Microchip Technology SAM B11ZR Xplained Pro, ATSAMB11ZR User Manual

ATSAMB11ZR

SAM B11ZR Xplained Pro User Guide

Description

Microchip's SAM B11ZR Xplained Pro evaluation kit is a hardware platform used to evaluate the
ATSAMB11ZR-210CA module.

Supported by the Atmel Studio integrated development platform, the kit provides easy access to the
features of the ATSAMB11ZR and explains how to integrate the device in a custom design.

The Xplained Pro MCU series evaluation kits include an on-board Embedded Debugger, and no external
tools are necessary to program or debug the ATSAMB11ZR.

The Xplained Pro extension kits offer additional peripherals to extend the features of the board and ease
the development of custom designs.

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ATSAMB11ZR

Table of Contents

Description.......................................................................................................................1

1. Introduction................................................................................................................3

1.1. Feature list....................................................................................................................................3

1.2. Kit Overview................................................................................................................................. 3

2. Xplained Pro Getting Started.....................................................................................5

2.1. Xplained Pro Quick Start.............................................................................................................. 5

2.2. Design Documentation and Relevant Links................................................................................. 5

3. Xplained Pro.............................................................................................................. 6

3.1. Xplained Pro.................................................................................................................................6

3.2. Embedded Debugger................................................................................................................... 6

3.3. Xplained Pro Analog Module........................................................................................................7

3.4. Hardware Identification System....................................................................................................8

3.5. Power Sources............................................................................................................................. 9

3.6. Xplained Pro Headers and Connectors......................................................................................10

4. Hardware User Guide..............................................................................................12

4.1. Connectors.................................................................................................................................12

4.2. Peripherals................................................................................................................................. 15

4.3. Embedded Debugger Implementation........................................................................................17

5. Hardware Revision History...................................................................................... 20

5.1. Identifying Product ID and Revision........................................................................................... 20

5.2. Hardware Revision..................................................................................................................... 20

6. Document Revision History..................................................................................... 21

The Microchip Web Site................................................................................................ 22

Customer Change Notification Service..........................................................................22

Customer Support......................................................................................................... 22

Product Identification System........................................................................................23

Microchip Devices Code Protection Feature................................................................. 23

Legal Notice...................................................................................................................24

Trademarks................................................................................................................... 24

Quality Management System Certified by DNV.............................................................25

Worldwide Sales and Service........................................................................................26

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1. Introduction

1.1 Feature list

• ATSAMB11ZR-210CA module

• Bluetooth® host and Device mode

• One mechanical reset button

• One mechanical programmable button

• One user LED (yellow)

• Battery header (1x2 100mil header)

• 32.768 kHz crystal

• Two Xplained Pro extension headers

• Embedded Debugger

– Auto-ID for board identification in Atmel Studio

– One status LED (yellow)

– One power LED (green)

– Symbolic debug of complex data types including scope information

– Programming and debugging, including power measurements

– Data Gateway Interface (DGI): SPI, I2C, four GPIOs

– Virtual COM port (CDC)

• Embedded current measurement circuitry with support for data visualization

• USB-powered

• Supported with application examples in Atmel Software Framework

ATSAMB11ZR

1.2 Kit Overview

The SAM B11ZR Xplained Pro evaluation kit is a hardware platform used to evaluate the
ATSAMB11ZR-210CA module.

The kit offers a set of features that enable the user to get started with the ATSAMB11ZR-210CA module
peripherals right away, and to understand how to integrate the device in their own design.

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ATSAMB11ZR

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2. Xplained Pro Getting Started

2.1 Xplained Pro Quick Start

Steps to start exploring the Xplained Pro platform:

1. Download and install Atmel Studio.

2. Launch Atmel Studio.

3. Connect the Debug USB port on the evaluation kit to the computer using a USB cable (Standard-A
to Micro-B or Micro-AB).

ATSAMB11ZR

When the Xplained Pro MCU kit is connected to the computer for the first time, the operating system
installs the driver software automatically. This driver supports 32-bit and 64-bit versions of Microsoft
Windows® XP, Windows Vista®, Windows 7, Windows 8, Windows 10, and Windows Server 2012.

When the Xplained Pro MCU board is powered, the power LED (green) glows and the Atmel Studio
automatically detects the specific Xplained Pro MCU and extension board(s) that are connected. The
landing page of the kit in the Atmel Studio has an option to launch the Atmel Software Framework (ASF)
and the Atmel START example application codes for the kit. The SAM B device is programmed and
debugged by the on-board embedded debugger and therefore no external programmer or debugger tool
is required.

