Microchip Technology dsPIC33EP128GS806 User Manual

Page 1
dsPIC33EP128GS806
Digital Power
Plug-In Module (PIM)
User’s Guide
2018 Microchip Technology Inc. DS50002761A
Page 2
Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al M illennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and t he like is provided on ly for your conve nience and may be su perseded by upda t es . I t is your responsi bil i ty to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life supp ort and/or safety ap plications is entir ely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Mi crochip from any and all dama ges, claims, suits, or expenses re sulting from such use. No licens es are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEEL
®
OQ
code hopping
QUALITY MANAGEMENT S
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXSt ylu s, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch , SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, U NI/O, and XMEGA are registered trade marks of Microchip Technology Incorporated in the U.S. A. and other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppress i on, AKS, Analog-for-the-Digital Age, A ny Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsP ICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In­Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatr ix, REAL ICE, Ripp le Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSH AR C , USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Stora ge Technology is a registered trademark of Microchi p Technology Inc. in other countries.
GestIC is a registered trade marks of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., i n other countries.
All other trademarks mentioned herein are property of their respective companies.
©2018, Microchip Technology Incorporated, All Rights Re se rved. ISBN: 978-1-5224-3283 -8
DS50002761A-page 2 2018 Microchip Technology Inc.
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dsPIC33EP128GS806 DIGIT A L
POWER PIM USER’S GUIDE

Table of Contents

Preface ...........................................................................................................................5
Chapter 1. Overview.......................................................................................................9
1.1 Introduction .....................................................................................................9
1.2 Features .................................... ..................................................................... 9
1.2.1 Electrical Characteristics ...........................................................................10
1.2.2 Analog and Digital Signals ........................................................................10
1.2.3 dsPIC33EP128GS806 DP PIM – PCB Edge Connector ...........................10
1.3 UART Commun ic a tio n ......... ....................................................... .................. 1 1
1.4 Low-Frequency Bode Plot Measurements ...................................................11
Appendix A. Board Layout and Schematics..............................................................13
A.1 Pinout ...........................................................................................................13
A.2 Board Schema tics ...... .. ................................................................................ 15
A.3 PCB Layout .................................................................................................. 17
Appendix B. Bill of Materials (BOM)...........................................................................21
B.1 Bill of Materials ............................................................................................. 21
Worldwide Sales and Service ....................................................................................24
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dsPIC33EP128GS806 Digital Power PIM User’s Guide
NOTES:
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dsPIC33EP128GS806 DIGIT A L
POWER PIM USER’S GUIDE

Preface

NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.
For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available online help files.
®
IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the dsPIC33EP128GS806 Digital Power Plug-In Module (PIM). Items discussed in this chapter include:
Document Layout
Conventi ons Used in this Guide
Recommended Reading
The Microchip Website
Product Change Notification Service
Customer Support
Document Revision History

DOCUMENT LAYOUT

This document describes how to use the dsPIC33EP128GS806 Digital Power PIM as a development tool to emulate and debug firmware on a target board. The document is organized as follows:
Chapter 1. “Overview ” – This chapter introduces the dsPIC33EP128GS806 Digital Power PIM and provides a brief overview of its various features.
Appendix A. “Board Layout and Schematics” – This appendix presents the schematics and the board layouts for the dsPIC33EP128GS806 Digital Power PIM.
Appendix B. “Bill of Materials (BOM)” – This appendix presents the Bill of Materials fo r th e dsPIC33EP128GS806 Digital Power PIM.
2018 Microchip Technology Inc. DS50002761A-page 5
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dsPIC33EP128GS806 Digital Power PIM User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following docum entat io n conven tion s:

DOCUMENTATION CONVENTIONS

Description Represents Examples
Arial font:
Italic chara c ters Referenced books MPLAB
Emphasized text ...is the only comp ile r...
Initial caps A window the Output window
A dialog the Settings dialog A menu selection select Enable Programmer
Quotes A field name in a window or
dialog
Underlined, italic text with right angle bracket
Bold characters A dialog button Click OK
N‘Rnnnn A number in verilog format,
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Courier New font:
Plain Courier New Sample source code #define START
Italic Courier New A variable argument file.o, where file can be
Square brackets [ ] Optional arguments mcc18 [options] file
Curly brackets and pipe character: { | }
Ellipses... Replaces r epeated text var_name [,
A menu path File>Save
A tab Click the Power tab
where N is the tota l number of digits, R is th e radi x and n is a digit.
Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’
Choice of mutually exclusive arguments; an OR selection
Represents code supplied by user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options] errorlevel {0|1}
var_name...] void main (void)
{ ... }
®
IDE User’s Guide
DS50002761A-page 6 2018 Microchip Technology Inc.
Page 7

RECOMMENDED READING

This user’s guide describes how to use the dsPIC33EP128GS806 Digital Power PIM. Other useful document(s) are listed below. The following Microchip document(s) are recommended as suppl emental r eference resources.
“dsPIC33EPXXXGS70X/80X Family Data Sheet” (DS70005258) and is available for download from the Microchip website (www.microchip.com)

THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:
Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip consultant program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events; and listings of Microchip sales offices, distributors and factory representatives
Preface

PRODUCT CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.
To register, access the Microchip website at www.microchip.com, click on Product
Change Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Corporate Application Engineer (CAE)
• Embedded Solutions Engineer (ESE)
Customers should contact their distributor, representative or Embedded Solutions Engineer (ESE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the website at:
http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (June 2018)
This is the initial release of this document.
2018 Microchip Technology Inc. DS50002761A-page 7
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dsPIC33EP128GS806 Digital Power PIM User’s Guide
NOTES:
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dsPIC33EP128GS806 DIGIT A L
1
2
3
4
5
6
7
8
9
10
11
10
A
D
DA
4
9
PCB Top View
PCB Bottom View

Chapter 1. Overview

1.1 INTRODUCTION

The dsPIC33EP128GS806 Digital Power Plug-In Module (DP PIM) is a demonstration board that showcases the Microchip dsPIC33EP128GS806 16-Bit Digital Signal Controller (DSC) features. The DP PIM provides access to the dsPIC33EP128GS806 analog inputs, the Digital-to-Analog Converter (DAC) outputs, the Pulse-Width Modulation (PWM) outputs and the General Purpose Input and Output (GPIO) ports. The Microchip series of DP PIMs for digital power share the same pinout at the mating socket. However, these DP PIMs show slightly different performing characteristics.

1.2 FEATURES

The dsPIC33EP128GS806 DP PIM has the following features, as shown in Figure 1-1:

FIGURE 1-1: dsPIC33EP128GS806 DP PIM

POWER PIM USER’S GUIDE
1. Microchip dsPIC33EP128GS806 16-Bit Digital Signal Controller
(64-pin TQFP package).
2. ICSP™ programming header (6-pin, 2.54 mm header).
3. On-board LDO (3.6 VDC to 6.3 VDC) with Power Good (PG) function.
4. Solder pad for ground connection.
5. Micro USB connector.
2
C serial converter.
6. MCP2221A USB to UART/I
7. Power indicator LED (Green).
8. User LED (Red).
9. Board edge connection interface for analog inputs/outputs, PWM outputs and
GPIO ports.
10. Analog input with op amp buffer via test point loop connector; can be used for
Bode plot measurements.
11. Test point loops for DAC outputs.
Board dimensions are: 51 mm (length) x 38.5 mm (width).
2018 Microchip Technology Inc. DS50002761A-page 9
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dsPIC33EP128GS806 Digital Power PIM User’s Guide

1.2.1 Electrical Characteristics

Table 1-1 shows the electrical characteristics of the dsPIC33EP128GS806 DP PIM.
TABLE 1-1: ELECTRICAL CHARACTERISTICS
Parameter Value
Input Voltage Range 3.6 VDC to 6.3 VDC Current Consumption <100 mA Power Dissipation <0.6W max. Operating Temperature Range -40°C to +85°C

1.2.2 Analog and Digital Signals

The dsPIC33EP128GS806 DP PIM ensures good signal integrity and provides all signals needed to control a power train. These signals are divided into two main sections: Analog, marked with A, and Digital, marked with D (see Figure 1-1):
1. Analog Section The analog section is located at the left connector side (smaller section in
Figure 1-1). It consists of 17 signals, all referenced to analog ground. These lines
are split into four subsections:
• High-Speed Comparator Inputs: RC filtered with corner frequency of 10 MHz
and maximum signal rise/fall time of 33 ns. These lines are designed to be used with on-chip comparators for signal zero-cross detections, etc.
• High-Speed ADC Inputs: RC filtered with corner frequency of 2 MHz and
maximum signal rise/fall time of 180 ns. These lines are connected to the Track-and-Hold (T&H) circuitry of the dedicated ADC inputs and to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs.
• Medium Speed ADC Inputs: RC filtered with corner frequency of 190 kHz and
maximum signal rise/fall time of 1.8 µs. These lines are connected to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs. The different RC filtering is needed because of the significant difference between T&H and S&H circuitry, and the sampling times.
• DAC Output(s): These line(s) have a 560 Ohm series resistance. Please note
that there is a capacitor placeholder on the board that can be used for additional filtering.
2. Digital Section The digital section is located at the right connector side (larger section in
Figure 1-1). It consists of 31 signals, all referenced to digital ground. These lines
are split into four subsections:
High-Speed PWM Outputs: Each line has a 75 series resistance.
Medium Speed GPIO: Each line has a 270 series resistance.
Programing/Debugging Lines: Each line has a 100 series resistance.
Communication Lines (SPI, I
2
C): Each line has a 75 series resistance.
Note: RC filtering and series resistance are needed for good signal integrity and
EMI issues. Hence, the board can be used for development purposes under frequent plug-in/out cycles. This decoupling also increases robustness in case of accidental shorts and EMC issues.

