Microchip Technology BM70ABCDEFGH User Manual

BM70/BM71

Bluetooth® 4.2 BLE Module

Features

• Bluetooth

• 1.9V~3.6V operating range

• UART/ I2C/ SPI interface supported

• PWM supported(3-ch for BM70, 1-ch for BM71)

• Temperature range (-20℃~70℃)

• Main Crystal : 32MHz

• Temperature sensor supported

• 12 bits ADC supported for 6CH(BM70)

/4CH(BM71) input ports and battery voltage
detection

• Wake up by any GPIO

• Peak current: TX 13mA/RX 13mA with Buck,@

VBAT=3.0V

• RSSI Monitor

RF/Analog Features

• ISM Band 2.402 to 2.480 GHz operation

• Channels 0-39

• Rx Sensitivity: -90 dBm@ BLE, in typical

• Tx Power: +2 dBm, support class 2 power output

• RSSI monitor

Antenna

• Ceramic Chip Antenna

(BM70BLES1FC2/BM71BLES1FC2)

• External Antenna Connection via RF pad

(BM70BLE01FC2/BM71BLES1FC2)

®

Smart 4.2 BLE compliant

FIGURE 1: (BM71 NA)

Description

The BM70/BM71 BLE module is designed for App­enabled accessories and IoT (Internet of Things)
through Bluetooth® connectivity.

It is available in the 2.4GHz ISM band radio,
compatible with Bluetooth Core Specification Version

4.2 to enhance the throughputs and security for IoT
applications.

For improving user experiences for IoT applications,
the patent and trademark for Beacon Things
Technology is applied to let users can control
automatically and receive data to cloud without open
App through iPhone.

The module build-in Bluetooth® stacks to be
embedded Bluetooth® LE solution, so developer can
save time to finish their design without taking efforts to
care Bluetooth® issue. In addition, it narrows down the
module size and minimizes its cost. For portable and
wearable applications, the product optimized power
design to minimize current consumption to extend
battery life.

Applications

• IoT/ IoE

• Payment/ Security

• Wearable devices

• Smart Home

• Smart Health

• Apple iBeacon

• Digital Sports

• Proximity/ Find Me

BM70/BM71

Table of Contents

1.0 PRODUCT OVERVIEW .............................................................................................................. 5

1.1 Interface Description ............................................................................................................. 6

1.2 Configuring the BM70/BM71 ............................................................................................ 9

1.3 UART Interface .................................................................................................................. 9

1.4 Control and Indication I/O Pins ........................................................................................ 9

1.5 RESET (RST_N) .............................................................................................................. 10

1.6 System Configuration ...................................................................................................... 10

1.7 Power ................................................................................................................................ 11

1.8 Mounting Details .............................................................................................................. 12

1.9 Soldering Recommendations ........................................................................................ 13

2.0 APPLICATION INFORMATION ............................................................................................. 21

2.1 External Configuration and Programming ................................................................... 21

2.2 Reference Circuit ............................................................................................................. 21

2.2.1 Power Drop Protection ........................................................................................ 24

2.3 BM70BLES1FC2/BM71BLES1FC2 Ceramic Chip Antenna ..................................... 24

2.4 UART ready after Reset & Power On Timing .............................................................. 26

2.5 Power On Reset Timing ................................................................................................. 26

2.6 Power Consumption ........................................................................................................ 27

3.0 REGULATORY APPROVAL ................................................................................................... 29

3.1 United States .............................................................................................................. 29

3.1.1 LABELING AND USER INFORMATION REQUIREMENTS ............................ 29

3.2 Canada .............................................................................................................................. 31

3.2.1 LABELING AND USER INFORMATION REQUIREMENTS ................................. 31

3.2.2 RF EXPOSURE ....................................................................................................... 32

3.2.3 HELPFUL WEB SITES........................................................................................... 32

3.3 Europe ............................................................................................................................... 33

2015 Microchip Technology Inc. Advance Information page 2

BM70/BM71

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
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If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
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Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The
last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

•

Microchip’s Worldwide Web site; http://www.microchip.com

•

Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.

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Register on our web site at www.microchip.com to receive the most current information on all of our products.

Abbreviations List:

BLE: Bluetooth Low Energy
IOT: Internet of Things

2015 Microchip Technology Inc. Advance Information page 3

TO OUR VALUED CUSTOMERS

Part Number

Antenna on Board

Shielding

Pin #

Dimension

BM70BLE01FC2

No (External)

No

28

12mm x 15mm

BM70BLES1FC2

Yes

Yes

33

12mm x 22mm

BM71BLE01FC2

No (External)

No

17

6mm x 8mm

BM71BLES1FC2

Yes

Yes

16

9mm x 11.5mm

BM70/BM71

1.0 PRODUCT OVERVIEW

BM70 and BM71 are embedded 2.4 GHz Bluetooth® Version 4.2 (BLE) modules. The chip inside incorporates
Bluetooth stack, power management subsystem, 2.4 GHz transceiver, and RF power amplifier. With the module
developers can

The BM70 and BM71 provide cost and time to market savings as a self‐contained module solution. The
modules have been designed to provide developers with a simple Bluetooth® solution as below:

• Ease of integration and programming

• Vastly reduced development time

• Minimum system cost and highest quality for wireless module

• Interoperability with Apple iOS and Google Android OS

• Maximum value in a range of applications

In addition, BM70 and BM71 also provide the BeaconThings® Technology to improve user
experiences for IoT applications:

• Auto Connection/Control

• Data to Cloud Easily

The BM70 and BM71 can independently maintain a low power wireless connection. Low power usage and flexible
power management maximize the module’s lifetime in battery operated devices. A wide operating temperature
range allows use in indoor and outdoor environments.

