Microchip Technology CX8703B User Manual

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Page 1

JukeBlox Networked Media Module

CX Series

Datasheet

• Complete audio networking system on a small module Integrated Ethernet + USB 2.0

•

WiFi-certified 802.11b/g

•

• Built-in strip antenna

• Optional 2X Diversity Antenna

Glueless audio, video and control ports

•

FCC certified

•

• Ideal for enabling network and USB audio playback for iPod docks, audio

systems, AV Receivers, active speaker systems, internet radios, network playback adaptors

SMSC CX860/CX870 Revision 2.4 (03-23-12)

SMSC CONFIDENTIAL

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JukeBlox Networked Media Modules – CX Series

Datasheet

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80 ARKAY DRIVE, HAUPPAUGE, NY 11788 (631) 435-6000 or 1 (800) 443-SEMI

Copyright © 2011 SMSC or its subsidiaries. All rights reserved. Circuit diagrams and other information relating to SMSC products are included as a means of illustrating typical applications. Consequently, complete information sufficient for

construction purposes is not necessarily given. Although the information has been checked and is believed to be accurate, no responsibility is assumed for inaccuracies. SMSC reserves the right to make changes to specifications and product descriptions at any time without notice. Contact your local SMSC sales office to obtain the latest specifications before placing your product order. The provision of this information does not convey to the purchaser of the described semiconductor devices any licenses under any patent rights or other intellectual property rights of SMSC or others. All sales are expressly conditional on your agreement to the terms and conditions of the most recently dated version of SMSC's standard Terms of Sale Agreement dated before the date of your order (the "Terms of Sale Agreement"). The pro duct may contain design defects or errors known as anomalies which may cause the product's functions to deviate from published specifications. Anomaly sheets are available upon request. SMSC products are not designed, intended, authorized or warranted for use in any life support or other application where product failure could cause or contribute to personal injury or seve re propert y damage. Any and all such uses without prior written approval of an Officer of SMSC and furthe r te sting and/or modification will b e f ully at the risk of the customer. Copies of this document or other SMSC literature, as well as the Terms of Sale Agreement, may be obtained by visiting SMSC’s website at http://www.smsc.com. SMSC is a registered trademark of Standard Microsystems Corporation (“SMSC”). Product names and company names are the trademarks of their respective holders.

SMSC DISCLAIMS AND EXCLUDES ANY AND ALL WARRANTIES, INCLUDING WITHOUT LIMITATION ANY AND ALL IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, TITLE, AND AGAINST INFRINGEMENT AND THE LIKE, AND ANY AND ALL WARRANTIES ARISING FROM ANY COURSE OF DEALING OR USAGE OF TRADE. IN NO EVENT SHALL SMSC BE LIABLE FOR ANY DIRECT, INCIDENTAL, INDIRECT, SPECIAL, PUNITIVE, OR CONSEQUENTIAL DAMAGES; OR FOR LOST DATA, PROFITS, SAVINGS OR REVENUES OF ANY KIND; REGARDLESS OF THE FORM OF ACTION, WHETHER BASED ON CONTRACT; TORT; NEGLIGENCE OF SMSC OR OTHERS; STRICT LIABILITY; BREACH OF WARRANTY; OR OTHERWISE ; WHETHER OR NOT ANY REMEDY OF BUYER IS HELD TO HAVE FAILED OF ITS ESSENTIAL PURPOSE, AND WHETHER OR NOT SMSC HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.

SMSC CX860/CX870 2 Revision 2.4 (03-23-12)

SMSC CONFIDENTIAL

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JukeBlox Networked Media Modules – CX Series

Datasheet

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Table of Contents

1 INTRODUCTION...............................................................................................................4

2 BLOCK DIAGRAM.............................................................................................................4

3 BOARD PICTURES............................................................................................................5

3.1 TOP VIEW OF CX870 ........................................................................................................ 5

3.2 BOTTOM VIEW OF CX870 ................................................................................................... 6

3.2.1 CX870 Bottom View with 64-pin Low Density Connector........................................ ...... 6

3.2.2 CX870 Bottom View with 120-pin Media Connector.....................................................6

3.3 PRODUCTION MODULE WITH TOP AND RF SHIELDS IN PLACE – T OP VIEW .............................................7

3.4 PRODUCTION MODULE WITH 64-PIN CONNECTOR OPTION – SIDE VIEW ..............................................7

3.5 EXAMPLE PRODUCTION MODULE SHOWING SOLDERED RF SHIELD ..................................................... 8

3.6 PRODUCTION MODULE WITH BOTTOM SHIELD (PART NUMBERS WITH A “B” AFTER THE CONFIGURATION LETTER)9

3.6.1 Including J3 Low Density 64-pin connector – Bottom View........................................... 9

3.6.2 Including J2 High Density 120-pin connector – Bottom View........................................ 9

4 ORDERING GUIDE .........................................................................................................10

4.1 PART NUMBER SYNTAX ................................. .................................................................... 11

5 ELECTRICAL SPECIFICATIONS....................................................................................... 12

5.1 ABSOLUTE MAXIMUM RATINGS ............................................................................................ 13

5.2 OPERATING CONDITIONS................................................................................................... 13

5.3 WIFI SPECIFICATION (CX870 ONLY).................................................................................... 14

6REGULATORY COMPLIANCE AND QUALITY ....................................................................15

6.0.1 Antenna Considerations.............................. ........................ ......................... ............ 16

6.1 ROHS......................................................................... ............................................... 17

6.2 ENVIRONMENTAL TEST................................................. ..................................................... 17

6.3 ESD AND TRANSIENT TEST (APPLIES TO LAN AND USB EXTERNAL CONNECTIONS ONLY)......................... 17

6.4 MAGNETIC FIELD TEST ..................................................................................................... 17

6.5 MTBF...................................................................................................... .................. 17

6.6 MECHANICAL SPECIFICATIONS............................................................................................. 17

6.7 MODULE QUALITY........................................................................................................... 17

7 BOARD DIMENSIONS AND WEIGHT...............................................................................18

7.1 TOP & BOTTOM VIEW OF CX870 MODULE WITHOUT BOTTOM SHIELD............................................... 18

7.1.1 Top & Bottom View of CX870 Module with Bottom Shield .......................................... 18

7.2 SIDE VIEW OF CX870 MODULE WITHOUT BOTTOM SHIELD ........................................................... 19

7.2.1 Side View of CX870 Module with Bottom Shield......................... .. ... .. .... .. .. .. .. .... .. .. .. .. 19

7.3 3D VIEW OF CX870 MODULE WITHOUT BOTTOM SHIELD....................................... ...................... 20

7.4 MODULE WEIGHT ........................................................................................................... 20

8 CONNECTORS AND CONNECTIONS ................... .. .. ........................ .. ... .. .. .. ......................21

8.1WLAN UFL A

8.2M

9 APPLICATION GUIDELINES...........................................................................................29

9.1 POWER SUPPLY SEQUENC I NG AND RESET TIMING ....................................................................... 29

9.2 RF CONSIDERATIONS .......................... ............................................................................ 30

10 REVISION CONTROL....................................................................................................31

11 APPENDIX 1: CERTIFICATION NOTICES......................................................................38

SMSC CX860/CX870 3 Revision 2.4 (03-23-12)

ODULE CONNECTORS

8.2.1Pin Descriptions ................................................................................................... 22

8.2.2 Connector PIN Assignments......................................................... .......................... 27

8.2.3 GPIO Assignments................................... .. .. .. .... .. .. .. .... .. .. .... .. ... .. .... .. .. .. .... .. .. .. .... .. 29

9.1.1 Power up, Reset and Power Down Timing................................................................ 30

NTENNA CONNECTOR (OPTIONAL

..................................................................................................... 21

SMSC CONFIDENTIAL

)........................................................................ 21



  

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JukeBlox Networked Media Modules – CX Series

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1 Introduction

The CX-series module is a single-board networked media player module, based on SMSC’s DM860A and DM870A media processors, and enables fast product developments with Ethernet, USB and optional WiFi connectivity. The module connects to standard legacy components in various audio, video/LCD and control formats.

