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MCP1624
Schematic [ru]
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Microchip MCP1623, MCP1624 Schematic [ru]

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MCP1623/24
4
1
2
3
6
V
IN
V
FB
SW
GND
EN
5
V
OUT
MCP1623/24
6-Lead SOT-23
Low-Voltage Input Boost Regulator
for PIC® Microcontrollers
Features
• Up to 96% Typical Efficiency
• 425 mA Typical Peak Input Current Limit:
-I
> 50 mA @ 1.2V VIN, 3.3V V
OUT
-I
> 175 mA @ 2.4V VIN, 3.3V V
OUT
-I
> 175 mA @ 3.3V V
OUT
IN,
• Low Start-up Voltage: 0.65V, typical 3.3V V @ 1 mA
• Low Operating Input Voltage: 0.35V, typical
OUT
@ 1 mA
3.3V
• Adjustable Output Voltage Range: 2.0V to 5.5V
• Maximum Input Voltage  V
OUT
• Automatic PFM/PWM Operation (MCP1624)
• PWM-only Operation (MCP1623)
• 500 kHz PWM Frequency
• Low Device Quiescent Current: 19 µA, typical PFM mode
• Internal Synchronous Rectifier
• Internal Compensation
• Inrush Current Limiting and Internal Soft-Start
• True Load Disconnect
• Shutdown Current (All States): < 1 µA
• Low Noise, Anti-Ringing Control
• Overtemperature Protection
• SOT-23-6 Package
5.0V V
< 5.5V
OUT
OUT
OUT
OUT
General Description
The MCP1623/24 is a compact, high-efficiency, fixed frequency, synchronous step-up DC-DC converter. It provides an easy-to-use power supply solution for PIC microcontroller applications powered by either one-cell, two-cell, or three-cell alkaline, NiCd, NiMH, one-cell Li-Ion or Li-Polymer batteries.
Low-voltage technology allows the regulator to start up without high inrush current or output voltage overshoot from a low 0.65V input. High efficiency is accomplished by integrating the low resistance N-Channel Boost switch and synchronous P-Channel switch. All compensation and protection circuitry are integrated to minimize external components. For standby applications, the MCP1624 operates and consumes only 19 µA while operating at no load. The MCP1623 device option is available that operates in PWM-only mode.
A “true” load disconnect mode provides input to output isolation while disabled (EN = GND) by removing the normal boost regulator diode path from input to output. This mode consumes less than 1 µA of input current.
Output voltage is set by a small external resistor divider.
Packaging
Applications
• One, Two and Three Cell Alkaline and NiMH/NiCd Low-Power PIC
2010 Microchip Technology Inc. DS41420A-page 1
®
Microcontroller Applications
MCP1623/24
V
GND
V
FB
SW
VIN
0.9V To 1.7V
V
OUT
3.3V
C
OUT
10 µF
C
4.7 µF
L
1
4.7 µH
V
OUT
+
-
976 K
562 K
ALKALINE
EN
PIC® MCU
VDD
VSS
MCP1623/24 Typical Application Circuit
MCP1624 Efficiency vs. I
OUT
, V
OUT
= 3.3V
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
I
OUT
(mA)
VIN= 0.8V
VIN= 1.2V
VIN= 2.5V
Efficiency (%)
FIGURE 1: Typical Application.
DS41420A-page 2 2010 Microchip Technology Inc.
MCP1623/24
1.0 ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
EN, FB, V
EN, FB ...........<greater of V
Output Short Circuit Current....................... Continuous
IN, VSW
, V
- GND ...........................+6.5V
OUT
or VIN > (GND - 0.3V)
OUT
† Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect
device reliability.
Power Dissipation ............................ Internally Limited
Storage Temperature .........................-65
Ambient Temp. with Power Applied......-40
Operating Junction Temperature........-40
o
C to +150oC
o
C to +85oC
o
C to +125oC
ESD Protection On All Pins:
HBM........................................................ 3 kV
MM........................................................ 300 V
DC CHARACTERISTICS
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, C
= +25°C.
T
A
Boldface specifications apply over the T
range of -40oC to +85oC.
A
Parameters Sym Min Typ Max Units Conditions
Input Characteristics
Minimum Start-Up Voltage V
Minimum Input Voltage After
V
