MICROCHIP MCP1702 Technical data

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GND V

OUT

MCP1702

GND V

OUT

MCP1702

3-Pin SOT-23A

3-Pin SOT-89

3-Pin TO-92

OUT

GND

Bottom

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查询MCP1702T-1202E/CB供应商

250 mA Low Quiescent Current LDO Regulator

MCP1702

Features

• 2.0 µA Quiescent Current (typical)

• Input Operating Voltage Range: 2.7V to 13.2V

• 250 mA Output Current for Output Voltages ≥ 2.5V

• 200 mA Output Current for Output Voltages < 2.5V

• Low Dropout (LDO) voltage

• 0.4% Typical Output Voltage Tolerance

• Standard Output Voltage Options:

• Output voltage range 1.2V to 5.5V in 0.1V

• Stable with 1.0 µF to 22 µF Output Capacitor

• Short-Circuit Protection

• Overtemperature Protection

Applications

• Battery-powered Devices

• Battery-powered Alarm Circuits

• Smoke Detectors

•CO

• Pagers and Cellular Phones

• Smart Battery Packs

• Low Quiescent Current Voltage Reference

•PDAs

• Digital Cameras

• Microcontroller Power

• Solar-Powered Instruments

• Consumer Products

• Battery Powered Data Loggers

Related Literature

• AN765, “Using Microchip’s Micropower LDOs”,

• AN766, “Pin-Compatible CMOS Upgrades to

• AN792, “A Method to Determine How Much

- 625 mV typical @ 250 mA (V

- 1.2V, 1.5V, 1.8V, 2.5V, 2.8V,

3.0V, 3.3V, 4.0V, 5.0V

Increments (50 mV increments available upon request)

Detectors

OUT

= 2.8V)

DS00765, Microchip Technology Inc., 2002

BiPolar LDOs”, DS00766, Microchip Technology Inc., 2002

Power a SOT-23 Can Dissipate in an Application”, DS00792, Microchip Technology Inc., 2001

Description

The MCP1702 is a family of CMOS low dropout (LDO) voltage regulators that can deliver up to 250 mA of current while consuming only 2.0 µA of quiescent current (typical). The input operating range is specified from 2.7V to 13.2V, making it an ideal choice for two to six primary cell battery-powered applications, 9V alkaline and one or two cell Li-Ion-powered applications.

The MCP1702 is capable of delivering 250 mA with only 625 mV (typical) of input to output voltage differential (V of the MCP1702 is typically ±0.4% at +25°C and ±3% maximum over the operating junction temperature range of -40°C to +125°C. Line regulation is ±0.1% typical at +25°C.

Output voltages available for the MCP1702 range from

1.2V to 5.0V. The LDO output is stable when using only 1 µF of output capacitance. Ceramic, tantalum or aluminum electrolytic capacitors can all be used for input and output. Overcurrent limit and overtemperature shutdown provide a robust solution for any application.

Package options include the SOT-23A, SOT-89-3, and TO-92.

= 2.8V). The output voltage tolerance

OUT

Package Types

MCP1702

OUT

GND

Error Amplifier

Voltage

Reference

Overcurrent

Overtemperature

MCP1702

1µF Ceramic

OUT

1 µF Ceramic

OUT

3.3V

OUT

50 mA

GND

OUT

9V Battery

Functional Block Diagrams

Typical Application Circuits

MCP1702

1.0 ELECTRICAL CHARACTERISTICS

† Notice: Stresses above those listed under “Maximum Rat-

ings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the

Absolute Maximum Ratings †

VDD...............................................................................+14.5V

All inputs and outputs w.r.t. .............(V

-0.3V) to (VIN+0.3V)

operational listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.

Peak Output Current ...................................................500 mA

Storage temperature .....................................-65°C to +150°C

Maximum Junction Temperature...................................150°C

Operating Junction Temperature...................-40°C to +125°C

ESD protection on all pins (HBM;MM)............... ≥ 4kV; ≥ 400V

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise specified, all limits are established for VIN = V

= 100 µA, C

LOAD

Boldface type applies for junction temperatures, T

= 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.

OUT

of -40°C to +125°C. (Note 7)

OUT(MAX)

Parameters Sym Min Typ Max Units Conditions

Input / Output Characteristics

Input Operating Voltage V Input Quiescent Current I Maximum Output Current I

OUT_mA

2.7 — 13.2 V Note 1 —2.0 5 µA IL = 0 mA

250 —— mAFor V

50 100 — mA For V 100 130 — mA For V 150 200 — mA For V 200 250 — mA For V

Output Short Circuit Current I

OUT_SC

Output Voltage Regulation V

Temperature Coefficient TCV

OUT

Line Regulation ΔV

OUT

Load Regulation

Note 1: The minimum V

2: V

is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.

