MICROCHIP MCP1702 Technical data

1
3
2
V
IN
GND V
OUT
MCP1702
1
2
3
V
IN
GND V
OUT
MCP1702
3-Pin SOT-23A
3-Pin SOT-89
V
IN
3-Pin TO-92
12
V
OUT
V
IN
GND
Bottom
View
3
查询MCP1702T-1202E/CB供应商
250 mA Low Quiescent Current LDO Regulator
MCP1702
Features
• 2.0 µA Quiescent Current (typical)
• Input Operating Voltage Range: 2.7V to 13.2V
• 250 mA Output Current for Output Voltages ≥ 2.5V
• 200 mA Output Current for Output Voltages < 2.5V
• Low Dropout (LDO) voltage
• 0.4% Typical Output Voltage Tolerance
• Standard Output Voltage Options:
• Output voltage range 1.2V to 5.5V in 0.1V
• Stable with 1.0 µF to 22 µF Output Capacitor
• Short-Circuit Protection
• Overtemperature Protection
Applications
• Battery-powered Devices
• Battery-powered Alarm Circuits
• Smoke Detectors
•CO
• Pagers and Cellular Phones
• Smart Battery Packs
• Low Quiescent Current Voltage Reference
•PDAs
• Digital Cameras
• Microcontroller Power
• Solar-Powered Instruments
• Consumer Products
• Battery Powered Data Loggers
Related Literature
• AN765, “Using Microchip’s Micropower LDOs”,
• AN766, “Pin-Compatible CMOS Upgrades to
• AN792, “A Method to Determine How Much
- 1.2V, 1.5V, 1.8V, 2.5V, 2.8V,
3.0V, 3.3V, 4.0V, 5.0V
Increments (50 mV increments available upon request)
2
Detectors
OUT
= 2.8V)
DS00765, Microchip Technology Inc., 2002
BiPolar LDOs”, DS00766, Microchip Technology Inc., 2002
Power a SOT-23 Can Dissipate in an Application”, DS00792, Microchip Technology Inc., 2001
Description
The MCP1702 is a family of CMOS low dropout (LDO) voltage regulators that can deliver up to 250 mA of current while consuming only 2.0 µA of quiescent current (typical). The input operating range is specified from 2.7V to 13.2V, making it an ideal choice for two to six primary cell battery-powered applications, 9V alkaline and one or two cell Li-Ion-powered applications.
The MCP1702 is capable of delivering 250 mA with only 625 mV (typical) of input to output voltage differential (V of the MCP1702 is typically ±0.4% at +25°C and ±3% maximum over the operating junction temperature range of -40°C to +125°C. Line regulation is ±0.1% typical at +25°C.
Output voltages available for the MCP1702 range from
1.2V to 5.0V. The LDO output is stable when using only 1 µF of output capacitance. Ceramic, tantalum or aluminum electrolytic capacitors can all be used for input and output. Overcurrent limit and overtemperature shutdown provide a robust solution for any application.
Package options include the SOT-23A, SOT-89-3, and TO-92.
= 2.8V). The output voltage tolerance
OUT
Package Types
© 2007 Microchip Technology Inc. DS22008B-page 1
MCP1702
+
-
MCP1702
V
IN
V
OUT
GND
+V
IN
Error Amplifier
Voltage
Reference
Overcurrent
Overtemperature
MCP1702
V
IN
C
IN
1µF Ceramic
C
OUT
1 µF Ceramic
V
OUT
V
IN
3.3V
I
OUT
50 mA
GND
V
OUT
9V Battery
+
Functional Block Diagrams
Typical Application Circuits
DS22008B-page 2 © 2007 Microchip Technology Inc.
MCP1702
1.0 ELECTRICAL CHARACTERISTICS
† Notice: Stresses above those listed under “Maximum Rat-
ings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the
Absolute Maximum Ratings †
VDD...............................................................................+14.5V
All inputs and outputs w.r.t. .............(V
-0.3V) to (VIN+0.3V)
SS
operational listings of this specification is not implied. Expo­sure to maximum rating conditions for extended periods may affect device reliability.
Peak Output Current ...................................................500 mA
Storage temperature .....................................-65°C to +150°C
Maximum Junction Temperature...................................150°C
Operating Junction Temperature...................-40°C to +125°C
ESD protection on all pins (HBM;MM)............... ≥ 4kV; ≥ 400V
DC CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = V
I
= 100 µA, C
LOAD
Boldface type applies for junction temperatures, T
= 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.
