MICROCHIP TCM809, TCM810 Technical data

查询TCM809JELB713供应商

3-Pin Microc ontroller Reset Monitors

TCM809/TCM810

Features

• Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V
Nominal System Voltage Supplies

• 140 msec Minimum RESET Time Out Period

• RESET Output to VDD = 1.0V (TCM809)

• Low Supply Current, 9 µA (typ.)

•VDD Transient Immunity

• Small 3-Pin SC-70 and SOT-23B Packages

• No External Components

• Push-Pull RESET Output

• Temperature Range:

- Industrial, SC-70 (E): -40°C to +85°C

- Extended, SOT-23, SC-70 (V): -40°C to +125°C

Applications

• Computers

• Embedded Systems

• Battery-Powered Equipment

• Critical Microcontroller Power Supply Monitoring

• Automotive

Typical Application Circuit

V

DD

3

V

DD

TCM809

RESET

GND

1

Microcontroller

2

V

DD

PICmicro

RESET
INPUT
(Active-Low)

GND

General Description

The TCM809 and TCM810 are cost-effective system
supervisor circuits designed to monitor V
systems and provide a reset signal to the host proces­sor, when necessary. No external components are
required.

The RESET output is typically driven active within
65 µsec of V
old. RESET is maintained active for a minimum of
140 msec after VDD rises above the reset threshold.
The TCM810 has an act ive-high RESET outp ut, while
the TCM809 has an active-low RESET output. The out­put of the TCM809/TCM810 is valid down to V
Both devices are available in 3-Pin SC-70 and SOT-23B
packages.

The TCM809/TCM810 is optimized to reject fast
transient glitches on the V
of 9 µA (typ., V
for battery-powered applications.

falling through the reset voltage thresh-

DD

line. A low supply current

= 3.3V) make these devices suitable

DD

DD

in digital

DD

DD

= 1V.

Pin Configurations

SOT-23B/SC-70

1

GND

®

TCM809 RESET

TCM810 (RESET)

Note: 3-Pin SOT-23B is equivalent to

JEDEC TO-236.

2

TCM810

TCM809/

V

3

DD

 2004 Microchip Technology Inc. DS21661C-page 1

TCM809/TCM810

1.0 ELECTRICAL

PIN FUNCTION TABLE

CHARACTERISTICS

NAME FUNCTION

Absolute Maximum Ratings†

Supply Voltage (VDD to GND)..........................................6.0V

, RESET.................................... – 0.3V to (VDD +0.3V)

RESET
Input Current, V
Output Current, RESET
dV/dt (V

DD

Operating Temperature Range....................– 40°C to +125°C

Power Dissipation (T

3-Pin SOT-23B (derate 4 mW/°C above +70°C)......320 mW

3-Pin SC-70 (derate 2.17 mW/°C above +70°C)......174 mW

Storage Temperature Range.......................– 65°C to +150°C

Maximum Junction Temperature, T

† Notice: Stresses above those listed under “M aximum ratings” may
cause permanent damage to the device. This is a stress rating only and
functional operation of the device at those or any ot her conditions
above those indicat ed in th e o per ati o nal li st i ngs of t his specification is
not implied. Exposure to maximum rating conditions for extended peri­ods may affect device reliability.

.........................................................20 mA

DD

, RESET...................................20 mA

).............................................................100V/µsec

= 70°C):

A

..............................150°C

J

GND Ground.
RESET

(TCM809) RESET push-pull output

remains low while V
the reset voltage threshold and
for 240 msec (140msec min.)
after V

rises above reset

DD

threshold.

RESET (TCM810) RESET push-pull output

remains high wh ile V
the reset voltage threshold and
for 240 msec (140msec min.)
after V

rises above reset

DD

threshold.

V

DD

Supply voltage (+2.5V, +3.0V,
+3.3V, +5.0V).

ELECTRICAL CHARACTERISTICS

VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C,

= 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).

V

DD

Parameter Sym Min Typ Max Units Test Conditions

Range 1.0 — 5.5 V TA = 0°C to +70°C

V

DD

1.2 — 5.5 T

Supply Current I

Reset Threshold (Note 2) V

Reset Threshold T empco — 30 — ppm/°C
V

to Reset Delay, — 65 — µsec VDD = VTH to (VTH – 100 mV) (Note 2)

DD

Reset Active Time Out
Period

Note 1: Production testing done at T

2: RESET

output for TCM809, RESET output for TCM810.

