Microchip Technology dsPICDEM MCHV-3 User Manual

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dsPICDEM™ MCHV-3

Development Board

User’s Guide

 2016 Microchip Technology Inc. DS50002505A

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.

Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

MCUs and dsPIC® DSCs, KEEL

code hopping

QUALITY MANAGEMENT S

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST, MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo, RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

ClockWorks, The Embedded Control Solutions Company, ETHERSYNCH, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker, Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.

Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.

GestIC is a registered trademarks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.

All other trademarks mentioned herein are property of their respective companies.

ISBN: 978-1-5224-0663-1

DS50002505A-page 2  2016 Microchip Technology Inc.

Object of Declaration: dsPICDEM

MCHV-3 Development Board

dsPICDEM™ MCHV-3 Development Board User’s Guide

NOTES:

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dsPICDEM™ MCHV-3 DEVELOPMENT

BOARD USER’S GUIDE

Safety Notice

To avoid a safety hazard, the safety notices and operating instructions provided should be adhered to. If in any doubt, consult your supplier.

WARNING – This system must be earthed (grounded) at all times. WARNING – The output terminals are NOT isolated from the incoming AC mains

supply and may be at up to 410V with respect to ground, regardless of the input mains supply voltage applied. These terminals are live during operation AND for five minutes after disconnection from the supply. Do not attempt to access the terminals or remove the cover during this time.

WARNING – The unit may obtain power through the output terminals if these are

connected to a rotating motor acting as a generator. If this is the case, then the previous warning also applies (i.e., the output terminals are live when connected to the generator and for five minutes after the generator has been stopped). Note that this case can arise even when the unit has been disconnected from the incoming AC mains supply.

CAUTION – The system should not be installed, operated, serviced or modified except

by qualified personnel who understand the danger of electric shock hazards and have read and understood the user instructions. Any service or modification performed by the user is done at the user’s own risk and voids all warranties.

CAUTION – If a motor is connected to the output of this unit, the frame should be

connected to the output protective ground terminal provided. Particular care should be taken to mechanically guard such a motor, bearing in mind that unexpected behavior is likely to result from the process of code development.

CAUTION – For continued protection against the risk of fire, replace the fuse with one

of the same type only (i.e., Fast Act Fuse 15A/250V).

• The system is intended for evaluation and development purposes, and should only be operated in a normal laboratory environment, as defined by IEC 61010-1:2001.

• Clean with a dry cloth only.

• Operate flat on a bench; do not move during operation and do not block the ventilation holes.

• The system should not be operated without all the supplied covers fully secured in place.

• The system should not be connected or operated if there is any apparent damage to the unit.

• The unit is designed to be connected to the AC mains supply via a standard non-locking plug. As the unit has no mains switch, this plug constitutes the means of disconnection from the supply, and thus, the user must have unobstructed access to this plug during operation.

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dsPICDEM™ MCHV-3 Development Board User’s Guide

NOTES:

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dsPICDEM™ MCHV-3 DEVELOPMENT

BOARD USER’S GUIDE

Safety Notice .................................................................................................................5

Preface ...........................................................................................................................9

Chapter 1. Introduction

1.1 Overview ...................................................................................................... 15

1.2 Features ....................................................................................................... 18

Chapter 2. Getting Started

2.1 Board Components ...................................................................................... 19

2.2 User Interface ............................................................................................... 20

2.3 Connecting the System ................................................................................ 22

2.4 Power Sequences ........................................................................................ 26

Chapter 3. Hardware

3.1 Power Factor Correction (PFC) Stage Board ............................................... 31

3.2 Power Module Stage .................................................................................... 37

3.3 Electrical Specifications ................................................................................ 47

Appendix A. Board Layout and Schematics..............................................................49

A.1 Introduction .................................................................................................. 49

A.2 Board Schematics and Layout ..................................................................... 49

Index .............................................................................................................................65

Worldwide Sales and Service ....................................................................................68

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dsPICDEM™ MCHV-3 Development Board User’s Guide

NOTES:

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dsPICDEM™ MCHV-3 DEVELOPMENT

BOARD USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are const antly evolving to meet customer needs, so some actual dialogs and/ or tool descriptions may differ from those in this document. Please refer to our web site (www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.

For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available on-line help files.

INTRODUCTION

IDE on-line help.

This preface contains general information that will be useful to know before using the dsPICDEM™ MCHV-3 Development Board. Topics discussed in this preface include:

• Document Layout

• Conventions Used in this Guide

• Warranty Registration

• Recommended Reading

• The Microchip Web Site

• Development Systems Customer Change Notification Service

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This user’s guide describes how to use the dsPICDEM™ MCHV-3 Development Board. The document is organized as follows:

• Chapter 1. “Introduction” – This chapter introduces the dsPICDEM™ MCHV-3

Development Board and provides a brief overview of its features.

• Chapter 2. “Gettin g Started” – This chapter provides information on getting

started with the dsPICDEM™ MCHV-3 Development Board.

• Chapter 3. “Hardwa re” – This chapter describes the hardware on the

dsPICDEM™ MCHV-3 Development Board.

• Appendix A. “Board Layout and Schematics” – This appendix provides

diagrams of the hardware layout, as well as schematic diagrams for the dsPICDEM™ MCHV-3 Development Board.

 2016 Microchip Technology Inc. DS50002505A-page 9

dsPICDEM™ MCHV-3 Development Board User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly braces and pipe character: { | }

Ellipses... Replaces repeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the total number of digits, R is the radix and n is a digit.

Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’

Choice of mutually exclusive arguments; an OR selection

Represents code supplied by user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options] errorlevel {0|1}

var_name...] void main (void)

{ ... }

IDE User’s Guide

DS50002505A-page 10  2016 Microchip Technology Inc.

WARRANTY REGISTRATION

Please complete the enclosed Warranty Registration Card and mail it promptly. Sending in the Warranty Registration Card entitles users to receive new product updates. Interim software releases are available at the Microchip web site.

THE MICROCHIP WEB SITE

Microchip provides online support via our web site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample

programs, design resources, user’s guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical

support requests, online discussion groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip

press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives

DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFI CATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip web site at www.microchip.com, click on Customer Change Notification and follow the registration instructions.

The Development Systems product group categories are:

• Compilers – The latest information on Microchip C compilers and other language

tools. These include the MPLAB assemblers; MPLINK™ and MPLAB 16-bit object linkers; and MPLIB™ and MPLAB 16-bit object librarians.

• Emulators – The latest information on the Microchip MPLAB REAL ICE™

in-circuit emulator.

• In-Circuit Debuggers – The latest information on the Microchip in-circuit

debugger, MPLAB ICD 3.

• MPLAB IDE – The latest information on Microchip MPLAB IDE, the Windows

Integrated Development Environment for development systems tools. This list is focused on the MPLAB IDE, MPLAB SIM simulator, MPLAB IDE Project Manager, and general editing and debugging features.

• Programmers – The latest information on Microchip programmers. These include

the MPLAB PM3 device programmer and the PICkit™ 3 development programmers.

C compiler; MPASM™ and MPLAB 16-bit

DS50002505A-page 12  2016 Microchip Technology Inc.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or FAE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://support.microchip.com

DOCUMENT REVISION HISTORY

Revision A (June 2016)

This is the initial released version of the document.

Preface

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dsPICDEM™ MCHV-3 Development Board User’s Guide

NOTES:

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1.1 OVERVIEW

The Microchip dsPICDEM™ MCHV-3 Development Board is intended to aid the user in the rapid evaluation and development of a wide variety of motor control applications using PIC32 and PIC24 Microcontrollers (MCUs), and dsPIC Controllers (DSCs). This development system is targeted to control Brushless DC (BLDC) motors, Permanent Magnet Synchronous Motors (PMSM) and AC Induction Motors (ACIM) in sensor or sensorless operation.

This flexible and cost-effective tool can be configured in different ways for use with Microchip’s specialized motor control devices. The dsPICDEM™ MCHV-3 Development Board is essentially an upgraded version of the dsPICDEM System. The dsPICDEM™ MCHV-3 Development Board is designed to support the PIC24F, PIC24E, dsPIC33F, dsPIC33E and PIC32 Motor Control device families, and offers a mounting option to connect a generic 100-pin Plug-In Module (PIM).

The system has a three-phase power module device that contains the motor inverter and the gate driver’s circuitry. The circuit drives a BLDC, PMSM or ACIM motor using different control techniques without requiring any additional hardware. It also has Power Factor Correction (PFC) circuitry in order to provide a full set of tools used in motor control applications. Figure 1-1 provides a photograph of the dsPICDEM MCHV-3. A block diagram that shows the main components of the system is provided in Figure 1-2.

The rated continuous output current from the inverter is 6.5A (RMS). This allows up to approximately 2 kVA output when running from a 208V to 230V single-phase input voltage in a maximum 30ºC (85ºF) ambient temperature environment. Therefore, the system is ideally suited for running a standard 3-phase induction motor of up to a 1 kW (1.34 HP) rating or a slightly higher rated industrial servo motor. The power module is capable of driving other types of motors and electrical loads that do not exceed the maximum power limit, and are predominantly inductive. Furthermore, single-phase loads can be driven using one or two of the inverter outputs.

The unit is capable of operating from 90V, up to a maximum of 265V. A more detailed

explanation of power limitations is provided in Chapter 3. “Hardware”.

dsPICDEM™ MCHV-3 DEVELOPMENT

BOARD USER’S GUIDE

Chapter 1. Introduction

Digital Signal

MCHV Development

Note: It is recommended to carefully read Chapter 3. “ Har d ware ” before

attempting to use the system.

 2016 Microchip Technology Inc. DS50002505A-page 15

dsPICDEM™ MCHV-3 Development Board User’s Guide

dsPICDEM™ MCHV-3 Development Board

(Part # DM330023-3)

FIGURE 1-1: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD

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PFC Feedback Signals

15V, 3.3V, A-3.3V

PFC PWM

BUS

PFC Circuitry

VAC Voltage

Feedback

EMI Choke,

In-Rush Current

Protection, Fuse

90V-265V

Rectifier

PFC Fault

dsPIC® DSC

Power

Alternative

15V PSU

Isolated User Interface

RS-232/

USB

Starter Kit

POT, PB, RESET

Current

Feedback

Circuitry

Hall

Sensors

Voltage

Feedback

Circuitry

BUS

and Motor)

Fault

Non-Isolated

ICSP™ Connector

Hall

Sensors

Motor

External

Programmer/

Debugger

ICSP

Commands

User

Interface

PFC Stage Board

Power Module Board

Circuitry

Module

PIC24 MCU

Matrix Board

on Board

PFC Current

Feedback

Circuitry

VAC Zero

Crossing

3.3 VA-3.3V

15V PSU

Relay Circuit

Alternative

3.3V/A3.3V

FIGURE 1-2: SYSTEM BLOCK DIAGRAM

Introduction

dsPICDEM™ MCHV-3 Development Board User’s Guide

1.2 FEATURES

This section provides some of the key features of the dsPICDEM MCHV-3 Development Board.

