Microchip Technology dsPIC33EP128GS806 User Manual

dsPIC33EP128GS806

Digital Power

Plug-In Module (PIM)

User’s Guide

 2018 Microchip Technology Inc. DS50002761A

Note the following details of the code protection feature on Microchip devices:

YSTEM

CERTIFIED BY DNV

== ISO/TS 16949 ==

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al M illennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and t he like is provided on ly for your conve nience
and may be su perseded by upda t es . I t is your responsi bil i ty to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
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arising from this information and its use. Use of Microchip
devices in life supp ort and/or safety ap plications is entir ely at
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suits, or expenses re sulting from such use. No licens es are
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Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEEL

®

OQ

code hopping

QUALITY MANAGEMENT S

Trademarks

The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, CryptoMemory, CryptoRF,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer,
LANCheck, LINK MD, maXSt ylu s, maXTouch, MediaLB,
megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC,
picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch ,
SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, U NI/O,
and XMEGA are registered trade marks of Microchip Technology
Incorporated in the U.S. A. and other countries.

ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppress i on, AKS, Analog-for-the-Digital Age, A ny
Capacitor, AnyIn, AnyOut, BodyCom, chipKIT, chipKIT logo,
CodeGuard, CryptoAuthentication, CryptoAutomotive,
CryptoCompanion, CryptoController, dsP ICDEM, dsPICDEM.net,
Dynamic Average Matching, DAM, ECAN, EtherGREEN, In­Circuit Serial Programming, ICSP, INICnet, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain,
Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo,
MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart,
PureSilicon, QMatr ix, REAL ICE, Ripp le Blocker, SAM-ICE, Serial
Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II,
Total Endurance, TSH AR C , USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.

SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.

Silicon Stora ge Technology is a registered trademark of Microchi p
Technology Inc. in other countries.

GestIC is a registered trade marks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., i n other countries.

All other trademarks mentioned herein are property of their
respective companies.

©2018, Microchip Technology Incorporated, All Rights Re se rved.
ISBN: 978-1-5224-3283 -8

DS50002761A-page 2  2018 Microchip Technology Inc.

dsPIC33EP128GS806 DIGIT A L

POWER PIM USER’S GUIDE

Table of Contents

Preface ...........................................................................................................................5

Chapter 1. Overview.......................................................................................................9

1.1 Introduction .....................................................................................................9

1.2 Features .................................... ..................................................................... 9

1.2.1 Electrical Characteristics ...........................................................................10

1.2.2 Analog and Digital Signals ........................................................................10

1.2.3 dsPIC33EP128GS806 DP PIM – PCB Edge Connector ...........................10

1.3 UART Commun ic a tio n ......... ....................................................... .................. 1 1

1.4 Low-Frequency Bode Plot Measurements ...................................................11

Appendix A. Board Layout and Schematics..............................................................13

A.1 Pinout ...........................................................................................................13

A.2 Board Schema tics ...... .. ................................................................................ 15

A.3 PCB Layout .................................................................................................. 17

Appendix B. Bill of Materials (BOM)...........................................................................21

B.1 Bill of Materials ............................................................................................. 21

Worldwide Sales and Service ....................................................................................24

 2018 Microchip Technology Inc. DS50002761A-page 3

dsPIC33EP128GS806 Digital Power PIM User’s Guide

NOTES:

DS50002761A-page 4  2018 Microchip Technology Inc.

dsPIC33EP128GS806 DIGIT A L

POWER PIM USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.

For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.

®

IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the
dsPIC33EP128GS806 Digital Power Plug-In Module (PIM). Items discussed in this
chapter include:

• Document Layout

• Conventi ons Used in this Guide

• Recommended Reading

• The Microchip Website

• Product Change Notification Service

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the dsPIC33EP128GS806 Digital Power PIM as
a development tool to emulate and debug firmware on a target board. The document
is organized as follows:

• Chapter 1. “Overview ” – This chapter introduces the dsPIC33EP128GS806
Digital Power PIM and provides a brief overview of its various features.

• Appendix A. “Board Layout and Schematics” – This appendix presents the
schematics and the board layouts for the dsPIC33EP128GS806 Digital Power PIM.

• Appendix B. “Bill of Materials (BOM)” – This appendix presents the Bill of
Materials fo r th e dsPIC33EP128GS806 Digital Power PIM.

 2018 Microchip Technology Inc. DS50002761A-page 5

dsPIC33EP128GS806 Digital Power PIM User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following docum entat io n conven tion s:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic chara c ters Referenced books MPLAB

Emphasized text ...is the only comp ile r...

Initial caps A window the Output window

A dialog the Settings dialog
A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, italic text with
right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe
character: { | }

Ellipses... Replaces r epeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the tota l number of
digits, R is th e radi x and n is a
digit.

Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’

Choice of mutually exclusive
arguments; an OR selection

Represents code supplied by
user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]
errorlevel {0|1}

var_name...]
void main (void)

{ ...
}

®

IDE User’s Guide

DS50002761A-page 6  2018 Microchip Technology Inc.

RECOMMENDED READING

This user’s guide describes how to use the dsPIC33EP128GS806 Digital Power PIM.
Other useful document(s) are listed below. The following Microchip document(s) are
recommended as suppl emental r eference resources.

• “dsPIC33EPXXXGS70X/80X Family Data Sheet” (DS70005258) and is
available for download from the Microchip website (www.microchip.com)

THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This
website is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the website contains the following
information:

• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events; and listings of Microchip sales
offices, distributors and factory representatives

Preface

PRODUCT CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.