CC

TH

—1230µATCM8xxL/M/J: VDD < 5.5V
—925 TCM8xxR/S/T/Z: V

4.56 4.63 4.70 V TCM8xxL: TA = +25°C

4.50 — 4.75

4.31 4.38 4.45 V TCM8xxM: T

4.25 — 4.50 V T

3.93 4.00 4.06 V TCM809J: T

3.89 — 4.10 V T

3.04 3.08 3.11 V TCM8xxT: T

3.00 — 3.15 V T

2.89 2.93 2.96 V TCM8xxS: T

2.85 — 3.00 V T

2.59 2.63 2.66 V TCM8xxR: T

2.55 — 2.70 V T

2.28 2.32 2.35 V TCM8xxZ: T

2.25 — 2.38 V T

140 320 560 msec

= +25°C, overtemperature limits ensured by QC screen.

A

= – 40°C to +125°C

A

< 3.6V

DD

= – 40°C to +125°C

T

A

= +25°C

A

= – 40°C to +125°C

A

= +25°C

A

= – 40°C to +125°C

A

= +25°C

A

= – 40°C to +125°C

A

= +25°C

A

= – 40°C to +125°C

A

= +25°C

A

= – 40°C to +125°C

A

= +25°C

A

= – 40°C to +125°C

A

is below

DD

is below

DD

DS21661C-page 2  2004 Microchip Technology Inc.

TCM809/TCM810

ELECTRICAL CHARACTERISTICS (CONTINUED)

VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C,
V

= 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).

DD

Parameter Sym Min Typ Max Units Test Conditions

RESET Output Voltage
Low (TCM809)

Output Voltage

RESET
High (TCM809)

RESET Output Voltage
Low (TCM810)

RESET Output Voltage
High (TCM810)

Note 1: Production testing done at T

2: RESET

output for TCM809, RESET output for TCM810.

V

OL

V

OH

V

OL

V

OH

——0.3VTCM809R/S/T/Z: VDD = VTH min, I
——0.4 TCM809L/M/J: V
——0.3 V

0.8 V

DD

V

– 1.5 — — TCM809L/M/J: VDD > VTH max, I

DD

——VTCM809R/S/T/Z: VDD > VTH max, I

> 1.0V, I

DD

SINK

DD

= 50 µA

= VTH min, I

——0.3VTCM810R/S/T/Z:VDD = VTH max, I
——0.4 TCM810L/M: V

0.8 V

DD

= +25°C, overtemperature limits ensured by QC screen.

A

——V1.8 < V

DD

< VTH min, I

= VTH max, I

DD

SOURCE

= 150 µA

SINK
SINK

SOURCE

SOURCE

SINK

= 3.2 mA

SINK

= 1.2 mA
= 3.2 mA

= 500 µA

= 800 µA

= 1.2 mA

 2004 Microchip Technology Inc. DS21661C-page 3

TCM809/TCM810

Supply Current ( µA)

2.0 TYPICAL PERFORMANCE CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

18

TCM8xx/R/S/T/ Z, N o Lo ad

16

14

12

10

8

6

4

2

0

-40 -20 0 20 40 60 80 100 120
Temperature ( ° C)

VDD = 5V

VDD = 3V

VDD = 1V

450

400

350

300

250

200

150

100

Power-up Reset Timeout (µsec)

50

0

-40 -20 0 20 40 60 80 100 120
Temperature ( °C )

FIGURE 2-1: Supply Current vs.
Temperature.

16

TCM8xx/L/M/J, No Load

14

12

10

8

6

Supply Current ( µA)

4

2

0

-40-20 0 20406080100120

Temperature ( °C )

VDD = 5V

VDD = 3V

FIGURE 2-2: Supply Current vs.
Temperature.

VDD = 1V

FIGURE 2-3: Power-up Reset Time Out
vs. Temper atu re.

1.001

1

0.999

0.998

Normalized Reset Threshold

0.997

-40-200 20406080100120

Temperature (°C)

FIGURE 2-4: Normalized Reset
Threshold vs. Temperature.

DS21661C-page 4  2004 Microchip Technology Inc.

TCM809/TCM810

3.0 APPLICATIONS INFORMATION

3.1 VDD Transient Rejection

The TCM809/TCM8 10 prov ides accurate V
ing and reset timing during powe r-up, power-d own an d
brown-out/sag conditions. These devices also reject
negative-going transients (glitches) on the power sup­ply line. Figure3-1 shows the maximum transient dura­tion vs. maximum negative excursion (overdrive) for
glitch rejection. Any combination of duration and over­drive that lies under the curve will not generate a reset
signal.

