Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIE DBYDNV
== ISO/TS16949==
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, flexPWR, JukeBlox, K
LANCheck, MediaLB, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, PICSTART, PIC
SST, SST Logo, SuperFlash and UNI/O are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
The Embedded Control Solutions Company and mTouch are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, BodyCom, chipKIT, chipKIT logo,
CodeGuard, dsPICDEM, dsPICDEM.net, ECAN, In-Circuit
Serial Programming, ICSP, Inter-Chip Connectivity, KleerNet,
KleerNet logo, MiWi, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
RightTouch logo, REAL ICE, SQI, Serial Quad I/O, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
DS50002375A-page 2 2015 Microchip Technology Inc.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
Object of Declaration: HV7351 Ultrasound Tx Beamformer Evaluation Board
DS50002375A-page 6 2015 Microchip Technology Inc.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.
®
IDE online help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
HV7351 Ultrasound Tx Beamformer Evaluation Board. Items discussed in this chapter
include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Web Site
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the HV7351 Ultrasound Tx Beamformer
Evaluation Board as a development tool to emulate and debug firmware on a target
board. The manual layout is as follows:
• Chapter 1. “Product Overview” – Important information about the HV7351
Ultrasound Tx Beamformer Evaluation Board.
• Chapter 2. “Installation and Operation” – This chapter includes a detailed
description of each function of the demonstration board and instructions on how to
begin using the board.
Choice of mutually exclusive
arguments; an OR selection
Represents code supplied by
user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options]
errorlevel {0|1}
var_name...]
void main (void)
{ ...
}
DS50002375A-page 8 2015 Microchip Technology Inc.
RECOMMENDED READING
This user’s guide describes how to utilize the HV7351 Ultrasound Tx Beamformer
Evaluation Board. Another useful document is listed below. The following Microchip
document is available and recommended as a supplemental reference resource.
• HV7351 Data Sheet – “8-Channel ±70V 3A Programmable High Voltage
Ultrasound Transmit Beamformer” (DS20005412).
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives
Preface
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at:
DS50002375A-page 10 2015 Microchip Technology Inc.
Chapter 1. Product Overview
1.1INTRODUCTION
This chapter discusses the following topics:
• HV7351 Device Overview
• Board Overview
• What the HV7351 Ultrasound Tx Beamformer Evaluation Board Kit Includes
1.2HV7351 DEVICE OVERVIEW
The Microchip Technology Inc. HV7351 is a monolithic, eight channel, high-speed,
high-voltage ultrasound transmitter Return-To-Zero (RTZ) programmable pulser. This
integrated, high-performance circuit comes in a single 11 x 11 x 0.9 mm, 80-lead DFN
package.
Each channel is capable of swinging up to ±70V with an active discharge back to 0V.
The outputs can source and sink more than 3A to achieve fast output rise and fall times.
The active discharge is also capable of sourcing and sinking 3A for a fast return to
ground. The digital beamforming topology of the HV7351 will significantly reduce the
number of I/O logic control lines to the transmitter.
Each output is controlled by a 16 or 32-bit serial shift register. An arbitrary pattern can
be generated depending on what is loaded into the shift registers, including four
independent pattern options.
Once the patterns are loaded, the user can quickly select any of the four predefined
patterns without having to clock in new data. A programmable 10-bit delay counter is
provided for each output. This allows the user to program different delay times for each
channel for beamforming.
HV7351
ULTRASOUND TX BEAMFORMER
EVALUATION BOARD USER’S GUIDE
1.3BOARD OVERVIEW
There are two built-in Complex Programmable Logic Devices (CPLDs) and one serial
EEPROM on the board to provide multiple demo waveform patterns. Other custom
experimental data can be easily downloaded to these CPLDs/PROMs via the 6-pin
Joint Test Action Group (JTAG) interface.
The HV7351 Board output waveforms can be directly displayed using an oscilloscope,
by connecting the scope probe to the test points TX1 - TX8 and GND. The soldering
jumper can select whether or not to connect the on-board dummy-load, a 330 pF
capacitor paralleling with a 2.5 k resistor. The test points can be used to connect the
user’s transducer to easily evaluate the pulser.
DS50002375A-page 14 2015 Microchip Technology Inc.
EVALUATION BOARD USER’S GUIDE
Chapter 2. Installation and Operation
2.1GETTING STARTED
The HV7351 Ultrasound Tx Beamformer Evaluation Board is fully assembled and
tested. The board requires external voltage sources.
2.1.1 Additional Tools Required for Operation
• A DC power supply, a bench supply that can produce 3.3V, 5V, -5V, 12V, -12V,
70V and -70V
• An oscilloscope and/or a multi-meter to observe the waveforms and measure
electrical parameters
2.2SETUP PROCEDURE
To operate the HV7351 Ultrasound Tx Beamformer Evaluation Board, the following
steps must be followed:
HV7351
ULTRASOUND TX BEAMFORMER
WARNING
Read the HV7351 Ultrasound Tx Beamformer Evaluation Board User’s Guide (this
document) fully before proceeding to board setup.
1. Connect the supplies correctly to the board as shown in Figure 2-1.
2. Set the voltages and current limits of the supply rails according to Ta bl e 2 - 1,
before connecting the power connector J4.