OUT
of -40°C to +125°C. (Note 7)
J
OUT(MAX)
Parameters Sym Min Typ Max Units Conditions
Input / Output Characteristics
Input Operating Voltage V Input Quiescent Current I Maximum Output Current I
OUT_mA
IN
q
2.7 13.2 V Note 1 —2.0 5 µA IL = 0 mA
250 —— mAFor V
50 100 mA For V 100 130 mA For V 150 200 mA For V 200 250 mA For V
Output Short Circuit Current I
OUT_SC
Output Voltage Regulation V
Temperature Coefficient TCV
V
OUT
Line Regulation ΔV
(V
OUT
Load Regulation
Note 1: The minimum V
2: V
is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
R
The input voltage V
3: TCV
OUT
= (V
temperature range. V
ΔV
OUT/VOUT
must meet two conditions: VIN ≥ 2.7V and VIN V
IN
= V
IN
OUT-HIGH
- V
OUT-LOW
OUT
OUT
/
OUT
XΔVIN)
OUT(MAX)
OUT-LOW
= lowest voltage measured over the temperature range.
400 mA VIN = V
VR-3.0%
V
-2.0%
R
±0.4%VR+3.0%
V
R
V
+2.0%
R
V Note 2
—50150 ppm/°C Note 3
-0.3 ±0.1 +0.3 %/V (V
-2.5 ±1.0 +2.5 %IL = 1.0 mA to 250 mA for VR 2.5V
+ V
= highest voltage measured over the
+ V
DROPOUT(MAX)
or VIN = 2.7V (whichever is greater); I
) *106 / (VR * ΔTemperature), V
OUT(MAX)
OUT-HIGH
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of V
OUT(MAX)
+ V
DROPOUT(MAX)
or 2.7V, whichever is greater.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
, TJ, θJA). Exceeding the maximum allowable power
A
junction temperatures above 150°C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
+ V
DROPOUT(MAX)
2.5V
R
< 2.5V, VIN 2.7V
R
< 2.5V, VIN 2.95V
R
< 2.5V, VIN 3.2V
R
< 2.5V, VIN 3.45V
R
(Note 1), V
IN(MIN)
Current (average current) measured 10 ms after short is applied.
OUT(MAX)
V
I
= 1.0 mA to 200 mA for VR < 2.5V,
L
V
IN
DROPOUT(MAX)
+ V
13.2V, (Note 1)
IN
DROPOUT(MAX)
= 3.45V Note 4
.
= 100 µA.
OUT
.
OUT
, Note 1,
= GND,
OUT
)
© 2007 Microchip Technology Inc. DS22008B-page 3
MCP1702
DC CHARACTERISTICS (CONTINUED)
Electrical Specifications: Unless otherwise specified, all limits are established for VIN = V
I
= 100 µA, C
LOAD
Boldface type applies for junction temperatures, T
= 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.
OUT
of -40°C to +125°C. (Note 7)
J
OUT(MAX)
Parameters Sym Min Typ Max Units Conditions
Dropout Voltage
(Note 1, Note 5)
V
DROPOUT
330 650 mV IL = 250 mA, VR = 5.0V — 525 725 mV I — 625 975 mV I — 750 1100 mV I —— mV V
Output Delay Time T
Output Noise e Power Supply Ripple
PSRR 44 dB f = 100 Hz, C
DELAY
N
1000 µs VIN = 0V to 6V, V
—8 µV/(Hz)
1/2
Rejection Ratio
Thermal Shutdown Protection T
Note 1: The minimum V
2: V
is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.
R
The input voltage V
3: TCV
= (V
OUT
temperature range. V
must meet two conditions: VIN ≥ 2.7V and VIN V
IN
= V
IN
OUT-HIGH
- V
OUT-LOW
SD
OUT(MAX) OUT-LOW
= lowest voltage measured over the temperature range.
150 °C
+ V
DROPOUT(MAX)
or VIN = 2.7V (whichever is greater); I
) *106 / (VR * ΔTemperature), V
OUT(MAX)
OUT-HIGH
+ V
= highest voltage measured over the
4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output
voltage due to heating effects are determined using thermal regulation specification TCV
5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured
value with an applied input voltage of V
OUT(MAX)
+ V
DROPOUT(MAX)
or 2.7V, whichever is greater.
6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained
, TJ, θJA). Exceeding the maximum allowable power
A
junction temperatures above 150°C can impact the device reliability.
7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the
desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.
+ V
DROPOUT(MAX)
= 250 mA, 3.3V ≤ VR < 5.0V
L
= 250 mA, 2.8V ≤ VR < 3.3V
L
= 250 mA, 2.5V ≤ VR < 2.8V
L
< 2.5V, See Maximum Output
R
Current Parameter
R
= 50Ω resistive
L
OUT
IL = 50 mA, f = 1 kHz, C
= 1 µF, IL = 50 mA,
V
INAC
V
=1.2V
R
DROPOUT(MAX)
OUT
= 100 mV pk-pk, CIN = 0 µF,
.
= 100 µA.
