Microchip Technology MCP2200 User’s Guide

MCP2200

Breakout Module

User’s Guide

 2012 Microchip Technology Inc. DS52064A

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and t he lik e is provided only for your convenience
and may be su perseded by upda t es . It is y our responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
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OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
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Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
K

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,

32

PIC

logo, rfPIC and UNI/O are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MXDEV, MXLAB, SEEVAL and The Embedded Control
Solutions Company are registered trademarks of Microchip
Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, chipKIT,
chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net,
dsPICworks, dsSPEAK, ECAN, ECONOMONITOR,
FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP,
Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB,
MPLINK, mTouch, Omniscient Code Generation, PICC,
PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE,
rfLAB, Select Mode, Total Endurance, TSHARC,
UniWinDriver, WiperLock and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2012, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

ISBN: 978-1-62076-297-4

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

DS52064A-page 2  2012 Microchip Technology Inc.

MCP2200 BREAKOUT MODULE

USER’S GUIDE

Table of Contents

Preface ...........................................................................................................................5

Introduction............................................................................................................5

Document Layout .................................................................................................. 5

Conventions Used in this Guide............................................................................ 6

Recommended Reading.............................................................. .. ........................7

The Microchip Web Site........................................................................................ 7

Customer Support.................... .................................... .................. .......................7

Document Revision History................................................................................... 7

Chapter 1. Product Overview

1.1 Introduction .....................................................................................................9

1.2 What Is the MCP2200 Breakout Module? ......................................................9

1.3 What the MCP2200 Breakout Module Kit Contains .......................................9

Chapter 2. Installation and Operation

2.1 Introduction ...................................................................................................11

2.2 Board Setu p ............. .................................................................................... 11

2.3 Board Oper a tio n .............................................. ............................................. 12

2.4 MCP2200 Typical Usage Scenarios ...................... .. .....................................13

Appendix A. Schematic and Layouts

A.1 Introduction ..................................................................................................15

A.2 Board – Schematic ... .................................................................... ................ 1 6

A.3 Board – Top Sil k ............ ....................................................... ....................... 17

A.4 Board – Top Silk and Pads ..........................................................................18

A.5 Board – Top Copper ....................................................................................19

A.6 Board – Bott o m Si lk ......................................................................... ............ 20

A.7 Board – Bottom Silk and Pads ..................... .. .. .. ............................. .. ...........21

A.8 Board – Bottom Copper ...............................................................................22

Appendix B. Bill of Materials (BOM)

Worldwide Sales and Service ....................................................................................24

 2012 Microchip Technology Inc. DS52064A-page 3

 2012 Microchip Technology Inc. DS52064A-page 4

MCP2200 BREAKOUT MODULE

USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the p age number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.

For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.

®

IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the
MCP2200 Breakout Module. Items discussed in this chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Web Site

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP2200 Breakout Module board. The
manual layout is as follows:

• Chapter 1. “Product Overview” – Important information about the MCP2200
Breakout Module

• Chapter 2. “Installation and Operation” – Covers the initial set-up of this board,
required tools and board operatio n

• Appendix A. “Schematic and Layouts” – Shows the schematic and board
layouts for the MCP2200 Breakout Module

• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to populate the
MCP2200 Breakout Module

 2012 Microchip Technology Inc. DS52064A-page 5

MCP2200 Breakout Module User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following docum entat io n conven tion s:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic chara c ters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog
A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with
right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brac kets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe
character: { | }

Ellipses... Replaces r epeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the tota l number of
digits, R is th e radi x and n is a
digit.

Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’

Choice of mut ually exclus ive
arguments; an OR selection

Represents code supplied by
user

®

IDE User’s Guide

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]
errorlevel {0|1}

var_name...]
void main (void)

{ ...
}

DS52064A-page 6  2012 Microchip Technology Inc.

RECOMMENDED READING

This user's guide describes how to use the MCP2200 Breakout Module. Another useful
document is listed below. The following Microchip document is available and
recommended as a supplemental reference resource.

• MCP2200 Data Sheet - “USB 2.0 to UART Protocol Converter with GPIO”
(DS22228)

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:

• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives

Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.

Technical support is available through the web site at:
http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (May 2012)

• Initial Release of this Document.

 2012 Microchip Technology Inc. DS52064 A-page 7

MCP2200 Breakout Module User’s Guide

NOTES:

DS52064A-page 8  2012 Microchip Technology Inc.

MCP2200 BREAKOUT

MODULE USER’S GUIDE

Chapter 1. Product Overview

1.1 INTRODUCTION

This chapter provides an overview of the MCP2200 Breakout Module and covers the
following topics:

• What Is the MCP2200 Breakout Module?

• What the MCP2200 Breakout Module Kit Contains

1.2 WHAT IS THE MCP2200 BREAKOUT MODULE?

The MCP2200 Breakout Module is a development and evaluation platform for the
USB-to-UART (Universal Serial Bus-to-Universal Asynchronous Receiver/Transmitter)
serial converter MCP2200 device. The module is comprised of a single Dual In-Line
Package (DIP) form-factor board.