BM71 is the small form factor for wearable, compact, surface mount module with castellated pads for easy and
reliable host PCB mounting.

TABLE 1‐1: BM70/BM71 MODULE FAMILY TYPES

add

Bluetooth® functionality rapidly for any IoT devices.

2015 Microchip Technology Inc. Advance Information page 4

BM70/BM71

1.1 Interface Description

The block diagram of BM70/BM71 is shown in Figure 1-1.
descriptions are shown in Table 1-1. Test pads on button side of each module, which are used for production
test, are listed in Table 1-2.

FIGURE 1-1: BM70/BM71 BLOCK DIAGRAM

Advance Information 2015 Microchip Technology Inc. page 5

Pin diagram is shown in Figure 1-2 and the

pin

BM70BLES1FC2

BM70BLE01FC2

BM71BLE01FC2

BM71BLES1FC2

BM70/BM71

FIGURE 1-2: BM70/BM71 PIN DIAGRAM

Advance Information 2015 Microchip Technology Inc. page 6

BM70BLE01FC2

BM70BLES1FC2

BM71BLE01FC2

BM71BLES1FC2

Symbol

Type

Description

-- ‐

1

--

--

GND

Power

Ground reference

-- ‐

2

--

--

GND

Power

Ground reference

1

3

12

13

GND

Power

Ground reference

2 4 11

14

VBAT

Power

Battery input. Main positive supply input.
Voltage Range: 1.9V~3.6V

10

--

BK_IN

Power

Buck input. Main positive supply input. Connect to
10uF low ESR ceramic capacitor. Voltage Range:

1.9V~3.6V

3 5 --

--

P2_2

DIO

GPIO, default pull-high input
PWM1

4 6 --

--

VDD_IO

Power

I/O positive supply. Ensure VDD_IO and MCU I/O
voltage are compatible

5 7 --

--

VDD_IO

Power

I/O positive supply. Ensure VDD_IO and MCU I/O
voltage are compatible

6 8 --

--

ULPC_O

Power

1.2V Programmable ULPC LDO Output for AON­logic and Retention Memory Supply

7 9 --

--

P2_3

DI

GPIO, default pull-high input
PWM2

8

10

--

--

BK_O

Power

1.55V buck output
13

6

P1_6

DIO
AO

P1_6
External 32.768KHz Crystal Input: XI32K

14

5

P1_7

DIO
AI

P1_7
External 32.768KHz Crystal Output: XO32K

9

11

15

15

P2_7

DIO
AI
DO
DO

GPIO, default pull-high input
AD14
NCS2 : : 2nd SPI-Bus (Master mode)
TX_IND

10

12

--

--

P1_1

DIO
AI

GPIO, default pull-high input
AD9

11

13

2 3 P1_2

DIO
AI
I/O

GPIO, default pull-high input
AD10
I2C SCL.

12

14

3

4

P1_3

DIO
AI
DIO

GPIO, default pull-high input
AD11
I2C SDA

13

15 8 11

P0_0

DIO
AI
DI

GPIO, default pull-high input
AD0
UART flow-control CTS

14

16

--

--

P1_0

DIO
AI

GPIO, default pull-high input
AD8

15

17

6 9 P3_6

DIO
DO
DO

GPIO, default pull-high input
PWM0
UART flow-control RTS

16

18

16

16

P2_0

DIO

System configuration, default pull-high
input
H  Application
L  test mode.

TABLE 1-1: PIN DESCRIPTION

BM70/BM71

2015 Microchip Technology Inc. Advance Information page 7

17

19

--

--

P2_4

DIO

GPIO, default pull-high input

18

20

--

--

NC

No Connection

19

21

7

10

RST_N

DI

Module Reset(active low) (internal pull-

20

22

5

7

HCI_RXD

DI

HCI UART Data Input

21

23

4

8

HCI_TXD

DO

HCI UART Data Output

22

24

--

--

P3_1

DIO

GPIO, default pull-high input

23

25

--

--

P3_2

DIO
DO

GPIO, default pull-high input
SPI-Bus: MISO

24

26

--

--

P3_3

DIO
DI

GPIO, default pull-high input
SPI-Bus: MOSI

25

27

--

--

P3_4

DIO
DO

GPIO, default pull-high input
SPI-Bus: SCLK

26

28

--

--

P3_5

DIO
AI

GPIO, default pull-high input
LED1

27

29

--

--

P0_7

DIO

GPIO, default pull-high input

28

30 9 12

P0_2/LED

DIO
AI

P02
AD2

29

31

17 2 GND

Power

Ground reference

--

32

--

--

GND

Power

Ground reference

30

--

1

1

BT_RF

AIO

External Antenna Connection (50 Ω)

--

33

--

--

GND

Power

Ground reference

BM70BLE01FC2

BM70BLES1FC2

BM71BLE01FC2

BM71BLES1FC2

Symbol

Type Description

TP-1

TP-1

TP-3

TP-3

VCC_PA

Power

1.55V RF PA LDO

TP-2

TP-2

TP-1

TP-5

CLDO_O

Power

1.2V CLDO Output

TP-3

TP-3

TP-2

TP-2

VCC_RF

Power

1.2V RF LDO Output

--

--

TP-4

TP-4

ULPC_O

Power

1.2V ULPC LDO Output

--

--

TP-5

TP-1

BK_O

Power

1.55V Buck Output

BM70/B71

Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output.
Table 1-2 Test Points on Button Side

1.2 Configuring the BM70/BM71

Configuring the BM70/BM71 features and service table can be performed by using the “Windows UI Configuration tool”.
The detail information will be disclosed in the Application Note.

1.3 UART Interface

Figures 1-4 and 1-5 show Power and MCU interface examples
The BM70 UART pins TXD and RXD connect to the UART pins of the host MCU. It is highly recommended to use

hardware flow control pins RTS and CTS. The BM70 hardware flow control is disabled by default and must be
configured to enable. The UART Baud rate is configurable.

