Microchip SAM9X60-EK User Manual

SAM9X60-EK
SAM9X60-EK User's Guide

Scope

This user's guide introduces the SAM9X60 Evaluation Kit (SAM9X60-EK) and describes the development and debugging capabilities running on SAM9 Arm®-based embedded MPUs.
© 2019 Microchip Technology Inc.
DS50002907A-page 1
SAM9X60-EK

Table of Contents

Scope............................................................................................................................................................. 1
1. Introduction............................................................................................................................................. 3
1.1. Document Layout......................................................................................................................... 3
1.2. Recommended Reading...............................................................................................................3
2. Product Overview....................................................................................................................................4
2.1. SAM9X60-EK Features................................................................................................................ 4
2.2. Evaluation Kit Specifications........................................................................................................ 5
2.3. Power Sources............................................................................................................................. 5
2.4. Connectors on Board................................................................................................................... 5
2.5. Default Jumper Settings............................................................................................................... 8
2.6. Kit Content....................................................................................................................................8
3. Function Blocks.......................................................................................................................................9
3.1. Power Supply Topology and Power Distribution...........................................................................9
3.2. Processor................................................................................................................................... 13
3.3. On-board Memories................................................................................................................... 28
3.4. Peripherals................................................................................................................................. 32
3.5. User Interaction and Debugging.................................................................................................48
4. Installation and Operation..................................................................................................................... 55
4.1. System and Configuration Requirements...................................................................................55
4.2. Board Setup............................................................................................................................... 55
5. Erratum................................................................................................................................................. 56
6. Appendix. Schematics and Layouts...................................................................................................... 57
7. Revision History.................................................................................................................................... 64
7.1. DS50002907A - 10/2019............................................................................................................64
The Microchip Website.................................................................................................................................65
Product Change Notification Service............................................................................................................65
Customer Support........................................................................................................................................ 65
Microchip Devices Code Protection Feature................................................................................................ 65
Legal Notice................................................................................................................................................. 65
Trademarks.................................................................................................................................................. 66
Quality Management System....................................................................................................................... 66
Worldwide Sales and Service.......................................................................................................................67
© 2019 Microchip Technology Inc.
DS50002907A-page 2

1. Introduction

1.1 Document Layout

The document is organized as follows:
• Chapter 1. “Introduction”
• Chapter 2. “Product Overview” – Important information about the SAM9X60-EK board
• Chapter 3. “Function Blocks” – Specifications of the SAM9X60-EK and high-level description of the major components and interfaces
• Chapter 4. “Installation and Operation” – Instructions on how to get started with the SAM9X60-EK
• Appendix. “Schematics and Layouts” – SAM9X60-EK schematics and layout diagrams

1.2 Recommended Reading

The following Microchip document is available and recommended as a supplemental reference resource:
• SAM9X60 Datasheet. Lit. Number DS60001579
SAM9X60-EK
Introduction
© 2019 Microchip Technology Inc.
DS50002907A-page 3

2. Product Overview

The SAM9X60-EK follows the Microchip MPU strategy for low cost evaluation kits, showcasing all the features that the SAM9X60 MPU can offer.

2.1 SAM9X60-EK Features

Table 2-1. SAM9X60-EK Features
Characteristic Specification Featured Components
Processor 228-ball TFBGA, 11x11 mm, 0.65 mm pitch Microchip SAM9X60
SAM9X60-EK
Product Overview
External clock
Memory
SD/MMC One standard 4-bit SD card interface
USB
CAN Two CAN interfaces Microchip MCP2542
Ethernet One ETH port Microchip KSZ8081
Wi-Fi/BT One optional Wi-Fi® /Bluetooth® interface Slot for Microchip ATWILC3000
Audio One ClassD audio port
Display One 24-bit LCD interface
Camera One 12-bit Image Sensor Interface
IO One expander IO Microchip MCP23008
Debug port
MPU: 24 MHz, 32.768 KHz
Misc. osc.: 25 MHz
One 16-bit, 2-Gbit DDR2
One NAND Flash
One QSPI Flash
One EEPROM
Two stacked Type-A connectors with power switches
One Micro-B USB Device
One J-Link-OB + CDC
One JTAG interface
DSC1001CI5
DSC6083CE2A
Winbond W972GG6KB-25
Micron MT29F08BA
Microchip SST26VF064B
Microchip 24AA02E48
2 * Microchip MIC2025
Embedded J-Link-OB through the CDC interface (ATSAM3U4C TFBGA100)
Board monitor
Expansion
Power management
Board supply From USB A or from external connector
Backup battery SuperCap
© 2019 Microchip Technology Inc.
One RGB (Red, Green, Blue) LED
Four push button switches
One PIO connector
One mikroBUS™ connector
Two power regulators
Two power consumption measurement devices
Hundreds of possible Click extensions featuring Microchip functions inside
Microchip MIC2800, MCP1725
Microchip PAC1934, PAC1710
DS50002907A-page 4

2.2 Evaluation Kit Specifications

CAUTION
Table 2-2. Evaluation Kit Specifications
Characteristic Specification
Board SAM9X60-EK
Board supply voltage External or USB-powered
SAM9X60-EK
Product Overview
Relative humidity 0 to 90% (non-condensing)
Main board dimensions 150 × 125 × 20 mm
RoHS status Compliant
Board identification SAM9X60 Evaluation Kit

2.3 Power Sources

Two options are available to power up the SAM9X60-EK board:
• Powering through an external AC to DC +5V wall adapter connector (J1)
• Powering through the USB Micro-B connector on the USBA port (J7 – default choice)
Table 2-3. Electrical Characteristics
Electrical Parameters Value
Input voltage 5VDC
Maximum input voltage (limits) 6VDC
Maximum 3.3VDC current 300 mA
Operating: 0°C to +70°C Storage: –40°C to +85°C
The SAM9X60-EK board runs at a 3.3V voltage level logic. The maximum voltage that the I/O pins can tolerate is 3.3V. Providing higher voltages (e.g., 5V) to an I/O pin could damage the board.

