MICROCHIP TCM809, TCM810 Technical data

TCM809/TCM810
3-Pin Microc ontroller Reset Monitors
Features
• Precision VDD Monitor for 2.5V, 3.0V, 3.3V, 5.0V Nominal System Voltage Supplies
• 140 msec Minimum RESET Time-Out Period
• RESET Output to VDD = 1.0V (TCM809)
• Low Supply Current, 9 µA (typ.)
•VDD Transient Immunity
• Small 3-Pin SC-70 and SOT-23B Packages
• No External Components
• Push-Pull RESET Output
• Temperature Ranges:
- Industrial: SC-70 (E): -40°C to +85°C
- Extended: SOT-23, SC-70 (V): -40°C to +125°C
Applications
• Computers
• Embedded Systems
• Battery-powered Equipment
• Critical Microcontroller Power Supply Monitoring
• Automotive
Typical Application Circuit
V
DD
3
V
DD
TCM809
RESET
GND
1
Microcontroller
2
V
DD
PICmicro
RESET INPUT (Active-Low)
GND
®
General Description
The TCM809 and TCM810 are cost-effective system supervisor circuits designed to monitor V systems; providin g a reset s ignal to th e host proc essor, when necessary. No external components are required.
The RESET output is typically driven active within 65 µsec of V old. RESET is maintained active for a minimum of 140 msec after VDD rises above the reset threshold. The TCM810 has an act ive-high RESET outp ut, while the TCM809 has an active-low RESET output. The output of the TCM809/TCM810 is valid down to
= 1V. Both devices are available in 3-Pin SC-70
V
DD
and SOT-23B packages. The TCM809/TCM810 are optimized to reject fast
transient glitches on the V of 9 µA (typ., V for battery-powered applications.
falling through the reset voltage thresh-
DD
line. A low supply current
= 3.3V) make these devices suitable
DD
DD
in digital
DD
Pin Configurations
SOT-23B/SC-70
1
GND
V
3
DD
TCM810
TCM809 RESET
TCM810 (RESET)
Note: 3-Pin SOT -23B is equiv ale nt to
JEDEC TO-236.
2
TCM809/
© 2005 Microchip Technology Inc. DS21661D-page 1
TCM809/TCM810

