Microchip Technology PAC1710, PAC1720 User Manual
PAC1710 and PAC1720
High-Side Current Sensors
Evaluation Board
User’s Guide
2015 Microchip Technology Inc. DS50002367A
Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, K
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach,
Omniscient Code Generation, PICDEM, PICDEM.net, PICkit,
PICtail, RightTouch logo, REAL ICE, SQI, Serial Quad I/O,
Total Endurance, TSHARC, USBCheck, VariSense,
ViewSpan, WiperLock, Wireless DNA, and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
ISBN: 978-1-63277-736-2
EELOQ, KEELOQ logo, Kleer,
32
logo, RightTouch, SpyNIC,
QUALITY MANAGEMENT S
DS50002367A-page 2 2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
Object of Declaration: PAC17X0 High-Side Current Sensors Evaluation Board
2015 Microchip Technology Inc. DS50002367A-page 3
NOTES:
DS50002367A-page 4 2015 Microchip Technology Inc.
PAC17X0 HIGH-SIDE CURRENT
SENSORS EVALUATION
BOARD USER’S GUIDE
Table of Contents
Preface ........................................................................................................................... 7
Introduction............................................................................................................ 7
Document Layout .................................................................................................. 7
Conventions Used in this Guide ............................................................................ 8
Warranty Registration............................................................................................ 8
Recommended Reading........................................................................................ 9
The Microchip Web Site ........................................................................................ 9
Product Change Notification Service..................................................................... 9
Customer Support ................................................................................................. 9
Document Revision History ................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ................................................................................................... 11
1.2 PAC17X0 Device Features .......................................................................... 11
1.3 What is the PAC17X0 High-Side Current Sensors Evaluation Board? ........ 12
1.4 What the PAC17X0 High-Side Current Sensors Evaluation
Board Kit Contains .................................................................................. 13
Chapter 2. Installation and Operation
2.1 Getting Started ............................................................................................. 15
2.1.1 System Requirements ............................................................................... 15
2.1.2 Installing the Evaluation Board .................................................................. 15
Chapter 3. Hardware Description
3.1 Introduction ................................................................................................... 23
3.1.1 PAC1710 and PAC1720 ............................................................................ 23
3.1.2 Power Source ............................................................................................ 23
3.2 USB-to-SMBus Bridge .................................................................................. 23
3.2.1 Direct SMBus Connect Option .................................................................. 23
3.3 LED Indicators .............................................................................................. 24
3.4 Jumper Settings ........................................................................................... 25
3.5 PAC17X0 Test Points ................................................................................... 27
3.6 Demo Mode Setup and Operation ................................................................ 28
3.6.1 Steady-State Current Source .................................................................... 28
3.6.2 10 Hertz Current Source ........................................................................... 29
3.6.3 Pulse Current Source ................................................................................ 30
3.7 Sys Mode Setup and Operation ................................................................... 31
3.7.1 Jumper Positions ....................................................................................... 31
3.7.2 Load Connection ....................................................................................... 31
3.8 Measurement Polarity .................................................................................. 32
2015 Microchip Technology Inc. DS50002367A-page 5
PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide
Chapter 4. Software Description
4.1 Chip Manager Application Overview ............................................................ 33
4.1.1 Real-Time Register Graphs .......................................................................33
4.1.2 Selecting Registers to Plot .........................................................................34
4.1.3 Starting the Plots ........................................................................................35
4.1.4 Exporting and Importing the Plot Data .......................................................35
Chapter 5. Evaluation Board Demonstration
5.1 Introduction ................................................................................................... 37
5.2 Steady-State Current Source – Rotary Switch 1 .......................................... 37
5.3 Momentary Pulse Current Source (Amplitude) –
Rotary Switch 2 ...................................................................................... 39
5.4 Momentary Pulse Current Source (Duration) – Rotary Switch 2 .................. 40
5.5 10 Hz Pulse Train Current Source – Rotary Switch 5 .................................. 40
Appendix A. Schematic and Layouts
A.1 Introduction .................................................................................................. 41
A.2 Board – Schematic: Current Sensors .......................................................... 42
A.3 Board – Schematic: Current Sources .......................................................... 43
A.4 Board – Schematic: MCP2221 USB Bridge ................................................. 44
A.5 Board – Top Silk .......................................................................................... 45
A.6 Board – Top Copper and Silk ....................................................................... 46
A.7 Board – Top Copper .................................................................................... 47
A.8 Board – Bottom Copper ............................................................................... 48
A.9 Board – Bottom Copper and Silk ................................................................. 49
A.10 Board – Bottom Silk ................................................................................... 50
Appendix B. Bill of Materials (BOM) ...........................................................................51
Worldwide Sales and Service .....................................................................................54
DS50002367A-page 6 2015 Microchip Technology Inc.
