Microchip Technology A090668, A090667 User Manual

ZigBit™ 2.4 GHz Amplified Wireless Modules

D

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...................................................................................................................

ATZB-A24-UFL/U0

Datasheet

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ZigBit™ 2.4 GHz Amplified Wireless Modules 1-2

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Table of Contents

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Section 1

1.1 Summary............................................................................................................................ 1-1

1.2 Applications........................................................................................................................ 1-1

1.3 Key Features...................................................................................................................... 1-2

1.4 Benefits .............................................................................................................................. 1-2

1.5 Abbreviations and Acronyms ............................................................................................. 1-2

1.6 Related Documents ........................................................................................................... 1-4

Section 2

2.1 Overview ............................................................................................................................ 2-5

Section 3

3.1 Electrical Characteristics.................................................................................................... 3-7

3.1.1 Absolute Maximum Ratings ................................................................................. 3-7

3.1.2 Test Conditions.................................................................................................... 3-7

3.1.3 RF Characteristics ............................................................................................... 3-8

3.1.4 ATmega1281V Microcontroller Characteristics ................................................... 3-8

3.1.5 Module Interfaces characteristics ........................................................................ 3-8

3.2 Physical/Environmental Characteristics and Outline ......................................................... 3-9

3.3 Pin Configuration ............................................................................................................. 3-10

3.4 Mounting Information ....................................................................................................... 3-14

3.5 Soldering Profile............................................................................................................... 3-14

3.6 Antenna Reference Design .............................................................................................. 3-15

Section 4

4.1 Ordering Information ........................................................................................................ 4-16

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1.1 Summary

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Section 1

Introduction

ZigBit™ Amp is an ultra-compact, extended range, low-power, high-sensitivity 2.4GHz
IEEE 802.15.4/ZigBee
ware platform, this module is enhanced by an output power amplifier and an input low-noise amplifier,
and is designed for wireless sensing, monitoring & control and data acquisition applications. ZigBit Amp
modules eliminate the need for costly and time-consuming RF development, and shortens time to mar­ket for wireless applications with extended range requirements.

Two different versions of ZigBit 2.4 GHz Amplified modules are available: ATZB-A24-UFL with built-in
U.FL antenna connector and the ATZB-A24-U0 with unbalanced RF output. These modules are an addi­tion to the ZigBit family represented by ATZB-24-A2 and ATZB-24-B0. In addition Atmel offer the ZigBit
900 MHz Wireless Module ATZB-900-B0 [2].

1.2 Applications

ZigBit module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing, self­organizing mesh network, while optimizing network traffic and minimizing power consumption. Atmel
offers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified software
development platform supporting reliable, scalable, and secure wireless applications running on Atmel’s
ZigBit modules. SerialNet allows programming of the module via serial AT-command interface.

The applications include, but are not limited to:

•

Building automation & monitoring

– Lighting controls
– Wireless smoke and CO detectors
– Structural integrity monitoring

• HVAC monitoring & control

• Inventory management

• Environmental monitoring

• Security

• Water metering

• Industrial monitoring

– Machinery condition and performance monitoring
– Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity,

vibration, etc.

• Automated meter reading (AMR)

®

OEM module from Atmel. Based on the innovative Atmel's mixed-signal hard-

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1.3 Key Features

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• Ultra compact size (38.0 x 13.5 x 2.0 mm)

• High RX sensitivity (-104 dBm)

• Outperforming link budget (up to 124 dB)

• Up to +20 dBm output power

• Very low power consumption:

– < 6 µA in Sleep mode,
– 23 mA in RX mode,
– 50 mA in TX mode

• Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM)

• Wide range of interfaces (both analog and digital):

– 9 spare GPIO, 2 spare IRQ lines
– 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled)
– UART with CTS/RTS control
–USART
–I2C
– SPI
–1-Wire
– Up to 30 lines configurable as GPIO

• Capability to use MAC address written into EEPROM

• IEEE 802.15.4 compliant transceiver

• 2.4 GHz ISM band

• BitCloud embedded software, including serial bootloader and AT command set

Introduction

1.4 Benefits

• Extended range through additional PA and LNA

• Ultra low power consumption combined with unprecedented range

• Rapid design-in with built-in U.FL connector (ATZB-A24-UFL)

• Flexibility in using a different external antenna for every application

• Small physical footprint and low profile for optimum fit in even the smallest of devices

• Mesh networking capability

• Easy-to-use low cost Development Kit

• Single source of support for HW and SW

• Worldwide license-free operation

1.5 Abbreviations and Acronyms

ADC Analog-to -Digital Converter

API Application Programming Interface

DC Direct Current

DTR Data Terminal Ready

EEPROM Electrically Erasable Programmable Read-Only Memory

ESD Electrostatic Discharge

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GPIO General Purpose Input/Output

