Microchip Technology MRF89XAM9A User Manual

MRF89XAM9A

Data Sheet

915 MHz Ultra Low-Power Sub-GHz

Transceiver Module

© 2011 Microchip Technology Inc. Preliminary DS00000A

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Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

K

32

logo, rfPIC and UNI/O are registered trademarks of

PIC
Microchip Technology Incorporated in the U.S.A. and other
countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified
logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance,
TSHARC, UniWinDriver, WiperLock and ZENA are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2011, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN:

Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
T empe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memo ry and
analog products. In addition, Microchip’s quality system for th e desig n
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

DS00000A-page ii Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

2
3
4
5
6

1

7

V

IN

GND

8

9

10

RESET

CSCON

SDO

SDI

SCK

CSDATA

IRQ1

GND

IRQ0

12
11 GN D

915 MHz Ultra Low-Power Sub-GHz Transceiver Module

Features

• Module designed from the MRF89XA Integrated

Ultra Low-Power, Sub-GHz Transceiver IC.

• Supports MiWi™ Development Environment

Proprietary Wireless Networking Protocols

• 4-Wire Serial Peripheral Interface (SPI) with

Interrupts

• Small Size: 0.7" x 1.1" (17.8 mm x 27.9 mm),

Surface Mountable — Pin compatible with
MRF89XAM9A

• Integrated Crystal, Internal Voltage Regulator,

Matching Circuitry and Printed Circuit Board
(PCB) Antenna

• Easy Integration into Final Product — Minimize

Product Development, Quicker Time to Market

• Compatible with Microchip’s Microcontroller

Families (PIC16, PIC18, PIC24, dsPIC33 and
PIC32)

• Radio Regulation Certified for United States

(FCC), Canada (IC) and Australia/New Zealand
(C-TICK)

Operational

• Operating Voltage: 2.1–3.6V (3.3V typical)

• Temperature Range: -40°C to +85°C Industrial

• Low-Current Consumption:

- Rx mode: 3 mA (typical)

- Tx mode: 25 mA at +10 dBm (typical)

- Sleep: 0.1 µA (typical)

RF/Analog Features

• ISM Band 902–928 MHz Operation

• Modulation: FSK and OOK

• Data Rate (to conform to FCC and IC regulations):

- FSK: 50–200 kbps

- OOK: 16 kbps

• Reception sensitivity

- FSK: -107 dBm (typical) at 50 kbps

- OOK: -113 dBm (typical) at 2 kbps

• +10 dBm Typical Output Power with 21 dB Tx
Power Control Range

Media Access Controller (MAC)/ Baseband Features

• Packet handling feature with data whitening and
automatic CRC generation

• Incoming sync word (pattern) recognition

• Built-in bit synchronizer for incoming data, and clock
synchronization and recovery

• 64-byte transmit/receive FIFO with preload in Stand-by
mode

• Supports Manchester encoding/decoding
techniques

Pin diagram

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 1

MRF89XAM9A

Table of Contents

1.0 Device Overview .......................................................................................................................................................................... 3

2.0 Circuit Description ........................................................................................................................................................................ 9

3.0 Regulatory Approval................................................................................................................................................................... 17

4.0 Electrical Characteristics ............................................................................................................................................................ 21

Appendix A: Revision History............................................................................................................................................................... 27

The Microchip Web Site ....................................................................................................................................................................... 29

Customer Change Notification Service ................................................................................................................................................ 29

Customer Support ................................................................................................................................................................................ 29

Reader Response ................................................................................................................................................................................ 30

Product Identification System............................................................................................................................................................... 31

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DS00000A-page 2 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

MRF89XA

Control

Interface

Power

Management

BasebandRF

MRF89XAM9A Module

SPI

Digital I/O

IRQ0

Power

12.8 MHz Crystal

Matching

Circuitry

and

SAW Filter

PCB

Antenna

Loop
Filter

VCO
Tank

IRQ1

CSDATA

CSCON

RESET

1.0 DEVICE OVERVIEW

The MRF89XAM9A is an Ultra Low-Power Sub-GHz
surface mount transceiver module with integrated
crystal, internal voltage regulator, matching circuitry
and PCB antenna. The MRF89XAM9A module
operates in the United States/Canada 902–928 MHz
ISM frequency band. The integrated module design
frees the integrator from extensive RF and antenna
design, and regulatory compliance testing, allowing
quicker time to market.

The MRF89XAM9A module is compatible with
Microchip’s MiWi™ Development Environment software
stacks. The software stacks are available as a free
download, including source code, from the Microchip’s
web site http://www.microchip.com/wireless.

