Microchip Technology EVB-SEC1210, EVB-SEC1212-DEV, EVB-SEC1110 User Manual

EVB-SEC1110/EVB-SEC1210/

EVB-SEC1212-DEV

Evaluation Board User’s Guide

 2013 Microchip Technology Inc. DS00001574A

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, K
PICSTART, PIC
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.

FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.

Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their
respective companies.

© 2013, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

ISBN: 9781620774649

EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,

32

logo, rfPIC, SST, SST Logo, SuperFlash

QUALITY MANAGEMENT S

 2013 Microchip Technology Inc. DS00001574A-page 2

Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

Object of Declaration:

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV User’s Guide

 2013 Microchip Technology Inc. DS00001574A-page 3

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

NOTES:

DS00001574A-page 4  2013 Microchip Technology Inc.

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

EVALUATION BOARD

USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 7

Conventions Used in this Guide ............................................................................ 8

The Microchip Web Site ........................................................................................ 9

Development Systems Customer Change Notification Service ............................ 9

Customer Support ................................................................................................. 9

Document Revision History ................................................................................. 10

Chapter 1. Introduction

1.1 SEC1110 Features ....................................................................................... 11

1.1.1 Smartcard .................................................................................................. 11

1.1.2 USB ........................................................................................................... 11

1.2 SEC1210 Features ....................................................................................... 12

1.2.1 SPI1 ........................................................................................................... 12

1.2.2 UART ......................................................................................................... 12

1.3 SEC1212-DEV Features .............................................................................. 12

1.4 Directory structure ........................................................................................ 13

Chapter 2. EVBPCBA Documentation

2.5 EVB-SEC2112-DEV ..................................................................................... 14

2.5.1 Board Layout ............................................................................................. 16

2.5.2 Inserting a Chip into the Socket ................................................................ 17

2.5.3 Connector Description ............................................................................... 17

2.5.4 Switch Description ..................................................................................... 20

2.5.5 Test Points Description ............................................................................. 20

2.5.6 Bond Options ............................................................................................. 20

2.5.7 Selecting the Code Fetch Source .............................................................. 21

2.6 EVB-SEC1210 .............................................................................................. 21

2.6.1 Placing a Chip in the Socket ..................................................................... 22

2.6.2 Connector Description ............................................................................... 23

2.7 EVB-SEC1110 .............................................................................................. 24

2.7.1 Placing a Chip in the Socket ..................................................................... 25

2.7.2 Connector Description ............................................................................... 26

Chapter 3. CCID Firmware

3.8 Features ....................................................................................................... 27

3.9 Single Slot CCID Firmware .......................................................................... 27

3.10 Dual Slot CCID Firmware ........................................................................... 27

3.11 Smartcard Reader Driver Installation under Windows ............................... 27

Chapter 4. Checking Device Firmware Revision

Chapter 5. OTP Programming Procedures

Chapter 6. SPI Programming Procedures

 2013 Microchip Technology Inc. DS00001574A-page 5

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

Worldwide Sales and Service .....................................................................................41

DS00001574A-page 6  2013 Microchip Technology Inc.

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

EVALUATION BOARD USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXA”, where “XXXXX” is the document number and “A” is the revision level of the
document.

For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.

®

IDE online help.

 2013 Microchip Technology Inc. DS00001574A-page 7

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB® IDE User’s Guide

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog
A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with
right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe
character: { | }

Ellipses... Replaces repeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the total number of
digits, R is the radix and n is a
digit.

Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’

Choice of mutually exclusive
arguments; an OR selection

Represents code supplied by
user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]
errorlevel {0|1}

var_name...]
void main (void)

{ ...
}

DS00001574A-page 8  2013 Microchip Technology Inc.

Preface

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web
site is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the web site contains the following
information:

• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program
member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives

DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.

To register, access the Microchip web site at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.

The Development Systems product group categories are:

• Compilers – The latest information on Microchip C compilers, assemblers, linkers

and other language tools. These include all MPLAB C compilers; all MPLAB
assemblers (including MPASM assembler); all MPLAB linkers (including MPLINK
object linker); and all MPLAB librarians (including MPLIB object librarian).

