Microchip MCP331X1D User Manual

MCP331X1D 16/14/12-Bit,

1 Msps SAR ADC

Evaluation Kit

User’s Guide

 2018-2019 Microchip Technology Inc. DS50002733B

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ISBN: 978-1-5224-4713-9

DS50002733B-page 2  2018-2019 Microchip Technology Inc.

MCP331X1D 16/14/12-BIT,

1 MSPS SAR ADC EVALUATION KIT

USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 5

Introduction............................................................................................................ 5

Document Layout .................................................................................................. 5

Conventions Used in this Guide ............................................................................ 6

Recommended Reading........................................................................................ 7

The Microchip Website .......................................................................................... 7

Customer Support ................................................................................................. 7

Document Revision History ................................................................................... 7

Chapter 1. Quick Start Guide for Hardware Setup...................................................... 9

Chapter 2. Product Overview...................................................................................... 11

2.1 Introduction ................................................................................................... 11

2.2 MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation

Board Features ....................................................................................... 11

2.3 MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit Contents ....... 11

2.4 MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation

Kit Requirements .................................................................................... 12

2.5 MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation

Board Overview ...................................................................................... 12

2.6 SAR ADC Device Configuration ................................................................... 14

2.7 PIC32MZ EF Curiosity Development Board (DM320104) Overview ............ 15

2.8 SAR ADC Utility Software Overview ............................................................ 16

Chapter 3. Installation and Operation ........................................................................ 25

3.1 Configuration Requirements ......................................................................... 25

3.2 Evaluation Kit Setup ..................................................................................... 25

Chapter 4. Firmware..................................................................................................... 27

4.1 PIC32MZ2048EFM100 Initialization ............................................................. 27

4.2 Data Acquisition ........................................................................................... 27

4.3 USB Transfer ................................................................................................ 29

4.4 ADC Functions ............................................................................................. 30

Appendix A. Schematics and Layout......................................................................... 33

A.1 Introduction .................................................................................................. 33

A.2 Board – Schematic (Page 1 of 2) ................................................................. 34

A.3 Board – Schematic (Page 2 of 2) ................................................................. 35

A.4 Board – Top Silk Layer ................................................................................ 36

A.5 Board – Top Copper and Silk Layer ............................................................. 37

A.6 Board – Top Copper Layer .......................................................................... 38

 2018-2019 Microchip Technology Inc. DS50002733B-page 3

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

A.7 Board – Bottom Copper Layer ..................................................................... 39

A.8 Board – Bottom Copper and Silk Layer ....................................................... 40

A.9 Board – Bottom Silk Layer ........................................................................... 41

Appendix B. Bill of Materials (BOM) ...........................................................................43

B.1 MCP331X1D Evaluation Board – Bill of Materials (BOM) ............................ 43

Worldwide Sales and Service .....................................................................................48

DS50002733B-page 4  2018-2019 Microchip Technology Inc.

MCP331X1D 16/14/12-BIT,

1 MSPS SAR ADC EVALUATION KIT

USER’S GUIDE

Preface

NOTICE TO CUSTOMERS

All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.

Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.

For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.

®

IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the
MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit. Items discussed in this
chapter include:

• Document Layout

• Conventions Used in this Guide

• Recommended Reading

• The Microchip Website

• Customer Support

• Document Revision History

DOCUMENT LAYOUT

This document describes how to use the MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC
Evaluation Kit to demonstrate the performance of the MCP331X1 device family. The
manual layout is as follows:

• Chapter 1. “Quick Start Guide for Hardware Setup” – Provides quick,

step-by-step information on setting up the MCP331X1D 16/14/12-Bit, 1 Msps SAR
ADC Evaluation Kit.

• Chapter 2. “Product Overview” – Important information about the MCP331X1D

16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit.

• Chapter 3. “Installation and Operation” – Includes instructions on how to get

started with the MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit.

• Chapter 4. “Firmware” - Includes information about the firmware that is included

with the MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit.

• Appendix A. “Schematic and Layouts” – Refer to the board’s web page for the

complete Schematics and Layouts.

• Appendix B. “Bill of Materials (BOM)” – Refer to the board’s web page for the

complete Bill of Materials.

 2018-2019 Microchip Technology Inc. DS50002733B-page 5

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:

DOCUMENTATION CONVENTIONS

Description Represents Examples

Arial font:

Italic characters Referenced books MPLAB

Emphasized text ...is the only compiler...

Initial caps A window the Output window

A dialog the Settings dialog
A menu selection select Enable Programmer

Quotes A field name in a window or

dialog

Underlined, Italic text with
right angle bracket

Bold characters A dialog button Click OK

N‘Rnnnn A number in verilog format,

Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>

Courier New font:

Plain Courier New Sample source code #define START

Italic Courier New A variable argument file.o, where file can be

Square brackets [ ] Optional arguments mcc18 [options] file

Curly brackets and pipe
character: { | }

Ellipses... Replaces repeated text var_name [,

A menu path File>Save

A tab Click the Power tab

where N is the total number of
digits, R is the radix and n is a
digit.

Filenames autoexec.bat
File paths c:\mcc18\h
Keywords _asm, _endasm, static
Command-line options -Opa+, -Opa-
Bit values 0, 1
Constants 0xFF, ‘A’

Choice of mutually exclusive
arguments; an OR selection

Represents code supplied by
user

“Save project before build”

4‘b0010, 2‘hF1

any valid filename

[options]

errorlevel {0|1}

var_name...]

void main (void)
{ ...
}

®

IDE User’s Guide

DS50002733B-page 6  2018-2019 Microchip Technology Inc.

RECOMMENDED READING

This user’s guide describes how to use the MCP331X1D 16/14/12-Bit, 1 Msps SAR
ADC Evaluation Kit. Another useful document is listed below. The following Microchip
document is available and recommended as a supplemental reference resource.

• MCP33131D/21D/11D-XX Data Sheet – “1 Msps /500 ksps 16/14/12-Bit
Differential Input SAR ADC” (DS20005947)

THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This website is
used as a means to make files and information easily available to customers. Accessible
by using your favorite Internet browser, the website contains the following information:

• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software

• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing

• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events, listings of Microchip sales offices,
distributors and factory representatives

Preface

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:

• Distributor or Representative

• Local Sales Office

• Embedded System Engineer (ESE)

• Technical Support

Customers should contact their distributor, representative or field application engineer
(FAE) for support. Local sales offices are also available to help customers. A listing of
sales offices and locations is included in the back of this document.

Technical support is available through the website at:

http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision B (June 2019)

• Updated figure in Chapter 1. “Quick Start Guide for Hardware Setup”

• Updated figures in Section 2.6 “SAR ADC Device Configuration”

• Updated Appendix A. “Schematic and Layouts”

• Updated Appendix B. “Bill of Materials (BOM)”

• Grammar and styling updates

Revision A (April 2018)

• Initial release of this document.

 2018-2019 Microchip Technology Inc. DS50002733B-page 7

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

NOTES:

DS50002733B-page 8  2018-2019 Microchip Technology Inc.

MCP331X1D 16/14/12-BIT,

1

2

7

6

5

4

3

8

9

MCP331X1D Evaluation

Board

PIC32MZ EF Curiosity

Development Board

1 MSPS SAR ADC EVALUATION KIT

USER’S GUIDE

Chapter 1. Quick Start Guide for Hardware Setup

The following nine steps provide a quick start guide for setting up the MCP331X1D 16/14/12-Bit, 1 Msps
SAR ADC Evaluation Board and the PIC32MZ EF Curiosity Development Board.

FIGURE 1-1: MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit (default).

1. On the PIC32MZ EF Curiosity Development Board, move the PWR IN jumper to connect pins, V

2. Connect the Micro-USB cable from the PC to J12 on the PIC32MZ EF Curiosity Development Board.

3. If using a preprogrammed PIC32MZ EF Curiosity Development Board, skip to Step 5. If using a

4. Once the firmware is loaded, remove the programmer and wait for LED4 to illuminate with a solid red

5. Connect the MCP331X1D Evaluation Board (ADM00873) to the top right mikroBUS™ header (J10),

6. Connect a 9V power supply to the barrel jack connection point using either the supplied 9V wall power

and V

This USB is used for both power and data transfer for the PIC32MZ EF board.

non-programmed version of the PIC32MZ EF Curiosity Development Board, then program the
PIC32MZ with the latest MCP331X1D Evaluation Board (ADM00873) Hex file (available on

www.microchip.com) using an external programmer (MPLAB

the ICSP™ HDR (J16).

light. A solid red lit LED indicates that the firmware is loaded and the board is working as intended.

as displayed in Figure 1-1.

supply or, alternatively, connect 9V from an external power source to the H1 headers. D1, directly
below the barrel jack, will illuminate to confirm that 9V is being supplied to the evaluation board.