2.4 Connectors on Board

The fully-featured SAM9X60-EK board integrates multiple peripherals and interface connectors, as shown in the following figures.
© 2019 Microchip Technology Inc.
DS50002907A-page 5
Figure 2-1. SAM9X60-EK Top Connectors
D1
J8
J1
Q5
Q1
R9
R249
R245
R236
R242
R8
R34
R48
R49
FB6
C113
R153
D7
C69
C77
J2
C85D2C88
R128
R91
Y6
C56
C128
C126
R171
R181
J16
R19
R18
VDD_3V3_3 U
C150
U27
R116
C120
Q12
R114
C117
R149
C90
R221
TP4
R225
R224
R231
R230
R218
TP6
R213
C127
VBUS_USBC
Q3
R16
C173
Y10
C152
R235
R238
C2
R10
C6
L1
R7
R250
C176
J7
C4
U6
C122
R94
R93
R84
C58
C116
Q10
Q11
J5
Y2
SW1
R156
R158
R74
R72
SW2
R53
R54
R45
R41
R32
R67
R62
SW3
R97
R98C54
C136
Y8
R162
R110
R111
R109
Y7
C131
D4
R177
C141
C99
J14
FB13
J22
J24
C8
C172
R251
R237
D8
FB1
U1
R11
R29
C18
C1
C19
R246
R234
C148
R239
R258
R256
U2
C5
R4
R13
R12
U4
R243
R233
R241
R257
R47
R36
R35
U9
R265
FB8
C119
R92 R90
C60
R189
J3
R155
U10
J20
C76
C70
Y3
R188
J13
R126
C86
U11
R27
R28
Y1
R197
D3
R20
R119
U5
R22
R24
R21 C27
C25
C23
Y5
C91
R88
R86
R159
R157
U8
R85
R82
R75
R71
R65
R66
R203
R201
R199
Q15
Q14
Q13
U21
C125
C129
C55
U26
R59
R52
R145
R44
R40
R31
R142
R68
R64
R196
U7
R191
R185
J17
R136
R175
J9
R118
R107
C57
R112
R108
R113
C100
R137
R172
FB9
R161
R138
Q7 Q6
D5
J11
R173
R170
R169
Q9 Q8
R174
R182
D6
U24
Y9
U28
R17
Q2
TP9
C149
R1
R6
C106
VDDIOM
C61
VDD_3V3
U32
R117
U20
C124
C123
C121
U19
C118
C115
C114
R187
TP2
R127
R122
R220
R223
R222
C92
C93
R215
R216
R219
R227
R229
R226
R228
U23
TP5
TP7
R26
R190
C105
U17
U15
C103
C97
U14
C104
C102
C101
C130
R160
R176
FB10
C142
C138
R179
R178
FB11
C137
R183
R180
VDDCORE
VBUS_USBA
VBUS_USBB
C9
C3
C20
C22
C7
R148
R150
R33
C12
C11
D9
R132
R133
R79
R80
C29
SW4
R195
R58
R141
R146
U13
U12
C95
C132
R5
R2
Q4
C17
VBUS_JLINK
C171
C151
J18
U3
R96 R95
R154
R89
R87
R37
C179
R259
R260
J19
R130
R124
R152
R81 R77
R69
C75
C62
R70
C24
R194
J21
LD1
VDD_WILC
R207 R202
R105
R104
R135
R134
J6
J10
U22
C134
C133
R139
J12
R3
R15
R240
J23
R83
C53
C59
U31
R115
R123
C26
R212
C96
TP8
C135
J4
U16
VDD_MAIN_5V
Configuration
Jumpers
ISI
Connector
2 x CAN
Connector
CLASSD Audio
Connector
JTAG 20-pin
IDC Connector
UART
DEBUG
JLINK USB
Micro-B
External
Power Jack
MikroBus
USB 2.0
Micro-B
Stacked USB
type A
Ethernet
10/100
4 x User Buttons
I2C and PCM audio header
to/from ATWILC3000
Place to solder the
Wi-Fi / BT Module
SD Card
Connector
Raspberry Pi
Connector
SAM9X60-EK
Product Overview
© 2019 Microchip Technology Inc.
DS50002907A-page 6
Figure 2-2. SAM9X60-EK Bottom Connectors
C156
R247
C13
C63
R121
C84
R125
C51
R129
C50
C40
R208
C98
R164
R253
C167
R23
C34
C28
R101
R100
R102
R264
R14
C175
C10
C155
PAD2
R270
Q16
C82
C73
R232
R186
C67
R192
C42
C33
C43
C45
C143
R63
R50
R57
R55
R43
R39
R144
R168
R166
R261
R263
R262
C170
C178
R266
C177
R248
C168
C165
C163
C164
C161
C160
U29
FB5
PAD1
C16
C14
C162
C153
R244
C157U25
C79 C71
C68
C81
C78
C72
R120
C66
C65
R131
C83
FB2
C64
C35
C37
C36
C32
C49
C47
FB3
C44 C46
C39
R106
R206
R60
R46
R56
R38
R73
R61
R78
C94
R167
R165
R163
C140
C139
R255
C174
R252
C169
C159
C15
C21
C166
C38
C48
C52
C87
C41
R25
R103
R99
R147
R209
R211
C158
C89
C74
C145
C147
PAD4
PAD3
R268
U30
FB7
C154
C146
C80
C31
R30
R204
C144
R200
R143
R51
R42
R76
R140
R214 R217
R210
J15
FB12
R254
LCD
Connector
SAM9X60-EK
Product Overview
Table 2-4. SAM9X60-EK Board Interface Connectors
Connector Interfaces to
J1 External power jack
J4 Standard SDMMC connector
J6 Dual CAN
J7 USB 2.0 Micro-B (USB-A)
J8A Stacked Type-A USB (USB-B)
J8B Stacked Type-A USB (USB-B)
J10 (not populated) ATWILC3000 GPIO
J9 (not populated) ATWILC3000 UART
© 2019 Microchip Technology Inc.
DS50002907A-page 7
SAM9X60-EK
Product Overview
...........continued
Connector Interfaces to
J5 Ethernet 10/100 RJ45 (port 1)
J11 Audio external power
J12 ClassD audio output
J14 mikroBUS socket
J15 LCD connector
J16 External GPIO
J17 ISI Camera Connector
J18 PCB connector for factory-programming the SAM3U/J-Link-OB (not to be used by end user)
J22 USB 2.0 Micro-B, J-Link-OB/J-Link-CDC
J23 JTAG, 20-pin IDC
J24 FTDI connector (UART debugger)

2.5 Default Jumper Settings

Table 2-5. SAM9X60-EK Jumper Settings
Jumper State Function
J2 Closed VDDBU current measurement
J3
J13
J19 (not populated)
J20
J21
Closed Disable the SHDN function and always keep the board powered on
Open (default) Normal behavior, the PMIC can be powered down by the MPU
Closed Booting from on-board memories is permanently disabled
Open (default) Booting from on-board memories is disabled only when SW4 is pressed
Closed
Open (default) Normal SAM3U operation (runs the J-Link interface)
Closed
Open (default)
Closed Disable UART communication (CDC) between MPU and SAM3U
Open (default)
Erase SAM3U firmware (not populated, reserved for factory configuration and should never be used by the end user)
J-Link on-board interface is disabled. MPU debugging is done through J23, the 20­pin SAM-ICE™ connector (i.e., an external JTAG interface is required)
J-Link on-board interface is enabled. MPU debugging is done through it (i.e., using the SAM3U MCU and the micro USB connector J22)
Enable UART communication (CDC) between MPU and SAM3U (PD20 port must be high as well)

2.6 Kit Content

The SAM9X60 evaluation kit includes the following:
• The SAM9X60-EK board
• USB-A to USB Micro-B cable
• 50-position FFC/FPC cable
© 2019 Microchip Technology Inc.
DS50002907A-page 8

3. Function Blocks

SAM9X60
600 MHz ARM926EJ-S CPU
BGA 228
On Board Memories
NAND Flash
4Gb (512M x 8)
MT29F4G08ABAEAWP
QSPI Flash
64Mb (8M x 8)
SST26VF064B
I2C EEPROM
2Kb (256 x 8)
24AA025E48
DDR2 SDRAM
2Gb
W972GG6KB
External connections
ETHERNET PHY
RMII
KSZ8081RNAIA
RJ45
Connector
Camera
ISI
Connector
LCD
Connector
2 x CAN
2 x MCP2542
2 x CAN
2 x Connector
CLASS D
Audio Amplier
Analog Audio
Connector
RASPBERRY PI
Connector
SD Card
Connector
Wi-Fi / BLE
ATWILC3000
mikroBUS
Connector
USB A,B&C
Connectors
RGB LED'sUSER Buttons
SAM9X60 - EVALUATION KIT
Power Supply
5V INPUT
Connector
PMIC
MIC2800
Voltage & Current
Measurement
PAC1710 PAC1934
Backup Power
3V3 SUPERCAP
Program and debug
UART
DEBUG
Connector
On Board
Programmer
ATSAM3U4CA
J-TAG
Connector
USBA
SAM-BA
This section covers the specifications of the SAM9X60-EK and provides a high-level description of the board's major components and interfaces. This document is not intended to provide detailed documentation about the processor or about any other component used on the board. It is expected that the user will refer to the appropriate documents of these devices to access detailed information.
Figure 3-1. SAM9X60-EK Block Diagram
SAM9X60-EK
Function Blocks

3.1 Power Supply Topology and Power Distribution

budget for all the devices on the board and a correct power-up sequence for the MPU. The power-up and power­down sequences indicated in the SAM9X60 datasheet must be respected for a reliable operation of the device.