2 Block Diagram

JukeBlox Networked Media Module – CX Series

RJ-45

Transformer

Type-A

Display

SD-Card

CCIR-656

A/D, D/A

S/PDIF

Host

Controller/

LCD setup

USB

Apple Coprocessor

3.3V

1.2V

1.9V

Reset In

3x6bit RGB

4/8bit MMC

Video Out

Audio I/O

SPI Ctrl.

GPIO

Ethernet

Transceiver

I2C

PWM DAC

UART

I2C

JTAG

DM860A DM870A

RST

RMII

USB LCD

SSM

I2C

DAC

Ports

UART

I2C

JTAG

SPI

GPIO

Flash Mem.

Bus

802.11

RF Amp. ANT

Ext.

Antenna

NAND-Flash

256 Mbit

SDRAM

NOR-Flash

2.4 GHz RF transceiver

switch

PCB

Ext.

Antenna

24.000 MHz

PCB

Antenna

Note: Choice of antenna is a build option, see Ordering Guide.

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3 Board Pictures

Please note that all production modules include the RF and top shield. The below top view has the shields temporarily removed to show the components. Also, please note that the 64-pin connector mounted on the module is the male gender.

3.1 Top View of CX870

802.11b/g front-end

PCB antenna

External Antenna

Connectors

SMSC processor

Ethernet PHY

SDRAM

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3.2 Bottom View of CX870

3.2.1 CX870 Bottom View with 64-pin Low Density Connector

LCD connector

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Low density connector

LCD

connector

3.2.2 CX870 Bottom View with 120-pin Media Connector

FLASH

Media

connector

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3.3 Production Module with Top and RF shields in place – Top View

3.4 Production Module with 64-pin Connector Option – Side View

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3.5 Example Production Module Showing Soldered RF Shield

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3.6 Production Module with Bottom Shield (Part Numbers with a “B” after the configuration letter)

3.6.1 Including J3 Low Density 64-pin connector – Bottom View

3.6.2 Including J2 High Density 120-pin connector – Bottom View

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4 Ordering Guide

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Part Number SMSC IC’s

CX870-3A CX870-3B CX870-3D

CX870-3DS

CX870-3F CX870-3G CX870-3H

CX870-3I CX870-3J CX870-3K

CX870-3BB CX870-3DB

CX870-

3DBS

CX870-3HB

CX870-3IB

CX870-3JB

CX870-3B-D

CX870-3B-

D60

DM870A+T6201 X (X)* X X X X X X X X DM870A+T6201 X X X X X X X X DM870A+T6201 X X X X X X X X

% DM870A+T6201 X X X X X X X X

DM870A+T6201 X X X X X X X DM870A+T6201 X X X X X X

DM870A+T6201 X X X X X X X

DM870A+T6201 X X X X X X

DM870A+T6201 X X X X X X DM870A+T6201 X X X X X X X DM870A+T6201 X X X X X X X X DM870A+T6201 X X X X X X X X

DM870A+T6201 X X X X X X X X

DM870A+T6201 X X X X X X X X DM870A+T6201 X X X X X X X DM870A+T6201 X X X X X X X DM870A+T6201 X X X X X X X X X

DM870A+T6201 X X X X X X X X X

Internal PCB

Diversity

Antennas

Ext. Diversity

Antennas (UFL

Conn.)+

One

Two

Ant.

Low

Ethernet

USB

density 64-

Host

pin Conn.

Hi density

120-pin

Conn.

density

LCD

Conn.

64MB

SDRAM

32MB

SDRAM

16MB

SDRAM

1Gb

NAND

8MByte

NOR

Top

Module

Shield

Note: Please note that the Apple Authentication Coprocessor will not be provided on the CX module. The Apple Authentication Coprocessor should be provided on the product motherboard, connected to the SDA, SCL signals from the CX module.

Note: Shaded rows indicate Custom or Obsolete configuration - NOT TO BE USED FOR NEW/STANDARD MP DESIGNS.

* Connector on board, but requires board modification to enable the connector.

+ The position of the X in the One Ant. column indicates that there is one external antenna connector provided. The position of the X in the Two Ant. column indicates that there are two external antenna connectors provided. Do not use a module which has two external antenna connectors with only one external antenna connected. Leaving one antenna socket open will degrade WiFi performance. SMSC recommends always using modules with two external antennas for best performance.

The CX870-3DS is the same as CX870-3D, except that the RF shield is soldered in place.

Bottom Module

Shield

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4.1 Part Number Syntax

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5 Electrical Specifications

Parameter State Model Voltage Symbol min. typ. max. Units

Power Supply Input Voltage

Logic Input high voltage VIH 1.7 5.5 V Logic Input low voltage VIL -0.3 0.7 V Logic Input threshold voltage VIT 1.29 1.39 1.5 V Schmitt-trigger input low to

high threshold voltage Schmitt-trigger input high to

low threshold voltage Logic Output high voltage VOH 2.4 V Logic Output low voltage VOL 0.4 V Logic Low-level output

current

=0.4V)

Logic High-level output current

=2.4V)

Current Consumption

Reset State

Operating in idle state

Playback over WiFi high mips & rate condition

The maximum current values are 30% larger than the typical values. The maximum

Note:

values are intended to be used for power supply sizing calculations.

CX870

3.3 I3.3 60 78 mA

1.2 I1.2 32 42 mA

1.9 I1.9 18 23 mA

3.3 I3.3 185 241 mA

1.2 I1.2 337 438 mA

1.9 I1.9 257 334 mA

3.3 I3.3 240 312 mA

1.2 I1.2 347 451 mA

1.9 I1.9 258 335 mA

VIN

1.58 1.65 1.71 V

IT+

0.95 1.01 1.06 V

IT-

-9.6 -15.6 -19.3 mA

11.1 22.5 35.3 mA

3.0

1.08

1.8

3.3

1.2

1.9

3.6

1.32

2.0

V V V

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5.1 Absolute Maximum Ratings

Parameter Component Min Max Units

3.3V Supply Voltage -0.5 4.6 V

1.2V Supply Voltage -0.5 1.8 V

1.9V Supply Voltage -0.5 2.2 V Logic Input Voltage -0.5 6 V Logic Output Voltage

Main

5.2 Operating Conditions

Parameter Min Max Units

Operating Temperature 0 +70 °C Operating Humidity 10 90 (non condensing) %RH Storage Temperature -10 +75 °C Storage Humidity 10 95 (non condensing) %RH Storage Temperature Cycle Test 24 hrs -10 +75 °C

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-0.5 4.6 V

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5.3 WiFi Specification (CX870 only)

Feature Description

WLAN Standards IEEE 802.11b

IEEE 802.11g

Frequency Band 2.412 – 2.472 GHz (2.4GHz ISM Band, 13 Channels)

Channel 1 - Channel 13 North America FCC, Japan Telec, Europe ETSI

Modulation 802.11b mode (DS-SS: IEEE 802.11b)

802.11g mode (OFDM: IEEE 802.11g)

Transmission Speed 802.11b mode

11Mbps, 5.5Mbps, 2Mbps, 1Mbps

802.11g mode 54Mbps, 48Mbps, 36Mbps, 24Mbps, 18Mbps, 12Mbps, 9Mbps, 6Mbps

Tx Power 802.11b mode: 16.5dBm, +/-1dB

802.11g mode: 15.0dBm, +/-1dB

Using nominal production settings as follows:

Channel RF11 Rate: 11B ='3' (11Mbps), 11G = '8' (54Mbps) MIB: 11B=9, 11G=1 (Reference for Tx Power Tuning) Room temperature

The above TX Power specifications will apply to modules shipped from Liteon

after 9 April 2012. Power-on Ramp < 2us RF Carrier Suppression < 15dBc TX EVM 802.11b mode: <-22dB

802.11g mode: <-25dB

Rx Sensitivity (incl. CE2 Mother board)

Throughput Rate (measured for each module)

802.11b mode: <=-82dBm @ 1Mbps, <=81dBm @ 2Mbps, <=-81dBm @ 5.5Mbps, <=-78dBm @ 11Mbps

802.11g mode: <=-82dBm @ 9Mbps, <=-81dBm @ 18Mbps, <=-75dBm @ 36Mbps, <=-70dBm @ 54Mbps

See factory test specification

Note: About Tx Power, different (higher/lower) RF output power settings may be used for specific regions, antennas and/or enclosures, in which case re-certification may be required.

