查询MCP1701T-1802I/CB供应商
2 µA Low Dropout Positive Voltage Regulator
MCP1701
Features
• 2.0 µA Typical Quiescent Current
• Input Operating Voltage Range up to 10.0V
• Low Dropout Voltage:
- 250 mV (typ) @ 100 mA
- 500 mV (typ) @ 200 mA
• High Output Current: 250 mA (V
• High-Accuracy Output Voltage: ±2% (max)
• Low Temperature Drift: ±100 ppm/°C (typ.)
• Excellent Line Regulation: 0.2%/V (typ.)
• Package Options: 3-Pin SOT-23A and
3-Pin SOT-8 9
• Short Circuit Protection
• Standard Output Voltage Options:
- 1.8V, 2.5V, 3.0V, 3.3V, 5.0V
OUT
= 5.0V)
Applications
• Battery-Powered Devi ce s
• Battery-Powered Alarm Circu it s
• Smoke Detectors
2
•CO
Detectors
• Smart Battery Packs
•PDAs
• Low Quiescent Current Voltage Reference
• Cameras and Portable Video Equipment
• Pagers and Cellular Phones
• Solar-Powered Instruments
• Consumer Products
• Microcontroller Power
Related Literature
• AN765, “Using Microchip’s Micropower LDOs”,
DS00765, Microchip Technology Inc., 2002
• AN766, “Pin-Compatible CMOS Upgrades to
Bipolar LDOs”, DS00766, Microchip Technology
Inc., 2002
General Description
The MCP1701 is a f amily o f CM OS low d rop out (LDO ),
positive voltage regulators that can deliver up to
250 mA of current while consuming only 2.0 µA of
quiescent current (typ.). The input operating range is
specified up to 10V, making it ideal for lithium-ion (one
or two cells), 9V alkaline and other two and three
primary cell battery-power ed app lic ati on s.
The MCP1701 is capable of delivering 250 mA with an
input-to-output voltage differential (dropout voltage) of
650 mV. The low dropout voltage extends the battery
operating lifetime. It als o perm its high currents in small
packages when operated with minimum V
differentials.
The MCP1701 has a tight tolerance output voltage
regulation of ± 0.5% (typ.) and very good line regula tion
at ±0.2%. The LDO output is stable when using only
1 µF of output capacitance of either tantalum or
aluminum-electrolytic style capacitors. The MCP1701
LDO also incorporates short circuit protec tion to ensure
maximum reliability.
Package options include the 3-pin SOT-23A and 3-pin
SOT-89.
IN
– V
OUT
Package Types
3-Pin SOT-23A
V
IN
3
MCP1701
12
GND V
Note: 3-Pin SOT-23A is equivalent to the EIAJ
OUT
SC-59.
3-Pin SOT-89
V
IN
MCP1701
123
GND V
INVOUT
© 2005 Microchip Technology Inc. DS21874B-page 1
MCP1701
Functional Block Diagram
MCP1701
V
IN
Typical Application Circuits
V
OUT
3.3V
I
OUT
50 mA
Short-Circuit
Protection
Voltage
Reference
GND
MCP1701
GND
V
OUT
C
OUT
1 µF Tantal um
+
–
V
IN
9V Alkaline Battery
V
IN
V
OUT
C
IN
1 µF Tantalum
DS21874B-page 2 © 2005 Microchip Technology Inc.
MCP1701
1.0 ELECTRICAL
CHARACTERISTICS
† Notice: Stresses above those listed under “Absolute
Maximum Ratings” may cause permanent damage to the
device. These are stress ratings only and functional operation
of the device at these or any other conditions above those
Absolute Maximum Ratings †
indicated in the operation sections of the specifications is not
implied. Exposure to Absolute Maximum Rating conditions for
Input Vo ltage ........................................................+12V
Output Current (Continuous)..........PD/(VIN – V
OUT
)mA
Output Current (peak)..................................... 500 mA
Output Voltage ............... (GND – 0.3V) to (V
+ 0.3V)
IN
extended periods may affect device reliability.
PIN FUNCTION TABLE
Symbol Description
Continuous Power Dissipation:
3-Pin SOT-23A ............................................150 mW
3-Pin SOT-89...............................................500 mW
GND Ground Terminal
V
OUT
V
IN
Regulated Voltage Output
Unregulated Supply Input
ELECTRICAL CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, all limits are established for an ambient temperature of TA = +25°C.
