MICROCHIP TC1269 Technical data

TC1269

300mA CMOS LDO with Shutdown and V

Features

• Very Low Ground Current for Longer Battery Life

• Very Low Dr opout Voltage

• 300mA Output Circuit

• High Output Voltage Accuracy

• Standard or Custom Output Voltages

• Power Saving Shutdown Mode

• Bypass Input for Ultra Quiet Operation

• Over Current and O ver Temperature Protection

• Space-Saving MSOP Package

Applications

• Battery Operated Systems

• PortableComputers

• Medical Instruments

• Instrumentation

• Cellular/GSM/PHSPhones

• Linear Post-Regulator for SMPS

• Pagers

• Digital Cameras

Device Selection Table

Output*

Part Number

TC1269-2.5VUA 2.5 8-Pin MSOP -40°C to +125°C
TC1269-2.8VUA 2.8 8-Pin MSOP -40°C to +125°C
TC1269-3.0VUA 3.0 8-Pin MSOP -40°C to +125°C
TC1269-3.3VUA 3.3 8-Pin MSOP -40°C to +125°C
TC1269-5.0VUA 5.0 8-Pin MSOP -40°C to +125°C

*Other output voltages are available. Please contact Microchip
Technology Inc. for details.

Voltage

(V)

Package

Junction

Temp. Range

Bypass

REF

General Description

The TC1269 is a fixed output, high accuracy (typically
±0.5%) CMOS upgrade for older (bipolar) low dropout
regulators. Total supply current is typically 50µAatfull
load (20 to 60 times lower than in bipolar regulators).

TC1269 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically240mV at full load),and fast responseto step
changes in load. Supply current i s reduced to 0.05µA
(typical) and V

falls to zero when the shutdown

OUT

input is low.

The TC1269 incorporates both over temperature and
over current protection. The TC1269 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA.

Typical Application

V

OUT

1

V

C1
1µF

OUT

2

NC

+

TC1269

3

NC

4

GND

V

SHDN

NC

Bypass

8

V

IN

IN

7

Shutdown Control
(from Power
Control Logic)

6

C

BYPASS

470pF
(Optional)

Package Type

8-Pin MSOP

V



2002 Microchip TechnologyInc. DS21380B-page 1

1

OUT

2

NC
NC

GND

TC1269

3

45

8

7

6

V

IN

SHDN
NC
Bypass

TC1269

1.0 ELECTRICAL
CHARACTERISTICS

*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the

Absolute Maximum Ratings*

Input Voltage .........................................................6.5V

Output Voltage.................... (V

Maximum Voltage on Any Pin ........V

–0.3)to(VIN+0.3V)

SS

+0.3V to -0.3V

IN

operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affectdevice reliability.

Power Dissipation................Internally Limited (Note 6)

Operating Temperature ...............-40°C < T

< +125°C

J

Storage Temperature..........................-65°C to +150°C

TC1269 ELECTR ICAL SPECI FICATIONS

Electrical Characteristics: VIN=V

type specifications apply for junctiontemperaturesof -40°C to +125°C.

Symbol Parameter Min Typ Max Units Test Conditions

V

IN

I

OUTMAX

V

OUT

∆V

OUT

∆V

OUT

∆V

OUT/VOUT

VIN-V

I

SS1

I

SS2

OUT

InputOperatingVoltage — — 6.0 V
MaximumOutputCurrent 300 ——mA
Output Voltage —

/∆TV

Temperature Coefficient — 40 —ppm/°CNote 2

OUT

/∆VINLine Regulation — 0.05 0.35 %(VR+1V)≤ VIN ≤ 6V

Load Regulation — 0.5 2.0 %IL=0.1mAtoI
Dropout Voltage —

Supply Current — 50 90 µA SHDN =V

ShutdownSupply Current — 0.05 0.5 µA SHDN =0V
PSRR Power Supply Rejection Ratio — 50 — dB F
I

OUTSC

∆V

OUT

Output Short Circuit Current — 550 650 mA V

/∆PDThermalRegulation — 0.04 — V/W Note 5

eN Output Noise — 260 — nV/√Hz

Input

SHDN

V

IH

V

IL

Note 1: VRis the regulator output voltage setting.