3.1.1 Input Power Options

The SAM9X60-EK board can be powered through:
This section describes the implementation and the circuitry that ensures adequate voltage stability and current
The +5V from the wall adapter is protected through an NCP349 positive overvoltage controller switch. The controller is able to disconnect the system from its output pin when incorrect input operating conditions are detected (5.83V max).
The USB-powered operation comes from the USB device port connected to a PC or a 5VDC supply. The USB supply is enough to power the board in most applications. It is important to note that when the USB supply is used, the USB port has limited power. If USB Host port is required for the application, it is recommended that the external DC supply be used.
© 2019 Microchip Technology Inc.
• an external AC to DC +5V wall adapter connected via a 2.1 mm center-positive plug into the power jack of the board (J1). The recommended output capacity of the power adapter is 2A,
• USB port A (J7).
DS50002907A-page 9
0.1uF 50V 0402
C3
0.1uF 50V 0402
C9
GND
IN
1
IN_PAD
7
EN
6
GND
2
FLAG
3
OUT2
5
OUT1
4
NCP349MNAETBG
U1
2
3
1
2.1mm EJ508A
J1
VDD_MAIN_5V_
GND
EXT_5V DC_5V
180R 0603
FB1
USB_5V
0.1uF 50V 0402
C7
2
71 6
SIA923AEDJ-T1-GE3
Q1A
5
8 4 3
SIA923AEDJ-T1-GE3
Q1B
2
71 6
SIA923AEDJ-T1-GE3
Q2A
5
8 4 3
SIA923AEDJ-T1-GE3
Q2B
GND GND GND GND
GND GND GND
100µF 16V Radial, Can
C4
GND
USBA_VBUS_5V
10uF 25V 1206
C1
10uF 25V 1206
C2
10uF 25V 1206
C8
100k 0402 5%
R2
100k 0402 5%
R3
100k 0402 5%
R5
PIC101 PIC102
COC1
PIC201 PIC202
COC2
PIC301 PIC302
COC3
PIC401 PIC402
COC4
PIC701 PIC702
COC7
PIC801 PIC802
COC8
PIC901 PIC902
COC9
PIFB101
PIFB102
COFB1
PIJ101
PIJ102
PIJ103
COJ1
PIQ101
PIQ102
PIQ106
PIQ107
COQ1A
PIQ103
PIQ104
PIQ105
PIQ108
COQ1B
PIQ201
PIQ202
PIQ206
PIQ207
COQ2A
PIQ203
PIQ204
PIQ205
PIQ208
COQ2B
PIR201
PIR202
COR2
PIR301
PIR302
COR3
PIR501
PIR502
COR5
PIU101
PIU102
PIU103
PIU104 PIU105
PIU106
PIU107
COU1
PIC201
PIC301
PIQ101
PIQ202
PIQ205
PIR202
PIU104 PIU105
PIC101
PIJ101
PIU101 PIU107
PIC102
PIC202
PIC302
PIC402
PIC702
PIC802
PIC902
PIJ102
PIR201
PIR301
PIR501
PIU102
PIU106
PIJ103
PIQ102
PIQ105
PIQ203
PIQ206
PIQ207
PIQ208
PIR302
PIQ103
PIQ106
PIQ107
PIQ108
PIU103
PIC801
PIC901
PIFB102
PIQ201
PIR502
PIC701
PIFB101
PIC401
PIQ104
PIQ204
SAM9X60-EK
Function Blocks
The switch between the two powering options is made by four transistors that ensure the separation between the two when both are plugged. The switch prioritizes powering from the wall adapter to maximize power transfer.
The following figure shows the input power supply topology.
Figure 3-2. Input Power Options
Note:  USB-powered operation eliminates additional wires and batteries. It is the preferred mode of operation for any
project that requires only a 5V source at up to 500 mA.

3.1.2 Power Management Integrated Circuit

The MIC2800 is a high-performance power management IC providing three output voltages with maximum efficiency. Integrating a 2-MHz DC/DC converter with an LDO post-regulator, the MIC2800 gives two high-efficiency outputs with a second, 300 mA LDO for maximum flexibility. The DC-to-DC converter uses small values of L and C to reduce board space while still retaining efficiency over 90% at load currents up to 600 mA. For more information about the MIC2800, refer to the product web page.
Each LDO has an independent Enable (EN) pin thus allowing a proper power-up sequence for the MPU. The 20 KΩ resistor in series and the 0.1 µF capacitor in parallel with the EN1 input make a low-pass filter and introduce the necessary delay between the 3.3V and 1.15V rails needed for the proper operation of the MPU. The diode (D1 in
Figure 3-3) ensures that the capacitor fast discharges during the power-down sequence.
Detailed information on the SAM9X60 MPU power supplies and power-up/down considerations are described in section “Electrical Characteristics” in the SAM9X60 device datasheet (see 1.2 Recommended Reading).
The MIC2800-G8S comes preset to supply all the voltage rails needed by the system:
• 1.8V DC/DC supplies SAM9X60 DDR2 pads (VDDIOM) and devices.
• 1.15V LDO1 supplies SAM9X60 Core (VDDCORE).
• 3.3V LDO2 supplies SAM9X60 I/O pads.
The figure below shows the power management scheme.
© 2019 Microchip Technology Inc.
DS50002907A-page 10
Figure 3-3. Power Management Integrated Circuit
GND GNDGND GND
VDD_1V15
VDD_MAIN_5V
2.2uH
L1
GND
GNDGND
VDD_1V8
GND
GND
GND
MIC2800_nRST
GND
0.1uF 50V 0402
C17
0.1uF 50V 0402
C18
0.1uF 50V 0402
C19
LOWQ
1
BIAS
2
SGND
3
PGND
4
SW
5
VIN
6
VIN
7
LDO2
8
FB
9
LDO
10
LDO1
11
POR
12
CSET
13
CBYP
14
EN1
15
EN2
16
U3
MIC2800-G8SYML-TR
600mA
300mA 300mA
VDD_3V3_LDO
POWER_EN
10uF 25V 1206
C10
10uF 25V 1206
C11
10uF 25V 1206
C12
10uF 25V 1206
C21
10uF 25V 1206
C22
10nF 16V 0402
C20
1N4148
D1
20k 0402 1%
R11
100k 0402 5%
R29
PIC1001
PIC1002
COC10
PIC1101
PIC1102
COC11
PIC1201
PIC1202
COC12
PIC1701 PIC1702
COC17
PIC1801 PIC1802
COC18
PIC1901 PIC1902
COC19
PIC2001 PIC2002
COC20
PIC2101 PIC2102
COC21
PIC2201 PIC2202
COC22
PID101
PID102
COD1
PIL101
PIL102
COL1
PIR1101
PIR1102
COR11
PIR2901
PIR2902
COR29
PIU301
PIU302
PIU303
PIU304
PIU305
PIU306
PIU307
PIU308
PIU309
PIU3010
PIU3011
PIU3012 PIU3013
PIU3014
PIU3015
PIU3016
COU3
PIC1002
PIC1102
PIC1202
PIC1702
PIC1802
PIC1902
PIC2002
PIC2102
PIC2202
PIU303
PIU304
PIU3012
POMIC28000nRST
PIC1701
PIU3014
PIC1801
PIU302
PIC1901
PID101
PIR1102
PIU3015
PIC2001
PIU3013
PIL101
PIU305
PIR2901
PIU301
PID102
PIR1101
PIU3016
NLPOWER0EN
PIC1101
PIC1201
PIL102
PIU309
PIU3010
PIC2201
PIU3011
PIC2101
PIU308
PIC1001
PIR2902
PIU306
PIU307
POMIC28000nRST
10k 0402 5%
R19
1k 0402 5%
R18
12
HDR-2.54 Male 1x2
J3
GND GND
GND
VDD_MAIN_5V VDD_MAIN_5V
SHDN
POWER_EN
Shunt 2.54mm 1x2
JP2
GND
MIC2800_nRST
STARTB
VDD_3V3
100k 0402 5%
R15
100k 0402 5%
R16
100k 0402 5%
R17
3
1
2
BSS138N
Q3
3
1
2
BSS138N
Q4
3
1
2
BSS138N
Q5
PIJ301
PIJ302
COJ3
COJP2
PIQ301
PIQ302
PIQ303
COQ3
PIQ401
PIQ402
PIQ403
COQ4
PIQ501
PIQ502
PIQ503
COQ5
PIR1501
PIR1502
COR15
PIR1601
PIR1602
COR16
PIR1701
PIR1702
COR17
PIR1801
PIR1802
COR18
PIR1901
PIR1902
COR19
PIJ302
PIQ302
PIQ402
PIQ502
PIQ503
PIR1701
POMIC28000nRST
PIJ301
PIR1801
PIQ301
PIR1901
PIQ403
PIR1601
NLPOWER0EN
PIR1902
POSHDN
PIQ303
PIQ401
PIQ501
PIR1501
PIR1802
NLSTARTB
PIR1702
PIR1502
PIR1602
POMIC28000nRST
POSHDN
WARNING