Parameters Sym Min Typ Max Units Conditions
Output Voltage Regulation
Maximum Output Current I
Load Regulation (Note 3) ΔV
Dropout Voltage V
Input Quiescent Current I
Line Regulation ΔV
Input Voltage V
Temperature Coefficient of
V
OUT
OUTMAX
OUT/ VOUT
- V
IN
Q
OUT
ΔV
IN•VOUT
IN
TCV
OUT
Output Voltage
Output Rise Time T
R
1: VR is the nominal regulator output voltage. For example: VR = 1.8V, 2.5V, 3.3V, 4.0V, 5.0V.
The input voltage V
2: TCV
OUT
= (V
OUT-HIGH
= VR + 1.0V, I
IN
– V
over the temperature range. V
3: Load regulation is measured at a constant junction temperature using low duty cycle pulse testing.
OUT
•100
OUT-LOW
VR - 2%
V
±0.5% VR + 2% V
R
250 — — mA V
200 — — V
150 — — V
150 — — V
125 — — V
110 — — V
-1.60 ±0.8 +1.60 % V
-2.25 ±1.1 +2.25 V
-2.72 ±1.3 +2.72 V
-3.00 ±1.5 +3.00 V
-3.60 ±1.8 +3.60 V
-1.60 ±0.8 +1.60 V
— 400 630 mV I
— 400 630 I
— 400 700 I
— 400 700 I
— 400 700 I
— 180 300 I
—2.03.0µAV
— 0.2 0.3 %/V I
I
= 40 mA (Note 1)
OUT
= 5.0V (VIN = VR + 1.0V)
OUT
= 4.0V
OUT
= 3.3V
OUT
= 3.0V
OUT
= 2.5V
OUT
= 1.8V
OUT
= 5.0V, 1 m A ≤ I
OUT
= 4.0V, 1 m A ≤ I
OUT
= 3.3V, 1 m A ≤ I
OUT
= 3.0V, 1 m A ≤ I
OUT
= 2.5V, 1 m A ≤ I
OUT
= 1.8V, 1 m A ≤ I
OUT
= 200 mA, VR = 5.0V
OUT
= 200 mA, VR = 4.0V
OUT
= 160 mA, VR = 3.3V
OUT
= 160 mA, VR = 3.0V
OUT
= 120 mA, VR = 2.5V
OUT
= 20 mA, VR = 1.8V
OUT
= VR + 1.0V
IN
= 40 mA, (VR +1) ≤ VIN ≤ 10.0V
OUT
OUT
OUT
OUT
OUT
OUT
OUT
≤ 100 mA
≤ 100 mA
≤ 80 mA
≤ 80 mA
≤ 60 mA
≤ 30 mA
—— 10V
— ±100 — ppm/°CI
= 40 mA, -40°C ≤ TA ≤ +85°C
OUT
(Note 2)
— 200 — µsec 10% VR to 90% VR, VIN = 0V to VR +1V,
R
= 25Ω resist ive
L
= 40 mA.
OUT
) *106 / (VR * ΔTemperature), V
OUT-LOW
= Lowest voltage measured over the temperature range.
OUT-HIGH
= Highest voltage measured
© 2005 Microchip Technology Inc. DS21874B-page 3
MCP1701
TEMPERATURE CHARACTERISTICS
Electrical Specifications: Unless otherwise specified, T
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Specified Temperature Range (I) T
Storage Temperature Range T
Package Thermal Resistances
Thermal Resistance, 3L-SOT-23A θ
Thermal Resistance, 3L-SOT-89 θ
A
A
JA
JA
-40 — +85 °C
-40 — +125 °C
— 335 — °C/W Minimum trace width single
— 230 — °C/W Typical FR4, 4-layer
— 52 — °C/W Typical, when mounted on 1
= +25°C.
A
layer application
application
square inch of copper
DS21874B-page 4 © 2005 Microchip Technology Inc.
MCP1701
2.0 TYPICAL PERFORMANCE CURVES
Note: The graphs and tables provided following this note ar e a st a tis tic al summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Notes: Unless otherwise specified, V
2.65
2.60
2.55
2.50
A)
µ
Supply Current (
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
1.95
+25°C
0°C
-40°C
2345678910
= 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, C
OUT
VR = 1.8V
Input Voltage (V)
FIGURE 2-1: Supply Current vs. Input
Voltage (V
Supply Current (µA)
= 1.8V).
