MICROCHIP TC72 Technical data

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M

Digital Temperature Sensor with SPI™ Interfa

Features

• Temperature-to-Digital Converter

• SPI™ Compatible Interface

• 10-Bit Resolution (0.25°C/Bit)

• ±2°C (max.) Accuracy from -40°C to +85°C

• ±3°C (max.) Accuracy from -55°C to +125°C

• 2.65V to 5.5V Operating Range

• Low Power Consumption:

- 250 µA (typ.) Continuous Temperature
Conversion Mode

- 1 µA (max.) Shutdown Mode

• Power Saving One-Shot Temperature
Measurement

• Industry Standard 8-Pin MSOP Package

• Space Saving 8-Pin DFN (3x3 mm) Package

Typical Applications

• Personal Computers and Servers

• Hard Disk Drives and Other PC Peripherals

• Entertainment Systems

• Office Equipment

• Datacom Equipment

• Mobile Phones

• General Purpose Temperature Monitoring

Package Types

MSOP

1

DFN

NC

SCK

CE

GND

NC

CE

SCK

GND

1

2

3

4

TC72

2

3

4

TC72

8

7

6

5

V

DD

NC

SDI

SDO

8

7

6

5SDI

V

DD

NC

SDO

TC72

ce

General Description

The TC72 is a digital temperature sensor capable of
reading temperatures from -55°C to +125°C. This sen­sor features a serial interface that allows communica­tion with a host controller or other peripherals. The
TC72 interface is compatible with the SPI protocol. The
TC72 does not require any additional external compo­nents. However, it is recommended that a decoupling
capacitor of 0.01 µF to 0.1 µF be provided between the
V

and GND pins.

DD

The TC72 can be used either in a Continuous Temper­ature Conversion mode or a One-Shot Conversion
mode. The Continuous Conversion mode measures
the temperature approximately every 150 ms and
stores the data in the temperature registers. In con­trast, the One-Shot mode performs a single tempera­ture measurement and returns to the power saving
shutdown mode.

The TC72 features high temperature accuracy, ease­of-use and is the ideal solution for implementing ther­mal management in a variety of systems. The device is
available in both 8-pin MSOP and 8-pin DFN space­saving packages. The TC72 also features a shutdown
mode for low power operation.

Block Diagram

V

DD

Internal

Diode

Temperature

Sensor

10-Bit

Sigma Delta

A/D Converter

Temperature

Register

GND

TC72

Manufacturer
ID Register

Serial

Port

Interface

Control

Register

CE
SCK

SDO
SDI

 2002 Microchip Technology Inc. DS21743A-page 1

TC72

Typical Application

V

DD

0.1µF

V

DD

TC72

PICmicro

MCU

®

SDO

GND

CE

SCK

AN0

SCK

SDI

SDOSDI

DS21743A-page 2  2002 Microchip Technology Inc.

TC72

1.0 ELECTRICAL

CHARACTERISTICS

1.1 Maximum Ratings

VDD........................................................................ 6.0V

All inputs and outputs w.r.t. GND ...-0.3V to V

Storage temperature .......................... -65°C to +150°C

Ambient temp. with power applied ..... -55°C to +125°C

Junction Temperature ........................................ 150°C

ESD protection on all pins:

Human Body Model (HBM)............................. > 4 kV

Man Machine Model (MM).............................> 400V

Latch-Up Current at each pin ........................ ±200 mA

Maximum Power Dissipation........................... 250 mW

† Notice: Stresses above t hose listed under "Maximum
Ratings" may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operation listings of this specification is not implied. Exposure
to maximum rating conditions for extended periods may affect
device reliability.

†

+0.3V

DD

DC CHARACTERISTICS

PIN FUNCTION TABLE

Name Function

NC No Internal Connection

CE Chip Enable Input, the device is selected

when this input is high

SCK Serial Clock Input

GND Ground

SDO Serial Data Output

SDI Serial Data Input

NC No Internal Connection

V

DD

Power Supply

Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125 °C.

Parameters Sym Min Typ Max Units Conditions

Power Supply

Operating Voltage Range V

Operating Current:

Normal Mode, ADC Active

Shut-Down Supply Current I

Temperature Sensor and Analog-to-Digital Converter

Temperature Accuracy
(Note 1)

Resolution — 10 — Bits Note 4

ADC Conversion Time t

Digital Input / Output

High Level Input Voltage V

Low Level Input Voltage V

High Level Output Voltage V

Low Level Output Voltage V

Input Resist ance R

Pin Capacitance C

Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the

TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,

3.3V and 5.0V respectively. As V
Figure 2-5 and Figure 2-6.

2: Measured with a load of C
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.

The rise and fall times are defined as the 10% to 90% transition time.

