Microchip Technology PAC1710, PAC1720 User Manual

PAC1710 and PAC1720

High-Side Current Sensors

Evaluation Board

User’s Guide

 2015 Microchip Technology Inc. DS50002367A

Note the following details of the code protection feature on Microchip devices:

YSTEM

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== ISO/TS 16949 ==

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intended manner and under normal conditions.

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Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
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Information contained in this publication regarding device
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All other trademarks mentioned herein are property of their
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© 2015, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

ISBN: 978-1-63277-736-2

EELOQ, KEELOQ logo, Kleer,

32

logo, RightTouch, SpyNIC,

QUALITY MANAGEMENT S

DS50002367A-page 2  2015 Microchip Technology Inc.

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

Object of Declaration: PAC17X0 High-Side Current Sensors Evaluation Board

 2015 Microchip Technology Inc. DS50002367A-page 3

NOTES:

DS50002367A-page 4  2015 Microchip Technology Inc.

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 7

Introduction............................................................................................................ 7

Document Layout .................................................................................................. 7

Conventions Used in this Guide ............................................................................ 8

Warranty Registration............................................................................................ 8

Recommended Reading........................................................................................ 9

The Microchip Web Site ........................................................................................ 9

Product Change Notification Service..................................................................... 9

Customer Support ................................................................................................. 9

Document Revision History ................................................................................... 9

Chapter 1. Product Overview

1.1 Introduction ................................................................................................... 11

1.2 PAC17X0 Device Features .......................................................................... 11

1.3 What is the PAC17X0 High-Side Current Sensors Evaluation Board? ........ 12

1.4 What the PAC17X0 High-Side Current Sensors Evaluation

Board Kit Contains .................................................................................. 13

Chapter 2. Installation and Operation

2.1 Getting Started ............................................................................................. 15

2.1.1 System Requirements ............................................................................... 15

2.1.2 Installing the Evaluation Board .................................................................. 15

Chapter 3. Hardware Description

3.1 Introduction ................................................................................................... 23

3.1.1 PAC1710 and PAC1720 ............................................................................ 23

3.1.2 Power Source ............................................................................................ 23

3.2 USB-to-SMBus Bridge .................................................................................. 23

3.2.1 Direct SMBus Connect Option .................................................................. 23

3.3 LED Indicators .............................................................................................. 24

3.4 Jumper Settings ........................................................................................... 25

3.5 PAC17X0 Test Points ................................................................................... 27

3.6 Demo Mode Setup and Operation ................................................................ 28

3.6.1 Steady-State Current Source .................................................................... 28

3.6.2 10 Hertz Current Source ........................................................................... 29

3.6.3 Pulse Current Source ................................................................................ 30

3.7 Sys Mode Setup and Operation ................................................................... 31

3.7.1 Jumper Positions ....................................................................................... 31

3.7.2 Load Connection ....................................................................................... 31

3.8 Measurement Polarity .................................................................................. 32

 2015 Microchip Technology Inc. DS50002367A-page 5

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

Chapter 4. Software Description

4.1 Chip Manager Application Overview ............................................................ 33

4.1.1 Real-Time Register Graphs .......................................................................33

4.1.2 Selecting Registers to Plot .........................................................................34

4.1.3 Starting the Plots ........................................................................................35

4.1.4 Exporting and Importing the Plot Data .......................................................35

Chapter 5. Evaluation Board Demonstration

5.1 Introduction ................................................................................................... 37

5.2 Steady-State Current Source – Rotary Switch 1 .......................................... 37

5.3 Momentary Pulse Current Source (Amplitude) –

Rotary Switch 2 ...................................................................................... 39

5.4 Momentary Pulse Current Source (Duration) – Rotary Switch 2 .................. 40

5.5 10 Hz Pulse Train Current Source – Rotary Switch 5 .................................. 40

Appendix A. Schematic and Layouts

A.1 Introduction .................................................................................................. 41

A.2 Board – Schematic: Current Sensors .......................................................... 42

A.3 Board – Schematic: Current Sources .......................................................... 43

A.4 Board – Schematic: MCP2221 USB Bridge ................................................. 44

A.5 Board – Top Silk .......................................................................................... 45

A.6 Board – Top Copper and Silk ....................................................................... 46

A.7 Board – Top Copper .................................................................................... 47

A.8 Board – Bottom Copper ............................................................................... 48

A.9 Board – Bottom Copper and Silk ................................................................. 49

A.10 Board – Bottom Silk ................................................................................... 50

Appendix B. Bill of Materials (BOM) ...........................................................................51

Worldwide Sales and Service .....................................................................................54

DS50002367A-page 6  2015 Microchip Technology Inc.

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.

For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics, to open a list of available online help files.

®

IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the
PAC17X0 High-Side Current Sensors Evaluation Board. Items discussed in this
chapter include:

• Document Layout

• Conventions Used in this Guide

• Warranty Registration

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the PAC17X0 High-Side Current Sensors
Evaluation Board as a development tool to emulate and debug firmware on a target
board. The manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the PAC17X0

High-Side Current Sensors Evaluation Board.

• Chapter 2. “Installation and Operation” – Includes instructions on installing and

starting the Microchip Chip Manager application.

• Chapter 3. “Hardware Description” – Shows hardware details of the PAC17X0

High-Side Current Sensors Evaluation Board.

• Chapter 4. “Software Description” – Describes the main operations in the

Microchip Chip Manager software.

• Chapter 5. “Evaluation Board Demonstration” – Highlights several experiments

with the PAC17X0 High-Side Current Sensors Evaluation Board.

• Appendix A. “Schematic and Layouts” – Shows the schematic and layout

diagrams for the PAC17X0 High-Side Current Sensors Evaluation Board.

• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the

PAC17X0 High-Side Current Sensors Evaluation Board.

 2015 Microchip Technology Inc. DS50002367A-page 7

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog

A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with
right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe
character: { | }

Ellipses... Replaces repeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the total number of
digits, R is the radix and n is a
digit.

Filenames autoexec.bat

File paths c:\mcc18\h

Keywords _asm, _endasm, static

Command-line options -Opa+, -Opa-

Bit values 0, 1

Constants 0xFF, ‘A’

Choice of mutually exclusive
arguments; an OR selection

Represents code supplied by
user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]

errorlevel {0|1}

var_name...]

void main (void)
{ ...
}

WARRANTY REGISTRATION

Please complete the enclosed Warranty Registration Card and mail it promptly.
Sending in the Warranty Registration Card entitles users to receive new product
updates. Interim software releases are available at the Microchip web site.

DS50002367A-page 8  2015 Microchip Technology Inc.

RECOMMENDED READING

This user’s guide describes how to use the PAC17X0 High-Side Current Sensors
Evaluation Board. Other useful documents are listed below. The following Microchip
document is available and recommended as a supplemental reference resource:

PAC1710/20 Data Sheet (DS20005386)

This data sheet describes the operation and features of the PAC1710/20 devices which
have a single and dual high-side current-sense monitor with power calculation.

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This
web site is used as a means to make files and information easily available to
customers. Accessible by using your favorite Internet browser, the web site contains
the following information:

• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program
member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives

Preface

PRODUCT CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notifications whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.

To register, access the Microchip web site at www.microchip.com, click on Product

Change Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.

Technical support is available through the web site at:

http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (July 2015)

• Initial Release of this Document.

 2015 Microchip Technology Inc. DS50002367A-page 9

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

NOTES:

DS50002367A-page 10  2015 Microchip Technology Inc.