R
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
345678910
+25°C
+85°C
-40°C
VR = 3.0V
Input Voltage (V)
= 1 µF Tantalum.
OUT
2.10
2.05
2.00
1.95
1.90
1.85
1.80
1.75
1.70
1.65
1.60
1.55
1.50
1.45
1.40
Supply Current (µA)
1.35
1.30
1.25
1.20
0 20 40 60 80 100 120 140 160
0°C
+25°C
+85°C
-40°C
VIN = 4.0V
V
= 3.0V
R
Load Current (mA)
FIGURE 2-4: Supply Current vs. Load
Current (V
Supply Current (µA)
= 3.0V).
R
2.75
2.70
2.65
2.60
2.55
2.50
2.45
2.40
2.35
2.30
2.25
2.20
2.15
2.10
2.05
2.00
0 20 40 60 80 100 120 140 160 180 200
+25°C
+85°C
0°C
-40°C
Load Current (mA)
VIN = 6.0V
V
= 5.0V
R
FIGURE 2-2: Supply Current vs. Input
Voltage (V
Supply Current (µA)
= 3.0V).
R
3.00
VR = 5.0V
2.85
2.70
+25°C
2.55
2.40
2.25
2.10
1.95
1.80
1.65
1.50
+85°C
-40°C
5678910
Input Voltage (V)
FIGURE 2-3: Supply Current vs. Input
Voltage (V
= 5.0V).
R
FIGURE 2-5: Supply Current vs. Load
Current (V
Supply Current (µA)
= 5.0V).
R
2.9
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
-40-200 20406080100
VR = 5.0V
VR = 1.8V
VR = 3.0V
VIN = VR + 1V
= 0 µA
I
OUT
Temperature (°C)
FIGURE 2-6: Supply Current vs.
Temperature.
© 2005 Microchip Technology Inc. DS21874B-page 5
MCP1701
Note: Unless otherwise indicated, V
1.85
1.84
1.83
1.82
1.81
1.80
Output Voltage (V)
1.79
1.78
+25°C
+85°C
0°C
-40°C
2345678910
= 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, C
OUT
I
= 0.1 mA
OUT
Input Voltage (V)
FIGURE 2-7: Output Voltage vs. Input
Voltage (V
Output Voltage (V)
= 1.8V).
R
3.05
3.04
3.03
3.02
3.01
3.00
2.99
2.98
2.97
+25°C
+85°C
0°C
-40°C
4.0 5.0 6.0 7.0 8.0 9.0 10.0
I
OUT
= 0.1 mA
Input Voltage (V)
= 1 µF Tantalum.
OUT
1.83
1.82
1.81
1.80
1.79
Output Voltage (V)
1.78
1.77
0 102030405060708090
+25°C
+85°C
-40°C
VIN = 2.8V
0°C
Load Current (mA)
FIGURE 2-10: Output Voltage vs. Load
Current (V
Output Voltage (V)
= 1.8V).
R
3.06
3.04
3.02
3.00
2.98
2.96
2.94
0 15 30 45 60 75 90 105 120 135 150
-40°C
+25°C
+85°C
0°C
Load Current (mA)
VIN = 4.0V
FIGURE 2-8: Output Voltage vs. Input
Voltage (V
Output Voltage (V)
= 3.0V).
R
5.10
5.09
5.08
5.07
5.06
5.05
5.04
5.03
5.02
5.01
5.00
4.99
4.98
4.97
4.96
+25°C
+85°C
0°C
-40°C
5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10.0
I
OUT
= 0.1 mA
Input Voltage (V)
FIGURE 2-9: Output Voltage vs. Input
Voltage (V
= 5.0V).
R
FIGURE 2-11: Output Voltage vs. Load
Current (V
Output Voltage (V)
= 3.0V).
R
5.07
5.05
5.03
5.01
4.99
4.97
4.95
4.93
0 25 50 75 100 125 150 175 200 225 250
+25°C
+85°C
0°C
-40°C
Load Current (mA)
VIN = 6.0V
FIGURE 2-12: Output Voltage vs. Load
Current (V
= 5.0V).
R
DS21874B-page 6 © 2005 Microchip Technology Inc.
MCP1701
Note: Unless otherwise indicated, V
0.7
VR = 1.8V
0.6
0.5
0.4
0.3
0.2
Dropout Voltage (V)
0.1
0.0
0 102030405060708090
+85°C
-40°C
Load Current (mA)
= 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, C
OUT
0°C
FIGURE 2-13: Dropout Voltage vs. Load
Current (V
0
Dropout Voltage (V)
= 1.8V).