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6 Regulatory Compliance and Quality

Description Country Compliance Module Versions Passed

Electromagnetic Compatibility (Prescan)

Radio Regulations (CX870 only)

SMSC does not certify all module variants for all countries. Please see above table for those module versions for which certain certifications have already been done.

Please contact your SMSC sales office for the latest information about which modules are certified for which countries, and arranging for additional certification for your chosen module if needed. Any additional cert ifications will need to be paid for by the customer.

Product manufacturers are responsible for the end product certification.

SMSC can help manufacturers to prepare for the WiFi Alliance tests by providing an example test plan and the required commands to enable special test modes. Please contact your SMSC sales office about WiFi Alliance logo certification assistance.

The CX module has received Limited Module Approval (LMA) from FCC. This is because the CX module does not have a built-in +1.9V regulator circuit. SMSC recommends that customers follow the +1.9V supply voltage requirements given in this data sheet, and follow the +1.9V power supply design given in “CX Module Power Supply_V1.1.pdf” document or later version. If the power supply recommendations are followed, then customers will not need to go through formal certification of the product for WiFi related RF behavior for FCC. It is the product manufacturers responsibility to make sure that the power supply recommendations are followed, and that the RF behavior meets the certification requirements when the module is installed in the final product.

Please check the SMSC/BridgeCo Customer Portal at https://portal.bridgeco.net/ certification and recommended interfacing and power supply schematics.

USA Europe

USA Japan Canada Europe New Zealand/Australia China Korea

FCC CFR47 Part15B EN 55022 EN 55024 EN 61000-3-2 EN 61000-3-3 EN 61000-4-2 EN 61000-4-3 EN 61000-4-4 EN 61000-4-5 EN 61000-4-6 EN 61000-4-8 EN 61000-4-11

FCC Part 15C Telec IC RSS-210 CE CE SRRC KCC

for documents about WiFi

B, D, F, H, I, J B B, D, F, H, I, J B

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6.0.1 Antenna Considerations

Here are the antennas used for certification:

CX870-3B

Dipole, WINiZEN, WIE-WO-08, 3.2 dBi for 2.4GHz

CX870-3D

FCC&IC: Inverted-F, Tyco Electronics, 2174241, 2.19 dBi for 2.4 GHz CE: Wanshih 01S0940-00, dipole, 1.59dBi@2.4GHz, 2.65dBi@2.45GHz, 1.76dBi@2.5GHz

CX870-3F

Printed on PCB, Lite-On, N/A, 3.91 dBi for 2.4 GHz

CX870-3H

Dipole, MAG.LAYERS, EDA-8709-2G4C1-A66, 2 dBi for 2.4GHz

CX870-3I

Dipole, MAG.LAYERS, EDA-8709-2G4C1-A66, 2 dBi for 2.4GHz

CX870-3J

Dipole, MAG.LAYERS, EDA-8709-2G4C1-A66, 2 dBi for 2.4GHz

Notes about antenna changes:

1) Equivalent antennas from other manufacturers may be substituted, and then marketed without a Class II permissive change

2) Equivalent antennas must be of the same type (e.g. dipole, PIFA, etc.), must be of equal or less gain than the antennas listed and previously authorized under the same FCC ID, and must have similar in band and out of band characteristics (consult specification sheet for cutoff frequencies).

3) In case of new antenna types, or higher gain antennas, a Class II permissive change is required and compliance with FCC section 15.203 must be met.

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6.1 RoHS

Uses only RoHS compliant components

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6.2

Withstands 4 hours at 70°C, 90% RH

6.3

Environmental Test

ESD and Transient Test (Applies to LAN and

USB external connections only)

ESD: +/- 2kV operation, +/- 4kV no destruction (part of CE test) Fast electrical transients: +/- 500V operation, +/- 1000V no destruction (part of CE test)

6.4 Magnetic Field Test

Passes EN55022 and EN55024 (part of CE test)

6.5

>10000 hours

6.6

Passes drop test according to I.E.C. 68-2-32, height 100 cm, 1 corner, 6 faces. Passes vibration test with sine, vertical, 60 minutes, 600 to 18000 cpm, 1G

6.7

Defect Rate: < 1% AQL CR=0, MA=0.4, MI=0.4

MTBF

Mechanical Specifications

Module Quality

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7 Board Dimensions and Weight

7.1

Top & Bottom View of CX870 Module without

Bottom Shield

7.1.1 Top & Bottom View of CX870 Module with Bottom Shield

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7.2 Side View of CX870 module without Bottom Shield

Note:

1. All dimensions are measured in

2. PCB’s thickness: 1.00 +/- 0.10mm

3. Tolerance: +/-0.10mm

4. Outline Tolerance: +/-0.10mm

5. NPTH Hole: +/-0.05mm

6. PTH Hole: +/-0.075mm

7. Connector positions, board dimensions, mounting hole positions and sizes are the same for all module variants.

8. Connector position tolerance: +/- 0.38mm

9. The 64-pin connector mounted on the module along

one edge is the male gender.

10. Not all module variants have all connectors. Please

see the Ordering Guide table for details of connector options.

millimetres

(mm).

7.2.1 Side View of CX870 Module with Bottom Shield

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7.3

3D View of CX870 Module without Bottom

Shield

Note: A 3D file of the CX module in .stp format is available

from the SMSC Customer Portal.

7.4 Module Weight

CX860: 20g CX870: 20g

Note: Module weight applies to all versions of the module.

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8 Connectors and Connections

8.1 WLAN UFL Antenna Connector (optional)

The module includes two PCB strip antennas operated in diversity mode. Alternatively, one or two coaxial antenna connectors are provided for connecting external (to the module) antennas. The choice between using the strip antenna or using the coaxial sockets is a build option, determined by the position of surface mount capacitors on the module PCB. If the PCB antennas are chosen, then diversity mode is always used. If external (to the module) antenna sockets are used, then two external antennas should be used to provide 2X diversity operation.

If external antenna is used, please choose the proper part number indicating two external antenna sockets. Do not use a module which has two external antenna sockets with only one external antenna connected; this will result in reduced WiFi performance.

Please see ordering guide for build option details.

The surface-mount antenna socket used in the CX module is:

UF.L type Ultra Small Surface Mount Coaxial Connector

8.2

The CX860/870 module uses 3 board-to-board connectors as interfaces to the product main board. The part numbers for the connectors needed on the product main board, which mate with the connectors on the CX module, are shown in the table below.

Connector Number

J1 LCD 30 2 x 15 x 0.5mm 14-5046-030-145-829+ (Kyocera) J2 Media 120 2 x 60 x 0.5mm 14-5046-120-145-829+ (Kyocera) J3 Low Density

Module Connectors

Connector Purpose

Connector Type

B2B

Connector

Number of Pins

64 2 x 32 x 2.54mm CSHA201-3202A001A1AB

Pin Configuration

Mating Connector Part Numbers

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The pinout and signal names are shown on the next page. The following table provides an overview for the most important control and interface signals.

8.2.1 Pin Descriptions

Signal(s) Type Description

POWER

VIN(+3.3V) P Power supply input ; +3.3V. VIN (+1.2V) P Power supply input ; +1.2V. VIN (+1.9V) P Power Supply input; +1.9V for powering RF section. Make sure this is a clean supply. 3V3RTC P The RTC function is no longer supported. This pin should be left open. GND P Ground (GND) connection for power supply 0V, signal returns and shielding.

