Microchip SAM R34 User Manual

SAM R34 Xplained Pro
Evaluation Kit (DM320111)
SAM R34 Xplained Pro User Guide

Introduction

Microchip's SAM R34 Xplained Pro Evaluation Kit is a hardware platform used to evaluate the ATSAMR34 Low Power LoRa® Sub-GHz SiP.
The Xplained Pro MCU series evaluation kits include an on-board Embedded Debugger, and no external tools are necessary to program or debug the SAM R34 devices.
The Xplained Pro extension kits offer additional peripherals to extend the features of the board and ease the development of custom designs.
Figure 1. SAM R34 Xplained Pro Evaluation Board (DM320111)

Features

• SAM R34 SiP with Cortex® M0+ CPU and LoRa Transceiver
• Supports 868 MHz and 915 MHz Operation
• On-Board EDBG Debugger and Support for Atmel Studio 7 ICE
• Two Extension Headers for Signal Breakout and Expansion Boards
• On-Board Power Management System with Current Monitoring and USB Power Conditioning
• XPRO Current Measurement System Data Visualizer Support
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• USB Power Inlet with ESD Protection and Buck Converter
• On-Board TCXO
• Up to +20 dBm Maximum Output Power
• +13 dBm High-Efficiency Operation
• +17 dBm High-Power Operation
• SMA RF Antenna Port with External Whip Antenna Included
• Manual Reset Button
• GPIO Button
• Indicator LEDs for Status and Power
• Auxiliary 10-Pin Cortex Programming Header
• Direct USB Connection to SAM R34 with ESD Protection
• Qtouch® Button
• CR1220 Backup Battery Holder
• Supported by Studio 7 Integrated Development Platform
• Software Examples Supported in Advanced Software Framework (ASF)
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Table of Contents

Introduction......................................................................................................................1
Features.......................................................................................................................... 1
1. Kit Overview.............................................................................................................. 5
2. Xplained Pro Getting Started.....................................................................................6
2.1. Xplained Pro Quick Start.............................................................................................................. 6
2.2. Design Documentation and Relevant Links................................................................................. 6
2.3. Chip-Down Design Package ....................................................................................................... 7
3. Xplained Pro..............................................................................................................8
3.1. Xplained Pro.................................................................................................................................8
3.2. Embedded Debugger................................................................................................................... 8
3.3. Xplained Pro Analog Module........................................................................................................9
3.4. Hardware Identification System..................................................................................................11
3.5. Power Sources........................................................................................................................... 11
3.6. Xplained Pro Headers and Connectors......................................................................................12
4. Hardware User Guide..............................................................................................15
4.1. Schematics and BOM.................................................................................................................15
4.2. Power Distribution...................................................................................................................... 15
4.3. Connectors................................................................................................................................. 16
4.4. Peripherals................................................................................................................................. 19
4.5. Embedded Debugger Implementation........................................................................................20
4.6. Kit Modifications......................................................................................................................... 24
4.7. Limitations.................................................................................................................................. 25
5. Agency Certification.................................................................................................27
5.1. Antenna Considerations............................................................................................................. 27
5.2. A09-3167 Usage Instructions under Limited Modular Approval (FCC)...................................... 27
5.3. United States..............................................................................................................................27
5.4. Canada.......................................................................................................................................28
5.5. Europe........................................................................................................................................30
6. Hardware Revision History......................................................................................31
6.1. Identifying Product ID and Revision........................................................................................... 31
6.2. Hardware Revision..................................................................................................................... 31
7. Document Revision History..................................................................................... 33
The Microchip Web Site................................................................................................ 34
Customer Change Notification Service..........................................................................34
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Customer Support......................................................................................................... 34
Microchip Devices Code Protection Feature................................................................. 34
Legal Notice...................................................................................................................35
Trademarks................................................................................................................... 35
Quality Management System Certified by DNV.............................................................36
Worldwide Sales and Service........................................................................................37
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1. Kit Overview

