Microchip Technology RN52 Users manual

RN52 Bluetooth Audio Module
r
r

Features:

• Fully qualified Bluetooth® version 3.0 module, fully compatible with Bluetooth version 2.1+EDR,
1.2, and 1.1
• Software configurable through commands over UART console interface
• Dedicated GPIO pins enable MCUs to access control and status functions efficiently
• Postage-stamp-sized form factor, 13.5 x 26.0 x
2.7 mm
• Embedded Bluetooth stack profiles: A2DP, AVRCP, HFP/HSP, and SPP
• Dual-channel, differential audio input and output for highest quality audio
• Supports iAP profile to discover iOS devices and apps (requires a special firmware build)
• Integrated amplifier for driving 16 Ω speakers
• UART (SPP) data connection interfaces
• External audio CODECs supported via S/PDIF
2
S interface
and I
• Castellated SMT pads for easy and reliable PCB mounting
• Environmentally friendly, RoHS compliant
• Certifications: FCC, ICS, CE
• Bluetooth SIG certified

RN52 Block Diagram:

RN52
2 LEDs
MIC
MIC
PCB Antenna
Bluetooth 3.0 RF Baseband
Audio DSP
16-Bit Stereo
CODEC
RN52-DS
Speake
Speake
UART
USB

Applications:

• High-quality, 2-channel audio streaming
• Wireless stereo headsets
I2S
S/PDIF
16-Bit RISC MCU
16-MBit Flash
11 GPIO
Pins
1 AIO
• Automotive hands free audio
• Wireless audio docking station for smartphones
• Wireless speakers
• Intercom push-to-talk audio connection
• Remote control for media player
• Medical devices
• Computer accessories
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Advanced Information
RN52-DS

1.0 DEVICE OVERVIEW

Roving Network’s RN52 Bluetooth audio module pro­vides a highly integrated solution for delivering high­quality stereo audio in a small form factor. It combines a class 2 Bluetooth radio with an embedded DSP pro­cessor. The module is programmed and controlled with a simple ASCII command language.
The RN52 module complies with Bluetooth specifica­tion version 3.0. It integrates RF, a baseband controller, etc., making it a complete Bluetooth subsystem. The RN52 supports a variety of profiles including HSP/HFP, A2DP, AVRCP, SPP, and iAP. It provides a UART inter­face, several user programmable I/O pins, stereo speaker outputs, microphone inputs, and a USB port.
Ta bl e 1 -1 provides the general specifications for the
module. Ta b le 1 -2 and Table 1-3 provide the module’s weight, dimensions, and electrical characteristics.
TABLE 1-1: GENERAL SPECIFICATIONS
Specification Description
Standard Bluetooth 3.0, class 2
Frequency Band 2.4 ~ 2.48 GHz
Modulation Method GFSK, PI/4-DQPSK, 8 DPSK
Maximum Data Rate 3 Mbps
RF Input Impedance 50 ohms
Interface UART, GPIO, AIO, USB, SPI, speaker, microphone
Operation Range 10 meters (33 feet)
Sensitivity -85 dBm at 0.1 % BER
RF TX Power 4 dBm
TABLE 1-2: WEIGHT & DIMENSIONS
Specification Description
Dimensions 26.0 mm x 13.5 mm x 2.7 mm
Weight 1.2 g
TABLE 1-3: ELECTRICAL CHARACTERISTICS
Specification Description
Supply Voltage 3.0 ~ 3.6 V DC
Working current Depends on profiles, 30 mA typical
Standby current (disconnected) < 0.5 mA
Temperature -40ºC to +85ºC
ESD JESD22-A224 class 0 product
Humidity 10% ~ 90% non-condensing
Figure 1-1 shows the module’s dimensions and Figure 1-2 shows recommended landing pattern and
layout.
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Advanced Information