• Emulators – The latest information on Microchip in-circuit emulators.This

includes the MPLAB REAL ICE and MPLAB ICE 2000 in-circuit emulators.

• In-Circuit Debuggers – The latest information on the Microchip in-circuit

debuggers. This includes MPLAB ICD 3 in-circuit debuggers and PICkit 3 debug
express.

• MPLAB IDE – The latest information on Microchip MPLAB IDE, the Windows

Integrated Development Environment for development systems tools. This list is
focused on the MPLAB IDE, MPLAB IDE Project Manager, MPLAB Editor and
MPLAB SIM simulator, as well as general editing and debugging features.

• Programmers – The latest information on Microchip programmers. These include

production programmers such as MPLAB REAL ICE in-circuit emulator, MPLAB
ICD 3 in-circuit debugger and MPLAB PM3 device programmers. Also included
are nonproduction development programmers such as PICSTART Plus and
PIC-kit 2 and 3.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

 2013 Microchip Technology Inc. DS00001574A-page 9

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.

Technical support is available through the web site at:

http://www.microchip.com/support

DOCUMENT REVISION HISTORY

Revision A (September 2013)

• Initial Release of this Document.

DS00001574A-page 10  2013 Microchip Technology Inc.

Chapter 1. Introduction

The SEC1110/SEC1210/SEC1212-DEV is a family low power, OEM configurable, sin­gle-chip smartcard reader solutions. Three evaluation boards (EVBs) are available for
device development:

• EVB-SEC2112-DEV

• EVB-SEC1210

• EVB-SEC1110

These EVBs demonstrate standalone solutions with all of the interfaces and features
listed the following sub-sections. For details on each individual EVB, refer to Chapter 2.

1.1 SEC1110 FEATURES

1.1.1 Smartcard

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

EVALUATION BOARD USER’S GUIDE

• Single Smartcard slot

• Fully compliant with the ISO/IEC 7816, EMV and PC/SC standards

• Versatile ETU rate generation, supporting current and proposed rates (to 861
Kbps and beyond)

• Full support of both T=0 and T=1 protocols

• Full-packet FIFO (259 bytes) for transmit and receive

• Half-Duplex operation, with no software intervention required between transmit
and receive phases of an exchange

• Very loose real-time response required of software

• (worst case scenario of approximately 180 ms)

• Dynamically programmable FIFO threshold, with byte granularity

• Time-out FIFO flush interrupt, independent of threshold

• Programmable Smart Card clock frequency

• UART-like register file structure

• Supports Class A, Class B, Class C, or Class AB Smart Cards (all 1.8 V, 3 V and
5 V cards)

• Automatic Character Repetition for T=0 protocol Parity Error recovery

• Automatic card deactivation on card removal and on other system events, includ­ing persistent Parity Errors

1.1.2 USB

• Supports Full-Speed data transfer

• Endpoints can be configured for control, bulk & interrupt transfer types

• Max packet size configurable for each endpoint

• (8 / 16/ 32/ 64 bytes are allowed)

• Ping pong buffers supported for non-control endpoints

 2013 Microchip Technology Inc. DS00001574A-page 11

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

• Supports Suspend, Resume, and Remote Wakeup per the USB specification
requirements

• Endpoint buffer may be located anywhere in the 1.5K SRAM, as per the alignment
requirements based on the max packet size

1.2 SEC1210 FEATURES

Along with the features mentioned in Section 1.1, the SEC1210 includes two Smartcard
slots and the following additional features:

1.2.1 SPI1

• Supports full-duplex mode

• Supports master or slave mode

• Supports seven SPI1 Master baud rates

• Slave Clock rate up to spi1_clk/8

• Serial clock with programmable polarity and phase

• Master Mode fault error flag with MCU interrupt capability

• Write collision flag protection

• Byte Transfer/Receive APIs

• Bulk Transfer/ Receive APIs

• Simultaneous Transfer/ Receive APIs

1.2.2 UART

• Software compatible with Standard 16C450 and 16C550A

• Separate 16 byte FIFO for transmission and reception

- Prevents buffer overrun

- Helps software to be less time critical in handling transmission / reception

• Programmable baud rate generator - Up to 3 Mbps baud rate can be achieved

• Supports flow control using RTS / CTS signals

• Pin Polarity control

• Programmable communication parameters:

- Word length - 5, 6, 7, 8 bits

- Stop bits - 1, 1.5, 2 bits

- Parity - None, Odd, Even, Mark, Space

• Low power sleep mode available

Note: A voltage level shifter board / cable is required to connect the UART port to

the PC. An FTDI cable is used for this.

