This user's guide introduces the SAM9X60 Evaluation Kit (SAM9X60-EK) and describes the development and
debugging capabilities running on SAM9 Arm®-based embedded MPUs.
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Microchip MIC2800, MCP1725
Microchip PAC1934, PAC1710
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DS50002907A-page 4
2.2 Evaluation Kit Specifications
CAUTION
Table 2-2. Evaluation Kit Specifications
CharacteristicSpecification
BoardSAM9X60-EK
Board supply voltageExternal or USB-powered
SAM9X60-EK
Product Overview
Temperature
Relative humidity0 to 90% (non-condensing)
Main board dimensions150 × 125 × 20 mm
RoHS statusCompliant
Board identificationSAM9X60 Evaluation Kit
2.3 Power Sources
Two options are available to power up the SAM9X60-EK board:
• Powering through an external AC to DC +5V wall adapter connector (J1)
• Powering through the USB Micro-B connector on the USBA port (J7 – default choice)
Table 2-3. Electrical Characteristics
Electrical ParametersValue
Input voltage5VDC
Maximum input voltage (limits)6VDC
Maximum 3.3VDC current300 mA
Operating: 0°C to +70°C
Storage: –40°C to +85°C
The SAM9X60-EK board runs at a 3.3V voltage level logic. The maximum voltage that the I/O pins can
tolerate is 3.3V. Providing higher voltages (e.g., 5V) to an I/O pin could damage the board.
2.4 Connectors on Board
The fully-featured SAM9X60-EK board integrates multiple peripherals and interface connectors, as shown in the
following figures.
This section covers the specifications of the SAM9X60-EK and provides a high-level description of the board's major
components and interfaces. This document is not intended to provide detailed documentation about the processor or
about any other component used on the board. It is expected that the user will refer to the appropriate documents of
these devices to access detailed information.
Figure 3-1. SAM9X60-EK Block Diagram
SAM9X60-EK
Function Blocks
3.1 Power Supply Topology and Power Distribution
budget for all the devices on the board and a correct power-up sequence for the MPU. The power-up and powerdown sequences indicated in the SAM9X60 datasheet must be respected for a reliable operation of the device.
3.1.1 Input Power Options
The SAM9X60-EK board can be powered through:
This section describes the implementation and the circuitry that ensures adequate voltage stability and current
The +5V from the wall adapter is protected through an NCP349 positive overvoltage controller switch. The controller
is able to disconnect the system from its output pin when incorrect input operating conditions are detected (5.83V
max).
The USB-powered operation comes from the USB device port connected to a PC or a 5VDC supply. The USB supply
is enough to power the board in most applications. It is important to note that when the USB supply is used, the USB
port has limited power. If USB Host port is required for the application, it is recommended that the external DC supply
be used.
• an external AC to DC +5V wall adapter connected via a 2.1 mm center-positive plug into the power jack of the
board (J1). The recommended output capacity of the power adapter is 2A,
• USB port A (J7).