FIGURE 1-1: MODULE DIMENSIONS

0.00
2.55
0.85
3.75
4.95
6.15
7.35
8.55
9.75
10.95
12.65
13.50
0.0
26.00
PCB Outline: +/- 0.13 mm PCB Thickness: +/- 0.100 mm
Tolerances:
(Top View)
Dimensions are in millimeters
21.20
21.40
20.00
18.80
17.60
16.40
15.20
14.00
12.80
11. 60
10.40
9.20
8.00
6.80
5.60
4.40
3.20
2.00
(Side View)
26.00
21.40
0.70
0.00
0.00
0.80
2.70
0.75
12.75
0.8mm
1.6mm
0.80mm
Dimensions are in millimeters
0.00
2.55
0.85
3.75
4.95
6.15
7.35
8.55
9.75
10.95
12.65
13.50
0.0
26.00
21.20
21.40
20.00
18.80
17.60
16.40
15.20
14.00
12.80
11. 60
10.40
9.20
8.00
6.80
5.60
4.40
3.20
2.00
3.25
4.65
6.05
7.45
8.85
10.25
20.70
Ground Pads
0.8 x 1.0 mm
Host Ground Plane Edge (See Mounting Details)
(Top View)
RN52-DS

FIGURE 1-2: RECOMMENDED PCB FOOTPRINT

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Advanced Information
Figure 1-3 shows the pinout and Ta bl e 1- 4 describes
RN52
Top View
GND
GPIO7
GPIO6
PWREN
VDD
PCM_IN
PCM_OUT
PCM_SYNC
PCM_CLK
GND
GND GPIO3 GPIO2 AICO0 GPIO4 GPIO5 GPIO12 GPIO13 GPIO11 GPIO10 GPIO9 USBD­USBD+ UART_RTS UART_CTS UART_TX UART_RX
GND
SPKR_L+
SPKR_R+
SPKR_L-
SPKR_R-
AGND
MIC_R-
MIC_L-
MIC_R+
MIC_L+
MIC_BIAS
LED0 LED1
SPI_MOSI
SPI_SCK
SPI_MISO
SPI_SS
GND
GND
GND
GND
GND
GND
1 2 3 4 5 6 7 8
9 10 11 12 13 14 15 16 17
44 43 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28
18
19202122232425
26
27
5049484746
45
the module’s pins.

