Serials pin 6. This means that the orientation marker on the PCB are incorrect for the PICkit Serial Analyzer.

C.2 SOLUTION

Orientate the PICkit Serial Analyzer pin 1 to the PCB pin 6. Revision 2 of the Schematic and PCB addresses this issue.

C.3 HOW TO DETERMINE PCB REVISION

Look at the bottom layer of the board (see Figure C.4.5), in the bottom right corner. You will see some text, 104-00273-R1. The R1 indicates that the PCB is Revision 1.

C.4 SCHEMATICS AND PCB LAYOUT OF REVISION 1

Board - Schematic - Revision 1 shows the schematic of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board.

Board - Revision 1 - Top Layer and Silk shows the layout for the top layer of the SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board. The layer order is shown in Figure C-1.

FIGURE C-1: Layer Order.

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C.4.1 Board - Schematic - Revision 1

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Board Revision 1 Errata

C.4.2 Board - Revision 1 - Layout Components and Silk

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

C.4.3 Board - Revision 1 - Top Layer and Silk

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C.4.4 Board - Revision 1 - Bottom Layer

Board Revision 1 Errata

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

C.4.5 Board - Revision 1 - Power Plane

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C.4.6 Board - Revision 1 - Ground Plane

Board Revision 1 Errata

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SC70-6 and SOT-23-6/8 to DIP-8 Evaluation Board User’s Guide

C.4.7 Board - Revision 1 - Bottom

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NOTES:

Board Revision 1 Errata

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03/26/09

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