User Guide
DS50002907A-page 9
0.1uF
50V
0402
C3
0.1uF
50V
0402
C9
GND
IN
1
IN_PAD
7
EN
6
GND
2
FLAG
3
OUT2
5
OUT1
4
NCP349MNAETBG
U1
2
3
1
2.1mm
EJ508A
J1
VDD_MAIN_5V_
GND
EXT_5VDC_5V
180R 0603
FB1
USB_5V
0.1uF
50V
0402
C7
2
71
6
SIA923AEDJ-T1-GE3
Q1A
5
84
3
SIA923AEDJ-T1-GE3
Q1B
2
71
6
SIA923AEDJ-T1-GE3
Q2A
5
84
3
SIA923AEDJ-T1-GE3
Q2B
GNDGNDGNDGND
GNDGNDGND
100µF
16V
Radial, Can
C4
GND
USBA_VBUS_5V
10uF
25V
1206
C1
10uF
25V
1206
C2
10uF
25V
1206
C8
100k
0402
5%
R2
100k
0402
5%
R3
100k
0402
5%
R5
PIC101
PIC102
COC1
PIC201
PIC202
COC2
PIC301
PIC302
COC3
PIC401
PIC402
COC4
PIC701
PIC702
COC7
PIC801
PIC802
COC8
PIC901
PIC902
COC9
PIFB101
PIFB102
COFB1
PIJ101
PIJ102
PIJ103
COJ1
PIQ101
PIQ102
PIQ106
PIQ107
COQ1A
PIQ103
PIQ104
PIQ105
PIQ108
COQ1B
PIQ201
PIQ202
PIQ206
PIQ207
COQ2A
PIQ203
PIQ204
PIQ205
PIQ208
COQ2B
PIR201
PIR202
COR2
PIR301
PIR302
COR3
PIR501
PIR502
COR5
PIU101
PIU102
PIU103
PIU104
PIU105
PIU106
PIU107
COU1
PIC201
PIC301
PIQ101
PIQ202
PIQ205
PIR202
PIU104
PIU105
PIC101
PIJ101
PIU101
PIU107
PIC102
PIC202
PIC302
PIC402
PIC702
PIC802
PIC902
PIJ102
PIR201
PIR301
PIR501
PIU102
PIU106
PIJ103
PIQ102
PIQ105
PIQ203
PIQ206
PIQ207
PIQ208
PIR302
PIQ103
PIQ106
PIQ107
PIQ108
PIU103
PIC801
PIC901
PIFB102
PIQ201
PIR502
PIC701
PIFB101
PIC401
PIQ104
PIQ204
SAM9X60-EK
Function Blocks
The switch between the two powering options is made by four transistors that ensure the separation between the two
when both are plugged. The switch prioritizes powering from the wall adapter to maximize power transfer.
The following figure shows the input power supply topology.
Figure 3-2. Input Power Options
Note: USB-powered operation eliminates additional wires and batteries. It is the preferred mode of operation for any
project that requires only a 5V source at up to 500 mA.
3.1.2 Power Management Integrated Circuit
The MIC2800 is a high-performance power management IC providing three output voltages with maximum efficiency.
Integrating a 2-MHz DC/DC converter with an LDO post-regulator, the MIC2800 gives two high-efficiency outputs with
a second, 300 mA LDO for maximum flexibility. The DC-to-DC converter uses small values of L and C to reduce
board space while still retaining efficiency over 90% at load currents up to 600 mA. For more information about the
MIC2800, refer to the product web page.
Each LDO has an independent Enable (EN) pin thus allowing a proper power-up sequence for the MPU. The 20 KΩ
resistor in series and the 0.1 µF capacitor in parallel with the EN1 input make a low-pass filter and introduce the
necessary delay between the 3.3V and 1.15V rails needed for the proper operation of the MPU. The diode (D1 in
Figure 3-3) ensures that the capacitor fast discharges during the power-down sequence.
Detailed information on the SAM9X60 MPU power supplies and power-up/down considerations are described in
section “Electrical Characteristics” in the SAM9X60 device datasheet (see 1.2 Recommended Reading).
The MIC2800-G8S comes preset to supply all the voltage rails needed by the system:
• 1.8V DC/DC supplies SAM9X60 DDR2 pads (VDDIOM) and devices.
• 1.15V LDO1 supplies SAM9X60 Core (VDDCORE).
• 3.3V LDO2 supplies SAM9X60 I/O pads.
The figure below shows the power management scheme.
The processor can assert the SHDN signal to shut down the PMIC and enter Power-down mode. This is done by
pulling both enable pins of the PMIC to GND through a Field Effect Transistor (FET) scheme.
Jumper J3 must not be set to enable this functionality. By setting jumper JP2/J3, the user can shut down the MPU
without powering down its power rails.
Figure 3-4. Shutdown Circuitry
SAM9X60-EK
Function Blocks
3.1.4 Battery Unit
A 3.3V battery (supercapacitor) is implemented to permanently maintain the VDDBU voltage.
This function allows the user to shut down the MPU and the system, thus entering a low power mode, and still keep
the custom configuration that was previously set in the MPU backup area. While in Shut-down mode, the board can
be woken up by action on the SW2 button (WAKE UP), which signals the MPU to resume operations.
Jumper JP1/J2 must be in place for proper operation of the MPU, and can be removed if the user wants to bring the
MPU back to the initial configuration, by resetting the General Purpose Backup Registers (GPBR).
