MICROCHIP TC4426A, TC4427A, TC4428A Technical data

TC4426A/TC4427A/TC4428A

1.5A Dual High-Speed Power MOSFET Drivers

Features

• High Peak Output Current – 1.5A

• Wide Input Supply Voltage Operating Range:

- 4.5V to 18V

• High Capacitive Load Drive Capability – 1000 pF
in 25 ns (typ.)

• Short Delay Times – 30 ns (typ.)

• Matched Rise, Fall and Delay Times

• Low Supply Current:

- With Logic ‘1’ Input – 1 mA (typ.)

- With Logic ‘0’ Input – 100 µA (typ.)

• Low Output Impedance – 7Ω (typ.)

• Latch-Up Protected: Wi ll Withstand 0.5A Revers e
Current

• Input Will Withstand Negative Inputs Up to 5V

• ESD Protected – 4 kV

• Pin-compatible with TC426/TC427/TC428 and
TC4426/TC4427/TC4428

• Space-saving 8-Pin MSOP and 8-Pin 6x5 DFN
Packages

Applications

• Switch Mode Power Supplies

• Line Drivers

• Pulse Transformer Drive

General Description

The TC4426A/TC4427A/TC4428A are improved
versions of th e e a r li er T C4 4 26 /TC4427/TC44 2 8 fa mi ly
of MOSFET drivers. In additi on to matched ris e and fall
times, the TC4426A/TC4427A/TC4428A devices have
matched leading and falling edge propagation delay
times.

These devices are highly latch-up resistant under any
conditions within their power and voltage ratings. They
are not subject to damage when up to 5V of noise
spiking (of either polarity) occurs on the ground pin.
They can accept, without damage or logic upset, up to
500 mA of reverse current (of either polarity) being
forced back into their outputs. All terminals are fully
protected against Electrostatic Discharge (ESD) up to
4kV.

The TC4426A/TC4427A/TC4428A MOSFET drivers
can easily charge/discharge 1000 pF gate
capacitances in under 30 ns. These devices provide
low enough impedance s in both the on and of f states to
ensure the MOSFET's intended state will not be
affected, even by large transients.

Package Types

8-Pin MSOP/

PDIP/SOIC

NC

IN A

GND

IN B

1

TC4426A

2

TC4427A

3

TC4428A

4

TC4426A TC4427A

8
7
6
5

NC
OUT A
V

DD

OUT B

NC
OUT A
V

DD

OUT B

TC4428A

NC
OUT A
V

DD

OUT B

NC

IN A

GND

IN B

8-Pin DFN

1

TC4426A

2

TC4427A

3

TC4428A

4

Note 1: Exposed pad of the DFN package is electrically isolated.

 2004 Microchip Technology Inc. DS21423E-page 1

(1)

TC4426A TC4427A

8

NC

7

OUT A

6

V

DD

5

OUT B

NC
OUT A
V

DD

OUT B

TC4428A

NC
OUT A
V

DD

OUT B

TC4426A/TC4427A/TC4428A

Functional Block Diagram

Inverting

500 µA

300 mV

V

DD

Output

Input

Effective

Input C = 12 pF

(Each Input)

GND

Note 1: TC4426A has two inverting drivers, while the TC4427A has two non-inverting

2: Ground any unused driver input.

Non-Inverting

4.7V

TC4426A/TC4427A/TC4428A

drivers. The TC4428A has one inverting and one non-inverting driver.

DS21423E-page 2  2004 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A

1.0 ELECTRICAL

CHARACTERISTICS

† Notice: Stresses above those listed under "Absolute Maxi­mum Ratings" may cause permanent damage to the device.
These are stress ratings only and functional operation of the
device at these or any other conditions above those indicated

Absolute Maximum Ratings†

Supply Voltage.....................................................+22V

in the operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.

