This user’s guide provides detailed information about the SAM E70 Xplained Ultra Evaluation kit and its
various features. Figure below illustrates the SAM E70 Xplained Ultra Evaluation kit.
Figure 1. SAM E70 Xplained Ultra Evaluation Kit with PHY Daughter Board
• Ethernet Interface with External IEEE 802.3az 10Base-T/100Base-TX Ethernet RMII PHY on a
Daughter Board
• AT24MAC402 256KB EEPROM with EUI-48 Address
• ATA6561 CAN Transceiver
• Micro SD Card Connector with SDIO Support
• Camera Interface Connector
• Two Xplained Pro Extension Headers
• Graphics Card Interface
• CoreSight® 20 Connector for 4-bit ETM
• Arduino MEGA Shield Connector
• External Debugger Connector
• USB Interface, Device and Host Mode
• Embedded Debugger:
– Programming and debugging through USB interface
– Auto-ID for board identification in Atmel Studio and MPLAB® X
– One yellow status LED
– One green board power LED
– Symbolic debug of complex data types including scope information
– Data Gateway Interface: SPI, I2C, four GPIOs
– Virtual COM port (CDC)
• External Power Input (5-14V) or USB Power
• X32 Daughter Board Interface to Support Audio and Bluetooth
®
• One mikroBus™ Interface
Kit Overview
The Microchip PIC32 SAM E70 Xplained Ultra Development Kit (DM320113) provides a modular
development system for Microchip’s line of 32-bit Cortex® microcontrollers.
For a free Microchip demonstration code and additional information, visit the MPLAB Harmony™ web
page at: http://www.microchip.com/MPLABHarmony.
The Atmel SAM E70 Xplained Ultra Dvelopment Kit is a hardware platform to evaluate the Microchip
ATSAME70Q21. The kit offers a set of features that enables the ATSAME70Q21 users to start with the
SAM E70 peripherals and understand how to integrate the device in their design.
The SAM E70 Xlpained Ultra kit contains the following items:
• One SAM E70 Xplained Ultra Development Kit
• One KSZ8061 Ethernet PHY
• One Graphics card set up for 565 (16-bit color) graphics
Note: If any items are missing in the kit, contact Microchip sales office for assistance. A list of Microchip
Sales offices is provided on the last page of this document.
The figure below illustrates the SAM E70 Xplained Ultra Evaluation Kit features.
Follow these steps to explore the Atmel SAM E70 Xplained Ultra evaluation kit:
1.Download and install MPLAB X.
2.Launch MPLAB X.
3.Install MPLAB Harmony 3™.
Getting Started
When Microchip SAM E70 Xplained Ultra is connected to the computer for the first time, the operating
system will install a driver software. The driver file supports both 32-bit and 64-bit versions of Microsoft
Windows® XP/ Vista /7/8/10.
Once the kit is powered, the green power LED will be lit and MPLAB X will auto-detect the kit and identify
which Xplained Pro extension boards are connected. MPLAB X will provide relevant information like data
sheets and kit documentation. The SAM E70 device is programmed and debugged by the on-board
Embedded Debugger, hence no external programmer or debugger tool is needed.
Design Documentation and Relevant Links
The following list provides links to the relevant documents and software for the SAM E70 Xplained Ultra.
• Xplained Pro products
– Atmel Xplained Pro is a series of small-sized and easy-to-use evaluation kit for Microchip
microcontrollers and other Microchip products. It consists of a series of low-cost MCU boards for
evaluation and demonstration of features and capabilities of different MCU families.
• Microchip MPLAB® Integrated Development Environment
– A free Microchip MPLAB IDE for development of C/C++ and assembler code for Microchip
microcontrollers.
• MPLAB Harmony
– A free MPLAB Harmony code base is available for user application. The latest MPLAB Harmony
code is available for download at:http://www.microchip.com/MPLABHarmony.
• EDBG User Guide
– This user’s guide provides additional information about the on-board Embedded Debugger.
• Data Visualizer
– Data Visualizer is a program used for processing and visualizing data. The Data Visualizer can
receive data from various sources, such as the Embedded Debugger Data Gateway Interface
that is found on the Xplained Pro boards and COM ports.
• IAR Embedded Workbench® for ARM
– A commercial C/C++ compiler that is available for ARM. A 30-day evaluation version and a code
size limited kick-start version are also available for download from their web site. The code size
limit is 16-KB for devices with M0, M0+, M1 cores, and 32-KB for devices with other cores.