3.1.3 Shutdown Circuitry

The processor can assert the SHDN signal to shut down the PMIC and enter Power-down mode. This is done by pulling both enable pins of the PMIC to GND through a Field Effect Transistor (FET) scheme.
Jumper J3 must not be set to enable this functionality. By setting jumper JP2/J3, the user can shut down the MPU without powering down its power rails.
Figure 3-4. Shutdown Circuitry
SAM9X60-EK
Function Blocks

3.1.4 Battery Unit

A 3.3V battery (supercapacitor) is implemented to permanently maintain the VDDBU voltage.
This function allows the user to shut down the MPU and the system, thus entering a low power mode, and still keep the custom configuration that was previously set in the MPU backup area. While in Shut-down mode, the board can be woken up by action on the SW2 button (WAKE UP), which signals the MPU to resume operations.
Jumper JP1/J2 must be in place for proper operation of the MPU, and can be removed if the user wants to bring the MPU back to the initial configuration, by resetting the General Purpose Backup Registers (GPBR).
© 2019 Microchip Technology Inc.
Make sure the board is powered off before removing the JP1/J2 jumper.
DS50002907A-page 11
Figure 3-5. Battery Unit
220mF
3.3V P8.3L11.7D6.8H1.8
C23
1
2
3
BAT54C
D2
PMEG6010ER
D3
VDDBU
GND
Shunt 2.54mm 1x2
JP1
VDD_3V3
12
HDR-2.54 Male 1x2
J2
100R 0402 1%
R20
PIC2301 PIC2302
COC23
PID201
PID202
PID203
COD2
PID301
PID302
COD3
PIJ201
PIJ202
COJ2
COJP1
PIR2001
PIR2002
COR20
PIC2302
PIC2301
PID202
PIR2002
PID203
PIJ202
PID302
PIR2001
PID201
PID301
PIJ201
I2C ADR : 1001_101[R/W]
GND GND GND
10k 0402 5%
R4
VDD_3V3
VDD_MAIN_5V_ VDD_MAIN_5V
PAC1710_TWCK PAC1710_TWD
VDD_MAIN_5V
GND
PAC1710_INT
1 2
3
4
0.01R 1206
1%
0.25W
R1
SENSE+
1
SENSE-
2
NC
3
NC
4
GND
5
ADDR_SEL
6
ALERT#
7
SMDATA
8
SMCLK
9
VDD
10
PAD
11
PAC1710
U2
5V_P 5V_N
TP LOOP Black TH
TP1
4.7uF 10V 0402
C5
0.1uF 50V 0402
C6
VDD_3V3_LDO
100R 0402 1%
R6
PIC501
PIC502
COC5
PIC601
PIC602
COC6
PIR101
PIR102
PIR103
PIR104
COR1
PIR401
PIR402
COR4
PIR601
PIR602
COR6
PITP101
COTP1
PIU201
PIU202
PIU203
PIU204
PIU205
PIU206
PIU207
PIU208
PIU209
PIU2010
PIU2011
COU2
PIVDD0MAIN05V01
COVDD0MAIN05V
PIR104
PIU202
NL5V0N
PIR103
PIU201
NL5V0P
PIC501
PIC601
PIR602
PITP101
PIU205
PIU2011
PIR601
PIU206
PIU203
PIU204
PIR401
PIU207
POPAC17100INT
PIU209
POPAC17100TWCK
PIU208
POPAC17100TWD
PIR402
PIC502
PIC602
PIU2010
PIR102
PIVDD0MAIN05V01
PIR101
POPAC17100INT POPAC17100TWCK
POPAC17100TWD

3.1.5 Current Measurement

Two Microchip DC power/energy monitors are embedded on the SAM9X60-EK board:
• one single high-side current sense monitor PAC1710
• one four-channel current sense monitor PAC1934
Both chips communicate with the MPU via a Two-wire Interface (TWI) and both output their ALERT# signal to a port expander.
The PAC1710 is a single high-side bidirectional current sensing monitor with precision voltage measurement capabilities. The power monitor measures the voltage developed across an external sense resistor to represent the high-side current of a battery or voltage regulator. The PAC1710 also measures the SENSE+ pin voltage and calculates average power over the integration period. The PAC1710 can be programmed to assert the ALERT# pin when high and low limits are exceeded for current sense and bus voltage. For more information about the PAC1710, refer to the product web page.
One current sense resistor is populated on board for measuring voltage and current on the main 5V power rail.
Figure 3-6. PAC1710 Current Measurement
SAM9X60-EK
Function Blocks
Table 3-1. PAC1710 Signal Descriptions
PIO Signal Name Shared PIO Signal Description
PA31 PAC1710_TWCK Power TWI TWI clock
PA30 PAC1710_TWD Power TWI TWI data
PAC1710_INT Interrupt – to port expander U6
The PAC1934 is a four-channel power/energy monitor with current sensor amplifier and bus voltage monitors that feed high resolution ADCs. Digital circuitry performs power calculations and energy accumulation. The PAC1934 enables energy monitoring with integration periods from 1 ms to up to 36 hours. Bus voltage, sense resistor voltage, and accumulated proportional power are stored in registers for retrieval by the system master or embedded controller. For more information about the PAC1934, refer to the product web page.
© 2019 Microchip Technology Inc.
DS50002907A-page 12
I2C ADR : 0010_111[R/W]
8.45k 0603 1%
R14
10k 0402 5%
R13
10k 0402 5%
R12
PAC1934_TWCK
PAC1934_TWD
VDDCORE
VDDIOM
VDD_3V3
PAC1934_INT
1 2
3
4
0.01R 1206
1%
R7
1 2
3
4
0.01R 1206
1%
R8
1 2
3
4
0.01R 1206
1%
R9
SENSE1_P
SENSE1_N
SENSE2_N
SENSE2_P
SENSE3_P
SENSE3_N
4.7uF 10V 0402
C13
0.1uF 50V 0402
C14
4.7uF 10V 0402
C15
0.1uF 50V 0402
C16
GND
GND
GND
VDD_3V3_LDOVDD_3V3_LDO
ADDRSEL
6
SLOW/ALERT
1
VDD
2
GND
3
VDD/IO
15
SENSE3-
7
SENSE3+
8
SENSE4-
9
SENSE4+
10
SENSE1+
11
SENSE1-
12
SENSE2+
13
SENSE2-
14
PWRDN
16
SM_DATA
5
SM_CLK
4
EP
17
U4 PAC1934
VDD_3V3_LDO
VDD_1V15
VDD_1V8
VDD_3V3
VDDIOM
VDDCORE
1 2
3
4
0.01R 1206
1%
R10
SENSE4_P
SENSE4_N
VDD_3V3 VDD_3V3_MPU
PIC1301
PIC1302
COC13
PIC1401
PIC1402
COC14
PIC1501
PIC1502
COC15
PIC1601
PIC1602
COC16
PIR701
PIR702
PIR703
PIR704
COR7
PIR801
PIR802
PIR803
PIR804
COR8
PIR901
PIR902
PIR903
PIR904
COR9
PIR1001
PIR1002
PIR1003
PIR1004
COR10
PIR1201
PIR1202
COR12
PIR1301
PIR1302
COR13
PIR1401
PIR1402
COR14
PIU401
PIU402
PIU403
PIU404
PIU405
PIU406
PIU407
PIU408
PIU409
PIU4010
PIU4011
PIU4012
PIU4013
PIU4014
PIU4015
PIU4016
PIU4017
COU4
PIVDD03V301
COVDD03V3
PIVDDCORE01
COVDDCORE
PIVDDIOM01
COVDDIOM
PIC1301
PIC1401
PIC1501
PIC1601
PIR1401
PIU403 PIU4017
PIR1301
PIU4016
PIR1402
PIU406
PIR1201
PIU401
POPAC19340INT
PIU404
POPAC19340TWCK
PIU405
POPAC19340TWD
PIR704
PIU4012
NLSENSE10N
PIR703
PIU4011
NLSENSE10P
PIR804
PIU4014
NLSENSE20N
PIR803
PIU4013
NLSENSE20P
PIR904
PIU407
NLSENSE30N
PIR903
PIU408
NLSENSE30P
PIR1004
PIU409
NLSENSE40N
PIR1003
PIU4010
NLSENSE40P
PIR701
PIR801
PIR901
PIR1002
PIC1302
PIC1402
PIC1502
PIC1602
PIR1001
PIR1202
PIR1302
PIU402
PIU4015
PIR902
PIVDD03V301
PIR802
PIVDDCORE01
PIR702
PIVDDIOM01
POPAC19340INT
POPAC19340TWCK
POPAC19340TWD
SAM9X60-EK
Function Blocks
Four current sense resistors are populated on board for measuring voltage and current consumption on the power rails:
• 3.3V VDD_3V3_MPU - MPU on the 3.3V rail
• 3.3V VDD_3V3_SYS - rest of the system on the 3.3V rail
• 1.8V VDDIOM - MPU and DDR2 memory
• 1.15V VDDCORE – MPU core
Figure 3-7. PAC1934 Current Measurement
Table 3-2. PAC1934 Signal Descriptions
PIO Signal Name Shared PIO Signal Description
PA31 PAC1934_TWCK Power TWI TWI clock
PA30 PAC1934_TWD Power TWI TWI data
PAC1934_INT Interrupt – to port expander U6

