Microchip Technology MCP1630V, MCP1630 User Manual

MCP1630/MCP1630V

High-Speed, Microcontroller-Adaptable,

Pulse Width Modulator

Features

• High-S pe ed PWM Op era tion (12ns Current
Sense to Output Delay)

• Operating Temperature Range:

- -40°C to +125°C

• Precise Peak Current Limit (±5%) (MCP1630)

• Volt age M ode an d A ver age Curren t Mode Contro l
(MCP1630V)

• CMOS Output Driver (drives MOSFET driver or
low-side N-channel MOSFET directly)

• External Oscillator Input
(from PICmicro

®

Microcontroller (MCU))

• External Voltage Reference Input (for adjustable
voltage or current out put app lic at ion )

• Peak Current Mode Operation > 1 MHz

• Low Operating Current: 2.8 mA (typ.)

• Fast Output Rise and Fall Times: 5.9 ns and

6.2 ns

• Undervoltage Lockout (UVLO) Protection

• Output Short Circuit Protection

• Overtemperature Protection

Applications

• Intelligent Power Systems

• Smart Battery Charger Applications

• Multiple Output/Multiple Phase Converters

• Output V oltage Calibration

• AC Power Factor Correction

• VID Capability (programmed and cal ibrated by
PICmicro

• Buck/Boost/Buck-Boost/SEPIC/Flyback/Isolated
Converters

• Parallel Power Supplies

®

microcontroller)

Description

The MCP1630/V is a high-speed Pulse Width Modula­tor (PWM ) used t o devel op int ellige nt power syst ems.
When used with a microcontroller unit (MCU), the
MCP1630/V will control the pow er system dut y cycle to
provide output voltage or current regulation. The MCU
can be used to ad just o utput v olt age o r curren t, switc h­ing frequency, maximum duty cycle and other features
that make the power system more intelligent.

Typical applications include smart battery chargers,
intelligent power systems, brick dc/dc converters, ac
power-factor correction, multiple output power supplies,
multi-phase power supplies and more.

The MCP1630/V inputs were developed to be easily
attached to the I/O of a MCU. The MC U supplies the
oscillator and reference to the MCP1630/V to provide
the most flexible and adaptable power system. The
power system switching frequency and maximum duty
cycle are set using the I/O of the MCU. The reference
input can be external, a D/A Converter (DAC) output or
as simple as an I/ O ou tput fro m the MCU . This enab les
the power system to adapt to many external signals
and variables in order to optimize performance and
facilitate calib rati on.

When operating in Current mode, a precise limit is set
on the peak current. With the fast comparator speed
(typically 12 ns), the MCP1630 is capable of providing a
tight limit on the maximum switch current over a wide
input voltage range when compared to other high-speed
PWM controllers.

For Voltage mode or Average Current mode
applications, the MCP1630V provides a larger range for
the external ramp voltage.

Additional protection features include: UVLO,
overtemperature and overcurrent.

Related Literature

Package Type

• “MCP1630 NiMH Demo Board User’s Guide”,
Microchip Technology Inc., DS51505, 2004

• “MCP1630 Low-Cost Li- Ion Battery Charger
User’s Guide”, Microchip Technology Inc.,
DS51555, 2005

• “MCP1630 Li-Ion Multi-Bay Battery Charger
User’s Guide”, Microchip Technology Inc.,
DS51515, 2005

8-Lead DFN

(2 mm x 3 mm)

COMP

1

FB

2

CS

3

OSC IN

4

8
7
6
5

V

REF

V

IN

V

EXT

GND

COMP

FB

CS

OSC IN

8-Lead MSOP

1
2
3
4

V

8

REF

7

V

IN

6

V

EXT

5

GND

• “MCP1630 Dual Buck Demo Board User’s Guide”,
Microchip Technology Inc., DS51531, 2005

© 2005 Microchip Technology Inc. DS21896B-page 1

MCP1630/MCP1630V

Functional Block Diagram – MCP1630

MCP1630 High-Speed PWM

V

IN

Overtemperature

V

IN

0.1 µA

OSC IN

V

IN

0.1 µA
CS
COMP

V

IN

FB

–

REF

EA

+

2R

2.7V Clamp

V

Note: During overtemperat ure, V

S

+
Comp

–

EXT

R

R

driver is high-impedance.

UVLO

Note

Q

Q

Latch Truth Table

SRQ

00Qn
011
100
111

V

EXT

GND

100 kΩ

DS21896B-page 2 © 2005 Microchip Technology Inc.

Functional Block Diagram – MCP1630V

MCP1630V High-Speed PWM

V

IN

MCP1630/MCP1630V

V

Overtemperature

IN

0.1 µA

OSC IN

V

IN

0.1 µA
CS
COMP

V

IN

FB

–

REF

EA

+

2.7V Clamp

V

Note: During overtemperature, V

+
Comp

–

S

R

driver is high-impedance.