The MRF89XAM9A module has received regulatory
approvals for modular devices in the United States
(FCC) and Canada (IC). Modular approval removes the
need for expensive RF and antenna design, and allows
the end user to place the MRF89XAM9A module inside
a finished product and not require regulatory testing for
an intentional radiator (RF transmitter). To maintain
conformance, refer to module settings in Section 3.1.1,

MRF89XAM9A SETTINGS for the United States and
Section 3.2.1, MRF89XAM9A SETTINGS for Canada.

1.1 Interface description

The simplified block diagram of the MRF89XAM9A
module is shown in Figure 1-1. The module is based on
the Microchip Technology MRF89XA Ultra Low-Power
Sub-GHz Transceiver Integrated Circuit (IC). The
module interfaces to many popular Microchip PIC
microcontrollers through a 3-wire serial SPI interface,
two chip selects (Configuration and Data), two
interrupts — Interrupt Request 0 (IRQ0) and Interrupt
Request 1 (IRQ1), Reset, Power and Ground as shown
in Figure 1-2. Ta bl e 1 -1 provides the pin descriptions.

Data communication and module configuration are

documented in the “MRF89XA Ultra Low-Power,
Integrated Sub-GHz Transceiver” (DS70622) Data

Sheet. For more information on specific serial interface
protocol and general register definitions, refer to the

“MRF89XA Data Sheet” and see Section 1.3,

Operation for specific register settings unique to the

MRF89XAM9A module operation to maintain
regulatory compliance.

®

FIGURE 1-1: MRF89XAM9A BLOCK DIAGRAM

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 3

MRF89XAM9A

PIC® Microcontroller

I/O

I/O

SDO

SDI

SCK

INTx

INTx

I/O

MRF89XAM9A

CSCON

CSDATA

SDI

SDO

SCK

IRQ0

IRQ1

RESET

V

IN

GND

TABLE 1-1: PIN DESCRIPTION

Pin Symbol T ype Description

1GNDPower Ground

2 RESET DI Reset Pin

3CSCON

4 IRQ0 DO Interrupt Request Output

5 SDI DI Serial Interface Data Input

6 SCK DI Serial Interface Clock

7 SDO DO Serial Interface Data Output

8CSDATA

9 IRQ1 DO Interrupt Request Output

10 Vin Power Power Supply

11 GND Power Ground

12 GND Power Ground

FIGURE 1-2: MICROCONTROLLER TO MRF89XAM9A INTERFACE

DI Serial Interface Configure Chip Select

DI Serial Interface Data Chip Select

DS00000A-page 4 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

1.2 Mounting Details

The MRF89XAM9A is a surface mountable module.
Module dimensions are shown in Figure 1-3. The
module PCB is 0.032" thick with castellated mounting
holes on the edge. Figure 1-4 is the recommended host
PCB footprint for the MRF89XAM9A.

FIGURE 1-3: MODULE DETAILS

The MRF89XAM9A has an integrated PCB antenna.
For the best performance, follow the mounting details
shown in Figure 1-5. It is recommended that the
module be mounted on the edge of the host PCB and
an area around the antenna, approximately 3.4" (8.6
cm), be kept clear of metal objects for best
performance. A host PCB ground plane around the
MRF89XAM9A acts as a counterpoise to the PCB
antenna. It is recommended to extend the ground plane
at least 0.4" (1 cm) around the module.

FIGURE 1-4: RECOMMENDED PCB FOOTPRINT

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 5

MRF89XAM9A

3.4”

3.4”

0.4”

0.4”

Edge of PCB

0.470”

Keep area around antenna
(approximately 3.4 (6.8 cm)
inches) clear of metallic structures
for best performance

Host PCB Top Copper Ground
Plane (Antenna Counterpoise):
Extend the host PCB top copper
ground plane under and to the left
and right side of the module at least

0.4 inches (1 cm) for best antenna
performance.

FIGURE 1-5: MOUNTING DETAILS

DS00000A-page 6 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

1.3 Operation

The MRF89XAM9A module is based on the Microchip
Technology MRF89XA Ultra Low-Power, Integrated
ISM Band Sub-GHz Transceiver IC. Data
communication and module configuration are

documented in the “MRF89XA Ultra Low-Power,

Integrated ISM Band Sub-GHz Transceiver Data
Sheet” (DS70622).

This section emphasizes operational settings that are
unique to the MRF89XAM9A module design that must
be followed for proper operation.

1.3.1 RESET

Pin 2 of the module, RESET, allows for an external
reset of the MRF89XA IC. RESET is connected to the
TEST8 pin of the MRF89XA IC. During normal
operations of the MRF89XAM9A, the RESET pin
should be held in a high impedance state. For more
information on Assertion of the RESET pin, refer to the

“Section 3.1.2 Manual Reset” of “MRF89XA Data
Sheet” (DS70622).