Chapter 1. Product Overview

1.1 INTRODUCTION

The PAC17X0 High-Side Current Sensors Evaluation Board provides an easily- accessible
platform to test the various features of the PAC17X0. The System Management Bus
(SMBus) communication is accomplished using a Universal Serial Bus (USB) bridge, which
provides a standard interface for the application code interface. The evaluation board
supports communication with both the PAC1710 and PAC1720 devices that are populated
on the board. The SMBus address of the PAC1710 is set by R4 and the PAC1720 SMBus
address is selectable with the J12 jumper.

1.2 PAC17X0 DEVICE FEATURES

The PAC1710 and PAC1720 are I2C/SMBus devices that provide high-side,
bidirectional current sensing with precision voltage measurement capabilities. The
devices are similar, except that the PAC1710 contains one current sensing circuit and
the PAC1720 contains two. Both devices measure the voltage developed across an
external sense resistor to represent the high-side current of a battery or voltage
regulator. They also measure the SENSE+ pin voltage and use these measured values
to present a proportional average power calculation. Current sensing includes Fault
protection. During a Fault, the ALERT

The PAC17X0 High-Side Current Sensors Evaluation Board provides users with the
means to exercise device functionality while connected either to target systems
(Sys mode) or while utilizing on-board sources (Demo mode). On-board sources
include bus power, selectable steady-state current, adjustable low-frequency square
wave current signal, and a test current pulse with selectable amplitude and duration.

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

pin can be asserted or masked.

 2015 Microchip Technology Inc. DS50002367A-page 11

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

PAC1720

SMBus

Connector

SMBus

Address Select

PAC1710

System

I-source

System

I-source

System

I-load

System

I-load

EVB

I-source

EVB

I-source

EVB

I-load

EVB

I-load

V

DD

SENSE

USB-to-SMBus Bridge

USB Connector

ALERT

SMBus

V

DD

SMBus

#ALERT

ADDR_SEL

SENSE1

SENSE2

Channel2Channel1

Rsys

Rdemo

Rsys

Rdemo

ALERT

1.3 WHAT IS THE PAC17X0 HIGH-SIDE CURRENT SENSORS EVALUATION BOARD?

All functions of the PAC17X0 devices can be tested and observed using the
USB-based PAC17X0 High-Side Current Sensors Evaluation Board. Figure 1-1 shows
the block diagram of this board.

FIGURE 1-1: PAC17X0 High-Side Current Sensors Evaluation Board Block Diagram.

The evaluation system is comprised of the PAC17X0 High-Side Current Sensors
Evaluation Board and the Microchip Chip Manager application. The PAC17X0
High-Side Current Sensors Evaluation Board has the following features:

• Test points and LEDs for monitoring on-board function

• Screw terminal connections for monitoring external system current up to 20A

• Multiple on-board adjustable current sources (steady state, square wave,
test pulse)

• USB-to-SMBus bridge for power and communications

• Capability to connect directly to external SMBus master

The user can perform the following operations using the Chip Manager application:

• Viewing and changing register values

• Saving settings of all registers, allowing for quick configuration at a later time

• Graphing of any register

DS50002367A-page 12  2015 Microchip Technology Inc.

Product Overview

The evaluation board is designed for ease of use and experimentation purposes.

Figure 1-2 shows the top silk screen of the PAC17X0 High-Side Current Sensors

Evaluation Board.

FIGURE 1-2: PAC17X0 High-Side Current Sensors Evaluation Board – Top Silk Screen.

1.4 WHAT THE PAC17X0 HIGH-SIDE CURRENT SENSORS EVALUATION BOARD KIT CONTAINS

This PAC17X0 High-Side Current Sensors Evaluation Board kit includes:

• PAC17X0 High-Side Current Sensors Evaluation Board (ADM00494)

• Supplied USB-A Male to Mini USB-B Male Cable

• Information Sheet

 2015 Microchip Technology Inc. DS50002367A-page 13

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

NOTES:

DS50002367A-page 14  2015 Microchip Technology Inc.

Chapter 2. Installation and Operation

2.1 GETTING STARTED

2.1.1 System Requirements

To use the PAC17X0 High-Side Current Sensors Evaluation Board, the following are
required:

•A PC running Microsoft

• A display resolution of 800x600 or larger, for viewing several windows
simultaneously

• An available USB port

2.1.2 Installing the Evaluation Board

Follow the next steps to install the Microchip Chip Manager application:

1. Before installing and running the Chip Manager, install the “MCP2200/MCP2221

Windows Driver & Installer” on the local machine. If the driver and installer
package has already been installed, skip this step. The “MCP2200/MCP2221
Windows Driver & Installer” can be downloaded from:

http://www.microchip.com/wwwproducts/Devices.aspx?product=MCP2221.

Follow the on-screen instructions to complete the installation process.

2. Download the ChipMan file from the board web page. Unzip the archive. The

application’s revision history and install/uninstall notes may be found in the
readme.txt file.

3. To install the Chip Manager application and the device driver on the PC, run

ChipMan-v4.16.7-windows-installer.exe.

4. Connect the supplied USB cable to an available USB port on the PC. Plug the

mini-B end of the USB cable into the board connector, J14. The LEDs for
VDD_Power, USB_Power, USB_OK and ALERT (LD5) should illuminate, and
the 10 Hz LED (LD7) will blink. For a description of the LEDs, see

Section 3.3 “LED Indicators”.

5. If the USB bridge driver has not previously been installed on the selected USB

port, the Driver Software Installation window pops up, prompting for the driver
install (see Figure 2-1).

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

®

Windows® operating system

 2015 Microchip Technology Inc. DS50002367A-page 15

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

FIGURE 2-1: Driver Software Installation Window.

6. After the driver installation is complete, the initial setup screen for the Chip

Manager application appears (see Figure 2-2). Click Next to start the installation.

FIGURE 2-2: Application Install Window.

DS50002367A-page 16  2015 Microchip Technology Inc.

Installation and Operation

7. To proceed with the installation, read the License Agreement and accept by clicking

the radio button corresponding to “I accept the agreement”. Then click Next.

FIGURE 2-3: License Agreement Dialog.

8. On the Installation Directory dialog, browse for the desired location or click Next

to install in the default location (see Figure 2-4).

FIGURE 2-4: Installation Directory Dialog.

 2015 Microchip Technology Inc. DS50002367A-page 17

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

FIGURE 2-5: Ready to Install Dialog.

FIGURE 2-6: Setup Window – Installation Progress.

9. After the setup is complete, the MSXML Parser used by the Chip Manager
software is installed, as shown in Figure 2-7. Once the setup completes
successfully, press Finish to exit the install.

DS50002367A-page 18  2015 Microchip Technology Inc.

Installation and Operation

FIGURE 2-7: MSXML Parser Install Window.

FIGURE 2-8: Installation Complete Dialog.

 2015 Microchip Technology Inc. DS50002367A-page 19

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

10. Start the software by either going to Windows Start button > All Programs >
Microchip > Microchip Chip Manager or by double-clicking the software icon

( ) on the desktop. The evaluation board software will initialize and the
Microchip Chip Manager with the Quick Help screen appears (see Figure 2-9).

FIGURE 2-9: Microchip Chip Manager – Quick Help Window.

DS50002367A-page 20  2015 Microchip Technology Inc.

Installation and Operation

PAC17x0

11. If a message stating that no device has been selected appears, click Yes to

select a device. Alternatively, go to the Chip Manager’s main menu, select

Options > Select Device

displays, as shown in Figure 2-10.

In the “Device” list, choose PAC17X0. The “Master Controller” drop-down list
should highlight “USB SMBus Bridge”. Click OK

. In either case, the Select Microchip Device window

to complete the device selection.

FIGURE 2-10: Select Device Window.

