MICROCHIP rfRXD0420, rfRXD0920 User Manual

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rfRXD0420/0920
UHF ASK/FSK/FM Receiver
Features:
• Low cost single conversion superheterodyne receiver architecture
• Compatible with rfPIC™ and rfHCS series of RF transmitters
• Easy interface to PICmicro (MCU) and K
EELOQ
microcontroller
decoders
• VCO phase locked to quartz crystal reference:
- Narrow receiver bandwidth
- Maximizes range and interference immunity
• Selectable LNA gain control for improved dynamic range
• Selectable IF bandwidth via external ceramic IF filter
• Received Signal Strength Indicator (RSSI) for signal strength indication (FSK, FM) and ASK demodulation
• FSK/FM quadrature (phase coincidence) detector demodulator
• 32-Lead LQFP package
UHF ASK/FSK Receiver:
• Single frequency receiver set by crystal frequency
• Receive frequency range:
Device Frequency Range
rfRXD0420 300 MHz to 450 MHz
rfRXD0920 800 MHz to 930 MHz
• Maximum data rate:
- ASK: 80 Kbps NRZ
- FSK: 40 Kbps NRZ
• IF frequency range: 455 kHz to 21.4 MHz
• RSSI range: 70 dB
• Frequency deviation range: ±5 kHz to ±120 kHz
• Maximum FM modulation frequency: 15 kHz
Pin Diagram:
LNA
LNA
LQFP
V
SS
GAIN
OUT
1IF
IN
V
SS
1IF+
1IF­V
DD
VDD
LNAINVSSLF
323130
1 2 3
rfRXD0420
4 5
rfRXD0920
6 7 8
101112
9
2IFINVSS
1IFOUT
29
FBC1
ENRX
28
13
14
VDD
FBC2
VDD
272526
15
2IF
OUT
XTAL
16
DEM
IN
SS
V
24 23 22 21 20 19 18 17
DEM DEM
SS
V
RSSI OPA+ OPA-
OPA
DD
V
Applications:
• Wireless remote command and control
• Wireless security systems
• Remote Keyless Entry (RKE)
• Low power telemetry
• Low power FM receiver
• Home automation
• Remote sensing
Bi-CMOS Technology:
• Wide operating voltage range
• Low current consumption in Active and Standby modes
- rfRXD0420
- 8.2 mA (typical, LNA High Gain mode)
- <100 nA standby
- rfRXD0920
- 9.2 mA (typical, LNA High Gain mode)
- <100 nA standby
• Wide temperature range:
- Industrial: -40°C to +85°C
OUT OUT
­+
2003 Microchip Technology Inc. Preliminary DS70090A-page 1
rfRXD0420/0920
1.0 DEVICE OVERVIEW
The rfRXD0420/0920 are low cost, compact single frequency short-range radio receivers requiring only a minimum number of external components for a complete receiver system. The rfRXD0420 covers the receive frequency range of 300 MHz to 450 MHz and the rfRXD0920 covers 800 MHz to 930 MHz. The rfRXD0420 and rfRXD0920 share a common architec­ture. They can be configured for Amplitude Shift Keying (ASK), Frequency Shift Keying (FSK), or FM modula­tion. The rfRXD0420/0920 are compatible with rfPIC™ and rfHCS series of RF transmitters.
• High frequency stability over temperature and power supply variations
• Low spurious signal emission
• High large-signal handling capability with selectable LNA gain control for improved dynamic range
• Selectable IF bandwidth via external low cost ceramic IF filter. The IF Frequency range is selectable between 455 kHz to 21.4 MHz. This facilitates the use of readily available low cost
