Microchip Technology PAC1921 User Manual

PAC1921

High-Side Current/Power Sensor

Evaluation Board

User’s Guide

 2015 Microchip Technology Inc. DS50002376A

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, K
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.

The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.

Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.

GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.

All other trademarks mentioned herein are property of their
respective companies.

© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

ISBN: 978-1-63277-460-6

EELOQ, KEELOQ logo, Kleer,

32

logo, RightTouch, SpyNIC,

QUALITY MANAGEMENT S

DS50002376A-page 2  2015 Microchip Technology Inc.

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

Object of Declaration: PAC1921 High-Side Current/Power Sensor Evaluation Board

 2015 Microchip Technology Inc. DS50002376A-page 3

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

NOTES:

DS50002376A-page 4  2015 Microchip Technology Inc.

PAC1921

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 7

Introduction............................................................................................................ 7

Document Layout .................................................................................................. 7

Conventions Used in this Guide ............................................................................ 8

Warranty Registration............................................................................................ 8

Recommended Reading........................................................................................ 9

The Microchip Web Site ........................................................................................ 9

Customer Support ................................................................................................. 9

Document Revision History ................................................................................... 9

Chapter 1. Product Overview

1.1 Introduction ................................................................................................... 11

1.2 PAC1921 Evaluation System ........................................................................ 11

1.3 What is the PAC1921 High-Side Current/Power Sensor Evaluation Board? ..... 12

1.3.1 Board Layout ............................................................................................. 12

1.4 What the PAC1921 High-Side Current/Power Sensor Evaluation

Board Kit Contains................................................................................... 13

Chapter 2. Installation and Operation

2.1 Getting Started .............................................................................................. 15

2.1.1 System Requirements ................................................................................ 15

2.2 Installing the Evaluation Board Software....................................................... 15

2.3 Microchip USB Bridge Installation ................................................................. 19

Chapter 3. Hardware Description

3.1 Introduction.................................................................................................... 21

3.1.1 Power Source ............................................................................................. 21

3.2 USB-to-SMBus Bridge................................................................................... 21

3.2.1 Direct SMBus Connect Option ................................................................... 21

3.3 Operating Mode............................................................................................. 22

3.3.1 SMBus Mode .............................................................................................. 22

3.4 LED Indicators............................................................................................... 22

3.5 Jumper Settings ............................................................................................ 23

3.6 Test Points .................................................................................................... 24

3.7 Demo Mode Setup and Operation................................................................. 25

3.8 Sys Mode Setup and Operation .................................................................... 25

3.8.1 Jumper Positions ........................................................................................ 25

3.8.2 Load Connection ........................................................................................ 25

 2015 Microchip Technology Inc. DS50002376A-page 5

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

Chapter 4. Software Description

4.1 Overview ....................................................................................................... 27

4.1.1 Tips for Using the Evaluation Board GUI ...................................................28

4.2 Interface Description and Operation.............................................................. 29

4.2.1 Panel Control Section .................................................................................29

4.2.2 Main Configuration Panel............................................................................31

4.2.3 Overflow Status Panel ................................................................................32

4.2.4 R

4.2.5 Panel and Integration Control Panel ...........................................................32

4.2.6 EVB Demo Configuration Panel..................................................................33

4.3 Tab Descriptions ........................................................................................... 34

4.3.1 Vbus & Vsense Tab ....................................................................................34

4.3.2 Vbus, Vsense and Vpower Tabs.................................................................35

4.3.3 Calculations/File IO Tab..............................................................................36

4.3.4 Integration Table Tab ..................................................................................38

4.4 Evaluation Board Examples .......................................................................... 39

4.4.1 Power Pin-Controlled Integration Example .................................................39

4.4.2 Power Free-Run Integration Example.........................................................42

4.5 Troubleshooting............................................................................................. 45

4.5.1 GUI Controls Unresponsive After Installation .............................................45

4.5.2 GUI Freezes................................................................................................45

Panel ...............................................................................................32

sense

Appendix A. Schematic and Layouts

A.1 Introduction ................................................................................................... 47

A.2 Board – PAC1921 Current Shunt and Power Monitor Schematic................. 48

A.3 Board – USB Bridge and Sig Gen Schematic............................................... 49

A.4 Board – Top Silk ........................................................................................... 50

A.5 Board – Top Copper and Silk........................................................................ 50

A.6 Board – Top Copper ..................................................................................... 51

A.7 Board – Bottom Copper ................................................................................ 51

A.8 Board – Bottom Copper and Silk .................................................................. 52

A.9 Board – Bottom Silk ...................................................................................... 52

Appendix B. Bill of Materials (BOM) ...........................................................................53

Worldwide Sales and Service .....................................................................................56

DS50002376A-page 6  2015 Microchip Technology Inc.

PAC1921

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.

For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available on-line help files.

®

IDE on-line help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the
PAC1921 High-Side Current/Power Sensor Evaluation Board. Items discussed in this
chapter include:

• Document Layout

• Conventions Used in this Guide

• Warranty Registration

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the PAC1921 High-Side Current/Power Sensor
Evaluation Board as a development tool to emulate and debug firmware on a target
board. The manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the PAC1921

High-Side Current/Power Sensor Evaluation Board.

• Chapter 2. “Installation and Operation” – Includes instructions on installing and

starting the application.

• Chapter 3. “Hardware Description” – Shows hardware details of the PAC1921

High-Side Current/Power Sensor Evaluation Board.

• Chapter 4. “Software Description” – Describes the main operations in the software.

• Appendix A. “Schematic and Layouts” – Shows the schematic and layout

diagrams for the PAC1921 High-Side Current/Power Sensor Evaluation Board.

• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the

PAC1921 High-Side Current/Power Sensor Evaluation Board.

 2015 Microchip Technology Inc. DS50002376A-page 7

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog
A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with
right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe
character: { | }

Ellipses... Replaces repeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the total number of
digits, R is the radix and n is a
digit.

Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’

Choice of mutually exclusive
arguments; an OR selection

Represents code supplied by
user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]

errorlevel {0|1}

var_name...]

void main (void)
{ ...
}

®

IDE User’s Guide

WARRANTY REGISTRATION

Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip web site.

DS50002376A-page 8  2015 Microchip Technology Inc.

RECOMMENDED READING

This user’s guide describes how to use PAC1921 High-Side Current/Power Sensor
Evaluation Board. Other useful documents are listed below. The following Microchip
documents are available and recommended as supplemental reference resources.

PAC1921 Data Sheet (DS20005293)

This data sheet describes the operation and features of the PAC1921 high-side
power/current monitor device with a configurable analog output.

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:

• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program
member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives

Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.

Technical support is available through the web site at:

http://www.microchip.com/support

DOCUMENT REVISION HISTORY

Revision A (June 2015)

• Initial Release of this Document.

 2015 Microchip Technology Inc. DS50002376A-page 9

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

NOTES:

DS50002376A-page 10  2015 Microchip Technology Inc.