PAC17X0 HIGH-SIDE CURRENT
SENSORS EVALUATION
BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics, to open a list of available online help files.
®
IDE online help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
PAC17X0 High-Side Current Sensors Evaluation Board. Items discussed in this
chapter include:
• Document Layout
• Conventions Used in this Guide
• Warranty Registration
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the PAC17X0 High-Side Current Sensors
Evaluation Board as a development tool to emulate and debug firmware on a target
board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the PAC17X0
High-Side Current Sensors Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on installing and
starting the Microchip Chip Manager application.
• Chapter 3. “Hardware Description” – Shows hardware details of the PAC17X0
High-Side Current Sensors Evaluation Board.
• Chapter 4. “Software Description” – Describes the main operations in the
Microchip Chip Manager software.
• Chapter 5. “Evaluation Board Demonstration” – Highlights several experiments
with the PAC17X0 High-Side Current Sensors Evaluation Board.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the PAC17X0 High-Side Current Sensors Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
PAC17X0 High-Side Current Sensors Evaluation Board.
2015 Microchip Technology Inc. DS50002367A-page 7
PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide
CONVENTIONS USED IN THIS GUIDE
This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description Represents Examples
Arial font:
Italic characters Referenced books MPLAB® IDE User’s Guide
Emphasized text ...is the only compiler...
Initial caps A window the Output window
A dialog the Settings dialog
A menu selection select Enable Programmer
Quotes A field name in a window or
dialog
Underlined, italic text with
right angle bracket
Bold characters A dialog button Click OK
N‘Rnnnn A number in verilog format,
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Courier New font:
Plain Courier New Sample source code #define START
Italic Courier New A variable argument file.o, where file can be
Square brackets [ ] Optional arguments mcc18 [options] file
Curly brackets and pipe
character: { | }
Ellipses... Replaces repeated text var_name [,
A menu path File>Save
A tab Click the Power tab
where N is the total number of
digits, R is the radix and n is a
digit.
Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’
Choice of mutually exclusive
arguments; an OR selection
Represents code supplied by
user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options]
errorlevel {0|1}
var_name...]
void main (void)
{ ...
}
WARRANTY REGISTRATION
Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip web site.
DS50002367A-page 8 2015 Microchip Technology Inc.
RECOMMENDED READING
This user’s guide describes how to use the PAC17X0 High-Side Current Sensors
Evaluation Board. Other useful documents are listed below. The following Microchip
document is available and recommended as a supplemental reference resource:
PAC1710/20 Data Sheet (DS20005386)
This data sheet describes the operation and features of the PAC1710/20 devices which
have a single and dual high-side current-sense monitor with power calculation.
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This
web site is used as a means to make files and information easily available to
customers. Accessible by using your favorite Internet browser, the web site contains
the following information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
Preface
PRODUCT CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notifications whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip web site at www.microchip.com, click on Product
Change Notification and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (July 2015)
• Initial Release of this Document.
2015 Microchip Technology Inc. DS50002367A-page 9
PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide
NOTES:
DS50002367A-page 10 2015 Microchip Technology Inc.
Chapter 1. Product Overview
1.1 INTRODUCTION
The PAC17X0 High-Side Current Sensors Evaluation Board provides an easily- accessible
platform to test the various features of the PAC17X0. The System Management Bus
(SMBus) communication is accomplished using a Universal Serial Bus (USB) bridge, which
provides a standard interface for the application code interface. The evaluation board
supports communication with both the PAC1710 and PAC1720 devices that are populated
on the board. The SMBus address of the PAC1710 is set by R4 and the PAC1720 SMBus
address is selectable with the J12 jumper.
1.2 PAC17X0 DEVICE FEATURES
The PAC1710 and PAC1720 are I2C/SMBus devices that provide high-side,
bidirectional current sensing with precision voltage measurement capabilities. The
devices are similar, except that the PAC1710 contains one current sensing circuit and
the PAC1720 contains two. Both devices measure the voltage developed across an
external sense resistor to represent the high-side current of a battery or voltage
regulator. They also measure the SENSE+ pin voltage and use these measured values
to present a proportional average power calculation. Current sensing includes Fault
protection. During a Fault, the ALERT
The PAC17X0 High-Side Current Sensors Evaluation Board provides users with the
means to exercise device functionality while connected either to target systems
(Sys mode) or while utilizing on-board sources (Demo mode). On-board sources
include bus power, selectable steady-state current, adjustable low-frequency square
wave current signal, and a test current pulse with selectable amplitude and duration.
PAC17X0 HIGH-SIDE CURRENT
SENSORS EVALUATION
BOARD USER’S GUIDE
pin can be asserted or masked.