10.7 MHz ceramic IF filters in a variety of bandwidths.
• ASK or FSK for digital data reception
• FM modulation for analog signal reception
• FSK/FM demodulation using quadrature detector (phase coincidence detector)
• Received Signal Strength Indication (RSSI) for signal strength indication and ASK detection
• Wide supply voltage range
• Low active current consumption
• Very low standby current
The rfRXD0420/0920 is a single conversion superhet­erodyne architecture. A block diagram is illustrated in Figure 1-1. The rfRXD0420/0920 consists of:
• Low-noise amplifier (LNA) - Gain selectable
• Mixer for down-conversion of the RF signal to the Intermediate Frequency (IF) followed by an IF preamplifier
• Fully integrated Phase-Locked Loop (PLL) frequency synthesizer for generation of the Local Oscillator (LO) signal. The frequency synthesizer consists of:
- Crystal oscillator
- Phase-frequency detector and charge pump
- High-frequency Voltage Controlled Oscillator
(VCO)
- Fixed feedback divider
- rfRXD0420 = divide by 16
- rfRXD0920 = divide by 32
• IF limiting amplifier to amplify and limit the IF signal and for Received Signal Strength Indication (RSSI) generation
• Demodulator (DEMOD) section consists of a phase detector (MIXER2) and amplifier creating a quadrature detector (also known as a phase coincidence detector) to demodulate the IF signal in FSK and FM modulation applications
• Operational amplifier (OPA) that can be config­ured as a comparator for ASK or FSK data decision or as a filter for FM modulation.
• Bias circuitry for bandgap biasing and circuit shutdown
DS70090A-page 2 Preliminary  2003 Microchip Technology Inc.
FIGURE 1-1: rfRXD0420/0920 BLOCK DIAGRAM
-
19
OPA-
OPA
OPA
18
VDD
17
DEM
IN
1615
2IF
OUT
VDD
14
FBC2
+-
DEMOD
OPA+
MIXER2
rfRXD0420/0920
20
21
RSSI
VSS
22
DEM
OUT+
+-
OUT-
DEM
24 23
FBC1
IN
2IF
VSS
10
OUT
1IF
VDD
8
IF Preamp
1IF-
76 9 11 12 13
1IF+
VSS
5
MIXER1
1IF
IN
LNA
OUT
34
GAIN
LNA
2
VSS
1
DD
V
32
with RSSI
IF Limiting Amplifier
Frequency
Synthesizer
16: rfRXD0420
32: rfRXD0920
Fixed Divide by
LNA
IN
LNA
31
Crystal
Oscillator
and
Charge Pump
Phase Detector
Voltage
Oscillator
Controlled
SS
V
30
Bias
VSS
25
XTAL
VDD
27
ENRX
28
LF
29 26
2003 Microchip Technology Inc. Preliminary DS70090A-page 3
rfRXD0420/0920
TABLE 1-1: rfRXD0420/0920 PINOUT I/O DESCRIPTION
Pin Name Pin Number Pin Type Buffer Type Description
LNA
GAIN 2 I CMOS LNA gain control (with hysteresis)
OUT 3 O Analog LNA output (open collector)
LNA
IN 4 I Analog 1st IF stage input
1IF
1IF+ 6 -- Analog MIXER1 bias (open collector)
1IF- 7 -- Analog MIXER1 bias (open collector)
OUT 9 O Analog 1st IF stage output
1IF
IN 11 I Analog 2nd IF stage input
2IF
FBC1 12 -- Analog Limiter IF Amplifier external feedback capacitor
FBC2 13 -- Analog Limiter IF Amplifier external feedback capacitor
OUT 15 O Analog 2nd IF stage output
2IF
DEM
IN 16 I Analog Demodulator input
OPA 18 O Analog Operational amplifier output
OPA- 19 I Analog Operational amplifier input (negative)
OPA+ 20 I Analog Operational amplifier input (positive)
RSSI 21 O Analog Received signal strength indicator output
OUT+ 23 O Analog Demodulator output (positive)
DEM
OUT- 24 O Analog Demodulator output (negative)
DEM
XTAL 26 I Analog Crystal oscillator input
ENRX 28 I CMOS Receiver enable input
LF 29 I Analog External loop filter connection. Common node of
charge pump output and VCO tuning input.
IN 31 I Analog LNA input
LNA
V
DD 8, 14, 17, 27, 32 P Positive supply
SS 1, 5, 10, 25, 30 P Ground reference
V
Legend: I = Input, O = Output, I/O = Input/Output, P = Power, CMOS = CMOS compatible input or output
DS70090A-page 4 Preliminary  2003 Microchip Technology Inc.
rfRXD0420/0920
A
2.0 CIRCUIT DESCRIPTION
This section gives a circuit description of the internal circuitry of the rfRXD0420/0920 receiver. External connections and components are given in the APPLICATION CIRCUITS section.