1.3 SEC1212-DEV FEATURES

Along with the features mentioned in section 1.1 and1.2 the following modules are also
available in the SEC1212-DEV:

• Boot from SPI2 Interface

• The SVB is equipped with a 1Kbyte Atmel SPI flash (AT26DF081A-SSU). SPI
flash from Atmel and Windbond are supported.

• On-board RS232 Transceiver for debugging as well as RS232 host interface

• On-board Reset button

• On-board EDP header for f/w debugging.

• On-board JTAG header for entering ASIC test mode and debugging

DS00001574A-page 12  2013 Microchip Technology Inc.

1.4 DIRECTORY STRUCTURE

The EVB-SEC2112-DEV release package provides the following file/folder structure:

EVB Schematics & BOM

Contains EVB schematics and BOM

SW Tools/WinUSB Driver

This is the device driver required for BootROM USB Device

SW Tools/OTPProgrammer

Contains the OTP programming utility and user manual

SW Tools/Linux Libraries

Contains the required Linux libraries

SW Tools/SPIFlashUtitly

Contains utility to program the SEC1212-DEV SPI2 flash and the relevant user manual.

Firmware

This folder contains the firmware binary files for programming into the OTP / SPI Flash.
Filenames with "SPI2" are intended to be programmed onto the SPI flash using SPI­FlashWriter application. Filenames with "OTP" are intended to be programmed onto
the OTP using OTPProgrammer application. Similarly, "SINGLESLOT" or
"DUALSLOT" in the file name indicates a single slot or dual slot reader, respectively.

Introduction

 2013 Microchip Technology Inc. DS00001574A-page 13

Chapter 2. EVBPCBA Documentation

This chapter details the evaluation boards available for the SEC family of ASIC's and
their hardware settings. A standard USB A-to-B cable is required to connect the EVB
to the USB Host.

2.5 EVB-SEC2112-DEV

The EVB-SEC2112-DEV includes a 48-pin QFN SEC1212-DEV with the following
interfaces and features:

• USB host interface

• Two smartcard slots

• SPI1

• SPI2 Code execution (Either from external or on board flash)

•UART

• Input bond options allow a single chip to function as either an SEC1110 or
SEC1210.

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

EVALUATION BOARD USER’S GUIDE

 2013 Microchip Technology Inc. DS00001574A-page 14

EVBPCBA Documentation

FIGURE 2-1: EVB-SEC2112-DEV PROTOTYPE COMPONENT SIDE TOP LAYER

 2013 Microchip Technology Inc. DS00001574A-page 15

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

2.5.1 Board Layout

Please follow this legend to understand the following figure.

1. In each header, Pin 1 is represented by a thick band near the edge.

2. Pins filled in dark red indicate they are to be shorted by a jumper.

FIGURE 2-2: DEFAULT BOARD SETUP TO RUN FROM OTP USING INTERNAL OSCILLATOR

IN SEC1212-DEV (QFN48) MODE

DS00001574A-page 16  2013 Microchip Technology Inc.

EVBPCBA Documentation

2.5.2 Inserting a Chip into the Socket

This section is applicable only if the ASIC is not directly soldered on the PCB and the
EVB is equipped with a socket. The following guidelines must be followed when replac­ing the ASIC in the socket.

Place the ASIC in the socket in such a way that the Pin1 marking (dot) on the ASIC and
the socket Pin1 marking on the PCB (triangle) align, as shown in Figure 2-3.

