Microchip Technology MGC3130 Hillstar Development Kit User guide

MGC3130

Hillstar Development Kit

User’s Guide

 2013 Microchip Technology Inc. DS40001721A

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, FlashFlex, K PICSTART, PIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MTP, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O, Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA and Z-Scale are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

ISBN: 9781620775134

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

logo, rfPIC, SST, SST Logo, SuperFlash

QUALITY MANAGEMENT S

DS40001721A-page 2  2013 Microchip Technology Inc.

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

MCUs and dsPIC® DSCs, KEELOQ

code hopping

Object of Declaration: MGC3130 Hillstar Development Kit User’s Guide

 2013 Microchip Technology Inc. DS40001721A-page 3

MGC3130 Hillstar Development Kit User’s Guide

NOTES:

DS40001721A-page 4  2013 Microchip Technology Inc.

MGC3130 HILLSTAR DEVELOPMENT KIT

USER’S GUIDE

Preface ........................................................................................................................... 7

Introduction............................................................................................................ 7

Document Layout .................................................................................................. 7

Conventions Used in this Guide ............................................................................ 8

Warranty Registration............................................................................................ 9

Recommended Reading........................................................................................ 9

The Microchip Web Site ...................................................................................... 10

Development Systems Customer Change Notification Service .......................... 10

Customer Support ............................................................................................... 11

Revision History .................................................................................................. 11

Chapter 1. Overview

1.1 Introduction ................................................................................................... 13

1.2 Hillstar Concept and Deliverables ................................................................ 13

1.3 Hillstar Development Kit Package Content .................................................. 14

1.4 Hillstar Development Kit Reference Electrodes ........................................... 15

1.5 MGC3130 Software Package – Aurea GUI and GestIC Library ................... 17

1.6 MGC3130 Software Development Kit (SDK) ................................................ 17

Chapter 2. Getting Started

2.1 Prerequisites ................................................................................................ 19

2.2 Step 1: Build-up Development Kit ................................................................ 19

2.3 Step 2: Connecting Hillstar Development Kit with Your PC ......................... 20

2.4 Step 3: Install Windows CDC Driver ............................................................. 20

2.5 Step 4: Start Aurea ....................................................................................... 20

Chapter 3. Hillstar Boards – Hardware Description

3.1 Overview ...................................................................................................... 23

3.1.1 I2C™ to USB Bridge .................................................................................. 23

3.1.2 MGC3130 Unit ........................................................................................... 23

3.1.3 95x60 mm Reference Electrode PCB ........................................................ 23

3.2 MGC3130 Unit ............................................................................................. 24

3.3 Hillstar 95x60 mm Reference Electrode ...................................................... 25

3.4 I

C to USB Bridge ....................................................................................... 27

Chapter 4. Design In: Hillstar In Target Application

4.1 Introduction ................................................................................................... 29

4.2 Integration Examples .................................................................................... 29

Chapter 5. Troubleshooting

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MGC3130 Hillstar Development Kit User’s Guide

Appendix A. Schematics

A.1 Introduction .................................................................................................. 35

A.2 Bill of Materials ............................................................................................. 35

A.3 Board – Schematics and Layout .................................................................. 37

Appendix B. Sensitivity Profile and Capacitances

B.1 Introduction .................................................................................................. 41

B.2 Sensitivity Profiles ........................................................................................ 41

B.3 Electrode Capacities .................................................................................... 42

Appendix C. Parameterization Support

C.1 How to Build a Hand Brick ........................................................................... 43

C.2 Usage of the Hand Brick as Artificial Hand .................................................. 45

Appendix D. Driver Installation Manual

D.1 Open Device Manager ................................................................................. 47

D.2 Select Device ............................................................................................... 47

D.3 Locate Driver ............................................................................................... 48

D.4 Verify Communication .................................................................................. 48

Appendix E. Glossary

Worldwide Sales and Service .....................................................................................50

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MGC3130 HILLSTAR DEVELOPMENT

KIT USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available online help files.