BUS

.

®

ICD, PICkit™ ICD, etc.) connected to

IN

 2018-2019 Microchip Technology Inc. DS50002733B-page 9

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

7. Connect either a fully differential or single-ended signal source.

a) When using a Fully Differential signal source:

- Connect positive input to J1 SMA connector

- Connect negative input to J2 SMA connector

b) When using Single-Ended input signal:

- Connect positive input to J1 SMA connector

- Populate jumper at J6 headers to connect the negative input to V

Note: When the jumper J6 is connected, V

driver). The U1 output swings with V

/2 is automatically provided to input pin IN- of U1 (ADC

REF

+/2 centered at the V

IN

COM

is used in this board.

8. PC GUI: Install and launch SAR_ADC_Utility.exe (available on www.microchip.com). The
software will automatically recognize the plugged in device and launch the GUI.

9. Once the GUI is open, use the blue Play button to run single or continuous acquisitions. The GUI will
display all performance analysis data related to the acquired signal.

/2

REF

voltage. Where V

REF

= 4.048V

DS50002733B-page 10  2018-2019 Microchip Technology Inc.

MCP331X1D 16/14/12-BIT,

1 MSPS SAR ADC EVALUATION KIT

USER’S GUIDE

Chapter 2. Product Overview

2.1 INTRODUCTION

This chapter provides an overview of the MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC
Evaluation Kit and covers the following topics:

• MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board Features

• MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit Contents

• MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit Requirements

• MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board Overview

• SAR ADC Device Configuration

• PIC32MZ EF Curiosity Development Board (DM320104) Overview

• SAR ADC Utility Software Overview

2.2 MCP331X1D 16/14/12-BIT, 1 MSPS SAR ADC EVALUATION BOARD

FEATURES

This MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit is a fully assembled,
programmed and tested solution to evaluate and demonstrate the MCP33131D
operating performance.

The MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit features:

• Full-Scale Analog Input Range: -V

- ADM00873 with Differential Input Configuration: -4 VPP to +4 V

- ADM00873 with Single-Ended Input Configuration: 0V to +4 V

• Dynamic Performance Monitoring

• Evaluation of Performance Parameters, such as: SNR, SFDR, THD, INL, DNL,
Voltage Measurement and so on

• Evaluate Input Signal in Time Domain

• Ability to Save and Load Software Configurations

• Ability to Save and Load Raw Data for User Post-Processing

For information about the device features, refer to the “MCP331X1 Data Sheet”.

REF

to +V

REF

PP

PP

2.3 MCP331X1D 16/14/12-BIT, 1 MSPS SAR ADC EVALUATION KIT CONTENTS

The MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board includes the
following items:

• MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board with On-Board
Reference (V

• PIC32MZ EF Curiosity Development Board, Preprogrammed with SAR ADC
Firmware (ADM320104)

• 9V Wall Plug-in Power Supply

• USB Cable from Curiosity PIC32 Development Board to PC

• Important Information Sheet

= 4V) (ADM00873)

REF

 2018-2019 Microchip Technology Inc. DS50002733B-page 11

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

9V Power Supply 5V Power Supplied via USB

USB

MCP331X1D

Evaluation Board

(Note 1)

Curiosity PIC32MZEF

Development Board
(DM320104) (Note 2)

PC GUI

(SAR ADC Utility

Software)

(Note 3)

Note 1: The ADC part is available on this board.

2: This board collects ADC data from the evaluation board and passes them to the PC GUI.
3: This GUI provides various user interfaces to test the performance of the MCP331X1 device.

Signal
Input

SPI

2.4 MCP331X1D 16/14/12-BIT, 1 MSPS SAR ADC EVALUATION KIT REQUIREMENTS

The MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board requires:

• Curiosity PIC32MZEF Development Board (DM320104)

• Type A Male to Micro-B USB Cable

• External Signal Input:

- Supplied by the user

• SAR ADC Utility Software (GUI):

- Available on the Microchip website

2.5 MCP331X1D 16/14/12-BIT, 1 MSPS SAR ADC EVALUATION BOARD OVERVIEW

The MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board is intended to
demonstrate the performance of the MCP331X1 device family. This evaluation board
is used together with:

• Curiosity PIC32MZEF Development Board (DM320104)

• SAR ADC Utility Software

Figure 2-1 displays the system setup.

FIGURE 2-1: MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit System Setup.

This evaluation board supports the MCP331X1D-10 device family, which is Microchip
Technology’s fully differential single channel 12/14/16-bit, 1 Msps SAR Analog-to-Digital
Converter (ADC).

The MCP331X1D Evaluation Board comes with the MCP331X1 device on board. All
conditions and features can be evaluated using this evaluation board. Refer to Figure 2-2
and Figure 2-3 for photos of the evaluation boards, and refer to Ta bl e 2 -1 for our currently
available fully differential device offerings compatible with this evaluation board.

TABLE 2-1: DEVICES SUPPORTED BY MCP331X1D EVALUATION KIT

(2)

REF

Part Number Resolution Sample Rate SNR

MCP33131D-10 16-bit 1 Msps 91.3 dBFS 103.5 dB Differential

MCP33121D-10 14-bit 1 Msps 85.1 dBFS 103.5 dB Differential

MCP33111D-10 12-bit 1 Msps 73.9 dBFS 99.3 dB Differential

MCP33131D-05 16-bit 500 ksps 91.3 dBFS 103.5 dB Differential

MCP33121D-05 14-bit 500 ksps 85.1 dBFS 103.5 dB Differential

MCP33111D-05 12-bit 500 ksps 73.9 dBFS 99.3 dB Differential

Note 1: Contact Microchip Technology Inc. for availability.

2: SNR and SFDR are measured with f

= 10 kHz, VIN= -1 dBFS, V

IN

(1)

(2)

SFDR

=5V.

Input

Configuration

DS50002733B-page 12  2018-2019 Microchip Technology Inc.

Product Overview

FIGURE 2-2: MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board, 4V Reference.

Note: The 4V on-board reference can be replaced with an external voltage

reference source by removing R60 and supplying a reference voltage at TP7.

 2018-2019 Microchip Technology Inc. DS50002733B-page 13

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

2.6 SAR ADC DEVICE CONFIGURATION

Each evaluation board features a 4-way SPST DIP switch (schematic designator:
SW1) that allows the user to manually configure the board for a variety of available
Microchip SAR ADC devices. Ta ble 2 -2 lists each available switch setting. Refer to

Figure 3-1 from Chapter 3. “Installation and Operation” to view the location of SW1.

TABLE 2-2: SW1 DEVICE CONFIGURATION SETTINGS

Part Number Resolution Speed

MCP33111-05 12 500 ksps Single-Ended 0-0-0-0

MCP33111D-05 12 500 ksps Differential 0-0-0-1

MCP33121-05 14 500 ksps Single-Ended 0-0-1-0

MCP33121D-05 14 500 ksps Differential 0-0-1-1

MCP33131-05 16 500 ksps Single-Ended 0-1-0-0

MCP33131D-05 16 500 ksps Differential 0-1-0-1

MCP33111-10 12 1 Msps Single-Ended 1-0-1-0

MCP33111D-10 12 1 Msps Differential 1-0-1-1

MCP33121-10 14 1 Msps Single-Ended 1-1-0-0

MCP33121D-10 14 1 Msps Differential 1-1-0-1

MCP33131-10 16 1 Msps Single-Ended 1-1-1-0

MCP33131D-10 16 1 Msps Differential 1-1-1-1 Default

Input

Configuration

SW1 Setting:

(ID3:ID2:ID1:ID0)

Notes

DS50002733B-page 14  2018-2019 Microchip Technology Inc.

Product Overview

2.7 PIC32MZ EF CURIOSITY DEVELOPMENT BOARD (DM320104) OVERVIEW

Note 1: The PIC32MZ EF Curiosity Development Board is used for data capture

from the MCP331X1D Evaluation Board. This board can be purchased
with preprogrammed SAR ADC firmware compatible with the
MCP331X1D Evaluation Board (ADM00873).

