Microchip USB7216 User Manual

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USB7216

6-Port USB 3.2 Gen 2 Type-C® Controller Hub

Highlights

• 6-Port USB Smart Hub with:

- Native USB Gen 2 Type-C® support on downstream port 1

- Three Standard USB 3.2 Gen 2 downstream ports

- Two Standard USB 2.0 downstream ports

- Internal Hub Feature Controller enables:

-USB to I2C/SPI/I2S/GPIO bridge endpoint support

-USB to internal hub register write and read

• USB Link Power Management (LPM) support

• Programming of firmware image to external SPI memory device from USB host

• USB-IF Battery Charger revision 1.2 support on downstream ports (DCP, CDP, SDP)

• Enhanced OEM configuration options available through either OTP or external SPI memory

• Available in 100-pin (12mm x 12mm) VQFN RoHS compliant package

• Commercial and industrial grade temperature support

Target Applications

• Standalone USB Hubs

• Laptop Docks

• PC Motherboards

• PC Monitor Docks

• Multi-function USB 3.2 Gen 2 Peripherals

Key Benefits

• USB 3.2 Gen 2 compliant 10 Gbps, 5 Gbps, 480 Mbps, 12 Mbps, and 1.5Mbps operation

- 5V tolerant USB 2.0 pins

- 1.21V tolerant USB 3.2 Gen 2 pins

- Integrated termination and pull-up/down resistors

• Native USB Type-C Support

- Type-C CC Pin with integrated Rp and Rd resistors

- Integrated multiplexer on USB Type-C enabled

ports. USB 3.2 Gen 2 PHYs are disabled until a valid Type-C attach is detected, saving idle power.

- Control for external VCONN supply

• Supports battery charging of most popular battery powered devices on all ports

- USB-IF Battery Charging rev. 1.2 support

(DCP, CDP, SDP)

- Apple

- Chinese YD/T 1591-2006/2009 charger emulation

- European Union universal mobile charger support

- Supports additional portable devices

portable product charger emulation

• On-chip Microcontroller

- manages I/Os, VBUS, and other signals

• 96kB RAM, 256kB ROM

• 8kB One-Time-Programmable (OTP) ROM

- Includes on-chip charge pump

• Configuration programming via OTP Memory, SPI external memory, or SMBus

• FlexConnect

- The roles of the upstream and all downstream

ports are reversible on command

• Multi-Host Endpoint Reflector

- Integrated host-controller endpoint reflector via

CDC/NCM device class for automotive applications

• USB Bridging

- USB to I2C, SPI, I2S, and GPIO

• PortSwap

- Configurable USB 2.0 differential pair signal swap

• PHYBoost

- Programmable USB transceiver drive strength for

recovering signal integrity

• VariSense

- Programmable USB receive sensitivity

• USB Power Delivery Billboard Device Support

- Internal port can enumerate as a Power Delivery

Billboard device to communicate Power Delivery Alternate Mode negotiation failure cases to host

• Compatible with Microsoft Windows 10, 8, 7, XP, Apple OS X 10.4+, and Linux hub drivers

• Optimized for low-power operation and low thermal dissipation

• 100-pin VQFN package (12mm x 12mm)

* USB Type-C® and USB-C® are registered trademarks of USB

Implementers Forum.

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 1

USB7216

TO OUR VALUED CUSTOMERS

It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and enhanced as new volumes and updates are introduced.

If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via E-mail at docerrors@microchip.com or fax the Reader Response Form in the back of this data sheet to (480) 792-4150. We welcome your feedback.

Most Current Data Sheet

To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:

http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page. The last character of the literature number is the version number, (e.g., DS30000A is version A of document DS30000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are using.

Customer Notification System

DS00003143B-page 2  2018 - 2020 Microchip Technology Inc.

USB7216

1.0 PREFACE

1.1 General Terms

TABLE 1-1: GENERAL TERMS

Term Description

ADC Analog-to-Digital Converter

Byte 8 bits

CDC Communication Device Class

CSR Control and Status Registers

DFP Downstream Facing Port

DWORD 32 bits

EOP End of Packet

EP Endpoint

FIFO First In First Out buffer

FS Full-Speed

FSM Finite State Machine

GPIO General Purpose I/O

HS Hi-Speed

HSOS High Speed Over Sampling

Hub Feature Controller The Hub Feature Controller, sometimes called a Hub Controller for short is the internal

processor used to enable the unique features of the USB Controller Hub. This is not to be confused with the USB Hub Controller that is used to communicate the hub status back to the Host during a USB session.

C Inter-Integrated Circuit

LS Low-Speed

lsb Least Significant Bit

LSB Least Significant Byte

msb Most Significant Bit

MSB Most Significant Byte

N/A Not Applicable

NC No Connect

OTP One Time Programmable

PCB Printed Circuit Board

PCS Physical Coding Sublayer

PHY Physical Layer

PLL Phase Lock Loop

RESERVED Refers to a reserved bit field or address. Unless otherwise noted, reserved bits must

always be zero for write operations. Unless otherwise noted, values are not guaranteed when reading reserved bits. Unless otherwise noted, do not read or write to reserved addresses.

SDK Software Development Kit

SMBus System Management Bus

UFP Upstream Facing Port

UUID Universally Unique IDentifier

WORD 16 bits

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USB7216

1.2 Buffer Types

TABLE 1-2: BUFFER TYPES

Buffer Type Description

I Input.

IS Input with Schmitt trigger.

O12 Output buffer with 12 mA sink and 12 mA source.

OD12 Open-drain output with 12 mA sink

PU 50 μA (typical) internal pull-up. Unless otherwise noted in the pin description, internal pull-

PD 50 μA (typical) internal pull-down. Unless otherwise noted in the pin description, internal

ICLK Crystal oscillator input pin

OCLK Crystal oscillator output pin

I/O-U Analog input/output defined in USB specification.

I-R RBIAS.

A Analog.

AIO Analog bidirectional.

P Power pin.

ups are always enabled.

Internal pull-up resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive signals external to the device. When connected to a load that must be pulled high, an external resistor must be added.

pull-downs are always enabled.

Internal pull-down resistors prevent unconnected inputs from floating. Do not rely on internal resistors to drive signals external to the device. When connected to a load that must be pulled low, an external resistor must be added.

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USB7216

1.3 Pin Reset States

The pin reset state definitions are detailed in Table 1-3. Refer to Section 3.1, Pin Assignments for details on individual pin reset states.

TABLE 1-3: PIN RESET STATE LEGEND

Symbol Description

AI Analog input

AIO Analog input/output

AO Analog output

PD Hardware enables pull-down

PU Hardware enables pull-up

Y Hardware enables function

Z Hardware disables output driver (high impedance)

PU Hardware enables internal pull-up

PD Hardware enables internal pull-down

1.4 Reference Documents

1. Universal Serial Bus Revision 3.2 Specification, http://www.usb.org

2. Battery Charging Specification, Revision 1.2, Dec. 07, 2010, http://www.usb.org

3. I

C-Bus Specification, Version 1.1, http://www.nxp.com/documents/user_manual/UM10204.pdf

4. I

S-Bus Specification, http://www.sparkfun.com/datasheets/BreakoutBoards/I2SBUS.pdf

5. System Management Bus Specification, Version 1.0, http://smbus.org/specs

Note: Additional USB7216 resources can be found on the Microchip USB7216 product page at www.micro-

chip.com/USB7216.

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 5

USB7216

2.0 INTRODUCTION

2.1 General Description

The Microchip USB7216 hub is a low-power, OEM configurable, USB 3.2 Gen 2 hub controller with 6 downstream ports and advanced features for embedded USB applications. The USB7216 is fully compliant with the Universal Serial Bus Revision 3.2 Specification and USB 2.0 Link Power Management Addendum. The USB7216 supports 10 Gbps SuperSpeed+ (SS+), 5 Gbps SuperSpeed (SS), 480 Mbps Hi-Speed (HS), 12 Mbps Full-Speed (FS), and 1.5 Mbps LowSpeed (LS) USB downstream devices on four standard USB 3.2 Gen 2 downstream ports and only legacy speeds (HS/ FS/LS) on two standard USB 2.0 downstream ports.

The USB7216 is a standard USB 3.2 Gen 2 hub that supports native basic Type-C with integrated CC logic on downstream port 1. The downstream Type-C port includes an internal USB 3.2 Gen 2 multiplexer; no external multiplexer is required for Type-C support.

The USB7216 supports the legacy USB speeds (HS/FS/LS) through a dedicated USB 2.0 hub controller that is the culmination of seven generations of Microchip hub feature controller design and experience with proven reliability, interoperability, and device compatibility. The SuperSpeed hub controller operates in parallel with the USB 2.0 controller, decoupling the 10/5 Gbps SS+/SS data transfers from bottlenecks due to the slower USB 2.0 traffic.

The USB7216 enables OEMs to configure their system using “Configuration Straps.” These straps simplify the configuration process assigning default values to USB 3.2 Gen 2 ports and GPIOs. OEMs can disable ports, enable battery charging and define GPIO functions as default assignments on power up removing the need for OTP or external SPI ROM.

The USB7216 supports downstream battery charging. The USB7216 integrated battery charger detection circuitry supports the USB-IF Battery Charging (BC1.2) detection method and most Apple devices. The USB7216 provides the battery charging handshake and supports the following USB-IF BC1.2 charging profiles:

• DCP: Dedicated Charging Port (Power brick with no data)

• CDP: Charging Downstream Port (1.5A with data)

• SDP: Standard Downstream Port (0.5A[USB 2.0]/0.9A[USB 3.2] with data)

Additionally, the USB7216 includes many powerful and unique features such as:

The Hub Feature Controller, an internal USB device dedicated for use as a USB to I external circuits or devices to be monitored, controlled, or configured via the USB interface.

Multi-Host Endpoint Reflector, which provides unique USB functionality whereby USB data can be “mirrored” between two USB hosts (Multi-Host) in order to perform a single USB transaction.This capability is fully covered by Microchip intellectual property (U.S. Pat. Nos. 7,523,243 and 7,627,708) and is instrumental in enabling Apple CarPlay the Apple iPhone

FlexConnect, which provides flexible connectivity options. One of the USB7216’s downstream ports can be reconfigured to become the upstream port, allowing master capable devices to control other devices on the hub.

PortSwap, which adds per-port programmability to USB differential-pair pin locations. PortSwap allows direct alignment of USB signals (D+/D-) to connectors to avoid uneven trace length or crossing of the USB differential signals on the PCB.

PHYBoost, which provides programmable levels of Hi-Speed USB signal drive strength in the downstream port transceivers. PHYBoost attempts to restore USB signal integrity in a compromised system environment. The graphic on the right shows an example of Hi-Speed USB eye diagrams before and after PHYBoost signal integrity restoration. in a compromised system environment.

VariSense, which controls the Hi-Speed USB receiver sensitivity enabling programmable levels of USB signal receive sensitivity. This capability allows operation in a sub-optimal system environment, such as when a captive USB cable is used.

Port Split, which allows for the USB 3.2 Gen 2 and USB 2.0 portions of downstream ports 2, 3, and 4 in Configuration 1 and downstream port 4 (only) in Configuration 2 to operate independently and enumerate two separate devices in parallel in special applications.

USB Power Delivery Billboard Device, which allows an internal device to enumerate as a Billboard class device when a Power Delivery Alternate Mode negotiation has failed. The Billboard device will enumerate temporarily to the host PC when a failure occurs, as indicated by a digital signal from an external Power Delivery controller.

becomes a USB Host.

C/SPI/GPIO interface that allows

™

, where

DS00003143B-page 6  2018 - 2020 Microchip Technology Inc.

USB7216

Hub Con troller Lo gic

I2C/SPI

25 Mhz

USB3 USB2

P5 ‘A’

USB7216

+3.3 V

VCORE

PHY2PHY1

PHY2

‘B’

PHY1

‘A’

P1 ‘C’

P2 ‘A’

PHY3 PHY3

P3 ‘A’

PHY4 PHY4

P4 ‘A’

PHY5 PHY5

P6 ‘A’

PHY6

Hub Feature Controller

GPIO SMB

OTP

SPI I2S

Mux

HFC PHY

PHY0PHY0

P0 ‘B’

The USB7216 can be configured for operation through internal default settings. Custom OEM configurations are supported through external SPI ROM or OTP ROM. All port control signal pins are under firmware control in order to allow for maximum operational flexibility and are available as GPIOs for customer specific use.

The USB7216 is available in commercial (0°C to +70°C) and industrial (-40°C to +85°C) temperature range. An internal block diagram of the USB7216 in an upstream Type-B application is shown in Figure 2-1.

FIGURE 2-1: USB7216 INTERNAL BLOCK DIAGRAM - UPSTREAM TYPE-B APPLICATION

Note: All port numbering in this document is LOGICAL port numbering with the device in the default configuration.

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 7

LOGICAL port numbering is the numbering as communicated to the USB host. It is the end result after any port number remapping or port disabling. The PHYSICAL port number is the port number with respect to the physical PHY on the chip. PHYSICAL port numbering is fixed and the settings are not impacted by LOGICAL port renumbering/remapping. Certain port settings are made with respect to LOGICAL port numbering, and other port settings are made with respect to PHYSICAL port numbering. Refer to the “Configuration of USB7202/USB7206/USB725x” application note for details on the LOGICAL vs. PHYSICAL mapping and additional configuration details.

