Microchip Technology MCP2210 User guide

MCP2210

Breakout Module

User’s Guide

© 2012 Microchip Technology Inc. DS52056A

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and t he lik e is provided only for your convenience
and may be su perseded by upda t es . It is y our responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life supp ort and/or safety ap plications is entir ely at
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suits, or expenses re sulting from such use. No licens es are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
K

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

32

PIC

logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-62076-117-5

QUALITY MANAGEMENT SYSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

DS52056A-page 2 © 2012 Microchip Technology Inc.

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Table of Contents

Preface ...........................................................................................................................5

Introduction............................................................................................................5

Document Layout .................................................................................................. 5

Conventions Used in this Guide............................................................................ 6

Recommended Reading.............................................................. .. ........................7

The Microchip Web Site........................................................................................ 7

Customer Support....................... ....................................................... ...................7

Document Revision History................................................................................... 7

Chapter 1. Product Overview

1.1 Introduction .....................................................................................................9

1.2 MCP2210 Breakout Module General Description ..........................................9

1.3 What the MCP2210 Breakout Module Kit Includes ........................................9

Chapter 2. Installation and Operation

2.1 Introduction ...................................................................................................11

2.2 Board Setu p ............. .................................................................................... 11

2.3 Board Oper a tio n .. .. ............................. .......................................................... 12

2.4 MCP2210 Typical Usage Scenarios ...................... .. .....................................14

Appendix A. Schematic and Layouts

A.1 Introduction ..................................................................................................17

A.2 Board – Schematic ... .................................................................... ................ 18

A.3 Board – Top Silk and Pads ..........................................................................19

A.4 Board – Top Silk, Pads and Copper ............................ .. .......................... .. ..20

A.5 Board – Top Pads and Copper ............. ......................... .. ............................21

A.6 Board – Bottom Silk and Pads .......................................................... ...........22

A.7 Board – Bottom Silk, Pads and Copper .......................................................23

A.8 Board – Bottom Pads and Copper ................... ...................... ......................24

Appendix B. Bill of Materials

Worldwide Sales and Service ....................................................................................26

© 2012 Microchip Technology Inc. DS52056A-page 3

MCP2210 Breakout Module User’s Guide

DS52056A-page 4 © 2012 Microchip Technology Inc.

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the p age number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.

For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.

®

IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the
MCP2210 Breakout Module. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP2210 Breakout Module board. The
manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the MCP2210
Breakout Module

• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board,
required tools, board setup and Graphical User Interface (GUI)

• Appendix A. “Schematic and Layouts” – Shows the schematic and board
layouts for the MCP2210 Breakout Module User’s Guide

• Appendix B. “Bill of Materials” – Lists the parts used to populate the MCP2210
Breakout Module

© 2012 Microchip Technology Inc. DS52056A-page 5

MCP2210 Breakout Module User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following docum entat io n conven tion s:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic chara c ters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog
A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with
right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brac kets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe
character: { | }

Ellipses... Replaces r epeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the tota l number of
digits, R is th e radi x and n is a
digit.

Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’

Choice of mut ually exclus ive
arguments; an OR selection

Represents code supplied by
user

®

IDE User’s Guide

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]
errorlevel {0|1}

var_name...]
void main (void)

{ ...
}

DS52056A-page 6 © 2012 Microchip Technology Inc.

RECOMMENDED READING

This user's guide describes how to use MCP2210 Breakout Module. Other useful
documents are listed below. The following Microchip document is available and
recommended as a supplemental reference resource.

• MCP2210 Data Sheet - “USB-to-SPI Protocol Converter with GPIO (Master
Mode)” (DS22288)

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:

• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives

Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.

T echnical support is available through the web site at: http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (March 2012)

• Initial Release of this Document.

© 2012 Microchip Technology Inc. DS52056A-page 7

MCP2210 Breakout Module User’s Guide

NOTES:

DS52056A-page 8 © 2012 Microchip Technology Inc.

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the MCP2210 Breakout Module and covers the
following topics:

• MCP2210 Breakout Module General Description

• What the MCP2210 Breakout Module Kit Includes

1.2 MCP2210 BREAKOUT MODULE GENERAL DESCRIPTION

The MCP2210 Breakout Module is a development and evaluation platform for the
MCP2210 device. The module is comprised of a single DIP form-factor board.