HIGH-SIDE CURRENT/POWER SENSOR

USB Cable

PC with 3$& GUI and

Microchip USB Bridge Driver

Microchip

3$&

Device

3$&(YDOXDWLRQ%RDUG

EVALUATION BOARD USER’S GUIDE

Chapter 1. Product Overview

1.1 INTRODUCTION

The PAC1921 is a dedicated power monitoring device with a configurable output. The
PAC1921 High-Side Current/Power Sensor Evaluation Board package provides users
with the means to exercise device functionality while connected either to target
systems (Sys mode) or while utilizing on-board sources (Demo mode).

1.2 PAC1921 EVALUATION SYSTEM

The evaluation system has three major parts, as shown in Figure 1-1:

• Customer-provided Windows

• Microchip PAC1921 Graphical User Interface (GUI) (based on
National Instruments™ LabVIEW™ software)

• Microchip PAC1921 High-Side Current/Power Sensor Evaluation Board

• USB Cable for GUI communications (Standard-A plug to Mini-B plug)

®

PC with an available USB port

PAC1921

 2015 Microchip Technology Inc. DS50002376A-page 11

FIGURE 1-1: PAC1921 Evaluation System.

Note: Screen captures in this document were taken on a PC with Windows® 7

Professional using the default desktop colors. The colors on your screen
may vary, especially if a Windows theme has been applied on the PC.

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

1.3 WHAT IS THE PAC1921 HIGH-SIDE CURRENT/POWER SENSOR EVALUATION BOARD?

The evaluation system is comprised of the ADM00592 and a LabVIEW software-based
application which allows the user to do the following:

• View and change register values

• Saving settings of all registers allowing for quick configuration at a later time

• Graphing registers

The hardware platform provides the following features to the user:

• Headers for connecting a sense resistor

• USB-to-SMBus bridge for communications

• Capability to connect directly to an external SMBus master

1.3.1 Board Layout

The evaluation board was designed for ease of use and user experimentation.

Figure 1-2 shows the top silkscreen for the board.

FIGURE 1-2: PAC1921 High-Side Current/Power Sensor Evaluation Board – Top Silkscreen.

DS50002376A-page 12  2015 Microchip Technology Inc.

Product Overview

1.4 WHAT THE PAC1921 HIGH-SIDE CURRENT/POWER SENSOR EVALUATION BOARD KIT CONTAINS

This PAC1921 High-Side Current/Power Sensor Evaluation Board kit includes:

• PAC1921 High-Side Current/Power Sensor Evaluation Board (ADM00592)

• Supplied USB Mini Connector Cable

• Important Information Sheet

 2015 Microchip Technology Inc. DS50002376A-page 13

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

NOTES:

DS50002376A-page 14  2015 Microchip Technology Inc.

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

Chapter 2. Installation and Operation

2.1 GETTING STARTED

2.1.1 System Requirements

To use the PAC1921 High-Side Current/Power Sensor Evaluation Board, the following
are required:

•A PC running the Microsoft

• A display resolution of 800x600 or larger, for viewing several windows
simultaneously

• An available USB port

2.2 INSTALLING THE EVALUATION BOARD SOFTWARE

Follow these steps in order to install the board’s Graphical User Interface (GUI):

1. Download the software archive from the board’s web page, unzip it and

double-click the Setup.exe to start the installation. Figure 2-1 shows the initial
installation screen, which displays briefly as the setup program loads.

®

Windows® operating system

PAC1921

FIGURE 2-1: Software Installation – Initialize Window.

 2015 Microchip Technology Inc. DS50002376A-page 15

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

2. Click Next in the Destination Directory window, shown in Figure 2-2. For proper

operation, the files must be installed in the default locations. The default location
for the software files is C:\Program Files (x86)\Microchip\PAC1921
and for the LabVIEW™ software is C:\Program Files\
National Instruments.

FIGURE 2-2: Software Installation – Setting the Destination Directory.

DS50002376A-page 16  2015 Microchip Technology Inc.

Installation and Operation

3. Read and accept the license agreement, then click Next.

FIGURE 2-3: Software Installation – Software License Agreement.

4. To use the LabVIEW software, read and accept the license agreement, then click

Next.

FIGURE 2-4: Software Installation – LabVIEW™ Software License Agreement.

 2015 Microchip Technology Inc. DS50002376A-page 17

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

5. Follow the on-screen instructions to complete the installation. During installation,
shortcuts will be created on the Windows Start Menu under Programs>
and on the desktop.

PAC1921

FIGURE 2-5: Software Installation – LabVIEW™ Software Installation Screen.

FIGURE 2-6: Software Installation – LabVIEW™ Software Installation Complete.

DS50002376A-page 18  2015 Microchip Technology Inc.

Installation and Operation

When the installation is complete, the program will automatically run (see Figure 2-7).

FIGURE 2-7: PAC1921 GUI Start-up Screen.

2.3 MICROCHIP USB BRIDGE INSTALLATION

Connect the USB mini connector to the evaluation board and the standard USB con­nector to any available USB port on the PC. If the Microchip USB bridge driver has not
previously been installed on the selected USB port, download the MCP2221 Windows
driver and installer from www.microchip.com at:

http://www.microchip.com/wwwproducts/Devices.aspx?product=MCP2221

Follow the on-screen instructions to complete the installation process.

 2015 Microchip Technology Inc. DS50002376A-page 19

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

NOTES:

DS50002376A-page 20  2015 Microchip Technology Inc.

Chapter 3. Hardware Description

3.1 INTRODUCTION

The PAC1921 High-Side Current/Power Sensor Evaluation Board provides the means
to evaluate features, and to view and modify registers. There are two modes for using
the evaluation board:

• Demo mode: Monitors an on-board power source

• Sys mode: Monitors an external power source

LEDs indicate status information and test points are included to monitor system
voltages with a user-provided voltmeter or oscilloscope.

The PAC1921 device is an SMBus-compliant, high-side current/power monitor in a
10-pin, 3 mm x 3 mm DFN package. For details regarding the PAC1921 device, refer
to the “PAC1921 Data Sheet” (DS20005293).

3.1.1 Power Source

The board requires only one Universal Serial Bus (USB) connection to power the
board. USB bus voltage is provided to the on-board test power sources and the
USB-to-SMBus bridge. The evaluation board circuitry uses the on-board regulator to
regulate the +5V USB power to +3.3V.

PAC1921

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

3.2 USB-TO-SMBus BRIDGE

The USB-to-SMBus is based on the MCP2221 USB-to-I2C™ protocol converter, which
provides the interface between the USB and the SMBus. Power is sourced to the
microcontroller from the USB interface for device power and communication.

3.2.1 Direct SMBus Connect Option

It is also possible to connect an external SMBus master to the PAC1921 High-Side
Current/Power Sensor Evaluation Board. A few modifications to the board are
required, as explained below:

• Remove the jumpers on J13 and connect the SMBus master to the

SMBus_DATA, SMBus_CLK and #READ/INT pins, as well as an external supply
for +3.3V. Note that a return is also provided on this header for convenience
(GND).

