Microchip Technology BM78ABCDEFGH User Manual

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BM78SPPS5MC2,RN4678

Bluetooth® 4.0 Dual mode Module

Features:

•

Bluetooth Classic (BR/EDR) and Low
Energy (LE)

•

Complete , Fully Certified, Embedded 2.4
GHz Bluetooth® Version 4.0 IC

•

Bluetooth SIG Certified

•

Transparent UART mode for seamless
serial data over UART interface

•

Easy to configure with Windows GUI or
direct by MCU

•

Firmware can be field upgradable via UART

•

Compact surface mount module: 22 x 12 x

2.4 mm

•

Castellated surface mount pads for easy
and reliable host PCB mounting

•

Perfect for Portable Battery Operated
Devices

•

Internal Battery Regulator Circuitry

•

Worldwide regulatory certifications

•

1 LED and it has 16 steps Brightness.

Operational:

•

Single operating voltage: 3.2V to 4.3V

Data Throughput:

•

11k bps (BR/EDR)@ UART baud Rate is 115200
bps

•

8 Kbps (LE) UART baud Rate is 115200 bps

MAC/Baseband/Higher Layer:

•

Secure AES128 encryption

•

BTv3.0: GAP, SPP, SDP, RFCOMM and L2CAP

•

BTv4.0: GAP, GATT, ATT, SMP and L2CAP.

FIGURE 1: BM78 TOP VIEW

•

Temperature range: -20℃ to 70℃
Industrial

•

Simple, UART interface

•

Integrated crystal, internal voltage
regulator, and matching circuitry

•

Multiple I/O pins for control and status

RF/Analog:

•

Frequency: 2.402 to 2.480 GHz

•

Receive Sensitivity: -90 dBm (BR/EDR); -92
dBm (LE)

•

Power Output: +2 dBm (typ.)

2015 Microchip Technology Inc.

General Description:
The BM78 is a fully-certified Bluetooth®
Version 4.0 (BR/EDR/LE) IC for designers who
want to easily add dual mode Bluetooth®
wireless capability to their products.

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Delivering local connectivity for the
Internet of Things (IoT), the IC bridges your
product to Smart Phones and Tablets for
convenient data transfer, control and
access to cloud applications.
It supports GAP, SDP, SPP, and GATT
profiles. Data is transferred over the
Bluetooth link by sending/receiving data
via transparent UART mode, making it easy
to integrate with any processor or
Microcontroller with a UART interface.
Configuration is made easy using a
Windows® based GUI or directly via UART

by a MCU

Applications:

•

Mobile Point of Sales (mPOS)

•

LED lighting (16 step)

•

Wearables

•

Digital Sports

•

Fitness Devices

•

Health Care/ Medical

•

Automotive Accessories

•

Home Automation

•

Remote Control Toys

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BM78SPPS5M

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It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at [e-mail]. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The
last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

 Microchip’s Worldwide Web site; http://www.microchip.com
 Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.

Customer Notification System

Register on our web site at www.microchip.com to receive the most current information on all of our products.

TO OUR VALUED CUSTOMERS

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BM78SPPS5M

C2

, RN4678

Device

Antenna

Shield

Regulatory

Ce

rtifications

BM7

8

SPPS

5NC2 Integral

ceramic chip

Yes FCC,

IC, CE, KCC,

NCC,

Japan

BM7

8

SPP0

5NC2

External

No NO

1.0 DEVICE OVERVIEW

The BM78 is a complete, fully certified, embedded 2.4 GHz Bluetooth® version 4.0

(BR/EDR/LE) wireless IC. It incorporates an on-board Bluetooth stack, cryptographic accelerator,
power management subsystem, 2.4 GHz transceiver, and RF power amplifier (see Figure 1). With
the BM78, designers can embed Bluetooth functionality rapidly into virtually any device.

The BM78 provides cost and time-to-market savings as a self-contained Bluetooth solution.

The IC has been designed to provide integrators with a simple Bluetooth solution that features:

• Ease of integration and programming

• Vastly reduced development time

• Minimum system cost

• Interoperability with Bluetooth hosts

• Maximum value in a range of applications

The BM78 can independently maintain a low-power wireless connection. Low-power usage
and flexible power management maximize the IC’s lifetime in battery-operated devices. A wide
operating temperature range allows use in indoor and outdoor environments (industrial
temperature range).

The BM78 module comes in two varieties. The BM78SPPS3MC2 is a complete, fully
regulatory certified module with integral ceramic chip antenna and shield. The BM78SPP03MC2 is
a lower cost alternative with external antenna and no shield. The integrator is responsible for the
antenna, antenna matching, and regulatory certifications.

The BM78 is a small, compact, surface mount module with castellated pads for easy and
reliable host PCB mounting. The module is compatible with standard pick-and-place equipment.

TABLE 1‐1: BM78 MODULE FAMILY TYPES

FIGURE 1: Block Diagram

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BM78SPPS5M

C2

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BM78SPPS5M

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FIGURE 1‐2: BM78SPPS5NC2 PIN DIAGRAM

FIGURE 1‐3: BM78SPP05NC2 PIN DIAGRAM

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BM78SPPS5MC2 , RN4678

2 -- GND

Power

Ground reference

Connect to 10

uF (X5R/X7R)

capacitor.

Connect to 10

uF (X5R/X7R)

capacitor.

Ensure VDD_IO and MCU I/O voltages are compatible.

(internal pull-up)

Connect to 1

uF (X5R/X7R)

capacitor.