Note: The socket is manufactured by R&D Interconnect (P/N: 106458-0020).

FIGURE 2-3: EVB-SEC2112-DEV PIN 1 SOCKET ALIGNMENT

2.5.3 Connector Description

Note: The board’s default settings are indicated in the Settings column.

Connector Description Settings

J2 Self/Bus Power Header

J3 Power IN 1-2 Short (default)

J4 5V_DUT 1-2 Short (default)

J9 MUX’d RS232-I/F

1 --- 2
2 --- 3

1-2
3-4
5-6
7-8

Supplied Externally
Supplied by Upstream VBUS (default)

Short (and open J11) to select RS232 interface

 2013 Microchip Technology Inc. DS00001574A-page 17

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

Connector Description Settings

1-2

J11 MUX’d SPI1-I/F

3-4
5-6
7-8

Short (and open J9) to select SPI1 interface

J12 TEST

J13 JTAG Select Header

J14 PCLK_ENABLE

J15 OSC_IN 1-2

J20 SC1_Load 1-2 Open (default)

J21 SC1_PRSNT

J26 BootROM select 1-2 Open (default)

1-2
2-3

1 --- 2

2 --- 3

1-2
2-3

1-2

2-3

Chip will enter TEST mode
Chip will enter functional mode (default)

JTAG_CLK (JTAG CLK is routed from J39 when this setting
is selected)

VBUS_DET(default)

Chip starts with external oscillator
Chip starts with internal oscillator (default)

External oscillator is fed to PCLK_IN_48MHZ. To be shorted
if the chip is to work from external oscillator

SC1 Card detect pin routed from smartcard connector
(default)
SC1 card detect pin is permanently grounded

SC2 Card detect pin routed from smartcard connector

1-2

J27 SC2_PRSNT

2-3

J28 SC2_Load 1-2 Open (default)

J29 OSC_SEL Unused Open (default)

J31 SPI1_Interface 1-10

J34 SPI2_Internal Flash 1-8 Short to program SPI2 flash and execute code from

J35 RS232 10 pin header 1-10

DS00001574A-page 18  2013 Microchip Technology Inc.

(default)

SC2 card detect pin is permanently grounded

Open (default). Header for connecting Cheetah / Aardvark
SPI host adapters

Header to which Microchip’s 10 pin serial cable to be con­nected

EVBPCBA Documentation

Connector Description Settings

J36

J37

J38

J19

J25

Bond 0 Configuration
Header

Bond 1 Configuration
Header

Bond 2 Configuration
Header

Smart Card 1 (SC1 I/F –
Credit Card)

Smart Card 2 (SC2 I/F –
Credit Card)

1 --- 2
2 --- 3

1 --- 2
2 --- 3

1 --- 2
2 --- 3

10

9
8
4
7
3
6
2
5
1

10

9
8
4
7
3
6
2
5
1

Pulled high to VDD33 (default)
Pulled down to GND

Pulled high to VDD33 (default)
Pulled down to GND

Pulled high to VDD33
Pulled down to GND (default) for OTP / ROM execution

CDSW2 (GND)
SC1_PRSNT#
SC1_C8
SC1_C4
SC1_IO
SC1_CLK
NC
SC1_RST#
GND
SC1_VCC

CDSW2 (GND)
SC2_PRSNT#
NC
NC
SC2_IO
SC2_CLK
NC
SC2_RST#
GND
SC2_VCC

2,6,10,16

1,3,4,5,7,9

,11,13,15,

J39

J40

 2013 Microchip Technology Inc. DS00001574A-page 19

DUT EDP/EDP-T JTAG
Header

General purpose pull up
to 3.3V thru 1K ohm
resistor

17,19,20

8
12
14
18

1-4 Open (default)

nc pins

GND Test Points

TCK (JTAG_CLK)
TDO (PJTAG_TDO)
TDI (PJTAG_TDI)
TMS (PJTAG_TMS)

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

Connector Description Settings

General purpose pull

J41

J42 Open JTAG Header Unused Open (default)

J43 LED Polarity control 2-3 Short (default)