The MCP2210 Breakout Module has the following features:

• SPI bus signals (MOSI, MISO, SCK)

• Nine GP lines, configurable for GPIO, Chip Select or dedicated function operation

• Provides a user selectable (by using a jumper) power supply of 3.3V or 5V (up to
500 mA)

• DIP form-factor (0.6 inches overall row spacing between pins)

• PICkit™ Serial Analyzer header – used for SPI communication only

A Windows
of the MCP2210 device as a USB-to-SPI (Master) device. It allows I/O control and
custom device configuration. The software is downloadable from the board web page
on www.microchip.com.

A DLL package is included to allow development of custom PC applications using the
MCP2210. The DLL package is also available for download on the board web page.

®

-based PC sof tware was c reated to hel p with th e evaluation /demonstr ation

1.3 WHAT THE MCP2210 BREAKOUT MODULE KIT INCLUDES

The MCP2210 Breakout Module Kit includes:

• MCP2210 Breakout Module (ADM00419)

•Mini-USB cable

• Important Information Sheet

© 2012 Microchip Technology Inc. DS52056A-page 9

MCP2210 Breakout Module User’s Guide

NOTES:

DS52056A-page 10 © 2012 Microchip Technology Inc.

Chapter 2. Installation and Operation

2.1 INTRODUCTION

The MCP2210 Breakout Module is designed to demonstrate the device as a
USB-to-SPI (Master) bridge solution.

The package is comprised of a single board and has the following features:

• Small plug-in board with DIP form factor (600 millimeters overall row spacing
between pins)

• Mini-USB conne ctor

• Access to SPI bus and all GP signals through USB port

• PICkit™ Serial Analyzer compatible header

• 3.3 or 5V jumper selectable V
500 mA to the rest of the system. The board already provides a signal trace
between the V
V

header must be mounted on the board. A jumper will close the middle pin and

DD

the 5V pin.

MCP2210 BREAKOUT MODULE

USER’S GUIDE

; the breakout board can be used to supply up to

DD

and the 3.3V rail. For systems requiring 5V VDD power supply,

DD

2.2 BOARD SETUP

Follow these steps to set up the MCP2210 Breakout Module:

1. Download the support material (PC applications and DLL libraries) that can be

found on the board’s page, on the Microchip web site.

2. Attach the MCP2210 Breakout Module to a board that has one or more SPI slave

devices attached to a bus (SPI).

3. Plug the MCP2210 Breakout Module in to a PC.

4. The computer operating system will automatically install the driver for this board.

When the installation is complete, the board is ready for operation.

5. Install the downloaded PC software.

6. Start the SPI Terminal utility.

© 2012 Microchip Technology Inc. DS52056A-page 11

MCP2210 Breakout Module User’s Guide

2.3 BOARD OPERATION

The MCP2210 will be detected by a Windows PC host as an HID device. The
accompanying software can be used to exercise the MCP2210 Breakout Module’s
features and also provides a reference point for users that want to design their own
applications based on the MCP2210 device.

2.3.1 MCP2210 Breakout Board Operation

The MCP2210 Breakout Module can be used as a stand-alone USB-to-SPI (Master)
bridge module. The breakout board provides all the signals required to assist the user
in building their boards with the MCP2210.

The board has the following features:

• SPI bus signals (MOSI, MISO, SCK)

• Nine GP signals that can be configured for:

- GPIO functionality (digital input or output pins)

- Chip Select functionality (working with the SPI bus signals)

- Dedicated function pins

• Jumper selectable power suppl y: 3.3 or 5V (up to 500 mA)

• PICkit™ Serial Analyzer header using GP4 pin as Chip Select signal
Note: This function is available only on SPI operations, it does not work on I

UART signals.

• DIP form-factor (0.6 inches overall row spacing between pins)

By using the provided software and libraries, the user can create personalized PC
applications, using the breakout board as a USB-to-SPI (Master) bridge adapter.

2

C or

2.3.2 MCP2210 Utility

The MCP2210 Utility software was created for custom device setting requirements. A
few of the settings that this utility can alter include VID, PID, power requirements, and
string descriptors. A download link for this software can be found on the board web
page. For instructions on the use of this software, refer to the software’s supporting
documentation included within the application install package.