BM78

State indication , refer to P1

_5

B

luetooth link status indication

13 11 P1_2/SCL

DO

I2C SCL (Do Not Connect)

14 12 P1_3/SDA

DIO I2C SDA (Do Not Connect)

16 14 P0_5 DIO Configurable Control or Indication pin

18 16 P2_0 DI System configuration (internal pull-up)

20 18 EAN DI System configuration (internal pull-down)

22 20 RXD DI UART data input

23 21 TXD DO UART data output

(when configured as input: internal pull-up)

(when configured as input: internal pull-up)

TABLE 1‐1: PIN DESCRIPTION

S5

pin

03

pin

Symbol Type Description

1 -- GND Power Ground reference

3 1 GND Power Ground reference
4 2 BAT_IN Power Battery Input. Main positive supply input.

5 3 SW_BTN DI Software Button H: Power On / L: Power Off
6 4 LDO33_O Power Internal 3.3V LDO regulator output.

7 5 VDD_IO Power

I/O positive supply input.

8 6 LDO18_O Power Internal 1.8V LDO regulator output.

Connect to 10uF (X5R/X7R) capacitor.

9 7 WAKEUP DI Wakeup from shutdown mode (active low)

10 8 PMULDO_O Power Power management unit output.

11 9 P0_4 DO UART_TX_IND:

H: BM78 indicate UART data will be transmitted out

after certain timing.

(Setting by UI@ “MCU setting”, default wait 5ms)*1
L: Otherwise.
STATUS_IND_2:

12 10 P1_5 DO STATUS_IND:

15 13 P1_7/CTS DIO Configurable Control or Indication pin or

UART CTS (input)

17 15 P0_0/RTS DIO Configurable Control or Indication pin or

19 17 P2_4 DI System configuration (internal pull-up)

21 19 RST_N DI Module reset (active low) (internal pull-up)

24 22 P3_1 DIO Configurable Control or Indication pin

25 23 P3_2 DIO Configurable Control or Indication pin

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UART RTS (output)

Apply a pulse of at least 63 ns.

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BM78SPPS5MC2 , RN4678

(when configured as input: internal pull-up)

31 29 GND

Power

Ground reference

-- 30

BT_RF

AIO External antenna

connection (50 ohm)

33 -- GND

Power

Ground reference

26 24 P3_3 DIO Configurable Control or Indication pin

(when configured as input: internal pull-up)

27 25 P3_4 DIO Configurable Control or Indication pin

(when configured as input: internal pull-up)
28 26 P3_6 DIO (Do Not Connect)
29 27 P3_7 DIO Configurable Control or Indication pin

30 28 LED1 DO Status LED

32 -- GND Power Ground reference

Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output.

UI setting:

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BM78SPPS5MC2 , RN4678

1.1 Power Tree

Figures 2-1 : Power Tree

1.2 UART Interface

Figures 2-2 : Power and MCU interface examples.

Figure 2‐2 shows an example power scheme using a 3.3 volt to MCU VDD. Battery power is

applied to BAT_IN pin. From the LDO33_O pin, voltage can be routed the VDD_IO pin and external
circuitry including the MCU. This power scheme ensures that BM78 and MCU I/O voltages are
compatible.

CAUTION: The internal 3.3volt LDO current source: 50mA maximum!!

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BM78SPPS5MC2 , RN4678

2.0 Bluetooth behavior auto/manual pattern configuration

Power ON

Enabled

Auto Pattern Setting

Disabled

2.1 auto pattern

Configure Mode

Auto Pattern

Manual Pattern

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BM78SPPS5MC2 , RN4678

Standby mode

Pairing Procedure

Access State

Link state Connected mode

Shutdown state Shutdown mode

2.2 Manual pattern

Configure mode

Link back mode

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BM78SPPS5MC2 , RN4678

2.3 UI setting

NOTE: Please reference

“Application Note_IS1678S_Draft.docx” and “IS1678S Command Set v0

97 20140924.docx.”

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BM78SPPS5MC2 , RN4678

P0_0

■

P0_5

■

P1_7

■

P3_1

■

P3_2

■

P3_3

■

P3_4

■

P3_7

■

3.0 Control and Indication I/O Pins

I/O pins P0_0, P0_5, P1_7, P3_1, P3_2, P3_3, P3_4 and P3_7 are configurable control and

indication I/O. Control signals are input to the BM78. Indication signals are output from the BM78.
Table 4‐1 shows configurable I/O pin assignment to control and indication signals.
Note: that RTS can only be assigned to P0_0 and CTS is assigned to P1_7.

Configuring the BM78 can reference the “Application Note_IS1678S_Draft.docx” and

“IS1678S Command Set v0 97 20140924.docx.”

TABLE 3‐1: CONFIGURATION AND INDICATION I/O ASSIGNMENTS

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BM78SPPS5MC2 , RN4678

3.1 UI setting

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(

UART data be

tween

being and stop

transmitted)

4.0 Status Indication I/O Pins

I/O pins P1_5 and P0_4 are Status Indicator 1 and 2 signals respectively. Together they

provide status indication to the MCU as shown in Table 4‐1.

TABLE 4‐1: STATUS INDICATION

P1_5

/STATUS_IND_1

P0_4

/STATUS_IND_2

H H Power-on to setting default and Shutdown State.

HH status should be stable for at least 500ms

H L Access state

L H Link state

L L Link state (UART data stop transmitted)

4.1 System Configuration

I/O pins P2_0, P2_4, and EAN place the BM78 into operation modes as shown in Table 4‐2.