1.4 Control and Indication I/O Pins

I/O pins on BM70 are configurable control and indication I/O. Control signals are input to the BM70. Indication
signals are output from the BM70. Table 1‐3 shows configurable I/O pin assignment to control and indication
signals example of BM70 BLEDK3 application. Note that for different BM70 application, the I/O assignment is
different. The detail information will be disclosed in the related application note and configurable in the dedicated
“UI Configuration Tool”.

2015 Microchip Technology Inc. Advance Information Page 8

N/C LOW_BATTERY_IND RSSI_IND LINK_DROP

UART_RX_IND

PAIRING_KEY RF_ACTIVE_IND BLEDK_STATUS1_IND

(*Note) BLEDK_STATUS2_IND

(*Note)

P10

Default

P31

Default

P32

Default

P33

Default

P34

Default

P07

Default

P11

Default P22

Default

P24

Default

P35

Default

P36

UART_RTS

P00

UART_CTS

P27

TX_IND

P12

I2C/SCL

P13

I2C/SDA

P02

LED0

P31

SPI BUS/ NCS

P32

SPI BUS/ MISO

P33

SPI BUS/ MOSI

P34

SPI BUS/ SCLK

P20

Operational Mode

High

Application Mode

Low

Test Mode (Write UI/Flash: Firmware Programming)

BM70/BM71

TABLE 1‐3: CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM70 BLEDK3
APPLICATION

*Note: Detail BLEDK status indication please see BLEDK3 release note.

For the BM70 BLEDK3 example, some I/O functions are fixed to dedicated function as listed in Table 1-4.

TABLE 1-4: FIX I/O ASSIGNMENTS FOR BM70 BLEDK3 APPLICATION

1.5 RESET (RST_N)

The Reset (RST_N) input pin resets the BM70/BM71 (active low pulse for at least 63 ns).

1.6 System Configuration

I/O pins P20 place the BM70 into operation modes as shown in Table1-5. P20 have internal pull-up.

TABLE 1‐5: SYSTEM CONFIGURATION SETTINGS

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BM70/BM71

1.7 Power

Figure 1-4 shows an example power scheme using a 3.3 volt low-dropout (LDO) regulator supplying 3.3 volts to both
the BM70/BM71 (BAT_IN and VDD_IO) and MCU VDD. This power scheme ensures that BM70 and MCU I/O voltages
are compatible.

Figure 1-5 shows an example power scheme using a button cell battery. For BM71, a 10uF cap(X5R/X7R) is applied to
BAT_IN pin. BM71BLES1FC2 need to connect BK_IN with VBAT.

FIGURE 1-4: BM70/BM71 TO MCU INTERFACE EXAMPLE – 3.3V LDO

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BM70/BM71

FIGURE 1-5: BM70 EMBEDDED APPLICATION EXAMPLE – Button Cell Battery

1.8 Mounting Details

BM70BLES1FC2

The BM70BLES1FC2 physical dimensions are shown in Figure 1-6, recommended host PCB footprint in
Figure 1-7, and mounting suggestion in Figure 1-8. There should not be top copper layer near the test pin
area shown in Figure 1-7. When laying out the host PCB, the areas under the antenna should not contain
any top, inner layer, or bottom copper as shown in Figure 1-8. A low-impedance ground plane will ensure
best radio performance (best range, lowest noise). Figure 1-8 shows a minimum ground plane area to the
left and right of the module for best antenna performance. The ground plane can be extended beyond the
minimum recommended as need for host PCB EMC noise reduction. For best range performance, keep all
external metal away from the ceramic chip antenna at least 30 mm.

BM70BLE01FC2

The BM70BLE01FC2 physical dimensions are shown in Figure 1-9, recommended host PCB footprint in
Figure 1-10, and mounting suggestion in Figure 1-11. It is highly recommended to layout the host PCB as
suggested in Figure 1-11. A low-impedance ground plane will ensure best radio performance (best range,
lowest noise). Pin 30 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB trace
antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This trace
can be extended to include passive parts for antenna attenuation padding, impedance matching, or to
provide test posts. It is recommended that the micro-strip trace be as short as possible for minimum loss
and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm impedance. Figure
1-11 shows an example connection to U.FL connector.

2015 Microchip Technology Inc. Advance Information Page 11

BM70/BM71

BM71BLES1FC2

The BM71BLES1FC2 physical dimensions are shown in Figure 1-12, recommended host PCB footprint in
Figure 1-13, and mounting suggestion in Figure 1-14. There should not be top copper layer near the test
pin area shown in Figure 1-13. When laying out the host PCB, the areas under the antenna should not
contain any top, inner layer, or bottom copper as shown in Figure 1-14. A low-impedance ground plane
will ensure best radio performance (best range, lowest noise). Figure 1-14 shows a space area around
antenna section for best antenna performance. The ground plane can be extended beyond the minimum
recommended as need for host PCB EMC noise reduction. For best range performance, keep all external
metal away from the ceramic chip antenna at least 30 mm.

BM71BLE01FC2

The BM71BLE01FC2 physical dimensions are shown in Figure 1-15, recommended host PCB footprint in
Figure 1-16, and mounting suggestion in Figure 1-17. It is highly recommended to layout the host PCB as
suggested in Figure 1-17. A low-impedance ground plane will ensure best radio performance (best range,
lowest noise). Pin 1 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB trace antenna,
or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This trace can be
extended to include passive parts for antenna attenuation padding, impedance matching, or to provide
test posts. It is recommended that the micro-strip trace be as short as possible for minimum loss and
best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm impedance. Figure 1­17 shows an example connection to U.FL connector.