—0.65 0.8 V Note 1
—0.35 — VNote 1
Start-Up
Output Voltage Adjust Range V
Maximum Output Current I
Feedback Voltage V
Feedback Input Bias Current I
Quiescent Current – PFM
I
OUT
OUT
FB
VFB
QPFM
2.0 5.5 VV
50 ——mA1.5V V
1.120 1.21 1.299 V—
—10 —pA—
— 19 30 µA Measured at V
mode
Quiescent Current – PWM
I
QPWM
— 220 — µA Measured at V
mode
Quiescent Current – Shutdown I
QSHDN
NMOS Switch Leakage I
PMOS Switch Leakage I
NMOS Switch ON Resistance R
PMOS Switch ON Resistance R
DS(ON)N
DS(ON)P
Note 1: 3.3 K resistive load, 3.3V
2: For V 3: IQ is measured from V
> V
OUT
estimated by: (I
, V
will not remain in regulation.
OUT
OUT
* (V
QPFM
4: 220 resistive load, 3.3V
NLK
PLK
OUT
; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
OUT/VIN
OUT
—0.7 2.3µAV
—0.3 1 µAV
— 0.05 0.2 µA VIN=VSW= GND;
—0.6 — VIN = 3.3V, ISW = 100 mA —0.9 — VIN = 3.3V, ISW = 100 mA
(1 mA).
)), (I
QPWM
* (V
(15 mA).
5: Peak current limit determined by characterization, not production tested.
= CIN = 10 µF, L = 4.7 µH, V
OUT
OUT/VIN
)).
OUT
VIN; Note 2
OUT
EN = V
=3.3V, I
, 3.3V V
, I
IN
OUT
=15mA,
OUT
OUT
= 4.0V;
OUT
= 0 mA;
Note 3
; EN = VIN
= 0 mA; Note 3
I
OUT
= EN = GND;
OUT
OUT
Includes N-Channel and P-Channel Switch Leakage
IN=VSW
5.5V V
V
OUT
=5V; V
EN=VFB
=5.5V
OUT
=GND
=
2010 Microchip Technology Inc. DS41420A-page 3
MCP1623/24
DC CHARACTERISTICS (CONTINUED)
Electrical Characteristics: Unless otherwise indicated, VIN = 1.2V, C
= +25°C.
T
A
Boldface specifications apply over the T
range of -40oC to +85oC.
A
Parameters Sym Min Typ Max Units Conditions
NMOS Peak Switch Current
I
N(MAX)
300 425 — mA Note 5
Limit
V
% -7.4 — +7.4 % Includes Line and Load
V
Accuracy
OUT
Line Regulation V
Load Regulation V
Maximum Duty Cycle DC
Switching Frequency f
EN Input Logic High V
EN Input Logic Low V
EN Input Leakage Current I
Soft-start Time t
Thermal Shutdown Die
OUT
OUT
V
V
OUT
SW
ENLK
T
OUT
) /
OUT
MAX
IL
SS
SD
/V
—0.01
|
—0.01 — %I
/
|
—90 —%
370 500 630 kHz
90
——
—
—
—
0.005 — µA VEN = 5V
750
150
Temperature
(1 mA).
)), (I
(15 mA).
—
QPWM
* (V
Die Temperature Hysteresis T
Note 1: 3.3 K resistive load, 3.3V
2: For VIN > V 3: I
is measured from V
Q
estimated by: (I
OUT
, V
will not remain in regulation.
OUT
OUT
* (V
QPFM
4: 220 resistive load, 3.3V
SDHYS
OUT
; VIN quiescent current will vary with boost ratio. VIN quiescent current can be
OUT/VIN
OUT
5: Peak current limit determined by characterization, not production tested.
= CIN = 10 µF, L = 4.7 µH, V
OUT
——
10
OUT/VIN
)).
—
%/V V
%of V
20 %of V
—
—
—
µS EN Low-to-High, 90% of
C
C
OUT
Regulation; V I
OUT
= 1.5V to 3V
IN
I
OUT
OUT
= 1.5V
V
I
OUT
I
OUT
V
OUT
=3.3V, I
OUT
IN
=15mA,
= 1.5V
= 50 mA
= 25 mA
= 25 mA to 50 mA;
= 1 mA
= 1 mA
; Note 4
TEMPERATURE SPECIFICATIONS
Electrical Specifications:
Parameters Sym Min Typ Max Units Conditions
Temperature Ranges
Operating Junction Temperature Range
Storage Temperature Range T
Maximum Junction Temperature T
Package Thermal Resistance
Thermal Resistance, 5L-TSOT23
DS41420A-page 4 2010 Microchip Technology Inc.
T
J
A
J
JA
-40 — +125 °C Steady State
-65 — +150 °C
— — +150 °C Transient
— 192 — °C/W EIA/JESD51-3 Standard
MCP1623/24
10.0
12.5
15.0
17.5
20.0
22.5
25.0
27.5
-40 -25 -10 5 20 35 50 65 80
Ambient Temperature (°C)
I
Q
PFM Mode (µA)
V
OUT
= 2.0V
V
OUT
= 5.0V
V
OUT
= 3.3V
VIN = 1.2V
150
175
200
225
250
275
300
-40 -25 -10 5 20 35 50 65 80
Ambient Temperature (°C)
I
Q
PWM Mode (µA)
V
OUT
= 3.3V
V
OUT
= 5.0V
VIN = 1.2V
0
50
100
150
200
250
300
350
0.511.522.533.544.55
Input Voltage (V)
V
OUT
= 3.3V
V
OUT
= 2.0V
V
OUT
= 5.0V
Output Current (mA)
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
I
OUT
(mA)
VIN= 0.8V
VIN= 1.2V
VIN= 1.6V
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
I
OUT
(mA)
VIN= 0.8V
VIN= 1.2V
VIN= 2.5V
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
I
OUT
(mA)
VIN= 3.6V
VIN= 1.2V
VIN= 1.8V
Efficiency (%)