1.2.3 dsPIC33EP128GS806 DP PIM – PCB Edge Connector

The dsPIC33EP128GS806 DP PIM card has an edge connector compatible with any application board that provides a mating socket.
The mating socket type is Samtec, Inc.: MECF-30-01-L-DV-WT.
DS50002761A-page 10 2018 Microchip Technology Inc.
Page 11

1.3 UART COMMUNICATION

The on-board USB to UART serial bridge enables easy serial connection to PCs. The USB port can provide power to the Digital Power PIM and allows the user to communicate with the dsPIC
®
Digital Signal Controller (DSC).

1.4 LOW-FREQUENCY BODE PLOT MEASUREMENTS

The dsPIC33EP128GS806 device, with the additional on-board circuitry, is able to perform Bode plot measurements without the need for an isolation transformer. The transformer might be required if the injecting signal tends to be at a very low frequency (for instance, in case of Power Factor Correction (PFC) applications).
Perform the following steps:
1. Solder the R72 (0) resistor. Make sure that the AN5 line is not used by another
low-impedance source.
2. Run the power stage in Open-Loop mode with a fixed duty cycle.
3. Connect the Bode 100 AC output to TP4 and TP5. The on-board operational
amplifier is adding a V is needed anymore.
4. Connect DAC1 to CH2 and DAC2 to CH1 of the Bode 100.
5. Use the AN5 input to sample the signal from Bode 100 in every PWM cycle at
Frequency Switching (FSW) (action in firmware is needed).
6. Remove the V
DD
is needed).
7. Add sampled AC signal to the nominal duty cycle (PDCx) (action in firmware is
needed).
8. Use ADC2 to sample the output of the plant at FSW. The output can be:
• Output voltage
• Average coil current sampled at T
9. Duty cycle input and plant output are converted into an analog signal using DAC1
and DAC2.
Measured transfer function is the plant (Power Stage + Digital Modulator) – after scaling and ADC sampling, versus digital duty cycle input (PDCx).
DD
/2 (1.65V) offset. In this case, no injection transformer
/2 offset to regain a signal with no DC value (action in firmware
ON
/2, where TON is the switch ON time.
Note: Due to run-time delays of Sample-and-Hold circuits, and conversation time
of ADC and DAC, this measurement is only recommended for low-frequency measurements: maximum two decades below sampling frequency.
2018 Microchip Technology Inc. DS50002761A-page 11
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dsPIC33EP128GS806 Digital Power PIM User’s Guide
Power Stage
PWM
V
OUT
V
IN
Nominal
Duty RaƟo
Output
+
Signal InjecƟŽŶ
ADC1
ADC2
ADC/2
Remove Oīset!
Out
Bode 100
In
DAC2
DAC1
Bode 100
Generator
1.65V
50R
CH2
CH1
VÊ
G = 2
sÃÖ= 1.65V + 2 x sÊ
Power Stage
PWM
VOUT
V
IN
Compensator
Output
Bode 100
Generator
Out
Bode 100
In
1.65V
Signal
InjecƟŽn
ADC2
ADC/2
Remove OīƐet!
Min/Max
Clamp
Reference
ADC1
+
DAC2
DAC1
50R
CH2
CH1
VÊ
sÃÖ= 1.65V + 2 x sÊ
Figure 1-2 and Figure 1-3 show measuring procedure examples for plant and
closed-loop measurements.

FIGURE 1-2: MEASURING PROCEDURE FOR PLANT MEASUREMENT

FIGURE 1-3: MEASURING PROCEDURE FOR CLOSED-LOOP
MEASUREMENT
DS50002761A-page 12 2018 Microchip Technology Inc.
Page 13

Appendix A. Board Layout and Schematics

A.1 PINOUT

dsPIC33EP128GS806 DIGIT A L
POWER PIM USER’S GUIDE
This appendix contains the pinout, the schematics and the board layouts for the dsPIC33EP128GS806 DP PIM.
Pinout
Board Schematics
PCB Layout
Pinout and electrical parameters are shown in Table A-1.