USB7216

Thermal slug connects to VSS

1009998979695949392

9089888786

8180797877

Microchip

USB7216

(Top View 100-VQFN)

RESET_N

DP1_VBUS_MON

PF31

DP1_CC1

USB3DN_RXDM1A

USB3DN_RXDP1A

VCORE

USB3DN_TXDM1A

USB3DN_TXDP1A

USB2DN_DM1/PRT_DIS_M1

PF30

USB3DN_RXDM1B

USB2DN_DP1/PRT_DIS_P1

USB3DN_RXDP1B

VCORE

USB3DN_TXDM1B

USB3DN_TXDP1B

USB2DN_DM5/PRT_DIS_M5

USB2DN_DP5/PRT_DIS_P5

DP1_CC2

CFG_STRAP1

CFG_STRAP2

CFG_STRAP3

TESTEN

VCORE

USB2DN_DP2/PRT_DIS_P2

USB3DN_TXDP3

USB2DN_DM3/PRT_DIS_M3

VCORE

USB3DN_TXDM3

USB2DN_DM2/PRT_DIS_M2

USB2DN_DP3/PRT_DIS_P3

USB3DN_RXDM2

VCORE

USB3DN_TXDM2

USB3DN_TXDP2

VDD33

USB3DN_RXDP2

PF9

USB3DN_RXDP3

USB2DN_DM6/PRT_DIS_M6

USB3DN_RXDM3

PF3

VDD33

PF5

PF4

PF6

PF8

PF7

USB2DN_DP6/PRT_DIS_P6

PF17

SPI_D3/PF25

SPI_D0/CFG_BC_E N/PF22

SPI_CLK/PF21

VDD33

SPI_D1/PF23

PF19

PF26

TEST3

SPI_CE_N/CFG_NON_REM/PF20

TEST1

PF10

PF13

VDD33

TEST2

SPI_D2/PF24

PF18

PF15

PF16

VDD33

VCORE

PF12

PF29

PF11

PF14

PF27

PF28

VCORE

USB3DN_TXDM4

USB3DN_TXDP4

USB2DN_DM4/PRT_DIS_M4

USB2DN_DP4/PRT_DIS_P4

VBU S_MO N_UP

VDD33

USB3UP_TXDM

USB3UP_TXDP

USB2UP_DM

USB2UP_DP

VDD33

USB3DN_RXDM4

USB3DN_RXDP4

RBIAS

VDD33

XTALI/CLK_IN

XTALO

ATEST

USB3UP_R XDM

USB3UP_R XDP

VCORE

3.0 PIN DESCRIPTIONS

3.1 Pin Assignments

FIGURE 3-1: USB7216 100-VQFN PIN ASSIGNMENTS

Note: Configuration straps are identified by an underlined symbol name. Signals that function as configuration

straps must be augmented with an external resistor when connected to a load.

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USB7216

Pin Num Pin Name Reset Pin Num Pin Name Reset

1 RESET_N Z 51 PF10 PD

2 PF30 Z 52 PF11 PD

3 PF31 Z 53 VDD33 Z

4 DP1_VBUS_MON AI 54 PF12 PD

5 USB2DN_DP1/PRT_DIS_P1 AIO PD 55 VCORE Z

6 USB2DN_DM1/PRT_DIS_M1 AIO PD 56 PF13 PD

7 USB3DN_TXDP1A AO PD 57 PF14 PD

8 USB3DN_TXDM1A AO PD 58 PF15 PD

9 VCORE Z 59 PF16 PD

10 USB3DN_RXDP1A AI PD 60 PF17 PD

11 USB3DN_RXDM1A AI PD 61 PF18 Z

12 DP1_CC1 AI 62 VDD33 Z

13 DP1_CC2 AI 63 TEST1 Z

14 USB2DN_DP5/PRT_DIS_P5 AIO PD 64 TEST2 Z

15 USB2DN_DM5/PRT_DIS_M5 AIO PD 65 TEST3 Z

16 USB3DN_TXDP1B AO PD 66 PF19 Z

17 USB3DN_TXDM1B AO PD 67 VDD33 Z

18 VCORE Z 68 SPI_CLK/PF21 Z

19 USB3DN_RXDP1B AI PD 69 SPI_CE_N/CFG_NON_REM/PF20 PU

20 USB3DN_RXDM1B AI PD 70 SPI_D0/CFG_BC_EN/PF22 Z

21 CFG_STRAP1 Z 71 SPI_D1/PF23 Z

22 CFG_STRAP2 Z 72 SPI_D2/PF24 Z

23 CFG_STRAP3 Z 73 SPI_D3/PF25 Z

24 TESTEN Z 74 PF29 Z

25 VCORE Z 75 PF26 Z

26 VDD33 Z 76 PF27 Z

27 USB2DN_DP2/PRT_DIS_P2 AIO PD 77 PF28 Z

28 USB2DN_DM2/PRT_DIS_M2 AIO PD 78 VCORE Z

29 USB3DN_TXDP2 AO PD 79 VDD33 Z

30 USB3DN_TXDM2 AO PD 80 VBUS_MON_UP AI

31 VCORE Z 81 USB2DN_DP4/PRT_DIS_P4 AIO PD

32 USB3DN_RXDP2 AI PD 82 USB2DN_DM4/PRT_DIS_M4 AIO PD

33 USB3DN_RXDM2 AI PD 83 USB3DN_TXDP4 AO PD

34 USB2DN_DP3/PRT_DIS_P3 AIO PD 84 USB3DN_TXDM4 AO PD

35 USB2DN_DM3/PRT_DIS_M3 AIO PD 85 VCORE Z

36 USB3DN_TXDP3 AO PD 86 USB3DN_RXDP4 AI PD

37 USB3DN_TXDM3 AO PD 87 USB3DN_RXDM4 AI PD

38 VCORE Z 88 VDD33 Z

39 USB3DN_RXDP3 AI PD 89 USB2UP_DP AIO Z

40 USB3DN_RXDM3 AI PD 90 USB2UP_DM AIO Z

41 USB2DN_DM6/PRT_DIS_M6 AIO PD 91 USB3UP_TXDP AO PD

42 USB2DN_DP6/PRT_DIS_P6 AIO PD 92 USB3UP_TXDM AO PD

43 VDD33 Z 93 VCORE Z

44 PF3 Z 94 USB3UP_RXDP AI PD

45 PF4 Z 95 USB3UP_RXDM AI PD

46 PF5 Z 96 ATEST AO

47 PF6 Z 97 XTALO AO

48 PF7 Z 98 XTALI/CLK_IN AI

49 PF8 Z 99 VDD33 Z

50 PF9 Z 100 RBIAS AI

Exposed Pad (VSS) must be connected to ground.

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USB7216

3.2 Pin Descriptions

This section contains descriptions of the various USB7216 pins. The “_N” symbol in the signal name indicates that the active, or asserted, state occurs when the signal is at a low voltage level. For example, RESET_N indicates that the reset signal is active low. When “_N” is not present after the signal name, the signal is asserted when at the high voltage level.

The terms assertion and negation are used exclusively. This is done to avoid confusion when working with a mixture of “active low” and “active high” signal. The term assert, or assertion, indicates that a signal is active, independent of whether that level is represented by a high or low voltage. The term negate, or negation, indicates that a signal is inactive.

The “If Unused” column provides information on how to terminate pins if they are unused in a customer design.

Buffer type definitions are detailed in Section 1.2, Buffer Types.

TABLE 3-1: PIN DESCRIPTIONS

Name Symbol

Upstream USB

3.2 Gen 2 TX D+

Upstream USB

3.2 Gen 2 TX D-

Upstream USB

3.2 Gen 2 RX D+

Upstream USB

3.2 Gen 2 RX D-

Downstream

Port 1 USB 3.2

Gen 2 TX D+ Orientation A

Downstream

Port 1 USB 3.2

Gen 2 TX D- Ori-

entation A

USB3DN_TXDP1A I/O-U Downstream USB Type-C

USB3DN_TXDM1A I/O-U Downstream USB Type-C “Orientation A”

Buffer

Type

USB 3.2 Gen 2 Interfaces

USB3UP_TXDP I/O-U Upstream USB 3.2 Gen 2 Transmit Data

Plus.

USB3UP_TXDM I/O-U Upstream USB 3.2 Gen 2 Transmit Data

Minus.

USB3UP_RXDP I/O-U Upstream USB 3.2 Gen 2 Receive Data

Plus.

USB3UP_RXDM I/O-U Upstream USB 3.2 Gen 2 Receive Data

Minus.

SuperSpeed+ Transmit Data Plus, port 1.

SuperSpeed+ Transmit Data Minus, port 1.

Description If Unused

“Orientation A”

Float

Weak pulldown to GND

Float

Downstream

Port 1 USB 3.2

Gen 2 RX D+ Orientation A

Downstream

Port 1 USB 3.2

Gen 2 RX DOrientation A

Downstream

Port 1 USB 3.2

Gen 2 TX D+ Orientation B

DS00003143B-page 10  2018 - 2020 Microchip Technology Inc.

USB3DN_RXDP1A I/O-U Downstream USB Type-C “Orientation A”

SuperSpeed+ Receive Data Plus, port 1.

USB3DN_RXDM1A I/O-U Downstream USB Type-C “Orientation A”

SuperSpeed+ Receive Data Minus, port 1.

USB3DN_TXDP1B I/O-U Downstream USB Type-C “Orientation B”

SuperSpeed+ Transmit Data Plus, port 1.

Weak pulldown to GND

Float

TABLE 3-1: PIN DESCRIPTIONS (CONTINUED)

USB7216

Name Symbol

Downstream

Port 1 USB 3.2

Gen 2 TX D-

Orientation B

Downstream

Port 1 USB 3.2

Gen 2 RX D+

Orientation B

Downstream

Port 1 USB 3.2

Gen 2 RX D-

Orientation B

Downstream

Ports 2-4 USB

3.2 Gen 2 TX D+

Downstream

Ports 2-4 USB

3.2 Gen 2 TX D-

Downstream

Ports 2-4 USB

3.2 Gen 2 RX D+

USB3DN_TXDM1B I/O-U Downstream USB Type-C “Orientation B”

USB3DN_RXDP1B I/O-U Downstream USB Type-C “Orientation B”

USB3DN_RXDM1B I/O-U Downstream USB Type-C “Orientation B”

USB3DN_TXDP[2:4] I/O-U Downstream SuperSpeed+ Transmit Data

USB3DN_TXDM[2:4] I/O-U Downstream SuperSpeed+ Transmit Data

USB3DN_RXDP[2:4] I/O-U Downstream SuperSpeed+ Receive Data

Buffer

Type

Description If Unused

SuperSpeed+ Transmit Data Minus, port 1.

SuperSpeed+ Receive Data Plus, port 1.

SuperSpeed+ Receive Data Minus, port 1.

Plus, ports 2 through 4.

Minus, ports 2 through 4.

Plus, ports 2 through 4.

Float

Weak pulldown to GND

Float

Weak pulldown to GND

Downstream

Ports 2-4 USB

3.2 Gen 2 RX D-

Upstream USB

2.0 D+

Upstream USB

2.0 D-

Downstream

Ports 1-6 USB

2.0 D+

Downstream

Ports 1-6 USB

2.0 D-

SPI Clock SPI_CLK I/O-U SPI clock. If the SPI interface is enabled,

USB3DN_RXDM[2:4] I/O-U Downstream SuperSpeed+ Receive Data

Minus, ports 2 through 4.

USB 2.0 Interfaces

USB2UP_DP I/O-U Upstream USB 2.0 Data Plus (D+). Mandatory

USB2UP_DM I/O-U Upstream USB 2.0 Data Minus (D-). Mandatory

USB2DN_DP[1:6] I/O-U Downstream USB 2.0 Ports 1-6 Data Plus

(D+).

USB2DN_DM[1:6] I/O-U Downstream USB 2.0 Ports 1-6 Data Minus

(D-)

SPI Interface

this pin must be driven low during reset.

Weak pulldown to GND

Note 3-9

Connect directly to

3.3V

Connect directly to

3.3V

Weak pulldown to GND

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 11

USB7216

VBUS_P1

43K

49.9K

DP1_VBUS_MON

TABLE 3-1: PIN DESCRIPTIONS (CONTINUED)

Name Symbol

SPI Data 3-0 SPI_D[3:0] I/O-U SPI Data 3-0. If the SPI interface is enabled,

SPI Chip

Enable

SPI_CE_N I/O12 Active low SPI chip enable input. If the SPI

Buffer

Type

Description If Unused

these signals function as Data 3 through 0.

Note 3-1 SPI_D0 operates as the

CF G _ BC _E N

external SPI memory is not used. It must be terminated wit h t h e sel e c t ed st r a p resistor to 3.3V or GND. SP I _ D[ 1 : 3 ] sh o u l d b e connected to GND through a weak pull-down.

interface is enabled, this pin must be driven high in powerdown states.

Note 3-2 Operates as the

CFG_NO N _REM

external SPI memory is not used. It must be terminated wit h t h e sel e c t ed st r a p resistor to 3.3V or GND.

s t r a p i f

str ap if

Note 3-1

Note 3-2

Downstream

Port 1 Type-C

Voltage Monitor

USB Type-C Connector Control

DP1_VBUS_MON AIO Used to detect Type-C VBUS vSafe5V and

vSafe0V states on Port 1. A nominal voltage of 2.7V (2.4V min -3.0V max) is required to detect the presence of vSafe5V. Externally, VBUS can be as high as 5.25 V, which can be damaging to this pin. The amplitude of VBUS must be reduced by a voltage divider. The recommended voltage divider is shown below. 1% tolerance resistors are recommended.

For proper Type-C port operation, it is critical that this pin actually be connected to VBUS of the port through the recommended resistor divider. This pin should not be tied permanently to a fixed voltage power rail.

Note 3-3 If unused: Weak pull-down

to GND. This pin may be le ft unu s e d if Port 1 is disabled or reconfigured to ope rate in legacy Type-A m o d e t h r o ug h h u b configuration.

Note 3-3

DS00003143B-page 12  2018 - 2020 Microchip Technology Inc.