1.3.2 CRYSTAL FREQUENCY

When calculating frequency deviation, bit rate, receiver
bandwidth, and PLL R, P and S values, use crystal

frequency f

= 12.8 MHz.

xtal

1.3.3 CLOCK OUTPUT (CLKOUT)

The CLKOUT pin 19 of the MRF89XA IC is not used on
the module. Ensure that the CLKOUT signal is disabled
to minimize the current consumption.

1.3.4 FREQUENCY BAND SELECT

The Frequency Band Select (FBS<1:0>) bits in the
GCONREG<4:3> should be set for target channel
range 902–915 MHz FBS<1:0> = '00' or 915–928 MHz
FBS<1:0> = '01'.

1.3.5 VCO TANK TRIM VALUE

The VCO Trim (VCOT<1:0>) bits in the
GCONREG<2:1> should be set for VCOT<1:0> = '11'
for the inductor values of the module.

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 7

MRF89XAM9A

NOTES:

DS00000A-page 8 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

Note 1

+

C2

1 0

μ

F

C1

0.1

μ

F

To Host

Microcontroller

To Host

Microcontroller

U1

MRF89XAM9A-I/RM

+ 3.3V

GND

RESET

CSCON

IRQ0

SDI

SCK

GND

GND

V

IN

IRQ1

CSDATA

SDO

1

2

3

4

5

6

12

11

10

9

8

7

Note: For battery powered applications, place a 10 μF capacitor in parallel with the 0.1 μF bypass

capacitor to provide a low impedance during startup sequences.

2.0 CIRCUIT DESCRIPTION

The MRF89XAM9A module interfaces to Microchip’s
PIC16, PIC 18, PIC24, dsPIC33 and PIC32
microcontrollers with a minimum of external
components through digital only connections. An
example application schematic is shown in Figure 2-2.

2.1 Module Schematic

The MRF89XAM9A module is based on the Microchip
Technology MRF89XA Ultra Low-Power, Integrated
ISM Band sub-GHz Transceiver IC. The serial I/O
(CSCON
IRQ0 and IRQ1 pins are brought out to the module
pins. Crystal X1 is a 12.8 MHz crystal with a
frequency tolerance of ±10 ppm at 25°C. The RFIO
output is matched to the SAW filter FL1 and further
matched to the PCB trace antenna.

Figure 2-2 illustrates the MRF89XAM9A schematics.
Table 2-1 details the Bill of Materials (BOM).

FIGURE 2-1: MRF89XAM9A APPLICATION SCHEMATIC

, CSDATA, SCK, SDO and SDI), RESET,

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 9

DS00000A-page 10 Preliminary © 2011 Microchip Technology Inc.