1.0 ELECTRICAL CHARACTERISTICS

† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
Absolute Maximum Ratings†
operational listings of this specification is not implied. Exposure to maximum rating conditions fo r ext ended pe riods
Supply Voltage (VDD to GND) ........................................................6.0V
, RESET ...................................................-0.3V to (VDD +0.3V)
RESET Input Current, V Output Current, RESET dV/dt (V
DD
Operating Temperature Range ...................................-40°C to +125°C
Power Dissipation (T
3-Pin SOT-23B (derate 4 mW/°C above +70°C) ....................320 mW
3-Pin SC-70 (derate 2.17 mW/°C above +70°C)....................174 mW
Storage Temperature Range.......................................-65°C to +150°C
Maximum Junction Temperature, T
.......................................................................20 mA
DD
, RESET.................................................20 mA
)...........................................................................100V/µsec
= 70°C):
A
............................................150°C
J
may affect device reliability.
ELECTRICAL CHARACTERISTICS
VDD = Full Range, TA = Operating Temperature Range, unless otherwise noted. Typical values are at TA = +25°C,
= 5V for L/M/J, 3.3V for T/S, 3.0V for R and 2.5V for Z (Note 1).
V
DD
Parameter Sym Min Typ Max Units Test Conditions
V
Range 1.0 5.5 V TA = 0°C to +70°C
DD
1.2 5.5 T
Supply Current I
CC
—123ATCM8xxL/M/J: VDD < 5.5V —925 TCM8xxR/S/T/Z: V
Reset Threshold (Note 2) V
TH
4.56 4.63 4.70 V TCM8xxL: TA = +25°C
4.50 4.75 T
4.31 4.38 4.45 V TCM8xxM: T
4.25 4.50 V T
3.93 4.00 4.06 V TCM809J: T
3.89 4.10 V T
3.04 3.08 3.11 V TCM8xxT: T
3.00 3.15 V T
2.89 2.93 2.96 V TCM8xxS: T
2.85 3.00 V T
2.59 2.63 2.66 V TCM8xxR: T
2.55 2.70 V T
2.28 2.32 2.35 V TCM8xxZ: T
2.25 2.38 V T
Reset Threshold T empco 30 ppm/°C
to Reset Delay, 65 µsec VDD = VTH to (VTH – 100 mV) (Note 2)
V
DD
Reset Active Time Out
140 320 560 msec
Period
RESET
Output Voltage
Low (TCM809)
V
OL
——0.3VTCM809R/S/T/Z: VDD = VTH min, I ——0.4 TCM809L/M/J: V ——0.3 V
RESET
Output Voltage
High (TCM809)
RESET Output Voltage
Low (TCM810)
RESET Output Voltage
High (TCM810)
Note 1: Production testing done at T
2: RESET
output for TCM809, RESET output for TCM810.
V
0.8 V
OH
V
OL
DD
– 1.5 TCM809L/M/J: VDD > VTH max, I
V
DD
——0.3VTCM810R/S/T/Z:VDD = VTH max, I
——VTCM809R/S/T/Z: VDD > VTH max, I
——0.4 TCM810L/M: V
0.8 V
V
OH
DD
= +25°C, overtemperature limits ensured by QC screen.
A
——V1.8 < V
= – 40°C to +125°C
A
> 1.0V, I
DD
DD
= 50 µA
SINK
DD
< VTH min, I
< 3.6V
DD
= – 40°C to +125°C
A
= +25°C
A
= – 40°C to +125°C
A
= +25°C
A
= – 40°C to +125°C
A
= +25°C
A
= – 40°C to +125°C
A
= +25°C
A
= – 40°C to +125°C
A
= +25°C
A
= – 40°C to +125°C
A
= +25°C
A
= – 40°C to +125°C
A
= VTH min, I
DD
= VTH max, I
= 150 µA
SOURCE
SINK SINK
SOURCE
SOURCE
SINK
= 3.2 mA
SINK
= 1.2 mA = 3.2 mA
= 500 µA
= 800 µA
= 1.2 mA
DS21661D-page 2 © 2005 Microchip Technology Inc.
TCM809/TCM810
Supply Current ( µA)

2.0 TYPICAL PERFORMANCE CHARACTERISTICS

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
18
TCM8xx/R/S/T/ Z, N o Lo ad
16
14
12
10
8
6
4
2
0
-40 -20 0 20 40 60 80 100 120 Temperature ( ° C)
VDD = 5V
VDD = 3V
VDD = 1V
450
400
350
300
250
200
150
100
Power-up Reset Timeout (µsec)
50
0
-40 -20 0 20 40 60 80 100 120 Temperature ( °C )

FIGURE 2-1: Supply Current vs. Temperature.

16
TCM8xx/L/M/J, No Load
14
12
10
8
6
Supply Current ( µA)
4
2
0
-40-20 0 20406080100120
Temperature ( °C )
VDD = 5V
VDD = 3V

FIGURE 2-2: Supply Current vs. Temperature.

VDD = 1V

FIGURE 2-3: Power-up Reset Time Out vs. Temper atu re.

1.001
1
0.999
0.998
Normalized Reset Threshold
0.997
-40-200 20406080100120
Temperature (°C)

FIGURE 2-4: Normalized Reset Threshold vs. Temperature.

© 2005 Microchip Technology Inc. DS21661D-page 3
TCM809/TCM810

3.0 PIN DESCRIPTIONS

The descriptions of the pins are given in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

NAME FUNCTION
GND Ground RESET (TCM809) RESET push-pull output RESET (TCM810) RESET push-pull output V
DD

3.1 Ground (GND)

Ground terminal.

3.2 RESET Output (TCM809)

The RESET push-pull output remains low while VDD is below the res et voltage threshold, and for 240 msec (140 msec min.) after VDD rises above reset thres hol d.
Supply voltage (+2.5V, +3.0V, +3.3V, +5.0V).