EXT

UVLO

Note

Q

Q

Latch Truth Table

SRQ

00Qn
011
100
111

V

EXT

GND

100 kΩ

© 2005 Microchip Technology Inc. DS21896B-page 3

MCP1630/MCP1630V

Typical Application Circuit – MCP1630

MCP1630 NiMH Battery Charger and Fuel Gauge Application Diagram

+8V to +15V Input Voltage

SEPIC Converter

C

C

+V

BATT

4 NiMH Cells

5.7V

+5V Bias

+V

BATT

I2C™ To System

MCP1700

3.0V

SOT23

Cin

MCP1630

V

IN

COMP

V

EXT

FB
OSC IN

V

REF

CS

GND

+5V Bias

PIC16LF818

PWM OUT

V

DD

+

A/D

A/D

1:1

N-channel
MOSFET

I

SW

1/2 MCP6042

1/2 MCP6042

C

OUT

I

BATT

3V

0V

V

DD

+

V

DD

+

DS21896B-page 4 © 2005 Microchip Technology Inc.

Typical Application Circuit - MCP1630V

Bidirectional Power Converter/Battery Charger for 4-Series Cell Li-Ion Batteries

Bidirectional Buck/Boost

MCP1630/MCP1630V

4-Cell Li-Ion
Battery Pack

+

DC Bus
Voltage

–

Boost Buck

L

Sync.

FET

Driver

Boost
Switch

REF

+

C

IN

V

SENSE

0V to 2.7V

+DC Bus V

MCP1630V

V

Comp

REF

V

FB

IN

V

CS

EXT

GND

OSC

(1/2) MCP6021

+
–

GND

R

SENSE

Battery Protection
Switches

SMBus

Charge Current Loop

Battery
Protection
and
Monitor

+2.5 V

REF

Fuse

PS501

+V

BATT

-V

BATT

Buck
Switch

+

C

OUT

I

SENSE

(1/2) MCP6021

+
–

PIC16F88

DC bus Voltage Loop

SMBus

I

Voltage (PWM)

REF

Filter

+
–

(1/2) MCP6021

© 2005 Microchip Technology Inc. DS21896B-page 5

MCP1630/MCP1630V

1.0 ELECTRICAL CHARACTERISTICS

† Notice: Stresses above those listed under “Maximum

Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the

Absolute Maximum Ratings †

operational listings of this specification is not implied.
Exposure to maximum rating conditions fo r ext ended pe riods

VDD...................................................................................6.0V

Maximum Voltage on Any Pin .. (V
V

Short Circuit Current...........................Internally Limited

EXT

- 0.3)V to (VIN + 0.3)V

GND

may affect device reliability.

Storage temperature....................... .. .... .. ..... .-65°C to +150°C

Maximum Junction Temperature, T

...........................+150°C

J

Continuous Operating T emperature Range..-40°C to +125°C

ESD protection on all pins, HBM......................................... 3kV

AC/DC CHARACTERISTICS

AC/

Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, F

for typical values= 5.0V, TA= -40°C to +125°C.

V

IN

Parameters Sym Min Typ Max Units Conditions

Input Voltage

Input Operating Voltage V
Input Quiescent Current I(V

IN

)—2.84.5mAI

IN

3.0 — 5.5 V

Oscillator Input

External Oscillator Range F
Min. Oscillator High Time

Min. Oscillator Low Time

T

OH_MIN

T

OL_MIN

Oscillator Rise Time T
Oscillator Fall Time T
Oscillator Input Voltage Low V
Oscillator Input Voltage High V
Oscillator Input Capacitance C

OSC

RISE
FALL

L
H

OSC

—— 1MHzNote 1
—10 ns

0.01 — 10 µs Note 2

0.01 — 10 µs Note 2
——0.8V

2.0 — — V
5pf

External Reference Input

Reference Voltage Input V

REF

0—VINV Note 2, Note 3

Error Amplifier

Input Offset Voltage V

OS

-4 0.1 +4 mV
Error Amplifier PSRR PSRR 80 99 — dB V
Common Mode Input Range V

GND - 0.3 — V

CM

Common Mode Rejection Ratio — 80 — dB V
Open-loop Voltage Gain A

Low-level Output V

VOL

OL

85 95 — dB RL=5kΩ to VIN/2, 100 mV < V

— 25 GND + 50 m V RL = 5 kΩ to VIN/2
Gain Bandwidth Product GBWP — 3.5 — MHz V
Error Amplifier Sink Current I

Error Amplifier Source Current I

SINK

SOURCE

511—mAV

-2 -9 — mA VIN=5V, V

Note 1: Capable of higher frequency operation depending on minimum and maximum duty cycles needed.

2: External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal

levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.

3: The reference input of the internal amplifier is capable of rail-to-rail operation.

= 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,

OSC

=0mA, F

EXT

= 3.0V to 5.0V, VCM=1.2V

IN

IN

V Note 2, Note 3

=5V, VCM= 0V to 2.5V

IN

< V

- 100 mV, VCM=1.2V

IN

=5V

IN

=5V, V

IN

V

COMP

V

COMP

OSC IN

= 1.2V, VFB=1.4V,

REF

=2.0V

= 1.2V, VFB=1.0V,

REF

= 2.0V, Absolute Value

=0Hz

EAOUT

DS21896B-page 6 © 2005 Microchip Technology Inc.