2.1 Bias Circuitry
Bias circuitry provides bandgap biasing and circuit shutdown capabilities. The ENRX (Pin 28) modes are summarized in Table 2-1. The ENRX pin is a CMOS compatible input and is internally pulled down to Vss.
TABLE 2-1: BIAS CIRCUITRY CONTROL
(1)
ENRX
0 Standby mode
1 Receiver enabled
Note 1: ENRX has internal pull-down to Vss
2.2 Frequency Synthesizer
The Phase-locked Loop (PLL) frequency synthesizer generates the Local Oscillator (LO) signal. It consists of:
• Crystal oscillator
• Phase-frequency detector and charge pump
• Voltage Controlled Oscillator (VCO)
• Fixed feedback divider:
- rfRXD0420 = divide by 16
- rfRXD0920 = divide by 32
Description
The PLL consists of a phase-frequency detector, charge pump, voltage-controlled oscillator (VCO), and fixed divide-by-16 (rfRXD0420) or divide-by-32 (rfRXD0920) divider. The rfRXD0420/0920 employs a charge pump PLL that offers many advantages over the classical voltage phase detector PLL: infinite pull-in range and zero steady state phase error. The charge pump PLL allows the use of passive loop filters that are lower cost and minimize noise. Charge pump PLLs have reduced flicker noise thus limiting phase noise.
An external loop filter is connected to pin LF (Pin 29). The loop filter controls the dynamic behavior of the PLL, primarily lock time and spur levels. The applica­tion determines the loop filter requirements.
The VCO gain for the rfRXD0420/0920 receivers are listed in Table 2-2.
TABLE 2-2: PLL PARAMETERS
Device
K
VCO
(1)
rfRXD0420 250 MHz/V at
433 MHz
rfRXD0920 300 MHz/V at
868 MHz
Note 1: Typical value
The LF pin is illustrated in Figure 2-2.
(1)
ICP
Divider
60 µA16
60 µA32
FIGURE 2-2: BLOCK DIAGRAM OF LOOP
FILTER PIN
2.2.1 CRYSTAL OSCILLATOR
The internal crystal oscillator is a Colpitts type oscilla­tor. It provides the reference frequency to the PLL. A crystal is normally connected to the XTAL (Pin 26) and ground. The internal capacitance of the crystal oscilla­tor is 15 pF. Alternatively, a signal can be injected into the XTAL pin from a signal source. The signal should be AC coupled via a series capacitor at a level of approximately 600 mV
.
pp
The XTAL pin is illustrated in Figure 2-1.
FIGURE 2-1: BLOCK DIAGRAM OF
XTAL PIN
VDD
VDD VDD
XTAL
26
VSS
50 k
30 pF
30 pF
VSS VSS
40 µ
VDD
LF
29
VSS
200
400
4 pF
VSS
VSS
2.3 Low Noise Amplifier
The Low-Noise Amplifier (LNA) is a high-gain amplifier whose primary purpose is to lower the overall noise figure of the entire receiver thus enhancing the receiver sensitivity. The LNA is an open-collector cascode design. The benefits of a cascode design are:
• high gain with low noise
• high-frequency
• wide bandwidth
• low effective input capacitance with stable input impedance
• high output resistance
• high reverse isolation that provides improved stability and reduces LO leakage
2003 Microchip Technology Inc. Preliminary DS70090A-page 5
rfRXD0420/0920
Approximate LNA noise figures are listed in Table 2-3.
TABLE 2-3: LNA NOISE FIGURES
Device
Noise Figure
rfRXD0420 TBD
rfRXD0920 TBD
Note 1: Approximate value
LNA
IN (Pin 31) has an input impedance of approxi-
mately 26 || 2 pF single-ended.
OUT (Pin 3) has an open-collector output and is
LNA pulled up to V
DD via a tuned circuit.
Important: To ensure LNA stability the V
must be connected to a low impedance ground.
The LNA pins are illustrated in Figure 2-3.
(1)
SS pin (Pin 1)
FIGURE 2-3: BLOCK DIAGRAM OF LNA
PINS
LNA
VSS
V
VSS
OUT
3
DD
VSS
1
LNA
31
1.6V
0.8V
VDD
5 k
IN
VSS
The gain of the LNA can be selected between High and Low Gain modes by the LNA
GAIN pin (Pin 2). LNAGAIN
is a CMOS input with hysteresis. Table 2-4 summarizes the voltage levels and modes for LNA gain.
