MICROCHIP TC4420, TC4429 Technical data

查询TC4420EOA713供应商

TC4420/TC4429

6A High-Speed MOSFET Drivers

Features

• Latch-Up Protected: Will Withstand >1.5A
Reverse Output Current

• Logic Input Will Withstand Negative Swing Up To
5V

• ESD Protected: 4 kV

• Matched Rise and Fall Times:

- 25 ns (2500 pF load)

• High Peak Output Current: 6A

• Wide Input Supply Voltage Operating Range:

- 4.5V to 18V

• High Capacitive Load Drive Capability: 10,000pF

• Short Delay Time: 55 ns (typ.)

• CMOS/TTL Compatible Input

• Low Supply Current With Logic ‘1’ Input:

-450µA (typ.)

• Low Output Impedance: 2.5Ω

• Output Voltage Swing to Within 25 mV of Ground
or V

DD

• Space-Saving 8-Pin SOIC and 8-Pin 6x5 DFN
Packages

Applications

General Description

The TC4420/TC4429 are 6A (peak), single-output
MOSFET drivers. The TC4429 is an inverting driver
(pin-compatible with the TC429), while the TC4420 is a
non-inverting driver. These drivers are fabricated in
CMOS for lower power and more efficient operation
versus bipolar drivers.

Both devices have TTL/CMOS compatible inpu ts that
can be driven as high a s V
without upset or damage to th e device. T his elimi nates
the need for external level-shifting circuitry and its
associated cost and size. The output swing is rail-to-rail,
ensuring better dri ve voltage margin, espe cially during
power-up/power-down sequencing. Propagational
delay time is only 55 ns (typ.) and the output rise and fall
times are only 25 ns (typ.) into 2500 pF across the
usable power supply range.

Unlike other drivers, the TC4420/TC4429 are virtually
latch-up proof. They replace three or more discrete
components, saving PCB area, parts and improving
overall system reliability.

+ 0.3V or as low as –5V

DD

• Switch-Mode Power Supp lie s

• Motor Controls

• Pulse Transformer Driver

• Class D Switching Amplifiers

Package Types

8-Pin CERDIP/

(1)

TC4420 TC4429

PDIP/SOIC

V

1

V

1

DD

TC4420

2

INPUT

TC4429

3

NC

4

GND

Note 1: Duplicate pins must both be connected for proper operation.

2: Exposed pad of the DFN package is electrically isolated.

8
7
6
5

V

DD

OUTPUT
OUTPUT
GND

V

DD

OUTPUT
OUTPUT
GND

DD

INPUT

NC

GND

2
3
4

8-Pin DFN

TC4420
TC4429

(2)

TC4420 TC4429

V

8

DD

7

OUTPUT

6

OUTPUT

5

GND

V

DD

OUTPUT
OUTPUT
GND

5-Pin TO-220

Tab is
Common
to V

TC4420
TC4429

DD

V

GND

GND

INPUT

OUTPUT

DD

 2004 Microchip Technology Inc. DS21419C-page 1

TC4420/TC4429

Functional Block Diagram

500 µA

300 mV

TC4429

Inverting

V

DD

Output

Input

GND

TC4420

Non-Inverting

4.7V

Effective

Input

C = 38 pF

DS21419C-page 2  2004 Microchip Technology Inc.

TC4420/TC4429

1.0 ELECTRICAL

CHARACTERISTICS

Absolute Maximum Ratings†

Supply Voltage.....................................................+20V

† Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.

Input Voltage..................................– 5V to VDD + 0.3V

Input Current (VIN > VDD)...................................50 mA

Power Dissipation (T

≤ 70°C)

A

5-Pin TO-220....................................................1.6W

CERDIP.......................................................800 mW

DFN............................................ ...................Note 2

PDIP............................................................730 mW

SOIC............................................................470 mW

Package Power Dissipation (T

≤ 25°C)

A

5-Pin TO-220 (With Heatsink) ........................12.5W

Thermal Impedances (To Case)

5-Pin TO-220 R

......................................10°C/W

θJ-C

DC CHARACTERISTICS

Electrical Specifications: Unless other wise noted, TA = +25°C with 4.5V ≤ VDD ≤ 18V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input
Voltage

Logic ‘0’, Low Input Voltage V
Input Voltage Range V
Input Current I

Output

High Output Voltage V
Low Output Voltage V
Output Resistanc e, Hi gh R
Output Resistanc e, Low R
Peak Output Current I
Latch-Up Protection

Withstand Reverse Current
Switching Time (Note 1)
Rise Time t
Fall Time t
Delay Time t
Delay Time t

Power Supply

Power Supply Current I

Operating Input Voltage V

Note 1: Switching times ensured by design.