4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (2

DD

I

DD-CON

SHD

T

ACY

CONV

IH

IL

OH

OL

IN

IN

C

OUT

= 50 pF on the SDO output pin of the TC72.

L

2.65 — 5.5 V Note 1

— 250 400 µA Continuous temp. conversion mode

(Shutdown Bit = ‘0’)

— 0.1 1.0 µA Shutdown Mode (Shutdown Bit = ‘1’)

-2.0 — +2.0 °C -40°C < TA < +85°C

-3.0 — +3.0 -55°C < T

—150200ms

0.7 V

— — 0.2 V

0.7 V

— — 0.2 V

1.0 — — MΩ

—15—pF

—50—

varies from the nominal operating value, the accuracy may be degraded. Refer to

DD

——V

DD

DD

——VIOH = 1 mA

DD

DD

10

) = 256/1024 = 0.25°C/Bit

V

VIOL = 4 mA

< +125°C

A

 2002 Microchip Technology Inc. DS21743A-page 3

TC72

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise noted, all parameters apply at VDD = 2.65V to 5.5V, TA = -55°C to +125 °C.

Parameters Sym Min Typ Max Units Conditions

Serial Port AC Timing (Note 2, 3)

Clock Frequency f

SCK Low Time t

SCK High Time t

CE to SCK Setup t

SCK to Data Out Valid t

CE to Output Tri-state t

SCK to Data Hold Time t

Data to SCK Set-up Time t

SCK to CE Hold Time t

SCK Rise Time t

SCK Fall Time t

CE Inactive Time t

CLK

CL

CH

CC

CDD

CDZ

CDH

DC

CCH

R

F

CWH

Thermal Package Resistance

Thermal Resistance, MSOP-8 θ
Thermal Resistance, DFN-8 θ

JA

JA

Note 1: The TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX will operate from a supply voltage of 2.65V to 5.5V. However, the

TC72-2.8MXX, TC72-3.3MXX and TC72-5.0MXX are tested and specified at the nominal operating voltages of 2.8V,

3.3V and 5.0V respectively. As V
Figure 2-5 and Figure 2-6.

2: Measured with a load of C
3: All time measurements are measured with respect to the 50% point of the signal, except for the SCK rise and fall times.

= 50 pF on the SDO output pin of the TC72.

L

The rise and fall times are defined as the 10% to 90% transition time.

4: Resolution = Temperature Range/No. of Bits = (+127°C – -128°C) / (2

DC — 7.5 MHz

65 — — ns

65 — — ns

400 — — ns

— — 55 ns

— — 40 ns

35 — — ns

35 — — ns

100 — — ns

——200ns

——200ns

400 — — ns

—206—°C/W

—60.5—°C/W

varies from the nominal operating value, the accuracy may be degraded. Refer to

DD

10

) = 256/1024 = 0.25°C/Bit

DS21743A-page 4  2002 Microchip Technology Inc.

SPI READ DATA TRANSFER

(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 0)

CE

1/f

t

CC

CLK

SCK

t

CCH

t

CWH

TC72

SDI

SDO

t

DC

A7

HIGH Z

t

CDH

MSb

t

t

R

F

A0

LSb

t

t

CH

CDD

D7

t

CL

MSb

SPI WRITE DATA TRANSFER

(CP = 0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7 = 1)

CE

1/f

t

CC

CLK

SCK

t

t

R

F

t

t

DC

CDH

t

t

CL

CH

t

CCH

D0

t

CWH

LSb

t

CDZ

HIGH Z

SDI

A7 = 1

Note:

MSb LSb MSb LSb

The timing diagram is drawn with CP = 0. The

A0

D7 D0

TC72

also functions with CP = 1;

however, the edges of SCK are reversed as defined in Table 3-3 and Figure 3-2.

FIGURE 1-1: Serial Port Timing Diagrams.

 2002 Microchip Technology Inc. DS21743A-page 5

TC72

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, all parameters apply at V

3.5
3

2.5
2

1.5

Mean

1

0.5
0

-0.5

-1

-1.5

-2

-2.5

Temperature Error (°C)

-3

-3.5

-55 -25 5 35 65 95 125

Upper Specification Limit

Mean + 3V

Mean - 3V

Lower Specification Limit

Reference Temperature (°C)

FIGURE 2-1: Accuracy vs. Temperature
(TC72-X.XMXX).

260

TC72-X.XMXX

250

TA = +25°C

240

230

220

210

Supply Current (µA)

200

2.5 3.0 3.5 4.0 4.5 5.0 5.5

TA = +125°C

TA = -55°C

Supply Voltage (V)

= 2.65V to 5.5V, TA = -55°C to +125°C.