R
0.6
VR = 3.0V
0.5
0.4
0.3
0.2
0.1
0
0 15 30 45 60 75 90 105 120 135 150
+85°C
0°C
-40°C
Load Current (mA)
= 1 µF Tantalum.
OUT
VIN=0V to
2.8V
R
LOAD
C
OUT
=1.8V
V
R
FIGURE 2-16: Start-up From V
(V
= 1.8V).
R
VIN=0V to
4.0V
R
LOAD
C
V
=3.0V
R
OUT
= 25 ohms
= 1 µF Tantalum
IN
= 25 ohms
= 1 µF Tantalum
FIGURE 2-14: Dropout Voltage vs. Load
Current (V
Dropout Voltage (V)
= 3.0V).
R
0.8
VR = 5.0V
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
0 25 50 75 100 125 150 175 200 225 250
+85°C
-40°C
Load Current (mA)
0°C
FIGURE 2-15: Dropout Voltage vs. Load
Current (V
= 5.0V).
R
FIGURE 2-17: Start-up From V
(V
= 3.0V).
R
VIN=0V to
6.0V
R
LOAD
C
V
=5.0V
R
OUT
FIGURE 2-18: Start-up From V
(V
= 5.0V).
R
IN
= 25 ohms
= 1 µF Tantalum
IN
© 2005 Microchip Technology Inc. DS21874B-page 7
MCP1701
Note: Unless otherwise indicated, V
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
Load Regulation (%)
-0.35
-0.40
-40-30-20-10 0 102030405060708090
VIN = 6.0V
VIN = 2.8V
= 1.8V, 3.0V, 5.0V, TA = +25°C, CIN = 1 µF Tantalum, C
OUT
VR = 1.8V
= 1 to 30mA
I
OUT
VIN = 4.0V
Temperature (°C)
FIGURE 2-19: Load Regulation vs.
Temperature (V
-0.30
-0.35
-0.40
-0.45
-0.50
-0.55
-0.60
Load Regulation (%)
-0.65
-0.70
-40-30-20-10 0 102030405060708090
= 1.8V).
R
VIN = 10.0V
VIN = 6.0V
Temperature (°C)
VR = 3.0V
= 1 to 80 mA
I
OUT
VIN = 4.0V
= 1 µF Tantalum.
OUT
0.15
0.14
I
= 90 mA
0.13
0.12
I
= 1 mA
0.11
Line Regulation (%/V)
0.10
OUT
-40-30-20-100 102030405060708090
OUT
I
OUT
= 40 mA
I
OUT
VR = 1.8V
= 2.8V to 10V
V
IN
= 10 mA
Temperature (°C)
FIGURE 2-22: Line Regulation vs.
Temperature (V
0.13
0.12
0.11
0.10
0.09
0.08
VR = 3.0V
Line Regulation (%/V)
0.07
V
0.06
-40-30-20-100 102030405060708090
R
= 4.0V to 10V
IN
= 1.8V).
I
OUT
Temperature (°C)
= 1 mA
I
= 150 mA
OUT
I
OUT
= 10 mA
FIGURE 2-20: Load Regulation vs.
Temperature (V
0.0
-0.1
-0.2
-0.3
-0.4
Load Regulation (%)
-0.5
-0.6
-40-30-20-100 102030405060708090
R
VIN = 10.0V
= 3.0V).
VIN = 7.0V
Temperature (°C)
VR = 5.0V
I
= 1 to 100 mA
OUT
VIN = 6.0V
FIGURE 2-21: Load Regulation vs.
Temperature (V
= 5.0V).
R
FIGURE 2-23: Line Regulation vs.
I
OUT
= 3.0V).
R
= 250 mA
I
= 1 mA
OUT
I
= 100 mA
OUT
Temperature (°C)
VR = 5.0V
= 6.0V to 10V
V
IN
I
OUT
Temperature (V
0.17
0.16
0.15
0.14
0.13
0.12
0.11
0.10
Line Regulation (%/V)
0.09
0.08
-40-30-20-100 102030405060708090
FIGURE 2-24: Line Regulation vs.
Temperature (V
= 5.0V).
R
= 10 mA
DS21874B-page 8 © 2005 Microchip Technology Inc.
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
Pin No.
SOT-23A
1 1 GND Ground Terminal
23V
32V
Pin No.