2: Package power dissipation is dependent on the copper pad area on the PCB.

V

I

REV

IH

IL
IN

IN

OH
OL
OH

OL

PK

2.4 1.8 — V

—1.30.8V
–5 — VDD+0.3 V

–10 — +10 µA 0V ≤ VIN ≤ V

VDD – 0.025 — — V DC TEST

— — 0.025 V DC TEST
—2.12.8Ω I
—1.52.5Ω I
—6.0—AV
— > 1.5 — A Duty cycle ≤ 2%, t ≤ 300 µsec

R

F
D1
D2

S

DD

—2535nsFigure 4-1, CL = 2,500 pF
—2535nsFigure 4-1, CL = 2,500 pF
—5575nsFigure 4-1
—5575nsFigure 4-1

—
—

0.45
55

1.5

150

mAµAVIN = 3V

4.5 — 18 V

OUT
OUT

V

DD

= 0V

IN

DD

= 10 mA, VDD = 18V
= 10 mA, VDD = 18V

= 18V

 2004 Microchip Technology Inc. DS21419C-page 3

TC4420/TC4429

DC CHARACTERISTICS (OVER OPERATING TEMPERATURE RANGE)

Electrical Specifications: Unless otherwise noted, over operating temperature range with 4.5V ≤ VDD ≤ 18V.

Parameters Sym Min Typ Max Units Conditions

Input

Logic ‘1’, High Input
Voltage

Logic ‘0’, Low Input Voltage V
Input Voltage Range V
Input Current I

Output

High Output Voltage V
Low Output Voltage V
Output Resistanc e, Hi gh R
Output Resistanc e, Low R
Switching Time (Note 1)
Rise Time t
Fall Time t
Delay Time t
Delay Time t

Power Supply

Power Supply Current I

Operating Input Voltage V
Note 1: Switching times ensured by design.

V

IH

IL
IN

IN

OH
OL
OH

OL

R

F
D1
D2

S

DD

2.4 — — V

——0.8V
–5 — VDD + 0.3 V

–10 — +10 µA 0V ≤ VIN ≤ V

VDD – 0.025 — — V DC TEST

— — 0.025 V DC TEST
—35Ω I
—2.35Ω I

—3260nsFigure 4-1, CL = 2,500 pF
—3460nsFigure 4-1, CL = 2,500 pF
—50100nsFigure 4-1
—65100nsFigure 4-1

—
—

0.45
60

3

400

4.5 — 18 V

= 10 mA, VDD = 18V

OUT

= 10 mA, VDD = 18V

OUT

mAµAVIN = 3V

V

= 0V

IN

DD

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all parameters apply with 4.5V ≤ V

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range (C) T
Specified Temperature Range (I) T
Specified Temperature Range (E) T
Specified Temperature Range (V) T
Maximum Junction Temperature T
Storage Temperature Range T

Package Thermal Resistances

Thermal Resistance, 5L-TO-220 θ
Thermal Resistance, 8L-CERDIP θ
Thermal Resistance, 8L-6x5 DFN θ

Thermal Resistance, 8L-PDIP θ
Thermal Resistance, 8L-SOIC θ

A
A
A
A
J
A

JA
JA
JA

JA
JA

0—+70°C
–25 — +85 °C
–40 — +85 °C
–40 — +125 °C

— — +150 °C

–65 — +150 °C

—71—°C/W
—150—°C/W
— 33.2 — °C/W Typical four-layer board

—125—°C/W
—155—°C/W

≤ 18V.

DD

with vias to ground plane.

DS21419C-page 4  2004 Microchip Technology Inc.

TC4420/TC4429

0

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and ta bles provided followi ng thi s n ote are a statistical s umm ar y based on a limite d n um ber of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.

120

100

C = 10,000 pF

80

60

Time (nsec)

40

20

0

579111315

Supply Voltage (V)

L

C = 4700 pF

L

C = 2200 pF

L

FIGURE 2-1: Rise Time vs. Supply
Voltage.

