Microchip Technology MCP6V01 Input Offset Demo Board User guide

MCP6V01
Input Offset
Demo Board
User’s Guide
© 2009 Microchip Technology Inc. DS51801A
Note the following details of the code protection feature on Microchip devices:
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32
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All other trademarks mentioned herein are property of their respective companies.
© 2009, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
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Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and T empe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memo ry and analog products. In addition, Microchip’s quality system for the desig n and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
DS51801A-page ii © 2009 Microchip Technology Inc.
MCP6V01 INPUT OFFSET
DEMO BOARD USER’S GUIDE
Table of Contents
Preface ...........................................................................................................................1
Introduction............................................................................................................1
Document Layout..................................................................................................1
Conventions Used in this Guide............................................................................2
Recommended Reading........................................................................................3
The Microchip Web Site........................................................................................ 3
Customer Support.................................................................................................3
Document Revision History...................................................................................4
Chapter 1. Product Overview
1.1 Introduction .....................................................................................................5
1.2 Kit Contents ....................................................................................................5
1.3 Intended Use .................................................................................................. 6
1.4 Description .....................................................................................................6
Chapter 2. Installation and Operation
2.1 Introduction .....................................................................................................9
2.2 Required Tools ...............................................................................................9
2.3 Connecting the Lab Equipment ......................................................................9
2.4 Operating Conditions ....................................................................................10
2.5 Calculating the DUT’s Input Offset Voltage ..................................................10
2.6 Converting Input Offset Voltage to Other Parameters ..................................10
2.7 Reducing the Measurement Noise ............................................................... 12
Chapter 3. Possible Modifications
3.1 Introduction ...................................................................................................13
3.2 Changing the DUT ........................................................................................13
3.3 Connecting a Chip Select Pin to Ground ......................................................14
Appendix A. Schematics and Layouts
A.1 Introduction ..................................................................................................15
A.2 Schematic .................................................................................................... 15
A.3 Combination of the Top Silk Screen and Top Metal Layers .....................17
A.4 Top Silk Screen ........................................................................................17
A.5 Top Metal Layer ....................................................................................... 18
A.6 Bottom Metal Layer ..................................................................................18
Appendix B. Bill Of Materials (BOM)
B.1 MCP6V01 Input Offset Demo Board BOM ...................................................19
Worldwide Sales and Service ....................................................................................20
© 2009 Microchip Technology Inc. DS51801A-page iii
MCP6V01 Input Offset Demo Board User’s Guide
NOTES:
DS51801A-page iv © 2009 Microchip Technology Inc.
MCP6V01 INPUT OFFSET
DEMO BOARD USER’S GUIDE

Preface

NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number . The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document.
For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available on-line help files.
®
IDE on-line help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the MCP6V01 Input Offset Demo Board. Items discussed in this chapter include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP6V01 Inpu t Offset Demo Boar d. The manual layout is as follows:
Chapter 1. “Product Overview” - Important information about the MCP6V01 Input Offset Demo Board.
Chapter 2. “Installation and Operation” – Covers the initial set-up of the MCP6V01 Input Offset Demo Board. It lists the required tools and shows how to connect and set up the lab equipment. The basic theory on converting measurements to offset voltage, open-loop gain, CMRR, PSRR and input offset drift is given, along with a worked example. Hints are then given on reducing measurement noise.
Chapter 3. “Possible Modifications” - Shows simple modifications to the MCP6V01 Input Offset Demo Board.
Appendix A. “Schematics and Layouts” – Shows the schematic and board layouts for the MCP6V01 Input Offset Demo Board.
Appendix B. “Bill Of Materials (BOM)” – Lists the parts used to build the sub-assemblies in the MCP6V01 Input Offset Demo Board.
© 2009 Microchip Technology Inc. DS51801A-page 1
MCP6V01 Input Offset Demo Board User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description Represents Examples
Arial font:
Italic characters Referenced books MPLAB® IDE User’s Guide
Emphasized text ...is the only compiler...
Initial caps A window the Output window
A dialog the Settings dialog A menu selection select Enable Programmer
Quotes A field name in a window or
dialog
Underlined, italic text with right angle bracket
Bold characters A dialog button Click OK
N‘Rnnnn A number in verilog format,
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Courier New font:
Plain Courier New Sample source code #define START
Italic Courier New A variable argument file.o, where file can be
Square brackets [ ] Optional arguments mcc18 [options] file
Curly brackets and pipe character: { | }
Ellipses... Replaces repeated text var_name [,
A menu path File>Save
A tab Click the Power tab
where N is the total number of digits, R is the radix and n is a digit.
Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’
Choice of mutually exclusive arguments; an OR selection
Represents code supplied by user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options] errorlevel {0|1}
var_name...] void main (void)
{ ... }
DS51801A-page 2 © 2009 Microchip Technology Inc.