The input voltage V

3: TCV

OUT

= (V

temperature range. V

ΔV

OUT/VOUT

must meet two conditions: VIN ≥ 2.7V and VIN ≥ V

= V

OUT-HIGH

- V

OUT-LOW

OUT

XΔVIN)

OUT(MAX)

OUT-LOW

= lowest voltage measured over the temperature range.

— 400 — mA VIN = V

VR-3.0%

-2.0%

±0.4%VR+3.0%

+2.0%

V Note 2

—50150 ppm/°C Note 3

-0.3 ±0.1 +0.3 %/V (V

-2.5 ±1.0 +2.5 %IL = 1.0 mA to 250 mA for VR ≥ 2.5V

+ V

= highest voltage measured over the

+ V

DROPOUT(MAX)

or VIN = 2.7V (whichever is greater); I

) *106 / (VR * ΔTemperature), V

OUT(MAX)

OUT-HIGH

4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCV

5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with an applied input voltage of V

OUT(MAX)

+ V

DROPOUT(MAX)

or 2.7V, whichever is greater.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., T dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

, TJ, θJA). Exceeding the maximum allowable power

junction temperatures above 150°C can impact the device reliability.

7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.

+ V

DROPOUT(MAX)

≥ 2.5V

< 2.5V, VIN ≥ 2.7V

< 2.5V, VIN ≥ 2.95V

< 2.5V, VIN ≥ 3.2V

< 2.5V, VIN ≥ 3.45V

(Note 1), V

IN(MIN)

Current (average current) measured 10 ms after short is applied.

OUT(MAX)

≤ V

= 1.0 mA to 200 mA for VR < 2.5V,

DROPOUT(MAX)

+ V

≤ 13.2V, (Note 1)

DROPOUT(MAX)

= 3.45V Note 4

= 100 µA.

OUT

, Note 1,

= GND,

OUT

)

MCP1702

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise specified, all limits are established for VIN = V

= 100 µA, C

LOAD

Boldface type applies for junction temperatures, T

= 1 µF (X7R), CIN = 1 µF (X7R), TA = +25°C.

OUT

of -40°C to +125°C. (Note 7)

OUT(MAX)

Parameters Sym Min Typ Max Units Conditions

Dropout Voltage

(Note 1, Note 5)

DROPOUT

— 330 650 mV IL = 250 mA, VR = 5.0V — 525 725 mV I — 625 975 mV I — 750 1100 mV I ——— mV V

Output Delay Time T

Output Noise e Power Supply Ripple

PSRR — 44 — dB f = 100 Hz, C

DELAY

— 1000 — µs VIN = 0V to 6V, V

—8 µV/(Hz)

1/2

Rejection Ratio

Thermal Shutdown Protection T

Note 1: The minimum V

2: V

is the nominal regulator output voltage. For example: VR = 1.2V, 1.5V, 1.8V, 2.5V, 2.8V, 3.0V, 3.3V, 4.0V, or 5.0V.

The input voltage V

3: TCV

= (V

OUT

temperature range. V

must meet two conditions: VIN ≥ 2.7V and VIN ≥ V

= V

OUT-HIGH

- V

OUT-LOW

OUT(MAX) OUT-LOW

= lowest voltage measured over the temperature range.

— 150 — °C

+ V

DROPOUT(MAX)

or VIN = 2.7V (whichever is greater); I

) *106 / (VR * ΔTemperature), V

OUT(MAX)

OUT-HIGH

+ V

= highest voltage measured over the

4: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing. Changes in output

voltage due to heating effects are determined using thermal regulation specification TCV

5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its measured

value with an applied input voltage of V

OUT(MAX)

+ V

DROPOUT(MAX)

or 2.7V, whichever is greater.

6: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., T dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained

, TJ, θJA). Exceeding the maximum allowable power

junction temperatures above 150°C can impact the device reliability.

7: The junction temperature is approximated by soaking the device under test at an ambient temperature equal to the

desired Junction temperature. The test time is small enough such that the rise in the Junction temperature over the ambient temperature is not significant.