100

80

60

V = 5V

1000

DD

V = 12V

DD

Capcitive Load (pF)

V = 18V

DD

10,000

40

Time (nsec)

20

10

100

80

C = 10,000 pF

60

40

Time (nsec)

20

0

57 9111315

Supply Voltage (V)

L

C = 4700 pF

L

C = 2200 pF

L

FIGURE 2-4: Fall Time vs. Supply
Voltage.

100

80

60

40

V = 5V

DD

V = 12V

Time (nsec)

20

10

1000

DD

Capacitive Load (pF)

V = 18V

DD

10,00

FIGURE 2-2: Rise Time vs. Capacitive
Load.

50

C = 2200 pF

L

V = 18V

DD

40

t

D2

30

20

Delay Time (nsec)

10

0

t

D1

–60 –20 20 60 100

TA (°C)

140

FIGURE 2-3: Propagation Delay Time vs.
Temperature.

FIGURE 2-5: Fall Time vs. Capacitive
Load.

84

V = 15V

DD

70

56

42

28

Supply Current (mA)

14

0

0 100 1000

500 kHz

200 kHz

Capacitive Load (pF)

20 kHz

10,000

FIGURE 2-6: Supply Current vs.
Capacitive Load.

 2004 Microchip Technology Inc. DS21419C-page 5

TC4420/TC4429

5

Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.

50

C = 2200 pF

L

V = 18V

DD

40

30

20

Time (nsec)

10

0

t

FALL

t

RISE

–60 –20 20 60 100

TA (°C)

140

FIGURE 2-7: Rise and Fall Times vs.
Temperature.

65

60

55

t

50

45

Delay Time (nsec)

40

35

4 6 81012141618

D2

t

D1

Supply Voltage (V)

5

100 mA

10 mA

5913

7111

50 mA

Supply Voltage (V)

OUT

R ( )Ω

4

3

2

FIGURE 2-10: High-State Output
Resistance vs Supply Voltage.

200

Load = 2200 pF

160

120

Input 2.4V

Input 3V

80

Delay Time (nsec)

40

0

Input 5V

Input 8V and 10V

567 11 13

8 9 10 12 14

V (V)

DD

15

FIGURE 2-8: Propagation Delay Time vs.
Supply Voltage.

1000

C = 2200 pF

L

100

10

Supply Current (mA)

0

0 100 1000

Frequency (kHz)

18V

10V

5V

10,000

FIGURE 2-9: Supply Current vs.
Frequency.

FIGURE 2-11: Effect of Input Amplitude on
Propagation Delay.

2.5

2

OUT

R ( )Ω

1.5

1

5913

71115

Supply Voltage (V)

100 mA

50 mA

10 mA

FIGURE 2-12: Low-State Output
Resistance vs. Supply Voltage.

DS21419C-page 6  2004 Microchip Technology Inc.

Note: Unless otherwise indicated, TA = +25°C with 4.5V ≤ VDD ≤ 18V.

4

-8

3

2

1

Crossover Area (A•S) x 10

0

567 11 13

8 9 10 12 14

Supply Voltage (V)

15

The values on this graph represent the loss seen
by the driver during one complete cycle. For a
single transition, divide the value by 2.

FIGURE 2-13: Crossover Energy.

TC4420/TC4429

 2004 Microchip Technology Inc. DS21419C-page 7

TC4420/TC4429

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin No.

8-Pin CERDIP/

PDIP/SOIC

11—VDDSupply input, 4.5V to 18V
2 2 1 INPUT Control input, TTL/CMOS compatible input
3 3 — NC No Connection
4 4 2 GND Ground
5 5 4 GND Ground
6 6 5 OUTPUT CMOS push-pull output
7 7 — OUTPUT CMOS push-pull output

883V
—PAD— NCExposed Metal Pad
——TABV

3.1 Supply Input (VDD)

The VDD input is the bias supp ly for the MO SFET driver
and is rated for 4.5V to 18V with respect to the ground
pins. The VDD input should be bypassed to ground with
a local ceram ic capacitor. The value of the capacito r
should be chos en base d on the capaciti ve load th at is
being driven. A minimum val ue of 1. 0µF is suggested.

Pin No.