Make sure the board is powered off before removing the JP1/J2 jumper.
User Guide
DS50002907A-page 11
Figure 3-5. Battery Unit
220mF
3.3V
P8.3L11.7D6.8H1.8
C23
1
2
3
BAT54C
D2
PMEG6010ER
D3
VDDBU
GND
Shunt 2.54mm 1x2
JP1
VDD_3V3
12
HDR-2.54 Male 1x2
J2
100R
0402
1%
R20
PIC2301
PIC2302
COC23
PID201
PID202
PID203
COD2
PID301
PID302
COD3
PIJ201
PIJ202
COJ2
COJP1
PIR2001
PIR2002
COR20
PIC2302
PIC2301
PID202
PIR2002
PID203
PIJ202
PID302
PIR2001
PID201
PID301
PIJ201
I2C ADR : 1001_101[R/W]
GNDGNDGND
10k
0402
5%
R4
VDD_3V3
VDD_MAIN_5V_VDD_MAIN_5V
PAC1710_TWCK
PAC1710_TWD
VDD_MAIN_5V
GND
PAC1710_INT
12
3
4
0.01R
1206
1%
0.25W
R1
SENSE+
1
SENSE-
2
NC
3
NC
4
GND
5
ADDR_SEL
6
ALERT#
7
SMDATA
8
SMCLK
9
VDD
10
PAD
11
PAC1710
U2
5V_P5V_N
TP LOOP Black TH
TP1
4.7uF
10V
0402
C5
0.1uF
50V
0402
C6
VDD_3V3_LDO
100R
0402
1%
R6
PIC501
PIC502
COC5
PIC601
PIC602
COC6
PIR101
PIR102
PIR103
PIR104
COR1
PIR401
PIR402
COR4
PIR601
PIR602
COR6
PITP101
COTP1
PIU201
PIU202
PIU203
PIU204
PIU205
PIU206
PIU207
PIU208
PIU209
PIU2010
PIU2011
COU2
PIVDD0MAIN05V01
COVDD0MAIN05V
PIR104
PIU202
NL5V0N
PIR103
PIU201
NL5V0P
PIC501
PIC601
PIR602
PITP101
PIU205
PIU2011
PIR601
PIU206
PIU203
PIU204
PIR401
PIU207
POPAC17100INT
PIU209
POPAC17100TWCK
PIU208
POPAC17100TWD
PIR402
PIC502
PIC602
PIU2010
PIR102
PIVDD0MAIN05V01
PIR101
POPAC17100INT
POPAC17100TWCK
POPAC17100TWD
3.1.5 Current Measurement
Two Microchip DC power/energy monitors are embedded on the SAM9X60-EK board:
• one single high-side current sense monitor PAC1710
• one four-channel current sense monitor PAC1934
Both chips communicate with the MPU via a Two-wire Interface (TWI) and both output their ALERT# signal to a port
expander.
The PAC1710 is a single high-side bidirectional current sensing monitor with precision voltage measurement
capabilities. The power monitor measures the voltage developed across an external sense resistor to represent the
high-side current of a battery or voltage regulator. The PAC1710 also measures the SENSE+ pin voltage and
calculates average power over the integration period. The PAC1710 can be programmed to assert the ALERT# pin
when high and low limits are exceeded for current sense and bus voltage. For more information about the PAC1710,
refer to the product web page.
One current sense resistor is populated on board for measuring voltage and current on the main 5V power rail.
Figure 3-6. PAC1710 Current Measurement
SAM9X60-EK
Function Blocks
Table 3-1. PAC1710 Signal Descriptions
PIOSignal NameShared PIOSignal Description
PA31PAC1710_TWCKPower TWITWI clock
PA30PAC1710_TWDPower TWITWI data
–PAC1710_INT–Interrupt – to port expander U6
The PAC1934 is a four-channel power/energy monitor with current sensor amplifier and bus voltage monitors that
feed high resolution ADCs. Digital circuitry performs power calculations and energy accumulation. The PAC1934
enables energy monitoring with integration periods from 1 ms to up to 36 hours. Bus voltage, sense resistor voltage,
and accumulated proportional power are stored in registers for retrieval by the system master or embedded
controller. For more information about the PAC1934, refer to the product web page.