FIGURE 1-3: PIN DIAGRAM

RN52-DS
TABLE 1-4: PIN DESCRIPTION (PART 1 OF 3) Note 1
Pin Symbol I/O Type Description Direction Default
1 GND Ground. Ground. 2 GPIO3 Bidirectional with program-
mable strength internal pull-up/down.
3 GPIO2 Bidirectional with program-
4 AIO0 Bidirectional. Analog programmable input/output line. I/O 5 GPIO4 Bidirectional with program-
mable strength internal pull-up/down.
mable strength internal pull-up/down.
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This pin enters device firmware update (DFU) mode at bootup if a USB device powers VBUS. GPIO3 requires 47 kΩ to ground and 22 kΩ to the USB VBUS signal if the USB VBUS is supply­ing power to the main board.
Reserved, event register. Toggles from high to low for 100 ms to indicate that the module’s state has changed. A microcontroller can enter com­mand mode and poll the state register using the Q action command.
Factory reset mode. To reset the module to the factory defaults, GPIO4 should be high on power-up and then toggle low, high, low, high with a 1 second wait between the transitions.
Advanced Information
Input Low
Output High
Input Low
RN52-DS
TABLE 1-4: PIN DESCRIPTION (PART 2 OF 3) Note 1
Pin Symbol I/O Type Description Direction Default
6 GPIO5 Bidirectional with program-
mable strength internal pull-up/down.
7 GPIO12 Bidirectional with program-
mable strength internal pull-up/down.
8 GPIO13 Bidirectional with program-
mable strength internal pull-up/down.
9 GPIO11 Bidirectional with program-
mable strength internal pull-up/down.
10 GPIO10 Bidirectional with program-
mable strength internal pull-up/down.
11 GPIO9 Bidirectional with program-
mable strength internal pull-up/down.
12 USBD- Bidirectional. USB data minus. I/O 13 USBD+ Bidirectional. USB data plus with selectable internal 1.5-Kohm
14 UART_RTS CMOS output, tri-state, with
weak internal pull-up.
15 UART_CTS CMOS input with weak
internal pull-down.
16 UART_TX CMOS output, tri-state, with
weak internal pull-up.
17 UART_RX CMOS input with weak
internal pull-down.
18 GND Ground. Ground. 19 GPIO7 Bidirectional with program-
mable strength internal pull-up/down.
20 GPIO6 Bidirectional with program-
mable strength internal pull-up/down.
21 PWREN Analog. Pull high to power up RN52. 22 VDD 3.3-V power input. 3.3v power input. 23 PCM_IN CMOS input, with weak
internal pull down.
24 PCM_OUT CMOS input, with weak
internal pull down.
25 PCM_SYNC Bidirectional with weak
internal pull down.
26 PCM_CLK CMOS input, with weak
internal pull down.
Programmable I/O. I/O High
Programmable I/O. I/O High
Programmable I/O. I/O High
Programmable I/O. I/O High
Programmable I/O. I/O High
When you drive this signal low, the module’s
Input High UART goes into command mode. If this signal floats high, the UART is in data mode. Reserved. Not available for use at runtime.
I/O
pull-up resistor.
UART request to send active low. Output
UART clear to send active low. Input
UART data output. Output
UART data input. Input
Driving this pin low sets the UART baud rate to
I/O High 9,600. By default the pin is high with a baud rate of 115,200.
Programmable I/O. I/O High
Synchronous data input, configurable for SPDIF_IN or SD_IN (I
Synchronous data input, configurable for SPDIF_OUT or SD_OUT (I
2
S).
2
S).
Input
Input
Synchronous data sync; WS (I2S). I/O
Synchronous data clock; SCK (I
2
S). Input
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Advanced Information
RN52-DS
TABLE 1-4: PIN DESCRIPTION (PART 3 OF 3) Note 1
Pin Symbol I/O Type Description Direction Default
27 GND Ground. Ground. 28 SPI_SS CMOS input with weak
internal pull-up.
29 SPI_MISO CMOS output, tri-state, with
weak internal pull-down.
30 SPI_CLK Input with weak internal
pull-down.
31 SPI_MOSI CMOS input, with weak
internal pull-down.
32 LED1 Open drain output. Drives an LED. For the RN-52-EK board, this
33 LED0 Open drain output. Drives an LED. For the RN-52-EK board, this
34 MIC_BIAS Analog. Microphone bias. Output 35 MIC_L+ Analog. Microphone input positive, left. Output 36 MIC_R+ Analog. Microphone input positive, right. Output 37 MIC_L- Analog. Microphone input negative, left. Output 38 MIC_R- Analog. Microphone input negative, right. Output 39 AGND Analog. Ground connection for audio. 40 SPK_R- Analog. Speaker output negative (right side). Output 41 SPK_L- Analog. Speaker output negative (left side). Output 42 SPK_R+ Analog. Speaker output positive (right side). Output 43 SPK_L+ Analog. Speaker output positive (left side). Output 44 GND Ground. Ground. 45 GND Ground. RF ground. 46 GND Ground. RF ground. 47 GND Ground. RF ground. 48 GND Ground. RF ground. 49 GND Ground. RF ground. 50 GND Ground. RF ground.
Note 1: All GPIO pins default to input with weak pull-down.
Chip select for Synchronous Serial Interface active low.
Serial Peripheral Interface (SPI) output. Output
SPI clock. Input
SPI input. Input
signal drives the red LED.
signal drives the blue LED.
Input
Output
Output

1.1 Audio Interface Circuit Description

The RN52 audio interface circuit consists of:
• Stereo audio CODEC
• Dual audio inputs and dual outputs
• Configurable S/PDIF and I
The audio input circuitry has a dual audio input that can be configured as single-ended or fully differential and programmed for microphone or line input. It has an analog and digital programmable gain stage so that it can be optimized for different microphones. See
Figure 1-4.
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2
S interface
Advanced Information

1.1.1 STEREO AUDIO CODEC INTERFACE

The stereo audio CODEC interface has stereo and mono analog input/output for voice and audio bands. It supports the IEC-60958 stereo digital audio bus stan­dards, e.g., S/PDIF and AES3/EBU.
The built-in CODEC uses a fully differential architecture in the analog signal path, which results in low noise sensitivity and good power supply rejection while effec­tively doubling the signal amplitude. It operates from a
1.5 V single power supply and uses a minimum of
external components. See Figure 1-5.
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