Note: Designators not used: C6, L5

FIGURE 2-2: MRF89XAM9A SCHEMATIC

MRF89XAM9A

MRF89XAM9A

TABLE 2-1: MRF89XAM9A BILL OF MATERIALS

Desi
gnatorValue Description Manufacturer Part Number

C1 0.047 µF Capacitor, Ceramic, 10V, ±10%, X7R, SMT

0402

C2 0.22 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

C3 1 µF Capacitor, Ceramic, 6.3V, ±10%, X5R, SMT

0603

C4 30 pF Capacitor, Ceramic, 50V, ±5%, UHI-Q NP0,

SMT 0402

C5 1.8 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q

NP0, SMT 0402

C6 — Designator not used — —

C7 33 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT

0402

C8 0.1 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

C9 680 pF Capacitor, Ceramic, 50V, ±5%, C0G, SMT

0402

C10 0.01 µF Capacitor, Ceramic, 16V, ±10%, X7R, SMT

0402

C11 1.0 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q

NP0, SMT 0402

C12 0.9 pF Capacitor, Ceramic, 50V, ±0.1 pF, UHI-Q

NP0, SMT 0402

FL1 TA0281A Filter, SAW, 902–928 MHz Tai-saw Technology TA0281A

L1 10 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07C10NJV6T

L2 100 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07CR10JV6T

L3 5.6 nH Inductor, Wirewound, ±5%, SMT 0402 Johanson Technology L-07W5N6JV4T

L4 5.6 nH Inductor, Wirewound, ±5%, SMT 0402 Johanson Technology L-07W5N6JV4T

L5 — Designator not used — —

L6 10 nH Inductor, Ceramic, ±5%, SMT 0402 Johanson Technology L-07C10NJV6T

R1 1Ω Resistor, 1%, ±100 ppm/

R2 100KΩ Resistor, 5%, ±100 ppm/

R3 6.8KΩ Resistor, 1%, ±100 ppm/0C, SMT 0402 Yageo RC0402FR-076K8L

U1 MRF89XA Transceiver, Ultra Low-Power, Integrated

Sub-GHz

X1 12.8 MHz Crystal, ±10 ppm, 15 pF, ESR 100 ohms,

SMT 5 x 3.2mm

0

C, SMT 0402 Vishay/Dale CRCW04021R00FKED

0

C, SMT 0402 Yageo RC0402JR-07100KL

Murata GRM155R71A473KA01D

Murata GRM155R71C224KA12D

Murata GRM188R60J105KA01D

Johanson Technology 250R07S300JV4T

Johanson Technology 500R07S1R8BV4

Murata GRM1555C1H330JZ01D

Murata GRM155R71C104KA88D

Murata GRM1555C1H681JA01D

Murata GRM155R71C103KA01D

Johanson Technology 500R07S1R0BV4

Johanson Technology 500R07S0R9BV4

Microchip Technology MRF89XA-I/MQ

Abracon ABM3B-155-12.800MHz-T

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 11

MRF89XAM9A

2.2 Printed Circuit Board

The MRF89XAM9A module PCB is constructed with
high temperature FR4 material, four layers and 0.032
inches thick. The layers are shown in Figure 2-3
through Figure 2-8. The stack up of the PCB is shown
in Figure 2-9

FIGURE 2-3: TOP SILK SCREEN

FIGURE 2-5: LAYER 2 — GROUND

PLANE

FIGURE 2-6: LAYER 3 — POWER

PLANE

FIGURE 2-4: TOP COPPER

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 12

MRF89XAM9A

Top Copper

Ground Plane

Power Plane

Bottom Copper

1/2 oz. Copper

1/2 oz. Copper

1/2 oz. Copper

1/2 oz. Copper

8 mil FR4

12 mil FR4

8 mil FR4

0.032”

±0.005”

FIGURE 2-7: BOTTOM COPPER FIGURE 2-8: BOTTOM SILK SCREEN

FIGURE 2-9: PCB LAYER STACK UP

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 13

MRF89XAM9A

16.8mm

1.0mm

8.4mm

1.1mm

0.5mm

2.5mm

2.3 PCB Antenna

The PCB antenna is fabricated on the top copper trace.

Figure 2-11 shows the trace dimensions. The layers

below the antenna have no copper traces. The ground
and power planes under the components serve as a
counterpoise to the PCB antenna. Additional ground
plane on the host PCB will substantially enhance the
performance of the module. For best performance,
place the module on the host PCB by following the
recommendations in Section 1.2, Mounting Details.

The PCB antenna was designed and simulated using
Ansoft Designer
software by ANSYS, Inc. (www.ansoft.com). The
design goal was to create a compact, low-cost antenna
with the best radiation pattern. Figure 2-11 shows the
simulation drawing and Figure 2-12 and Figure 2-13
show the 2D and 3D radiation patterns, respectively. As
shown by the radiation patterns, the performance of the
antenna is dependant upon the orientation of the
module. Figure 2-14 shows the impedance simulation
and Figure 2-15 shows the actual impedance
measurement. The discrete matching circuitry matches
the impedance of the antenna with the SAW filter and
MRF89XA transceiver IC.

®

and HFSS™ 3D full-wave solver

FIGURE 2-10: PCB ANTENNA

FIGURE 2-11: PCB ANTENNA SIMULATION DRAWING

DIMENSIONS

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 14

FIGURE 2-12: SIMULATED 2D RADIATION PATTERN

MRF89XAM9A

FIGURE 2-13: SIMULATED 3D RADIATION PATTERN

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 15

FIGURE 2-14: SIMULATED PCB ANTENNA IMPEDANCE

MRF89XAM9A

FIGURE 2-15: SIMULATED PCB ANTENNA VSWR

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 16

3.0 REGULATORY APPROVAL

The MRF89XAM9A module has received regulatory
approvals for modular devices in the United States and
Canada. Modular approval allows the end user to place
the MRF89XAM9A module inside a finished product
and not require regulatory testing for an intentional
radiator (RF transmitter), provided no changes or
modifications are made to the module circuitry.
Changes or modifications could void the user’s
authority to operate the equipment. The end user must
comply with all of the instructions provided by the
Grantee, which indicate installation and/or operating
conditions necessary for compliance.

The integrator is still responsible for testing the end
product for any additional compliance requirements
required with this module installed (digital device
emission, PC peripheral requirements, etc.) in the
specific country that the end device will be marketed.

For more information on details on regulatory
compliance, refer to the specific country radio
regulations in the following sections.