1.2.1 Motor Control Interfaces:

• Three-phase inverter bridge with a power rating of 400V/6.5A (J17)

• Hall sensors/Quadrature Encoder Interface (QEI) for sensored motor control algorithms (J9)

• Phase voltage feedback for sensorless BLDC operation

• DC bus current sense resistor for single shunt vector control

• Phase current sense resistor for dual shunt vector control

• Overcurrent protection

• Support for Microchip MCUs/dsPIC DSCs with internal op amps and comparators

1.2.2 Input/Output:

• One isolated push button (S1)

• Isolated Reset push button (RESET)

• Isolated 10 k potentiometer (POT1)

• LED indicators for PWM outputs

• Two LED indicators for debugging purposes (D2 and D19)

1.2.3 Isolated Communication Ports:

• UART communication via USB (J6)

• UART communication via RS-232 (J8)

1.2.4 Built-in Isolated Programmer/Debugger (J20):

• Starter Kit on-board programmer/debugger (daughter board)

1.2.5 Power Factor Corrector:

• Maximum input voltage: 90 VAC to 265 VAC

• Current feedback circuitry

• VAC input voltage sensing

• Zero-crossing detection

• DC bus sensing

• Overcurrent protection (the maximum power available is specified in

Section 3.3 “Electrical Specifications”)

1.2.6 Built-in Power Supplies:

• 15V power supply, maximum power available: 11W

• 3.3V power supply, maximum power available: 2W

1.2.7 Relay Circuit:

• In parallel with inrush current limiter

• Turns on after inrush current minimizes

1.2.8 Additional Protection Circuitry:

• 250 VAC/15A fuse

• Inrush current limiter

• EMI filter

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dsPICDEM™ MCHV-3 DEVELOPMENT

BOARD USER’S GUIDE

Chapter 2. Getting Started

2.1 BOARD COMPONENTS

The dsPICDEM™ MCHV-3 Development Board consists of two stages:

•PFC Stage The first stage is integrated by the Power Factor Correction (PFC) circuitry, the

full-bridge rectifier, the 15V power supply, the 3.3V power supply and the relay circuit.

• Power Module Stage The second stage is the Power Module Board. This board contains the PIM

connector, the isolated user interface connectors and the motor drive.

Figure 2-1 shows an interior view.

FIGURE 2-1: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD ENCLOSURE VIEW

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dsPICDEM™ MCHV-3 Development Board User’s Guide

J20

POT1

Reset

PWM LED Indicators

J2,J3

2.2 USER INTERFACE

The dsPICDEM MCHV-3 has the following components to interact with the user.

Figure 2-2 shows a photograph of the front of the system.

• Input/Output Control Switches (Figure 2-2):

- One isolated push button (S1)

- Isolated Reset push button (RESET)

- Isolated 10 kΩ potentiometer (POT1)

- LED indicators for PWM outputs

- Two LED indicators for debugging purposes (D2 and D19 on the Power Module Board; not shown in Figure 2-2)

• PWM Outputs (Figure 2-2):

- Enable and disable jumpers (J7)

• Isolated Communication Ports (Figure 2-2):

- UART communication via USB (J6)

- UART communication via RS-232 (J8)

- Communication ports selector (J2, J3)

• Built-in Isolated Programmer/Debugger (Figure 2-2):

- Starter kit type programmer/debugger (J20)

• Motor Connectors (Figure 2-4):

- Three-phase inverter bridge connector with a power rating of 400V/6.5A (J17)

- Hall sensors/Quadrature Encoder Interface (QEI) for sensored motor control algorithms (J9)

- Ground terminal with a power rating of 300V/30A

• Power Supply Connector (Figure 2-3):

- AC power inlet specified for 250 VAC/10 amps max (J1)

FIGURE 2-2: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD (FRONT)

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Getting Started

FIGURE 2-3: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD (LEFT SIDE)

FIGURE 2-4: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD (RIGHT SIDE)

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dsPICDEM™ MCHV-3 Development Board User’s Guide

2.3 CONNECTING THE SYSTEM

CAUTION

The user must be aware of the operating procedures outlined below and ensure that they are followed. Failure to do so may result in damage to the system.

2.3.1 Power Connections

It is recommended that cables used for the power connections should be terminated with blue or red insulated crimp terminals. If crimp terminals are not used, care should be taken to ensure that stray strands of wire do not short to adjacent terminals or the enclosure. If possible, all wires should be stripped and tinned with solder before connecting to the dsPICDEM™ MCHV-3 Development Board terminals.

For the AC mains supply input, standard double-insulated, 3-core flex cable should be used with a minimum current rating of 10A (1 mm can be used.

Note: The system is designed for Installation Category II. Therefore, the incoming

mains cable should be wired into a standard non-locking 2-pin, in addition with an earth ground type plug.

The recommended output cable size is 1.0 to 1.5 mm should have a 600V rating. This cable should also be double-insulated or have a protective ground screen. Access to the terminal screws is provided via holes in the lid of the enclosure. A slotted screwdriver should be used.

18 AWG). A computer power cable

(18 AWG to 16 AWG) and it

Note: The user should only access the power terminals when the system is fully

discharged (see the “Safety Notice” section on page 5).

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Getting Started

Figure 2-7 provides the locations of all connectors. Corresponding tables that describe

each connection are provided in the relevant section.

FIGURE 2-5: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD CONNECTIONS

The power connections are listed in Table 2-1.

TABLE 2-1: POWER CONNECTIONS

Number Name Type

1 Neutral Input

2 Earth Ground Input

3 Live (Fused) Input

4 Motor Phase 1 (M1) Output

5 Motor Phase 2 (M2) Output

6 Motor Phase 3 (M3) Output

7 Hall Sensor A (HA) Input

8 Hall Sensor B (HB) Input

9 Hall Sensor C (HC) Input

10 Hall Sensors, 5V Power Supply Terminal Output

11 Hall Sensors, Ground Terminal Output

12 Motor Ground Terminal Input

 2016 Microchip Technology Inc. DS50002505A-page 23

dsPICDEM™ MCHV-3 Development Board User’s Guide

2.3.2 Host/Communication Connections

A mini-USB to USB certified cable or a standard DB9 male-to-female cable should be used to connect the dsPICDEM™ MCHV-3 Development Board to the host computer.

The communication port connectors are listed in Tab le 2 -2 . Refer to Figure 2-5 for their exact location.

TABLE 2-2: I/O CONNECTORS

Number Name Type

13 USB to UART Connector Input/Output

14 RS-232 to UART Connector Input/Output

15 USB Connector for the Starter Kit on the Board Programmer/Debugger Input/Output

16 Non-Isolated ICSP™ Connector for Device Programming/Debugging Input/Output

17 Matrix Board Input/Output

2.3.3 Connection Sequence

The recommended connection sequence is listed below. The user should ensure that the following sequence is met before connecting the system to the mains, the motor and the host computer.

Note: Before making any connection, verify that the system is not powered and it

is fully discharged. The system is completed discharged when the red D13 LED is off.

1. Connect the motor terminals, R, Y and B (also known as RWB, or 123 or ABC), to the connection nodes, M1, M2 and M3 (4, 5 and 6 in Figure 2-5), respectively, and connect the motor ground to the ground terminal provided on the board chassis.

2. Follow the next steps if position sensors are utilized to control the motor. If not, proceed to Step 3.

a) If the motor position is sensed with Hall sensors, connect the Terminals A, B

and C to the connection nodes, HA, HB and HC (7, 8 and 9 in Figure 2-5), respectively. Also, connect the positive terminal +5V to the connection node, +5V, and the ground terminal to the connection node, GND (10 and 11 in

Figure 2-5).

b) If the motor position is sensed with a Quadrature Encoder Interface, connect

the terminals, Phase A, Phase B and index, to the connection nodes, HA, HB and HC (7, 8 and 9 in Figure 2-5), respectively.

3. Connect the communication ports. a) If RS-232 communication is used, connect the DB9 male connector to the

RS-232 port. Connect the other end to the host PC (12 in Figure 2-5).

b) If USB communication is used, connect the mini-USB male terminal to the

mini-USB female connector, labeled “USB” (12 in Figure 2-5). Connect the other end to the host PC.

Note: The Microchip serial emulator driver (mchpcdc.inf) should be installed

on your PC in order to activate the USB-to-serial emulator. The emulator can be obtained from the dsPICDEM™ MCHV-3 Development Board product page: http://www.microchip.com/mchv3

DS50002505A-page 24  2016 Microchip Technology Inc.

Getting Started

4. Connect the USB cable to the mini-USB female connector, labeled

“Program/Debug” (14 in Figure 2-5). Connect the USB male terminal to the USB ports of the host PC.

Note: The built-in programmer/debugger is supported in MPLAB

5. Ensure that the appropriate matrix board is plugged into the connector, labeled

J4, and that the board is oriented so that its pins are correctly lined up, as shown

in Figure 2-6. Refer to Section 3.2.5 “Mat rix Board” for more information

regarding the matrix board.

FIGURE 2-6: MATRIX BOARD CONNECTION

X IDE.

6. Power cord connection. Make sure the power cord is disconnected from the AC

mains before connecting the female terminal of the power cable to the AC input connector (1, 2 and 3 in Figure 2-5) of the dsPICDEM™ MCHV-3 Development Board.

Note: The unit is designed to be connected to the AC mains supply via a standard

non-locking plug. As the unit has no mains switch, this plug constitutes the means of disconnection from the supply. Therefore, the user must have unobstructed access to this plug during operation.

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dsPICDEM™ MCHV-3 Development Board User’s Guide

2.4 POWER SEQUENCES

The user should ensure that the following power sequences are adhered to.

2.4.1 Power-up Sequence

The unit is powered up when the power cable is connected to the AC mains. To verify that the unit is powered, make sure that the LEDs D6, D13, D17 and D18 are on.

Note: The unit is designed to be connected to the AC mains supply via a standard

non-locking plug. As the unit has no mains switch, this plug constitutes the means of disconnection from the supply and thus, the user must have unobstructed access to this plug during operation.

2.4.2 Power-Down Sequence

1. Stop firing all power devices by removing the PWM OUTPUTS shunt jumper.

2. Turn off the incoming AC supply by disconnecting the power cord from the mains.

3. Wait until the red DC bus LED indicator (D13), located next to the DC bus connector, is no longer illuminated (this will take 5 minutes or less).

2.4.3 Programming/Debugging an Application Code Using the

Built-in Starter Kit on the Board Programmer/Debugger

The MPLAB® Starter Kit on-board programmer/debugger for the dsPICDEM™ MCHV-3 Development Board may be used with MPLAB X IDE, the free Integrated Development Environment, which is available from Microchip’s web site (www.microchip.com). MPLAB X IDE allows the Starter Kit on the board to be used as an in-circuit debugger, as well as a programmer.

In-circuit debugging allows you to run, examine and modify your program using the Starter Kit on-board hardware. This greatly assists you in debugging your firmware and hardware together.

Special Starter Kit on-board software interacts with the MPLAB X IDE application to run, stop and single step through programs. Breakpoints can be set and the processor can be reset. Once the processor is stopped, the register’s contents can be examined and modified.

2.4.4 Setting Up an Application for Debug

To prepare the application for debug:

1. Launch MPLAB X IDE and then open the application project. The related workspace will be open. For information on projects and workspaces, refer to the

MPLAB X IDE documentation listed in the “Recommended Reading” section of the “Preface” in this user’s guide.

2. In the toolbar, click Debug Project. The build progress will be visible in the Build

tab of the Output window.

3. Once the build sequence is complete, MPLAB X IDE will program the target device and begin executing the application code in Debug mode, as shown in

Figure 2-7.

DS50002505A-page 26  2016 Microchip Technology Inc.