2: The PIC32MZ EF Curiosity Development Board included in the

MCP331X1D Evaluation Kit is already preprogrammed with SAR ADC
firmware.

The PIC32MZ EF Curiosity Development Board (DM320104) is a fully-integrated,
32-bit development platform featuring the high-performance PIC32MZ EF Series PIC
Microcontroller (PIC32MZ2048EFM100), which is utilized for capturing the digital data
received from the MCP331X1D Analog-to-Digital Converter (ADC) Evaluation Board.

Figure 2-1 shows the connection of the PIC32MZ EF Curiosity Development Board

directly between the MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board
and the SAR ADC Utility Software.

The Curiosity Development Board (DM320104) connects to the PC through a USB
cable, providing the user with two functionalities:

• The ability to send user commands directly to the device from the SAR ADC Utility
Software.

• The ability to collect data from the evaluation board and send them to the SAR
ADC Utility Software.

Figure 2-3 displays a close-up of the PIC32MZ EF Curiosity Development Board. More

information, including user’s guides and other resources for the Curiosity Development
Board, can be found by visiting www.microchip.com.

®

FIGURE 2-3: PIC32MZ EF Curiosity Development Board (DM320104).

 2018-2019 Microchip Technology Inc. DS50002733B-page 15

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

2.7.1 Using the PIC32MZ EF Curiosity Development Board for Firmware Development Tool

The PIC32MZ EF Curiosity Development Board includes the PICkit™ On-Board
(PKOB) debugger based on the PIC24FJ256GB106 USB microcontroller. In addition,
it provides the option to use external debuggers, such as MPLAB
MPLAB ICD 3, by connecting to the In-Circuit Serial Programming™ (ICSP™) header,
J16.

By default, the on-board debugger is connected to the programming pins (PGEC and
PGED) of the PIC32 device. To use an external debugger, remove jumper J2 to
disconnect the on-board debugger from driving the programming pins.

Note: More details about this can be found in the “PIC32MZ EF Curiosity

Development Board User’s Guide” (DS70005282), available for download

at www.microchip.com.

TABLE 2-3: DEBUGGER SELECTION

J2 Jumper Positions

On-Board Debugger External Debugger

Pins 1-2 Shorted Pins 1-2 Open

Pins 3-4 Shorted Pins 3-4 Open

®

REAL ICE™ or

2.8 SAR ADC UTILITY SOFTWARE OVERVIEW

The SAR ADC Utility Software is the Graphical User Interface (GUI) used to
communicate with the device and to configure its operating parameters. The software
communicates with the ADC through the PIC32MZ EF Curiosity Development Board
and a USB cable. When the user interacts with the software, the user’s commands are
passed to the MCP331X1 device through the PIC32MZ EF Curiosity Development
Board. Once the commands are executed by the MCP331X1D Evaluation Board, the
software receives the requested data from the PIC32MZ EF Curiosity Development
Board. The software then analyzes the data, performs an FFT or other analysis and
displays the results. Refer to Figure 2-1 for a diagram of the system setup.

Figure 2-4 through Figure 2-10 show screen captures of the various performance

displays available within the SAR ADC Utility.

The SAR ADC Utility Software is available for download at www.microchip.com. For
instructions on using the GUI, refer to the software’s supporting documentation
included with the installation file, as well as within the application Help menu.

DS50002733B-page 16  2018-2019 Microchip Technology Inc.

Product Overview

1

2

3

FIGURE 2-4: SAR ADC Utility Software Displaying a Typical FFT Waveform.

1. Click the Single Conv. button for a single shot of the conversion results. Click
Continuous for continuous repeated conversion results.

2. Click Calibrate to manually send an ADC calibration command. ADC automatically
self-calibrates on initial hardware start-up.

3. Device selected automatically based on DIP setting at SW1. See

Section 2.6 “SAR ADC Device Configuration” for details.

 2018-2019 Microchip Technology Inc. DS50002733B-page 17

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

1

2

3

FIGURE 2-5: SAR ADC Utility Software Displaying a Single Acquisition Bit Position Digital Output.

1. This feature is only available in Single Conversion One-Shot mode.

2. Select Single-Shot from Operating Mode drop-down menu to enable the single
acquisition bit position digital output display.

3. V

value must be manually entered based on the ADC’s supplied V

REF

ADM00873 defaults on board to V

REF

=4V.

REF

.

This feature is very useful for the MCU firmware developer for using a known input
signal, and seeing the output code and voltage to validate the firmware.

DS50002733B-page 18  2018-2019 Microchip Technology Inc.

Product Overview

1

FIGURE 2-6: INL DNL Performance Display.

1. Select INL DNL from the Domain menu in order to enable INL DNL Measurement

mode.

 2018-2019 Microchip Technology Inc. DS50002733B-page 19

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

1

FIGURE 2-7: Codes vs. Time Display.

1. Select Codes/Time from the Domain menu in order to enable the ADC Output
Codes vs. Time display.

The display represents the digitized code value that corresponds to the input signal
amplitude in time domain.

DS50002733B-page 20  2018-2019 Microchip Technology Inc.

Product Overview

1

FIGURE 2-8: Codes vs. Time Display (Zoomed).

1. Select the +/- magnifying glass, then click and drag on the screen to zoom in and

out. The data cursor can be selected to hover over the wave form and see the
exact code value at any point in the display.

 2018-2019 Microchip Technology Inc. DS50002733B-page 21

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

1

2

FIGURE 2-9: Input Signal Voltage Amplitude vs. Time Display.

1. Select Volts/Time from the Domain menu in order to enable the ADC Input Signal
Voltage vs. Time display.

2. V

value must be manually entered based on the ADC’s supplied V

REF

ADM00873 defaults on board to V

REF

=4V.

This display shows the digitized input signal with the voltage amplitude reconstructed
based on the supplied voltage reference value.

REF

.

DS50002733B-page 22  2018-2019 Microchip Technology Inc.

Product Overview

FIGURE 2-10: Volts vs. Time Display (Zoomed).

 2018-2019 Microchip Technology Inc. DS50002733B-page 23

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

NOTES:

DS50002733B-page 24  2018-2019 Microchip Technology Inc.

1 MSPS SAR ADC EVALUATION KIT

Chapter 3. Installation and Operation

3.1 CONFIGURATION REQUIREMENTS

To power up and run the evaluation kit, the following are required:

• SAR ADC Utility Software

• MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board

• PIC32MZ EF Curiosity Development Board (DM320104)

• Type A Male to Micro-B USB Cable

• External Signal Source, Differential or Single-Ended Output (see

Section 3.2.1 “Input Signal”)

3.1.1 Power Input Connection

This MCP331X1D Evaluation Board comes with a 9V wall plug-in switching power
supply (CUI INC P/N: SWI12-9-N-P6). This power supply is able to provide a 9V, 1.2A
maximum output. It can be connected to an AC wall outlet rated between 100V AC and
240V AC, at a frequency of 50 Hz to 60 Hz. The other end of the power supply is a

2.1 mm barrel plug that connects to the MCP331X1D Evaluation Board (see

Figure 3-1). If the user chooses to connect a different external power supply, a mini-

mum output of 500 mA is required, with a voltage output between 6V-12V. There is no
on-board 9V regulator, so the 9V OUT pin (TP4) will read a voltage equal to the voltage
input value selected by the user.

MCP331X1D 16/14/12-BIT,

USER’S GUIDE

Avoid connecting a power supply with a voltage greater than what is recommended in
this user guide. Doing so can damage the voltage regulators, requiring them to be
replaced.

3.2 EVALUATION KIT SETUP

1. Connect the MCP331X1D Evaluation Board and the PIC32MZ EF Curiosity

Development Board, as shown in Figure 3-1.

2. Connect the PIC32MZ EF Curiosity Development Board to a computer using a

Type A male to Micro-B USB cable. In order to power the Curiosity Board through
USB, the USB cable must be plugged into the USB connection located at J12. In
addition to this, the headers located at J8 need to have the jumper connecting
the V

3. Power up the MCP331X1D Evaluation Board using the provided 9V power

supply.