OUT
.
OUT
, Note 1,
= 90% VR
= 1 µF
OUT
TEMPERATURE SPECIFICATIONS (NOTE 1)
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range T Operating Temperature Range T Storage Temperature Range T
J
J
A
Thermal Package Resistance
Thermal Resistance, 3L-SOT-23A
Thermal Resistance, 3L-SOT-89
Thermal Resistance, 3L-TO-92 θ
θ
JA
θ
JC
θ
JA
θ
JC
JA
θ
JC
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction
temperature and the thermal resistance from junction to air (i.e., T dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.
DS22008B-page 4 © 2007 Microchip Technology Inc.
-40 +125 °C
-40 +125 °C
-65 +150 °C
—336—°C/W
EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board
—110—°C/W
—52—°C/W
EIA/JEDEC JESD51-7
FR-4 0.063 4-Layer Board —10—°C/W — 131.9 °C/W — 66.3 °C/W
, TJ, θJA). Exceeding the maximum allowable power
A
MCP1702
0.00
1.00
2.00
3.00
4.00
5.00
2468101214
Input Voltage (V)
Quiescent Current (µA)
V
OUT
+25°C
+130°C
-45°C
0°C
+90°C
0.00
1.00
2.00
3.00
4.00
5.00
3 5 7 9 11 13
Input Voltage (V)
Quiescent Current (µA)
V
OUT
+25°C
+130°C
-45°C
0°C
+90°C
1.00
2.00
3.00
4.00
5.00
67891011121314
Input Voltage (V)
Quiescent Current (µA)
V
OUT
+25°C
+130°C
-45°C
0°C
+90°C
0.00
20.00
40.00
60.00
80.00
100.00
120.00
0 40 80 120 160 200
Load Current (mA)
GND Current (µA)
Temperature = +25°C
V
OUT
= 1.2V
V
IN
= 2.7V
0.00
20.00
40.00
60.00
80.00
100.00
120.00
0 50 100 150 200 250
Load Current (mA)
GND Current (µA)
Temperature = +25°C
V
OUT
= 5.0V
V
IN
= 6.0V
V
OUT
= 2.8V
V
IN
= 3.8V
0.00
0.50
1.00
1.50
2.00
2.50
3.00
-45-20 5 305580105130
Junction Temperature (°C)
Quiescent Current (µA)
I
OUT
V
OUT
= 5.0V
V
IN
= 6.0V
V
OUT
= 1.2V
V
IN
= 2.7V
V
OUT
= 2.8V
V
IN
= 3.8V
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated: VR = 2.8V, C TA = +25°C, VIN = V
OUT(MAX)
+ V
DROPOUT(MAX)
= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
OUT
.
Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.
= 1.2V
FIGURE 2-1: Quiescent Current vs. Input Voltage.
= 2.8V
FIGURE 2-4: Ground Current vs. Load Current.
FIGURE 2-2: Quiescent Current vs.Input Voltage.
FIGURE 2-3: Quiescent Current vs.Input Voltage.
© 2007 Microchip Technology Inc. DS22008B-page 5
= 5.0V
FIGURE 2-5: Ground Current vs. Load Current.
= 0 mA
FIGURE 2-6: Quiescent Current vs. Junction Temperature.
MCP1702
1.18
1.19
1.20
1.21
1.22
1.23
1.24
2468101214
Input Voltage (V)
Output Voltage (V)
V
OUT
I
LOAD
+25°C
+130°C
-45°C
0°C
+90°C
2.77
2.78
2.79
2.80
2.81
2.82
2.83
2.84
2.85
3 4 5 6 7 8 9 1011121314
Input Voltage (V)
Output Voltage (V)
V
OUT
= 2.8V
I
LOAD
= 0.1 mA
+25°C
+130°C
-45°C
0°C
+90°C
4.96
4.98
5.00
5.02
5.04
5.06
6 7 8 9 10 11 12 13 14
Input Voltage (V)
Output Voltage (V)
V
OUT
= 5.0V
I
LOAD
= 0.1 mA
+25°C
+130°C
-45°C
0°C
+90°C
1.18
1.19
1.20
1.21
1.22
1.23
0 20406080100
Load Current (mA)
Output Voltage (V)
V
OUT
+25°C
+130°C
-45°C
0°C
+90°C
2.77
2.78
2.79
2.80
2.81
2.82
2.83
0 50 100 150 200 250
Load Current (mA)
Output Voltage (V)
V
OUT
+25°C
+130°C
-45°C
0°C
+90°C
4.96
4.97
4.98
4.99
5.00
5.01
5.02
5.03
5.04
0 50 100 150 200 250
Load Current (mA)
Output Voltage (V)
V
OUT
+25°C
+130°C
-45°C
0°C
+90°C
Note: Unless otherwise indicated: VR = 2.8V, C
TA = +25°C, VIN = V
OUT(MAX)
+ V
DROPOUT(MAX)
OUT
.