T ABLE A-1: PINOUT AND ELECTRICAL PARAMETERS

Edge
Name
GND_A 1 20 Analog Ground Reserved for AGND
GND_A 2 20 Analog Ground Reserved for AGND
RD13_DAC2_ OUT
RD7_AN15_IN 4 21 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs RC10_AN10_IN 5 24 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns RA2_AN2_IN 6 15 Analog Input, RC Filtered F RB3_DAC1_OUT 7 32 DAC Output 560R series resistance RC2_CMP_IN 8 35 Analog Input, RC Filtered Fc = 10 MHz, tr = 33 ns RC9_AN11_IN 9 23 Analog Input, RC Filtered F RB0_AN3_IN 10 16 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns RD2_AN16_IN 11 30 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs RA0_AN0_IN 12 13 Analog Input, RC Filtered F RB2_AN7_IN 13 29 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns RA1_AN1_IN 14 14 Analog Input, RC Filtered F RC1_AN8_IN 15 27 Analog Input, RC Filtered F RD8_AN5_IN 16 42 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs RC12_AN14_IN 17 12 Analog Input, RC Filtered F RB9_CMP_IN 18 17 Analog Input, RC Filtered F
—19— — — RD5_AN12_IN 20 53 Analog Input, RC Filtered F slot slot slot slot slot slot slot slot slot slot
—2348 — — RC7_GPIO 24 36 Digital General Pur pose
Connector
Pin
3 22 DAC Output 560R series resistance
Device
Pin
Function/Description Remark
connection
connection
= 1.9 MHz, tr = 180 ns
c
= 1.9 MHz, tr = 180 ns
c
= 1.9 MHz, tr = 180 ns
c
= 1.9 MHz, tr = 180 ns
c
= 1.9 MHz, tr = 180 ns
c
= 190 kHz, tr = 1.8 µs
c
= 10 MHz, tr = 33 ns
c
= 190 kHz, tr = 1.8 µs
c
270R series resistance
SPI_MISO
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dsPIC33EP128GS806 Digital Power PIM User’s Guide
TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS (CONTINUED)
Edge
Name
Connector
Pin
RD0_GPIO 25 47 Digital General Purpose 270R series resistance RD14_GPIO 26 14 Digital General Purpose 270R series resistance RC5_GPIO 27 51 Digital General Purpose 270R series resistance RD9_GPIO 28 40 Digital General Purpose 270R series resistance
—29— —
—30— — — RD6_PWM5H 31 54 PWM Output 75R series resistance RC8_GPIO 32 37 Digi tal General Purpose
RC3_PWM5L 33 55 PWM Output 75R series resistance RC4_GPIO 34 50 Digital General Purpose 270R series resistance RD4_GPIO 35 58 Digital General Purpose 270R series resistance RC6_GPIO 36 52 Digi tal General Purpose
RB11_PWM3H 37 60 PWM Output 75R series resistance RD15_GPIO 38 59 Digital General Purpose 270R series resistance RB5_GPIO19 39 46 Digital General Purpose 270R series resistance RB14_PWM2L 40 63 PWM Output 75R series resistance RB12_PWM3L 41 61 PWM Output 75R series resistance RB13_PWM2H 42 13 PWM Output 75R series resistance RD1_PWM4H 43 64 PWM Output 75R series resistance RD3_PWM4L 44 1 PWM Output 75R series resistance RA4_PWM1H 45 2 PWM Output 75R series resistance RC0_GPIO 46 4 Digital General Purpose 270R series resistance RA3_PWM1L 47 3 PWM Output 75R series resistance RC13_GPIO 48 5 Digital General Purpose
MCLR_IN 49 7 Reset 100R series resistance RD12_GPIO 50 8 Digital General Purpose 270R series resistance RB7_PGC 51 49 Programing/Debugging
RD10_GPIO 52 6 Digital General Purpose 270R series resistance RB15_SCL 53 44 I RD11_GPIO 54 45 Digital General Purpose 270R series resistance RB8_SDA 55 43 I RB6_PGD 56 48 Programing/Debugging
5V 57 NA V GND_D 58 41, 25, 9Digital Ground
Device
Pin
Function/Description Remark
270R series resistance
SPI_SCK
270R series resistance
SPI_MOSI
270R series resistance
SPI_CS
100R series resistance
Line
2
C Clock Line 75R series resistance
2
C Data Line 75R series resistance
100R series resistance
Line
DD
Rail 6.3V max, 70 mA max
5V 59 NA V
DD
Rail
GND_D 60 41, 25, 9Digital Ground
DS50002761A-page 14 2018 Microchip Technology Inc.
Page 15
2018 Microchip Technology Inc. DS 50002761A-page 15
Designed with
Altium.com
0603 DNP
C18
100 pF 0603 50V
C13
560 pF 0603 50V
C6
560 pF 0603 50V
C3
150R 0603
1%
R3