Reset
SW0 User Button
Debug USB
Current Measurement
Header
Target USB
Power and
Status LED
Power Header
J101
Extension 1
Header
Cortex® Programming
Header
Extension 3 Header
Qtouch® Button
Battery
Power Source
J102
SMA
ATSAMR34J18B
The SAM R34 Xplained Pro Evaluation Kit is a hardware platform used to evaluate the ATSAMR34 Low Power LoRa® Sub-GHz SiP module.
The kit offers a set of features that enable the user to get started with the ATSAMR34 Low Power LoRa Sub-GHz SiP peripherals right away, and to understand how to integrate the device in their own design.
The SAM R34 Xplained Pro Evaluation Kit contains the following items:
• One SAM R34 Xplained Pro Evaluation Board
• One external antenna
SAM R34 Xplained Pro Evaluation Kit...
Kit Overview
®
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2. Xplained Pro Getting Started

2.1 Xplained Pro Quick Start

The steps to start exploring the Xplained Pro platform are listed below. See also: SAM R34 Xplained Pro
Evaluation Kit (DM320111) Quick Start Guide.
1. Download and install Atmel Studio.
2. Launch Atmel Studio.
When the Xplained Pro kit is connected to the computer for the first time, the operating system installs the driver software automatically. This driver supports 32-bit and 64-bit versions of Microsoft® Windows® XP, Windows Vista®, Windows 7, Windows 8, Windows 10, and Windows Server 2012.
When the Xplained Pro board is powered:
• The green power LED D400 is lit
• Atmel Studio automatically detects the connected Xplained Pro and extension board(s)
• In Atmel Studio, the landing page of the kit presents an option to launch the associated ASF. For more details, see the SAM R34 MLS Getting Started Guide (DS50002812).
• The SAM R34 device is programmed and debugged by the on-board Embedded Debugger
• No external programmer or debugger tool is required
Xplained Pro Getting Started

2.2 Design Documentation and Relevant Links

The following list contains links to the most relevant documents and software for the SAM R34 Xplained Pro Evaluation Kit.
• Ordering Code – The SAM R34 Xplained Pro Evaluation Kit can be ordered from
www.microchipdirect.com using Ordering Code “DM320111”.
Atmel Studio – Atmel Studio presents Free Atmel IDE for development of C/C++ and assembler code for microcontrollers and relevant documentation.
Microchip sample store – Microchip sample store where samples of devices can be ordered.
EDBG User Guide – User guide containing more information about the on-board Embedded Debugger.
Data Visualizer – Data Visualizer is a program used for processing and visualizing data. Data Visualizer can receive data from various sources such as the Embedded Debugger Data Gateway Interface found on Xplained Pro boards and COM ports.
AN2842 SAM R34/R35 RF Hardware Design Guidelines Application Note – This application note provides the RF design guidelines and circuit optimization techniques to design using the SAM R34. This document is available in the SAM R34 Chip-Down Design Package.
SAM R34/R35 Low Power LoRa® Sub-GHz SiP Data Sheet (DS70005356)
SAM R34 MLS Getting Started User Guide (DS50002812)
SAM R34 Xplained Pro Evaluation Kit (DM320111) Quick Start Guide (DS30010200)
SAM L21 Family Data Sheet (DS60001477A)
Semtech SX1276/77/78/79 Data Sheet rev 5
SAM R34 Chip-down Design Package – Includes SAMR34-XPRO Design Database and MCHPRT Test Application.
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2.3 Chip-Down Design Package

The Chip-Down Design Package is a guide for customers wanting to do their own chip-level RF PCB designs. In addition, it contains software tools for manufacturing and regulatory testing. The package includes the following:
• AN2842 RF Hardware Design Guidelines
• Complete CAD source for SAMR34-XPRO
• MCHPRT PC Application for Production and Regulatory Testing
• Example Python® scripts
• SAMR34 Radio Utility Firmware
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Xplained Pro Getting Started
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3. Xplained Pro

3.1 Xplained Pro
Xplained Pro is an evaluation platform which contains a series of microcontroller boards (evaluation kits) and extension boards. Atmel Studio is used to program and debug the microcontrollers on these boards. Atmel Studio includes Advanced Software Framework (ASF) and Atmel START, which has drivers and demo code, and Data Visualizer, which supports data streaming and advanced debugging. Xplained Pro evaluation kits can be connected to a wide range of Xplained Pro extension boards through standardized headers and connectors. Xplained Pro extension boards have identification (ID) chips to uniquely identify which boards are connected to the Xplained Pro evaluation kits.

