Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al M illennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and t he like is provided on ly for your conve nience
and may be su perseded by upda t es . I t is your responsi bil i ty to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life supp ort and/or safety ap plications is entir ely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Mi crochip from any and all dama ges, claims,
suits, or expenses re sulting from such use. No licens es are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEEL
®
OQ
code hopping
QUALITY MANAGEMENT S
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, CryptoMemory, CryptoRF,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer,
LANCheck, LINK MD, maXSt ylu s, maXTouch, MediaLB,
megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC,
picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch ,
SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, U NI/O,
and XMEGA are registered trade marks of Microchip Technology
Incorporated in the U.S. A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppress i on, AKS, Analog-for-the-Digital Age, A ny
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsP ICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, EtherGREEN, InCircuit Serial Programming, ICSP, INICnet, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain,
Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart,
PureSilicon, QMatr ix, REAL ICE, Ripp le Blocker, SAM-ICE, Serial
Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II,
Total Endurance, TSH AR C , USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Stora ge Technology is a registered trademark of Microchi p
Technology Inc. in other countries.
GestIC is a registered trade marks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., i n other countries.
All other trademarks mentioned herein are property of their
respective companies.
DS50002761A-page 4 2018 Microchip Technology Inc.
Page 5
dsPIC33EP128GS806 DIGIT A L
POWER PIM USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.
®
IDE online help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
dsPIC33EP128GS806 Digital Power Plug-In Module (PIM). Items discussed in this
chapter include:
• Document Layout
• Conventi ons Used in this Guide
• Recommended Reading
• The Microchip Website
• Product Change Notification Service
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the dsPIC33EP128GS806 Digital Power PIM as
a development tool to emulate and debug firmware on a target board. The document
is organized as follows:
• Chapter 1. “Overview ” – This chapter introduces the dsPIC33EP128GS806
Digital Power PIM and provides a brief overview of its various features.
• Appendix A. “Board Layout and Schematics” – This appendix presents the
schematics and the board layouts for the dsPIC33EP128GS806 Digital Power PIM.
• Appendix B. “Bill of Materials (BOM)” – This appendix presents the Bill of
Materials fo r th e dsPIC33EP128GS806 Digital Power PIM.
Choice of mutually exclusive
arguments; an OR selection
Represents code supplied by
user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options]
errorlevel {0|1}
var_name...]
void main (void)
{ ...
}
®
IDE User’s Guide
DS50002761A-page 6 2018 Microchip Technology Inc.
Page 7
RECOMMENDED READING
This user’s guide describes how to use the dsPIC33EP128GS806 Digital Power PIM.
Other useful document(s) are listed below. The following Microchip document(s) are
recommended as suppl emental r eference resources.
• “dsPIC33EPXXXGS70X/80X Family Data Sheet” (DS70005258) and is
available for download from the Microchip website (www.microchip.com)
THE MICROCHIP WEBSITE
Microchip provides online support via our website at www.microchip.com. This
website is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the website contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events; and listings of Microchip sales
offices, distributors and factory representatives
Preface
PRODUCT CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip website at www.microchip.com, click on Product
Change Notification and follow the registration instructions.
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Corporate Application Engineer (CAE)
• Embedded Solutions Engineer (ESE)
Customers should contact their distributor, representative or Embedded Solutions
Engineer (ESE) for support. Local sales offices are also available to help customers.
A listing of sales offices and locations is included in the back of this document.
Technical support is available through the website at:
DS50002761A-page 8 2018 Microchip Technology Inc.
Page 9
dsPIC33EP128GS806 DIGIT A L
1
2
3
4
5
6
7
8
9
10
11
10
A
D
DA
4
9
PCB Top View
PCB Bottom View
Chapter 1. Overview
1.1INTRODUCTION
The dsPIC33EP128GS806 Digital Power Plug-In Module (DP PIM) is a demonstration
board that showcases the Microchip dsPIC33EP128GS806 16-Bit Digital Signal
Controller (DSC) features. The DP PIM provides access to the dsPIC33EP128GS806
analog inputs, the Digital-to-Analog Converter (DAC) outputs, the Pulse-Width
Modulation (PWM) outputs and the General Purpose Input and Output (GPIO) ports.
The Microchip series of DP PIMs for digital power share the same pinout at the mating
socket. However, these DP PIMs show slightly different performing characteristics.