 2016 Microchip Technology Inc. DS50002505A-page 27

FIGURE 2-7: MPLAB® X IDE WORKSPACE

Getting Started

dsPICDEM™ MCHV-3 Development Board User’s Guide

2.4.4.1 RUNNING THE APPLICATION IN DEBUG MODE

The Starter Kit on the board executes the application code in either real-time (Continue) or steps (Step Into, Step Over, Run to Cursor, and Set PC at Cursor). Real-time

execution occurs when you select Continue in MPLAB X IDE. Once the device code is halted, either by clicking Pause or by a breakpoint, you can step.

Note: When Pause is clicked to stop the program execution, all of the peripherals

are frozen.

To see how these options function, do the following:

1. Select Debug

2. Select Debug

operates.

3. Select Debug>Pause

solid arrow will mark the line of code in the File window where the program halted.

4. Select Debug

once. The green solid arrow will move down one line of code in the File window. Repeatedly click the button to step through the code.

5. Select Debug

6. Select Debug>Finish Debug Session

exit Debug mode.

>Reset or click the Reset icon to reset the program.

>Continue or click the Continue icon. Observe how the application

or click the Pause icon to stop program execution. A green

>Step Into or click the Step Into icon to step the program execution

>Reset OR click the Reset icon to reset the program again.

or click the Finish Debug Session icon to

DS50002505A-page 28  2016 Microchip Technology Inc.

Getting Started

Existing Code

2.4.4.2 DEBUGGING THE APPLICATION

MPLAB X IDE provides an editor and several debug features, such as breakpoints and Watch windows to aid in application code debugging.

2.4.4.2.1 Editing Application Code

To view application code so it may be edited, do one of the following:

Select File>Open File

in the Project window to open an existing code file. See an example Project window in

Figure 2-8.

FIGURE 2-8: PROJECT EXAMPLE

to search for and open an existing code file or double click a file

For more information on using MPLAB X IDE to create and edit code, see the MPLAB X IDE Help.

 2016 Microchip Technology Inc. DS50002505A-page 29

dsPICDEM™ MCHV-3 Development Board User’s Guide

2.4.5 Programming an Application

When the program is successfully debugged and running, the next step is to program the device for stand-alone operation in the finished design. When doing this, the resources reserved for debug are released for use by the application. To program the application, use the following steps:

1. Select Debug>Finish Debug Session

exit Debug mode.

2. Select Run>Run Project program the device and release it from Reset. Alternatively, click the Make and Program Device icon to build the application and program the device (this action

does not release the device from Reset).

At this point, the application code will run independently.

or click the Run Project icon to build the application,

2.4.6 Determining Device Support and Reserved Resources

Due to the built-in in-circuit debugging capability of MPLAB ICD 3 devices, and the In-Circuit Serial Programming™ (ICSP™) function offered by the debugger, the Starter Kit on the board uses some on-chip resources when debugging. It also uses program memory and file register locations in the target device during debugging. These locations are not available for use by user code. In MPLAB X IDE, registers marked with an “R” in the register display represent reserved registers.

or click the Finish Debug Session icon to

2.4.7 Troubleshooting

2.4.7.1 DEBUG CONNECTION PROBLEMS

While using the Starter Kit on the board as a debugger, you may receive the error, “Starter Kits (PKOB) not found”, when programming the device. This can result from communication being lost between the Starter Kit on the board and MPLAB X IDE. To resolve this:

1. Unplug the USB cable from the Starter Kit.

2. Plug the USB cable back into the Starter Kit.

MPLAB X IDE should automatically reconnect to the Starter Kit on the board and display its Serial Number (SN) in the same dialog box. Click the serial number, followed

by OK to continue. If this does not work, do the following:

1. Check the USB connection between the PC and Starter Kit at both ends.

2. If using a USB hub, make sure it is powered.

3. Make sure the USB port is not in use by another device.

2.4.7.2 PROGRAMMING PROBLEMS

If, during the course of developing your own application, you can no longer program the device, you may have set device Configuration bits to code-protect or some other state that prevents programming. To view the settings of the Configuration bits, select

Window>PIC Memory Views>Configuration bits

2.4.8 Start er Kit On-Board Information Tab

The firmware version and Operating System (OS) version of the Starter Kit on the board can be obtained from the Project Dashboard window of MPLAB X IDE. The Project Dashboard window also displays other useful information, such as the Starter Kit on-board V

DS50002505A-page 30  2016 Microchip Technology Inc.

, target Device ID and target Device ID revision.

dsPICDEM™ MCHV-3 DEVELOPMENT

BOARD USER’S GUIDE

Chapter 3. Hardware

This chapter describes the hardware components of the dsPICDEM™ MCHV-3 Development Board.

Topics covered include:

• Power Factor Correction (PFC) Stage Board

• Power Module Stage

• Electrical Specifications

3.1 POWER FACTOR CORRECTION (PFC) STAGE BOARD

This board has two main functions: the first one is to provide the required power supplies to the Power Module Stage Board; the second function is to create the power bus rail that will be used to energize the motor through the power module.

Note: The circuits for the hardware described in this section are shown in

Appendix A. “Board Layout and Schematics”.

3.1.1 AC Supply Input

The AC supply input stage of the board consists of the following components:

• F1 – 15A/250 VAC fast acting fuse (only replace with a part of the same rating).

• C1, C2 – Film capacitors to aid in the suppression of AC supply transients, and to

also provide a low-impedance return path for any currents that flow from the power device tabs to the heat sink and enclosure due to capacitive coupling.

• C3 – Film capacitor to aid in the suppression of AC supply transients.

• R1 – A metal oxide varistor located across the incoming supply lines to suppress

high-energy transients.

• L1 – 2.3 mH/15A choke inductor for suppressing EMI.

• C4 – Film capacitor to aid in the suppression of EMI.

• C5, C6 – Film capacitors to aid in the suppression of AC supply transients. and to

also provide a low-impedance return path for any currents that flow from the power device tabs to the heat sink and enclosure due to capacitive coupling.

• R7 – A 1W high-voltage resistor, which acts to discharge C4.

• R6 – A resistor with a negative temperature coefficient that acts to limit the surge

of input current that would occur at initial application of power due to the discharged DC bus capacitance. The initial nominal cold resistance is 1 Ohm, which reduces once current flows and the device heats up.

• BR1 – A single-phase bridge rectifier to convert the incoming AC into DC suitable

for input to the power conditioning stage.

• K1 – Relay which comes into operation after the inrush current dies out.

• R76, R77 – These are the voltage divider resistor outputs, which are connected to

the gate input of the MOSFET.

• C25 – This is used as a charging capacitor to introduce delay before turning on

the MOSFET.

• U9 – MOSFET is used to turn on the relay, K1.

• D15 – Diode is used to avoid premature turn-on of the MOSFET.

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dsPICDEM™ MCHV-3 Development Board User’s Guide

3.1.2 Active Power Factor Correction (PFC)

The active PFC circuit is essentially a simple boost chopper with the control aimed at shaping the input current to follow the incoming mains supply waveform. The purpose of the different parts of the circuit is described below.

• L6 – A high-frequency axial inductor with a single layer winding on a ferrite core.

This component is in-series with the main inductor (L7) to reduce the effect of the self-capacitance of its winding. Without L6, significant high-frequency (15 MHz) ringing of the inductor current occurs at every transistor turn-on, which would increase EMI and the PFC transistor switching loss.

• L7 – A power inductor with three stacked toroidal cores, made from a powdered

iron material, to limit the core loss while maintaining good energy storage density. The particular cores used are Magnetics 0077083A7. A simple multilayer winding is used, which results in moderate copper loss, but significant self-capacitance. Sixty-six turns of a 1.5 mm diameter enameled copper wire is used. The design offers a good compromise between cost, core loss and size for this application. The nominal inductance is 1 mH at 10A.

• Q2 – A 600V TO-247 IGBT. As the tab of the device is not isolated, a thermally

conductive insulator is used. When closed, Q2 increases the energy stored in the inductor, L7. When open, energy stored in the inductance is transferred to the DC bus capacitors (C30-C32). Energy is also drawn from the AC supply during this time. By appropriate control of the switches, the input current waveform can be profiled to obtain good power factor and low harmonic distortion.

• D12 – A 600V TO-247 diode optimized for use at high switching frequency. As the

tab of the device is not isolated, a thermally conductive insulator is used.

• C28, R31, R32, R33, D11 – A “snubber” that acts to dampen high-frequency

oscillations and limit the rate of change of voltage across Q2.

• C30, C31, C32 – 470 µF/450V electrolytic capacitors, which act as the main DC

bus energy storage capacitors.

• U6 – The MCP14E4 device is made up of 4.0A buffers/MOSFET drivers and dual

non-inverting, enable inputs. It is capable of operating from a 4.5V to 18V single power supply, and can easily charge and discharge a 2200 pF gate capacitance in under 15 ns (typical). It provides low-impedance in both the ON and OFF states to ensure the MOSFET’s intended state will not be affected, even by large transients. The MCP14E4 inputs may be driven directly from either the TTL or CMOS (2.4V to 18V). It is an ideal choice for this application, allowing up to 4A of peak gate drive current to switch Q2 rapidly and therefore, achieve low switching loss. It also has a small footprint, allowing it to be located physically close to the transistors, allowing a low-inductance gate circuit layout.

• R90,R94,R101 – These resistors are used to pull down the corresponding

input/output pins of the gate driver.

• D9, C26, C27 – Inductance of the power tracking between the source of Q2, due

to the physical board layout, means there is a substantial transient voltage between the +15V supply point reference at R28 and the source of Q2. This simple, low-cost circuit allows the power supply of U19 to move transiently.

• R75, R29 and D10 – These components control the current and voltage to turn on

and turn off the IGBT. R29 controls the rising time and the di/dt when the IGBT is turned ON. R29, in parallel with R75, controls the falling time and the di/dt when the IGBT is turned off.

DS50002505A-page 32  2016 Microchip Technology Inc.

Hardware

3.1.3 PFC Feedback Circuitry

In a digitally controlled PFC, the relevant analog parameters and control loops need to be redefined and discretized. This enables changeover from existing hardware, to its digital counterpart, easier and more logical.

The PFC is an AC-to-DC Converter, which converts the AC input voltage to a DC voltage and maintains sinusoidal input current at a high input power factor. In a digitally controlled PFC, three inputs signals are required to implement the current control.

The input rectifier (BR1) converts (shown in Section 3.1.1 “AC Supply Input”) the alter-

nating voltage at power frequency into a unidirectional voltage. This rectified voltage is fed to the chopper circuit to produce a smooth and constant DC output voltage to the load. The chopper circuit is controlled by the PWM switching pulses, generated by the Microchip PIC

• Rectified input voltage

• AC input voltage zero-crossing event

• Rectified input current

• DC bus voltage

The rectified input voltage is measured in two stages:

• Signal conditioning: R22, R23, R24, R25, C24 and D7 convert and filter the AC

input voltage waveform, from 90-265 VAC to 0-3.3 VAC. D7 limits the maximum voltage to 3.3V. C24, along with R22, R23 and R25, form a low-pass filter. The

circuit is shown in Appendix A. “Board Layout and Schematics”.

• Amplification: The operational amplifier, MCP6024 (U13B), amplifies the

conditioned AC input voltage; R45, R46, R47, R48, R49 and R51 set the gain. The MC6024 also shifts the conditioned AC input voltage to a 1.65V DC level. Therefore, the voltage applied to the dsPIC to 3.3V. The offset is controlled by R50, R53 and R54. R39 and C39 filter out the high-frequency noise.