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Note: Unless otherwise indicated, V
FIGURE 2-1: V
OUT IQ
vs. Ambient
Temperature in PFM Mode.
= EN = 1.2V, C
IN
OUT=CIN
=10µF, L =4.7µH, V
OUT
=3.3V, I
=15mA, TA=+25°C.
LOAD
FIGURE 2-4: MCP1624 Efficiency vs.
I
, V
OUT
= 2.0V.
OUT
FIGURE 2-2: V Temperature in PWM Mode.
FIGURE 2-3: MCP1623/24 I V
OUT
.
2010 Microchip Technology Inc. DS41420A-page 5
OUT IQ
vs. Ambient
OUTMAX
vs.
FIGURE 2-5: MCP1624 Efficiency vs.
I
, V
OUT
= 3.3V.
OUT
FIGURE 2-6: MCP1624 Efficiency vs.
, V
I
OUT
OUT
= 5.0V.
MCP1623/24
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
I
OUT
(mA)
VIN= 1.6V
VIN= 0.8V
VIN= 1.2V
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
I
OUT
(mA)
VIN= 2.5V
VIN= 0.8V
VIN= 1.2V
Efficiency (%)
0
10
20
30
40
50
60
70
80
90
100
0.01 0.1 1 10 100 1000
I
OUT
(mA)
VIN= 3.6V
VIN= 1.2V
VIN= 1.8V
Efficiency (%)
0.25
0.40
0.55
0.70
0.85
1.00
0 20406080100
I
OUT
(mA)
V
IN
(V)
Startup
Shutdown
V
OUT
= 3.3V
480
485
490
495
500
505
510
515
520
525
-40 -25 -10 5 20 35 50 65 80
Ambient Temperature (°C)
Switching Frequency (kHz)
V
OUT
= 3.3V
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
012345678910
I
OUT
(mA)
V
IN
(V)
V
OUT
= 3.3V
V
OUT
= 5.0V
V
OUT
= 2.0V
Note: Unless otherwise indicated, V
= EN = 1.2V, C
IN
FIGURE 2-7: MCP1623 Efficiency vs. I
, V
OUT
= 2.0V.
OUT
OUT=CIN
=10µF, L =4.7µH, V
OUT
=3.3V, I
=15mA, TA= +25°C.
LOAD
FIGURE 2-10: Minimum Start-up and Shutdown V
into Resistive Load vs. I
IN
OUT
.
FIGURE 2-8: MCP1623 Efficiency vs.
, V
I
OUT
OUT
= 3.3V.
FIGURE 2-9: MCP1623 Efficiency vs. I
, V
OUT
= 5.0V.
OUT
DS41420A-page 6 2010 Microchip Technology Inc.
FIGURE 2-11: F
vs. Ambient
OSC
Temperature.
FIGURE 2-12: MCP1623 PWM Pulse Skipping Mode Threshold vs. I
OUT
.
MCP1623/24
10
100
1000
10000
0.8 1.1 1.4 1.7 2 2.3 2.6 2.9 3.2 3.5
VIN (V)
I
IN
(µA)
V
OUT
= 3.3V V
OUT
= 5.0V
V
OUT
= 2.0V
V
OUT
= 2.0V
V
OUT
= 3.3V
V
OUT
= 5.0V
PWM / PFM
PWM ONLY
0
1
2
3
4
5
1 1.5 2 2.5 3 3.5 4 4.5 5
> VIN or V
Switch Resistance (Ohms)
P - Channel
N - Cha nnel
0
2
4
6
8
10
12
14
16
00.511.522.533.54
VIN (V)
I
OUT
(mA)
V
OUT
= 2.0V
V
OUT
= 3.3V
V
OUT
= 5.0V
Note: Unless otherwise indicated, V
= EN = 1.2V, C
IN
FIGURE 2-13: Input No Load Current vs. V
.
IN
OUT=CIN
=10µF, L =4.7µH, V
OUT
=3.3V, I
=15mA, TA=+25°C.
LOAD
FIGURE 2-16: MCP1624 3.3V V
Mode Waveforms.
OUT
PFM
FIGURE 2-14: N-Channel and P-Channel R
vs. > of VIN or V
DSON
OUT
FIGURE 2-15: PFM/PWM Threshold
IN
.
Current vs. V
2010 Microchip Technology Inc. DS41420A-page 7
OUT
FIGURE 2-17: MCP1623 3.3V V
.
PWM Mode Waveforms.
OUT
FIGURE 2-18: MCP1623/24 High Load
Waveforms.
MCP1623/24
MCP1623 PWM
Note: Unless otherwise indicated, V
= EN = 1.2V, C
IN
FIGURE 2-19: 3.3V Start-up After Enable.
OUT=CIN
=10µF, L =4.7µH, V
OUT
=3.3V, I
=15mA, TA= +25°C.
LOAD
FIGURE 2-22: MCP1623 3.3V V Transient Waveforms.
OUT
Load
FIGURE 2-20: 3.3V Start-up when V V
ENABLE
FIGURE 2-21: MCP1624 3.3V V
.
OUT
Transient Waveforms.
=
IN
Load
FIGURE 2-23: MCP1623 2.0V V Transient Waveforms.
FIGURE 2-24: 3.3V V
Line Transient
OUT
Waveforms.
OUT
Load
DS41420A-page 8 2010 Microchip Technology Inc.