Four current sense resistors are populated on board for measuring voltage and current consumption on the power
rails:
• 3.3V VDD_3V3_MPU - MPU on the 3.3V rail
• 3.3V VDD_3V3_SYS - rest of the system on the 3.3V rail
• 1.8V VDDIOM - MPU and DDR2 memory
• 1.15V VDDCORE – MPU core
Figure 3-7. PAC1934 Current Measurement
Table 3-2. PAC1934 Signal Descriptions
PIOSignal NameShared PIOSignal Description
PA31PAC1934_TWCKPower TWITWI clock
PA30PAC1934_TWDPower TWITWI data
–PAC1934_INT–Interrupt – to port expander U6
3.2 Processor
The SAM9X60 is a high-performance, ultra-low power ARM926EJ-S CPU-based embedded microprocessor (MPU)
running up to 600 MHz, with support for multiple memories such as SDRAM, LPSDRAM, LPDDR, DDR2, QSPI and
e.MMC Flash. The device integrates powerful peripherals for connectivity and user interface applications, and offers
security functions (tamper detection, etc.), TRNG, as well as high-performance crypto accelerators for AES and SHA.
Refer to the SAM9X60 datasheet for more information (see 1.2 Recommended Reading).
3.2.1 Power Supply
The PMIC (main regulator) provides all power supplies required by the SAM9X60 device:
Decoupling capacitors are placed close to the MPU power pins to stabilize the voltage rails.
• 1.8V for VDDIOM
• 3.3V for VDDIOP0, VDDIOP1, VDDANA, VDDNF, VDDQSPI, VDDIN33 and VDDBU
User Guide
DS50002907A-page 13
Figure 3-8. Processor Power Supplies
GND
0.1uF16V0201
C32
0.1uF16V0201
C33
SAM9X60POWERSUPPLY
4.7uF10V0402
C31
VDDCORE
L6
VDDCORE
F6
VDDCORE
F11
VDDIOM
G14
VDDIOM
C10
VDDIOM
C13
VDDANA
C4
VDDIN33
P13
VDDOUT25
P10
VDDIN33
L11
GND
J8
GND
E7
GND
G12
GNDANA
B4
GNDIN33
R13
VDDNF
K14
VDDIOP0
G3
GND
E10
GND
B13
GND
K5
GND
G5
GND
N15
VDDQSPI
C7
VDDIOP0
K3
GND
H8
GND
H9
GNDIN33
M10
GND
K12
GND
T16
GND
A1
GND
A16
GND
T1
VDDBU
P7
GND
M7
VDDIOP1
N3
GND
N2
U5G
SAM9X6_TFBGA-228
VDDOUT25
VDDBU
VDDCORE
VDDIOM
0.1uF16V0201
C34
0.1uF16V0201
C36
0.1uF16V0201
C37
0.1uF16V0201
C38
0.1uF16V0201
C41
0.1uF16V0201
C42
0.1uF16V0201
C43
0.1uF16V0201
C44
0.1uF16V0201
C45
0.1uF16V0201
C46
0.1uF16V0201
C48
0.1uF16V0201
C49
4.7uF10V0402
C47
0.1uF16V0201
C50
0.1uF16V0201
C51
GND
4.7uF10V0402
C35
VDDIN33
VDDIN33
2.2uF10V0402
C52
4.7uF10V0402
C40
4.7uF10V0402
C39
0R 0402
R30
VDD_3V3_MPU
VDD_3V3_MPU
SAM9X60-EK
Function Blocks
3.2.2 Main Configuration and Control
This block depicts the main block for processor configuration and control:
• XIN and XOUT are the Main Clock Oscillator input/output.
• XIN32 and XOUT32 are the Slow Clock Oscillator input/output.
• SHDN is an output signal used to enable and disable an external power supply circuit.
• WKUP is an event detection input pin used to wake up the processor from Shutdown state.
• JTAGSEL is an input that when pulled high enables the JTAG boundary scan.
• TCK, TDI, TDO, TMS and RTCK are used for JTAG communication.
• nRST is the processor main reset input.
• HHSD_A/B/C are the three USB ports embedded inside the MPU.