V

DD

V

TH

Overdrive

Duration

400

TA = +25°C

320

240

monitor-

DD

Combinations above the curve are detected as a
brown-out or power-down condition. Transient immu­nity can be improved by adding a capacitor in close
proximity to the V

pin of the TCM809/TC M810.

DD

3.2 RESET Signal Integrity During
Power-Down

The TCM809 RESET output is valid to VDD = 1.0V.
Below this voltage the output becomes an "open cir­cuit" and does not sink current. This means CMOS
logic inputs to the microcontroller will be floating at an
undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where RESET
tained valid to V
connected from RESET

= 0V, a pull-down resistor must be

DD

to ground to discharge stray
capacitance s and hold the out put low (Figure3-2). This
resistor value, though not critical, should be chosen
such that it does not appreciably load RESET
normal operation (100 kΩ will be suitable for most
applications). Similarly, a pull-up resistor to VDD is
required for the TCM810 to ensure a valid high RESET
for VDD below 1.0V.

V

DD

must be main-

under

160

80

TCM8XXZ/R/S/T

(SOT-23)

0

Maximum Transient Duration (µsec)

1

Reset Comparator Overdrive

130
120
110
100

90
80
70
60

to Reset Delay (µsec)

50

DD

40

V

30

1 10 100 1000

Reset Comparator Overdrive (mV)

TCM8XXL/M/J (SOT-23)

5

[V

TH

[VTH - VDD] (mv)

100

- VDD] (mv)

TCM8XXL/M/J (SC-70)

TCM8XXZ/R/S/T (SC-70)

1000

FIGURE 3-1: Maximum Transient
Duration vs. Overdrive for Glitch Rejection at
+25°C.

V

DD

TCM809

RESET

R

1

GND

100 kΩ

FIGURE 3-2: The addition of R1 at the
RESET
RESET

output of the TCM809 ensures that the
output is valid to V

DD

= 0V.

 2004 Microchip Technology Inc. DS21661C-page 5

TCM809/TCM810

3.3 Controllers and Processors With
Bidirectional I/O Pins

Some microcontrollers have bidirectional reset pins.
Depending on the cu rrent drive cap ability of the co ntrol­ler pin, an indeterminate logic level may result if there
is a logic conflict. This can be avoided by adding a

4.7 kΩ resistor in series with the output of the TCM809/

TCM810 (Figure 3-3). If there are other components in
the system that require a reset signal, they should be
buffered so as not to load the reset line. If the other
components are required to follow the reset I/O of the
microcontroller, the buffer should be connected as
shown with the solid line.

Buffered RESET
To Other System
Components

®

V

DD

TCM809

RESET

GND

4.7 kΩ

Buffer

PICmicro

Micro-

controller

RESET

GND

FIGURE 3-3: Interfa cing the TCM809 to a
Bidirection al RESET I/O.

DS21661C-page 6  2004 Microchip Technology Inc.

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

3-Pin SOT-23B 3-Pin SC-70

TCM809/TCM810

cdef

cde

Top Side

Part Number SOT-23/SC-70

TCM809LENB J1
TCM809MENB J2
TCM809TENB J3
TCM809SENB J4
TCM809RENB J5
TCM809JENB J6
TCM809ZENB J7

TCM809LVNB/TCM809LVLB JZ
TCM809MVNB/TCM809MVLB JY
TCM809TVNB/TCM809TVLB JX
TCM809SVNB/TCM809SVLB JV
TCM809RVNB/TCM809RVLB JU
TCM809JVNB/TCM809JVLB JT
TCM809ZVNB/TCM809ZVLB JS (SC-70 package only)

Part Number SOT-23/SC-70

TCM810LENB K1
TCM810MENB K2
TCM810TENB K3
TCM810SENB K4
TCM810RENB K5
TCM810ZENB K6

fgh

Bottom Side

TCM810LVNB/TCM810LVLB KZ
TCM810MVNB/TCM810MVLB KY
TCM810TVNB/TCM810TVLB KX
TCM810SVNB/TCM810SVLB KV
TCM810RVNB/TCM 810RVLB KU

Legend: 1 Part Number + temperature range and voltage (two-digit code)

Note: In the event the full Microchip part number cannot be marked on one line, it will be

 2004 Microchip Technology Inc. DS21661C-page 7

2 Part Number + temperature range and voltage (two-digit code)
3 Lot ID number
4 Year and work week
5 Year and work week
6 Year and work week

carried over to the next line thus limiting the number of available characters for customer
specific information.