+ V

DROPOUT(MAX)

= 250 mA, 3.3V ≤ VR < 5.0V

= 250 mA, 2.8V ≤ VR < 3.3V

= 250 mA, 2.5V ≤ VR < 2.8V

< 2.5V, See Maximum Output

Current Parameter

= 50Ω resistive

OUT

IL = 50 mA, f = 1 kHz, C

= 1 µF, IL = 50 mA,

INAC

=1.2V

DROPOUT(MAX)

OUT

= 100 mV pk-pk, CIN = 0 µF,

= 100 µA.

OUT

, Note 1,

= 90% VR

= 1 µF

OUT

TEMPERATURE SPECIFICATIONS (NOTE 1)

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range T Operating Temperature Range T Storage Temperature Range T

Thermal Package Resistance

Thermal Resistance, 3L-SOT-23A

Thermal Resistance, 3L-SOT-89

Thermal Resistance, 3L-TO-92 θ

Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction

temperature and the thermal resistance from junction to air (i.e., T dissipation will cause the device operating junction temperature to exceed the maximum 150°C rating. Sustained junction temperatures above 150°C can impact the device reliability.

-40 +125 °C

-65 +150 °C

—336—°C/W

EIA/JEDEC JESD51-7 FR-4 0.063 4-Layer Board

—110—°C/W

—52—°C/W

EIA/JEDEC JESD51-7

FR-4 0.063 4-Layer Board —10—°C/W — 131.9 — °C/W — 66.3 — °C/W

, TJ, θJA). Exceeding the maximum allowable power

MCP1702

0.00

1.00

2.00

3.00

4.00

5.00

2468101214

Input Voltage (V)

Quiescent Current (µA)

OUT

+25°C

+130°C

-45°C

0°C

+90°C

0.00

1.00

2.00

3.00

4.00

5.00

3 5 7 9 11 13

Input Voltage (V)

Quiescent Current (µA)

OUT

+25°C

+130°C

-45°C

0°C

+90°C

1.00

2.00

3.00

4.00

5.00

67891011121314

Input Voltage (V)

Quiescent Current (µA)

OUT

+25°C

+130°C

-45°C

0°C

+90°C

0.00

20.00

40.00

60.00

80.00

100.00

120.00

0 40 80 120 160 200

Load Current (mA)

GND Current (µA)

Temperature = +25°C

OUT

= 1.2V

= 2.7V

0.00

20.00

40.00

60.00

80.00

100.00

120.00

0 50 100 150 200 250

Load Current (mA)

GND Current (µA)

Temperature = +25°C

OUT

= 5.0V

= 6.0V

OUT

= 2.8V

= 3.8V

0.00

0.50

1.00

1.50

2.00

2.50

3.00

-45-20 5 305580105130

Junction Temperature (°C)

Quiescent Current (µA)

OUT

= 5.0V

= 6.0V

OUT

= 1.2V

= 2.7V

OUT

= 2.8V

= 3.8V

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated: VR = 2.8V, C TA = +25°C, VIN = V

OUT(MAX)

+ V

DROPOUT(MAX)

= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,

OUT

Note: Junction Temperature (TJ) is approximated by soaking the device under test to an ambient temperature equal to the desired junction temperature. The test time is small enough such that the rise in Junction temperature over the Ambient temperature is not significant.

= 1.2V

FIGURE 2-1: Quiescent Current vs. Input Voltage.

= 2.8V

FIGURE 2-4: Ground Current vs. Load Current.

FIGURE 2-2: Quiescent Current vs.Input Voltage.

FIGURE 2-3: Quiescent Current vs.Input Voltage.

= 5.0V

FIGURE 2-5: Ground Current vs. Load Current.

= 0 mA

FIGURE 2-6: Quiescent Current vs. Junction Temperature.

MCP1702

1.18

1.19

1.20

1.21

1.22

1.23

1.24

2468101214

Input Voltage (V)

Output Voltage (V)

OUT

LOAD

+25°C

+130°C

-45°C

0°C

+90°C

2.77

2.78

2.79

2.80

2.81

2.82

2.83

2.84

2.85

3 4 5 6 7 8 9 1011121314

Input Voltage (V)

Output Voltage (V)

OUT

= 2.8V

LOAD

= 0.1 mA

+25°C

+130°C

-45°C

0°C

+90°C

4.96

4.98

5.00

5.02

5.04

5.06

6 7 8 9 10 11 12 13 14

Input Voltage (V)

Output Voltage (V)

OUT

= 5.0V

LOAD

= 0.1 mA

+25°C

+130°C

-45°C

0°C

+90°C

1.18

1.19

1.20

1.21

1.22

1.23

0 20406080100

Load Current (mA)

Output Voltage (V)