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HAF High Frequency

HVAC Heating, Ventilating and Air Conditioning

HW Hardware

2

C Inter-Integrated Circuit

I

IEEE Institute of Electrical and Electrionics Engineers

IRQ Interrupt Request

ISM Industrial, Scientific and Medical radio band

Introduction

JTAG

Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface

LNA Low Noise Amplifier

MAC Medium Access Control layer

MCU

Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit
module

NRE Network layer

OEM Non-Recurring Engineering

OTA Over-The-Air upgrade

PA Power Amplifier

PCB Printed Circuit Board

PER Package Error Ratio

RAM Random Access Memory

RF Radio Frequency

RTS/CTS Request to Send/ Clear to Send

RX Receiver

SMA Surface Mount Assembly

SPI Serial Peripheral Interface

SW Software

TTM Time To Market

TX Transmitter

UART Universal Asynchronous Receiver/Transmitter

USART Universal Synchronous/Asynchronous Receiver/Transmitter

USB Universal Serial Bus

ZDK ZigBit Development Kit

ZigBee,
ZigBee PRO

Wireless networking standards targeted at low-power applications

802.15.4 The IEEE 802.15.4-2003 standard applicable to low-rate wireless Personal Area Network

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1.6 Related Documents

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[1] ZigBit™ 2.4 GHz Wireless Modules ATZB-24-B0/A2. Product datasheet. Atmel’s doc8226.pdf

[2]. ZigBit™ 700/800/900 MHz Wireless Modules ATZB-900-B. Product datasheet. Atmel’s doc8227.pdf

[3] ZigBit™ Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~01

[4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549F
AVR 04/06

[5] Atmel Low-Power Transceiver for ZigBee Applications. AT86RF230 datasheet. doc5131.pdf

[6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height.
http://www.hirose.co.jp/cataloge_hp/e32119372.pdf

[7] ZigBit™ Amp Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~02

[8] IEEE Std 802.15.4-2003 IEEE Standard for Information technology - Part 15.4 Wireless Medium
Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area
Networks (LR-WPANs)

[9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007

[10] BitCloud™ IEEE 802.15.4/ZigBee Software. Product User Guide. Atmel’s doc8199.pdf

Introduction

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2.1 Overview

0

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ZigBit™ Amp is an extended-range, low-power, high sensitivity IEEE 802.15.4/ZigBee OEM module,
which occupies less than a square inch of space. Based on a solid combination of Atmel's latest MCU
Wireless hardware platform, power amplifier and low-noise amplifier, the ZigBit Amp offers an
unmatched combination of superior radio performance, ultra-low power consumption and exceptional
ease of integration.

Figure 2-1. ATZB-A24-UFL/UN Block Diagram

Section 2

Zigbit™ Module Overview

VCC (1.8 - 3.6V)

IRQ

UART

USART/SPI

I2C

JTAG

ANALOG

ZigBit Amp modules contains Atmel's ATmega1281V Microcontroller [4] and AT86RF230 RF Trans­ceiver [5]. The module features 128K bytes flash memory and 8K bytes RAM.

The compact all-in-one-chip integration of output Power Amplifier and input Low-Noise Amplifier, along
with RF switches enables digital control of an external RF front-end to dramatically improve ZigBit's
range performance on signal transmission and increase its sensitivity. This ensures stable connectivity
with larger coverage area without significant increase in module size. The HF U.FL coaxial connector [6]
used in the ATZB-A24-UFL module enables the user to choose appropriate external antenna for every
type of application.

ZigBit Amp already contains a complete RF/MCU design with all the necessary passive components
included. The module can be easily mounted on a simple 2-layer PCB with a minimum of required exter­nal connection. Compared to a custom RF/MCUsolution, a module-based solution offers considerable
savings in development time and NRE cost per unit during the design, prototyping, and mass production
phases of product development.

ATmega1281

GPIO

SPI Bus

AT86RF230

RF

Transceiver

RF

I/O

PA

Antenna

SW SW

LNA

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Zigbit™ Module Overview

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To jumpstart evaluation and development, Atmel also offers a complete set of evaluation and develop­ment tools. The new ZigBit Amp Development Kit [7] (ATZB-DK-A24) comes with everything you need to
create custom applications featuring ZigBit Amp module.

The kit features MeshBean development boards with an easy-to-access extension connector for attach­ing third party sensors and other peripherals, and a JTAG connector for easy application uploading and
debugging.