INTRODUCTION

IDE online help.

This chapter contains general information that will be useful to know before using the Hillstar Development Kit. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Warranty Registration

• Recommended Reading

• The Microchip Web Site

• Development Systems Customer Change Notification Service

• Customer Support

• Revision History

DOCUMENT LAYOUT

This document describes the installation and use of the MGC3130 Hillstar Development Kit. The document is organized as follows:

• Chapter 1. “Overview”

• Chapter 2. “Getting Started”

• Chapter 3. “Hillstar Boards – Hardware Description”

• Chapter 4. “Design In: Hillstar In Target Application”

• Chapter 5. “Troubleshooting”

• Appendix A. “Schematics”

• Appendix B. “Sensitivity Profile and Capacitances”

• Appendix C. “Parameterization Support”

• Appendix D. “Driver Installation Manual”

• Appendix E. “Glossary”

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MGC3130 Hillstar Development Kit User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe character: { | }

Ellipses... Replaces repeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the total number of digits, R is the radix and n is a digit.

Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’

Choice of mutually exclusive arguments; an OR selection

Represents code supplied by user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]

errorlevel {0|1}

var_name...] void main (void)

{ ... }

IDE User’s Guide

DS40001721A-page 8  2013 Microchip Technology Inc.

WARRANTY REGISTRATION

Please complete the enclosed Warranty Registration Card and mail it promptly. Sending in the Warranty Registration Card entitles users to receive new product updates. Interim software releases are available at the Microchip web site.

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.

The Development Systems product group categories are:

• Compilers – The latest information on Microchip C compilers, assemblers, linkers

and other language tools. These include all MPLAB assemblers (including MPASM™ assembler); all MPLAB linkers (including MPLINK™ object linker); and all MPLAB librarians (including MPLIB™ object librarian).

• Emulators – The latest information on Microchip in-circuit emulators.This

includes the MPLAB REAL ICE™ and MPLAB ICE 2000 in-circuit emulators.

• In-Circuit Debuggers – The latest information on the Microchip in-circuit

debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit™ 3 debug express.

• MPLAB

Integrated Development Environment for development systems tools. This list is focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and MPLAB SIM simulator, as well as general editing and debugging features.

• Programmers – The latest information on Microchip programmers. These include

production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included are nonproduction development programmers such as PICSTART PICkit 2 and 3.

IDE – The latest information on Microchip MPLAB IDE, the Windows®

C compilers; all MPLAB

Plus and

DS40001721A-page 10  2013 Microchip Technology Inc.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at:

http://www.microchip.com/support.

REVISION HISTORY

Revision A (October, 2013)

This is the initial release of this document.

Preface

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MGC3130 Hillstar Development Kit User’s Guide

NOTES:

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MGC3130 HILLSTAR DEVELOPMENT

Chapter 1. Overview

1.1 INTRODUCTION

The MGC3130 is the first product based on Microchip’s GestIC® technology. It is developed as a mixed-signal controller. The MGC3130 has one transmit and five very sensitive receive channels that are capable to detect changes of a transmitted electrical field (E-field) corresponding to capacitive changes in the femtofarad (1 fF = 10 range.

In order to transmit and receive an electrical field, electrodes have to be connected to the transmitting and receiving channels of the MGC3130 controller. The spatial arrangement of the electrodes allows the chip to determine the center of gravity of the electric field distortion, and thus position tracking and gesture recognition of a user’s hand in the detection space.

1.2 HILLSTAR CONCEPT AND DELIVERABLES

The Hillstar Development Kit is designed to support an easy integration of Microchip’s MGC3130 3D Tracking and Gesture Controller into customer’s applications. It provides MGC3130 system setup, related hardware and software references.

