Microchip Technology SAM L10, SAM L1, SAM L11 Xplained Pro, SAM L10 Xplained Pro User Manual

SAM L10/L11 Xplained Pro User Guide

Preface

The Microchip® SAM L10 and SAM L11 Xplained Pro evaluation kits are hardware platforms for
evaluating the SAM L10/L11 microcontrollers (MCUs). Each kit is supported by the Atmel Studio
integrated development platform, which provides an easy access to the features of the microcontroller.
The Xplained Pro MCU series evaluation kits include an on-board embedded debugger, hence external
tools are not required to program or debug the microcontroller. The Xplained Pro extension kit offers
additional peripherals to extend the features of the board and ease the development of custom designs.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 1

Table of Contents

Preface............................................................................................................................ 1

1. Introduction................................................................................................................3

1.1. Features....................................................................................................................................... 3

1.2. Kit Overview................................................................................................................................. 3

2. Getting Started.......................................................................................................... 5

3. Xplained Pro.............................................................................................................. 6

3.1. Embedded Debugger................................................................................................................... 6

3.2. Xplained Pro Analog Module........................................................................................................7

3.3. Hardware Identification System....................................................................................................8

3.4. Power Sources............................................................................................................................. 9

3.5. Xplained Pro Headers and Connectors........................................................................................9

4. Hardware User Guide..............................................................................................12

4.1. Connectors................................................................................................................................. 12

4.2. Peripherals................................................................................................................................. 17

4.3. Embedded Debugger Implementation........................................................................................18

5. XAM Configuration.................................................................................................. 21

6. Identifying Product ID and Revision........................................................................ 23

7. Revision History.......................................................................................................24

The Microchip Web Site................................................................................................ 25

Customer Change Notification Service..........................................................................25

Customer Support......................................................................................................... 25

Microchip Devices Code Protection Feature................................................................. 25

Legal Notice...................................................................................................................26

Trademarks................................................................................................................... 26

Quality Management System Certified by DNV.............................................................27

Worldwide Sales and Service........................................................................................28

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 2

1. Introduction

1.1 Features

The following are key features of the board:

• ATSAML10E16A-AU/ATSAML11E16A-AU microcontrollers

• One mechanical reset button

• One mechanical programmable button

• One QTouch® button

• One user LED (yellow)

• 32.768 kHz crystal

• ATECC508A CryptoAuthentication™ IC

• Two Xplained Pro extension headers

• mikroBUS™ header

• X32 header

• Embedded debugger

– Auto ID for board identification in Atmel Studio

– One status LED (yellow)

– One board power LED (green)

– Symbolic debug of complex data types, including scope information

– Programming and debugging, including power measurements

– Data Gateway Interface: SPI, I2C, four GPIOs

– Virtual COM port (CDC)

• Embedded current measurement circuitry with Atmel Data Visualizer support for data visualization

• USB powered

Introduction

1.2 Kit Overview

The Microchip SAM L10 and SAM L11 Xplained Pro Evaluation kits are hardware platforms for the
evaluation of the Microchip SAM L10/L11 devices.

The Evaluation kit part numbers are as follows:

• SAM L10 Xplained Pro: DM320204

• SAM L11 Xplained Pro: DM320205

The kit offers a set of features that enables the user to get started with the microcontroller peripherals
immediately and to obtain an understanding of how to integrate the device in their required design.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 3

Figure 1-1. SAM L10 Xplained Pro Evaluation Kit Overview

Introduction

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 4

2. Getting Started

Follow these steps to explore the Microchip Xplained Pro platform:

1. Download Atmel Studio.

2. Launch Atmel Studio.

3. Connect the debug USB port on the kit to the computer using a USB cable (Standard-A to Micro-B
or Micro-AB).

When the Xplained Pro MCU kit is connected to the computer for the first time, the operating system will
install the software driver. The driver file supports both the 32-bit and 64-bit versions of Microsoft
Windows®XP, Windows Vista®, Windows 7, Windows 8, and Windows 10.

When the Xplained Pro MCU board is powered, the power LED (green) will glow and Atmel Studio will
autodetect the specific Xplained Pro MCU and extension boards that are connected to it. Atmel Studio will
present relevant information, such as datasheets and kit documentation.

The SAM L10/L11 devices are programmed and debugged by the on-board embedded debugger,
therefore, no external programmer or debugger tool is required.

Getting Started

®

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 5

3. Xplained Pro

The Xplained Pro is an evaluation platform that provides the full Microchip microcontroller experience.

The platform consists of a series of Microcontrollers (MCUs) and extension boards. These are integrated
with Atmel Studio, which contains Advanced Software Framework (ASF) drivers, demo code, support
data streaming, and so on.

The Xplained Pro MCU boards support a wide range of Xplained Pro extension boards, and are
connected through a set of standardized headers and connectors. Each extension board has an
identification (ID) chip to uniquely identify which boards are connected to an Xplained Pro MCU board.
This information is used to present relevant user guides, application notes, data sheets, and example
code through Atmel Studio.

3.1 Embedded Debugger

The Xplained Pro contains the Microchip Embedded Debugger (EDBG) for on-board debugging. The
EDBG is a complex USB device with three interfaces, such as a debugger, virtual COM port, and a data
gateway interface (DGI). Together with Atmel Studio, the EDBG debugger interface can program and
debug the microcontroller. On the SAM L10/SAM L11 Xplained Pro, the SWD interface is connected
between the EDBG and the microcontroller.