DD

0.20

0.15
TC72-5.0MXX

= 5.0V

V

DD

0.10

0.05

Shutdown Current (µA)

0.00

-55 -25 5 35 65 95 125

TC72-5.0MXX
V

DD

Temperature (°C)

= 2.8V

TC72-3.3MXX

= 3.3V

V

DD

FIGURE 2-4: Shutdown Current vs.
Temperature.

0.4
TC72-2.8MXX

0.3

0.2

0.1

0.0

-0.1

-0.2

-0.3

Temperature Change (°C)

-0.4

2.6 2.7 2.8 2.9 3.0

T

A

TA = +25°C

= +85°C

TA = -25°C

Supply Voltage (V)

FIGURE 2-2: Supply Current vs. Supply
Voltage.

400

350

TC72-5.0MXX

= 5.0V

V

DD

300

250

200

150

100

Supply Current (uA)

50

0

-55-255 356595125

TC72-2.8MXX

= 2.8V

V

DD

Temperature (°C)

TC72-3.3MXX

= 3.3V

V

DD

FIGURE 2-3: Supply Current vs.
Temperature.

FIGURE 2-5: Temperature Accuracy vs.
Supply Voltage (TC72-2.8MXX).

1.0
TC72-5.0MXX

0.8

0.6

0.4

0.2

TA = +85°C

0.0

-0.2

-0.4

-0.6

-0.8

Temperature Change (°C)

-1.0

4.5 4.6 4.7 4.8 4.9 5.0 5.1 5.2 5.3 5.4 5.5

TA = +25°C

TA = -25°C

Supply Voltage (V)

FIGURE 2-6: Temperature Accuracy vs.
Supply Voltage (TC72-5.0MXX).

DS21743A-page 6  2002 Microchip Technology Inc.

TC72

Note: Unless otherwise indicated, all parameters apply at V

50
45
40
35
30
25
20
15
10

5
0

Percentage of Occurances (%)

-3

-2.5-2-1.5-1-0.5

Temperature Error (°C)

TC72-X.XMXX
Sample Size = 166

= -55°C

T

A

0

0.511.522.5

3

FIGURE 2-7: Histogram of Temperature
Accuracy at -55 Degrees C.

60

TC72-X.XMXX
Sample Size = 166

50

= -40°C

T

A

40

30

20

10

0

Percentage of Occurances (%)

-2 -1.5 -1 -0.5 0 0.5 1 1.5 2

Temperature Error (°C)

= 2.65V to 5.5V, TA = -55°C to +125°C.

DD

60

50

40

30

20

10

0

Percentage of Occurances (%)

-1.50

-1.25

-1.00

-0.75

-0.50

Temperature Error (°C)

TC72-X.XMXX
Sample Size = 166
T

A

0.00

0.25

-0.25

= +65°C

0.50

0.75

FIGURE 2-10: Histogram of Temperature
Accuracy at +65 Degrees C.

50
45
40
35
30
25
20
15
10

5
0

Percentage of Occurances (%)

-2 -1.5 -1 -0.5 0 0.5 1 1.5 2

Temperature Error (°C)

TC72-X.XMXX
Sample Size = 166

= +85°C

T

A

1.00

1.25

1.50

FIGURE 2-8: Histogram of Temperature
Accuracy at -40 Degrees C.

60

TC72-X.XMXX

50

Sample Size = 166

= +25°C

T

A

40

30

20

10

0

Percentage of Occurances (%)

0.00

0.25

0.50

0.75

1.00

1.25

-1.50

-1.25

-1.00

-0.75

-0.50

Temperature Error (°C)

-0.25

1.50

FIGURE 2-9: Histogram of Temperature
Accuracy at +25 Degrees C.

FIGURE 2-11: Histogram of Temperature
Accuracy at +85 Degrees C.

40

35

30

25

20

15

10

5

0

Percentage of Occurances (%)

-3

-2.5-2-1.5-1-0.5

Temperature Error (°C)

TC72-X.XMXX
Sample Size = 166

= +125°C

T

A

0

0.511.522.5

3

FIGURE 2-12: Histogram of Temperature
Accuracy at +125 Degrees C.

 2002 Microchip Technology Inc. DS21743A-page 7

TC72

3.0 FUNCTIONAL DESCRIPTION

The TC72 consists of a band-gap type temperature
sensor, a 10-bit Sigma Delta Analog-to-Digital Con­verter (ADC), an internal conversion oscillator and a
double buffer digital output port. The 10-bit ADC is
scaled from -128°C to +127°C; therefore, the resolution
is 0.25°C per bit. The ambient temperature operating
range of the TC72 is specified from -55°C to +125°C.