2:

3: Regulation is measuredat a constant junctiontemperature using low dutycyclepulse testing. Load regulatio nis tested over a load rangefrom

4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a 1V differen-
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the

SHDN Input High Threshold 45 ——%V

SHDN Input Low Threshold — — 15 %V

TCV

=(V

OUT

OUTMAX–VOUTMIN

V

x ∆T

OUT

0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specifica­tion.

tial.
line regulation effects. Specifications are for a current pulse equal to I
thermal resistance from junction-to-air (i.e., T

thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.

+1V,IL=0.1µA, CL=3.3µF,SHDN >VIH,TA= 25°C, unless otherwise noted. Boldface

OUT

)x10

±0.5%

V

V

R

–2.5%

R

—

20
—
—

6

, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate

A,TJ

80

240

V

R

—

+2.5%

30

V Note 1

mV I

160
480

at VIN= 6V for T = 10 msec.

LMAX

=0.1mA

L

I

=100mA

L

I

=300mA(Note 4)

L

RE
OUT

F=1kHz,C

IN
IN

≤ 120Hz

=0V

IH

OUT

OUTMAX

=1µF, R

LOAD

=50Ω

DS21380B-page 2



2002 Microchip TechnologyInc.

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

TC1269

Pin No.

(8-Pin SOIC)

1V
2 NC No connect.
3 NC No connect.
4 GND Ground terminal.
5 Bypass Reference bypass input. Connectinga 470pF to this input furtherreduces output noise.
6 NC No connect.
7 SHDN

8V

Symbol Description

OUT

IN

Regulated voltage output.

Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator is fully enabledwhena logic high is appliedto this input.Theregulator entersshut­down when a logic low is applied to this input. During shutdown, output voltage falls to zero and
supply current is reduced to 0.05µA(typical).

Unregulatedsupply input.



2002 Microchip TechnologyInc. DS21380B-page 3

TC1269

3.0 DETAILED DESCRIPTION

The TC1269 is a precision regulator available in fixed
voltages. Unlike the bipolar regulators, the TC1269
supply current does not increase with load current. In
addition, V
over the entire 0mA to I
range, (an i mportant consideration in RTC and CMOS
RAM battery backup applications).

Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN

) is at or above VIH, and shutdown (disabled)
when SHDN
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN
should be connected directly to the input supply.While
in shutdown, supply current decreases to 0.05µA
(typical), V

FIGURE 3-1: TYPICAL APPLICATION

V

OUT

+

remains stable and w ithin regulation

OUT

OUTMAX

operating load current

is at or below VIL. SHDN may be

input is not required, it

fallsto zero.

OUT

CIRCUIT

C1
1µF

1

V

OUT

2

NC

TC1269

3

NC

4

GND

V

SHDN

NC

Bypass

8

IN

7

6

+

C1
1µF

Shutdown Control
(from Power
Control Logic)

C

BYPASS

470pF
(Optional)

Battery

+

–

3.1 Bypass Input

A 470pF capacitor connected from the Bypass input to
ground reduces noise present on t he internal
reference, which i n turn significantly reduces output
noise.Ifoutputnoiseisnota concern,thisinputmaybe
left unconnected. Larger capacitor values may be
used, but resultsin a longer time period to rated output
voltagewhen power is initially applied.