3.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Tab le 3- 1.

TABLE 3-1: PIN FUNCTION TABLE

Pin No. MCP1623/24 SOT23 Description
SW 1 Switch Node, Boost Inductor Input Pin
GND 2 Ground Pin
EN 3 Enable Control Input Pin
FB 4 Feedback Voltage Pin
V
OUT
V
IN

3.1 Switch Node Pin (SW)

Connect the inductor from the input voltage to the SW pin. The SW pin carries inductor current and can be as high as 425 mA peak. The integrated N-Channel switch drain and integrated P-Channel switch source are inter­nally connected at the SW node.
5 Output Voltage Pin
6 Input Voltage Pin
MCP1623/24

3.2 Ground Pin (GND)

The ground or return pin is used for circuit ground connection. Length of trace from input cap return, output cap return and GND pin should be made as short as possible to minimize noise on the GND pin.

3.3 Enable Pin (EN)

The EN pin is a logic-level input used to enable or disable device switching and lower quiescent current while disabled. A logic high (>90% of VIN) will enable the regulator output. A logic low (<20% of V ensure that the regulator is disabled.
IN
) will

3.4 Feedback Voltage Pin (FB)

The FB pin is used to provide output voltage regulation by using a resistor divider. The FB voltage will be 1.21V typical with the output voltage in regulation.
3.5 Output Voltage Pin (V
The output voltage pin connects the integrated P-Channel MOSFET to the output capacitor. The FB voltage divider is also connected to the V voltage regulation.
OUT
)
OUT
pin for
3.6 Power Supply Input Voltage Pin
(V
)
IN
Connect the input voltage source to VIN. The input source should be decoupled to GND with a 4.7 µF minimum capacitor.
2010 Microchip Technology Inc. DS41420A-page 9
MCP1623/24

4.0 DETAILED DESCRIPTION

4.1 Device Option Overview

The MCP1623/24 family of devices is capable of low start-up voltage and delivers high efficiency over a wide load range for single cell, two cell, three cell alkaline, NiMH, NiCd and single cell Li-Ion battery inputs. A high level of integration lowers total system cost, eases implementation and reduces board area. The devices feature low start-up voltage, adjustable output voltage, PWM/PFM mode operation, low I nous switch, internal compensation, low noise anti-ring control, inrush current limit and soft start. There is one feature option for the MCP1623/24 family: PWM/PFM mode or PWM mode only.
4.1.1 PWM/PFM MODE OPTION
The MCP1624 devices use an automatic switchover from PWM to PFM mode for light load conditions to maximize efficiency over a wide range of output current. During PFM mode, higher peak current is used to pump the output up to the threshold limit. While operating in PFM or PWM mode, the P-Channel switch is used as a synchronous rectifier, turning off when the inductor current reaches 0 mA to maximize efficiency. In PFM mode, a comparator is used to terminate switching when the output voltage reaches the upper threshold limit. Once switching has terminated, the output voltage will decay or coast down. During this period, very low I consumed from the device and input source, which keeps power efficiency high at light load. The disadvantages of PWM/PFM mode are higher output ripple voltage and variable PFM mode frequency. The PFM mode frequency is a function of input voltage, output voltage and load. While in PFM mode, the boost converter pumps the output up at a switching frequency of 500 kHz.
, integrated synchro-
Q
is
Q
4.1.2 PWM MODE ONLY OPTION
The MCP1623 devices disable PFM mode switching, and operate only in PWM mode over the entire load range. During periods of light load operation, the MCP1623 continues to operate at a constant 500 kHz switching frequency, keeping the output ripple voltage lower than PFM mode. During PWM-only mode, the MCP1623 P-Channel switch acts as a synchronous rectifier by turning off to prevent reverse current flow from the output cap back to the input in order to keep efficiency high. For noise immunity, the N-Channel MOSFET current sense is blanked for approximately 100 ns. With a typical minimum duty cycle of 100 ns, the MCP1623 continues to switch at a constant frequency under light load conditions. Figure 2-12 represents the input voltage versus load current for the pulse-skipping threshold in PWM-only mode. At lighter loads, the MCP1623 device begins to skip pulses.