Xplained Pro

The virtual COM Port is connected to a UART on the microcontroller and provides a straightforward way
to communicate with the target application through terminal software. It offers variable baud rate, parity,
and stop bit settings. Note that the settings on the microcontroller must match the settings given in the
terminal software.

Note:  The virtual COM port in the EDBG requires the terminal software to set the data terminal ready
(DTR) signal to enable the UART pins connected to the microcontroller. If the DTR signal is not enabled,
the UART pins on the EDBG is kept in high-z (tristate), rendering the COM port unusable. The DTR signal
is set automatically by some terminal software, but it must be manually enabled in the terminal.

The DGI consists of several physical interfaces for communication with the host computer.
Communication over the interfaces is bidirectional. It can be used to send events and values from the
microcontroller or as a generic printf-style data channel. Traffic over the interfaces can be time stamped
on the EDBG for accurate tracing of events. Timestamping imposes an overhead that reduces maximum
throughput. The Atmel Data Visualizer Extension, installed with Atmel Studio, is used to send and receive
data through DGI.

The EDBG controls two LEDs on the SAM L10/SAM L11 Xplained Pro: a power LED and a status LED.
The following table provides how the LEDs are controlled in different operation modes.

Table 3-1. EDBG LED Control

Operation Mode Power LED Status LED

Normal Operation Power LED is lit when power is

applied to the board.

Activity indicator, LED flashes
when any communication
happens to the EDBG.

Bootloader Mode (idle) The power LED and the status LED blink simultaneously.

Bootloader Mode (firmware
upgrade)

© 2018 Microchip Technology Inc.

The power LED and the status LED blink in an alternating pattern.

User Guide

DS70005359B-page 6

For further documentation on the EDBG, refer to the Microchip EDBG User Guide.

3.2 Xplained Pro Analog Module

3.2.1 Overview

The Xplained Pro Analog Module (XAM) extends the embedded debugger with high dynamic range
current measurement, and this enables the power profiling of the target system.

Figure 3-1. Xplained Pro Analog Module (XAM)

Xplained Pro

The XAM consists of these following key features:

• Calibration circuitry

• Voltage reference

• Analog frontend

– Shunt resistors with a range selection switch

– Pre-amplifier

– Two active filters with gain

• Control MCU

– Analog-to-Digital Converter (ADC)

– Signal processing

– Control/communication interface to the EDBG

The current measurement frontend is a high-side shunt measurement with a pre-amplifier, and a second
active filter stage with gain. The wide dynamic range is achieved by four measurement ranges which are
defined by two shunts, and the two parallel second stage active filters with gain.

3.2.2 EDBG Interface

The Xplained Pro Analog Module (XAM) is connected to the EDBG with the following interfaces:

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 7

• I2C: This is used to control and configure the XAM.

• SPI: Current measurement data is streamed to the EDBG through this interface. This is a one-way
data transfer channel from the XAM to the EDBG.

• SWD: The MCU in the XAM is programmed through SWD from the EDBG.

• GPIO: At least one GPIO, that is connected to the EDBG from the target MCU, is also connected to
the current measurement unit to enable the user to sync current measurements with their
application.

• Clock sync: Synchronization signal to synchronize ADC measurements with EDBG.

3.2.3 Sample Rate

The raw sampling rate of the Xplained Pro analog module (XAM) is up to 250 kHz and with the default
averaging configuration (average of 16 samples). The actual output of the XAM is 16.67 kSPS, and the
XAM output sample rate is not an integer fraction of the raw sampling.

3.2.4 Measurement Ranges and Accuracy

The Xplained Pro analog module has four measurement ranges. These are defined by two shunt
resistors and two gain stages.

Table 3-2. Xplained Pro Analog Module Measurement Ranges and Accuracy

Xplained Pro

Measurement
Range

Range 1 Low-current shunt and

Range 2 Low-current shunt and

Range 3 High-current shunt and

Range 4 High current shunt and

The ranges are switched automatically by the XAM to achieve best measurement results and the current
active range is visualized in the Microchip Data Visualizer frontend tool. The maximum voltage drop over
the shunt resistor is 100 mV, and the XAM will switch the range automatically before this limit is reached.

Hardware Resolution Accuracy Comments

high-gain stage

low-gain stage

high-gain stage

low gain stage

3.3 Hardware Identification System

All Xplained Pro compatible extension boards have one Microchip ATSHA204 CryptoAuthentication
chip. This chip contains information that identifies the extension with its name and some extra data.

20 nA 1 LSB ±1% Below 1 µA the error will

increase. Typical error for 300
nA is 1 LSB ±10%

150 nA 1 LSB ±1% -

10 μA 1 LSB ±1% -

100 μA 1 LSB ±1% Above 100 mA the error will

increase to 1 LSB ±5% at 400
mA. Maximum current is 400
mA

™

When Xplained Pro extension is connected to the Xplained Pro MCU board, the information is read and
sent to Atmel Studio.

The Microchip Kits extension, installed with Atmel Studio, will give relevant information, code examples,
and links to relevant documents.