This device features a four-wire serial interface that is
fully compatible with the SPI specification and, there­fore, allows simple communications with common
microcontrollers and processors. The TC72 can be
used either in a Continuous Temperature Conversion
mode or a One-Shot Conversion mode. The TC72 tem­perature measurements are performed in the back­ground and, therefore, reading the temperature via the
serial I/O lines does not affect the measurement in
progress.

MSB LSB

0111 1101 / 0000 0000

The Continuous Conversion mode measures the tem­perature approximately every 150 ms and stores the
data in the temperature registers. The TC72 has an
internal clock generator that controls the automatic
temperature conversion sequence. The automatic tem­perature sampling operation is repeated indefinitely
until the TC72 is placed in a shutdown mode by a write
operation to the Control register. The TC72 will remain
in the shutdown mode until the shutdown bit in the
Control register is reset.

In contrast, the One-Shot mode performs a single tem­perature measurement and returns to the power-sav­ing shut down mode. This mode is especially useful for
low power applications.

Output

Code

Te m p

+25°C

+0.25°C

MSB LSB

0001 1001 / 0000 0000

MSB LSB

0000 0000 / 0100 0000

MSB LSB

0000 00 00 / 0000 0000

-55°C

-25°C

Note: The ADC converter is scaled from -128°C to -127°C, but the operating range of the

TC72 is specified from -55°C to +125°C.

0°C

-0.125°C

MSB LSB

1111 1111 / 1100 0000

MSB LSB

1110 0111 / 0000 0000

MSB LSB

1100 1001 / 0000 0000

Tem p

+125°C

FIGURE 3-1: Temperature-To-Digital Transfer Function (Non-linear Scale).

DS21743A-page 8  2002 Microchip Technology Inc.

TC72

3.1 Temperature Data Format

Temperature data is represented by a 10-bit two’s com­plement word with a resolution of 0.25°C per bit. The
temperature data is stored in the Temperature registers
in a two’s complement format. The ADC converter is
scaled from -128°C to +127°C, but the operating range
of the TC72 is specified from -55°C to +125°C.

Example:

Temperature = 41.5°C
MSB Temperature Register= 00101001b

=2

5

+ 23 + 2

0

= 32 + 8 + 1 = 41

LSB Temperature Register = 10000000b = 2

-1

= 0.5

TABLE 3-1: TC72 TEMPERATURE

OUTPUT DATA

Temperature

+125°C 0111 1101/0000 0000 7D00

+25°C 0001 1001/0000 0000 1900

+0.5°C 0000 0000/1000 0000 0080

+0.25°C 0000 0000/0100 0000 0040

0°C 0000 0000/0000 0000 0000

-0.25°C 1111 1111/1100 0000 FFC0

-25°C 1110 0111/0000 0000 E700

-55°C 1100 1001/0000 0000 C900

Binary

MSB / LSB

Hex

TABLE 3-2: TEMPERATURE REGISTER

D7 D6 D5 D4 D3 D2 D1 D0

Sign 2

6252423232120

-12-2

2

000000

Address/
Register

02H

Te m p . M S B

01H

Temp . L S B

3.2 Power-Up And Power-Down

The TC72 is in the low power consumption shutdown
mode at power-up. The Continuous Temperature Con­version mode is selected by performing a Write opera­tion to the Control register, as described in Section 4.0,
“Internal Register Structure”.

A supply voltage lower than 1.6V (typical) is considered
a power-down state for the TC72. If the supply voltage
drops below the 1.6V threshold, the internal registers
are reset to the power-up default state.

3.3 Serial Bus Interface

The serial interface consists of the Chip Enable (CE),
Serial Clock (SCK), Serial Data Input (SDI) and Serial
Data Output (SDO) signals. The TC72 operates as a
slave and is compatible with the SPI bus specifications.
The serial interface is designed to be compatible with
the Microchip PICmicro

The CE input is used to select the TC72 when multiple
devices are connected to the serial clock and data
lines. The CE is active-high, and data is written to or
read from the device, when CE is equal to a logic high
voltage. The SCK input is disabled when CE is low. The
rising edge of the CE line initiates a read or write oper­ation, while the falling edge of CE completes a read or
write operation.

The SCK input is provided by the external microcontrol­ler and is used to synchronize the data on the SDI and
SDO lines. The SDI input writes data into the TC72’s
Control register, while the SDO outputs the tempera­ture data from the Temperature register and the status
of Shutdown bit of the Control register.

The TC72 has the capability to function with either an
active-high or low SCK input. The SCK inactive state is
detected when the CE signal goes high, while the
polarity of the clock input (CP) determines whether the
data is clocked and shifted on either the rising or falling
edge of the system clock, as shown in Figure 3-2.
Table 3-3 gives the appropriate clock edge used to
transfer data into and out of the registers. Each data bit
is transferred at each clock pulse, and the data bits are
clocked in groups of eight bits, as shown in Figure 3-3.