2.3.3 SPI Terminal Utility

The SPI Terminal Utility is a tool that allows low-level data exchange at the SPI bus
level. This application is useful for low-level communication and troubleshooting
between the MCP2210 and various SPI slave modules.

The utility window has different sections for GP designation, SPI transfer parameters
and user data areas.

DS52056A-page 12 © 2012 Microchip Technology Inc.

FIGURE 2-1: SPI TERMINAL UTILITY WINDOW

SPI user data
section

HEX/Decimal
user data
mode

Installation and Operation

GP Settings Section

SPI Transfer
Parameters
Section

Status messages

After the application is started, the state of the connection with the MCP2210 is shown
in the Status Messages section (lower left corner of the screen).

The user can establish the GP configuration. The GPs can be used as chip select pins.
Each GP Active and Idle value can be established by selecting the appropriate check
boxes, or by directly supplying the correct value in the GP Direct Settings section. The
same behavior applies to the GP designation (the GP designation can be established
by clicking the appropriate radio button, or by directly supplying the GP designation
value in the GP Settings Direct Values section).

The SPI settings pertaining to the needed SPI transfer can be established in the SPI
Parameters section.

The data to be sent goes in the Tx Data field. T o send the data to the SPI slave device,
click the SPI Transfer Data button on the lower-right side of the screen. The data
received from the SPI slave device is displayed in the Rx Data field.

The user data can be supplied in either HEX or Decimal mode. This can be accom­plished by selecting the HEX mode check box. The data in the Tx and Rx Data fields
will be displayed in HEX or Decimal.

Transfer Data button

GP Direct
Settings section

© 2012 Microchip Technology Inc. DS52056A-page 13

MCP2210 Breakout Module User’s Guide

A wider range of tests is available when using this board and the utility software with
the MCP2210 Evaluation Kit (ADM00421). This kit allows communication with several
SPI slave devices (I/O expander, EEPROM, ADC and temperature sensor). For more
details on examples using the SPI Terminal Utility software, see MCP2210 Evaluation
Kit User’s Guide (DS52057).

2.4 MCP2210 TYPICAL USAGE SCENARIOS

MCP2210 can be used in systems where an SPI bus is available. The MCP2210 can
be either the single master on the bus, or one of the masters sharing the bus, if a proper
master access arbitration scheme is in place.

A typical usage scenario is shown in Figure 2-2, where MCP2210 is the only master on
the SPI bus. This link s the SPI sl av e chip s in th e system , whil e a few GPs ( confi gure d
for Chip Select function) can be used as Chip Select lines.

If SPI slave interrupt monitoring is required, the GP6 needs to be configured for its
dedicated function, in order to monitor the interrupts coming from the SPI slave chips.

The PC application will take care of all the details necessary for data transfer between
the MCP2210 and the SPI slave chips.

FIGURE 2-2: MCP2210 TYPICAL USAGE DIAGRAM

USB

MCP2210

USB-to-SPI

bridge

External

Interrupt

(GP6)

SPI bus

Chip Select lines

MOSI, MISO, SCK

CS0-CS8

SPI slave chip #1 SPI slave chip #n

...

Interrupt

Interrupt

When a system requires more than one SPI master that share the same bus, an
arbitration scheme needs to be developed, in order to prevent the multiple SPI masters
from accessing the bus at the same time.

MCP2210 has support for an arbitration mechanism which uses GP7 and GP8
(configured for dedicated pin functionality) for this purpose.

DS52056A-page 14 © 2012 Microchip Technology Inc.

Installation and Operation

When GP8 is configured for its dedicated functionality, the pin can be used as a bus
release request for MCP2210 coming from another master. GP7 (configured for its
dedicated functionality) is used as an SPI bus release acknowledge signal towards the
requesting master. When an external SPI master requests the MCP2210 to release the
bus, the device completes the current SPI transfer (or it can be cancelled by the PC
application sending the proper USB command), then releases the bus and signals the
event on the acknowledge pin (GP7). The second master now has ownership of the
bus, and can keep it, as long as the SPI bus request pin (GP8) is kept asserted.

By using the dedicated functionality of the GP7 and GP8, the MCP2210 can be used
in a multiple SPI master system.