P2_0 , P2_4and EAN each have internal pull-ups.

TABLE 4‐2: SYSTEM CONFIGURATION SETTINGS

IC P2_0 P2_4 EAN Operational Mode

Indication

IS1678S Low High High Write EEPROM and test mode

High High High Normal operation / APP Mode

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BM78SPPS5MC2 , RN4678

5.0 Software Button (SW_BTN)

The Software Button (SW_BTN) input pin powers the BM78 on (high) or off (low) in to S4 mode.

Figures 5‐1 : SW_BTN Time (high) @APP mode

Note:
A. P0_4/P1_5 state: Refer to table5-1
B. Reset is floating.

Figures 5‐2 : SW_BTN Time (low) at access states.

Note:

A. SW_BTN pull low can’t active on Shutdown State.
B. Reset is floating.

Figures 5‐3 : SW_BTN Time (low) at link states.

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BM78SPPS5MC2 , RN4678

Note:

C. *1: this time by iPhone LE mode disconnect time.
D. SW_BTN pull low can’t active on Shutdown State.
E. Reset is floating.

6.0 WAKE UP

The Wake Up input pin wakes the BM78 from shutdown mode (active low).
Figures 6‐1 : WAKE_UP Time at Shutdown State.

7.0 EXTERNAL RESET

A watchdog timer capable of reset the chip. It has an integrated Power-On Reset (POR)
circuit that resets all circuits to a known power-on state. This action can also be driven by an
external reset signal that can be used to externally control the device, forcing it into a power-on
reset state. The RST signal input is active low and no connection is required in most applications.

Figures 7 ‐1 : Reset Time at Shutdown State.

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BM78SPPS5MC2 , RN4678

Note:

a. Auto pattern can use external reset.
b. Manual pattern can use external reset and reset command.

8.0 LED DRIVER

There are one dedicate LED drivers to control the LEDs. The LED can be connected directly
with BM78. The LED max current is 4 mA and it has 16 steps to trim Brightness.

LDO33_O

LED1

BM78

The status LED (LED1) indicates:



Standby



Link Back



Low Battery



Inquiry



Link



Page

Each indication is a configurable flashing sequence. LED brightness can also be configured.

9.0 MEMORY

A synchronous single port RAM interface is used. There are sufficient ROM and RAM to
fulfill the requirement of processor. A register bank, a dedicated single port memory and a flash
memory are connected to the processor bus. The processor coordinates all the link control
procedures and data movement using a set of pointers registers.

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BM78SPPS5MC2 , RN4678

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10.0 Throughput

The BM78 UART pins TXD and RXD connect to the UART pins of the host MCU. It is highly
recommended to use hardware flow control pins RTS and CTS. The BM78 hardware flow control is
disabled by default and must be configured to enable. The UART Baud is configurable. The
available signal rates are listed in Table 10‐1.

TABLE 10‐1: UART BAUD

Baud Crystal Frequency (MHz) Actual Baud Error Rate (%)

921600 16 941176 2.12

460800 16 457143 -0.79

307200 16 307692 0.16

230400 16 231884 0.64

115200 16 117647 2.1

57600 16 57145 -0.97

38400 16 38462 0.16

28800 16 28623 -0.62

19200 16 19231 0.16

14400 16 14480 0.55

9600 16 9615 0.16

4800 16 4808 0.16

2400 16 2399 -0.03

TABLE 10‐2: APP mode Throughput report

BR/EDR mode iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}

921600 bps echo Tx echo Rx Tx Rx

Burst Throughput(byte/s) 14384.46 9845.31 14521.5 14333.3

Normal

Throughput(byte/s)

8437.462 8375.28 6674.11 14399.4

BR/EDR mode iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}

115200 bps echo Tx echo Rx Tx Rx

Burst Throughput(byte/s) 11080.55 9284.37 11640.3 11134.8

Normal

Throughput(byte/s)

6248.758 6211.69 11513 11158.4

BR/EDR mode Android Samsung Note3/Android 4.3

921600 bps echo Tx echo Rx Tx Rx

Normal

Throughput(byte/s)

9727.704 9041.34 17030.1 10233.6

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BM78SPPS5MC2 , RN4678

(response)

(Reliable Burst Transmit)

(response)

(Reliable Burst Transmit)

BR/EDR mode Android Samsung Note3/Android 4.3

115200 bps echo Tx echo Rx Tx Rx

Normal

Throughput(byte/s)

11312.2 10548.5 9842.5 11436.4

LE mode iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}

115200 bps TX

RX

Rx

Normal

Throughput(byte/s)

LE mode iPad mini (Wi‐Fi disable){iOS 7.0.4 (11B554a)}

921600 bps TX

Normal

Throughput(byte/s)

7935.2 3337.3 7082.1

RX

Rx

8063.2 3384.5 6839.9

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BM78SPPS5MC2 , RN4678

11.0 Mounting Details

The BM78 SPPS5NC2 physical dimensions are shown in Figure 11-1, recommended host PCB footprint
in Figure 11-2, and mounting suggestion in Figure 11-3. There should not be top copper layer near the
test pin area shown in Figure 11-2. When laying out the host PCB, the areas under the antenna should
not contain any top, inner layer, or bottom copper as shown in Figure 11-3. A low-impedance ground
plane will ensure best radio performance (best range, lowest noise). Figure 11-3 shows a minimum
ground plane area to the left and right of the module for best antenna performance. The ground plane
can be extended beyond the minimum recommended as need for host PCB EMC noise reduction. For
best range performance, keep all external metal away from the ceramic chip antenna at least 31 mm.