TABLE 3-1: PIN DESCRIPTIONS (CONTINUED)

VBUS_UP

43K

49.9K

VBUS_MON_UP

USB7216

Name Symbol

Downstream

Port 1 Type-C

CC1

Downstream

Port 1 Type-C

CC2

Buffer

Type

DP1_CC1 I/O12 Used for Type-C attach and orientation

detection on Port 1. Includes configurable Rp/Ra selection. Connect this pin directly to the CC1 pin of the respective Type-C connector.

Note 3-4 If unused: Weak pull-down

DP1_CC2 I/O12 Used for Type-C attach and orientation

detection on Port 1. Includes configurable Rp/Ra selection. Connect this pin directly to the CC2 pin of the respective Type-C connector.

Note 3-5 If unused: Weak pull-down

Description If Unused

to GND. This pin may only be left unused if Port 1 is disabled or reconfigured to ope rate in legacy Type-A m o d e t h r o ug h h u b configuration.

Note 3-4

Note 3-5

Upstream

Voltage Monitor

VBUS_MON_UP I/O12 Used to detect VBUS on the upstream port.

Externally, VBUS can be as high as 5.25 V, which can be damaging to this pin. A nominal voltage of 2.7V (2.4V min -3.0V max) is required to detect the presence of vSafe5V. The amplitude of VBUS must be reduced by a voltage divider. The recommended voltage divider is shown below. 1% tolerance resistors are recommended.

Note: For embedded host applications,

this pin should be controlled by an I/O on the host processor to a

2.68V logic level.

Mandatory

Note 3-9

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 13

USB7216

TABLE 3-1: PIN DESCRIPTIONS (CONTINUED)

Name Symbol

Programmable

Function Pins

Test 1 TEST1 A Test 1 pin.

Test 2 TEST2 A Test 2 pin.

Test 3 TEST3 A Test 3 pin.

PF[31:3] I/O12 Programmable function pins.

Buffer

Type

Miscellaneous

Description If Unused

Note 3-6 If unused: depends on the

co n fi g ure d pin functi on. Ref e r to S e c t io n 3. 3 .4 ,

PF [ 3 1 : 3 ] C o n f i g ur a ti on (CFG_STRAP[2:1])

This signal is used for test purposes and must always be pulled-up to 3.3V via a 10 k

 resistor.

This signal is used for test purposes and must always be pulled-up to 3.3V via a 10 k

 resistor.

This signal is used for test purposes and must always be pulled-up to 3.3V via a 10 k

 resistor.

Note 3-6

Pull to 3.3V through a 10 k



resistor

Pull to 3.3V through a 10 k



resistor

Pull to 3.3V through a 10 k



resistor

Reset Input RESET_N IS This active low signal is used by the system

to reset the device.

Bias Resistor RBIAS I-R A 12.0 k

ground to this pin to set the transceiver’s internal bias settings. Place the resistor as close the device as possible with a dedicated, low impedance connection to the ground plane.

Test TESTEN I/O12 Test pin.

This signal is used for test purposes and must always be connected to ground.

Analog Test ATEST A Analog test pin.

This signal is used for test purposes and must always be left unconnected.

External 25 MHz

Crystal Input

External 25 MHz Reference Clock

Input

XTALI ICLK External 25 MHz crystal input Mandatory

CLK_IN ICLK External reference clock input.

The device may alternatively be driven by a single-ended clock oscillator. When this method is used, XTALO should be left unconnected.

 1.0% resistor is attached from

Mandatory

Note 3-9

Mandatory

Note 3-9

Connect to GND

Float

Note 3-9

Mandatory

Note 3-9

DS00003143B-page 14  2018 - 2020 Microchip Technology Inc.

TABLE 3-1: PIN DESCRIPTIONS (CONTINUED)

USB7216

Name Symbol

External 25 MHz

Crystal Output

Port 6-1 D+

Disable

Configuration

Strap

Buffer

Type

XTALO OCLK External 25 MHz crystal output Float

Configuration Straps

PRT_DIS_P[

6:1] I Port 6-1 D+ Disable Configuration Strap.

These configuration straps are used in conjunction with the corresponding

PRT_DIS_M[

related port (6-1). See Note 3-10.

Both USB data pins for the corresponding port must be tied to 3.3V to disable the associated downstream port.

Description If Unused

6:1] straps to disable the

(only if single-ended clock is connected to

CLK_IN)

N/A

Port 6-1 D-

Disable

Configuration

Strap

Non-Removable

Ports

Configuration

Strap

PRT_DIS_M[

CFG_NON_REM

6:1] I Port 6-1 D- Disable Configuration Strap.

These configuration straps are used in conjunction with the corresponding

PRT_DIS_P[

related port (6-1). See Note 3-10.

Both USB data pins for the corresponding port must be tied to 3.3V to disable the associated downstream port.

I Non-Removable Ports Configuration Strap.

This configuration strap controls the number of reported non-removable ports. See

Note 3-10 .

Note 3-7 Mandatory if external SPI

6:1] straps to disable the

me mor y is not us e d for f i r m w a r e e x e c u t i o n . I f ext e r na l S P I memory is us e d f o r fi r m w a r e ex e c u t i o n, t he n configuration strap resistor should be omitted.

Mandatory

Note 3-9

Note 3-7

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 15

USB7216

TABLE 3-1: PIN DESCRIPTIONS (CONTINUED)

Name Symbol

Battery Charging

Configuration

Strap

Device Mode

Configuration

Straps 3-1

+3.3V I/O Power

Supply Input

CFG_STRAP[3:1]

Buffer

Type

CFG_BC_EN

VDD33 P +3.3 V power and internal regulator input. Mandatory

I/O12 Battery Charging Configuration Strap.

This configuration strap controls the number of BC 1.2 enabled downstream ports. See

Note 3-10.

Note 3-8 Mandatory if external SPI

I Device Mode Configuration Straps 3-1.

These configuration straps are used to select the device’s mode of operation. See

Note 3-10.

Power/Ground

Description If Unused

Mandatory

Note 3-9

me mor y is not us e d for f i r m w a r e e x e c u t i o n . I f ex t e r na l S P I memory is us e d f o r fi r m w a r e ex e c u t i o n, t he n configuration strap resistor should be omitted.

Mandatory

Note 3-9

Digital Core

Power Supply

Input

Ground VSS P Common ground.

Note 3-9 Configuration strap values are latched on Power-On Reset (POR) and the rising edge of RESET_N

(external chip reset). Configuration straps are identified by an underlined symbol name. Signals that function as configuration straps must be augmented with an external resistor when connected to a load. For additional information, refer to Section 3.3, Configuration Straps and Programmable

Functions.

Note 3-10 Pin use is mandatory. Cannot be left unused.

VCORE P Digital core power supply input. Mandatory

Note 3-9

Mandatory

Note 3-9

This exposed pad must be connected to the ground plane with a via array.

3.3 Configuration Straps and Programmable Functions

Configuration straps are multi-function pins that are used during Power-On Reset (POR) or external chip reset (RESET_N) to determine the default configuration of a particular feature. The state of the signal is latched following deassertion of the reset. Configuration straps are identified by an underlined symbol name. This section details the various device configuration straps and associated programmable pin functions.

Note: The system designer must guarantee that configuration straps meet the timing requirements specified in

Section 9.6.2, Power-On and Configuration Strap Timing and Section 9.6.3, Reset and Configuration Strap Timing. If configuration straps are not at the correct voltage level prior to being latched, the device may

capture incorrect strap values.

DS00003143B-page 16  2018 - 2020 Microchip Technology Inc.

USB7216

3.3.1 PORT DISABLE CONFIGURATION (PRT_DIS_P[6:1] / PRT_DIS_M[6:1])

The PRT_DIS_P[6:1] / PRT_DIS_M[6:1] configuration straps are used in conjunction to disable the related port (6-1)

For PRT_DIS_P

0 = Port x D+ Enabled

1 = Port x D+ Disabled

For PRT_DIS_M

0 = Port x D- Enabled

1 = Port x D- Disabled

x (where x is the corresponding port 6-1):

Note: Both PRT_DIS_P

the associated downstream port. Disabling the USB 2.0 port will also disable the corresponding USB 3.0 port.

x and PRT_DIS_Mx (where x is the corresponding port) must be tied to 3.3 V to disable

3.3.2 NON-REMOVABLE PORT CONFIGURATION (CFG_NON_REM)

The CFG_NON_REM configuration strap is used to configure the non-removable port settings of the device to one of six settings. These modes are selected by the configuration of an external resistor on the CFG_NON_REM resistor options are a 200 kΩ pull-down, 200 kΩ pull-up, 10 kΩ pull-down, 10 kΩ pull-up, 10 Ω pull-down, and 10 Ω pullup, as shown in Table 3-2.

pin. The

TABLE 3-2: CFG_NON_REM RESISTOR ENCODING

CFG_NON_REM Resistor Value Setting

200 kΩ Pull-Down All ports removable

200 kΩ Pull-Up Port 1 non-removable

10 kΩ Pull-Down Ports 1, 2 non-removable

10 kΩ Pull-Up Ports 1, 2, 3 non-removable

10 Ω Pull-Down Ports 1, 2, 3, 4 non-removable

10 Ω Pull-Up Ports 1, 2, 3, 4, 5, 6 non-removable

3.3.3 BATTERY CHARGING CONFIGURATION (CFG_BC_EN)

The CFG_BC_EN configuration strap is used to configure the battery charging port settings of the device to one of six settings. These modes are selected by the configuration of an external resistor on the CFG_BC_EN options are a 200 kΩ pull-down, 200 kΩ pull-up, 10 kΩ pull-down, 10 kΩ pull-up, 10 Ω pull-down, and 10 Ω pull-up, as shown in Table 3-3.

pin. The resistor

TABLE 3-3: CFG_BC_EN RESISTOR ENCODING

CFG_BC_EN Resistor Value Setting

200 kΩ Pull-Down Battery charging not enable on any port

200 kΩ Pull-Up BC1.2 DCP and CDP battery charging enabled on Port 1

10 kΩ Pull-Down BC1.2 DCP and CDP battery charging enabled on Ports 1, 2

10 kΩ Pull-Up BC1.2 DCP and CDP battery charging enabled on Ports 1, 2, 3

10 Ω Pull-Down BC1.2 DCP and CDP battery charging enabled on Ports 1, 2, 3, 4

10 Ω Pull-Up BC1.2 DCP and CDP battery charging enabled on Ports 1, 2, 3, 4, 5, 6

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 17

USB7216

3.3.4 PF[31:3] CONFIGURATION (CFG_STRAP[2:1])

The USB7216 provides 29 programmable function pins (PF[31:3]). These pins can be configured to 2 predefined configuration via the CFG_STRAP[2:1]

CFG_STRAP[2:1]

pins, as detailed in Table 3-4. Resistor values and combinations not detailed in Table 3-4 are reserved

and should not be used.

pins. These configurations are selected via external resistors on the

Note: CFG_STRAP3

is not used and must be pulled-down to ground via a 200 k resistor.

TABLE 3-4: CFG_STRAP[2:1] RESISTOR ENCODING

Mode

CFG_STRAP2

Resistor Value

Configuration 1 200 kΩ Pull-Down 200 kΩ Pull-Down

Configuration 2 200 kΩ Pull-Down 200 kΩ Pull-Up

A summary of the configuration pin assignments for each of the 2 configurations is provided in Table 3-5. For details on behavior of each programmable function, refer to Table 3-6.

CFG_STRAP1

Resistor Value

TABLE 3-5: PF[31:3] FUNCTION ASSIGNMENT

Configuration 1

(SMBus/I

PF3 DP1_VCONN2 DP1_VCONN2

PF4 DP1_VCONN1 DP1_VCONN1

PF5 DP1_DISCHARGE DP1_DISCHARGE

PF6 GPIO70 GPIO70

PF7 GPIO71 MIC_DET

PF8 GPIO72 GPIO72

PF9 GPIO73 GPIO73

PF10 PRT_CTL2_U3 I2S_SDI

PF11 PRT_CTL3_U3 I2S_MCLK

PF12 PRT_CTL4_U3 PRT_CTL4_U3

PF13 PRT_CTL4 PRT_CTL4

PF14 PRT_CTL3 PRT_CTL3

PF15 PRT_CTL2 PRT_CTL2

PF16 PRT_CTL5 PRT_CTL5

PF17 PRT_CTL1 PRT_CTL1

PF18 ALERT0 ALERT0

PF19 - I2S_SDO

PF20 SPI_CE_N SPI_CE_N

PF21 SPI_CLK SPI_CLK

PF22 SPI_D0 SPI_D0

PF23 SPI_D1 SPI_D1

PF24 SPI_D2 SPI_D2

PF25 SPI_D3 SPI_D3

PF26 SLV_I2C_CLK I2S_SCK

PF27 SLV_I2C_DATA PRT_CTL6

PF28 PRT_CTL6 I2S_LRCK

(

) (

PF29

Note 3-1

Configuration 2

(I2S)

)

Note 3-1

DS00003143B-page 18  2018 - 2020 Microchip Technology Inc.

USB7216

TABLE 3-5: PF[31:3] FUNCTION ASSIGNMENT (CONTINUED)

PF30 MSTR_I2C_CLK MSTR_I2C_CLK

PF31 MSTR_I2C_DATA MSTR_I2C_DATA

Note 3-1 The default function is not used in the USB7216.

Note: The default PFx pin functions can be overridden with additional configuration by modification of the pin mux

registers. These changes can be made during the SMBus configuration stage, by programming to OTP memory, or during runtime (after hub has attached and enumerated) by register writes via the SMBus slave interface or USB commands to the internal Hub Feature Controller Device.

Configuration 1

(SMBus/I

Configuration 2

(I2S)

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 19

USB7216

TABLE 3-6: PROGRAMMABLE FUNCTIONS DESCRIPTIONS

Function

Buffer

Type

Master SMBus/I

MSTR_I2C_CLK I/O12 Bridging Master SMBus/I

1). External 1k-10k pull-up resistors to 3.3V are required if the I Master Interface is to be used.