• Keil MDK-ARM Microcontroller Development Kit
– The MDK-ARM is a complete software development environment for Cortex®-M, Cortex-R4,
ARM7™, and ARM9™ processor-based devices. The MDK-ARM is specifically designed for
microcontroller applications, it is user friendly yet powerful enough for the most demanding
embedded applications.
The SAM E70 Xplained Ultra implements several Xplained Pro standards like extension headers and
connectors. Xplained Pro is an evaluation platform that provides a full Microchip microcontroller
experience. The platform consists of a series of Microcontroller (MCU) boards and extension boards that
are integrated with the Microchip MPLAB IDE that supports data streaming. The Xplained Pro MCU
boards support a wide range of Xplained Pro extension boards, such as audio DACs/CODECs, Ethernet
PHYs, graphics cards, and mikroBUS™ that are connected through a set of standardized headers and
connectors. Each extension board has an identification (ID) chip to uniquely identify which boards are
connected to a Xplained Pro MCU board. This information is used to present relevant user guides,
application notes, data sheets, and example code through MPLAB X.
The SAM E70 Xplained Ultra contains Microchip Embedded Debugger (EDBG) for on-board debugging.
The EDBG is a composite USB device, which is based on the following interfaces:
• Debugger
• Virtual COM Port
• Data Gateway Interface (DGI)
Together with the Microchip MPLAB IDE, the EDBG debugger interface can program and debug the
ATSAME70Q21. On the SAM E70 Xplained Ultra, the SWD interface is connected between the EDBG
and the ATSAME70Q21.
The Virtual COM Port is connected to a UART on the ATSAME70Q21 and provides an easy way to
communicate with the target application through the terminal software. It offers variable baud rate, parity,
and Stop bit settings. The settings on the ATSAME70Q21 must match the settings given in the terminal
software.
Note: If not set automatically, Data Terminal Ready (DTR) must be set in the terminal software.
The DGI consists of several physical interfaces for communication with the host computer.
Communication over the interfaces is bidirectional. It can be used to send events and values from the
ATSAME70Q21, or as a generic printf-style data channel. Traffic over the interfaces can be timestamped
on the EDBG for accurate tracing of events. Note that timestamping imposes an overhead that reduces
maximal throughput. The Data Visualizer is used to send and receive data through DGI.
Embedded Debugger
The EDBG controls two LEDs on SAM E70 Xplained Ultra: a power LED and a status LED.
The following table describes how the LEDs are controlled in different operation modes.
Table 3-1. EDBG LED Control
Operation ModePower LEDStatus LED
Normal operationThe power LED is lit when power is
applied to the board.
Bootloader mode
(idle)
Bootloader mode
(firmware upgrade)
For additional information on EDBG, refer to the EDBG User Guide.
The power LED and the status LED
blinks simultaneously.
The power LED and the status LED
blinks in an alternating pattern.
3.1 Hardware Identification System
All Xplained Pro-compatible extension boards have an Microchip ATSHA204 CryptoAuthentication™ chip
mounted. This chip contains information that identifies the extension with its name and data. When an
Xplained Pro extension is connected to an Xplained Pro MCU board, the information is read and sent to
the MPLAB X IDE. The Microchip kits extension, installed with MPLAB X, provides relevant information,
such as code examples, and links to relevant documents. The following table provides the data fields
stored in the ID chip with content examples.
Activity indicator, LED flashes when any
communication happens to the EDBG.
The power LED and the status LED
blinks simultaneously.
The power LED and the status LED
blinks in an alternating pattern.
The following figure illustrates the high-level signal block diagram of the SAM E70 Xplained Ultra
Development Kit.
Figure 4-1. Signal Level Block Diagram
System Level Block Diagram
Wire buses that are tied together are connected together. In this system the SPI bus data and clock are
shared across several interfaces. The SPI Slave selects are addressed individually with GPIO.
System I2C uses I2C0 and connects to the debugger, EXT1, EXT2, and mikroBus/X32. Touch I2C uses
I2C2 and only goes from the microcontroller to the graphics connector.
The debugger has the following interfaces connected: DGI SPI, DGI I2C, DGI UART, and SWD.
UART wires from the microcontroller to the blocks are not shared with each other.