To register, access the Microchip website at www.microchip.com, click on Product

Change Notification and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Corporate Application Engineer (CAE)

• Embedded Solutions Engineer (ESE)

Customers should contact their distributor, representative or Embedded Solutions
Engineer (ESE) for support. Local sales offices are also available to help customers.
A listing of sales offices and locations is included in the back of this document.

Technical support is available through the website at:

http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (June 2018)

This is the initial release of this document.

 2018 Microchip Technology Inc. DS50002761A-page 7

dsPIC33EP128GS806 Digital Power PIM User’s Guide

NOTES:

DS50002761A-page 8  2018 Microchip Technology Inc.

dsPIC33EP128GS806 DIGIT A L

1

2

3

4

5

6

7

8

9

10

11

10

A

D

DA

4

9

PCB Top View

PCB Bottom View

Chapter 1. Overview

1.1 INTRODUCTION

The dsPIC33EP128GS806 Digital Power Plug-In Module (DP PIM) is a demonstration
board that showcases the Microchip dsPIC33EP128GS806 16-Bit Digital Signal
Controller (DSC) features. The DP PIM provides access to the dsPIC33EP128GS806
analog inputs, the Digital-to-Analog Converter (DAC) outputs, the Pulse-Width
Modulation (PWM) outputs and the General Purpose Input and Output (GPIO) ports.
The Microchip series of DP PIMs for digital power share the same pinout at the mating
socket. However, these DP PIMs show slightly different performing characteristics.

1.2 FEATURES

The dsPIC33EP128GS806 DP PIM has the following features, as shown in Figure 1-1:

FIGURE 1-1: dsPIC33EP128GS806 DP PIM

POWER PIM USER’S GUIDE

1. Microchip dsPIC33EP128GS806 16-Bit Digital Signal Controller

(64-pin TQFP package).

2. ICSP™ programming header (6-pin, 2.54 mm header).

3. On-board LDO (3.6 VDC to 6.3 VDC) with Power Good (PG) function.

4. Solder pad for ground connection.

5. Micro USB connector.

2

C serial converter.

6. MCP2221A USB to UART/I

7. Power indicator LED (Green).

8. User LED (Red).

9. Board edge connection interface for analog inputs/outputs, PWM outputs and

GPIO ports.

10. Analog input with op amp buffer via test point loop connector; can be used for

Bode plot measurements.

11. Test point loops for DAC outputs.

Board dimensions are: 51 mm (length) x 38.5 mm (width).

 2018 Microchip Technology Inc. DS50002761A-page 9

dsPIC33EP128GS806 Digital Power PIM User’s Guide

1.2.1 Electrical Characteristics

Table 1-1 shows the electrical characteristics of the dsPIC33EP128GS806 DP PIM.

TABLE 1-1: ELECTRICAL CHARACTERISTICS

Parameter Value

Input Voltage Range 3.6 VDC to 6.3 VDC
Current Consumption <100 mA
Power Dissipation <0.6W max.
Operating Temperature Range -40°C to +85°C

1.2.2 Analog and Digital Signals

The dsPIC33EP128GS806 DP PIM ensures good signal integrity and provides all
signals needed to control a power train. These signals are divided into two main
sections: Analog, marked with A, and Digital, marked with D (see Figure 1-1):

1. Analog Section
The analog section is located at the left connector side (smaller section in

Figure 1-1). It consists of 17 signals, all referenced to analog ground. These lines

are split into four subsections:

• High-Speed Comparator Inputs: RC filtered with corner frequency of 10 MHz

and maximum signal rise/fall time of 33 ns. These lines are designed to be
used with on-chip comparators for signal zero-cross detections, etc.

• High-Speed ADC Inputs: RC filtered with corner frequency of 2 MHz and

maximum signal rise/fall time of 180 ns. These lines are connected to the
Track-and-Hold (T&H) circuitry of the dedicated ADC inputs and to the
Sample-and-Hold (S&H) circuitry of the shared ADC inputs.

• Medium Speed ADC Inputs: RC filtered with corner frequency of 190 kHz and

maximum signal rise/fall time of 1.8 µs. These lines are connected to the
Sample-and-Hold (S&H) circuitry of the shared ADC inputs. The different RC
filtering is needed because of the significant difference between T&H and
S&H circuitry, and the sampling times.

• DAC Output(s): These line(s) have a 560 Ohm series resistance. Please note

that there is a capacitor placeholder on the board that can be used for
additional filtering.

2. Digital Section
The digital section is located at the right connector side (larger section in

Figure 1-1). It consists of 31 signals, all referenced to digital ground. These lines

are split into four subsections:

• High-Speed PWM Outputs: Each line has a 75 series resistance.

• Medium Speed GPIO: Each line has a 270 series resistance.

• Programing/Debugging Lines: Each line has a 100 series resistance.

• Communication Lines (SPI, I

2

C): Each line has a 75 series resistance.

Note: RC filtering and series resistance are needed for good signal integrity and

EMI issues. Hence, the board can be used for development purposes
under frequent plug-in/out cycles. This decoupling also increases
robustness in case of accidental shorts and EMC issues.

1.2.3 dsPIC33EP128GS806 DP PIM – PCB Edge Connector

The dsPIC33EP128GS806 DP PIM card has an edge connector compatible with any
application board that provides a mating socket.