J44 3V3 1-4 Open (default). Connected to 3.3V

J45 GND 1-4 Open (default). Connected to GND

Ref. Des Description Settings

down to GND thru 1K
ohm resistor

2.5.4 Switch Description

1-4 Open (default)

SW2 Reset Switch Press : In Reset

Release : Out of Reset

2.5.5 Test Points Description

Test Point Description Connection

TP1 5V 5V input to MIC37100 3.3V regulator (U1) &

SEC1210 (U2)

TP2 3.3V 3.3V output of MIC37100 3.3V regulator (U1)

TP4 GND GND

TP5 VDD33 VDD33 power output of internal regulator

2.5.6 Bond Options

Depending on the Bond option set on jumper J36, J37 and J38, the SEC1212-DEV pro­totype can work in SEC1210 (QFN24) and SEC1110 (QFN16) pin modes also.

PART No. BOND0(J36) BOND1(J37) BONd2(J38) Remarks

SEC1110 0 0 x

SEC1210 0 1 x

SEC1212-DEV 1 1 0 OTP/Internal ROM boot

SEC1212-DEV 1 1 1 External SPI2 Flash boot

DS00001574A-page 20  2013 Microchip Technology Inc.

EVBPCBA Documentation

2.5.7 Selecting the Code Fetch Source

SEC1212-DEV can execute code from Internal /OTP ROM as well as from external
serial SPI flash (one at a time).

The following sub-sections detail the pre-requisites to select the required code fetch
source.

2.5.7.1 CODE EXECUTION FROM INTERNAL BOOT ROM

1. OTP_ROM_EN & FORCE_OTP_ROM bits are not programmed through OTP
Programmer application

2. Pins 2-3 of J38 are to be shorted

2.5.7.2 CODE EXECUTION FROM INTERNAL OTP ROM

1. OTP should have been programmed through OTP Programmer application

2. OTP_ROM_EN bit is programmed through OTP Programmer application

3. Pins 2-3 of J38 are to be shorted

2.5.7.3 CODE EXECUTION FROM SPI FLASH

1. SPI Flash should have been programmed through SPI Flashwriter application

2. FORCE_OTP_ROM bit is not programmed through OTP Programmer applica-

3. Pins 1-2 of J38 are to be shorted

2.6 EVB-SEC1210

The EVB-SEC1210 utilizes the 24-pin QFN SEC1210 and includes the following inter­faces and features.

•USB

• Two smartcard slots

• SPI1 or UART Interface

Note 1: A standard USB A-to-B cable is required to connect to the USB Host.

tion

2: Code execution is possible only from internal SRAM or OTP.

 2013 Microchip Technology Inc. DS00001574A-page 21

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

FIGURE 2-4: EVB-SEC1210 COMPONENT SIDE TOP LAYER

2.6.1 Placing a Chip in the Socket

This section is applicable only if the ASIC is not directly soldered on the PCB and the
EVB is equipped with a socket. The following guidelines must be followed when replac­ing the ASIC in the socket.

Place the ASIC in the socket in such a way that the Pin1 marking (dot) on the ASIC and
the socket Pin1 marking on the PCB (triangle) align, as shown in Figure 2-5.

Note: The socket is manufactured by R&D Interconnect (P/N: 106458-0133).

DS00001574A-page 22  2013 Microchip Technology Inc.

EVBPCBA Documentation

FIGURE 2-5: EVB-SEC1210 PIN 1 SOCKET ALIGNMENT

2.6.2 Connector Description

Ref. Des. Description Settings

5,6

J1

J2

J3 Smart Card 2

J4 RS-232 D-sub9 connector 1-10

USB-B Upstream Connec-

tor

Smart Card 1

(SC1 I/F – Credit Card)

(SC2 I/F – Credit Card)

1
2
3
4

10

9
8
4
7
3
6
2
5
1

10

9
8
4
7
3
6
2
5
1

Shield connections to earth

GND

VBUS_UP

USBUP_DM

USBUP_DP

GND

CDSW2 (GND)

SC1_PRSNT#

SC1_C8
SC1_C4

SC1_IO

SC1_CLK

NC

SC1_RST#

GND

SC1_VCC

CDSW2 (GND)

SC2_PRSNT#

NC
NC

SC2_IO

SC2_CLK

NC

SC2_RST#

GND

SC2_VCC

Header to which SMSC’s

10 pin RS232 cable needs

to be connected

 2013 Microchip Technology Inc. DS00001574A-page 23

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

2.7 EVB-SEC1110

The EVB-SEC1110 utilizes the 16-pin QFN SEC1110 and includes the following inter­faces and features.