MSTR_I2C_DATA I/O12 Bridging Master SMBus/I

1). External 1k-10k pull-up resistors to 3.3V are required if the I Master Interface is to be used.

Slave SMBus/I

SLV_I2C_CLK I/O12 Slave SMBus/I

C controller clock (SMBus/I2C controller 2). External 1k-10k pull-up resistors to 3.3V are required if the I Interface is to be used.

SLV_I2C_DATA I/O12 Slave SMBus/I

C controller data (SMBus/I2C controller 2). External 1k-10k pull-up resistors to 3.3V are required if the I face is to be used.

S Interface

I2S_SDI I I

I2S_SDO O12 I

I2S_SCK O12 I

I2S_LRCK O12 I

I2S_MCLK O12 I

MIC_DET I I

S Serial Data In Weak pull-

S Serial Data Out Weak pull-

S Continuous Serial Clock Weak pull-

S Word Select / Left-Right Clock Weak pull-

S Master Clock Weak pull-

S Microphone Plug Detect

0 = No microphone plugged into the audio jack 1 = Microphone plugged into the audio jack

Description If Unused

C Interface

C controller clock (SMBus/I2C controller

Weak pulldown to GND

C controller data (SMBus/I2C controller

Weak pulldown to GND

C Interface

C Slave

Weak pulldown to GND

C Slave Inter-

Weak pulldown to GND

down to GND

Weak pulldown to GND

DS00003143B-page 20  2018 - 2020 Microchip Technology Inc.

TABLE 3-6: PROGRAMMABLE FUNCTIONS DESCRIPTIONS (CONTINUED)

USB7216

Function

ALERT0 I Alert 0

DP1_VCONN1 I/O12 Port 1 VCONN1 enable. Active high signal.

DP1_VCONN2 I/O12 Port 1 VCONN2 enable. Active high signal.

Buffer

Type

Description If Unused

Miscellaneous

Interrupt input for connection to the local companion (UPD360/ UPD350) power delivery controller’s IRQ# signal.

0 = VCONN is turned off. 1 = VCONN is turned on. If DP1_VCONN1 is asserted and >3.0V is not sensed on the CC1 line, a VCONN fault condition is detected.

Note 3-1 This pin can be left unused only if Port 1 is

disabled or reconfigured to operate as a legacy Type-A port via OTP/SMBus/SPI configuration.

0 = VCONN is turned off. 1 = VCONN is turned on. If DP1_VCONN2 is asserted and >3.0V is not sensed on the CC2 line, a VCONN fault condition is detected.

Note 3-2 This pin can be left unused only if Port 1 is

disabled or reconfigured to operate as a legacy Type-A port via OTP/SMBus/SPI configuration.

Weak pulldown to GND (Note 3-1)

Weak pulldown to GND (Note 3-2)

DP1_DISCHARGE I/O12 Port 1 DISCHARGE enable. Active high signal.

0 = VBUS discharging is not active. 1 = VBUS is being discharged to GND. This pin only asserts for a short duration when VBUS is being discharged from 5V (vSafe5V) to 0V (vSafe0V).

Note 3-3 This pin can be left unused only if Port 1 is

disabled or reconfigured to operate as a legacy Type-A port via OTP/SMBus/SPI configuration.

PRT_CTL6 I/O12

(PU)

Port 6 power enable / overcurrent sense

When the downstream port is enabled, this pin is set as an input with an internal pull-up resistor applied. The internal pull-up enables power to the downstream port while the pin monitors for an active low overcurrent signal assertion from an external current monitor on USB port 6.

This pin will change to an output and be driven low when the port is disabled by configuration or by the host control.

Note: This signal controls both the USB 2.0 and USB 3.2 por-

tions of the port.

Note 3-4 This pin can be left unused only if Port 6 is

disabled via strap/OTP/SMBus/SPI configuration.

Weak pulldown to GND (Note 3-3)

Float (Note 3-4)

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USB7216

TABLE 3-6: PROGRAMMABLE FUNCTIONS DESCRIPTIONS (CONTINUED)

Function

PRT_CTL5 I/O12

PRT_CTL4 I/O12

Buffer

Type

(PU)

Description If Unused

Port 5 power enable / overcurrent sense

This pin will change to an output and be driven low when the port is disabled by configuration or by the host control.

Note: This signal controls both the USB 2.0 and USB 3.2 por-

tions of the port.

Note 3-5 This pin can be left unused only if Port 5 is

disabled via strap/OTP/SMBus/SPI configuration.

Port 4 power enable / overcurrent sense

This pin will change to an output and be driven low when the port is disabled by configuration or by the host control.

Note: When PortSplit is disabled, this signal controls both the

USB 2.0 and USB 3.2 portions of the port. When PortSplit is enabled, this signal controls the USB 2.0 portion of the port only.

Note 3-6 This pin can be left unused only if Port 4 is

disabled via strap/OTP/SMBus/SPI configuration.

Float (Note 3-5)

Float (Note 3-6)

PRT_CTL3 I/O12

(PU)

DS00003143B-page 22  2018 - 2020 Microchip Technology Inc.

Port 3 power enable / overcurrent sense

This pin will change to an output and be driven low when the port is disabled by configuration or by the host control.

Note: When PortSplit is disabled, this signal controls both the

USB 2.0 and USB 3.2 portions of the port. When PortSplit is enabled, this signal controls the USB 2.0 portion of the port only.

Note 3-7 This pin can be left unused only if Port 3 is

disabled via strap/OTP/SMBus/SPI configuration.

Float (Note 3-7)

TABLE 3-6: PROGRAMMABLE FUNCTIONS DESCRIPTIONS (CONTINUED)

USB7216

Function

PRT_CTL2 I/O12

PRT_CTL1 I/O12

Buffer

Type

(PU)

Description If Unused

Port 2 power enable / overcurrent sense

This pin will change to an output and be driven low when the port is disabled by configuration or by the host control.

Note: When PortSplit is disabled, this signal controls both the

USB 2.0 and USB 3.2 portions of the port. When PortSplit is enabled, this signal controls the USB 2.0 portion of the port only.

Note 3-8 This pin can be left unused only if Port 2 is

disabled via strap/OTP/SMBus/SPI configuration.

Port 1 power enable / overcurrent sense

Float (Note 3-4)

This pin will change to an output and be driven low when the port is disabled by configuration or by the host control.

Note: This signal controls both the USB 2.0 and USB 3.2 por-

tions of the port.

Note 3-9 This pin can be left unused only if Port 1 is

disabled via strap/OTP/SMBus/SPI configuration.

PRT_CTL4_U3 O12 Port 4 USB 3.2 PortSplit power enable

This signal is an active high control signal used to enable to the USB 3.2 portion of the downstream port 4 when PortSplit is enabled. When PortSplit is disabled, this pin is not used.

Note: This signal should only be used to control an embedded

USB 3.2 device.

PRT_CTL3_U3 O12 Port 3 USB 3.2 PortSplit power enable

This signal is an active high control signal used to enable to the USB 3.2 portion of the downstream port 3 when PortSplit is enabled. When PortSplit is disabled, this pin is not used.

Note: This signal should only be used to control an embedded

USB 3.2 device.

Float

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 23

USB7216

TABLE 3-6: PROGRAMMABLE FUNCTIONS DESCRIPTIONS (CONTINUED)

Function

PRT_CTL2_U3 O12 Port 2 USB 3.2 PortSplit power enable

GPIOx I/O12 General Purpose Input/Output

Buffer

Type

Description If Unused

This signal is an active high control signal used to enable to the USB 3.2 portion of the downstream port 3 when PortSplit is enabled. When PortSplit is disabled, this pin is not used.

Note: This signal should only be used to control an embedded

USB 3.2 device.

(x = 70-73)

Float

Weak pulldown to GND

3.4 Physical and Logical Port Mapping

The USB72xx family of devices are based upon a common architecture, but all have different modifications and/or pin bond outs to achieve the various device configurations. The base chip is composed of a total of 6 USB3 PHYs and 7 USB2 PHYs. These PHYs are physically arranged on the chip in a certain way, which is referred to as the PHYSICAL port mapping.

The actual port numbering is remapped by default in different ways on each device in the family. This changes the way that the ports are numbered from the USB host’s perspective. This is referred to as LOGICAL mapping.

The various configuration options available for these devices may, at times, be with respect to PHYSICAL mapping or LOGICAL mapping. Each individual configuration option which has a PHYSICAL or LOGICAL dependency is declared as such within the register description.

The PHYSICAL vs. LOGICAL mapping is described for all port related pins in Table 3-7. A system design in schematics and layout is generally performed using the pinout in Section 3.1, Pin Assignments, which is assigned by the default LOGICAL mapping. Hence, it may be necessary to cross reference the PHYSICAL vs. LOGICAL look up tables when determining the hub configuration.

Note: The MPLAB Connect tool makes configuration simple; the settings can be selected by the user with respect

to the LOGICAL port numbering. The tool handles the necessary linking to the PHYSICAL port settings. Refer to Section 6.0, Device Configuration for additional information.

DS00003143B-page 24  2018 - 2020 Microchip Technology Inc.

USB7216

TABLE 3-7: USB7216 PHYSICAL VS. LOGICAL PORT MAPPING

Device

10 USB3DN_RXDP1A X X

11 USB3DN_RXDM1A X X

14 USB2DN_DP5 X X

15 USB2DN_DM5 X X

16 USB3DN_TXDP1B X X

17 USB3DN_TXDM1B X X

19 USB3DN_RXDP1B X X

20 USB3DN_RXDM1B X X

27 USB2DN_DP2 X X

28 USB2DN_DM2 X X

29 USB3DN_TXDP2 X X

30 USB3DN_TXDM2 X X

32 USB3DN_RXDP2 X X

33 USB3DN_RXDM2 X X

34 USB2DN_DP3 X X

35 USB2DN_DM3 X X

36 USB3DN_TXDP3 X X

37 USB3DN_TXDM3 X X

39 USB3DN_RXDP3 X X

40 USB3DN_RXDM3 X X

41 USB2DN_DM6 X X

42 USB2DN_DP6 X X

81 USB2DN_DP4 X X

82 USB2DN_DM4 X X

83 USB3DN_TXDP4 X X

84 USB3DN_TXDM4 X X

86 USB3DN_RXDP4 X X

87 USB3DN_RXDM4 X X

89 USB2UP_DP X X

90 USB2UP_DM X X

91 USB3UP_TXDP X X

92 USB3UP_TXDM X X

94 USB3UP_RXDP X X

95 USB3UP_RXDM X X

Pin Name (as in datasheet)

5 USB2DN_DP1 X X

6 USB2DN_DM1 X X

7 USB3DN_TXDP1A X X

8 USB3DN_TXDM1A X X

LOGICAL PORT NUMBER PHYSICAL PORT NUMBER

0 1 2 3 4 5 6 0 1 2 3 4 5 6

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 25

USB7216

+3.3V

Supply

USB721 6

3.3V Internal Logic

VDD33

(x8)

VSS

(exposed pad)

Digital Core

Internal Logic

VCORE

(x9)

VCORE

Supply

+3.3V

0. 1uF

0. 001uF

+3.3V

4. 7uF

VCORE

0. 1uF

0. 001uF

VCOR E

4. 7uF

USB7216

SPI_CE_N

SPI_CLK

SPI_D0

SPI_D1

Quad-SPI Flash

CE#

CLK

SIO0

SIO1

SPI_D2

SPI_D3

SIO2/WPn

SIO3/HOLDn

+3.3V

10K

4.0 DEVICE CONNECTIONS

4.1 Power Connections

Figure 4-1 illustrates the device power connections.

FIGURE 4-1: POWER CONNECTIONS

4.2 SPI Flash Connections

Figure 4-2 illustrates the Quad-SPI flash connections.

FIGURE 4-2: QUAD-SPI FLASH CONNECTIONS

DS00003143B-page 26  2018 - 2020 Microchip Technology Inc.

4.3 SMBus/I2C Connections

+3.3V

USB721 6

x_I2 C_C LK

x_I2C_DAT

SMBus/I2C

Clock

Data

4.7K

+3.3V

4.7K

USB721 6

I2S_LRCK

I2S_SDO

I2S_SD

I2S_MCLK

CODEC

I2S_SCK

+3. 3V

10K

I2S

MSTR_I2C_CLK

MSTR_I2C_DAT

I2C

Audio Jack

MIC_DET

Figure 4-3 illustrates the SMBus/I2C connections.

FIGURE 4-3: SMBUS/I2C CONNECTIONS

4.4 I2S Connections

Figure 4-4 illustrates the I2S connections.

USB7216

FIGURE 4-4: I

S CONNECTIONS

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 27

USB7216

Combine OTP

Config Data

In SPI Mode

& Ext. SPI ROM

present?

YES

Run From

External SPI ROM

(SPI_INIT)

SMBus Slave Pull-ups?

RESET_N deasserted

Modify Config

Based on Config

Straps

(CFG_ROM)

Load Config from

Internal ROM

YES

(SMBUS_CHECK)

Perform SMBus/I2C

Initializati on

SOC Done?

YES

(CFG_SMBUS)

(CFG_OTP)

Hub Connect

(USB_ATTACH)

Normal Operation (NORMAL_MODE)

(CFG_STRAP)

Configuration 1?

YES

5.0 MODES OF OPERATION

The device provides two main modes of operation: Standby Mode and Hub Mode. These modes are controlled via the RESET_N pin, as shown in Table 5-1.

TABLE 5-1: MODES OF OPERATION

RESET_N Input Summary

0 Standby Mode: This is the lowest power mode of the device. No functions are active

other than monitoring the RESET_N input. All port interfaces are high impedance and the PLL is halted. Refer to Section 8.11, Resets for additional information on RESET_N.