The BM78SPP03MC2 physical dimensions are shown in Figure 11-4, recommended host PCB footprint in
Figure 11-5, and mounting suggestion in Figure 11-6. It is highly recommended to layout the host PCB as
suggested in Figure 11-6. A low-impedance ground plane will ensure best radio performance (best
range, lowest noise). Pin 30 (

BT_RF

) is a 50 ohm connection to an external antenna connector, PCB
trace antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This
trace can be extended to include passive parts for antenna attenuation padding, impedance matching,
or to provide test posts. It is recommended that the micro-strip trace be as short as possible for
minimum loss and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm
impedance. Figure 11-6 shows an example connection to U.FL connector.

Soldering Recommendations

The BM78 wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020.
The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recommendations are given:

•

Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)
provides solder reflow recommendations

•

Do not exceed peak temperature (TP) of 250 deg C

•

Refer to the solder paste data sheet for specific reflow profile recommendations

•

Use no-clean flux solder paste

•

Do not wash as moisture can be trapped under the shield

•

Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

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FIGURE 11‐1: BM78SPPS5NCS MODULE DIMENSIONS

FIGURE 11‐2: BM78SPPS5NC2 RECOMMEDED PCB FOOTPRINT

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FIGURE 11‐3: BM78SPPS5NCS HOST PCB MOUNTING SUGGESTION

Top and Bottom Copper

>4.7mm

Edge of
host PCB

layer keep out area

>6.4mm

Top Copper Layer

Bottom Copper Layer

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FIGURE 11‐4: BM78SPP05NCS MODULE DIMENSIONS

FIGURE 11‐5: BM78SPP05NC2 RECOMMEDED PCB FOOTPRINT

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FIGURE 11‐6: BM78SPP05NCS HOST PCB MOUNTING SUGGESTION

Top Copper Layer

Bottom Copper Layer

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12.0 ANTENNA PLACEMENT RULE

For Bluetooth product, antenna placement will affect whole system performance.
Antenna need free space to transmit RF signal, it can’t be surround by GND plane.

Here are some examples of good and poor placement on a Main Application board with GND plane.

FIGURE 12-1: KEEP OUT AREA SUGGESTION FOR ANTENNA

For more detail free space of antenna placement design, you can reference the design rule of
antenna produce vendor.

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Frequency

2450 MHz

Max Gain

1.63 dBi

Efficiency

71.55%

12-2

BM78SPPS5NC2 Ceramic Chip Antenna

The BM78SPPS5NC2 module contains an integral ceramic chip antenna. The antenna performance on
the module is shown in Figure 12-2.

FIGURE 12‐2: BM78SPPS5NC2 ANTENNA RADIATION PATTERN

Gain (dBi)

5.0

Y

-

a

x

i

s

s

i
x
a

­Z

0.0

-5.0

-10.0

-15.0

-20.0

-25.0

s

i

x

a

-

X

-30.0

-35.0

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13.0 Electrical Characteristics

Recommended Operating Conditions

Rating Min Typ Max

Storage temperature range -65ºC +25ºC +150ºC

Ambient Operating temperature range -20ºC +25ºC +70ºC

Relative Humidity (Operating) 10% 90%

Relative Humidity (Storage) 10% 90%

HBM ±2KV

ESD

MM 200V

HTOL

(*1)

1000 hrs

Supply voltage : BAT_IN 3.2V 4.3V

SW_BTN 1.7V 4.3V

LED1 3.6V

Reset

IOH

IOL

VIL input logic levels low

VIH input logic levels high

VOL output logic levels low

VOH output logic levels high

V

threshold voltage

TH,res

1.6V

12mA

12mA

-0.3V 0.8V

2.0V 3.6V

0.4V

2.4V

RF TX mode 43 mA

RF RX mode 37 mA

1) HTOL life test condition : +125ºC , BAT_IN=4.2V, LDO33_O= 3.3V, LDO18_O=1.9V

1.8V LDO

(*3)

80m

V drop

)

with

0.3

mV drop

)

(*1)(*2) Min Typ Max Unit

Operation Temperature -20 70

℃

Input Voltage (Vin)
Output Current (VIN=3.0v/load regulation with

2.0 3.6 V

100

Quiescent Current (Vin <3.0V) 13 uA

1) With 1uF capacitors at LDO18_O as the condition of IP verification.

2) Output voltage can calibration by MP tool

3.3V LDO

(*1)(*2) Min Typ Max Unit

Operation Temperature -20 70

Input Voltage (Vin) 3.2 4.3 V
Output Current (VIN=3.6v / load regulation with

100mV drop)

100

Quiescent Current(VIN=3.6v) 150 uA

1) With 10uF capacitor at LDO33_O as the condition of IP verification

2) Output voltage can calibration by MP tool

PMU LDO

(*1)(*2) Min Typ Max Unit

Operation Temperature -20 70

mA

℃

mA

℃

Input Voltage (Vin) 3.2 4.3 V
Output Current (VIN=3.6v / load regulation

100 uA

Quiescent Current(VIN=3.6v) 120 uA

1) With 1uF capacitor at PMULDO_O as the condition of IP verification.

2) Output voltage can calibration by MP tool

SAR‐ADC and Battery Voltage Detector

Min Typ Max Unit

Operation Temperature -20 70

AVDD_SAR power supply

1.8

SAR_BAT(BAT_IN) 1.1 4.5 V

Resolution 10 bit

℃

V

Operating Current (including bandgap) 1 mA

Shutdown Current 1 uA

1) SAR_BAT is shorted to BAT_IN internally for battery voltage detection.

