Microchip Technology MCP2210 User’s Guide

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MCP2210

Evaluation Kit

User’s Guide

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and t he lik e is provided only for your convenience and may be su perseded by upda t es . It is y our responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life supp ort and/or safety ap plications is entir ely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless M icrochip from any and all dama ges, claims, suits, or expenses re sulting from such use. No licens es are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

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EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC

logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

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All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

ISBN: 978-1-62076-118-2

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

MCUs and dsPIC® DSCs, KEELOQ

code hopping

MCP2210 EVALUATIO N KI T

USER’S GUIDE

Preface ...........................................................................................................................5

Introduction............................................................................................................5

Document Layout .................................................................................................. 5

Conventions Used in this Guide............................................................................ 6

Recommended Reading.............................................................. .. ........................7

The Microchip Web Site........................................................................................ 7

Customer Support....................... ....................................................... ...................7

Document Revision History................................................................................... 7

Chapter 1. Product Overview

1.1 Introduction .....................................................................................................9

1.2 MCP2210 Evaluation Kit General Description ................ .. ........................ .. ....9

1.3 What The MCP2210 Evaluation Kit Includes ................................................. 9

Chapter 2. Installation and Operation

2.1 Introduction ...................................................................................................11

2.2 Kit Setup ....................................................................................................... 11

2.3 Board Oper a tio n .. .. ............................. .......................................................... 12

2.4 MCP2210 Typical Usage Scenarios ...................... .. .....................................17

Appendix A. Schematic and Layouts

A.1 Introduction ..................................................................................................19

A.2 MCP2210 Breakout Board Schematic and Layouts .....................................20

A.3 MCP2210 SPI Slave Motherboard Schematic and Layouts ........................27

Appendix B. Bill of Materials

Worldwide Sales and Service ....................................................................................36

MCP2210 Evaluation Kit User’s Guide

NOTES:

MCP2210 EVALUATIO N KI T

USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the p age number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available online help files.

IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the MCP2210 Evaluation Kit. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP2210 Evaluation Kit as a development tool. The manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the MCP2210 Evaluation Kit

• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board and Graphical User Interface (GUI)

• Appendix A. “Schematic and Layouts” – Shows the schematic and board layouts for the MCP2210 Evaluation Kit User’s Guide

• Appendix B. “Bill of Materials” – Lists the parts used to populate the MCP2210 Evaluation Kit

MCP2210 Evaluation Kit User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following docum entat io n conven tion s:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic chara c ters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brac kets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe character: { | }

Ellipses... Replaces r epeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the tota l number of digits, R is th e radi x and n is a digit.

Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’

Choice of mut ually exclus ive arguments; an OR selection

Represents code supplied by user

IDE User’s Guide

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options] errorlevel {0|1}

var_name...] void main (void)

{ ... }

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

T echnical support is available through the web site at: .http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (March 2012)

• Initial Release of this Document.

MCP2210 Evaluation Kit User’s Guide

NOTES:

MCP2210 EVALUATIO N KI T

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the MCP2210 Evaluation Kit and covers the following topics:

• MCP2210 Evaluation Kit General Description

• What The MCP2210 Evaluation Kit Includes

1.2 MCP2210 EVALUATION KIT GENERAL DESCRIPTION

The MCP2210 Evaluation Kit (ADM00421) is a development and evaluation platform for the MCP2210 device. The kit is comprised of two connected boards:

• MCP2210 Breakout Board (ADM00419)

• MCP2210 SPI Slave Motherboard (ADM00420)

The MCP2210 SPI Slave Motherboard is designed to work together with the MCP2210 Breakout Board (ADM00419). The motherboard provides the test-points required for measurements. It also contains the following SPI slave devices:

• MCP23S08 – 8-bit I/O expander

• MCP3204 – 4 channel, 12-bit ADC

• 25LC02 – 2 kbit EEPROM

• TC77 – Temperature sensor

All devices are SPI slaves, controlled by the MCP2210. Windows®-based PC software is used to evaluate/demonstrate the MCP2210 as a

USB-to-SPI (Master) device. It allows I/O control and custom device configuration. The software is downloadable from the board web page on www.microchip.com.

