ZigBit™ 700/800/900 MHz Wireless Modules
....................................................................................................................
ATZB-900-B0
Datasheet
8227C–MCU Wireless–06/09
ZigBit™ 700/800/900 MHz Wireless Modules 1-2
8227C–MCU Wireless–06/09
Section 1
1.1 Summary............................................................................................................................ 1-1
1.2 Applications........................................................................................................................ 1-1
1.3 Key Features...................................................................................................................... 1-2
1.4 Benefits.............................................................................................................................. 1-2
1.5 Abbreviations and Acronyms ............................................................................................. 1-2
1.6 Related Documents............................................................................................................1-3
Section 2
2.1 Overview............................................................................................................................ 2-1
Section 3
3.1 Electrical Characteristics.................................................................................................... 3-3
3.1.1 Absolute Maximum Ratings................................................................................. 3-3
3.1.2 Test Conditions.................................................................................................... 3-3
3.1.3 RF Characteristics ............................................................................................... 3-4
3.1.4 ATmega1281V Microcontroller Characteristics ................................................... 3-4
3.1.5 Module Interfaces characteristics ........................................................................ 3-5
3.2 Physical/Environmental Characteristics and Outline.......................................................... 3-5
3.3 Pin Configuration................................................................................................................ 3-6
3.4 Mounting Information .........................................................................................................3-9
3.5 Soldering Profile .. ... ... .... ... ... ... .... ...................................... .... ... ... ... .... ... .... ........................ 3-10
3.6 Antenna Reference Design....................................... .... ... .... ... ... ... .... ............................... 3-10
3.6.1 General recommendations ................................ .... ............................................ 3-11
Section 4
4.1 Ordering Information........................................................................................................ 4-12
ZigBit™ 700/800/900 MHz Wireless Modules 1-i
8227C–MCU Wireless–06/09
1.1 Summary
Section 1
Introduction
ZigBit™ 900 is an ultra-compact, exte nded range, low-power, high-sens itivity 784/868/915 MHz
IEEE 802.15.4/ZigBee
It is designed for wireless sensing, control and data acquisition applications. ZigBit modules eliminate
the need for costly and ti me-consum ing RF dev elopment, and sho rtens time t o market for a wide ran ge
of wireless applications.
This module is the latest addition to the ZigBit family also represented by 2.4 GHz modules ATZB- 24A2/B0 [1], and ATZB-A24-UFL/U0 [3].
1.2 Applications
ZigBit 900 module is compatible with robust IEEE 802.15.4/ZigBee stack that supports a self-healing,
self-organizing mesh network, while optimizing network traffic and minimizing power consumption. Atmel
offers two stack configurations: BitCloud and SerialNet. BitCloud is a ZigBee PRO certified software
development platform supporting r eliab le, s calab le, a nd secure wireless applications running on Atmel’s
ZigBit modules. SerialNet allows programming of the module via serial AT-command interface.
The applications include, but are not limited to:
•
Building automation & monitoring
– Lighting controls
– Wireless smoke and CO detectors
– Structural integrity monitoring
• HVAC monitoring & control
• Inventory management
• Environmental monitoring
• Security
• Water metering
• Industrial monitoring
– Machinery condition and performance monitoring
– Monitoring of plant system parameters such as temperature, pressure, flow, tank level, humidity,
vibration, etc.
• Automated meter reading (AMR)
®
OEM module, based on the innovative Atmel’s mixed-signal hardware platform.