MCP1630/MCP1630V

AC/DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, VIN = 3.0V to 5.5V, F

for typical values = 5.0V, TA= -40°C to +125°C.

V

IN

Parameters Sym Min Typ Max Units Conditions

Current Sense Input

Maximum Current Sense Signal

V

CS_MAX

0.85 0.9 0.95 V Set by maximum error amplifier

MCP1630
Delay From CS to V

EXT

T

CS_VEXT

—1225ns

MCP1630
Maximum Current Sense Signal

MCP1630V

Delay From CS to V

EXT

V

CS_MAX

T

CS_VEXT

2.55 2.7 2.85 V VIN > 4.25V

— 17.5 35 ns

MCP1630V
Minimum Duty Cycle DC

Current Sense Input Bias Current I

MIN

CS_B

—— 0 %V

—-0.1— µAV

Internal Driver

P-channel R

R

DSON

R

N-channel R

DSON

Rise Time T

V

EXT

V

Fall Time T

EXT

DSon_P
DSon_N

RISE

FALL

—1030 Ω
—730Ω
— 5.9 18 ns CL= 100 pF

— 6.2 18 ns CL= 100 pF

Protection Features

Under Voltage Lockout UVLO 2.7 — 3.0 V V

Under Voltage Lockout Hysteresis UVLO
Thermal Shutdown T
Thermal Shutdown Hysteresis T

SHD_HYS

HYS

SHD

50 75 150 mV

— 150 — °C
—18—°C

Note 1: Capable of higher frequency operation depending on minimum and maximum duty cycles needed.

2: External oscillator input (OSC IN) rise and fall times between 10 ns and 10 µs used for characterization testing. Signal

levels between 0.8V and 2.0V with rise and fall times measured between 10% and 90% of maximum and minimum
values. Not production tested.

3: The reference input of the internal amplifier is capable of rail-to-rail operation.

= 1 MHz with 10% Duty Cycle, CIN = 0.1 µF,

OSC

clamp voltage, divided by 3.

Maximum CS input range limited by
comparator input common mode
range. V

V

Typical for V

Typical for V

CS_MAX=VIN

FB=VREF

=GND

CS

=5V

IN

falling, V

IN

+0.1V,

=3V

IN

=3V

IN

low state when in

EXT

UVLO

-1.4V

TEMPERATURE SPECIFICATIONS

Electrical Specifications: V

= 3.0V to 5.5V, F

IN

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Operating Junction Temperature Range T
Storage Temperature Range T
Maximum Junction Temperature T

Thermal Package Resistances

Thermal Resistance, 8L-DFN
(2 mm x 3 mm)

Thermal Resistance, 8L-MSOP θ

© 2005 Microchip Technology Inc. DS21896B-page 7

= 1 MHz with 10% Duty Cycle, CIN = 0.1 µF. TA= -40°C to +125°C.

OSC

A
A

J

θ

JA

-40 — +125 °C Steady state

-65 — +150 °C
— — +150 °C Transient

— 50.8 — °C/W Typical 4-layer board with two

interconnecting vias

JA

— 208 — °C/W Typical 4-layer board

MCP1630/MCP1630V

Amplifier Phase Shift

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and t ables provided following this note are a statistical summar y b as ed on a l im ite d n um ber of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise noted, VIN = 3.0V to 5.5V, F
values = 5.0V, T

3.5
3

2.5
2

1.5
1

0.5

Quiescent Current (mA)

IN

V

0

= -40°C to +125°C.

A

F

= DC

OSC IN

TA = - 40°C

3

3.25

3.5

TA = + 125°C

TA = + 25°C

3.7544.25

Input Voltage (V)

4.5

4.7555.25

5.5

FIGURE 2-1: Input Quiescent Current vs. Input Voltage.

4.5

F

= 1 MHz

OSC IN

4

3.5
3

2.5
2

1.5
1

Quiescent Current (mA)

0.5

IN

V

0

TA = - 40°C

3

3.25

3.5

TA = + 125°C

TA = + 25°C

3.7544.25
Input Voltage (V)

4.5

4.7555.25

5.5

= 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typic al

OSC

700

VCM = V

IN

3

3.25

TA = + 125°C

TA = - 40°C

3.5

3.7544.25

Input Voltage (V)

TA = + 85°C

4.5

4.7555.25

TA = + 25°C

Amplifier Input Bias Current

600
500
400
300

(pA)

200
100

0

-100

FIGURE 2-4: Error Amplifier Input Bias Current vs. Input Voltage.

18
16
14
12
10

8
6
4
2

Amplifier Sink Current (mA)

0

3

3.25

3.5

3.7544.25
Input Voltage (V)

TA = - 40°C

TA = + 25°C

TA = + 125°C

4.5

4.7555.25

5.5

5.5

FIGURE 2-2: Input Quiescent Current vs. Input Voltage.