1 Hub (Normal) Mode: The device operates as a configurable USB hub. This mode has

various sub-modes of operation, as detailed in Figure 5-1. Power consumption is based on the number of active ports, their speed, and amount of data received.

The flowchart in Figure 5-1 details the modes of operation and details how the device traverses through the Hub Mode stages (shown in bold). The remaining sub-sections provide more detail on each stage of operation.

FIGURE 5-1: HUB MODE FLOWCHART

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5.1 Boot Sequence

5.1.1 STANDBY MODE

If the RESET_N pin is asserted, the hub will be in Standby Mode. This mode provides a very low power state for maximum power efficiency when no signaling is required. This is the lowest power state. In Standby Mode all downstream ports are disabled, the USB data pins are held in a high-impedance state, all transactions immediately terminate (no states saved), all internal registers return to their default state, the PLL is halted, and core logic is powered down in order to minimize power consumption. Because core logic is powered off, no configuration settings are retained in this mode and must be re-initialized after RESET_N is negated high.

5.1.2 SPI INITIALIZATION STAGE (SPI_INIT)

The first stage, the initialization stage, occurs on the deassertion of RESET_N. In this stage, the internal logic is reset, the PLL locks if a valid clock is supplied, and the configuration registers are initialized to their default state. The internal firmware then checks for an external SPI ROM. The firmware looks for an external SPI flash device that contains a valid signature of “2DFU” (device firmware upgrade) beginning at address 0x3FFFA. If a valid signature is found, then the external SPI ROM is enabled and the code execution begins at address 0x0000 in the external SPI device. If a valid signature is not found, then execution continues from internal ROM (CFG_ROM stage).

The required SPI ROM must be a minimum of 1 Mbit, and 60 MHz or faster. Both 1, 2, and 4-bit SPI operation is supported. For optimum throughput, a 2-bit SPI ROM is recommended. Both mode 0 and mode 3 SPI ROMs are also supported.

If the system is not strapped for SPI Mode, code execution will continue from internal ROM (CFG_ROM stage).

5.1.3 CONFIGURATION FROM INTERNAL ROM STAGE (CFG_ROM)

In this stage, the internal firmware loads the default values from the internal ROM. Most of the hub configuration registers, USB descriptors, electrical settings, etc. will be initialized in this state.

5.1.4 CONFIGURATION STRAP READ STAGE (CFG_STRAP)

In this stage, the firmware reads the following configuration straps to override the default values:

• CFG_STRAP[3:1]

• PRT_DIS_P[

• PRT_DIS_M[

• CFG_NON_REM

• CFG_BC_EN

If the CFG_STRAP[3:1] it will move to the CFG_OTP stage. Refer to Section 3.3, Configuration Straps and Programmable Functions for information on usage of the various device configuration straps.

6:1]

pins are set to Configuration 1, the device will move to the SMBUS_CHECK stage, otherwise

5.1.5 SMBUS CHECK STAGE (SMBUS_CHECK)

Based on the PF[31:3] configuration selected (refer to Section 3.3.4, PF[31:3] Configuration (CFG_STRAP[2:1])), the firmware will check for the presence of external pull up resistors on the SMBus slave programmable function pins. If 10K pull-ups are detected on both pins, the device will be configured as an SMBus slave, and the next state will be CFG_SMBUS. If a pull-up is not detected in either of the pins, the next state is CFG_OTP.

5.1.6 SMBUS CONFIGURATION STAGE (CFG_SMBUS)

In this stage, the external SMBus master can modify any of the default configuration settings specified in the integrated ROM, such as USB device descriptors, port electrical settings, and control features such as downstream battery charging.

There is no time limit on this mode. In this stage the firmware will wait indefinitely for the SMBus/I external SMBus master writes to register 0xFF to end the configuration in legacy mode. In non-legacy mode, the SMBus command USB_ATTACH (opcode 0xAA55) or USB_ATTACH_WITH_SMBUS (opcode 0xAA56) will finish the configuration.

C configuration. The

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5.1.7 OTP CONFIGURATION STAGE (CFG_OTP)

Once the SOC has indicated that it is done with configuration, all configuration data is combined in this stage. The default data, the SOC configuration data, and the OTP data are all combined in the firmware and the device is programmed.

Note: If the same register is modified in both CFG_SMBUS and CFG_OTP stages, the value from CFG_OTP will

overwrite any value written during CFG_SMBUS.

5.1.8 HUB CONNECT STAGE (USB_ATTACH)

Once the hub registers are updated through default values, SMBus master, and OTP, the device firmware will enable attaching the USB host by setting the USB_ATTACH bit in the HUB_CMD_STAT register (for USB 2.0) and the USB3_HUB_ENABLE bit (for USB 3.2). The device will remain in the Hub Connect stage indefinitely.

5.1.9 NORMAL MODE (NORMAL_MODE)

Lastly, the hub enters Normal Mode of operation. In this stage full USB operation is supported under control of the USB Host on the upstream port. The device will remain in the normal mode until the operating mode is changed by the system.

If RESET_N is asserted low, then Standby Mode is entered. The device may then be placed into any of the designated hub stages. Asserting a soft disconnect on the upstream port will cause the hub to return to the Hub Connect stage until the soft disconnect is negated.

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6.0 DEVICE CONFIGURATION

The device supports a large number of features (some mutually exclusive), and must be configured in order to correctly function when attached to a USB host controller. Microchip provides a comprehensive software programming tool, MPLAB Connect Configurator (formerly ProTouch2), for OTP configuration of various USB7216 functions and registers. All configuration is to be performed via the MPLAB Connect Configurator programming tool. For additional information on this tool, refer to the MPLAB Connect Configurator programming tool product page at http://www.microchip.com/ design-centers/usb/mplab-connect-configurator.

Additional information on configuring the USB7216 is also provided in the “Configuration of the USB7202/USB725x” application note, which contains details on the hub operational mode, SOC configuration stage, OTP configuration, USB configuration, and configuration register definitions. This application note, along with additional USB7216 resources, can be found on the Microchip USB7216 product page at www.microchip.com/USB7216.

Note: The USB7216 requires external firmware to operate. Functions such as Power Delivery will not operate

without external firmware. Refer to the “Configuration of the USB7202/USB725x” application note for addi- tional information.

Note: Device configuration straps and programmable pins are detailed in Section 3.3, Configuration Straps and

Programmable Functions.

Refer to Section 7.0, Device Interfaces for detailed information on each device interface.

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7.0 DEVICE INTERFACES

The USB7216 provides multiple interfaces for configuration, external memory access, etc.. This section details the various device interfaces:

• SPI/SQI Master Interface

• SMBus/I2C Master/Slave Interfaces

• I2S Interface

Note: For details on how to enable each interface, refer to Section 3.3, Configuration Straps and Programmable

Functions.

For information on device connections, refer to Section 4.0, Device Connections. For information on device configuration, refer to Section 6.0, Device Configuration.

Microchip provides a comprehensive software programming tool, MPLAB Connect Configurator (formerly ProTouch2), for configuring the USB7216 functions, registers and OTP memory. All configuration is to be performed via the MPLAB Connect Configurator programming tool. For additional information on this tool, refer to th MPLAB Connect Configurator programming tool product page at http://www.microchip.com/ design-centers/usb/mplab-connect-configurator.

7.1 SPI/SQI Master Interface

The SPI/SQI controller has two basic modes of operation: execution of an external hub firmware image, or the USB to SPI bridge. On power up, the firmware looks for an external SPI flash device that contains a valid signature of 2DFU (device firmware upgrade) beginning at address 0x3FFFA. If a valid signature is found, then the external ROM mode is enabled and the code execution begins at address 0x0000 in the external SPI device. If a valid signature is not found, then execution continues from internal ROM and the SPI interface can be used as a USB to SPI bridge.

The entire firmware image is then executed in place entirely from the SPI interface. The SPI interface will remain continuously active while the hub is in the runtime state. The hub configuration options are also loaded entirely out of the SPI memory device. Both the internal ROM firmware image and internal OTP memory are completely ignored while executing the firmware and configuration from the external SPI memory.

The second mode of operation is the USB to SPI bridge operation. Additional details on this feature can be found in

Section 8.9, USB to SPI Bridging.

Table 7-1 details how the associated pins are mapped in SPI vs. SQI mode

TABLE 7-1: SPI/SQI PIN USAGE

SPI Mode SQI Mode Description

SPI_CE_N SQI_CE_N SPI/SQI Chip Enable (Active Low)

SPI_CLK SQI_CLK SPI/SQI Clock

SPI_D0 SQI_D0 SPI Data Out; SQI Data I/O 0

SPI_D1 SQI_D1 SPI Data In; SQI Data I/O 1

- SQI_D2 SQI Data I/O 2

- SQI_D3 SQI Data I/O 3

Note: For SPI/SQI master timing information, refer to Section 9.6.10, SPI/SQI Master Timing.

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7.2 SMBus/I2C Master/Slave Interfaces

The device provides three independent SMBus/I2C controllers (Slave, Master, and Power Delivery Master) which can be used to access internal device run time registers or program the internal OTP memory. The device contains two 128 byte buffers to enable simultaneous master/slave operation and to minimize firmware overhead in processed I ets. The I

The SMBus/I

C interfaces support 100KHz Standard-mode (Sm) and 400KHz Fast Mode (Fm) operation.

C interfaces are assigned to programmable pins (PFx) and therefore the device must be programmed into specific configurations to enable specific interfaces. Refer to Section 3.3.4, PF[31:3] Configuration (CFG_STRAP[2:1]) for additional information.

C pack-

Note: For SMBus/I

C timing information, refer to Section 9.6.7, SMBus Timing and Section 9.6.8, I2C Timing.

7.3 I2S Interface

The device provides an integrated I2S interface to facilitate the connection of digital audio devices. The I2S interface conforms to the voltage, power, and timing characteristics/specifications as set forth in the I consists of the following signals:

• I2S_SDI: Serial Data Input

• I2S_SDO: Serial Data Output

• I2S_SCK: Serial Clock

• I2S_LRCK: Left/Right Clock (SS/FSYNC)

• I2S_MCLK: Master Clock

• MIC_DET: Microphone Plug Detect

Each audio connection is half-duplex, so I2S_SDO exists only on the transmit side and I2S_SDI exists only on the receive side of the interface. Some codecs refer to the Serial Clock (I2S_SCK) as Baud/Bit Clock (BCLK). Also, the Left/ Right Clock is commonly referred to as LRC or LRCK. The I

S and other audio protocols refer to LRC as Word Select

(WS).

The following codec is supported by default:

• Analog Devices ADAU1961 (24-bit 96KHz)

S interface is assigned to programmable pins (PFx) and therefore the device must be programmed into specific

The I configurations to enable the interface. Refer to Section 3.3.4, PF[31:3] Configuration (CFG_STRAP[2:1]) for additional information.

S-Bus Specification, and

Note: For I

S timing information, refer to Section 9.6.9, I2S Timing. For detailed information on utilizing the I2S

interface, including support for other codecs, refer to the application note “USB7202/USB725x I

S Opera-

tion”, which can be found on the Microchip USB7216 product page at www.microchip.com/USB7216.

7.3.1 MODES OF OPERATION

The USB audio class operates in three ways: Asynchronous, Synchronous and Adaptive. There are also multiple operating modes, such as hi-res, streaming, etc.. Typically for USB devices, inputs such as microphones are Asynchronous, and output devices such as speakers are Adaptive. The hardware is set up to handle all three modes of operation. It is recommended that the following configuration be used: Asynchronous IN; Adaptive OUT; 48Khz streaming mode; Two channels: 16 bits per channel.

7.3.1.1 Asynchronous IN 48KHz Streaming

In this mode, the codec sampling clock is set to 48Khz based on the local oscillator. This clock is never changed. The data from the codec is fed into the input FIFO. Since the sampling clock is asynchronous to the host clock, the amount of data captured in every USB frame will vary. This issue is left for the host to handle. The input FIFO has two markers, a low water mark (THRESHOLD_LOW_VAL), and a high water mark (THRESHOLD_HIGH_VAL). There are three registers to determine how much data to send back in each frame. If the amount of data in the FIFO exceeds the high water mark, then HI_PKT_SIZE worth of data is sent. If the data is between the high and low water mark, the normal MID_PKT_SIZE amount of data is sent. If the data is below the low water mark, LO_PKT_SIZE worth of data is sent.

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7.3.1.2 Adaptive OUT 48KHz Streaming

In this mode, the codec sampling clock is initially set to 48Khz based on the local oscillator. The host data is fed into the OUT FIFO. The host will send the same amount of data on every frame, i.e. 48KHz of data based on the host clock. The codec sampling clock is asynchronous to the host clock. This will cause the amount of data in the OUT FIFO to vary. If the amount of data in the FIFO exceeds the high water mark, then the sampling clock is increased. If the data is between the high and low water mark, the sampling clock does not change. If the data is below the low water mark, the sampling clock is decreased.

7.3.1.3 Synchronous Operation

For synchronous operation, the internal clock must be synchronized with the host SOF. The Frame SOF is nominally 1mS. Since there is significant jitter in the SOFs, there is circuitry provided to measure the SOFs over a long period of time to get a more accurate reading. The calculated host frequency is used to calculate the codec sampling clock.

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SOC

VBUS[n]

INT

SCL

SDA

Microchip

Hub

DC Power

8.0 FUNCTIONAL DESCRIPTIONS

This section details various USB7216 functions, including:

• Downstream Battery Charging

• Port Power Control

• CC Pin Orientation and Detection

• PortSplit

• FlexConnect

• Multi-Host Endpoint Reflector

• USB to GPIO Bridging

• USB to I2C Bridging

• USB to SPI Bridging

• Link Power Management (LPM)

• Resets

8.1 Downstream Battery Charging

The device can be configured by an OEM to have any of the downstream ports support battery charging. The hub’s role in battery charging is to provide acknowledgment to a device’s query as to whether the hub system supports USB battery charging. The hub silicon does not provide any current or power FETs or any additional circuitry to actually charge the device. Those components must be provided externally by the OEM.