3.2 Processor

The SAM9X60 is a high-performance, ultra-low power ARM926EJ-S CPU-based embedded microprocessor (MPU) running up to 600 MHz, with support for multiple memories such as SDRAM, LPSDRAM, LPDDR, DDR2, QSPI and e.MMC Flash. The device integrates powerful peripherals for connectivity and user interface applications, and offers security functions (tamper detection, etc.), TRNG, as well as high-performance crypto accelerators for AES and SHA.
Refer to the SAM9X60 datasheet for more information (see 1.2 Recommended Reading).

3.2.1 Power Supply

The PMIC (main regulator) provides all power supplies required by the SAM9X60 device:
• 1.15V for VDDCORE
© 2019 Microchip Technology Inc.
Decoupling capacitors are placed close to the MPU power pins to stabilize the voltage rails.
• 1.8V for VDDIOM
• 3.3V for VDDIOP0, VDDIOP1, VDDANA, VDDNF, VDDQSPI, VDDIN33 and VDDBU
DS50002907A-page 13
Figure 3-8. Processor Power Supplies
GND
0.1uF16V0201
C32
0.1uF16V0201
C33
SAM9X60 P OWER SUPPLY
4.7uF10V0402
C31
VDDCORE
L6
VDDCORE
F6
VDDCORE
F11
VDDIOM
G14
VDDIOM
C10
VDDIOM
C13
VDDANA
C4
VDDIN33
P13
VDDOUT25
P10
VDDIN33
L11
GND
J8
GND
E7
GND
G12
GNDANA
B4
GNDIN33
R13
VDDNF
K14
VDDIOP0
G3
GND
E10
GND
B13
GND
K5
GND
G5
GND
N15
VDDQSPI
C7
VDDIOP0
K3
GND
H8
GND
H9
GNDIN33
M10
GND
K12
GND
T16
GND
A1
GND
A16
GND
T1
VDDBU
P7
GND
M7
VDDIOP1
N3
GND
N2
U5G
SAM9X6_TFBGA-228
VDDOUT25
VDDBU
VDDCORE
VDDIOM
0.1uF16V0201
C34
0.1uF16V0201
C36
0.1uF16V0201
C37
0.1uF16V0201
C38
0.1uF16V0201
C41
0.1uF16V0201
C42
0.1uF16V0201
C43
0.1uF16V0201
C44
0.1uF16V0201
C45
0.1uF16V0201
C46
0.1uF16V0201
C48
0.1uF16V0201
C49
4.7uF10V0402
C47
0.1uF16V0201
C50
0.1uF16V0201
C51
GND
4.7uF10V0402
C35
VDDIN33
VDDIN33
2.2uF10V0402
C52
4.7uF10V0402
C40
4.7uF10V0402
C39
0R 0402
R30
VDD_3V3_MPU
VDD_3V3_MPU
SAM9X60-EK
Function Blocks

3.2.2 Main Configuration and Control

This block depicts the main block for processor configuration and control:
• XIN and XOUT are the Main Clock Oscillator input/output.
• XIN32 and XOUT32 are the Slow Clock Oscillator input/output.
• SHDN is an output signal used to enable and disable an external power supply circuit.
• WKUP is an event detection input pin used to wake up the processor from Shutdown state.
• JTAGSEL is an input that when pulled high enables the JTAG boundary scan.
• TCK, TDI, TDO, TMS and RTCK are used for JTAG communication.
• nRST is the processor main reset input.
• HHSD_A/B/C are the three USB ports embedded inside the MPU.
• RTUNE is used for USB external tuning.
• TST input is reserved for processor manufacturing tests.
• ADVREFP and ADVREFN are the positive and negative reference points for the embedded analog comparator. A small low-pass filter is placed to reduce the input noise and improve accuracy.
© 2019 Microchip Technology Inc.
DS50002907A-page 14
Figure 3-9. Processor Main Configuration and Control
JTAG_TCK
JTAG_TDI JTAG_TDO JTAG_TMS
JTAG_RTCK
USBA_N
USBA_P
USBB_N
USBB_P
USBC_N
USBC_P
0R 0402
R26
VDDBU
5.62k
0402 1%
R23
SHDN
WAKE_UP
XIN XOUT
XIN32 XOUT3 2
GND
GND
SAM9X60 CONFIG
GND
1uF 10V 0201
C28
10R 0201 1%
R25
0R 0402
R22
DNP
VDD_3V3_MPU
MPU_nRST
XIN
R10
XOUT
T10
XIN32
T9
XOUT32
R9
SHDN
R11
WKUP
T11
JTAGSEL
P9
nRST
R1
TST
J9
HHSDPA
T12
HHSDMA
R12
HHSDPB
T13
HHSDMB
T14
HHSDPC
P12
HHSDMC
N12
TCK
R3
TDI
F3
TDO
H5
TMS
F5
RTCK
T2
ADVREFP
D5
RTUNE
P11
ADVREFN
C5
U5F
SAM9X6_TFBGA-228
0.1uF 50V 0402
C29
GND
TP2
VDD_3V3
GND
XIN
GND
24MHz 18pF
ABM8G-24.000MHZ-18-D2Y-T
Y1
DNP
27pF
0402
C24
DNP
27pF0402
C25
DNP
1M 0402 5%
R21
DNP
STB
1
GND
2
OUT
3
VDD
4
24MHz DSC1001CI5-024.0000
Y3
GND
XOUT
0R 0402
R28
32.768Khz ABS06-32.768KHZ-T
Y2
GND
XIN32
XOUT32
20pF
0402
C26
20pF0402
C27
1M 0402 5%
R24
DNP
0R 0402
R27
DNP
0R 0402
R91
DNP
XIN
XOUT
51R 0402
R149

3.2.3 Clock Circuitry

The embedded MPU generates its necessary clocks based on two oscillators: one slow clock (SLCK) oscillator running at 32.768 kHz and one main clock oscillator running at 24 MHz.
The main clock oscillator is implemented with a MEMS (Micro Electro-Mechanical System) device DSC1001.
For evaluation purposes, we leave users the freedom to mount a crystal instead, using the PCB footprint reservation (Y1). In that case, resistors R149 and R28 should be removed, resistors R27 and R91 should be populated and capacitors C24 and C25 should be populated with the appropriate load capacitance for the selected crystal.
Figure 3-10. Processor Clock Circuitry
SAM9X60-EK
Function Blocks
© 2019 Microchip Technology Inc.
DS50002907A-page 15