150R 0603
1%
R6
150R 0603
1%
R10
150R 0603
1%
R15
+3.3V
1 μF 10V 0402
C8
1 μF 10V 0402
C9
0.1uF 50V 0402
C11
GND_DGND_DGND_D
GND_D
GND_A GND_A
GND_A
GND_A
GND_A
GND_A
560R 0603
1%
R21
GND_A
560 pF 0603 50V
C14
560 pF 0603 50V
C15
GND_A
GND_A
GND_A
1 μF 10V 0402
C10
1 μF 10V 0402
C7
GND_D
3.3k
0402
R23
75R
R4
150R 0603
1%
R8
150R 0603
1%
R9
TP1
Signal from BODE
75R
R5
75R
R16
75R
R19
75R
R13
75R
R14
75R
R20
75R
R22
75R
R17
75R
R41
270R
R27
75R
R29
270R
R33
270R
R35
270R
R38
270R
R40
270R
R43
270R
R24
270R
R32
270R
R44
270R
R51
270R
R52
270R
R53
270R
R49
270R
R54
270R
R37
75R
R45
560 pF 0603 50V
C27
150R 0603
1%
R48
GND_A
5600 pF 0603 25V
C28
150R 0603
1%
R65
GND_A
5600 pF 0603 25V
C30
150R 0603
1%
R67
GND_A
560 pF 0603 50V
C29
150R 0603 1%
R66
GND_A
5600 pF 0603 25V
C16
150R 0603
1%
R46
GND_A
5600 pF 0603 25V
C26
150R 0603
1%
R47
GND_A
270R
R69
5600 pF 0603 25V
C22
560R 0603
1%
R68
Fg = 500 kHz
0603 DNP
C31
GND_A
TP2
100R
R73
100R
R74
Fg = 500 kHz
+5V
GND_A
GND_D
12 34 56 78 910 1112 1314 1516 1718 1920
2324 2526 2728 2930 3132 3334 3536 3738 3940 4142 4344 4546 4748 4950 5152 5354 5556 5758 5960
Edge Card 60
J5
150R 0603
1%
R18
100 pF 0603 50V
C17
DB2S31000L
D4
DB2S31000L
D6
+3.3V
GND_A
DB2S31000L
D3
GND_A
DB2S31000L
D5
+3.3V
560 pF 0603 50V
C34
150R 0603
1%
R11
GND_A
560 pF 0603 50V
C35
150R 0603
1%
R12
GND_A
Programming
0.1 μF 50V 0402
C33
GND_D
+3.3V
75R
R7
RB1_CLKI
SDA
SCL
UART TX
UART RX
RB4_UART TX
RB8_SDA
RB15_SCL
RC15_UART RX
0.1 μF 50V 0402
C4
+3.3V_A
RD13_DAC2_OUT
RB3_DAC1_OUT RB3_DACOUT1
RD13_DACOUT2
RD0_GPIO RD1_PWM4H
RD3_PWM4L RD4_GPIO
RD6_PWM5H
RD9_GPIO RD10_GPIO RD11_GPIO RD12_GPIO
RD14_GPIO RD15_GPIO
RD3_PWM4L
RB13_PWM2H
RB14_PWM2L
RA0_AN0_IN RA1_AN1_IN
RA2_AN2_IN
RB0_AN3_IN
RB9_CMP_IN
RD8_AN5_IN
RC2_CMP_IN
RD5_AN12_IN
RD7_AN15_IN
RC0_GPIO
RC4_GPIO RC6_GPIO
RC7_GPIO
RC8_GPIO
RC13_GPIO
RD9_GPIO
RD10_GPIO RD11_GPIO
RD12_GPIO
RD14_GPIO
RD15_GPIO
RD13_DAC2_OUT
MCLR_IN RB7_PGC
RB8_SDARB6_PGD
RB3_DAC1_OUT
RB15_SCL
RB11_PWM3H
RB12_PWM3L
RA3_PWM1L
RA4_PWM1H
RC3_PWM5L
RD6_PWM5H
RD1_PWM4H
RB2_AN7_IN RC1_AN8_IN
RC10_AN10_IN
RC9_AN11_IN
RC12_AN14_IN
RD2_AN16_IN
RC5_GPIO
RD0_GPIO
RD4_GPIO
RB5_GPIO19
RED
LD2
GND_A
GND_D GND_D
RC14_LED
RC14_LED
RC13_GPIO
RC15_UART RX
RC3_PWM5L RC4_GPIO RC5_GPIO RC6_GPIO RC7_GPIO RC8_GPIO
RB4_UART TX RB5_GPIO19
RB8_SDA
RB11_PWM3H RB12_PWM3L
RA3_PWM1L RA4_PWM1H
RB6_PGD RB7_PGC
RB13_PWM2H RB14_PWM2L RB15_SCL
RC0_GPIO
RB1_CLKI
RA0_AN0_IN
RA1_AN1_IN
RA2_AN2_IN
RB0_AN3_IN
RB2_AN7_IN
RC1_AN8_IN
RC9_AN11_IN
RC10_AN10_IN
RC12_AN14_IN
RB9_CMP_IN
RC2_CMP_IN
10k 0402
0.5%
R59
49.9R 0805 1%
R62
GND_A
Vbode_max = 1 Vrms
0R 0603 DNP
R72
TP LOOP Yellow
TP4
Vbode
TP LOOP Black
TP5
49.9R 0402 1%
R57
GND_A
10k
0402 0.5%
R60
0.1 μF 50V 0402
C32
GND_A
10k
0402 0.5%
R61
3.3k 0402
0.5%
R63
+3.3V_OPA
+3.3V_OPA
GND_A
0.1 μF 50V 0402
C24
GND_A
+3.3V_OPA
VB_inj = Vcc/2 – Vbode
RD8_AN5_IN
+A
3
-A
4
OUTA
1
V
SS
2
V
DD
5
MCP6021
U4
22 pF 50V0402
C23
10 μF 10V 0603
C5
RD2_AN16
RD7_AN15 RD8_AN5
RA0_AN0
RB0_AN3
RB2_AN7
RB9_CMP
RC1_AN8 RC2_CMP
RC9_AN11 RC10_AN10 RC12_AN14
MCLR
STB
1
GND
2
OUT
3
V
DD
4
7.3728 MHz DSC6011JI2A-007.3728
Y1
+3.3V
GND_A
1
2
3
4
5
6
HDR-2.54 Male 1x6
J1
RB6_PGD RB7_PGC
MCLR
+3.3V
GND_D
100R
0402 1%
R2
10k 0402 1%
R1
56 pF 50V 0402
C25
MCLR_IN
MCLR_IN
MCLR_IN
RD13_DACOUT2
RB3_DACOUT1
RA1_AN1 RA2_AN2
RD2_AN16_IN
RD5_AN12
RD5_AN12_IN
RD7_AN15_IN
RD8_AN5_IN
BAS3010A-3W
D1
RD3
1
RA4
2
RA3
3
RC0
4
RC13
5
RD10
6
MCLR
7
RD12
8
V
SS
9
V
DD
10
AV
DD
11
RC12
12
RA0
13
RA1
14
RA2
15
RB0
16
RB9
17
AV
DD
18
AV
DD
19
AV
SS
20
RD7
21
RD13
22
RC9
23
RC10
24
V
SS
25
V
DD
26
RC1
27
RB1
28
RB2
29
RD2
30
RC15
31
RB3
32
RB4
33
RC14
34
RC2
35
RC7
36
RC8
37
V
DD
38
RD14
39
RD9
40
V
SS
41
RD8
42
RB8
43
RB15
44
RD11
45
RB5
46
RD0
47
RB6
48
RB7
49
RC4
50
RC5
51
RC6
52
RD5
53
RD6
54
RC3
55
V
CAP
56
V
DD
57
RD4
58
RD15
59
RB11
60
RB12
61
RB13
62
RB14
63
RD1
64
dsPIC33EP128GS806
U2