FIGURE 8-1: BATTERY CHARGING EXTERNAL POWER SUPPLY

If the OEM provides an external supply capable of supplying current per the battery charging specification, the hub can be configured to indicate the presence of such a supply from the device. This indication, via the PRT_CTLx pins, is on a per port basis. For example, the OEM can configure two ports to support battery charging through high current power FETs and leave the other two ports as standard USB ports.

The port control signals are assigned to programmable pins (PFx) and therefore the device must be programmed into specific configurations to enable the signals. Refer to Section 3.3.4, PF[31:3] Configuration (CFG_STRAP[2:1]) for addi- tional information.

For detailed information on utilizing the battery charging feature, refer to the application note “USB Battery Charging with Microchip USB7202 and USB725x Hubs”, which can be found on the Microchip USB7216 product page www.microchip.com/USB7216.

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USB Power

Switch

50k

PRTPWR

OCS

Pull‐UpEnable

USB

Device

FILTER

PRT_CTLx

8.2 Port Power Control

Port power and over-current sense share the same pin (PRT_CTLx) for each port. These functions can be controlled directly from the USB hub, or via the processor.

Note: The PRT_CTLx function is assigned to programmable function pins (PFx) via configuration straps. Refer

to Section 3.3.4, PF[31:3] Configuration (CFG_STRAP[2:1]) for additional information.

Note: The port power control for the USB 2.0 and USB 3.2 portions of a specific port can also be individually con-

trolled via the PortSplit function. Refer to Section 8.4, PortSplit for additional information.

8.2.1 PORT POWER CONTROL USING USB POWER SWITCH

When operating in combined mode, the device will have one port power control and over-current sense pin for each downstream port. When disabling port power, the driver will actively drive a '0'. To avoid unnecessary power dissipation, the pull-up resistor will be disabled at that time. When port power is enabled, it will disable the output driver and enable the pull-up resistor, making it an open drain output. If there is an over-current situation, the USB Power Switch will assert the open drain OCS signal. The Schmidt trigger input will recognize that as a low. The open drain output does not interfere. The over-current sense filter handles the transient conditions such as low voltage while the device is powering up.

Note: An external power switch is the required implementation for Type-C ports due to the requirement that VBUS

on Type-C ports must be discharged to 0V when no device is attached to the port.

FIGURE 8-2: PORT POWER CONTROL WITH USB POWER SWITCH

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PRT_CTLx

50k

PRTPWR

OCS

USB

Device

Pull-Up Enable

Poly Fuse

FILTER

8.2.2 PORT POWER CONTROL USING POLY FUSE

When using the device with a poly fuse, there is no need for an output power control. A single port power control and over-current sense for each downstream port is still used from the Hub's perspective. When disabling port power, the driver will actively drive a '0'. This will have no effect as the external diode will isolate pin from the load. When port power is enabled, it will disable the output driver and enable the pull-up resistor. This means that the pull-up resistor is providing

3.3 volts to the anode of the diode. If there is an over-current situation, the poly fuse will open. This will cause the cathode of the diode to go to 0 volts. The anode of the diode will be at 0.7 volts, and the Schmidt trigger input will register this as a low resulting in an over-current detection. The open drain output does not interfere.

Note: Type-C ports may not utilize a Poly-Fuse port power implementation due to the requirements that VBUS

on Type-C ports must be discharged to 0V when no device is attached to the port.

FIGURE 8-3: PORT POWER CONTROL USING A POLY FUSE

8.3 CC Pin Orientation and Detection

The device provides CC1 and CC2 pins on all Type-C ports for cable plug orientation and detection of a USB Type-C receptacle. The device also integrates a comparator and DAC circuit to implement Type-C attach and detach functions, which supports up to eight programmable thresholds for attach detection between a UFP and DFP. When operating as a UFP, the device supports detecting changes in the DFP’s advertised thresholds.

When operating as a DFP, the device implements current sources to advertise current charging capabilities on both CC pins. By default, the CC pins advertise a 3A VBUS sourcing capability when operating in DFP mode. This may be reconfigured to 1.5A or Default USB (500mA for USB2 DFP or 900mA for a USB3 DFP) via OTP, SMBus, or SPI configuration. When a UFP connection is established, the current driven across the CC pins creates a voltage across the UFP’s Rd pull-down that can be detected by the integrated CC comparator. When connected to an active cable, an alternative pull-down, Ra, appears on the CC pin.

When operating as a UFP, the device applies an Rd pull-down on both CC lines and waits for a DFP connection from the assertion of VBUS. The CC comparator is used to determine the advertised current charger capabilities supported by the DFP.

VCONN is a 3V-5V supply used to power circuitry in the USB Type-C plug that is required to implement Electronically Marked Cables and other VCONN Powered accessories. By default the DFP always sources VCONN when connected to an active cable. The USB7216 requires the use of two external VCONN FETs. The device provides the enables for these FETs, and can detect an over-current event (OCS) by monitoring the output voltage of the FET via the CC pins.

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If the voltage on the VCONN line is sensed as <3.0V by the CC comparator of the either CC1 or CC2 (whichever pin is operating as VCONN at the time) then an over-current event is detected and the VCONN supply is shut off. VCONN is only sourced on either the CC1 or the CC2 pin, never both. The pin which is to become the VCONN supply is determined only when a device is attached to the Type-C port. The VCONN supply is controlled from the hub DP1_VCONN1/ DP1_VCONN2/DP2_VCONN2/DP2_VCONN2.

The device also implements a comparator for determining when a VBUS is within a programmed range, vSafe5V or vSafe0V. VBUS is divided down externally to provide a nominal 2.68V at the VBUS_MON pin. For a DFP, the VBUS comparator is useful to detect when VBUS is within the required range per power delivery negotiations. For a UFP, the VBUS comparator is utilized to determine when a DFP is attached or detached. It may also use the comparator to determine when VBUS is within a new voltage range per power delivery negotiations.

Note: The native USB Type-C functionality (including CC pin orientation and detection features) is managed

autonomously by the USB7216.

8.4 PortSplit

The PortSplit feature allows the USB 2.0 and USB 3.2 PHYs associated with a downstream port to be operationally separated. The intention of this feature is to allow a system designer to connect an embedded USB 3.x device to the USB

3.2 PHY, while allowing the USB 2.0 PHY to be used as either a standard USB 2.0 port or with a separate embedded USB 2.0 device. PortSplit can be configured via OTP/SMBus. By default, all ports are configured to non-split mode. PortSplit is supported for ports 2, 3, and 4 in configuration 1 and only for port 4 in configuration 2 (refer to Table 3-5).

When PortSplit is disabled on a specific port, the corresponding PRT_CTLx pin controls both the USB 2.0 and USB 3.2 portions of the port (port power and overcurrent condition). When PortSplit is enabled on a specific port, the corresponding PRT_CTLx pin controls the USB 2.0 portion of the port, and the corresponding PRT_CTLx_U3 pin controls the USB 3.2 portion of the port.

8.5 FlexConnect

The device allows the upstream port to be swapped with any downstream port, enabling any USB port to assume the role of USB host at any time during hub operation. This host role exchange feature is called FlexConnect. Additionally, the USB 2.0 ports can be flexed independently of the USB 3.2 ports.

This functionality can be used in two primary ways:

1. Host Swapping: This functionality can be achieved through a hub wherein a host and device can agree to swap

the host/device relationship; The host becomes a device, and the device becomes a host.

2. Host Sharing: A USB ecosystem can be shared between multiple hosts. Note that only 1 host may access to

the USB tree at a time.

FlexConnect can be enabled through any of the following three methods:

• I

C Control: The embedded I2C slave can be used to control the state of the FlexConnect feature through basic

write/read operations.

• USB Command: FlexConnect can be initiated via a special USB command directed to the hub’s internal Hub

Feature Controller device.

• Direct Pin Control: Any available GPIO pin on the hub can be assigned the role of a FlexConnect control pin.

Note: Direct Pin Control is only available in certain configurations. Refer to Section 3.3.4, PF[31:3] Configuration

(CFG_STRAP[2:1]) for additional information.

For detailed information on utilizing the FlexConnect feature, refer to the application note “USB720x/USB725x FlexCon- nect Operation”, which can be found on the Microchip USB7216 product page at www.microchip.com/USB7216.

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8.6 Multi-Host Endpoint Reflector

The internal Multi-Host Endpoint Reflector allows for smart-phone automotive mode sessions to be entered on the downstream ports. The device supports the Multi-Host Endpoint Reflector on downstream ports.

The Multi-Host Endpoint Reflector uses standard Network Control Model (NCM v1.0) device protocol, which is a subclass of Communication Device Class (CDC) group of protocols. Standard NCM USB drivers may be utilized; No custom drivers are required.

A Multi-Host Endpoint Reflector session may be entered on only 1 downstream port at a time. Entry into Multi-Host mode is initiated via a no data Control USB transfer addressed to the internal Hub Feature Controller device in the hub.

The USB7216 has two internal USB devices. The Multi-Host Endpoint Reflector is a Composite iAP and NCM device. The Hub Feature Controller is a Generic USB Device Class device which enables the USB bridging functions.

The hub ports which are connected to both the Multi-Host Endpoint Reflector and Hub Feature Controller are both configured as non-removable.

For detailed information on utilizing the multi-host endpoint reflector feature, refer to the application note “USB7202/ USB725x Multi-Host Endpoint Reflector Operation”, which can be found on the Microchip USB7216 product page at www.microchip.com/USB7216.

8.7 USB to GPIO Bridging

The USB to GPIO bridging feature provides system designers expanded system control and potential BOM reduction. General Purpose Input/Outputs (GPIOs) may be used for any general 3.3V level digital control and input functions.

Commands may be sent from the USB Host to the internal Hub Feature Controller device in the Microchip hub to perform the following functions:

• Set the direction of the GPIO (input or output)

• Enable a pull-up resistor

• Enable a pull-down resistor

• Read the state

• Set the state For detailed information on utilizing the USB to GPIO bridging feature, refer to the application note “USB to GPIO Bridg-

ing with Microchip USB7202 and USB725x Hubs”, which can be found on the Microchip USB7216 product page at www.microchip.com/USB7216.

8.8 USB to I2C Bridging

The USB to I2C bridging feature provides system designers expanded system control and potential BOM reduction. The use of a separate USB to I standalone USB to I

Commands may be sent from the USB Host to the internal Hub Feature Controller device in the Microchip hub to perform the following functions:

• Configure I

• I

C Write

• I

C Read

For detailed information on utilizing the USB to I with Microchip USB7202 and USB725x Hubs”, which can be found on the Microchip USB7216 product page at www.microchip.com/USB7216.

C Pass-Through Interface

C device is no longer required and a downstream USB port is not lost, as occurs when a

C device is implemented.

C bridging feature, refer to the application note “USB to I2C Bridging

8.9 USB to SPI Bridging

The USB to SPI bridging feature provides system designers expanded system control and potential BOM reduction. The use of a separate USB to SPI device is no longer required and a downstream USB port is not lost, as occurs when a standalone USB to SPI device is implemented.

Commands may be sent from the USB Host to the internal Hub Feature Controller device in the Microchip hub to perform the following functions:

• Enable SPI Pass-Through Interface

• SPI Write/Read

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USB7216

• Disable SPI Pass-Through Interface

For detailed information on utilizing the USB to SPI bridging feature, refer to the application note “USB to SPI Bridging with Microchip USB7202 and USB725x Hubs”, which can be found on the Microchip USB7216 product page at www.microchip.com/USB7216.

8.10 Link Power Management (LPM)

The device supports the L0 (On), L1 (Sleep), and L2 (Suspend) link power management states. These supported LPM states offer low transitional latencies in the tens of microseconds versus the much longer latencies of the traditional USB suspend/resume in the tens of milliseconds. The supported LPM states are detailed in Table 8-1.

TABLE 8-1: LPM STATE DEFINITIONS

State Description Entry/Exit Time to L0

L2 Suspend Entry: ~3 ms

Exit: ~2 ms (from start of RESUME)

L1 Sleep Entry: <10 us

Exit: <50 us

L0 Fully Enabled (On) -

8.11 Resets

The device includes the following chip-level reset sources:

• Power-On Reset (POR)

• External Chip Reset (RESET_N)

• USB Bus Reset

8.11.1 POWER-ON RESET (POR)

A power-on reset occurs whenever power is initially supplied to the device, or if power is removed and reapplied to the device. A timer within the device will assert the internal reset per the specifications listed in Section 9.6.2, Power-On

and Configuration Strap Timing.

8.11.2 EXTERNAL CHIP RESET (RESET_N)

A valid hardware reset is defined as assertion of RESET_N, after all power supplies are within operating range, per the specifications in Section 9.6.3, Reset and Configuration Strap Timing. While reset is asserted, the device (and its asso- ciated external circuitry) enters Standby Mode and consumes minimal current.

Assertion of RESET_N causes the following:

1. The PHY is disabled and the differential pairs will be in a high-impedance state.

2. All transactions immediately terminate; no states are saved.

3. All internal registers return to the default state.

4. The external crystal oscillator is halted.

5. The PLL is halted.

Note: All power supplies must have reached the operating levels mandated in Section 9.2, Operating Condi-

tions**, prior to (or coincident with) the assertion of RESET_N.

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8.11.3 USB BUS RESET

In response to the upstream port signaling a reset to the device, the device performs the following:

1. Sets default address to 0.

2. Sets configuration to Unconfigured.

3. Moves device from suspended to active (if suspended).

4. Complies with the USB Specification for behavior after completion of a reset sequence.

The host then configures the device in accordance with the USB Specification.

Note: The device does not propagate the upstream USB reset to downstream devices.