4. Connect a differential or single-ended analog input signal to the MCP331X1D

Evaluation Board SMA terminals. For single-ended operation, populate jumper
J6 (see Figure 3-1 for jumper location). By populating this jumper, the negative
signal input will be tied to V
negative signal input (J2) with 0Ω. This can be done by shorting C34.

5. Run the SAR ADC Utility Software. See Section 2.8 “SAR ADC Utility

Software Overview”.

pin to VIN. Figure 3-1 shows the component locations.

BUS

WARNING

(V

REF/2

). Another option is to terminate the

COM

 2018-2019 Microchip Technology Inc. DS50002733B-page 25

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

- +

Configuration
Switch (SW1)

PIC32MZ EF Curiosity Development Board (DM320104)

Analog Inputs

ADC Power Circuit

Power
Supply
Input (9V)

Alternate
Power
Supply (9V)

MCP331X1D 16/14/12-Bit, 1 Msps SAR
ADC Evaluation Board (ADM00873)

Differential Driver (U1)

V

REF

Regulator (U2)

MCP6286 Op Amp (U5)

ADC Device (U3)

USB Power
Supply (J12)

Curiosity Power
Source Selection
Header (J8)

V

COM (VREF

/2 for S.E.

Source) Jumper (J6))

Driver Enable (J8)

-1V/GND Driver Input Select (J4)

FIGURE 3-1: The MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Board (ADM00873) connected to the PIC32MZ EF Curiosity Development Board (DM320104).

3.2.1 Input Signal

The best way to evaluate the MCP331X1D device is to use a clean analog input signal
with as little noise as possible and no harmonic contents. The AP2722 Audio Analyzer
from Audio Precision can be used to generate a clean analog signal for evaluation
purposes
source and EVB to remove any noise outside of the desired frequency.

. If using a less pure signal source, a filter can be added between the signal

DS50002733B-page 26  2018-2019 Microchip Technology Inc.

1 MSPS SAR ADC EVALUATION KIT

Chapter 4. Firmware

4.1 PIC32MZ2048EFM100 INITIALIZATION

MPLAB® X IDE and MPLAB Harmony were used to develop the firmware for the
PIC32MZ2048EFM100 on the PIC32MZ EF Curiosity Development Board
(DM320104).

The MCU runs at 130 MHz and the SPI prescaler is set to perform a division by 2 in
order to obtain an SPI clock frequency of 65 MHz. This is the minimum SPI speed
required to successfully read 16 bits of data out of the ADC at 1 Msps.

In the firmware for this demo, a USB stack was used to achieve communication with
the GUI. Direct Memory Access (DMA) was used together with SPI and Output
Compare in order to acquire data, and to gate the clock during acquisition.

4.2 DATA ACQUISITION

In this demonstration, the ADC acquisition is triggered by the CONV pulse (RPD5),
which is generated by the OC2. The OC2 is generated by Timer3 (OCTSEL = 1).
Timer3 is also used to generate OC1 which triggers the DMA SPI transfer. Because
both the SPI transfer and CONV pulse are generated by the same timer, they are
synchronous. Figure 4-1 displays the timing diagram between the CONV pulse and
SPI transfer.

MCP331X1D 16/14/12-BIT,

USER’S GUIDE

FIGURE 4-1: SPI Transfer and CONV Pulse.

The reason for using OC2 and not SS is related to Electromagnetic Interference (EMI).
By using OC2, the user can control the timing between the falling edge of the CONV
pulse and SPI transfer, and also the timing between the data transfer and CONV rising
edge/ADC conversion start. For best EMI performance, it is recommended to keep a
few nanoseconds between the SPI data transfer and ADC conversion start.

 2018-2019 Microchip Technology Inc. DS50002733B-page 27

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

The ADC’s data conversion time is fixed (700 ns for the MCP33131D-10), but the input
acquisition time (300 ns for 1 Msps sampling rate) can be increased by the user for a
lower sampling rate. The ADC output data are transferred during the input acquisition
time (300 ns for 1 Msps sampling rate).

It is important to reduce external noises during the data conversion time for accurate
performance (i.e., higher SNR and SFDR). The high-speed SPI operation can disturb
the ADC’s data conversion during the data conversion time. Therefore, it is highly
recommended to allow at least 10 ns of quiet time between the last edge on the SPI
clock/data and the rising edge on the ADC conversion start pulse.

FIGURE 4-2: Input Acquisition (Input Sampling) and Data Conversion of the ADC Operation Sequence.

Once the data are transfered from the ADC to SPI, the DMA will place it in a 8192 word
buffer (ADC_BUFFER[]). Since the sampling speed is 1 Msps, this buffer will be
updated every 8.1 ms, making timing less critical for other tasks.

The GUI requires a larger amount of data to be processed in order to indicate accurate
performance characteristics: FFT, THD, SINAD, etc. Because of this, a larger data
buffer is created in RAM (storage[]) with a length of 262144 bytes. 32 DMA
transfers are required to fill this buffer. The flowchart in Figure 4-3 provides a simple
overview of the sample acquisition process and an overview of the entire firmware
process.

DS50002733B-page 28  2018-2019 Microchip Technology Inc.

Firmware

Start (Power On)

Sample ADC Input

(Standby Mode)

USB Transfer

Commands

Start (Power On)Start (Power On)

Calibrate ADC

(0x70)

Request Device ID

(0x60)

Configure SPI Speed

(0x81)

Request Single Shot

(0x50)

Transfer Data to GUI

(0x80)

ADC Self-Calibration

Self-Calibration

Complete

No

CNVST Rising
Edge Detected

No

Yes

Yes

ADC Input Conversion

CNVST Set to Logic Low

ADC Input

Conversion

Complete

No

Yes

ADC Transmits

Converted Data (SPI)

MCU Receives Incoming

Data (SPI)

Store Incoming Data in

ADC_BUFFER[]

(8192 bytes)

ADC_BUFFER[] Full

No

Transfer

ADC_BUFFER[]

Contents to Storage[]

(262144 bytes)

Yes

> 32768 Bytes

in Storage[]

No

Construct USB Transfer Packet:
(32768 bytes of sampled data +

512 bytes configuration and

settings information)

Yes

USB Transfer

Packet Ready

No

Transmit USB Transfer

Packet to GUI

Yes

Double Buffering

SPI DMA CH1

SPI DPA CH2

Get Calibration Status

(0x71)

ADC Calibrated?

Verify ADC Calibration

[0x71, 0x1] Chip is

Calibrated

[0x71, 0x0] Chip is

Uncalibrated

NoYes

4 Sampling Speeds:

1000 ksps
500 ksps
250 ksps
125 ksps

In this Mode, the Hardware SPI

SPI is Disabled and Switched

to Software SPI with a

Lower Speed.

It will Acquire One Sample and

Enable the Hardware SPI

Again.

512 bytes for
configuration

32768 bytes – samples

33280 bytes USB trans fer packet

FIGURE 4-3: Firmware Flowchart.

4.3 USB TRANSFER

The MCU firmware implements a WinUSB device to handle the data transfer between
the USB host (a PC for example) and the USB device (evaluation board).

Each USB transfer has a length of 33280 bytes out of which the first 512 bytes are
configuration and setting bytes. The remaining 32768 bytes will contain samples. This
will require eight logical transfers to be executed (Figure 4-4). The physical USB layer will
split the 33280 byte packets into 512 byte chunks before transmitting on the USB bus.

FIGURE 4-4: USB Transfer Frame.

 2018-2019 Microchip Technology Inc. DS50002733B-page 29

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

4.4 ADC FUNCTIONS

In addition to the actual sample transfer from MCU to PC, there are other ADC
functions available: Calibration, Read Device ID and Sampling Speed Change.

The PC not only receives data from the EVB, but it also sends 512 bits of data
back to the MCU. The 512-bit length size is required because of the USB
high-speed endpoint size. Out of these, only the first five are meaningful. The
first element, receivedDataBuffer[0], indicates to the MCU the desired function. For
0x80, the MCU will send samples. For 0x81, the transfer is stopped and the MCU RAM
is filled with samples from the ADC. The code will not perform transfers in the same
time as the acquisition of ADC samples.

The calibration function is executed when value 0x70 is received. Calibration status
function has code 0x71. Ta b le 4 - 1 provides the command structure byte values sent to,
and the responses from, the PIC32MZ2048EFM100 on the PIC32MZ EF Curiosity
Development Board (DM320104). Figure 4-5 displays the timing diagram of the
calibration process.