An AC input voltage, zero-crossing event is sensed using a voltage divider (R2-R5) and

two optocouplers (U1 and U2). The circuit is shown in Appendix A. “Board Layout

and Schematics”.

Rectified input current is measured using the shunt resistor, R34, and the operational amplifier, MCP6024 (U13A); R38, R39, R40, R41, R42 and R43 set the gain. R43 shifts the voltage present at the shunt resistor to a 1.65V DC level. Therefore, the voltage applied to the dsPIC trolled by R43, R53 and R54. R44 and C37 filter out the high-frequency noise. The

circuit is shown in Appendix A. “Board Layout and Schematics”.

The DC bus voltage is sensed at the power module stage. Please refer to

Section 3.2.4 “Feedback Circuitry” for more information.

MCU/dsPIC® DSC devices, based on four measured feedback signals:

DSC ADC channel varies within 0V

DSC ADC channel varies within 0V to 3.3V. The offset is con-

 2016 Microchip Technology Inc. DS50002505A-page 33

dsPICDEM™ MCHV-3 Development Board User’s Guide

3.1.4 Power Supplies

The PFC Stage Board provides the 15V power supply required to fire the power module IGBTs. The 15V power supply is built using a low-power offline SMPS primary switcher. The switching frequency is fixed to 60 kHz; the feedback signal to the power supply is provided by the optocoupler. The output voltage is regulated at 15V with a maximum output current of 0.750A, with the resultant maximum power at 11.25W. The input voltage range for this power supply is from 90 VAC to 265 VAC.

The PFC stage board also provides the 3.3V to powering up the Microchip PIC MCU/dsPIC programmer, etc. It also generates the 3.3V for powering the analog circuits and the analog reference for the Analog-to-Digital Converter (ADC) module.

The 3.3V rail is created using a step-down regulator, which is attached to the 15V regulator. The maximum output current is 0.650A, thus the resultant maximum power is 2.145W.

The 3.3V rail required for the analog circuits, such as the current feedback and the Analog-to-Digital Converter, is generated by a decoupling circuitry attached to the

3.3V regulator.

3.1.5 Fault Circuitry

Given the development nature of the system, robust independent Fault protection is provided on the PFC stage board. Two different Fault categories are used to indicate a Fault to the Microchip PIC MCU/dsPIC DSC devices.

DC Bus Overcurrent: This Fault signal is generated when the maximum current limit

of 13A is reached. The comparison of the threshold value and the actual current is done by comparator, U8. The threshold limit is set by R56 and R57. R69 is a shunt jumper resistor that can disconnect the overcurrent Fault to the Microchip PIC MCU/dsPIC DSC devices.

DC Bus Overvoltage: This Fault signal is generated when the maximum voltage limit

on the DC bus rails is reached. The threshold value is set to 412V. The comparison of the threshold value and the actual DC bus voltage is done by comparator, U7. The threshold limit is set by R96, R60, R61 and R62. R66 is a shunt jumper resistor that can disconnect the overvoltage Fault to the Microchip PIC MCU/dsPIC DSC devices.

DSC devices, the isolation circuitry, the communication ports, the Starter Kit

Note: Both comparators are of an open-drain type and need an external pull-up

resistor. Both circuits share this pull-up resistor, creating an OR condition at the output.

DS50002505A-page 34  2016 Microchip Technology Inc.

Hardware

3.1.6 Board Connectors

The PFC stage board has four tab fast-on connectors, one AC inlet and one 14-pin keyed connector for attaching a flat cable.

For the AC mains supply input, standard double-insulated, 3-core flex cable should be used with a minimum current rating of 10A (1 mm can be used. The recommended cable size is 1.0 mm and it should have a 600V rating. This cable should also be double-insulated or have a protective ground screen.

Note 1: The system is designed for Installation Category II. Therefore, the

incoming mains cable should be wired into a standard non-locking, 2-pin in addition with an earth ground-type plug.

2: The unit is designed to be connected to the AC mains supply via a

standard non-locking plug. As the unit has no mains switch, this plug constitutes the means of disconnection from the supply. Therefore, the user must have unobstructed access to this plug during operation.

18 AWG). A computer power cable

to 1.5 mm

(18 AWG to 16 AWG)

The tab fast-on connectors, AC_N and AC_L, provide the connections to the bridge rectifier, BR1. The recommended cable size is 18 AWG to 16 AWG or 1.0 mm

1.5 mm

. It is also recommended that cables used for the power connections should

be terminated with blue or red crimp terminals. If crimp terminals are not used, care should be taken to ensure that stray strands of wire do not short to adjacent terminals or the enclosure. If possible, all wires should be stripped and tinned with solder before connecting to the dsPICDEM™ MCHV-3 Development Board terminals.

The fast-on connectors, PFC_OUT “+” and PFC_OUT “-”, provide DC bus voltage to the power module stage. The recommended cable size is 18 AWG to 16 AWG or

1.0 mm

to 1.5 mm2. It is also recommended that cables used for the power connections should be terminated with blue or red crimp terminals. If crimp terminals are not used, care should be taken to ensure that stray strands of wire do not short to adjacent terminals or the enclosure. If possible, all wires should be stripped and tinned with solder before connecting to the dsPICDEM™ MCHV-3 Development Board terminals.

Note: The user should only access the power terminals when the system is fully

discharged (see the Safety Notice” section on page 5).

 2016 Microchip Technology Inc. DS50002505A-page 35

dsPICDEM™ MCHV-3 Development Board User’s Guide

The 14-pin keyed connector provides the signals and power supply rails from and to the power stage. These signals are shown in Table 3-1.

TABLE 3-1: 14-PIN KEYED CONNECTORS

Number Name Type

1 3.3V, Digital Rail Output

2 Fault (Overcurrent or Overvoltage Condition) Output

3 3.3V, Analog Rail Output

4 AC Input Voltage Feedback Output

5 Ground, Analog Rail Output

6 AC Input Current Feedback Output

7 PFC Driver Enable Output

8 VAC Zero-Crossing Signal Output

9 Ground, Digital Rail Output

10 PWM Signal for the PFC IGBT Input

11 Ground, Digital Rail Output

12 Not Connected NC

13 15V Output

14 Not Connected NC

DS50002505A-page 36  2016 Microchip Technology Inc.

Hardware

3.2 POWER MODULE STAGE

This board has two main functions: the first is to control the motor using a Microchip PIC MCU/dsPIC DSC device and a power module, and the associated feedback signals for each control algorithm; the second is to provide a safe method in which to interact with the user.

Note: The circuits for the hardware described in this section are shown in

Appendix A. “Board Layout and Schematics”.

3.2.1 Plug-In Module Configuration

Ta bl e 3 - 2 summarizes the pinout functionality of the PIM (U11).

TABLE 3-2: dsPICDEM™ MCHV-3 PIM PINOUT FUNCTIONALITY

Routed

PIM

Pin #

1 DBG_LED1 Debug LED 1 No

3 PWM1H3 PWM Output – 3H No

4N/A N/A No

5N/A N/A No

6N/A N/A No

7N/A N/A No

8N/A N/A No

9N/A N/A No

10 N/A N/A No

11 N/A N/A No

12 N/A N/A No

13 MCLR

14 N/A N/A No

15 V

16 V

17 N/A N/A No

18 FAULT IBus Current Fault (active-low logic) No

19 PFC_FLT IPFC Fault (overvoltage or overcurrent) No

20 PIM_INDX/POT/V_M3 Hall Sensor/Current Sense/Voltage Feedback Signal Yes

21 PIM_QEB/IB/V_M2 Hall Sensor/Current Sense/Voltage Feedback Signal Yes

22 PIM_QEA/IA/V_M1 Hall Sensor/Current Sense/Voltage Feedback Signal Yes

23 PIM_IBUS/V

24 PIM_IB/POT AC Input Zero Cross/AC Input Voltage (downscaled)/Potentiometer Yes

25 PIM_IA/IPFC PFC Current (buffered) Yes

26 PGC Device Programming Clock Line No

27 PGD Device Programming Data Line No

28 AV

29 PIM_REC_NEUTR Reconstructed Motor Neutral Line Voltage Yes

30 AV

31 AV

Signal Name Pinout Description

BUS

/2 Reference Voltage (half of AVDD voltage) No

N/A No

Device Master Clear No

N/A No

DC Bus Voltage (downscaled) Yes

Analog Supply No

Matrix

Board

via

 2016 Microchip Technology Inc. DS50002505A-page 37

dsPICDEM™ MCHV-3 Development Board User’s Guide

TABLE 3-2: dsPICDEM™ MCHV-3 PIM PINOUT FUNCTIONALITY (CONTINUED)

Routed

PIM

Pin #

32 PIM_POT Potentiometer Signal Yes

33 PIM_POT Potentiometer Signal Yes

34 PIM_GEN2 General I/O Yes

35 PIM_DC_BUS DC Bus Voltage (downscaled) Yes

36 V

37 V

38 PIM_VAC_VOL2 AC Input Voltage (unbuffered) Yes

39 PIM_IPFC_C_SHUNT PFC Shunt Signal Yes

40 PIM_PFC_L PFC Shunt Signal Yes

41 PIM_V_M1/POT Hall Sensor/Current Sense/Voltage Feedback Signal Yes

42 PIM_V_M2 Hall Sensor/Current Sense/Voltage Feedback Signal Yes

43 PIM_V_M3/IBUS Hall Sensor/Current Sense/Voltage Feedback Signal Yes

44 N/A N/A No

45 V

46 V

47 HB/QEB Hall Sensor/QEI Input No

48 HC/INDX Hall Sensor/QEI Input No

49 RX UART Receive No

50 TX UART Transmit No

51 N/A N/A No

52 N/A N/A No

53 N/A N/A No

54 N/A N/A No

55 N/A N/A No

56 N/A N/A No

57 N/A N/A No

58 PIM_FLT_OUT2 General I/O Yes

59 PIM_FLT_OUT1 General I/O Yes

60 DBG_LED2 Debug LED #2 No

61 HOME Home Signal for QEI (test point only) No

62 V

63 OSCI Crystal Oscillator In No

64 OSCO Crystal Oscillator Out No

65 V

66 PIM_IBUS+ IBus Shunt Signal Yes

67 PIM_IBUS- IBus Shunt Signal Yes

68 BTN Push Button No

69 N/A N/A No

70 RX UART Receive No

71 PIM_PFC_PWM PFC PWM Output Yes

72 HA/QEA Hall Sensor/QEI Input No

73 PIM_IB+ IB Shunt Signal Yes

Signal Name Pinout Description

N/A No

via Matrix Board

DS50002505A-page 38  2016 Microchip Technology Inc.