SPI

SPI_DOUT O SPI data from DM870A to host controller. SPI_DIN I SPI data from host controller to DM870A. SPI_CLK I SPI clock from host controller to DM870A. Maximum recommended frequency is 2MHz,

SPI_NCS0 I SPI chip select from host controller to DM870A. PDOUT1 O This signal is used as SPI_REQ, SPI request signal, from DM870A to host controller for

SPI_NCS1 I Not used. Leave open.

UART

RXD1 I UART1 input to the DM870A, used for shell access. SMSC recommends providing a

TXD1 O UART1 output from the DM870A, used for shell access. SMSC recommends providing a

RXD0 I UART0 input. Optionally used for controlling an iPod via UART. TXD0 O UART0 output. Optionally used for controlling an iPod via UART.

typical frequency is 1MHz. See Note 2 below.

eDMP applications. Logic 1 indicates that there is an SPI message waiting to be read, the host controller should start the SPI clock and read any changed registers. Logic 0 indicates that all changed register messages have been read and the message buffer is empty. Also GPIO-06.

connection to an external RS-232 transceiver and DB9 connector to connect to a PC COM port. Such a connection can be used for product development debugging, and for module programming control on the product manufacturing line and for module control during certification procedures.

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AUDIO AV2DATA0 O I2S or left justified audio data output. Typically connected to external D/A converter input

or to external DSP for further audio processing. Used for main left and right channel audio output data. See Note 3.

AV2CTRL0 O LRCK, audio data word clock at the audio sample rate (Fs). Maximum currently supported

frequency is 192kHz.

AV2CTRL1 O MCLK, audio master clock at 256Fs. This can be used to clock an external D/A converter

or DSP. AV2CLK O SCLK, audio data bit clock at 64Fs. Allows for up to 32 audio data bits per sample word. AV4DATA1 O SPDIF format output. Can support samples rates up to 192kHz, so the maximum

instantaneous frequency on this pin is 24.576MHz. AV4DATA0 I SPDIF input. Not used at present. Leave open. AV2DATA1 O I2S or left justified audio data output. Not used at present. Leave open. AOUTLP/AOUTLN,

AOUTRP/AOUTRN

AV2DATA2 I I2S or left justified audio data input. Can be driven from an optional external A/D

AV2DATA3 I I2S or left justified audio data input. Not used at present. Leave open.

CONTROL

NCS3 I This signal is configured as GPIO-17 and is currently not used. DM870A-internal pull-up.

PDOUT0 I Factory Reset. GPIO-04. Return the CnE to factory settings. High-active input, DM870A-

VCO0 I Infrared sensor input. GPIO-05. This is a Schmitt-Trigger input and can handle inputs with

AV3CLK O ETH_NRESET Low-active reset for the on-board ethernet PHY. This output is driven by

AV3CTRL0, AV3CTRL1

NRESET_MOD I Low-active input to reset the module. This signal must be driven by an external reset

NPD_RF I Active low input to shut down the power for the 802.11 RF section. Internal 10kohm pull-

O Differential stereo output from PWM-DAC, right and left channels. These signals require

analog low pass filtering. SMSC is not recommending using the PWM-DAC outputs

because of the potential for high out-of-band noise and uncharacterized audio quality.

SMSC recommends using an external D/A converter connected to AV2DATA0.

converter used to interface to iPod analog output or other analog audio sources. If not

used, leave open.

Leave this pin open.

internal pull-down. Pull to GND with a 10kohm resistor, unless return to factory settings

from a hardware control is needed. Normally, return to factory settings is controlled from

the host controller via SPI register. This pin is only monitored during the boot up process.

slow slopes. Used for aDMP firmware builds for infrared remote control sensor output

connection to DM870A. For applications with a host controller, pull this pin to +3.3V via a

10kohm resistor.

the DM870A. GPIO-12. Leave this pin open.

I/O I2C_SCL, I2C_SDA bus created by GPIO-13 and GPIO-14.

No internal pull-ups; Use 4.7kohm pull up resistor on each pin to +3.3V. Maximum

frequency is 400kHz.

generator, or by a GPIO output from a host controller. See the application section of this

data sheet for the timing requirements for NRESET_MOD. Includes internal 10K pull-up

resistor to +3.3V.

up resistor to +3.3V. Leave open if powering down the RF section is not required.

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ETHERNET

ETH_RXN, ETH_RXP, ETH_TXN, ETH_TXP

ETH_LED_SPEED, ETH_LED_ACT

M Ethernet signals between the PHY on the module and the external magnetics

(transformer). See Note 4. Maximum bit rate is 100Mbps.

3.3V push-pull outputs (max. ±12mA) to drive the ethernet LEDs.

100Mbps speed mode and activity are indicated by the outputs being low. Connect to

LEDs through 220ohm resistors.

USB

USB_DN, USB_DP M USB data signals, normally connected to type A connector, USB switch or iPod dock

USB_VBUS M Analog input for monitoring USB type A connector power. Connect to the +5V power which

USBVBUSDRV O Logic output to control an external MOSFET that is in series with USB type A connector

JTAG

TMS,TCK,TDI, TDO I/O JTAG port for DM870A. Leave open.

SSM

SSMD4, SSMD5, SSMD6, SSMD7

SSMD0, SSMD1, SSMD2, SSMD3, SSMCLK, SSMCP, SSMCMD, SSMWP

VIDEO

AV0CLK, AV0CTRL0, AV0CTRL1, AV0CTRL2, AV0DATA0, AV0DATA1, AV0DATA2, AV0DATA3,

AV1DATA0, AV1DATA1, AV1DATA2, AV1DATA3

connector. Maximum bit rate is USB High Speed at 480Mbps.

is driving the USB type A connector power pins. If this pin drops below 4.6V, then the

DM870A will drive the USBVBUSDRV signal low to control an external power MOSFET to

disconnect +5V power from the USB type A connector. See Note 5.

power. See USB_VBUS above and Note 5.

I/O Can be used to drive external shift registers to make extended GPIO signals (see Note 6),

or as individual GPIO signals, or to make an SD card interface. SD card firmware is not

supported at present in JB2. Can be mapped to GPIO #s 08,09,10,11. Leave open if not

used.

I/O Used to make an SD card interface. SD card firmware is not supported at present in JB2.

Leave open.

O ITU-R BT.656 digital video output signals. Optionally used to make a TVout menu display,

or to display decoded album art. Can be connected to video D/A converter (see Note 7), or

connected to a video DSP.

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GPIO (not already mentioned elsewhere in this table)

A22 O GPIO18 Reserved for NOR flash address A22. Leave open. A23 O GPIO-16 Reserved for NOR flash address A23. Leave open. NWAIT I/O GPIO-15 Not currently assigned. Leave open. NCS2 I GPIO-19 Assigned to iPod dock connector iPod NDETECT. See Note 8. VCO1 I/O GPIO-07 Not currently assigned. Leave open. MIICRS I/O GPIO-00 Not currently assigned. Leave open. MIICOL I/O GPIO-01 Not currently assigned. Leave open. MIITXER I/O GPIO-02 Not currently assigned. Leave open. MIITXCLK I/O GPIO-03 iPod dock connector Accessory Power signal. See Note 8.

MII

MIITXD0, MIITXD1, MIIRXD0, MIIRXD1

LCD

LCDD0, LCDD1, LCDD2, LCDD3, LCDD4, LCDD5, LCDD6, LCDD7, LCDD8, LCDD9, LCDD10, LCDD11, LCDD12, LCDD13, LCDD14, LCDD15, LCD16, LCDD17, LCDCLK, LCDCTRL0, LCDCTRL1, LCDCTRL2, LCDCTRL3

I/O Can be used, with GPIO signals above, to drive an external ethernet PHY. This is not

supported by JB2 firmware. Leave open.

O Uses optional J1 LCD connector. Connect to local LCD display. See Note 9. Leave open if

not used.

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Notes:

1. Signal type codes: I – 3.3V level Digital Logic Input into the DM870A O – 3.3V level Digital Logic Output from the DM870A IO – 3.3V level Digital Logic Input and Output (bi-directional) signal M – Miscellaneous, see text for description P – Power Supply

2. For SPI timing diagram for eDMP applications, please see: BridgeCo_JB2x - DeviceControlProtocol_Registers_v_2_1.pdf, or later version.

