MICROCHIP TC7662A Technical data

M
Charge Pump DC-to-DC Converter
TC7662A
Features
• Wide Operating Range
- 3V to 18V
• Increased Output Current (40mA)
• Pin Compatible with ICL7662/SI7661/TC7660/ LTC1044
• No External Diodes Required
• Low Output Impedance @ I
-40Ω Typ.
• No Low-Voltage Terminal Required
CMOS Construction
Available in 8-Pin PDIP and 8-Pin CERDIP
Packages
= 20mA
L
Applications
Laptop Computers
Disk Drives
Process Instrumentation
µP-based Controllers
Device Selection Table
Part
Number
TC7662ACPA 8-Pin PDIP 0°C to +70°C TC7662AEPA 8-Pin PDIP -40°C to +85°C
TC7662AIJA 8-Pin CERDIP -25°C to +85°C
TC7662AMJA 8-Pin CERDIP -55°C to +125°C
Package
Operating
Temp.
Range
Package Type
8-Pin PDIP
8-Pin CERDIP
NC
C
1
+
2
8
V
DD
7
OSC
TC7662A
GND
C
3
4
6
NC
V
5
OUT
General Description
The TC7662A is a pin-compatible upgrade to the industry standard TC7660 charge pump voltage converter. It converts a +3V to +18V input to a corresponding -3V to -18V output using only two low­cost capacitors, eliminating inductors and their associated cost, size and EMI. In addition to a wider power supply input range (3V to 18V versus 1.5V to 10V for the TC7660), the TC7662A can source output currents as high as 40mA. The on-board oscillator operates at a nominal frequency of 12kHz. Operation below 12kHz (for lower supply current applications) is also possible by connecting an ex tern al ca pacitor from OSC to ground.
The TC7662A directly is recommended for designs requiring greater output current and/or lower input/ output voltage drop. It is available in 8-pin PDIP and CERDIP packages in commercial and extended temperature ranges.
2002 Microchip Technology Inc. DS21468B-page 1
TC7662A
Functional Block Diagram
+
DS21468B-page 2 2002 Microchip Technology Inc.
TC7662A
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings*
Supply Voltage VDD to GND.................................+18V
Input Voltage (Any Pin).........(V
+ 0.3) to (V
DD
SS
– 0.3)
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions above those indicated in the operation sections of the specifications is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.
Current into Any Pin............................................10mA
Output Short Circuit ........... Continuous (at 5.5V Input)
ESD Protection ................................................±2000V
Package Power Dissipation (T
70°C)
A
8-Pin CERDIP..........................................800mW
8-Pin PDIP...............................................730mW
Package Thermal Resistance CPA, EPA θ IJA, MJA θ
.........................................140°C/W
JA
............................................90°C/W
JA
Operating Temperature Range
C Suffix............................................0°C to +70°C
I Suffix..........................................-25°C to +85°C
E Suffix.........................................-40°C to +85°C
M Suffix......................................-55°C to +125°C
Storage Temperature Range..............-65°C to +150°C
TC7662A ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VDD = 15V, TA = +25°C, Test circuit (Figure 3- 1) unless otherw ise noted.
Symbol Parameter Min Typ Max Units Test Conditions
V I
R
F P
V
DD
S
O
OSC EFF
EFF
Supply Voltage 3 18 V Supply Current
— — — — — —
Output Source Resistance
— —
Oscillator Frequency 12 kHz Power Efficiency 93
Voltage Efficiency 99
96
510 560 650 190 210 210
40 50
100
97
99.9
— —
700
— — — — —
50 60
125
— —
— — —
µAR
I
%VDD = +15V
%VDD = +15V
=
L
VDD = +15V 0
°C T
+70°C
A
T
= +5V
T
= 2k
=
+125°C
A
+70°C
A
+125°C
A
-55°C V
DD
0
°C T
-55°C = 20mA, VDD = +15V
L
I
= 40mA, VDD = +15V
L
= 3mA, VDD = +5V
I
L
R
L
R
L
Over operating temperature range.
2002 Microchip Technology Inc. DS21468B-page 3
TC7662A
2.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1: PIN FUNCTION TABLE
Pin No.