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9.0 OPERATIONAL CHARACTERISTICS

9.1 Absolute Maximum Ratings*

Digital Core Supply Voltage (VCORE) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to +1.21 V

+3.3 V Supply Voltage (VDD33) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.5 V to +4.6 V

Positive voltage on input signal pins, with respect to ground (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +4.6 V

Negative voltage on input signal pins, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V

Positive voltage on XTALI/CLK_IN, with respect to ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.63 V

Positive voltage on USB DP/DM signal pins, with respect to ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +6.0 V

Positive voltage on USB 3.2 Gen 2 USB3UP_xxxx and USB3DN_xxxx signal pins, with respect to ground . . . . . 1.21 V

Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55

Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +125

Lead Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Refer to JEDEC Spec. J-STD-020

HBM ESD Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +/-3.5 kV

Note 1: When powering this device from laboratory or system power supplies, it is important that the absolute max-

imum ratings not be exceeded or device failure can result. Some power supplies exhibit voltage spikes on their outputs when AC power is switched on or off. In addition, voltage transients on the AC power line may appear on the DC output. If this possibility exists, it is suggested that a clamp circuit be used.

Note 2: This rating does not apply to the following pins: All USB DM/DP pins, XTAL1/CLK_IN, XTALO and

VBUS_MON_UP.

*Stresses exceeding those listed in this section could cause permanent damage to the device. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Functional operation of the device at any condition exceeding those indicated in Section 9.2, Operating Conditions**, Section 9.5,

DC Specifications, or any other applicable section of this specification is not implied.

C to +150oC

9.2 Operating Conditions**

Digital Core Supply Voltage (VCORE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +1.09 V to +1.21 V

+3.3 V Supply Voltage (VDD33) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +3.0 V to +3.6 V

Input Signal Pins Voltage (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 V to +3.6 V

XTALI/CLK_IN Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 V to +3.6 V

USB 2.0 DP/DM Signal Pins Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3 V to +5.5 V

USB 3.2 Gen 2 USB3UP_xxxx and USB3DN_xxxx Signal Pins Voltage . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +1.21 V

Ambient Operating Temperature in Still Air (T

Digital Core Supply Voltage Rise Time (T

+3.3 V Supply Voltage Rise Time (T

Note 3: 0

C to +70oC for commercial version, -40oC to +85oC for industrial version. **Proper operation of the device

is guaranteed only within the ranges specified in this section. Do not drive input signals without power supplied to the device.

). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Note 3

in Figure 9-1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ms

in Figure 9-1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 ms

DS00003143B-page 42  2018 - 2020 Microchip Technology Inc.

USB7216

10%

90%

Voltage

90%

Time

100%

3.3 V

VSS

VDD33

90%

100%

VCORE

FIGURE 9-1: SUPPLY RISE TIME MODEL

Note: The Power Supply Rise time requirement does not apply if the RESET_N signal is held low during power

on and released after power levels rise and stabilize above the power on thresholds, or if the RESET_N signal is toggled after power supplies become stable.

9.3 Package Thermal Specifications

TABLE 9-1: PACKAGE THERMAL PARAMETERS

Symbol °C/W Velocity (Meters/s)

19 0







Note: Thermal parameters are measured or estimated for devices in a multi-layer 2S2P PCB per JESDN51.

16 1

14 2.5

0.1 0

0.1 1

9 0

1.3 0

1.3 1

10 -

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 43

USB7216

9.4 Power Consumption

This section details the power consumption of the device as measured during various modes of operation. Power dissipation is determined by temperature, supply voltage, and external source/sink requirements.

TABLE 9-2: DEVICE POWER CONSUMPTION

Typical (mA) @ 25°C Typical Power

VCORE (1.15V) VDD33 (3.3V) (mW)

Global Suspend 9.6 14.5 59

VBUS Off 9.4 13.8 56

Reset 4.2 0.2 5

Data for Calculating Active Transfer Current

Upstream Port Link Speed Base Currents

SS+ Current 410 30.8

SS Current 370 27.3

HS Current 58 19.7

Additional Current Per Enabled Port

SS+ Current 179 11.1

SS Current 143 9.1

HS Current 1 10.8

Example Active Data Transfer Current Calculation: 1 SS+ Port and 2 HS Ports

Active Data Transfer Current (mA @ 3.3V) {30.8} + {1 * 11.1} + {2 * 10.8} = 63.5

Active Data Transfer Current (mA @ 1.15V) {410} + {1 * 179} + {2 * 1} = 591

Note: In the Active Idle and Active Data Transfer sections of Table 9-2, the various port configurations are indi-

cated via the following acronyms:

SS+ = USB 3.2 SuperSpeed+ (Gen 2) SS = USB 3.2 SuperSpeed (Gen 1) HS = USB 2.0 High Speed

DS00003143B-page 44  2018 - 2020 Microchip Technology Inc.

9.5 DC Specifications

TABLE 9-3: I/O DC ELECTRICAL CHARACTERISTICS

Parameter Symbol Min Typical Max Units Notes

I Type Input Buffer

USB7216

Low Input Level

High Input Level

2.1

0.9 V

IS Type Input Buffer

Low Input Level

High Input Level

Schmitt Trigger Hysteresis (V

- V

ILT

)

IHT

HYS

2.1

100 160

0.9

240

O12 Type Output Buffer

Low Output Level

High Output Level

VDD33-0.4

0.4 VVI

OD12 Type Output Buffer

Low Output Level V

0.4 V IOL = 12 mA

ICLK Type Input Buffer (XTALI Input)

Low Input Level

High Input Level

1.1

0.35 V

IO-U Type Buffer (See Note 5)

Note 4: XTALI can optionally be driven from a 25 MHz singled-ended clock oscillator.

Note 5: Refer to the USB 3.2 Gen 2 Specification for USB DC electrical characteristics.

= 12 mA

= -12 mA

Note 4

Note 5

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 45

USB7216

VDD33

VCORE

RESET_N

All External

Power Supplies

opp

Configuration

Straps

csh

9.6 AC Specifications

This section details the various AC timing specifications of the device.

9.6.1 POWER SUPPLY AND RESET_N SEQUENCE TIMING

There is no specific requirement for power sequencing of VDD33 and VCORE for device operation. Figure 9-2 illustrates the recommended power supply sequencing for ensuring long term reliability of the device. VCORE should rise after or at the same time as VDD33. Similarly, RESET_N should rise after or at the same time as VDD33. RESET_N does not have any other timing dependencies. The rise times for VCORE and VDD33 are provided in Section 9.2, Operating Con-

ditions** and Figure 9-1.

FIGURE 9-2: POWER SUPPLY AND RESET_N SEQUENCE TIMING

TABLE 9-4: POWER SUPPLY AND RESET_N SEQUENCE TIMING

9.6.2 POWER-ON AND CONFIGURATION STRAP TIMING

Figure 9-3 illustrates the configuration strap valid timing requirements in relation to power-on, for applications where

RESET_N is not used at power-on. In order for valid configuration strap values to be read at power-on, the following timing requirements must be met. The operational levels (V

Section 9.2, Operating Conditions**.

FIGURE 9-3: POWER-ON CONFIGURATION STRAP VALID TIMING

TABLE 9-5: POWER-ON CONFIGURATION STRAP LATCHING TIMING

Device configuration straps are also latched as a result of RESET_N assertion. Refer to Section 9.6.3, Reset and Con-

figuration Strap Timing for additional details.

DS00003143B-page 46  2018 - 2020 Microchip Technology Inc.

Symbol Description Min Typ Max Units

VDD33

reset

Symbol Description Min Typ Max Units

csh

VDD33 to VCORE rise delay 0 ms

VDD33 to RESET_N rise delay 0 ms

) for the external power supplies are detailed in

opp

Configuration strap hold after external power supplies at operational levels

1 ms

USB7216

RESET_N

Configuration

Straps

rstia

csh

All External

Power Supplies

& Reset

opp

SMBus

SMBus commands accepted

(if SMBus slave interface is enabled)

SMBus interface not available

(slave interface will stretch clock if addressed)

Power-on-Reset

SOC_CFG STAGE

9.6.3 RESET AND CONFIGURATION STRAP TIMING

Figure 9-4 illustrates the RESET_N pin timing requirements and its relation to the configuration strap pins. Assertion of

RESET_N is not a requirement. However, if used, it must be asserted for the minimum period specified. Refer to

Section 8.11, Resets for additional information on resets. Refer to Section 3.3, Configuration Straps and Programmable Functions for additional information on configuration straps.

FIGURE 9-4: RESET_N CONFIGURATION STRAP TIMING

TABLE 9-6: RESET_N CONFIGURATION STRAP TIMING

Symbol Description Min Typ Max Units

rstia

csh

RESET_N input assertion time 5 s

Configuration strap pins hold after RESET_N deassertion 1 ms

Note: The clock input must be stable prior to RESET_N deassertion.

Configuration strap latching and output drive timings shown assume that the Power-On reset has finished first otherwise the timings in Section 9.6.2, Power-On and Configuration Strap Timing apply.

9.6.4 POWER-ON OR RESET TO SMBUS SLAVE READY TIMING

Figure 9-5 illustrates the SMBus Slave interface readiness in relation to power-on or de-assertion of RESET_N. In order

to ensure reliable SMBus slave operation, the SMBus master must allow the bus to remain idle until t has been met. The operational levels (V

) for the external power supplies are detailed in Section 9.2, Operating Con-

opp

SMBUS_RDY

timing

ditions**.

FIGURE 9-5: POWER-ON OR RESET TO SMBUS SLAVE READY TIMING

TABLE 9-7: POWER-ON OR RESET TO SMBUS SLAVE READY TIMING

Symbol Description Min Typ Max Units

SMBUS_RDY

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 47

Power-on or RESET_N deassertion to SMBus ready 40 ms

USB7216

SMBus

SMBus commands accepted

(if ‘Attach with I2C slave enabled during

runtime’ command is used )

SMBus interface not available

(slave interface will stretch clock if addressed)

SOC_CFG Stage

Attach

Command ACK

Runtime StageSOC_CFG Stage

At tach

Command

9.6.5 USB ATTACH COMMAND TO SMBUS SLAVE READY TIMING

Figure 9-6 illustrates the SMBus Slave interface readiness in relation to ACK of the Slave interface to the “USB Attach

with SMBus Runtime Access” (AA56h) from the SMBus Master. In order to ensure reliable SMBus slave operation, the SMBus master must allow the bus to remain idle after issuing the “USB Attach with SMBus Runtime Access” until t

TACH_RDY

timing has been met.

Note: When accessing SMBus during runtime, it is critical to force some clocks to stay on. If this step is not taken,

the SMBus slave interface will not be accessible while the hub is placed into a Suspend state by the host.

FIGURE 9-6: USB ATTACH COMMAND TO SMBUS SLAVE READY TIMING

AT-

TABLE 9-8: USB ATTACH COMMAND TO SMBUS SLAVE READY TIMING

Symbol Description Min Typ Max Units

ATTACH_RDY

Note 6: The t

USB Attach command to SMBus ready (Note 6) 11.5 ms

ATTACH_RDY

values are preliminary and subject to change.

9.6.6 USB TIMING

All device USB signals conform to the voltage, power, and timing characteristics/specifications as set forth in the Uni- versal Serial Bus Specification. Please refer to the Universal Serial Bus Revision 3.2 Specification, available at http:// www.usb.org/developers/docs.

9.6.7 SMBUS TIMING

All device SMBus signals conform to the voltage, power, and timing characteristics/specifications as set forth in the Sys- tem Management Bus Specification. Please refer to the System Management Bus Specification, Version 1.0, available at http://smbus.org/specs.

9.6.8 I2C TIMING

All device I2C signals conform to the 100KHz Standard-mode (Sm) and 400KHz Fast Mode (Fm) voltage, power, and timing characteristics/specifications as set forth in the I available at http://www.nxp.com/documents/user_manual/UM10204.pdf.

C-Bus Specification. Please refer to the I2C-Bus Specification,

9.6.9 I2S TIMING

All device I2S signals conform to the voltage, power, and timing characteristics/specifications as set forth in the I2S-Bus Specification. Please refer to the I I2SBUS.pdf

S-Bus Specification, available at www.sparkfun.com/datasheets/BreakoutBoards/

DS00003143B-page 48  2018 - 2020 Microchip Technology Inc.

9.6.10 SPI/SQI MASTER TIMING

SPI_CLK

SPI_D[3:0] (in)

SPI_D[3:0] (out)

SPI_CE_N

cel

Output

data valid

clq

ceh

Output

data valid

Input

data valid

ceh

This section specifies the SPI/SQI master timing requirements for the device.

FIGURE 9-7: SPI/SQI MASTER TIMING

USB7216

TABLE 9-9: SPI/SQI MASTER TIMING (30 MHZ OPERATION)

Symbol Description Min Typ Max Units

Clock frequency 30 MHz

Chip enable (SPI_CE_N) high time 100 ns

Clock to input data 13 ns

Input data hold time 0 ns

Output setup time 5 ns

Output hold time 5 ns

Clock to output valid 4 ns

Chip enable (SPI_CE_N) low to first clock 12 ns

Last clock to chip enable (SPI_CE_N) high 12 ns

ceh

clq

cel

ceh

TABLE 9-10: SPI/SQI MASTER TIMING (60 MHZ OPERATION)

Symbol Description Min Typ Max Units

Clock frequency 60 MHz

Chip enable (SPI_CE_N) high time 50 ns

Clock to input data 9 ns

Input data hold time 0 ns

Output setup time 5 ns

Output hold time 5 ns

Clock to output valid 4 ns

Chip enable (SPI_CE_N) low to first clock 12 ns

Last clock to chip enable (SPI_CE_N) high 12 ns

ceh

clq

cel

ceh

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 49

USB7216

XTALO

XTALI

9.7 Clock Specifications

The device can accept either a 25MHz crystal or a 25MHz single-ended clock oscillator input. If the single-ended clock oscillator method is implemented, XTALO should be left unconnected and XTALI/CLK_IN should be driven with a nominal 0-3.3V clock signal. The input clock duty cycle is 40% minimum, 50% typical and 60% maximum.