The following table provides the data fields stored in the ID chip with example content.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 8

Table 3-3. Xplained Pro ID Chip Content

Data Field Data Type Example Content

Manufacturer ASCII string Atmel’\0’

Product Name ASCII string Segment LCD1 Xplained Pro’\0’

Product Revision ASCII string 02’\0’

Product Serial Number ASCII string 1774020200000010’\0’

Minimum Voltage [mV] uint16_t 3000

Maximum Voltage [mV] uint16_t 3600

Maximum Current [mA] uint16_t 30

3.4 Power Sources

The SAM L10/SAM L11 Xplained Pro kits can be powered by several power sources as listed in the
following table.

Xplained Pro

Table 3-4. Power Sources for SAM L10/SAM L11 Xplained Pro

Power Input Voltage Requirements Current Requirements Connector

External Power 4.3V to 5.5V . Recommended maximum is 2A due

Embedded
Debugger

The kit will automatically detect the available power sources and choose which one to use according to
the following priority:

• External power

• Embedded debugger USB

Note:  External power is required when 500 mA from a USB connector is not sufficient to power the
board with possible extension boards.

4.4V to 5.25V (according to
USB specifications).

3.5 Xplained Pro Headers and Connectors

3.5.1 Xplained Pro Standard Extension Header

All Xplained Pro kits have many dual row, 20-pin, 100 mil extension headers. The Xplained Pro MCU
boards have male headers, while Xplained Pro extensions have their female counterparts. All pins are not
always connected, and the connected pins follow the defined pin-out descriptions given in the following
table.

to the input protection maximum
current specification.

500 mA (according to USB
specifications)

Marking

PWR

DEBUG USB

The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained Pro MCU
boards, or to access the pins of the target MCU on Xplained Pro MCU boards directly.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 9

Xplained Pro

Table 3-5. Xplained Pro Standard Extension Header

Pin Number Name Description

1 ID_EXTx Communication line to the ID chip on an extension board EXTx

2 GND Ground

3 ADC(+) Analog-to-Digital Converter (ADC) alternatively positive part of

differential ADC

4 ADC(-) ADC alternatively negative part of differential ADC

5 GPIO General purpose I/O

6 GPIO General purpose I/O

7 PWM(+) Pulse Width (PWM) alternatively positive part of differential PWM

8 PWM(-) PWM alternatively negative part of differential PWM

9 IRQ/GPIO Interrupt Request Line and/or general purpose I/O

10 SPI_SS_B/GPIO Slave Select for SPI and/or general purpose I/O

11 TWI_SDA Data line for I²C interface

12 TWI_SCL Clock line for I²C interface

13 UART_RX Receiver line of target device UART

14 UART_TX Transmitter line of target device UART

15 SPI_SS_A Slave Select for SPI. Should preferably be unique.

16 SPI_MOSI Master out slave in line of serial peripheral interface

17 SPI_MISO Master in slave out line of serial peripheral interface

18 SPI_SCK Clock for SPI. Always implemented, bus type.

19 GND Ground

20 VCC Power for extension board

3.5.2 Xplained Pro Power Header

The power header (PWR) can be used to connect external power to the SAM L10/SAM L11 Xplained Pro
kit. The kit will automatically detect and switch to any external power if supplied. The power header can
also be used as a supply for external peripherals or extension boards. Care must be taken not to exceed
the total current limitation of the on-board regulator when using the 3.3V pin.

Table 3-6. Xplained Pro Power Header (PWR)

Pin Number Pin Name Description Connector Marking

1 VCC_EXT_P5V0 External 5V input 5.0V IN

2 GND Ground GND

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 10

Xplained Pro

Pin Number Pin Name Description Connector Marking

3 VCC_MUX_P5V0 Unregulated 5V (output, derived from one of

the input sources)

4 VCC_TARGET_P3V3 Regulated 3.3V (output, used as main

power supply for the kit)

5.0V

VCC

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 11

4. Hardware User Guide

4.1 Connectors

The following sections describe the implementation of the different connectors and headers on the SAM
L10/SAM L11 Xplained Pro and their connections to the SAM L10/L11.

The tables below describe which signals are shared between the headers and on-board functionality.

The following figure shows available connectors and jumpers on the SAM L10/SAM L11 Xplained Pro.

Figure 4-1. Xplain Pro Connectors

Hardware User Guide

4.1.1 Xplained Pro Extension Headers

The SAM L10/SAM L11 Xplained Pro headers, EXT1 and EXT2, offer access to the I/O of the
microcontroller to expand the board by connecting extensions. These headers are based on the standard
extension header specified in the following table. The headers have a pitch of 2.54 mm.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 12