8-Pin DFN

Pin No.

5-Pin TO-220

Symbol Description

DD

DD

Supply input, 4.5V to 18V

Metal Tab is at the VDD Potential

3.3 CMOS Push-Pull Output

The MOSFET driver output is a low-impedance,
CMOS, push-pull style output capable of driving a
capacitive load with 6.0A peak currents. The MOSFET
driver output is capable of withstanding 1.5A peak
reverse currents of either polarity.

3.4 Ground

3.2 Control Input

The MOSFET driver input is a high-impedance,
TTL/CMOS compatible input. The input circuitry of the
TC4420/TC4429 MOSFET driver also has a “speed­up” capacitor. This helps to decrease the propagation
delay times of the driver. Because of this, input signals
with slow rising or falling edges should not be us ed, a s
this can result in double-pulsing of the MOSFET driver
output.

The ground pins are the return path for the bias current
and the high peak currents that discharge the load
capacitor . The ground pins sh ould be tie d into a g round
plane or have very short traces to the bias supply
source return.

3.5 Exposed Metal Pad

The exposed met al p ad of the 6x5 DFN pac ka ge i s n ot
internally connected to any potential. Therefore, this
pad can be connected to a ground plane or other
copper plane on a printed circuit board (PCB) to aid in
heat removal from the package.

DS21419C-page 8  2004 Microchip Technology Inc.

4.0 APPLICATIONS INFORMATION

TC4420/TC4429

+5V

Input

V

0.1 µF

Input

= 18V

DD

4.7 µF

18

0.1 µF

26

Output

7

CL = 2,500 pF

+18V

Output

+5V

0V

0V

10%

Input

54

0V

10%

+18V

Input: 100 kHz,

square wave,

t

= t

RISE

FALL

≤ 10 ns

Output

0V

Note: Pinout shown is for the PDIP, SOIC, DFN and CERDIP packages.

t

D1

t

F

90%

10%

Inverting Driver

TC4429

90%

t

D1

t

R

10%

Non-Inverting Driver

TC4420

t

D2

90%

t

D2

90%

10%

t

R

10%

90%

90%

t

F

FIGURE 4-1: Switching Time Test Circuits.

 2004 Microchip Technology Inc. DS21419C-page 9

TC4420/TC4429

5.0 PACKAGING INFORMATION

5.1 Package Marking Information

5-Lead TO-220

XXXXXXXXX
XXXXXXXXX

YYWWNNN

8-Lead CERDIP (300 mil)

XXXXXXXX
XXXXXNNN

YYWW

8-Lead DFN

Example:

TC4420CAT

0419256

Example:

TC4420

MJA256

Example

0419

:

XXXXXXX
XXXXXXX

XXYYWW

NNN

Legend: XX...X Customer specific information*

YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code

Note: In the event the full Microchip part numbe r cannot be marke d on one li ne, it wi ll

be carried over to the next line thus limiti ng the number of available chara ct ers
for customer specific information.

* Standard OTP marking consists of Microchip part number, year code, week code, and traceability code.

TC4420

EMF

0419

256

DS21419C-page 10  2004 Microchip Technology Inc.

Package Marking Information (Continued)

TC4420/TC4429

8-Lead PDIP (300 mil)

XXXXXXXX
XXXXXNNN

YYWW

8-Lead SOIC (150 mil)

XXXXXXXX
XXXXYYWW

NNN

Example:

TC4420

CPA256

0419

Example:

TC4420

EOA0419

256

 2004 Microchip Technology Inc. DS21419C-page 11

TC4420/TC4429

5-Lead Plastic Transistor Outline (AT) (TO-220)

L H1

b

Q

e1

e3

e

EJECTOR PIN

C1

J1

D

Units

Dimension Limits
Lead Pitch
Overall Lead Centers e1 .263
Space Between Leads e3 .030 1.02.040 0.76
Overall Height
Overall Width
Overall Length D
Flag Length H1 .234 6.55.258 5.94
Flag Thickness F .045 1.40.055 1.14
Through Hole Center
Through Hole Diameter P .146 .156 3.71 3.96
Lead Length

Lead Thickness
Lead Width
Mold Draft Angle

*Controlling Parameter
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed .010" (0.254mm) per side.
JEDEC equivalent: TO-220

Drawing No. C04-036

e

A

E

Q

L

J1Base to Bottom of Lead .090 2.29.115 2.92

C1

b

a

E

ØP

(5X)

a

A

F

INCHES*

MIN

.060

.160 4.06
.385
.560

.103 2.87.113 2.62

.540

.014

3° 7° 3° 7°

.072 1.52 1.83
.273 6.68 6.93

.190
.415 9.78 10.54
.590 14.22 14.99

.560 13.72

.022 0.36 0.56

MILLIMETERS

MINMAX

MAX

4.83

14.22

1.020.64.040.025

DS21419C-page 12  2004 Microchip Technology Inc.