(8-Pin PDIP,
CERDIP)
1 NC No connection. 2C 3 GND Ground terminal. 4C 5V 6 NC No connection. 7 OSC Oscillator control input. Bypass with an external capacitor to slow the oscillator. 8V
Symbol Description
+
Charge pump capacitor positive terminal.
-
Charge pump capacitor negative terminal.
OUT
DD
Output voltage.
Power supply positive voltage input.
DS21468B-page 4 2002 Microchip Technology Inc.
TC7662A
3.0 DETAILED DESCRIPTION
The TC7662A is a c apac itive ch arge pump (sometime s called a switched-capacitor circuit), where four MOSFET switches con trol th e cha rge and disc harge of a capacitor.
The functional block diag ram sho ws how the switc hin g action works. SW1 and SW2 are turned on simulta­neously, charging C assumes that th e ON resistance of the MOSFETs in series with the capacitor produce a charging time (3 time constants) less than the ON time provided by the oscillator frequency, as shown:
3 (R
DS(ON) CP
In the next cycle, SW1 and SW2 are turned OFF and, after a very short interval with all switches OFF (preventing large currents from occurring due to cross conduction), SW3 and SW4 are turn ed ON. The charge
is then transferred to CR, but with the polarity
in C
P
inverted. In this way, a negative voltage is derived. An oscillator supplies pulses to a flip-flop that is fed to
a set of level shifters. These level shifters then drive each set of switches at one-half the oscillator frequency.
The oscillator has a pin that controls the frequency of oscillation. Pin 7 can have a capacitor added that is connected to ground. This will lower the frequency of the oscillator by adding capacitance to the internal timing capacitor of the TC7662A. (See Typical Characteristics – Oscillator Frequency vs. C
FIGURE 3-1: TC7662A TEST CIRCUIT
NC
+
10µF
C
P
to the su pply vol tage, VDD. This
P
) <CP/(0.5 f
1
2
TC7662A
3
4
OSC
8
7
6
5
NC
).
C
OSC
.)
OSC
I
S
V
DD
(+5V)
I
L
R
L
V
OUT
(-5V)
C
10µF
R
+
3.1 Theoretical Power Efficiency Considerations
In theory, a voltage converter can approach 100% efficiency if cert a in co ndi tio ns are me t:
1. The drive circuitry consumes minimal power.
2. The output switches ha ve extremely low ON
resistance and virtually no offset.
3. The impedances of the pump and reservoir
capacitors are negligible at the pump frequency.
The TC7662A approaches these conditions for negative voltage conversion if large values of C
are used.
C
R
and
P
Note: Energy is lost only in the transfer of charge
between capacitors if a change in voltage occurs.
The energy lost is defined by:
2
E = 1/2 C
(V
P
2
– V
1
)
2
V1 and V2 are the volta ges o n CP during the pump and transfer cycles. If the impedances of C
and CR are
P
relatively high a t the pump fre quency (ref er to Figure 3-
1), compared to the value of R
substantial di fference in voltage s V it is desirable not only to make C
, there will be a
L
and V2. Therefore,
1
as large as possible
R
to eliminate output voltage ripple, but also to employ a correspondingly large value for CP in order to achieve maximum efficiency of operation.
3.2 Dos and Don’ts
Do not exceed maximum supply voltages.
Do not short circuit the output to V+ supply for
voltages above 5.5V for extended periods; however , tran sie nt con di tion s inc lu din g st art-up are okay.
When using polarized capacitors in the inverting
mode, the + terminal of C pin 2 of the TC7662A and the + terminal of C must be connected to GND (pin 3).
If the voltage supply driving the TC7662A has a
large source impedance (25-30 ohms), then a
2.2µF capacitor from pin 8 to ground may be required to limit the rate o f rise of the inpu t volt age to less than 2V/µsec.
must be connected to
P
R
2002 Microchip Technology Inc. DS21468B-page 5
TC7662A
4.0 TYPICAL APPLICATIONS
4.1 Simple Negative Voltage Converter
The majority of applications will undoubtedly utilize the TC7662A for generation of negative supply voltages. Figure 4-1 shows typical connections to provide a negative supply whe re a positive supply of +3V to +18V is available.