In the High Gain mode the LNA operates normally. In Low Gain mode the gain of the LNA is reduced approx­imately 25 dB, reduces total supply current, and increases maximum input signal levels (see Electrical Characteristics section for values).
TABLE 2-4: LNA GAIN CONTROL
LNAGAIN Description
< 0.8 V High Gain mode
> 1.4 V Low Gain mode
The 1IF+ (Pin 6) and 1IF- (Pin 7) are bias connections to the MIXER1 balanced collectors. Both pins are open-collector outputs and are individually pulled up to
DD by a load resistor. The MIXER1 bias pins are illus-
V trated in Figure 2-5.
1IF
OUT (Pin 9) has an approximately 330 single-
ended output impedance. The 330 impedance provides a direct match to low cost ceramic IF filters. The 1IF
OUT pins is illustrated in Figure 2-6.
FIGURE 2-4: BLOCK DIAGRAM OF MIXER1
PIN
1IF
4
VDD
IN
VSS
13
13
500 µA
VSS
FIGURE 2-5: BLOCK DIAGRAM OF MIXER1
BIAS PINS
VDD VDD
VSS
20 pF
500 µA
1IF-
7
VSS
1IF+
6
20 pF
VSS
500 µA
VSS
FIGURE 2-6: BLOCK DIAGRAM OF IF
PREAMP PIN
VDD VDD
6.8 k
130
230 µA
VSS
1IF
9
VDD
OUT
VSS
2.5 IF Limiting Amplifier with RSSI
2.4 MIXER1 and IF Preamp
MIXER1 performs down-conversion of the RF signal to the Intermediate Frequency (IF) and is followed by an
The IF Limiting Amplifier amplifies and limits the IF signal at the 2IF
IN pin (Pin 11). It also generates the
Received Signal Strength Indicator (RSSI) signal (Pin 21).
IF preamplifier.
IN (Pin 4) has an approximately 33 single-ended
1IF input impedance. The 1IF
IN pin is illustrated in Figure 2-
4.
2.5.1 IF LIMITING AMPLIFIER
Magnitude control circuitry is used in the last stage of the receiver to keep the signal constant for demodula­tion. It can consist of a limiting or Automatic Gain Control (AGC) amplifier. A limiting amplifier is
DS70090A-page 6 Preliminary  2003 Microchip Technology Inc.
rfRXD0420/0920
employed in this design because it can handle a larger dynamic range while consuming less power with simple circuitry than AGC circuitry.
The internal resistance of the 2IF
IN pin is approximately
2.2 k. In order to terminate ceramic IF filters whose output impedance is 330 , a 390 resistor can be paralleled to the 2IF
IN and FBC2 pins.
FBC1 (Pin 12) and FBC2 (Pin 13) are connected to external feedback capacitors.
The IF Limiting Amplifier pins are illustrated in Figures 2-7 and 2-8.
FIGURE 2-7: BLOCK DIAGRAM OF IF
LIMITING AMPLIFIER INPUT PINS
2IF
11
FBC2
13
VDD
IN
VSS
VDD
VSS
2.2 k
2.2 k
200 µA
Vss
VDD
FBC1
12
VSS
FIGURE 2-8: BLOCK DIAGRAM OF IF
LIMITING AMPLIFIER OUTPUT PIN
VDD
VDD
OUT
2IF
15
VSS
40 µA
VSS
2.5.2 RECEIVED SIGNAL STRENGTH INDICATOR (RSSI)
The RSSI signal is proportional to the log of the signal at 2IF
IN. The 2IFIN input RSSI range is approximately
40 µV to 160 mV. The slope of the RSSI output is approximately 26 mV/dB of RF signal.
The RSSI output has an internal 36 k resister to Vss fed by a current source. This resistor converts the RSSI current to voltage.
For Amplitude Shift Keying (ASK) demodulation, RSSI is compared to a reference voltage (static or dynamic). Post detector filtering is easily implemented by connecting a capacitor to ground from the RSSI pin effectively creating an RC filter with the internal 36 k resistor.
For FSK and FM demodulation, the RSSI represents the received signal strength of the incoming RF signal.
The RSSI pin is illustrated in Figure 2-9.