All Xplained Ultra Kits have many dual row, 20-pin, 100 mil extension headers. Xplained Ultra MCU
boards have male headers, while Xplained Ultra extensions have their female counterparts as shown in
the image below.
Note: All pins are not always connected.
The extension headers can be used to connect a variety of Xplained Pro extensions to Xplained Ultra
MCU boards or to access the pins of the target MCU on Xplained Ultra MCU boards directly.
Figure 5-1. Extension Headers
Hardware Features
All connected pins follow the defined pinout description as shown in the following table.
Table 5-1. Xplained Pro Standard Extension Header
Pin number NameDescription
1IDCommunication line to the ID chip on an extension board
2GNDGround
3ADC(+)Analog-to-Digital Converter, alternatively positive part of differential ADC
4ADC(-)Analog-to-Digital Converter, alternatively negative part of differential ADC
5GPIO1General purpose I/O
6GPIO2General purpose I/O
7PWM(+)Pulse-Width Modulation, alternatively positive part of differential PWM
8PWM(-)Pulse-Width Modulation, alternatively negative part of differential PWM
9IRQ/INT/GPIOInterrupt request line and general purpose I/O
10SPI SS B/GPIO SPI Slave Select or general purpose I/O
11I2C SDAData line for I2C interface. Always implemented, bus type
12I2C SCLClock line for I2C interface. Always implemented, bus type
15SPI SS A/GPIO SPI Slave Select or general purpose I/O
16SPI MOSIMaster Out Slave In line of serial peripheral interface. Always
implemented, bus type.
17SPI MISOMaster In Slave Out line of serial peripheral interface. Always
implemented, bus type.
18SPI SCKClock for serial peripheral interface. Always implemented, bus type.
19GNDGround
20V
CC
Power for extension boards (3.3V)
5.2 Graphics Connectors or GFX Card Interface
The SAM E70 Xplained Ultra Development Kit is designed to have a modular graphics interface. This
interface enables using several graphics cards, which allow for expandability and different use cases. A
565 adapter card is included in the kit, which takes 16-bit parallel LCD data and converts it to 24-bit data.
This card also provides access to ADC for resistive touch screens, hence an external controller is not
needed. See table below for pin descriptions.
Table 5-2. Graphics Interface Pinout
Pin Number NameDescription
1GNDGround
2GNDGround
3MCLRMaster Clear, Controlled by the debuggers. Allows for a
complete system reboot.
4IRQ1 (LCD Touch)Interrupt request line for cap touch device
55.0v V
6IRQ2 (Q Touch)Interrupt request line for Q touch devices
CC
5.0v
7LCDENLCD Data Enable
8IRQ3 (Display Controllers) Interrupt request line for external display controllers
9LCDHSYNC/NCS3LCD Horizontal Sync
10IRQ4 (Resistive touch)Interrupt request line for resistive touch controllers
11LCDVSYNC/nWELEC Vertical Sync or Write enable (active-low)
125.0v V
13LCDPCK/nRDLCD pixel Clock or Read Enable (active-low)
14I2C SDAData line for I2C interface. Always implemented, bus type.
The external bus interface (EBI) on SAM E71 Xplaned Ultra is controlled by the static memory controller
(SMC) and SDRAM controllers modules in the ATSAME70Q21B.
ATSAME70Q21B has on-die series termination on very I/O pin as shown in figure below.
Figure 5-2. On-Die Termination
Hardware Features
The EBI is connected to the on-board SDRAM and the Xplained Pro Graphics connector. The following
figure shows how the SDRAM and LCD share the same sets of data pins, and displays the location of the
series termination resistors.
Figure 5-3. LCD and SDRAM
As the I/O pins have on-die series termination, the impedance of the drivers must be matched to the
impedance of the EBI tracks on the PCB using series resistors. The EBI tracks are routed as 50Ω on
SAM E70 Xplained Ultra. The clock and address lines are only driven by the ATSAME70Q21B, while the
data lines are driven by the ATSAME70Q21B and the on-board SDRAM.
Simulation of the transmissions lines using IBIS files for the ATSAME70Q21B and the SDRAM gave the
results are shown in the table below.