FIGURE 4-1: SIMPLE NEGATIVE
CONVERTER AND ITS OUTPUT EQUIVALENT
V
DD
1
2
+
10µF
TC7662A
3
4
The output characteristics of the circuit in Figure 4-1 are those of a nearly ideal volt age sourc e in series with a resistance as shown in Figure 4-1b. The voltage source has a value of -(V
) is a function of the ON resistance of the internal
(R
O
MOS switches (shown in the Functional Block Diagram), the swit ching freque ncy, the value of C
, and the ESR (equivalent series resistance) of C
C
R
and CR. A good first order approximation for RO is:
R
(f
PUMP
O
2(R
+ R
SW1
ESR
f
OSC
= , R
2
8
7
6
5
10µF
= -V+
V
OUT
+
R
O
V
OUT
VDDV
V
V
DD
DD
DD
+
AB
). The output impedance
DD
and
P
+ ESRCP) + 2(R
SW2
1
) + + ESR
CP
SWX
x C
f
PUMP
P
= MOSFET switch resistance)
SW3
CR
+ R
SW4
+
Combining the four R
R
2 x R
O
+ + 4 x ESRCP + ESR
SW
terms as RSW, we see that:
SWX
1
f
x C
PUMP
P
CR
RSW, the total switch resi st a nc e, is a fun cti on o f supply voltage and temperature (See Section5.0, Typical Characteristics Output Source Resistance graphs), typically 23 at + 25 °C and 5V. Careful selection of C
P
and CR will reduce the re maining terms, mi nimizin g the output impedance. High value capacitors will reduce the 1/(f
x CP) component, and low ESR
PUMP
capacitors will lower the ESR term. Increasing the oscillator frequenc y will reduce the 1/(f
PUMP
x CP) term, but may have the side effect of a net increase in output impedance when CP > 10µF and there is not enough time to fully charge the capacitors every cycle. In a typ­ical application when f
= 12kHz and C = CP = CR =
OSC
10µF:
R
2 x 23 + + 4 x ESR
O
(5 x 12
R
O
1
3
x 10 x 10-6)
(46 + 20 + 5 x E S R
+ ESR
CP
)
C
CR
Since the ESRs of the capacitors are reflected in the output impedance multiplied by a factor of 5, a high value could potent ially sw amp o ut a low 1/( f
PUMP
x CP) term, rendering an increase in switching frequency or filter capacitance ineffective. Typical electrolytic capacitors may have ESRs as high as 10Ω.
P
DS21468B-page 6 2002 Microchip Technology Inc.
TC7662A
4.2 Output Ripple
ESR also affec ts the rip ple volta ge se en at t he ou tp ut. The total ripple is determined by 2 voltages, A and B, as shown in Figure 4-2. Segment A is the voltage drop across the E SR of C charged by C
P
charged through the load (current flowing out of C The magnitude of this current change is 2 x I the total drop is 2 x I the voltage ch ange acros s C the cycle when C drop at B is I
OUT
voltage is the sum of these voltage drops:
V
( + 2 x ESR
RIPPLE
FIGURE 4-2: OUTPUT RIPPLE
0
V
at the ins tan t it g o es fr om be i ng
R
(current flowing into CR) to being dis-
R
, hence
x ESRCR volts. Segm en t B is
OUT
supplies curr ent to the load. The
R
during time t2, the half of
R
OUT
x t2/CR volts. The peak-to-peak ripple
B
2 x f
PUMP
t
2
1
x C
R
t
1
CR
x I
OUT
)
4.3 Paralleling Devices
Any number of TC7662A voltage converters may be paralleled to reduce output resistance (Figure 4-3). The reservoir capacitor, C each device requires its own pump capacitor, C
, serves all devices, while
R
. The
P
resultant output resistance would be approximately:
).
R
OUT
R
(of TC7662A)
OUT
=
n (number of devices)
4.4 Cascading Devices
The TC7662A may be cascad ed as shown (Figu re 4-4) to produce larger negative multiplication of the initial supply voltage. However, due to the finite efficiency of each device, the practical limit is 10 devices for light loads. The output voltage is defined by:
= – n (VIN)
V
OUT
where n is an integer representing the number of devices cascaded. The resulting output resistance would be approximately the weighted sum of the individual TC7662A R
OUT
values.