 2015 Microchip Technology Inc. DS50002367A-page 21

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

12. From the Chip Manager main menu, ensure that Options > Auto refresh Registers
is checked. In the left panel, click the Hardware Monitor (HWM) to expand the
content, then select any of the register groups, as shown in Figure 2-11. The
SM_ACT LED on the board starts blinking when any of the register groups are
selected. The register values are automatically updated every second when the
Auto Refresh option is on.

FIGURE 2-11: Chip Manager Register Groups.

Devices supported with PAC17X0 are listed in Ta bl e 2- 1 .

TABLE 2-1: PAC17X0 SUPPORTED DEVICES

Address J12 State Device

58h N/A PAC1710

98h Installed PAC1720

9Ah Open PAC1720

DS50002367A-page 22  2015 Microchip Technology Inc.

Chapter 3. Hardware Description

3.1 INTRODUCTION

The PAC17X0 High-Side Current Sensors Evaluation Board provides the means to
evaluate features and to view and modify registers. There are two modes of evaluation
board current monitoring operation:

• Demo Mode: Monitors an on-board current source

• Sys Mode: Monitors an external current source

LEDs indicate status information and test points are included to monitor system
voltages with a user-provided voltmeter or oscilloscope.

3.1.1 PAC1710 and PAC1720

The PAC1710 and PAC1720 devices are SMBus-compliant, high-side, bidirectional
current-sense monitors in a 10-pin, 3 mm x 3 mm DFN package. Communications with
the sensor are via the SMBus. For details regarding the PAC1710 and PAC1720, refer
to the device data sheet.

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

3.1.2 Power Source

This evaluation board only requires a single USB cable to operate. USB bus voltage is
provided to the on-board test current sources and the USB-SMBus bridge. The
USB-SMBus bridge regulates the +5V USB power to +3.3V used by the PAC1710,
PAC1720 and other evaluation board circuitry.

3.2 USB-TO-SMBus BRIDGE

The communication bridge on the PAC17X0 evaluation board is based on the
MCP2221 protocol converter. The MCP2221 enables USB connectivity in applications
that have UART and/or I

The MCP2221 USB bridge requires a driver to be installed on the computer for proper
communication with the PAC17X0 devices. Please refer to Section 2.1.1 “System

Requirements” to review the installation process of the MCP2221 communication driver.

3.2.1 Direct SMBus Connect Option

It is also possible to connect an external communication master to the PAC17X0:

• Remove the jumpers on J13 and connect the SMBus master to the SDA, SCL and

ALERT
provided on this header for convenience (GND).

• The +3.3V can be supplied by the communication bridge by leaving the +3.3V

jumper in place and retaining the USB connection.

pins, as well as an external supply for +3.3V. Note that a return is also

2

C and SMBus interfaces.

 2015 Microchip Technology Inc. DS50002367A-page 23

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

LD7

10Hz

VDD_Power

USB_OK

SM_ACT

USB_Power

LD6
Pulse

3.3 LED INDICATORS

Figure 3-1 identifies the location of the LEDs.

FIGURE 3-1: LED Locations.

Ta bl e 3- 1 details the LED status of the following signals:

.

TABLE 3-1: LED STATUS INDICATORS

LED # Signal

1 USB Activity No activity on USB port Activity on USB port N/A

2 SMBus Activity No activity within

USB-SMBus bridge

3V

4 USB Power USB power is not present USB power is present N/A

5Alert N/A ALERT

6 Pulse SW4 pulse trigger

7 10 Hz (Blinking) 10 Hz test square wave source is operating N/A

Power VDD is not present VDD is present VDD is present

DD

OFF GREEN RED

is not pressed

LED Status

SW4 pulse trigger is pressed N/A

N/A Activity within

USB-SMBus bridge

is not asserted ALERT is asserted

DS50002367A-page 24  2015 Microchip Technology Inc.

3.4 JUMPER SETTINGS

J12

J17

J16

J1

J2 J13

J5

J4

J3

J15

J9

J8

J10

J7

J6

J18

J19

J20

J11

Figure 3-2 identifies the jumper locations on the evaluation board.

Hardware Description

FIGURE 3-2: Jumper Locations.

This evaluation board has pin headers and jumper configurations to evaluate the
features of the PAC1710 and PAC1720 devices. Jumper settings are described in

Ta bl e 3- 2 .

 2015 Microchip Technology Inc. DS50002367A-page 25

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

TABLE 3-2: JUMPER SETTINGS

Pin

Header

J1, J2 V

J3, J4 DEMO SYS (1) Select Demo mode R

J5 Polarity Normal polarity of V

J6, J7 V

J8, J9 DEMO SYS (2) Select Demo mode R

J10 Polarity Normal polarity of V

J11 GND Connect ground from external source

J12 J12 (ADDR_SEL) Set SMBus address at power-up to

J13 GND, ALERT

J14 USB Connection USB connection for Chip Manager control and monitoring.

J15 Pulse Dur Range See Section 3.6.3 “Pulse Current Source”

J16 Demo Current

J17 V

J18 V

J19 V

J20 V

Label Default Position Alternate Position(s)

SOURCE

V

SOURCE

SOURCE

V

SOURCE

1+,

1-

Positions 3-2 are jumpered on both jumpers.
See Section 3.6 “Demo Mode Setup and

Operation”.

Positions 2-4 and 1-3 are jumpered.

2+,

External power source terminals. See Section 3.7.2 “Load Connection”.

2-

Positions 3-2 are jumpered on both jumpers.
PAC1720 only.
See Section 3.6 “Demo Mode Setup and

Operation”.

Positions 2-4 and 1-3 are jumpered.

External power source terminals. See Section 3.7.2 “Load Connection”.

SENSE

1+/-.

Select Sys mode R

SENSE

Positions 1-2 are jumpered on both jumpers.
See Section 3.7 “Sys Mode Setup and

Operation”.

SOURCE

1.

Reversed polarity of V
Positions 1-2 and 3-4 are jumpered.

SENSE

2+/-.

Select Sys mode R

SENSE

Positions 1-2 are jumpered on both jumpers.
PAC1720 only.
See Section 3.7 “Sys Mode Setup and

Operation”.

SOURCE

2.

Reversed polarity of V
Positions 1-2 and 3-4 are jumpered.

for Sys mode.

Set SMBus address at power-up to

SCL, SDA, 3.3V

1001_100b – 98h.
Jumper in place (closed).

,

USB bridge generates on-board 3.3V and
provides SMBus host.

1001_101b – 9Ah.
Jumper off (open).

See Section 3.2.1 “Direct SMBus

Connect Option”.

Positions 1-2, 3-4, 5-6, 7-8, 9-10 are
all jumpered.

Range Sel

SOURCE

SOURCE

SOURCE

SOURCE

80 mV range. Positions 1-2 are jumpered.
See Section 3.6.1 “Steady-State Current

Source”.

1+ Power jacks. See Section 3.7.2 “Load Connection”.

1-

2+

2-

40 mV range. Positions 3-4 are jumpered.
20 mV range. Positions 5-6 are jumpered.
10 mV range. Positions 7-8 are jumpered.

1+/-.

SOURCE

2+/-.

SOURCE

1.

2.

DS50002367A-page 26  2015 Microchip Technology Inc.

Hardware Description

3.5 PAC17X0 TEST POINTS

The PAC17X0 High-Side Current Sensors Evaluation Board provides test points for
ground reference and signal access. Ta b le 3 -3 summarizes these test points.