• The +3.3V can be supplied by the SMBus bridge by leaving the +3.3V jumper in

place and retaining the USB connection.

 2015 Microchip Technology Inc. DS50002376A-page 21

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

LED 1
V

DD

Power

LED 2
USB Power

LED 6
READ/INT

3.3 OPERATING MODE

3.3.1 SMBus Mode

By default, the evaluation board is configured so that the PAC1921 operates in SMBus
mode with an SMBus address of, 1001_100xb (98h). The address can be changed to
1001_101xb (9Ah) by moving jumper J8 to position 2-3. Cycle power to the evaluation
board in order for the change to take effect.

3.4 LED INDICATORS

LED locations are indicated in Figure 3-1.

FIGURE 3-1: LED Indicator Locations.

LEDs indicate the status of the signals, as described in Ta bl e 3- 1:

TABLE 3-1: LED STATUS INDICATORS

LED Signal OFF Green Red

LD1 V

LD2 +5V USB Power USB power is not present N/A +5V USB power is

LD6 READ/INT Pin is not asserted

DS50002376A-page 22  2015 Microchip Technology Inc.

Power VDD is not present N/A VDD is present

DD

(Read State)

Pin is asserted

(Integrate State)

present

N/A

3.5 JUMPER SETTINGS

J11

GND

J2

V

SOURCE-

J1

V

SOURCE+

J3

Demo Sys

J4

Demo Sys

J13

Connections

J5

Reserved

J6

Reserved

J7

Reserved

J8

ADDR/SEL

Note: Refer to Appendix A. “Schematic and Layouts” to see the

connections of each jumper position.

This evaluation board has pin headers and jumper configurations to evaluate the
features of the PAC1921. Jumper locations are indicated in Figure 3-2.

Hardware Description

FIGURE 3-2: Jumper and External Connection Locations.

 2015 Microchip Technology Inc. DS50002376A-page 23

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

Jumper settings are described in Tab le 3 - 2.

TABLE 3-2: JUMPER SETTINGS

Pin

Header

J1, J2 Vsource+, Vsource- External power source terminals. (See Section 3.8.2 “Load Connection”.)

J3, J4 Demo Sys Select Demo mode R

J5, J6, J7Reserved Reserved for future use

Label Default Position Alternate Position(s)

Positions 3-2 are jumpered on both

SENSE+/-

jumpers. (See Section 3.7 “Demo

Mode Setup and Operation”.)

.

Select Sys mode R
Positions 1-2 are jumpered on both
jumpers. (See Section 3.8 “Sys Mode

Setup and Operation”.)

SENSE+/-

.

J8 J8 (ADDR_SEL)

(See

Section 3.3.1 “SMBus
Mode”)

J11 GND Connect ground from external source for

J13 GND, #READ/INT,

SMBus_DATA,
SMBus_CLK, VDD

In SMBus mode, sets SMBus address to
1001_100b at power-up.
Positions 1-2 are jumpered.

USB bridge generates on-board 3.3V
and provides SMBus host.
Positions 1-2, 3-4, 5-6, 7-8, 9-10 are all
jumpered.

In SMBus mode, sets SMBus address to
1001_101b at power-up.
Positions 2-3 are jumpered.

Sys mode.

(See Section 3.2.1 “Direct SMBus

Connect Option”.)

3.6 TEST POINTS

The PAC1921 High-Side Current/Power Sensor Evaluation Board provides test points
for ground reference and signal access. Table 3-3 summarizes these test points.

TABLE 3-3: TEST POINTS

Test Point Marking Signal Function Monitored

1 Vsense+ (orange) SENSE+

2 Vsense- (yellow) SENSE-

3 OUT (white) OUT Pin

4 ADDR_SEL SMBus Address Select

5 Vdd (red) V

6 GND (black) Ground

7 #READ/INT (yellow) READ

DD

/INT Pin

DS50002376A-page 24  2015 Microchip Technology Inc.

3.7 DEMO MODE SETUP AND OPERATION

J11 GND

Connect to

System Ground

J2 V

SOURCE-

Connect to

System DC

Load or Supply

J1 V

SOURCE+

Connect to

System DC

Load or Supply

Demo mode uses an on-board current source to exercise and demonstrate the features
of the PAC1921 power monitor. The 100 mV constant-current source is provided using
a +5V USB as the supply. Parallel sense resistors are provided to convert the current
to a corresponding voltage for the PAC1921 to read at the SENSE+ and SENSE­inputs. The evaluation board is assembled with jumpers J3 and J4 positioned for Demo
mode (see Section 3.5 “Jumper Settings”). Current is controlled by the evaluation
board Demo Configuration section of the evaluation board GUI (see

Section 4.2.6 “EVB Demo Configuration Panel”).

3.8 SYS MODE SETUP AND OPERATION

Sys mode uses external current sources to exercise and demonstrate the features of
the PAC1921 power monitor.

3.8.1 Jumper Positions

To use Sys mode, reposition jumpers J3 and J4 (see Table 3-2) to disconnect the
on-board demonstration current sources.

3.8.2 Load Connection

Hardware Description

A 5 milliohm (1% tolerance) sense resistor, connected between J1 and J2, is provided
on-board the PAC1921 evaluation board to measure system current.

Load connections to the system can be established, as shown in Figure 3-3.

.

.

FIGURE 3-3: Load Connection Location.

 2015 Microchip Technology Inc. DS50002376A-page 25

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

NOTES:

DS50002376A-page 26  2015 Microchip Technology Inc.

4.1 OVERVIEW

Panel Control

Main Configuration Panel

Panel and Integration Control

Rsense Option Panel

EVB Demo Configuration Panel

Configuration/View Tabs

Overflow Status Panel

To get the Graphical User Interface (GUI) and the Evaluation Board (EVB) running,
follow these instructions:

1. Start the PAC1921 GUI software: from the Windows Start menu, select

2. Connect the USB mini connector end of the cable to the board and the standard

The PAC1921 High-Side Current/Power Sensor Evaluation Board Graphical User
Interface (GUI) is shown in Figure 4-1.

PAC1921

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

Chapter 4. Software Description

Programs

USB connector of the cable to any available USB port on the PC. The V
USB power LEDs (LD1 and LD2, respectively) will illuminate RED, indicating that
the PAC1921 is powered up and the MCP2221 USB bridge is connected to the PC.

>PAC1921.

DD

and

FIGURE 4-1: GUI Interface Panel.

 2015 Microchip Technology Inc. DS50002376A-page 27

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

When the evaluation board is connected or disconnected, a message displays as
shown in Figure 4-2. With the evaluation board connected, click Auto-detect Address
to restart communications.

FIGURE 4-2: Communications Failure Message.

4.1.1 Tips for Using the Evaluation Board GUI

• After a power-up of the evaluation board, the default settings are loaded. Users

can save the setting configurations to user-named files, which can be reloaded at
any time for quick reconfiguration (see Section 4.3.3.1 “Configuration Save and

Load”).