3.1 United States

The MRF89XAM9A has received Federal
Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional
Radiators” 15.247 and 15.249 and modular approval in
accordance with FCC Public Notice DA 00-1407
Released: June 26, 2000, Part 15 Unlicensed Modular
Transmitter Approval. The MRF89XAM9A module can
be integrated into a finished product without obtaining
subsequent and separate FCC certification.

The MRF89XAM9A module has been labeled with its
own FCC ID number, and if the FCC ID is not visible
when the module is installed inside another device,
then the outside of the finished product into which the
module is installed must also display a label referring
to the enclosed module. This exterior label can use
wording as following:

Contains Transmitter Module FCC ID:

9

OA3MRF8

-or-

Contains FCC ID: OA3MRF89XAM9A

This device complies with Part 15 of the FCC Rules.
Operation is subject to the following two conditions:
(1) this device may not cause harmful interference,
and (2) this device must accept any interference
received, including interference that may cause
undesired operation.

XAM9A

MRF89XAM9A

Requirements for product labeling are given in Part

15.19 Labelling Requirements.

The user’s manual should include the following
statement:

This equipment has been tested and found to comply
with the limits for a Class B digital device, pursuant to
part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful
interference in a residential installation. This
equipment generates, uses and can radiate radio
frequency energy, and if not installed and used in
accordance with the instructions, may cause harmful
interference to radio communications. However, there
is no guarantee that interference will not occur in a
particular installation. If this equipment does cause
harmful interference to radio or television reception,
which can be determined by turning the equipment
OFF and ON, the user is encouraged to try to correct
the interference by one or more of the following
measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment
and receiver.

• Connect the equipment into an outlet on a
circuit different from that to which the receiver is
connected.

• Consult the dealer or an experienced radio/TV
technician for help.

3.1.1 MRF89XAM9A SETTINGS

To meet the FCC requirements, the following settings
must be observed by the integrator:

3.1.1.1 FSK Modulation

The following settings configure the MRF89XAM9A for
wideband digital modulation techniques that conform to
the requirements of Part 15.247. These settings allow
for higher radio frequency (RF) output power and
greater link budget:

• Bit Rate Setting: 50 - 200 kbps

- Transmit Power Maximum Setting:13 dBm

• Bit Rate Setting: 2 - 40 kbps

- Transmit Power Maximum Setting:7 dBm

• Frequency Deviation Setting: 200 kHz

• Data Whitening: On

• Transmit Bandwidth Setting: 400 kHz

• Lower Frequency Setting: 902.800 MHz

• Upper Frequency Setting: 926.500 MHz

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 17

MRF89XAM9A

3.1.1.2 OOK Modulation

The following settings configure the MRF89XAM9A for
narrowband operation that conform to the requirements
of Part 15.249. Part 15.249 requires a much lower
power setting than is allowed in Part 15.247. These set­tings are good for applications that require lower trans­mit power current consumption and shorter transmit
distances:

• Transmit Power Maximum Setting:1 dBm

• Bit Rate Maximum Setting: 16 kbps

• Frequency Deviation Setting: 200 kHz

• Transmit Bandwidth Setting: 400 kHz

• Lower Frequency Setting: 902.330 MHz

• Upper Frequency Setting: 927.500 MHz

3.1.2 RF EXPOSURE

All transmitters regulated by FCC must comply with RF

exposure requirements. OET Bulletin 65 “Evaluating

Compliance with FCC Guidelines for Human Exposure
to Radio Frequency Electromagnetic Fields” provides

assistance in determining whether proposed or existing
transmitting facilities, operations or devices comply
with limits for human exposure to RF fields adopted by
the Federal Communications Commission (FCC). The
bulletin offers guidelines and suggestions for
evaluating compliance.

If appropriate, compliance with exposure guidelines for
mobile and unlicensed devices can be accomplished
by the use of warning labels and by providing users
with information concerning minimum separation
distances from transmitting structures and proper
installation of antennas.

The following statement must be included as a
CAUTION statement in manuals and OEM products to
alert users of FCC RF Exposure compliance:

To satisfy FCC RF Exposure requirements for mobile
and base station transmission devices, a separation
distance of 20 cm or more should be maintained
between the antenna of this device and persons
during operation. To ensure compliance, operation at
closer than this distance is not recommended.

The antenna(s) used for this transmitter must not be
co-located or operating in conjunction with any other
antenna or transmitter.

If the MRF89XAM9A module is used in a portable
application (antenna is less than 20 cm from persons
during operation), the integrator is responsible for
performing Specific Absorption Rate (SAR) testing in
accordance with FCC rules 2.1091.