A DLL package is also available for development of custom PC applications using the MCP2210. The DLL package is downloadable from the board’s web page.

USER’S GUIDE

1.3 WHAT THE MCP2210 EVALUATION KIT INCLUDES

The MCP2210 Evaluation Kit includes (ADM00421):

• MCP2210 Breakout Board (ADM00419)

• MCP2210 SPI Slave Motherboard (ADM00420)

•Mini-USB cable

• Important Information Sheet

MCP2210 Evaluation Kit User’s Guide

NOTES:

Chapter 2. Installation and Operation

2.1 INTRODUCTION

The MCP2210 Evaluation Kit is designed to demonstrate the device as a USB-to-SPI (Master) bridge solution.

The Evaluation Kit is comprised of two boards that have the following features:

• MCP2210 Breakout Board:

- Small plug-in board with DIP form factor (0.6 inches overall row spacing

between pins)

- Mini-USB co nnector

- Access to the SPI bus and all GP signals

- PICkit™ Serial Analyzer compatible header

- 3.3 or 5V jumper selectable V

up to 500 mA to the rest of the system

• MCP2210 SPI Slave Motherboard:

- Socket for plugging in the MCP2210 Breakout Board

- Test-points for the SPI bus and GP signals

- PICkit™ Serial Analyzer header (it can be used to access only one of the SPI

slave chips present on this board – MCP23S08)

- 8-bit I/O expander (MCP23S08) with eight LEDs

- Four channel, 12-bit ADC (MCP3204) – a potentiometer is used to vary the

voltage on the Channel 1 ADC input

- 2 kbit EEPROM – 25LC02

- Temperature sensor – TC77

MCP2210 EVALUATIO N KI T

USER’S GUIDE

; the Breakout Board can be used to supply

2.2 KIT SETUP

Follow these steps to set up the MCP2210 Evaluation Kit:

1. Download the support material (PC applications and DLL libraries) that can be

found on the board’s page (www.microchip.com/mcp2210evaluationkit).

2. Plug the MCP2210 Breakout Board into the MCP2210 SPI Slave Motherboard.

3. Connect the MCP2210 Breakout Board to a PC via a USB port.

4. The system will automatically install the driver for this board. When the

installation is complete, the board is ready for operation.

5. Install the downloaded PC software.

6. Start the demo application and exercise the SPI slave chip’s features.

MCP2210 Evaluation Kit User’s Guide

2.3 BOARD OPERATION

The MCP2210 device is detected by a Windows®-based PC host as a Human Interface Device (HID). The accompanying software can be used to exercise the Evaluation Kit’s features. It also provides a reference point for users that want to create custom applications based on the MCP2210.

2.3.1 MCP2210 Breakout Board Operation

The MCP2210 Breakout Board can be used with either the provided motherboard, or as a stand-alone USB-to-SPI (Master) bridge module. The breakout board provides all the required signals in order to assist the user in building customized boards using the MCP2210.

The breakout board has the following features:

• SPI bus signals (MOSI, MISO, SCK)

• 9 GP signals configurable for:

- GPIO functionality (digital input or output pins)

- Chip Select functionality (working with the SPI bus signals)

- Dedicated function pins

• Jumper selectable power supply: 3.3 or 5V (up to 500 mA). The board has a default connection trace between V mounting unnecessary when powering the board with 3.3V. For 5V operation, a 3-pin header must be mounted on the board.

• PICkit™ Serial Analyzer header using GP4 as the Chip Select signal

and 3.3V rail, making the voltage header

Note: This function is available only on SPI operations, it does not work on I

UART signals.

• Dip form-factor (0.6 inches overall row spacing between pins)

By using the provided software and libraries, the user can create personalized PC applications using the breakout board as a USB-to-SPI (Master) bridge adapter.

C or

2.3.2 MCP2210 Breakout Board Operation

The MCP2210 Utility software was created for custom device setting requirements. A few of the settings that this utility can alter include VID, PID, power requirements, and string descriptors. A download link for this software can be found on the board web page. For instructions on the use of this software, refer to the software’s supporting documentation included with in the appl ic at ion install package.