OUT

+25°C

+130°C

-45°C

0°C

+90°C

2.77

2.78

2.79

2.80

2.81

2.82

2.83

0 50 100 150 200 250

Load Current (mA)

Output Voltage (V)

OUT

+25°C

+130°C

-45°C

0°C

+90°C

4.96

4.97

4.98

4.99

5.00

5.01

5.02

5.03

5.04

0 50 100 150 200 250

Load Current (mA)

Output Voltage (V)

OUT

+25°C

+130°C

-45°C

0°C

+90°C

Note: Unless otherwise indicated: VR = 2.8V, C

TA = +25°C, VIN = V

OUT(MAX)

+ V

DROPOUT(MAX)

OUT

= 1.2V

= 0.1 mA

FIGURE 2-7: Output Voltage vs. Input Voltage.

= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,

= 1.2V

FIGURE 2-10: Output Voltage vs. Load Current.

= 2.8V

FIGURE 2-8: Output Voltage vs. Input Voltage.

FIGURE 2-9: Output Voltage vs. Input Voltage.

FIGURE 2-11: Output Voltage vs. Load Current.

= 5.0V

FIGURE 2-12: Output Voltage vs. Load Current.

MCP1702

0.60

0.70

0.80

0.90

1.00

1.10

1.20

1.30

1.40

100 120 140 160 180 200

Load Current (mA)

Dropout Voltage (V)

OUT

= 1.8V

+25°C

+130°C

-45°C

0°C

+90°C

0.00

0.10

0.20

0.30

0.40

0.50

0.60

0.70

0.80

0.90

1.00

0 25 50 75 100 125 150 175 200 225 250

Load Current (mA)

Dropout Voltage (V)

OUT

= 2.8V

+25°C

+130°C

+0°C

-45°C

+90°C

0.00

0.05

0.10

0.15

0.20

0.25

0.30

0.35

0.40

0.45

0.50

0 25 50 75 100 125 150 175 200 225 250

Load Current (mA)

Dropout Voltage (V)

OUT

= 5.0V

+25°C

+130°C

+0°C

-45°C

+90°C

0.00

100.00

200.00

300.00

400.00

500.00

600.00

4 6 8 10 12 14

Input Voltage (V)

Short Circuit Current (mA)

OUT

= 2.8V

OUT

< 0.1

Note: Unless otherwise indicated: VR = 2.8V, C TA = +25°C, VIN = V

OUT(MAX)

+ V

DROPOUT(MAX)

OUT

FIGURE 2-13: Dropout Voltage vs. Load Current.

= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,

FIGURE 2-16: Dynamic Line Response.

FIGURE 2-14: Dropout Voltage vs. Load

Current.

FIGURE 2-15: Dropout Voltage vs. Load Current.

FIGURE 2-17: Dynamic Line Response.

FIGURE 2-18: Short Circuit Current vs.

Input Voltage.

MCP1702

-0.30

-0.25

-0.20

-0.15

-0.10

-0.05

0.00

0.05

0.10

0.15

0.20

-45-20 5 305580105130

Temperature (°C)

Load Regulation (%)

OUT

= 1.2V

LOAD

= 0.1 mA to 200 mA

VIN = 4V

VIN = 13.2V

VIN = 6V

VIN = 12VVIN = 10V

-0.60

-0.50

-0.40

-0.30

-0.20

-0.10

0.00

0.10

0.20

0.30

0.40

-45-20 5 305580105130

Temperature (°C)

Load Regulation (%)

OUT

LOAD

= 1 mA to 250 mA

VIN = 3.8V

VIN = 13.2V

VIN = 10V

VIN = 6V

-0.10

0.00

0.10

0.20

0.30

0.40

-45-20 5 305580105130

Temperature (°C)

Load Regulation (%)

OUT

LOAD

VIN = 6V

VIN = 13.2V

VIN = 8V

VIN = 10V

0.00

0.04

0.08

0.12

0.16

0.20

-45-20 5 305580105130

Temperature (°C)

Line Regulation (%/V)

OUT

1 mA

100 mA

0 mA

0.00

0.04

0.08

0.12

0.16

0.20

-45-20 5 305580105130

Temperature (°C)

Line Regulation (%/V)

OUT

= 2.8V

= 3.8V to 13.2V

200 mA

100 mA

0 mA

250 mA

0.06

0.08

0.10

0.12

0.14

0.16

-45-20 5 305580105130

Temperature (°C)

Line Regulation (%/V)

OUT

= 5.0V

= 6.0V to 13.2V

200 mA

100 mA

0 mA

250 mA

Note: Unless otherwise indicated: VR = 2.8V, C

TA = +25°C, VIN = V

OUT(MAX)

+ V

DROPOUT(MAX)

FIGURE 2-19: Load Regulation vs.