2
0

-2

-4

-6

-8

-10

Amplifier Gain (db)

-12

-14

1M 10M 5M

1000000 10000000

V

= 2V

REF

R

= 4.7 k

LOAD

C

= 67 pF

LOAD

Gain

Ω

Phase

Frequency (Hz)

250

200

150

100

50

0

(degrees)

FIGURE 2-3: Error Amplifier Frequency Response.

FIGURE 2-5: Error Amplifier Sink Current vs. Input Voltage.

0

-2

-4

-6

-8

-10

-12

-14

Amplifier Source Current (mA)

3

3.5

3.25
Input Voltage (V)

TA = + 125°C

TA = + 25°C

TA = - 40°C

3.7544.25

4.5

4.7555.25

5.5

FIGURE 2-6: Error Amplifier Source Current vs. Input Voltage.

DS21896B-page 8 © 2005 Microchip Technology Inc.

MCP1630/MCP1630V

DSON

Note: Unless otherwise noted, VIN = 3.0V to 5.5V, F

values = 5.0V, T

10

9
8
7
6
5
4

Rise Time (ns)

3

EXT

2

V

1
0

FIGURE 2-7: V

= -40°C to +125°C.

A

TA = + 25°C

3

3.25

3.5

TA = + 125°C

TA = - 40°C

3.7544.25
Input Voltage (V)

EXT

4.5

Rise Time vs. Input

CL = 100 pF

4.7555.25

5.5

Voltage.

Fall Time (ns)
V

EXT

9
8
7
6
5
4

TA = + 25°C

3
2
1
0

3

3.25

3.5

TA = + 125°C

TA = - 40°C

3.7544.25
Input Voltage (V)

4.5

4.7555.25

CL = 100 pF

5.5

= 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typic al

OSC

0.9

TA = - 40°C

TA = + 125°C

TA = + 25°C

3

3.25

3.5

3.7544.25
Input Voltage (V)

4.5

4.7555.25

CS Clamp Voltage (V)

0.899

0.898

0.897

0.896

0.895

FIGURE 2-10: Current Sense Clamp Voltage vs. Input Voltage (MCP1630).

2.96

2.94

2.92

2.90

2.88

UVLO Threshold (V)

2.86

2.84

-40 -25 -10 5 20 35 50 65 80 95 110 125

Turn On Thresh old

Turn Off Thres hold

Ambient Temperature (°C)

5.5

FIGURE 2-8: V

Fall Time vs. Input

EXT

Voltage.

25

20

15

delay (ns)

EXT

10

5

CS to V

0

3

3.25

3.5

TA = + 125°C

TA = - 40°CTA = + 25°C

3.7544.25

Input Voltage (V)

4.5

4.7555.25

FIGURE 2-9: Current Sense to V
Delay vs. Input Voltage (MCP1630).

EXT

FIGURE 2-11: Undervoltage Lockout vs. Temperature.

12
10

8
6

(ohms)

4
2
0

EXT Output N-Channel R

5.5

FIGURE 2-12: EXT Output N-channel
R

DSON

3

vs. Input Voltage.

3.5

3.25

TA = + 125°C

TA = - 40°CTA = + 25°C

4

3.75

4.25

Input Voltage (V)

4.5

5

4.75

5.5

5.25

© 2005 Microchip Technology Inc. DS21896B-page 9

MCP1630/MCP1630V

DSON

Note: Unless otherwise noted, VIN = 3.0V to 5.5V, F

values = 5.0V, T

18
16
14
12
10

8

(Ohms)

6
4
2

EXT Output P-Channel R

0

= -40°C to +125°C.

A

TA = + 25°C

3

3.5

3.25

3.75

TA = + 125°C

TA = - 40°C

4

Input Voltage (V)

4.5

4.25

5

4.75

5.5

5.25

FIGURE 2-13: EXT Output P-channel
R

vs. Input Voltage.

DSON

0

-50

-100

(µV)

-150

-200

-250

Error Amp Input Offset Voltage

3

TA = + 125°C

TA = + 25°C

TA = - 40°C

3.5

3.25

3.7544.25

Input Voltage (V)

4.5

V

= 0V

CM IN

4.7555.25

5.5

= 1 MHz with 10% Duty Cycle, CIN = 0.1 µF, VIN for typic al

OSC

3

2.7

2.4

2.1

1.8

Maximum CS Inpu t (V)

1.5

33.544.555.5
Input Voltage (V)

CS Common Mode
Input Range

TA = +25°C

FIGURE 2-16: Current Sense Common Mode Input Voltage Range vs. Input Voltage (MCP1630V).

30

Delay (ns)

CS to V

EXT

25
20
15
10

5
0

3

3.25

TA = -40°C

3.5

3.7544.25
Input Voltage (V)

TA = +125°C

TA = +25°C

4.5

4.7555.25

5.5

FIGURE 2-14: Error Amplifier Input Offset Voltage vs. Input Voltage.