The mating socket type is Samtec, Inc.: MECF-30-01-L-DV-WT.

DS50002761A-page 10  2018 Microchip Technology Inc.

1.3 UART COMMUNICATION

The on-board USB to UART serial bridge enables easy serial connection to PCs.
The USB port can provide power to the Digital Power PIM and allows the user to
communicate with the dsPIC

®

Digital Signal Controller (DSC).

1.4 LOW-FREQUENCY BODE PLOT MEASUREMENTS

The dsPIC33EP128GS806 device, with the additional on-board circuitry, is able to
perform Bode plot measurements without the need for an isolation transformer. The
transformer might be required if the injecting signal tends to be at a very low frequency
(for instance, in case of Power Factor Correction (PFC) applications).

Perform the following steps:

1. Solder the R72 (0) resistor. Make sure that the AN5 line is not used by another

low-impedance source.

2. Run the power stage in Open-Loop mode with a fixed duty cycle.

3. Connect the Bode 100 AC output to TP4 and TP5. The on-board operational

amplifier is adding a V
is needed anymore.

4. Connect DAC1 to CH2 and DAC2 to CH1 of the Bode 100.

5. Use the AN5 input to sample the signal from Bode 100 in every PWM cycle at

Frequency Switching (FSW) (action in firmware is needed).

6. Remove the V

DD

is needed).

7. Add sampled AC signal to the nominal duty cycle (PDCx) (action in firmware is

needed).

8. Use ADC2 to sample the output of the plant at FSW. The output can be:

• Output voltage

• Average coil current sampled at T

9. Duty cycle input and plant output are converted into an analog signal using DAC1

and DAC2.

Measured transfer function is the plant (Power Stage + Digital Modulator) – after
scaling and ADC sampling, versus digital duty cycle input (PDCx).

DD

/2 (1.65V) offset. In this case, no injection transformer

/2 offset to regain a signal with no DC value (action in firmware

ON

/2, where TON is the switch ON time.

Note: Due to run-time delays of Sample-and-Hold circuits, and conversation time

of ADC and DAC, this measurement is only recommended for
low-frequency measurements: maximum two decades below sampling
frequency.

 2018 Microchip Technology Inc. DS50002761A-page 11

dsPIC33EP128GS806 Digital Power PIM User’s Guide

Power Stage

PWM

V

OUT

V

IN

Nominal

Duty RaƟo

Output

+

Signal InjecƟŽŶ

ADC1

ADC2

–

ADC/2

Remove Oīset!

Out

Bode 100

In

DAC2

DAC1

Bode 100

Generator

1.65V

50R

CH2

CH1

VÊ

G = 2

sÃÖ= 1.65V + 2 x sÊ

Power Stage

PWM

VOUT

V

IN

Compensator

Output

Bode 100

Generator

Out

Bode 100

In

1.65V

Signal

InjecƟŽn

ADC2

–

ADC/2

Remove OīƐet!

Min/Max

Clamp

Reference

ADC1

+

DAC2

DAC1

50R

CH2

CH1

VÊ

sÃÖ= 1.65V + 2 x sÊ

Figure 1-2 and Figure 1-3 show measuring procedure examples for plant and

closed-loop measurements.

FIGURE 1-2: MEASURING PROCEDURE FOR PLANT MEASUREMENT

FIGURE 1-3: MEASURING PROCEDURE FOR CLOSED-LOOP

MEASUREMENT

DS50002761A-page 12  2018 Microchip Technology Inc.

Appendix A. Board Layout and Schematics

A.1 PINOUT

dsPIC33EP128GS806 DIGIT A L

POWER PIM USER’S GUIDE

This appendix contains the pinout, the schematics and the board layouts for the
dsPIC33EP128GS806 DP PIM.

• Pinout

• Board Schematics

• PCB Layout

Pinout and electrical parameters are shown in Table A-1.

T ABLE A-1: PINOUT AND ELECTRICAL PARAMETERS

Edge

Name

GND_A 1 20 Analog Ground Reserved for AGND

GND_A 2 20 Analog Ground Reserved for AGND

RD13_DAC2_
OUT

RD7_AN15_IN 4 21 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs
RC10_AN10_IN 5 24 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns
RA2_AN2_IN 6 15 Analog Input, RC Filtered F
RB3_DAC1_OUT 7 32 DAC Output 560R series resistance
RC2_CMP_IN 8 35 Analog Input, RC Filtered Fc = 10 MHz, tr = 33 ns
RC9_AN11_IN 9 23 Analog Input, RC Filtered F
RB0_AN3_IN 10 16 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns
RD2_AN16_IN 11 30 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs
RA0_AN0_IN 12 13 Analog Input, RC Filtered F
RB2_AN7_IN 13 29 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns
RA1_AN1_IN 14 14 Analog Input, RC Filtered F
RC1_AN8_IN 15 27 Analog Input, RC Filtered F
RD8_AN5_IN 16 42 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs
RC12_AN14_IN 17 12 Analog Input, RC Filtered F
RB9_CMP_IN 18 17 Analog Input, RC Filtered F

—19— — —
RD5_AN12_IN 20 53 Analog Input, RC Filtered F
slot slot slot slot slot
slot slot slot slot slot