A.2 BOARD SCHEMATICS

Figure A-1 and Figure A-2 show the board schematics.

FIGURE A-1: dsPIC33EP128GS806 DIGITAL POWER PIM SCHEMATIC REV. 1.1 (PAGE 1 OF 2)

Board Layout and Schematics
Page 16
DS50002761A-page 16 2018 Microchip Technology Inc.
10k 0402 1%
R36
+5V_USB
GND_D
0.47 μF 16V 0603
C2
USB/UART-I2C interface
1 μF 10V 0402
C20
270R
0402 5%
R55
270R
0402 5%
R56
+3.3V
75R
0402 1%
R70
1 2 3 4 50
IDD+D-+5V GND
Micro-AB Receptacle
USB 2.0 MICRO-B FEMALE
J3
+3.3V
GND_D
75R
0402 1%
R71
GND_D
GND_DGND_D
+5V_USB
USB_N
USB_P
4.7k 0402 5%
R39
4.7k 0402 5%
R50
+5V_USB
GND_D
+5V
+3.3V
GND_DGND_D
3.6V..6V max. from edge connector
+5V_USB
470R
FB2
0.1 μF 50V 0402
C21
GND_D
3.3k 0402 5%
R26
GREEN 0603
LD1
V
IN
1
SHDN
3
GND
2
PWRGD
4
V
OUT
5
MCP1755/3.3V
U1
MCLR_IN
MCLR_IN
GND_A
0R
0603
R25
GND_D
0R
0603
R64
Shield
“Shield” = Bottom copper pour connection
470R
FB1
+3.3V_A
GND_A
+3.3V_OPA
+3.3V
SDA
SCL
UART TX
UART RX
10R
0402
1%
R58
10 μF 10V 0603
C1
10 μF 10V 0603
C19
10 μF 10V 0603
C12
V
DD
16
GP0
1
GP1
2
RST
3
UART RX
4
UART TX
5
GP2
6
GP3
7
SDA
8
SCL
9
V
USB
10
D-
11
D+
12
V
SS
13
EP
17
NC
14
NC
15
MCP2221A
U3
BAS3010A-3W
D2

FIGURE A-2: dsPIC33EP128GS806 DIGITAL POWER PIM SCHEMATIC REV. 1.1 (PAGE 2 OF 2)

dsPIC33EP128GS806 Digital Power PIM User’s Guide
Page 17
2018 Microchip Technology Inc. DS 50002761A-page 17
Top Silk sc r een
Top Copper

A.3 PCB LAYOUT

The dsPIC33EP128GS806 DP PIM is a four-layer FR4, 1.55 mm, Plated Through-Hole (PTH) PCB construction. Figure A-3 through Figure A-5 illustrate the PCB layers and Figure A-6 shows the assembly drawings of the dsPIC33EP128GS806 DP PIM.