Table 4-1. Extension Header EXT1

Hardware User Guide

EXT1 pin

1 [ID] - - - Communication line to the ID Chip on

2 [GND] GND - GND Ground

3 [ADC(+)] PA02 AIN0 PA02_ADC0 mikroBUS, X32

4 [ADC(-)] PA03 AIN1 / VREFA PA03_ADC1_VREF -

5 [GPIO] PA10 SERCOM2/PAD[2]/USART RTS PA10_GPIO1_S2_USART_RTS DGI GPIO, X32

6 [GPIO] PA11 SERCOM2/PAD[3]/USART CTS PA11_GPIO2_S2_USART_CTS DGI GPIO, X32

7 [PWM(+)] PA18 TC2/WO[0] PA18_PWM_TC2_0 mikroBUS

8 [PWM(-)] PA19 TC2/WO[1] PA19_PWM_TC2_1 -

9 [IRQ/GPIO] PA22 EXTINT[1] PA22_GPIO_IRQ_1 mikroBUS, X32

10 [SPI_SS_B/GPIO] PA23 GPIO/SERCOM0/PAD[1]/SPI SS PA23_GPIO_SS DGI GPIO

11 [TWI_SDA] PA16 SERCOM1/PAD[0]/I²C SDA PA16_S1_I2C_SDA EXT2, DGI I²C, mikroBUS, X32, I²C

12 [TWI_SCL] PA17 SERCOM1/PAD[1]/ I²C SCL PA17_S1_I2C_SCL EXT2, DGI I²C, mikroBUS, X32, I²C

13 [USART_RX] PA09 PA09_S2_UART_RX PA09_S2_UART_RX mikroBUS, X32

14 [USART_TX] PA08 PA08_S2_UART_TX PA08_S2_UART_TX mikroBUS, X32

15 [SPI_SS_A] PA05 PA05_S0_SPI_SS PA05_S0_SPI_SS mikroBUS, X32

16 [SPI_MOSI] PA14 PA14_S0_SPI_MOSI PA14_S0_SPI_MOSI EXT2, DGI SPI, mikroBUS, X32

17 [SPI_MISO]] PA04 PA04_S0_SPI_MISO PA04_S0_SPI_MISO EXT2, DGI SPI, mikroBUS, X32

18 [SPI_SCK] PA15 PA15_S0_SPI_SCK PA15_S0_SPI_SCK EXT2, DGI SPI, mikroBUS, X32

19 [GND] GND - GND Ground

20 [VCC] - - VCC_TARGET_P3V3 Power for extension Board

SAM L10/SAM

L11 pin

Functions Schematics Net Name Shared Functionality

the extension board

Pull-up, ECC508

Pull-up, ECC508

Table 4-2. Extension Header EXT2

EXT2 pin

1 [ID] - - - Communication line to the ID Chip on the

2 [GND] GND - GND Ground

3 [ADC(+)] - - Not Connected -

4 [ADC(-)] - - Not Connected -

5 [GPIO1] - - Not Connected -

6 [GPIO2] - - Not Connected -

7 [PWM(+)] - - Not Connected -

8 [PWM(-)] - - Not Connected -

9 [IRQ/GPIO] - - Not Connected -

10 [SPI_SS_B/GPIO] PA27 GPIO/SPI SS PA27_GPIO_SS DGI GPIO, SW0

11 [TWI_SDA] PA16 SERCOM1/PAD[0]/I²C SDA PA16_S1_I2C_SDA EXT1, DGI I²C, mikroBUS, X32, I²C Pull-up,

12 [TWI_SCL] PA17 SERCOM1/PAD[1]/ I²C SCL PA17_S1_I2C_SCL EXT1, DGI I²C, mikroBUS, X32, I²C Pull-up,

SAM L10/SAM L11
pin

Functions Schematics Net Name Shared Functionality

extension board

ECC508

ECC508

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 13

Hardware User Guide

EXT2 pin SAM L10/SAM L11

pin

13 [USART_RX] PA25 SERCOM0/PAD[3]/UART RX PA25_UART_RX mikroBUS, X32

14 [USART_TX] PA24 SERCOM0/PAD[2]/UART TX PA24_UART_TX mikroBUS, X32

15 [SPI_SS_A] PA06 GPIO/SPI SS PA06_SPI_SS mikroBUS, X32, QT BTN1

16 [SPI_MOSI] PA14 SERCOM0/PAD[2]/SPI MOSI PA14_S0_SPI_MOSI EXT1, DGI SPI, mikroBUS, X32

17 [SPI_MISO] PA04 SERCOM0/PAD[0]/SPI MISO PA04_S0_SPI_MISO EXT1, DGI SPI, mikroBUS, X32

18 [SPI_SCK] PA15 SERCOM0/PAD[3]/SPI SCK PA15_S0_SPI_SCK EXT1, DGI SPI, mikroBUS, X32

19 [GND] GND - GND Ground

20 [VCC] - - VCC_TARGET_P3V3 Power for extension Board

4.1.2 mikroBUS™ Header

The mikroBUS socket is comprised of a pair of 1×8 female headers with a proprietary pin configuration
and silkscreen markings. The pinout (always laid out in the same order) consists of three groups of
communication pins (SPI, UART and I2C), five additional pins (PWM, interrupt, analog input, reset and
chip select), and two power groups (+3.3V and 5V). The figure below illustrates the mikroBUS socket,
and the table below provides mikroBUS header details.

Figure 4-2. mikroBUS Socket

Functions Schematics Net Name Shared Functionality

Table 4-3. mikroBUS Header

mikroBUS pin

[AN] PA02 AIN0 PA02_ADC0 EXT1, X32

[RST] /RESET Reset TARGET_MCU_RESET EDBG SWD, X32, User BUS

[CS] PA05 SERCOM0/PAD[1]/SPI SS PA05_S0_SPI_SS EXT1, X32

[SCK] PA15 SERCOM0/PAD[3] /SPI SCK PA15_S0_SPI_SCK EXT1, EXT2, DGI SPI, X32

[MISO] PA04 SERCOM0/PAD[0]/SPI MISO PA04_S0_SPI_MISO EXT1, EXT2, DGI SPI, X32

[MOSI] PA14 SERCOM0/PAD[2]/SPI MOSI PA14_S0_SPI_MOSI EXT1, EXT2, DGI SPI, X32

[+3.3V] - - VCC_TARGET_P3V3 -

[GND] GND - GND Ground

[PWM] PA18 TC2/ WO[0] PA18_PWM_TC2_0 EXT1

© 2018 Microchip Technology Inc.