• To configure the GUI and PAC1921 for free-run integration power measurement,

press the <F2> function key on the keyboard.

• To reload the PAC1921 register defaults, press the <F6> function key on the

keyboard.

• When using the GUI, the PAC1921 can enter a Sleep state; however, it wakes to

service the GUI SMBus communications, then returns to Sleep. For this reason,
the current consumption will be slightly higher than expected in Sleep state when
using the GUI.

• When the PAC1921 enters Sleep state, the PAC1921 clears the measurement

registers, and consequently, the GUI Calculations/File IO tab is cleared. To
prevent the PAC1921 from entering Sleep, check the “SLEEP OVR” box in the
Main Configuration section.

DS50002376A-page 28  2015 Microchip Technology Inc.

4.2 INTERFACE DESCRIPTION AND OPERATION

COM Status
Indicator

SMBus
Address
Indicator

Stop Button

Enable Single
Read Option

Register Content

Run Button

4.2.1 Panel Control Section

The Panel Control section on the right side of the GUI, shown in Figure 4-3, affects the
GUI operation.

Software Description

FIGURE 4-3: Panel Control Section.

4.2.1.1 STOP AND RUN BUTTONS

Pressing the Stop button, as shown in Figure 4-3, interrupts the GUI software commu­nications with the evaluation board. When the Stop button is clicked, the Run button is
displayed on the menu bar (see Figure 4-4).

FIGURE 4-4: Run Button.

 2015 Microchip Technology Inc. DS50002376A-page 29

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

SMBus
Address
Indicator

COM Status
Indicator

Single Read
Button

To restart the communication between the software and the evaluation board, click the

Run button. The arrow button disappears when the communications resume.

Note 1: Stopping and restarting the GUI does not affect register settings. To

restore default register settings, disconnect power from the evaluation
board, then reconnect power.

2: Stopping the GUI clears the “Enable DC Vsense- Stimulus” box (see

Section 4.2.6 “EVB Demo Configuration Panel”).

To close the program, use the Close (X) button in the upper right corner of the window.

4.2.1.2 SMBus ADDRESS

The “SMBus Address” box, shown in Figure 4-5, indicates the selected SMBus
address. The SMBus address can be changed by moving a jumper (see

Section 3.3.1 “SMBus Mode”).

FIGURE 4-5: SMBus Address Indicator.

4.2.1.3 COM STATUS INDICATOR

The “COM” status indicator, on the right side of the panel as shown in Figure 4-5,
indicates the status of communications over the SMBus. During normal operation, the
“COM” indicator is black. If the SMBus communications fail, the “COM” indicator turns
red.

4.2.1.4 SINGLE READ/CONTINUOUS READ

The panel defaults to continuous register reads (toggle switch in down position, as
shown in Figure 4-5). To stop continuous register reads, check the “Enable Single
Read” box. In order to capture the register values at a given time, click the switch, which
will briefly flip to “Single Read”.

4.2.1.5 REGISTER CONTENT

“Reg Content”, shown in Figure 4-3, is a scrollable list of the PAC1921 registers and
the last read value. It is important to note that not all addresses are physical memory
locations on the device; these registers will read ‘0’. Likewise, some registers shown
(undocumented in the data sheet) may have data. Editing these registers can cause
unexpected results.

To update a register value, locate the register address in the left column, type the new
value in the corresponding cell in the right column, and press Enter on the keyboard or
click on another part of the GUI.

DS50002376A-page 30  2015 Microchip Technology Inc.

Software Description

4.2.1.5.1 Numbering Systems Views

The “Reg Content” section allows values to be displayed using different numbering
systems: Decimal, Hex, Octal, Binary or SI Notation.

To view a value using a different numbering system, click the indicator to the left of the
value in the cell, shown circled in Figure 4-6.

FIGURE 4-6: Numbering System Indicators.

4.2.2 Main Configuration Panel

The Main Configuration section, shown in Figure 4-7, contains the PAC1921 configu­ration controls in registers 00h, 01h and 02h. Refer to the data sheet for register bit
descriptions.

FIGURE 4-7: Main Configuration Panel.

4.2.2.1 ENABLE AUTO INT_EN

The “Enable Auto INT_EN” control is a GUI control convenience. Under normal
operation, for most of the integration parameter settings, changes do not take effect
until the PAC1921 is placed in the Read state. When the “Enable Auto INT_EN” control
is activated (light green – shown as “Enabled” in Figure 4-8), it automatically places the
PAC1921 into the Read state and back to Integrate state whenever a Main Configura­tion control is changed. It also updates the GUI calculations. When the
“Enable Auto INT_EN” control is disabled (dark green), the user must place the device
in the Read state before the “I_RES”, “V_RES”, “SAMPLES”, “VSENSE FILT_EN” and
“VBUS FILT_EN” changes take effect, and to update the GUI calculations.

It is recommended that the “Enable Auto INT_EN” control be activated when using
the GUI.

FIGURE 4-8: Enable Auto INT_EN GUI Control.

 2015 Microchip Technology Inc. DS50002376A-page 31

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

“READ/INT OVR” Box is Checked

4.2.3 Overflow Status Panel

The Overflow Status section, shown in Figure 4-9, represents the three bits in the
Overflow Status Register 1Ch. When an indicator turns red, it indicates an overflow.

FIGURE 4-9: Overflow Status.

4.2.4 Rsense Panel

The Rsense section, shown in Figure 4-10, needs to reflect the value of the R
resistor in use on the evaluation board. This value is used in calculations done by the
GUI. In Demo mode, select the 1 Ohm - Demo button. In Sys mode, select the

0.005 Ohm - System button. If another resistor is used, check the Custom option

button and fill the corresponding value in the spin box underneath the option.

FIGURE 4-10: Rsense Configuration Panel.

SENSE

4.2.5 Panel and Integration Control Panel

The Panel and Integration Control section, shown in Figure 4-11, contains GUI controls
which set and clear the INT_EN bit. When using these controls, check the “READ/INT
OVR” box in the Main Configuration section to allow the INT_EN bit to override the
READ

/INT pin state.

Note: Read Period (ms) is always enabled.

DS50002376A-page 32  2015 Microchip Technology Inc.

FIGURE 4-11: Panel and Integration Control.

Software Description

4.2.6 EVB Demo Configuration Panel

The EVB Demo Configuration panel, shown in Figure 4-12, contains GUI controls
which affect the Demo mode. To inject current onto V
Vsense- Stimulus” box. To set the current level, rotate the “DC Vsense- Stimulus” dial
or type a value between 0 and 100 in the (mV) spin box below the dial.

FIGURE 4-12: Evaluation Board Demo Configuration.

SENSE-

, check the “Enable DC

 2015 Microchip Technology Inc. DS50002376A-page 33

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

Click to enter new values to scale the plot.