2.2 Design Documentation and Relevant Links

The following list contains links to the most relevant documents and software for the SAM B11ZR
Xplained Pro.

• Xplained products - Xplained evaluation kits are a series of easy-to-use evaluation kits for
microcontrollers and other products. For low pin count devices, the Xplained Nano series provides
a minimalistic solution with access to all I/O pins of the target microcontroller. Xplained Mini kits are
for medium pin count devices and adds Arduino Uno compatible header footprint and a prototyping
area. Xplained Pro kits are for medium to high pin count devices, and feature advanced debugging
and standardized extensions for peripheral functions. All these kits have on board programmers/
debuggers which creates a set of low-cost boards for evaluation and demonstration of features and
capabilities of different products.

• Atmel Studio - Atmel Studio presents Free Atmel IDE for development of C/C++ and assembler
code for microcontrollers and relevant documentation.

• Microchip sample store - Microchip sample store where you can order samples of devices.

• EDBG User Guide - User guide containing more information about the on-board Embedded
Debugger.

• IAR Embedded Workbench ® for ARM ® - This is a commercial C/C++ compiler that is available for
ARM . There is a 30-day evaluation version as well as a code size limited kick-start version
available from their website. The code size limit is 16KB for devices with M0, M0+, and M1 cores
and 32KB for devices with other cores.

• Atmel Data Visualizer - Atmel Data Visualizer is a program used for processing and visualizing
data. Data Visualizer can receive data from various sources such as the Embedded Debugger Data
Gateway Interface found on Xplained Pro boards and COM ports.

• SAM B11ZR Xplained Pro BluSDK - Software, firmware, applications, and tools packages.

®

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3. Xplained Pro

3.1 Xplained Pro

Xplained Pro is an evaluation platform which contains a series of microcontroller boards (evaluation kits)
and extension boards. Atmel Studio is used to program and debug the microcontrollers on these boards.
Atmel Studio includes Advanced Software Framework (ASF) and Atmel START, which has drivers and
demo code, and Data Visualizer, which supports data streaming and advanced debugging. Xplained Pro
evaluation kits can be connected to a wide range of Xplained Pro extension boards through standardized
headers and connectors. Xplained Pro extension boards have identification (ID) chips to uniquely identify
which boards are connected to the Xplained Pro evaluation kits.

3.2 Embedded Debugger

The SAM B11ZR Xplained Pro contains an Embedded Debugger (EDBG) for on-board debugging. The
EDBG is a USB composite device with the following interfaces:

• Debugger

• Virtual COM Port

• Data Gateway Interface (DGI)

ATSAMB11ZR

The EDBG can program and debug the ATSAMB11ZR with the help of Atmel Studio. The SWD interface
is connected between the EDBG and the ATSAMB11ZR on the SAM B11ZR Xplained Pro.

The Virtual COM Port is connected to a UART on the ATSAMB11ZR and provides an easy way to
communicate with the target application through terminal software. It offers variable baud rate, parity, and
stop bit settings. The settings on the ATSAMB11ZR must match the settings given in the terminal
software.

Info:  The Virtual COM Port in the EDBG requires the terminal software to set the Data
Terminal Ready (DTR) signal to enable the UART pins connected to the ATSAMB11ZR. If the
DTR signal is not enabled, the UART pins on the EDBG are kept in tri-state (high-z) to render
the COM Port not usable. The DTR signal is automatically set by some terminal software, but it
may have to be manually enabled in your terminal.

The DGI consists of several physical interfaces for bidirectional communication with the host computer.
Communication over the interfaces is bidirectional. It can be used to send event values, and data from
the ATSAMB11ZR. Traffic over the interfaces can be timestamped by the EDBG for more accurate tracing
of events, but timestamping reduces the maximal data throughput. The Data Visualizer is used to send
and receive data through DGI.

The EDBG controls two LEDs on the SAM B11ZR Xplained Pro, a power LED and a status LED. The
following table provides details on how the LEDs are controlled in different operation modes.

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Table 3-1. EDBG LED Control

Mode Power LED Status LED

ATSAMB11ZR

Normal mode The power LED is ON when

Bootloader mode (idle) The power LED and the status LED blink simultaneously.

Bootloader mode (firmware
upgrade)

For additional information on the EDBG, see the EDBG User Guide.