FIGURE 2-9: BLOCK DIAGRAM OF RSSI
PIN
VDD
RSSI
21
50
VSS
I (Pi)
36 k
VSS
2.6 Demodulator
The demodulator (DEMOD) section consists of a phase detector (MIXER2) and amplifier creating a quadrature detector (also known as a phase coincidence detector) to demodulate the IF signal in FSK and FM modulation applications. The quadrature detector provides all the IF functions required for FSK and FM demodulation with only a few external parts.
The in-phase signal comes directly from the output of the IF limiting amplifier to MIXER2. The quadrature signal is created by an external tuned circuit from the output of the IF limiting amplifier (2IF coupled to the MIXER2 DEM impedance of the DEM
IN (Pin 16) input. The input
IN pin is approximately 47 kΩ.
The external tuned circuit can be constructed from sim­ple inductor-capacitor (LC) components but will require one of the elements to be tunable. A no-tune solution can be constructed with a ceramic discriminator.
The output voltage of the DEMOD amplifier (DEMout+ and DEMout-, Pins 23 and 24) depends on the peak deviation of the FSK or FM signal and the Q of the external tuned circuit. DEMout+ and DEMout- are high impedance outputs with only a 20 µA current capability.
The Demodulator pins are illustrated in Figures 2-10 and 2-11.
FIGURE 2-10: BLOCK DIAGRAM OF
DEMODULATOR INPUT PIN
VDD
VDD VDD
DEM
IN
16
VSS
OUT, Pin 15) AC-
47 k
2003 Microchip Technology Inc. Preliminary DS70090A-page 7
rfRXD0420/0920
FIGURE 2-11: BLOCK DIAGRAM OF
DEMODULATOR OUTPTUT PINS
VDD
VSS
V
VSS
50
20 µA20 µA
VSS VSS
DD
50
20 µA20 µA
VSS VSS
DEM
OUT+
23
DEM
OUT-
24
2.7 Operational Amplifier
The internal operational amplifier (OPA) can be configured as a comparator for ASK or FSK or as a filter for FM modulation applications.
The Op Amp pins are illustrated in Figures 2-12 and 2-13.
FIGURE 2-12: BLOCK DIAGRAM OF OP AMP
INPUT PINS
VDD
VDD VDD
OPA-
19
50 50
VSS VSS
20 µA
OPA+
20
FIGURE 2-13: BLOCK DIAGRAM OF OP AMP
OUTPUT PIN
VDD
OPA
18
VSS
VDD
50
VSS
DS70090A-page 8 Preliminary  2003 Microchip Technology Inc.
rfRXD0420/0920
)
3.0 APPLICATION CIRCUITS
This section provides general information on applica­tion circuits for the rfRXD0420/0920 receiver. The following connections and external components provide starting points for designs and list the minimum circuitry recommended for general purpose applications.
Performance of the radio system (transmitter and receiver) is affected by component selection and the environment in which it operates. Each system design has its own unique requirements. Specifications for a particular design requires careful analysis of the appli­cation and compromises for a practical implementation.
3.1 General
This subsection lists connections and components that are common between applications. The following subsections give specific circuit connections and components for ASK, FSK and FM applications.
3.1.1 BYPASS CAPACITORS
Bypass capacitors should be placed as physically close as possible to V respectively. Additional bypassing and board level low­pass filtering of the power supply may be required depending on the application.
3.1.2 FREQUENCY PLANNING
The rfRXD0420/0920 receivers are single-conversion superheterodyne architecture with a single IF frequency. The receive frequency is set by the crystal frequency (f a majority of applications an external crystal is connected to XTAL (Pin 26). Figure 3-1 illustrates an example circuit with an optional trim capacitor.
FIGURE 3-1: XTAL EXAMPLE CIRCUIT
DD pins 8, 14, 17, 27 and 32
) and intermediate frequency (fif). For
XTAL
WITH OPTIONAL TRIM CAPACITOR
XTAL
26
C TRIM
(OPTIONAL
X1
effect the trim capacitor has on the receive frequency for the rfRXD0420 at 433.92 MHz. Keep in mind that this graph represents one example circuit and the actual results depends on the crystal and PCB layout.
FIGURE 3-2: RECEIVE FREQUENCY VS.