Hardware

TABLE 3-2: dsPICDEM™ MCHV-3 PIM PINOUT FUNCTIONALITY (CONTINUED)

PIM

Pin #

74 PIM_IA+ IA Shunt Signal Yes

75 V

76 HB/QEB Hall Sensor/QEI Input No

77 PIM_HALLC/INDX/STP_PWM Hall Sensor/QEI Input Yes

78 PIM_PFC_PWM PFC PWM Output Yes

79 VACZX AC Input Zero Cross No

80 HA/QEA Hall Sensor/QEI Input No

81 N/A N/A No

82 PIM_GEN1 General I/O Yes

83 N/A N/A No

84 TX UART Transmit No

85 N/A N/A No

86 V

87 N/A N/A No

88 N/A N/A No

89 N/A N/A No

90 N/A N/A No

91 N/A N/A No

92 N/A N/A No

93 PWM1L1 PWM Output – 1L No

94 PWM1H1 PWM Output – 1H No

95 N/A N/A No

96 N/A N/A No

97 N/A N/A No

98 PWM1L2 PWM Output – 2L No

99 PWM1H2 PWM Output – 2H No

100 PWM1L3 PWM Output – 3L No

Signal Name Pinout Description

N/A No

Routed

via

Matrix

Board

 2016 Microchip Technology Inc. DS50002505A-page 39

dsPICDEM™ MCHV-3 Development Board User’s Guide

3.2.2 Power Supplies

The system default configuration is to get the 15V, 3.3V and 3.3V analog rail voltages from the PFC stage board. However, it is also possible to use an external 24V power supply to generate these voltages.

U19, C70, C73, C71 and C74 regulate the voltage applied to the system via J15 (28V max). The output of the regulator is connected to the system through R109. The circuit

is shown in Appendix A. “Board Layout and Schematics”.

Note: It is the responsibility of the user to populate these components if an

external power supply is used.

U18, C67, R110, C68, D16, D15, L3, R111, R112 and C75 regulate the 15V to create a 3.3V digital rail. This auxiliary 3.3V digital rail is applied to the system through R106.

The circuit is shown in Appendix A. “Board Layout and Schematics”.

Note: It is the responsibility of the user to populate these components if an

external power supply is used.

R114, R107, C69 and C72 form a decoupling circuit for generating a 3.3V rail for the analog circuitry, such as the ADC reference and the current feedback reference. This auxiliary 3.3V analog rail is applied to the system through R108.

Note: It is the responsibility of the user to populate these components if an

external power supply is used.

3.2.3 Power Module

The three-phase inverter is embedded in a power module (U16). This power module contains:

• 600V/30A 3-phase IGBT inverter bridge

• Gate driver circuitry for each IGBT

• Three independent connections to the negative DC bus for current sensing

• Short-circuit protection circuitry

• Thermal shutdown

• Gate driver power supply undervoltage protection

• Gate driver power supply overvoltage protection

• Single grounded power supply

• Isolation of 2.5 kV per minute

• Maximum switching frequency: 20 kHz

The Microchip PIC MCU/dsPIC DSC devices provide the PWM signals to this power module in order to turn on/off the IGBT and therefore, apply power to the motor phases.

R95 and R124 set the threshold limit for the overcurrent circuitry. If this voltage is greater than 0.5V (typical), a Fault signal is asserted and the low-side IGTBs are turned off. R94 and C53 form a low-pass RC filter that filters out the frequencies above

88.4 kHz.

C56 sets the Fault pulse duration; the value of C56 is given by the following equation: C56 = 18.3E – 6 x 1.8E – 3 seconds. Therefore, the Fault pulse duration is 54 µs.

The power module Fault Output pin (VFO) is configured as an open-collector. R50 pulls up the Fault output to the analog 3.3V rail. R53 and C40 form a low-pass RC filter that filters out the frequencies above 53 kHz.

For more information about this power module, please refer to the manufacturer’s data sheet.

DS50002505A-page 40  2016 Microchip Technology Inc.

Hardware

3.2.4 Feedback Circuitry

The power module stage provides three different methods to sense the motor position. These signals are also useful to determine the speed, torque, current consumption and applied voltage.

Hall Sensors: The Hall sensor circuitry is designed to attach open-collector configured

sensors. It has a pull-up resistor at the Hall sensor inputs (R23, R24 and R25) and a voltage divider (R26-R29, R27-R30, R28-R31) in order to scale the input waveforms to the PIC MCU or dsPIC DSC logic levels. C25-C27 and R26-R28 form a low-pass RC filter for each Hall sensor signal.

Phase Voltage Feedback: For each phase, this circuitry is compounded by a voltage

divider, a current limiter and a low-pass RC filter. R79, R84 and R92 scale the Phase M1 voltage in order to match the PIC MCU or dsPIC the current going to the ADC pin (<6 mA). C51, R79 and R84 form the low-pass filter. The Phase M2 and M3 have the exact same circuitry as shown in the schematic.

DC Bus V oltage Feedback: This voltage feedback is compounded by a voltage divider

and a low-pass RC filter. R75, R76 and R81 scale the DC bus voltage in order to match the PIC MCU or dsPIC DSC logic levels. C47, R75 and R76 form the low-pass filter.

Inverter Leg Shunt Resistor Feedback: A shunt resistor is located between the

emitter of the low-side switches, M1 and M2, and the “-DC bus”. A simple differential

amplifier circuit is used, as shown in Appendix A. “Board Layout and Schematics”.

The operation of the circuit used for the Phase M1 leg is described in the following paragraph.

The current is measured using the shunt resistor, R86, and the operational amplifier, MCP6024 (U13A); R32, R33, R34, R36 and R37 set the gain. R38 shifts the voltage present at the shunt resistor to a 1.65V DC level. Hence, the voltage applied to the PIC MCU or dsPIC DSC ADC channel varies within 0V to 3.3V. The offset is controlled by R59, R60, R38 and U13D. R35 and C34 filter out the high-frequency noise.

The same topology is used for the Phase M2.

DC Bus Current Feedback: A shunt resistor is located between the shunt resistors of

side switches, M1 and M2, and the “-DC bus”. A simple differential amplifier circuit is used, as shown in the schematic. The operation of the circuit used for sensing the DC bus current is described in the following paragraph.

The current is sensed using the shunt resistor, R95, and the operational amplifier, MCP6024 (U13C); R49, R51, R52, R56 and R57 set the gain. R58 shifts the voltage present at the shunt resistor to a 1.65V DC level. Hence, the voltage applied to the PIC MCU or dsPIC DSC ADC channel varies within 0V to 3.3V. The offset is controlled by R59, R60, R58 and U13D. R54 and C42 filter out the high-frequency noise.

DSC logic levels. R85 limits

Note: It is possible to select any of these feedback signals using jumpers, J12,

J13 and J14. Please refer to Section 3.2.9 “User Interfaces” for more

information.

 2016 Microchip Technology Inc. DS50002505A-page 41

dsPICDEM™ MCHV-3 Development Board User’s Guide

Shunt Resistor Signals (direct)

Reconstructed Motor Neutral Voltage

Feedback Signals

(Hall sensor/phase voltage/shunt resistor)

DC Bus Voltage

Potentiometer

Matrix Board

Plug-In Module

3.2.5 Matrix Board

The functions of the matrix board interface are to:

• Connect the appropriate signals to the correct pins on the PIM

• Disconnect signals and provide isolation on signal paths that are not being used in a particular hardware configuration

The matrix board header has two rows of pins. One row (Pin 1 to Pin 25) hosts signals from different signal sources, while the other (Pin 26 to Pin 50) hosts connections to the PIM. A block diagram describing the matrix board interface is shown in Figure 3-1.

FIGURE 3-1: MATRIX BOARD BLOCK DIAGRAM

DS50002505A-page 42  2016 Microchip Technology Inc.

The dsPICDEM™ MCHV-3 Development Board uses discrete op amps (U13) to amplify the shunt resistor signals. Alternatively, some of the PIC MCU or dsPIC DSC devices include on-board op amps that can be used for this purpose. To accommodate these two basic configurations, the dsPICDEM™ MCHV-3 Development Board comes with two matrix boards.

The internal op amp configuration matrix board is used to configure the development board to use op amps that are internal to the PIC MCU or dsPIC DSC devices. This matrix board bypasses the current feedback circuitry on the Power Module Board and directly connects the shunt resistor signals to the appropriate pins of the PIM.

The External Op Amp Configuration Matrix Board is used to configure the development board to use the current feedback circuitry on the Power Module Board. This matrix board disconnects the shunt resistor signals from the Plug-In Module pins and connects the current feedback circuitry output to the appropriate Plug-In Module pins.

The PFC – External Op Amp Configuration Matrix Board is used for configuring the development board to use the current feedback circuitry on the Power Module Board and current/voltage feedback circuitry on the PFC board. This matrix board disconnects the shunt resistor signals from the Plug-In Module pins and connects the current feedback circuitry output to the appropriate Plug-In Module pins. In addition, it also connects the PFC input AC current and PFC input AC voltage signals.

Note: Unless specified in the Plug-In Module information sheet, all PIMs are

compatible only with the External Op Amp Configuration Matrix Board. Certain PIMs are designed to work with the Internal Op Amp Configuration Matrix Boards only. In this case, the corresponding PIM information sheet and/or Readme file within the source code folder (available at

www.microchip.com/pims) will explicitly state this. Using any combination

(Development Board + PIM + Matrix Board) other than that mentioned in the Readme file placed in the source code may lead to unexpected operation.

Hardware

3.2.6 Fault Circuitry

In addition to the Fault signal generated by the power module, the system can also create a DC bus overcurrent Fault.

DC Bus Overcurrent: This Fault signal is generated when the maximum current limit

of 15A is reached. The comparison of the threshold value and the actual current is done by comparator, U14. The threshold limit is set by R42 and R47.

Note: The comparator is open-drained and needs an external pull-up resistor.

Both the power module output and the comparator output share this pull-up resistor, creating an OR condition at the output.

3.2.7 Isolation

The power supply used by the push buttons, communication ports and the Starter Kit on-board programmer/debugger is isolated from the power supply used by the power module or the Microchip PIC MCU/dsPIC DSC devices. An isolated 3.3V rail is generated from the digital 3.3V rail using a DC-to-DC Converter (U10). This converter provides galvanic isolation, rated up to 1000 V

3.2.8 Communication Ports

The Power Module Stage Board provides two methods for transmitting/receiving data to and from the system. Both communication methods are powered using the isolated

3.3V rail.

UART-to-USB: This communication port is based on a PIC18LFJ2450 device with a

serial emulator firmware. This device translates the USB signals to the Microchip PIC MCU/dsPIC DSC UART compatible signals. Isolation for the UART-to-USB communication port is provided by U25.

UART-to-RS-232: This communication port is based on a RS-232 transceiver (U9).

This device translates the PIC MCU/dsPIC DSC UART signals to UART compatible signals. Isolation for the UART-to-RS-232 communication port is provided by U25.

Shunt jumpers, J2 and J3, select the communication port. Ta b le 3 -3 shows the possible configurations.

/1 second.

TABLE 3-3: COMMUNICATION PORT CONFIGURATION

Designator Position Description

J2 1-2 Connects UART Receive Line to RX.

2-3 Connects USB Receive Line to RX.

J3 1-2 Connects UART Transmit Line to TX.

2-3 Connects USB Transmit Line to TX.

 2016 Microchip Technology Inc. DS50002505A-page 43

dsPICDEM™ MCHV-3 Development Board User’s Guide

3.2.9 User Interfaces

There are two types of user interfaces, isolated and non-isolated.

• Isolated Interfaces:

- Potentiometer labeled “POT” (R14)

- RESET Push Button

- PUSH BUTTON (S1)

- PWM OUTPUT Enable Shunt Jumper (J7)

- Communication Port Selection Shunt Jumper (J2 and J3)

- ICSP™ Programmer/Debugger Connector for the Starter Kit on the Board (J4)

- ICSP Programmer/Debugger Connector for the UART-to-USB Converter (J1)

• Non-Isolated Interfaces:

- 15V Power Supply LED (D17)

- 3.3V Power Supply LED (D18)

- PWM2L1, PWM1L1, PWM1H1, PWM1L2, PWM1H2, PWM1L3, PWM1H3

LEDs

- USB Communication LED (D1)

- USB Cable Connected LED (D3)

- Starter Kit On-Board USB Cable Connected LED (D21)

- Starter Kit On-Board Power-on LED (D19)

- ICSP Programmer/Debugger Connector for the PIC MCU or dsPIC DSC (J18)

- Feedback Selection Shunt Jumpers, J11, J12, J13 and J14

- Debug LEDs (D2 and D19)

Ta bl e 3 - 4 shows the multiple feedback signals that can be selected.