3.3 Xplained Pro Analog Module

3.3.1 Overview

The Xplained Pro Analog Module (XAM) extends the embedded debugger with high dynamic range
current measurement. This enables power profiling of the target system.

Figure 3-1. XAM Block Diagram

Calibration

circuitry

Current output

Calibration ON/OFF

Activity indicator, the LED flashes

power is applied to the board.

when any communication
happens to the EDBG.

The power LED and the status LED blink in an alternating pattern.

Sync GPIO

I2C

SPI

Clock sync

SWD

EDBG

voltage

reference

2.7V

GPIO(s)

GPIO

AREF

Control MCU

Pre-amplifier

Range selection

100 mOhm

Current input

20x

20x

100 Ohm

Xplained Pro Analog Module (XAM)

The XAM consists of:

• Calibration circuitry

• Voltage reference circuitry

• Analog front-end:

– Shunt resistors with a range selection switch

– Pre-amplifier

– Two active filters with gain

• Control MCU

2x

16x

Active filter with

gain

ADC0

ADC1

GND

GPIO

S&H

ADC

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– Analog-to-Digital Converter

– Signal processing

– Control/communication interface to the EDBG

The current measurement front-end is a high side shunt measurement with a pre-amplifier and a second
active filter stage with gain as shown in Figure 3-1. The wide dynamic range is achieved by four
measurement ranges, which are defined by two shunt resistors and the two parallel second stage active
filters with gain.

3.3.2 Sample Rate

The raw sampling rate of the XAM is up to 250 kHz and with the default averaging configuration (average
of 16 samples), the actual output of the XAM is 16.67 ksps.

Info:  The XAM output sample rate is not an integer fraction of the raw sampling.

3.3.3 Measurement Ranges and Accuracy

The XAM has four measurement ranges. These are defined by two shunt resistors and two gain stages.

ATSAMB11ZR

Table 3-2. XAM Measurement Ranges and Accuracy

Measurement
Range

Range 1 Low current shunt and

Range 2 Low current shunt and

Range 3 High current shunt and

Range 4 High current shunt and

The ranges are automatically switched by the XAM to achieve the best measurement results and the
currently active range is visualized in the Data Visualizer front-end tool. The maximum voltage drop over
the shunt resistor is 100 mV, and the XAM switches the range automatically before reaching this limit.

Hardware Resolution Accuracy Comments

20 nA 1 LSB ±1% Accuracy will decrease below

high gain stage

150 nA 1 LSB ±1%

low gain stage

10 μA 1 LSB ±1%

high gain stage

100 μA 1 LSB ±1% Accuracy will decrease above

low gain stage

1 μA. Typical accuracy for
300 nA is 1 LSB ±10%.

100 mA. Typical accuracy is
1 LSB ±5% at 400 mA.
Maximum current is 400 mA.

3.4 Hardware Identification System

All Xplained Pro extension boards come with an identification chip (ATSHA204A CryptoAuthentication
chip) to uniquely identify the boards that are connected to the Xplained Pro evaluation kit. This chip
contains information that identifies the extension with its name and some extra data. When an Xplained
Pro extension is connected to an Xplained Pro evaluation kit, the information is read and sent to the
Atmel Studio. The following table shows the data fields stored in the ID chip with example content.

© 2017 Microchip Technology Inc.

User Guide

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Table 3-3. Xplained Pro ID Chip Content

Data Field Data Type Example Content

Manufacturer ASCII string Microchip'\0'

Product name ASCII string Segment LCD1 Xplained Pro'\0'

Product revision ASCII string 02'\0'

Product serial number ASCII string 1774020200000010’\0’

Minimum voltage [mV] uint16_t 3000

Maximum voltage [mV] uint16_t 3600

Maximum current [mA] uint16_t 30

3.5 Power Sources

The SAM B11ZR Xplained Pro kit can be powered by several power sources as listed in the table below.

Table 3-4. Power Sources for SAM B11ZR Xplained Pro

Power input Voltage requirements Current requirements Connector marking

ATSAMB11ZR

External power 5V ±2% (±100 mV) for

USB host operation.

4.3V to 5.5V if USB host
operation is not
required.

Embedded debugger
USB

Battery header is another power input, refer to Battery Header.

The kit will automatically detect which power sources are available and choose which one to use
according to the following priority:

1. External power.

2. Embedded Debugger USB.

Note:  The selection for the supply of the Target MCU has a separate connector. The above priority
selects which supply is used to power the EDBG and the VCC_P3V3_CON.

4.4V to 5.25V (according
to USB spec.)