3.2.4 Reset Circuitry

MIC2800_nRST
JTAG_nRST
100R 04021%
R185
100R 04021%
R190
100R 04021%
R191
USER_nRST
MPU_nRST
DDR_A2 DDR_A3 DDR_A4 DDR_A5 DDR_A6 DDR_A7 DDR_A8 DDR_A9 DDR_A10 DDR_A11
DDR_A13 DDR_A14 DDR_A15
DDR_D3 DDR_D6 DDR_D4 DDR_D1 DDR_D5 DDR_D2 DDR_D7 DDR_D0 DDR_D12 DDR_D15 DDR_D13 DDR_D8 DDR_D9 DDR_D10 DDR_D14 DDR_D11
DDR_DQM0 DDR_DQM1
DDR_DQS0_P DDR_DQS0_N
DDR_DQS1_P DDR_DQS1_N
DDR_RAS DDR_CAS DDR_WE
DDR_CS DDR_CLK_P DDR_CLK_N
DDR_CKE
22pF 50V 0402
C62
DDR_A16 DDR_A17 DDR_A18
20k 0402 1%
R119
GND
DDR_SDA10
DIFF100 DIFF100
DIFF100 DIFF100
DIFF100 DIFF100
SDCKn
B14
SDCK
A15
SDCKE
F13
nWR0
E8
SDA10
D12
nRD
F12
nWR1
A10
DDR_CAL
B8
A1
G16
A15
G15
A8
F16
A4
B12
A0
B10
A13
B11
A10
C11
A6
A12
A2
A13
A17
F14
A12
A11
A19
H14
A16
E14
A18
C16
A3
D15
A7
B16
A5
E11
A14
C15
A9
D14
A11
E13
D10
F9
D9
D8
D13
B9
D14
D11
D6
J16
D11
A9
D8
G9
D12
F10
D3
H11
D4
J14
D1
H10
D7
J13
D0
H16
D2
H15
D5
J11
D15
C9
DDR_VREF
A14
nCS1
E16
nCS0
F15
DQS1
D9
SDWE
D16
nDQS1
E9
RAS
E15
nDQS0
H13
DQS0
H12
CAS
C12
DQM1
C8
DQM0
G11
nWR3
L14
U5E
SAM9X6_TFBGA-228
DDR_VREF
Three reset sources for the SAM9X60 MPU are placed on the board:
• Power-on Reset from the power management unit MIC2800
• User push button reset SW3
• External JTAG or J-Link-OB reset from an in-circuit emulator
Figure 3-11. Processor Reset Circuitry

3.2.5 DDR Controller (MPDDRC)

The SAM9X60 embeds a Multi-Port DDR-SDRAM Controller (MPDDRC) to drive DDR2 and LPDDR1 memories.
Note the following regarding the command and control signal connections between the DDR Controller and the DDR Memory:
• Addresses A0, A1 and A12 are not used on the controller side.
• Addresses A2 to A11 are connected to A0 to A9 on the memory side.
• Signal SDA10 must be connected to A10.
• Addresses A13 to A15 are connected to the last three addresses on the memory side.
• A16 to A18 are connected to BA0 to BA2.
It is recommended to double-check the design schematic against the information provided in the datasheet.
Figure 3-12. Processor DDR Controller
SAM9X60-EK
Function Blocks
© 2019 Microchip Technology Inc.
DS50002907A-page 16
4.7k 0201 1%
R120
4.7k 0201 1%
R121
0.1uF 16V 0201
C63
0.1uF 16V 0201
C66
GND
4.7uF 10V 0402
C65
GND
VDDIOM
DDR_VREF
LCD_D17_PC17 LCD_D18_PC18 LCD_D19_PC19 LCD_D20_PC20 LCD_D21_PC21 LCD_D22_PC22 LCD_D23_PC23
LCD_PCLK_PC30
LCD_VSYNC/CS_PC27
LCD_HSYNC/WE_PC28
LCD_DATA_ENABLE_PC29
LCD_IRQ1_PC25
LCD_PWM_PC26
FLEXCOM5_IO1_RX_PA21 FLEXCOM5_IO0_TX_PA22
SDMMC0_DAT2_PA19
SDMMC0_CMD_PA16
SDMMC0_DAT3_PA20
SDMMC0_CLK_PA17
SDMMC0_DAT0_PA15
SDMMC0_DAT1_PA18
SDMMC0_CD_PA23
CLASSD_L0_PA24 CLASSD_L1_PA25 CLASSD_L2_PA26 CLASSD_L3_PA27
WILC3000_ENABLE_PA29
WILC3000_INTERRUPT_PA28
CAN/FLEXCOM_RX_PA06
CAN/FLEXCOM_TX_PA05
FLEXCOM0_IO0_PA00 FLEXCOM0_IO1_PA01
FLEXCOM6_TWD_PA30
FLEXCOM6_TWCK_PA31
CAN/DBGU_TX_PA10
CAN/DBGU_RX_PA09
PA02 PA03 PA04
PA07 PA08
PA11 PA12 PA13 PA14
PC31
SAM9X60 PORT PA
SAM9X60 PORT PC
LCD_D12_ISI_PCK_PC12
LCD_D13_ISI_VSYNC_PC13
LCD_D14_ISI_HSYNC_PC14
LCD_D15_ISI_MCK_PC15
LCD_D0_ISI_D0_PC00
LCD_D2_ISI_D2_PC02
LCD_D4_ISI_D4_PC04
LCD_D6_ISI_D6_PC06
LCD_D8_ISI_D8_PC08
LCD_D10_ISI_D10_PC10
LCD_D1_ISI_D1_PC01
LCD_D3_ISI_D3_PC03
LCD_D5_ISI_D5_PC05
LCD_D7_ISI_D7_PC07
LCD_D9_ISI_D9_PC09
LCD_D11_ISI_D11_PC11
LCD_ISI_ENABLE_PC24
LCD_D16_ISI_nRST_PC16
PA0
P2
PA1
M3
PA2
P1
PA3
L3
PA4
N1
PA5
L4
PA6
M2
PA7
K6
PA8
M1
PA9
G8
PA10
L2
PA11
H7
PA12
L1
PA13
J6
PA14
K1
PA15
H6
PA16
K2
PA17
J3
PA18
J1
PA19
J5
PA20
J2
PA21
G6
PA22
G1
PA23
J4
PA24
F8
PA25
H1
PA26
F7
PA27
H2
PA28
F1
PA29
H3
PA30
G2
PA31
H4
U5A
SAM9X6_TFBGA-228
PC0
M4
PC1
P4
PC2
N5
PC3
P5
PC4
L5
PC5
R4
PC6
M6
PC7
T3
PC8
N8
PC9
T4
PC10
P6
PC11
N6
PC12
R5
PC13
L7
PC14
T5
PC15
J7
PC16
R6
PC17
K8
PC18
T6
PC19
L8
PC20
P8
PC21
M8
PC22
R7
PC23
K9
PC24
R8
PC25
L9
PC26
T8
PC27
M9
PC28
N9
PC29
L10
PC30
T7
PC31
M13
U5C
SAM9X6_TFBGA-228
SAM9X60-EK
Function Blocks
The MPDDRC I/Os embed an automatic impedance matching control to avoid overshoots and to reach the best performance levels depending on the bus load and external memories. A serial termination connection scheme, where the driver has an output impedance matched to the characteristic impedance of the line, is used to improve signal quality and reduce EMI. This is done using the ZQ calibration procedure to calibrate the SAM9X60 DDR I/O drive strength. The pin name where the ZQ resistor must be connected is DDR_CAL and, as indicated in the SAM9X60 datasheet for DDR2 case, the resistor value is 20 KOhms.
The DDR_VREF pin serves as a voltage reference input for the DDR I/Os when DDR2 or LPDDR external SDRAM memories are used.
Figure 3-13. DDR Reference Voltage

