MCP16311/2
Synchronous Buck Converter
Evaluation Board
User’s Guide
2013 Microchip Technology Inc. DS50002111A
Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and t he lik e is provided only for your convenience
and may be su perseded by upda t es . It is y our responsibility to
ensure that your application meets with your specifications.
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Company are registered trademarks of Microchip Technology
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ECONOMON ITO R , FanSense, HI-T IDE, In-Circuit S e ri a l
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
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Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
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GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. KG, a subsidiary of
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All other trademarks mentioned herein are property of their
respective companies.
© 2013, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-62077-772-5
EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
32
logo, rfPIC, SST, SST Logo, SuperFlash
QUALITY MANAGEMENT S
DS50002111A-page 2 2013 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
Object of Declaration: MCP16311/2 Synchronous Buck Converter Evaluation Board
User’s Guide
2013 Microchip Technology Inc. DS50002111 A-page 3
MCP16311/2 Synchronous Buck Converter Evaluation Board User’s Guide
NOTES:
DS50002111A-page 4 2013 Microchip Technology Inc.
MCP16311/2 SYNCHRONOUS
BUCK CONVERTER EVALUATION
BOARD USER’S GUIDE
Table of Contents
Preface ...........................................................................................................................7
Introduction............................................................................................................7
Document Layout .................................................................................................. 7
Conventions Used in this Guide............................................................................ 8
Recommended Reading.............................................................. .. ........................9
The Microchip Web Site........................................................................................ 9
Customer Support....................... ....................................................... ...................9
Document Revision History................................................................................... 9
Chapter 1. Product Overview
1.1 Introduction ...................................................................................................11
1.2 What is the MCP16311/2 Synchronous Buck Converter
Evaluation Bo a rd ? ......... ....................................................... .................. 12
1.3 What the MCP16311/2 Synchronous Buck Converter
Evaluation Bo a rd C ontains ..................................................................... 12
Chapter 2. Installation and Operation
2.1 Introduction ...................................................................................................13
2.2 Board Featu r e s ........... ..................................................................................14
2.3 Getting Sta rted ............................................................................................. 14
Appendix A. Schematic and Layouts
A.1 Introduction ..................................................................................................17
A.2 Board – Schematic ... .................................................................... ................ 18
A.3 Board – Top Sil k ............ .............................................................................. 19
A.4 Board – Top Copper ....................................................................................19
A.5 Board – Top Copper and Silk .......................................................................20
A.6 Board – Bottom Copper ...............................................................................20
Appendix B. Bill of Materials (BOM)
Worldwide Sales and Service ....................................................................................22
2013 Microchip Technology Inc. DS50002111A-page 5
MCP16311/2 Synchronous Buck Converter Evaluation Board User’s Guide
NOTES:
DS50002111A-page 6 2013 Microchip Technology Inc.
MCP16311/2 SYNCHRONOUS BUCK
CONVERTER EVALUATION BOARD
USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the p age number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.
For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.
®
IDE online help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
MCP16311/2 Synchronous Buck Converter Evaluation Board. Items discussed in this
chapter include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the MCP16311/2 Synchronous Buck Converter
Evaluation Board as a development tool. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the MCP16311/2
Synchronous Buck Converter Evaluation Board.
• Chapter 2. “Installation and Operation” – Includes instructions on how to get
started with this user’s guide and a description of the user’s guide.
• Appendix A. “Schematic and Layouts” – Shows the schematic and layout
diagrams for the MCP16311/2 Synchronous Buck Converter Evaluation Board.
• Appendix B. “Bill of Materials (BOM)” – Lists the parts used to build the
MCP16311/2 Synchronous Buck Converter Evaluation Board.
2013 Microchip Technology Inc. DS50002111A-page 7
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