Recommended
minimum is 1A to be
able to provide enough
current for connected
USB devices and the
board itself.
Recommended
maximum is 2A due to
the input protection
maximum current
specification.

500 mA (according to
USB spec.)

PWR

DEBUG USB

Info:  External power is required when 500mA from a USB connector is not enough to power
the board with possible extension boards. A connected USB device in a USB host application
might easily exceed this limit.

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3.6 Xplained Pro Headers and Connectors

3.6.1 Xplained Pro Standard Extension Header

All Xplained Pro kits have many dual row, 20-pin, 100-mil extension headers. The Xplained Pro MCU
boards have male headers, while the Xplained Pro extensions have their female counterparts. All
connected pins follow the defined pin description in the table.

Info:  Not all pins are always connected on all extension headers.

The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained Pro MCU
boards or to access the pins of the target microcontroller on the Xplained Pro boards.

Table 3-5. Xplained Pro Standard Extension Header

Pin Number Pin Name Description

1 ID Pin to communicate with the ID chip on an extension board.

2 GND Ground

ATSAMB11ZR

3 ADC(+) Analog-to-Digital Converter; alternatively, a pin for the positive

terminal of a differential ADC.

4 ADC(-) Analog-to-Digital Converter; alternatively, a pin for the negative

terminal of a differential ADC.

5 GPIO1 General purpose I/O pin.

6 GPIO2 General purpose I/O pin.

7 PWM(+) Pulse width modulation; alternatively, a pin for the positive part of a

differential PWM.

8 PWM(-) Pulse width modulation; alternatively, a pin for the negative part of a

differential PWM.

9 IRQ/GPIO Interrupt request pin and/or general purpose I/O pin.

10 SPI_SS_B/

GPIO

11 I2C_SDA Data pin for I2C interface. Always connected, bus type.

12 I2C_SCL Clock pin for I2C interface. Always connected, bus type.

13 UART_RX Receiver pin of target device UART.

14 UART_TX Transmitter pin of target device UART.

Slave select pin for Serial Peripheral Interface (SPI) and/or general
purpose I/O pin.

15 SPI_SS_A Slave select for SPI. This pin should preferably not be connected to

anything else.

16 SPI_MOSI SPI master out slave in pin. Always connected, bus type.

17 SPI_MISO SPI master in slave out pin. Always connected, bus type.

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Pin Number Pin Name Description

18 SPI_SCK SPI clock pin. Always connected, bus type.

19 GND Ground pin for extension boards.

20 VCC Power pin for extension boards.

3.6.2 Xplained Pro Power Header

The power header can be used to connect external power to the SAM B11ZR Xplained Pro kit. The kit
automatically detects and switches to any external power if supplied. The power header can also be used
to supply power to external peripherals or extension boards. Ensure that the total current does not
exceed the recommended current limit of the on-board regulator when using the 3.3V pin.

Table 3-6. Xplained Pro Power Header

Pin Number Pin Name Description

1 VEXT_P5V0 External 5V input pin

2 GND Ground pin

ATSAMB11ZR

3 VCC_P5V0

4 VCC_P3V3

Unregulated 5V pin (an output, derived from one of
the input sources)

Regulated 3.3V pin (an output, used as main power
supply for the kit)

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4. Hardware User Guide

4.1 Connectors

The following sections describe the implementation of the relevant connectors and headers on SAM
B11ZR Xplained Pro and their connection to the ATSAMB11ZR. The tables of connections in the sections
also describe which signals are shared between the headers and on-board functionality.

Figure 4-1. SAMB11ZR Xplained Pro Connector Overview

ATSAMB11ZR

4.1.1 Xplained Pro Extension Headers

The SAM B11ZR Xplained Pro headers EXT1 and EXT3 offers access to the I/O of the microcontroller in
order to expand the board e.g., by connecting extensions to the board. These headers are based on the
standard extension header specified in Xplained Pro Standard Extension Header . The headers have a
pitch of 2.54mm

Table 4-1. Extension Header EXT1

EXT1 pin SAM B11ZR

pin

1 [ID] - - Communication line to the ID

2 [GND] - - Ground

© 2017 Microchip Technology Inc.