—2348 — —
RC7_GPIO 24 36 Digital General Pur pose

Connector

Pin

3 22 DAC Output 560R series resistance

Device

Pin

Function/Description Remark

connection

connection

= 1.9 MHz, tr = 180 ns

c

= 1.9 MHz, tr = 180 ns

c

= 1.9 MHz, tr = 180 ns

c

= 1.9 MHz, tr = 180 ns

c

= 1.9 MHz, tr = 180 ns

c

= 190 kHz, tr = 1.8 µs

c

= 10 MHz, tr = 33 ns

c

= 190 kHz, tr = 1.8 µs

c

270R series resistance

SPI_MISO

 2018 Microchip Technology Inc. DS50002761A-page 13

dsPIC33EP128GS806 Digital Power PIM User’s Guide

TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS (CONTINUED)

Edge

Name

Connector

Pin

RD0_GPIO 25 47 Digital General Purpose 270R series resistance
RD14_GPIO 26 14 Digital General Purpose 270R series resistance
RC5_GPIO 27 51 Digital General Purpose 270R series resistance
RD9_GPIO 28 40 Digital General Purpose 270R series resistance

—29— — —

—30— — —
RD6_PWM5H 31 54 PWM Output 75R series resistance
RC8_GPIO 32 37 Digi tal General Purpose

RC3_PWM5L 33 55 PWM Output 75R series resistance
RC4_GPIO 34 50 Digital General Purpose 270R series resistance
RD4_GPIO 35 58 Digital General Purpose 270R series resistance
RC6_GPIO 36 52 Digi tal General Purpose

RB11_PWM3H 37 60 PWM Output 75R series resistance
RD15_GPIO 38 59 Digital General Purpose 270R series resistance
RB5_GPIO19 39 46 Digital General Purpose 270R series resistance
RB14_PWM2L 40 63 PWM Output 75R series resistance
RB12_PWM3L 41 61 PWM Output 75R series resistance
RB13_PWM2H 42 13 PWM Output 75R series resistance
RD1_PWM4H 43 64 PWM Output 75R series resistance
RD3_PWM4L 44 1 PWM Output 75R series resistance
RA4_PWM1H 45 2 PWM Output 75R series resistance
RC0_GPIO 46 4 Digital General Purpose 270R series resistance
RA3_PWM1L 47 3 PWM Output 75R series resistance
RC13_GPIO 48 5 Digital General Purpose

MCLR_IN 49 7 Reset 100R series resistance
RD12_GPIO 50 8 Digital General Purpose 270R series resistance
RB7_PGC 51 49 Programing/Debugging

RD10_GPIO 52 6 Digital General Purpose 270R series resistance
RB15_SCL 53 44 I
RD11_GPIO 54 45 Digital General Purpose 270R series resistance
RB8_SDA 55 43 I
RB6_PGD 56 48 Programing/Debugging

5V 57 NA V
GND_D 58 41, 25, 9Digital Ground —

Device

Pin

Function/Description Remark

270R series resistance

SPI_SCK

270R series resistance

SPI_MOSI

270R series resistance

SPI_CS

100R series resistance

Line

2

C Clock Line 75R series resistance

2

C Data Line 75R series resistance

100R series resistance

Line

DD

Rail 6.3V max, 70 mA max

5V 59 NA V

DD

Rail —

GND_D 60 41, 25, 9Digital Ground —

DS50002761A-page 14  2018 Microchip Technology Inc.

 2018 Microchip Technology Inc. DS 50002761A-page 15

Designed with

Altium.com

0603
DNP

C18

100 pF
0603
50V

C13

560 pF
0603
50V

C6

560 pF
0603
50V

C3

150R
0603

1%

R3

150R
0603

1%

R6

150R
0603

1%

R10

150R
0603

1%

R15

+3.3V

1 μF
10V
0402

C8

1 μF
10V
0402

C9

0.1uF
50V
0402

C11

GND_DGND_DGND_D

GND_D

GND_A GND_A

GND_A

GND_A

GND_A

GND_A

560R
0603

1%

R21

GND_A

560 pF
0603
50V

C14

560 pF
0603
50V

C15

GND_A

GND_A

GND_A

1 μF
10V
0402

C10

1 μF
10V
0402

C7

GND_D

3.3k

0402

R23

75R

R4

150R
0603

1%

R8

150R
0603

1%

R9

TP1

Signal from BODE

75R

R5

75R

R16

75R

R19

75R

R13

75R

R14

75R

R20

75R

R22

75R

R17

75R

R41

270R

R27

75R

R29

270R

R33

270R

R35

270R

R38

270R

R40

270R

R43

270R

R24

270R

R32

270R

R44

270R

R51

270R

R52

270R

R53

270R

R49

270R

R54

270R

R37

75R

R45

560 pF
0603
50V

C27

150R
0603

1%

R48

GND_A

5600 pF
0603
25V

C28

150R
0603

1%

R65

GND_A

5600 pF
0603
25V

C30

150R
0603

1%

R67

GND_A

560 pF
0603
50V

C29

150R
0603
1%

R66

GND_A

5600 pF
0603
25V

C16

150R
0603

1%

R46

GND_A

5600 pF
0603
25V

C26

150R
0603

1%

R47

GND_A

270R

R69

5600 pF
0603
25V

C22

560R
0603

1%

R68

Fg = 500 kHz

0603
DNP

C31

GND_A

TP2

100R

R73

100R

R74

Fg = 500 kHz

+5V

GND_A

GND_D

12
34
56
78
910
1112
1314
1516
1718
1920

2324
2526
2728
2930
3132
3334
3536
3738
3940
4142
4344
4546
4748
4950
5152
5354
5556
5758
5960

