Microchip Technology BM70ABCDEFGH User Manual

BM70/BM71

Bluetooth® 4.2 BLE Module

Features

• Bluetooth

• 1.9V~3.6V operating range

• UART/ I2C/ SPI interface supported

• PWM supported(3-ch for BM70, 1-ch for BM71)

• Temperature range (-20℃~70℃)

• Main Crystal : 32MHz

• Temperature sensor supported

• 12 bits ADC supported for 6CH(BM70)

/4CH(BM71) input ports and battery voltage detection

• Wake up by any GPIO

• Peak current: TX 13mA/RX 13mA with Buck,@

VBAT=3.0V

• RSSI Monitor

RF/Analog Features

• ISM Band 2.402 to 2.480 GHz operation

• Channels 0-39

• Rx Sensitivity: -90 dBm@ BLE, in typical

• Tx Power: +2 dBm, support class 2 power output

• RSSI monitor

Antenna

• Ceramic Chip Antenna

(BM70BLES1FC2/BM71BLES1FC2)

• External Antenna Connection via RF pad

(BM70BLE01FC2/BM71BLES1FC2)

Smart 4.2 BLE compliant

FIGURE 1: (BM71 NA)

Description

The BM70/BM71 BLE module is designed for Appenabled accessories and IoT (Internet of Things) through Bluetooth® connectivity.

It is available in the 2.4GHz ISM band radio, compatible with Bluetooth Core Specification Version

4.2 to enhance the throughputs and security for IoT applications.

For improving user experiences for IoT applications, the patent and trademark for Beacon Things Technology is applied to let users can control automatically and receive data to cloud without open App through iPhone.

The module build-in Bluetooth® stacks to be embedded Bluetooth® LE solution, so developer can save time to finish their design without taking efforts to care Bluetooth® issue. In addition, it narrows down the module size and minimizes its cost. For portable and wearable applications, the product optimized power design to minimize current consumption to extend battery life.

Applications

• IoT/ IoE

• Payment/ Security

• Wearable devices

• Smart Home

• Smart Health

• Apple iBeacon

• Digital Sports

• Proximity/ Find Me

BM70/BM71

Table of Contents

1.0 PRODUCT OVERVIEW .............................................................................................................. 5

1.1 Interface Description ............................................................................................................. 6

1.2 Configuring the BM70/BM71 ............................................................................................ 9

1.3 UART Interface .................................................................................................................. 9

1.4 Control and Indication I/O Pins ........................................................................................ 9

1.5 RESET (RST_N) .............................................................................................................. 10

1.6 System Configuration ...................................................................................................... 10

1.7 Power ................................................................................................................................ 11

1.8 Mounting Details .............................................................................................................. 12

1.9 Soldering Recommendations ........................................................................................ 13

2.0 APPLICATION INFORMATION ............................................................................................. 21

2.1 External Configuration and Programming ................................................................... 21

2.2 Reference Circuit ............................................................................................................. 21

2.2.1 Power Drop Protection ........................................................................................ 24

2.3 BM70BLES1FC2/BM71BLES1FC2 Ceramic Chip Antenna ..................................... 24

2.4 UART ready after Reset & Power On Timing .............................................................. 26

2.5 Power On Reset Timing ................................................................................................. 26

2.6 Power Consumption ........................................................................................................ 27

3.0 REGULATORY APPROVAL ................................................................................................... 29

3.1 United States .............................................................................................................. 29

3.1.1 LABELING AND USER INFORMATION REQUIREMENTS ............................ 29

3.2 Canada .............................................................................................................................. 31

3.2.1 LABELING AND USER INFORMATION REQUIREMENTS ................................. 31

3.2.2 RF EXPOSURE ....................................................................................................... 32

3.2.3 HELPFUL WEB SITES........................................................................................... 32

3.3 Europe ............................................................................................................................... 33

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BM70/BM71

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

•

Microchip’s Worldwide Web site; http://www.microchip.com

•

Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.

Customer Notification System

Abbreviations List:

BLE: Bluetooth Low Energy IOT: Internet of Things

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TO OUR VALUED CUSTOMERS

Part Number

Antenna on Board

Shielding

Pin #

Dimension

BM70BLE01FC2

No (External)

12mm x 15mm

BM70BLES1FC2

Yes

12mm x 22mm

BM71BLE01FC2

No (External)

6mm x 8mm

BM71BLES1FC2

Yes

9mm x 11.5mm

BM70/BM71

1.0 PRODUCT OVERVIEW

BM70 and BM71 are embedded 2.4 GHz Bluetooth® Version 4.2 (BLE) modules. The chip inside incorporates Bluetooth stack, power management subsystem, 2.4 GHz transceiver, and RF power amplifier. With the module developers can

The BM70 and BM71 provide cost and time to market savings as a self‐contained module solution. The modules have been designed to provide developers with a simple Bluetooth® solution as below:

• Ease of integration and programming

• Vastly reduced development time

• Minimum system cost and highest quality for wireless module

• Interoperability with Apple iOS and Google Android OS

• Maximum value in a range of applications

In addition, BM70 and BM71 also provide the BeaconThings® Technology to improve user experiences for IoT applications:

• Auto Connection/Control

• Data to Cloud Easily

The BM70 and BM71 can independently maintain a low power wireless connection. Low power usage and flexible power management maximize the module’s lifetime in battery operated devices. A wide operating temperature range allows use in indoor and outdoor environments.