Temperature.

= 2.8V

= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,

OUT

= 2.7V to 13.2V

FIGURE 2-22: Line Regulation vs.

Temperature.

= 1.2V

FIGURE 2-20: Load Regulation vs.

Temperature.

FIGURE 2-21: Load Regulation vs.

Temperature.

= 1 mA to 250 mA

= 5.0V

FIGURE 2-23: Line Regulation vs.

Temperature.

FIGURE 2-24: Line Regulation vs. Temperature.

MCP1702

-90

-80

-70

-60

-50

-40

-30

-20

-10

0.01 0.1 1 10 100 1000 Frequency (kHz)

PSRR (dB)

VR=1.2V C

OUT

=1.0 μF ceramic X7R

=2.7V

=0 μF

OUT

=1.0 mA

-90

-80

-70

-60

-50

-40

-30

-20

-10

0.01 0.1 1 10 100 1000 Frequency (kHz)

PSRR (dB)

VR=5.0V C

OUT

=1.0 μF ceramic X7R

=6.0V

=0 μF

OUT

=1.0 mA

0.001

0.01

0.1

100

0.01 0.1 1 10 100 1000 Frequency (kHz)

Noise (μV/ ¥Hz)

VR=5.0V, VIN=6.0V

OUT

=50 mA

VR=2,8V, VIN=3.8V

VR=1.2V, VIN=2.7V

Note: Unless otherwise indicated: VR = 2.8V, C TA = +25°C, VIN = V

OUT(MAX)

+ V

DROPOUT(MAX)

FIGURE 2-25: Power Supply Ripple Rejection vs. Frequency.

= 1 µF Ceramic (X7R), CIN = 1 µF Ceramic (X7R), IL = 100 µA,

OUT

FIGURE 2-28: Power Up Timing.

FIGURE 2-26: Power Supply Ripple

Rejection vs. Frequency.

FIGURE 2-27: Output Noise vs. Frequency.

FIGURE 2-29: Dynamic Load Response.

FIGURE 2-30: Dynamic Load Response.

MCP1702

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin No.

SOT-23A

1 1 1 GND Ground Terminal 233V 32, Tab2 V – – – NC No connection

Pin No. SOT-89

Pin No.

TO-92

Symbol Function

OUT

Regulated Voltage Output Unregulated Supply Voltage

3.1 Ground Terminal (GND)

Regulator ground. Tie GND to the negative side of the output and the negative side of the input capacitor. Only the LDO bias current (2.0 µA typical) flows out of this pin; there is no high current. The LDO output regulation is referenced to this pin. Minimize voltage drops between this pin and the negative side of the load.

3.2 Regulated Output Voltage (V

Connect V positive terminal of the output capacitor. The positive side of the output capacitor should be physically located as close to the LDO V The current flowing out of this pin is equal to the DC load current.

to the positive side of the load and the

OUT

pin as is practical.

OUT

)

3.3 Unregulated Input Voltage Pin )

Connect VIN to the input unregulated source voltage. Like all LDO linear regulators, low source impedance is necessary for the stable operation of the LDO. The amount of capacitance required to ensure low source impedance will depend on the proximity of the input source capacitors or battery type. For most applications, 1 µF of capacitance will ensure stable operation of the LDO circuit. For applications that have load currents below 100 mA, the input capacitance requirement can be lowered. The type of capacitor used can be ceramic, tantalum or aluminum electrolytic. The low ESR characteristics of the ceramic will yield better noise and PSRR performance at highfrequency.

4.0 DETAILED DESCRIPTION

MCP1702

OUT

GND

Error Amplifier

Voltage Reference

Overcurrent Overtemperature

MCP1702

4.1 Output Regulation

A portion of the LDO output voltage is fed back to the internal error amplifier and compared with the precision internal bandgap reference. The error amplifier output will adjust the amount of current that flows through the P-Channel pass transistor, thus regulating the output voltage to the desired value. Any changes in input voltage or output current will cause the error amplifier to respond and adjust the output voltage to the target voltage (refer to Figure 4-1).

4.2 Overcurrent

The MCP1702 internal circuitry monitors the amount of current flowing through the P-Channel pass transistor. In the event of a short-circuit or excessive output current, the MCP1702 will turn off the P-Channel device for a short period, after which the LDO will attempt to restart. If the excessive current remains, the cycle will repeat itself.