Intensity controllable LED driver

Min Typ Max Unit

Operation Temperature -20 70

Open-drain Voltage 3.6 V

℃

Current Step 0.3

Programmable Current Range 0 5 mA

Intensity control 16 step

Power down open-drain current 1 uA

Shutdown Current 1 uA

mA

specification

specification

14.0 Radio Characteristics:

Transmitter Performance (25℃℃℃℃)

Min Typ Max

Bluetooth

Unit

BDR power

2

-6 ~ +4

dBm EDR power 0 -6 ~ +4

LE power 2 -20 ~ +10

NOTE:

1) The RF Transmit power calibrated during production using MP Tool software and MT8852

Bluetooth Test equipment.

2) Test condition: VCC_RF= 1.80V, temperature=25 ºC.

Receiver Performance (25℃℃℃℃)

Basic Data Rate Min Typ Max

Bluetooth

Unit

BDR Sensitivity -90

EDR 2M Sensitivity -90

≤-70 dBm

EDR 3M Sensitivity -82

LE Sensitivity -92

NOTE:

1) Test condition: VCC_RF= 1.80V, temperature=25 ºC.

15.0 System Current Consumption

Current

(avg.)

Standb

y mode

2.543

shut

down

mode

0.187

Connect

ed +

Sniff,

Master

(no data) 0.

541 No

data

was transmitted

Connect

ed +

Sniff,

Slave

(no data)

0.

551 No

data

was transmitted

Data,

Master

10.67

(Data

trans

mi

tted at 1152

00

bps;

Data,

Slave

14.87

(Data

trans

mi

tted at 1152

00

bps;

Current

(avg.)

Shutdown

mode

1.21

0.88

0.48

1.72

B

eacon 100 ms

0.62

B

eacon 500 ms

0.39

1.00

0.51

interval = 961 ms +

Beacon 500 ms

0.39

0.43

0.45

0.60

6.6

7.0

SUPPLY CONSUMPTION – CLASSIC

(1)

Parameter

Note 1: Classic BR/EDR, RX_IND Function Enabled

2. The DATA from IS1678S-151

Units : mA

SUPPLY CONSUMPTION –LOW ENERGY

Parameter

(1)

Units : mA

0.13

Sniff interval = 500ms

Sniff interval = 500ms

block size=500)

block size=500)

Notes

Notes

LE fast advertising

Reduced Power advertising

Connected (No data)

Connected (iPhone6IC)

LE fast advertising interval =100 ms

LE fast advertising interval = 160 ms

LE fast advertising interval = 500 ms

LE fast advertising interval = 100 ms +

LE fast advertising interval = 500 ms +

LE Reduced Power advertising
interval = 961 ms
LE Reduced Power advertising
interval = 961 ms+ Beacon 100 ms
LE Reduced Power advertising

Connection interval = 1500 ms

Connection interval = 600 ms

Connection interval = 500 ms

Connection interval = 200 ms

Connected (ICiPhone6)

Note 1. Only Low Energy, RX_IND Function Enabled

Connection interval = 500 ms

Connection interval = 200 ms

2. The DATA from IS1678S-151

16.0 REFERENCE CIRCUIT

BM78 Reference Circuit

BAT_IN

1

Test PIN

C1
10u/16V

LDO33_O

TP2 TP-2

TP6 TP-2

TP10TP-2

P2_0

P2_4

EAN

BAT_IN
SW_BTN
LDO33_0
VDD_I O

WAKEUP

P0_4
P1_5
P1_2
P1_3

FP1
FP-BM78SPPA

1

G

2

G

3

GND

4

BAT_IN

5

SW_BTN

6

LDO33_O

7

VDD_IO

8

LDO18_O

9

WAKEUP

10

PMULDO_O

11

P0_4

12

P1_5

13

P12 / SC L

14

P13 / SD A

TP3 TP-2

TP7 TP-2

TP11TP-2

P1_715P0_516P0_017P2_018P2_419EAN20RST_N

P1_7

P0_5

BAT_IN

UART_RXD

UART_TXD

P3_7
P3_4

1

33

G

32

G

GND

LED1

P3_7
P3_6
P3_4
P3_3
P3_2
P3_1

HCI_ TXD

HCI _RXD

31
30
29

P3_7

28

P3_6

27

P3_4

26

P3_3

25

P3_2

24

P3_1

23

UART_TXD

22

UART_RXD

12

LED1
LED-B

LDO33_O

1

MCU

21

RST_N

P0_0

P2_0

EAN

P2_4

TP4 TP-2

TP8 TP-2

TP12TP-2

PMULDO_O

LDO18_O

LDO33_O

TP5 TP-2

TP9 TP-2

TP13TP-2

SW_BTN

RST_N

P3_3

Functional GPIO

P3_2
P3_1
P0_5

1

Reset for I2C IC

P3_6

1

P0_4

Status_IND

P1_5

1

P0_0

UART CT S / RT S

P1_7

1

UART_RXD

UART T XD / RXD

UART_TXD

1

WAKEUP

WAKEUP

1

SW_BTN

SW_BTN

1

RST_N

RST_N

5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,

Hsinchu City 30078, Taiwan

Boar d Nam e

Size

Custom

Dat e : S h eet of

BM78S REFERANCE CIRCUIT

Title Rev

MAIN CIRCUIT

TEL. [phone]

2 4Friday , April 24, 2015

P/N

0222

1.0

Contains Transmitter Module FCC ID:

A8TBM78ABCDEFGH

1.0 REGULATORY APPROVAL

This section outlines the regulatory information for the BM78SSPS5MC2 module for the following
countries:

•

United States

•

Canada

•

Europe

•

Australia

•

Japan

•

Korea

•

Taiwan

•

China

1.2 United States

The BM78SSPS5MC2 module has received Federal Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part

15.212 Modular Transmitter approval. Modular approval allows the end user to integrate the BM78
module into a finished product without obtaining subsequent and separate FCC approvals for intentional
radiation, provided no changes or modifications are made to the module circuitry. Changes or
modifications could void the user’s authority to operate the equipment. The end user must comply with all
of the instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.