3.2 Output Capacitor

A1µF(min)capacitorfromV
recommended. The output capacitor should have an
effective series resistance greater than 0.1Ω and less
than 5.0Ω, and a resonant frequency above 1MHz. A
1µF capacitor should be connected from V
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors f reeze at approxi­mately - 30°C, solid tantalums are recommended for
applications operating below -25°C.) When operating
from sources other than batteries, supply-noise
rejection and transient response can be improved by
increasing the value of the input and output capacitors
and employing passive filtering techniques.

to ground is

OUT

to GND if

IN

DS21380B-page 4



2002 Microchip TechnologyInc.

TC1269

4.0 THERMAL CONSIDERATIONS

4.1 Thermal Shutdown

Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until t he die temperature
drops to approximately 140°C.

4.2 Power Dissipation

The amount of power the regulator dissipates i s
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:

EQUATION 4-1:

PD≈ (V

INMAX–VOUTMIN)ILOADMAX

Where:

P

= Worst case actual power dissipation

D

= Maximum voltage on

V

MAX

IN

V

I

LOADMAX

= Minimum regulator output voltage

OUTMIN

= Maximum output (load) current

The maximum al lowable power dissipation
(Equation 4-2) is a function of the maximum ambient
temperature (T
temperature (T
junction-to-air (θ

), the maximum allowable die

AMAX

) and the t hermal resistance f rom

JMAX

).

JA

EQUATION 4-2:

P

=(T

D

MAX

Where all terms are previously defined.

J

MAX

V

IN

–

T

)

A

MAX

θ

JA

Equation 4-1 can be used in conjunction with
Equation 4-2 to ensure regulator thermal operation is
within limits. For example:

Given:

V

INMAX

V

OUTMIN

I

LOAD

T

AMAX

= 3.0V ± 10%
=2.7V–2.5%
= 250mA
=55°C

Find: 1. Actual power dissipation

2. Maximum allowable dissipation
Actual power dissipation:
P

≈ (V

D

INMAX–VOUTMIN)ILOADMAX

= [ (3.0 x 1.1) – (2.7 x .975)]250 x 10

-3

= 167mW

Maximum allowable power dissipation:

P

DMAX

=(T

JMAX–TAMAX

θ

)

JA

= (125 – 55)

200

= 350mW

In this example, the TC1269 dissipates a maximum of
167mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits.

4.3 Layout Considerations

The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θ
increase the maximum allowable power dissipation
limit.

and, therefore,

JA



2002 Microchip TechnologyInc. DS21380B-page 5

TC1269

5

C

8

C

0

C

5

C

0

C

0

C

5.0 TYPICAL CHARACTERISTICS

Note: The graphs and tables provided following this note are a statisticalsummary based on a limited number of

samplesandareprovidedforinformational purposesonly.Theperformancecharacteristicslistedhereinare
not tested or guaranteed. In some graphs or tables,the data presented may be outside the specified
operating range ( e.g., outside specified power supply range) and therefore outside the warranted range.

0.012

0.010

0.008

0.006

0.004

0.002

0.000

LINE REGULATION (%)

-0.002

-0.004

-40° -20°

0° 20° 40° 60° 80° 100° 120°

TEMPERATURE (

Supply Current

100.0

90.0

80.0

70.0

60.0

SUPPLY CURRENT (µA)

50.0

40.0

-40° -20°

0° 20° 40° 60° 80° 100° 120°

TEMPERATURE (°C)

Line Regulation

Output Noise

10.0

1.0

0.1

NOISE (µV/√HZ)

0.0

0.01

0.01 1

°

C)

FREQUENCY (kHz)

R
C

10

LOAD

= 1µF

OUT

100 1000

= 50Ω

2.00

1.80

1.60

1.40

1.20

1.00

0.80

0.60

LOAD REGULATION (%)

0.40

0.20

0.00

-40° -20° 0° 20° 40° 60° 80° 100° 120°

Dropout Voltage vs. Load Current

(V)

OUT

V

3.075

3.025

2.975

2.925

-40° -20°

0.40

0.35

0.30

0.25

0.20

0.15

0.10

DROPOUT VOLTAGE (V)

0.05

0.00
0

2

50

100

LOAD CURRENT (mA)

12

7

150

-4

200 250 300

Load Regulation

1 to 300mA

1 to 100mA

TEMPERATURE (

V

vs. Temperature

OUT

VIN = 4V
I

= 100µA

LOAD

= 3.3µF

C

LOAD

0° 20° 40° 60° 80° 100° 120°

TEMPERATURE (°C)

1 to 50mA

°

C)

DS21380B-page 6



2002 Microchip TechnologyInc.

6.0 PACKAGING INFORMATION

6.1 Package Marking Information

Package marking data not available at this time.