The kit also includes reference applications to speed up application development, source code for hard­ware interface layer and reference drivers for the all the module interfaces, intuitive development
environment from Atmel, and comprehensive set of application notes and product tutorials.

ZigBit Amp modules comes bundled with BitCloud, a 2

nd

generation embedded software stack from
Atmel. BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and con­trol [7], [8], [9], and it provides an augmented set of APIs which, while maintaining 100% compliance with
the standard, offer extended functionality designed with developer's convenience and ease-of-use in
mind.

Depending on end-user design requirements, ZigBit Amp can operate as a self-contained sensor node,
where it would function as a single MCU, or it can be paired with a host processor driving the module
over a serial interface. In the former case, a user application may be used with the BitCloud software
allowing customization of embedded applications through BitCloud's C API.

In the latter case, the host processor controls data transmission and manages module peripherals via an
extensive set of SerialNet AT commands. Thus, no firmware customization is required for a successful
module design-in. Additionally, third-party sensors can be connected directly to the module, thus
expanding the existing set of peripheral interfaces.

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3.1 Electrical Characteristics

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3.1.1 Absolute Maximum Ratings

Section 3

Specifications

Table 3-1. Absolute Maximum Ratings

Voltage on any pin, except RESET with respect to Ground -0.5V VCC + 0.5V

DC Current per I/O Pin 40 mA

DC Current DVCC and DGND pins 300 mA

Input RF Level +5 dBm

Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no

3.1.2 Test Conditions

,

Table 3-2. Test conditions (unless otherwise stated) F = 2.45 GHz, VCC=3V, T

(1)(2)

Parameters Min Max

circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond
those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.

This is a stress rating only. Functional operation of the device at these or other conditions, beyond those
indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.

2. Attention! ZigBit AMP is an ESD-sensitive device. Precaution should be taken when handling the
device in order to prevent permanent damage.

=25°C

amb

Parameters Range Unit

Supply Voltage, V

Current Consumption: RX mode 23 mA

Current Consumption: TX mode

Current Consumption: Power-save mode

Notes: 1. The parameters are measured under the following conditions:

ZigBit™ 2.4 GHz Amplified Wireless Modules 3-7

CC

(1)

(1)

a) RMS, BitCloud Software is running at 4 MHz clock rate, DTR line management is turned off
b) All interfaces are set to the default state (see Pin Assignment Table)
c) Output TX power (when measuring consumption in TX mode) is +20dBm
d) JTAG is not connected

3.0 to 3.6 V

50 mA

< 6 µA

8228B–MCU Wireless–06/09

Current consumption actually depends on multiple factors, including but not limited to, the board design

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and materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends on
MCU load and/or peripherals used by an application.

3.1.3 RF Characteristics

Table 3-3. RF Characteristics

Frequency Band 2.4000 to 2.4835 GHz

Numbers of Channels 16

Channel Spacing 5 MHz

Transmitter Output Power Adjusted in 16 steps +10 to +20 dBm

Receiver Sensitivity

On-Air Data Rate 250 kbps

TX Output/ RX Input Nominal Impedance Unbalanced output 50 Ω

Range, outdoors

Specifications

Parameters Condition Range Unit

(1)

PER = 1% -104 dBm

With external 2.2 dBi

antenna

Up to 4000 m

Note: 1. Preliminary data

3.1.4 ATmega1281V Microcontroller Characteristics

Table 3-4. ATmega1281V Characteristics

Parameters Condition Range Unit

On-chip Flash Memory size 128K bytes

On-chip RAM size 8K bytes

On-chip EEPROM size 4K bytes

Operation Frequency 4 MHz

3.1.5 Module Interfaces characteristics

Table 3-5. Module Interfaces characteristics

Parameters Condition Range Unit

UART Maximum Baud Rate 38.4 kbps

ADC Resolution/ Conversion Time

In single conversion

mode

10/200 Bits/µs

ADC Input Resistance >1 MΩ

ADC Reference Voltage (VREF) 1.0 to VCC-3 V

ADC Input Voltage 0 - VREF V

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Table 3-5. Module Interfaces characteristics

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Parameters Condition Range Unit

I2C Maximum Clock 222 kHz

GPIO Output Voltage (High/Low) -10/ 5 mA 2.3/ 0.5 V

Real Time Oscillator Frequency 32.768 kHz

3.2 Physical/Environmental Characteristics and Outline

Parameters Value Comments

Size 38.0 x 13.5 x 2.0 mm ATZB-A24-UFL/U0

Operating Temperature Range -20°C to +70°C-40°C to +85°C operational

Operating Relative Humidity Range no more than 80%

Note: 1. Minor degration of clock stability may occur.

