50mA and 100mA CMOS LDOs with Shutdown, ERROR Output and V
Features:
• 50 µA Ground Current for Longer Battery Life
• Very Low Dropout Voltage
• Choice of 50 mA (TC1072) and 100 mA (TC1073)
Output
• High Output Voltage Accuracy
• Standard or Custom Output Voltages
• Power-Saving Shutdown Mode
• ERROR
Output Can Be Used as a Low Battery
Detector or Processor Reset Generator
• Bypass Input for Ultra Quiet Operation
• Overcurrent and Overtemperature Protection
• Space-Saving 6-Pin SOT-23 Package
• Pin Compatible Upgrades for Bipolar Regulators
• Standard Output Voltage Options:
- 1.8V, 2.5V, 2.6V, 2.7V, 2.8V, 2.85V, 3.0V,
3.3V, 3.6V, 4.0V, 5.0V
• Other output voltages are available. Please
contact Microchip Technology Inc. for details.
Applications:
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
General Description
The TC1072 and TC1073 are high accuracy (typically
±0.5%) CMOS upgrades for older (bipolar) low dropout
regulators. Designed specifically for battery-operated
systems, the devices’ CMOS construction eliminates
wasted ground current, significantly extending battery
life. Total supply current is typically 50 µA at full load
(20 to 60 times lower than in bipolar regulators).
The devices’ key features include ultra low noise
operation (plus optional Bypass input); very low
dropout voltage (typically 85 mV, TC1072 and 180 mV,
TC1073 at full load) and fast response to step changes
in load. An error output (ERROR
) is asserted when the
devices are out-of-regulation (due to a low input
voltage or excessive output current). ERROR
used as a low battery warning or as a processor
signal (with the addition of an external RC
RESET
network). Supply current is reduced to 0.5 µA (max)
and both V
and ERROR
OUT
are disabled when the
shutdown input is low. The devices incorporate both
overtemperature and overcurrent protection.
The TC1072 and TC1073 are stable with an output
capacitor of only 1 µF and have a maximum output
current of 50 mA, and 100 mA, respectively. For higher
output current versions, please see the TC1185,
TC1186, TC1187 (I
TC1108 and TC1173 (I
† Note: Stresses above those listed under "Absolute
Maximum Ratings" may cause permanent damage to
the device. These are stress ratings only and functional
operation of the device at these or any other conditions
Absolute Maximum Ratings†
Input Voltage .........................................................6.5V
Output Voltage...........................(-0.3V) to (V
+ 0.3V)
IN
above those indicated in the operation sections of the
specifications is not implied. Exposure to Absolute
Maximum Rating conditions for extended periods may
affect device reliability.
Power Dissipation................Internally Limited (Note 6)
Maximum Voltage on Any Pin ........ VIN +0.3V to -0.3V
Operating Temperature Range...... -40°C < T
< 125°C
J
Storage Temperature..........................-65°C to +150°C
TC1072/TC1073 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: Unless otherwise noted, VIN=V
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
Note 1: VR is the regulator output voltage setting. For example: VR= 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
2:
+ 1V, IL= 0.1 mA, CL=3.3μF, SHDN
OUT
100
—
—
—
—
VR ±0.5% VR + 2.5%VNote 1
2.5%
—
40
2
20
—
—
—
65
85
180
—
—
—
—
120
250
>VIH, TA=+25°C.
mAmATC1072
TC1073
ppm/°C Note 2
(Note 3)
mVI
=0.1mA
L
I
=20mA
L
IL=50mA
IL= 100 mA (Note 4),
TC1073
RE
OUT
IL=I
470 pF from Bypass to GND
=VIH, IL= 0(Note 8)
=0V
≤ 1kHz
=0V
OUTMAX
OUTMAX
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T
thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.
7: Hysteresis voltage is referenced by V
8: Apply for Junction Temperatures of -40°C to +85°C.
9:The minimum VIN has to justify the conditions = VIN≥ VR+V
, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
Electrical Characteristics: Unless otherwise noted, VIN=V
Boldface type specifications apply for junction temperatures of -40°C to +125°C.
+ 1V, IL= 0.1 mA, CL=3.3μF, SHDN
OUT
>VIH, TA= +25°C.