2.3.3 SPI Terminal Utility

The SPI Terminal Utility is a tool that allows low-level data exchange at the SPI bus level. This application is useful for low-level communication and troubleshooting between the MCP2210 and various SPI slave modules.

The utility window has different sections for GP designation, SPI transfer parameters and user data area.

FIGURE 2-1: SPI TERMINAL UTILITY WINDOW

SPI user data section

HEX/Decimal user data mode

Installation and Operation

GP Settings Section

SPI Transfer Parameters Section

Status messages

After the application is started, the state of the connection with the MCP2210 is shown in the Status Messages bar (in the lower left corner of the screen).

The user can establish the GP configuration. The GPs can be used as chip select pins. Each GP Active and Idle value can be established by selecting the appropriate checkboxes, or by directly supplying the correct value in the GP Direct Settings section. The same behavior applies to the GP designation (the GP designation can be established by clicking the appropriate radio-button, or by directly supplying the GP designation value in the GP settings Direct Values section).

The SPI settings pertaining to the needed SPI transfer can be established in the SPI Parameters section.

The data to be sent out is filled in the Tx Data field. To send the data to the SPI slave device, press the SPI Transfer Da ta button on the lower right area of the screen. The data received from the SPI slave device is displayed in the Rx Data field.

The user data can be supplied in either HEX or Decimal mode. This can be accomplished by selecting the HEX mode checkbox. The data in the Tx and Rx Data fields will be displayed in HEX or Decimal.

Transfer Data button

GP Direct Settings section

MCP2210 Evaluation Kit User’s Guide

A simple test using the SPI Terminal utility shows how the MCP23S08 (an 8-bit I/O expander) uses the GP4 pin of the MCP2210 device as a chip select line. This line should be active low. The GP4 must be set as in the Figure 2-1, with the IDLE option checked (IDLE value is logic ‘1’) and the ACTIVE option unchecked (ACTIVE value is logic ‘0’).

The SPI parameters are set as follows:

• Bit rate - 500000 bps

• SPI Mode – 0

• Number of bytes to transfer – 3

• All the SPI related delays are set to 0

The TX Data should contain the following HEX values: 40, 00, 00. Click on the SPI Transfer Data button to complete the procedure and set the MCP23S08’s port as an output.

After setting this port, a value can be sent out to the port to light the LEDs on the board. To make this happen, insert the following three HEX values: 40, 0A, FF . By clicking the SPI Transfer Data button again, the inserted values are sent out to the MCP23S08 device. This command will light all the LEDs on the board. If any other LED light pattern is desired, the third value (FF) can be changed to any other 8-bit value.

To verify the value written to the MCP23S08’s port, another set of data must be written into the TX Data area: 41, 0A and any other 8-bit value (a “Don’t care” value for the third position is admissible, because the read value from the MCP23S08 is received on the third byte).

In the RX Data field, the third value should be the identical to the one sent out previously (in the given example, FF).

2.3.4 MCP2210 Evaluation Kit demo application

The provided demo application is designed to work with the MCP2210 SPI Slave Motherboard using the MCP2210 Breakout Board as a USB-to-SPI bridge.

The application’s source code is provided to facilitate the development of custom PC applications using the MCP2210 and the accompanying DLL package. This application was written in Visual Basic.

Installation and Operation

FIGURE 2-2: VISUAL BASIC APPLICATION WINDOW

I/O Expander Section

Temperature Sensor Section

ADC Section

I/O Expander Section

Selected EEPROM Addr es s

The PC GUI shows typical sections for each of the SPI slave devices present on the MCP2210 SPI Slave Motherboard.

2.3.5 MCP23S08 GPIO Expander controls

The GUI provides specific controls in order to assist the user in exploring the I/O expander features. The control for this chip shows eight color-coded buttons, each representing an I/O option.

FIGURE 2-3: MCP23S08 GPIO EXPANDER SECTION

I/O buttons

By double-clicking on any of the buttons, the assigned I/O pin will toggle from being a digital input to digital output and back.