SOT-89
Name Function
OUT
IN
Regulated Voltage Output
Unregulated Supply Input
MCP1701
3.1 Ground Terminal (GND)
Regulator ground. Tie GND to the negative side of the
output and the negative side of the input capacitor.
Only the LDO bias current (2 µA, typ.) flows out of this
pin, there is no high current. The LD O output regulatio n
is referenced to this pin. Minimize voltage drops
between this pin and the negative side of the load.
3.2 Regulated Voltage Output (V
Connect V
positive terminal of the output capacitor. The positive
side of the output capacitor should be physically
located as close as poss ib le to th e LD O V
current flowing out of this pin is equal to the DC load
current.
to the posit ive side of the l oad and the
OUT
OUT
)
OUT
pin. The
3.3 Unregulated Supply Input (VIN)
Connect the input supply voltage and the positive side
of the input capacitor to V
regulators, low source impedance is necessary for the
stable operation of the LDO. The amount of
capacitance required to ensure low source impedance
will depend on the proximity of the input source
capacitors or battery type. The input capacitor should
be physically located as close as possible to the V
pin. For most applications, 1 µF of capacitance will
ensure stable opera tion o f t he LDO circ uit. Fo r appl ications that have lo ad curr ents bel ow 100 mA, t he inpu t
capacitance requirement can be lowered. The type of
capacitor used can be ceramic, tantalum or aluminum
electrolytic. The low equivalent series resistence
characteristics of the ce ramic wil l yield better n oise an d
PSRR performance at high fr equency. The current flow
into this pin is equal to the DC load current, plus the
LDO bias current (2 µA, typ.).
. Like all low dropout linear
IN
IN
© 2005 Microchip Technology Inc. DS21874B-page 9
MCP1701
4.0 DETAILED DESCRIPTION
The MCP1701 is a low quiescent current, precision,
fixed-output voltage LDO. Unlike bipolar regulators,
the MCP1701 supply current does not increase
proportionally with load current.
4.1 Output Capacitor
A minimum of 1 µF output capacitor is required. The
output capacitor should have an ESR greater than
0.1Ω and less than 5Ω, plus a resonant frequency
above 1 MHz. Larger output capacitors can be us ed to
improve supply n oise re jecti on and tr ansie nt respo nse.
Care should be t a ke n w he n i ncreasing C
that the input impedance is not high enough to cause
high input impedance oscillation.
V
IN
to ensure
OUT
Short Circuit
Protection
4.2 Input Capacitor
A 1 µF input capacitor is recommended for most
applications when the input impedance is on the order
of 10Ω. Larger in put capacitan ce may be requ ired for
stability when op era ting from a bat tery inp ut, or if there
is a large di stance from the in put source to th e LDO.
When large values of output capacitance are used, the
input capacitance should be increased to prevent high
source impedance oscil lat ion s.
4.3 Overcurrent
The MCP1701 interna l circui try monit ors the amount of
current flowing through the P-channel pass transistor.
In the event of a short circuit or excessive output
current, the MCP1701 will a ct to limit the outpu t current.
V
OUT
+
–
FIGURE 4-1: Block Diagram.
Voltage
Reference
GND
DS21874B-page 10 © 2005 Microchip Technology Inc.
MCP1701
5.0 THERMAL CONSIDERATIONS
5.1 Power Dissipati on
The amount of power dissipated internal to the LDO
linear regulator is the sum of the power dissipation
within the linear pass devic e (P-channel MOSFET) and
the quiescent current required to bias the internal
reference and error amplifier. The internal linear pass
device power dissipation is calculated as shown in
Equation 5-1.
EQUATION 5-1:
(Pass Device) = (VIN – V
P
D
The internal power dissipat ion, as a res ult of the bias
current for the LDO internal reference and error
amplifier, is calculated as shown in Equation 5-2.
EQUATION 5-2:
PD (Bias) = VIN x I
The total internal power dissipation is the sum of P
(pass device) and PD (bias).
EQUATION 5-3:
P
= PD (Pass Device) + PD (Bias)
TOTAL
OUT
GND
) x I
OUT
T o determine the junction temperature of the device, the
thermal resistance from junction-to-ambient must be
known. The 3-pin SOT-23 thermal resistance from
junction-to-air (R
335° C/W. The SOT-89 R
) is estimated to be approximately
θJA
is estimated to be
θJA
approximately 52° C/W when mounted on 1 square inch
of copper. The R
will vary with physical layout, airflow
θJA
and other application-specific conditions.