The MCP2200 Breakout Module has the following features:

• UART Tx and Rx signals

• UART RTS and CTS signals

• 8 General Purpose (GP) lines - configurable for GPIO or dedicated function oper­ation

• User selectable power supply of 3.3V or 5V (up to 500 mA) by using a jumper

• DIP form-factor (0.6 inches overall row spacing between pins)

• PICkit™ Serial Analyzer header – used for UART communication only

A Windows
of the MCP2200 device as a USB-to-UART protocol converter. It allows I/O control and
custom device configuration. The software is downloadable from the board web page
on www.microchip.com.

®

-based PC software was created to help with the evaluation/demonstration

1.3 WHAT THE MCP2200 BREAKOUT MODULE KIT CONTAINS

The MCP2200 Breakout Module kit includes:

• MCP2200 Breakout Module (ADM00393)

•Mini-USB cable

• Important Information Sheet

 2012 Microchip Technology Inc. DS52064A-page 9

MCP2200 Breakout Module User’s Guide

NOTES:

DS52064A-page 10  2012 Microchip Technology Inc.

Chapter 2. Installation and Operation

2.1 INTRODUCTION

The MCP2200 Breakout Module is designed to demonstrate the device as an
USB-to-UART protocol converter solution.

The module is comprised of a single board and has the following features:

• Small plug-in board with DIP form factor (0.6 inches overall row spacing between
pins)

• Mini-USB conne ctor

• Access to the UART signals (Tx, Rx, RTS and CTS) and all GP signals

• PICkit™ Serial Analyzer compatible header

• 3.3 or 5V jumper selectable V
100 mA to the rest of the system. The board already provides a signal trace
between the V
the V
and the 5V pin.

MCP2200 BREAKOUT

MODULE USER’S GUIDE

DD; the breakout board can be used to supply up to

DD and the 3.3V rail. For systems requiring a 5V V

header must be mounted on the board. A jumper will close the middle pin

DD

power supply,

DD

2.2 BOARD SETUP

Follow these steps to set up the MCP2200 Breakout Module:

1. Download the support material (PC applications and DLL libraries) that can be

found on the board’s web page, on the Microchip web site.

2. Attach the MCP2200 Breakout Module to the system that requires the

USB-to-UART conversion, using a DIP adapter or the PICkit™ Serial Analyzer
header.

3. Plug the MCP2200 Breakout Module to a PC via a USB cable.

4. In the dialog window that appears, browse for MCP2200.inf to install the driver.

The board is now set up for operation.Optional steps include the following:

5. Install the downloaded PC software.

6. Start the demo application developed for the board, or a hyperterminal-like

application, in order to get access to the virtual COM port created by the PC for
the MCP2200 device.

 2012 Microchip Technology Inc. DS52064A-page 11

MCP2200 Breakout Module User’s Guide

FIGURE 2-1: BREAKOUT BOARD LAYOUT

2.3 BOARD OPERATION

The MCP2200 device is detected by a Windows®-based PC host as a composite
device. The accompanying software can be used to exercise the board’s features and
also provides a reference point for users that want to design their own applications
based on the MCP2200 device.

2.3.1 MCP2200 Breakout Module Operation

The MCP2200 Breakout Module can be used with a UART-based system. The
breakout board eases the USB support addition.

The board has the following features:

• UART signals (Tx, Rx, RTS and CTS)

• 8 GP signals that can be configured for:

- GPIO functionality (digital input or output pins)

- Dedicated function pins (signaling import system states, such as USB
Configured, USB Suspend)

• Jumper selectable power suppl y: 3.3 or 5V (up to 500 mA)

• PICkit™ Serial Analyzer header - the board can be directly plugged into systems
that have this type of header. The MCP2200 Breakout Module provides the
UART-to-USB access.

• DIP form-factor (0.6 inches overall row spacing between pins)

By using the provided software and libraries, the user can create personalized PC
applications, using the breakout board as an USB-to-UART protocol converter.

DS52064A-page 12  2012 Microchip Technology Inc.

Installation and Operation

UART-based system

MCP2200 Breakout Board

Tx

Rx

MCP2200

GND

V

DD

Rx

Tx

GND

2.4 MCP2200 TYPICAL USAGE SCENARIOS

MCP2200 can be used in systems where a UART bus is available. The MCP2200
enables the USB connection to a UART-based system.

FIGURE 2-2: MCP2200 TYPICAL USAGE DIAGRAM

 2012 Microchip Technology Inc. DS52064A-page 13

MCP2200 Breakout Module User’s Guide

NOTES:

DS52064A-page 14  2012 Microchip Technology Inc.

Appendix A. Schematic and Layouts

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the MCP2200
Breakout Module:

• Board – Schematic

• Board – Top Silk

• Board – Top Silk and Pads

• Board – Top Copper

• Board – Bottom Silk

• Board – Bottom Silk and Pads

• Board – Bottom Copper

MCP2200 BREAKOUT

MODULE USER’S GUIDE

 2012 Microchip Technology Inc. DS52064A-page 15

DS52064A-page 16  2012 Microchip Technology Inc.