SymbolParameterMinTypMaxUnitsTest Conditions
SHDN Input
V
IH
V
IL
ERROR
V
INMIN
V
OL
V
TH
V
HYS
t
DELAY
Note 1: VR is the regulator output voltage setting. For example: VR= 2.5V, 2.7V, 2.85V, 3.0V, 3.3V, 3.6V, 4.0V, 5.0V.
SHDN
Input High Threshold45——%VINVIN= 2.5V to 6.5V
Input Low Threshold——15%VINVIN= 2.5V to 6.5V
SHDN
Open Drain Output
Minimum VIN Operating Voltage1.0——V
Output Logic Low Voltage——400mV1 mA Flows to ERROR
ERROR Threshold Voltage—0.95 x V
—VSee Figure 4-2
R
ERROR Positive Hysteresis—50—mVNote 7
V
to ERROR
OUT
2:
3: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
4: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value.
5: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to I
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., T
thermal shutdown. Please see Section 5.0 “Thermal Considerations” for more details.
7: Hysteresis voltage is referenced by V
8: Apply for Junction Temperatures of -40°C to +85°C.
9:The minimum VIN has to justify the conditions = VIN≥ VR+V
Delay—2.5—msVout falling from VR to
VR-10%
at VIN=6V for T=10 ms.
LMAX
, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
Note:The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise specified, all parts are measured at temperature = +25°C.
Note: Unless otherwise specified, all parts are measured at temperature = +25°C.
Line Regulation of 5.0V LDO
Conditions: VIN = 6V, + 1V Squarewave @ 2.5kHz
V
IN
V
OUT
CIN = 0µF, C
I
LOAD
= 1µF, C
OUT
= 100mA, VIN & V
= 470pF,
BYP
are AC coupled
OUT
Thermal Shutdown Response of 5.0V LDO
Conditions: VIN = 6V, CIN = 0µF, C
V
OUT
I
was increased until temperature of die reached about 160°C, at
LOAD
which time integrated thermal protection circuitry shuts the regulator
off when die temperature exceeds approximately 160°C. The regulator
remains off until die temperature drops to approximately 150°C.
Connect unregulated input supply to the VIN pin. If
there is a large distance between the input supply and
the LDO regulator, some input capacitance is
necessary for proper operation. A 1 µF capacitor
connected from V
most applications.
to ground is recommended for
IN
3.2Ground (GND)
Connect the unregulated input supply ground return to
GND. Also connect the negative side of the 1 µF typical
input decoupling capacitor close to GND and the
negative side of the output capacitor C
OUT
to GND.
3.4Out-Of-Regulation Flag (ERROR
ERROR goes low when V
approximately – 5%.
is out-of-tolerance by
OUT
)
3.5Reference Bypass Input (Bypass)
Connecting a 470 pF to this input further reduces
output noise.
3.6Regulated Voltage Output (V
Connect the output load to V
connect the positive side of the LDO output capacitor
as close as possible to the V
of the LDO. Also
OUT
pin.
OUT
OUT
)
3.3Shutdown Control Input (SHDN
The regulator is fully enabled when a logic-high is
applied to SHDN
a logic-low is applied to SHDN
output voltage falls to zero, ERROR
and supply current is reduced to 0.5 µA (maximum).
The TC1072 and TC1073 are precision fixed output
voltage regulators. (If an adjustable version is desired,
please see the TC1070/TC1071/TC1187 data sheet.)
Unlike bipolar regulators, the TC1072 and TC1073’s
supply current does not increase with load current. In
addition, V
over the entire 0 mA to I
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 4-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
) is at or above VIH, and shutdown (disabled)
(SHDN
when SHDN
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05 µA
(typical), V
circuited.
Shutdown Control
(to CMOS Logic or Tie
to VIN if unused)
remains stable and within regulation
OUT
OUTMAX
load current range, (an
is at or below VIL. SHDN may be
input is not required, it
+
1 µF
C1
C3, 470 pF
R1
1M
0.2 µF
C2
is open-
V
OUT
BATTLOW
or RESET
falls to zero volts, and ERROR
OUT
+
Battery
V
IN
+
1 µF
GND
SHDN
C2 Required Only
if ERROR is used as a
Processor RESET Signal
TC1072
TC1073
(See Text)
V
OUT
Bypass
ERROR
V+
FIGURE 4-2:Error
Output Operation.