4.3 Overtemperature

The internal power dissipation within the LDO is a function of input-to-output voltage differential and load current. If the power dissipation within the LDO is excessive, the internal junction temperature will rise above the typical shutdown threshold of 150°C. At that point, the LDO will shut down and begin to cool to the typical turn-on junction temperature of 130°C. If the power dissipation is low enough, the device will continue to cool and operate normally. If the power dissipation remains high, the thermal shutdown protection circuitry will again turn off the LDO, protecting it from catastrophic failure.

FIGURE 4-1: Block Diagram.

MCP1702

5.0 FUNCTIONAL DESCRIPTION

The MCP1702 CMOS LDO linear regulator is intended for applications that need the lowest current consumption while maintaining output voltage regulation. The operating continuous load range of the MCP1702 is from 0mA to 250mA (V voltage range is from 2.7V to 13.2V, making it capable of operating from two or more alkaline cells or single and multiple Li-Ion cell batteries.

5.1 Input

The input of the MCP1702 is connected to the source of the P-Channel PMOS pass transistor. As with all LDO circuits, a relatively low source impedance (10Ω) is needed to prevent the input impedance from causing the LDO to become unstable. The size and type of the capacitor needed depends heavily on the input source type (battery, power supply) and the output current range of the application. For most applications (up to 100 mA), a 1 µF ceramic capacitor will be sufficient to ensure circuit stability. Larger values can be used to improve circuit AC performance.

≥ 2.5V). The input operating

5.2 Output

The maximum rated continuous output current for the MCP1702 is 250 mA (V where VR < 2.5V, the maximum output current is 200 mA.

A minimum output capacitance of 1.0 µF is required for small signal stability in applications that have up to 250 mA output current capability. The capacitor type can be ceramic, tantalum or aluminum electrolytic. The esr range on the output capacitor can range from 0Ω to

2.0Ω.

≥ 2.5V). For applications

5.3 Output Rise time

When powering up the internal reference output, the typical output rise time of 500 µs is controlled to prevent overshoot of the output voltage. There is also a startup delay time that ranges from 300 µs to 800 µs based on loading. The startup time is separate from and precedes the Output Rise Time. The total output delay is the Startup Delay plus the Output Rise time.

MCP1702

GND

OUT

1µF Ceramic

OUT

1µF Ceramic

OUT

(2.8V to 3.2V)

1.8V

OUT

150 mA

LDO

IN MAX)()VOUT MIN()

–()I

OUT MAX )()

×=

Where:

LDO

= LDO Pass device internal

power dissipation

IN(MAX)

= Maximum input voltage

OUT(MIN)

= LDO minimum output voltage

JMAX()PTOTAL

RθJA× T

AMAX

Where:

J(MAX)

= Maximum continuous junction

temperature

TOTAL

= Total device power dissipation

Rθ

Thermal resistance from junction to ambient

AMAX

= Maximum ambient temperature

DMAX()

JMAX()TAMAX()

–()

Rθ

---------------------------------------------------=

Where:

D(MAX)

= Maximum device power

dissipation

J(MAX)

= Maximum continuous junction

temperature

A(MAX)

Maximum ambient temperature

RθJA= Thermal resistance from

junction to ambient

JRISE()PDMAX()RθJA

×=

Where:

J(RISE)

= Rise in device junction

temperature over the ambient temperature

TOTAL

= Maximum device power

dissipation

Rθ

Thermal resistance from junction to ambient

TJT

JRISE()TA

Where:

= Junction Temperature

J(RISE)

= Rise in device junction

temperature over the ambient temperature

Ambient temperature

6.0 APPLICATION CIRCUITS AND ISSUES

6.1 Typical Application

The MCP1702 is most commonly used as a voltage regulator. It’s low quiescent current and low dropout voltage makes it ideal for many battery-powered applications.

FIGURE 6-1: Typical Application Circuit.

6.1.1 APPLICATION INPUT CONDITIONS

Package Type = SOT-23A

Input Voltage Range = 2.8V to 3.2V

maximum = 3.2V

typical = 1.8V

OUT

= 150 mA maximum

OUT

EQUATION 6-2:

The maximum power dissipation capability for a package can be calculated given the junction-toambient thermal resistance and the maximum ambient temperature for the application. The following equation can be used to determine the package maximum internal power dissipation.

