Microchip Technology PAC1921 User Manual
PAC1921
High-Side Current/Power Sensor
Evaluation Board
User’s Guide
2015 Microchip Technology Inc. DS50002376A
Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
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intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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FlashFlex, flexPWR, JukeBlox, K
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SST, SST Logo, SuperFlash and UNI/O are registered
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Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
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MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
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All other trademarks mentioned herein are property of their
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© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-460-6
EELOQ, KEELOQ logo, Kleer,
32
logo, RightTouch, SpyNIC,
QUALITY MANAGEMENT S
DS50002376A-page 2 2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
Object of Declaration: PAC1921 High-Side Current/Power Sensor Evaluation Board
2015 Microchip Technology Inc. DS50002376A-page 3
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 4 2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
Warranty Registration............................................................................................ 8
Recommended Reading........................................................................................ 9
The Microchip Web Site ........................................................................................ 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ................................................................................................... 11
1.2 PAC1921 Evaluation System ........................................................................ 11
1.3 What is the PAC1921 High-Side Current/Power Sensor Evaluation Board? ..... 12
1.3.1 Board Layout ............................................................................................. 12
1.4 What the PAC1921 High-Side Current/Power Sensor Evaluation
Board Kit Contains................................................................................... 13
Chapter 2. Installation and Operation
2.1 Getting Started .............................................................................................. 15
2.1.1 System Requirements ................................................................................ 15
2.2 Installing the Evaluation Board Software....................................................... 15
2.3 Microchip USB Bridge Installation ................................................................. 19
Chapter 3. Hardware Description
3.1 Introduction.................................................................................................... 21
3.1.1 Power Source ............................................................................................. 21
3.2 USB-to-SMBus Bridge................................................................................... 21
3.2.1 Direct SMBus Connect Option ................................................................... 21
3.3 Operating Mode............................................................................................. 22
3.3.1 SMBus Mode .............................................................................................. 22
3.4 LED Indicators............................................................................................... 22
3.5 Jumper Settings ............................................................................................ 23
3.6 Test Points .................................................................................................... 24
3.7 Demo Mode Setup and Operation................................................................. 25
3.8 Sys Mode Setup and Operation .................................................................... 25
3.8.1 Jumper Positions ........................................................................................ 25
3.8.2 Load Connection ........................................................................................ 25
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PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
Chapter 4. Software Description
4.1 Overview ....................................................................................................... 27
4.1.1 Tips for Using the Evaluation Board GUI ...................................................28
4.2 Interface Description and Operation.............................................................. 29
4.2.1 Panel Control Section .................................................................................29
4.2.2 Main Configuration Panel............................................................................31
4.2.3 Overflow Status Panel ................................................................................32
4.2.4 R
4.2.5 Panel and Integration Control Panel ...........................................................32
4.2.6 EVB Demo Configuration Panel..................................................................33
4.3 Tab Descriptions ........................................................................................... 34
4.3.1 Vbus & Vsense Tab ....................................................................................34
4.3.2 Vbus, Vsense and Vpower Tabs.................................................................35
4.3.3 Calculations/File IO Tab..............................................................................36
4.3.4 Integration Table Tab ..................................................................................38
4.4 Evaluation Board Examples .......................................................................... 39
4.4.1 Power Pin-Controlled Integration Example .................................................39
4.4.2 Power Free-Run Integration Example.........................................................42
4.5 Troubleshooting............................................................................................. 45
4.5.1 GUI Controls Unresponsive After Installation .............................................45
4.5.2 GUI Freezes................................................................................................45
Panel ...............................................................................................32
sense
Appendix A. Schematic and Layouts
A.1 Introduction ................................................................................................... 47
A.2 Board – PAC1921 Current Shunt and Power Monitor Schematic................. 48
A.3 Board – USB Bridge and Sig Gen Schematic............................................... 49
A.4 Board – Top Silk ........................................................................................... 50
A.5 Board – Top Copper and Silk........................................................................ 50
A.6 Board – Top Copper ..................................................................................... 51
A.7 Board – Bottom Copper ................................................................................ 51
A.8 Board – Bottom Copper and Silk .................................................................. 52
A.9 Board – Bottom Silk ...................................................................................... 52
Appendix B. Bill of Materials (BOM) ...........................................................................53
Worldwide Sales and Service .....................................................................................56
DS50002376A-page 6 2015 Microchip Technology Inc.
PAC1921
HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available on-line help files.
®
IDE on-line help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
PAC1921 High-Side Current/Power Sensor Evaluation Board. Items discussed in this
chapter include:
• Document Layout
• Conventions Used in this Guide
• Warranty Registration
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the PAC1921 High-Side Current/Power Sensor
Evaluation Board as a development tool to emulate and debug firmware on a target
board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the PAC1921
High-Side Current/Power Sensor Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on installing and
starting the application.
• Chapter 3. “Hardware Description” – Shows hardware details of the PAC1921
High-Side Current/Power Sensor Evaluation Board.
• Chapter 4. “Software Description” – Describes the main operations in the software.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the PAC1921 High-Side Current/Power Sensor Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
PAC1921 High-Side Current/Power Sensor Evaluation Board.
2015 Microchip Technology Inc. DS50002376A-page 7
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description Represents Examples
Arial font:
Italic characters Referenced books MPLAB
Emphasized text ...is the only compiler...
Initial caps A window the Output window
A dialog the Settings dialog
A menu selection select Enable Programmer
Quotes A field name in a window or
dialog
Underlined, italic text with
right angle bracket
Bold characters A dialog button Click OK
N‘Rnnnn A number in verilog format,
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Courier New font:
Plain Courier New Sample source code #define START
Italic Courier New A variable argument file.o, where file can be
Square brackets [ ] Optional arguments mcc18 [options] file
Curly brackets and pipe
character: { | }
Ellipses... Replaces repeated text var_name [,
A menu path File>Save
A tab Click the Power tab
where N is the total number of
digits, R is the radix and n is a
digit.
Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’
Choice of mutually exclusive
arguments; an OR selection
Represents code supplied by
user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options]
errorlevel {0|1}
var_name...]
void main (void)
{ ...
}
®
IDE User’s Guide
WARRANTY REGISTRATION
Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip web site.
DS50002376A-page 8 2015 Microchip Technology Inc.
RECOMMENDED READING
This user’s guide describes how to use PAC1921 High-Side Current/Power Sensor
Evaluation Board. Other useful documents are listed below. The following Microchip
documents are available and recommended as supplemental reference resources.
PAC1921 Data Sheet (DS20005293)
This data sheet describes the operation and features of the PAC1921 high-side
power/current monitor device with a configurable analog output.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
Preface
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support
DOCUMENT REVISION HISTORY
Revision A (June 2015)
• Initial Release of this Document.
2015 Microchip Technology Inc. DS50002376A-page 9
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
DS50002376A-page 10 2015 Microchip Technology Inc.
HIGH-SIDE CURRENT/POWER SENSOR
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EVALUATION BOARD USER’S GUIDE
Chapter 1. Product Overview
1.1 INTRODUCTION
The PAC1921 is a dedicated power monitoring device with a configurable output. The
PAC1921 High-Side Current/Power Sensor Evaluation Board package provides users
with the means to exercise device functionality while connected either to target
systems (Sys mode) or while utilizing on-board sources (Demo mode).
1.2 PAC1921 EVALUATION SYSTEM
The evaluation system has three major parts, as shown in Figure 1-1:
• Customer-provided Windows
• Microchip PAC1921 Graphical User Interface (GUI) (based on
National Instruments™ LabVIEW™ software)
• Microchip PAC1921 High-Side Current/Power Sensor Evaluation Board
• USB Cable for GUI communications (Standard-A plug to Mini-B plug)
®
PC with an available USB port
PAC1921
2015 Microchip Technology Inc. DS50002376A-page 11
FIGURE 1-1: PAC1921 Evaluation System.
Note: Screen captures in this document were taken on a PC with Windows® 7
Professional using the default desktop colors. The colors on your screen
may vary, especially if a Windows theme has been applied on the PC.
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
1.3 WHAT IS THE PAC1921 HIGH-SIDE CURRENT/POWER SENSOR EVALUATION BOARD?
The evaluation system is comprised of the ADM00592 and a LabVIEW software-based
application which allows the user to do the following:
• View and change register values
• Saving settings of all registers allowing for quick configuration at a later time
• Graphing registers
The hardware platform provides the following features to the user:
• Headers for connecting a sense resistor
• USB-to-SMBus bridge for communications
• Capability to connect directly to an external SMBus master
1.3.1 Board Layout
The evaluation board was designed for ease of use and user experimentation.
Figure 1-2 shows the top silkscreen for the board.
FIGURE 1-2: PAC1921 High-Side Current/Power Sensor Evaluation Board – Top Silkscreen.
DS50002376A-page 12 2015 Microchip Technology Inc.
Product Overview
1.4 WHAT THE PAC1921 HIGH-SIDE CURRENT/POWER SENSOR EVALUATION BOARD KIT CONTAINS
This PAC1921 High-Side Current/Power Sensor Evaluation Board kit includes:
• PAC1921 High-Side Current/Power Sensor Evaluation Board (ADM00592)
• Supplied USB Mini Connector Cable
• Important Information Sheet
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PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
NOTES:
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HIGH-SIDE CURRENT/POWER SENSOR
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1 GETTING STARTED
2.1.1 System Requirements
To use the PAC1921 High-Side Current/Power Sensor Evaluation Board, the following
are required:
•A PC running the Microsoft
• A display resolution of 800x600 or larger, for viewing several windows
simultaneously
• An available USB port
2.2 INSTALLING THE EVALUATION BOARD SOFTWARE
Follow these steps in order to install the board’s Graphical User Interface (GUI):
1. Download the software archive from the board’s web page, unzip it and
double-click the Setup.exe to start the installation. Figure 2-1 shows the initial
installation screen, which displays briefly as the setup program loads.
®
Windows® operating system
PAC1921
FIGURE 2-1: Software Installation – Initialize Window.
2015 Microchip Technology Inc. DS50002376A-page 15
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
2. Click Next in the Destination Directory window, shown in Figure 2-2. For proper
operation, the files must be installed in the default locations. The default location
for the software files is C:\Program Files (x86)\Microchip\PAC1921
and for the LabVIEW™ software is C:\Program Files\
National Instruments.
FIGURE 2-2: Software Installation – Setting the Destination Directory.
DS50002376A-page 16 2015 Microchip Technology Inc.
Installation and Operation
3. Read and accept the license agreement, then click Next.
FIGURE 2-3: Software Installation – Software License Agreement.
4. To use the LabVIEW software, read and accept the license agreement, then click
Next.
FIGURE 2-4: Software Installation – LabVIEW™ Software License Agreement.
2015 Microchip Technology Inc. DS50002376A-page 17
PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide
5. Follow the on-screen instructions to complete the installation. During installation,
shortcuts will be created on the Windows Start Menu under Programs>
and on the desktop.
PAC1921
FIGURE 2-5: Software Installation – LabVIEW™ Software Installation Screen.
FIGURE 2-6: Software Installation – LabVIEW™ Software Installation Complete.
DS50002376A-page 18 2015 Microchip Technology Inc.
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