4.3 TAB DESCRIPTIONS

4.3.1 Vbus & Vsense Tab

The Vbus & Vsense tab, shown in Figure 4-13, displays plots for calculated V
volts and calculated V

in volts. The plots are not self-scaling. If the value in the

SENSE

BUS

in

box at the right of the plot (indicated with arrows) falls outside the Y-axis range on the
plot, click the top and/or bottom value on the axis and type in a new value.

FIGURE 4-13: Vbus & Vsense Tab.

DS50002376A-page 34  2015 Microchip Technology Inc.

Software Description

To change the look of the plot lines, click the applicable graphic in the legend on the
right of the tab to display a menu of options, as shown in Figure 4-14.

FIGURE 4-14: Plot Legend Context Menu.

4.3.2 Vbus, Vsense and Vpower Tabs

There are separate tabs to show individual plots for Vbus, Vsense and Vpower. They
operate similarly to the Vbus & Vsense tab described above.

 2015 Microchip Technology Inc. DS50002376A-page 35

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

1LSB

0.1V

RDI_GAIN



------------ ------------- ------------ ---

32V

DV_GAIN

------------- --------------



1023 2

6



------------- ------------- ------------- ---------- ------------- ------------=

Where:

1LSB = LSB value in watts for V

POWER

Result Registers 1Dh and 1Eh

0.1V = Maximum V

SENSE

voltage

R=Value of R

SENSE

resistor in ohms

DI_GAIN = Digital current gain

32V/DV_GAIN = Maximum voltage

1023 = (210 – 1) = 10-bit FSR

2

6

= Adjustment for 6 unused register bits when read as a 16-bit number

4.3.3 Calculations/File IO Tab

The Calculations/File IO tab, shown in Figure 4-15, displays register data (in decimal
by default). It also shows calculated results which were obtained by applying the data
sheet equations to the register data.

DS50002376A-page 36  2015 Microchip Technology Inc.

FIGURE 4-15: Calculations/File IO Tab.

An example of using the equations to calculate power is as follows.

The value of one LSB in the V

Result registers, in watts, can be calculated

POWER

according to Equation 4-1.

EQUATION 4-1: LSB CALCULATION

Software Description

0.1V

1

1

------------- ----

32V

1

----------



1023

------------ ------------- ---------42 0.13138W=



Where:

0.1V = Maximum V

SENSE

voltage

1 = Value of R

SENSE

resistor

1 = Digital current gain

32V/1 = Maximum voltage

1023 = 10-bit FSR

42 = Decimal value of V

POWER

Result Registers 1Dh and 1Eh

The power calculation using the V

POWER

Result registers value from Figure 4-15 is

shown in Equation 4-2.

EQUATION 4-2: POWER CALCULATION

4.3.3.1 CONFIGURATION SAVE AND LOAD

The Calculations/File IO tab contains controls, as shown in Figure 4-16, which save the
settings currently configured in the PAC1921 to allow quick reconfiguration at any time.

 2015 Microchip Technology Inc. DS50002376A-page 37

FIGURE 4-16: Save/Load Section.

To save configuration settings, configure the PAC1921 as desired, then display the
Calculations/File IO tab. The “FF Reg File Path” box defaults to where the GUI soft­ware is installed. To change the location, type in a path, or click the folder icon to use
a Windows
file will be saved. The file should be named with the.txt extension or similar text file
format. Once a file name and location have been chosen, click the Save switch, and
the file is saved.

Note: If a file with the same name already exists, the file will be overwritten

The data is saved in two columns, separated by tabs. The first column is the register
address and the second column is the register data.

Once a file is saved, it can be recalled at any time by selecting the file in the “FF Reg
File Path” box and clicking the Load switch.

Click the Chip Defaults switch or press the <F6> function key on the keyboard to
reload register defaults on the PAC1921.

®

system-based navigation aid to select the folder where the configuration

without warning and old data will be lost.

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

Click the Quick Setup switch or press the <F2> function key on the keyboard to set up
the GUI and PAC1921 for free-run integration power measurement. The Quick Setup
switch does the following:

- Enables the “Enable Auto INT_EN” option.

- Enables the “READ/INT OVR” option.

- Enables the “INT_EN” option.

- Sets “MUX_SEL” to VPOWER free-run.

- Enables the “Enable DC Vsense- Stimulus” option.

4.3.4 Integration Table Tab

The Integration Table tab, shown in Figure 4-17, shows the maximum integration
periods for a selected number of samples with various settings.

FIGURE 4-17: Integration Table Tab.

DS50002376A-page 38  2015 Microchip Technology Inc.

4.4 EVALUATION BOARD EXAMPLES

Check the “READ/INT OVR” Box

Check the “Enable Auto INT_EN” Control

4.4.1 Power Pin-Controlled Integration Example

This example provides steps to experiment with pin-controlled integration in SMBus
mode and see the effects of gain.

1. In the Main Configuration section, check the “READ/INT OVR” box. This allows

the INT_EN bit to override the READ
INT_EN” control to set automatic GUI updates.

2. In the Panel and Integration Control section, check the “Integration Time GUI

Controlled” box, and set the “Read Period (ms)” to 500 ms. This causes the
INT_EN bit to toggle between high for 500 ms (putting the PAC1921 in the
Integrate state) and low for 500 ms (putting the device in the Read state).

3. In the EVB Demo Configuration section, check the “Enable DC Vsense-

Stimulus” box and type 40 mV in the “DC Vsense- Stimulus (mV)” box.

4. Observe the plots on the Vbus & Vsense tab, as shown in Figure 4-18. The

evaluation board demo V

BUS

/INT pin state. Also check the “Enable Auto

is ~5.1V and V

Software Description

is ~0.04V.

SENSE

FIGURE 4-18: Pin-Controlled Integration, No Gain.

 2015 Microchip Technology Inc. DS50002376A-page 39

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

5. Observe the data on the Calculations/File IO tab, as shown in Figure 4-19.

FIGURE 4-19: Pin-Controlled Integration without Gain.

6. To see the effects of gain, change “DI_GAIN” to 2X and “DV_GAIN” to 4X in the
Gain Config 00h section, as shown in Figure 4-20.

FIGURE 4-20: Pin-Controlled Integration with Gain.

DS50002376A-page 40  2015 Microchip Technology Inc.

Software Description

7. Observe the data on the Calculations/File IO tab, as shown in Figure 4-21.

Notice that the Register Data values (with the exception of the accumulators)
reflect the gain.

FIGURE 4-21: Pin-Controlled Integration with Gain.

 2015 Microchip Technology Inc. DS50002376A-page 41

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

4.4.2 Power Free-Run Integration Example

This section provides steps to experiment with free-run integration in SMBus mode and
see the effects of filtering, resolution and sampling. It starts by showing the fastest
integration period and progressively shows higher accuracy.

1. Press the <F2> function key on the keyboard. This performs Quick Setup, which
checks the “READ/INT OVR” box, the “INT_EN” bit box and the “Enable DC
Vsense- Stimulus” box, enables the “Enable Auto INT_EN” control and sets
“MUX_SEL” to VPOWER free-run. Integration begins using the 1 sample default.