FIGURE A-3: dsPIC33 EP128GS806 DIGITAL POWER PIM TOP SILKSCREEN AND TOP COPPER

Board Layout and Schematics
Page 18
DS50002761A-page 18 2018 Microchip Technology Inc.
Mid1 Inner Copper
Mid2 Inner Copper

FIGURE A-4: dsPIC33EP128GS806 DIGITAL POWER PIM MID1 AND MID2 INNER COPPER (BOTTOM VIEW)

dsPIC33EP128GS806 Digital Power PIM User’s Guide
Page 19
2018 Microchip Technology Inc. DS 50002761A-page 19
Bottom Copper
Bottom Silkscreen

FIGURE A-5: dsPIC33EP128GS806 DIGITAL POWER PIM BOTTOM COPPER AND BOTTOM SILKSCREEN (BOTTOM VIEW)

Board Layout and Schematics
Page 20
DS50002761A-page 20 2018 Microchip Technology Inc.
Top Assembly
Bottom Assembly

FIGURE A-6: dsPIC33EP128GS806 DIGITAL POWER PIM TOP AND BOTTOM ASSEMBLY

dsPIC33EP128GS806 Digital Power PIM User’s Guide
Page 21
dsPIC33EP128GS806 DIGIT A L
POWER PIM USER’S GUIDE

Appendix B. Bill of Materials (BOM)

This appendix contains the Bill of Materials (BOM) for the dsPIC33EP128GS806 Digital Power PIM.
Bill of Materials

B.1 BILL OF MATERIALS

Table B-1 shows the Bill of Materials for the dsPIC33EP128GS806.

