Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and t he lik e is provided only f or yo ur convenience
and may be su perseded by upda t es . I t is your responsibil it y to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life supp ort and/or safety ap plications is entir ely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless M icrochip from any and all dama ges, claims,
suits, or expenses re sulting from such use. No licens es are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEEL
®
OQ
code hopping
QUALITY MANAGEMENT S
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTA RT , PIC32 logo,
RightT ouch, S pyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
DS70005235C-Page 6 2015-2016 Microchip Technology Inc.
BM70 PICTAILTM/PICTAIL PLUS
EVB USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our web site
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the p age number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the M PLAB
Select the Help menu, and then Topics to open a list of available online help files.
®
X IDE online help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
BM70 PICtail
include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Web Site
• Development Systems Customer Change Notification Service
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document describes how to use the BM70 PICtail™/PICtail Plus EVB (also
referred as “BM70 EVB”), as a development tool to e mulate and debug firmware on a
target board. This user’s guide is composed of the following chapters:
• Chapter 1. “Introduction” provides an overview of the BM70 EVB and its features.
• Chapter 2. “Har d ware” provides hardware details of the BM70 EVB.
• Chapter 3. “G etti ng Started” provides information about various steps involved
to update the User Interface (UI) parameters and to set up a connection between
the BM70 EVB and a smartphone using the Bluetooth Low Energy (BLE) link.
• Chapter 4. “Flash Programming Procedure” describes various steps involved
in downloading the Flash code on the BM70 EVB.
• Chapter 5. “USB-to-UART Converter and Host DUT” describes the use of the
USB- to-UART converter circuit, available on the host Device Under Test (DUT).
• Appendix A. “Schematics” provides the BM70 EVB reference schematics.
™
/PICtail Plus Evaluation Board (EVB). Items discussed in this chapter
Choice of mutually exclusive
arguments; an OR selection
Represents code supplied by
user
A Note presents information
that we want to re-emphasize,
either to help you avoid a
common pitfa ll or to m ake you
aware of operating di fferences
between some device family
members. A Note can be in a
box, or when used in a table
or figure, it is located at the
bottom of the table or figure.
“Save project before build”
valid filename
[options]
errorlevel {0|1}
void main (void)
{ ...
}
DS70005235C-Page 8 2015-2016 Microchip Technology Inc.
RECOMMENDED READING
This user’s guide describes how to use the BM70 EVB. The following Microchip
document is available and recommended as supplemental reference resources.
BM70/BM71 Data Sheet (DS60001372)
Refer to this document for detailed information on the BM70 module. The reference
information found in this data sheet includes:
• Features and pin configurations
• Electrical s pecifications
• Reference circuits
THE MICROCHIP WEB SITE
Microchip provides online support via our web site at: http://www.microchip.com. This
web site makes files and information easily available to customers. Accessible by most
Internet browsers, the web site contains the following information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listings
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listings of seminars and events; and listings of Microchip sales
offices, distributors and factory representatives
Preface
2015-2016 Microchip Technology Inc.DS70005235C-P age 9
BM70 PICtailTM/PICtail Plus EVB User’s Guide
DEVELOPMENT SYSTEMS CUSTOMER CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive email notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip web site at www.microchip.com, click on Customer
Change Notification and follow the registration instructions.
The Development Systems product group categories are:
• Compilers – The latest info rmat ion on Mi croc hip C com pile rs an d ot her l ang uage
tools
• Emulators – The latest information on the Microchip in-circuit emulator, MPLAB
REAL ICE™
• In-Circuit Debuggers – The latest information on the Microchip in-circuit
debugger, MPLAB ICD 3
• MPLAB X IDE – The latest information on Microchip MPLAB X IDE, the
Windows
• Programmers – The latest information on Microchip programmers including the
PICkit™ 3 development programmer
®
Integrated Development Environment for development systems tools
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engi neer (FAE)
• Technical Support
Customers should contact their distributor, representative or Field Application Engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.
Technical support is available through the web site at: http://support.microchip.com.
DS70005235C-Page 10 2015-2016 Microchip Technology Inc.
DOCUMENT REVISION HISTORY
Revision A (October 2015)
This is the initial released version of this document.
Revision B (October 2015)
This revision includes the following updates:
• Added Figure 2-1, Table 2-1 through Table 2-10
• Updated Figure A-1
Minor updates to text and formatting were incorporated throughout the document.
DS70005235C-Page 12 2015-2016 Microchip Technology Inc.
Thank you for purchasing a Microchip T echnology BM70 PICtail™/PICtail Plus Evaluation Board (EVB). This document provides detailed information about the BM70 EVB.
The BM70 EVB is designed to evaluate and demonstrate the capabilities of the
Microchip BM70 BLE module.
This chapter includes the following topics:
1.1 “Kit Contents”
1.2 “BM70 EVB Features”
The BM70 EVB can be evaluated using various tools which are listed on the pr oduct
page of the Microchip worldwide web site: http:// www.microchip.com/bm-70-pictail.
1.1KIT CONTENTS
The BM70 EVB kit contains these items:
• One BM70 EVB, which contains the BM70BLES1FC2 module
• One micro-USB cable
BM70 PICTAILTM/PICTAIL PLUS
EVB USER’S GUIDE
Chapter 1. Introduction
Note:If you are missing any part of the kit, contact a Microchip sales office for
assistance. A list of Microchip offices for sales and service is provided on
the back page of this document.
1.2BM70 EVB FEATURES
The following are key features of the BM70 EVB:
• Option to switch power source between the Coin Cell battery, USB, and PICtail
interface
• The UART interface to connect to an external MCU
• Connection and test interface between the BM70 module and Host Emulator tool
on the PC (with UART commands)
• Ability to update the firmware using the micro-USB port
Representation of the layout of the BM70 EVB are illustrated in Figure 1-1 and Figure 1-2.
The top view of the board includ es the following key features as indicated in Figure 1-1.
1. The B M7 0B LES 1FC2 modul e
2. Power switch button (SW6)
3. SPI interface (J4)
4. USB GPIO interface (JP10)
5. USB-to-UART interface (J3)
6. LED
7. Power source connector (J1)
8. Reset bu tto n (S W5)
9. Test buttons (Push-low)
10. V
BAT
header pins (J10)
11. Test button header (J7)
2
12. I
C interface (JP12, JP13)
13. DIP switch (SW7)
14. LEDs and corresponding header pins (JP5)
15. GND header pins (J2)
16. PICtail interface (J8)
FIGURE 1-1:BM70 EVB (TOP VIEW)
DS70005235C-Page 14 2015-2016 Microchip Technology Inc.
Introduction
Figure 1-2 illustrates the bottom view of the BM70 EVB with the following key
components:
1. USB-to-UART converter. The switch SW8 is the USB Reset button
2. Module pads
3. Coin Cell battery holder
For additional information on these features, refer to Chapter 2. “Hardware”.