Function Shared functionality

chip on an extension board

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ATSAMB11ZR

EXT1 pin SAM B11ZR

pin

3 [ADC(+)] GPIO_MS1 ADC

4 [ADC(-)] GPIO_MS2 ADC

5 [GPIO1] LP_GPIO_5 GPIO/UART1_RTS EXT3

6 [GPIO2] LP_GPIO_4 GPIO/UART1_CTS EXT3

7 [PWM(+)] LP_GPIO_17 GPIO/SPI1_SCK EDBG GPIO,EXT3

8 [PWM(-)] LP_GPIO_18 GPIO/SPI1_MISO EDBG GPIO,EXT3

9 [IRQ/GPIO] AO_GPIO_0 IRQ/GPIO USER BUTTON

10 [SPI_SS_B/GPIO] AO_GPIO_2 GPIO Temperature Sensor, EXT3

11 [TWI_SDA] LP_GPIO_8* /

AO_GPIO_1

12 [TWI_SCL] LP_GPIO_9 I²C SCL EDBG I²C, Temperature Sensor

13 [USART_RX] LP_GPIO_2 UART1 RXD EDBG UART

14 [USART_TX] LP_GPIO_3 UART1 TXD EDBG UART

15 [SPI_SS_A] LP_GPIO_12 SPI_SSN EDBG SPI

Function Shared functionality

I²C SDA EDBG I²C, Temperature Sensor

16 [SPI_MOSI] LP_GPIO_11 SPI MOSI EDBG SPI

17 [SPI_MISO] LP_GPIO_13 SPI MISO EDBG SPI

18 [SPI_SCK] LP_GPIO_10 SPI SCK EDBG SPI

19 [GND] - - Ground

20 [VCC] - - Power for extension board

Table 4-2. Extension Header EXT3

EXT3 pin SAM B11ZR

pin

1 [ID] - - Communication line to the ID

2 [GND] - - Ground

3 [ADC(+)] GPIO_MS3 ADC

4 [ADC(-)] GPIO_MS4 ADC

5 [GPIO1] LP_GPIO_5 GPIO/UART1_RTS EXT1

6 [GPIO2] LP_GPIO_4 GPIO/UART1_CTS EXT1

7 [PWM(+)] - -

Function Shared functionality

chip on an extension board

8 [PWM(-)] - -

9 [IRQ/GPIO] AO_GPIO_1 IRQ/GPIO

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ATSAMB11ZR

EXT3 pin SAM B11ZR

pin

10 [SPI_SS_B/GPIO] AO_GPIO_2 GPIO Temperature Sensor,EXT1

11 [TWI_SDA] LP_GPIO_14*/

AO_GPIO_1

12 [TWI_SCL] LP_GPIO_15 I²C SCL DEBUG I²C,Crypto

13 [USART_RX] LP_GPIO_6/

LP_GPIO_2

14 [USART_TX] LP_GPIO_7/

LP_GPIO_3

15 [SPI_SS_A] LP_GPIO_16 SPI1 SSN EDBG GPIO,USER LED

16 [SPI_MOSI] LP_GPIO_19 SPI1 MOSI EDBG GPIO

17 [SPI_MISO] LP_GPIO_18 SPI1 MISO EDBG GPIO, EXT1

18 [SPI_SCK] LP_GPIO_17 SPI1 SCK EDBG GPIO, EXT1

19 [GND] - - Ground

20 [VCC] - - Power for extension board

Function Shared functionality

I²C SDA DEBUG I²C,Crypto

Authentication Device

Authentication Device

UART2 RX/UART1 RX * EDBG UART

UART2 TX/ UART1 TX * EDBG UART

Note : * denotes that particular pin is by default connected.

4.1.2 Current Measurement Header

An angled 1x2, 100mil pin-header marked with MCU current measurement is located at the upper edge of
the SAM B11ZR Xplained Pro. All power to the ATSAMB11ZR is exclusively routed through this header
(excluding power to headers and peripherals). To measure the power consumption of the device, remove
the jumper and replace it with an ammeter.

Caution:  Removing the jumper from the pin-header while the kit is powered may cause the
ATSAMB11ZR to be powered through its I/O pins. This may cause permanent damage to the
device.

4.1.3 Cortex Debug Connector

SAM B11ZR Xplained Pro has a 10-pin 50-mil Cortex® Debug Connector that can be used to attach
external debuggers to the ATSAMB11ZR.

Table 4-3. Cortex Debug Connector

Cortex Debug
Connector pin

1 VCC_TARGET_P3V3 ATSAMB11ZR voltage

Pin / Net Function Shared functionality

2 GPIO_1 SWD data signal EDBG SWD

3 GND Ground

4 GPIO_2 SWD clock signal EDBG SWD

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ATSAMB11ZR

Cortex Debug
Connector pin

5 GND Ground

6 - -

7 - -

8 - -

9 GND Ground

10 CHIP EN Target reset signal Reset Button

Note:  The Target reset (CHIP EN pin on the ATSAMB11ZR-210CA module) is isolated from the Cortex
Debug Connector by R300 (0 Ohm link) which is not mounted by default in the PCBA.