For the I/Os designated as digital inputs, any change on the pins will be shown on the GUI in yellow (for a logic high value) or in blue (for a logic low value).

For the I/Os designated as digital outputs, a single click on any of the I/O circles will toggle their output value from logic low (in red) to logic high (in green). When a digital output is set to logic high, the corresponding LED will be lit.

Color coded reference table for I/O option

2.3.6 EEPROM 25LC02 Controls

The EEPROM GUI section presents a data-grid control and three buttons (see Figure 2-4). The data-grid is organized in eight columns and sixty-four rows. The EEPROM addresses are read from left to right, top to bottom, starting at location 0 (in

MCP2210 Evaluation Kit User’s Guide

the first line, first column on the left). When, a particular cell in the data grid control is highlighted, the corresponding EEPROM address is displayed in the bottom left corner of the application window.

FIGURE 2-4: EEPROM 25LC02 SECTION

Data-grid controls

Control buttons

The EEPROM section also shows three buttons :

• Read EEPROM – Press this button to read the entire EEPROM memory. The content will show in the data-grid control.

• Write EEPROM – The user can modify the data and add other hex-represented byte values in the cells. When all the modifications are done, press this button to write the modified data-grid content on the EEPROM.

• Clear Mem – T o verify the EEPROM content, press this button. This action clears only the data-grid control, not the EEPROM contents. Later, when the Read EEPROM button is pressed again, the actual EEPROM content will display in the data-grid control.

2.3.7 TC77 Temp Sensor Section

The temperature sensor displays the temperature of the sensor device present on the motherboard in either Fahrenheit or Celsius scales.

FIGURE 2-5: TC77 TEMPERATURE SENSOR SECTION

Temperature

TC77 temperature

unit selection

Installation and Operation

2.3.8 MCP3204 ADC Display Section

The MCP3201 12-bit ADC section displays the board’s measured VDD voltage and a voltage between 0 and V motherboard potentiometer.

FIGURE 2-6: MCP3204 ADC VALUES DISPLAY

Motherboard potentiometer settings display (between 0 and and V

DD/2)

Custom voltage value display

The remaining channels (channels 2 and 3) can also display custom user measurements of voltages between 0V

DD/2, corresponding to the voltage value set by the

VDD voltage value display

– 2.5V (maximum).

2.4 MCP2210 TYPICAL USAGE SCENARIOS

The MCP2210 can be used in systems where an SPI bus is available. The MCP2210 device can be either the single master on the bus, or one of the masters sharing the bus, if a proper master-access arbitration scheme is in place.

In cases where the MCP2210 is the only master on the SPI bus, a typical usage scenario is shown in Figure 2-7. The SPI bus links the SPI slave chips to the system, while a few GPs (configured for chip select function) can be used as chip select lines.

If SPI slave interrupt monitoring is required, the GP6 needs to be configured for its dedicated function, in order to monitor the interrupts coming from the SPI slave chips.

The PC application will handle all the details necessary for data transfer between the MCP2210 and the SPI slave devices.

MCP2210 Evaluation Kit User’s Guide

FIGURE 2-7: MCP2210 TYPICAL USAGE DIAGRAM

MCP2210

USB

USB-to-SPI

bridge

External Interrupt

(GP6)

SPI bus

Chip-Select lines

SPI slave chip #1 SPI slave chip #n

MOSI, MISO, SCK

CS0-CS8

...

Interrupt

When a system requires more than one SPI master sharing the same bus, an arbitration scheme needs to be developed, to prevent multiple SPI masters trying to access the bus at the same time. MCP2210 has support for such a mechanism, using GP7 and GP8 (configured for dedicated pin functionality) for this purpose.

When GP8 is configured for its dedicated functionality, the pin can be used as a bus release request for MCP2210 coming from another master. GP7 (configured for its dedicated functionality) is used as an SPI bus release acknowledge signal towards the requesting master. When an external SPI master requests that the MCP2210 release the bus, the MCP2210 completes the current SPI transfer (or it can be cancelled by the PC application by sending the proper USB command). Then it releases the bus, and signals this event on the acknowledge pin (GP7). The second master now has ownership of the bus and can keep it as long as the SPI bus request pin (GP8) is kept asserted.