ZigBit™ 700/800/900 MHz Wireless Modules 1-1
8227C–MCU Wireless–06/09
1.3 Key Features
• Ultra compact size (18.8 x 13.5 mm)
• High RX sensitivity (-110 dBm)
• Outperfor ming link budget (120 dB)
• Up to 11 dBm output power
• Very low power consumption (< 6 µA in Sleep mode)
• Ample memory resources (128K bytes of flash memory, 8K bytes RAM, 4K bytes EEPROM)
• Wide range of interfaces (both analog and digi tal):
– 9 spare GPIO, 2 spare IRQ lines
– 4 ADC lines + 1 line for supply voltage control (up to 9 lines with JTAG disabled)
– UART with C TS/RTS control
–USART
2
–I
– SPI
–1-Wire
– Up to 30 lines configurable as GPIO
• Capability to write own MAC address into the EEPROM
• Optional antenna reference designs
• IEEE 802.15.4 compliant transceiver
• 868 / 915 MHz band
• 784 MHz Chinese band
• BitCloud embedded software, including serial bootloader and AT command set
Introduction
C
1.4 Benefits
• Over 6 km (4 miles) outdoor line-of-sight range
• Small physical footprint and low profile for optimum fit in even the smallest of devices
• Extended battery life
• Mesh networking capability
• Easy-to-use low cost Evaluation Kit
• Single source of support for HW and SW
Note: 1. The module is to be certified
1.5 Abbreviations and Acronyms
ADC Analog-to -Digital Converter
API Application Programming Interface
BPSK Binary Phase-Shift Keying modulation scheme
DC Direct Current
DTR Data Terminal Ready
EEPROM Electrically Erasable Programmable Read-Only Memory
(1)
ESD Electrostatic Discharge
ZigBit™ 700/800/900 MHz Wireless Modules 1-2
8227C–MCU Wireless–06/09
GPIO General Purpose Input/Output
HVAC Heating, Ventila ting and Air Conditioning
HW Hardware
2
C Inter-Integrated Circuit
I
IEEE Institute of Electrical and Electrionics Engineers
IRQ Interrupt Request
ISM Industrial, Scientific and Medical radio band
JTAG
MAC Medium Access Contro l layer
MCU
O-QPSK Offset Quadrature Phase-Shift Keying modulation scheme
OEM Original Equipment Manufacturer
OTA Over-The-Air u pgrade
PCB Pri nte d Circuit Board
PER Package Error Ratio
Digital interface for debugging of embedded device, also known as IEEE 1149.1 standard
interface
Microcontroller Unit. In this document it also means the processor, which is the core of ZigBit
module
Introduction
RAM Random Access Memory
RF Radio Frequency
RTS/CTS Request to Send/ Clear to Send
RX Receiver
SMA Surface Mount Assembly
SPI Serial Peripheral Interface
SW Software
TTM Time To Market
TX Transmitter
UART Universal Asynchronous Receiver/Transmitter
USART Universal Synchronous/Asynchronous Receiver/Transmitter
USB Universal Serial Bus
ZDK ZigBit Development Kit
ZigBee,
ZigBee PRO
802.15.4 The IEEE 802.15.4-2006 standard applica ble to low-rate wireless Personal Area Network
Wireless networking standards targeted at low-power applications
1.6 Related Documents
[1] ZigBit™ 2.4 GHz Wireless Modules ATZB-24-A2/B0 Datasheet. Atmel’s doc8226.pdf
[2] ZigBit™ Development Kit. User Guide. MeshNetics Doc. S-ZDK-451 - TBD
[3] ZigBit™ Amplified 2.4 GHz Wireless Modules datasheet. Atmel’s doc8228.pdf
ZigBit™ 700/800/900 MHz Wireless Modules 1-3
8227C–MCU Wireless–06/09
Introduction
[4] Atmel 8-bit AVR Microcontroller with 64K/128K/256K Bytes In-System Programmable Flash. 2549F
AVR 04/06
[5] Atmel AT86RF212 Low Power 800/900 MHz Transceiver for IEEE 802.15 . 4b , Zigbee, an d ISM Applications. Preliminary specification
[6] Ultra Small Surface Mount Coaxial Connectors - Low Profile 1.9mm or 2.4mm Mated Height.