4.2 Peripherals

4.2.1 Crystals

The SAM B11ZR Xplained Pro kit contains one mounted 32.768kHz crystal that can be used as a clock
source for the SAM B11ZR. The crystal has cut-straps next to it that can be used to measure the
oscillator safety factor. This is done by cutting the strap and adding a resistor across the strap.
Information about oscillator allowance and safety factors can be found in application note AVR41001.

Pin / Net Function Shared functionality

Table 4-4. External 32.768kHz Crystal

SAM B11ZR pin Function Shared functionality

RTC_CLKP XIN32 -

RTC_CLKN XOUT32 -

4.2.2 Mechanical Buttons

SAM B11ZR Xplained Pro contains two mechanical buttons:

• RESET button connected to the SAM B11ZR reset line

– When the RESET button is pressed it drives the I/O line to ground

• Generic user configurable button

– When the user button is pressed it drives the I/O line to target voltage

Note:  There is no pull up resistor connected to the generic user button. Remember to enable the
internal pull up in the SAM B11ZR to use the button.

Table 4-5. Mechanical Buttons

SAM B11ZR pin Silkscreen text Shared functionality

CHIP EN RESET EDBG SWD

AO_GPIO_0 SW0 EXT1

4.2.3 LED

There is one yellow LED available on the SAM B11ZR Xplained Pro board that can be turned on and off.
The LED can be activated by driving the connected I/O line to GND.

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Table 4-6. LED Connection

SAM B11ZR pin Function Shared functionality

LP_GPIO_16 Yellow LED0 EDBG GPIO, EXT3

4.2.4 Debug I2C and UART Headers

Debug I2C and UART headers are used for debugging the BLE stack in the SAM B11 boards. Both these
headers are not mounted on the production variant.

The following table provides the Debug I2C pin description:

Table 4-7. Debug I2C Pin description Specification

SAM B11ZR pin Function Shared functionality

I2C SCL Clock line for I2C EXT3, Crypto Authentication Device

GND Ground

I2C SDA Data line for I2C EXT3, Crypto Authentication Device

NC

The following table provides the Debug UART pin description:

ATSAMB11ZR

Table 4-8. Debug UART Pin description Specification

SAM B11ZR pin Function Shared functionality

UART TXD UART TX pin

UART RXD UART RX pin

GND

Note:  Debug information is not supported in the BluSDK Smart. This section will be updated once
support for this is available

4.2.5 Battery Header

The SAM B11ZR Xplained Pro has a BATTERY HEADER for connecting the battery to power the
ATSAMB11ZR-210CA module. The battery header has a VCC and GND pin and is reverse polarity
protected. The battery power supply can be given to the device by placing a jumper over pin 1-2 on the 3­pin VBAT SELECT header.

By default the jumper is placed over pin 2-3 to select the board power supply. This configuration is
selected to avoid draining the battery and can be used during development.

Table 4-9. VBAT SELECT Header

VBAT SELECT pin Function

1 Power from battery

2 VCC pin of SAM B11ZR board, powers both MCU and Extensions

3 Power from board supply

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4.2.6 Temperature Sensor

The SAM B11ZR Xplained Pro has an on-board temperature sensor AT30TSE758A, powered by the
VCC_TARGET_P3V3 of the board. The temperature sensor is I²C controlled and is available on the
address 0x48 (7-bit MSB address).

AT30TSE758A also has a serial EEPROM accessible through I2C.

SAMB11 pin Function Shared functionality

LP_GPIO_8 SDA (Data line) EXT1, EDBG I²C

LP_GPIO_9 SCL (Clock line) EXT1, EDBG I²C

AO_GPIO_2 ALERT EXT1, EXT3

4.2.7 Crypto Authentication Device

The SAM B11ZR Xplained Pro has a Crypto Authentication Device (ATECC508A) connected to the I2C
bus. The table below shows all the connections between the ATECC508A and ATSAMB11ZR-210CA
module.