3.3 RESET Output (TCM810)

The RESET push-pull output remains high while VDD is below the reset voltage threshold, and for 240 msec (140 msec min.) after VDD rises above reset thres hol d.

3.4 Supply Voltage (VDD)

VDD: +2.5V, +3.0V, +3.3V and +5.0V
DS21661D-page 4 © 2005 Microchip Technology Inc.
TCM809/TCM810

4.0 APPLICATIONS INFORMATION

4.1 VDD Transient Rejection

The TCM809/TCM8 10 prov ides accurate V ing and reset timing during powe r-up, power-d own an d brown-out/sag conditions. These devices also reject negative-going transients (glitches) on the power supply line. Figure 4-1 shows the maximum transient duration vs. maximum negative excursion (overdrive) for glitch rejection. Any combination of duration and overdrive that lies under the curve will not generate a reset signal.
V
DD
V
TH
Overdrive
Duration
400
TA = +25°C
320
240
monitor-
DD
Combinations above the curve are detected as a brown-out or power-down condition. Transient immunity can be improved by adding a capacitor in close proximity to the V
pin of the TCM809/TCM810.
DD

4.2 RESET Signal Integrity During Power-Down

The TCM809 RESET output is valid to VDD = 1.0V. Below this voltage the output becomes an "open cir­cuit" and does not sink current. This means CMOS logic inputs to the microcontroller will be floating at an undetermined voltage. Most digital systems are completely shut down well above this voltage. However, in situations where RESET tained valid to V connected from RESET
= 0V, a pull-down resistor must be
DD
to ground to discharge stray capacitance s and hold the out put low (Figure4-2). This resistor value, though not critical, should be chosen such that it does not appreciably load RESET normal operation (100 kΩ will be suitable for most applications). Similarly, a pull-up resistor to VDD is required for the TCM810 to ensure a valid high RESET for VDD below 1.0V.
V
DD
must be main-
under
160
80
TCM8XXZ/R/S/T
(SOT-23)
0
Maximum Transient Duration (µsec)
1
Reset Comparator Overdrive
130 120 110 100
90 80 70 60
to Reset Delay (µsec)
50
DD
40
V
30
1 10 100 1000
Reset Comparator Overdrive (mV)
TCM8XXL/M/J (SOT-23)
5
[V
TH
[VTH – VDD] (mv)
100
– VDD] (mv)
TCM8XXL/M/J (SC-70)
TCM8XXZ/R/S/T (SC-70)
1000

FIGURE 4-1: Maximum Transient Duration vs. Overdrive for Glitch Rejection at +25°C.

V
DD
TCM809
RESET
R
1
GND
100 kΩ
FIGURE 4-2: The addition of R1 at the RESET RESET
output of the TCM809 ensures that the output is valid to V
DD
= 0V.
© 2005 Microchip Technology Inc. DS21661D-page 5
TCM809/TCM810

4.3 Controllers and Processors With Bidirectional I/O Pins

Some microcontrollers have bidirectional reset pins. Depending on the cu rrent drive cap ability of the co ntrol­ler pin, an indeterminate logic level may result if there is a logic conflict. This can be avoided by adding a
4.7 kΩ resistor in series with the output of the TCM809/
TCM810 (Figure 4-3). If there are other components in the system that require a reset signal, they should be buffered so as not to load the reset line. If the other components are required to follow the reset I/O of the microcontroller, the buffer should be connected as shown with the solid line.
Buffered RESET To Other System Components
®
V
DD
TCM809
RESET
GND
4.7 kΩ
Buffer
PICmicro
Micro-
controller
RESET
GND

FIGURE 4-3: Interfa cing the TCM809 to a Bidirection al RESET I/O.

DS21661D-page 6 © 2005 Microchip Technology Inc.