1.2FEATURES
The dsPIC33EP128GS806 DP PIM has the following features, as shown in Figure 1-1:
FIGURE 1-1:dsPIC33EP128GS806 DP PIM
POWER PIM USER’S GUIDE
1. Microchip dsPIC33EP128GS806 16-Bit Digital Signal Controller
(64-pin TQFP package).
2. ICSP™ programming header (6-pin, 2.54 mm header).
3. On-board LDO (3.6 VDC to 6.3 VDC) with Power Good (PG) function.
4. Solder pad for ground connection.
5. Micro USB connector.
2
C serial converter.
6. MCP2221A USB to UART/I
7. Power indicator LED (Green).
8. User LED (Red).
9. Board edge connection interface for analog inputs/outputs, PWM outputs and
GPIO ports.
10. Analog input with op amp buffer via test point loop connector; can be used for
Bode plot measurements.
11. Test point loops for DAC outputs.
Board dimensions are: 51 mm (length) x 38.5 mm (width).
Table 1-1 shows the electrical characteristics of the dsPIC33EP128GS806 DP PIM.
TABLE 1-1:ELECTRICAL CHARACTERISTICS
ParameterValue
Input Voltage Range3.6 VDC to 6.3 VDC
Current Consumption<100 mA
Power Dissipation<0.6W max.
Operating Temperature Range-40°C to +85°C
1.2.2Analog and Digital Signals
The dsPIC33EP128GS806 DP PIM ensures good signal integrity and provides all
signals needed to control a power train. These signals are divided into two main
sections: Analog, marked with A, and Digital, marked with D (see Figure 1-1):
1. Analog Section
The analog section is located at the left connector side (smaller section in
Figure 1-1). It consists of 17 signals, all referenced to analog ground. These lines
are split into four subsections:
• High-Speed Comparator Inputs: RC filtered with corner frequency of 10 MHz
and maximum signal rise/fall time of 33 ns. These lines are designed to be
used with on-chip comparators for signal zero-cross detections, etc.
• High-Speed ADC Inputs: RC filtered with corner frequency of 2 MHz and
maximum signal rise/fall time of 180 ns. These lines are connected to the
Track-and-Hold (T&H) circuitry of the dedicated ADC inputs and to the
Sample-and-Hold (S&H) circuitry of the shared ADC inputs.
• Medium Speed ADC Inputs: RC filtered with corner frequency of 190 kHz and
maximum signal rise/fall time of 1.8 µs. These lines are connected to the
Sample-and-Hold (S&H) circuitry of the shared ADC inputs. The different RC
filtering is needed because of the significant difference between T&H and
S&H circuitry, and the sampling times.
• DAC Output(s): These line(s) have a 560 Ohm series resistance. Please note
that there is a capacitor placeholder on the board that can be used for
additional filtering.
2. Digital Section
The digital section is located at the right connector side (larger section in
Figure 1-1). It consists of 31 signals, all referenced to digital ground. These lines
are split into four subsections:
•High-Speed PWM Outputs: Each line has a 75 series resistance.
•Medium Speed GPIO: Each line has a 270 series resistance.
•Programing/Debugging Lines: Each line has a 100 series resistance.
•Communication Lines (SPI, I
2
C): Each line has a 75 series resistance.
Note:RC filtering and series resistance are needed for good signal integrity and
EMI issues. Hence, the board can be used for development purposes
under frequent plug-in/out cycles. This decoupling also increases
robustness in case of accidental shorts and EMC issues.
The dsPIC33EP128GS806 DP PIM card has an edge connector compatible with any
application board that provides a mating socket.
The mating socket type is Samtec, Inc.: MECF-30-01-L-DV-WT.
DS50002761A-page 10 2018 Microchip Technology Inc.
Page 11
1.3UART COMMUNICATION
The on-board USB to UART serial bridge enables easy serial connection to PCs.
The USB port can provide power to the Digital Power PIM and allows the user to
communicate with the dsPIC
®
Digital Signal Controller (DSC).
1.4LOW-FREQUENCY BODE PLOT MEASUREMENTS
The dsPIC33EP128GS806 device, with the additional on-board circuitry, is able to
perform Bode plot measurements without the need for an isolation transformer. The
transformer might be required if the injecting signal tends to be at a very low frequency
(for instance, in case of Power Factor Correction (PFC) applications).
Perform the following steps:
1. Solder the R72 (0) resistor. Make sure that the AN5 line is not used by another
low-impedance source.