The address byte is transferred first, followed by the
data. A7, the MSb of the address, determines whether
a read or write operation will occur. If A7 = ‘0’, one or
more read cycles will occur; otherwise, if A7 = ‘1’, one
or more write cycles will occur.

Data can be transferred either in a single byte or a
multi-byte packet, as shown in Figure 3-3. In the 3-byte
packet, the data sequence consists of the MSb temper­ature data, LSb temperature data, followed by the Con­trol register data. The multi-byte read feature is initiated
by writing the highest address of the desired packet to
registers. The TC72 will automatically send the register
addressed and all of the lower address registers, as
long as the Chip Enable pin is held active.

®

family of microcontrollers.

 2002 Microchip Technology Inc. DS21743A-page 9

TC72

TABLE 3-3: OPERATIONAL MODES

Mode CE SCK (Note 1) SDI SDO

Disable L Input Disabled Input Disabled High Z

Write (A7 = 1)HCP=1, Data Shifted on Falling Edge,

Data Clocked on Rising Edge
CP=0, Data Shifted on Rising Edge,

Data Clocked on Falling Edge

Read (A7 = 0)HCP=1, Data Shifted on Falling Edge,

Data Clocked on Rising Edge
CP=0, Data Shifted on Rising Edge,

Data Clocked on Falling Edge

Note 1: CP is the Clock Polarity of the microcontroller system clock. If the inactive state of SCK is logic level high,

CP is equal to ‘1’; otherwise, if the inactive state of SCK is low, CP is equal to ‘0’.

2: During a Read operation, SDO remains at a high impedance (High Z) level until the eight bits of data begin

to be shifted out of the Temperature register.

3.4 Read Operation

Data Bit Latch High Z

X Next data bit shift,

Note 2

The temperature and control register data is outputted
from the TC72 using the CE, SCK and SDO lines.
Figure 3-3 shows a timing diagram of the read opera­tion. Communication is initiated by the chip enable (CE)
going high. The SDO line remains at the voltage level
of the LSb bit that is outputted and goes to the tri-state
level when the CE line goes to a logic low level.

3.5 Write Operation

Data is clocked into the Control register in order to
enable the TC72’s power saving shutdown mode. The
write operation is shown in Figure 3-3 and is
accomplished using the CE, SCK and SDI line.

CP = 0

CE

SCK

SHIFT
EDGE

CP = 1

CE

SCK

SHIFT
EDGE

CLOCK

EDGE

CLOCK

EDGE

FIGURE 3-2: Serial Clock Polarity (CP)
Operation.

DS21743A-page 10  2002 Microchip Technology Inc.

Single Byte Write Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)

CE

TC72

SCK

1

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

A7=1

A

SDI

A A A A A A A D D D D D D D D

7654321076543210

MSb LSb

SDO

High Z

Single Byte Read Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)

CE

SCK

2 3 4 5 6 7 8 9 10 11 12 13 14 15 16

1

A7=0

A

SDI

SDO

A A A A A A A

76543210

High Z

D D

70

High Z

MSb LSb

SPI Multiple Byte Transfer

CE

SCK

Write Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=1)

SDI

Address Byte = 80hex

A7 A0

SDO

Control Byte

D7 D0

High Z

Read Operation

(CP=0, data shifted on rising edge of SCK, data clocked on falling edge of SCK, A7=0)

SDI

Address Byte = 02hex

A0

MSB Temp. Byte

D7 D0 D7 D0

LSB Temp. Byte

SDO

A7

High Z High Z

FIGURE 3-3: Serial Interface Timing Diagrams (CP=0).

Control Byte

D7

D0

 2002 Microchip Technology Inc. DS21743A-page 11

TC72

4.0 INTERNAL REGISTER
STRUCTURE

The TC72 registers are listed below.

TABLE 4-1: REGISTERS FOR TC72

Register

Control 00hex 80hex 000One-Shot

LSB Temperature 01hex N/A T1 T0 0 0 000 0 00hex

MSB Temperature 02hex N/A T9 T8 T7 T6 T5 T4 T3 T2 00hex
Manufacturer ID 03hex N/A 010 1 010 0 54hex

Read

Address

Write

Address

Bit7Bit6 Bit

5

Bit

4

(OS)

Bit3Bit2Bit

010Shutdown

1

Bit

0

(SHDN)

Value on

POR/BOR

05hex

4.1 Control Register

The Control register is both a read and a write register
that is used to select either the Shutdown, Continuous
or One-Shot Conversion operating mode. The Temper­ature Conversion mode selection logic is shown in
Table 4-2. The Shutdown (SHDN) bit is stored in bit 0
of the Control register. If SHDN is equal to ‘1’, the TC72
will go into the power-saving shutdown mode. If SHDN
is equal to ‘0’, the TC72 will perform a temperature
conversion approximately every 150 ms.