TABLE 2-1:POWER CONNECTOR DESCRIPTION
PinNameDescription
1VCC +3.3V Logic voltage input for V
2GND 0V, Ground
3VDD +5.0V HV7351 Board positive V
4VSS-5.0V HV7351 Board negative V
5VRN -5.0V to -12V HV7351 Board negative regulator supply, 50 mA
6VRP+5.0V to +12V HV7351 Board positive regulator supply, 50 mA
7GND 0V, Ground
8VNN -3.0V to -70V negative high-voltage supply, 10 mA to 50 mA (Note 1)
9GND 0V, Ground
10VPP+3.0V to +70V positive high-voltage supply, 10 mA to 50 mA (Note 1)
Note 1:The current limits given for V
program in which B/CW-mode transmission is limited to about 16 cycles.
If the user reprograms the CPLD for more CW cycles, the current limits
need to be similarly increased.
Carefully double-check the voltage of every supply rail, current-limit value and
polarity individually to avoid board damage.
Take extreme care while connecting the supplies to the board since
connecting them incorrectly to the wrong pins could result in permanent
damage to the entire board.
2.3EVALUATING THE HV7351 ULTRASOUND TX BEAMFORMER EVALUATION
BOARD
The best way to evaluate the HV7351 Ultrasound Tx Beamformer Evaluation Board is
to explore the circuit and measure the voltages and currents with a Digital Voltage
Meter (DVM) while probing the board with an oscilloscope.
2.4NORMAL OPERATION
The HV7351 Ultrasound Tx Beamformer Evaluation Board should be powered up with
multiple lab DC power supplies that feature current-limiting functions.
To meet the typical loading condition when using the high-impedance probe of an
oscilloscope, the on-board dummy load (330 pF||2.5 k) should be connected to the
high-voltage pulser output through the solder jumper. To evaluate different loading
conditions, the values of the RC may be changed within the current and power limits of
the device.
In order to drive the user’s piezoelectric transducers with a cable, the output load
impedance should be properly matched to avoid cable and transducer reflections.
A 70 to 75 k coaxial cable is recommended. The coaxial cable end should be
soldered to the TX1 - TX8 and GND directly with very short leads. If the user’s load is
being used, the on-board dummy load should be disconnected by cutting the small
shorting copper trace in between the 0k resistors (R8, R12, R29, R30, R10, R37, R52
and R53) and the eight resistor pads. They are shorted by factory default.
All on-board test points are designed to work with the high-impedance probe of an
oscilloscope. Some probes may have limited input voltage range. When using the
probe on these high-voltage test points, make sure that the V
exceed the probe limit. When using the high-impedance oscilloscope probe on the
on-board test points, it is important to have short ground leads to the circuit board
ground plane.
PP/VNN
voltages do not
DS50002375A-page 18 2015 Microchip Technology Inc.
The large thermal pad at the bottom of the HV7351 package is internally connected to
the IC’s substrate (V
externally on the PCB. The designer needs to pay attention to the connecting traces on
the outputs TX1 - TX8, specifically the high-voltage and high-speed traces. In
particular, controlled impedance to ground plane and more trace spacing needs to be
applied in such situations.
High-speed PCB trace design practices that are compatible with about
50 MHz to 100 MHz operating speeds are used for the HV7351 PCB layout. The
internal circuitry of the HV7351 can operate at rather high frequencies, the primary
speed limitation being the load capacitance.
Because of the high-speed and high-transient currents that result when driving
capacitive loads, the supply-voltage bypass capacitors should be as close to the pins
as possible. The GND pin should have low inductance feed-through via connections
that are soldered directly to a solid ground plane.
The device’s V
supplies and bypass capacitors pins must have a ceramic capacitor per pin and be
placed close to the pin. A ceramic capacitor of 1.0 µF may be used. Only the V
V
to GND capacitors need to be high-voltage type. The VPF to VPP and VNF to VNN
NN
capacitors can be low-voltage.
It is advisable to minimize the trace length to the ground plane and to insert a ferrite
bead in the power supply lead to the capacitor to prevent resonance within the power
supply lines. For applications that are sensitive to jitter and noise, and when using
multiple HV7351 ICs, another ferrite bead between each of the chip’s supply line should
be inserted.
To reduce inductance, special attention should be paid to minimizing trace lengths and
using sufficient trace width. Surface mount components are highly recommended.
Since the output impedance of the HV7351 high-voltage power stages is very low, in
some cases it may be desirable to add a small value resistor in series with the output
TX1 - TX8. This results in obtaining better waveform integrity at the load terminals after
long cables and will also reduce the output voltage slew rate at the terminals of a
capacitive load.
Special attention should be paid to the parasitic coupling from the outputs to the input
signal terminals of the HV7351. This feedback may cause oscillations or spurious
waveform shapes on the edges of signal transitions. Since the input operates with
signals down to 3.3V, even small coupling voltages may cause problems. The use of a
solid ground plane and good power and signal layout practices will prevent this
problem.
It should also be ensured that the circulating ground return current from the capacitive
load cannot react with common inductance to create noise voltages in the input
circuitry.
, AVDD, DVDD, PVDD, PVSS, VPP, VNN, VPF, VNF and VRN voltage
LL
). This thermal pad should be connected to 0V or GND