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

User Guide

DS70005359B-page 14

mikroBUS pin SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

[INT] PA22 EXTINT[1] PA22_GPIO_IRQ_1 EXT1, X32

[RX] PA09 SERCOM2/PAD[1]/ UART RX PA09_S2_UART_RX EXT1, X32

[TX] PA08 SERCOM2/PAD[0]/ UART TX PA08_S2_UART_TX EXT1, X32

[SCL] PA17 SERCOM1/PAD[1]/ I²C SCL PA17_S1_I2C_SCL EXT1, EXT2, DGI I²C, X32, I²C Pull-up, ECC508

[SDA] PA16 SERCOM1/PAD[0]/I²C SDA PA16_S1_I2C_SDA EXT1, EXT2, DGI I²C, X32, I²C Pull-up, ECC508

[+5V] - - VCC_P5V0 -

[GND] GND - GND Ground

4.1.3 X32 Header

The X32 header is populated on some of the PIC32 development kits, and enables the customer to plug
in an extension board, such as a Microchip Bluetooth or the AC320032-3 BM 64 Bluetooth Radio
daughter board, which is available for download at http://www.microchip.com/Developmenttools/

ProductDetails.aspx?PartNO=AC320032-3.

The X32 header is composed of a 20-pin connector and a 12-pin connector, which are described in the
following tables:

Table 4-4. 20-pin Connector

Hardware User Guide

X32BUS pin SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

1 [GND] Ground Ground - -

2 [GND] Ground Ground - -

3 [USART_RX] PA09 USART RX PA09_S2_UART_RX EXT1, mikroBUS

4 [USART_CTS] PA11 USART CTS PA11_GPIO2_S2_USART_CTS EXT1, DGI GPIO

5 [USART_TX] PA08 USART TX PA08_S2_UART_TX EXT1, mikroBUS

6 [USART_RTS] PA10 USART RTS PA10_GPIO1_S2_USART_RTS EXT1, DGI GPIO

7 [I2C_SCL] PA17 I²C SCL PA17_S1_I2C_SCL EXT1, EXT2, DGI I²C, mikroBUS, I²C Pull-up,

8 [STBY/RST_B] RESET RESET TARGET_MCU_RESET -

9 [I2C_SDA] PA16 I²C SDA PA16_S1_I2C_SDA EXT1, EXT2, DGI I²C, mikroBUS, I²C Pull-up,

10 [DMM/I2S_WS] PA05 DMM / I2S WS PA05_S0_SPI_SS EXT1, mikroBUS

11 [I2S_DIN] PA14 I²S DIN PA14_S0_SPI_MOSI EXT1, EXT2, mikroBUS, DGI SPI, XIN

12 [I2S_CK] PA15 I²S CK PA15_S0_SPI_SCK EXT1, EXT2, mikroBUS, DGI SPI, XOUT

13 [I2S_DOUT] PA04 I²S DOUT PA04_S0_SPI_MISO EXT1, EXT2, mikroBUS, DGI SPI

14 [CLK_AUDIO] PA22 CLK Audio PA22_GPIO_IRQ_1 EXT1, mikroBUS

15 [GND] GND Ground GND -

16 [GND] GND Ground GND -

17 Not Connected - - - -

18 [+3.3V] - - VCC_TARGET_P3V3 -

19 Not Connected - - - -

20 [+5V] - - VCC_P5V0 -

ECC508

ECC508

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 15

Table 4-5. 12-pin Connector

CAUTION

X32BUS pin SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

1 Not Connected - - - -

2 [ANALOG_POT] PA02 Analog Pot PA02_ADC0 EXT1, mikroBUS

3 Not Connected - - - -

4 Not Connected - - - -

5 Not Connected - - - -

6 Not Connected - - - -

7 Not Connected - - - -

8 Not Connected - - - -

9 Not Connected - - - -

10 Not Connected - - - -

11 [GND] Ground - - Ground

12 [GND] Ground - - Ground

4.1.4 Current Measurement Header

An angled 1x2, 100 mil pin-header marked with the MCU current measurement is located at the upper
edge of the Xplained Pro. All power to the SAM L10/L11 is routed through this header. To measure the
power consumption of the device, remove the jumper and replace it with an ammeter.

Hardware User Guide

Table 4-6. 

Current Measurement Header Pin Function

1 [VCC_MCU] VCC_MCU_P3V3

2 [VCC_TARGET] VCC_TARGET_P3V3

Removing the jumper from the pin-header while the kit is powered may cause the SAM L10/L11
to be powered through its I/O pins. This may cause permanent damage to the device.

4.1.5 Cortex Debug Connector

The Xplained Pro has a 10-pin, 50-mil Cortex® Debug Connector that can be used to attach external
debuggers to the SAM L10/L11.