TRIM CAPACITANCE
434.10
434.05
434.00
433.95
433.90
433.85
433.80
Receive Frequency (MHz)
433.75
82 pF
0 ohms
68 pF
56 pF
47 pF
Trim Capacitor (pF)
39 pF
33 pF
27 pF
22 pF
18 pF
15 pF
12 pF
10 pF
5 pF
Note that a 0 resistor, in the lower left of the graph, represents an infinite capacitance. This will be the lowest frequency obtainable for the crystal and PCB combination.
Calculation of the crystal frequency requires knowl­edge of the receive frequency (f frequency (f
). Figure 3-3 is a worksheet to assist the
if
) and intermediate
rf
designer in calculating the crystal frequency. Table 3-1 lists crystal frequencies for popular receive frequen­cies. Table 3-2 lists crystal parameters required for ordering crystals. For background information on crystal selection see Application Note AN826, Crystal Oscillator Basics and Crystal Selection for rfPIC PICmicro
Devices.
TM
and
TABLE 3-1: CRYSTAL FREQUENCIES FOR
POPULAR RECEIVE FREQUENCIES
Receive
Frequency
rfRXD0420
315 MHz 20.35625 MHz
433.92 MHz 26.45125 MHz
rfRXD0920
868.3 MHz 26.8 MHz
915 MHz 28.259375 MHz
(1) Low-side injection (2) High-side injection
Crystal
Frequency
(2)
(1)
(1)
(1)
TABLE 3-2: CRYSTAL PARAMETERS
Parameter Value
The crystal load capacitance should be specified to include the internal load capacitance of the XTAL pin of 15 pF plus PCB stray capacitance (approximately 2 to 3 pF). A trim capacitor can be used to trim the crystal on frequency within the limitations of the crystal’s trim sensitivity and pullability. Figure 3-2 illustrates the
2003 Microchip Technology Inc. Preliminary DS70090A-page 9
Frequency: (see Figure 3-1)
Mode: Fundamental
Load Capacitance: 15-20 pF
ESR: 60 Maximum
These values are for design guidance only.
rfRXD0420/0920
FIGURE 3-3: FREQUENCY PLANNING WORKSHEET
Step 1: Identify receive (f
= ____________________
f
rf
f
= ____________________
if
Step 2: Calculate crystal frequencies for high- and low-side injection:
High-side Injection
f
lo-HIGH
=
=
= f
f
XTAL-HIGH
Low-side Injection
f
XTAL-LOW
Step 3: Calculate Local Oscillator (LO) frequencies (f
High-side Injection
Low-side Injection
) and IF frequency (fif).
rf
( f
+ f
rf
PLL divide ratio 16 if rfRXD0420
( f
- f
rf
PLL divide ratio 16 if rfRXD0420
XTAL-HIGH
)
if
)
if
x PLL Divide Ratio
=
=
( _________ + _________ )
32 if rfRXD0920
( _________ - _________ )
32 if rfRXD0920
) using f
lo
= _________ x
XTAL-HIGH
f
rf
f
x PLL divide ratio
XTAL
= _______________
= _______________
and f
XTAL-LOW
16 if rfRXD0420
32 if rfRXD0920
f
f
lo
:
= _____________
if
= f
f
lo-LOW
Step 4: Select high-side injection (f
that is between the ranges of:
Step 5: From the chosen injection mode in Step 4, write the selected crystal frequency (f
injection mode.
f
XTAL
Step 6: Calculate image frequency (f
if High-side Injection
f
rf-image
if Low-side Injection
f
rf-image
Note: Image frequency should be sufficiently filtered by the preselector for the application.
XTAL-LOW
= ____________________ High-side Injection Low-side Injection
= frf + (2 x fif)
= frf - (2 x fif)
x PLL Divide Ratio
) or low-side injection (f
lo-HIGH
Device LO Frequency Range
rfRXD0420 300 to 430 MHz
rfRXD0920 800 to 915 MHz
rf-image
= ___________ + ( 2 x ___________ ) = ______________
= ___________ - ( 2 x ___________ ) = ______________
= _________ x
) for the Injection mode chosen:
16 if rfRXD0420
32 if rfRXD0920
) that corresponds to the LO frequency
lo-LOW
(circle one)
= _____________
) and circle
XTAL
DS70090A-page 10 Preliminary  2003 Microchip Technology Inc.
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