The finished product is required to comply with all applicable FCC equipment authorizations regulations,
requirements and equipment functions not associated with the transmitter module portion. For example,
compliance must be demonstrated to regulations for other transmitter components within the host
product; to requirements for unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such
as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements
for the non-transmitter functions on the transmitter module (i.e., Verification, or Declaration of
Conformity) (e.g., transmitter modules may also contain digital logic functions) as appropriate.

PENDING

1.2.1 LABELING AND USER INFORMATION REQUIREMENTS

The BM78 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when the
module is installed inside another device, then the outside of the finished product into which the module
is installed must also display a label referring to the enclosed module. This exterior label can use wording
as follows:

or

Contains FCC ID: A8TBM78ABCDEFGH

This device complies with Part 15 of the FCC Rules. Operation is subject to the
following two conditions: (1) this device may not cause harmful interference,
and (2) this device must accept any interference received, including
interference that may cause undesired operation

A user’s manual for the finished product should include the following statement:

This equipment has been tested and found to comply with the limits for a

Class B digital device, pursuant to part 15 of the FCC Rules. These limits are

designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio

frequency energy, and if not installed and used in accordance with the

instructions, may cause harmful interference to radio communications.

However, there is no guarantee that interference will not occur in a particular

installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off

and on, the user is encouraged to try to correct the interference by one or

more of the following measures:

•

Reorient or relocate the receiving antenna.

•

Increase the separation between the equipment and receiver.

•

Connect the equipment into an outlet on a circuit different from that

to which the receiver is connected.

•

Consult the dealer or an experienced radio/TV technician for help.

Additional information on labeling and user information requirements for Part 15 devices can be found in
KDB Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory
Division Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.

1.2.2 RF EXPOSURE

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF
Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities,
operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by
the Federal Communications Commission (FCC).

From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold to
OEM integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for
use with the specific antenna(s) tested in this application for Certification and must not be co-located or
operating in conjunction with any other antenna or transmitters within a host device, except in accordance
with FCC multi-transmitter product procedures.

1.2.3 HELPFUL WEB SITES

Federal Communications Commission (FCC): http://www.fcc.gov
FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):

http://apps.fcc.gov/oetcf/kdb/index.cfm

1.3 Canada

Contains transm

itter module IC: 12246A

-

BM7

8SPPS5M2

This device complies with Industry Canada license

-

exem

pt RSS standard(s).

The BM78SPPS5MC2 module has been certified for use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS-210 and RSS-Gen. Modular approval permits the installation of a module
in a host device without the need to recertify the device.

1.3.1 LABELING AND USER INFORMATION REQUIREMENTS

Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010): The
host device shall be properly labeled to identify the module within the host device.

The Industry Canada certification label of a module shall be clearly visible at all times when installed in the
host device, otherwise the host device must be labeled to display the Industry Canada certification
number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or
similar wording expressing the same meaning, as follows:

User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3, December

2010): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in
a conspicuous location in the user manual or alternatively on the device or both:

PENDING

Operation is subject to the following two conditions: (1) this device may not
cause interference, and (2) this device must accept any interference, including
interference that may cause undesired operation of the device.

Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux
appareils radio exempts de licence. L'exploitation est autorisée aux deux
conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2)
l'utilisateur de l'appareil doit accepter tout brouillage radioélectrique subi,
même si le brouillage est susceptible d'en compromettre le fonctionnement.

Certification

Standards

Article

Laboratory

Report Number

Date

Safety

EN

60950

-

1:2006+A11:2009+A1:2010

(3.1(a))

Health

EN 50371:2002

-03

Note:

To maintain conformance to the testing listed in

Table 3

‐

1:

European Compliance Testing

, the

1.3.2 RF EXPOSURE

All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio
Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands).

(Get direct quote from Certificate and place here)

1.3.3 HELPFUL WEB SITES

Industry Canada: http://www.ic.gc.ca/

1.4 Europe

The BM78SPPS5MC2 module is an R&TTE Directive assessed radio module that is CE marked and has been
manufactured and tested with the intention of being integrated into a final product.

The BM78 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are
summarized in Table 3‐1: European Compliance Testing. A Notified Body Opinion has also been issued. All
test reports are available on the BM78 product web page at http://www.microchip.com/bm78.

The R&TTE Compliance Association provides guidance on modular devices in document Technical
Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm.

module shall be installed in accordance with the installation instructions in this data sheet and shall
not be modified.

When integrating a radio module into a completed product the integrator becomes the manufacturer
of the final product and is therefore responsible for demonstrating compliance of the final product
with the essential requirements of the R&TTE Directive.

The label on the final product which contains the BM77 module must follow CE marking requirements. The
R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product CE
marking.