TCM809/TCM810

3-Lead Plastic Small Outline Transistor (NB) (SOT-23)

E
E1

2

B

n

1

c

β

Number of Pins
Pitch
Outside lead pitch (basic)

Foot Angle
Lead Thickness

Mold Draft Angle Top
Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: TO-236
Drawing No. C04-104

n
p

p1

φ

c

α

β

p1

D

p

A

φ

L

A1

MILLIMETERSINCHES*Units

α

A2

MAXNOMMINMAXNOMMINDimension Limits

33

0.96.038

1.92.076

1.121.010.89.044.040.035AOverall Height

1.020.950.88.040.037.035A2Molded Package Thickness

0.100.060.01.004.002.000A1Standoff §

2.642.372.10.104.093.083EOverall Width

1.401.301.20.055.051.047E1Molded Package Width

3.042.922.80.120.115.110DOverall Length

0.550.450.35.022.018.014LFoot Length
10501050

0.180.140.09.007.006.004

0.510.440.37.020.017.015BLead Width
10501050
10501050

DS21661C-page 8  2004 Microchip Technology Inc.

3-Lead Plastic Small Outline Transistor (LB) (SC-70)

E

E1

TCM809/TCM810

B

3

2

p1 D

p

1

a

c

b

Pitch
Outside lead pitch (basic)

Lead Thickness

Mold Draft Angle Top
Mold Draft Angle Bottom

*Controlling Parameter
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions
shall not exceed .005" (0.127mm) per side.

L

p1

A

p

c

a
b

.026 BSC.
.051 BSC.

A2

A1

MILLIMETERS*INCHESUnits

MAXMINMAXMINDimension Limits

33Number of Pins

0.65 BSC.

1.30 BSC.

1.100.80.043.031AOverall Height

1.000.80.039.031A2Molded Package Thickness
.0100.00.0004.000A1Standoff

2.401.80.094.071EOverall Width

1.351.15.053.045E1Molded Package Width

2.251.80.089.071DOverall Length

0.410.10.016.004LFoot Length

0.250.08.010.003

0.400.15.016.006BLead Width
12˚8˚12˚8˚
12˚8˚12˚8˚

JEITA (EIAJ) Equivalent: SC70

Drawing No. C04-104

 2004 Microchip Technology Inc. DS21661C-page 9

TCM809/TCM810

4.2 Product Tape and Reel Specifications

FIGURE 4-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16, AND 24 MM TAPE ONLY)

Top

Cover

Tape

A

0

W

K

0

B

0

P

TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS

Carrier

Case

Outline

Package

Type

Dimensions

W

mm

P

mm

NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180

LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180

Dimensions

A0

mm

Cavity

B0

mm

K0

mm

Output

Quantity

Units

FIGURE 4-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS

Device
Marking

User Direction of Feed

Pin 1

W, Width
of Carrier

Reel

Diameter in

mm

Tape

Marking
Device

Pin 1

P, Pitch

Standard Reel Component Orientation

DS21661C-page 10  2004 Microchip Technology Inc.

Reverse Reel Component Orientation

TCM809/TCM810

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X X

Device

V

DD

Reset

Temperature

Range

XXXX

X

Package

Threshold

Device: TCM80 9: Superv is or circuit with active-low RESET output

V

Reset Threshold: L = 4.63V

DD

Temperature Range: E = -40°C to +85°C

Package: NB713 = SOT-23B, 3-pin (Tape and Reel)

TCM810: Supervisor circuit with active-high RESET output

M=4.38V
J=4.00V
T=3.08V
S=2.93V
R=2.63V
Z=2.32V

V = -40°C to +125°C

LB713 = SC-70, 3-pin (Tape and Reel)

Examples:

a) TCM809LENB713: SOT-23B-3-TR,

b) TCM809LVLB713: SC-70-3-TR,

c) TCM809LVNB713: SOT-23B-3-TR,

a) TCM810MENB713: SOT-23B-3-TR,

b) TCM810RVLB713: SOT-23B-3-TR,

c) TCM810TVLB713: SC-70-3-TR,

Microcontroller 4.63V
Reset Monitor,

-40°C to +85°C,
Tape and Reel.

Microcontroller 4.63V
Reset Monitor,

-40°C to +125°C,
Tape and Reel.

Microcontroller 4.63V
Reset Monitor,

-40°C to +125°C,
Tape and Reel.

Microcontroller 4.38V
Reset Monitor,

-40°C to +85°C,
Tape and Reel.

Microcontroller 2.63V
Reset Monitor,

-40°C to +125°C,
Tape and Reel.