3.1.3 HELPFUL WEB SITES

Federal Communications Commission (FCC) http://

www.fcc.gov

DS00000A-page 18 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

3.2 Canada

The MRF89XAM9A module has been certified for use in
Canada under Industry Canada (IC) Radio Standards
Specification (RSS) RSS-210 and RSS-Gen. Modular
approval permits the installation of a module in a host
device without the need to recertify the device.

Labeling Requirements for the Host Device (from
Section 3.2.1, RSS-Gen, Issue 3, December 2010):

The host device shall be properly labeled to identify the
module within the host device.

The Industry Canada certification label of a module
shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled
to display the Industry Canada certification number of
the module, preceded by the words “Contains
transmitter module”, or the word “Contains”, or similar
wording expressing the same meaning, as follows:

Contains transmitter module IC: 7693A-89XAM9A

User Manual Notice for License-Exempt Radio
Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,
December 2010):

User manuals for license-exempt radio apparatus shall
contain the following or equivalent notice in a
conspicuous location in the user manual or
alternatively on the device or both.

This device complies with Industry Canada license­exempt RSS standard(s). Operation is subject to the
following two conditions: (1) this device may not
cause interference, and (2) this device must accept
any interference, including interference that may
cause undesired operation of the device.

Le présent appareil est conforme aux CNR
d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux
deux conditions suivantes: (1) l'appareil ne doit pas
produire de brouillage, et (2) l'utilisateur de l'appareil
doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en
compromettre le fonctionnement.

3.2.1 MRF89XAM9A SETTINGS

To meet Industry Canada (IC) requirements, the
following settings must be observed by the integrator:

3.2.1.1 FSK Modulation

The following settings configure the MRF89XAM9A for
wideband digital modulation techniques that conform to
the requirements of RSS-210 Issue 8 Annex 8. These
settings allow for higher radio frequency (RF) output
power and greater link budget.

• Bit Rate Setting: 50 - 200 kbps

- Transmit Power Maximum Setting:13 dBm

• Bit Rate Setting: 2 - 40 kbps

- Transmit Power Maximum Setting:7 dBm

• Frequency Deviation Setting: 200 kHz

• Data Whitening: On

• Transmit Bandwidth Setting: 400 kHz

• Lower Frequency Setting: 902.800 MHz

• Upper Frequency Setting: 926.500 MHz

3.2.1.2 OOK Modulation

The following settings configure the MRF89XAM9A for
narrowband operation that conform to the requirements
of RSS-Gen Issue 3. RSS-Gen Issue 3 requires a
much lower power setting than is allowed in Part RSS­210 Issue 8 Annex 8. These settings are good for
applications that require lower transmit power current
consumption and shorter transmit distances.

• Transmit Power Maximum Setting:1 dBm

• Bit Rate Maximum Setting: 16 kbps

• Frequency Deviation Setting: 200 kHz

• Transmit Bandwidth Setting: 400 kHz

• Lower Frequency Setting: 902.330 MHz

• Upper Frequency Setting: 927.500 MHz

3.2.2 HELPFUL WEB SITES

Industry Canada: http://www.ic.gc.ca/

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 19

MRF89XAM9A

NOTES:

DS00000A-page 20 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

4.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

Ambient temperature under bias.............................................................................................................. -40°C to +85°C

Storage temperature .............................................................................................................................. -55°C to +125°C

Voltage on V
Voltage on any combined digital and analog pin with respect to V
Input current into pin (except V

Electrostatic discharge with human body model.................................................................................................... 1000V

NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the

device. This is a stress rating only and functional operation of the device at those or any other conditions above
those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.

IN with respect to VSS ................................................................................................................ -0.3V to 6V

SS (except VIN) ...........................-0.3V to (VIN + 0.3V)

IN and VSS)........................................................................................... -25 mA to 25 mA

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 21

MRF89XAM9A

TABLE 4-1: RECOMMENDED OPERATING CONDITIONS

Parameter Min Typ Max Unit Condition

Ambient Operating Temperature -40 — +85 °C —

Supply Voltage for RF, Analog and Digital Circuits 2.1 — 3.6 V —

Supply Voltage for Digital I/O 2.1 — 3.6 V —

Input High Voltage (V

Input Low Voltage (VIL) -0.3V — 0.2 * VIN V—

AC Peak Voltage on Open Collector Outputs (IO)

Note 1: At minimum, V

TABLE 4-2: CURRENT CONSUMPTION

Symbol Chip Mode Min Typ Max Unit Condition

I

DDSL Sleep — 0.1 2 µA Sleep clock disabled, all blocks

I

DDST Idle — 65 80 µA Oscillator and baseband enabled

IDDFS Frequency Synthesizer — 1.3 1.7 mA Frequency synthesizer running

I

DDTX Tx —

IDDRX Rx — 3.0 3.5 mA —

Note 1: Guaranteed by design and characterization.