For detailed setup and hold timing details, see DM870A IC data sheet:

DM870A DS rev. 1.3_12-15-11.pdf, or later version.

3. For audio port timing diagrams, and for detailed setup and hold timing, please see DM870A IC data

sheet:

DM870A DS rev. 1.3_12-15-11.pdf, or later version.

4. For example ethernet external schematic, see: CX Module Ethernet (RJ45 + Ext.Magnetics)_V1.2.pdf, or later version.

5. For example USB schematics, see: CX Module USB_V1.2.pdf, or later version.

6. For example use of extended GPIO shift registers, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version.

7. For example connection to a video D/A converter, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version.

8. iPod dock connector pin and GPIO assignments are under discussion. Please contact SMSC for

recommendations for iPod dock connections to CX870 module.

9. For example connection to an LCD display, see CE2 schematic: A EVMCE2-4_schematic.pdf, or later version.

10. All the above signals are brought out to J2 pins. Not all the above signals are brought out to J3, the

64-pin low density connector. The J3 pin assignments table shows which signals are brought out to the J3 pins.

11. SMSC has a set of example motherboard schematics that shows example external circuitry that is

typically connected to the module. Please check the SMSC/BridgeCo customer portal at

https://portal.bridgeco.net/

12. Please check the SMSC/BridgeCo Customer Portal Download area for the latest version of the

SMSC documents. Go to https://portal.bridgeco.net/ SMSC.

for a copy of these example schematics.

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. If you do not have an account, please contact

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8.2.2 Connector PIN Assignments

J2 – Media Connector

Function GPIO IC PIN Signal Signal IC PIN GPIO Function

GND 1 2 GN D VIN (+3.3V ) 3 4 VIN (+3.3V ) VIN (+3.3V ) 5 6 VIN (+3.3V )

GND 7 8 GN D VIN (+1.2V ) 9 10 VIN (+1.2V) VIN (+1.2V ) 11 12 VIN (+1.2V )

GND 13 14 GND VIN (+1.9V ) 15 16 VIN (+1.9V )

GND 17 18 GND

3V3RTC 19 20 GND

GND 21 22 TMS B15

SPI

Debug UART

SPI_E_NCS GPIO-11 D12 SSMD7 41 42 SSMD1 B11 SPI_E_SDI GPIO-09 B12 SSMD5 43 44 SSMCMD A13

USB

GPIO-16 H17 A23 69 70

GPIO-18 H16 A22 71 72 I2C SDA GPIO-14 T3 AV3CTRL1 73 74 AV0CTRL0 M1 I2C SCL GPIO-13 U2

Vide o Output

LRCK T1 AV2CTRL0 93 94 AV4DATA1 U3 SPDIF output A/D dat a 1 P4 AV2DATA3 95 96 AV4DATA0 V2 SPDIF input A/D dat a 0 R3 AV2DATA2 97 98 GND D/A dat a 1 T2 AV2DATA1 99 100 ETH_LED_ACT D/A dat a 0 U1 AV2DATA0 101 102 ETH_LED_SPEED

Ethernet

GPIO-15 K18 NWAIT 117 118 MIIRXD1 V12

D15 SPI_DOUT 25 26 TDI A16 D14 SPI_DIN 27 28 TDO A15 B16 SPI_CLK 29 30 SPI_NCS0 C15 C13 TXD0 31 32 SPI_NCS1 B17 B14 RXD0 33 34 NRES ET_MOD Module res et input A14 RXD1 35 36 SSMD6 C12 GPIO-10 SPI_E_CLK B13 TXD1 37 38 SSMD4 A12 GPIO-08 SPI_E_SDO

D11 SSMD3 45 46 SSMWP D9 A11 SSMD0 47 48 C10 SSMCLK 49 50 NCS2 J17 GPIO-19 iPod NDETECT D10 SSMCP 51 52 GND

A1 U SB_DN 55 56 GND B1 USB_DP 57 58 AOUTRN L3 E3 USBVBUSDRV 59 60 AOUTRP L4

K4 AOUTLP 63 64 PDOUT1 J1 GPIO-06 SPI_REQ L2 AOUTLN 65 66 VCO1 J2 GPIO-07

M3 AV0CTRL2 77 78 AV1DATA2 P1 M2 AV0CTRL1 79 80 AV1DATA1 P2 L1 AV0CLK 81 82 AV1DATA0 P3 M4 AV0DATA3 83 84 GND N1 AV0DATA2 85 86 AV2CTRL1 T1 MCLK N2 AV0DATA1 87 88 GND N3 AV0DATA0 89 90 AV2CLK R1 SCLK

GND 23 24 TCK C14

GND 39 40 SSMD2 C11

GND 53 54 USB_VBUS D2

GND 61 62 GND

GND 67 68

AV3CTRL0 75 76 AV1DATA3 N4

GND 91 92 GND

GND 103 104 MIICRS R14 GPIO-00 ETH_RXN 105 106 MIICOL T13 GPIO-01 ETH_RXP 107 108 MIIT XER T11 GPIO-02

ETH_TXN 111 112 MIITXD0 U10 ETH_TXP 113 114 MIITXD1 V10

GND 115 116 MIIRXD 0 U12

NPD_RF 119 120 GND

Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit. This allows for easy cross-reference to the DM860A or DM870A data sheet information.

PIN Number

JTAG

SPI

NCS3

PDOUT0 VCO0 AV3CLK

109 110 MIIT XCLK R12 GPIO-03 iPod Access Power

H18

GPI O-17 BIST activate

GPI O-04 F actor y reset

GPIO-05 I R i n p ut

GP IO - 12 ET H NRESET

USB

Video Output

Ethe rne t

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J1 – LCD Connector

Function GPIO IC PIN Signal Signal IC PIN GPIO Function

PIN Number

LCD Interface

V8 LCDD0

GND

T8 LCDD2 V7 LCDD4 T7 LCDD6 V6 LCDD8 T6 LCDD10 V5 LCDD12 T5 LCDD14 U4 LCDD16

GND

T10 LCDCLK

T9 LCDCTRL1 V9 LCDCTRL3

GND

12 34 56 78

910 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30

GND LCDD1 U8 LCDD3 R8 LCDD5 U7 LCDD7 R7 LCDD9 U6 LCDD11 R6 LCDD13 U5 LCDD15 V4 LCDD17 V3 GND LCDCTRL0 R9 LCDCTRL2 U9 GND GND

LCD Interface

Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit.

This allows for easy cross-reference to the DM860A or DM870A data sheet information.

J3 – Low Density Connector

Function GPIO IC PIN Signal Signal IC PIN GPIO Function

GND VIN (+3.3) VIN (+3.3) GND VIN (+1.9) VIN (+1.9)

Free GPIO-15 K18 NWAIT iPod NDETECT GPIO-19 J17 NCS2

SPI

Free GPIO-17 H18 NCS3

E-GPIO_NCS/TBA GPIO-11 D12 SSMD7 I2C S D A GPIO - 1 4 T3 AV3CTRL1 I2C S C L G PIO- 1 3 U2 AV3CTRL0

SPI_REQ GPIO-06 J1 PDOUT1 Factory Reset GPIO-04 K1 PDOUT0 IR input GPIO-05 K2 VCO0

iPod Access Power GPIO-03 R12 MIITXCLK

Ethernet

Free GPIO-00 R14 MIICRS

GND

D13 NRESET

3V3RTC

GND

D14 SPI_DIN D15 SPI_DOUT B16 SPI_CLK C15 SPI_NCS0

GND

ETH_LED_SPEED

ETH_RXN

ETH_TXN

GND

PIN Number

12 34 56 78

910 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64

GND RXD0 B14 TXD0 C13 GND VIN (+1.2) VIN (+1.2) GND RXD1 A14 TXD1 B13 GND AV2CTRL1 R2 MCLK AV2CTRL0 T1 LRCK AV2CLK R1 SCLK AV2DATA2 R3 A/D dat a 0 AV2DATA0 U1 D/A dat a 0 AV4DATA1 T2 SP DIF out put AV4DATA0 V2 SPDIF input GND USB_DN A1 USB_DP B1 USBVBUSDRV E3 USB_VBUS D2 GND SSMD5 B12 GPIO-09 E-GPIO_SDI/TBA SSMD4 A12 GPIO-08 E-GPIO_SDO/TBA GND ETH_LED_ACT SSMD6 C12 GPIO-10 E-GPIO_CLK/TBA ETH_RXP ETH_TXP MIICOL T13 GPIO-01 Free GND

Deb u g UART

USB

Ethe rne tEthernet

Ethe rne t

Note: The IC PIN column indicates the pin number on the DM860A or DM870A integrated circuit.