Edge Card 60

J5

150R
0603

1%

R18

100 pF
0603
50V

C17

DB2S31000L

D4

DB2S31000L

D6

+3.3V

GND_A

DB2S31000L

D3

GND_A

DB2S31000L

D5

+3.3V

560 pF
0603
50V

C34

150R
0603

1%

R11

GND_A

560 pF
0603
50V

C35

150R
0603

1%

R12

GND_A

Programming

0.1 μF
50V
0402

C33

GND_D

+3.3V

75R

R7

RB1_CLKI

SDA

SCL

UART TX

UART RX

RB4_UART TX

RB8_SDA

RB15_SCL

RC15_UART RX

0.1 μF
50V
0402

C4

+3.3V_A

RD13_DAC2_OUT

RB3_DAC1_OUT RB3_DACOUT1

RD13_DACOUT2

RD0_GPIO
RD1_PWM4H

RD3_PWM4L
RD4_GPIO

RD6_PWM5H

RD9_GPIO
RD10_GPIO
RD11_GPIO
RD12_GPIO

RD14_GPIO
RD15_GPIO

RD3_PWM4L

RB13_PWM2H

RB14_PWM2L

RA0_AN0_IN
RA1_AN1_IN

RA2_AN2_IN

RB0_AN3_IN

RB9_CMP_IN

RD8_AN5_IN

RC2_CMP_IN

RD5_AN12_IN

RD7_AN15_IN

RC0_GPIO

RC4_GPIO
RC6_GPIO

RC7_GPIO

RC8_GPIO

RC13_GPIO

RD9_GPIO

RD10_GPIO
RD11_GPIO

RD12_GPIO

RD14_GPIO

RD15_GPIO

RD13_DAC2_OUT

MCLR_IN
RB7_PGC

RB8_SDARB6_PGD

RB3_DAC1_OUT

RB15_SCL

RB11_PWM3H

RB12_PWM3L

RA3_PWM1L

RA4_PWM1H

RC3_PWM5L

RD6_PWM5H

RD1_PWM4H

RB2_AN7_IN
RC1_AN8_IN

RC10_AN10_IN

RC9_AN11_IN

RC12_AN14_IN

RD2_AN16_IN

RC5_GPIO

RD0_GPIO

RD4_GPIO

RB5_GPIO19

RED

LD2

GND_A

GND_D GND_D

RC14_LED

RC14_LED

RC13_GPIO

RC15_UART RX

RC3_PWM5L
RC4_GPIO
RC5_GPIO
RC6_GPIO
RC7_GPIO
RC8_GPIO

RB4_UART TX
RB5_GPIO19

RB8_SDA

RB11_PWM3H
RB12_PWM3L

RA3_PWM1L
RA4_PWM1H

RB6_PGD
RB7_PGC

RB13_PWM2H
RB14_PWM2L
RB15_SCL

RC0_GPIO

RB1_CLKI

RA0_AN0_IN

RA1_AN1_IN

RA2_AN2_IN

RB0_AN3_IN

RB2_AN7_IN

RC1_AN8_IN

RC9_AN11_IN

RC10_AN10_IN

RC12_AN14_IN

RB9_CMP_IN

RC2_CMP_IN

10k
0402

0.5%

R59

49.9R
0805
1%

R62

GND_A

Vbode_max = 1 Vrms

0R
0603
DNP

R72

TP LOOP Yellow

TP4

Vbode

TP LOOP Black

TP5

49.9R
0402
1%

R57

GND_A

10k

0402 0.5%

R60

0.1 μF
50V
0402

C32

GND_A

10k

0402 0.5%

R61

3.3k
0402

0.5%

R63

+3.3V_OPA

+3.3V_OPA

GND_A

0.1 μF
50V
0402

C24

GND_A

+3.3V_OPA

VB_inj = Vcc/2 – Vbode

RD8_AN5_IN

+A

3

-A

4

OUTA

1

V

SS

2

V

DD

5

MCP6021

U4

22 pF
50V0402

C23

10 μF
10V
0603

C5

RD2_AN16

RD7_AN15
RD8_AN5

RA0_AN0

RB0_AN3

RB2_AN7

RB9_CMP

RC1_AN8
RC2_CMP

RC9_AN11
RC10_AN10
RC12_AN14

MCLR

STB

1

GND

2

OUT

3

V

DD

4

7.3728 MHz
DSC6011JI2A-007.3728

Y1

+3.3V

GND_A

1

2

3

4

5

6

HDR-2.54 Male 1x6

J1

RB6_PGD
RB7_PGC

MCLR

+3.3V

GND_D

100R

0402
1%

R2

10k
0402
1%

R1

56 pF
50V
0402

C25

MCLR_IN

MCLR_IN

MCLR_IN

RD13_DACOUT2

RB3_DACOUT1

RA1_AN1
RA2_AN2

RD2_AN16_IN

RD5_AN12

RD5_AN12_IN

RD7_AN15_IN

RD8_AN5_IN

BAS3010A-3W

D1

RD3

1

RA4

2

RA3

3

RC0

4

RC13

5

RD10

6

MCLR

7

RD12

8

V

SS

9

V

DD

10

AV

DD

11

RC12

12

RA0

13

RA1

14

RA2

15

RB0

16

RB9

17

AV

DD

18

AV

DD

19

AV

SS

20

RD7

21

RD13

22

RC9

23

RC10

24

V

SS

25

V

DD

26

RC1

27

RB1

28

RB2

29

RD2

30

RC15

31

RB3

32

RB4

33

RC14

34

RC2

35

RC7

36

RC8

37

V

DD

38

RD14

39

RD9

40

V

SS

41

RD8

42

RB8

43

RB15

44

RD11

45

RB5

46

RD0

47

RB6

48

RB7

49

RC4

50

RC5

51

RC6

52

RD5

53

RD6

54

RC3

55

V

CAP

56

V

DD

57

RD4

58

RD15

59

RB11

60

RB12

61

RB13

62

RB14

63

RD1

64

dsPIC33EP128GS806

U2

A.2 BOARD SCHEMATICS

Figure A-1 and Figure A-2 show the board schematics.