The device junction temperature is determined by
calculating the junction temperature rise above
ambient, then adding the rise to the ambient
temperature.
EQUATION 5-5: JUNCTION
TEMPERATURE – SOT-23
EXAMPLE:
TJP
DMAXRθJATA
116.0 milliwatts 335°C/W 5 5°C+×=
T
J
T
93.9°C=
J
+×=
EQUATION 5-6: JUNCTION
D
TEMPERATURE – SOT-89
EXAMPLE:
TJ116.0 milliwatts 52°C/W 55°C+×=
T
61°C=
J
For the MCP1701, the inte rnal quiescent b ias current is
so low (2 µA, typ.) that the P
(bias) term of the power
D
dissipation equation can be ignored. The maximum
power dissipation can be estimated by using the
maximum input voltage and the minimum output
voltage to obtain a maximum voltage differential
between inpu t and output. The ne xt step would be to
multiply the maximum voltage differential by the
maximum output current.
EQUATION 5-4:
Given:
V
V
OUT
I
OUT
T
AMAX
P
MAX
P
MAX
PD = (V
= 3.3V to 4.1V
IN
=3.0V ± 2%
= 1 mA to 100 mA
=55°C
= (4.1V – (3.0V x 0.98)) x 100 mA
= 116.0milliwatts
INMAX
– V
OUTMIN
) x I
OUTMAX
© 2005 Microchip Technology Inc. DS21874B-page 11
MCP1701
represen ts first voltage digit
represents first decimal place voltage (x.0 - x.9)
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
3-Pin SOT-23A 3-Pin SOT-8 9
2
112
1
43
4
3
1V, 2V, 3V, 4V, 5V, 6V
Ex: 3.xV =
2
Ex: 3.4V =
3
E
3
Symbol Voltage Symbol Voltage
A x.0 F x.5
B x.1 H x.6
C x.2 K x.7
Dx.3Lx.8
E x.4 M x.9
3
represents polarity
0 = Positive (fixed)
4
represents assembl y lot numbe r
Legend: XX...X Customer-specific information*
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumer ic traceability code
3
e
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )
Note: In the event the full Microchip part number ca nnot be m arked o n one line , it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
DS21874B-page 12 © 2005 Microchip Technology Inc.
can be found on the outer packaging for this package.
3
e
3-Lead Plastic Small Outline Transistor (CB) (SOT23)
E
E1
2
MCP1701
B
n
1
c
β
Number of Pins
Pitch
Outside lead pitch (basic)
Foot Angle
Lead Thickness
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
EIAJ SC-59 Equivalent
Drawing No. C04-104
n
p
p1
f
c
a
b
p1
D
p
A
φ
L
A1
MILLIMETERSINCHES*Units
0.96.038
1.92.076
1.01
α
A2
MAXNOMMINMAXNOMMINDimension Limits
33
1.301.16.051.046.040AOverall Height
1.201.101.00.047.043.039A2Molded Package Thickness
0.100.060.01.004.002.000A1Standoff §
3.002.802.60.118.110.102EOverall Width
1.801.601.50.071.063.059E1Molded Package Width
3.102.902.70.122.114.106DOverall Length
0.550.450.35.022.018.014LFoot Length
10501050
0.250.150.10.010.006.004
0.500.400.35.020.016.014BLead Width
10501050
10501050
© 2005 Microchip Technology Inc. DS21874B-page 13
MCP1701
3-Lead Plastic Small Outline Transistor (MB) (SOT89)
H
E
B1
3
B
D1
D
2
1
E1
A
Pitch
Outside lead pitch (basic)
Molded Package Width at Base E .090 .102 2.29 2.60
Molded Package Width at Top
Tab Length
Foot Length L .035 .047 0.89 1.20
Lead Thickness
Leads 1 & 3 Width
*Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
exceed .005" (0.127mm) per side.
JEDEC Equivalent: TO-243
Drawing No. C04-29
B1
L
C
p
p1
E1
D1
c
B1
p1
p
MILLIMETERS*INCHESUnits
.118 BSC
.014 .019 0.360.48
MAXMINMAXMINDimension Limits
1.50 BSC.059 BSC
3.00 BSC
1.601.40.063.055AOverall Height
4.253.94.167.155HOverall Width
2.292.13.090.084
4.604.40.181.173DOverall Length
1.831.62.072.064
0.440.35.017.014
0.560.44.022.017BLead 2 Width
DS21874B-page 14 © 2005 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision B (May 2005)
The following is the list of modifications:
1. Removed T0-92 device from entire data sheet.
2. Added Appendix A: Revision History.
Revision A (March 2004)
• Original Release of this Document.