8-Lead Ceramic Dual In-line – 300 mil (JA) (CERDIP)

E1

2

TC4420/TC4429

n

E

eB

Number of Pins
Pitch

Standoff §

Ceramic Pkg. Width

Lead Thickness
Upper Lead Width

Overall Row Spacing

*Controlling Parameter

JEDEC Equivalent: MS-030

Drawing No. C04-010

1

D

A2

A

c

L

B1

A1

MINDimension Limits
n
p

A1

E1

c

B1

eB

B

NOM

p

MILLIMETERSINCHES*Units

MINMAX

NOM

2.54.100

MAX

88

5.084.574.06.200.180.160ATop to Seating Plane

1.020.770.51.040.030.020

8.137.757.37.320.305.290EShoulder to Shoulder Width

7.626.735.84.300.265.230

10.169.789.40.400.385.370DOverall Length

5.084.133.18.200.163.125LTip to Seating Plane

0.380.290.20.015.012.008

1.651.401.14.065.055.045

0.510.460.41.020.018.016BLower Lead Width

10.169.158.13.400.360.320

 2004 Microchip Technology Inc. DS21419C-page 13

TC4420/TC4429

8-Lead Plastic Dual Flat No Lead Package (MF) 6x5 mm Body (DFN-S) – Saw Singulated

DS21419C-page 14  2004 Microchip Technology Inc.

8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)

E1

D

2

TC4420/TC4429

n

E

β

eB

Number of Pins
Pitch
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .38 5 9.14 9.46 9.78
Tip to Seating Plan e L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
Upper Lead Width
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing §
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter

§ Significant Characteristic
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018

Dimension Limits MIN NOM MAX MIN NOM MAX

1

α

A

c

Units INCHES* MILLIMETERS

n
p

c

B1

eB

α
β

.008 .012 .015 0.20 0.29 0.38
.045 .058 .070 1.14 1.46 1.78

.310 .370 .430 7.87 9.40 10.92

A1

B1

B

88

.100 2.54

5 10 15 5 10 15
5 10 15 5 10 15

A2

L

p

 2004 Microchip Technology Inc. DS21419C-page 15

TC4420/TC4429

8-Lead Plastic Small Outline (OA) – Narrow, 150 mil (SOIC)

E

E1

p

D

2

B

Number of Pins
Pitch

Foot Angle
Lead Thickness

Mold Draft Angle Top
Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic
Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057

n

45°

c

β

n
p

φ

c

α
β

1

h

A

φ

L

048048

A1

MILLIMETERSINCHES*Units

1.27.050

α

A2

MAXNOMMINMAXNOMMINDimension Limits

88

1.751.551.35.069.061.053AOverall Height

1.551.421.32.061.056.052A2Molded Package Thickness

0.250.180.10.010.007.004A1Standoff §

6.206.025.79.244.237.228EOverall Width

3.993.913.71.157.154.146E1Molded Package Width

5.004.904.80.197.193.189DOverall Length

0.510.380.25.020.015.010hChamfer Distance

0.760.620.48.030.025.019LFoot Length

0.250.230.20.010.009.008

0.510.420.33.020.017.013BLead Width
1512015120
1512015120

DS21419C-page 16  2004 Microchip Technology Inc.