Error Amp Input Offset Voltage

150
100

50

0

(µV)

-50

-100

-150

-200

3

3.25

3.5

TA = + 125°C

TA = + 25°C

TA = - 40°C

3.7544.25

Input Voltage (V)

V

4.5

4.7555.25

CM IN

= 1.2V

5.5

FIGURE 2-17: Current Sense to V
Delay vs. Input Voltage (MCP1630V).

EXT

FIGURE 2-15: Error Amplifier Input Offset Voltage vs. Input Voltage.

DS21896B-page 10 © 2005 Microchip Technology Inc.

MCP1630/MCP1630V

3.0 MCP1630 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

DFN/MSOP Name Function

1 COMP Error Amplifier Output pin
2 FB Error Amplifier Inverting Input
3 CS Current Sense Input pin (MCP1630) or Voltage Ramp Input pin (MCP1630V)
4 OSC IN Oscillator Input pin
5 GND Circuit Ground pin
6V
7V
8V

EXT

IN

REF

External Driver Output pin
Input Bias pin
Reference Voltage Input pin

3.1 Error Amplifier Output Pin (COMP)

COMP is an internal error amplifier out put pin. Externa l
compensation is connected from the FB pin to the
COMP pin for control-loop stabilization. An internal
voltage clamp is used to limit the maximum COMP pin
voltage to 2.7V (typ.). This clamp is used to set the
maximum peak curr ent in t he power s ystem swit ch by
setting a maximum limit on the CS input for Peak
Current mode control systems.

3.2 Error Amplifier Inverting Input (FB)

FB is an internal error amplifier inverting input pin. The
output (v oltage or cu rrent) is se nsed and fe d back to
the FB pin for regulation. Inverting or negative
feedback is used.

3.3 Current Sensing Input (CS)

CS is the current sense input pin used for cycle-by­cycle control for Peak Current mode converters. The
MCP1630 is typically used for sensed current
applications to reduce the current sense signal, thus
reducing power dissipation.

For Voltage mode or Average Current mode
applications, a ramp is used to compare the error
amplifier output voltage with producing the PWM duty
cycle. For applicatio ns that requ ire higher sign al levels ,
the MCP1630V is used to increase the level from a
maximum of 0.9V (MCP1630) to 2.7V (MCP1630V).
The common mode voltage range for the MCP1630V
CS input is V
CS input should be less than or equal to V
all times.

-1.4V. For normal PWM operation, the

IN

- 1.4V at

IN

3.4 Oscillator Input (OSC)

OSC is an external oscillator input pin. Typically, a
microcontroller I/O pin is used to generate the OSC
input. When high, the output driver pin (V

) is driven

EXT

low. The high-to-low transition initiates the start of a
new cycle. The duty cycle of the OSC input pin deter­mines the maximum dut y c yc le of th e po w er co nv erte r.
For example, if the OS C input is low for 75% of the time
and high for 25% of the time, the duty cycle range for
the power co nverter is 0% to 75% maximum.

3.5 Ground (GND)

Connect the circuit ground to the GND pin. For most
applications, this s ho uld be connected to the analog or
quiet ground plane . Noise on thi s grou nd can af fect th e
sensitive cycle-by-cycle comparison between the CS
input and the error amplifier output.

3.6 External Driver Output Pin (V

V

is an external driver output pin, used to determine

EXT

the power system duty cycle. For high-power or high­side drives, this output should be connected to the logic­level input of the MOSFE T driver. For low-power, low­side applications, the V
drive the gate of an N-channel MOSFET.

pin can be used to dir ectly

EXT

EXT

)

3.7 Input Bias Pin (VIN)

VIN is an input voltage pin. Connect the input voltage
source to the V
on the V

0.1 µF bypass capacitor should be connected between
the V

IN

pin and the GND pin.

IN

3.8 Reference Voltage Input (V

V

is an external reference input pin used to regulate

REF

the output of the power system. By changing the V
input, the output (voltage or current) of the power sys­tem can be changed. The reference voltage can range
from 0V to V

pin. For normal opera tion, the v oltag e

IN

pin should be between +3.0V and +5.5V. A

)

REF

REF

(rail-to-rail).

IN

© 2005 Microchip Technology Inc. DS21896B-page 11

MCP1630/MCP1630V

4.0 DETAILED DESCRIPTION

4.1 Device Overview

The MCP1630 is comprised of a high-speed compara­tor, high-bandwidth amplifier and logic gates that can
be combined with a PICmicro MCU to develop an
advanced programmable power supply. The oscillator
and reference voltage inputs are generated by the
PICmicro MCU so that switching frequency, maximum
duty cycle and outpu t volta ge are programm able. Refer
to Figure 4-1.