TABLE 4-1: PART NUMBER SELECTION

Part Number PWM/PFM PWM
MCP1624 X
MCP1623 X
DS41420A-page 10 2010 Microchip Technology Inc.
MCP1623/24
GATE DRIVE
AND
SHUTDOWN
CONTROL
LOGIC
V
IN
EN
V
OUT
GND
I
SENSE
I
ZERO
I
LIMIT
.3V
0V
SOFT-START
DIRECTION
CONTROL
OSCILLATOR
SLOPE COMP.
PWM/PFM
LOGIC
1.21V
INTERNAL
BIAS
SW
FB
EA

4.2 Functional Description

The MCP1623/24 is a compact, high-efficiency, fixed frequency, step-up DC-DC converter that provides an easy-to-use power supply solution for PIC microcontroller two-cell, or three-cell alkaline, NiCd, or NiMH, or one-cell Li-Ion or Li-Polymer batteries.
Figure 4-1 depicts the functional block diagram of the MCP1623/24.
4.2.1 LOW-VOLTAGE START-UP
The MCP1623/24 is capable of starting from a low input voltage. Start-up voltage is typically 0.65V for a 3.3V output and 1 mA resistive load. When enabled, the internal start-up logic turns the rectifying P-Channel switch on until the output capacitor is charged to a value close to the input voltage. The rectifying switch is current limited during this time. After charging the output capacitor to the input voltage, the device starts switching. If the input voltage is below 1.6V, the device runs open-loop with a fixed duty cycle of 70% until the output reaches 1.6V.
applications powered by either one-cell,
During this time, the boost switch current is limited to
50% of its nominal value. Once the output voltage
reaches 1.6V, normal closed-loop PWM operation is
initiated.
The MCP1623/24 charges an internal capacitor with a
very weak current source. The voltage on this capaci-
tor, in turn, slowly ramps the current limit of the boost
switch to its nominal value. The soft-start capacitor is
completely discharged in the event of a commanded
shutdown or a thermal shutdown.
There is no undervoltage lockout feature for the
MCP1623/24. The device will start-up at the lowest
possible voltage and run down to the lowest possible
voltage. For typical battery applications, this may result
in “motor-boating” for deeply discharged batteries.
FIGURE 4-1: MCP1623/24 Block Diagram.
2010 Microchip Technology Inc. DS41420A-page 11
MCP1623/24
4.2.2 PWM MODE OPERATION
In normal PWM operation, the MCP1623/24 operates as a fixed frequency, synchronous boost converter. The switching frequency is internally maintained with a oscillator typically set to 500 kHz. The MCP1623 device will operate in PWM-only mode even during periods of light load operation. By operating in PWM-only mode, the output ripple remains low and the frequency is constant. Operating in fixed PWM mode results in lower efficiency during light load operation (when compared to PFM mode (MCP1624).
Lossless current sensing converts the peak current sig­nal to a voltage to sum with the internal slope compen­sation. This summed signal is compared to the voltage error amplifier output to provide a peak current control command for the PWM signal. The slope compensation is adaptive to the input and output voltage. Therefore, the converter provides the proper amount of slope compensation to ensure stability, but is not excessive, which causes a loss of phase margin. The peak current limit is set to 425 mA typical.
4.2.3 PFM MODE OPERATION
The MCP1624 device is capable of operating in normal PWM mode and PFM mode to maintain high efficiency at all loads. In PFM mode, the output ripple has a vari­able frequency component that changes with the input voltage and output current. With no load, the quiescent current draw from the output is typically 19 µA. The PFM mode can be disabled in selected device options.
PFM operation is initiated if the output load current falls below an internally programmed threshold. The output voltage is continuously monitored. When the output voltage drops below its nominal value, PFM operation pulses one or several times to bring the output back into regulation. If the output load current rises above the upper threshold, the MCP1624 transitions smoothly into PWM mode.
4.2.4 ADJUSTABLE OUTPUT VOLTAGE
The MCP1623/24 output voltage is adjustable with a resistor divider over a 2.0V minimum to 5.5V maximum range. High value resistors are recommended to mini­mize quiescent current to keep efficiency high at light loads.
4.2.5 ENABLE/OUTPUT DISCONNECT
The enable pin is used to turn the boost converter on and off. The enable threshold voltage varies with input voltage. To enable the boost converter, the EN voltage level must be greater than 90% of the V disable the boost converter, the EN voltage must be less than 20% of the VIN voltage.
voltage. To
The MCP1623/24 devices incorporate a true output disconnect feature. With the EN pin pulled low, the output of the MCP1623/24 is isolated or disconnected from the input by turning off the integrated P-Channel switch and removing the switch bulk diode connection. This removes the DC path typical in boost converters, which allows the output to be disconnected from the input. During this mode, less than 1 µA of current is consumed from the input (battery). True output discon­nect does not discharge the output; the output voltage is held up by the external C
capacitance.
OUT
4.2.6 INTERNAL BIAS
The MCP1623/24 gets its start-up bias from VIN. Once the output exceeds the input, bias comes from the output. Therefore, once started, operation is completely independent of V limited by the output power level and the input source series resistance. Once started, the output will remain in regulation down to 0.35V typical with 1 mA output current for low source impedance inputs.
. Operation is only
IN
4.2.7 INTERNAL COMPENSATION
The error amplifier, with its associated compensation network, completes the closed loop system by com­paring the output voltage to a reference at the input of the error amplifier, and feeding the amplified and inverted signal to the control input of the inner current loop. The compensation network provides phase leads and lags at appropriate frequencies to cancel exces­sive phase lags and leads of the power circuit. All nec­essary compensation components and slope compensation are integrated.
4.2.8 SHORT CIRCUIT PROTECTION
Unlike most boost converters, the MCP1623/24 allows its output to be shorted during normal operation. The internal current limit and overtemperature protection limit excessive stress and protect the device during periods of short circuit, overcurrent and overtemperature.
4.2.9 LOW NOISE OPERATION
The MCP1623/24 integrates a low noise anti-ring switch that damps the oscillations typically observed at the switch node of a boost converter when operating in the Discontinuous Inductor Current mode. This removes the high frequency radiated noise.
4.2.10 OVERTEMPERATURE PROTECTION
Overtemperature protection circuitry is integrated in the MCP1623/24. This circuitry monitors the device junction temperature and shuts the device off if the junction temperature exceeds the typical +150 this threshold is exceeded, the device will automatically restart once the junction temperature drops by 10oC. The soft start is reset during an overtemperature condition.
o
C threshold. If
DS41420A-page 12 2010 Microchip Technology Inc.
MCP1623/24
R
TOP
R
BOT
V
OUT
V
FB
-------------
1–