2. In the Main Configuration section, click the “I_RES” and “V_RES” boxes so 11-bit
shows; this lowers the resolution from 14 bits to 11 bits.

3. In the Main Configuration section, uncheck the “VSENSE FILT_EN” and “VBUS
FILT_EN” boxes to disable the ADC post filters.

4. In the EVB Demo Configuration section, type 40 mV in the “DC Vsense­Stimulus” spin box.

5. Observe the plots on the Vbus & Vsense tab, as shown in Figure 4-22, adjusting
the Y-axis values as desired. These settings result in the shortest integration
period.

FIGURE 4-22: Free-Run Integration, Shortest Period.

DS50002376A-page 42  2015 Microchip Technology Inc.

Software Description

6. Check the “VSENSE FILT_EN” and “VBUS FILT_EN” boxes to enable the ADC

post filters, and observe the improvement in the plots on the Vbus & Vsense tab,
as shown in Figure 4-23.

FIGURE 4-23: Free-Run Integration with ADC Post Filters Enabled.

 2015 Microchip Technology Inc. DS50002376A-page 43

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

7. Uncheck the “I_RES” and “V_RES” boxes to enable 14-bit resolution, and
observe the improvement in the plots on the Vbus & Vsense tab, as shown in

Figure 4-24.

FIGURE 4-24: Free-Run Integration with 14-Bit Resolution.

DS50002376A-page 44  2015 Microchip Technology Inc.

Software Description

8. Change the number of “SAMPLES” to 8 and observe the improvement in the

plots on the Vbus & Vsense tab, as shown in Figure 4-25.

FIGURE 4-25: Increased Sample Effect.

4.5 TROUBLESHOOTING

4.5.1 GUI Controls Unresponsive After Installation

Restart the computer. In some cases, a restart is required after installation.

4.5.2 GUI Freezes

If the GUI freezes for unknown reasons, communications cannot be stopped and the
program cannot be closed. Disconnect the USB cable from the evaluation board, then
close the program. Reconnect the evaluation board, then restart the GUI.

 2015 Microchip Technology Inc. DS50002376A-page 45

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

NOTES:

DS50002376A-page 46  2015 Microchip Technology Inc.

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the PAC1921
High-Side Current/Power Sensor Evaluation Board:

• Board – PAC1921 Current Shunt and Power Monitor Schematic

• Board – USB Bridge and Sig Gen Schematic

• Board – Top Silk

• Board – Top Copper and Silk

• Board – Top Copper

• Board – Bottom Copper

• Board – Bottom Copper and Silk

• Board – Bottom Silk

PAC1921

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

 2015 Microchip Technology Inc. DS50002376A-page 47

DS50002376A-page 48  2015 Microchip Technology Inc.

V

SENSE+

V

SENSE-

V

SOURCE-

V

SOURCE+

+5V_USB

V

DD

V

DD

V

DD

V

DD

Demo

Sys

Sys

V

SENSE+

V

SENSE-

Demo

Out

#READ/INT

#READ/INT

GND

J8, 1-2 C lose (default) = 1001_100xb -> 98h
J8, 2-3 Close (alternative) = 1001_101x b -> 9Ah
J8, Open (alternative) = Apply external resistor
for GAIN_SEL function in Stand- Alone mode.
Read the data sheet for more information