Microcontroller 4.38V
Reset Monitor,

-40°C to +125°C,
Tape and Reel.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microc hip sales office

2. The Microchip Corporate Literature Center U.S. FAX: [phone]

3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2004 Microchip Technology Inc. DS21661C-page 11

TCM809/TCM810

NOTES:

DS21661C-page 12  2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

EELOQ, MPLAB, PIC, PICmic ro, PI C START,

PRO MATE, PowerSmart and rfPIC are registered
trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.

AmpLab, FilterLab, microID, MXDEV, M XL AB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK,
MPSIM, PICkit, PICDEM, PICDEM.net, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, rfLAB, Select Mode,
SmartSensor, SmartTel and Total Endurance are trademarks
of Microchip Technology Incorporated in the U.S.A. and other
countries.

SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

8-bit MCUs, KEELOQ

®

code hopping

 2004 Microchip Technology Inc. DS21661C-page 13

WORLDWIDE SALES AND SERVICE

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Fax: [phone]

Toronto

6285 Northam Drive, Suite 108
Mississauga, Ontario L4V 1X5, Cana da
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Australia

Suite 22, 41 Rawson Street
Epping 2121, NSW
Australia
Tel: [phone]
Fax: [phone]

China - Beijing

Unit 706B
Wan Tai Bei Hai Bldg.
No. 6 Chaoyangmen Bei Str.
Beijing, 100027, China
Tel: [phone]
Fax: [phone]

China - Chengdu

Rm. 2401-2402, 24th Floor,
Ming Xing Financial Tower
No. 88 TIDU Street
Chengdu 610016, China
Tel: [phone]
Fax: [phone]

China - Fuzhou

Unit 28F, World Trade Plaza
No. 71 Wusi Road
Fuzhou 350001, China
Tel: [phone]
Fax: [phone]

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza
223 Hing Fong Road
Kwai Fong, N.T., Hong Kong
Tel: [phone]
Fax: [phone]

China - Shanghai

Room 701, Bldg. B
Far East International Plaza
No. 317 Xian Xia Road
Shanghai, 200051
Tel: [phone]
Fax: [phone]

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza
No. 5022 Binhe Road, Futian District
Shenzhen 518033, China
Tel: [phone]
Fax: [phone]

China - Shunde

Room 401, Hongjian Building, No. 2
Fengxiangnan Road, Ronggui Town, Shunde
District, Foshan City, Guangdong 528303, China
Tel: [phone] Fax: [phone]

China - Qingdao

Rm. B505A, Fullhope Plaza,
No. 12 Hong Kong Central Rd.
Qingdao 266071, China
Tel: [phone] Fax: [phone]

India

Divyasree Chambers
1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: [phone] Fax: [phone]

Japan

Benex S-1 6F
3-18-20, Shinyokohama
Kohoku-Ku, Yokohama-shi
Kanagawa, 222-0033, Japan
Tel: [phone] Fax: [phone]

Korea

168-1, Youngbo Bldg. 3 Floor
Samsung-Dong, Kangnam-Ku
Seoul, Korea 135-882
Tel: [phone] Fax: [phone] or
82-2-558-5934

Singapore

200 Middle Road
#07-02 Prime Centre
Singapore, 188980
Tel: [phone] Fax: [phone]

Taiwan

Kaohsiung Branch
30F - 1 No. 8
Min Chuan 2nd Road
Kaohsiung 806, Taiwan
Tel: [phone]
Fax: [phone]

Taiwan

Taiwan Branch
11F-3, No. 207
Tung Hua North Road
Taipei, 105, Taiwan
Tel: [phone] Fax: [phone]

EUROPE

Austria

Durisolstrasse 2
A-4600 Wels
Austria
Tel: [phone]
Fax: [phone]

Denmark

Regus Business Centre
Lautrup hoj 1-3
Ballerup DK-2750 Denmark
Tel: [phone] Fax: [phone]

France

Parc d’Activite du Moulin de Massy
43 Rue du Saule Trapu
Batiment A - ler Etage
91300 Massy, France
Tel: [phone]
Fax: [phone]

Germany

Steinheilstrasse 10
D-85737 Ismaning, Germany
Tel: [phone]
Fax: [phone]

Italy

Via Quasimodo, 12
20025 Legnano (MI)
Milan, Italy
Tel: [phone]
Fax: [phone]

Netherlands

P. A. De Biesbosch 14
NL-5152 SC Drunen, Netherlands
Tel: [phone]
Fax: [phone]

United Kingdom

505 Eskdale Road
Winnersh Triangle
Wokingham
Berkshir e, England RG41 5TU
Tel: [phone]
Fax: [phone]

02/17/04

DS21661C-page 14  2004 Microchip Technology Inc.