This allows for easy cross-reference to the DM860A or DM870A data sheet information.

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8.2.3 GPIO Assignments

GPIO Assignments for J3 64-pin Low Density Connector

GPIO PIN Na me PIN Number Function

00 MIICRS 61 Free 01 MIICOL 62 Free 03 MIITXCLK 55 iPOD Access Power 04 PDOUT0 47 Factory Reset 05 VCO0 49 IR Input 06 PDOUT1 45 Host NIREQ 08 SSMD4 50 E_GPIO_SDO/TBA 09 SSMD5 48 E_GPIO_SDI/TBA 10 SSMD6 56 E_GPIO_CLK/TBA 11 SSMD7 37 E_GPIO_NCS/TBA 13 AV3CTRL0 41 I2C_SCL 14 AV3CTRL1 39 I2C_SDA 15 NWAIT 15 Free 17 NCS3 33 Free 19 NCS2 17 IPOD NDETECT

Note: Not all 20 GPIO signals are brought out to J3 64-pin low density connector. For the CX870-3K, GPIOs 00, 01 and 03 are not brought out to J3 64-pin low density connector. J3 pin numbers 61, 62 and 55 are not connected to any signal in the CX870-3K module.

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9 Application Guidelines

9.1 Power Supply sequencing and Reset Timing

There are strict power sequencing and reset timing requirements.

Power up the I/O voltage (3.3V) first and hold NRESET_MOD low.

•

The core voltage (1.2V) must never be higher than (I/O voltage +0.5 V).

•

The core voltage (1.2V) must be within the specified core voltage limits less than 300ms after the I/O voltage

•

(3.3V) reaches the specified I/O voltage limits.

• Throughout the power down process, the 3.3V supply must maintain a higher voltage than the 1.2V supply, until both have reached ground potential.

• To assure a proper IC reset, the power supplies must be present for a minimum time of 2ms before NRESET_MOD is de-asserted.

Please see the power and reset timing figure in Section 9.1.1 below.

About 1.9V, the arrival of 1.9V supply should lag behind the arrival of the 3.3V. The delay between the 1.9V and the

3.3V is not critical. Typical delay is approximately 10ms, for example using 10kohm resistor and 0.1uF capacitor on the enable pin of a 1.9V dc-to-dc converter.

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9.1.1 Power up, Reset and Power Down Timing

Voltage

Power Up Power Down

+3.3V

+1.2V

< 300ms

NRESET_MOD

>= 2ms

Time

9.2 RF Considerations

Note that overall system, RF and WiFi performance is significantly affected by the product design, environment and the application. It is the responsibility of the product designer to ensure proper system level shielding (if required) and to verify performance and fitness for the given product features and applications.

The WiFi performance will be affected by the RF environment surrounding th e CX module. Please ensure that the CX module is positioned in a “quiet” RF environment, as far away as possible from high frequency clock signals and any other sources of RF energy. Also, make sure the antenna is not shielded by any metal objects, for example loudspeakers or other metal parts. Please make sure that the power supplies, in particular the +1.9V supply, are quiet and free from noise.

SMSC recommends that systems implementing AirPlay should use a module configuration that includes on-module shielding, as well as paying particular attention to system configuration and shielding. In particular, SMSC is recommending the use of the Bottom Shield versions of the modules, which allows greater freedom in antenna positioning.

Also, please see the SMSC Application Note:

App Note Antenna Placement recommendation CX870 modules rev1.1.pdf

regarding antenna positioning guidelines.

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10 Revision Control

Revision Date / Author Details of Change Reason for Change

V2.5 (041112)

V2.4 (032312)

V2.4 (031712)

April 11, 2012

March 23, 2012 / SHs

March 17, 2012 / SHs

Added CX870-3B-D and CX870-3B-D60 option to Section 4 Ordering Guide

Added IC PIN entry for MIICRS in J3 Low Density Connector table in Section 8.2.2 Connector PIN Assignments.

Changed "MMIICRS" to "MIICRS" in Section

8.2.3 GPIO Assignments. Changed "MMIICRS" to "MIICRS" in J3 Low

Density Connector table in Section 8.2.2 Connector PIN Assignments.

Changed "MMIICRS" to "MIICRS" in GPIO table in Section 8.2.1 Pin Descriptions.

Added important note text to Tx Power row in Section 5.3 WiFi Specification.

Removed the ‘m’ from "+/-1dBm" in the Tx Power row in Section 5.3 WiFi Specification.

In Section 5.3 WiFi Specifications, updated Transmission Speed entry

In Section 4 Ordering Guide, changed all occurrences of DM870 to DM870A & DM860 to DM860A

In Section 2 Block Diagram, changed all occurrences of DM870 to DM870A & DM860 to DM860A

In Section 1 Introduction, changed all occurrences of DM870 to DM870A & DM860 to DM860A

In Section 8.2.1 Pin Descriptions, changed all occurrences of DM870 to DM870A

In the Notes for Section 8.2.1 Pin Descriptions, changed dat_DM870_16_datasheet.pdf to DM870A DS rev. 1.3_12-15-11.pdf

Changed all occurrences of DM870 to DM870A throughout the datasheet.

Updated J1, J2 & J3 tables in Section 8.2.2 Connector PIN Assignments, changing DM870 to DM870A.

Changed "WiFi (on-module PCB diversity)" column heading to "Internal PCB Diversity Antennas" in Section 4 Ordering Guide

Added ‘FCC’ to North America in Frequency Band entry in Section 5.3 WiFi Specification

Updated TX EVM entry in Section 5.3 WiFi Specifications

Updated Rx Sensitivity entry in Section 5.3 WiFi Specifications

Updated Tx Power entry in Section 5.3 WiFi Specifications

Added -3B-D and -3B-D60 option.

CX module uses DM870A.

Correction.

To indicate which modules the Tx Power specifications relate to.

Correction.

Add missing 2Mbps speed.

CX module uses DM870A.

Improve clarity of meaning.

Specify North American WiFi regulatory certification body.

Update values to better reflect actual performance.

Show test conditions.

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Revision Date / Author Details of Change Reason for Change

V2.4 (031212)

V2.4 (031012)

V2.3 (112011)

V2.2 (110811)

V2.1 (100711)

V2.0 (100211)

V2.0 (092611)

March 12, 2012 / SHs

March 10, 2012 / SHs

November 20, 2011 / SHs

November 8, 2011 / SHs

October 7, 2011 / SHs

October 2, 2011 / SHs

Sept. 26, 2011 / SHs

Added Section 3.6 Production Module with Bottom shield (Part Numbers with a "B" after the configuration letter)

Added Section 3.6.1 Including J3 Low Density 64-pin connector - Bottom View

Added Section 3.6.2 Including J2 High Density 120-pin connector - Bottom View

Updated Section 4 Ordering Guide & Section

4.1 Part Number Syntax drawing with bottom shield versions

Added another note to Section 8.2.3 GPIO Assignments

Updated TX Power row in Section 5.3 WiFi Specification (CX870 only)

Added Section 7.1.1 Top & Bottom View of CX870 Module with Bottom Shield

Added Section 7.2.1 Side View of CX870 Module with Bottom Shield

Added a note to Section 7.3 3D View of CX870 Module

Added additional text to Section 9.2 RF Considerations

Added CX870-3DS option to Section 4 Ordering Guide

Added CX870-3K option to Section 4 Ordering Guide.