http://www.hirose.co.jp/cataloge_hp/e32119372.pdf
[7] ZigBit 900 Development Kit. User's Guide. MeshNetics Doc. S-ZDK-451~03 TBD
[8] IEEE Std 802.15.4-2006 IEEE Standard for Information technology - Part 15.4 Wireless Medium
Access Control (MAC) and Physical Layer (PHY) Specifications for Low-Rate Wireless Personal Area
Networks (LR-WPANs)
[9] ZigBee Specification. ZigBee Document 053474r17, October 19, 2007
[10] BitCloud™ IEEE 802.15.4/ZigBee Software. AVR2050: BitCloud User Guide. Atmel’s doc8199.pdf
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2.1 Overview
ZigBit 900 is an extended-range low-power, a low-power, high-sensitivity IEEE 802.15.4/ ZigBee-compliant OEM module, which occupies less than a square inch. Based on a solid combination of Atmel’s latest
MCU Wireless hardware platform [5], power amplifier and low-noise amplifier, the ZigBit 900 offers superior radio performance, ultra-low power consumption and exceptional ease of integration.
Figure 2-1. ATZB-900-B0 Block Diagram
Section 2
Zigbit™700/800/900 MHz Wireless Modules Overview
ZigBit 900 contains Atmel’s ATme ga1281V Mic rocontroller [4] an d AT86RF212 R F Transcei ver [5]. T he
module features 128 Kbytes flash memory and 8 Kbytes RAM.
The ZigBit 900 already contains a complete RF/MCU-related design with all the necessary passive components included. The module can be easily mounted on a simple 2-layer PCB with a minimum of
required external connection. Compared to a custom RF/MCU design, a module-based solution offers
considerable savings in development time and NRE cost per unit during the design, prototyping, and
mass production phases of pro du c t development.
To jumpstart evaluation and development, Atmel also offers a complete set of eva luation and development tools. The new ZigBit 900 Development Kit [7] comes with everything you need to create custom
applications featuring ZigBit 900 module.
The kit features MeshBean development boards (ATZB-EVB-900-SMA) with an easy-to-access extension connector for attaching third party sensors and other peripherals, and a JTAG connector for easy
application uploading and debugging.
The kit also includes refere nce appl ic atio ns to speed up application development, source code for hardware interface layer and reference drivers for the all the module interfaces, intuitive development
environment from Atmel, and comprehensive set of application notes and product documentation.
ZigBit™ 700/800/900 MHz Wireless Modules 2-1
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Zigbit™700/800/900 MHz Wireless Modules Overview
ZigBit 900 modules come bundled with BitCloud, a 2nd generation embedded software stack from Atmel.
BitCloud is fully compliant with ZigBee PRO and ZigBee standards for wireless sensing and control [8],
[9], [10] and it provides an augmented set of APIs which, while maintaining 100% compliance with the
standard, offer extended functionality designed with developer's convenience and ease-of-use in mind.
Depending on end-user design requirements, ZigBit 900 can operate as a self-contained sensor node,
where it would function as a single MCU, or it can be paired with a host processor driving the module
over a serial interface. In the former case, a u ser application may be used with the BitCloud softwa re
allowing customization of embedded applications through BitCloud’s C API.
In the latter case, the host processor controls data transmission and manages module perip herals via an
extensive set of SerialNet AT commands. Thus, no firmware customization is required for a successful
module design-in. Additionally, third-party sensors can be connected directly to the module, thus
expanding the existing set of peripheral interfaces.
ZigBit™ 700/800/900 MHz Wireless Modules 2-2
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3.1 Electrical Characteristics
3.1.1 Absolute Maximum Ratings
Section 3
Specifications
Table 3-1. Absolute Maximum Ratings
Voltage on any pin, except RESET with respect to Ground -0.5V V
DC Current per I/O Pin 40 mA
DC Current DVCC and DGND pins 300 mA
Input RF Level +5 dBm
Notes: 1. Absolute Maximum Ratings are the values beyond which damage to the device may occur. Under no
3.1.2 Test Conditions
Table 3-2. Test conditions (unless otherwise stated), VCC=3V, T
(1)(2)
Parameters Min Max
+0.5V
CC
circumstances must the absolute maximum ratings given in this table be violated. Stresses beyond
those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
This is a stress rating only. Functional operation of the device at these or other conditions, beyond those
indicated in the operational sections of this specification, is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. Attention! ZigBit 900 is an ESD-sensitive device. Precaution should be taken when handling the device
in order to prevent permanent damage.