Table 4-7. 

Cortex Debug Connector
pin

1 [VCC] - - VCC_TARGET_P3V3 -

2 [SWDIO/TMS] PA31 SW Data In/Out SWDIO Serial Wire debug

3 [GND] GND Ground GND -

4 [SWCLK/TCK] PA30 SW Clock SWCLK Serial Wire debug

5 [GND] GND Ground GND -

6 [SWO/TDO] Not connected - - -

7 [KEY] Not connected - - -

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 16

Hardware User Guide

Cortex Debug Connector
pin

8 [NC/TDI] Not connected - - -

9 [GNDDetect] GND Ground GND -

10 [nRESET] /RESET Reset TARGET_MCU_RESET Serial Wire debug, User

4.2 Peripherals

4.2.1 Crystals

The Xplained Pro kit contains one mounted 32.768 kHz crystal and a footprint for higher frequency
crystals, which can be used as clock sources for SAM L10/L11. The footprint for the 32.768 kHz crystal is
based on the Kyocera ST3215SB series.

• 32.768 kHz Crystal connection details are given in the following table.

Table 4-8. 32 KHz Crystal Connection

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

PA00 XIN32 XIN32 -

PA01 XOUT32 XOUT32 -

• Higher Frequency crystal footprint details are provided in the following table.

Table 4-9. Main Crystal Connection

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

reset

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

PA14 XIN XIN EXT1, EXT2, DGI SPI,

PA15 XOUT XOUT EXT1, EXT2, DGI SPI,

4.2.2 Mechanical Buttons

The Xplained Pro contains two mechanical buttons. One button is the Reset button connected to the SAM
L10/L11 reset line, and the other is a generic user configurable button. When a button is pressed it will
drive the I/O line to GND.

Table 4-10. Mechanical Buttons Connections

SAML10/SAML11
pin

/RESET Reset RESET TARGET_MCU_R

PA27 GPIO SW0 USER_BUTTON DGI GPIO, EXT2

4.2.3 LED

There is one yellow LED available on the Xplained Pro board that can be turned on and off. The LED can
be activated by driving the connected I/O line to GND.

Function Silkscreen Text Schematics Net

Name

ESET

mikroBUS, X32

mikroBUS, X32

Shared
Functionality

-

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 17

Table 4-11. LED Connection

Hardware User Guide

SAML10/SAML11
pin

PA07 Yellow LED LED0 USER_LED DGI SPI

4.2.4 QTouch Button

One self-capacitance button is available on the Xplained Pro board that can be used as the I/O. The
QTouch button is intended to be driven by the built-in Peripheral Touch Controller (PTC) of the device. A
resistor is added on the board to easily disconnect the on-board touch buttons from the extension header
as the I/O lines are shared between the two.

Note:  To get started with QTouch refer to the Atmel QTouch® Library and Atmel QTouch® Composer.

Table 4-12. Qtouch Button Connection

SAML10/SAML11
pin

PA06 Self-capacitance

Function Silkscreen Text Schematics Net

Function Silkscreen Text Schematics Net

QT BTN1 USER_QTOUCH EXT2

QTouch button

4.3 Embedded Debugger Implementation

The Xplained Pro contains an Embedded Debugger (EDBG) that can be used to program and debug the
SAM L10/L11 using Serial Wire Debug (SWD). The Embedded Debugger also includes a virtual CPM port
interface over UART, an Atmel Data Gateway Interface over SPI, TWI (I²C), and four of the SAM L10/L11
GPIOs.

Name

Name

Shared
Functionality

Shared
Functionality

Atmel Studio can be used as a front end for the Embedded Debugger.

4.3.1 Serial Wire Debug

The Serial Wire Debug (SWD) uses two pins to communicate with the target. For further information on
how to use the programming and debugging capabilities of the EDBG, refer to the Embedded Debugger

User Guide.

Table 4-13. Serial Wire Debug Connection

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

/RESET Reset TARGET_MCU_RESET mikroBUS, X32BUS,

PA30 Serial Wire Clock SWCLK Cortex debug Connector

PA31 Serial Wire Data IN/OUT SWDIO Cortex debug Connector

4.3.2 Virtual COM Port

The Embedded Debugger acts as a virtual COM port gateway by using one of the SAM L10/L11 UARTs.
For further information on how to use the virtual COM port, refer to the Embedded Debugger User Guide.

USER Reset (RESET)

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 18

Hardware User Guide

Table 4-14. Virtual COM Port Connection

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

PA25 SERCOM0/PAD[3]/

UART RX

PA24 SERCOM0/PAD[2]/

UART TX

4.3.3 Atmel Data Gateway Interface

The Embedded Debugger features a Microchip Data Gateway Interface (DGI) by using either a SPI or
I²C. The DGI can be used to send many data from the SAM L10/L11 to the host PC. For further
information on how to use the DGI interface, refer to the Data Gateway Interface User’s Guide and the

EDBG User Guide.