BM71 is the small form factor for wearable, compact, surface mount module with castellated pads for easy and reliable host PCB mounting.

TABLE 1‐1: BM70/BM71 MODULE FAMILY TYPES

add

Bluetooth® functionality rapidly for any IoT devices.

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BM70/BM71

1.1 Interface Description

The block diagram of BM70/BM71 is shown in Figure 1-1. descriptions are shown in Table 1-1. Test pads on button side of each module, which are used for production test, are listed in Table 1-2.

FIGURE 1-1: BM70/BM71 BLOCK DIAGRAM

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Pin diagram is shown in Figure 1-2 and the

BM70BLES1FC2

BM70BLE01FC2

BM71BLE01FC2

BM71BLES1FC2

BM70/BM71

FIGURE 1-2: BM70/BM71 PIN DIAGRAM

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BM70BLE01FC2

BM70BLES1FC2

BM71BLE01FC2

BM71BLES1FC2

Symbol

Type

Description

-- ‐

GND

Power

Ground reference

-- ‐

GND

Power

Ground reference

GND

Power

Ground reference

2 4 11

VBAT

Power

Battery input. Main positive supply input. Voltage Range: 1.9V~3.6V

BK_IN

Power

Buck input. Main positive supply input. Connect to 10uF low ESR ceramic capacitor. Voltage Range:

1.9V~3.6V

3 5 --

P2_2

DIO

GPIO, default pull-high input PWM1

4 6 --

VDD_IO

Power

I/O positive supply. Ensure VDD_IO and MCU I/O voltage are compatible

5 7 --

VDD_IO

Power

I/O positive supply. Ensure VDD_IO and MCU I/O voltage are compatible

6 8 --

ULPC_O

Power

1.2V Programmable ULPC LDO Output for AONlogic and Retention Memory Supply

7 9 --

P2_3

GPIO, default pull-high input PWM2

BK_O

Power

1.55V buck output 13

P1_6

DIO AO

P1_6 External 32.768KHz Crystal Input: XI32K

P1_7

DIO AI

P1_7 External 32.768KHz Crystal Output: XO32K

P2_7

DIO AI DO DO

GPIO, default pull-high input AD14 NCS2 : : 2nd SPI-Bus (Master mode) TX_IND

P1_1

DIO AI

GPIO, default pull-high input AD9

2 3 P1_2

DIO AI I/O

GPIO, default pull-high input AD10 I2C SCL.

P1_3

DIO AI DIO

GPIO, default pull-high input AD11 I2C SDA

15 8 11

P0_0

DIO AI DI

GPIO, default pull-high input AD0 UART flow-control CTS

P1_0

DIO AI

GPIO, default pull-high input AD8

6 9 P3_6

DIO DO DO

GPIO, default pull-high input PWM0 UART flow-control RTS

P2_0

DIO

System configuration, default pull-high input H  Application L  test mode.

TABLE 1-1: PIN DESCRIPTION

BM70/BM71

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P2_4

DIO

GPIO, default pull-high input

No Connection

RST_N

Module Reset(active low) (internal pull-

HCI_RXD

HCI UART Data Input

HCI_TXD

HCI UART Data Output

P3_1

DIO

GPIO, default pull-high input

P3_2

DIO DO

GPIO, default pull-high input SPI-Bus: MISO

P3_3

DIO DI

GPIO, default pull-high input SPI-Bus: MOSI

P3_4

DIO DO

GPIO, default pull-high input SPI-Bus: SCLK

P3_5

DIO AI

GPIO, default pull-high input LED1

P0_7

DIO

GPIO, default pull-high input

30 9 12

P0_2/LED

DIO AI

P02 AD2

17 2 GND

Power

Ground reference

GND

Power

Ground reference

BT_RF

AIO

External Antenna Connection (50 Ω)

GND

Power

Ground reference

BM70BLE01FC2

BM70BLES1FC2

BM71BLE01FC2

BM71BLES1FC2

Symbol

Type Description

TP-1

TP-3

VCC_PA

Power

1.55V RF PA LDO

TP-2

TP-1

TP-5

CLDO_O

Power

1.2V CLDO Output

TP-3

TP-2

VCC_RF

Power

1.2V RF LDO Output

TP-4

ULPC_O

Power

1.2V ULPC LDO Output

TP-5

TP-1

BK_O

Power

1.55V Buck Output

BM70/B71

Note 1: Pin type abbreviation: A = Analog, D = Digital, I = Input, O = Output. Table 1-2 Test Points on Button Side

1.2 Configuring the BM70/BM71

Configuring the BM70/BM71 features and service table can be performed by using the “Windows UI Configuration tool”. The detail information will be disclosed in the Application Note.