Input Voltage, IN A or IN B

.....................................(V

+ 0.3V) to (GND – 5V)

DD

Package Power Dissipation (TA ≤ 70°C)

DFN.............................................................. Note 2

MSOP..........................................................340 mW

PDIP............................................................730 mW

SOIC............................................................470 mW

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input Voltage V
Logic ‘0’, Low Input Voltage V
Input Current I

IH
IL

IN

Output

High Output Voltage V
Low Output Voltage V
Output Resistance R

Peak Output Current I
Latch-Up Protection

I

REV

OH
OL

O

PK

Withstand Reverse Current
Switching Time (Note 1)
Rise Time t

Fall Time t

Delay Time t

Delay Time t

R

F

D1

D2

Power Supply

Power Supply Current I

S

Note 1: Switching times ensured by design.

2: Package power dissipation is dependent on the copper pad area on the PCB.

2.4 — — V
——0.8V

–1.0

–10

—

+1.0

—

+10

µA 0V ≤ VIN ≤ V

DD

VDD – 0.025 — — V DC Test

— — 0.025 V DC Test
—

—
—
—

—1.5—AV

7
7
8
8

10
11
12

9

Ω I

= 10 mA, VDD = 18V, TA = +25°C

OUT

0°C ≤ T

-40°C ≤ T

-40°C ≤ T

DD

A

= 18V

≤ +70°C

≤ +85°C

A

≤ +125°C

A

— > 0.5 — A Duty cycle ≤ 2%, t ≤ 300 µsec

V

= 18V

DD

—
—
—
—

—
—
—
—

—
—
—
—

—
—
—
—

—
—

25
27
29
30

25
27
29
30

30
33
35
38

30
33
35
38

1.0

0.1

35
40
40
40

35
40
40
40

35
40
45
50

35
40
45
50

2.0

0.2

ns TA = +25°C

0°C ≤ T

-40°C ≤ T

-40°C ≤ T

≤ +70°C

A

≤ +85°C

A

≤ +125°C, Figure 4-1

A

ns TA = +25°C

0°C ≤ T

-40°C ≤ T

-40°C ≤ T

≤ +70°C

A

≤ +85°C

A

≤ +125°C, Figure 4-1

A

ns TA = +25°C

0°C ≤ T

-40°C ≤ T

-40°C ≤ T

≤ +70°C

A

≤ +85°C

A

≤ +125°C, Figure 4-1

A

ns TA = +25°C

0°C ≤ T

-40°C ≤ T

-40°C ≤ T

≤ +70°C

A

≤ +85°C

A

≤ +125°C, Figure 4-1

A

mA VIN = 3V (Both inputs)

V

= 0V (Both inputs), VDD = 18V

IN

 2004 Microchip Technology Inc. DS21423E-page 3

TC4426A/TC4427A/TC4428A

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ VDD ≤ 18V.

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range (C) T
Specified Temperature Range (E) T
Specified Temperature Range (V) T
Maximum Junction Temperature T
Storage Temperature Range T

Package Thermal Resistances

Thermal Resistance, 8L-6x5 DFN θ
Thermal Resistance, 8L-MSOP θ
Thermal Resistance, 8L-PDIP θ
Thermal Resistance, 8L-SOIC θ

A
A
A

J

A

JA
JA
JA
JA

0—+70°C

-40 — +85 °C

-40 — +125 °C

——+150°C

-65 — +150 °C

—33.2 —°C/W
— 206 — °C/W
— 125 — °C/W
— 155 — °C/W

DS21423E-page 4  2004 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

100

80

60

(nsec)

40

RISE

t

20

0

CL = 2200 pF

CL = 100 pF

5.0

CL = 1500 pF

CL = 1000 pF

7.5 10.0 12.5 15.0 17.5

V

(V)

DD

= +25

T

A

CL = 470 pF

FIGURE 2-1: Rise Time vs. Supply Voltage.