FIGURE 2-3: MCP2210 TYPICAL USAGE DIAGRAM

MCP2210

GP8
GP7

SPI Bus Relea se Request

SPI Bus Release

Acknowledge

SPI Master #2

USB

USB-to-SPI

bridge

External
Interrupt

(GP6)

SPI bus

Chip-Select lines

SPI slave chip #1 SPI slave chip #n

...

Interrupt

Interrupt

MOSI, MISO, SCK

External
Interrupt

© 2012 Microchip Technology Inc. DS52056A-page 15

MCP2210 Breakout Module User’s Guide

DS52056A-page 16 © 2012 Microchip Technology Inc.

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the MCP2210
Breakout Module:

• Board – Schematic

• Board – Top Silk and Pads

• Board – Top Sil k, Pads and Copp er

• Board – Top Pads and Copper

• Board – Bottom Silk and Pads

• Board – Bottom Silk, Pads and Copper

• Board – Bottom Pads and Copper

MCP2210 BREAKOUT MODULE

USER’S GUIDE

© 2012 Microchip Technology Inc. DS52056A-page 17

MCP2210 Breakout Module User’s Guide

OU
T

G

D

S
T

OS

PGP

US

S

U

A.2 BOARD – SCHEMATIC

J5

D-2D+3I

USB_D-

USB_D+

5%390

0603

TP1

ID

4

Via_1.2x0.7

VDD

GND

5

X1

12MHz

USB-B-Mini SMD

GND D

GND D

GND D

GND D

U1

0603

C2

0.1uF

31

2

GP8

GP7

GP6

GP5

MI SO

0603

C6

1uF

VUSB

USB_D-

USB_D+

19

18

20

D-

D+

VSS

V

VDD1OSC12OSC23RST4GP05GP16GP27GP38MOSI9GP4

VDR

OSC2

OSC1

GND D

17

RST

16

VUSB

V

PPP

GP0

GP1

GP614GP715GP8

GP2

13

12

GP5

G

MI SO

P

M

GP3

MOSI

SCK

11

SCK

P

10

GP4

MCP2210

VBUS

VB

1

5V

R1

VDD

VDD

GP8

GP7

GND D

GP2

GP3

7 6 5 4 3 2 1

GP6

GP5

MI SO

VDD

GP4

SCK

MOSI

7 6 5 4 3 2 1

HDR M 1x7 VERT

Right Side Header

MOSI

SCK

MISO

GP4

HDR M 1x7 VERT

Left Side Header

J3

123456

HDR M 1x6 VERT

Serial Analyzer Header

PICkit™

J2

5V

22uF

1206

C1

GND D

J4

123

HDR M 1x3 VERT

Default connection

between 1 - 2. User

to cut the trace if

NT1

3.3V

VUSB

3

U2

MCP1825S-3.3V

1

5V

VOUT

V

VIN

N

GND

C4

C3

C5

2

0.1uF

4.7uF

0.1uF

0603

0603

5V VDD is needed.

0603

GND D

GND D GND D GND D

VDD

GND D

GP0

GP1

J1

DS52056A-page 18 © 2012 Microchip Technology Inc.

A.3 BOARD – TOP SILK AND PADS

Schematic and Layouts

© 2012 Microchip Technology Inc. DS52056A-page 19

MCP2210 Breakout Module User’s Guide

A.4 BOARD – TOP SILK, PADS AND COPPER

DS52056A-page 20 © 2012 Microchip Technology Inc.

A.5 BOARD – TOP PADS AND COPPER

Schematic and Layouts

© 2012 Microchip Technology Inc. DS52056A-page 21

MCP2210 Breakout Module User’s Guide

A.6 BOARD – BOTTOM SILK AND PADS

DS52056A-page 22 © 2012 Microchip Technology Inc.

Schematic and Layouts

A.7 BOARD – BOTTOM SILK, PADS AND COPPER

© 2012 Microchip Technology Inc. DS52056A-page 23

MCP2210 Breakout Module User’s Guide

A.8 BOARD – BOTTOM PADS AND COPPER

DS52056A-page 24 © 2012 Microchip Technology Inc.