5.0 PACKAGING INFORMATION

5.1 Package Marking Information
TCM809/TCM810
3-Pin SOT-23B
XXNN
3-Pin SC-70
XXN
Top Side
OR
XXNN
YWW
Bottom Side
Example:
Customer Specific Information Codes for:
TCM8xx
Part Number TCM809
TCM8xxLENB J1 K1
VNB JZ KZ
TCM8xxMENB J2 K2
VNB JY KY
TCM8xxTENB J3 K3
VNB JX KX
TCM8xxSENB J4 K4
VNB JV KV
TCM8xxRENB J5 K5
VNB JU KU
TCM8xxJ ENB J6
VNB JT KS
TCM8xxZENB J7 K6
Example:
Customer Specific Information Codes for:
TCM8xx
Part Number TCM809
TCM8xxL ELB J1
VLB JZ KZ
TCM8xxM ELB J2
VLB JY KY
TCM8xxT ELB J3
VLB JX KX
TCM8xxS ELB J4
VLB JV KV
TCM8xxR ELB J5
VLB JU KU
TCM8xxJ ELB J6
VLB JT KS
TCM8xxZ ELB J7
VLB JS KT
=
TCM810
=
TCM810
Legend: XX...X Customer-specific information*
Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code
3
e
Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-fr ee. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the even t the full M icroc hip p art numb er cann ot be mark ed on one line, it wil l
be carried over to the next line, thus limiting the number of available characters for customer-specific information.
© 2005 Microchip Technology Inc. DS21661D-page 7
3
e
TCM809/TCM810
3-Lead Plastic Small Outline Transistor (NB) (SOT-23)
E
E1
2
B
n
1
c
β
Number of Pins Pitch Outside lead pitch (basic)
Foot Angle Lead Thickness
Mold Draft Angle Top Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: TO-236 Drawing No. C04-104
n p
p1
φ
c
α β
p1
D
p
A
φ
L
A1
MILLIMETERSINCHES*Units
.038
α
A2
MAXNOMMINMAXNOMMINDimension Limits
33
0.96
1.92.076
1.121.010.89.044.040.035AOverall Height
1.020.950.88.040.037.035A2Molded Package Thickness
0.100.060.01.004.002.000A1Standoff §
2.642.372.10.104.093.083EOverall Width
1.401.301.20.055.051.047E1Molded Package Width
3.042.922.80.120.115.110DOverall Length
0.550.450.35.022.018.014LFoot Length 10501050
0.180.140.09.007.006.004
0.510.440.37.020.017.015BLead Width 10501050 10501050
DS21661D-page 8 © 2005 Microchip Technology Inc.
3-Lead Plastic Small Outline Transistor (LB) (SC-70)
E
E1
TCM809/TCM810
B
3
2
p1 D
p
1
a
c
b
Pitch Outside lead pitch (basic)
Lead Thickness
Mold Draft Angle Top Mold Draft Angle Bottom
*Controlling Parameter Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" (0.127mm) per side.
L
p
p1
c
a b
A
.026 BSC. .051 BSC.
A2
A1
MILLIMETERS*INCHESUnits
MAXMINMAXMINDimension Limits
33Number of Pins
0.65 BSC.
1.30 BSC.
1.100.80.043.031AOverall Height
1.000.80.039.031A2Molded Package Thickness .0100.00.0004.000A1Standoff
2.401.80.094.071EOverall Width
1.351.15.053.045E1Molded Package Width
2.251.80.089.071DOverall Length
0.410.10.016.004LFoot Length
0.250.08.010.003
0.400.15.016.006BLead Width 12°12°8° 12°12°
JEITA (EIAJ) Equivalent: SC70
Drawing No. C04-104
© 2005 Microchip Technology Inc. DS21661D-page 9
TCM809/TCM810