110

100

90

80

70

60
50
40

Delay Time (nsec)

30
20

t

D1

t

D2

12 3 4 567 8 9

Input Amplitude (V)

CL = 1000 pF

V

= 10V

DD

°C

100

(nsec)

FALL

t

CL = 2200pF

CL = 2200 pF

80

60

40

20

CL= 100pF

CL = 100 pF

0

5.0 7.5 10.0 12.5 15.0 17.5

CL = 1500 pF

CL = 1000 pF

V

DD

(V)

= +25

T

A

CL = 470 pF

°C

FIGURE 2-4: Fall Time vs. Supply Voltage.

60

55

50

45

40

35

30

Delay Time (nsec)

25

20

0 5 10 15 20

t

D1

t

D2

V

(V)

DD

CL = 1000 pF

FIGURE 2-2: Delay Time vs. Input Amplitude.

28

CL = 1000 pF

26

V

= 18V

DD

24

22

20

Time (nsec)

18

t

RISE

16

t

FALL

14

-100 -50 0 50 100 150

TEMPERATURE (°C)

FIGURE 2-3: Rise and F all Times vs. Temperature.

FIGURE 2-5: Propagation Delay Time vs. Supply Voltage.

40

CL = 1000 pF

35

V

= 18V

DD

30

25

t

Delay Time (nsec)

D2

20

15

t

D1

-100 -50 0 50 100 150

TEMPERATURE (°C)

FIGURE 2-6: Propagation Delay Time vs. Temperature.

 2004 Microchip Technology Inc. DS21423E-page 5

TC4426A/TC4427A/TC4428A

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

30

= +125

T

25

20

(Ω)

15

DS(ON)

10

R

5

0

0 5 10 15 20

°C

A

= +25

T

°C

A

V

(V)

DD

FIGURE 2-7: Hig h-State Output Resistance.

60

50

40

(mA)

30

20

SUPPLY

I

10

0

CL = 2200 pF

0

500 1000 1500 2000 2500

CL = 1500 pF

CL = 1000 pF

FREQUENCY (kHz)

V

CL = 100 pF

DD

= 18V

30

25

= +125

20

(Ω)

15

DS(ON)

10

R

5

0

T

T

0

A

A

= +25

°C

°C

5

10

V

(V)

DD

15 20

FIGURE 2-10: Low-State Output Resistance.

60

50

40

(mA)

30

20

SUPPLY

I

10

0

0

2 MHz

500 1000 1500 2000 2500

C

V

LOAD

DD

= 18V

(pF)

900 kHz

600 kHz

200 kHz

20 kHz

FIGURE 2-8: Su ppl y Curre nt vs. Frequency.

80

70

60

50

(mA)

40

30

SUPPLY

I

20

10

0

V

= 12V

DD

500

1000

FREQUENCY (kHz)

1500 2000 2500

0

CL = 2200 pF

CL = 1500 pF

CL = 1000 pF

FIGURE 2-9: Su ppl y Curre nt vs. Frequency.

CL = 100 pF

FIGURE 2-11: Supply Current vs. Capacitive Load.

80

V

= 12V

DD

70

60

50

(mA)

40

30

SUPPLY

I

20

10

0

0

500

1000

1500 2000 2500

C

(pF)

LOAD

FIGURE 2-12: Supply Current vs. Capacitive Load.

2 MHz

900 kHz

600 kHz

200 kHz

20 kHz

DS21423E-page 6  2004 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A

Note: Unless otherwise indicated, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

40

V

35

30

25

(mA)

20

15

SUPPLY

I

10

5

0

= 6V

DD

500

1000

FREQUENCY (kHz)

1500 2000 2500

0

CL = 2200 pF

CL = 1500 pF

CL = 1000 pF

CL = 100 pF

FIGURE 2-13: Supply Current vs. Frequency.