ADDR_SEL
/GAIN_SEL

V

DD

SMBUS_CLK

SMBUS_DATA

#READ/INT

IDEMO

Idemo

OUT

GP2

COMM_SEL

SMBus_CLK
SMBus_DATA
#READ/INT

TP LOOP Yellow

TP2

TP LOOP Orange

TP1

TP LOOP Black

TP6

TP LOOP White

TP3

TP LOOP White

TP4

TP LOOP Red

TP5

TP LOOP Yellow

TP7

EDZ250/2

J1

EDZ250/2

J2

EDZ250/2

J11

2R
2010
5%

R2

2R
2010
5%

R3

HDR-2.54 Male 1x3

J3

123

HDR-2.54 Male 1x3

J4

123

HDR-2.54 Male 1x3

J6

123

HDR-2.54 Male 1x3

J7

HDR-2.54 Male 1x3

J8

123

HDR-2.54 Male 1x3

J5

Shunt 2.54 mm 1x2 Handle

JP3

Shunt 2.54 mm 1x2 Handle

JP4

Shunt 2.54mm 1x2 Handle

JP5

Shunt 2.54 mm 1x2 Handle

JP6

Shunt 2.54mm 1x2 Handle

JP7

Shunt 2.54 mm 1x2 Handle

JP8

0.1 μF
16V
0603

C1

0.001 μF
50V
0603

C3

1 μF
16V
0603

C2

12.1k
0603
1%

R8

12.1k
0603
1%

R9

12.1k
0603
1%

R10

12.1k
0603
1%

R11

12.1k
0603
1%

R6

12.1k
0603
1%

R7

120R
0603
1%

R4

120R
0603

1%

R5

100R
0603

1%

R1

GREEN

LD6

2k

0603

1%

R12

V

DD

1

SENSE+

2

SENSE-

3

OUT

4

GND

5

ADDR_SEL

6

COMM_SEL

7

READ/INT

8

SM_DATA

9

SM_CLK

10

EP

11

PAC1921-1

U1

1 2

3

4

0.005R
1%

RS1

3 2 1

3 2 1

21

2121

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

A.2 BOARD – PAC1921 CURRENT SHUNT AND POWER MONITOR SCHEMATIC

 2015 Microchip Technology Inc. DS50002376A-page 49

GP1 GP3

+3.3V

V

DD

+5V_USB

+5V_USB

V

DD

+5V_USB

Steady state current generator Waveform Current Generator

VDD Power

USB Power

OUT

IDEMO

#READ/INT

SMBUS_DATA

SMBUS_CLK

Idemo

Idemo

SMBus_CLK
SMBus_DATA
#READ/INT

SMBusCLK
SMBusDATA

ID

4

V

BUS

1

GND

5

D-

2

D+

3

0

USB MINI-B Female

P1

0.47 μF

6.3V
0603

C10

SMBusDATA

SMBusCLK

+3.3V

+3.3V

+3.3V

+3.3V

RX
TX
GP2 GP3

GP0
GP1
RESET +3.3V

+3.3V

+3.3V

GP0

Rubber Pad Cyl D7.9H5.3

PAD1

Rubber Pad Cyl D7.9H5.3

PAD2

Rubber Pad Cyl D7.9H5.3

PAD3

Rubber Pad Cyl D7.9H5.3

PAD4

D­D+

V

BUS

1k

0603

1%

R20

1k

0603

1%

R21

12.1k
0603
1%

R18

12.1k
0603
1%

R19

12.1k
0603
1%

R26

1M

0603

1%

R27

3.32k
0603
1%

R44

12.1k
0603
1%

R41

7.5k
0603
1%

R43

12.1k
0603
1%

R50

15.4k
0603
1%

R40

20R

0603

1%

R70

120R
0603
1%

R37

3.32k
0603
1%

R47

12.1k
0603
1%

R48

7.5k
0603
1%

R46

12.1k
0603

1%

R51

15.4k
0603
1%

R49

20R
0603
1%

R72

120R
0603
1%

R38

0.022 μF
50V
0603

C14

2200 pF
50V
0603

C13

100 pF

50V

0603

C21

10 μF
10V
0603

C4

RED

LD2

RED

LD1

FB1

2200 pF
50V
0603

C12

2200 pF
50V
0603

C9

Shunt 2.54 mm 1x2 Handle

JP9

Shunt 2.54 mm 1x2 Handle

JP10

Shunt 2.54 mm 1x2 Handle

JP11

Shunt 2.54 mm 1x2 Handle

JP12

1 μF
16V
0603

C15

1 μF
16V
0603

C8

10 μF
10V
0603

C7

+A

3

-A

2

OUTA

1

V

SS

V

DD

11 4

MCP6004

U4A

+B

5

-B

6

OUTB

7

V

SS

V

DD

11 4

MCP6004

U4B

+C

10

-C

9

OUTC

8

V

SS

V

DD

11 4

MCP6004

U4C

+D

12

-D

13

OUTD

14

V

SS

V

DD

11 4

MCP6004

U4D

2

13

10k

3386F

10%

R73

2

1 3

10k

3386F

10%

R74

1

3

2

ESD5V3

D1

0.1 μF
16V
0603

C5

0.1 μF
16V
0603

C6

0.1 μF
16V
0603

C16

0.1 μF
16V
0603

C17

0.1uF
16V
0603

C18

0.1 μF
16V
0603

C19

0.1 μF
16V
0603

C20

V

IN

1

GND

2

V

OUT

3

MCP1825S/3.3V

U3

D

G

S

MCP87050

Q1

D

G

S

MCP87050

Q2

2k

0603

1%

R25

V

DD

1

GP0

2

GP1

3

RST

4

UART RX

5

UART TX

6

GP27GP3

8

SDA

9

SCL

10

V

USB

11

D-

12

D+

13

V

SS

14

MCP2221

U2

1

2

3

4

5

6

7

8

9

10

HDR-2.54 Male 2x5

J13

A.3 BOARD – USB BRIDGE AND SIG GEN SCHEMATIC

Schematic and Layouts

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

A.4 BOARD – TOP SILK

A.5 BOARD – TOP COPPER AND SILK

DS50002376A-page 50  2015 Microchip Technology Inc.

A.6 BOARD – TOP COPPER

Schematic and Layouts

A.7 BOARD – BOTTOM COPPER

 2015 Microchip Technology Inc. DS50002376A-page 51

PAC1921 High-Side Current/Power Sensor Evaluation Board User’s Guide

A.8 BOARD – BOTTOM COPPER AND SILK

A.9 BOARD – BOTTOM SILK

DS50002376A-page 52  2015 Microchip Technology Inc.

HIGH-SIDE CURRENT/POWER SENSOR

EVALUATION BOARD USER’S GUIDE

Appendix B. Bill of Materials (BOM)

PAC1921

TABLE B-1: BILL OF MATERIALS (BOM)

Qty Reference Description Manufacturer Part Number

8 C1, C5, C6,

C16, C17,
C18, C19, C20

1 C10 Cap. Ceramic, 0.47 µF, 6.3V, 10%,

1 C14 Cap. Ceramic, 0.022 µF, 50V, 10%,

3 C2, C8, C15 Cap. Ceramic, 1 µF, 16V, 10%, X7R,

1 C21 Cap. Ceramic, 100 pF, 50V, 1%, C0G,

1 C3 Cap. Ceramic, 0.001 µF, 50V, 20%,

2 C4, C7 Cap. Ceramic, 10 µF, 10V, 20%, X5R,

3 C9, C12, C13 Cap. Ceramic, 2200 pF, 50V, 10%,

1 D1 DIO TVSARR, ESD5V3U2U, 5.3V,

1 FB1 Ferrite, 500 mA, 0.1R, SMD, 0603 Laird-Signal Integrity LI0603E470R-10

3 J1, J2, J11 Conn. Terminal, 5.08 mm, 15A,

1 J13 Conn. HDR-2.54, Male, 2x5, 0.100"

6 J3, J4, J5, J6,

J7, J8

10 JP3, JP4, JP5,

JP6, JP7, JP8,
JP9, JP10,
JP11, JP12

2 LD1, LD2 DIO LED Red, 1.95V, 20 mA, 220 mcd,

1 LD6 DIO LED Green, 2V, 30 mA, 120 mcd,

1 P1 Conn. USB Mini-B Female, SMD, R/A Hirose Electric Co., Ltd. UX60SC-MB-5ST(80)

4PAD1, PAD2,

PAD3, PAD4

2 Q1, Q2 MCHP Analog PWM Controller, 1 MHz,

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Cap. Ceramic, 0.1 µF, 16V, 10%, X7R,
SMD, 0603

X5R, SMD, 0603

X7R, SMD, 0603

SMD, 0603

SMD, 0603

X7R, SMD, 0603

SMD, 0603

X7R, SMD, 0603

SMD, SOT-883

Female, 1x2, TH R/A

(2.54 mm), TH Vert.

Conn. HDR-2.54, Male, 1x3, Tin,

5.84 MH, TH Vert.

Mech. HW Jumper, 2.54 mm, 1x2,
Handle Gold

Clear, SMD, 0805

Diffuse, SMD, 0805

Mech. HW Rubber Pad, Cylindrical,
D7.9, H5.3, Black

MCP87050-U/MF, PDFN-8

(1)

NIC Components Corp. NMC0603X7R104K16TRPF

Murata Electronics

TDK Corporation C1608X7R1H223K

Taiyo Yuden Co., Ltd. EMK107B7105KA-T

TDK Corporation C1608C0G1H101F

KEMET™ C0603C102M5RAC

Panasonic

KEMET C0603C222K5RACTU

Infineon Technologies ESD5V3U2U-03LRH E6327

On Shore Technology
Inc.

Samtec, Inc. TSW-105-07-G-D

Samtec, Inc. TSW-103-07-T-S

TE Connectivity, Ltd. 881545-2

Kingbright Corp. APT2012SURCK

Avago Technologies US
Inc.

3M SJ61A11

Microchip Technology
Inc.

®

®

GRM188R60J474KA01D

ECJ-1VB1A106M

EDZ250/2

HSMM-C170

MCP87050T-U/MF

 2015 Microchip Technology Inc. DS50002376A-page 53

PAC1921

TABLE B-1: BILL OF MATERIALS (BOM)

(1)

(CONTINUED)

Qty Reference Description Manufacturer Part Number

1 R1 Res., TKF, 100R, 1%, 1/10W, SMD,

ROHM Semiconductor MCR03EZPFX1000

0603

1 R12, Res., TKF, 2k, 1%, 1/10W, SMD, 0603 Stackpole Electronics,

RMCF0603FT2K00

Inc.