4.2Output Capacitor
A 1 µF (minimum) capacitor from V
recommended. The output capacitor should have an
effective series resistance greater than 0.1Ω and less
than 5.0Ω, and a resonant frequency above 1 MHz. A
1 µF capacitor should be connected from V
there is more than 10 inches of wire between the
regulator and the AC filter capacitor, or if a battery is
used as the power source. Aluminum electrolytic or
tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at
approximately -30°C, solid tantalums are
recommended for applications operating below -25°C.)
When operating from sources other than batteries,
supply-noise rejection and transient response can be
improved by increasing the value of the input and
output capacitors and employing passive filtering
techniques.
to ground is
OUT
IN
to GND if
4.3Bypass Input
FIGURE 4-1:Typical Application Circuit.
A 470 pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
4.1ERROR
Open-Drain Output
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
ERROR
regulation by more than –5% (typical). This condition
may be caused by low input voltage, output current
limiting, or thermal limiting. The ERROR
value (e.g. ERROR
is driven low whenever V
=VOL at 4.75V (typical) for a 5.0V
falls out of
OUT
output voltage
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
regulator and 2.85V (typical) for a 3.0V regulator).
ERROR
output operation is shown in Figure 4-2.
Note that ERROR is active tDELAY (typically, 2.5 µs)
after V
above VTH by V
As shown in
battery low flag, or as a processor RESET
falls to VTH, and inactive when V
OUT
HYS
.
Figure 4-1, ERROR can be used as a
rises
OUT
signal (with
the addition of timing capacitor C2). R1 x C2 should be
chosen to maintain ERROR
RESET
input for at least 200 ms to allow time for the
below VIH of the processor
system to stabilize. Pull-up resistor R1 can be tied to
V
, VIN or any other voltage less than (VIN + 0.3V).
= Minimum regulator output voltage
= Maximum output (load) current
= Maximum voltage on V
IN
P
DMAX
= (T
JMAX
– T
AMAX
)
θ
JA
where all terms are previously defined.
P
DMAX
= (T
JMAX
– T
AMAX
)
θ
JA
= (125 – 55)
220
= 318 mW
5.0THERMAL CONSIDERATIONS
5.1Thermal Shutdown
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 160°C.
The regulator remains off until the die temperature
drops to approximately 150°C.
5.2Power Dissipation
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst-case actual power dissipation:
EQUATION 5-1:
The maximum allowable power dissipation
Equation 5-2) is a function of the maximum ambient
(
temperature (T
perature (T
JMAX
tion-to-air (θ
of approximately 220°C/Watt.
), the maximum allowable die tem-
AMAX
) and the thermal resistance from junc-
). The 6-Pin SOT-23 package has a θ
JA
JA
Equation 5-1 can be used in conjunction with
Equation 5-2 to ensure regulator thermal operation is
within limits. For example:
Given:
= 3.0V ±5%
V
INMAX
V
OUTMIN
I
LOADMAX
T
JMAX
T
AMAX
= 2.7V – 2.5%
= 40 mA
= 125°C
= 55°C
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Actual power dissipation:
P
≈
(V
D
= [(3.0 x 1.05) – (2.7 x 0.975)] x 40 x 10
INMAX
– V
OUTMIN)ILOADMAX
–3
= 20.7 mW
Maximum allowable power dissipation:
In this example, the TC1072 dissipates a maximum of
20.7 mW; below the allowable limit of 318 mW. In a
similar manner,
Equation 5-1 and Equation 5-2 can be
used to calculate maximum current and/or input
voltage limits.
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θ
increase the maximum allowable power dissipation
limit.
and therefore
JA
TC1072/TC1073
1
& = part number code + threshold voltage
2
(two-digit code)
3
represents year and quarter code
4
represents production lot ID code
W, Width of
Carrier Tape
User Direction of Feed
P,Pitch
Standard Reel Component
Orientation
Reverse Reel Component
Orientation
PIN 1
Device
Marking
PIN 1
Carrier Tape, Number of Components per Reel and Reel Size
PackageCarrier Width (W)Pitch (P)Part Per Full ReelReel Size
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