From R&TTE Compliance Association document Technical Guidance Note 01:

Provided the integrator installing an assessed radio module with an integral or specific antenna
and installed in conformance with the radio module manufacturer’s installation instructions
requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require
further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4]

The European Compliance Testing listed in Table 3‐1 was performed using the integral ceramic chip
antenna.

TABLE 3‐1: EUROPEAN COMPLIANCE TESTING

PENDING

1.4.1 LABELING AND USER INFORMATION REQUIREMENTS

1.4.2 ANTENNA REQUIREMENTS

EMC EN 301 489

-

1 V1.8.1 (2008

-

04) (3.1(b))

EN 301 489

-

17 V2.1.1 (2009

-

05)

Radio

EN 300 328 V1.7.1 (2006

-

10) (3.2)

Notified Body

Opinion

1.4.3 HELPFUL WEB SITES

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in
Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be
downloaded from the European Radio Communications Office (ERO) at: http://www.ero.dk/.

Additional helpful web sites are:

•

Radio and Telecommunications Terminal Equipment (R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

•

European Conference of Postal and Telecommunications Administrations (CEPT):

http://www.cept.org

•

European Telecommunications Standards Institute (ETSI):

http://www.etsi.org

•

European Radio Communications Office (ERO):

http://www.ero.dk

•

The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA):

http://www.rtteca.com/

1.5 Australia

The Australia radio regulations do not provide a modular approval policy similar to the United States (FCC)
and Canada (IC). However, BM77 module RF transmitter test reports can be used in part to demonstrate
compliance in accordance with ACMA Radio communications “Short Range Devices” Standard 2004 (The
Short Range Devices standard calls up the AS/NZS 4268:2008 industry standard). The BM77 module test
reports can be used as part of the product certification and compliance folder. For more information on
the RF transmitter test reports, contact Microchip Technology Australia sales office.

To meet overall Australian final product compliance, the developer must construct a compliance folder
containing all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of
Conformity) etc. It is the responsibility of the integrator to know what is required in the compliance folder
for ACMA compliance. All test reports are available on the BM78 product web page at

http://www.microchip.com. For more information on Australia compliance, refer to the Australian

Communications and Media Authority web site http://www.acma.gov.au/.

PENDING

1.5.1 HELPFUL WEB SITES

The Australian Communications and Media Authority: www.acma.gov.au/.

The BM78SPPS5MC2 module has received type certification and is labeled with its own technical
conformity mark and certification number as required to conform to the technical standards regulated by
the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.

Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed. Additional testing
may be required:

•

1.6 Japan

If the host product is subject to electrical appliance safety (for example, powered from an AC
mains), the host product may require Product Safety Electrical Appliance and Material (PSE)

PENDING

testing. The integrator should contact their conformance laboratory to determine if this testing is

(Number)

required.

• There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered

by VCCI: http://www.vcci.jp/vcci_e/index.html

1.6.1 LABELING AND USER INFORMATION REQUIREMENTS

The label on the final product which contains the BM78 module must follow Japan marking requirements.
The integrator of the module should refer to the labeling requirements for Japan available at the Ministry
of Internal Affairs and Communications (MIC) website.

The BM78module is labeled with its own technical conformity mark and certification number. The final
product in which this module is being used must have a label referring to the type certified module inside:

Contains transmitter module with certificate number:

202-XXXXXX

1.6.2 HELPFUL WEB SITES

Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm
Association of Radio Industries and Businesses (ARIB): http://www.arib.or.jp/english/

1.7 Korea

The BM78SPPS5MC2 module has received certification of conformity in accordance with the Radio Waves
Act. Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed.

1.7.1 LABELING AND USER INFORMATION REQUIREMENTS

The label on the final product which contains the BM77 module must follow KC marking requirements. The
integrator of the module should refer to the labeling requirements for Korea available on the Korea
Communications Commission (KCC) website.

The BM78 module is labeled with its own KC mark. The final product requires the KC mark and certificate
number of the module:

PENDING

1.7.2 HELPFUL WEB SITES

Korea Communications Commission (KCC): http://www.kcc.go.kr
National Radio Research Agency (RRA): http://rra.go.kr

1.8 Taiwan

The BM78SPPS5MC2 module has received compliance approval in accordance with the
Telecommunications Act. Customers seeking to use the compliance approval in their product should
contact Microchip Technology sales or distribution partners to obtain a Letter of Authority.

Integration of this module into a final product does not require additional radio certification provided
installation instructions are followed and no modifications of the module are allowed.

PENDING

1.8.1 LABELING AND USER INFORMATION REQUIREMENTS

The BM77 module is labeled with its own NCC mark and certificate number as below:

(Number)

The user’s manual should contain below warning (for RF device) in traditional Chinese:

注意 !
依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許可，
公司、商號或使用者均不得擅自變更頻率、加大功率或變更原設計
之特性及功能。
第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信；
經發現有干擾現象時，應立即停用，並改善至無干擾時方得繼續使用。
前項合法通信，指依電信規定作業之無線電信。
低功率射頻電機須忍受合法通信或工業、科學及醫療用電波輻射性
電機設備之干擾。

1.8.2 HELPFUL WEB SITES

National Communications Commission (NCC): http://www.ncc.gov.tw

1.9 Other Regulatory Jurisdictions

Should other regulatory jurisdiction certification be required by the customer, or the customer need to
recertify the module for other reasons, a certification utility is available. For further regulatory
Certification Utility and documentation, contact ISSC Technologies Corp.