1.9 Soldering Recommendations

The BM70/BM71 wireless module was assembled using standard lead-free reflow profile IPC/JEDEC J-STD-

020.
The module can be soldered to the host PCB using standard leaded and lead-free solder reflow profiles.
To avoid damaging the module, the following recommendations are given:

 Microchip Technology Application Note AN233 Solder Reflow Recommendation (DS00233)

provides solder reflow recommendations

 Do not exceed peak temperature (T

) of 250 deg C

P

 Refer to the solder paste data sheet for specific reflow profile recommendations
 Use no-clean flux solder paste
 Do not wash as moisture can be trapped under the shield
 Use only one flow. If the PCB requires multiple flows, apply the module on the final flow.

2015 Microchip Technology Inc. Advance Information Page 12

FIGURE 1-6: BM70BLES1FC2 MODULE DIMENSIONS

FIGURE 1-7: BM70BLES1FC2 RECOMMEDED PCB FOOTPRINT

BM70/BM71

2015 Microchip Technology Inc. Advance Information Page 13

Top and Bottom Copper

layer keep out area

Top Copper Layer

Bottom Copper Layer

>6.4mm

>4.7mm

Edge of
host PCB

BM70/BM71

FIGURE 1-8: BM70BLE01FC2 HOST PCB MOUNTING SUGGESTION

.

2015 Microchip Technology Inc. Advance Information Page 14

FIGURE 1-9: BM70BLE01FC2 MODULE DIMENSIONS

FIGURE 1-10: BM70BLE01FC2 RECOMMEDED PCB FOOTPRINT

BM70/BM71

2015 Microchip Technology Inc. Advance Information Page 15

Top Copper Layer

Bottom Copper Layer

Note: Keep out layer marked as is the test point position under module.

BM70/BM71

FIGURE 1-11: BM70BLE01FC2 HOST PCB MOUNTING SUGGESTION

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FIGURE 1-12: BM71BLES1FC2 MODULE DIMENSIONS

FIGURE 1-13: BM71BLES1FC2 RECOMMEDED PCB FOOTPRINT

BM70/BM71

FIGURE 1-14: BM71BLES1FC2 HOST PCB MOUNTING SUGGESTION

2015 Microchip Technology Inc. Advance Information Page 17

FIGURE 1-15: BM71BLE01FC2 MODULE DIMENSIONS

FIGURE 1-16: BM71BLE01FC2 RECOMMEDED PCB FOOTPRINT

BM70/BM71

2015 Microchip Technology Inc. Advance Information Page 18

BM70/BM71

FIGURE 1-17: BM71BLE01FC2 HOST PCB MOUNTING SUGGESTION

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BM70/BM71

2.0 APPLICATION INFORMATION

2.1 External Configuration and Programming

The BM70 module can be configured and firmware programmed using an external configuration and programming tool.
Figure 2-1 shows the connections between the module and test points, it is recommended to include these test points
on the host PCB for development.

Configuration and firmware programming modes are entered according to the system configuration I/O pins (see
Section 1.6).

FIGURE 2-1: EXTERNAL PROGRAMMING HEADER CONNECTIONS

2.2 Reference Circuit

Figure 2-2 ~ 2-5 show the BM70 and BM71 reference circuit. Figure In which UART, LED, GPIO, test interface and RF
matching circuit are listed. GPIOs are configurable and the connection depends on user’s application circuit. Power
input range is 1.9V~3.6V. If battery is used, battery reverse protection circuit is suggested. The VDD_IO voltage is the
same as power input. If LED display is used, be sure the power voltage > 3.0V to make it visual. RF antenna matching
circuit in BM70BLE01FC2 also needs to be reserved to fine tune the antenna impedance matching.

2015 Microchip Technology Inc. Advance Information Page 20

BM70/BM71

FIGURE 2-2: BM70BLES1FC2 Reference Circuit

Figure 2-3 shows the BM70BLES1MC2 reference circuit, the RF antenna circuit is not included.

FIGURE 2-3: BM70BLE01FC2 Reference Circuit

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FIGURE 2-4: BM71BLE01FC2 Reference Circuit

FIGURE 2-5: BM71BLES1FC2 Reference Circuit

BM70/BM71

2015 Microchip Technology Inc. Advance Information Page 22

Frequency

2442 MHz

Max Gain

4.7dBi

Efficiency

56.9%

BM70/BM71

2.2.1 Power Drop Protection

In order to prevent the BLE module disordering when power drop to low working voltage less than 1.9V, a reset chip
with “Open Drain” type , delay time ≦ 10ms and triggered at 1.8V output voltage is recommended. Figure 2-7 shows

the reset circuit block diagram.

FIGURE 2-7: Optional Reset Circuit Block Diagram

2.3 BM70BLES1FC2/BM71BLES1FC2 Ceramic Chip Antenna

The BM70BLES1FC2 and BM71BLES1FC2 module contains an integral ceramic chip antenna. The antenna

performance on the module is shown in Figure 2-6.

FIGURE 2-6: BM70BLES1FC2 ANTENNA RADIATION PATTERN

2015 Microchip Technology Inc. Advance Information Page 23

Frequency

2442 MHz

Max Gain

0.1dBi

Efficiency

42.7%

FIGURE 2-7: BM71BLES1FC2 ANTENNA RADIATION PATTERN

BM70/BM71

2015 Microchip Technology Inc. Advance Information Page 24

1mS

25mS

46mS

68mS

Ext
Reset

Test Mode
Process

Application

Mode

Process

P2_0=0

P2_0=1

UART Ready
for MCU

UART Ready for
MCU

Status pin/UART
Report Command

VBAT

Test Mode
Process

25mS

P2_0=0

P2_0=1

UART Ready
for MCU

UART Ready
for MCU

Application
Process

46mS

68mS

Status pin/UART
Report Command

Mode

BM70/BM71

2.4 UART ready after Reset & Power On Timing

In MCU application, the timing period between reset/power on and BM70 UART ready need to be notified,. The timing
diagram in Figure 2-2 illustrates the timing of BM70 UART port ready for test mode and application mode after reset.
Figure 2-3 shows the timing of BM70 UART port ready for test mode and application mode after power on.
In application mode, when BM70 ready to talk to MCU after reset, it will have either status pin indication standby mode
(see UI setting) or status report UART command to inform MCU that it is ready for communication.