IH) 0.5 * VIN —VIN + 0.3 V —

(1)

VIN – 1.5 — VIN + 1.5 V —

IN – 1.5V should not be lower than 1.8V.

disabled

—

25
16

30
21

mA
mA

Output power = +10 dBm

Output power = +1 dBm

(1)

TABLE 4-3: DIGITAL I/O PIN INPUT SPECIFICATIONS

(1)

Symbol Characteristic Min Typ Max Unit Condition

IL Input Low Voltage — — 0.2 * VIN V—

V

V

IH Input High Voltage 0.8 * VIN —— V —

IIL Input Low Leakage Current

I

IH Input High Leakage Current -0.5 — 0.5 µA VIH = VIN, VIN = 3.7

V

OL Digital Low Output Voltage — — 0.1 * VIN —IOL = 1 mA

V

OH Digital Low Output 0.9 * VIN —— V IOH = -1 mA

Note 1: Measurement Conditions: T

(2)

-0.5 — 0.5 µA VIL = 0V

A = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise

specified.

2: Negative current is defined as the current sourced by the pin.

DS00000A-page 22 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

TABLE 4-4: PLL PARAMETERS AC CHARACTERISTICS

Symbol Parameter Min Typ Max Unit Condition

FRO Frequency Ranges 902 — 928 MHz —

BRFSK Bit Rate (FSK) 1.56 — 40 kbps NRZ

BROOK Bit Rate (OOK) 1.56 — 16 kbps NRZ

FDFSK Frequency Deviation (FSK) 33 50 200 kHz —

FXTAL Crystal Oscillator Frequency 9 12.8 — MHz —

FSSTP Frequency Synthesizer Step — 2 — kHz Variable, depending on the

TSOSC Oscillator Wake-up Time — 1.5 5 ms From Sleep mode

TSFS Frequency Synthesizer Wake-

up Time; at most, 10 kHz

away from the target

TSHOP Frequency Synthesizer Hop

Time; at most, 10 kHz away

from the target

Note 1: Guaranteed by design and characterization.

— 500 800 µs From Stand-by mode

— 180 — µs 200 kHz step

— 200 — µs 1 MHz step

— 250 — µs 5 MHz step

— 260 — µs 7 MHz step

— 290 — µs 12 MHz step

— 320 — µs 20 MHz step

— 340 — µs 27 MHz step

(1)

frequency

(1)

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 23

MRF89XAM9A

TABLE 4-5: RECEIVER AC CHARACTERISTICS

(1)

Symbol Parameter Min Typ Max Unit Condition

RSF Sensitivity (FSK) — -107 — dBm 915 MHz, BR = 25 kbps,

= 50 kHz, f

f

dev

= 100 kHz

c

— -103 — dBm 915 MHz, BR = 66.7 kbps,

f

= 100 kHz, f

dev

= 200 kHz

c

RSO Sensitivity (OOK) — -113 — dBm 915 MHz, 2 kbps NRZ

fc – fo = 50 kHz, f

= 50 kHz

o

— -106 — dBm 915 MHz, 16.7 kbps NRZ

fc – fo = 100 kHz, f

= 100 kHz

o

CCR Co-Channel Rejection — -12 — dBc Modulation as wanted signal

ACR Adjacent Channel Rejection — 27 — dB Offset = 300 kHz, unwanted tone is

not modulated

— 52 — dB Offset = 600 kHz, unwanted tone is

not modulated

— 57 — dB Offset = 1.2 MHz, unwanted tone is

not modulated

BI Blocking Immunity — -48 — dBm Offset = 1 MHz, unmodulated

— -37 — dBm Offset = 2 MHz, unmodulated, no

SAW

— -33 — dBm Offset = 10 MHz, unmodulated, no

SAW

RXBWF Receiver Bandwidth in FSK

RXBWU Receiver Bandwidth in OOK

Mode

Mode

(2)

(2)

ITP3 Input Third Order Intercept

Point

50 — 250 kHz Single side BW, Polyphase Off

50 — 400 kHz Single side BW, Polyphase On

— -28 — dBm Interferers at 1 MHz and 1.950 MHz

offset

TSRWF Receiver Wake-up Time — 280 500 µs From FS to Rx ready

TSRWS Receiver Wake-up Time — 600 900 µs From Stand-by to Rx ready

TSRHOP Receiver Hop Time from Rx

Ready to Rx Ready with a

Frequency Hop

— 400 — µs 200 kHz step

— 400 — µs 1 MHz step

— 460 — µs 5 MHz step

— 480 — µs 7 MHz step

— 520 — µs 12 MHz step

— 550 — µs 20 MHz step

— 600 — µs 27 MHz step

RSSIST RSSI Sampling Time — — 1/f

dev

s From Rx ready

RSSTDR RSSI Dynamic Range — 70 — dB Ranging from sensitivity

Note 1: Guaranteed by design and characterization.