900
800

BOTH INPUTS = 1
700

600

(µA)

500

400

300

QUIESCENT

I

200

BOTH INPUTS = 0
100

0

0 5 10 15 20

V

(V)

DD

40

V

= 6V

DD

35

30

25

(mA)

20

15

SUPPLY

I

10

5

0

500

1000

1500 2000 2500

C

(pF)

LOAD

0

2 MHz

900 kHz

600 kHz

200 kHz

20 kHz

FIGURE 2-15: Supply Current vs. Capacitive Load.

1100
1000

BOTH INPUTS = 1

900

= 25

T

°C

A

800

(µA)

700
600
500
400

QUIESCENT

300

I

BOTH INPUTS = 0

200
100

0

-100 -50 0 50 100 150

TEMPERATURE (°C)

V

= 18V

DD

FIGURE 2-14: Quiescent Supply Current vs. Voltage.

FIGURE 2-16: Quiescent Supply Current vs. Temperature.

 2004 Microchip Technology Inc. DS21423E-page 7

TC4426A/TC4427A/TC4428A

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

8-Pin PDIP/

MSOP/SOIC

1 1 NC No connection
2 2 IN A Input A
33GNDGround
4 4 IN B Input B
55OUT BOutput B
66V
77OUT AOutput A
8 8 NC No connection

— PAD NC Exposed Metal Pad

Note 1: Duplicate pins must be connected for proper operation.

8-Pin

DFN

Symbol Description

DD

Supply input

3.1 Inputs A and B

MOSFET driver inputs A and B are high-impedance,
TTL/CMOS compatible inputs. These inputs also have
300 mV of hysteresis between the high and low
thresholds that prevents output glitching, even when
the rise and fall time of the input signal is very slow.

3.2 Ground (GND)

The ground pin is the return path for both the bias
current and the high peak current that discharges the
external lo ad capacitance. The gr ound pin should be
tied into a ground plane or have a v ery short trace to th e
bias supply source return.

3.3 Output A and B

MOSFET driver outputs A and B are low-impedance,
CMOS push-pull st yle outp uts . The pu ll-down an d pul l­up devices are of equal strength, making the rise and
fall times equivalent.

3.4 Supply Input (VDD)

The VDD input is the bias supp ly for the MOSFET d river
and is rated for 4.5V to 18 V, with respect to the ground
pin. The VDD input should be bypassed with local
ceramic capacitors. The value of these capacitors
should be chosen based on the capacitive load that is
being driven.

3.5 Exposed Metal Pad

The exposed met al p ad of the 6x5 DFN pac kage is not
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board, to aid in heat
removal from the package.

DS21423E-page 8  2004 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A

4.0 APPLICATIONS INFORMATION

Input

VDD = 18V

2

4

Input: 100 kHz,

square wave,

= t

t

RISE

FALL

6

3

≤ 10 ns

4.7 µF

7

5

0.1 µF

Output

CL = 1000 pF

+5V

Input

V

Output

+5V

Input

0V

V

DD

Output

0V

0V

DD

0V

10%

10%

t

D1

t

F

t

D2

90%

10%

Inverting Driver

(TC4426A, 1/2 TC4428A)

90%

90%

t

D1

t

R

t

D2

10%

Non-Inverting Driver

(TC4427A, 1/2 TC4428A)

90%

10%

t

R

10%

90%

90%

t

F

FIGURE 4-1: Switching Time Test Circuit.

 2004 Microchip Technology Inc. DS21423E-page 9

TC4426A/TC4427A/TC4428A

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

8-Lead DFN

XXXXXXX
XXXXXXX

XXYYWW

NNN

8-Lead MSOP

XXXXX

YWWNNN

8-Lead PDIP (300 mil)

XXXXXXXX
XXXXXNNN

YYWW

Example

TC4426A

EMF

0420

Example:

4426AE

420256

Example:

TC4427A

EPA256

:

256

0420

8-Lead SOIC (150 mil)

XXXXXXXX
XXXXYYWW

NNN

Legend: XX...X Customer specific information*

YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code

Note: In the event the full Micro chip p art num ber can not be ma rked on on e line, it will

be carried over to the next line thus limiti ng the number of available chara ct ers
for customer specific information.