RECOMMENDED READING

This user's guide describes how to use MCP6V01 Input Offset Demo Board. Other useful documents are listed below. The following Microchip documents are available and recommended as supplemental reference resources.
MCP6V01/2/3 Data Sheet, “300 µA, Auto-Zeroed Op Amps”, DS22058
Gives detailed information on one op amp family that is used on the MCP6V01 Input Offset Demo Board.
MCP6021/1R/2/3/4 Data Sheet, “Rail-to-Rail Input/Output, 10 MHz Op Amps”, DS21685
Gives detailed information on another op amp family that is used on the MCP6V01 Input Offset Demo Board.
AN1177 Application Note, “Op Amp Precision Design: DC Errors”, DS01177
Discusses how to achieve high DC accuracy in op amp circuits. Also discusses the relationship between an op amp’s input offset voltage (V Open-Loop Gain and V

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser , the web site contains the following information:
Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives
Drift over Temperature.
OS
), CMRR, PSRR,
OS
Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
• Development Systems Information Line
Customers should contact their distributor, representative or field application engineer for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com
© 2009 Microchip Technology Inc. DS51801A-page 3
MCP6V01 Input Offset Demo Board User’s Guide

DOCUMENT REVISION HISTORY

Revision A (March 2009)
• Initial Release of this Document.
DS51801A-page 4 © 2009 Microchip Technology Inc.

Chapter 1. Product Overview

1.1 INTRODUCTION

The MCP6V01 Input Offset Demo Board is described by the following:
• Assembly # : 102-00227-R3
• Order # : MCP6V01DM-VOS
• Name: MCP6V01 Input Offset Demo Board
Items discussed in this chapter include:
• Kit Contents
• Intended Use
• Description

1.2 KIT CONTENTS

This MCP6V01 Input Offset Demo Board Kit includes:
• Assembled Printed Circuit Board (PCB)
• Important Information “Read First”
• Analog and Interface Products Demonstration Boards CD-ROM (DS21912) Includes:
- MCP6V01 Input Offset Demo Board User’s Guide, (DS51801)
MCP6V01 INPUT OFFSET
DEMO BOARD USER’S GUIDE
FIGURE 1-1: MCP6V01 Input Offset Demo Board Contents.
© 2009 Microchip Technology Inc. DS51801A-page 5
MCP6V01 Input Offset Demo Board User’s Guide
Outputs
GND
V
CM
V
DD
GND
V
M
VDD/2
Inputs
DUT
Diff. Amp.
VDD/2
Reference
V
CM
Reference
(buffered)
(buffered)
High Gain Feedback
Network
V
REF
.
V
CM

1.3 INTENDED USE

The MCP6V01 Input Offset Demo Board is intended to provide a simple means to measure the MCP6V01/2/3 op amp’s input offse t voltage ( V conditions. This V sheet plus changes due to power supply voltage (PSRR), common mode voltage (CMRR), output voltage (A