3.2 Embedded Debugger

The SAM R34 Xplained Pro contains an Embedded Debugger (EDBG) for on-board debugging. The EDBG is a USB composite device with the following interfaces:
• Debugger
• Virtual COM Port
• Data Gateway Interface (DGI)
SAM R34 Xplained Pro Evaluation Kit...

Xplained Pro

The EDBG can program and debug the SAM R34 with the help of Atmel Studio. The Serial Wire Debug (SWD) interface is connected between the EDBG and the SAM R34 on the SAM R34 Xplained Pro.
The Virtual COM Port is connected to a UART on the SAM R34 and provides an easy way to communicate with the target application through terminal software. It offers variable baud rate, parity, and stop bit settings. The settings on the SAM R34 must match the settings given in the terminal software.
Info:  The Virtual COM Port in the EDBG requires the terminal software to set the Data Terminal Ready (DTR) signal to enable the UART pins connected to the SAM R34. If the DTR signal is not enabled, the UART pins on the EDBG are kept in tri-state (high-Z) to render the COM Port not usable. The DTR signal is automatically set by terminal software, but it may have to be manually enabled in your terminal.
The DGI consists of several physical interfaces for bidirectional communication with the host computer. Communication over the interfaces is bidirectional. It can be used to send event values and data from the SAM R34. Traffic over the interfaces can be timestamped by the EDBG for more accurate tracking of events, but timestamping reduces the maximal data throughput. The Data Visualizer is used to send and receive data through DGI.
The EDBG controls two LEDs on the SAM R34 Xplained Pro; a power LED and a status LED. The following table provides details on how the LEDs are controlled in different operation modes.
Table 3-1. EDBG LED Control
Mode Power LED Status LED
Normal mode The power LED is ON when
power is applied to the board.
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Activity indicator, the LED flashes when any communication happens to the EDBG.
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Mode Power LED Status LED
Bootloader mode (idle) The power LED and the status LED blink simultaneously.
Xplained Pro
Bootloader mode (firmware upgrade)
For additional information on the EDBG, see the EDBG User Guide.

3.3 Xplained Pro Analog Module

3.3.1 Overview

The Xplained Pro Analog Module (XAM) extends the embedded debugger with high dynamic range current measurement. This enables power profiling of the target system.
Figure 3-1. XAM Block Diagram
Calibration
circuitry
Current output
Range selection
Calibration ON/OFF
100 mOhm
Pre-amplifier
20x
100 Ohm
20x
2x
16x
Active filter with
gain
The power LED and the status LED blink in an alternating pattern.
Sync GPIO
I2C
SPI
Clock sync
SWD
EDBG
voltage
reference
2.7V
GPIO(s)
GPIO
AREF
ADC0
ADC1
Control MCU
S&H
ADC
GND
GPIO
Current input
Xplained Pro Analog Module (XAM)
The XAM consists of:
• Calibration circuitry
• Voltage reference circuitry
• Analog front-end:
– Shunt resistors with a range selection switch
– Pre-amplifier
– Two active filters with gain
• Control MCU
– Analog-to-Digital Converter
– Signal processing
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– Control/communication interface to the EDBG
The current measurement front-end is a high side shunt measurement with a pre-amplifier and a second active filter stage with gain as shown in Figure 3-1. The wide dynamic range is achieved by four measurement ranges, which are defined by two shunt resistors and the two parallel second stage active filters with gain.

3.3.2 EDBG Interface

The XAM is connected to the EDBG with the following interfaces:
I2C: This is used to control and configure the XAM.
SPI: Current measurement data is streamed to the EDBG via this interface. This is a unidirectional channel from the XAM to the EDBG.
SWD: The MCU in the XAM is programmed via SWD from the EDBG.
Clock sync: Signal used to synchronize ADC measurements with the EDBG.
Reference clock: Reference clock for the XAM.

3.3.3 Sample Rate

The raw sampling rate of the XAM is up to 250 kHz and with the default averaging configuration (average of 16 samples), the actual output of the XAM is 16.67 ksps.
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Info:  The XAM output sample rate is not an integer fraction of the raw sampling.