2015 Microchip Technology Inc. DS50002367A-page 11
PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide
PAC1720
SMBus
Connector
SMBus
Address Select
PAC1710
System
I-source
System
I-source
System
I-load
System
I-load
EVB
I-source
EVB
I-source
EVB
I-load
EVB
I-load
V
DD
SENSE
USB-to-SMBus Bridge
USB Connector
ALERT
SMBus
V
DD
SMBus
#ALERT
ADDR_SEL
SENSE1
SENSE2
Channel2Channel1
Rsys
Rdemo
Rsys
Rdemo
ALERT
1.3 WHAT IS THE PAC17X0 HIGH-SIDE CURRENT SENSORS EVALUATION BOARD?
All functions of the PAC17X0 devices can be tested and observed using the
USB-based PAC17X0 High-Side Current Sensors Evaluation Board. Figure 1-1 shows
the block diagram of this board.
FIGURE 1-1: PAC17X0 High-Side Current Sensors Evaluation Board Block Diagram.
The evaluation system is comprised of the PAC17X0 High-Side Current Sensors
Evaluation Board and the Microchip Chip Manager application. The PAC17X0
High-Side Current Sensors Evaluation Board has the following features:
• Test points and LEDs for monitoring on-board function
• Screw terminal connections for monitoring external system current up to 20A
• Multiple on-board adjustable current sources (steady state, square wave,
test pulse)
• USB-to-SMBus bridge for power and communications
• Capability to connect directly to external SMBus master
The user can perform the following operations using the Chip Manager application:
• Viewing and changing register values
• Saving settings of all registers, allowing for quick configuration at a later time
• Graphing of any register
DS50002367A-page 12 2015 Microchip Technology Inc.
Product Overview
The evaluation board is designed for ease of use and experimentation purposes.
Figure 1-2 shows the top silk screen of the PAC17X0 High-Side Current Sensors
Evaluation Board.
FIGURE 1-2: PAC17X0 High-Side Current Sensors Evaluation Board – Top Silk Screen.
1.4 WHAT THE PAC17X0 HIGH-SIDE CURRENT SENSORS EVALUATION BOARD KIT CONTAINS
This PAC17X0 High-Side Current Sensors Evaluation Board kit includes:
• PAC17X0 High-Side Current Sensors Evaluation Board (ADM00494)
• Supplied USB-A Male to Mini USB-B Male Cable
• Information Sheet
2015 Microchip Technology Inc. DS50002367A-page 13
PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide
NOTES:
DS50002367A-page 14 2015 Microchip Technology Inc.
Chapter 2. Installation and Operation
2.1 GETTING STARTED
2.1.1 System Requirements
To use the PAC17X0 High-Side Current Sensors Evaluation Board, the following are
required:
•A PC running Microsoft
• A display resolution of 800x600 or larger, for viewing several windows
simultaneously
• An available USB port
2.1.2 Installing the Evaluation Board
Follow the next steps to install the Microchip Chip Manager application:
1. Before installing and running the Chip Manager, install the “MCP2200/MCP2221
Windows Driver & Installer” on the local machine. If the driver and installer
package has already been installed, skip this step. The “MCP2200/MCP2221
Windows Driver & Installer” can be downloaded from:
http://www.microchip.com/wwwproducts/Devices.aspx?product=MCP2221.
Follow the on-screen instructions to complete the installation process.
2. Download the ChipMan file from the board web page. Unzip the archive. The
application’s revision history and install/uninstall notes may be found in the
readme.txt file.
3. To install the Chip Manager application and the device driver on the PC, run
ChipMan-v4.16.7-windows-installer.exe.
4. Connect the supplied USB cable to an available USB port on the PC. Plug the
mini-B end of the USB cable into the board connector, J14. The LEDs for
VDD_Power, USB_Power, USB_OK and ALERT (LD5) should illuminate, and
the 10 Hz LED (LD7) will blink. For a description of the LEDs, see
Section 3.3 “LED Indicators”.
5. If the USB bridge driver has not previously been installed on the selected USB
port, the Driver Software Installation window pops up, prompting for the driver
install (see Figure 2-1).
PAC17X0 HIGH-SIDE CURRENT
SENSORS EVALUATION
BOARD USER’S GUIDE
®
Windows® operating system
2015 Microchip Technology Inc. DS50002367A-page 15
PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide
FIGURE 2-1: Driver Software Installation Window.
6. After the driver installation is complete, the initial setup screen for the Chip
Manager application appears (see Figure 2-2). Click Next to start the installation.
FIGURE 2-2: Application Install Window.
DS50002367A-page 16 2015 Microchip Technology Inc.
Installation and Operation
7. To proceed with the installation, read the License Agreement and accept by clicking
the radio button corresponding to “I accept the agreement”. Then click Next.
FIGURE 2-3: License Agreement Dialog.
8. On the Installation Directory dialog, browse for the desired location or click Next
to install in the default location (see Figure 2-4).
FIGURE 2-4: Installation Directory Dialog.
2015 Microchip Technology Inc. DS50002367A-page 17
Loading...