TABLE 4-1: COMMAND STRUCTURE BYTE VALUES

receivedDataB uffe r[x] transmitD ataBu ffer [x]

Command

Byte[0]

Send
Samples

Change
Sampling
Speed

Calibrate ADC 0x70 — — 0x70 0x01 — — [0x70, 0x01] – Command received

Calibration
Status

Acquire Single
Sample

Read Device ID0x60 — — 0x60 — — — [0x60, chip ID]

Byte[1]
Byte[2]

0x80 — [0 to 7]

0x81 — 1-4

0x71 — — 0x71 0x01 — — [0x71, 0x01] – Calibration successful,

0x50 — — 0x50 MSb LSb — [0x50, ADCHighByte, ADCLowByte]

Byte[3] Byte[0] Byte[1] Byte[2]

0x80 0x00 — — 33280-byte reply,

Package

Index

0x81 0x01 — — Select sampling speed from Byte[3] and

Sampling

Speed

0x80 0x01 — —

Byte[3]
Byte[4]
Byte[5]

Description

[0-511] – Irrelevant,
[512-33279] – Data samples,
Combine the read data into a 16b
signed value as follows:
dataH: dataL = read[odd index]:
read[even index]

change transmitDataBuffer[1] = 0x80 to
start sending data

successfully,
[0x70, 0x00] – Error

[0x71, 0x00] – Calibration failed

DS50002733B-page 30  2018-2019 Microchip Technology Inc.

FIGURE 4-5: ADC Calibration.

Firmware

The Read Device ID code is 0x60. In order to retrieve the Chip ID, more Read registers
are required. Figure 4-6 describes the Read register command format.

To retrieve the samples, the GUI will send to the MCU information on the packet
required to be received as an index, which is a number from 0 to 7. This index is sent
to the MCU in receivedDataBuffer[4].

Another function controlled by the GUI is the sampling speed change. There are four
available sampling speeds. These are selected in accordance with the value received
in receivedDataBuffer[3]. The sampling speed is controlled by changing the
prescaler of the reference system clock.

FIGURE 4-6: Read Register from ADC.

 2018-2019 Microchip Technology Inc. DS50002733B-page 31

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

NOTES:

DS50002733B-page 32  2018-2019 Microchip Technology Inc.

Appendix A. Schematics and Layout

A.1 INTRODUCTION

This appendix contains the following schematics and layouts for the MCP331X1D
16/14/12-Bit, 1 Msps SAR ADC Evaluation Board with 4 V

• Board – Schematic (Page 1 of 2)

• Board – Schematic (Page 2 of 2)

• Board – Top Silk Layer

• Board – Top Copper and Silk Layer

• Board – Top Copper Layer

• Board – Bottom Copper Layer

• Board – Bottom Copper and Silk Layer

• Board – Bottom Silk Layer

MCP331X1D 16/14/12-BIT,

1 MSPS SAR ADC EVALUATION KIT

USER’S GUIDE

(ADM00873):

REF

 2018-2019 Microchip Technology Inc. DS50002733B-page 33

DS50002733B-page 34  2018-2019 Microchip Technology Inc.

SAR ADC

GND

GND

DIFF DRIVER

GND GND

GND

GND

GND

GND

-1V_Out

+5.5V

+1.8V

ENABLE_MCP6D11

VIN1-

VIN1+

GND

Test GND Points

1k ±0.1%

R5

1k

R4

1k

R6

1k

R7

right angle

1uF

C9

0.1uF

C10

GND

0.1uF

DNP

C12

GND

GND

GND1 GND2 GND3 GND4

24R

R8

24R

R3

GND

GND

GND

100pF
25V

C7

GND

VREF

J1

J2

right angle

1

TP1

0.1uF

C15

0.1uFC11uF

C2

1uF

C16

1

DNP

IN1+

1

DNP

IN1-

0.1uF
16V

C59

GND

ENABLE_MCP6D11

1uF
25V0603

C64

1uF

C20

GND

VREF/2

0.062uF

C33

Capacitor NP

GND

0.062uF

DNP

C34

GND

Optional. BW = 50 kHz with 50 ohms//0.062 uF

Differential Input

8

24R

3

GND

G

* C_filter >20 x C_sample. * Keep fc< 500 kHz

20R

0603

1%

R9

GND

GND

DGND

GND

VIO_3.3V

VIO_3.3V

+5.5V

GND

GND

GND

GND

1uF

C3

1k

R37

GND

1uF
16V

C4

OUT

1

SHDN

4

GND

VDD

6

O

SHDN

GND

VDD

2,3,5

MCP1501/4.096V

U2

+5.5V

GNDGND

1uF
16V

C22

10μF
25V

C13

Reference: 4.096V

10.5R
0603
1%

R36

fc = 1/(2pi RC) = 689 Hz

1uF

25V

0603

C11

2.2uF

16V
0603

C5

7.15K
0603

1%

R25

13.3k
0603

1%

R43

0R

0603

DNP

R2

DNP

2nd Order LP: fc = 11 Hz

DNP if not needed

fc = 1/(2pi RC) = 16Hz

0R

R48

0R

R49

DNP

20R
0603

1%

R1

GND

Option: MIC920

+4.54 Vmax

ON

OFF

0R
0402

R18

0R
0402

R19

5.5V

GND

GND

C

1u

25V

0603

C

2.2u

16V

0603

C5

7.15K

0603

%

25

1

k

0603

%

R43

2nd Order

L

P

Hz

10.

0603

1%

R36

DNP

DEVICE ID3

DEVICE ID1

DEVICE ID2

DEVICE ID0

1 8
2 7
3 6
4 5

DIP 4 SPST

SW1

10k
0603
5%

R16

10k
0603
5%

R15

10k
0603
5%

R14

10k
0603
5%

R17

DGND

VIO_3.3V

SW1 is Device ID setting. Th is Device ID is read out from GUI.

1k

FB6

1k

FB4

+5.5V

0R

0402

DNP

R22

DNP

0R
0402

DNP

R23

DNP

DNP

0R
0402

DNP

R24

0R

0402

3.3V_from_MCU

DGND

DEVICE ID0

DEVICE ID1

SDO

SDI

SCK

CNV

DEVICE ID2

DEVICE ID3

1234567 8

J10_A

1234567 8

J10_B

MCU GND

DGND

MCU GND

5V_from_MCU

(MIKROBUS 2)

This connector is connected to the J10 on PIC32MZ Curiosity Board.

SDO

SDI

SCK

CNV

1

TP8

1k

FB8

1k

FB5

GND

1

DNP

TP7

VREF

k

R

10

μ

2

C13

30k
0603
5%

R13

0R
0603

R38

0R
0402

R39

0R

0402

DNP

R45

GND

DNP

0

0603

DNP

2.048V

22uF
16V
TANT-B

C21

u

C3

DNP

0.062uF

C33

DNP

F

10k
0603
1%

R12

47k
0603
1%

R52

GND

10k
0603

0.1%

R10

10k
0603

0.1%

R11

1

2

3

MMBD1503A

D4

1uF

C8

100pF
25V

C23

1k

FB7

GND

GND

VCOM

0R

R56

0R

R42

Remove R38 and R25

To by-pass U5: Populate R2,

+

1

P

-

uF

DNP

C

DNP

DNP

1

DNP

10uF
16V
TANT-A

C6

123

HDR-1.27 Male 1x3

DNP

J8

12

HDR-1.27 Male 1x2

DNP

J7

33R0603

R44

33R

0603

R53

33R 0603

R55

33R 0603

R54

VREF

1

AVdd

2

Ain+

3

VIO

10

VSS5CNV

6

SDO

7

Ain-

4

SCK

8

SDI

9

MCP33131D-10

U3

Vin+

3

Vin-

4

VOUT

1

VSS

2

VDD

5

Vi

n+

n-

VOUT

V

SS

VDD

Vi

n

V

Vi

n

V

V

MCP6286

U5

0R

R59

0R

R60

0R
DNP

R61

1 2

HDR-2.54 Male 1x2

J6

0R

DNP

R6

DNP

DNP

J8

DNP

al

e 1x2

NP

J

DNP

FB+

4

FB-

1

V+

5

OUT+

10

OUT-

11

V-

13

VOCM

9

IN+

2

V-14V-15V-

16

V+6V+7V+

8

IN-

3

DISABLE

12

EP

17

MCP6D11

U1

1800 pF

50V 0603
C0G

C35

1800 pF

50V 0603
C0G

C37

Note 1: DNP = Do Not Populate. The compo nents with DNP are not populated on the board.