-(VDD)
A
FIGURE 4-3: PARALLELING DEVICES LOWERS OUTPUT IMPEDANCE
V
DD
1
2
C
1
TC7662A
3
4
"1"
8
7
6
5
C
1
1
2
TC7662A
3
4
"n"
8
7
6
5
FIGURE 4-4: INCREASED OUTPUT VOLTAGE BY CASCADING DEVICES
V
DD
10µF
1
2
+
TC7662A
3
4
"1"
8
7
6
5
10µF
+
10µF
1
2
TC7662A
3
4
"n"
8
7
6
5
R
L
C
2
+
V
*
OUT
10µF
+
*V
= -nV
OUT
DD
2002 Microchip Technology Inc. DS21468B-page 7
TC7662A
4.5 Changing the TC7662A Oscillator Frequency
It is possible to increase the conversion efficiency of
the TC7662A at low load levels by lowering the oscillator freque ncy. This reduces the switching los ses, and is shown in Figure 4-5. However, lowering the oscillator freque nc y will cause an undesirable increas e in the impedance of the pump (C
) and reservoir (CR)
P
capacitors; th is is overco me by increa sing the valu es of C
and CR by the same factor that the frequency has
P
been reduced. For example, the addition of a 100pF capacitor between pin 7 (OSC) and V
will lower the
DD
oscillator frequen cy to 2kHz from its nom inal freque ncy of 12kHz (multiple of 6), and thereby necessitate a corresponding i ncrease in the value of C
and CR (from
P
10µF to 68µF).
FIGURE 4-5: LOWERING OSCILLATOR
FREQUENCY
V
DD
10µF
1
2
+
TC7662A
3
4
8
7
C
6
5
OSC
V
OUT
10µF
+
4.6 Positive Voltage Doubling
4.7 Combined Negative Voltage Conversion and Positive Supply Multiplication
Figure 4-7 com bin es the fu nct ion s shown in Figure 4-1 and Figure 4-6 to pr ovid e negati ve voltag e conve rsion and positive voltage doubling simultaneously. This approach would be, for example, suitable for generat­ing +9V and -5V from an existing +5V supply. In this instance, capacitors C1 and C3 perform the pump and reservoir functions, respectively, for the generation of
D
1
V (2 V
D
2
and C4 are
2
V
=
OUT
– V
-(V
DD
C
3
+
=
OUT
) – (2 VF)
DD
+
C
4
)
F
the negative voltage, while capacitors C pump and reservoir, respectively, for the doubled positive volta ge. There is a penal ty in this co nfiguratio n which combines both functions, however, in that the source impedances of the generated supplies will be somewhat higher due to the finite impedance of the common charge pump driver at pin 2 of the device.
FIGURE 4-7: COMBINED NEGATIVE
CONVERTER AND POSITIVE DOUBLER
V
DD
1
2
TC7662A
3
4
+
C
1
8
7
6
5
+
C
2
The TC7662A may be employed to achieve positive voltage doubling using the circuit shown in Figure 4-6. In this application, the pump inverter switches of the TC7662A are used to charge C V
– VF (where VDD is the supply voltage and VF is
DD
the forward volta ge on C applied through dio de D thus created on C
R
plus the supply volt age (VDD)
P
to capacitor CR). The voltage
2
becomes (2 VDD) – (2 VF), or twice
to a voltage level of
P
the supply volt age minus the combined forward voltage drops of diodes D
The source impe dance of the o utput (V on the output current, but for V
and D2.
1
) will depend
OUT
= 5V and an output
DD
current of 10 mA, it will be approximately 60Ω.