=25C
amb
Parameters Condition Range Unit
Supply Voltage, V
Current Consumption: RX mode
Current Consumption: TX mode
Current Consumption: Power-save mode
Note: 1. Preliminary data
CC
(1)
(1)
PTX = 5 dBm 20 mA
(1)
1.8 to 3.6 V
15 mA
6µA
Current consumption actually depends on multi ple fact ors, incl uding but not limited to, the b oard desig n
and materials, BitCloud settings, network activity, EEPROM read/write operations. It also depends on
MCU load and/or peripherals used by an application.
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3.1.3 RF Characteristics
Table 3-3. RF Characteristics
Frequency Band
Number of Channels 15
Channel Spacing 2MHz
Transmitter Output Power -11 to +11 dBm
Receiver Sensitivity AWGN channel, PER = 1%
20 kbit/s
40 kbit/s
100 kbit/s
250 kbit/s
200 kbit/s
400 kbit/s -90
500 kbit/s -97
1000 kbit/s -92
On-Air Data Rate
(2)
(2)
(2)
(2)
Specifications
Parameters Condition Range Unit
779 to 787
PSDU length of 20 octets
PSDU length of 127 octets
BPSK modulation
O-QPSK modulation
868 to 868.6
902 to 928
-110
-108
-101
-100
-97
20 (at 868 MHz),
40 (at 915 MHz)
100 (at 868 MHz)
250 (at 915 MHz
and 784 MHz)
MHz
dBm
kbps
TX Output/ RX Input Nominal Impedance For balanced output 100
Range, outdoors
(1)
Notes: 1. Preliminary data
2. IEEE 802.15.4-2006 compliant
3.1.4 ATmega1281V Microcontroller Characteristics
Table 3-4. ATmega1281V Characteristics
Parameters Condition Range Unit
On-chip Flash Memory size 128 Kbytes
On-chip RAM size 8 Kbytes
On-chip EEPROM size 4 Kbytes
Operation Frequency 4 MHz
For balanced output 6 km
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3.1.5 Module Interfaces characteristics
Table 3-5. Module Interfaces characteristics
Parameters Condition Range Unit
UART Maximum Baud Rate 38.4 kbps
ADC Resolution/ Conversion Time
ADC Input Resistance >1 M
ADC Reference Voltage (VREF) 1.0 to VCC-3 V
ADC Input Vo ltage 0 - VREF V
I2C Maximum Clock 222 kHz
GPIO Output Voltage (High/Low) -10/ 5 mA, V
Real Time Oscillator Frequency 32.768 kHz
In the single
conversion mo de
=3V 2.3/ 0.5 V
CC
Specifications
10/200 Bits/µs
3.2 Physical/Environmental Characteristics and Outline
Parameters Value Comments
Size 18.8 x 13.5 x 2.0 mm ATZB-900-B0
Operating Temperature Range -20
Operating Relative Humidity Range no more than 80%
Note: 1. Minor degration of clock stability may occur.
Figure 3-1. ATZB-900-B0 Mechanical drawing
C to +70 C-40C to +85 C operational
(1)
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8227C–MCU Wireless–06/09
3.3 Pin Configuration
Figure 3-2. ATZB-900-B0 Pinout
Specifications
Table 3-6. Pin descriptions
Connector
Pin Pin Name Description I/O
1 SPI_CLK Reserved for stack operation
2 SPI_MISO Reserved for stack operation
3 SPI_MOSI Reserved for stack operation
4 GPIO0 General Purpose digital Input/Output 0
5 GPIO1 General Purpose digital Input/Output 1
6 GPIO2 General Purpose digital Input/Output 2
7 OSC32K_OUT 32.768 kHz clock output
8 RESET Reset input (active low)
9,22,23 DGND Digital Ground
RF clock output. When module is in active state,
10 CPU_CLK
11 I2C_CLK I
12 I2C_DATA I
13 UAR T_TXD UART transmit out put
14 UART_RXD UART receive input
4 MHz signal is present on this line. While module
is in the sleeping state, clock generation is also
stopped
2
C serial clock output
2
C serial clock input/output
(4)
.