•USB

• One smartcard slot

Note 1: A standard USB A-to-B cable is required to connect to the USB Host.

2: Code execution is possible only from internal SRAM or OTP.

FIGURE 2-6: EVB-SEC1110 COMPONENT SIDE TOP LAYER

DS00001574A-page 24  2013 Microchip Technology Inc.

EVBPCBA Documentation

2.7.1 Placing a Chip in the Socket

This section is applicable only if the ASIC is not directly soldered on the PCB and the
EVB is equipped with a socket. The following guidelines must be followed when replac­ing the ASIC in the socket.

Place the ASIC in the socket in such a way that the Pin1 marking (dot) on the ASIC and
the socket Pin1 marking on the PCB (triangle) align, as shown in Figure 2-7.

Note:

The socket is manufactured by R&D Interconnect (P/N:
106458-0134).

FIGURE 2-7: EVB-SEC1110 PIN 1 SOCKET ALIGNMENT

 2013 Microchip Technology Inc. DS00001574A-page 25

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

2.7.2 Connector Description

Ref.

Des.

P1 USB-A Upstream Connector

J1 Smart Card 1 (SC1 I/F – Credit

Description Settings

Card)

5,6

1
2
3
4

10

9
8
4
7
3
6
2
5
1

Shield connections to earth GND

VBUS_UP

USBUP_DM

USBUP_DP

GND

CDSW2 (GND)

SC1_PRSNT#

SC1_C8
SC1_C4

SC1_IO

SC1_CLK

NC

SC1_RST#

GND

SC1_VCC

DS00001574A-page 26  2013 Microchip Technology Inc.

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

Chapter 3. CCID Firmware

3.8 FEATURES

• Supports smartcards of all voltages (1.8V, 3V and 5V)

• Supports T=0 and T=1 protocols

• Supports the fastest possible smartcards. (As per ISO Spec, ATR with TA1=17 is

the maximum speed possible for a smartcard. This is equivalent to 826Kbps.)

• Has a maximum CCID command length of 271 bytes

• Supports suspending the device in order to save power

• Remote wake-up is possible through smartcard insertion. When host is in sus-

pended state, on inserting a smartcard, the device will wake up the host.

• Support in-box drivers of all Windows and Linux versions

3.9 SINGLE SLOT CCID FIRMWARE

• USB CCID class compliant single slot firmware

• This firmware supports EVB-SEC1110, EVB-SEC1210 & EVB-SEC2112-DEV

boards

• Card can be removed / re-inserted. Interrupt notification will be sent to host

according to card changes in slot.

EVALUATION BOARD USER’S GUIDE

3.10 DUAL SLOT CCID FIRMWARE

• USB CCID class compliant dual slot firmware (enumerates as a composite USB

device)

• This firmware supports EVB-SEC1210 & EVB-SEC2112-DEV boards

• In slot1, card removed / re-insertion is supported

• In slot2, card removal / re-insertion is not supported as no status change interrupt

endpoint is supported for this interface

3.11 SMARTCARD READER DRIVER INSTALLATION UNDER WINDOWS

Most Windows OS installations include USBCCID drivers integrated by default. In
these cases, as soon as the EVB is connected to the system, the usbccid.sys driver is
loaded and the EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV smartcard reader
will be listed in the Device Manager as shown below.

 2013 Microchip Technology Inc. DS00001574A-page 27

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

FIGURE 3-8: SEC1110 DEVICE ENUMERATION UNDER WINDOWS 7

FIGURE 3-9: SEC1210/SEC1212-DEV DEVICE ENUMERATION UNDER WINDOWS 7

DS00001574A-page 28  2013 Microchip Technology Inc.