MCP2210 BREAKOUT MODULE

USER’S GUIDE

Appendix B. Bill of Mater ials

TABLE B-1: BILL OF MATERIALS

Qty Designator D esc riptio n_ Manufacturer 1 Part Number

1 C1 Cap. Cerm. 22 uF 10V 20% Y5V 1206 TDK
3 C2, C4, C5 Cap. Cerm .1 uF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A
1 C3 Cap. Cerm. 4.7 uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K
1 C6 Cap. Cerm. 1 uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C105K
2J1, J2 DO NOT POPULATE

Conn. Hdr. Male .100 1x7 Pos. Vertical

1J3 DO NOT POPULATE

Conn. Hdr. Male .100 1x6 Pos. Vertical

1J4 DO NOT POPULATE

Conn. Hdr. Male .100 1x3 Pos. Vertical
1 J5 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co. Ltd. UX60SC-MB-5ST(80)
1 R1 Res. 390 Ohm 1/10W 5% 0603 SMD Panasonic® - ECG ERJ-3GEYJ391V
1 U1 IC USB-TO-SPI SSOP-20 Microchip Technology

1 U2 IC LDO Reg. 500 mA 3.3V SOT-223-3 Microchip Technology

1 X1 Cer. Resonator 12.0 MHz SMD Murata Electronics® CSTCE12M0G55-R0
Note 1: The components listed in this Bi ll of Material s ar e represe nta tive of th e PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

®

Corporation

®

Electron ics HDR M 1x7 Vertical

Tyco

Tyco Electronics HDR M 1x6 Vertical

Tyco Electronics HDR M 1x3 Vertical

Inc.

Inc.

C3216Y5V1A226Z

MCP2210-I/SS

MCP1825S-3302E/DB

© 2012 Microchip Technology Inc. DS52056A-page 25

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

http://www.microchip.com/
support

Web Address:

www.microchip.com

Atlanta

Duluth, GA
Tel: [phone]
Fax: [phone]

Boston

Westborough, MA
Tel: [phone]
Fax: [phone]

Chicago

Itasca, IL
Tel: [phone]
Fax: [phone]

Cleveland

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Tel: [phone]
Fax: [phone]

Dallas

Addison, TX
Tel: [phone]
Fax: [phone]

Detroit

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Tel: [phone]
Fax: [phone]

Indianapolis

Noblesville, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

Santa Clara

Santa Clara, CA
Tel: [phone]
Fax: [phone]

Toronto

Mississauga, Ontario,
Canada
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: [phone]
Fax: [phone]

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Tel: [phone]
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Tel: [phone]
Fax: [phone]

China - Chengdu

Tel: [phone]
Fax: [phone]

China - Chongqing

Tel: [phone]
Fax: [phone]

China - Hangzhou

Tel: [phone]
Fax: [phone]

China - Hong Kong SAR

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China - Nanjing

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China - Qingdao

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China - Shanghai

Tel: [phone]
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China - Shenyang

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China - Shenzhen

Tel: [phone]
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China - Wuhan

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China - Xian

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Fax: [phone]

China - Xiamen

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China - Zhuhai

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ASIA/PACIFIC

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi

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India - Pune

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Fax: [phone]

Japan - Osaka

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Fax: [phone]

Japan - Yokohama

Tel: [phone]
Fax: [phone]

Korea - Daegu

Tel: [phone]
Fax: [phone]

Korea - Seoul

Tel: [phone]
Fax: [phone] or
82-2-558-5934

Malaysia - Kuala Lumpur

Tel: [phone]
Fax: [phone]

Malaysia - Penang

Tel: [phone]
Fax: [phone]

Philippines - Manila

Tel: [phone]
Fax: [phone]

Singapore

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Fax: [phone]

Tai wan - Hsin Chu

Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung

Tel: [phone]
Fax: [phone]

Taiwan - Taipei

Tel: [phone]
Fax: [phone]

Thailand - Bangkok

Tel: [phone]
Fax: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]

Denmark - Copenhagen

Tel: [phone]
Fax: [phone]

France - Paris

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Germany - Munich

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Fax: [phone]

Italy - Milan

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Fax: [phone]

Netherlands - Drunen

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Fax: [phone]

Spain - Madrid

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Fax: [phone]

UK - Wokingham

Tel: [phone]
Fax: [phone]

11/29/11

DS52056A-page 26 © 2012 Microchip Technology Inc.