TABLE 3-4: MULTIPLE FEEDBACK SIGNALS

Designator Position Description

J11 1-2 Connects AC Input Voltage Zero-Crossing Event to

VACZX_VAC_POT

3-4 Connects AC Input Voltage to VACZX_VAC_POT

5-6 Connects the POT Voltage to VACZX_VAC_POT

J12 1-2 Connects Phase M1 Shunt Current Feedback to MONITOR_1

3-4 Connects Phase M1 Voltage Feedback to MONITOR_1

5-6 Connects Hall A/QEA Sensor Signal to MONITOR_1

J13 1-2 Connects Phase M2 Shunt Current Feedback to MONITOR_2

3-4 Connects Phase M2 Voltage Feedback to MONITOR_2

5-6 Connects Hall B/QEB Sensor Signal to MONITOR_2

J14 1-2 Connects DC Bus Shunt Current Feedback to MONITOR_3

3-4 Connects Phase M3 Voltage Feedback to MONITOR_3

5-6 Connects Hall C/INDEX Sensor Signal to MONITOR_3

7-8 Connects the POT Voltage to MONITOR_3

DS50002505A-page 44  2016 Microchip Technology Inc.

3.2.10 Hardware for Programming and Debugging

The dsPICDEM™ MCHV-3 Development Board, with its built-in Starter Kit on-board debugger/programmer, provides an all-in-one solution for debugging and programming applications using MPLAB IDE. The debugging/programming operations are controlled by a PIC24FJ256GB106 MCU. The PIC24FJ256GB106 device’s built-in USB engine provides the communication interface between the Starter Kit on the board and the host PC.

Power to the Starter Kit on the board is provided via the isolated 3.3V rail. The PIC24FJ256GB106 MCU accomplishes debugging or programming of the target PIC MCU or dsPIC DSC by controlling the target’s MCLR PGD1/EMUD1 signals. A Microchip 25LC256 serial EEPROM is used to store the serial number and debug control information. Isolation for the MCLR and PGD1/EMUD1 signals is provided by the digital isolators, U3, U6, U22 and U7.

3.2.11 Board Connectors

Figure 3-2 provides the locations of the connectors. The Power Module Stage Board

connectors are listed in Ta b le 3- 4.

FIGURE 3-2: POWER MODULE BOARD CONNECTORS

Hardware

, PGC1/EMUC1 and

, PGC1/EMUC1

 2016 Microchip Technology Inc. DS50002505A-page 45

dsPICDEM™ MCHV-3 Development Board User’s Guide

TABLE 3-5: POWER MODULE STAGE BOARD CONNECTORS

Number Designator Type

1 Motor Phase 1 (M1) Output/Power

2 Motor Phase 2 (M2) Output/Power

3 Motor Phase 3 (M3) Output/Power

4 DC Bus “+” Input/Power

5 DC Bus “-” Input/Power

6 Hall Sensor A (HA) Input

7 Hall Sensor B (HB) Input

8 Hall Sensor C (HC) Input

9 Hall Sensors, 5V Power Supply Terminal Output/Power

10 Hall Sensors, Ground Terminal Output/Power

11 UART-to-USB Connector Input/Output

12 UART-to-RS-232 Connector Input/Output

13 USB Connector for the Starter Kit Programmer/Debugger Input/Output

14 Connector for Matrix Board (J4) Input/Output

15 Isolated ICSP™ Programmer/Debugger Connector for

UART-to-USB Converter (J1)

16 ICSP Programmer/Debugger Connector for PIC

17 14-Pin Keyed Connector (J16) Input/Output/Power

dsPIC

DSC (J18)

MCU or

Input/Output

The 14-pin keyed connector provides the signals, and power supply rails, from and to the Power Module Stage Board. These signals are shown in Ta b le 3 -6 .

TABLE 3-6: 14-PIN KEYED CONNECTORS

Number Name Type

1 3.3V, Digital Rail Output

2 AC Input Voltage Feedback (not buffered) Output

3 3.3V, Analog Rail Output

4 AC Input Voltage Feedback (buffered) Output

5 Ground, Analog Rail Output

6 AC Input Current Feedback Output

7 Fault (overcurrent or overvoltage condition) Output

8 VAC Zero-Crossing Signal Output

9 PFC Shunt Signal Output

10 PWM Signal for the PFC IGBT Input

11 Ground, Digital Rail Output

12 PWM Fault Output

13 15V Output

14 PFC Shunt Signal Output

DS50002505A-page 46  2016 Microchip Technology Inc.

3.3 ELECTRICAL SPECIFICATIONS

The maximum power and current capability of the system is dictated by the allowable temperature rise of the different components. Establishing maximum limits is not simple, given the different ways the user may use the system. The voltage and the nature of the electrical load used, both affect the dissipation that occurs. In determining the allowable limits for the power semiconductors, the following assumptions have been made:

• Heat sink is at 70°C (worst case)

• Thermal resistance of the insulating thermal pad is 3°C/W

TABLE 3-7: INVERTER ELECTRICAL SPECIFICATIONS

Parameter Min Typ Max Units

Hardware

DC Bus 40 310 400 V

Current 0.1 6.5

Power Rating 4 2015

Switching Frequency 0 — 20 kHz

Note 1: The system is continuously operated during one hour; 15 kHz switching frequency

and the PFC boost circuit are disabled.

2: It is possible to increase the available maximum output power, up to 4000W, by

using an external ventilation mechanism attached to the system near to the power module. To provide additional air flow, a conventional AC muffin fan can be used (Comair-rotron Part Number 028021 or 028023). An alternative bonded fin heat sink with fans attached is also an option (C&H Technology, Inc. Part Number CH5117F).

(1)

(2)

4000

(1)

(2)

Watts

TABLE 3-8: PFC ELECTRICAL SPECIFICATIONS

Parameter Min Typ Max Units

DC Bus 90 380 400 V

Current 0.1 2.1 2.5

Power Rating 9 800 1000W

Switching Frequency 0 50 100 kHz

Note 1: The system continuously operated during one hour; 50 kHz switching frequency.

2: It is possible to increase the available maximum output power, up to 1000W, by

using an external ventilation mechanism attached to the system near to the PFC IGBT. To provide additional air flow, a conventional AC muffin fan can be used (Comair-rotron Part Number 028021 or 028023). An alternative bonded fin heat sink with fans attached is also an option (C&H Technology, Inc. Part Number CH5117F).

(1)

(2)

Watts

 2016 Microchip Technology Inc. DS50002505A-page 47

dsPICDEM™ MCHV-3 Development Board User’s Guide

NOTES:

DS50002505A-page 48  2016 Microchip Technology Inc.

dsPICDEM™ MCHV-3 DEVELOPMENT

Appendix A. Board Layout and Schematics

A.1 INTRODUCTION

This chapter provides detailed technical information on dsPICDEM™ MCHV-3 Development Board.

A.2 BOARD SCHEMATICS AND LAYOUT

The following schematics and layout diagrams provided detailed information about the board:

• Figure A-1 – PFC Stage Board Layout (Top)

• Figure A-2 – PFC Stage Schematic (Sheet 1 of 3)

• Figure A-3 – PFC Stage Schematic (Sheet 2 of 3)

• Figure A-4 – PFC Stage Schematic (Sheet 3 of 3)

• Figure A-5 – Power Module Stage Board Layout (Top)

• Figure A-6 – Power Module Stage Board Layout (Bottom)

• Figure A-7 – Power Module Stage Schematic (Sheet 1 of 6)

• Figure A-8 – Power Module Stage Schematic (Sheet 2 of 6)

• Figure A-9 – Power Module Stage Schematic (Sheet 3 of 6)

• Figure A-10 – Power Module Stage Schematic (Sheet 4 of 6)

• Figure A-11 – Power Module Stage Schematic (Sheet 5 of 6)

• Figure A-12 – Power Module Stage Schematic (Sheet 6 of 6)

• Figure A-13 – Internal Op Amp Configuration Matrix Board Schematic

• Figure A-14 – External Op Amp Configuration Matrix Board Schematic

• Figure A-15 – PFC – External Op Amp Configuration Board Schematic

BOARD USER’S GUIDE

 2016 Microchip Technology Inc. DS50002505A-page 49

dsPICDEM™ MCHV-3 Development Board User’s Guide

FIGURE A-1: PFC STAGE BOARD LAYOUT (TOP)

DS50002505A-page 50  2016 Microchip Technology Inc.

Board Layout and Schematics







FIGURE A-2: PFC STAGE SCHEMATIC (SHEET 1 OF 3)

 2016 Microchip Technology Inc. DS50002505A-page 51

dsPICDEM™ MCHV-3 Development Board User’s Guide

FIGURE A-3: PFC STAGE SCHEMATIC (SHEET 2 OF 3)

DS50002505A-page 52  2016 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-4: PFC STAGE SCHEMATIC (SHEET 3 OF 3)

 2016 Microchip Technology Inc. DS50002505A-page 53

dsPICDEM™ MCHV-3 Development Board User’s Guide



FIGURE A-5: POWER MODULE STAGE BOARD LAYOUT (TOP)

DS50002505A-page 54  2016 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-6: POWER MODULE STAGE BOARD LAYOUT (BOTTOM)

 2016 Microchip Technology Inc. DS50002505A-page 55

dsPICDEM™ MCHV-3 Development Board User’s Guide

AVDD/2 PWM1L2

PIM_POT

PIM_GEN2

PIM_PFC_L

HA/QEA

RX PIM_HALLC/INDX/STP_PWM

PIM_V_M3/IBUS

V_M2

VBUS

MONITOR_1

IPFC_C_SHUNT

IA_SHUNT+

GND_DIG

DBG_LED1

GND_DIG

OSCI

IPFC

VBUS

OSCO

V_M3

HC/INDX

PWM2L1

POT

REC_NEUTR

PFC_L

MONITOR_2

IB_SHUNT+

IBUS_SHUNT+

IBUS_SHUNT-

GND_DIG

1413

PGC

PGD

PWM1L3

PWM1H2

PWM1H1

PWM1L1

+3.3V_DIG

PIM_V_M2

+3.3V_DIG

9 8

HB/QEB

HC/INDX

VACZX

PIM_GEN1

PIM_PFC_PWM

TX HB/QEB

GND_DIG

FAULT_IP/IBUS

GND_DIG

V_M1

FAULT_IP/IBUS

MONITOR_3

VAC_VOL2

GND_DIG

PIM_REC_NEUTR

PIM_DC_BUS

PIM_VAC_VOL2

PIM_V_M1/POT

PIM_IPFC_C_SHUNT

FAULT

PIM_IBUS/VBUS

PIM_INDX/POT/V_M3

IPFC ISO_D+

PIM_FLT_OUT1

BTN

PIM_PFC_PWM

PIM_IA+

PIM_GEN1

PIM_IB/POT

PIM_DC_BUS

PIM_IA+

PFC_FLT

PFC_PWM

VACZX

15V_PFC

PFC_L

AVDD_PFC VAC

VDD_PFC VAC_VOL2

PIM_IA/IPFC

PIM_IB/POT

PFC_FLT

PIM_QEB/IB/V_M2

PIM_QEA/IA/V_M1

FAULT

MCLR

+3.3V_DIG

GND_DIG

PWM1H3

+3.3V_DIG

ISO_D-

ISO_VDD_USB

GND_DIG

+3.3V_DIG

PIM_FLT_OUT2

OSCI

HOME

DBG_LED2

OSCO

PIM_IBUS-

PIM_IBUS+

HA/QEA

PIM_IB+

PIM_GEN2

PIM_IA/IPFC

PIM_POT

PIM_V_M2

PIM_PFC_L

PIM_IBUS-

PIM_IB+

PIM_IBUS+

HC/INDX

HB/QEB

HA/QEA

+3.3V_DIG

GND_DIG

181921

121315

679

134

PIM_QEB/IB/V_M2

PIM_FLT_OUT2

VACZX_VAC_POT

PIM_V_M1/POT

PIM_IPFC_C_SHUNT

IPFC_C_SHUNT

PIM_INDX/POT/V_M3

+3.3V_ANA

PIM_HALLC/INDX/STP_PWM

PIM_PFC_PWM

+3.3V_ANA

PIM_IBUS/VBUS

PIM_REC_NEUTR

PIM_QEA/IA/V_M1

PIM_FLT_OUT1

PIM_V_M3/IBUS

PIM_VAC_VOL2

FIGURE A-7: POWER MODULE STAGE SCHEMATIC (SHEET 1 OF 6)

DS50002505A-page 56  2016 Microchip Technology Inc.