FIGURE 2-2: Timing diagram of BM70 UART ready for test mode and application mode

after reset

2.5 Power On Reset Timing

FIGURE 2-3: Timing diagram of BM70 UART ready for test mode and application mode

after power on

2015 Microchip Technology Inc. Advance Information Page 25

BM70/BM71

2.6 Power Consumption

Figure 2-4 and 2-5 illustrate the TX/RX mode peak current consumption in connected mode. In both modes, the

peak current of VBAT input is about 13mA.

FIGURE 2-4: Current consumption of RF TX in connected mode

FIGURE 2-5: Current consumption of RF RX in connected mode

In BM70 BLEDK3 application, 4 basic modes of BLE device have defined in Table 1-6. A current consumption
measurement example includes test condition and test environment setup is described in document “BM70 and
BLEDK3 Application Note”. In the example the connected mode TX/RX data transfer has also be tested.

2015 Microchip Technology Inc. Advance Information Page 26

Status

Description

Shutdown Mode

BLEDK3 is shutdown

Standby Mode

BLEDK3 sends advertising packets and
wait for connection. BLEDK3 is under
discoverable and connectable.

BLE Connected Mode

BLE link is established and CCCD of
ISSC_Transparent_TX characteristic is
disabled

Transparent Service Enabled Mode

BLE link is established and CCCD of
ISSC_Transparent_TX characteristic is
enabled

TABLE 1‐6: Status Definition of BLEDK3 Application Example

Note: CCCD stands for Client Characteristic Configuration, in GATT service characteristics.

2015 Microchip Technology Inc. Advance Information Page 27

BM70/BM71

Contains Transmitter Module FCC ID: BM70ABCDEFGH or
Contains FCC ID: BM70ABCDEFGH

This device complies with Part 15 of the FCC Rules. Operation is
subject to the following two conditions: (1) this device may not cause
harmful interference, and (2) this device must accept any interference
received, including interference that may cause undesired operation

BM70/BM71

3.0 REGULATORY APPROVAL

This section outlines the regulatory information for the BM70BLES1FC2 module for the following countries:

• United States

• Canada

• Europe

• Australia

• New Zealand

• Japan

• Korea

• Taiwan

• Other Regulatory Jurisdictions

3.1 United States

The BM70BLES1FC2 module has received Federal Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with Part 15.212
Modular Transmitter approval. Modular approval allows the end user to integrate the BM70 module into a finished
product without obtaining subsequent and separate FCC approvals for intentional radiation, provided no changes or
modifications are made to the module circuitry. Changes or modifications could void the user’s authority to operate
the equipment. The end user must comply with all of the instructions provided by the Grantee, which indicate
installation and/or operating conditions necessary for compliance.

The finished product is required to comply with all applicable FCC equipment authorizations regulations,
requirements and equipment functions not associated with the transmitter module portion. For example, compliance
must be demonstrated to regulations for other transmitter components within the host product; to requirements for
unintentional radiators (Part 15 Subpart B “Unintentional Radiators”), such as digital devices, computer peripherals,
radio receivers, etc.; and to additional authorization requirements for the non‐ transmitter functions on the transmitter
module (i.e., Verification, or Declaration of Conformity) (e.g., transmitter modules may also contain digital logic
functions) as appropriate.

3.1.1 LABELING AND USER INFORMATION REQUIREMENTS

The BM70 module has been labeled with its own FCC ID number, and if the FCC ID is not visible when

installed inside another device, then the outside of the finished product into which the module is installed must also

display a label referring to the enclosed module. This exterior label can use wording as follows:

Contains Transmitter Module FCC ID: BM70ABCDEFGH or
Contains FCC ID: BM70ABCDEFGH

This device complies with Part 15 of the FCC Rules. Operation is subject to the following
two conditions: (1) this device may not cause harmful interference, and (2) this device
must accept any interference received, including interference that may cause undesired
operation

the module is

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This equipment has been tested and found to comply with the limits for a Class B
digital device, pursuant to part 15 of the FCC Rules. These limits are designed to
provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy,
and if not installed and used in accordance with the instructions, may cause harmful
interference to radio communications. However, there is no guarantee that
interference will not occur in a particular installation. If this equipment does cause
harmful interference to radio or

television reception, which can be determined by turning the
equipment off and on, the user is encouraged to try to
correct the interference by one or more of the following
measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit

different from that to which the receiver is
connected.

• Consult the dealer or an experienced radio/TV technician for help.

A user’s manual for the finished product should include the following statement:

BM70/BM71

Additional information on labeling and user information requirements for Part 15 devices can be found in KDB
Publication 784748 available at the FCC Office of Engineering and Technology (OET) Laboratory Division
Knowledge Database (KDB) http://apps.fcc.gov/oetcf/kdb/index.cfm.

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure
Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or
devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal
Communications Commission (FCC).

From the FCC Grant: Output power listed is conducted. This grant is valid only when the module is sold
integrators and must be installed by the OEM or OEM integrators. This transmitter is restricted for use with the
specific antenna(s) tested in this application for Certification and must not be co‐ located or operating in conjunction
with any other antenna or transmitters within a host device, except in accordance with FCC multi‐ transmitter product
procedures.