* Standard marking consists of Microchip part number, year code, week code, traceability code (facility

code, mask r ev#, and assembly code).

DS21423E-page 10  2004 Microchip Technology Inc.

Example:

TC4428A

COA0420

256

TC4426A/TC4427A/TC4428A

8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated

 2004 Microchip Technology Inc. DS21423E-page 11

TC4426A/TC4427A/TC4428A

8-Lead Plastic Micro Small Outline Package (UA) (MSOP)

E

E1

p

D

2

B

n 1

α

A

c

(F)

β

Units

Dimension Limits
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length

Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom

*Controlling Parameter
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .010" (0.254mm) per side.

JEDEC Equivalent: MO-187

Drawing No. C04-111

A2
A1

E1

MIN

n
p

A

E

D
L

φ

c

B

α

β

INCHES

.026 BSC

.030
.000

.193 TYP.
.118 BSC
.118 BSC

.016 .024

.037 REFFFootprint (Reference)

0° - 8°
.003
.009

5°

5° -

L

NOM

8

.033

.006
.012

φ

A1

MAX NOM

--

-

-

.043
.037
.006

.031

.009

.016

15°
15°

MIN

0.75

0.00

0.40

0.08

0.22

MILLIMETERS*

MAX

8

0.65 BSC

--

0.85

-

4.90 BSC

3.00 BSC

3.00 BSC

0.60

0.95 REF

0°

-

-

-

A2

1.10

0.95

0.15

0.80

8°

0.23

0.40
15°5° ­15°5° -

DS21423E-page 12  2004 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

E1

D

2

n

E

β

eB

Number of Pins
Pitch
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .3 13 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter

§ Significant Characteristic
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018

Dimension Limits MIN NOM MAX MIN NOM MAX

1

α

A

c

Units INCHES* MILLIMETERS

n

p

c

α

β

.008 .012 .015 0.20 0.29 0.38

A1

B1

B

88

.100 2.54

51015 51015
51015 51015

A2

L

p

 2004 Microchip Technology Inc. DS21423E-page 13

TC4426A/TC4427A/TC4428A

8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

Number of Pins
Pitch

Foot Angle
Lead Thickness

Mold Draft Angle Top
Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

n

45°

c

β

n
p

φ

c

α

β

1

h

A

φ

L

048048

A1

MILLIMETERSINCHES*Units

1.27.050

α

A2

MAXNOMMINMAXNOMMINDimension Limits

88

1.751.551.35.069.061.053AOverall Height

1.551.421.32.061.056.052A2M olded Pa ckag e Thickness

0.250.180.10.010.007.004A1Standoff §

6.206.025.79.244.237.228EOverall Width

3.993.913.71.157.154.146E1Molded Package Width

5.004.904.80.197.193.189DOverall Length

0.510.380.25.020.015.010hChamfer Distance

0.760.620.48.030.025.019LFoot Length

0.250.230.20.010.009.008

0.510.420.33.020.017.013BLead Width
1512015120
1512015120

DS21423E-page 14  2004 Microchip Technology Inc.

TC4426A/TC4427A/TC4428A

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X XX

Device

PackageTemperature

XXX

Tape & ReelXPB Free

Range

Device: TC4426A: 1.5A Dual MOSFET Driver, Inverting

Temperature Range: C = 0°C to +70°C (PDIP & SOIC Only)

Package: MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead

PB Free: G = Lead-Free device *

TC4427A: 1.5A Dual MOSFET Driver, Non-Inverting
TC4428A: 1.5A Dual MOSFET Driver, Complementary

E = -40°C to +85°C
V = -40ºC to +125°C

MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
PA = Plastic DIP (300 mil Body), 8-lead

OA = Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead

UA = Plastic Micro Small Outline (MSOP), 8-lead
UA713 = Plastic Micro Small Outline (MSOP), 8-lead

* Available on selected packages. Contact your local sales

(Tape and Reel)

(Tape and Reel)

(Tape and Reel)

= Blank

representative for availability.

