Microchip Technology BM8NSPXSYC2A User Manual
Datasheet of Bluetooth
BM87SPPS5MC2 Module
ISSC Technologies Corp.
Revision History
Date Revision Content Version
2013/09/05 The first version 0.9
Content
1. Introduction ...................................................................................................................... 3
1.1. Major Components ................................................................................................................................. 3
1.2. Features ................................................................................................................................................. 3
1.3. Application ............................................................................................................................................. 3
2. Product Specification ...................................................................................................... 4
2.1. Chipset ................................................................................................................................................... 4
2.2. Interfaces ............................................................................................................................................... 4
3. Hardware Architecture ..................................................................................................... 5
4. Compatibility Requirements ............................................................................................ 5
5. Environmental Requirements ......................................................................................... 6
5.1. Temperature ........................................................................................................................................... 6
5.2. Humidity ................................................................................................................................................. 6
Appendix A: Dimension and Foot Print ................................................................................... 7
Appendix B: Product Image ...................................................................................................... 7
Appendix C: Reflow Profile ....................................................................................................... 8
Appendix D: Label Information ................................................................................................. 8
Appendix E: Packaging Information ........................................................................................ 8
CONFIDENTIAL
© 2000~2013 ISSC Technologies Corp.
2
1. Introduction
Part Name: ISSC BM87SPPS5MC2 Bluetooth module
Part Number: BM87SPPS5MC2-xxxxxx
The ISSC BM87SPPS5MC2 Bluetooth module is designed for both MFi (The Made for iPhone, iPad and iPod badge)
and Bluetooth SPP App-Enabled Accessories with audio solution. It is available in the 2.4GHz ISM band Class 2
Radio, compatible with Bluetooth Core Specification Version 3.0 + EDR and has passed the Bluetooth SIG and FCC
Part 15 certification
ISSC IS1687SM single chip solution combines transceiver and baseband function to decrease the external
components. It narrows down the module size, minimizes its cost and the optimized power design minimize power
consumption to keep low battery.
To provide the best audio and voice quality, IS1687SM also integrates a DSP co-processor, a PLL, and a stereo
CODEC to handle voice and audio applications. For voice, not only basic A-law/μ-law/CVSD encoding /decoding but
also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to reach the best quality
in the both sending and receiving sides. For enhanced audio applications, SBC or MP3 encoding/decoding functions
can be also carried out by DSP to satisfy A2DP requirements.
1.1. Major Components
- ISSC IS1687SM (7x7 mm2, 56 pin QFN, single-chip Bluetooth transceiver and baseband processor)
- 4M bits flash and 32K bits (24C32) EEPROM
1.2. Features
- Bluetooth 3.0 EDR compliant
- Profiles: HSP 1.0, HFP 1.5, A2DP 1.0, AVRCP 1.0, SPP 1.0
- Low power 1.8V RF operation
- RF transmitter output power Class 2
- RF receiver GFSK typical -90dBm, π/4 PSK typical -91dBm, 8DPSK typical -84dBm
- Internal ROM and 4Mibts of flash
- 36-MIPS DSP co-processor (32/24/16-bit fixed point core)
- I2C for external EEPROM and Apple CP (to accomplish certification and authorization flow in MFi App-Enabled
Accessories)
- 2 LED drivers
1.3. Application
- Stereo Headset
- Bluetooth Speakerphone
- Toys
- Gaming
- Health & Fitness
- Smart Watch/Feature Watch
- Wearable Accessories
- Conference/Education system
CONFIDENTIAL
© 2000~2013 ISSC Technologies Corp.
3
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