3.2.6 PIOs

The following sections depict all the signals connected to the SAM9X60 MPU ports.
See Table 3-3 for details about each port’s functions.
Figure 3-14. Processor PIOs PA and PC
© 2019 Microchip Technology Inc.
DS50002907A-page 17
LCD_IRQ2_PB17
ETH0_TXCK_PB04
ETH0_TX0_PB09
ETH0_TXEN_PB07
ETH0_TX1_PB10
ETH0_RX1_PB01
ETH0_RX0_PB00
ETH0_RXER_PB02
ETH0_RXDV_PB03
ETH0_MDC_PB06
ETH0_MDIO_PB05
ETH0_IRQ_PB08
NAND_IO0_PD06 NAND_IO1_PD07 NAND_IO2_PD08 NAND_IO3_PD09 NAND_IO4_PD10 NAND_IO5_PD11 NAND_IO6_PD12 NAND_IO7_PD13
NAND_CLE_PD03
NAND_ALE_PD02
NAND_nWE_PD01
NAND_nRE_PD00
NAND_nCS_PD04
NAND_RB_PD05
USBB_EN_5V_PD15 USBC_EN_5V_PD16
MBUS_AD4_PB15
USBA_VBUSDETECT_PB16
MBUS_RST_PB14
NRST_PB25
SEL_FNCT1_PD19 SEL_FNCT2_PD20
MCP23008_INT_PD17
PB19 PB20 PB21 PB22 PB23 PB24
MBUS_INT_PB18
PB11 PB12 PB13
CAN_STBY_PD21
SAM9X60 PORT PB
SAM9X60 PORT PD
LCD_ID_PD14
USER_BUTTON_PD18
PB0
F4
PB1
C1
PB2
D3
PB3
D1
PB4
E3
PB5
E1
PB6
D2
PB7
A5
PB8
E6
PB9
A2
PB10
A3
PB11
D6
PB12
C2
PB13
A4
PB14
F2
PB15
B5
PB16
B3
PB17
B1
PB18
E4
PB19
C6
PB20
A6
PB21
A7
PB22
B7
PB23
B6
PB24
A8
PB25
E2
U5B
SAM9X6_TFBGA-228
PD0
R14
PD1
T15
PD2
P15
PD3
N14
PD4
R16
PD5
N11
PD6
K16
PD7
J12
PD8
K15
PD9
J10
PD10
L16
PD11
K11
PD12
L15
PD13
J15
PD14
L12
PD15
M16
PD16
M14
PD17
N16
PD18
L13
PD19
P16
PD20
M11
PD21
M15
U5D
SAM9X6_TFBGA-228
22R 0402 1%
R31
22R 0402 1%
R32
22R 0402 1%
R38
22R 0402 1%
R39
22R 0402 1%
R40
22R 0402 1%
R41
SDMMC1_WILC3000_DAT3_PA04
SDMMC1_WILC3000_DAT2_PA03
SDMMC1_WILC3000_DAT1_PA02
SDMMC1_WILC3000_DAT0_PA11
SDMMC1_WILC3000_CMD_PA12
SDMMC1_WILC3000_CK_PA13
FLEXCOM5_IO4_BT_RTS_PA07
FLEXCOM5_IO3_BT_CTS_PA08
PA02
PA03
PA04
PA07
PA08
PA11
PA12
PA13
PA14
22R 0402 1%
R42
22R 0402 1%
R43
22R 0402 1%
R44
22R 0402 1%
R45
22R 0402 1%
R46
22R 0402 1%
R50
22R 0402 1%
R51
22R 0402 1%
R52
22R 0402 1%
R53
22R 0402 1%
R54
22R 0402 1%
R55
22R 0402 1%
R56
22R 0402 1%
R57
22R 0402 1%
R58
22R 0402 1%
R59
EXT40_GPIO_PA02
EXT40_GPIO_PA03
EXT40_GPIO_PA04
EXT40_SPI_MOSI_PA12
EXT40_SPI_MISO_PA11
EXT40_SPI_SCLK_PA13
EXT40_GPIO_PA14
EXT40_NPCS1_PA07
EXT40_NPCS2_PA08
MBUS_NPCS0_PA14
MBUS_SPCK_PA13
MBUS_MISO_PA11
MBUS_MOSI_PA12
QSPI_IO0_PB21
QSPI_IO1_PB22
QSPI_IO2_PB23
QSPI_IO3_PB24
QSPI_SCK_PB19
QSPI_CS_PB20
22R 0402 1%
R69
22R 0402 1%
R70
22R 0402 1%
R71
22R 0402 1%
R72
PB19
PB20
PB21
22R 0402 1%
R74
22R 0402 1%
R75
22R 0402 1%
R77
22R 0402 1%
R79
22R 0402 1%
R80
22R 0402 1%
R81
PB22
PB23
PB24
PC31
EXT40_I2SMCK_PB23
EXT40_CLK1_PC31
EXT40_I2SWS_PB20
EXT40_I2SCK_PB19
EXT40_GPIO_PB24
EXT40_I2SDIN_PB21
EXT40_I2SDOUT_PB22
ETH0_PCK1_PC31
LED_RED_PB11
LED_GREEN_PB12
LED_BLUE_PB13
EXT40_CLK2_PB13
EXT40_PWM1_PB12
EXT40_PWM0_PB11
0R 0402
R66
0R 0402
R63
0R 0402
R60
PB11
PB12
PB13
MBUS_PWM_PB13
0R 0402
R65
22R 0402 1%
R82
22R 0402 1%
R85
22R 0402 1%
R86
22R 0402 1%
R88
SAM9X60-EK
Function Blocks
Figure 3-15. Processor PIOs PB and PD
Some of the ports were multiplexed to accommodate more devices on the evaluation kit and to showcase all the functions the SAM9X60 MPU can address off a single PIO wire.
Most of the ports that share multiple functions are split through passive resistors placed on the board as close to the MPU as possible, therefore no other hardware change must be made. In most cases, the user can use only one of their functions at a time, or can develop a composite driver enabling the use of multiple functions at the same time.
Figure 3-16. Processor PIO Muxing
Table 3-3. Processor PIOs Pin Assignment and Signal Description
Pad Power Rail Function I/O Type
PA0 VDDIOP0 (3.3V) FLEXCOM0_IO0
PA1 VDDIOP0 (3.3V) FLEXCOM0_IO1
© 2019 Microchip Technology Inc.
TWI Data (TWD) bidirectional line shared between the LCD, EEPROMs and external 40-pin header
TWI Clock (TWCK) output line shared between the LCD, EEPROMs and external 40-pin header
DS50002907A-page 18
...........continued
Pad Power Rail Function I/O Type
SAM9X60-EK
Function Blocks
PA2 VDDIOP0 (3.3V)
PA3 VDDIOP0 (3.3V)
PA4 VDDIOP0 (3.3V)
PA51VDDIOP0 (3.3V)
PA61VDDIOP0 (3.3V)
PA7 VDDIOP0 (3.3V)
PA8 VDDIOP0 (3.3V)
SDMMC1_DAT1
GPIO GPIO going to the external 40-pin header
FLEXCOM0_IO3
GPIO GPIO going to the external 40-pin header
FLEXCOM0_IO2
GPIO GPIO going to the external 40-pin header
FLEXCOM1_IO0 UART Transmit (TX) output line going to the external 40-pin header
CANTX1
FLEXCOM1_IO1 UART Receive (RX) input line going to the external 40-pin header
CANRX1
FLEXCOM4_IO4 First SPI Chip Select (nCS) output line for the external 40-pin header
FLEXCOM5_IO4 SPI Request to Send (RTS) output line for the BT module
FLEXCOM4_IO5
FLEXCOM5_IO3 SPI Clear to Send (CTS) input line for the BT module
SDIO Data 1 (I/O1) bidirectional line for the ATWILC3000 Wi-Fi/BT module
SDIO Data 2 (I/O2) bidirectional line for the ATWILC3000 Wi-Fi/BT module
SDIO Data 3 (I/O3) bidirectional line for the ATWILC3000 Wi-Fi/BT module
CAN Transmit (CANTX) output line going to the second CAN transceiver MCP2542
CAN Receive (CANRX) input line going to the second CAN transceiver MCP2542
Second SPI Chip Select (nCS) output line for the external 40-pin header
PA92VDDIOP0 (3.3V)
PA102VDDIOP0 (3.3V)
PA11 VDDIOP0 (3.3V)
PA12 VDDIOP0 (3.3V)
PA13 VDDIOP0 (3.3V)
PA14 VDDIOP0 (3.3V)
DRXD DEBUG UART Receive (DRX) input line
CANRX0
DTXD DEBUG UART Transmit (DTX) input line
CANTX0
FLEXCOM4_IO1
SDMMC1_DAT0
FLEXCOM4_IO0
SDMMC1_CMD
FLEXCOM4_IO2
SDMMC1_CK
FLEXCOM4_IO3 SPI Chip Select (nCS) output line for the mikroBUS connector
GPIO GPIO going to the external 40-pin header
CAN Receive (CANRX) input line going to the first CAN transceiver MCP2542
CAN Transmit (CANTX) output line going to the first CAN transceiver MCP2542
SPI Master Input Slave Output (MISO) input line shared between the mikroBUS and external 40-pin connectors
SDIO Data 0 (I/O0) bidirectional line going to the ATWILC3000 Wi­Fi/BT module