FIGURE A-1: dsPIC33EP128GS806 DIGITAL POWER PIM SCHEMATIC REV. 1.1 (PAGE 1 OF 2)

Board Layout and Schematics

DS50002761A-page 16  2018 Microchip Technology Inc.

10k
0402
1%

R36

+5V_USB

GND_D

0.47 μF
16V
0603

C2

USB/UART-I2C interface

1 μF
10V
0402

C20

270R

0402
5%

R55

270R

0402
5%

R56

+3.3V

75R

0402
1%

R70

1 2 3 4 50

IDD+D-+5V GND

Micro-AB Receptacle

USB 2.0 MICRO-B FEMALE

J3

+3.3V

GND_D

75R

0402
1%

R71

GND_D

GND_DGND_D

+5V_USB

USB_N

USB_P

4.7k
0402
5%

R39

4.7k
0402
5%

R50

+5V_USB

GND_D

+5V

+3.3V

GND_DGND_D

3.6V..6V max. from edge connector

+5V_USB

470R

FB2

0.1 μF
50V
0402

C21

GND_D

3.3k
0402
5%

R26

GREEN
0603

LD1

V

IN

1

SHDN

3

GND

2

PWRGD

4

V

OUT

5

MCP1755/3.3V

U1

MCLR_IN

MCLR_IN

GND_A

0R

0603

R25

GND_D

0R

0603

R64

Shield

“Shield” = Bottom copper pour connection

470R

FB1

+3.3V_A

GND_A

+3.3V_OPA

+3.3V

SDA

SCL

UART TX

UART RX

10R

0402

1%

R58

10 μF
10V
0603

C1

10 μF
10V
0603

C19

10 μF
10V
0603

C12

V

DD

16

GP0

1

GP1

2

RST

3

UART RX

4

UART TX

5

GP2

6

GP3

7

SDA

8

SCL

9

V

USB

10

D-

11

D+

12

V

SS

13

EP

17

NC

14

NC

15

MCP2221A

U3

BAS3010A-3W

D2

FIGURE A-2: dsPIC33EP128GS806 DIGITAL POWER PIM SCHEMATIC REV. 1.1 (PAGE 2 OF 2)

dsPIC33EP128GS806 Digital Power PIM User’s Guide

 2018 Microchip Technology Inc. DS 50002761A-page 17

Top Silk sc r een

Top Copper

A.3 PCB LAYOUT

The dsPIC33EP128GS806 DP PIM is a four-layer FR4, 1.55 mm, Plated Through-Hole (PTH) PCB construction. Figure A-3 through Figure A-5 illustrate
the PCB layers and Figure A-6 shows the assembly drawings of the dsPIC33EP128GS806 DP PIM.

FIGURE A-3: dsPIC33 EP128GS806 DIGITAL POWER PIM TOP SILKSCREEN AND TOP COPPER

Board Layout and Schematics

DS50002761A-page 18  2018 Microchip Technology Inc.

Mid1 Inner Copper

Mid2 Inner Copper

FIGURE A-4: dsPIC33EP128GS806 DIGITAL POWER PIM MID1 AND MID2 INNER COPPER (BOTTOM VIEW)

dsPIC33EP128GS806 Digital Power PIM User’s Guide

 2018 Microchip Technology Inc. DS 50002761A-page 19

Bottom Copper

Bottom Silkscreen

FIGURE A-5: dsPIC33EP128GS806 DIGITAL POWER PIM BOTTOM COPPER AND BOTTOM SILKSCREEN (BOTTOM VIEW)

Board Layout and Schematics

DS50002761A-page 20  2018 Microchip Technology Inc.

Top Assembly

Bottom Assembly

FIGURE A-6: dsPIC33EP128GS806 DIGITAL POWER PIM TOP AND BOTTOM ASSEMBLY

dsPIC33EP128GS806 Digital Power PIM User’s Guide

dsPIC33EP128GS806 DIGIT A L

POWER PIM USER’S GUIDE

Appendix B. Bill of Materials (BOM)

This appendix contains the Bill of Materials (BOM) for the dsPIC33EP128GS806 Digital
Power PIM.

• Bill of Materials

B.1 BILL OF MATERIALS

Table B-1 shows the Bill of Materials for the dsPIC33EP128GS806.