Table 5-3. EBI Simulation Results
Driving CircuitSignal TypeDriver Impedance
(from ibis)
ATSAME70Q21BData/Address22Ω24Ω ≈ 22Ω50Ω
Clock21Ω25Ω ≈ 22Ω50Ω
SDRAMData11Ω32Ω ≈ 33Ω50Ω
The routing of the data lines to the LCD connector causes stubs on the data lines at the SDRAM (the
stubs are even longer when a cable is plugged in). The 200Ω resistors are placed close to the SDRAM to
create a high-impedance path for the signal to the stubs, improving the signal integrity when
communicating with the SDRAM.
TIP:
• The series-termination is always placed near to the driving pin.
• The 200Ω resistors are placed close to the intersection between the SDRAM routing and the routing
to the LCD connector.
• All designs must be simulated using an IBIS file for the ATSAMV71Q21B and the target peripherals
to check whether the signals are within the limits of the devices.
Users can connect to the PIC32 USB microcontroller using any one of the following modes:
• Host mode: If connecting the device to the Type-A/B Micro connector, an adapter is required. Using
this method, a maximum of 400 mA can be supplied from the debug USB port to the host port. If a
full 500 mA supply is needed, an external supply must be connected to the application board.
• Device mode: Connect the SAM E70 to the target USB Micro-A/B port using a USB cable. This is
enough to power the board as a device. If programming and debugging is required, connect the
Debug USB Micro-A/B port. The other end of the cable must have a Type-A connector, to connect it
to a USB host.
• On-The-Go (OTG) mode: Connect the starter kit to the OTG device by using an OTG Micro-A/B
cable to the Micro-A/B port.
Hardware Features
There is a 1x3, 100mil pin-header marked VBUS on the kit. The PB08 pin on the SAM E70 can be
connected to the LED2 or to the target USB VBUS DETECT signal by placing a jumper between pin 1
and pin 2, or pin 2 and pin 3 on this pin-header. The USB VBUS DETECT is the target USB voltage
divided by 1.64. When connected to the PB08 pin the signal can be used to detect power on the target
USB connector.
Table 5-5. USB Jumper Description
Pin number NameDescription
1LED2LED2 active-low
2PB08Pin and Port to microcontroller
3VBUS_ Detect VBUS Detect, used to detect when a device cable (micro-B) is plugged
into the SAM E70
The SAM E70 Xplained Ultra has a Micro-USB connector to use with the SAM E70 USB module labeled
as TARGET USB on the kit. In USB Host mode, the VBUS voltage is provided by the kit, and must be
enabled by setting the VBUS Host Enable pin to low. When a USB OTG cable is plugged in, it will
automatically trigger the power supply.
A 1x2 pin-header is connected to the SAM E70 chip erase pin, PB12, and 3V3 is marked ERASE. This
header can be used to chip erase the SAM E70 by placing the jumper on the header and toggle power to
the board. After the power is toggled, the jumper must be removed. Using the chip erase jumper may be
the only way to erase a chip with the security bit set, and applications that immediately set invalid clock
options, or go into deep sleep without any wake-up sources enabled.
5.7 Audio Connectivity
The SAM E70 provides an audio connection through the X32 interface to the two main audio modules in
the chip, such as the SSC and the I2S. On this board the SSC interface is considered the main audio
interface. See image below.
There is a 32-pin interface to the board to support the audio codec or DACs and Bluetooth radios. This
interface has two audio supply interfaces, such as the SSC and the I2S. Addition to this other control lines
and data interfaces are available.
The mikroBUS™ interface enables using the additional click boards. For additional information and to
identify the boards to be used with this development kit, visit the following web site: https://
www.mikroe.com/.
Table 5-8. mikroBUS™ interface Pin Description
Pin NumberNameFunction
1GNDGround
2+5V+5.0V
3SDAI2C SDA
4SCLI2C SCL
Hardware Features
5TXUART TX
6RXUART RX
7INTInterrupt request line
8PWMPulse-Width Modulation
9GNDGround
10+3.3VGround
11MOSIMaster Out Slave In line of serial peripheral interface
12MISOMaster In Slave Out line of serial peripheral interface
13SCKClock for serial peripheral interface
14CSChip Select for serial peripheral interface. (Active-low)
15RSTReset
16ANAnalog-to-Digital Converter.
5.9 CAN
The development kit provides access to the a CAN-FD interface that is post transceiver. The SAM E70
Xplained Ultra has two MCAN modules that perform communications according to ISO11898-1 (Robert
Bosch GmbH CAN specification 2.0 part A and B). Bosch CAN FD specification V1.0. MCAN1 is
connected to an on-board ATA6561 CAN physical-layer transceiver. These connections are described in
the following table.