Note 2: This board can be configured for a Sing le-Ended Input using one of the follo wing two options:

Option A : Short J6's two pi ns. This will set VCOM (VREF/2 = 2V) voltage at J2 (VIN1-). Apply analog inpu t to J1 only.

Option B: Short C34, and apply analog inpu t at J1 only.

This R56 separates analog GND and digital GND. See the PCB layout file for more details.

See Note 2

See Note 2

See Note 3

Note 3: If other than 4V Reference is needed, disconnect J7 from U2 output and apply WKH Reference Voltage at J7.

DNP

To Mother board

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

A.2 BOARD – SCHEMATIC (PAGE 1 OF 2)

1

0.062

4

NP

37

1

F

: fc = 11

R

3.3

1

11

F

1

HDR1.27 M

7

D

2

R

3

5V

IN1

0.1

DN

IN1

NP

12

R

R

4

ND

UT

2

5R

4.7uF
25V

0805

C47

4.7uF

25V0805

C45

0.1uF 50V 0805C46

56k
0805
1%

R31

4.7 uH

L9

22uF16V

C48

DNP

R28

30V 1A

D2

4.7uF
25V 0805

C52

1uH

L8

GND

-1V Circuit

+9V IN

Power Jack 2.5mm

2

3

1

J5

1uF
16V

C60

10uF
50V

C51

GND

GND

GND

1 mH

L6

47UH 2A

L5

+9V OUT

6V ADJ REGULATOR

GND

GND

GND

GND

EN

1

IN

2

OUT

3

BYP/ADJ

4

GND

EN

IN

O

P

G

5,6,7,8

MIC5219 ADJU9

1R
1%

R26

GND

2.2uF
50V

C42

470pF

50V

C44

GND

+9V OUT

10μF
25V
0805

C43

GND

GND

+5.5V

+9V OUT

GND

GND

2k
0603
1%

R57

Green

D1

To ADC Driver, Reference, & ADC Input Buffer

To DVIO

Rubber Pad Cyl D7.9H5.3

PAD1

Rubber Pad Cyl D7.9H5.3

PAD2

Rubber Pad Cyl D7.9H5.3

PAD3

Rubber Pad Cyl D7.9H5.3

PAD4

Rubber Pad Cyl D7.9H5.3

PAD5

To ADC Driver

Vout = 1.24 * (1+R2/R1)

3.3V ADJ REGULATOR

EN

1

IN

2

OUT

3

BYP/ADJ

4

GND

EN

N

OU

BY

P/

GND

5,6,7,8

MIC5219 ADJU4

1R
1%

R32

2.2uF
50V

C17

470pF

50V

C19

10μF
25V
0805

C18

VIO_3.3V

+9V OUT

237k
0603

±1%

R35

143k
0603
±1%

R34

EARTH

EARTH

GND

-1V

To ADC VDD

GND

GND

1.8V ADJ REGULATOR

GND

GND

EN

1

IN

2

OUT

3

BYP/ADJ

4

GND

EN

IN

O

BY

P/

GND

5,6,7,8

MIC5219 ADJU6

1R
1%

R40

GND

2.2uF
50V

C26

470pF

50V

C32

GND

10μF
25V
0805

C31

+1.8V

+9V OUT

158k
0603

±1%

R46

348k

0603

1%

R41

0R
0805

R47

GND

GND

GND

GND

GND

GND

1

TP4

1

TP5

1

TP6

1

TP9

Changed to Green LED

If 0V is needed: Disconnect -1V output, and connect to G ND.

280k
0603
1%

R30

82k
0603

1%

R27

0R
0402

R20

Note 2: Adding Ferr ite Bead (FB4, FB5) impro ves SNR (~3dB) and SFDR (~10dB).

1k

FB1

1k

FB2

1k

FB3

0R
0402
DNP

R21

GND

1N4148

D3

1

TP10

GND

-1V_Out

1

2

TERMINAL 1x2

H1

GND

10uF

20V

TANT-B

CT1

10uF

20V

TANT-B

C41

10uF
20V
TANT-B

C14

10uF
20V

TANT-B

C25

0R

R33

0R

R50

0R

R51

BOOST

1

GND

2

VFB

3

EN

4

SW

6

VIN

5

BOO

ST

GND

V

EN

SW

VIN

MCP16301/2V to 15V

U10

123

HDR-1.27 Male 1x3

DNP

J4

14k
0805
±1%

R29

0R

0402

0

0R

2

DNP

8

DNP

3/4" Standoff Nylon

STANDOFF1

Phillips Nyl on Screw 4 -40

SCR1

0R

R58

1 2

HDR-2.54 Male 1x2

J3

Shunt 2.54mm 1x2 Handle

JP1

22uF
25V
1210

C49

22uF
25V
1210

C50

M

DNP

J

DNP

ADAPTER 9V 12W 1.2A

PS1

Note 1: DNP = Do Not Populate. The compo nents with DNP are not populated on the board.

Earth GND is tied @ Layer 3
Signal GND is tied to C48

WARNING - R20 and R21 must never be populated at the same time.
R20: Enables -1V Circuit
R21: Disables -1V Circuit

 2018-2019 Microchip Technology Inc. DS50002733B-page 35

A.3 BOARD – SCHEMATIC (PAGE 2 OF 2)

UT

/ADJ

ND

I

T

ADJ

UT

ADJ

R2

R21

040

R2

NP

B

HDR

1.27

4

Schematics and Layouts

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

A.4 BOARD – TOP SILK LAYER

DS50002733B-page 36  2018-2019 Microchip Technology Inc.

A.5 BOARD – TOP COPPER AND SILK LAYER

Schematics and Layouts

 2018-2019 Microchip Technology Inc. DS50002733B-page 37

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

A.6 BOARD – TOP COPPER LAYER

DS50002733B-page 38  2018-2019 Microchip Technology Inc.

A.7 BOARD – BOTTOM COPPER LAYER

Schematics and Layouts

 2018-2019 Microchip Technology Inc. DS50002733B-page 39

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

A.8 BOARD – BOTTOM COPPER AND SILK LAYER

DS50002733B-page 40  2018-2019 Microchip Technology Inc.

A.9 BOARD – BOTTOM SILK LAYER

Schematics and Layouts

 2018-2019 Microchip Technology Inc. DS50002733B-page 41

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

NOTES:

DS50002733B-page 42  2018-2019 Microchip Technology Inc.

MCP331X1D 16/14/12-BIT,

1 MSPS SAR ADC EVALUATION KIT

USER’S GUIDE

Appendix B. Bill of Materials (BOM)

B.1 MCP331X1D EVALUATION BOARD – BILL OF MATERIALS (BOM)

TABLE B-1: MCP331X1D EVALUATION BOARD – BILL OF MATERIALS (BOM)

Qty. Reference Description Manufacturer Part Number

4 C1, C10, C15, C59 Capacitor, Ceramic, 0.1 µF, 16V,

10%, X7R, SMD, 0603

1 C11 Capacitor, Ceramic, 1 µF, 25V,

10%, X7R, SMD, 0603

0 C12 Capacitor, Ceramic, 0.1 µF, 16V,

10%, X7R, SMD, 0603

4 C13, C18, C31,

C43

4 C14, C25, C41,

CT1

3 C17, C26, C42 Capacitor, Ceramic, 2.2 µF, 50V,

3 C19, C32, C44 Capacitor, Ceramic, 470 pF, 50V,

3 C2, C16, C20 Capacitor, Ceramic, 1 µF, 16V,

1 C21 Capacitor, Tantalum, 22 µF, 16V,

4 C3, C8, C9, C22 Capacitor, Ceramic, 1 µF, 16V,

0 C33 0.062 µF, 1206, Ceramic, 50V,

0 C34 0.062 µF, 1206, Ceramic, 50V,

2 C35, C37 Multilayer Ceramic Capacitors

1 C4 Capacitor, Ceramic, 1 µF, 16V,

3 C45, C47, C52 Capacitor, Ceramic, 4.7 µF, 25V,

1 C46 Capacitor, Ceramic, 0.1 µF, 50V,

1 C48 Capacitor, Ceramic, 22 µF, 16V,

2 C49, C50 Capacitor, Ceramic, 22 µF, 25V,

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Capacitor, Ceramic, 10 µF,
±10%, 25V, X5R, MLCC, 0805

Capacitor, Tantalum, 10 µF, 20V,
10%, 2.1, SMD, B

10%, X7R, SMD, 1206

10%, X7R, SMD, 0603

10%, X7R, SMD, 0603

10%, 2.3, SMD, B

10%, X5R, SMD, 0603

5%, COG

5%, COG

MLCC – SMD/SMT, 0603,
1800 pF, 50V, C0G, 2%

20%, Y5V, SMD, 0805

10%, X7R, SMD, 0805

10%, X7R, SMD, 0805

20%, X5R, SMD, 1206

10%, X7R, SMD, 1210

AVX Corporation 0603YC104KAT2A

TDK Corporation CGA3E1X7R1E105K080AC

AVX Corporation 0603YC104KAT2A

Murata Electronics
North America, Inc.