EQUATION 6-3:

6.2 Power Calculations

6.2.1 POWER DISSIPATION

The internal power dissipation of the MCP1702 is a function of input voltage, output voltage and output current. The power dissipation, as a result of the quiescent current draw, is so low, it is insignificant (2.0 µA x V calculate the internal power dissipation of the LDO.

EQUATION 6-1:

The maximum continuous operating junction temperature specified for the MCP1702 is +125 estimate the internal junction temperature of the MCP1702, the total internal power dissipation is multiplied by the thermal resistance from junction to ambient (Rθ ambient for the SOT-23A pin package is estimated at

°C/W.

336

). The following equation can be used to

). The thermal resistance from junction to

EQUATION 6-4:

EQUATION 6-5:

°C. To

MCP1702

PIC

MCP1702

GND

1µF

OUT

1µF

Bridge Sensor

OUT

REF

ADO AD1

Ratio Metric Reference

2 µA Bias

Microcontroller

6.3 Voltage Regulator

Internal power dissipation, junction temperature rise, junction temperature and maximum power dissipation are calculated in the following example. The power dissipation, as a result of ground current, is small

Junction Temperature Estimate

To estimate the internal junction temperature, the calculated temperature rise is added to the ambient or offset temperature. For this example, the worst-case junction temperature is estimated below.

enough to be neglected.

6.3.1 POWER DISSIPATION EXAMPLE

Package

Input Voltage

LDO Output Voltages and Currents

Maximum Ambient Temperature

A(MAX)

Internal Power Dissipation

Internal Power dissipation is the product of the LDO output current times the voltage across the LDO (VIN to V

OUT

LDO(MAX)

P P

=SOT-23A

Type

= 2.8V to 3.2V

=1.8V

OUT

=150mA

OUT

= +40°C

=(V

OUT(MAX)

= (3.2V - (0.97 x 1.8V)) x 150 mA

LDO

= 218.1 milli-Watts

LDO

IN(MAX)

- V

OUT(MIN)

) x

TJ=113.3°C

Maximum Package Power Dissipation at +40°C Ambient Temperature

SOT-23 (336.0°C/Watt = RθJA)

D(MAX)

= (125°C - 40°C) / 336°C/W = 253 milli-Watts

SOT-89 (52°C/Watt = RθJA)

D(MAX)

= (125°C - 40°C) / 52°C/W = 1.635 Watts

TO92 (131.9°C/Watt = RθJA)

D(MAX)

= (125°C - 40°C) / 131.9°C/W = 644 milli-Watts

6.4 Voltage Reference

The MCP1702 can be used not only as a regulator, but also as a low quiescent current voltage reference. In many microcontroller applications, the initial accuracy of the reference can be calibrated using production test equipment or by using a ratio measurement. When the

JRISE

+ T

A(MAX)

initial accuracy is calibrated, the thermal stability and

Device Junction Temperature Rise

line regulation tolerance are the only errors introduced by the MCP1702 LDO. The low-cost, low quiescent

The internal junction temperature rise is a function of internal power dissipation and the thermal resistance from junction to ambient for the application. The thermal resistance from junction to ambient (Rθ

) is derived

current and small ceramic output capacitor are all advantages when using the MCP1702 as a voltage reference.

from an EIA/JEDEC standard for measuring thermal resistance for small surface mount packages. The EIA/ JEDEC specification is JESD51-7, “High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages”. The standard describes the test method and board specifications for measuring the thermal resistance from junction to ambient. The actual thermal resistance for a particular application can vary depending on many factors, such as copper area and thickness. Refer to AN792, “A Method to Determine

How Much Power a SOT-23 Can Dissipate in an Application”, (DS00792), for more information regarding

this subject.

J(RISE)

T T

=P = 218.1 milli-Watts x 336.0°C/Watt

JRISE

= 73.3°C

JRISE

x Rq

TOTAL

FIGURE 6-2: Using the MCP1702 as a voltage reference.

6.5 Pulsed Load Applications

For some applications, there are pulsed load current events that may exceed the specified 250 mA maximum specification of the MCP1702. The internal current limit of the MCP1702 will prevent high peak load demands from causing non-recoverable damage. The 250 mA rating is a maximum average continuous rating. As long as the average current does not exceed 250 mA, pulsed higher load currents can be applied to the MCP1702 MCP1702 is 500 mA (T

. The typical current limit for the

+25°C).

MCP1702

3-Pin SOT-23A

XXNN

Standard

Extended Temp

Symbol Voltage * Symbol Voltage *

HA 1.2 HF 3.0 HB 1.5 HG 3.3 HC 1.8 HH 4.0 HD 2.5 HJ 5.0 HE 2.8 — —

* Custom output voltages available upon request. Contact your local Microchip sales office for more information.