MCP1701
© 2005 Microchip Technology Inc. DS21874B-page 15
MCP1701
NOTES:
DS21874B-page 16 © 2005 Microchip Technology Inc.
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. XXX
Device
Device: MCP1701: 2 µA Low Dropout Positive Voltage Regulator
Tape and Reel: T = Tape and Reel
Output Voltage: 18 = 1.8V “Standard”
Extra Feature Code: 0 = Fixe d
Tolerance: 2 = 2.0% (Standard)
Temperature: I = -40°C to +85°C
Package Type: CB = 3-Pin SOT-23A (equivalent to EIAJ SC-59)
X-
Tape
and Reel
X
Output Feature
Voltage
25 = 2.5V “Standard”
30 = 3.0V “Standard”
33 = 3.3V “Standard”
50 = 5.0V “Standard”
*Contact factory for other output voltage options.
MB = 3-Pin SOT-89
Code
ToleranceX/Temp.XXPackage
Examples:
a) MCP1701T-1802I/CB: 1.8V LDO Positive
b) MCP1701T-1802I/MB: 1.8V LDO Positive
c) MCP1701T-2502I/CB: 2.5V LDO Positive
d) MCP1701T-3002I/CB: 3.0V LDO Positive
e) MCP1701T-3002I/MB: 3.0V LDO Positive
f) MCP1701T-3302I/CB: 3.3V LDO Positive
g) MCP1701T-3302I/MB: 3.3V LDO Positive
h) MCP1701T-5002I/CB: 5.0V LDO Positive
i) MCP1701T-5002I/MB: 5.0V LDO Positive
MCP1701
Voltage Regulator,
SOT-23A-3 pkg.
Voltage Regulator,
SOT89-3 pkg.
Voltage Regulator,
SOT-23A-3 pkg.
Voltage Regulator,
SOT-23A-3 pkg.
Voltage Regulator,
SOT89-3 pkg.
Voltage Regulator,
SOT-23A-3 pkg.
Voltage Regulator,
SOT89-3 pkg.
Voltage Regulator,
SOT-23A-3 pkg.
Voltage Regulator,
SOT89-3 pkg.
© 2005 Microchip Technology Inc. DS21874B-page 17
MCP1701
NOTES:
DS21874B-page 18 © 2005 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,
WRITTEN OR ORAL, STATUTORY OR OTHERWISE,
RELATED TO THE INFORMATION, INCLUDING BUT NOT
LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE,
MERCHANTABILITY OR FITNESS FOR PURPOSE.
Microchip disclaims all liability arising from this information and
its use. Use of M icrochip’s prod ucts as critical components in
life support systems is not authorized except with express
written approval by Microchip. No licenses are conveyed,
implicitly or otherwise, under any Microchip intellectual property
rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K
EELOQ, microID, MPLAB, PIC, PICmicro,
PICSTART, PRO MATE, PowerSma rt , rfPIC, and
SmartShunt are registered trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.
AmpLab, FilterLab, Migratable Memory, MXDEV, MXLAB,
PICMASTER, SEEVAL, SmartSensor and The Embedded
Control Solutions Company are registered trademarks of
Microchip Technology Incorporat ed in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, dsPICDEM,
dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR,
FanSense, FlexROM, fuzzyLAB, In-Circuit Serial
Programming, ICSP, ICEPIC , Linear Active Thermist or,
MPASM, MPLIB , MPLINK, MPSIM, PICkit, PICDEM,
PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo,
PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode,
Smart Serial, SmartTel, Total Endurance and WiperLock are
trademarks of Microchip Technology Inco rporated in the
U.S.A. and other countries.
SQTP is a service mark of Microchip T echnology Incorporated
in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2005, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received ISO/TS-16949:2002 quality system certification for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in
October 2003. The Company’s quality system processes and
procedures are for its PICmicro
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
8-bit MCUs, KEELOQ
®
code hopping
© 2005 Microchip Technology Inc. DS21874B-page 19
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
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Tel: 480-792-7200
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04/20/05
DS21874B-page 20 © 2005 Microchip Technology Inc.
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