4.2 PWM

The V
the output level of the internal high-speed comparator
and the level of the external oscillator. When the oscil­lator level is high, the PWM output (V
When the external oscillator is low, the PWM output is
determined by the output level of the internal high­speed comparator. During UVLO, the V
in the low state. During overte mperatu re o perati on, the
V

EXT

4.3 Normal Cycle by Cycle Control

The beginning of a cy cl e is def ined when OSC IN tran­sitions from a high st ate to a low state. For no rmal oper­ation, the state of the high-speed comparator output
(R) is low an d the Q
OSC IN high-to-low transition, the S and R input s to the
high-speed latch are both low and the Q output will
remain unchanged (low). The output of the OR gate
(V
turning on the internal P-channel drive transistor in the
output stage of the PWM. This will change the PWM
output (V
on the power-train external switch and ramping current
in the power-train magnetic device.

The sensed current in the magnetic device is fed into
the CS input (shown as a ramp) and increa ses lin ear ly.
Once the sensed curren t ramp (MCP16 30) reaches th e
same voltage l evel as 1 /3 of the EA ou tput, the co mpar­ator output (R) changes states (low-to-high) and resets
the PWM latch. The Q
state to a hig h state, turn ing on the N-chan nel MOSFET
in the output sta ge, which turns of f the V
external MOSFET driver terminating the duty cycle.
The OSC IN will transition from a low state to a high
state while the V
input ramp had ne ve r rea ch ed the same level as 1/3 of
the error amplifier output, the low-to-high transition on
OSC IN would terminate the duty cycle and this would
be considered maximum duty cycle. In either case,
while OSC IN is high, the V
off the external power-train switch. The next cycle will
start on the transition of the OSC IN pin from a high
state to a low state.

output of the MCP1 630/V is det ermined by

EXT

) is forced low .

EXT

EXT

pin is high-impedance (100 kΩ to ground).

output of the latch is low. On the

) will transition from a high state to a low state,

DRIVE

) from a low state to a high state, turning

EXT

output transitions from a low

EXT

pin remains unchanged. If the CS

EXT

drive pin is low, turning

EXT

pin is held

drive to the

For Voltage mode or Averag e Current mode appli ca­tions that utili ze a large signal ra mp at the CS in put, th e
MCP1630V is used to provide more signal (2.7V typ.).
The operation of the PWM does not change.

4.4 Error Amp/Comparator Current Limit Function

The internal amplifier is used to create an error output
signal that is dete rmined by the ext ernal V
the power supply output fed back into the FB pin. The
error amplifier output is rail-to-rail and clamped by a
precision 2.7V. The output of the error amplifier is then
divided down 3:1 (MCP1630) and connected to the
inverting input of the hi gh-speed comp ar ator. Since the
maximum output of th e error ampl ifier i s 2.7V, the max­imum input t o t he i nve r t ing p in o f t h e hi gh- s pe ed co m­parator is 0.9V. This sets the peak current limit for the
switching power supply.

For the MCP1630V, the maximum error amplifier out­put is still 2.7V. However, the resistor divider is
removed, raising the max im um inp ut s ig nal lev el at th e
high-speed comparator inverting input (CS) to 2.7V.

As the output load c urrent de mand i ncrea ses, th e error
amplifier output increases, causing the inverting input
pin of the high-speed comparator to increase.
Eventually, the output of the error amplifier will hit the

2.7V clamp, limiting the input of the high-speed com-

parator to 0.9V max (MCP1630). Even if the FB input
continues to decrease (calling for more current), the
inverting input is li mited to 0.9V . By limiting the inve rting
input to 0.9V, the current-sense input (CS) is limited to

0.9V, thus limiting the output current of the power

supply.
For Vo lta ge mo de co ntro l, the error a mplif ier ou tput w ill

increase as input volt age decreas es. A vo ltag e ramp i s
used instead of sensed indu ctor curre nt at the C S input
of the MCP1630V. The 3:1 internal error amplifier out­put resistor divid er is removed in the MCP163 0V option
to increase the maximum signal level input to 2.7V
(typ.).

4.5 0% Duty Cycle Operation

The duty cycle of the V
ing 0% when the FB pi n is held highe r than the V
(inverting error amplifier). This is accomplished by the
rail-to-rail output capability of the error amplifier and the
offset voltage of the high-speed comparator. The mini­mum error amplifier outpu t vo lt a ge, divided by three, is
less than the offset voltage of the high-speed compar­ator. In the case where the output v oltage of t he con­verter is above the desired regulation point, the FB
input will be above the V
fier will be pulled to the bottom rail (GND). This low
voltage is divided down 3:1 by the 2R and 1R resistor
(MCP1630) and connected to the input of the high­speed comparator. This voltage will be low enough so
that there is no triggering of the comparator, allowing
narrow pulse widths at V

output is capable of reach-

EXT

input and the error ampli-

REF

.

EXT

input and

REF

REF

pin

DS21896B-page 12 © 2005 Microchip Technology Inc.