TABLE B-1: dsPIC33EP128GS806 DIGITAL POWER PIM BILL OF MATERIALS

Qty. Designator Description Manufacturer Manufacturer Part Number

4 C1, C5, C12, C19 Capacitor Ceramic, 10 µF,

10V, 20%, X5R, SMD, 0603

1 C2 Capacitor Ceramic, 0.47 µF,

16V, 10%, X7R, SMD, 0603

8 C3, C6, C14, C15, C27,

C29, C34 , C35

6 C4, C11, C21, C24,

C32, C33

5 C7, C8, C9, C10, C20 Capacitor Ceramic, 1 µF,

2 C13, C17 Capacitor Ceramic, 100 pF,

5 C16, C22, C26, C28,

C30

1 C23 Capacitor HiQ, 22 pF, 50V,

1 C25 Capacitor Ceramic, 56 pF,

2 D1, D2 Diode Schottky,

4 D3, D4, D5, D6 Diode Schottky, DB2S31000L,

2 FB1, FB2 Ferrite, 300 mA, 470R, SMD,

1 J1 Connector Header-2.54 Male,

1 J3 Connector USB 2.0 micro-B

Capacitor Ceramic, 560 pF,
50V, 5%, C0G, NP0, SMD,
0603

Capacitor Ceramic, 0.1 µF,
50V, 10%, X7R, SMD, 0402

10V, 10%, X7S, SMD, 0402

50V, 5%, NP0, SMD, 0603
Capacitor Ceramic, 5600 pF,

25V, 5%, C0G, SMD, 0603

5%, NP0, 1.95 GHz, SMD,
0402

50V, 5%, C0G, SMD, 0402

BAS3010A-3W , 470 mV, 1A,
30V, SOD-323

470 mV, 200mA, 30V , SMD,
SOD-523

0603

1x6, Gold, 5.84MH, TH,
Vertical

Female, TH/SMD, R/A

Samsung Group CL10A106MP8NNNC

®

Murata Electronics

KEMET C0603C561J5GACTU

TDK Corporation C1005X7R1H104K050BB

TDK Corporation C1005X7S1A105K050BC

Cal-Chip
Electronics Inc.

TDK Corporation C1608C0G1E562J080AA

Johanson
Technology Inc.

TDK Corporation C1005C0G1H560J050BA

Infineon
Technologies AG

®

Panasonic
Electronic Co.

Murata Electronics
North America, Inc.

FCI 68000-106HLF

FCI 10118194-0001LF

GRM188R71C474KA88D

GMC10CG101J50NTLF

500R07S220JV4T

BAS3010A03WE6327HTSA1

DB2S31000L

BLM18BB471SN1D

 2018 Microchip Technology Inc. DS50002761A-page 21

dsPIC33EP128GS806 Digital Power PIM User’s Guide

TABLE B-1: dsPIC33EP128GS806 DIGITAL POWER PIM BILL OF MATERIALS (CONTINUED)

Qty. Designator Description Manufacturer Manufacturer Part Number

1 LD1 Dio de LED Green, 2V,

30 mA, 35 mcd, Clear, SMD,
0603

1 LD2 Diode LED Red, 1.8V,

40 mA, 10 mcd, Clear, SMD,
0603

2 R1, R36 Resistor TKF, 10k, 1%,

1/10W, SMD, 040 2

3 R2, R73, R74 Resistor TKF, 100R, 1%,

1/10W, SMD, 040 2

15 R3, R6, R8, R9, R10,

R11, R12, R15, R18,
R46, R47, R48, R65,
R66, R67

15 R4, R5, R7, R13, R14,

R16, R17, R19, R20,
R22, R29, R41, R45,
R70, R71

2 R21, R68 Resistor TKF, 560R, 1%,

2 R23, R26 Resistor TKF, 3.3k, 5%,

18 R24, R27, R32, R33,

R35, R37, R38, R40,
R43, R44, R49, R51,
R52, R53, R54, R55,
R56, R69

2 R25, R64 Resistor T KF, 0R, 1/10W,

2 R39, R50 Resistor TKF, 4.7k, 5%,

1 R57 Resistor TKF, 49.9R, 1%,

1 R58 Resistor TKF, 10R, 1%,

3 R59, R60, R61 Resistor TKF, 10k, 0.5%,

1 R62 Resistor TKF, 49.9R, 1%,

1 R63 Resistor TKF, 3.3k, 0.5%,

3 TP1, TP2, TP4 Misc, Test Point PC Mini,

1 TP5 Misc, Test Point Multipu rpose

Resistor TKF, 150R, 1%,
1/10W, SMD, 060 3

Resistor TKF, 75R, 1%,
1/16W, SMD, 040 2

1/10W, SMD, 060 3

1/10W, SMD, 040 2
Resistor TKF, 270R, 5%,

1/10W, SMD, 040 2

SMD, 0603

1/10W, SMD, 040 2

1/16W, SMD, 040 2

1/16W, SMD, 040 2

1/16W, SMD, 040 2

1/8W, SMD 0805

1/16W, SMD, 040 2

0.040", D, Yellow

Mini, Black

®

Lite-On

Lite-On, Inc. LTST-C190KRKT

Panasonic
Electronic Co.

Panasonic
Electronic Co.

Stackpole
Electronics, Inc.

Yageo Corporation RC0402FR-0775RL

Yageo Corporation RC0603FR-07560RL

Panasonic - ECG ERJ-2GEJ332X

Panasonic - ECG ERJ-2GEJ271X

NIC Components Corp. NRC06Z0TRF

Panasonic - ECG ERJ-2GEJ472X

ROHM Semiconductor MCR01MRTF49R9

ROHM Semiconductor MCR01MRTF10R0

Susumu Co., Ltd. RR0510P-103-D

Panasonic - ECG ERJ-6ENF49R9V

Panasonic
Electronic Co.