3.3.4 Measurement Ranges and Accuracy

The XAM has four measurement ranges. These are defined by two shunt resistors and two gain stages.
Table 3-2. XAM Measurement Ranges and Accuracy
Measurement Range
Range 1 Low current shunt and
Range 2 Low current shunt and
Range 3 High current shunt and
Range 4 High current shunt and
Hardware Resolution Accuracy Comments
high gain stage
low gain stage
high gain stage
low gain stage
20 nA 1 LSB ±1% Accuracy will decrease below
1 μA. Typical accuracy for 300 nA is 1 LSB ±10%.
150 nA 1 LSB ±1%
10 μA 1 LSB ±1%
100 μA 1 LSB ±1% Accuracy will decrease above
100 mA. Typical accuracy is 1 LSB ±5% at 400 mA. Maximum current is 400 mA.
The ranges are automatically switched by the XAM to achieve the best measurement results, and the currently active range is visualized in the Data Visualizer front-end tool. The maximum voltage drop over the shunt resistor is 100 mV, and the XAM switches the range automatically before reaching this limit.
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3.4 Hardware Identification System

All Xplained Pro extension boards come with an identification chip (ATSHA204A CryptoAuthentication chip) to uniquely identify the boards that are connected to the Xplained Pro Evaluation Kit. This chip contains information that identifies the extension with its name and some extra data. When an Xplained Pro extension is connected to an Xplained Pro Evaluation Kit, the information is read and sent to the Atmel Studio. The following table shows the data fields stored in the ID chip with example content.
Table 3-3. Xplained Pro ID Chip Content
Data Field Data Type Example Content
Manufacturer ASCII string Microchip'\0'
Product name ASCII string Segment LCD1 Xplained Pro'\0'
Product revision ASCII string 02'\0'
Product serial number ASCII string 1774020200000010’\0’
Minimum voltage [mV] uint16_t 3000
Maximum voltage [mV] uint16_t 3600
Xplained Pro
Maximum current [mA] uint16_t 30

3.5 Power Sources

The SAM R34 Xplained Pro Evaluation Kit can be powered by several power sources, as listed in the table below.
Table 3-4. Power Sources for SAM R34 Xplained Pro
Power input Voltage requirements Current requirements Connector marking
External power 5V ±2% (±100 mV) for
Embedded Debugger USB
USB host operation.
4.3V to 5.5V if USB host operation is not required.
4.4V to 5.25V (according to USB spec.)
Recommended minimum is 1A to be able to provide enough current for connected USB devices and the board itself. Recommended maximum is 2A due to the input protection maximum current specification.
500 mA (according to USB spec.)
PWR
DEBUG USB
Target USB 4.4V to 5.25V (according
to USB spec.)
The kit will automatically detect which power sources are available and choose which one to use according to the following priority:
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500 mA (according to USB spec.)
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1. External power
2. Embedded Debugger USB
3. Target USB
Note:  If powering the board from the Target USB connector then jumpers J101 and J102 MUST be in the bypass position.
Info:  External power is required when 500 mA from a USB connector is not enough to power the board with possible extension boards. A connected USB device in a USB host application might easily exceed this limit.

3.6 Xplained Pro Headers and Connectors

3.6.1 Xplained Pro Standard Extension Header

All Xplained Pro kits have many dual-row, 20-pin, 100 mil extension headers. The Xplained Pro MCU boards have male headers, while the Xplained Pro extensions have their female counterparts. The following table provides the pin description of all the connected pins.
Xplained Pro
Info:  Not all pins are always connected on all extension headers.
The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained Pro MCU boards or to access the pins of the target microcontroller on the Xplained Pro boards.
Table 3-5. Xplained Pro Standard Extension Header
Pin Number Pin Name Description
1 ID Pin to communicate with the ID chip on an extension board.
2 GND Ground
3 ADC(+) Analog-to-Digital Converter; alternatively, a pin for the positive
terminal of a differential ADC.
4 ADC(-) Analog-to-Digital Converter; alternatively, a pin for the negative
terminal of a differential ADC.
5 GPIO1 General purpose I/O pin.
6 GPIO2 General purpose I/O pin.
7 PWM(+) Pulse-Width Modulation; alternatively, a pin for the positive part of a
differential PWM.
8 PWM(-) Pulse-Width Modulation; alternatively, a pin for the negative part of a
differential PWM.
9 IRQ/GPIO Interrupt request pin and/or general purpose I/O pin.
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