In conclusion, when the dedicated functionality of the GP7 and GP8 are used, MCP2210 can be used in a multiple SPI master system.

Interrupt

Installation and Operation

FIGURE 2-8: MCP2210 TYPICAL USAGE DIAGRAM

MCP2210

GP8 GP7

SPI Bus Release Request

SPI Bus Release

Acknowledge

SPI Master #2

USB

USB-toSPI

bridge

External Interrupt

(GP6)

SPI bus

Chip-Select lines

SPI slave chip #1 SPI slave chip #n

...

Interrupt

MOSI, MISO, SCK

External Interrupt

MCP2210 Evaluation Kit User’s Guide

NOTES:

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the MCP2210 Evaluation Kit:

• MCP2210 Breakout Board Schematic and Layouts

- Board – Schematic

- Board – Top Silk and Pads

- Board – Top Silk, Pads and Copper

- Board – Top Pads and Copper

- Board – Bottom Silk and Pads

- Board – Bottom Silk, Pads and Copper

- Board – Bottom Pads and Copper

• MCP2210 SPI Slave Motherboard Schematic and Layouts

- Board – Schematic

- Board – Top Silk

- Board – Top Silk and Copper

- Board – Top Copper

- Board – Bottom Silk

- Board – Bottom Silk and Copper

MCP2210 EVALUATIO N KI T

USER’S GUIDE

MCP2210 Evaluation Kit User’s Guide

S T

PGP

OU T

A.2 MCP2210 BREAKOUT BOARD SCHEMATIC AND LAYOUTS

A.2.1 Board – Schematic

D-2D+

USB_D-

5%390

USB_D+

0603

TP1

Via_1.2x 0.7

VDD

GND

12MHz

USB-B-Mini SMD

GND D

0603

0.1uF

GP8

GP7

GP6

GP5

MI SO

0603

1uF

VUSB

USB_D-

USB_D+

D+

VSS

VDD1OSC12OSC23RST4GP05GP16GP27GP38MOSI9GP4

VDR

OSC2

OSC1

GND D

D-

RST

VUSB

PPP

GP0

GP1

GP614GP715GP8

GP2

MI SO

GP3

GP5

MOSI

SCK

GP4

MCP2210

VBUS

VDD

GP8

GP2

GP7

GP3

GP6

GP4

GP5

MOSI

76543

MI SO

SCK

76543

1 x 7 VERT

Right Side Header

HDR M

GND D

HDR M 1x7 VERT

Left Side Header

VDD

SCK

GP4

MOSI

MISO

123456

Serial Analyzer Header

HDR M 1x6 VERT

PICkit™

VDD

GND D

NT1

VUSB

MCP1825S-3.3V

3.3V

VOUT

VIN

123

GND

0.1uF

4.7uF

1 x 3 VERT

HDR M

Default connection

0603

0.1uF

0603

between 1 - 2. User to

cut the trace if 5V VDD

GND D

GND D GND D GND D

is needed.