Table 5-9. Connections Between the ATSAME70Q21 and the ATA6561
Pin NumberNameDescription
1CAN_HCAN High Signal
2GNDGround
3CAN_LCAN Low Signal
5.10 Ethernet
The SAM E70 Xplained Ultra kit has a modular Ethernet PHY system that allows for different PHYs to be
plugged into the board. This interface is set up to use a Reduced Media-Independent Interface (RMII), as
well as a SPI bus interface with GPIO.
16 (4)MOSIMaster Out Slave In line of serial peripheral interface
17 (5)MISOMaster In Slave Out line of serial peripheral interface
18 (6)GNDGround
19 (7)NCNo Connect
20 (8)REFCLK (in)Reference Clock input (50 MHz)
21 (9)GNDGND
22 (10)+3.3v V
23 (11)CSChip Select for serial peripheral interface
24 (12)SCKClock for serial peripheral interface
25 -30EGNDShield Ground
DD
5.11 Debug USB Connectivity
The starter kit includes an EDBG USB microcontroller that provides debugger connectivity over the USB.
The EDBG MCU is hard-wired to the SAM E70 device to provide protocol translation.
An external programmer, such as MPLAB ICD4, may be used with the development kit through either the
SWD interface or through the Coresite 20 interface.
+3.3V V
DD
5.12 Switches
The starter kit provides the following two push button switches. The push button switches do not have
any debounce circuitry and require the use of internal pull-up resistors. This enables the user to
investigate the software debounce techniques. When Idle, the switches are pulled high (+3.3V,) and when
pressed, they are grounded.
The development board has an on-board 2-Kbit I2C serial EEPROM which is available for user
applications. This serial EEPROM has a unique EUI-48, EUI-64, and 128-bit serial number. The unique
number can be seen in the Microchip MPLAB Xplained window or Atmel Studio Xplained window after the
kit has been plugged into the PC.
Figure 5-6. SAM E70 Xplained Ultra Window
Hardware Features
Note: The above figure provides an example of the Xplained window with the MAC48 address.
Users can change the device address using the solder pads on the board, but all address bits have been
defaulted to one, refer to schematics for additional information. For additional usage information of on this
part, refer to “AT24MAC402 and AT24MAC602 data sheet”, which is available for download from the
following location: http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8807-SEEPROM-
AT24MAC402-602-Datasheet.pdf.
5.14 Power Sources
The SAM E70 Xlplained Ultra evaluation kit has several power systems to it. This section covers the
power sub system in detail. Figure below shows a high-level block diagram of the power system.
Figure 5-7. Power Sources Block Diagram
Hardware Features
The following options can be used to power the development kit:
• Using the Micro-USB connector that is connected to the EDBG known as Debug USB.
• Using the Micro-USB connector which is known as Target USB.
• Using the Barrel Jack. This input can take a large range of power inputs from 5.5V to 19V.
• Using the Arduino headers. This has several options one must be careful of when using this method.
Not all power rails are protected from the user error. VIN connects to the input side of the main buck
supply (step down), and it is similar to the barrel jack (2.1 mm).
• Using the 2 x 2 x 0.1 header, located on the side of the board, which has a 3.3v and 5.0v capable
inputs.
The SAM E70 Xplained Ultra kit can be powered by several power sources as described in the following
table.
Table 5-11. Power Sources for SAM E70 Xplained Ultra
Hardware Features
Power InputVoltage RequirementsCurrent Requirements
External Power5V ±2% (±100 mV) for USB
host operation. 4.3V to 5.5V if
USB host operation is not
required.
Embedded
Debugger USB
Target USB4.4V to 5.25V (according to
External Jack
Input
The development kit will detech and choose the available power sources based on the following options:
• External jack input
• External power
• Embedded debugger USB
• Target USB
4.4V to 5.25V (according to
USB spec.)
USB spec.)
5.5v to 19V1A minimum, 2.5A is recommended.
Recommended minimum current is
1A to be able to provide enough
current for the connected USB
devices and the board.
Recommended maximum current is
2A due to the input protection
maximum current specification.
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To register, access the Microchip web site at http://www.microchip.com/. Under “Support”, click on
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• There are dishonest and possibly illegal methods used to breach the code protection feature. All of
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Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Tel: 317-536-2380
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
Tel: 951-273-7800