With the MGC3130 Software Package, including Aurea Graphical User Interface and GestIC Library, the MGC3130 Software Development Kit (SDK) and PIC18 Host Reference code, design-in is easy in five steps:

1. Feature Definition

2. Electrode Design

3. MGC3130 Parameterization

4. Host Application Programming

5. Verification

Hillstar hardware builds a complete MGC3130 reference system consisting of three individual PCBs:

• MGC3130 Unit

•I

C™ to USB Bridge

• Reference Electrode with a 95x60 mm sensitive area

It can be plugged to a PC via USB cable and used for evaluation of MGC3130 chip and GestIC technology. During the customer’s design-in process the individual boards can be combined according to the customers need.

Three examples are given below:

• Combine MGC3130 Unit and I electrodes

•Use I

• Combine MGC3130 Unit and Electrodes to develop gesture-driven applications

C to USB Bridge to parameterize and debug the MGC3130 application

circuitry in the customer’s design

for PC based or embedded software environments

C to USB Bridge to evaluate customized

KIT USER’S GUIDE

-15

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MGC3130 Hillstar Development Kit User’s Guide

The Hillstar Development Kit provides an artificial test hand, further called hand brick, helping to stimulate the human hand operating the GestIC application. The hand brick has to be used during the design-in process to parametrize and evaluate customer’s applications. The hand brick’s surface is conductive and connected to GND via cable in order to reproduce the grounding conditions of the human body.

1.3 HILLSTAR DEVELOPMENT KIT PACKAGE CONTENT

The Hillstar Development Kit package content is listed below:

• MGC3130 Module

•I

to USB Bridge Module

• 4-layer reference electrode (95x60 mm sensitive area)

• ‘Hand brick’ set (self-assembly, four foam blocks, one copper foil)

• USB Cable for PC connection

FIGURE 1-1: HILLSTAR DEVELOPMENT KIT

The ‘hand brick’ set is used during the design-in process for sensor calibration and performance evaluation purposes. For usage and assembly information, refer to Appendix C. “Parameterization Support”.

DS40001721A-page 14  2013 Microchip Technology Inc.

1.4 HILLSTAR DEVELOPMENT KIT REFERENCE ELECTRODES

140x90

100x50

95x60

80x80

50x30

30x30

The Hillstar development kit includes a collection of layout references (Gerber files) for electrode designs and ready-to-use sensor modules with MGC3130 backside assembly.

The following electrode designs are included:

• 140x90 mm sensitive area – outline 168 x 119 mm

• 95x60 mm sensitive area – outline of 120 x 85 mm

• 80x80 mm sensitive area – outline 104 x 104 mm

• 100x50 mm sensitive area – outline 128 x 72 mm

• 50x30 mm sensitive area – outline 63 x 47 mm

• 30x30 mm sensitive area – outline 49 x 49 mm

Sensor Modules

• 95x60 mm sensitive area – outline of 120 x 85 mm

• 30x30 mm sensitive area – outline 49 x 52 mm

Overview

FIGURE 1-2:

HILLSTAR DEVELOPMENT KIT REFERENCE ELECTRODES

Dimensions of the designs are given in Table 1-1 and Figure 1-3 below.

 2013 Microchip Technology Inc. DS40001721A-page 15

+ 35 hidden pages

Microchip Technology MGC3130 Hillstar Development Kit User guide

Specifications and Main Features

Frequently Asked Questions

User Manual

Trademarks

Table of Contents

Preface

INTRODUCTION

DOCUMENT LAYOUT

CONVENTIONS USED IN THIS GUIDE

WARRANTY REGISTRATION

RECOMMENDED READING

THE MICROCHIP WEB SITE

DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE

CUSTOMER SUPPORT

REVISION HISTORY

Chapter 1. Overview

1.1 INTRODUCTION

1.2 HILLSTAR CONCEPT AND DELIVERABLES

1.3 HILLSTAR DEVELOPMENT KIT PACKAGE CONTENT

FIGURE 1-1: HILLSTAR DEVELOPMENT KIT

1.4 HILLSTAR DEVELOPMENT KIT REFERENCE ELECTRODES