22uF

1206

GND D

GP0

GP1

A.2.2 Board – Top Silk and Pads

Schematic and Layouts

MCP2210 Evaluation Kit User’s Guide

A.2.3 Board – Top Silk, Pads and Copper

A.2.4 Board – Top Pads and Copper

Schematic and Layouts

MCP2210 Evaluation Kit User’s Guide

A.2.5 Board – Bottom Silk and Pads

A.2.6 Board – Bottom Silk, Pads and Copper

Schematic and Layouts

MCP2210 Evaluation Kit User’s Guide

A.2.7 Board – Bottom Pads and Copper

Schematic and Layouts

D /

A.3 MCP2210 SPI SLAVE MOTHERBOARD SCHEMATIC AND LAYOUTS

A.3.1 Board – Schematic

VDD

ADC

R16

10k

0603

4.7uF

0603

VDD

CH0

J10

0603

MCP3204

J23

GND

VDD

GP4

MI SO

Ferrite Bead 0603

GND

SCK

VREF

0.1uF

Vdd

Vref

CLK

AGND

HHH

CH01CH12CH23CH34NC5NC6DGND

0603

R14

0603

R15

10k

R17

SCK

MOSI

6 5 4 3 2 1

GND

AGND

GP1

MOSI

MISO

in Din

Dout

SH S

CS/SHDN

R12

R13

J22

CH1

AGND

HDR M 1x6 RA

PICkit™ Serial Analyzer Header

0603

J21

0603

J18

GP1

GND

CH3

CH2

GP1

GP8

GP7

GP2

GP3

7 6 5 4 3 2 1

GP6

GP5

MI SO

GP4

SCK

MOSI

7 6 5 4 3 2 1

HDR M 1x7 VERT

Right Side Header

HDR M 1x7 VERT

Left Side Header

0603

R10

0603

LD8

LD7

LD6

LD5

LD4

LD3

LD2

LD1

GND GND GND GND GND GND GND GND

GP5

J15

GP8

GP3

GP2

GND

J14

VDD

GP6

GP2

GP3

GP8

GP5

GND

VDD

GP6

J13

VDD

GND

GP0

J11

GP7

GND

0.1uF

VDD

O SI /O1SCK2NC3VSS

SCK

33k

MOSI

NC5NC

J17

GP7

TC77 SPI 5V

GND

SCK

J16

MOSI

HDR M 2x8 VERT

J12

10 8

0603

VDD

TEMP

J20

MISO

0603

R11

GND

0603

0.1uF

VDD

SCK1SI2SO3A1

I/O EXPANDER

SCK

MOSI

MI SO

GP515GP616GP7

GP414GP313GP212GP111GP0

A05RESET6CS7INT8VSS

0603

GND

VDD

MCP23S08

10k

GP4

GND

0603

GP6

GP4

VREF

J19

AGND

GND

VDD

4.7uF

0603

MCP1525

0603

VREF

VOUT

VIN

GND

0.1uF

0603

VDD

VCC

HOLD

VSS

GND

EEPROM

GP0

25LC020

GP0

SCK

GND

VSS

MOSI

MI SO

MCP2210 Evaluation Kit User’s Guide

A.3.2 Board – Top Silk

A.3.3 Board – Top Silk and Copper

Schematic and Layouts

MCP2210 Evaluation Kit User’s Guide

A.3.4 Board – Top Copper

A.3.5 Board – Bottom Silk

Schematic and Layouts

MCP2210 Evaluation Kit User’s Guide

A.3.6 Board – Bottom Silk and Copper

MCP2210 EVALUATIO N KI T

USER’S GUIDE

Appendix B. Bill of Mater ials

TABLE B-1: BILL OF MATERIALS - MCP2210 BREAKOUT BOARD

Qty Reference Description_ Manufacturer Part Number

1 C1 Cap. Cer. 22 uF 10V 20% Y5V 1206 TDK 3 C2, C4, C5 Cap. Cer. 1 uF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A 1 C3 Cap. Cer. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K 1 C6 Cap. Cer. 1 uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C105K 2J1, J2 DO NOT POPULATE

Conn. Hdr. Male .100 1x7 POS Vert.

1J3 DO NOT POPULATE

Conn. Hdr. Male .100 1x6 POS Vert.

1J4 DO NOT POPULATE

Conn. Hdr. Male .100 1x3 POS Vert. 1 J5 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co. Ltd. UX60SC-MB-5ST(80) 1 PCB RoHS compliant bare PCB, MCP2210

Breakout Board 1 R1 Res. 390 Ohm 1/10W 5% 0603 SMD Panasonic 1 U1 IC USB-TO-SPI SSOP-20 Microchip Technology

1 U2 IC LDO Reg. 500 mA 3.3V SOT-223-3 Microchip Technology

1 X1 Cer. Resonator 12.0 MHz SMD Murata Electronics

Note 1: The components listed in this Bi ll of Material s ar e represe nta tive of th e PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Corporation

TE Connectivity Ltd. HDR M 1x7 Vertical

TE Connectivity Ltd. HDR M 1x6 Vertical

TE Connectivity Ltd. HDR M 1x3 Vertical

— 104-00419

Inc.

