Microchip Technology MCP2200 User’s Guide

MCP2200

Breakout Module

User’s Guide

 2012 Microchip Technology Inc. DS52064A

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and t he lik e is provided only for your convenience and may be su perseded by upda t es . It is y our responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life supp ort and/or safety ap plications is entir ely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless M icrochip from any and all dama ges, claims, suits, or expenses re sulting from such use. No licens es are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, K

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

PIC

logo, rfPIC and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

ISBN: 978-1-62076-297-4

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

MCUs and dsPIC® DSCs, KEELOQ

code hopping

DS52064A-page 2  2012 Microchip Technology Inc.

MCP2200 BREAKOUT MODULE

USER’S GUIDE

Preface ...........................................................................................................................5

Introduction............................................................................................................5

Document Layout .................................................................................................. 5

Conventions Used in this Guide............................................................................ 6

Recommended Reading.............................................................. .. ........................7

The Microchip Web Site........................................................................................ 7

Customer Support.................... .................................... .................. .......................7

Document Revision History................................................................................... 7

Chapter 1. Product Overview

1.1 Introduction .....................................................................................................9

1.2 What Is the MCP2200 Breakout Module? ......................................................9

1.3 What the MCP2200 Breakout Module Kit Contains .......................................9

Chapter 2. Installation and Operation

2.1 Introduction ...................................................................................................11

2.2 Board Setu p ............. .................................................................................... 11

2.3 Board Oper a tio n .............................................. ............................................. 12

2.4 MCP2200 Typical Usage Scenarios ...................... .. .....................................13

Appendix A. Schematic and Layouts

A.1 Introduction ..................................................................................................15

A.2 Board – Schematic ... .................................................................... ................ 1 6

A.3 Board – Top Sil k ............ ....................................................... ....................... 17

A.4 Board – Top Silk and Pads ..........................................................................18

A.5 Board – Top Copper ....................................................................................19

A.6 Board – Bott o m Si lk ......................................................................... ............ 20

A.7 Board – Bottom Silk and Pads ..................... .. .. .. ............................. .. ...........21

A.8 Board – Bottom Copper ...............................................................................22

Appendix B. Bill of Materials (BOM)

Worldwide Sales and Service ....................................................................................24

 2012 Microchip Technology Inc. DS52064A-page 3

 2012 Microchip Technology Inc. DS52064A-page 4

MCP2200 BREAKOUT MODULE

USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the p age number. The numbering convention for the DS number is “DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available online help files.

IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the MCP2200 Breakout Module. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP2200 Breakout Module board. The manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the MCP2200 Breakout Module

• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board, required tools and board operatio n

• Appendix A. “Schematic and Layouts” – Shows the schematic and board layouts for the MCP2200 Breakout Module

• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to populate the MCP2200 Breakout Module

 2012 Microchip Technology Inc. DS52064A-page 5

MCP2200 Breakout Module User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following docum entat io n conven tion s:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic chara c ters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brac kets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe character: { | }

Ellipses... Replaces r epeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the tota l number of digits, R is th e radi x and n is a digit.

Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’

Choice of mut ually exclus ive arguments; an OR selection

Represents code supplied by user

IDE User’s Guide

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options] errorlevel {0|1}

var_name...] void main (void)

{ ... }

DS52064A-page 6  2012 Microchip Technology Inc.

DOCUMENT REVISION HISTORY

Revision A (May 2012)

• Initial Release of this Document.

 2012 Microchip Technology Inc. DS52064 A-page 7

MCP2200 Breakout Module User’s Guide

NOTES:

DS52064A-page 8  2012 Microchip Technology Inc.

+ 16 hidden pages

Microchip Technology MCP2200 User’s Guide

Specifications and Main Features

Frequently Asked Questions

User Manual

Trademarks

Table of Contents

Preface

DOCUMENT REVISION HISTORY