If the driver is has not been pre-installed on the PC, follow the steps below to install the
driver via the Windows Update site (Shown for SEC1110 under Windows XP OS).

• Connect the reader to a free USB port on the PC.

• Once the smartcard reader is connected, Window reports that new hardware has

been detected and will offer to connect to Windows Update to search for a suit­able driver.

• Choose Recommended Option and click Next to continue.

FIGURE 3-10: FOUND NEW HARDWIRE WIZARD

CCID Firmware

• Choose "Yes, Connect and search for software on the Internet" and click

Next.

 2013 Microchip Technology Inc. DS00001574A-page 29

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

FIGURE 3-11: FOUND NEW HARDWARE WIZARD - OPTIONS

DS00001574A-page 30  2013 Microchip Technology Inc.

FIGURE 3-12: FOUND NEW HARDWARE WIZARD - SEARCH

CCID Firmware

 2013 Microchip Technology Inc. DS00001574A-page 31

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

FIGURE 3-13: FOUND NEW HARDWARE WIZARD - COMPLETED

• Click Finish when the last window shows that the installation has finished.

• After successful driver installation, the device will be included in the Device Man­ager, as shown in Figure 3-14.

DS00001574A-page 32  2013 Microchip Technology Inc.

FIGURE 3-14: DEVICE MANAGER - NEW DEVICE

CCID Firmware

 2013 Microchip Technology Inc. DS00001574A-page 33

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

EVALUATION BOARD USER’S GUIDE

Chapter 4. Checking Device Firmware Revision

To check the device's firmware revision, go to Device Manager and select the smart
card reader. Right click and select Properties.

FIGURE 4-15: DEVICE MANAGER - PROPERTIES

In the Details tab select Hardware Ids, where the revision number is listed.

 2013 Microchip Technology Inc. DS00001574A-page 34

Checking Device Firmware Revision

FIGURE 4-16: DEVICE MANAGER - FIRMWARE REVISION

Note 1: F/W version in the above case is 2.19

2: If the reader is enumerated as SMSC WINUSB, then the device is not pro-

grammed.

 2013 Microchip Technology Inc. DS00001574A-page 35

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

EVALUATION BOARD USER’S GUIDE

Chapter 5. OTP Programming Procedures

Note: This procedure is applicable only to EVB-SEC2112-DEV, as the

EVB-SEC1110 and EVB-SEC1210 are pre-programmed with appropriate
firmware. Only the EVB-SEC2112-DEV includes firmware loaded to SPI2
Flash - and user has an option to program the OTP only once. Once the
OTP is programmed and the "OTP_ROM_EN" option is set as detailed in
step 6 of the procedure below, the SPI flash cannot be updated again and
the boot from OTP or SPI2 can be switched using Jumper J38.

1. The device should enumerate as "SMSC WINUSB". Otherwise the device can't
be programmed.

2. Open the OTP Programmer and confirm the device enumerated

3. Select the .bin file using Browse… button

4. Click Execute

 2013 Microchip Technology Inc. DS00001574A-page 36

OTP Programming Procedures

FIGURE 5-17: OTP PROGRAMMER - DEVICE LIST

5. After successful completion, the message shown in Figure 5-17 will be shown in
the status box.

6. Select Modify OTP Special Register and click the OTP_ROM_EN check box,
as shown in Figure 5-18.

7. Select Update and press OK.

Note: Steps 4, 5 and 6 must be performed without resetting the device after OTP

programming. Otherwise, the device will enumerate as SMSC WINUSB.

 2013 Microchip Technology Inc. DS00001574A-page 37

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

FIGURE 5-18: OTP PROGRAMMER - SPECIAL REGISTER CONTROL PANEL

DS00001574A-page 38  2013 Microchip Technology Inc.

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV

EVALUATION BOARD USER’S GUIDE

Chapter 6. SPI Programming Procedures

Note: SPI Programming can only be performed on the EVB-SEC2112-DEV.