2. Run the power stage in Open-Loop mode with a fixed duty cycle.
3. Connect the Bode 100 AC output to TP4 and TP5. The on-board operational
amplifier is adding a V
is needed anymore.
4. Connect DAC1 to CH2 and DAC2 to CH1 of the Bode 100.
5. Use the AN5 input to sample the signal from Bode 100 in every PWM cycle at
Frequency Switching (FSW) (action in firmware is needed).
6. Remove the V
DD
is needed).
7. Add sampled AC signal to the nominal duty cycle (PDCx) (action in firmware is
needed).
8. Use ADC2 to sample the output of the plant at FSW. The output can be:
• Output voltage
• Average coil current sampled at T
9. Duty cycle input and plant output are converted into an analog signal using DAC1
and DAC2.
Measured transfer function is the plant (Power Stage + Digital Modulator) – after
scaling and ADC sampling, versus digital duty cycle input (PDCx).
DD
/2 (1.65V) offset. In this case, no injection transformer
/2 offset to regain a signal with no DC value (action in firmware
ON
/2, where TON is the switch ON time.
Note:Due to run-time delays of Sample-and-Hold circuits, and conversation time
of ADC and DAC, this measurement is only recommended for
low-frequency measurements: maximum two decades below sampling
frequency.
TABLE A-1:PINOUT AND ELECTRICAL PARAMETERS (CONTINUED)
Edge
Name
Connector
Pin
RD0_GPIO2547Digital General Purpose 270R series resistance
RD14_GPIO2614Digital General Purpose 270R series resistance
RC5_GPIO2751Digital General Purpose 270R series resistance
RD9_GPIO2840Digital General Purpose 270R series resistance
—29— ——
—30— ——
RD6_PWM5H3154PWM Output75R series resistance
RC8_GPIO3237Digi tal General Purpose
RC3_PWM5L3355PWM Output75R series resistance
RC4_GPIO3450Digital General Purpose 270R series resistance
RD4_GPIO3558Digital General Purpose 270R series resistance
RC6_GPIO3652Digi tal General Purpose
RB11_PWM3H3760PWM Output75R series resistance
RD15_GPIO3859Digital General Purpose 270R series resistance
RB5_GPIO193946Digital General Purpose 270R series resistance
RB14_PWM2L4063PWM Output75R series resistance
RB12_PWM3L4161PWM Output75R series resistance
RB13_PWM2H4213PWM Output75R series resistance
RD1_PWM4H4364PWM Output75R series resistance
RD3_PWM4L441PWM Output75R series resistance
RA4_PWM1H452PWM Output75R series resistance
RC0_GPIO464Digital General Purpose 270R series resistance
RA3_PWM1L473PWM Output75R series resistance
RC13_GPIO485Digital General Purpose
MCLR_IN497Reset100R series resistance
RD12_GPIO508Digital General Purpose 270R series resistance
RB7_PGC5149Programing/Debugging
RD10_GPIO526Digital General Purpose 270R series resistance
RB15_SCL5344I
RD11_GPIO5445Digital General Purpose 270R series resistance
RB8_SDA5543I
RB6_PGD5648Programing/Debugging
5V57NAV
GND_D5841, 25, 9Digital Ground—
Device
Pin
Function/DescriptionRemark
270R series resistance
SPI_SCK
270R series resistance
SPI_MOSI
270R series resistance
SPI_CS
100R series resistance
Line
2
C Clock Line75R series resistance
2
C Data Line75R series resistance
100R series resistance
Line
DD
Rail6.3V max, 70 mA max
5V59NAV
DD
Rail—
GND_D6041, 25, 9Digital Ground—
DS50002761A-page 14 2018 Microchip Technology Inc.
The dsPIC33EP128GS806 DP PIM is a four-layer FR4, 1.55 mm, Plated Through-Hole (PTH) PCB construction. Figure A-3 through Figure A-5 illustrate
the PCB layers and Figure A-6 shows the assembly drawings of the dsPIC33EP128GS806 DP PIM.
FIGURE A-3:dsPIC33 EP128GS806 DIGITAL POWER PIM TOP SILKSCREEN AND TOP COPPER
Board Layout and Schematics
Page 18
DS50002761A-page 18 2018 Microchip Technology Inc.
Mid1 Inner Copper
Mid2 Inner Copper
FIGURE A-4:dsPIC33EP128GS806 DIGITAL POWER PIM MID1 AND MID2 INNER COPPER (BOTTOM VIEW)