At power-up, the SHDN bit is set to ‘1’. Thus, the TC72
is in the shutdown operating mode at startup. The Con­tinuous Temperature Conversion mode is selected by
writing a ‘0’ to the SHDN bit of the Control register.

The Shutdown mode can be used to minimize the
power consumption of the TC72 when active tempera­ture monitoring is not required. The shutdown mode
disables the temperature conversion circuitry; how­ever, the serial I/O communication port remains active.
A temperature conversion will be initialized by a Write
operation to the Control register to select either the
Continuous Temperature Conversion or the One-Shot
operating mode. The temperature data will be available
in the MSB and LSB Temperature registers approxi­mately 150 ms after the Control register Write
operation.

The One-Shot mode is selected by writing a ‘1’ into bit
4 of the Control register. The One-Shot mode performs
a single temperature measurement and returns to the
power-saving shutdown mode. After completion of the
temperature conversion, the One-Shot bit (OS) is reset
to ‘0’ (i.e. “OFF”). The user must set the One-Shot bit
to ‘1’ to initiate another temperature conversion.

Bits 1, 3, 5, 6 and 7 of the Control register are not used
by the TC72. Bit 2 is set to a logic ‘1’. Any write opera­tion to these bit locations will have no affect on the
operation of the TC72.

4.2 Temperature Register

The Temperature register is a read-only register and
contains a 10-bit two’s complement representation of
the temperature measurement. Bit 0 through Bit 5 of
the LSB Temperature register are always set to a logic
‘0’.

At Power-On Reset (POR) or a Brown-Out Reset
(BOR) low voltage occurrence, the temperature regis­ter is reset to all zeroes, which corresponds to a tem­perature value of 0°C. A V

1.6V is considered a reset event and will reset the
Temperature register to the power-up state.

power supply less than

DD

4.3 Manufacturer ID Register

The Manufacturer Identification (ID) register is a read­only register used to identify the temperature sensor as
a Microchip component.

TABLE 4-2: CONTROL REGISTER TEMPERATURE CONVERSION MODE SELECTION

Operational Mode One-Shot (OS) Bit 4 Shutdown (SHDN) Bit 0

Continuous Temperature Conversion 00
Shutdown 01

Continuous Temperature Conversion
(One-Shot Command is ignored if SHDN = ‘0’)

One-Shot 11

DS21743A-page 12  2002 Microchip Technology Inc.

10

5.0 APPLICATIONS INFORMATION

The TC72 does not require any additional components
in order to measure temperature; however, it is recom­mended that a decoupling capacitor of 0.1mF to 1mF
be provided between the V
the current consumption of the TC72 is modest
(250 mA, typical), the TC72 contains an on chip data
acquisition with internal digital switching circuitry. Thus,
it is considered good design practice to use an external
decoupling capacitor with the sensor. A high frequency
ceramic capacitor should be used and be located as
close as possible to the IC power pins in order to
provide effective noise protection to the TC72.

The TC72 measures temperature by monitoring the
voltage of a diode located on the IC die. The IC pins of
the TC72 provide a low impedance thermal path
between the die and the PCB, allowing the TC72 to
effectively monitor the temperature of the PCB board.
The thermal path between the ambient air is not as effi­cient because the plastic IC housing package functions
as a thermal insulator. Thus the ambient air tempera­ture (assuming that a large temperature gradient exists
between the air and PCB) has only a small effect on the
temperature measured by the TC72.

Note that the exposed metal center pad on the bottom
of the DFN package is connected to the silicon sub­strate. The center pad should be connected to either
the PCB ground plane or treated as a “No Connect” pin.
The mechanical dimensions of the center pad are given
in Section 6.0, “Packaging Information”, of this
datasheet.

A potential for self-heating errors can exist if the TC72
SPI communication lines are heavily loaded. Typically,
the self-heating error is negligible because of the rela­tively small current consumption of the TC72. A tem­perature accuracy error of approximately 0.5°C will
result from self-heating if the SPI communication pins
sink/source the maximum current specified for the
TC72. Thus to maximize the temperature accuracy, the
output loading of the SPI signals should be minimized.

and GND pins. Although

DD

TC72

 2002 Microchip Technology Inc. DS21743A-page 13

TC72

6.0 PACKAGING INFORMATION

6.1 Taping Form

Component Taping Orientation for 8-Pin MSOP Devices

User Direction of Feed

PIN 1

PIN 1

User Direction of Feed

Standard Reel Component Orientation
for TR Suffix Device

Carrier Tape, Number of Components Per Reel and Reel Size

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

8-Pin MSOP 12 mm 8 mm 2500 13 in

Reverse Reel Component Orientation
for RT Suffix Device

Tape and Reel information for the 8-Lead DFN package will be available TBD.