6.2 Taping Form

Component Taping Orientation for 8-Pin MSOP Devices

PIN 1

TC1269

User Direction of Feed

W

Carrier Tape, Number of Components Per Reel and Reel Size

Package Carrier Width (W) Pitch (P) Part Per Full Reel Reel Size

8-Pin MSOP 12 mm 8 mm 2500 13 in

6.3 Package Dimensions

8-Pin MSOP

.026 (0.65) TYP.

.122 (3.10)
.114 (2.90)

PIN 1

.122 (3.10)
.114 (2.90)

P

Standard Reel Component Orientation
for TR Suffix Device

.197 (5.00)
.189 (4.80)

.043 (1.10)

MAX.

.016 (0.40)
.010 (0.25)



2002 Microchip TechnologyInc. DS21380B-page 7

.006 (0.15)
.002 (0.05)

6° MAX.

.028 (0.70)
.016 (0.40)

Dimensions: inches (mm)

.008 (0.20)
.005 (0.13)

TC1269

NOTES:

DS21380B-page 8



2002 Microchip TechnologyInc.

TC1269

SALES AND SUPPORT

Data Sheets

Products supportedby a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mendedworkarounds.To determine if an erratasheet exists for a particulardevice, please contactoneof the following:

1. Your local Microchip sales office

2. The MicrochipCorporate Literature Center U.S. FAX: [phone]

3. The Microchip Worldwide Site (www.microchip.com)
Pleasespecify which device, revision of silicon and Data Sheet (includeLiterature #) you are using.

New Customer Notification System

Register on our web site (www.microchip.com/cn) to receive the most current information on our products.

 2002 Microchip Technology Inc. DS21380B-page 9

TC1269

NOTES:

DS21380B-page 10  2002 Microchip Technology Inc.

TC1269

Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com­ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con­veyed, implicitly or otherwise, under any intellectual property
rights.

Trademarks

The Microchip name and logo, the Microchip logo, FilterLab,
K

EELOQ,microID,MPLAB,PIC,PICmicro,PICMASTER,

PICSTART, PRO MATE, SEEV A L and The Embedded Control
SolutionsCompany areregiste red trademarksof MicrochipTech­nologyIncorp or ated in the U.S.A. and other countries .

dsPIC, ECONOMONITOR, FanS ense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, microPort,
Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM,
MXDEV,MXLAB, PICC, PICDEM, PICDEM.net, rfPIC, Select
Mode and Total Endurance are trademarks of Microchip
TechnologyIncorporated in the U.S.A.

Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip TechnologyIncorporated in t he U.S.A.

All other trademarks mentioned h erein are property of their
respective companies.

© 2002, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received QS-9000 quality system
certification for its worldwide headquarters,
design and wafer fabrication facilities in
Chandler and Tempe, Arizona in July 1999
and Mountain View, California in March 2002.
The Company’s quality system processes and
procedures are QS-9000 compliant for its

®

PICmicro
devices, Serial EEPROMs, microperipherals,
non-volatile memory and analog products. In
addition, Microchip’s quality system for the
design and manufacture of development
systemsisISO 9001certified.



2002 Microchip TechnologyInc. DS21380B-page 11

8-bit MCUs, KEELOQ®code hopping

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05/01/02

DS21380B-page 12

*DS21380*



2002 Microchip Technology Inc.