=
I
OUT
C
OUT
dV
dt
-------


=

5.0 APPLICATION INFORMATION

5.1 Typical Applications

The MCP1623/24 synchronous boost regulator oper­ates over a wide input voltage and output voltage range. The power efficiency is high for several decades of load range. Output current capability increases with input voltage and decreases with increasing output voltage. The maximum output current is based on the N-Channel peak current limit. Typical characterization curves in this data sheet are presented to display the typical output current capability.

5.2 Adjustable Output Voltage Calculations

To calculate the resistor divider values for the MCP1623/24, the following equation can be used. Where R to GND and both are connected to the FB input pin.
EQUATION 5-1:
Example A:
V
OUT
= 1.21V
V
FB
R
BOT
R
TOP
Example B:
V
OUT
= 1.21V
V
FB
R
BOT
R
TOP
There are some potential issues with higher value resistors. For small surface mount resistors, environment contamination can create leakage paths that significantly change the resistor divider that effect the output voltage. The FB input leakage current can also impact the divider and change the output voltage tolerance.
is connected to V
TOP
= 3.3V
= 309 k
= 533.7 k (Standard Value = 536 k)
= 5.0V
= 309 k
= 967.9 k (Standard Value = 976 k)
OUT
, R
BOT
is connected

5.3 Input Capacitor Selection

The boost input current is smoothed by the boost inductor reducing the amount of filtering necessary at the input. Some capacitance is recommended to provide decoupling from the source. Low ESR X5R or X7R are well suited since they have a low temperature coefficient and small size. For most applications,
4.7 µF of capacitance is sufficient at the input. For high power applications that have high source impedance or long leads, connecting the battery to the input 10 µF of capacitance is recommended. Additional input capacitance can be added to provide a stable input voltage.
Table 5-1 contains the recommended range for the
input capacitor value.