Federal Communications Commission (FCC): http://www.fcc.gov

FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB):

http://apps.fcc.gov/oetcf/kdb/index.cfm

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to OEM

Contains transmitter module IC: 12246A-BM70BLES1F2

This device complies with Industry Canada license‐ exempt
RSS standard(s). Operation is subject to the following two
conditions: (1) this device may not cause interference, and (2)
this device must accept any interference, including
interference that may cause undesired operation of the
device.

Le présent appareil est conforme aux CNR d'Industrie
Canada applicables aux appareils radio exempts de
licence. L'exploitation est autorisée aux deux conditions
suivantes: (1) l'appareil ne doit pas produire de brouillage,
et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible
d'en compromettre le fonctionnement.

BM70/BM71

3.2 Canada

The BM70BLES1FC2 module has been certified for use in Canada under Industry Canada (IC) Radio
Standards Specification (RSS) RSS‐ 210 and RSS‐ Gen. Modular approval permits the installation of a module
in a host device without the need to recertify the device.

3.2.1 LABELING AND USER INFORMATION REQUIREMENTS

Labeling Requirements for the Host Device (from Section 3.2.1, RSS‐ Gen, Issue 3, December 2010): The host

device shall be properly labeled to identify the module within the host device.

The Industry Canada certification label of a module shall be clearly visible at all times when installed in

host device must be labeled to display the Industry Canada certification
number of the module, preceded by the words “Contains transmitter module”, or the word “Contains”,
or similar wording expressing the same meaning, as follows:

User Manual Notice for License‐ Exempt Radio Apparatus (from Section 7.1.3 RSS‐ Gen, Issue 3, December 2010):
User manuals for license‐ exempt radio apparatus shall contain the following or equivalent notice in a conspicuous
location in the user manual or alternatively on the device or both:

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BM70/BM71

3.2.2 RF EXPOSURE

All transmitters regulated by IC must comply with RF exposure requirements listed in RSS‐ 102 ‐ Radio Frequency
(RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency Bands).

(Get direct quote from Certificate and place here)

3.2.3 HELPFUL WEB SITES

Industry Canada: http://www.ic.gc.ca/

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Certification

Standards

Article

Laboratory

Report Number

Date

Safety

EN 60950‐

(3.1(a))
Health

EN 50371:2002‐03

EMC
EN 301 489‐1 V1.8.1 (2008‐04)

(3.1(b))
EN 301 489‐17 V2.1.1 (2009‐05)

Radio

EN 300 328 V1.7.1 (2006‐10)

(3.2)

Notified Body
Opinion

BM70/BM71

3.3 Europe

The BM70BLES1FC2 module is an R&TTE Directive assessed radio module that is CE marked and
has been manufactured and tested with the intention of being integrated into a final product.

The BM70 module has been tested to R&TTE Directive 1999/5/EC Essential Requirements for Health and
Safety (Article (3.1(a)), Electromagnetic Compatibility (EMC) (Article 3.1(b)), and Radio (Article 3.2) and are
summarized in Table 3‐ 1: European Compliance Testing. A Notified Body Opinion has also been issued.
All test reports are available on the BM70 product web page at http://www.microchip.com/bm70.

The R&TTE Compliance Association provides guidance on modular devices in document Technical
Guidance Note 01 available at http://www.rtteca.com/html/download_area.htm.

Note: To maintain conformance to the testing listed in Table 3‐1: European Compliance Testing, the

module shall be installed in accordance with the installation instructions in this data sheet and shall
not be modified.

When integrating a radio module into a completed product the integrator becomes the manufacturer of
the final product and is therefore responsible for demonstrating compliance of the final product with the
essential requirements of the R&TTE Directive.

3.1.3 LABELING AND USER INFORMATION REQUIREMENTS

The label on the final product which contains the BM70 module must follow CE marking requirements.
The R&TTE Compliance Association Technical Guidance Note 01 provides guidance on final product
CE marking.

3.1.4 ANTENNA REQUIREMENTS

From R&TTE Compliance Association document Technical Guidance
Note 01:

Provided the integrator installing an assessed radio module with an integral or specific antenna
and installed in conformance with the radio module manufacturer’s installation instructions
requires no further evaluation under Article 3.2 of the R&TTE Directive and does not require
further involvement of an R&TTE Directive Notified Body for the final product. [Section 2.2.4]

The European Compliance Testing listed in Table 3‐ 1 was performed using the integral ceramic chip
antenna.

TABLE 3‐ 1: EUROPEAN COMPLIANCE TESTING

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3.3.3 HELPFUL WEB SITES

BM70/BM71

A document that can be used as a starting point in understanding the use of Short Range Devices (SRD)

in Europe is
the European Radio Communications Committee (ERC) Recommendation 70‐ 03 E, which can be downloaded from
the European Radio Communications Office (ERO) at: http://www.ero.dk/.

Additional helpful web sites are:

• Radio and Telecommunications Terminal Equipment (R&TTE):

http://ec.europa.eu/enterprise/rtte/index_en.htm

• European Conference of Postal and Telecommunications Administrations (CEPT):

http://www.cept.org

• European Telecommunications Standards Institute (ETSI):

http://www.etsi.org

• European Radio Communications Office (ERO):

http://www.ero.dk

• The Radio and Telecommunications Terminal Equipment Compliance Association (R&TTE CA):

http://www.rtteca.com/

3.2 Australia

The Australia radio regulations do not provide a modular approval policy similar to the United States (FCC) and
Canada (IC). However, BM70 module RF transmitter test reports can be used in part to demonstrate compliance in
accordance with ACMA Radio communications “Short Range Devices” Standard 2004 (The Short Range Devices
standard calls up the AS/NZS 4268:2008 industry standard). The BM70 module test reports can be used as part of
the product certification and compliance folder. For more information on the RF transmitter test reports, contact
Microchip Technology Australia sales office.