MCP1630/MCP1630V

4.6 Undervoltage Lockout (UVLO)

When the input voltage (VIN) is less than the UVLO
threshold, the V
ensure that, if the voltage is not adequate to operate
the MCP1630/V, the main power supply switch will be
held in the off state. When the UVLO threshold is
exceeded, there is some hy steresis i n the in put volt age
prior to the UVLO off threshold being reached. The
typical hysteresi s is 7 5 mV . T yp ically, the MCP1630 will
not start operating until the input voltage at V
between 3.0V and 3.1V.

is held in the low state. This will

EXT

is

IN

4.7 Overtemperature Protection

To protect the V
MCP1630/V V
junction temperature is above the thermal shutdown
threshold. There is an internal 100 kΩ pull-down resis­tor connected from V
pull-down during overtemperature conditions. The
protection is set to 150°C (typ.), with a hysteresis of
18°C.

output if shorted to VIN or GND, the

EXT

output will be high-impedance if the

EXT

to ground to provide some

EXT

© 2005 Microchip Technology Inc. DS21896B-page 13

MCP1630/MCP1630V

MCP1630 High-Speed PWM Timing Diagram

OSC IN

S

COMP

CS

R

Q

V

DRIVE

V

EXT

0.1 µA

OSC IN

CS
COMP

FB

V

REF

V

–

IN

EA

+

V

IN

0.1 µA

V

IN

2R

2.7V Clamp

+
Comp

–

R

V

IN

Overtemperature

UVLO

V

EXT

Note

S

Q

GND

100 kΩ

R

Q

Latch Truth Table

SRQ

00Qn
011
100
111

Note: During overtemperature, V

driver is high-impedance.

EXT

FIGURE 4-1: Cycle-by-Cycle Timing Diagram (MCP1630).

DS21896B-page 14 © 2005 Microchip Technology Inc.

OSC IN

COMP

CS

V

DRIVE

MCP1630/MCP1630V

MCP1630V High-Speed PWM Timing Diagram

S

R

Q

V

EXT

OSC IN

FB

V

0.1 µA

CS
COMP

REF

V

–
+

IN

EA

V

IN

0.1 µA

V

IN

2.7V Clamp

+
Comp

–

V

IN

Overtemperature

UVLO

V

V

DRIVE

EXT

Note

S

Q

GND

100 kΩ

R

Q

Latch Truth Table

SRQ

00Qn
011
100
111

Note: During overtemperature, V

driver is high-impedance.

EXT

FIGURE 4-2: Cycle-by-Cycle Timing Diagram (MCP1630V).

© 2005 Microchip Technology Inc. DS21896B-page 15

MCP1630/MCP1630V

5.0 APPLICATION CIRCUITS/ISSUES

5.1 Typical Applications

The MCP1630/V hig h-speed PWM can be used for any
circuit topology and power-train application when
combined with a microcontroller. Intelligent, cost­effective power systems can be developed for applica­tions that require multiple outputs, multiple phases,
adjustable outputs, temperature monitoring and
calibration.

5.2 NiMH Battery Charger Application

A typical NiMH battery charger application is shown in
the “Typical Application Circuit – MCP1630” of this
data sheet. In that example, a Single-Ended P rimary
Inductive Converter (SEPIC) is used to provide a
constant charge current to the series-connected
batteries. The MCP1630 is used to regulate the charge
current by monitoring the current through the battery
sense resistor and providing the proper pulse width.

The PIC16F818 monitors the batt ery voltage to pro vide
a termination to the c harg e c urre nt. Addi tio nal fea ture s
(trickle charge, fast charge, overvoltage protection,
etc.) can be added to the sy stem using the programm a­bility of the microcontroller and the flexibility of the
MCP1630.

5.3 Bidirectional Power Converter

A bidirect ional Li-Io n charger/ buck regul ator is show n
in the “Typical Application Circuit” of the this data
sheet. In this example, a synchronous, bidirectional
power converter example is shown using the
MCP1630V. In this application, when the ac-dc input
power is present, the bidirectional power converter is
used to charge 4-series Li-Ion batteries by boo sting th e
input voltage. When ac-dc power is removed, the
bidirectional power conv erter bu cks th e battery volt age
down to provide a dc bus for system power. By using
this method, a single power train is capable of charging
4-series ce ll Li-Ion batt eries and effici ently convert ing
the battery voltage down to a low, usable voltage.

5.4 Multiple Output Converters

By using additional MCP1630 devices, multiple output
converters can be developed using a single MCU. If a
two-output converter is desired, the MCU can provide
two PWM outp uts that are phased 180° apart. This will
reduce the input ripple current to the source and
eliminate beat frequencies .

DS21896B-page 16 © 2005 Microchip Technology Inc.

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

8-Lead MSOP

XXXXX

YWWNNN

MCP1630/MCP1630V

Example:

1630E

522256

Example:

1630VE
522256

8-Lead DFN (2 mm x 3 mm)

XXX

YWW

NN

For DFN samples, cont act your Microc hip Sales Of fice for availability..