4.3.3.1 DGI Interface Connections When Using SPI

SAML10/SAML11

pin

PA07 GPIO / SS PA07_LED_PWM_TC0 LED0

PA14 SERCOM0/PAD[2]/ SPI

MOSI

PA04 SERCOM0/PAD[0]/ SPI

MISO

PA15 SERCOM0/PAD[3] /SPI

SCK

Function Schematics Net Name Shared Functionality

PA25_UART_RX EXT2

PA24_UART_TX EXT2

PA14_S0_SPI_MOSI EXT1, EXT2, mikroBUS, X32

PA04_S0_SPI_MISO EXT1, EXT2, mikroBUS, X32

PA15_S0_SPI_SCK EXT1, EXT2, mikroBUS, X32

4.3.3.2 DGI Interface When Using I2C

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

PA16 DGI TWI SDA PA16_S1_I2C_SDA EXT1, EXT2, mikroBUS,

PA17 DGI TWI SCL PA17_S1_I2C_SCL EXT1, EXT2, mikroBUS,

Four GPIO lines are connected to the Embedded Debugger. The EDBG can monitor these lines and time
stamp the pin value changes. This makes it possible to accurately time stamp events in the application
code.

X32, I²C Pull-up,
ECC508

X32, I²C Pull-up,
ECC508

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 19

4.3.3.3 GPIO Lines Connected to The EDBG

SAML10/SAML11 pin Function Schematics Net Name Shared Functionality

Hardware User Guide

PA10 DGI_GPIO0 PA10_GPIO1_S2_USA

RT_RTS

PA11 DGI_GPIO1 PA11_GPIO2_S2_USAR

T_CTS

PA23 DGI_GPIO2 PA23_GPIO_SS EXT1

PA27 DGI_GPIO3 PA27_GPIO_SS EXT2, SW0 user button

4.3.4 Trusted and Secure Authentication Device: ATECC508A

The ATECC508A is a secure element from the Microchip CryptoAuthentication portfolio with advanced
Elliptic Curve Cryptography (ECC) capabilities.

With ECDH and ECDSA built in, this device is ideal for the rapidly growing IoT market by easily supplying
the full range of security features, such as confidentiality, data integrity, and authentication to systems
with MCU or MPUs running encryption and decryption algorithms (i.e., AES). Similar to all Microchip
CryptoAuthentication products, the new ATECC508A employs ultra-secure hardware-based cryptographic
key storage and cryptographic counter measures which are robust than software-based key storage.

For additional information, refer to the ATECC508A document which is available for download at https://

www.microchip.com/wwwproducts/en/ATECC508A.

The connection between SAM L10/L11 and the ATECC508A requires only two I2C wires that are
summarized in the following table:

EXT1, X32

EXT1, X32

Table 4-15. ATECC508A Connections

SAML10/L11 pin Function Schematics Net Name Shared Functionality

PA16 I2C_SDA PA16_S1_I2C_SDA EXT1, EXT2, DGI I²C,

mikroBUS, X32, I2C pull­up

PA17 I2C_SCL PA17_S1_I2C_SCL EXT1, EXT2, DGI I²C,

mikroBUS, X32, I2C pull­up

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 20

5. XAM Configuration

On the SAM L10/SAM L11 Xplained Pro, the MCU and the MCU peripherals (for example, extensions)
are powered by its own regulator as shown in the following figure. All other parts of the board, specifically
the embedded debugger and accompanying Xplained Pro Analog Module (XAM), are powered from a
separate regulator. The current to the MCU and peripherals can be measured by connecting them to the
XAM output through the jumper settings.

Figure 5-1. XAM

XAM Configuration

On the Xplained Pro, the XAM can be used in the following four configurations:

• No current measurement or external MCU current measurement: The XAM is bypassed and
the MCU and peripherals are supplied by the regulator. Set both the jumpers in the BYPASS
position. In this configuration, it is also possible to connect external measurement tools on the
Xplained Pro MCU power measurement header to measure MCU current directly instead of using
the XAM.

• MCU current measurement: The XAM measures only the MCU current while the peripherals are
supplied by the regulator. For this configuration, place the jumper for the I/O (peripherals) into the
BYPASS position and the MCU into the MEASURE position.

• Peripherals measurement: The XAM measures only the current of the peripherals while the MCU
is supplied by the regulator. For this configuration place the jumper for MCU into the BYPASS
position and the I/O jumper into the MEASURE position.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 21

XAM Configuration

• MCU and peripherals measurement: In this configuration both the MCU and the peripherals are
measured by the XAM. Place both the jumpers on I/O and MCU headers in the MEASURE position.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 22

6. Identifying Product ID and Revision

The revision and product identifier of Xplained Pro boards can be found in two ways: either through Atmel
Studio or by looking at the sticker on the bottom of the PCB. By connecting an Xplained Pro MCU board
to a computer with Atmel Studio running, an information window will pop up. The first six digits of the
serial number, which is listed under kit details, contain the product identifier and revision. Information
about connected Xplained Pro extension boards will also appear in the Atmel Kit's window. The same
information can be found on the sticker on the bottom side of the PCB. Most kits will print the identifier
and revision in plain text as A09-nnnn\rr, where nnnn is the identifier and rr is the revision. Boards with
limited space have a sticker with only a QR-code, which contains a serial number string. The serial
number string has the following format:

"nnnnrrssssssssss"

n = product identifier

r = revision

s = serial number

Identifying Product ID and Revision

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 23

7. Revision History

Revision B

June, 2018

Removed errata section.

Revision A

May, 2018

Initial version of the document.