(1)(2)(3)(4)(7)
(1)(2)(3)(4)(7)
(4)
(4)
(4)
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(4)(5)
(4)
(2)(3)(4)(7)
(2)(3)(4)(7)
Default
State after
Power on
O
I/O
I/O
I/O tri-state
I/O tri-state
I/O tri-state
O
O
O tri-state
I/O tri-state
O tri-state
I tri-state
15 UART_RTS
RTS input (Request To send) for UART hardw are
flow control. Active low
(2)(3)(4)(7)
I tri-state
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Table 3-6. Pin descriptions (Continued)
Connector
Pin Pin Name Description I/O
Specifications
Default
State after
Power on
16 UART_CTS
CTS output (Clear To send) for UART hardware
flow control. Active low
(2)(3)(4)(7)
17 GPIO6 General Purpose digital Input/Output 6
18 GPIO7 General Purpose digital Input/Output 7
19 GPIO3 General Purpose digital Input/Output 3
20 GPIO4 General Purpose digital Input/Output 4
21 GPIO5 General Purpose digital Input/Output 5
24,25 D_VCC Digital Supply Voltage (V
26 JTAG_TMS JTAG Test Mode Select
27 JTAG_TDI JTAG Test Data Input
28 JT AG_TDO JTAG Test Data Output
29 JTAG_TCK JTAG Test Clock
30 ADC_INPUT_3 ADC Input Channel 3
31 ADC_INPUT_2 ADC Input Channel 2
32 ADC_INPUT_1 ADC Input Channel 1
33 BAT
ADC Input Channel 0, used for battery level
measurement. This pin equals V
(2)(3)(4)(6)
(2)(3)(4)(6)
(2)(3)(4)(6)
(2)(3)(4)(6)
(2)(3)(7)
(2)(3)(7)
(2)(3)(7)
CC
CC
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(9)
)
(2)(3)(7)
/3.
O tri-state
I/O tri-state
I/O tri-state
I/O tri-state
I/O tri-state
I/O tri-state
I
I
O
I
I tri-state
I tri-state
I tri-state
I tri-state
34 A_VREF Input/Output reference voltage for ADC I/O tri-state
35 AGND Analog ground
36 GPIO_1WR 1-wire interface
(2)(3)(4)(7)
I/O
37 UART_DTR
38 USART0_RXD USART/SPI Receive pin
39 USART0_TXD USART /SPI Transmit pin
40 USART0_EXTCLK USART/SPI External Clock
41 GPIO8 General Pur pose Digital Input/Output 8
42 IRQ_7 Digital Input Interrupt request 7
43 IRQ_6 Digital Input Interrupt request 6
DTR input (Data Terminal Ready) for UART.
Active low
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
(2)(3)(4)(7)
I tri-state
I tri-state
O tri-state
I/O tri-state
I/O tri-state
I tri-state
I tri-state
44,46,48 RF GND RF Analog Ground
45 RFP_IO Differential RF Input/Output I/O
47 RFN_IO Differential RF Input/Output I/O
Notes: 1. The UART_TXD pin is intended for input (i.e. its designation as "TXD" implies some complex system
containing ZigBit 900 as its RF terminal unit), while UART_RXD pin, vice versa, is for output.
2. Most of pins can be configured for general purpose I/O or for some alter nate function s as described in
details in the ATmega1281V Datasheet [1].
3. GPIO pins can be programmed either for output, or for input with/without pull-up resistors. Output pin
drivers are strong enough to drive LED displays directly (refer to figures on pages 387-388, [1]).