1.3 UART Interface

Figures 1-4 and 1-5 show Power and MCU interface examples The BM70 UART pins TXD and RXD connect to the UART pins of the host MCU. It is highly recommended to use

hardware flow control pins RTS and CTS. The BM70 hardware flow control is disabled by default and must be configured to enable. The UART Baud rate is configurable.

1.4 Control and Indication I/O Pins

I/O pins on BM70 are configurable control and indication I/O. Control signals are input to the BM70. Indication signals are output from the BM70. Table 1‐3 shows configurable I/O pin assignment to control and indication signals example of BM70 BLEDK3 application. Note that for different BM70 application, the I/O assignment is different. The detail information will be disclosed in the related application note and configurable in the dedicated “UI Configuration Tool”.

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N/C LOW_BATTERY_IND RSSI_IND LINK_DROP

UART_RX_IND

PAIRING_KEY RF_ACTIVE_IND BLEDK_STATUS1_IND

(*Note) BLEDK_STATUS2_IND

(*Note)

P10

Default

P31

Default

P32

Default

P33

Default

P34

Default

P07

Default

P11

Default P22

Default

P24

Default

P35

Default

P36

UART_RTS

P00

UART_CTS

P27

TX_IND

P12

I2C/SCL

P13

I2C/SDA

P02

LED0

P31

SPI BUS/ NCS

P32

SPI BUS/ MISO

P33

SPI BUS/ MOSI

P34

SPI BUS/ SCLK

P20

Operational Mode

High

Application Mode

Low

Test Mode (Write UI/Flash: Firmware Programming)

BM70/BM71

TABLE 1‐3: CONFIGURATION AND INDICATION I/O ASSIGNMENTS FOR BM70 BLEDK3 APPLICATION

*Note: Detail BLEDK status indication please see BLEDK3 release note.

For the BM70 BLEDK3 example, some I/O functions are fixed to dedicated function as listed in Table 1-4.

TABLE 1-4: FIX I/O ASSIGNMENTS FOR BM70 BLEDK3 APPLICATION

1.5 RESET (RST_N)

The Reset (RST_N) input pin resets the BM70/BM71 (active low pulse for at least 63 ns).

1.6 System Configuration

I/O pins P20 place the BM70 into operation modes as shown in Table1-5. P20 have internal pull-up.

TABLE 1‐5: SYSTEM CONFIGURATION SETTINGS

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BM70/BM71

1.7 Power

Figure 1-4 shows an example power scheme using a 3.3 volt low-dropout (LDO) regulator supplying 3.3 volts to both the BM70/BM71 (BAT_IN and VDD_IO) and MCU VDD. This power scheme ensures that BM70 and MCU I/O voltages are compatible.

Figure 1-5 shows an example power scheme using a button cell battery. For BM71, a 10uF cap(X5R/X7R) is applied to BAT_IN pin. BM71BLES1FC2 need to connect BK_IN with VBAT.

FIGURE 1-4: BM70/BM71 TO MCU INTERFACE EXAMPLE – 3.3V LDO

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BM70/BM71

FIGURE 1-5: BM70 EMBEDDED APPLICATION EXAMPLE – Button Cell Battery

1.8 Mounting Details

BM70BLES1FC2

The BM70BLES1FC2 physical dimensions are shown in Figure 1-6, recommended host PCB footprint in Figure 1-7, and mounting suggestion in Figure 1-8. There should not be top copper layer near the test pin area shown in Figure 1-7. When laying out the host PCB, the areas under the antenna should not contain any top, inner layer, or bottom copper as shown in Figure 1-8. A low-impedance ground plane will ensure best radio performance (best range, lowest noise). Figure 1-8 shows a minimum ground plane area to the left and right of the module for best antenna performance. The ground plane can be extended beyond the minimum recommended as need for host PCB EMC noise reduction. For best range performance, keep all external metal away from the ceramic chip antenna at least 30 mm.

BM70BLE01FC2

The BM70BLE01FC2 physical dimensions are shown in Figure 1-9, recommended host PCB footprint in Figure 1-10, and mounting suggestion in Figure 1-11. It is highly recommended to layout the host PCB as suggested in Figure 1-11. A low-impedance ground plane will ensure best radio performance (best range, lowest noise). Pin 30 (BT_RF) is a 50 ohm connection to an external antenna connector, PCB trace antenna, or component (ceramic chip) antenna through a host PCB 50 ohm micro-strip trace. This trace can be extended to include passive parts for antenna attenuation padding, impedance matching, or to provide test posts. It is recommended that the micro-strip trace be as short as possible for minimum loss and best impedance matching. If the micro-strip trace is longer, it should be a 50 ohm impedance. Figure 1-11 shows an example connection to U.FL connector.

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