12MHz

2

31

X1

10%0.1uF

0603

C4

GND

VDD

VDD

GND

GND

GND

5V

VUSB

HDR M 1x7 VERT

J3

HDR M 1x7 VERT

J4

GP7
GP6
GP5
GP4
GP3

TX
RX

GP0
GP1
GP2
CTS
RTS

RX

VDD

GND

USB_N

USB_P

0.1uF
0603

C5

VDD

GND D

ID

4

VBUS

1

GND

5

D-

2

D+

3

D

US

GND

D

D

+

USB-B-Mini SMD

J1

VDD

1

OSC1

2

OSC2

3

RST

4

GP7/TxL ED

5

GP6/RxL ED

6

GP5

7

GP4

8

GP3

9

TX

10

RTS

11

RX

12

CTS

13

GP2

14

GP1

15

GP0

16

VUSB

17

D-

18

D+

19

VSS

20

VDD

OSC1

OSC2

RST

G

D

G

D

GP5

GP4

GP3

TX

RTS

R

CTS

GP2

G

G

VUS

D

D

+

SS

U1

4.7k

5%
0603

R1

RX

TX

GND

VDD

CTS

RTS

HDR M 1x6 VERT

J5

USB_N

USB_P

VIN

3

GND

1

VOUT

2

VOUT

MCP1700

U2

5V

GND

10%0.1uF

0603

C3

10%

0.1uF

0603

C2

GND

GND

123

HDR M 1x3 VERT

J2

VDD

5V

VUSB

3.3V

4.7uF
0603

C1

GND

1

23

45

6

PICkit Serial

1
2
3
4
5
67

TM

1
2
3
4
5
6
7

MCP2200 Breakout Module User’s Guide

A.2 BOARD – SCHEMATIC

VB

V

B
P0
P1

X

VI

P7/TxLE
P6/RE

A.3 BOARD – TOP SILK

Schematic and Layouts

 2012 Microchip Technology Inc. DS52064A-page 17

MCP2200 Breakout Module User’s Guide

A.4 BOARD – TOP SILK AND PADS

DS52064A-page 18  2012 Microchip Technology Inc.

A.5 BOARD – T OP COPPER

Schematic and Layouts

 2012 Microchip Technology Inc. DS52064A-page 19

MCP2200 Breakout Module User’s Guide

A.6 BOARD – BOTTOM SILK

DS52064A-page 20  2012 Microchip Technology Inc.

A.7 BOARD – BOTTOM SILK AND PADS

Schematic and Layouts

 2012 Microchip Technology Inc. DS52064A-page 21

MCP2200 Breakout Module User’s Guide

A.8 BOARD – BOTTOM COPPER

DS52064A-page 22  2012 Microchip Technology Inc.

MCP2200 BREAKOUT

MODULE USER’S GUIDE

Appendix B. Bill of Materials (BOM)

TABLE B-1: BILL OF MATERIALS

Qty. Designator Description Manufacturer Part Number

1 C1 Cap. Ceramic 4.7uF 6.3V 10% X5R 0603 TDK Corporation C1608X5R0J475K
3 C2, C3, C4 Cap. Ceramic 1UF 10% 16V X7R 0603 AVX Corporation 0603YC104KAT2A
1 C5 Cap. Ceramic 0.1uF 16V 10% X7R 0603 TDK Corporation C1608X7R1C104K
1 J1 Conn. Rcpt. USB Mini B R/A SMD Hirose Electric Co., Ltd. UX60SC-MB-5ST(80)
1 J2 Conn. Hdr. Male .100 1x3 POS Vert. TE Connectivity HDR M 1x3 Vertical
2J3, J4 DO NOT POPULATE

Conn. Hdr. Male .100 1x7 POS Vert.

1J5 DO NOT POPULATE

Conn. Hdr. Male .100 1x6 POS Vert.

1 JP1 Conn. Jumper with Handle 2 POS .100"

30 GOLD

1 PCB MCP2200 Breakout Module Printed

Circuit Board
1 R1 Res. 4.7k Ohm 1/10W 5% 0603 SMD Panasonic
1 U1 IC USB-to-UART SSOP-20 Microchip Technology Inc. MCP2200-I/SS
1 U2 IC Reg. LDO 3.3V 250 mA SOT-23-3 Microchip Technology Inc. MCP1700T-3302E/TT
1 X1 Ceramic Resonator 12.0 MHz SMD Murata Electronics

Note 1: The components listed in this Bill of Materi als are repr esent ative of the PCB assem bly. The released BOM

used in manufacturing uses all RoHS-compliant components.

TE Connectivity HDR M 1x7 Vertical

TE Connectivity HDR M 1x6 Vertical

TE Connectivity 881545-2

— 104-00393

®

- ECG ERJ-3GEYJ472V

®

CSTCE12M0G55-R0

 2012 Microchip Technology Inc. DS52064A-page 23

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11/29/11

DS52064A-page 24  2012 Microchip Technology Inc.