Board Layout and Schematics

VFO

15V

M3_L

M1_H

VCC(UH)

VS(M2)

VCC(VH)

VS(M3)

VCC(WH)

IB_SHUNT+

15V_PFC

V_M3

V_M1

VDD_PFC

VBUS

GND_DIG

M1_L

M2_L

VS(M1)

VB(U)

VB(V)

M2_H

VB(W)

M3_H

GND_DIG

15V

IBUS_SHUNT-

GND_DIG

IBUS_SHUNT+

GND_DIG

D16

SS1P3L

GND_DIG

VDD_EXT

15V

AVDD_PFC

GND_DIG

VDD_EXT

GND_DIG

SML4747

D14

IBUS_SHUNT+

IA_SHUNT+

V_M1

V_M2

VCC(WH)

VS(M3)

VS(M2)

IBUS_SHUNT+

GND_DIG

D15

BAT17

GND_DIG

+3.3V_DIG

REC_NEUTRV_M3

V_M2

+3.3V_ANA

VB(W)

VCC(VH)

VB(V)

VCC(UH)

VS(M1)

VB(U)

15V

GND

4EN5

6SW1

BOOST

GND_DIG

BP2

BP1

GND

OUT

FIGURE A-8: POWER MODULE STAGE SCHEMATIC (SHEET 2 OF 6)

 2016 Microchip Technology Inc. DS50002505A-page 57

dsPICDEM™ MCHV-3 Development Board User’s Guide

V_M2

POT

MONITOR_1

AVDD/2

FAULT_IP/IBUS

V_M3

POT

VAC

PWM2L1

PWM1L2

PWM1H3

AVDD/2

IBUS_SHUNT-

AVDD/2

IBUS_SHUNT+

IA_SHUNT+

FAULT

HC/INDX

HB/QEB

MONITOR_2

V_M1

VACZX

PWM1L1

PWM1H1

PWM1H2

PWM1L3

+3.3V_ANA

IBUS_SHUNT+

IB_SHUNT+

AVDD/2

+3.3V_ANA

GND_DIG

MONITOR_3

FAULT_IP/IBUS

561

3 4

VACZX_VAC_POT

IBUS_SHUNT+

+3.3V_ANA

VFO

137

HA/QEA

5 6

3 4

IN+4IN-

3 4

PWM1L2

M3_H

PWM2L1

PWM1L3

M1_L

PWM_EN

PWM1H1

M2_H

M3_L

PWM1L1

PWM_EN

PWM1H2

PWM1H3

M1_H

M2_L

PFC_PWM

GND_DIG

2Y1

1A3

2Y4

1Y4

2A3

1Y1

2Y2

2Y3

1A4

11G2

1A1

1Y3

1Y2

2A2

GND

1A2

2A1

2A4

GND_DIG

+3.3V_ANA

13-12

6-5

4 11

FIGURE A-9: POWER MODULE STAGE SCHEMATIC (SHEET 3 OF 6)

DS50002505A-page 58  2016 Microchip Technology Inc.

Board Layout and Schematics

D+

D-

18F_PGD

PWM_EN

UART_TX_ISO

VDD_USB

D+

D-

18F_PGC

USB_TX_ISO

GND_DIG

+3.3V_DIG

BTN

GND_DIG

MCLR

PGC

USB_RX_ISO

416

16235

GND_DIG

416

UART_RX_ISO

ISO_D+

TARGET_MCLR

18F_PGD

MCLR_18F

USB_RX_ISO

UART_TX_ISO

POT

MCLR_18F

ISO_D-

18F_PGC

TARGET_MCLR

GND_DIG

UART_RX_ISO

USB_TX_ISO

PGD

+3.3V_DIG

GND_DIG

+3.3V_DIG

GND_DIG

+3.3V_DIG

7 98 6

345

GND_DIG

IN+4IN-

ISO_VDD_USB

V-

C2+

R1OUT

T2IN

R1IN

T2OUT

C2-2V+

GND

C1+

R2OUT

C1-

T1IN

R2IN

T1OUT

TARGET_MCLR

+3.3V_DIG

IN+

IN-

23123

TAB

MCLR

PGM/RB5

RCO/T1CKI

USB

D-/VM/RC4

RA1/AN1

RA0/AN0

AN11/RB4

PGC/RB6

PGD/RB7

RC2

RC1/UOE

D+//VP/RC5

TX/CK/RC6

INT2/RB2

RX/DT/RC7

INT0/RB0

AN9/RB3

INT1/RB1

RA3/AN37OSC2/CLKO

RA5/AN46OSC1/CLKI

RA2/AN23RA4/RCV

PIC18F2450

ICSP™ for USB

FIGURE A-10: POWER MODULE STAGE SCHEMATIC (SHEET 4 OF 6)

 2016 Microchip Technology Inc. DS50002505A-page 59

dsPICDEM™ MCHV-3 Development Board User’s Guide

MINI – ICSP™

INTERFACE

PICkit™ 3 MCU

FIGURE A-11: POWER MODULE STAGE SCHEMATIC (SHEET 5 OF 6)

DS50002505A-page 60  2016 Microchip Technology Inc.

Board Layout and Schematics

FIGURE A-12: POWER MODULE STAGE SCHEMATIC (SHEET 6 OF 6)

 2016 Microchip Technology Inc. DS50002505A-page 61

dsPICDEM™ MCHV-3 Development Board User’s Guide

IB u s _S HUNT +

IBu s _SHUNT-

IA_SHUNT+

IB_S HUNT+

VAC_ V OL2

IPFC_C_SHUNT

PFC_L

REC_NEUTR

MONITOR_1

MONITOR_2

MONITOR_3

BUS

/IBu s

IPFC/IA

VAC ZX_ VA C_ P OT/IB

POT

FAULT_ IP/ IB u s

PWM2L1

HC/INDX

V_M1

V_M2

V_M3

PIM_INDX /POT/V_M3

PIM_QEB/IB/V_M2

PIM_QEA/IA/V_M1

PIM_GE N2

PIM_GEN1

PIM_HAL LC/IND X /STP_PWM

PIM_PFC_PWM

PIM_FLT_OU T2

PIM_FLT_OUT1

PIM_POT

PIM_IB/POT

PIM_IA/IPFC

PIM_IBUS/V

BUS

PIM_DC _BUS

PIM_V_M3/IBus

PIM_V_M2

PIM_V_M1/POT

PIM_REC_NEUTR

PIM_PFC_L

PIM_IPFC_C_SHUN T

PIM_VAC _VOL2

PIM_IB+

PIM_IA+

PIM_IBus-

PIM_IBus+

FIGURE A-13: INTERNAL OP AMP CONFIGURATION MATRIX BOARD SCHEMATIC

DS50002505A-page 62  2016 Microchip Technology Inc.

Board Layout and Schematics

IBu s _SHUNT+

IBu s _SHUNT-

IA_SHUNT+

IB_S HUNT+

VAC_VOL2

IPFC_C_SHUNT

PFC_L

REC_ NEUTR

MONITOR_1

MONITOR_2

MONITOR_3

VBUS

VBUS/ IB u s

IPFC/IA

VACZX_VAC_POT/ IB

POT

FAULT_IP/ IB u s

PWM2L1

HC/INDX

V_M1

V_M2

V_M3

PIM_INDX /POT/V_M3

PIM_QEB/IB/V_M2

PIM_QE A/I A/V_ M1

PIM_GE N2

PIM_GEN1

PIM_HALLC/ INDX/STP_PWM

PIM_PFC_PWM

PIM_FLT_OU T2

PIM_FLT_OU T1

PIM_POT

PIM_IB/POT

PIM_IA/IPFC

PIM_IBus/V

BUS

PIM_DC_BUS

PIM_V_M3/IBus

PIM_V_M2

PIM_V_ M1/ POT

PIM_REC_NEUTR

PIM_PFC_L

PIM _IPFC_C_SHUNT

PIM_VAC _VOL2

PIM_IB+

PIM_IA+

PIM_IBus-

PIM_IBus+

FIGURE A-14: EXTERNAL OP AMP CONFIGURATION MATRIX BOARD SCHEMATIC

 2016 Microchip Technology Inc. DS50002505A-page 63

dsPICDEM™ MCHV-3 Development Board User’s Guide

IBus_SHUNT+

IBus_SHUNT-

IA_SHUNT+

IB_SHUNT+

VAC_VOL2

IPFC_C_SHUNT

PFC_L

REC_NEUTR

MONITOR_1

MONITOR_2

MONITOR_3

BUS

/IBus

IPFC/IA

VACZX_VAC_POT/IB

POT

FAULT_IP/IBus

PWM2L1

HC/INDX

V_M1

V_M2

V_M3

PIM_INDX/POT/V_M3

PIM_QEB/IB/V_M2

PIM_QEA/IA/V_M1

PIM_GEN2

PIM_GEN1

PIM_HALLC/INDX/STP_PWM

PIM_PFC_PWM

PIM_FLT_OUT2

PIM_FLT_OUT1

PIM_POT

PIM_IB/POT

PIM_IA/IPFC

PIM_IBus/V

BUS

PIM_DC_BUS

PIM_V_M3/IBus

PIM_V_M2

PIM_V_M1/POT

PIM_REC_NEUTR

PIM_PFC_L

PIM_IPFC_C_SHUNT

PIM_VAC_VOL2

PIM_IB+

PIM_IA+

PIM_IBus-

PIM_IBus+

FIGURE A-15: PFC – EXT OP AMP CONFIGURATION BOARD SCHEMATIC

DS50002505A-page 64  2016 Microchip Technology Inc.