AVX Corporation TAJB106K020RNJ

TDK Corporation CGA5L3X7R1H225K160AB

Johanson
Technology Inc.

TDK Corporation C1608X7R1C105K

AVX Corporation TAJB22226K016R

AVX Corporation 0603YD105KAT2A

Murata Electronics

Murata Electronics GRM31C5C1H623JA01L

Murata Electronics
North America, Inc.

AVX Corporation 0805YG105ZAT2A

TDK Corporation C2012X7R1E475K125AB

Yageo Corporation CC0805KRX7R9BB104

Panasonic

Samsung
Electro-Mechanics
America, Inc.

®

- ECG ECJ-3YB1C226M

GRM21BR61E106KA73L

500R14W471KV4T

®

GRM31C5C1H623JA01L

GCM1885C1H182GA16J

CL32B226KAJNFNE

(1)

 2018-2019 Microchip Technology Inc. DS50002733B-page 43

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

TABLE B-1: MCP331X1D EVALUATION BOARD – BILL OF MATERIALS (BOM)

(1)

(CONTINUED)

Qty. Reference Description Manufacturer Part Number

1 C5 Capacitor, Ceramic, 2.2 µF, 16V,

TDK Corporation C1608X5R1C225K

10%, X5R, SMD, 0603

1 C51 Capacitor, Ceramic, 10 µF, 50V,

TDK Corporation C3225X7S1H106M

20%, X7S, SMD, 1210

1 C6 Capacitor, Tantalum, 10 µF, 16V,

KEMET T491A106M016AS

20%, 8 SMD, A

1 C60 Capacitor, Ceramic, 1 µF, 16V,

Yageo Corporation CC0603KRX7R7BB105

10%, X7R, SMD, 0603

1 C64 Capacitor, Ceramic, 1 µF, 25V,

Panasonic

®

- ECG ECJ-1V41E105M

20%, X5R, SMD, 0603

2 C7, C23 Capacitor, Ceramic, 100 pF, 25V,

AVX Corporation 06033A101KAT2A

10%, NP0, SMD, 0603

1 D1 Diode, LED, Red, 2V, 30 mA,

Lite-On®, Inc. LTST-C190EKT

2 mcd, Clear, SMD, 0603

1 D2 Diode, Schottky, 30V, 1A,

Diodes Incorporated

®

PD3S130L-7

POWERDI323

1 D3 Diode, Rectifier, 1N4148,

Diodes Incorporated 1N4148WS-7-F

855 mV, 300 mA, 75V, SOD-323

1 D4 Diode, Rectifier, MMBD1503A,

1.1V, 200 mA, 200V, SMD,

Fairchild
Semiconductor

®

MMBD1503A

SOT-23-3

8 FB1, FB2, FB3,

Ferrite Bead, 1 k, 0603, 1LN Wurth Elektronik 742792662
FB4, FB5, FB6,
FB7, FB8

4 GND1, GND2,

GND3, GND4

1 H1 Connector, Terminal, 3.5 mm,

0 IN1+, IN1-, TP7 Connector, HDR-2.54, Male,

Connector, Test Point, Loop,

Black, TH

6A, Female, 1x2, TH, R/A

Keystone

5011

Electronics Corp.

Keystone

8722

Electronics Corp.

Samtec, Inc. TSW-101-07-L-S

1x1, Gold, 5.97MH, TH, Vertical

2 J1, J2 Connector, RF Coaxial, SMA,

Female, TH, R/A

2 J10_A, J10_B Connector, HDR-2.54, Male,

TE Connectivity

5-1814400-1

Alcoswitch

FCI 68001-108HLF

1x8, Gold, 5.84MH, TH

2 J3, J6 Connector, HDR-2.54, Male,

FCI 77311-118-02LF

1x2, Gold, 5.84MH, TH, Vertical

0 J4, J8 Connector, HDR, 1.27 mm, TH,

Harwin Plc. 952-3599-ND

Gold, 3POS

1 J5 Connector, Power Jack, Male,

CUI Inc. PJ-002B

2.5 mm, CLSD

0 J7 Connector, HDR-1.27, Male,

Harwin Plc. 952-3598-ND

1x2, Gold, TH, Vertical

1 JP1 Mechanical, HW, Jumper,

2.54 mm, 1x2, w/Handle

1 L5 Fixed Inductor, 47 H, 2A,

TE Connectivity
Alcoswitch

®

Bourns

, Inc. SRR1240-470M

880584-4

135 M, SMD

1 L6 Fixed Inductor, 1 MH, 250 MA,

Wurth Elektronik 7447462102

6 TH

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

DS50002733B-page 44  2018-2019 Microchip Technology Inc.

Bill of Materials (BOM)

TABLE B-1: MCP331X1D EVALUATION BOARD – BILL OF MATERIALS (BOM)

Qty. Reference Description Manufacturer Part Number

1 L8 Fixed Inductor, 1 µH, 1A, 60 M,

SMD

1 L9 Fixed Shielded Power Inductor,

4.7 µH

5 PAD1, PAD2,

PAD 3 , PAD4 ,
PAD 5

1 PCB1 Printed Circuit Board -

1 PS1 AC/DC, Wall Mount Adapter, 9V,

2 R1, R9 Resistor, Thin Film, 20R, 1%,

2 R10, R11 Resistor, Thin Film, 10 k, 0.1%,

1 R12 Resistor, Thin Film, 10 k, 1%,

1 R13 Resistor, Thick Film, 30 k, 5%,

4 R14, R15, R16,

R17

2 R18, R19 Resistor, Thick Film, 0R, SMD,

0 R2, R61 Resistor, Thick Film, 0R, 1/10W,

2 R20, R39 Resistor, Thick Film, 0R, 1/16W,

0 R21, R45 Resistor, Thick Film, 0R, 1/16W,

0 R22, R23, R24 Resistor, Thick Film, 0R, SMD,

1 R25 Resistor, Thick Film, 7.15 k,

3 R26, R32, R40 Resistor, Thick Film, 1R, 1%,

1 R27 Resistor, Thick Film, 82 k, 1%,

0 R28 Resistor, Thick Film, 35.7 k

1 R29 Resistor, Thick Film, 14 k, 1%,

2 R3, R8 Resistor, Thick Film, 24R, 1%,

1 R30 Resistor, Thick Film, 280 k

1 R31 Resistor, Thick Film, 56 k, 1%,

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Mechanical HW Rubber Pad,
Cylindrical, D7.9, H5.3, Black

MCP331X1D 16/14/12-Bit,
1 Msps SAR ADC Evaluation
Board

12W, 1.2A, 2.5 mm, I.D

1/16W, SMD, 0603

1/10W, SMD, 0603

1/16W, SMD, 0603

1/10W, SMD, 0603

Resistor, Thick Film, 10 k, 5%
1/10W, SMD, 0603

0402

SMD, 0603

SMD, 0402

SMD, 0402

0402

1%, 1/10W, SMD, 0603

1/10W, SMD, 0603

1/10W, SMD, 0603

1%, 1/10W, SMD, 0603

1/8W, SMD, 0805

1/10W, SMD, 0603

1%, 1/10W, SMD, 0603

1/8W, SMD, 0805

Murata Electronics
North America, Inc.

Coilcraft LPS3015-472MLB

3M SJ61A11

Microchip
Technology Inc.