5.2 Product Tape and Reel Specifications

FIGURE 5-1: EMBOSSED CARRIER DIMENSIONS (8, 12, 16 AND 24 MM TAPE ONLY)
Top
Cover
Tape
A
0
W
K
0
B
0
P
TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS
Carrier
Case
Outline
Package
Type
Dimensions
W
mmPmm
mm
NB SOT-23 3L 8 4 3.15 2.77 1.22 3000 180
LB SC-70 3L 8 4 2.4 2.4 1.19 3000 180
Dimensions
A0
Cavity
B0
mm
K0
mm
Output
Quantity
Units
FIGURE 5-2: 3-LEAD SOT-23/SC70 DEVICE TAPE AND REEL SPECIFICATIONS
Device Marking
User Direction of Feed
Pin 1
W, Width of Carrier
Reel
Diameter in
mm
Marking Device
Tape
Pin 1
P, Pitch
Standard Reel Component Orientation
DS21661D-page 10 © 2005 Microchip Technology Inc.
Reverse Reel Component Orientation
APPENDIX A: REVISION HISTORY
Revision D (March 2005)
• Updated 6.0 “Packaging Information” to include old and new packaging examples.
• Applied new template and rearranged sections to be consistent with current documentat ion.
Revision C (April 2004) Revision B (January 2002) Revision A (May 2001)
Initial release of data sheet.
TCM809/TCM810
© 2005 Microchip Technology Inc. DS21661D- page 11
TCM809/TCM810
NOTES:
DS21661D-page 12 © 2005 Microchip Technology Inc.
TCM809/TCM810
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X X
Device
V
DD
Reset
Temperature
Range
XXXXX
Package
Threshold
Device: TCM80 9: Superv is or circuit with active-low RESET output
V
Reset Threshold: L = 4.63V
DD
Temperature Range: E = -40°C to +85°C
Package: NB713 = SOT-23B, 3-pin (Tape and Reel)
TCM810: Supervisor circuit with active-high RESET output
M=4.38V J=4.00V T=3.08V S=2.93V R=2.63V Z=2.32V
V = -40°C to +125°C
LB713 = SC-70, 3-pin (Tape and Reel)
Examples:
a) TCM809LENB713: SOT-23B-3-TR,
b) TCM809LVLB713: SC-70-3-TR,
c) TCM809LVNB713: SOT-23B-3-TR,
a) TCM810MENB713: SOT-23B-3-TR,
b) TCM810RVLB713: SOT-23B-3-TR,
c) TCM810TVLB713: SC-70-3-TR,
Microcontroller 4.63V Reset Monitor,
-40°C to +85°C, Tape and Reel.
Microcontroller 4.63V Reset Monitor,
-40°C to +125°C, Tape and Reel.
Microcontroller 4.63V Reset Monitor,
-40°C to +125°C, Tape and Reel.
Microcontroller 4.38V Reset Monitor,
-40°C to +85°C, Tape and Reel.
Microcontroller 2.63V Reset Monitor,
-40°C to +125°C, Tape and Reel.
Microcontroller 4.38V Reset Monitor,
-40°C to +125°C, Tape and Reel.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microc hip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
Customer Notification System
Register on our web site (www.microchip.com) to receive the most current information on our products .
© 2005 Microchip Technology Inc. DS21661D-page 13
TCM809/TCM810
NOTES:
DS21661D-page 14 © 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WAR­RANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of M icrochip’s prod ucts as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.
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Printed on recycled paper.
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®
8-bit MCUs, KEELOQ
®
code hopping
© 2005 Microchip Technology Inc. DS21661D-page 15
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Tel: 86-755-8203-2660 Fax: 86-755-8203-1760
China - Shunde
Tel: 86-757-2839-5507 Fax: 86-757-2839-5571
China - Qingdao
Tel: 86-532-502-7355 Fax: 86-532-502-7205
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-2229-0061 Fax: 91-80-2229-0062
India - New Delhi
Tel: 91-11-5160-8631 Fax: 91-11-5160-8632
Japan - Kanagawa
Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea - Seoul
Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934
Singapore
Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan - Kaohsiung
Tel: 886-7-536-4818 Fax: 886-7-536-4803
Taiwan - Taipei
Tel: 886-2-2500-6610 Fax: 886-2-2508-0102
Taiwan - Hsinchu
Tel: 886-3-572-9526 Fax: 886-3-572-6459
EUROPE
Austria - Weis
Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
Denmark - Ballerup
Tel: 45-4450-2828 Fax: 45-4485-2829
France - Massy
Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany - Ismaning
Tel: 49-89-627-144-0 Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611 Fax: 39-0331-466781
Netherlands - Drunen
Tel: 31-416-690399 Fax: 31-416-690340
England - Berkshire
Tel: 44-118-921-5869 Fax: 44-118-921-5820
03/01/05
DS21661D-page 16 © 2005 Microchip Technology Inc.
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