= 1.2V
= 0.1 mA
FIGURE 2-7: Output Voltage vs. Input Voltage.
= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
= 1.2V
FIGURE 2-10: Output Voltage vs. Load Current.
= 2.8V
FIGURE 2-8: Output Voltage vs. Input Voltage.
FIGURE 2-9: Output Voltage vs. Input Voltage.
DS22008B-page 6 © 2007 Microchip Technology Inc.
FIGURE 2-11: Output Voltage vs. Load Current.
= 5.0V
FIGURE 2-12: Output Voltage vs. Load Current.
MCP1702
0.60
0.70
0.80
0.90
1.00
1.10
1.20
1.30
1.40
100 120 140 160 180 200
Load Current (mA)
Dropout Voltage (V)
V
OUT
= 1.8V
+25°C
+130°C
-45°C
0°C
+90°C
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
0 25 50 75 100 125 150 175 200 225 250
Load Current (mA)
Dropout Voltage (V)
V
OUT
= 2.8V
+25°C
+130°C
+0°C
-45°C
+90°C
0.00
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0 25 50 75 100 125 150 175 200 225 250
Load Current (mA)
Dropout Voltage (V)
V
OUT
= 5.0V
+25°C
+130°C
+0°C
-45°C
+90°C
0.00
100.00
200.00
300.00
400.00
500.00
600.00
4 6 8 10 12 14
Input Voltage (V)
Short Circuit Current (mA)
V
OUT
= 2.8V
R
OUT
< 0.1
Note: Unless otherwise indicated: VR = 2.8V, C TA = +25°C, VIN = V
OUT(MAX)
+ V
DROPOUT(MAX)
OUT
.
FIGURE 2-13: Dropout Voltage vs. Load Current.
= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
FIGURE 2-16: Dynamic Line Response.
FIGURE 2-14: Dropout Voltage vs. Load
Current.
FIGURE 2-15: Dropout Voltage vs. Load Current.
© 2007 Microchip Technology Inc. DS22008B-page 7
FIGURE 2-17: Dynamic Line Response.
FIGURE 2-18: Short Circuit Current vs.
Input Voltage.
MCP1702
-0.30
-0.25
-0.20
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
0.20
-45-20 5 305580105130
Temperature (°C)
Load Regulation (%)
V
OUT
= 1.2V
I
LOAD
= 0.1 mA to 200 mA
VIN = 4V
VIN = 13.2V
VIN = 6V
VIN = 12VVIN = 10V
-0.60
-0.50
-0.40
-0.30
-0.20
-0.10
0.00
0.10
0.20
0.30
0.40
-45-20 5 305580105130
Temperature (°C)
Load Regulation (%)
V
OUT
I
LOAD
= 1 mA to 250 mA
VIN = 3.8V
VIN = 13.2V
VIN = 10V
VIN = 6V
-0.10
0.00
0.10
0.20
0.30
0.40
-45-20 5 305580105130
Temperature (°C)
Load Regulation (%)
V
OUT
I
LOAD
VIN = 6V
VIN = 13.2V
VIN = 8V
VIN = 10V
0.00
0.04
0.08
0.12
0.16
0.20
-45-20 5 305580105130
Temperature (°C)
Line Regulation (%/V)
V
OUT
V
IN
1 mA
100 mA
0 mA
0.00
0.04
0.08
0.12
0.16
0.20
-45-20 5 305580105130
Temperature (°C)
Line Regulation (%/V)
V
OUT
= 2.8V
V
IN
= 3.8V to 13.2V
200 mA
100 mA
0 mA
250 mA
0.06
0.08
0.10
0.12
0.14
0.16
-45-20 5 305580105130
Temperature (°C)
Line Regulation (%/V)
V
OUT
= 5.0V
V
IN
= 6.0V to 13.2V
200 mA
100 mA
0 mA
250 mA
Note: Unless otherwise indicated: VR = 2.8V, C
TA = +25°C, VIN = V
OUT(MAX)
+ V
DROPOUT(MAX)
FIGURE 2-19: Load Regulation vs.
Temperature.
= 2.8V
= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,
OUT
.
= 2.7V to 13.2V
FIGURE 2-22: Line Regulation vs.
Temperature.
= 1.2V
FIGURE 2-20: Load Regulation vs.
Temperature.
FIGURE 2-21: Load Regulation vs.
Temperature.
DS22008B-page 8 © 2007 Microchip Technology Inc.
= 1 mA to 250 mA
= 5.0V
FIGURE 2-23: Line Regulation vs.
Temperature.
FIGURE 2-24: Line Regulation vs. Temperature.
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