Table 4-10. ATECC508A Connections

SAMB11 ZR pin ATECC508A pin Function Shared Functionality

ATSAMB11ZR

4 5 UART2_CTS/I2C1_SDA DEBUG I²C,EXT3

5 6 UART2_RTS/I2C1_SCL DEBUG I²C,EXT3

4.3 Embedded Debugger Implementation

SAM B11ZR Xplained Pro contains an Embedded Debugger (EDBG) that can be used to program and
debug the ATSAMB11ZR using Serial Wire Debug (SWD). The Embedded Debugger also includes a
Virtual Com port interface over UART, a Data Gateway Interface (DGI) over SPI, and I2C , and also
includes four of the SAM B11ZR GPIOs. The kit also includes a XAM extension processor to the
Embedded Debugger for on-board current measurement. Atmel Studio can be used as a front-end for the
Embedded Debugger.

4.3.1 Serial Wire Debug

The Serial Wire Debug (SWD) uses two pins to communicate with the target. For further information on
how to use the programming and debugging capabilities of the EDBG, see Embedded Debugger.

Table 4-11. SWD Connections

SAM B11ZR pin Function

LP_GPIO_0 SWD clock

LP_GPIO_1 SWD data

4.3.2 Virtual COM Port

The Embedded Debugger acts as a Virtual Com Port gateway by using one of the ATSAMB11ZR UARTs.
For further information on how to use the Virtual COM port, see Embedded Debugger.

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Table 4-12. Virtual COM Port Connections

SAM B11ZR pin Function Shared functionality

LP_GPIO_2 RX line EXT1,EXT3

LP_GPIO_3 TX line EXT1,EXT3

4.3.3 Data Gateway Interface

The Embedded Debugger features an Data Gateway Interface (DGI) by using either an SPI or I²C. The
DGI can be used to send a variety of data from the ATSAMB11ZR to the host PC.

Table 4-13. DGI Interface Connections When Using SPI

SAM B11ZR pin Function Shared functionality

ATSAMB11ZR

LP_GPIO_12 GPIO/SPI SS (Slave select) (SAM

B11ZR is Master)

LP_GPIO_13 SPI MISO (Master In, Slave Out) EXT1

LP_GPIO_11 SERCOM5 PAD[2] SPI MOSI (Master

Out, Slave in)

LP_GPIO_10 SERCOM5 PAD[3] SPI SCK (Clock Out) EXT1

Table 4-14. DGI Interface Connections When Using I²C

SAM B11ZR pin Function Shared functionality

LP_GPIO_8 SDA (Data line) EXT1, Temperature Sensor

LP_GPIO_9 SCL (Clock line) EXT1, Temperature Sensor

Four GPIO lines are connected to the Embedded Debugger. The EDBG can monitor these lines and time
stamp pin value changes. This makes it possible to accurately time stamp events in the SAM B11ZR
application code.

Table 4-15. GPIO Lines Connected to the EDBG

SAM B11ZR pin Function Shared functionality

LP_GPIO_16 GPIO0 EXT3, USER LED

EXT1

EXT1

LP_GPIO_17 GPIO1 EXT1, EXT3

LP_GPIO_18 GPIO2 EXT1, EXT3

LP_GPIO_19 GPIO3 EXT3

4.3.4 SAM B11ZR Xplained Pro XAM Configuration

On the SAM B11ZR Xplained Pro the MCU and the MCU peripherals (e.g. extensions) are powered by
their own regulator, as shown in the following figure. All other parts of the board, mainly the embedded
debugger and accompanying Xplained Pro Analog Module (XAM), are powered from a separate
regulator. The current to the MCU and peripherals can be measured by connecting them to the XAM
output through jumper settings.

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Figure 4-2. SAMB11ZR XAM Implementation Block Diagram

ATSAMB11ZR

On the SAM B11ZR Xplained Pro the XAM can be used in four configurations:

1. No current measurement or external MCU current measurement: The XAM is bypassed and
thus the MCU and peripherals are supplied directly by the regulator. Set both jumpers in the
"BYPASS" position. In this configuration it is also possible to connect external measurement tools
on the Xplained Pro MCU power measurement header to measure MCU current directly instead of
using the XAM.

2. MCU current measurement: The XAM measures only the MCU current while the peripherals are
supplied directly by the regulator. For this configuration, place the jumper for "I/O" (peripherals) into
the "BYPASS" position and the for "MCU" into the "MEASURE" position.

3. Peripherals measurement: The XAM measures only the peripherals current while the MCU is
directly supplied by the regulator. For this configuration, place the jumper for "MCU" into the
"BYPASS" position and the "I/O" jumper into the "MEASURE" position.