SPI Master Output Slave Input (MOSI) output line shared between the mikroBUS and external 40-pin connectors
SDIO Command (CMD) bidirectional line going to the ATWILC3000 Wi-Fi/BT module
SPI Source Clock (SCLK) output line shared between the mikroBUS and external 40-pin connectors
SDIO Data 0 (I/O0) bidirectional line going to the ATWILC3000 Wi­Fi/BT module
© 2019 Microchip Technology Inc.
DS50002907A-page 19
SAM9X60-EK
Function Blocks
...........continued
Pad Power Rail Function I/O Type
PA15 VDDIOP0 (3.3V) SDMMC0_DAT0 SDIO Data 0 (I/O0) bidirectional line going to the SD card connector
PA16 VDDIOP0 (3.3V) SDMMC0_CMD
PA17 VDDIOP0 (3.3V) SDMMC0_CK SDIO Clock (CLK) output line going to the SD card connector
PA18 VDDIOP0 (3.3V) SDMMC0_DAT1 SDIO Data 1 (I/O1) bidirectional line going to the SD card connector
PA19 VDDIOP0 (3.3V) SDMMC0_DAT2 SDIO Data 2 (I/O2) bidirectional line going to the SD card connector
PA20 VDDIOP0 (3.3V) SDMMC0_DAT3 SDIO Data 3 (I/O3) bidirectional line going to the SD card connector
PA21 VDDIOP0 (3.3V) FLEXCOM5_IO1
PA22 VDDIOP0 (3.3V) FLEXCOM5_IO0
PA23 VDDIOP0 (3.3V) GPIO
PA24 VDDIOP0 (3.3V) CLASSD_L0 CLASSD Left Output L0
PA25 VDDIOP0 (3.3V) CLASSD_L1 CLASSD Left Output L1
PA26 VDDIOP0 (3.3V) CLASSD_L2 CLASSD Left Output L2
PA27 VDDIOP0 (3.3V) CLASSD_L3 CLASSD Left Output L3
PA28 VDDIOP0 (3.3V) GPIO / WKUP4
PA29 VDDIOP0 (3.3V) GPIO
SDIO Command (CMD) bidirectional line going to the SD card connector
UART Receive (RX) input line shared between the mikroBUS connector and the BT transceiver on the ATWILC3000 module
UART Transmit (TX) output line shared between the mikroBUS connector and the BT transceiver on the ATWILC3000 module
GPIO used as input to detect when an SD card has been inserted in the SD connector
GPIO Input used to signal any interrupt coming from the WILC300 Wi­Fi/BT module
GPIO Output used to enable the WILC300 Wi-Fi/BT module by enabling its power supply
PA30 VDDIOP0 (3.3V) FLEXCOM6_IO0
PA31 VDDIOP0 (3.3V) FLEXCOM6_IO1
PB0 VDDANA (3.3V) E0_RX0 RMII Ethernet Receive Data 0 signal going to KSZ8081
PB1 VDDANA (3.3V) E0_RX1 RMII Ethernet Receive Data 1 signal going to KSZ8081
PB2 VDDANA (3.3V) E0_RXER RMII Ethernet Receive Error signal going to KSZ8081
PB3 VDDANA (3.3V) E0_RXDV RMII Ethernet Receive Data Valid signal going to KSZ8081
PB4 VDDANA (3.3V) E0_TXCK RMII Ethernet Transmit Clock signal going to KSZ8081
PB5 VDDANA (3.3V) E0_MDIO RMII Ethernet Management Data I/O signal going to KSZ8081
PB6 VDDANA (3.3V) E0_MDC RMII Ethernet Management Data Clock signal going to KSZ8081
PB7 VDDANA (3.3V) E0_TXEN RMII Ethernet Receive Data Valid signal going to KSZ8081
PB8 VDDANA (3.3V) E0_TXER RMII Ethernet Transmit Coding Error signal going to KSZ8081
PB9 VDDANA (3.3V) E0_TX0 RMII Ethernet Transmit Data 0 signal going to KSZ8081
PB10 VDDANA (3.3V) E0_TX1 RMII Ethernet Transmit Data 1 signal going to KSZ8081
PB11 VDDANA (3.3V) PWM0
TWI Data (TWD) bidirectional signal shared between PAC1934, PAC1710, MPC23008 and the mikroBUS connector
TWI Clock (TWCK) Bidirectional signal shared between PAC1934, PAC1710, MPC23008 and the mikroBUS connector
PWM signal shared between the LD1 red LED and the 40-pin connector
© 2019 Microchip Technology Inc.
DS50002907A-page 20
...........continued
Pad Power Rail Function I/O Type
SAM9X60-EK
Function Blocks
PB12 VDDANA (3.3V) PWM1
PB13 VDDANA (3.3V) PWM2
PB14 VDDANA (3.3V) GPIO GPIO output used as the reset signal for the mikroBUS connector
PB15 VDDANA (3.3V) AD4 Analog input for the mikroBUS connector
PB16 VDDANA (3.3V) GPIO
PB17 VDDANA (3.3V) GPIO GPIO input used to signal any interrupt request from the LCD
PB18 VDDANA (3.3V) GPIO
QSCK QSPI Serial Clock (SCK) signal going to SST26VF064B
PB19 VDDQSPI (3.3V)
I2SMCC_CK I2S Bit Clock (CK) signal going to the 40-pin connector
QCS QSPI Chip Select (CS) signal going to SST26VF064B
PB20 VDDQSPI (3.3V)
I2SMCC_WS I2S Word Select (WS) signal going to the 40-pin connector
QIO0 QSPI Data I/O 0 (IO0) signal going to SST26VF064B
PB21 VDDQSPI (3.3V)
I2SMCC_DIN0 I2S Data IN 0 (DIN0) signal going to the 40-pin connector
QIO1 QSPI Data I/O 1 (IO1) signal going to SST26VF064B
PB22 VDDQSPI (3.3V)
I2SMCC_DOUT0 I2S Data Out 0 (DOUT0) signal going to the 40-pin connector
PWM signal shared between the LD1 green LED and the 40-pin connector
PWM signal shared between the LD1 blue LED, the mikroBUS and the 40-pin connectors
GPIO input used to detect if the board has been connected to a host on the USBA port
GPIO input used to signal any interrupt request from the mikroBUS connector
PB23 VDDQSPI (3.3V)
PB24 VDDQSPI (3.3V)
PB25 VDDIOP0 (3.3V) NRST_OUT Output signal used to reset all the devices on the board
PC0 VDDIOP1 (3.3V)
PC1 VDDIOP1 (3.3V)
PC2 VDDIOP1 (3.3V)
PC3 VDDIOP1 (3.3V)
QIO2 QSPI Data I/O 2 (IO2) signal going to SST26VF064B
I2SMCC_MCK I2S Master Clock (MCK) signal going to the 40-pin connector
QIO3 QSPI Data I/O 3 (IO3) signal going to SST26VF064B
GPIO GPIO signal going to the 40-pin connector
LCDDAT0 LCD Data Output 0 (DAT0) signal going to the LCD connector
ISI_D0
LCDDAT1 LCD Data Output 1 (DAT1) signal going to the LCD connector
ISI_D1
LCDDAT2 LCD Data Output 2 (DAT2) signal going to the LCD connector
ISI_D2
LCDDAT3 LCD Data Output 3 (DAT3) signal going to the LCD connector
ISI_D3
Image Sensor Interface (ISI) Data Input 0 (D0) signal going to the ISI connector
Image Sensor Interface (ISI) Data Input 1 (D1) signal going to the ISI connector
Image Sensor Interface (ISI) Data Input 2 (D2) signal going to the ISI connector
Image Sensor Interface (ISI) Data Input 3 (D3) signal going to the ISI connector
© 2019 Microchip Technology Inc.
DS50002907A-page 21
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