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code

3

e

Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Mic rochip part nu mber ca nnot be m arked o n one lin e, it will

be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

Example:

ABC

522

25

3

e

© 2005 Microchip Technology Inc. DS21896B-page 17

MCP1630/MCP1630V

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

E

E1

p

D

2

B

n 1

α

L

8

.033

.006
.012

A

φ

A1

MAX NOM

--

.043
.037
.006

-

.031

.009

.016

-

MIN

15°
15°

0.75

0.00

0.40

0.08

0.22

c

(F)

β

Dimension Limits

Units

Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length

Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom

*Controlling Parameter
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

MIN

n
p

A

A2

A1

E

E1

D

L

φ

c

B

α
β

INCHES

NOM

.026 BSC

.030
.000

.193 TYP.
.118 BSC
.118 BSC

.016 .024

.037 REFFFootprint (Reference)

0° - 8°

.003

.009

5°
5° -

MILLIMETERS*

8

0.65 BSC

--

0.85

4.90 BSC

3.00 BSC

3.00 BSC

0.60

0.95 REF

0°

MAX

-

-

-

-

A2

1.10

0.95

0.15

0.80

8°

0.23

0.40
15°5° ­15°5° -

DS21896B-page 18 © 2005 Microchip Technology Inc.

MCP1630/MCP1630V

8-Lead Plastic Dual Flat No Lead Package (MC) 2x3x0.9 mm Body (DFN) – Saw Singulated

For DFN samples, contact your Microchip Sales Office for availability..

p

D

b

n

L

E

EXPOSED

PIN 1

ID INDEX

AREA

(NOTE 2)

A3

Number of Pins
Pitch
Overall Height
Standoff

Overall Length
Exposed Pad Length
Overall Width
Exposed Pad Width
Contact Width
Contact Length

TOP VIEW

Dimension Limits

(Note 3)

(Note 3)

Units

n
p

A

A1

A3Contact Thickness

D

D2

E

E2

b
L

A

A1

MIN

.031

.000

.055

.047
.008
.012

METAL

PAD

(NOTE 1)

INCHES

NOM

.020 BSC

.035

.079 BSC

.065

.118 BSC

.059
.010
.016

EXPOSED

TIE BAR

8

.001

D2

BOTTOM VIEW

MAX

.039
.002

.067

.061
.012
.020

*Controlling Parameter
Notes:

1. BSC: Basic Dimension. Theoretically exact value shown without tolerances.
See ASME Y14.5 M

2. REF: Reference Dimension, usually without tolerance, for information purposes only.
See ASME Y14.5 M

Exposed pad varies according to die attach paddle size.

Package may have one or more exposed tie bars at ends.
Pin 1 visual index feature may vary, but must be located within the hatched area.

JEDEC equivalent: M0-229

Drawing No. C04-123, Revised 05-05-05

2 1

MIN

0.80

1.39

1.20

0.20

0.30

E2

MILLIMETERS*

NOM

8

0.50 BSC

0.90

0.020.00

0.20 REF..008 REF.

2.00 BSC

1.65

3.00 BSC

1.50

0.25

0.40

MAX

1.00

0.05

1.70

1.55

0.30

0.50

© 2005 Microchip Technology Inc. DS21896B-page 19

MCP1630/MCP1630V

NOTES:

DS21896B-page 20 © 2005 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision B (June 2005)

The following is the list of modifications:

1. Added MCP1630V device information
throughout data sheet

2. Added DFN package information throughout
data sheet.

3. Added Appendix A: Revision History.

Revision A (June 2004)

• Original Release of this Document .

MCP1630/MCP1630V

© 2005 Microchip Technology Inc. DS21896B-page 21

MCP1630/MCP1630V

NOTES:

DS21896B-page 22 © 2005 Microchip Technology Inc.

MCP1630/MCP1630V

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX

Device

PackageTemperature

Range

Device: MCP1630: High-Speed, Microcontroller-Adaptable,

MCP1630T: High-Speed, Microcontroller-Adaptable,

Temperature Range: E = -40°C to +125°C

Package: MC *= Dual Flat, No Lead (2x3mm Body), 8-lead

MS = Plastic MSOP, 8-lead
* For DFN samples, contact your Microchip Sales Office for

availability.

PWM
PWM (Tape and Reel)

Examples:

a) MCP1630-E/MS: Extended Temperature,
b) MCP1630T-E/MS: Tape and Reel

c) MCP1630-E/MC: Extended Temperature,

a) MCP1630V-E/MS: Extended Temperature,
b) MCP1630VT-E/MS: Tape and Reel

c) MCP1630V-E/MC: Extended Temperature,

8LD MSOP package.
Extended Temperature,

8LD MSOP package.
8LD DFN package.

8LD MSOP package.
Extended Temperature,

8LD MSOP package.
8LD DFN package.

© 2005 Microchip Technology Inc. DS21896B-page 23

MCP1630/MCP1630V

NOTES:

DS21896B-page 24 © 2005 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WAR­RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of M icrochip’s prod ucts as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

EELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSma rt , rfP IC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Linear Active Thermistor,
MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDE M,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB , rfPICD EM , Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

8-bit MCUs, KEELOQ

®

code hopping

© 2005 Microchip Technology Inc. DS21896B-page 25

WORLDWIDE SALES AND SERVICE

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DS21896B-page 26 © 2005 Microchip Technology Inc.

Mouser Electronics

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