To meet overall Australian final product compliance, the developer must construct a compliance folder containing all
relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity) etc. It is the
responsibility of the integrator to know what is required in the compliance folder for ACMA compliance. All test reports
are available on the BM70 product web page at http://www.microchip.com. For more information on Australia
compliance, refer to the Australian Communications and Media Authority web site http://www.acma.gov.au/.

3.2.1 HELPFUL WEB SITES

The Australian Communications and Media Authority: www.acma.gov.au/.

3.3 New Zealand

The New Zealand radio regulations do not provide a modular approval policy similar to the United States (FCC) and
Canada (IC). However, BM70 module RF transmitter test reports can be used in part to demonstrate compliance
against the New Zealand “General User Radio License for Short Range

Devices”. New Zealand Radio
communications (Radio Standards) Notice 2010 calls up the AS / NZS 4268:2008 industry standard. The BM70
module test reports can be used as part of the product

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BM70/BM71

certification and compliance folder. All test reports are available on the BM70 product web page at

http://www.microchip.com/bm70. For more information on the RF transmitter test reports, contact Microchip Technology

sales office.

Information on the New Zealand short range devices license can be found in the following web links:

http://www.rsm.govt.nz/cms/licensees/types‐ oflicence/general‐ user‐ licences/short‐ range‐ devices

and

http://www.rsm.govt.nz/cms/policy‐and‐planning/spectrum‐policy‐overview/legislation/gazette‐
compliance/ .

To meet overall New Zealand final product compliance, the developer must construct a compliance folder containing
all relevant compliance test reports e.g. RF, EMC, electrical safety and DoC (Declaration of Conformity) etc. It is the
responsibility of the developer to know what is required in the compliance folder for New Zealand Radio
communications. For more information on New Zealand compliance, refer to the web site http://www.rsm.govt.nz/.

3.3.1 HELPFUL WEB SITES

Radio Spectrum Ministry of Economic Development: http://www.rsm.govt.nz/.

3.4 Japan

The BM70BLES1FC2 module has received type certification and is labeled with its own technical conformity mark
and certification number as required to conform to the technical standards regulated by the Ministry of Internal
Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan.

Integration of this module into a final product does not require additional radio certification provided installation
instructions are followed and no modifications of the module are allowed. Additional testing may be required:

• If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the
host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator
should contact their conformance laboratory to determine if this testing is required.

• There is an voluntary Electromagnetic Compatibility (EMC) test for the host product
administered by VCCI: http://www.vcci.jp/vcci_e/index.html

3.4.1 LABELING AND USER INFORMATION REQUIREMENTS

The label on the final product which contains the BM70 module must follow Japan marking requirements.
The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of
Internal Affairs and Communications (MIC) website.

The BM70 module is labeled with its own technical conformity mark and certification number. The final product in
which this module is being used must have a label referring to the type certified module inside:

notices/product‐

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f CCAN15LP0500T1

202-SMD069

BM70/BM71

Contains transmitter module with certificate number:

202‐SMC066

3.4.2 HELPFUL WEB SITES

Ministry of Internal Affairs and Communications (MIC): http://www.tele.soumu.go.jp/e/index.htm Association of Radio
Industries and Businesses (ARIB): http://www.arib.or.jp/english/

3.5 Korea

The BM70BLES1FC2 module has received certification of conformity in accordance with the Radio Waves Act.
Integration of this module into a final product does not require additional radio certification provided installation
instructions are followed and no modifications of the module are allowed.

3.5.1 LABELING AND USER INFORMATION REQUIREMENTS

The label on the final product which contains the BM70 module must follow KC marking requirements.
The integrator of the module should refer to the labeling requirements for Korea available on the Korea

Communications Commission (KCC) website.

The BM70 module is labeled with its own KC mark. The final product requires the KC mark and certificate number of
the module:

(Number)

3.5.2 HELPFUL WEB SITES

Korea Communications Commission (KCC): http://www.kcc.go.kr National Radio
Research Agency (RRA): http://rra.go.kr

3.6 Taiwan

The BM70BLES1FC2 module has received compliance approval in accordance with the Telecommunications Act.
Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or
distribution partners to obtain a Letter of Authority.

installation instructions are followed and no modifications of the module are allowed.
Integration of this module into a final product does not require additional radio certification provided

3.6.1 LABELING AND USER INFORMATION REQUIREMENTS

The BM70 module is labeled with its own NCC mark and certificate number as below:

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BM70/BM71

The user’s manual should contain below warning (for RF device) in traditional Chinese:

注意 !

依據 低功率電波輻射性電機管理辦法
第十二條 經型式認證合格之低功率射頻電機，非經許可， 公司、商號或使用者均
不得擅自變更頻率、加大功率或變更原設計 之特性及功能。

第十四條 低功率射頻電機之使用不得影響飛航安全及干擾合法通信； 經發現有干擾現象時，應立即停用，並改善至無干擾時

方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用

電波輻射性

電機設備之干擾。

3.8.2 HELPFUL WEB SITES

National Communications Commission (NCC): http://www.ncc.gov.tw

3.7 Other Regulatory Jurisdictions

Should other regulatory jurisdiction certification be required by the customer, or the customer need to recertify the
module for other reasons, a certification utility is available. For further regulatory Certification Utility and
documentation, contact ISSC Technologies Corp.

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Parameter

Value

Temperature Range (Operating)

-20℃ to +70℃

Temperature Range (Storage)

-65℃ to +150℃

Relative Humidity (Operating)

10% to 90%

Relative Humidity (Storage)

10% to 90%

Moisture Sensitivity Level

2

Parameter

Min.

Typ.

Max.