TABLE 3-3: TEST POINT LOCATION

Test Point # Marking Monitored Signal Function

1V

2V

3V

4V

1+ (orange) SENSE+

SENSE

1- (yellow) SENSE-

SENSE

2+ (orange) SENSE+

SENSE

2- (yellow) SENSE-

SENSE

5 ALERT (white) ALERT

6 ADDR_SEL (white) SMBus Address Select (at power-up)

7 10 Hz (white) Square Wave Current Output

8 PULSE (white) Momentary Pulse (SW4 pushed)

9I

(white) Current Monitor with 2.5V/mA Sensitivity

DD

 2015 Microchip Technology Inc. DS50002367A-page 27

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

3.6 DEMO MODE SETUP AND OPERATION

Demo mode uses three on-board current sources to exercise and demonstrate the
features of the PAC1710 and PAC1720 devices. Jumpers J3, J4, J8 and J9 are initially
set for Demo mode (see Section 3.4 “Jumper Settings”).

3.6.1 Steady-State Current Source

A constant current source is provided using +5V USB as the supply. This current is
adjustable from zero to approximately 85 mA (80 mV range) using rotary switch, SW1
SS Amp Adjust. Parallel sense resistors are provided for a combined value of one ohm,
with accuracy less than or equal to 0.3%. This is used to convert the current to a cor­responding voltage for the PAC1720 to read at the SENSE+ and SENSE- inputs. The
steady-state current consumption for the rotary switch SW3 Pulse Duration settings, in
conjunction with the J16 jumper position which sets the range, are shown in Table 3-4.

TABLE 3-4: STEADY-STATE CURRENT CONSUMPTION

SW1

Position

0 0 mA 0 mA 0 mA 0 mA

1 ~6.6 mA ~3.3 mA ~1.6 mA ~0.8 mA

2 ~13.2 mA ~6.6 mA ~3.2 mA ~1.7 mA

3 ~19.4 mA ~9.6 mA ~4.6 mA ~2.4 mA

4 ~26.8 mA ~13.3 mA ~6.4 mA ~3.4 mA

5 ~32.4 mA ~16.0 mA ~7.8 mA ~4.1 mA

6 ~38.1 mA ~18.9 mA ~9.1 mA ~4.8 mA

7 ~43.4 mA ~21.5 mA ~10.4 mA ~5.5 mA

8 ~53.2 mA ~26.3 mA ~12.8 mA ~6.7 mA

9 ~57.9 mA ~28.7 mA ~13.9 mA ~7.3 mA

A ~62.8 mA ~31.1 mA ~15.1 mA ~7.9 mA

B ~67.2 mA ~33.3 mA ~16.1 mA ~8.4 mA

C ~72.7 mA ~36.0 mA ~17.4 mA ~9.1 mA

D ~76.9 mA ~38.0 mA ~18.4 mA ~9.7 mA

E ~81.1 mA ~40.1 mA ~19.4 mA ~10.2 mA

F ~85.0 mA ~42.1 mA ~20.4 mA ~10.7 mA

Pins 1-2

(80 mV Range)

(40 mV Range)

J16 Jumper Position

Pins 2-3

Pins 3-4

(20 mV Range)

Pins 5-6

(10 mV Range)

DS50002367A-page 28  2015 Microchip Technology Inc.

Hardware Description

3.6.2 10 Hertz Current Source

Rotary switch SW5 10 Hz Amp Adj injects a 10 Hz square wave signal into the
current-sense measurement circuit. This function is provided to demonstrate the
PAC1710 and PAC1720 devices’ ability to attenuate circuit noise. The steady-state
current consumption for the rotary switch SW1 Steady-State settings, in conjunction
with the J16 jumper position which sets the range, are shown in Table 3-4. The square
wave amplitude is adjustable by rotary switch SW5 to obtain the pulse consumption
shown in Ta b le 3 -5 .

TABLE 3-5: 10 Hz PULSE CURRENT CONSUMPTION

SW5 Position 10 Hz Pulse Consumption (mA)

00mA

1~0.7mA

2~1.4mA

3~2.0mA

4~2.8mA

5~3.4mA

6~4.0mA

7~4.6mA

8~5.6mA

9~6.1mA

A~6.6mA

B~7.1mA

C~7.6mA

D~8.1mA

E~8.5mA

F~8.9mA

 2015 Microchip Technology Inc. DS50002367A-page 29

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

3.6.3 Pulse Current Source

The pulse current source is provided to demonstrate the PAC1710 and PAC1720
devices’ ability to detect current spikes of varying amplitude and duration. The current
source is activated using momentary switch SW4 Pulse Trigger. Rotary switch SW2
Pulse Amp Adj, in conjunction with the J15 jumper position which increases the
dynamic range of the pulse width, sets the pulse duration as shown in Table 3-6. Single
pulse current consumption is shown in Tab le 3- 7 .

TABLE 3-6: SINGLE PULSE DURATION

SW2

Position

0 ~1.38 ms ~14.68 ms ~0.176s

1 ~2.45 ms ~28.60 ms ~0.347s

2 ~3.53 ms ~42.55 ms ~0.517s

3 ~4.58 ms ~56.00 ms ~0.683s

4 ~5.73 ms ~70.60 ms ~0.862s

5 ~6.76 ms ~83.70 ms ~1.03s

6 ~7.79 ms ~96.80 ms ~1.19s

7 ~8.79 ms ~109.4 ms ~1.35s

8 ~9.74 ms ~121.6 ms ~1.50s

9 ~10.70 ms ~133.8 ms ~1.66s

A ~11.64 ms ~145.6 ms ~1.81s

B ~12.52 ms ~156.8 ms ~1.95s

C ~13.44 ms ~168.8 ms ~2.10s

D ~14.26 ms ~179.0 ms ~2.23s

E ~15.04 ms ~189.0 ms ~2.36s

F ~15.7 ms ~190.0 ms ~2.47s

Pins 1-2 Pins 2-3 Open

J15 Jumper Position

TABLE 3-7: SINGLE PULSE CURRENT CONSUMPTION

SW5 Position Single Pulse Consumption (mA)

00 mA

1~2.8mA

2~5.6mA

3~8.2mA

4~11.3mA

5~13.7mA

6~16.1mA

7~18.4mA

8~22.4mA

9~24.5mA

A~26.5mA

B~28.4mA

C~30.7mA

D~32.5mA

E~34.3mA

F~35.9mA

DS50002367A-page 30  2015 Microchip Technology Inc.

3.7 SYS MODE SETUP AND OPERATION

J1

V

SOURCE

1+ Connects to

DC Load/Supply

J2

V

SOURCE

1- Connects to

DC Load/Supply

J7

V

SOURCE

2- Connects to

DC Load/Supply

J6

V

SOURCE

2+ Connects to

DC Load/Supply

J11
Connects to
System Ground

Note: J17/J18 are alternate connections for V

SOURCE

1 and J19/J20 are alternate connections for V

SOURCE

2.

Sys mode uses external current sources, such as 12 VDC, to exercise and demonstrate
the features of the PAC1710 and PAC1720.

3.7.1 Jumper Positions

To use Sys mode, adjust jumpers J3, J4, J8 and J9 (see Ta bl e 3 - 2) to disconnect the
on-board demonstration current sources.

3.7.2 Load Connection

A 3 m (1% tolerance) sense resistor is provided on-board the PAC17X0 High-Side
Current Sensors Evaluation Board to measure system current. For V
sense resistor is connected between J17 and J18 if using these power jacks, or between
J1 and J2 if using wire terminals. For V
J19 and J20 if using these power jacks, or between J6 and J7 if using wire terminals.

When using wire terminals, connections to the system can be established as shown in

Figure 3-3.

SOURCE

Hardware Description

SOURCE

2, this sense resistor is connected between

1, this

FIGURE 3-3: External Load Connection Using Wire Terminals.