4. MCU and peripherals measurement: In this configuration both MCU and peripherals are
measured by the XAM. Place both jumpers on "I/O" and "MCU" headers in the "MEASURE"
position.

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5. Hardware Revision History

5.1 Identifying Product ID and Revision

The revision and product identifier of the Xplained Pro boards can be found in two ways: either through
Atmel Studio or by looking at the sticker on the bottom side of the PCB.

When an Xplained Pro MCU board is connected to a computer with Atmel Studio running, an information
window with the serial number is shown. The first six digits of the serial number contain the product
identifier and revision. Information about connected Xplained Pro extension boards is also shown in the
window.

The same information can be found on the sticker on the bottom side of the PCB. Most kits have stickers
that have the identifier and revision printed in plain text as A09-nnnn\rr, where nnnn is the identifier and rr
is the revision. Boards with limited space have a sticker with only a data matrix code, which contains a
serial number string.

The serial number string has the following format:

"nnnnrrssssssssss"

ATSAMB11ZR

n = product identifier

r = revision

s = serial number

The product identifier for the SAM B11ZR Xplained Pro is A09-2691.

5.2 Hardware Revision

Revision 4 is the initially released revision.

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6. Document Revision History

Rev A - 09/2017

Section Changes

Document Initial Release

ATSAMB11ZR

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ATSAMB11ZR

The Microchip Web Site

Microchip provides online support via our web site at http://www.microchip.com/. This web site is used as
a means to make files and information easily available to customers. Accessible by using your favorite
Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design
resources, user’s guides and hardware support documents, latest software releases and archived
software

• General Technical Support – Frequently Asked Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases,
listing of seminars and events, listings of Microchip sales offices, distributors and factory
representatives

Customer Change Notification Service

Microchip’s customer notification service helps keep customers current on Microchip products.
Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata
related to a specified product family or development tool of interest.

To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on
“Customer Change Notification” and follow the registration instructions.

Customer Support

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included
in the back of this document.

Technical support is available through the web site at: http://www.microchip.com/support

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DS70005334A-page 22

PART NO. X /XX XXX

PatternPackageTemperature

Range

Device

[X]

(1)

Tape and Reel

Option

-

ATSAMB11ZR

Product Identification System

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

Device: PIC16F18313, PIC16LF18313, PIC16F18323, PIC16LF18323

Tape and Reel Option: Blank = Standard packaging (tube or

tray)

T = Tape and Reel

Temperature Range: I = -40°C to +85°C (Industrial)

E = -40°C to +125°C (Extended)

Package:

(2)

JQ = UQFN

P = PDIP

ST = TSSOP

(1)

SL = SOIC-14

SN = SOIC-8

RF = UDFN

Pattern: QTP, SQTP, Code or Special Requirements (blank otherwise)

Examples:

• PIC16LF18313- I/P Industrial temperature, PDIP package

• PIC16F18313- E/SS Extended temperature, SSOP package

Note: 

1. Tape and Reel identifier only appears in the catalog part number description. This identifier is used
for ordering purposes and is not printed on the device package. Check with your Microchip Sales
Office for package availability with the Tape and Reel option.

2. Small form-factor packaging options may be available. Please check http://www.microchip.com/

packaging for small-form factor package availability, or contact your local Sales Office.

Microchip Devices Code Protection Feature

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the
market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of
these methods, to our knowledge, require using the Microchip products in a manner outside the
operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is
engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

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DS70005334A-page 23

ATSAMB11ZR

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their
code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the
code protection features of our products. Attempts to break Microchip’s code protection feature may be a
violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software
or other copyrighted work, you may have a right to sue for relief under that Act.

Legal Notice

Information contained in this publication regarding device applications and the like is provided only for
your convenience and may be superseded by updates. It is your responsibility to ensure that your
application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY
OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS
CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life
support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend,
indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting
from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual
property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BeaconThings,
BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo,
Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, RightTouch, SAM-BA,
SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight
Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip
Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom,
chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoCompanion, CryptoController,
dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient
Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, QMatrix, RightTouch logo, REAL
ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of
Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

©

2017, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.

© 2017 Microchip Technology Inc.

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DS70005334A-page 24

ATSAMB11ZR

ISBN: 978-1-5224-2143-6

Quality Management System Certified by DNV

ISO/TS 16949

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer
fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures are for its PIC® MCUs and dsPIC
DSCs, KEELOQ® code hopping devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design and manufacture of development
systems is ISO 9001:2000 certified.

®

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Worldwide Sales and Service

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