1.4 DESCRIPTION

Figure 1-2 sho ws th e blo ck dia gr a m fo r the MCP6 V0 1 In pu t Offset Demo Boar d.
includes the specified input offset voltage va lue found in the dat a
OS
) and temperature (ΔVOS/ΔTA).
OL
) under a variety of bias
OS
FIGURE 1-2: Block Diagram.
This circuit does the following:
• Supports Microchip’s auto-zeroed, single op amps:
-SOIC-8 package
- Used as both Device Under Test (DUT) and in a difference amplifier
• Test points for connecting lab equipment
• Single supply configuration
• The bias inputs V
•The V
/2 Reference uses a resistor ladder to divide VDD in half, then buffers that
DD
, VCM and GND set the conditions for the DUT
DD
voltage with an op amp in unity gain
•The V
Reference:
CM
- Has a resistor divider at the input that sets V
CM=VDD
/2 when that input is left
open
- When V effect on V
-VCM is buffered
is driven by an external voltage source, the resistor divider has n o
CM
CM
• The High Gain Feedback Network and DUT together:
- Have a noise gain of G
10.0 kV/V
N
- Have a common mode gain of 1 V/V
- Produce an output voltage of G
NVOS+VCM
DS51801A-page 6 © 2009 Microchip Technology Inc.
Product Overview
• The Difference Amplifier (Diff. Amp.):
- Rejects the DUT’s common mode output (V
- Provides additional gain (G
10.0 V/V) to the term GNVOS at the DUT’s
DA
output
- Shifts the output so it is centered on the reference V
- Produce an output voltage of G
DAGNVOS+VDD
The inputs:
• Allow the DUT to be biased at most valid bias points
• Allow V
to set by the circuit at VDD/2, or set by the user
CM
The outputs:
• Make it easy to measure the important bias voltages V
• Make it easy to measure VM–VDD/2 = GDAGNV
CM
)
/2
OS
REF=VDD
/2 and V
DD
/2
CM
© 2009 Microchip Technology Inc. DS51801A-page 7
MCP6V01 Input Offset Demo Board User’s Guide
NOTES:
DS51801A-page 8 © 2009 Microchip Technology Inc.

Chapter 2. Installation and Operation

Power Supply
Power Supply VCM – GND
VDD – GND
Voltmeter
VDD/2 – GND
Voltmeter
VM –VDD/2
Voltmeter VCM – GND
Voltmeter
VO1–GND

2.1 INTRODUCTION

This chapter shows how to set up the MCP6V01 Input Offset Demo Board. Items discussed in this chapter include:
• Required Tools
• Connecting the Lab Equipment
• Operating Conditions
• Calculating the DUT’s Input Offset Voltage (V
• Converting Input Offset Voltage to Other Parameters
• Reducing the Measurement Noise

2.2 REQUIRED TOOLS

• Lab Power Supplies:
- Two outputs
- 0V to 5.5V minimum range
- Adjustable
• One Voltmeter:
- 1 mV resolution
- -6V to +6V minimum range
- Differential measurement (e.g., hand held meter)
MCP6V01 INPUT OFFSET
DEMO BOARD USER’S GUIDE
)
OS

2.3 CONNECTING THE LAB EQUIPMENT

Lab equipment is connected to this board as shown in F igure 2-1. The (surface mount) test points allow lab equipment to be connected to these boards. The power supplies are connected at the right. The voltmeter is connected at the four different points shown.
FIGURE 2-1: Board Connections for the MCP6V01 Input Offset Demo Board.
© 2009 Microchip Technology Inc. DS51801A-page 9
MCP6V01 Input Offset Demo Board User’s Guide
V
OST
VMVDD2()1GDAG
N
()()=
Where:
1/(G
DAGN
) 10.0 µV/V

2.4 OPERATING CONDITIONS

This board works most effectively at room temperature (near +25°C). Measurements at other temperatures should be done in an oven where the air velocity is minimal.
The power supply (V The common mode voltage (V
operation of this demo board.