- ECG ERJ-3GEYJ391V

C3216Y5V1A226Z

MCP2210-I/SS

MCP1825S-3302E/DB

CSTCE12M0G55-R0

TABLE B-2: BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD

Qty Reference Description_ Manufacturer Part Number

5 C1, C2, C3,

C4, C6

2 C5, C7 Cap. Cer. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K

19 J1, J2, J3, J4,

J5, J6, J7, J8, J9, J14, J15, J16, J17, J18, J19, J20, J21,

J22, J23 1 J10 Conn. Hdr. Male .100 1x6 Pos. RA TE Connectivity Ltd. HDR M 1x6 RA 2 J11, J13 Conn. Hdr. Male .100 1x7 Pos. Vert. TE Connectivity Ltd. HDR M 1x7 Vertical 1 J12 Conn. Hdr. Male .100 2x8 Pos. Vert. TE Connectivity Ltd. HDR M 2x8 Vertical 1 L1 Ferrite Chip 47 Ohms 500 mA 0603 Laird Technologies

Note 1: The components listed in thi s Bill of Material s are repr esent ative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Cap. Cer. 0.1 uF 50V X7R 10% 0603 TDK Corporation C1608X7R1H104K

PC test point Tin SMD Harwin Plc. S1751-46R

LI0603E470R-10

MCP2210 Evaluation Kit User’s Guide

TABLE B-2: BILL OF MATERIALS - MCP2210 SPI SLAVE MOTHERBOARD (CONTINUED)

Qty Reference Description_ Manufacturer Part Number

8 LD1, LD2,

LD3, LD4, LD5, LD6, LD7, LD8

1 PCB RoHS compliant bare PCB, MCP2210

13 R1, R2, R3,

R4, R5, R6, R8, R9, R10, R12, R13, R14, R15

1 R7 Res. 10k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ103V 1 R11 Res. 33k Ohm 1/10W 5% 0603 SMD Panasonic - ECG ERJ-3GEYJ333V 1 R16 Res. 10k Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF1002V 1 R17 Trimmer 10K OHM 0.5W TH Bourns 1 U1 IC I/O Expander SPI 8B SOIC-18 Microchip Technology

1 U2 IC EEPROM 2k Bit 10 MHz SOIC-8 Microchip Technology

1 U3 IC ADC 12 BIT 2.7V 4 Ch. SPI SOIC-14 Microchip Technology

1 U4 IC Sensor Thermal SPI 5V SOIC-8 Microchip Technology

1 U5 IC Volt. Ref. 2.5V SOT-23-3 Microchip Technology

Note 1: The components listed in thi s Bill of Material s are repr esent ativ e of the PCB assembl y. The released BOM

used in manufacturing uses all RoHS-compliant components.

LED Smartled Red 630 nm 0603 OSRAM Opto

Semiconductors GmbH.

— 104-00420

SPI Slave Motherboard Res. 1k Ohm 1/10W 1% 0603 SMD Panasonic - ECG ERJ-3EKF1001V

, Inc. 3386F-1-103TLF

Inc.

LS L29K-G1J2-1-0-2-R18-Z

MCP23S08-E/SO

25LC020A-I/SN

MCP3204T-CI/SL

TC77-5.0MOA

MCP1525T-I/TT

NOTES:

Bill of Materials

Worldwide Sales and Service

AMERICAS

Corporate Office

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http://www.microchip.com/ support

Web Address:

www.microchip.com

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Chicago

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Cleveland

Independence, OH Tel: 216-447-0464 Fax: 216-447-0643

Dallas

Addison, TX Tel: 972-818-7423 Fax: 972-818-2924

Detroit

Farmington Hills, MI Tel: 248-538-2250 Fax: 248-538-2260

Indianapolis

Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453

Los Angeles

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Santa Clara

Santa Clara, CA Tel: 408-961-6444 Fax: 408-961-6445

Toronto

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ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8569-7000 Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511 Fax: 86-28-8665-7889