Example:

HANN

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available characters for customer-specific information.

Standard

Extended Temp

Symbol Voltage * Symbol Voltage *

HA 1.2 HF 3.0 HB 1.5 HG 3.3 HC 1.8 HH 4.0 HD 2.5 HJ 5.0 HE 2.8 — —

* Custom output voltages available upon request. Contact your local Microchip sales office for more information.

3-Lead SOT-89

XXXYYWW

NNN

Example

HA0619

256

3-Lead TO-92

XXXXXX XXXXXX XXXXXX

YWWNNN

Example

1702 1202E

TO^^ 619256

7.0 PACKAGING INFORMATION

7.1 Package Marking Information

3-Lead Plastic Small Outline Transistor (CB) [SOT-23A]

Notes:

1. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN NOM M AX Number of Pins N 3 Lead Pitch e 0.95 BSC Outside Lead Pitch e1 1.90 BSC Overall Height A 0.89 – 1.45 Molded Package Thickness A2 0.90 – 1 .30 Standoff A1 0.00 – 0.15 Overall Width E 2.10 – 3.00 Molded Package Width E1 1.20 – 1 .80 Overall Length D 2.70 – 3.10 Foot Length L 0.15 – 0.60 Foot Angle φ 0° – 30° Lead Thickness c 0.09 – 0.26 Lead Width b 0.30 – 0.51

Microchip Technology Drawing C04-130B

MCP1702

3-Lead Plastic Small Outline Transistor Header (MB) [SOT-89]

Notes:

1. Dimensions D and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.127 mm per side.

2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units MILLIMETERS

Dimension Limits MIN MAX Number of Leads N 3 Pitch e 1.50 BSC Outside Lead Pitch e1 3.00 BSC Overall Height A 1.40 1.60 Overall Width H 3.94 4.25 Molded Package Width at Base E 2.29 2.60 Molded Package Width at Top E1 2.13 2.29 Overall Length D 4.39 4.60 Tab Length D1 1.40 1.83 Foot Length L 0.79 1.20 Lead Thickness c 0.35 0.44 Lead 2 Width b 0.41 0.56 Leads 1 & 3 Width b1 0.36 0.48

Microchip Technology Drawing C04-029B

3-Lead Plastic Transistor Outline (TO) [TO-92]

Notes:

1. Dimensions A and E do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005" per side.

2. Dimensioning and tolerancing per ASME Y14.5M. BSC: Basic Dimension. Theoretically exact value shown without tolerances.

Note: For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Units INCHES

Dimension Limits MIN MAX Number of Pins N 3 Pitch e .050 BSC Bottom to Package Flat D .125 .165 Overall Width E .175 .205 Overall Length A .170 .210 Molded Package Radius R .080 .105 Tip to Seating Plane L .500 – Lead Thickness c .014 .021 Lead Width b .014 .022

Microchip Technology Drawing C04-101B

MCP1702

NOTES:

APPENDIX A: REVISION HISTORY

Revision B (May 2007)

• All Pages: Corrected minor errors in document.

• Page 4: Added junction-to-case information to Temperature Specifications table.

• Page 16: Updated Package Outline Drawings in Section 7.0 “Packaging Information”.

• Page 21: Updated Revison History.

• Page 23: Corrected examples in ”Product Identi-

fication System”.

Revision A (September 2006)

• Original Release of this Document.

MCP1702

NOTES:

PRODUCT IDENTIFICATION SYSTEM

Device: MCP1702: 2 µA Low Dropout Positive Voltage Regulator

Tape and Reel: T = Tape and Reel

Output Voltage *: 12 = 1.2V “Standard”

15 = 1.5V “Standard” 18 = 1.8V “Standard” 25 = 2.5V “Standard” 28 = 2.8V “Standard” 30 = 3.0V “Standard” 33 = 3.3V “Standard” 40 = 4.0V “Standard” 50 = 5.0V “Standard” *Contact factory for other output voltage options.

Extra Feature Code: 0 = Fixed

Tolerance: 2 = 2.0% (Standard)

Temperature: E = -40°C to +125°C

Package Type: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59)

MB = 3-Pin SOT-89 TO = 3-Pin TO-92

PART NO. XXX

Output Feature

Code

Device

Vol tag e

Tol era nceX/Tem p.XXPackage

X-

Tap e

and Reel

Examples:

a) MCP1702T-1202E/CB: 1.2V LDO Positive