FIGURE 20-1: Reflow Profile

Standard : IPC/JEDEC J-STD-020
Condition :

Preheat：150~200

℃、

60~120 seconds

Average ramp-up rate (217℃ to peak): 3℃/sec max.

Temperature maintained above 217℃ : 60~150 seconds

Time within 5℃ of peak temperature: 30 ~ 40 seconds.

Peak temperature：260 +5/-0 ℃

Ramp-down rate (peak to 217℃) : 6℃/sec. max.

Time 25℃ to peak temperature : 8 minutes max.
Cycle interval：5 minutes

Part Number

Description

BM7

8

SPPS

5NC2-000

--- Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module with integral

BM7

8

SPP0

5NC2-

000

--- Bluetooth® 4.0 Dual Mode, Class 2, Surface Mount module, external

Soldering Recommendations

Stereo module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-020. The
module can be soldered to the main PCB using standard leaded and lead-free solder reflow profiles. To
avoid damaging of the module, the recommendations are listed as follows:

•

Refer to Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)

for the

soldering reflow recommendations

•

Do not exceed peak temperature (TP) of 250 degree C

•

Refer to the solder paste data sheet for specific reflow profile recommendations

•

Use no-clean flux solder paste

•

Do not wash as moisture can be trapped under the shield

•

Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

ORDERING INFORMATION

TABLE 4‐1: ORDERING INFORMATION

antenna, with shield

antenna, no shield

A.3.3 HELPFUL WEB SITES

A document that can be used as a starting point in understanding the use of Short Range
Devices (SRD)

in Europe is the European Radio Communications Committee (ERC)

Recommendation 70‐03 E, which can be downloaded from the European Radio
Communications Office (ERO) at: http://www.ero.dk/.

Additional helpful web sites are:

• Radio and Telecommunications Terminal Equipment (R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

• European Conference of Postal and Telecommunications Administrations (CEPT):

http://www.cept.org

• European Telecommunications Standards Institute (ETSI):

http://www.etsi.org

• European Radio Communications Office (ERO):

http://www.ero.dk

• The Radio and Telecommunications Terminal Equipment Compliance Association
(R&TTE CA):

http://www.rtteca.com/

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

http://www.microchip.com/
support

Web Address:

www.microchip.com

Atlanta
Duluth, GA
Tel: [phone]
Fax: [phone]

Austin, TX
Tel: [phone]

Boston

Westborough, MA
Tel: [phone]
Fax: [phone]

Chicago
Itasca, IL
Tel: [phone]
Fax: [phone]

Cleveland

Independence, OH
Tel: [phone]
Fax: [phone]

Dallas
Addison, TX
Tel: [phone]
Fax: [phone]

Detroit
Novi, MI
Tel: [phone]

Houston, TX
Tel: [phone]

Indianapolis

Noblesville, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

New York, NY
Tel: [phone]

San Jose, CA
Tel: [phone]

Canada - Toronto
Tel: [phone]
Fax: [phone]

Worldwide Sales and Service

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: [phone]
Fax: [phone]

Australia - Sydney
Tel: [phone]
Fax: [phone]

China - Beijing
Tel: [phone]
Fax: [phone]

China - Chengdu
Tel: [phone]
Fax: [phone]

China - Chongqing
Tel: [phone]
Fax: [phone]

China - Hangzhou
Tel: [phone]
Fax: [phone]

China - Hong Kong SAR
Tel: [phone]
Fax: [phone]

China - Nanjing
Tel: [phone]
Fax: [phone]

China - Qingdao
Tel: [phone]
Fax: [phone]

China - Shanghai
Tel: [phone]
Fax: [phone]

China - Shenyang
Tel: [phone]
Fax: [phone]

China - Shenzhen
Tel: [phone]
Fax: [phone]

China - Wuhan
Tel: [phone]
Fax: [phone]

China - Xian
Tel: [phone]
Fax: [phone]

China - Xiamen
Tel: [phone]
Fax: [phone]

China - Zhuhai
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi
Tel: [phone]
Fax: [phone]

India - Pune
Tel: [phone]

Japan - Osaka
Tel: [phone]
Fax: [phone]

Japan - Tokyo
Tel: [phone]
Fax: [phone]

Korea - Daegu
Tel: [phone]
Fax: [phone]

Korea - Seoul
Tel: [phone]
Fax: [phone] or
82-2-558-5934

Malaysia - Kuala Lumpur
Tel: [phone]
Fax: [phone]

Malaysia - Penang
Tel: [phone]
Fax: [phone]

Philippines - Manila
Tel: [phone]
Fax: [phone]

Singapore
Tel: [phone]
Fax: [phone]

Taiwan - Hsin Chu
Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung
Tel: [phone]

Taiwan - Taipei
Tel: [phone]
Fax: [phone]

Thailand - Bangkok
Tel: [phone]
Fax: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]
Denmark - Copenhagen
Tel: [phone]
Fax: [phone]

France - Paris
Tel: [phone]
Fax: [phone]

Germany - Dusseldorf
Tel: [phone]

Germany - Munich
Tel: [phone]
Fax: [phone]

Germany - Pforzheim
Tel: [phone]

Italy - Milan
Tel: [phone]
Fax: [phone]

Italy - Venice
Tel: [phone]

Netherlands - Drunen
Tel: [phone]
Fax: [phone]

Poland - Warsaw
Tel: [phone]

Spain - Madrid
Tel: [phone]
Fax: [phone]

Sweden - Stockholm
Tel: [phone]

UK - Wokingham
Tel: [phone]
Fax: [phone]