5.4 Output Capacitor Selection

The output capacitor helps provide a stable output voltage during sudden load transients and reduces the output voltage ripple. As with the input capacitor, X5R and X7R ceramic capacitors are well suited for this application.
The MCP1623/24 is internally compensated so output capacitance range is limited. See Ta bl e 5 - 1 for the rec­ommended output capacitor range.
While the N-Channel switch is on, the output current is supplied by the output capacitor C output capacitance and equivalent series resistance will have a significant effect on the output ripple voltage. While C drop also appears across its internal ESR that results in ripple voltage.
provides load current, a voltage
OUT
EQUATION 5-2:
Where dV represents the ripple voltage and dt represents the ON time of the N-Channel switch (D * 1/FSW).
Table 5-1 contains the recommended range for the
input and output capacitor value.

TABLE 5-1: CAPACITOR VALUE RANGE

C
Min 4.7 µF 10 µF
Max none 100 µF
. The amount of
OUT
C
OUT
2010 Microchip Technology Inc. DS41420A-page 13
MCP1623/24
V
OUTIOUT
Efficiency
-------------------------------


V
OUTIOUT
– P
Dis
=

5.5 Inductor Selection

The MCP1623/24 is designed to be used with small surface mount inductors; the inductance value can range from 2.2 µH to 10 µH. An inductance value of
4.7 µH is recommended to achieve a good balance between inductor size, converter load transient response and minimized noise.
TABLE 5-2: MCP1623/24 RECOMMENDED
INDUCTORS
Part
Number
Coilcraft
ME3220 4.7 0.190 1.5 2.5x3.2x2.0
LPS3015 4.7 0.200 1.2 3.0x3.0x1.5
EPL3012 4.7 0.165 1.0 3.0x3.0x1.3
XPL2010 4.7 0.336 0.75 1.9x2.0x1.0
Coiltronics
SD3110 4.7 0.285 0.68 3.1x3.1x1.0
SD3112 4.7 0.246 0.80 3.1x3.1x1.2
SD3114 4.7 0.251 1.14 3.1x3.1x1.4
Part
Number
Wurth Elektronik
WE-TPC Typ e TH
WE-TPC Typ e S
WE-TPC Typ e M
Part
Number
Sumida
CMH23 4.7 0.537 0.70 2.3x2.3x1.0
CMD4D06 4.7 0.216 0.75 3.5x4.3x0.8
CDRH4D 4.7 0.09 0.800 4.6x4.6x1.5
EPCOS
B82462A2 472M000
B82462G4 472M
Several parameters are used to select the correct inductor: maximum rated current, saturation current and copper resistance (ESR). For boost converters, the inductor current can be much higher than the output current. The lower the inductor ESR, the higher the efficiency of the converter, a common trade-off in size versus efficiency.
Value
(µH)
®
®
Value
(µH)
4.7 0.200 0.8 2.8x2.8x1.35
4.7 0.105 0.90 3.8x3.8x1.65
4.7 0.082 1.65 4.8x4.8x1.8
Value
(µH)
®
®
4.7 0.084 2.00 6.0x6.0x2.5
4.7 0.04 1.8 6.3x6.3x3.0
®
DCR
(typ)
DCR
(max)
DCR
(max)
I
SAT
(A)
I
SAT
(A)
I
SAT
(A)
Size
WxLxH (mm)
Size
WxLxH (mm)
Size
WxLxH (mm)
Peak current is the maximum or limit, and saturation current typically specifies a point at which the induc­tance has rolled off a percentage of the rated value. This can range from a 20% to 40% reduction in induc­tance. As inductance rolls off, the inductor ripple cur­rent increases as does the peak switch current. It is important to keep the inductance from rolling off too much, causing switch current to reach the peak limit.

5.6 Thermal Calculations

By calculating the power dissipation and applying the package thermal resistance, ( ature is estimated. The maximum continuous junction temperature rating for the MCP1623/24 is +125
To quickly estimate the internal power dissipation for the switching boost regulator, an empirical calculation using measured efficiency can be used. Given the measured efficiency, the internal power dissipation is estimated by Equation 5-3.
EQUATION 5-3:
The difference between the first term, input power, and the second term, power delivered, is the internal MCP1623/24 power dissipation. This is an estimate assuming that most of the power lost is internal to the MCP1623/24 and not C There is some percentage of power lost in the boost inductor, with very little loss in the input and output capacitors. For a more accurate estimation of internal power dissipation, subtract the I dissipation.
), the junction temper-
JA
, C
and the inductor.
OUT
INRMS
o
C.
2
*L
power
ESR
DS41420A-page 14 2010 Microchip Technology Inc.