It is recommended that a crystal utilizing matching parallel load capacitors be used for the crystal input/output signals (XTALI/XTALO). The following circuit design (Figure 9-8) and specifications (Table 9-11) are required to ensure proper operation.

FIGURE 9-8: 25MHZ CRYSTAL CIRCUIT

9.7.1 CRYSTAL SPECIFICATIONS

It is recommended that a crystal utilizing matching parallel load capacitors be used for the crystal input/output signals (XTALI/XTALO). Refer to Table 9-11 for the recommended crystal specifications.

TABLE 9-11: CRYSTAL SPECIFICATIONS

Parameter Symbol Min Nom Max Units Notes

Crystal Cut AT, typ

Crystal Oscillation Mode Fundamental Mode

Crystal Calibration Mode Parallel Resonant Mode

Frequency F

Frequency Tolerance @ 25

Frequency Stability Over Temp F

Frequency Deviation Over Time F

Total Allowable PPM Budget - - ±100 PPM

Shunt Capacitance C

Load Capacitance C

Drive Level P

Equivalent Series Resistance R

Operating Temperature Range Note 8 - Note 9

XTALI/CLK_IN Pin Capacitance - 3 typ - pF Note 10

XTALO Pin Capacitance - 3 typ - pF Note 10

C F

fund

tol

temp

age

- 25.000 - MHz

- - ±50 PPM

- ±3 to 5 - PPM Note 7

- 7 typ - pF

- 20 typ - pF

100 - - uW

- - 60 Ω

DS00003143B-page 50  2018 - 2020 Microchip Technology Inc.

USB7216

Note 7: Frequency Deviation Over Time is also referred to as Aging.

Note 8: 0 °C for commercial version, -40 °C for industrial version.

Note 9: +70 °C for commercial version, +85 °C for industrial version.

Note 10: This number includes the pad, the bond wire and the lead frame. PCB capacitance is not included in this

value. The XTALI/CLK_IN pin, XTALO pin and PCB capacitance values are required to accurately calcu- late the value of the two external load capacitors. These two external load capacitors determine the accuracy of the 25.000 MHz frequency.

9.7.2 EXTERNAL REFERENCE CLOCK (CLK_IN)

When using an external reference clock, the following clock characteristics are required:

• 25 MHz

• 50% duty cycle ±10%, ±100 ppm

• Jitter < 100 ps RMS

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 51

USB7216

PIN 1

10.0 PACKAGE OUTLINE

10.1 Package Marking Information

100-VQFN (12x12 mm)

Legend: i Temperature range designator (Blank = commercial, i = industrial)

R Product revision nnn Internal code e3 Pb-free JEDEC YY Year code (last two digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it

will be carried over to the next line, thus limiting the number of available characters for customer-specific information.

* Standard device marking consists of Microchip part number, year code, week code and traceability code.

For device marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

designator for Matte Tin (Sn)

DS00003143B-page 52  2018 - 2020 Microchip Technology Inc.

10.2 Package Drawings

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http://www.microchip.com/packaging.

FIGURE 10-1: 100-VQFN PACKAGE (DRAWING)

USB7216

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 53

USB7216

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DS00003143B-page 54  2018 - 2020 Microchip Technology Inc.

FIGURE 10-3: 100-VQFN PACKAGE (LAND-PATTERN)

RECOMMENDED LAND PATTERN

Dimension Limits

Units

Optional Center Pad Width

Contact Pad Spacing

Optional Center Pad Length

Contact Pitch

8.10

MILLIMETERS

0.40 BSC

MIN

MAX

11.70

Contact Pad Length (X100)

Contact Pad Width (X100)

1.05

0.20

Microchip Technology Drawing C04-2407A

NOM

SILK SCREEN

100

C1Contact Pad Spacing 11.70

Contact Pad to Center Pad (X100) G1 0.20 Thermal Via Diameter V Thermal Via Pitch EV

0.33

1.20

ØV

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Notes:

Dimensioning and tolerancing per ASME Y14.5M

For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during reflow process

USB7216

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 55

USB7216

APPENDIX A: REVISION HISTORY

TABLE A-1: REVISION HISTORY

Revision Level & Date Section/Figure/Entry Correction

Cover • Added bullet: “Programming of firmware

image to external SPI memory device from USB host.”

• Updated “Configuration programming via

OTP ROM...” to “Configuration programming via OTP Memory”

DS00003143B (10-20-20)

All Updated USB 3.1 references to USB 3.2 per

• Updated “Enhanced OEM configuration options available through either OTP or SPI ROM” to “Enhanced OEM configuration options available through either OTP or external SPI memory

• Updated USB Type-C trademark, USB Type-C

latest USB IF guidelines.

to a registered

Table 1-2 Added AIO buffer type.

Section 1.3, Pin Reset States Added new pin reset state section/table.

Figure 2-1 Modified the block diagram

Section 3.1, Pin Assignments • Added pin reset states to pin table.

Table 3-1, Pin Descriptions • Added “If Unused” column and informa-

tion.

• Updated DP1_VBUS_MON buffer type to AIO, updated description and figure.

• Updated VBUS_MON_UP buffer type to AIO and updated description

Section 3.3.4, PF[31:3] Configuration (CFG_STRAP[2:1])

Table 3-6, Programmable Functions Descriptions

Section 3.0, Pin Descriptions, Figure 3-1, Table 3-1, Section 9.6.1, Power Supply and RESET_N Sequence Timing, Table 9-4

Section 5.1.7, OTP Configuration Stage (CFG_OTP)

Section 7.1, SPI/SQI Master Interface Added new second paragraph.

• Updated PF29 assignment.

• Added pin reset states to programmable function descriptions.

Removed VBUS_DET function (from pin 2).

Added note.

Section 8.2.1, Port Power Control using USB Power Switch

Section 8.2.2, Port Power Control using Poly Fuse

Section 8.3, CC Pin Orientation and Detection

DS00003143B-page 56  2018 - 2020 Microchip Technology Inc.

Added note after first paragraph.

Updated section description for clarity.

TABLE A-1: REVISION HISTORY (CONTINUED)

Revision Level & Date Section/Figure/Entry Correction

Section 8.5, FlexConnect Updated note.

USB7216

Section 8.6, Multi-Host Endpoint Reflector

Section 9.1, Absolute Maximum Ratings*

Section 9.2, Operating Conditions** • Revised Digital Code and 3.3V supply

Section 9.4, Power Consumption Updated power consumption data.

Section 9.5, DC Specifications • Updated I type buffer V

Section 9.6.1, Power Supply and RESET_N Sequence Timing

Section 9.6.4, Power-On or Reset to SMBus Slave Ready Timing and Section 9.6.5, USB Attach Command to SMBus Slave Ready Timing

DS00003143A (11-01-19) All Initial Release

Updated NCM reference to “NCM v1.0”

Added HBM ESD information.

voltage rise times.

• Added note under Figure 9-1

• Updated ICLK buffer type V

Updated description.

Added new sections.

and V

values.

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 57

USB7216

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

(1)

PART NO. [X]

Device

Device: USB7216

Tape and Reel Option:

[X]

Tape and Reel

Option

Blank = Standard packaging (tray) T = Tape and Reel

Range

(Note 1)

XXX

PackageTemperature

Examples:

a) USB7216/KDX

Tray, 0C to +70C, 100-pin VQFN

b) USB7216T/KDX

Tape & reel, 0C to +70C, 100-pin VQFN

c) USB7216-I/KDX

Tray, -40C to +85C, 100-pin VQFN

d) USB7216T-I/KDX

Tape & reel, -40C to +85C, 100-pin VQFN

Temperature Range:

Package: KDX = 100-pin VQFN

Blank = 0C to +70C (Commercial) I = -40C to +85C (Industrial)

Note 1: Tape and Reel identifier only appears in

the catalog part number description. This identifier is used for ordering purposes and is not printed on the device package. Check with your Microchip Sales Office for package availability with the Tape and Reel option.

DS00003143B-page 58  2018 - 2020 Microchip Technology Inc.

USB7216

THE MICROCHIP WEB SITE

Microchip provides online support via our WWW site at www.microchip.com. This web site is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the web site contains the following information:

• Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s

guides and hardware support documents, latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQ), technical support requests, online discussion

groups, Microchip consultant program member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of semi-

nars and events, listings of Microchip sales offices, distributors and factory representatives

CUSTOMER CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.

To register, access the Microchip web site at www.microchip.com. Under “Support”, click on “Customer Change Notification” and follow the registration instructions.

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Field Application Engineer (FAE)

• Technical Support

Customers should contact their distributor, representative or Field Application Engineer (FAE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.

Technical support is available through the web site at: http://microchip.com/support

 2018 - 2020 Microchip Technology Inc. DS00003143B-page 59

USB7216

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specifications contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is secure when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip's intellectual property rights.

• Microchip is willing to work with any customer who is concerned about the integrity of its code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is "unbreakable." Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip's code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications.

THIS INFORMATION IS PROVIDED BY MICROCHIP "AS IS". MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE.

IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE

FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer's risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.

Trademarks

The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in

other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other

countries. All other trademarks mentioned herein are property of their respective companies.

9781522463542

ISBN:

For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality.

DS00003143B-page 60  2018 - 2020 Microchip Technology Inc.

Worldwide Sales and Service

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 2018 - 2020 Microchip Technology Inc. DS00003143B-page 61

02/28/20

Microchip USB7216 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

1.0 PREFACE

1.1 General Terms

TABLE 1-1: GENERAL TERMS

1.2 Buffer Types

TABLE 1-2: BUFFER TYPES

1.3 Pin Reset States

TABLE 1-3: PIN RESET STATE LEGEND

1.4 Reference Documents

2.0 INTRODUCTION

2.1 General Description

FIGURE 2-1: USB7216 INTERNAL BLOCK DIAGRAM - UPSTREAM TYPE-B APPLICATION

3.0 PIN DESCRIPTIONS

3.1 Pin Assignments

FIGURE 3-1: USB7216 100-VQFN PIN ASSIGNMENTS

3.2 Pin Descriptions

TABLE 3-1: PIN DESCRIPTIONS

3.3 Configuration Straps and Programmable Functions

3.3.1 PORT DISABLE CONFIGURATION (PRT_DIS_P[6:1] / PRT_DIS_M[6:1])

3.3.2 NON-REMOVABLE PORT CONFIGURATION (CFG_NON_REM)

TABLE 3-2: CFG_NON_REM RESISTOR ENCODING

3.3.3 BATTERY CHARGING CONFIGURATION (CFG_BC_EN)

TABLE 3-3: CFG_BC_EN RESISTOR ENCODING

3.3.4 PF[31:3] CONFIGURATION (CFG_STRAP[2:1])

TABLE 3-4: CFG_STRAP[2:1] RESISTOR ENCODING

TABLE 3-5: PF[31:3] FUNCTION ASSIGNMENT

TABLE 3-6: PROGRAMMABLE FUNCTIONS DESCRIPTIONS

3.4 Physical and Logical Port Mapping

TABLE 3-7: USB7216 PHYSICAL VS. LOGICAL PORT MAPPING

4.0 DEVICE CONNECTIONS

4.1 Power Connections

FIGURE 4-1: POWER CONNECTIONS

4.2 SPI Flash Connections

FIGURE 4-2: QUAD-SPI FLASH CONNECTIONS

4.3 SMBus/I2C Connections

FIGURE 4-3: SMBUS/I2C CONNECTIONS

4.4 I2S Connections

5.0 MODES OF OPERATION

TABLE 5-1: MODES OF OPERATION

FIGURE 5-1: HUB MODE FLOWCHART

5.1 Boot Sequence

5.1.1 STANDBY MODE

5.1.2 SPI INITIALIZATION STAGE (SPI_INIT)

5.1.3 CONFIGURATION FROM INTERNAL ROM STAGE (CFG_ROM)

5.1.4 CONFIGURATION STRAP READ STAGE (CFG_STRAP)

5.1.5 SMBUS CHECK STAGE (SMBUS_CHECK)

5.1.6 SMBUS CONFIGURATION STAGE (CFG_SMBUS)

5.1.7 OTP CONFIGURATION STAGE (CFG_OTP)

5.1.8 HUB CONNECT STAGE (USB_ATTACH)

5.1.9 NORMAL MODE (NORMAL_MODE)

6.0 DEVICE CONFIGURATION

7.0 DEVICE INTERFACES

7.1 SPI/SQI Master Interface

TABLE 7-1: SPI/SQI PIN USAGE

7.2 SMBus/I2C Master/Slave Interfaces

7.3 I2S Interface

7.3.1 MODES OF OPERATION

8.0 FUNCTIONAL DESCRIPTIONS

8.1 Downstream Battery Charging

FIGURE 8-1: BATTERY CHARGING EXTERNAL POWER SUPPLY

8.2 Port Power Control

8.2.1 PORT POWER CONTROL USING USB POWER SWITCH

FIGURE 8-2: PORT POWER CONTROL WITH USB POWER SWITCH

8.2.2 PORT POWER CONTROL USING POLY FUSE

FIGURE 8-3: PORT POWER CONTROL USING A POLY FUSE

8.3 CC Pin Orientation and Detection

8.4 PortSplit

8.5 FlexConnect

8.6 Multi-Host Endpoint Reflector

8.7 USB to GPIO Bridging

8.8 USB to I2C Bridging

8.9 USB to SPI Bridging

8.10 Link Power Management (LPM)

TABLE 8-1: LPM STATE DEFINITIONS

8.11 Resets

8.11.1 POWER-ON RESET (POR)

8.11.2 EXTERNAL CHIP RESET (RESET_N)