dsPICDEM™ MCHV-3 DEVELOPMENT

BOARD USER’S GUIDE

Index

Application Debugging ............................................. 29

Running in Debug Mode ................................... 28

Application Programming......................................... 30

Block Diagrams

dsPICDEM MCHV-3 Development

Board System..................................... 17

Matrix Board ..................................................... 42

Board Components.................................................. 19

PFC Stage ........................................................ 19

Power Module Stage ........................................ 19

Board Layout and Schematics ................................. 49

Communication Ports............................................... 43

Connecting the System

Communication Port Connectors...................... 24

Connections...................................................... 23

Power Connections........................................... 22

Power Connections (table) ............................... 23

Sequence.......................................................... 24

Customer Change Notification Service.................... 12

Customer Support.................................................... 13

Device Support and Reserved Resources............... 30

Documentation

Conventions...................................................... 10

Layout ................................................................. 9

dsPICDEM™ MCHV-3 Development Board

Features............................................................ 18

Additional Protection Circuitry ................... 18

Built-in Isolated Programmer/Debugger .... 18

Built-in Power Supplies.............................. 18

Input/Output............................................... 18

Isolated Communication Ports................... 18

Motor Control Interfaces............................ 18

Power Factor Corrector ............................. 18

Relay Circuit .............................................. 18

Layout and Schematics .................................... 49

Overview........................................................... 15

Electrical Specifications ........................................... 47

Inverter.............................................................. 47

PFC................................................................... 47

Fault Circuitry

DC Bus Overcurrent.......................................... 43

Feedback Circuitry ................................................... 41

DC Bus Current Feedback................................ 41

DC Bus Voltage Feedback................................ 41

Hall Sensors...................................................... 41

Inverter Leg Shunt Resistor Feedback ............. 41

Phase Voltage Feedback.................................. 41

Hardware

Programming and Debugging ........................... 45

Hardware Components ............................................ 31

Interface Components.............................................. 20

Built-in Isolated Programmer/Debugger............ 20

Input/Output Control Switches .......................... 20

Isolated Communication Ports .......................... 20

Motor Connectors ............................................. 20

Power Supply Connector .................................. 20

PWM Outputs.................................................... 20

Internet Address....................................................... 12

Isolation.................................................................... 43

Matrix Board............................................................. 42

Microchip Internet Web Site ..................................... 12

PFC Stage Board ..................................................... 31

AC Supply Input................................................ 31

Active Correction............................................... 32

Connectors........................................................ 35

Fault Circuitry.................................................... 34

Feedback Circuitry............................................ 33

Power Supplies................................................. 34

Power Module Stage................................................ 37

Module .............................................................. 40

PIM Configuration ............................................. 37

Power Supplies................................................. 40

Power Module Stage Board

Connectors........................................................ 45

Power Sequences

Application Debug Setup ..................................26

Power-Down ..................................................... 26

Power-up........................................................... 26

Programming and Debugging ........................... 26

 2016 Microchip Technology Inc. DS50002505A-page 65

dsPICDEM™ MCHV-3 Development Board User’s Guide

Reading, Recommended.......................................... 11

Revision History .......................................................13

Safety Notice.............................................................. 5

Sales and Service .................................................... 67

Starter Kit

On-Board Information Tab ................................ 30

Troubleshooting

Debug Connection Problems ............................ 30

Programming Problems ....................................30

User Interfaces.........................................................44

Warranty Registration...............................................11

Worldwide Sales and Service...................................67

WWW Address......................................................... 12

DS50002505A-page 66  2016 Microchip Technology Inc.

NOTES:

Index

 2016 Microchip Technology Inc. DS50002505A-page 67

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support:

http://www.microchip.com/ support

Web Address:

www.microchip.com

Atlanta

Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455

Austin, TX

Tel: 512-257-3370

Boston

Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088

Chicago

Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075

Cleveland

Independence, OH Tel: 216-447-0464 Fax: 216-447-0643

Dallas

Addison, TX Tel: 972-818-7423 Fax: 972-818-2924

Detroit

Novi, MI Tel: 248-848-4000

Houston, TX

Tel: 281-894-5983

Indianapolis

Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453

Los Angeles

Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608

New York, NY

Tel: 631-435-6000

San Jose, CA

Tel: 408-735-9110

Canada - Toronto

Tel: 905-673-0699 Fax: 905-673-6509

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor Tower 6, The Gateway Harbour City, Kowloon

Hong Kong

Tel: 852-2943-5100 Fax: 852-2401-3431

Australia - Sydney

Tel: 61-2-9868-6733 Fax: 61-2-9868-6755

China - Beijing

Tel: 86-10-8569-7000 Fax: 86-10-8528-2104

China - Chengdu

Tel: 86-28-8665-5511 Fax: 86-28-8665-7889

China - Chongqing

Tel: 86-23-8980-9588 Fax: 86-23-8980-9500

China - Dongguan

Tel: 86-769-8702-9880

China - Hangzhou

Tel: 86-571-8792-8115 Fax: 86-571-8792-8116

China - Hong Kong SAR

Tel: 852-2943-5100 Fax: 852-2401-3431

China - Nanjing

Tel: 86-25-8473-2460 Fax: 86-25-8473-2470

China - Qingdao

Tel: 86-532-8502-7355 Fax: 86-532-8502-7205

China - Shanghai

Tel: 86-21-5407-5533 Fax: 86-21-5407-5066

China - Shenyang

Tel: 86-24-2334-2829 Fax: 86-24-2334-2393

China - Shenzhen

Tel: 86-755-8864-2200 Fax: 86-755-8203-1760

China - Wuhan

Tel: 86-27-5980-5300 Fax: 86-27-5980-5118

China - Xian

Tel: 86-29-8833-7252 Fax: 86-29-8833-7256

ASIA/PACIFIC

China - Xiamen

Tel: 86-592-2388138 Fax: 86-592-2388130

China - Zhuhai

Tel: 86-756-3210040 Fax: 86-756-3210049

India - Bangalore

Tel: 91-80-3090-4444 Fax: 91-80-3090-4123

India - New Delhi

Tel: 91-11-4160-8631 Fax: 91-11-4160-8632

India - Pune

Tel: 91-20-3019-1500

Japan - Osaka

Tel: 81-6-6152-7160 Fax: 81-6-6152-9310

Japan - Tokyo

Tel: 81-3-6880- 3770 Fax: 81-3-6880-3771

Korea - Daegu

Tel: 82-53-744-4301 Fax: 82-53-744-4302

Korea - Seoul

Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934

Malaysia - Kuala Lumpur

Tel: 60-3-6201-9857 Fax: 60-3-6201-9859

Malaysia - Penang

Tel: 60-4-227-8870 Fax: 60-4-227-4068

Philippines - Manila

Tel: 63-2-634-9065 Fax: 63-2-634-9069

Singapore

Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan - Hsin Chu

Tel: 886-3-5778-366 Fax: 886-3-5770-955

Taiwan - Kaohsiung

Tel: 886-7-213-7828

Taiwan - Taipei

Tel: 886-2-2508-8600 Fax: 886-2-2508-0102

Thailand - Bangkok

Tel: 66-2-694-1351 Fax: 66-2-694-1350

EUROPE

Austria - Wels

Tel: 43-7242-2244-39 Fax: 43-7242-2244-393

Denmark - Copenhagen

Tel: 45-4450-2828 Fax: 45-4485-2829

France - Paris

Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany - Dusseldorf

Tel: 49-2129-3766400

Germany - Karlsruhe

Tel: 49-721-625370

Germany - Munich

Tel: 49-89-627-144-0 Fax: 49-89-627-144-44

Italy - Milan

Tel: 39-0331-742611 Fax: 39-0331-466781

Italy - Venice

Tel: 39-049-7625286

Netherlands - Drunen

Tel: 31-416-690399 Fax: 31-416-690340

Poland - Warsaw

Tel: 48-22-3325737

Spain - Madrid

Tel: 34-91-708-08-90 Fax: 34-91-708-08-91

Sweden - Stockholm

Tel: 46-8-5090-4654

UK - Wokingham

Tel: 44-118-921-5800 Fax: 44-118-921-5820

07/14/15

DS50002505A-page 68  2016 Microchip Technology Inc.

Microchip Technology dsPICDEM MCHV-3 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Safety Notice

Table of Contents

Preface

INTRODUCTION

DOCUMENT LAYOUT

CONVENTIONS USED IN THIS GUIDE

DOCUMENTATION CONVENTIONS

WARRANTY REGISTRATION

RECOMMENDED READING

THE MICROCHIP WEB SITE

DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFI CATION SERVICE

CUSTOMER SUPPORT

DOCUMENT REVISION HISTORY

1.1 OVERVIEW

Chapter 1. Introduction

FIGURE 1-1: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD

FIGURE 1-2: SYSTEM BLOCK DIAGRAM

1.2 FEATURES

1.2.1 Motor Control Interfaces:

1.2.2 Input/Output:

1.2.3 Isolated Communication Ports:

1.2.4 Built-in Isolated Programmer/Debugger (J20):

1.2.5 Power Factor Corrector:

1.2.6 Built-in Power Supplies:

1.2.7 Relay Circuit:

1.2.8 Additional Protection Circuitry:

Chapter 2. Getting Started

2.1 BOARD COMPONENTS

FIGURE 2-1: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD ENCLOSURE VIEW

2.2 USER INTERFACE

FIGURE 2-2: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD (FRONT)

FIGURE 2-3: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD (LEFT SIDE)

FIGURE 2-4: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD (RIGHT SIDE)

2.3 CONNECTING THE SYSTEM

2.3.1 Power Connections

FIGURE 2-5: dsPICDEM™ MCHV-3 DEVELOPMENT BOARD CONNECTIONS

TABLE 2-1: POWER CONNECTIONS

2.3.2 Host/Communication Connections

TABLE 2-2: I/O CONNECTORS

2.3.3 Connection Sequence

FIGURE 2-6: MATRIX BOARD CONNECTION

2.4 POWER SEQUENCES

2.4.1 Power-up Sequence

2.4.2 Power-Down Sequence

2.4.4 Setting Up an Application for Debug

FIGURE 2-7: MPLAB® X IDE WORKSPACE

2.4.4.1 RUNNING THE APPLICATION IN DEBUG MODE

2.4.4.2 DEBUGGING THE APPLICATION

FIGURE 2-8: PROJECT EXAMPLE

2.4.5 Programming an Application

2.4.6 Determining Device Support and Reserved Resources

2.4.7 Troubleshooting

2.4.7.1 DEBUG CONNECTION PROBLEMS

2.4.7.2 PROGRAMMING PROBLEMS

2.4.8 Start er Kit On-Board Information Tab

Chapter 3. Hardware

3.1 POWER FACTOR CORRECTION (PFC) STAGE BOARD

3.1.1 AC Supply Input

3.1.2 Active Power Factor Correction (PFC)

3.1.3 PFC Feedback Circuitry

3.1.4 Power Supplies

3.1.5 Fault Circuitry

3.1.6 Board Connectors

TABLE 3-1: 14-PIN KEYED CONNECTORS

3.2 POWER MODULE STAGE

3.2.1 Plug-In Module Configuration

TABLE 3-2: dsPICDEM™ MCHV-3 PIM PINOUT FUNCTIONALITY

3.2.2 Power Supplies

3.2.3 Power Module

3.2.4 Feedback Circuitry

3.2.5 Matrix Board

FIGURE 3-1: MATRIX BOARD BLOCK DIAGRAM

3.2.6 Fault Circuitry

3.2.7 Isolation

3.2.8 Communication Ports

TABLE 3-3: COMMUNICATION PORT CONFIGURATION