5.7 PCB Layout Information

C
OUT
L
C
IN
+V
IN
GND
GND
+V
OUT
Via to GND Plane
MCP1623/24
Via for Enable
R
TOP
R
BOT
1
Good printed circuit board layout techniques are important to any switching circuitry and switching power supplies are no different. When wiring the switching high current paths, short and wide traces should be used. Therefore, it is important that the input and output capacitors be placed as close as possible to the MCP1623/24 to minimize the loop area.
The feedback resistors and feedback signal should be routed away from the switching node and the switching current loop. When possible, ground planes and traces should be used to help shield the feedback signal and minimize noise and magnetic interference.
MCP1623/24
FIGURE 5-1: MCP1623/24 SOT-23-6 Recommended Layout.
2010 Microchip Technology Inc. DS41420A-page 15
MCP1623/24
NOTES:
DS41420A-page 16 2010 Microchip Technology Inc.

6.0 PACKAGING INFORMATION

Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code Pb-free JEDEC designator for Matte Tin (Sn) * This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available characters for customer-specific information.
3
e
3
e
6-Lead SOT-23
XXNN
Example
CJNN
Package Marking
MCP1623 HUNN
MCP1624 CJNN

6.1 Package Marking Information (Not to Scale)

MCP1623/24
2010 Microchip Technology Inc. DS41420A-page 17
MCP1623/24
/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU&+>627@
1RWHV
 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH  'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0
%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV
1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW
KWWSZZZPLFURFKLSFRPSDFNDJLQJ
8QLWV 0,//,0(7(56
'LPHQVLRQ/LPLWV 0,1 120 0$;
1XPEHURI3LQV 1
3LWFK H %6&
2XWVLGH/HDG3LWFK H %6&
2YHUDOO+HLJKW $  ± 
0ROGHG3DFNDJH7KLFNQHVV $  ± 
6WDQGRII $  ± 
2YHUDOO:LGWK (  ± 
0ROGHG3DFNDJH:LGWK (  ± 
2YHUDOO/HQJWK '  ± 
)RRW/HQJWK /  ± 
)RRWSULQW /  ± 
)RRW$QJOH  ± 
/HDG7KLFNQHVV F  ± 
/HDG:LGWK E  ± 
b
E
4
N
E1
PIN1IDBY
LASER MARK
D
1
2
3
e
e1
A
A1
A2
c
L
L1
φ
0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%
DS41420A-page 18 2010 Microchip Technology Inc.
MCP1623/24
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2010 Microchip Technology Inc. DS41420A-page 19
MCP1623/24
NOTES:
DS41420A-page 20 2010 Microchip Technology Inc.
APPENDIX A: REVISION HISTORY
Revision A (05/2010)
• Original Release of this Document.
MCP1623/24
2010 Microchip Technology Inc. DS41420A-page 21
MCP1623/24
NOTES:
DS41420A-page 22 2010 Microchip Technology Inc.
MCP1623/24
Examples:
a) MCP1623T-I/CH: Tape and Reel,
0.65V, Sync Reg., 6LD SOT-23 package
b) MCP1624T-I/CH: Tape and Reel,
0.65V, Sync Reg., 6LD SOT-23 package
PART NO. X /XX
PackageTemperature
Range
Device
Device: MCP1623: 0.65V, PWM/PFM True Disconnect,
Sync Boost Regulator
MCP1623T: 0.65V, PWM/PFM True Disconnect,
Sync Boost Regulator (Tape and Reel)
MCP1624: 0.65V, PWM Only True Disconnect,
Sync Boost Regulator
MCP1624T: 0.65V, PWM Only True Disconnect,
Sync Boost Regulator (Tape and Reel)
Temperature Range:
I= -40C to +85C (Industrial)
Package: CH = Plastic Small Outline Transistor (SOT-23), 6-lead
X
Tap e
and Reel
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
2010 Microchip Technology Inc. DS41420A-page 23
MCP1623/24
NOTES:
DS41420A-page 24 2010 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, dsPIC, K
EELOQ, KEELOQ logo, MPLAB, PIC, PICmicro, PICSTART,
32
logo, rfPIC and UNI/O are registered trademarks of
PIC Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor, MXDEV, MXLAB, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Analog-for-the-Digital Age, Application Maestro, CodeGuard, dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN, ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial Programming, ICSP, Mindi, MiWi, MPASM, MPLAB Certified logo, MPLIB, MPLINK, mTouch, Octopus, Omniscient Code Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit, PICtail, REAL ICE, rfLAB, Select Mode, Total Endurance, TSHARC, UniWinDriver, WiperLock and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2010, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 978-1-60932-166-6
Microchip received ISO/TS-16949:2002 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
2010 Microchip Technology Inc. DS41420A-page 25
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DS41420A-page 26 2010 Microchip Technology Inc.
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