Examples:

a) TC4426ACOA: 1.5A Dual Inverting

b) TC4426AEOA: 1.5A Dual

c) TC4426AEMF: 1.5A Dual

a) TC4427ACPA: 1.5A Dual

b) TC4427AEPA: 1.5A Dual

c) TC4427AVMF713: 1.5A Dual

a) TC4428AEPA: 1.5A Dual

b) TC4428ACOA713: 1.5A Dual

c) TC4428AVMF: 1.5A Dual

MOSFET driver,
0°C to +70°C,
8LD SOIC package.

Inverting

MOSFET driver,

-40°C to +85°C,
8LD SOIC package.

Inverting

MOSFET driver,

-40°C to +85°C,

8LD DFN package.

Non-Inverting

MOSFET driver,
0°C to +70°C,
8LD PDIP package.

Non-Inverting

MOSFET driver,

-40°C to +85°C,
8LD PDIP package.

Non-Inverting

MOSFET driver,

-40°C to +125°C,
8LD DFN package,
Tape and Reel.

Complementary

MOSFET driver,

-40°C to +85°C,
8LD PDIP package.

Complementary

MOSFET driver,
0°C to +70°C
8LD SOIC package,
Tape and Reel.

Complementary

MOSFET driver,

-40°C to +125°C,
8LD DFN package.

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: [phone]

3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2004 Microchip Technology Inc. DS21423E-page 15

TC4426A/TC4427A/TC4428A

NOTES:

DS21423E-page 16  2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that i ts family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

EELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSmart, rfPIC, a nd
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM ,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

8-bit MCUs, KEELOQ

®

code hopping

 2004 Microchip Technology Inc. DS21423E-page 17

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:
480-792-7627
Web Address:
www.microchip.com

Atlanta

Alpharetta, GA
Tel: [phone]
Fax: [phone]

Boston

Westford, MA
Tel: [phone]
Fax: [phone]

Chicago

Itasca, IL
Tel: [phone]
Fax: [phone]

Dallas

Addison, TX
Tel: [phone]
Fax: [phone]

Detroit

Farmington Hills, MI
Tel: [phone]
Fax: [phone]

Kokomo

Kokomo, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

San Jose

Mountain View, CA
Tel: [phone]
Fax: [phone]

Toronto

Mississauga, Ontario,
Canada
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Australia - Sydney

Tel: [phone]
Fax: [phone]

China - Beijing

Tel: [phone]
Fax: [phone]

China - Chengdu

Tel: [phone]
Fax: [phone]

China - Fuzhou

Tel: [phone]
Fax: [phone]

China - Hong Kong SAR

Tel: [phone]
Fax: [phone]

China - Shanghai

Tel: [phone]
Fax: [phone]

China - Shenzhen

Tel: [phone]
Fax: [phone]

China - Shunde

Tel: [phone]
Fax: [phone]

China - Qingdao

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi

Tel: [phone]
Fax: [phone]

Japan - Kanagawa

Tel: [phone]
Fax: [phone]

Korea - Seoul

Tel: [phone]
Fax: [phone] or
82-2-558-5934

Singapore

Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung

Tel: [phone]
Fax: [phone]

Taiwan - Taipei

Tel: [phone]
Fax: [phone]

Taiwan - Hsinchu

Tel: [phone]
Fax: [phone]

EUROPE

Austria - Weis

Tel: [phone]
Fax: [phone]

Denmark - Ballerup

Tel: [phone]
Fax: [phone]

France - Massy

Tel: [phone]
Fax: [phone]

Germany - Ismaning

Tel: [phone]
Fax: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

England - Berkshire

Tel: [phone]
Fax: [phone]

08/24/04

DS21423E-page 18  2004 Microchip Technology Inc.