CUI Inc. SWI12-9-N-P6

Stackpole
Electronics, Inc.

Panasonic

TE Connectivity
Alcoswitch

Panasonic - ECG ERJ-3GEYJ303V

Panasonic - ECG ERJ-3GEYJ103V

Panasonic - ECG ERJ-2GE0R00X

Panasonic - ECG ERJ-3GSY0R00V

Yageo Corporation RC0402JR-070RL

Yageo Corporation RC0402JR-070RL

Panasonic - ECG ERJ-2GE0R00X

Panasonic - ECG ERJ-3EKF7151V

ROHM
Semiconductor

Panasonic - ECG ERJ-3EKF8202V

Vishay/Dale CRCW060335K7FKEA

Panasonic - ECG ERJ-6ENF1402V

Yageo Corporation RC0603FR-0724RL

Panasonic - ECG ERJ-3EKF2803V

Vishay/Dale CRCW080556K0FKEA

®

- ECG ERA-3AEB103V

LQH32CN1R0M33L

04-10726-R1

RNCP0603FTD20R0

5-1879337-9

KTR03EZPF1R00

(1)

(CONTINUED)

 2018-2019 Microchip Technology Inc. DS50002733B-page 45

MCP331X1D 16/14/12-Bit, 1 Msps SAR ADC Evaluation Kit User’s Guide

TABLE B-1: MCP331X1D EVALUATION BOARD – BILL OF MATERIALS (BOM)

Qty. Reference Description Manufacturer Part Number

11 R33, R38, R42,

R48, R49, R50,
R51, R56, R58,
R59, R60

1 R34 Resistor, SMD, 143 k, 1%,

1 R35 Resistor, SMD, 237 k 1%,

1 R36 Resistor, Thick Film, 10.5R, 1%,

5 R4, R5, R6, R7,

R37

1 R41 Resistor, Thick Film, 348 k,

1 R43 Resistor, Thick Film, 13.3 k,

4 R44, R53, R54,

R55

1 R46 Resistor, Thick Film, 158 k, 1%,

1 R47 Resistor, Thick Film, 0R, 1/8W,

1 R52 Resistor, Thick Film, 47 k, 1%,

1 R57 Resistor, Thick Film, 2 k, 1%,

1 SCR1 Mechanical HW Machine Screw,

1 STANDOFF1 Mechanical HW Standoff,

1 SW1 Switch Dip, 4-POS, Slide, SMD, 6VNidec Copal

7 TP1, TP4, TP5,

TP6, TP8, TP9,
TP10

1 U1 MCHP Analog Op Amp,

1 U10 MCHP Analog Switcher Buck,

1 U2 MCHP Analog V

1 U3 MCP33131D-10-I/MS Microchip

3 U4, U6, U9 MCHP Analog LDO, 2.5V-5V,

1 U5 IC Op Amp GP, 3.5 MHz, RRO,

Note 1: The components listed in this Bill of Materials are representative of the PCB assembly. The released BOM

used in manufacturing uses all RoHS-compliant components.

Resistor, Thick Film, 0R, 1/10W,

SMD, 0603

1/10W, 0603

1/10W, 0603

1/10W, SMD, 0603

Resistor, Thin Film, 1 k, 0.1%,

1/10W, SMD, 0603

1/10W, 1%, SMD, 0603

1%, 1/10W, SMD, 0603

Resistor, Thick Film, 33R, 1%,

1/10W, SMD, 0603

1/10W, SMD, 0603

SMD, 0805

1/10W, SMD, 0603

1/10W, SMD, 0603

Pan Phillips, 4-40, NYLON

#4-40 x 3/4", F/F, Hex, Nylon

Connector, HDR-2.54, Male,

1x1, Gold, 5.97MH, TH, Vertical

MCP6D11-MG16, QFN-16

2V to 15V, MCP16301T-I/CHY,

SOT-23-6

, 4.096V,

MCP1501T-40E/CHY, SOT-23-6

MIC5219YMM, MSOP-8

SOT23-5

REF

Panasonic® - ECG ERJ-3GSY0R00V

Bourns, Inc. CR0603-FX-1433ELF

Stackpole
Electronics, Inc.

Vishay/Dale CRCW060310R5FKEA

Panasonic - ECG ERA-3AEB102V

Stackpole
Electronics, Inc.

Stackpole
Electronics, Inc.

ROHM
Semiconductor

Yageo Corporation RC0603FR-07158KL

Panasonic - ECG ERJ-6GEY0R00V

Panasonic - ECG ERJ-3EKF4702V

Panasonic - ECG ERJ-3EKF2001V

™

B&F

Fasteners

Supply

Keystone
Electronics Corp.

Electronics, Inc.

Samtec, Inc. TSW-101-07-L-S

Microchip
Technology Inc.

Microchip
Technology Inc.

Microchip
Technology Inc.

Technology Inc.

Microchip
Technology Inc.

Microchip
Technology Inc.

RMCF0603FT237K

RMCF0603FT348K

RMCF0603FT13K3

MCR03EZPFX33R0

H544-ND

1902D

CHS-04TB

MCP6D11-MG16

MCP16301T-I/CHY

MCP1501T-40E/CHY

MCP33131D-10-I/MS

MIC5219YMM

MCP6286T-E/OT

(1)

(CONTINUED)

DS50002733B-page 46  2018-2019 Microchip Technology Inc.

NOTES:

Bill of Materials (BOM)

 2018-2019 Microchip Technology Inc. DS50002733B-page 47

Worldwide Sales and Service

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
Fax: [phone]
Technical Support:

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Web Address:

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Detroit

Novi, MI
Tel: [phone]

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Tel: [phone]

Indianapolis

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Tel: [phone]
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Tel: [phone]

Los Angeles

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Raleigh, NC

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New York, NY

Tel: [phone]

San Jose, CA

Tel: [phone]
Tel: [phone]

Canada - Toronto

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Australia - Sydney

Tel: [phone]

China - Beijing

Tel: [phone]

China - Chengdu

Tel: [phone]

China - Chongqing

Tel: [phone]

China - Dongguan

Tel: [phone]

China - Guangzhou

Tel: [phone]

China - Hangzhou

Tel: [phone]

China - Hong Kong SAR

Tel: [phone]

China - Nanjing

Tel: [phone]

China - Qingdao

Tel: [phone]

China - Shanghai

Tel: [phone]

China - Shenyang

Tel: [phone]

China - Shenzhen

Tel: [phone]

China - Suzhou

Tel: [phone]

China - Wuhan

Tel: [phone]

China - Xian

Tel: [phone]

China - Xiamen

Tel: [phone]

China - Zhuhai

Tel: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]

India - New Delhi

Tel: [phone]

India - Pune

Tel: [phone]

Japan - Osaka

Tel: [phone]

Japan - Tokyo

Tel: [phone]

Korea - Daegu

Tel: [phone]

Korea - Seoul

Tel: [phone]

Malaysia - Kuala Lumpur

Tel: [phone]

Malaysia - Penang

Tel: [phone]

Philippines - Manila

Tel: [phone]

Singapore

Tel: [phone]

Taiwan - Hsin Chu

Tel: [phone]

Taiwan - Kaohsiung

Tel: [phone]

Taiwan - Taipei

Tel: [phone]

Thailand - Bangkok

Tel: [phone]

Vietnam - Ho Chi Minh

Tel: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]

Denmark - Copenhagen

Tel: [phone]
Fax: [phone]

Finland - Espoo

Tel: [phone]

France - Paris

Tel: [phone]
Fax: [phone]

Germany - Garching

Tel: [phone]

Germany - Haan

Tel: [phone]

Germany - Heilbronn

Tel: [phone]

Germany - Karlsruhe

Tel: [phone]

Germany - Munich

Tel: [phone]
Fax: [phone]

Germany - Rosenheim

Tel: [phone]

Israel - Ra’anana

Tel: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Italy - Padova

Tel: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

Norway - Trondheim

Tel: [phone]

Poland - Warsaw

Tel: [phone]

Romania - Bucharest

Tel: [phone]

Spain - Madrid

Tel: [phone]
Fax: [phone]

Sweden - Gothenberg

Tel: [phone]

Sweden - Stockholm

Tel: [phone]

UK - Wokingham

Tel: [phone]
Fax: [phone]

DS50002733B-page 48  2018-2019 Microchip Technology Inc.

05/14/19