2: This reflects the whole receiver bandwidth, as described by conditions for active and passive filters.

DS00000A-page 24 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

TABLE 4-6: TRANSMITTER AC CHARACTERISTICS

Symbol Description Min Typ Max Unit Condition

RFOP RF Output Power, Programmable

with 8 Steps of typ. 3 dB

PN Phase Noise — -112 — dBc/Hz Measured with a 600 kHz

TXSP Transmitted Spurious — — -47 dBc At any offset between 200 kHz

Tx2 Second Harmonic

Tx3 Third Harmonic

Tx4 Fourth Harmonic

Txn Harmonics above Tx4

FSKDEV FSK Deviation ±33 ±55 ±200 kHz Programmable

TSTWF Transmitter Wake-up Time — 120 500 µs From FS to Tx ready

TSTWS Transmitter Wake-up Time — 600 900 µs From Stand-by to Tx ready

Note 1: Guaranteed by design and characterization.

2: Transmitter in-circuit performance with SAW filter and crystal.

— +12.5 — dBm Maximum power setting

— -8.5 — dBm Minimum power setting

——-40dBm

(1)

offset at the transmitter output

and 600 kHz, unmodulated

carrier, f

No modulation, see Note

= 50 kHz

dev

(2)

4.1 Timing Specification and Diagram

TABLE 4-7: SPI TIMING SPECIFICATION

Parameter Min Typ Max Unit Condition

SPI Configure Clock Frequency — — 6 MHz —

SPI Data Clock Frequency — — 1 MHz —

Data Hold and Setup Time 2 — — µs —

SDI Setup Time for SPI Configure 250 — — ns —

SDI Setup Time for SPI Data 312 — — ns —

CSCON
SCK Falling Edge to CSCON High

CSDATA
SCK Falling Edge to CSDATA

CSCON

CSDATA

Note 1: Typical Values: T

Low to SCK Rising Edge;

Low to SCK Rising Edge;

High

Rising to Falling Edge 500 — — ns —

Rising to Falling Edge 625 — — ns —

A = 25°C, VIN = 3.3V, Crystal Frequency = 12.8 MHz, unless otherwise specified.

2: Negative current is defined as the current sourced by the pin.

500 — — ns —

625 — — ns —

(1,2)

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 25

MRF89XAM9A

NOTES:

DS00000A-page 26 Preliminary © 2011 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision A (May 2011)

This is the Initial release of the document.

MRF89XAM9A

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 27

MRF89XAM9A

NOTES:

DS00000A-page 28 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at

www.microchip.com. This web site is used as a means

to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the web site contains the following
information:

• Product Support – Data sheets and errata,

application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software

• General Technical Support – Frequently Asked

Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
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• Business of Microchip – Product selector and

ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

CUSTOMER SUPPORT

Users of Microchip products can receive assistance
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• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

• Development Systems Information Line

Customers should contact their distributor,
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support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.

T echnical support is available through the web site
at: http://microchip.com/support

Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.

To register, access the Microchip web site at

www.microchip.com. Under “Support”, click on

“Customer Change Notification” and follow the
registration instructions.

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 29

MRF89XAM9A

TO: Technical Publications Manager

RE: Reader Response

Total Pages Sent ________

From:

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Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

Application (optional):

Would you like a reply? Y N

Device: Literature Number:

Questions:

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DS00000AMRF89XAM9A

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip
product. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our
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Please list the following information, and use this outline to provide us with your comments about this document.

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6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS00000A-page 30 Preliminary © 2011 Microchip Technology Inc.

MRF89XAM9A

Device MRF89XAM9A-I/RM: Ultra Low-Power, Integrated ISM Band Sub-GHz

Transceiver module

Temperature
Range

I = -40ºC to +85ºC (Industrial)

Example:

a) MRF89XAM9A-I/RM: Industrial temperature

tray.

b) MRF89XAM9AT-I/RM: Industrial temperature

tape and reel,

PART NO

Device

M

Module

X

Module

Type

Tape and

Reel

-X

Temperature

Range

T

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, for example, on pricing or delivery, refer to the factory or the listed sales office.

© 2011 Microchip Technology Inc. Preliminary DS00000A-page 31

Worldwide Sales and Service

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02/18/11

DS00000A-page 32 © 2011 Microchip Technology Inc.