TC4420/TC4429

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X XX

Device

PackageTemperature

Range

Device: TC4420: 6A High-Speed MOSFET Driver, Non-Inverting

Temperature Range: C = 0°C to +70°C (PDIP, SOIC, and TO-220 Only)

Package: AT = TO-220, 5-lead (C-Temp Only)

PB Free G = Lead-Free device*

TC4429: 6A High-Speed MOSFET Driver, Inverting

I = -25°C to +85°C (CERDIP Only)
E = -40°C to +85°C
V = -40°C to +125°C

JA = Ceramic Dual In-line (300 mil Body), 8-lead
MF = Dual, Flat, No-Lead (6X5 mm Body), 8-lead

MF713 = Dual, Flat, No-Lead (6X5 mm Body), 8-lead
PA = Plastic DIP (300 mil Body), 8-lead

OA = Plastic SOIC, (150 mil Body), 8-lead
OA713 = Plastic SOIC, (150 mil Body), 8-lead

* Available on selected packages. Contact your local sales

(I-Temp Only)

(Tape and Reel)

(Tape and Reel)

= Blank

representative for availability

XXX

Tape and

Reel

X

PB Free

Examples:

a) TC4420CAT: 6A High-Speed MOSFET

b) TC4420EOA:

c) TC4420VMF:

a) TC4429CAT:

Driver, Inverting,

b) TC4429EPA:

c) TC4429VMF:

Driver, Inverting,

Driver, Non-inverting,

TO-220 package,
0°C to +70°C.

6A High-Speed MOSFET
Driver, Non-inverting,

SOIC package,

-40°C to +85°C.

6A High-Speed MOSFET
Driver, Non-inverting,

DFN package,

-40°C to +125°C.

6A High-Speed MOSFET

TO-220 package,
0°C to +70°C

6A High-Speed MOSFET
Driver, Inverting,

PDIP package,

-40°C to +85°C

6A High-Speed MOSFET

DFN package,

-40°C to +125°C

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and
recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: [phone]

3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2004 Microchip Technology Inc. DS21419C-page 17

TC4420/TC4429

NOTES:

DS21419C-page 18  2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

EELOQ, microID, MPLAB, PIC, PICmicro,

PICSTART, PRO MATE, PowerSmart, rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL,
SmartSensor and The Embedded Control Solutions Company
are registered trademarks of Microchip Technology
Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC, Migratable Memory, MPASM ,
MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net,
PICLAB, PICtail, PowerCal, PowerInfo, PowerMate,
PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial,
SmartTel and Total Endurance are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.

®

8-bit MCUs, KEELOQ

®

code hopping

 2004 Microchip Technology Inc. DS21419C-page 19

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:
480-792-7627
Web Address:
www.microchip.com

Atlanta

Alpharetta, GA
Tel: [phone]
Fax: [phone]

Boston

Westford, MA
Tel: [phone]
Fax: [phone]

Chicago

Itasca, IL
Tel: [phone]
Fax: [phone]

Dallas

Addison, TX
Tel: [phone]
Fax: [phone]

Detroit

Farmington Hills, MI
Tel: [phone]
Fax: [phone]

Kokomo

Kokomo, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

San Jose

Mountain View, CA
Tel: [phone]
Fax: [phone]

Toronto

Mississauga, Ontario,
Canada
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Australia - Sydney

Tel: [phone]
Fax: [phone]

China - Beijing

Tel: [phone]
Fax: [phone]

China - Chengdu

Tel: [phone]
Fax: [phone]

China - Fuzhou

Tel: [phone]
Fax: [phone]

China - Hong Kong SAR

Tel: [phone]
Fax: [phone]

China - Shanghai

Tel: [phone]
Fax: [phone]

China - Shenzhen

Tel: [phone]
Fax: [phone]

China - Shunde

Tel: [phone]
Fax: [phone]

China - Qingdao

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi

Tel: [phone]
Fax: [phone]

Japan - Kanagawa

Tel: [phone]
Fax: [phone]

Korea - Seoul

Tel: [phone]
Fax: [phone] or
82-2-558-5934

Singapore

Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung

Tel: [phone]
Fax: [phone]

Taiwan - Taipei

Tel: [phone]
Fax: [phone]

Taiwan - Hsinchu

Tel: [phone]
Fax: [phone]

EUROPE

Austria - Weis

Tel: [phone]
Fax: [phone]

Denmark - Ballerup

Tel: [phone]
Fax: [phone]

France - Massy

Tel: [phone]
Fax: [phone]

Germany - Ismaning

Tel: [phone]
Fax: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

England - Berkshire

Tel: [phone]
Fax: [phone]

08/24/04

DS21419C-page 20  2004 Microchip Technology Inc.