Updated title of Section 6.1 from “1 RoHS” to “RoHS”.

In Section 10 Revision Control table, updated an entry for V2.0 b in the Reason for Change column from “RTV” to “RTC”

Removed “Preliminary Datasheet” from the footer.

Removed the word “Preliminary” from the title page.

Updated Section 5.3 WiFi Specification “TX Power” entry for 802.11g

Updated Section 6.0.1 Antenna Considerations with updated module numbering scheme

Updated Section 6.7 Module Quality with new Defect Rate

Updated Section 4.1 Part Number Syntax with removal of Antenna Configuration number and Note

Updated Section 10 Revision Control with new Reason for Change column

Change from BridgeCo logos and disclaimer text to SMSC logos and disclaimer text

Updated location of red boxes in Section 3.2.1 CX870 Bottom View with 64-pin Low density connector

Updated location of red boxes in Section 3.2.2 CX870 Bottom View with 120-pin Media connector

Show module versions with bottom shield.

Show bottom shield.

Bottom shield versions added to table and Syntax drawing.

Document missing GPIOs for CX870-3K.

Show improved tolerances for TX power.

Show drawings of module with Bottom Shield.

To indicate availability of digital copy of 3D view of module.

Providing further recommendations regarding the use of bottom shield versions and to indicate the availability of a pdf about antenna positioning guidelines.

To indicate soldered shield version.

Added -3K option.

Correcting typo.

CX module is in production, so the datasheet is no longer preliminary.

Correspond to actual production test limits.

Revert to original module numbering scheme.

Data is now available.

Revert to original part numbering scheme.

Corporate standard.

Improve alignment of red box to photo.

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Revision Date / Author Details of Change Reason for Change

V2.0 c Sept. 14,

2011 / SHs

V2.0 b Sept. 10,

2011 / SHs

Moved Section 5.3 WiFi Specification on to one page

Updated Customer Portal information in Section 6 Regulatory Compliance and Quality

Reverted Antenna Considerations back to Section 6.0.1; subsequently all subsections in Section 6 reverted back to original numbering

Updated Notes 11 & 12 in Section 8.2.1 Pin Descriptions with updated Customer Portal information

Updated Table of Contents Keep TOC aligned with actual content. Updated font styling of Table of Contents Easier to read. Update Section 2 Block Diagram : moved

RJ45+Transformer & USB Type A boxes inside the drawing boundary

Updated Section 5.3 WiFi Specification (CX870 only) TX Power Description entry

Updated Section 5.3 WiFi Specification (CX870 only) Rx Sensitivity Description entry

Updated Section 5.3 WiFi Specification (CX870 only) : add a Note underneath the table

Updated Section 4 Ordering Guide : changed CX870-3D row Two Ant entry from (X)* to X

Updated Section 4 Ordering Guide : removed the two blank rows

Updated the Description for pin NCS3 in Section

8.2.1 Pin Descriptions Updated Section 4 Ordering Guide : added gray

background to CX870-3F & CX870-3G Updated Section 4 Ordering Guide : removed

the 2 from A, H, I & J version Part Numbers

Updated Section 4 Ordering Guide : split Ext. Diversity Antennas column into two, added two sub-columns “One Ant.” & “Two Ant.”, moved Xs to correspond with correct sub-column

Updated Section 4 Ordering Guide : CX870-3D : removed X from WiFi column

Updated Section 4 Ordering Guide : updated + Note text

Updated Section 4 Ordering Guide : moved the + from Part Numbers column to Ext. Diversity Antennas column

Updated Section 4 Ordering Guide : removed # Note completely

Updated Section 4.1 Part Number Syntax : Updated graphic

Updated Section 4.1 Part Number Syntax : Updated Note text

Updated text in Section 8.1 WLAN UFL Antenna Connector

Removed RTC elements from Section 2 Block Diagram

Updated the Description for pin 3V3RTC in Section 8.2.1 Pin Descriptions

Improve readability.

Easier to access URL directly.

Decided to keep original part numbering scheme to avoid unnecessary paper work and the need to redo certifications.

Easier to access URL directly.

Improve accuracy of drawing.

Align data with test limits.

Clarification of the possible effect of changing the TX Power setting.

Change to match final CX870-3D configuration.

Improve readability.

Update to align with actual use.

Internal antenna versions are not available until performance issues are resolved.

Decided to keep original part numbering scheme to avoid unnecessary paper work and the need to redo certifications.

Show the number of external antenna connections.

CX870-3D is not configured for internal antenna.

Explained about one or two external antenna options.

Proper link for "+" Note.

Content now covered by "+" Note

Explain antenna configuration field

Explain about one or two antenna configuration.

Remove references to part numbering scheme which includes the number of antennas, and repeat advice to use two external antennas.

Support for RTC is removed.

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Revision Date / Author Details of Change Reason for Change

V2.0 a August 22,

2011 / SHs

V2.0 August 12,

2011 / SHs

V1.9 c August 2,

2011 / SHs

V1.9 b July 28, 2011

/ SHs

V1.9 a July 25, 2011

/ SHs

Added Section 3.5 Example Production Module Showing Soldered RF Shield

Updated Note Section 4.1 Part number syntax Highlighted that CX870-3D does not follow the

Updated all Section 3 Board Pictures to new versions + inserted new Sections 3.2.1 & 3.2.2 which show two different bottom views

• Updated Key Features on Title page: removed (optional) from “WiFi-certified

802.11b/g” entry

•

Updated Antenna Configuration entry in Section 4.1 Part number syntax

•

Updated Section 4.1 Part number syntax

Updated graphic

Added a Note

• Changed intro text in Section 3 Board Pictures

•

Updated Section 4 Ordering Guide

o Changed CX870-3B1 to CX870-

o Updated the text for + note o Added a note to CX870-3B Ext.

Diversity Antenna column

Added a new # note

• Added Section 6.0.1 Antenna Considerations

•

Inserted new photo for Section 3.1 Top View of CX870

•

Inserted new photo for Section 3.2 Bottom View of CX870

• Added new Section 3.3 Production Module with Top & RF shields

•

Added new Section 3.4 Production Module with 64-pin Connector Option

• Updated Section 4 Ordering Guide

o Added gray background to

CX870-3D

Changed CX870-3A to CX8703A2

o Changed CX870-3B to CX870-

3B1

o Changed CX870-3H to CX870-

3H2

Changed CX870-3I to CX8703I2

o Changed CX870-3J to CX870-

3J2

o Added a Note to the Part

Number title

• Updated Section 8.1 WLAN UFL Antenna Connector with new text

•

Updated Section 5.3 WiFi Specification TX EVM entry to

-9dB@6MHz

•

Updated Section 6 Regulatory Compliance & Quality with Module Versions Passed for Radio Regulations entries

Photo shows that RF shield is soldered, needed for Japan Telec certification.

new part numbering scheme. This Note was subsequently deleted, so this is not relevant any more.

Improve accuracy of data sheet photos.

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•

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Revision Date / Author Details of Change Reason for Change

• Replaced the Note in Section 6 to be main body text and updated the text.