China - Chongqing

Tel: 86-23-8980-9588 Fax: 86-23-8980-9500

China - Hangzhou

Tel: 86-571-2819-3187 Fax: 86-571-2819-3189

China - Hong Kong SAR

Tel: 852-2401-1200 Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460 Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355 Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533 Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829 Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8203-2660 Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300 Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252 Fax: 86-29-8833-7256

China - Xiamen

Tel: 86-592-2388138 Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040 Fax: 86-756-3210049

ASIA/PACIFIC

India - Bangalore

Tel: 91-80-3090-4444 Fax: 91-80-3090-4123

India - New Delhi

Tel: 91-11-4160-8631 Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-2566-1512 Fax: 91-20-2566-1513

Japan - Osaka

Tel: 81-66-152-7160 Fax: 81-66-152-9310

Japan - Yokohama

Tel: 81-45-471- 6166 Fax: 81-45-471-6122

Korea - Daegu

Tel: 82-53-744-4301 Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857 Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870 Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065 Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870 Fax: 65-6334-8850

Tai wan - Hsin Chu

Tel: 886-3-5778-366 Fax: 886-3-5770-955

Taiwan - Kaohsiung

Tel: 886-7-536-4818 Fax: 886-7-330-9305

Taiwan - Taipei

Tel: 886-2-2500-6610 Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351 Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39 Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828 Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany - Munich

Tel: 49-89-627-144-0 Fax: 49-89-627-144-44

Italy - Milan

Tel: 39-0331-742611 Fax: 39-0331-466781

Netherlands - Drunen

Tel: 31-416-690399 Fax: 31-416-690340

Spain - Madrid

Tel: 34-91-708-08-90 Fax: 34-91-708-08-91

UK - Wokingham

Tel: 44-118-921-5869 Fax: 44-118-921-5820

11/29/11

Microchip Technology MCP2210 User’s Guide

Specifications and Main Features

Frequently Asked Questions

User Manual

Trademarks

Table of Contents

Preface

INTRODUCTION

DOCUMENT LAYOUT

CONVENTIONS USED IN THIS GUIDE

RECOMMENDED READING

THE MICROCHIP WEB SITE

CUSTOMER SUPPORT

DOCUMENT REVISION HISTORY

Chapter 1. Product Overview

1.1 INTRODUCTION

1.2 MCP2210 EVALUATION KIT GENERAL DESCRIPTION

1.3 WHAT THE MCP2210 EVALUATION KIT INCLUDES

Chapter 2. Installation and Operation

2.1 INTRODUCTION

2.2 KIT SETUP

2.3 BOARD OPERATION

2.3.1 MCP2210 Breakout Board Operation

2.3.2 MCP2210 Breakout Board Operation

2.3.3 SPI Terminal Utility

2.3.4 MCP2210 Evaluation Kit demo application

2.3.5 MCP23S08 GPIO Expander controls

2.3.6 EEPROM 25LC02 Controls

2.3.7 TC77 Temp Sensor Section

2.3.8 MCP3204 ADC Display Section

2.4 MCP2210 TYPICAL USAGE SCENARIOS

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

A.2 MCP2210 BREAKOUT BOARD SCHEMATIC AND LAYOUTS

A.2.1 Board – Schematic

A.2.2 Board – Top Silk and Pads

A.2.3 Board – Top Silk, Pads and Copper

A.2.4 Board – Top Pads and Copper

A.2.5 Board – Bottom Silk and Pads

A.2.6 Board – Bottom Silk, Pads and Copper

A.2.7 Board – Bottom Pads and Copper

A.3 MCP2210 SPI SLAVE MOTHERBOARD SCHEMATIC AND LAYOUTS

A.3.1 Board – Schematic

A.3.2 Board – Top Silk

A.3.3 Board – Top Silk and Copper

A.3.4 Board – Top Copper

A.3.5 Board – Bottom Silk

A.3.6 Board – Bottom Silk and Copper

Appendix B. Bill of Mater ials

Worldwide Sales and Service