2.5 CALCULATING THE DUT’S INPUT OFFSET VOLTAGE

) should be between 1.8V and 5.5V.
DD
) needs to be between 0.3V and VDD– 0.3V for proper
CM
The DUT’s total input offset voltage (V
) can be calculated from a measurement as
OST
shown in Equation 2-1.
EQUATION 2-1:

2.6 CONVERTING INPUT OFFSET VOLTAGE TO OTHER PARAMETERS

2.6.1 Theory
Changing the bias voltages changes the input offset voltage. Microchip’s application note AN1 177 discusses in detail how these changes in V found in our data sheets. The following list summarizes the p arameters that contribute to V
OST
:
• Specified Input Offset Voltage:
-V
= Input offset at the specified bias point
OS
• DC Common Mode Rejection Ratio:
- CMRR = ΔV
CM
/ΔV
OS
• DC Power Supply Rejection Ratio:
- PSRR = (ΔV
ΔVSS)/ΔV
DD
OS
• DC Open-Loop Gain:
-A
OL
= ΔV
OUT
/ΔV
OS
• Input Offset Drift over Temperature:
- ΔV
OS
/ΔT
A
are related to specifications
OS
DS51801A-page 10 © 2009 Microchip Technology Inc.
Note: The data sheet Input Of fset Voltage (VOS) specification applies to one bias
point and temperature only. The total input offset voltage (V V
and other changes in input offset as bias voltages and temperature
OS
) includes
OST
change.
Installation and Operation
Given:
Then:
V
OST
=0.5µV, VCM=0V
V
OST
=1.0µV, VCM=5V
ΔV
OST
=0.5µV
ΔV
CM
=5.0V
CMRR = 5.0V / 0.5 µV
=10V/µV = 140 dB
Example 2-1 gives an example of how V voltage (V
CM
).
changes with the common mode input
OST
EXAMPLE 2-1: COMMON MODE CHANGE EXAMPLE
2.6.2 Application
When the common mode voltage (VCM) is changed on this demo board, the output voltage (V to independently change V Open-Loop Gain (A
Note: V
) is forced to change by the same amount. There is no means provided
OUT
) effect from the CMRR effect using this board.
OL
cannot be changed independently of VCM, so AOL and CMRR cannot
OUT
CM
and V
. Thus, it is not possible to separate the
OUT
be distinguished using this circuit.
Since A attribute most of the change to CMRR and ignore A
is usually much better than CMRR for the MCP6V0X op amps, we can
OL
in most cases. Table 2-1 shows
OL
one possible measurement matrix that will allow the user to estimate key parameters for the DUT.
TABLE 2-1: MEASUREMENT MATRIX
Operating Inputs
(Note 1)
V
T
A
(°C)
DD
(V)
+25 5.5 OFF V
1.8 VDD/3 V
-40 5.5 VDD/3 V
+85 VDD/3 V
+125 VDD/3 V
V
CM
(V)
/3 V
V
DD
0.5 V
5.0 V
0.3 V
1.5 V
Symbol Comments
M1 M2 M3 M4 M5 M6 M7 M8 M9
M10
Quick Check VOS and PSRR CMRR and A
VOS and PSRR CMRR and A
VOS at temperature and ΔVOS/ΔT
Note 1: VSS=GND=0V. VCM= OFF means that the its power supply is off (VCM=VDD/2).
V
VCM.
OUT
Measurement
OL
OL
A
Based on these measurements, we can make the following estimates, where the V
values are calculated from the measured VMk values (see Equation 2-1):
OST_k
© 2009 Microchip Technology Inc. DS51801A-page 11
MCP6V01 Input Offset Demo Board User’s Guide
TABLE 2-2: ESTIMATES
Operating Inputs Estimate
V
DD
(V)
1.8 and 5.5 -40 to +125 1/AOL= 0, by assumption µV/V
5.5 -40 V
1.8 +25 VOS=V
Note 1: V
OST_k
Obviously, other values of T
T
A
(°C)
+25 1/PSRR = (V
+25 V +85 VOS=V
+125 VOS=V
-40 to +125 ΔV +25 1/CMRR = {(V
is calculated from VMk using Equation 2-1.
, VDD, … can be used instead, with the proper adjustment s
A
/ΔTA=(V
OS
1/CMRR = (V
to these equations.