W

P

DS21743A-page 14  2002 Microchip Technology Inc.

6.2 Package Marking Information

TC72

8-Lead MSOP

XXXXXX
YWWNNN

8-Lead DFN

XXXXXXXX

MYWW

NNN

Example:

TC722M

221067

Example

7228

8221

067

:

Legend: XX...X Customer specific information*

YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line thus limiting the number of available characters
for customer specific information.

* Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

 2002 Microchip Technology Inc. DS21743A-page 15

TC72

8-Lead Plastic Micro Small Outline Package (MS) (MSOP)

p

B

n 1

c

(F)

β

Dimension Limits

Number of Pins

Pitch

Overall Height

Molded Package Thickness

Standoff §

Overall Width

Molded Package Width

Overall Length

Foot Length

Foot Angle

Lead Thickness

Lead Width

Mold Draft Angle Top

Mold Draft Angle Bottom

*Controlling Parameter

§ Significant Characteristic

Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm ) per side.

E1

E

D

2

A

Units

n
p

A

A2

A1

E

E1

D

L

φ

c

B

α
β

MIN

.030

.002

.184

.114

.114

.016

.004

.010

φ

L

INCHES

NOM

.026

.034

.193

.118

.118

.022

.037.035FFootprint (Reference)

0

.006

.012

A1

8

.044

.038

.006

.200

.122

.122

.028

6

.008

.016

7

7

MILLIMETERS*

MINMAX NOM

0.65

0.76

0.05

4.67

2.90

2.90

0.40

0

0.10

0.25

0.86

4.90

3.00

3.00

0.55

0.15

0.30

α

A2

MAX

8

1.18

0.97

0.15

.5.08

3.10

3.10

0.70

1.000.950.90.039

6

0.20

0.40

7

7

Drawing No. C04-111

DS21743A-page 16  2002 Microchip Technology Inc.

8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)

TC72

A3

E

TOP VIEW

A1

E2

p

2 1

n

L

D2

PIN 1
ID INDEX
AREA

(NOTE 2)

b

D

EXPOSED

METAL

PAD

BOTTOM VIEW

A

EXPOSED

TIE BAR

(NOTE 1)

Number of Pins
Pitch
Overall Height
Standoff
Lead Thickness
Overall Length
Exposed Pad Length

Overall Width

Exposed Pad Width
Lead Width
Lead Length

Dimension Limits

(Note 4)

(Note 4)

Units

MIN
n
p

A
A1
A3

E
E2

D
D2

b
L

INCHES

NOM

.026 BSC
.031
.000 .001

.008 REF.

.118 BSC
.055

.118 BSC
.047
.007
.012

.010
.019

MINMAX

8

.039
.002

.096

.069
.015

0.80

0.00

1.39

1.20

0.23

0.30.022

*Controlling Parameter
Notes:

Package may have one or more exposed tie bars at ends.1.
Pin 1 visual index feature may vary, but must be located within the hatched area.2.
Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not

3.
exceed .010" (0.254mm) per side.

4.

Exposed pad dimensions vary with paddle size.

5. JEDEC equivalent: Pending

Drawing No. C04-062

MILLIMETERS*

NOM

8

0.65 BSC

0.90.035

0.02

0.20 REF.

3.00 BSC

3.00 BSC

0.26

0.48

MAX

1.00

0.05

2.45

1.75

0.37

0.55

 2002 Microchip Technology Inc. DS21743A-page 17

TC72

8-Lead Plastic Dual Flat Pack, No Lead (MF) 3x3x1 mm Body (DFN)

Z G

X

CP

DFN LAND PATTERN

H

H2

p

Y

G2

THERMAL VIAS

ON 4 LAYER

PC BOARD

P1

0V

OPTIONAL FOUR LAYER

PCB LAND PATTERN

OPTIONAL TWO LAYER

PCB LAND PATTERN

Units

Dimension Limits

Terminal Pitch

Terminal Land Pattern O.D.

Terminal Land Pattern I.D.

Exposed Pad Clearance .006CP 0.15

Interior Lead Clearance Z .071 1.80

Terminal Land Width

Terminal Land Length

Exposed Pad Length

Optional Exposed Pad Length .130

Exposed Pad Width

Termal Via Pitch

Thermal Via Diameter

Minimum Solder Mask Clearance M .002 0.05

*Controlling Parameter

Notes:

Exposed pad dimensions vary with paddle size.1.