FIGURE 4-6: POSITIVE VOLTAGE
MULTIPLIER
V
DD
1
2
TC7662A
3
4
8
D
7
1
6
5
+
C
V
=
OUT
D
2
P
) – (2 VF)
(2 V
DD
+
C
R
4.8 Voltage Splitting
The same bidirectional characteristics can be used to split a higher supply in half, as shown in Figure 4-8. The combined load will be evenly shared between the two sides. Because the switches share the load in parallel, the output impedance is much lower than in the standard c ircuit s, and hi gher curren ts ca n be drawn from the device. By using this circuit, and then the circuit of Figure 4-4, +15V can be converted (via +7.5V
and -7.5V) to a nominal -15V, though with rather high
series resistance (~ 25 0Ω).
FIGURE 4-8: SPLITTING A SUPPLY IN
HALF
V
DD
R
L1
V
=
OUT
V
– V
DD
50 µF
2
R
L2
50µF
+
50µF
+
1
2
TC7662A
3
4
+
8
7
6
5
V
DS21468B-page 8 2002 Microchip Technology Inc.
TC7662A
00
01001000
0
)
(
)
0
C
OSC
0k
5
C
5.0 TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are pro vided for information al purposes only. The performance characte ristics listed h erein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Circuit of Figure 3-1, CP = CR = 10µF, C
Supply Current vs. Temperature
700
600
500
400
300
200
SUPPLY CURRENT (µA)
100
0
-60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C)
Frequency vs. Temperature
20
18
16
14
12
10
FREQUENCY (kHz)
8
6
-60 -40 -20 0 20 40 60 80 100 120 140 TEMPERATURE (°C)
ESRCP
VDD = 15V
VDD = 5V
C
1, TA = 25°C unless otherwise noted.
ESRCR
Oscillator Frequency vs.
1
Hz
REQUENCY
1
1
1
Output Resistance vs. Temperature
160
140
120
VDD = 5V, IL = 3mA
100
80
60
OUTPUT RESISTANCE ( )
40
20
-60 -40 -20 0 20 40 60 80 100 120 140
= +2
10,00
CAPACITANCE (pF
VDD = 15V, IL = 20mA
TEMPERATURE (°C)
Power Conversion Efficiency vs. I
110
100
90
Efficiency
80
70
60
50
40
30
20
10
POWER CONVERSION EFFICIENCY (%)
16 32 48 64 80
8244056720
LOAD CURRENT (mA)
Supply Current
T
= +25°C
A
LOAD
165
150
135
120
105
90
75
60
45
SUPPLY CURRENT (mA)
30
15 0
Output Resistance vs. Input Voltage
110
100
90
80
70
60
50
40
30
OUTPUT RESISTANCE ( )
20
10
0
IL =
20mA
2 6 10 14 18
4 8 12 16 20
INPUT VOLTAGE (V)
TA = +25°C
2002 Microchip Technology Inc. DS21468B-page 9
TC7662A
3
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)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
)
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Package mar k ing data not available a t this time.
6.2 Package Dimensions
.260 (6.60 .240 (6.10
.045 (1.14 .030 (0.76
.200 (5.08 .140 (3.56
.150 (3.81 .115 (2.92
.400 (10.16
.348 (8.84
.110 (2.79 .090 (2.29
.070 (1.78 .040 (1.02
.022 (0.56 .015 (0.38
.040 (1.02 .020 (0.51
.310 (7.87 .290 (7.37
.015 (0.38 .008 (0.20
.400 (10.16
.310 (7.87
DS21468B-page 10 2002 Microchip Technology Inc.
TC7662A
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc. DS21468B-page11
TC7662A
NOTES:
DS21468B-page12 2002 Microchip Technology Inc.
TC7662A
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchips products as critical com­ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con­veyed, implicitly or otherwise, under any intellectual property rights.
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®
8-bit MCUs, KEELOQ
®
code hoppin g
2002 Microchip Technology Inc. DS21468B-page 13
M
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China - Beij ing
Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-6766200 Fax: 86-28-6766599
China - Fuzhou
Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-2350361 Fax: 86-755-2366086
Hong Kong
Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, OShaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
Taiwan
Microchip Technology Taiwan 11F-3 , No . 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Denmark
Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL Parc dActivite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90- 79
Germany
Microchip Technology GmbH Gustav-Heinemann Ring 125 D-81739 Munich, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Arizona Microchip Technology Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820
03/01/02
'!" '
DS21468B-page 14 2002 Microchip Technology Inc.
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