• RTUNE is used for USB external tuning.
• TST input is reserved for processor manufacturing tests.
• ADVREFP and ADVREFN are the positive and negative reference points for the embedded analog comparator.
A small low-pass filter is placed to reduce the input noise and improve accuracy.
Figure 3-9. Processor Main Configuration and Control
JTAG_TCK
JTAG_TDI
JTAG_TDO
JTAG_TMS
JTAG_RTCK
USBA_N
USBA_P
USBB_N
USBB_P
USBC_N
USBC_P
0R
0402
R26
VDDBU
5.62k
04021%
R23
SHDN
WAKE_UP
XIN
XOUT
XIN32
XOUT3 2
GND
GND
SAM9X60CONFIG
GND
1uF
10V
0201
C28
10R
0201
1%
R25
0R0402
R22
DNP
VDD_3V3_MPU
MPU_nRST
XIN
R10
XOUT
T10
XIN32
T9
XOUT32
R9
SHDN
R11
WKUP
T11
JTAGSEL
P9
nRST
R1
TST
J9
HHSDPA
T12
HHSDMA
R12
HHSDPB
T13
HHSDMB
T14
HHSDPC
P12
HHSDMC
N12
TCK
R3
TDI
F3
TDO
H5
TMS
F5
RTCK
T2
ADVREFP
D5
RTUNE
P11
ADVREFN
C5
U5F
SAM9X6_TFBGA-228
0.1uF
50V
0402
C29
GND
TP2
VDD_3V3
GND
XIN
GND
24MHz
18pF
ABM8G-24.000MHZ-18-D2Y-T
Y1
DNP
27pF
0402
C24
DNP
27pF0402
C25
DNP
1M
0402
5%
R21
DNP
STB
1
GND
2
OUT
3
VDD
4
24MHz
DSC1001CI5-024.0000
Y3
GND
XOUT
0R
0402
R28
32.768Khz
ABS06-32.768KHZ-T
Y2
GND
XIN32
XOUT32
20pF
0402
C26
20pF0402
C27
1M
0402
5%
R24
DNP
0R
0402
R27
DNP
0R
0402
R91
DNP
XIN
XOUT
51R
0402
R149
3.2.3 Clock Circuitry
The embedded MPU generates its necessary clocks based on two oscillators: one slow clock (SLCK) oscillator
running at 32.768 kHz and one main clock oscillator running at 24 MHz.
The main clock oscillator is implemented with a MEMS (Micro Electro-Mechanical System) device DSC1001.
For evaluation purposes, we leave users the freedom to mount a crystal instead, using the PCB footprint reservation
(Y1). In that case, resistors R149 and R28 should be removed, resistors R27 and R91 should be populated and
capacitors C24 and C25 should be populated with the appropriate load capacitance for the selected crystal.
The MPDDRC I/Os embed an automatic impedance matching control to avoid overshoots and to reach the best
performance levels depending on the bus load and external memories. A serial termination connection scheme,
where the driver has an output impedance matched to the characteristic impedance of the line, is used to improve
signal quality and reduce EMI. This is done using the ZQ calibration procedure to calibrate the SAM9X60 DDR I/O
drive strength. The pin name where the ZQ resistor must be connected is DDR_CAL and, as indicated in the
SAM9X60 datasheet for DDR2 case, the resistor value is 20 KOhms.
The DDR_VREF pin serves as a voltage reference input for the DDR I/Os when DDR2 or LPDDR external SDRAM
memories are used.
Figure 3-13. DDR Reference Voltage
3.2.6 PIOs
The following sections depict all the signals connected to the SAM9X60 MPU ports.
See Table 3-3 for details about each port’s functions.
Some of the ports were multiplexed to accommodate more devices on the evaluation kit and to showcase all the
functions the SAM9X60 MPU can address off a single PIO wire.
Most of the ports that share multiple functions are split through passive resistors placed on the board as close to the
MPU as possible, therefore no other hardware change must be made. In most cases, the user can use only one of
their functions at a time, or can develop a composite driver enabling the use of multiple functions at the same time.
Figure 3-16. Processor PIO Muxing
Table 3-3. Processor PIOs Pin Assignment and Signal Description