1. In order for the device to enumerate as "SMSC WINUSB", the Bond2 jumper
(J38) must be set to 1-2 during power-up.

2. Open SPI Flashwriter and confirm the device has enumerated.

3. Select the .bin file using Browse… button

4. Click Program SPI2 Flash

FIGURE 6-19: SPI FLASH WRITER - SELECT DEVICE

5. After successful completion, the Status box will change to "Programming SPI2
flash completed successfully".

 2013 Microchip Technology Inc. DS00001574A-page 39

EVB-SEC1110/EVB-SEC1210/EVB-SEC1212-DEV
Evaluation Board User’s Guide

FIGURE 6-20: SPI FLASH WRITER - COMPLETED SUCCESSFULLY

6. Change the Bond2 jumper (J38) to 2-3 and reset the board. The EVB will now
boot from SPI.

DS00001574A-page 40  2013 Microchip Technology Inc.

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

http://www.microchip.com/
support

Web Address:

www.microchip.com

Atlanta

Duluth, GA
Tel: [phone]
Fax: [phone]

Boston

Westborough, MA
Tel: [phone]
Fax: [phone]

Chicago

Itasca, IL
Tel: [phone]
Fax: [phone]

Cleveland

Independence, OH
Tel: [phone]
Fax: [phone]

Dallas

Addison, TX
Tel: [phone]
Fax: [phone]

Detroit

Farmington Hills, MI
Tel: [phone]
Fax: [phone]

Indianapolis

Noblesville, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

Santa Clara

Santa Clara, CA
Tel: [phone]
Fax: [phone]

Toronto

Mississauga, Ontario,
Canada
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: [phone]
Fax: [phone]

Australia - Sydney

Tel: [phone]
Fax: [phone]

China - Beijing

Tel: [phone]
Fax: [phone]

China - Chengdu

Tel: [phone]
Fax: [phone]

China - Chongqing

Tel: [phone]
Fax: [phone]

China - Hangzhou

Tel: [phone]
Fax: [phone]

China - Hong Kong SAR

Tel: [phone]
Fax: [phone]

China - Nanjing

Tel: [phone]
Fax: [phone]

China - Qingdao

Tel: [phone]
Fax: [phone]

China - Shanghai

Tel: [phone]
Fax: [phone]

China - Shenyang

Tel: [phone]
Fax: [phone]

China - Shenzhen

Tel: [phone]
Fax: [phone]

China - Wuhan

Tel: [phone]
Fax: [phone]

China - Xian

Tel: [phone]
Fax: [phone]

China - Xiamen

Tel: [phone]
Fax: [phone]

China - Zhuhai

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi

Tel: [phone]
Fax: [phone]

India - Pune

Tel: [phone]

Japan - Osaka

Tel: [phone]
Fax: [phone]

Japan - Tokyo

Tel: [phone]
Fax: [phone]

Korea - Daegu

Tel: [phone]
Fax: [phone]

Korea - Seoul

Tel: [phone]
Fax: [phone] or
82-2-558-5934

Malaysia - Kuala Lumpur

Tel: [phone]
Fax: [phone]

Malaysia - Penang

Tel: [phone]
Fax: [phone]

Philippines - Manila

Tel: [phone]
Fax: [phone]

Singapore

Tel: [phone]
Fax: [phone]

Taiwan - Hsin Chu

Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung

Tel: [phone]
Fax: [phone]

Taiwan - Taipei

Tel: [phone]
Fax: [phone]

Thailand - Bangkok

Tel: [phone]
Fax: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]

Denmark - Copenhagen

Tel: [phone]
Fax: [phone]

France - Paris

Tel: [phone]
Fax: [phone]

Germany - Munich

Tel: [phone]
Fax: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

Spain - Madrid

Tel: [phone]
Fax: [phone]

UK - Wokingham

Tel: [phone]
Fax: [phone]

08/20/13

DS00001574A-page 41  2013 Microchip Technology Inc.

Mouser Electronics

Authorized Distributor

Click to View Pricing, Inventory, Delivery & Lifecycle Information:

Microchip:
EVB-SEC1110