TABLE B-1: dsPIC33EP128GS806 DIGITAL POWER PIM BILL OF MATERIALS

Qty. Designator Description Manufacturer Manufacturer Part Number
4 C1, C5, C12, C19 Capacitor Ceramic, 10 µF,
10V, 20%, X5R, SMD, 0603
1 C2 Capacitor Ceramic, 0.47 µF,
16V, 10%, X7R, SMD, 0603
8 C3, C6, C14, C15, C27,
C29, C34 , C35
6 C4, C11, C21, C24,
C32, C33
5 C7, C8, C9, C10, C20 Capacitor Ceramic, 1 µF,
2 C13, C17 Capacitor Ceramic, 100 pF,
5 C16, C22, C26, C28,
C30
1 C23 Capacitor HiQ, 22 pF, 50V,
1 C25 Capacitor Ceramic, 56 pF,
2 D1, D2 Diode Schottky,
4 D3, D4, D5, D6 Diode Schottky, DB2S31000L,
2 FB1, FB2 Ferrite, 300 mA, 470R, SMD,
1 J1 Connector Header-2.54 Male,
1 J3 Connector USB 2.0 micro-B
Capacitor Ceramic, 560 pF, 50V, 5%, C0G, NP0, SMD, 0603
Capacitor Ceramic, 0.1 µF, 50V, 10%, X7R, SMD, 0402
10V, 10%, X7S, SMD, 0402
50V, 5%, NP0, SMD, 0603 Capacitor Ceramic, 5600 pF,
25V, 5%, C0G, SMD, 0603
5%, NP0, 1.95 GHz, SMD, 0402
50V, 5%, C0G, SMD, 0402
BAS3010A-3W , 470 mV, 1A, 30V, SOD-323
470 mV, 200mA, 30V , SMD, SOD-523
0603
1x6, Gold, 5.84MH, TH, Vertical
Female, TH/SMD, R/A
Samsung Group CL10A106MP8NNNC
®
Murata Electronics
KEMET C0603C561J5GACTU
TDK Corporation C1005X7R1H104K050BB
TDK Corporation C1005X7S1A105K050BC
Cal-Chip Electronics Inc.
TDK Corporation C1608C0G1E562J080AA
Johanson Technology Inc.
TDK Corporation C1005C0G1H560J050BA
Infineon Technologies AG
®
Panasonic Electronic Co.
Murata Electronics North America, Inc.
FCI 68000-106HLF
FCI 10118194-0001LF
GRM188R71C474KA88D
GMC10CG101J50NTLF
500R07S220JV4T
BAS3010A03WE6327HTSA1
DB2S31000L
BLM18BB471SN1D
2018 Microchip Technology Inc. DS50002761A-page 21
Page 22
dsPIC33EP128GS806 Digital Power PIM User’s Guide
TABLE B-1: dsPIC33EP128GS806 DIGITAL POWER PIM BILL OF MATERIALS (CONTINUED)
Qty. Designator Description Manufacturer Manufacturer Part Number
1 LD1 Dio de LED Green, 2V,
30 mA, 35 mcd, Clear, SMD, 0603
1 LD2 Diode LED Red, 1.8V,
40 mA, 10 mcd, Clear, SMD, 0603
2 R1, R36 Resistor TKF, 10k, 1%,
1/10W, SMD, 040 2
3 R2, R73, R74 Resistor TKF, 100R, 1%,
1/10W, SMD, 040 2
15 R3, R6, R8, R9, R10,
R11, R12, R15, R18, R46, R47, R48, R65, R66, R67
15 R4, R5, R7, R13, R14,
R16, R17, R19, R20, R22, R29, R41, R45, R70, R71
2 R21, R68 Resistor TKF, 560R, 1%,
2 R23, R26 Resistor TKF, 3.3k, 5%,
18 R24, R27, R32, R33,
R35, R37, R38, R40, R43, R44, R49, R51, R52, R53, R54, R55, R56, R69
2 R25, R64 Resistor T KF, 0R, 1/10W,
2 R39, R50 Resistor TKF, 4.7k, 5%,
1 R57 Resistor TKF, 49.9R, 1%,
1 R58 Resistor TKF, 10R, 1%,
3 R59, R60, R61 Resistor TKF, 10k, 0.5%,
1 R62 Resistor TKF, 49.9R, 1%,
1 R63 Resistor TKF, 3.3k, 0.5%,
3 TP1, TP2, TP4 Misc, Test Point PC Mini,
1 TP5 Misc, Test Point Multipu rpose
Resistor TKF, 150R, 1%, 1/10W, SMD, 060 3
Resistor TKF, 75R, 1%, 1/16W, SMD, 040 2
1/10W, SMD, 060 3
1/10W, SMD, 040 2 Resistor TKF, 270R, 5%,
1/10W, SMD, 040 2
SMD, 0603
1/10W, SMD, 040 2
1/16W, SMD, 040 2
1/16W, SMD, 040 2
1/16W, SMD, 040 2
1/8W, SMD 0805
1/16W, SMD, 040 2
0.040", D, Yellow
Mini, Black
®
Lite-On
Lite-On, Inc. LTST-C190KRKT
Panasonic Electronic Co.
Panasonic Electronic Co.
Stackpole Electronics, Inc.
Yageo Corporation RC0402FR-0775RL
Yageo Corporation RC0603FR-07560RL
Panasonic - ECG ERJ-2GEJ332X
Panasonic - ECG ERJ-2GEJ271X
NIC Components Corp. NRC06Z0TRF
Panasonic - ECG ERJ-2GEJ472X
ROHM Semiconductor MCR01MRTF49R9
ROHM Semiconductor MCR01MRTF10R0
Susumu Co., Ltd. RR0510P-103-D
Panasonic - ECG ERJ-6ENF49R9V
Panasonic Electronic Co.
Keystone Electronics Corp.
Keystone Electronics Corp.
, Inc. LTST-C190KGKT
ERJ-2RKF1002X
ERJ-2RKF1000X
RMCF0603FT150R
ERA-2AED332X
5004
5001
DS50002761A-page 22 2018 Microchip Technology Inc.
Page 23
Bill of Materials (BOM)
TABLE B-1: dsPIC33EP128GS806 DIGITAL POWER PIM BILL OF MATERIALS (CONTINUED)
Qty. Designator Description Manufacturer Manufacturer Part Number
Microchip Parts
1 U1 Microchip Analog LDO, 3.3V,
MCP1755T-3302E/OT, SOT-23-5
1 U2 Microchip MCU, 16- Bit,
120 MHz, 128K, 8K, dsPIC33EP128GS806, TQFP-64
1 U3 Microchip Inte rface, USB,
I2C/UART, MCP2221A-I/ML, QFN-16
1 U4 Microchip Analog Op A mp,
1-Ch, 10 MHz, MCP6021T-E/OT, SOT-23-5
1 Y1 Microchip Clock Oscillator
Single, 7.3728 MHz, DSC6011JI2A-007.3728, VDFN-4
Mechanical Parts
1 LABEL3 Label, AIPD Board Assembly
1 PCB1 Printed Circuit Board 04-10750-R1.0
Do Not Populate Parts
2 C18, C31 Capacitor Ceramic, 560 pF,
50V, 5%, C0G, NP0, SMD, 0603
1 R72 Resistor TKF, 0R, 1/10W,
SMD, 0603
Microchip Technology Inc.
Microchip Technology Inc.
Microchip Technology Inc.
Microchip Technology Inc.
Microchip Technology Inc.
PCB
KEMET C0603C561J5GACTU
NIC Components Corp. NRC06Z0TRF
MCP1755T-3302E/OT
dsPIC33EP128GS806-I/PT
MCP2221A-I/ML
MCP6021T-E/OT
DSC6011JI2A-007.3728
2018 Microchip Technology Inc. DS50002761A-page 23
Page 24

Worldwide Sales and Service

AMERICAS
Corporate Office
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http://www.microchip.com/ support
Web Address:
www.microchip.com
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Tel: 281-894- 5983
Indianapolis
Noblesville, IN Tel: 317-773- 8323 Fax: 317-773-5453 Tel: 317-536- 2380
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Tel: 408-735- 9110 Tel: 408-436- 4270
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Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
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Tel: 49-8031-354-560
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Tel: 972-9-744-7705
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Tel: 39-0331-742611 Fax: 39-0331-466781
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Tel: 39-049-7625286
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Tel: 31-416-690399 Fax: 31-416-690340
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Tel: 44-118-921-5800 Fax: 44-118-921-5820
DS50002761A-page 24 2018 Microchip Technology Inc.
10/25/17
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