Units

Supply Voltage (VDD)

1.9 3.6

V

I/O Supply Voltage (VDD_IO = VDD)

1.9 3.6

V

I/O Voltage Levels

V

IL

input logic levels low

VSS

0.3VDD

V

V

IH

input logic levels high

0.7VDD

VDD

V

V

OL

output logic levels low

VSS

0.2VDD

V

V

OH

output logic levels high

0.8VDD

VDD

V

RESET

V

TH,res

threshold voltage

1.6 V

Reset low duration

63

ns

Input and Tri-State Current with

Pull-up Resistor

34

48

74

Kohm

Leakage current

-1 1

uA

Supply Current

TX mode peak current @ VDD=3V, TX=0dBm, Buck Mode

13

mA

RX mode peak current @ VDD=3V, Buck Mode

13

mA

Link static current

60 uA

Standby current

1.9

2.9

uA

Power-Saving

1

1.7

uA

ADC (Analog to Digital Converter)

Full scale (BAT_IN)

0

3.0

3.6

V

Full scale (AD0~AD15)

0 3.6

Conversion time (ENOB 8bit)

131

uS

Conversion time (ENOB 10bit)

387

uS

Operating current

500

uA

PTS(precise temperature sensor)

Detect range

-20 70

℃

Digital Output

1154

2613

Resolution

11.5

bits/℃

Accuracy

-3 3

℃

Conversion time (ENOB 8-bit)

1.5

mS

Operating current

200

uA

4.0 ELECTRICAL CHARACTERISTICS

TABLE 4‐ 1: ENVIRONMENTAL CONDITIONS

TABLE 4‐ 2: ELECTRICAL CHARACTERISTICS

BM70/BM71

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Part Number

Description

BM70BLE01FC2

Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module,external

antenna, no shield. Size: 12x15mm

BM70BLES1FC2

Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module with

antenna and shield. Size: 12x22mm

BM71BLE01FC2

Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module, external

antenna, no shield. Size: 6x8mm

BM71BLES1FC2

Bluetooth® 4.2 BLE Single Mode, Class 2, Surface Mount module with

antenna and shield. Size: 9x11.5mm

5.0 ORDERING INFORMATION

TABLE 4‐1: ORDERING INFORMATION

Note: The module can only be purchased through a Microchip representative.

Go to http://www.microchip.com/ for current pricing and a list of distributors carrying Microchip
products.

BM70/BM71

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AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

http://www.microchip.com/
support

Web Address:

www.microchip.com

Atlanta
Duluth, GA
Tel: [phone]
Fax: [phone]

Austin, TX
Tel: [phone]

Boston

Westborough, MA
Tel: [phone]
Fax: [phone]

Chicago
Itasca, IL
Tel: [phone]
Fax: [phone]

Cleveland

Independence, OH
Tel: [phone]
Fax: [phone]

Dallas
Addison, TX
Tel: [phone]
Fax: [phone]

Detroit
Novi, MI
Tel: [phone]

Houston, TX
Tel: [phone]

Indianapolis

Noblesville, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

New York, NY
Tel: [phone]

San Jose, CA
Tel: [phone]

Canada - Toronto
Tel: [phone]
Fax: [phone]

BM70/BM71

Worldwide Sales and Service

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: [phone]
Fax: [phone]

Australia - Sydney
Tel: [phone]
Fax: [phone]

China - Beijing
Tel: [phone]
Fax: [phone]

China - Chengdu
Tel: [phone]
Fax: [phone]

China - Chongqing
Tel: [phone]
Fax: [phone]

China - Hangzhou
Tel: [phone]
Fax: [phone]

China - Hong Kong SAR
Tel: [phone]
Fax: [phone]

China - Nanjing
Tel: [phone]
Fax: [phone]

China - Qingdao
Tel: [phone]
Fax: [phone]

China - Shanghai
Tel: [phone]
Fax: [phone]

China - Shenyang
Tel: [phone]
Fax: [phone]

China - Shenzhen
Tel: [phone]
Fax: [phone]

China - Wuhan
Tel: [phone]
Fax: [phone]

China - Xian
Tel: [phone]
Fax: [phone]

China - Xiamen
Tel: [phone]
Fax: [phone]

China - Zhuhai
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi
Tel: [phone]
Fax: [phone]

India - Pune
Tel: [phone]

Japan - Osaka
Tel: [phone]
Fax: [phone]

Japan - Tokyo
Tel: [phone]
Fax: [phone]

Korea - Daegu
Tel: [phone]
Fax: [phone]

Korea - Seoul
Tel: [phone]
Fax: [phone] or
82-2-558-5934

Malaysia - Kuala Lumpur
Tel: [phone]
Fax: [phone]

Malaysia - Penang
Tel: [phone]
Fax: [phone]

Philippines - Manila
Tel: [phone]
Fax: [phone]

Singapore
Tel: [phone]
Fax: [phone]

Taiwan - Hsin Chu
Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung
Tel: [phone]

Taiwan - Taipei
Tel: [phone]
Fax: [phone]

Thailand - Bangkok
Tel: [phone]
Fax: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]
Denmark - Copenhagen
Tel: [phone]
Fax: [phone]

France - Paris
Tel: [phone]
Fax: [phone]

Germany - Dusseldorf
Tel: [phone]

Germany - Munich
Tel: [phone]
Fax: [phone]

Germany - Pforzheim
Tel: [phone]

Italy - Milan
Tel: [phone]
Fax: [phone]

Italy - Venice
Tel: [phone]

Netherlands - Drunen
Tel: [phone]
Fax: [phone]

Poland - Warsaw
Tel: [phone]

Spain - Madrid
Tel: [phone]
Fax: [phone]

Sweden - Stockholm
Tel: [phone]

UK - Wokingham
Tel: [phone]
Fax: [phone]

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