 2015 Microchip Technology Inc. DS50002367A-page 31

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

3.8 MEASUREMENT POLARITY

Measurement polarity can be reversed using jumpers provided in J5 for V
J10 for V

SOURCE

2. For normal polarity measurements, jumpers are placed in

SOURCE

locations 1-3 and 2-4 (default). For measurement polarity reversal, jumpers are
positioned in locations 1-2 and 3-4.

1 and

DS50002367A-page 32  2015 Microchip Technology Inc.

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

Chapter 4. Software Description

4.1 CHIP MANAGER APPLICATION OVERVIEW

The Chip Manager application enables the user to display voltage readings, set bus
voltage and current-sense limits and read/write Configuration register values. The Chip
Manager initially displays a Quick Help screen (see Figure 2-9). For detailed
information on application features and usage, select Help > Contents
HTML-based Help document, as shown in Figure 4-1.

to display the

FIGURE 4-1: Chip Manager Help Screen.

4.1.1 Real-Time Register Graphs

The Chip Manager software has the ability to plot register values in real time, up to a
4 Hz continuous rate.

 2015 Microchip Technology Inc. DS50002367A-page 33

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

4.1.2 Selecting Registers to Plot

1. To plot a register, right-click the desired register name or value. Select the “Add
Register(s) to Plot” from the context menu (see Figure 4-2) to add the register or
value to the plot list.

FIGURE 4-2: Adding Registers to Plot.

2. Once the desired register is added to be plotted, a graphic plot window will
appear with a legend on top, as shown in Figure 4-3. The two windows can be
rearranged independently.

FIGURE 4-3: Register Plot Window.

3. To plot additional registers, go back to the Chip Manager Main window and
repeat Step 1.

DS50002367A-page 34  2015 Microchip Technology Inc.

Software Description

4.1.3 Starting the Plots

Note: Before starting the plots, it is important to disable the register’s

auto refresh. On the Chip Manager main menu, ensure that

Options > Auto Refresh Registers

All plots can be started simultaneously by selecting Control > Plots > Start All Plots from
the menu in the Main Application window. Multiple plots will be in sync if they are started
simultaneously.

Individual plots may be paused at any time by clicking Control > Pause
window. This will not cause loss of captured data on the other Plot windows.

For a better view of the plot, select a different “Time per division” value in the drop-down
menu at the bottom of the Plotting window. This scale change affects both the
Real-Time mode and the Playback mode, while the rate at which data is recorded is
unaffected.

4.1.4 Exporting and Importing the Plot Data

The data on each plot window may be stored in a semicolon-separated text file. To save
the data, follow the steps:

1. Stop the plotting by selecting Control > Stop

C

ontrol > Plots > Stop All Plots from the Chip Manager main window.

2. Select File > Export

To review saved data:

1. Select File > Import

from the plot window to save the data.

from an open plot window and then select the file name to open.

is not checked.

in the Plot

from the plot window or

Note: Importing a saved data file into a Plot window with a different data type is

not allowed by the Chip Manager application. In this case, a warning
message will display. It is recommended to choose a file name that reflects
the data type when exporting the plot data.

 2015 Microchip Technology Inc. DS50002367A-page 35

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

NOTES:

DS50002367A-page 36  2015 Microchip Technology Inc.

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

Chapter 5. Evaluation Board Demonstration

5.1 INTRODUCTION

This chapter provides insight to the PAC17X0 High-Side Current Sensors Evaluation
Board capabilities.

5.2 STEADY-STATE CURRENT SOURCE – ROTARY SWITCH 1

Rotary Switch 1 provides a means to control the current level through the on-board
1 sense resistor in fifteen discrete steps (see Section 3.6.1 “Steady-State Current

Source”). To demonstrate this, complete the following steps:

1. In the Chip Manager application, select Bus Monitoring from the left pane to show

registers. Right-click a V

Figure 5-1 and Section 4.1.2 “Selecting Registers to Plot”).

range and add it to the registers to plot (see

SENSE

FIGURE 5-1: Selecting Register to Plot.

2. Turn all rotary switches to the “0” position.

3. Go to the Control menu and start the plot. Figure 5-2 shows a plot of current with

all switches off.

FIGURE 5-2: All Current Sources Off Plot.

 2015 Microchip Technology Inc. DS50002367A-page 37

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

4. Turn the Rotary Switch 1 to move through positions “1” through “F” and observe
the plot (Figure 5-3).

FIGURE 5-3: Steady-State Current Plot.

5. After experimenting, you can stop the plot and export the data (see

Section 4.1.4 “Exporting and Importing the Plot Data”) or leave it running for

the next demonstration.

DS50002367A-page 38  2015 Microchip Technology Inc.

Evaluation Board Demonstration

5.3 MOMENTARY PULSE CURRENT SOURCE (AMPLITUDE) – ROTARY SWITCH 2

Rotary Switches 2 and 3 can be used to generate current spikes of varying amplitude
and duration (see Section 3.6.3 “Pulse Current Source”). To demonstrate amplitude
changes, complete the following steps:

1. Turn all rotary switches to the “0” position.

2. Ensure J15 is open. This increases pulse width so the demonstration is easier to
see.

3. Start the V

4. Turn Rotary Switch 3 to position “4”.

5. Turn Rotary Switch 2 to position “1” and press Switch 4 (Pulse Trigger button).

6. Turn Rotary Switch 2 to position “2” and press Switch 4 (Pulse Trigger button).

7. Continue turning Rotary Switch 2, one position at a time, and pressing Switch 4.
Observe the plot (Figure 5-4).

range plot used in the previous demonstration.

SENSE

FIGURE 5-4: Momentary Pulse Amplitude Plot.

8. After experimenting, you can stop the plot and export the data (see

Section 4.1.4 “Exporting and Importing the Plot Data”) or leave it running for

the next demonstration.

 2015 Microchip Technology Inc. DS50002367A-page 39

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

5.4 MOMENTARY PULSE CURRENT SOURCE (DURATION) – ROTARY SWITCH 2

Rotary Switches 2 and 3 can be used to generate current spikes of varying amplitude
and duration. To demonstrate duration changes, complete the following steps:

1. Turn all rotary switches to the “0” position.

2. Ensure J15 is open. This increases pulse width so the demonstration is easier to
see.

3. Start the V

4. Turn Rotary Switch 2 to position “F” (highest level of pulse).

5. Turn Rotary Switch 3 to position “F” and press Switch 4 (Pulse Trigger button) to
send the pulse.

6. Turn Rotary Switch 3 to position “E” and press Switch 4 (Pulse Trigger button) to
send the pulse.

7. Continue turning Rotary Switch 3, one position at a time, and pressing Switch 4.
Observe the plot (Figure 5-5).

range plot used in the previous demonstration.

SENSE

FIGURE 5-5: Momentary Pulse Duration Plot.

8. After experimenting, stop the plot.

5.5 10 Hz PULSE TRAIN CURRENT SOURCE – ROTARY SWITCH 5

Rotary Switch 5 can be used to introduce noise (see Section 3.6.2 “10 Hertz Current

Source”). The evaluation board with the Chip Manager tool does not demonstrate the

PAC1710 and PAC1720 devices’ ability to attenuate circuit noise because the maxi­mum update rate of the Chip Manager is limited to 4 Hz. To see this feature, connect
an external SMBus master to read the device quickly enough to properly see the results
of the injected 4 Hz noise.

DS50002367A-page 40  2015 Microchip Technology Inc.