4. All digital pins are provided with protection diodes to D_VCC and DGND
ZigBit™ 700/800/900 MHz Wireless Modules 3-7
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Specifications
5. It is strongly recommended to avoid assigning an alternate function for OSC32K_OUT pin because it is
used by BitCloud. However, this signal can be used if another peripheral or host processor req uires
32.768 kHz clock, otherwise this pin can be disconnecte d .
6. Normally, JTAG_TMS, JTAG_TDI, JTAG_TDO, JTAG_TCK pins are used for on-chip debugging and
flash burning. They can be used for A/D conversion if JTAGEN fuse is disabled.
7. The following pins can be configured with the BitCloud software to be general-purpose I/O lines:
GPIO0, GPIO1, GPIO2, GPIO3, GPIO4, GPIO5, GPIO6, GPIO7, GPIO8, GPIO_1WR, I2C_CLK,
I2C_DATA, UART_TXD, UART_RXD, UART_RTS, UART_CTS, ADC_INPUT_3, ADC_INPUT_2,
ADC_INPUT_1, BAT, UART_DTR, USART0_RXD, USART0_TXD, USART0_EXTCLK, IRQ_7, IRQ_6.
Additionally, four JTAG lines can be programmed with software as GPIO as well, but this requires
changing the fuse bits and will disable JTAG debugging.
8. With BitCloud, CTS pin can be configured to indicate sleep/a ctive condition of the module thus providing mechanism for power management of host processor. If this function is necessary, connecti on of
this pin to external pull-down resistor is recommended to prevent the undesirable transients during
module reset process.
9. Using ferrite bead and 1 µF capacitor located closely to the power supply pin is recommended, as
shown below.
10.In SPI mode, USART0_EXTCLK is output. In USART mode, this pin can be configured as either input or
output pin.
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Figure 3-3. Typical Reference Schematic
Specifications
3.4 Mounting Information
The below diagrams show the PCB layout recommended for ZigBit 900 module. Neither via-holes nor
wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,
RF_GND pins should be ground ed via sev eral holes to be locat ed right n ext to the pins thus minim izing
inductance and preventing both mismatch and losses.
ZigBit™ 700/800/900 MHz Wireless Modules 3-9
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Figure 3-4. ATZB-900-B0 PCB Recommended Layout, Top View
Specifications
3.5 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended, as given below.
Table 3-7. Soldering Profile
Average ramp-up rate (217 °C to peak) 3 °C/s max.
Preheat temperature 175 °C ± 25 °C 180 s max.
Temperature maintained above 217 °C 60 s to 150 s
Time within 5 °C of actual peak temperature 20 s to 40 s
Peak temperature range 6 °C/s max.
Ramp-down rate 8 minutes max.
Note: 1. The package is backward compatible with Pb/Sn soldering profile
3.6 Antenna Reference Design
(1)
Profile Feature Green Package
This section presents PCB design which may be used to combine ZigBit 900 with an external antenna
This antenna reference designs is recommended for successful design-in.
ZigBit™ 700/800/900 MHz Wireless Modules 3-10
8227C–MCU Wireless–06/09
Specifications
The external antenna used for this product must provide a separation distance of at least 20 cm from all persons
and must not be colocated or operating in conjunction with any other antenna or transmitter.
Figure 3-5. FCC/CE compliant RF reference design with RP-SMA connector recommended for ATZB-900-B0
Multiple factors affect proper antenna match, hence, affecting the antenna pattern. The particular factors
are the board material and thickness, shields, the material used for enclosure, the board neighborhood,
and other components adjacent to antenna.
3.6.1 General recommendations
Metal enclosure should not be used. Using low profile enclosure might also affect antenna tuning.
Placing high profile components next to antenna should be avoided.
Having holes punched around the periphery of the board eliminates parasitic radiation from the board
edges also distorting antenna pattern.
ZigBit 900 module should not be placed next to the consumer electronics which might interfere with
ZigBit 900's RF frequency band.