2.7 REDUCING THE MEASUREMENT NOISE

The noise seen in the measurements is a result of the design choices made for the MCP6V01 Input Offset Demo Board. The component s R12 and C5 set a lowpass po le at 0.16 Hz, which gives reasonable noise performance (±0.2 µV of the DUT) and settling time (1 to 2 seconds).
To achieve lower noise in your results, average many measurements together. For instance, measuring the output (V samples) should produce an estimate with noise 16 = 4 times lower (i.e., ±0.05 µV
There is a practical limit on increasing the sample rate; the noise does not improve significantly after a certain point. The analog lowpass pole at 0.16 Hz causes closely spaced samples to be correlated. To avoid the overhead caused by sampling too fast, keep the sampling period near or above the pole’s time constant (1.0s); this gives a minimum sample rate of 1 sample per second.
M–VDD
Equations (Note 1) Units
)/(3.7V) µV/V
) / (165°C) µV/°C
)/(4.5V) µV/V
)/(1.2V) µV/V
referred to the input
PK
OS OS
OST_2–VOST_5
=V
OST_8
=V
OST_2 OST_9 OST_10
OST_10–VOST_8
OST_4–VOST_3
OST_5
OST_7–VOST_6
/2) once a second for 16 seconds (16
µV µV µV µV
µV
PK
).
Note: Sampling much faster than 1 SPS will not improve the averaged noise of
this board’s output significantly.
DS51801A-page 12 © 2009 Microchip Technology Inc.

Chapter 3. Possible Modifications

Label
DUT’s Pin 1
Reference Designator

3.1 INTRODUCTION

This chapter shows simple modifications to the MCP6V01 Input Offset Demo Board:
• Changing the DUT
• Connecting a Chip Select Pin to Ground

3.2 CHANGING THE DUT

Change the DUT (see Figure 3-1) to the MCP6V06 Op Amp as follows:
1. Remove U1 from the PCB, using a de-soldering tool.
2. Solder a MCP6V06 op amp in its place. Use a MCP6V06 in a SOIC-8 package. Pin 1 is next to the U1 reference designator on the PCB (not next to the DUT label)
MCP6V01 INPUT OFFSET
DEMO BOARD USER’S GUIDE
FIGURE 3-1: Location and Orientation of DUT.
© 2009 Microchip Technology Inc. Draft DS51801A-page 13
MCP6V01 Input Offset Demo Board User’s Guide
DUT’s Pin 8 Ground Via

3.3 CONNECTING A CHIP SELECT PIN TO GROUND

The DUT can be changed to the MCP6V03 or MCP6V08 op amps with chip select. If desired, their Chip Select pin (pin 8) can be forced to ground. This is done as follows (see Figure 3-2):
1. Solder one end of a wire to the DUT’s pin 8. Pin 8 is next to the U1 reference designator on the PCB (not next to the DUT label)
2. Solder the other end of the wire the closest ground via on the PCB. The striped green arrow to the right in the figure shows the location. The solid green curve represents the wire.
FIGURE 3-2: Location and Orientation of DUT.
DS51801A-page 14 Draft © 2009 Microchip Technology Inc.

Appendix A. Schematics and Layouts

A.1 INTRODUCTION

This appendix contains the schematics and layouts for the MCP6V01 Input Offset Demo Board.
The Gerber files for this board are available on the Microchip website (www.microchip.com) and are contained in the “00227R3_Gerbers.zip” zip file .

A.2 SCHEMATIC

See below the circuit diagram. On the left is the DUT (U1), which produces the common mode voltage plus the DUT’s input offset (V difference amplifier that amplifies and level shifts the DUT’s output minus the mid-supply reference voltage. On the top ri ght is the mid-supply reference (V buffer. On the middle right is the common mode voltage reference (VCM) with buffer. On the bottom are the supply bypass capacitors and filter resistors.
MCP6V01 INPUT OFFSET
DEMO BOARD USER’S GUIDE
) times a gain. In the middle is the
OS
/2) and
DD
© 2009 Microchip Technology Inc. DS51801A-page 15
MCP6V01 Input Offset Demo Board User’s Guide
M
A.2 BOARD SCHEMATIC (Continued)
DS51801A-page 16 © 2009 Microchip Technology Inc.
Schematics and Layouts