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the PAC17X0
High-Side Current Sensors Evaluation Board:

• Board – Schematic: Current Sensors

• Board – Schematic: Current Sources

• Board – Schematic: MCP2221 USB Bridge

• Board – Top Silk

• Board – Top Copper and Silk

• Board – Top Copper

• Board – Bottom Copper

• Board – Bottom Copper and Silk

• Board – Bottom Silk

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

 2015 Microchip Technology Inc. DS50002367A-page 41

DS50002367A-page 42  2015 Microchip Technology Inc.

V

SENSE

2+

V

SENSE

2-

V

SENSE

1+

V

SENSE

1-

V

SOURCE

1-

V

SOURCE

1+

V

SOURCE

2+

V

SOURCE

2-

SENSE1+

1

SENSE1-

2

SENSE2+

3

SENSE2-

4

GND

5

ADDR_SEL

6

ALERT#

7

SMDATA

8

SMCLK

9

V

DD

10

GND1

11

PAC1720

U1

0.1%

2.21R

0603

R9

0.1%

2.21R
0603

R8

+5V_USB

+3.3V

+3.3V

Idemo

SMBus_CLK
SMBus_DATA
ALERT#

Close J12 (default) = 1001_100xb -> 98h

Open J12 = 1001_101xb -> 9Ah

heavy traces
or solid cooper

heavy traces
or solid cooper

heavy traces
or solid cooper

heavy traces
or solid cooper

Fixed address 2Ch

40 mV sensing range

IDD ANALOG MONITOR

2.5V/mA SENSITIVITY

12

J1

12

J2

JACK Power 2.1 mm Male

2

3

1

J17

JACK Power 2.1 mm Male

2

3

1

J18

21

J11

GND

21

J6

21

J7

JACK Power 2.1 mm Male

2

3

1

J19

JACK Power 2.1 mm Male

2

3

1

J20

123

J4

J3

J3_2

J4_2

123

4

J5

Mode Select:

SYS: 1-2
DEMO: 2-3

TP1

V

SENSE

1+

TP2

V

SENSE

1-

0R

R1

0R

R2

0R

R6

0R

R7

J8

123

J9

Mode Select:

SYS: 1-2
DEMO: 2-3

Default:
1-3
2-4

123

4

J10

Default:
1-3
2-4

TP3

V

SENSE

2+

TP4

V

SENSE

2-

TP6

ADDR_SEL

TP5

ALERT

21

J12

1k

R15

1k

R16

10k

R14

1k
0603
1%

R28

1k
0603
1%

R26

100k

R27

2 1

43

GREEN

RED

LD5

100R

R13

0.1 μF
16V

C1

0.1 μF
16V

C17

1 μF
16V

C2

1 μF
16V

C18

5.6k

R4

12

3
4

0.003R
2412
1%

R11

12

3
4

0.003R
2412
1%

R22

TP9

I

DD

1k

R31

1 μF
16V

C20

100k

0603
1%

R30

+

5V_USB

+5V_USB

24.9R
0603

1%

R5

2.21R
0603

0.1%

R12

2.21R

0603

0.1%

R17

10.5R
0603
1%

R18

56

7

14

SN74LVC14A

U4C

MCP6V31

+A

3

-A

4

OUTA

1

Vss

V

DD

25

U6

SENSE+

1

SENSE-

2

NC1

3

NC2

4

GND

5

ADDR_SEL

6

ALERT#

7

SMDATA

8

SMCLK

9

V

DD

10

GND1

11

PAC1710

U2

10.5R
0603
1%

R10

321321

A.2 BOARD – SCHEMATIC: CURRENT SENSORS

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

 2015 Microchip Technology Inc. DS50002367A-page 43

1%14.3R

0603

R60

1%24.9R

0603

R68

1%14.3R

0603

R72

1%24.9R

0603

R73

1%

24.9R
0603

R58

1%14.3R

0603

R67

1%

24.9R
0603

R49

1%

24.9R
0603

R57

1%24.9R

0603

R37

1%
221k
0603

R77

1%
221k
0603

R61

+3.3V

+3.3V

+3.3V

+3.3V

+5V_USB

+3.3V

+3.3V

Idemo

Idemo

Idemo

single pulse generator

PULSE DUR

T

single pulse
consumption

0

1

2

3

4

5

6

7

8

9

A

B

C

D

E

F

0

1

2

3

4

5

6

7

8

9

A

B

C

D

E

F

0

1

2

3

4

5

6

7

8

9

A

B

C

D

E

F

0

1

2

3

4

5

6

7

8

9

A

B

C

D

E

F

0 mA/0 mA/0 mA/0 mA

~6.6 mA/~3.3 mA/~1.6 mA/~0.8 mA

~85.0 mA/~42.1 mA/~20.4 mA/~10.7 mA

~81.1 mA/~40.1 mA/~19.4 mA/~10.2 mA

~76.9 mA/~38.0 mA/~18.4 mA/~9.7 mA

~72.7 mA/~36.0 mA/~17.4 mA/~9.1 mA

~67.2 mA/~33.3 mA/~16.1 mA/~8.4 mA

~62.8 mA/~31.1 mA/~15.1 mA/~7.9 mA

~57.9 mA/~28.7 mA/~13.9 mA/~7.3 mA

~53.2 mA/~26.3 mA/~12.8 mA/~6.7 mA

~43.4 mA/~21.5 mA/~10.4 mA/~5.5 mA

~38.1 mA/~18.9 mA/~9.1 mA/~4.8 mA

~32.4 mA/~16.0 mA/~7.8 mA/~4.1 mA

~26.8 mA/~13.3 mA/~6.4 mA/~3.4 mA

~19.4 mA/~9.6 mA/~4.6 mA/~2.4 mA

~13.2 mA/~6.6 mA/~3.2 mA/~1.7 mA

steady-state consumption
J16 possition 1-2/3-4/5-6/7-8

single pulse
consumption

10 Hz pulse
consumption

steady-state
consumption SS AMP

T

single pulse duration,
J15 position 1-2/2-3/no

~2.8 mA

~5.6 mA

~8.2 mA

~11.3 mA

~13.7 mA

~16.1 mA

~18.4 mA

~22.4 mA

~24.5 mA

~26.5 mA

~28.4 mA

~30.7 mA

~32.5 mA

~34.3 mA

~35.9 mA

0 mA

0 mA

~0.7 mA

~1.4 mA

~2.0 mA

~2.8 mA

~3.4 mA

~4.0 mA

~4.6 mA

~5.6 mA

~6.1 mA

~6.6 mA

~7.1 mA

~7.6 mA

~8.1 mA

~8.5 mA

~8.9 mA

~1.38 mS/~14.68 mS/~0.176S

~2.45 mS/~28.60 mS/~0.347S

~3.53 mS/~42.55 mS/~0.517S

~4.58 mS/~56.00 mS/~0.683S

~5.73 mS/~70.60 mS/~0.862S

~6.76 mS/~83.70 mS/~1.030S

~7.79 mS/~96.80 mS/~1.190S

~8.79 mS/~109.4 mS/~1.350S

~9.74 mS/~121.6 mS/~1.500S

~10.70 mS/~133.8 mS/~1.66S

~11.64 mS/~145.6 mS/~1.81S

~12.52 mS/~156.8 mS/~1.95S

~13.44 mS/~168.8 mS/~2.10S

~14.26 mS/~179.0 mS/~2.23S

~15.04 mS/~189.0 mS/~2.36S

10 Hz pulse generator

10 Hz AMP

T

10 Hz pulse
consumption

PULSE AMP

T

~15.76 mS/~198.0 mS/~2.47S

80 mV

40 mV

20 mV

10 mV

PULSE DUR

RANGE

PULSE
TRIGGER

4.7

R70

4.7

R42

4.7

R71

49.9R

R69

1

2

3

4

5

6

7

8

J16

0.1 μF
16V

C9

0.1 μF

16V

C8

1k

R40

1.9A

3

1

2

Q1

1.9A

3

1

2

Q2

1.9A

3

1

2

Q3

0.1 μF
16V

C14

0.1 μF
16V

C12

1k

R52

1k

R44

100R

R50

52.3k

R36

25.5k

R35

12.1k

R34

5.6k

R33

52.3k

R56

52.3k

R48

25.5k

R55

25.5k

R47

12.1k

R54

12.1k

R46

5.6k

R53

5.6k

R45

TP8

Pulse

TP7

10 Hz

1k

R66

1k

R43

GREEN

LD6

Pulse

GREEN

LD7

10 Hz

1.9A

3

1

2

Q6

10 μF
10V

C10

330k

R62

52.3k

R63

3.92k

R23

10k

R65

MMBT3906

1

2

3

Q5

MMBT3906

1

2

3

Q4

321

J15

14

23

SW4

Pulse

10k

R76

1M

R24

0.1 μF
16V

C36

0.1 μF
16V

C13

0.1 μF
16V

C11

0.1 μF
16V

C3

0.1 μF

16V

C15

0.1 μF
16V

C16

0.1 μF

C4

1k

R59

0.1 μF

C21

0.1 μF

C22

0.1 μF

C23

0.1 μF

C24

0.1 μF

C25

0.1 μF

C26

0.1 μF

C27

0.1 μF

C28

0.1 μF

C29

0.1 μF

C30

0.1 μF

C31

0.1 μF

C32

0.1 μF

C33

0.1 μF

C34

0.1 μF

C35

12.1k

R39

5.6k

R38

10k

R51

1M

R41

1

1

C

2

4

3

2

4

C

5

8

6

Hex

SW1

1

1

C

2

4

3

2

4

C

5

8

6

Hex

SW2

1

1

C

2

4

3

2

4

C

5

8

6

Hex

SW5

1

1

C

2

4

3

2

4

C

5

8

6

Hex

SW3

12

7

14

SN74LVC14A

U4A

34

7

14

SN74LVC14A

U4B

98

7

14

SN74LVC14A

U4D

1110

7

14

SN74LVC14A

U4E

13

12

7

14

SN74LVC14A

U4F

MCP6074

+A

3

-A

2

OUTA

1

Vss

11

VDD

4

U5A

MCP6074

+B

5

-B

6

OUTB

7

VSS

11

VDD

4

U5B

+5V_USB

MCP6074

+C

10

-C

9

OUTC

8

VSS

11

VDD

4

U5C

+5V_USB

MCP6074

+D

12

-D

13

OUTD

14

VSS

11

VDD

4

U5D

+5V_USB

IC1142

0R

0603

R19

0R

0603

R32

0R

0603

R75

A.3 BOARD – SCHEMATIC: CURRENT SOURCES

ADJUSTMEN

ADJUSTMEN

Schematic and Layouts

ADJUSTMEN

ADJUSTMEN

DS50002367A-page 44  2015 Microchip Technology Inc.

+3.3V

+3.3V

ALERT#

SMBus_DATA

SMBus_CLK

1k

R21

10 μF
10V

C19

220R

FB1

GREEN

LD3

VDD_Power

1

2

3

4

5

6

7

8

9

10

J13

USB_N

USB_P

USB_N

USB_P

0.47 μF 6.3V

0603

C37

GND

GP1

RX

TX
USB_OK SM_ACT

SDA

SCL

RESET VUSB

3.3V

MCP2221

V

DD

1

GP0

2

GP1

3

RST

4

UART RX

5

UART TX

6

GP27GP3

8

SDA

9

SCL

10

V

USB

11

D-

12

D+

13

Vss

14

U3

3.3V

1k
0603
5%

R78

RED

LD2

SM_ACT

3.3V

USB_OK

GREEN

LD1

USB_OK

1k
0603
5%

R3

3.3V

SM_ACT

ALERT

GND

GND

0.1 μF 16V

0603

C7

10k
0603
1%

R64

10k
0603
1%

R74

3.3V

GND

GND

2

V

IN

1

V

OUT

3

MCP1703/3.3V

U8

GND

10 μF
10V

0805

C6

GND

0.1 μF
16V
0603

C5

GND

3.3V

3.3V

ALERT

10k
0603
1%

R29

3.92k

R20

GREEN

LD4

USB_Power

ID

4

V

BUS

1

GND

5

D-

2

D+

3

0

USB MINI-B Female

J14

+5V_USB

10k

0603
1%

R25

GND

GND

1

2

3 4

5

6

5.25V

D1

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

A.4 BOARD – SCHEMATIC: MCP2221 USB BRIDGE

A.5 BOARD – TOP SILK

Schematic and Layouts

 2015 Microchip Technology Inc. DS50002367A-page 45

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

A.6 BOARD – TOP COPPER AND SILK

DS50002367A-page 46  2015 Microchip Technology Inc.

A.7 BOARD – TOP COPPER

Schematic and Layouts

 2015 Microchip Technology Inc. DS50002367A-page 47

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

A.8 BOARD – BOTTOM COPPER

DS50002367A-page 48  2015 Microchip Technology Inc.

A.9 BOARD – BOTTOM COPPER AND SILK

Schematic and Layouts

 2015 Microchip Technology Inc. DS50002367A-page 49

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

A.10 BOARD – BOTTOM SILK

DS50002367A-page 50  2015 Microchip Technology Inc.

PAC17X0 HIGH-SIDE CURRENT

SENSORS EVALUATION

BOARD USER’S GUIDE

Appendix B. Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS (BOM)

Qty. Reference Description Manufacturer Part Number

30 C1, C3, C4, C5,

C7, C8, C9,
C11-C17,
C21-C36

3 C2, C18, C20 Cap. ceramic, 1 µF, 16V, 10%, X7R,

3 C6, C10, C19 Cap. ceramic, 10 µF, 10V, 20%,

1 C37 Cap. ceramic, 0.47 µF, 6.3V, 10%,

1 CBL1 Mech. HW cable, USB-A male to

1 D1 Diode TVS array, USBLC6-2SC6,

1 FB1 Ferrite, 2A, 220R, SMD, 0805 Murata Electronics BLM21PG221SN1D

6 J1, J2, J6, J7,

J11, J12

5 J3, J4, J8, J9,

J15

2 J5, J10 Connector header-2.54, male, 2x2,

1 J13 Connector header-2.54, male, 2x5,

1 J14 Connector USB Mini-B female,

1 J16 Connector header-2.54, male, 2x4,

4 J17, J18, J19,

J20

14 JP1 Mech. HW jumper, 2.54 mm,

4 KNOB1 Actuator knob black Grayhill Inc. 947705-021

5 LD1, LD3, LD4,

LD6, LD7

1 LD2 Diode LED red, 1.95V, 30 mA,

1 LD5 Diode LED bIue, red, green, 2V,

4 PAD1, PAD2,

PAD3, PAD4

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Cap. ceramic, 0.1 µF, 16V, 10%,
X7R, SMD, 0603

SMD, 0603

Y5V, SMD, 0805

X5R, SMD, 0603

Mini USB-B male, 3 ft., black

5.25V, SMD, SOT-23-6

Connector header-2.54, male, 1x2,
gold, 5.84 MH, TH vert.

Connector header-2.54, male, 1x3,
gold, 5.84 MH, thin vert.

gold, 5.84 MH, thin vert.

gold, 5.84 MH, thin vert.

SMD, R/A

tin, 5.84 MH, thin vert.