Keystone Electronics
Corp.

Keystone Electronics
Corp.

, Inc. LTST-C190KGKT

ERJ-2RKF1002X

ERJ-2RKF1000X

RMCF0603FT150R

ERA-2AED332X

5004

5001

DS50002761A-page 22  2018 Microchip Technology Inc.

Bill of Materials (BOM)

TABLE B-1: dsPIC33EP128GS806 DIGITAL POWER PIM BILL OF MATERIALS (CONTINUED)

Qty. Designator Description Manufacturer Manufacturer Part Number

Microchip Parts

1 U1 Microchip Analog LDO, 3.3V,

MCP1755T-3302E/OT,
SOT-23-5

1 U2 Microchip MCU, 16- Bit,

120 MHz, 128K, 8K,
dsPIC33EP128GS806,
TQFP-64

1 U3 Microchip Inte rface, USB,

I2C/UART, MCP2221A-I/ML,
QFN-16

1 U4 Microchip Analog Op A mp,

1-Ch, 10 MHz,
MCP6021T-E/OT, SOT-23-5

1 Y1 Microchip Clock Oscillator

Single, 7.3728 MHz,
DSC6011JI2A-007.3728,
VDFN-4

Mechanical Parts

1 LABEL3 Label, AIPD Board Assembly — —

1 PCB1 Printed Circuit Board — 04-10750-R1.0

Do Not Populate Parts

2 C18, C31 Capacitor Ceramic, 560 pF,

50V, 5%, C0G, NP0, SMD,
0603

1 R72 Resistor TKF, 0R, 1/10W,

SMD, 0603

Microchip
Technology Inc.

Microchip
Technology Inc.

Microchip
Technology Inc.

Microchip
Technology Inc.

Microchip
Technology Inc.

PCB

KEMET C0603C561J5GACTU

NIC Components Corp. NRC06Z0TRF

MCP1755T-3302E/OT

dsPIC33EP128GS806-I/PT

MCP2221A-I/ML

MCP6021T-E/OT

DSC6011JI2A-007.3728

 2018 Microchip Technology Inc. DS50002761A-page 23

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

http://www.microchip.com/
support

Web Address:

www.microchip.com

Atlanta

Duluth, GA
Tel: [phone]
Fax: [phone]

Austin, TX

Tel: [phone]

Boston

Westborough, MA
Tel: [phone]
Fax: [phone]

Chicago

Itasca, IL
Tel: [phone]
Fax: [phone]

Dallas

Addison, TX
Tel: [phone]
Fax: [phone]

Detroit

Novi, MI
Tel: [phone]

Houston, TX

Tel: [phone]

Indianapolis

Noblesville, IN
Tel: [phone]
Fax: [phone]
Tel: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]
Tel: [phone]

Raleigh, NC

Tel: [phone]

New York, NY

Tel: [phone]

San Jose, CA

Tel: [phone]
Tel: [phone]

Canada - Toronto

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Australia - Sydney

Tel: [phone]

China - Beijing

Tel: [phone]

China - Chengdu

Tel: [phone]

China - Chongqing

Tel: [phone]

China - Dongguan

Tel: [phone]

China - Guangzhou

Tel: [phone]

China - Hangzhou

Tel: [phone]

China - Hong Kong SAR

Tel: [phone]

China - Nanjing

Tel: [phone]

China - Qingdao

Tel: [phone]

China - Shanghai

Tel: [phone]

China - Shenyang

Tel: [phone]

China - Shenzhen

Tel: [phone]

China - Suzhou

Tel: [phone]

China - Wuhan

Tel: [phone]

China - Xian

Tel: [phone]

China - Xiamen

Tel: [phone]

China - Zhuhai

Tel: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]

India - New Delhi

Tel: [phone]

India - Pune

Tel: [phone]

Japan - Osaka

Tel: [phone]

Japan - Tokyo

Tel: [phone]

Korea - Daegu

Tel: [phone]

Korea - Seoul

Tel: [phone]

Malaysia - Kuala Lumpur

Tel: [phone]

Malaysia - Penang

Tel: [phone]

Philippines - Manila

Tel: [phone]

Singapore

Tel: [phone]

Taiwan - Hsin Chu

Tel: [phone]

Taiwan - Kaohsiung

Tel: [phone]

Taiwan - Taipei

Tel: [phone]

Thailand - Bangkok

Tel: [phone]

Vietnam - Ho Chi Mi nh

Tel: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]

Denmark - Copenhagen

Tel: [phone]
Fax: [phone]

Finland - Esp oo

Tel: [phone]

France - Paris

Tel: [phone]
Fax: [phone]

Germany - Garching

Tel: [phone]

Germany - Haan

Tel: [phone]

Germany - Heilbronn

Tel: [phone]

Germany - Karlsruhe

Tel: [phone]

Germany - Munich

Tel: [phone]
Fax: [phone]

Germany - Rosenheim

Tel: [phone]

Israel - Ra’anana

Tel: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Italy - Padova

Tel: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

Norway - Trondheim

Tel: [phone]

Poland - Warsaw

Tel: [phone]

Romania - Bucharest

Tel: [phone]

Spain - Madrid

Tel: [phone]
Fax: [phone]

Sweden - Gothenberg

Tel: [phone]

Sweden - Stockholm

Tel: [phone]

UK - Wokingham

Tel: [phone]
Fax: [phone]

DS50002761A-page 24  2018 Microchip Technology Inc.

10/25/17