Revision History

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 24

The Microchip Web Site

Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as
a means to make files and information easily available to customers. Accessible by using your favorite
Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design
resources, user’s guides and hardware support documents, latest software releases and archived
software

• General Technical Support – Frequently Asked Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Microchip sales offices, distributors and factory
representatives

Customer Change Notification Service

Microchip’s customer notification service helps keep customers current on Microchip products.
Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata
related to a specified product family or development tool of interest.

To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on
“Customer Change Notification” and follow the registration instructions.

Customer Support

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included
in the back of this document.

Technical support is available through the web site at: http://www.microchip.com/support

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the
market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of
these methods, to our knowledge, require using the Microchip products in a manner outside the
operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is
engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 25

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their
code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the
code protection features of our products. Attempts to break Microchip’s code protection feature may be a
violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software
or other copyrighted work, you may have a right to sue for relief under that Act.

Legal Notice

Information contained in this publication regarding device applications and the like is provided only for
your convenience and may be superseded by updates. It is your responsibility to ensure that your
application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY
OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS
CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life
support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,
indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting
from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual
property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings,
BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo,
Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA,
SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight
Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip
Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,
chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient
Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL
ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 26

©

2018, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

ISBN: 978-1-5224-3258-6

Quality Management System Certified by DNV

ISO/TS 16949

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer
fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC
DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design and manufacture of development
systems is ISO 9001:2000 certified.

®

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 27

Worldwide Sales and Service

AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE

Corporate Office

2355 West Chandler Blvd.

Chandler, AZ 85224-6199

Tel: [phone]

Fax: [phone]

Technical Support:

http://www.microchip.com/

support

Web Address:

www.microchip.com

Atlanta

Duluth, GA

Tel: [phone]

Fax: [phone]

Austin, TX

Tel: [phone]

Boston

Westborough, MA

Tel: [phone]

Fax: [phone]

Chicago

Itasca, IL

Tel: [phone]

Fax: [phone]

Dallas

Addison, TX

Tel: [phone]

Fax: [phone]

Detroit

Novi, MI

Tel: [phone]

Houston, TX

Tel: [phone]

Indianapolis

Noblesville, IN

Tel: [phone]

Fax: [phone]

Tel: [phone]

Los Angeles

Mission Viejo, CA

Tel: [phone]

Fax: [phone]

Tel: [phone]

Raleigh, NC

Tel: [phone]

New York, NY

Tel: [phone]

San Jose, CA

Tel: [phone]

Tel: [phone]

Canada - Toronto

Tel: [phone]

Fax: [phone]

Australia - Sydney

Tel: [phone]

China - Beijing

Tel: [phone]

China - Chengdu

Tel: [phone]

China - Chongqing

Tel: [phone]

China - Dongguan

Tel: [phone]

China - Guangzhou

Tel: [phone]

China - Hangzhou

Tel: [phone]

China - Hong Kong SAR

Tel: [phone]

China - Nanjing

Tel: [phone]

China - Qingdao

Tel: [phone]

China - Shanghai

Tel: [phone]

China - Shenyang

Tel: [phone]

China - Shenzhen

Tel: [phone]

China - Suzhou

Tel: [phone]

China - Wuhan

Tel: [phone]

China - Xian

Tel: [phone]

China - Xiamen

Tel: [phone]

China - Zhuhai

Tel: [phone]

India - Bangalore

Tel: [phone]

India - New Delhi

Tel: [phone]

India - Pune

Tel: [phone]

Japan - Osaka

Tel: [phone]

Japan - Tokyo

Tel: [phone]

Korea - Daegu

Tel: [phone]

Korea - Seoul

Tel: [phone]

Malaysia - Kuala Lumpur

Tel: [phone]

Malaysia - Penang

Tel: [phone]

Philippines - Manila

Tel: [phone]

Singapore

Tel: [phone]

Taiwan - Hsin Chu

Tel: [phone]

Taiwan - Kaohsiung

Tel: [phone]

Taiwan - Taipei

Tel: [phone]

Thailand - Bangkok

Tel: [phone]

Vietnam - Ho Chi Minh

Tel: [phone]

Austria - Wels

Tel: [phone]

Fax: [phone]

Denmark - Copenhagen

Tel: [phone]

Fax: [phone]

Finland - Espoo

Tel: [phone]

France - Paris

Tel: [phone]

Fax: [phone]

Germany - Garching

Tel: [phone]

Germany - Haan

Tel: [phone]

Germany - Heilbronn

Tel: [phone]

Germany - Karlsruhe

Tel: [phone]

Germany - Munich

Tel: [phone]

Fax: [phone]

Germany - Rosenheim

Tel: [phone]

Israel - Ra’anana

Tel: [phone]

Italy - Milan

Tel: [phone]

Fax: [phone]

Italy - Padova

Tel: [phone]

Netherlands - Drunen

Tel: [phone]

Fax: [phone]

Norway - Trondheim

Tel: [phone]

Poland - Warsaw

Tel: [phone]

Romania - Bucharest

Tel: [phone]

Spain - Madrid

Tel: [phone]

Fax: [phone]

Sweden - Gothenberg

Tel: [phone]

Sweden - Stockholm

Tel: [phone]

UK - Wokingham

Tel: [phone]

Fax: [phone]

© 2018 Microchip Technology Inc.

User Guide

DS70005359B-page 28