Connector jack power, 2.1 mm, 24V,
5A, male, thin R/A

1x2, handle gold

Diode LED green, 2.2V, 25 mA,
15 mcd, clear, SMD, 0603

700 mcd, clear, SMD, 0603

2.2V, 30 mA, 25 mA, 4-SMD

Mech. HW rubber pad, cylindrical,
D7.9, H5.3, black

(1)

KEMET C0603C104M3RACTU

Samsung Electro-Mechanics
America, Inc.

TDK Corporation C1608X5R1C106M080AB

Murata Electronics

Katerno 10UM-02103BK

STMicroelectronics™ USBLC6-2SC6

FCI Electronics 68001-202HLF

FCI Electronics 68000-103HLF

FCI Electronics 67997-104HLF

FCI Electronics 67997-110HLF

Hirose Electric Co., Ltd. UX60-MB-5ST

FCI Electronics 67996-408HLF

CUI Inc. PJ-002AH

TE Connectivity, Ltd. 881545-2

Kingbright Corp. APT1608SGC

Kingbright Corp. APTD1608SURCK

®

Lumex

3M SJ61A11

Inc. SSL-LXA3025IGC-TR

®

CL10B105KO8NNNC

GRM188R60J474KA01D

 2015 Microchip Technology Inc. DS50002367A-page 51

PAC17X0 High-Side Current Sensors Evaluation Board User’s Guide

TABLE B-1: BILL OF MATERIALS (BOM)

Qty. Reference Description Manufacturer Part Number

0 PCB PAC17x0 High-Side Current

Sensors Evaluation Board – Printed
Circuit Board

4 Q1, Q2, Q3, Q6 Transistor FET N-Ch., ZXMN2A01F,

20V, 1.9A, 625 mW, SOT-23-3

2 Q4, Q5 Transistor BJT, PNP, MMBT3906,

-40V, -200 mA, 300 mW, SOT-23-3

7 R1, R2, R6, R7,

R19, R32, R75

2 R3, R78 Resistor TKF, 1k, 5%, 1/10W, SMD,

5 R4, R33, R38,

R45, R53

7 R5, R37, R49,

R57, R58, R68,
R73

4 R8, R9, R12,

R17

2 R10, R18 Resistor TKF, 10.5R, 1%, 1/10W,

2 R11, R22 Resistor 0.003R, 1%, 2W, 1%, 2412 Ohmite® Manufacturing LVK25R003FER

2 R13, R50 Resistor TKF, 100R, 1%, 1/10W,

8 R14, R25, R29,

R51, R64, R65,
R74, R76

12 R15, R16, R21,

R26, R28, R31,
R40, R43, R44,
R52, R59, R66

2 R20, R23 Resistor TKF, 3.92k, 1%, 1/10W,

2 R24, R41 Resistor TKF, 1M, 1%, 1/10W, SMD,

2 R27, R30 Resistor TKF, 100k, 1%, 1/4W,

4 R34, R39, R46,

R54

3 R35, R47, R55 Resistor TKF, 25.5k, 1%, 1/10W,

4 R36, R48, R56,

R63

3 R42, R70, R71 Resistor TKF, 4.7k, 1%, 1/10W,

3 R60, R67, R72 Resistor TKF, 14.3R, 1%, 1/10W,

2 R61, R77 Resistor TKF, 221k, 1%, 1/10W,

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Resistor TKF, 0R, 1/10W, SMD,
0603

0603

Resistor TKF, 5.6k, 1%, 1/10W,
SMD, 0603

Resistor TKF, 24.9R, 1%, 1/10W,
SMD, 0603

Resistor TF, 2.21R, 0.1%, 1/16W,
SMD, 0603

SMD, 0603

SMD, 0603

Resistor TKF, 10k, 1%, 1/10W,
SMD, 0603

Resistor TKF, 1k, 1%, 1/10W, SMD,
0603

SMD, 0603

0603

SMD, 0603

Resistor TKF, 12.1k, 1%, 1/10W,
SMD, 0603

SMD, 0603

Resistor TKF, 52.3k, 1%, 1/10W,
SMD, 0603

SMD, 0603

SMD, 0603

SMD, 0603

(1)

(CONTINUED)

Diodes

Central™
Semiconductor Corp.

NIC Components Corp. NRC06Z0TRF

Panasonic

Yageo Corporation RC0603FR-075K6L

Vishay/Dale CRCW060324R9FKEA

Stackpole Electronics, Inc. RNCF0603BKC2R21

Yageo Corporation RC0603FR-0710R5L

Panasonic - ECG ERJ-3EKF1000V

Vishay/Dale CRCW060310K0FKEA

Panasonic - ECG ERJ-3EKF1001V

Panasonic - ECG ERJ-3EKF3921V

Panasonic - ECG ERJ-3EKF1004V

Stackpole Electronics, Inc. RMCF0603FT100K

Yageo Corporation RC0603FR-0712K1L

Panasonic - ECG ERJ-3EKF2552V

Panasonic - ECG ERJ-3EKF5232

Panasonic - ECG ERJ-3RQF4R7V

Panasonic - ECG ERJ-3EKF14R3V

Panasonic - ECG ERJ-3EKF2213V

— 104-10308

®

Incorporated ZXMN2A01FTA

CMPT3906-PST-LEAD­FREE

®

- ECG ERJ-3GEYJ102V

DS50002367A-page 52  2015 Microchip Technology Inc.

Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS (BOM)

Qty. Reference Description Manufacturer Part Number

1 R62 Resistor TKF, 330k, 1%, 1/10W,

SMD, 0603

1 R69 Resistor TKF, 49.9R, 1%, 1/10W,

SMD, 0603

4SW1, SW2,

SW3, SW5

1 SW4 Switch, Tact. SPST, 15V, 20 mA,

2 TP1, TP3 Conn. TP loop, orange, thin Keystone Electronics Corp. 5013

2 TP2, TP4 Conn. TP loop, yellow, thin Keystone Electronics Corp. 5014

5 TP5, TP6, TP7,

TP8, TP9

1U1 Microchip Analog

1U2 Microchip Analog

1 U3 Microchip Interface USB I

1 U4 IC buffer inverter, SN74LVC14ADR,

1 U5 Microchip Analog Op Amp, 4-Ch.,

1 U6 IC Analog op amp, 1-Ch., 300 kHz,

1 U8 Microchip Analog LDO, 3.3V,

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Switch, Rotary HEX, 50V, 0.1A,
94HBB16T, thin, DIP-8

EVQ-PAC05R

Conn. TP loop, white, thin Keystone Electronics Corp. 5012

Current-Sense Monitor,
PAC1720-1-AIA-TR, DFN-10

Current-Sense Monitor,
PAC1710-1-AIA-TR, DFN-10

MCP2221-I/ST, TSSOP-14

SOIC-14

1.2 MHz, MCP6074-E/SL, SOIC-14

MCP6V31UT-E/OT, SOT-23-5

MCP1703T-3302E/DB, SOT-223-3

(1)

(CONTINUED)

2

C UART,

Panasonic - ECG ERJ-3EKF3303V

Panasonic - ECG ERJ-3EKF49R9V

Grayhill Inc. 94HBB16T

Panasonic - ECG EVQ-PAC05R

Microchip Technology Inc. PAC1720-1-AIA-TR

Microchip Technology Inc. PAC1710-1-AIA-TR

Microchip Technology Inc. MCP2221-I/ST

Texas Instruments SN74LVC14ADR

Microchip Technology Inc. MCP6074-E/SL

Microchip Technology Inc. MCP6V31UT-E/OT

Microchip Technology Inc. MCP1703-3302E/DB

 2015 Microchip Technology Inc. DS50002367A-page 53

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07/14/15

DS50002367A-page 54  2015 Microchip Technology Inc.