2 R2, R3 Res., TKF, 2R, 5%, 3/4W, SMD, 2010 Panasonic® - ECG ERJ-12ZYJ2R0U

2 R20, R21 Res., TKF, 1k, 1%, 1/10W, SMD, 0603 Panasonic - ECG ERJ-3EKF1001V

1 R25 Res., TKF, 2k, 1%, 1/10W, SMD, 0603 Stackpole Electronics,

RMCF0603FT2K00

Inc.

1 R27 Res., TKF, 1M, 1%, 1/10W, SMD, 0603 Panasonic

4 R4, R5, R37,

Res., TKF, 120R, 1%, 1/10W, SMD, 0603 Panasonic

- ECG ERJ-3EKF1004V

- ECG ERJ-3EKF1200V

R38

2 R40, R49 Res., TKF, 15.4k, 1%, 1/10W, SMD, 0603 Panasonic

- ECG ERJ-3EKF1542V

2 R43, R46 Res., TKF, 3.32k, 1%, 1/10W, SMD, 0603 ROHM MCR03EZPFX3321

2 R43, R46 Res., TKF, 7.5k, 1%, 1/10W, SMD, 0603 Panasonic

- ECG ERJ-3EKF7501V

1 R51 Res., TKF, 12.1k, 1%, 1/10W, SMD, 0603 Panasonic - ECG ERJ-3EKF1212V

12 R6, R7, R8,

Res., TKF, 12.1k, 1%, 1/10W, SMD, 0603 Panasonic

- ECG ERJ-3EKF1212V
R9, R10, R11,
R18, R19,
R26, R41,
R48, R50

2 R70, R72 Res., TKF, 20R, 1%, 1/10W, SMD, 0603 Panasonic

2 R73, R74 Res., Trimmer Cermet, 10k, 10%,

Bourns

- ECG ERJ-3EKF20R0V

®

, Inc. 3386F-1-103TLF

500 mW, TH, 3386F

®

1 RS1 Res., Shunt, 0.005R, 1%, 2W, 1%,

Ohmite

Manufacturing LVK25R005FER

2412

1 TP1 Conn. TP Loop, Orange, TH Keystone Electronics

5013

Corp.

2 TP2, TP7 Conn. TP Loop, Yellow, TH Keystone Electronics

5014

Corp.

2 TP3, TP4 Conn. TP Loop, White, TH Keystone Electronics

5012

Corp.

1 TP5 Conn. TP Loop, Red, TH Keystone Electronics

5010

Corp.

1 TP6 Conn. TP Loop, Black, TH Keystone Electronics

5011

Corp.

1 U1 MCHP Analog Current Sense Monitor,

PAC1921-1-AIA-TR, DFN-10

1 U2 MCHP Interface USB I

2

C™ UART,

MCP2221-I/ST, TSSOP-14

1 U3 MCHP Analog LDO, 3.3V,

MCP1825ST-3302E/DB, SOT-223-3

1 U4 MCHP Analog Op Amp, 4-Ch, 1 MHz,

MCP6004-I/SL, SOIC-14

Microchip Technology
Inc.

Microchip Technology
Inc.

Microchip Technology
Inc.

Microchip Technology
Inc.

PAC1921-1-AIA-TR

MCP2221-I/ST

MCP1825S-3302E/DB

MCP6004-I/SL

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

DS50002376A-page 54  2015 Microchip Technology Inc.

NOTES:

Bill of Materials (BOM)

 2015 Microchip Technology Inc. DS50002376A-page 55

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

http://www.microchip.com/
support

Web Address:

www.microchip.com

Atlanta

Duluth, GA
Tel: [phone]
Fax: [phone]

Austin, TX

Tel: [phone]

Boston

Westborough, MA
Tel: [phone]
Fax: [phone]

Chicago

Itasca, IL
Tel: [phone]
Fax: [phone]

Cleveland

Independence, OH
Tel: [phone]
Fax: [phone]

Dallas

Addison, TX
Tel: [phone]
Fax: [phone]

Detroit

Novi, MI
Tel: [phone]

Houston, TX

Tel: [phone]

Indianapolis

Noblesville, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

New York, NY

Tel: [phone]

San Jose, CA

Tel: [phone]

Canada - Toronto

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: [phone]
Fax: [phone]

Australia - Sydney

Tel: [phone]
Fax: [phone]

China - Beijing

Tel: [phone]
Fax: [phone]

China - Chengdu

Tel: [phone]
Fax: [phone]

China - Chongqing

Tel: [phone]
Fax: [phone]

China - Dongguan

Tel: [phone]

China - Hangzhou

Tel: [phone]
Fax: [phone]

China - Hong Kong SAR

Tel: [phone]
Fax: [phone]

China - Nanjing

Tel: [phone]
Fax: [phone]

China - Qingdao

Tel: [phone]
Fax: [phone]

China - Shanghai

Tel: [phone]
Fax: [phone]

China - Shenyang

Tel: [phone]
Fax: [phone]

China - Shenzhen

Tel: [phone]
Fax: [phone]

China - Wuhan

Tel: [phone]
Fax: [phone]

China - Xian

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

China - Xiamen

Tel: [phone]
Fax: [phone]

China - Zhuhai

Tel: [phone]
Fax: [phone]

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi

Tel: [phone]
Fax: [phone]

India - Pune

Tel: [phone]

Japan - Osaka

Tel: [phone]
Fax: [phone]

Japan - Tokyo

Tel: [phone]
Fax: [phone]

Korea - Daegu

Tel: [phone]
Fax: [phone]

Korea - Seoul

Tel: [phone]
Fax: [phone] or
82-2-558-5934

Malaysia - Kuala Lumpur

Tel: [phone]
Fax: [phone]

Malaysia - Penang

Tel: [phone]
Fax: [phone]

Philippines - Manila

Tel: [phone]
Fax: [phone]

Singapore

Tel: [phone]
Fax: [phone]

Taiwan - Hsin Chu

Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung

Tel: [phone]

Taiwan - Taipei

Tel: [phone]
Fax: [phone]

Thailand - Bangkok

Tel: [phone]
Fax: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]

Denmark - Copenhagen

Tel: [phone]
Fax: [phone]

France - Paris

Tel: [phone]
Fax: [phone]

Germany - Dusseldorf

Tel: [phone]

Germany - Munich

Tel: [phone]
Fax: [phone]

Germany - Pforzheim

Tel: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Italy - Venice

Tel: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

Poland - Warsaw

Tel: [phone]

Spain - Madrid

Tel: [phone]
Fax: [phone]

Sweden - Stockholm

Tel: [phone]

UK - Wokingham

Tel: [phone]
Fax: [phone]

01/27/15

DS50002376A-page 56  2015 Microchip Technology Inc.

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Microchip:
ADM00592