Drawing No. C04-2062

(Note 1)

A1

H2

G2

P1

MIN

p

Z

X

Y

H

V

M (TYP)

INCHES

NOM

.026 BSC

.134

.057

.033 .035 0.85 0.88

.130

.047

.012

TYPCAL SOLDER MASKS

MINMAX

.157

.060

3.40

1.45

3.30

3.30

MILLIMETERS*

NOM

0.65 BSC

1.20

0.30

MAX

4.00

1.53

0.420.35.014 .017

1.501.45.059.057

DS21743A-page 18  2002 Microchip Technology Inc.

TC72

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip
World Wide Web site.

The web site is used by Microchip as a means to make
files and information easily available to customers. To
view the site, the user must have access to the Internet
and a web browser, such as Netscape
Internet Explorer. Files are also available for FTP
download from our FTP site.

Connecting to the Microchip Internet Web Site

The Microchip web site is available at the following
URL:

www.microchip.com

The file transfer site is available by using an FTP ser­vice to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari­ety of Microchip specific business information is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked
Questions

• Design Tips

• Device Errata

• Job Postings

• Microchip Consultant Program Member Listing

• Links to other useful web sites related to
Microchip Products

• Conferences for products, Development Systems,
technical information and more

• Listing of seminars and events

®

or Microsoft

SYSTEMS INFORMATION AND
UPGRADE HOT LINE

The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.

®

Plus, this line provides information on how customers
can receive the most current upgrade kits.The Hot Line
Numbers are:

1-800-755-2345 for U.S. and most of Canada, and

1-480-792-7302 for the rest of the world.

092002

 2002 Microchip Technology Inc. DS21734A-page19

TC72

READER RESPONSE

It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod­uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at [phone].

Please list the following information, and use this outline to provide us with your comments about this document.

To :

RE: Reader Response

From:

Application (optional):

Would you like a reply? Y N

Device:

Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

Technical Publications Manager

Name

Company

Address

City / State / ZIP / Country

Telephone: (_______) _________ - _________

TC72

Literature Number:

Total Pages Sent ________

FAX: (______) _________ - _________

DS21734A

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21734A-page20  2002 Microchip Technology Inc.

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. -X.X XX

Device

Range

Device: TC72: Digital Temperature Sensor w/SPI Interface

Voltage Range: 2.8 = Accuracy Optimized for 2.8V

Temperature Range: M = -55°C to +125°C

Package: MF = Dual, Flat, No Lead (DFN) (3x3mm), 8-lead

3.3 = Accuracy Optimized for 3.3V

5.0 = Accuracy Optimized for 5.0V

MFTR = Dual, Flat, No L ead (DFN) (3x3mm), 8-lead

UA = Plastic Micro Small Outline (MSOP), 8-le ad
UATR = Plastic Micro Smal l Outline (MSOP), 8-lead

X

Temp era tur e

Range

(Tape and Reel)

(Tape and Reel)

PackageVoltag e

Examples:

a) TC72- 2.8MUA: Digital Temperature Sensor,

2.8V, 8LD MSOP package.

b) TC72- 2.8MUATR:

sor, 2.8V, 8LD MSOP (tape and reel) package.

c) TC72-2.8MMF: Digital Temperature Sensor,

2.8V, 8LD DFN package.

d) TC72- 3.3MUA:

3.3V, 8LD MSOP package.

e) TC72-3.3MMF: Digital Temperature Sensor,

3.3V, 8LD DFN package.

f) TC72- 5.0MUA:

5.0V, 8LD MSOP package.

g) TC72-5.0MMF: Digital Temperature Sensor,

5.0V, 8LD DFN package.

h) TC72-5.0MMFTR:

sor, 5.0V, 8LD DFN (tape an d reel) package.

TC72

Digital Temperature Sen-

Digital Temperature Sensor,

Digital Temperature Sensor,

Digital Temperature Sen-

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: [phone]

3. The Microchip Worldwide Site (www.microchip.com)

Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2002 Microchip Technology Inc. DS21743A-page21

TC72

NOTES:

DS21743A-page 22  2002 Microchip Technology Inc.

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com­ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con­veyed, implicitly or otherwise, under any intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, K

EELOQ

MPLAB, PIC, PICmicro, PICSTART and PRO MATE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.

FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL
and The Embedded Control Solutions Company are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.

dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

,

Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its
PICmicro
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog produ cts. In
addition, Microchip’s qua lity system for the
design and manufacture of development
systems is ISO 9001 certified.

®

8-bit MCUs, KEEL

®

code hopping

OQ

 2002 Microchip Technology Inc. DS21743A - page 23

M

W

ORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

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08/01/02

DS21743A-page 24  2002 Microchip Technology Inc.