A.3 COMBINATION OF THE TOP SILK SCREEN AND TOP METAL LAYERS

A.4 TOP SILK SCREEN

© 2009 Microchip Technology Inc. DS51801A-page 17
MCP6V01 Input Offset Demo Board User’s Guide

A.5 TOP METAL LAYER

A.6 BOTTOM METAL LAYER

DS51801A-page 18 © 2009 Microchip Technology Inc.
MCP6V01 INPUT OFFSET
DEMO BOARD USER’S GUIDE

Appendix B. Bill Of Materials (BOM)

B.1 MCP6V01 INPUT OFFSET DEMO BOARD BOM

The BOM in Table B-1 corresponds to Figure 2-1; it shows all of the components assembled on the PCB. Table B-2 shows additional parts that come in the ESD protection bag that the user, if needed, installs.
TABLE B-1: BILL OF MATERIALS FOR ASSEMBLED PCB
Qty Reference Description Manufacturer Part Number
7 C3, C4, C7, C10,
C14, C17, C18 5 C1, C2, C8, C13, C16 1.0 µF, 1206 SMD, X7R, 16V, 10% ECJ-3YB1C105K 5 C5, C6, C9, C11, C15 10 µF, 1206 SMD, X7R, 16V, 10% ECJ-3YX1C106K 1 C12 100 µF, Radial, Electrolytic, 10 V, 20% EEU-FC1A101S 1 PCB 2 layer PCB (2.20 in × 2.00 in) n/a n/a 2 R7, R10 33.2 kΩ, 0603 SMD, 0.1%, 25 ppm/°C,
2 R8, R11 332 kΩ, 0603 SMD, 0.1%, 25 ppm/°C,
3 R23, R24, R25 10.0Ω, 0603 SMD, 1%, 1/10W Panasonic-ECG ERJ-3EKF10R0V 2 R1, R2 20.0Ω, 0603 SMD, 1%, 1/10W ERJ-3EKF20R0V 2 R21, R22 49.9Ω, 0603 SMD, 1%, 1/10W ERJ-3EKF49R9V 1R4 1.00kΩ, 0603 SMD, 1%, 1/10W ERJ-3EKF1001V 2 R5, R9 3.01 kΩ, 0603 SMD, 1%, 1/10W ERJ-3EKF3011V 1 R19 10.0 kΩ, 0603 SMD, 1%, 1/10W ERJ-3EKF1002V 5 R6, R12, R15, R16,
R20 2 R17, R18 182 kΩ, 0603 SMD, 1%, 1/10W ERJ-3EKF1823V 1 R3 196 kΩ, 0603 SMD, 1%, 1/10W ERJ-3EKF1963V 2 R13, R14 200 kΩ, 0603 SMD, 1%, 1/10W ERJ-3EKF2003V 2 U1, U2 MCP6V01, SOIC-8, Single Op Amp Microchip 1 U3 MCP6002, SOIC-8, Dual Op Amp MCP6002-E/SN 7 TP1 – TP7 SMD, Test Point Keystone
Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM
used in manufacturing uses all RoHS-compliant components.
100 nF, 060 3 SMD, X7R, 16V, 10% Panasonic
Susumu Co. Ltd. RG1608P-3322-B-T5
1/10W
1/10W
100 kΩ, 0603 SMD, 1%, 1/10W ERJ-3EKF1003V
Technology Inc.
Electronics
®
-ECG ECJ-1VB1C104K
RG1608P-3323-B-T5
MCP6V01-E/SN
®
5016
TABLE B-2: BILL OF MATERIALS FOR LOOSE PARTS IN BAG
Qty. Reference Designator Description Manufacturer Part Number
4 (for PCB mounting) Stand-off, Hex, 0.500", 4 × 40 Thread,
Nylon, 0.285" max. O.D.
4 (for PCB mounting) Machine Screw, Phillips, 4 × 40 Thread,
1/4" long, Nylon
© 2009 Microchip Technology Inc. DS51801A-page 19
Keystone Electronics
Building Fasteners
1902C
NY PMS 440 0025 PH

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03/26/09
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