Figure 3-1. ATZB-A24-UFL/U0 Mechanical drawing

Specifications

(1)

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3.3 Pin Configuration

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Figure 3-2. ATZB-A24-UFL Pinout

Specifications

Figure 3-3. ATZB-A24-U0 Pinout

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Table 3-6. Pin descriptions

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Connector

Pin Pin Name Description I/O

1 SPI_CLK Reserved for stack operation

2 SPI_MISO Reserved for stack operation

3 SPI_MOSI Reserved for stack operation

4 GPIO0 General Purpose digital Input/Output 0

5 GPIO1 General Purpose digital Input/Output 1

6 GPIO2 General Purpose digital Input/Output 2

7 OSC32K_OUT 32.768 kHz clock output

8 RESET Reset input (active low)

9,22,23 DGND Digital Ground

RF clock output. When module is in active state, 4

10 CPU_CLK

11 I2C_CLK I

12 I2C_DATA I

13 UART_TXD UART receive input

14 UART_RXD UART transmit output

15 UART_RTS

16 UART_CTS

MHz signal is present on this line. While module is

in the sleeping state, clock generation is also

stopped

2

C Serial clock output

2

C Serial data input/output

(4)

.

(1)(2)(3)(4)(7)

(1)(2)(3)(4)(7)

RTS input (Request to send) for UART hardware

flow control. Active low

CTS output (Clear to send) for UART hardware

flow control. Active low

17 GPIO6 General Purpose digital Input/Output 6

18 GPIO7 General Purpose digital Input/Output 7

19 GPIO3 General Purpose digital Input/Output 3

20 GPIO4 General Purpose digital Input/Output 4

21 GPIO5 General Purpose digital Input/Output 5

24,25 D_VCC Digital Supply Voltage (V

26 JTAG_TMS JTAG Test Mode Select

27 JTAG_TDI JTAG Test Data Input

28 JTAG_TDO JTAG Test Data Output

29 JTAG_TCK JTAG Test Clock

(2)(3)(4)(6)

30 ADC_INPUT_3 ADC Input Channel 3

31 ADC_INPUT_2 ADC Input Channel 2

32 ADC_INPUT_1 ADC Input Channel 1

33 BAT

ADC Input Channel 0, used for battery level
measurement. This pin equals V

34 A_VREF Input/Output reference voltage for ADC I/O tri-state

(4)

(4)

(4)

(4)(5)

(4)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)(8)

(9)

)

CC

(2)(3)(4)(6)

(2)(3)(4)(6)

(2)(3)(4)(6)

(2)(3)(7)

(2)(3)(7)

(2)(3)(7)

/3.

CC

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(7)

I/O

I/O

I/O tri-state

I/O tri-state

I/O tri-state

I/O tri-state

I/O tri-state

I/O tri-state

I/O tri-state

I/O tri-state

I/O tri-state

Specifications

Default

State after

Power on

O

O

O

O tri-state

I tri-state

O tri-state

I tri-state

O tri-state

I

I

O

I

I tri-state

I tri-state

I tri-state

I tri-state

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Table 3-6. Pin descriptions

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Connector

Pin Pin Name Description I/O

35 AGND Analog ground

36 GPIO9/1_WR

General Purpose digital input/output 9 /

1-wire interface

(2)(3)(4)(7)

Specifications

Default

State after

Power on

I/O

37 UART_DTR

38 USART0_RXD USART/SPI Receive pin

39 USART0_TXD USART /SPI Transmit pin

40 USART0_EXTCLK USART/SPI External Clock

DTR input (Data Terminal Ready) for UART.

Active low

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)

(2)(3)(4)(7)(11)

I tri-state

I tri-state

O tri-state

I/O tri-state

41 GPIO8 General Purpose Digital Input/Output I/O tri-state

42 IRQ_7 Digital Input Interrupt request 7

43 IRQ_6 Digital Input Interrupt request 6

44,45,51,52,

53,56,57

DGND Digital ground

46,47 VRR Receiver supply voltage

48,50 RF GND RF Analog Ground

49 RFP_IO Differential RF Input/Output

54,55 VTT Transmitter supply voltage

(2)(3)(4)(7)

(2)(3)(4)(7)

(9)

(2)(3)(4)(7)

(10)

(9)

I tri-state

I tri-state

I/O

Notes: 1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex system

containing ZigBit Amp as its RF terminal unit), while UART_RXD pin, vice versa is for output.

2. Most of pins can be configured for general purpose I/O or for some alternate functions as described in
details in the ATmega1281V Datasheet [3].

3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pin
drivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [3]).