The board design should prevent propagation of microwave field inside the board material. Electromagnetic waves of high frequency may penetrate the board thus making the edges of the board radiate,
which may distort the antenna patt ern. To el iminate this effect, me talized a nd grounded holes must be
placed around the board's edges.
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4.1 Ordering Information
Agency Certifications
Section 5
5.1 UNITED STATES (FCC)
This equipment complies with Part 15 of the FCC rules and regulations. To fulfill FCC Certification requirements, an OEM
manufacturer must comply with the following regulations:
1. The modular transmitter must be labelled with its own FCC ID number, and, if the FCC ID is not visible when the module is
installed inside another device, then the outside of the device into which the module is installed must also display a label referring to
the enclosed module. This exterior label can use wording such as the following:
Contains FCC ID: VW4A090666
The enclosed device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (i.) this device may
not cause harmful interference and (ii.) this device must accept any interference received, including interference that may cause
undesired operation.
Any similar wording that expresses the same meaning may be used.
2. To be used with the ATZB900B0 module, the external antennas have been tested and approved which are specified in here
below. The ATZB900B0 Module may be integrated with other custom design antennas which OEM installer must authorize following
the FCC 15.21 requirements. If there are major deviations on the custom design antenna, then the product which carries the
ATZB900B0 module has to be recertified by the OEM of the end product.
WARNING: The Original Equipment Manufacturer (OEM) must ensure that the OEM modular transmitter must be labeled with its own
FCC ID number. This includes a clearly visible label on the outside of the final product enclosure that displays the contents shown below.
If the FCC ID is not visible when the equipment is installed inside another device, then the outside of the device into which the equipment
is installed must also display a label referring to the enclosed equipment.
IMPORTANT: This equipment complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device
may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation (FCC 15.19).
The internal / external antenna(s) used for this mobile transmitter must provide a separation distance of at least 20 cm from all persons
and must not be colocated or operating in conjunction with any other antenna or transmitter.
Installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. This device is
approved as a mobile device with respect to RF exposure compliance, and may only be marketed to OEM installers. Use in portable exposure conditions
(FCC 2.1093) requires separate equipment authorization.
IMPORTANT: Modifications not expressly approved by this company could void the user's authority to operate this equipment (FCC section 15.21).
IMPORTANT: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to Part 15 of the FCC Rules.
These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment.
This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may
cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference in which
case the user will be required to correct the interference at his own expense (FCC section 15.105).
Part Number Description
ATZB-900-B0R
Note: 1. Tape and Reel quantity: 200
(1)
Section 4
Ordering Information
783/868/915 MHz IEEE802.15.4/ZigBee Wireless Module w/ Balanced RF Port
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Headquarters International
5.2. EUROPEAN UNION (ETSI)
The ATZB900B0 Modules has been certified for use in European Union countries. If the ATZB900B0 Modules are incorporated into
a product, the manufacturer must ensure compliance of the final product to the European harmonized EMC and lowvoltage/safety
standards. A Declaration of Conformity must be issued for each of these standards and kept on file as described in Annex II of the
R&TTE Directive.
Furthermore, the manufacturer must maintain a copy of the ATZB900B0 Modules documentation and ensure the final product does
not exceed the specified power ratings, antenna specifications, and/or installation requirements as specified in the user manual. If any
of these specifications are exceeded in the final product, a submission must be made to a notified body for compliance testing to all
required standards.
IMPORTANT: The 'CE' marking must be affixed to a visible location on the OEM product. The CE mark shall consist of the initials
"CE" taking the following form:
The CE marking must have a height of at least 5mm except where this is not possible on account of the nature of the apparatus.
The CE marking must be affixed visibly, legibly, and indelibly.
More detailed information about CE marking requirements you can find at "DIRECTIVE 1999/5/EC OF THE EUROPEAN PARLIAMENT
AND OF THE COUNCIL" on 9 March 1999 at section 12.
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8227C–MCU Wireless–06/09
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