•

Added new Section 4.1 Part number syntax

• Updated module weight to 20g

V1.8 a July 10, 2011

/ SHs

V1.8 July 5, 2011 /

SHs

V1.7 c May 13, 2011

/ SHs

V1.7 b May 11, 2011

/ SHs

V1.7 a May 6, 2011 /

SHs

V1.7 May 4, 2011 /

SHs

SMSC CX860/CX870 35 Revision 2.4 (03-23-12)

•

Update section 8.1 WLAN UFL Antenna Connector

• Deleted section 8.1.1 Coaxial antenna connector dimensions

• Updated the acceptable surface-mount receptacle parts in Section 8.1 WLAN UFL Antenna Connector

•

Added Appendix 1: Certification Notices

• Updated “Module Quality” Defect Rate field entry

• Updated “Board Dimensions & Weight” drawings

•

Updated the “Electrical Specifications” table

• Added another Note to the “Pin Descriptions” section

•

Updated Note 8 in “Pin Descriptions” table

• Re-imported “Board Dimensions & Weight” drawings

•

Updated “Board Pictures” images

• Updated board photo on Cover page

•

Updated the Feature list on Cover page

• Updated J1, J2 & J3 “Connector PIN Assignments” tables: removed Power column & re-organised columns

•

Changed “Application Notes” title to “Application Guidelines”

•

Updated Table of Contents font styling

• Re-imported Block Diagram as a wmf file

•

Updated “Power up, Reset & Power down Timing” figure

• Updated “Pin Descriptions” table

•

Re-organised text in “Power Supply sequencing & Reset Timing”

• Re-imported J2 & J3 Connector PIN Assignment tables

• Added note to Module Weight section

•

Updated the Ordering Guide – Part Numbers & added new J version

• Added new text to the Board Pictures section

•

Updated all Mechanical Drawings and added & removed Notes

• Updated the J3 Low Density Connector table

•

Updated the GPIO Assignment table

• Added new Power Supply & Timing figure

•

Updated the text in the “Power Supply sequencing and Reset Timing” section

• Updated the Key Connections table U

dated “Key Connections” section title to

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Revision Date / Author Details of Change Reason for Change

“Pin Descriptions”

• Updated “Detailed Connector PIN Descriptions” section title to “Connector PIN Assignments”

•

Updated J2 Media Connector table

V1.6 d March 3,

2011 / SHs

V1.6 c February 24,

2011 / SHs

V1.6 b February 23,

2011 / SHs

V1.6 February 11,

2011 / SHs

V1.5 b January 27,

2011 / SHs

V1.5 a January 24,

2011 / SHs

V1.5 January 22,

2011 / SHs

V1.4 b January 11,

2011 / SHs

V1.4 January 3,

2011 / SHs

V1.3 December 23,

2010 / SHs

•

• Deleted warning note in “Board

•

• Entirely updated the “Ordering Guide”

•

• Added Note to “Board Dimensions and

•

• Added new feature to Summary on Front

•

• Updated “GPIO Assignments” table

•

• Updated “Block Diagram”

•

• Updated the module photo on the Title

•

• Added Notes to Ordering Guide

•

Updated J3 Low Density Connector table Update GPIO Assignments section and

table Updated all mechanical drawings in

“Board Dimensions and Weights” section

Dimensions and Weights” section Updated “J3-Low density connector” pin

description table Updated “GPIO Assignments” table

Added a Note to the “Ordering Guide” Updated the subsection titles for the

“Board Pictures” section Updated the Block Diagram – changed

‘WiFi Antenna’ to ‘Ext. Antenna’

Weight” section Updated the “Ordering Guide” – removed

Mfg column and consolidated into one table

Updated the Header to reflect Preliminary nature of datasheet

Updated the datasheet to be a Preliminary Datasheet

Page Updated “J3 - Low Density Connector”

table

Added note to “Board Dimensions & Weight – Side Views of CX870 module” section

Updated text in “Application Notes – Power Supply Sequencing & Reset Timing” section

Updated text in “Connectors & Connections – WLAN UFL Antenna Connector” section

Updated the Application Notes, RF Considerations section

page Updated the Application Notes, RF

Considerations section Updated Ordering Guide

Updated Block Diagram Updated “J3 – Low Density Connector”

table

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Revision Date / Author Details of Change Reason for Change

• Updated “Electrical Specifications” table

•

Added Power Consumption data to “Electrical Specifications” table

• Updated the Board Dimensions and Weight images

•

Updated the “GPIO Assignments” table

•

Added another Application Note

• Added titles to Application Notes

V1.2 December 19,

2010 / SHs

V1.1 December 13,

2010 / SHs

V1.0 October 18,

2010 / SHs

•

• Updated the Block Diagram.

•

• Updated the “Absolute Maximum Ratings”

•

• Updated “J3 – Low Density Connector”

•

• Added Board Pictures

•

• Initial Version

Inserted CX860 and CX870 Module Weights

Updated module image on Front Page Added the Ordering Guide.

Updated the “Electrical Specifications” table

table Updated the Notes for “Regulatory

Compliance and Quality” section Updated “Key Connections” table Updated “J2 – Media Connector” table

table Updated “GPIO Assignments” table

Replaced Mechanical Drawings in “Board Dimensions and Weight” section

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11 Appendix 1: Certification Notices

Federal Communications Commission Interference Statement

This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. H o w ever, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.

• Consult the dealer or an experienced radio/ TV technician for help.

CAUTION:

Any changes or modifications not expressly approved by the grantee of this device could void the user's authority to operate the equipment.

Labeling requirements

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.

RF exposure warning

This equipment must be installed and operated in accordance with provided instructions and the antenna(s) used for this transmitter must be installed to provide a separation distance of at least 20 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. End-users and installers must be provide with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance.

Information for the OEMs and Integrators

The following statement must be included with all versions of this document supplied to an OEM or integrator, but should not be distributed to the end user.

This device is intended for OEM integrators only. Please see the full Grant of Equipment document for other restrictions. This device must be operated and used with a locally approved access point.

Information To Be Supplied to the End User by the OEM or Integrator

The following regulatory and safety notices must be published in documentation supplied to the end user of the product or system incorporating an adapter in compliance with local regulations.

Host system must be labeled with "Contains FCC ID:ZQO-CX870-3”X”“, FCC ID displayed on the label. The label text should be updated according to the table shown in Ordering Guide section of this document. The proper letter shown in Ordering Guide Part Number column should be substituted for “X”. For example, for the CX870-3B module, the label text should be “Contains FCC ID:ZQO-CX870-3B“.

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Canada, Industry Canada (IC) Notices

This Class B digital apparatus complies with Canadian ICES-003 and RSS-210. Operation is subject to the following two conditions: (1) this device may not cause interference, and (2) this device

must accept any interference, including interference that may cause undesired operation of the device.

Radio Frequency (RF) Exposure Information

The radiated output power of the Wireless Device is below the Industry Canada (IC) radio frequency exposure limits. The Wireless Device should be used in such a manner such that the potential for human contact during normal operation is minimized.

This device has also been evaluated and shown compliant with the IC RF Exposure limits under mobile exposure conditions. (antennas are greater than 20cm from a person's body).

This device has been certified for use in Canada. Status of the listing in the Industry Canada’s REL (Radio Equipment List) can be found at the following web address:

http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng

Additional Canadian information on RF exposure also can be found at the following web address:

http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html

Canada, avis d'Industry Canada (IC)

Cet appareil numérique de classe B est conforme aux normes canadiennes ICES-003 et RSS-210. Son fonctionnement est soumis aux deux conditions suivantes : (1) cet appareil ne doit pas causer d'interférence et

(2) cet appareil doit accepter toute interférence, notamment les interférences qui peuvent affecter son fonctionnement.

Informations concernant l'exposition aux fréquences radio (RF)

La puissance de sortie émise par l’appareil de sans fil Dell est inférieure à la limite d'exposition aux fréquences radio d'Industry Canada (IC). Utilisez l’appareil de sans fil Dell de façon à minimiser les contacts humains lors du fonctionnement normal.

Ce périphérique a également été évalué et démontré conforme aux limites d'exposition aux RF d'IC dans des conditions d'exposition à des appareils mobiles (les antennes se situent à moins de 20 cm du corps d'une personne).

Ce périphérique est homologué pour l'utilisation au Canada. Pour consulter l'entrée correspondant à l’appareil dans la liste d'équipement radio (REL - Radio Equipment List) d'Industry Canada rendez-vous sur:

http://www.ic.gc.ca/app/sitt/reltel/srch/nwRdSrch.do?lang=eng Pour des informations supplémentaires concernant l'exposition aux RF au Canada rendez-vous sur: http://www.ic.gc.ca/eic/site/smt-gst.nsf/eng/sf08792.html

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