4. All digital pins are provided with protection diodes to D_VCC and DGND

5. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it is
used by BitCloud. However, this signal can be used if another peripheral or host processor requires

32.768 kHz clock, otherwise this pin can be disconnected.

6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and
flash burning. They can be used for A/D conversion if JTAGEN fuse is disabled.

7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines:
GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK, I2C_DATA,
UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2, ADC_INPUT_1,
BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6. Additionally, four
JTAG lines can be programmed with software as GPIO as well, but this requires changing the fuse bits
and will disable JTAG debugging.

8. With BitCloud, CTS pin can be configured to indicate sleep/active condition of the module thus provid­ing mechanism for power management of host processor. If this function is necessary, connection of
this pin to external pull-down resistor is recommended to prevent the undesirable transients during
module reset process.

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Specifications

01/12

9. Using ferrite bead and 1 µF capacitor located closely to the power supply pin is recommended, as
shown below.

10. Pins 48, 49 and 50 are featured for ATZB-A24-U0 module only.

11. In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input or
output pin.

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3.4 Mounting Information

The below diagrams show the PCB layout recommended for ZigBit Amp module. Neither via-holes nor
wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,
RF_GND pins should be grounded via several holes to be located right next to pins thus minimizing
inductance and preventing both mismatch and losses.

Figure 3-4. ATZB-A24-UFL/U0 PCB Recommended Layout, Top View

Specifications

3.5 Soldering Profile

The J-STD-020C-compliant soldering profile is recommended according to Table 3-7.

Table 3-7. Soldering profile

Time within 5°C of actual peak temperature 20s to 40s

Note: 1. The package is backward compatible with PB/Sn soldering profile.

(1)

Profile Feature Green package

Average ramp-up rate (217°C to peak) 3°C/s max

Preheat tempearture 175°C ± 25°C 180s max

Temperature maintained above 217°C 60s to 150s

Peak temperature range 260°C

Ramp-down rate 6°C/s max

Time within 25°C to peak temperature 8 minuts max

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3.6 Antenna Reference Design

Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors
are the board material and thickness, shields, the material used for enclosure, the board neighborhood,
and other components adjacent to antenna.

General Recommendations:

 Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.

 Placing high profile components next to antenna should be avoided.

 Having holes punched around the periphery of the board eliminates parasitic radiation from the board

edges also distorting antenna pattern.

 ZigBit Amp module should not be placed next to consumer electronics which might interfere with

ZigBit Amp's RF frequency band.

The board design should prevent propagation of microwave field inside the board material. Electromag­netic waves of high frequency may penetrate the board thus making the edges of the board radiate,
which may distort the antenna pattern. To eliminate this effect, metalized and grounded holes must be
placed around the board's edges.

Specifications

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4.1 Ordering Information

Section 5

Agency Certifications

This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM
manufacturer must comply with the following regulations:

1. The ATZBA24UFL modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID is not visible when the
module is installed inside another device, then the outside of the device into which the module is installed must also display a label
referring to the enclosed module. This exterior label can use wording such as the following:

Contains FCC ID: VW4A090668
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.
Any similar wording that expresses the same meaning may be used.

2. Designs using the ATZBA24U0 module must be labelled on an external visible area with the following information:

Contains FCC ID: VW4A090667
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.

WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own
FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below.
If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment
is installed must also display a label referring to the enclosed equipment.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation (FCC 15.19).
The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons
and must not be colocated or operating in conjunction with any other antenna or transmitter.

Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is
approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions
(FCC 2.1093) requires separate equipment authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense (FCC section 15.105).

Part Number Description

ATZB-A24-UFLR

ATZB-A24-U0R 2.4 GHz IEEE802.15.4/ZigBee Power Amplified OEM Module with Unbalanced RF output

Note: Tape&Reel quantity: 200

Section 4

Ordering Information

2.4 GHz IEEE802.15.4/ZigBee Power Amplified OEM Module with U.FL Antenna
Connector

ZigBit™ 2.4 GHz Amplified Wireless Modules 4-16

8228B–MCU Wireless–06/09

Headquarters International

The ATZBA24UFL, ATZBA24U0 Modules has been certified for use in European Union countries. If these modules are incorporated
into a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and lowvoltage/safety
standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the
R&TTE Directive.

Furthermore, the manufacturer must maintain a copy of the modules' documentation and ensure the final product does not exceed the
specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any of these
specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all
required standards.

IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials
"CE" taking the following form:
󾾠
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus.

The CE marking must be affixed visibly, legibly, and indelibly.

More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT
AND OF THE COUNCIL" on 9 March 1999 at section 12.

01/12

D

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8228B–MCU Wireless–06/09