MICROCHIP MCP1602 Technical data

MCP1602

V

IN

V

IN

8 7 6 54

3

2

1 SHDN

V

CC

PG A

GNDVOUT/VFB

L

X

P

GND

8 7 6 54

3

2

1

SHDN

V

CC

PG

A

GND

V

OUT/VFB

L

X

P

GND

3x3 DFN-8MSOP-8

2.0 MHz, 500 mA Synchronous Buck Regulator with Power-Good

Features

• Over 90% Typical Efficiency

• Output Current: Up To 500 mA

• Power-Good Output with 262 ms Delay

• Low Quiescent Current: 45 µA (typical)

• Low Shutdown Current: 0.05 µA (typical)

• Automatic PWM to PFM Mode Transition

• Adjustable Output Voltage:

- 0.8V to 4.5V

• Fixed Output Voltage:

- 1.2V, 1.5V, 1.8V, 2.5V, and 3.3V

• 2.0 MHz Fixed-Frequency PWM (Heavy Load)

• Internally Compensated

• Undervoltage Lockout (UVLO)

• Overtemperture Protection

• Overcurrent Protection

• Space Saving Packages:

- 8-Lead MSOP

- 8-Lead 3x3 DFN

Applications

• Cellular Telephones

• Portable Computers

• Organizers / PDAs

• USB Powered Devices

• Digital Cameras

• Portable Equipment

• +5V or +3.3V Distributed Systems

General Description

The MCP1602 is a high efficient, fully integrated 500 mA synchronous buck regulator with a powergood monitor. The 2.7V to 5.5V input voltage range and low quiescent current (45 µA, typical) makes the MCP1602 ideally suited for applications powered from 1-cell Li-Ion or 2-cell/3-cell NiMH/NiCd batteries.

At heavy loads, the MCP1602 operates in the 2.0 MHz fixed frequency PWM mode which provides a low noise, low output ripple, small-size solution. When the load is reduced to light levels, the MCP1602 automatically changes operation to a PFM mode to minimize quiescent current draw from the battery. No intervention is necessary for a smooth transition from one mode to another. These two modes of operation allow the MCP1602 to achieve the highest efficiency over the entire operating current range.

The open-drain power-good feature of the MCP1602 monitors the output voltage and provides indication when the output voltage is within 94% (typical) of the regulation value. The typical 2% hystereses in the power-good transition threshold as well as a 262 ms (typical) delay time ensures accurate powergood signaling.

The MCP1602 is available in either the 8-pin DFN or MSOP package. It is also available with either an adjustable or fixed output voltage. The available fixed output voltage options are 1.2V, 1.5V, 1.8V, 2.5V, and

3.3V. Additional protection features include: UVLO,

overtemperature, and overcurrent protection.

Package Types

MCP1602

SHDN

V

CC

PG

A

GND

V

FB

V

IN

L

X

P

GND

1

2

3

4

8

7

6

5

ON

OFF

MCP1602

V

IN

2.7V to 4.5V

V

OUT

1.5V @ 500 mA

V

IN

R

PULLUP

4.7 µF

4.7 µH

4.7 µF

0.1 µF

10Ω

Processor Reset

Typical Application Circuit

ILIM

PWM

ILIM

PFM

IPEAK

PWM

IPEAK

PFM

V

IN

SHDN

VFB/V

OUT

P

GND

L

X

Band

Gap

UVLO

Switch Drive

UVLO

V

REF

Logic and Timing

S

RQ

Q

Soft Start

V

REF

PWM/PFM

Logic

V

REF

Slope Comp

OSC

-IPK Limit

Thermal

Shutdown

TSD

EA

POFF NOFF

PWM/PFM

PFM Error Amp

PWM Error Amp

OV Threshold

UV Threshold

IPK Limit

-ILPK

IPEAK

PWM

IPEAK

PFM

Disable Switcher

-ILPK

PG Generator

with Delay

V

REF

V

CC

V

OUT

A

GND

PG

V

CC

Functional Block Diagram

MCP1602

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings †

VIN - A

All Other I/O ..............................(A

LX to P

Output Short Circuit Current..................................Continuous

Power Dissipation (Note 6) ..........................Internally Limited

Storage Temperature.................................... -65

Ambient Temp. with Power Applied................ -40

Operating Junction Temperature.................. -40

ESD Protection On All Pins:

HBM..............................................................................3 kV

MM............................................................................... 200V

......................................................................+6.0V

GND

............................................. -0.3V to (VIN + 0.3V)

GND

- 0.3V) to (VIN + 0.3V)

GND

o

C to +150oC

o

C to +85oC

o

C to +125oC

† Notice: Stresses above those listed under "Maximum Ratings" may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for extended periods may affect device reliability.

DC CHARACTERISTICS

Electrical Characteristics: Unless otherwise indicated, VIN = 3.6V, C

(ADJ) = 1.8V, I

V

OUT

= 100 mA, TA = +25°C. Boldface specifications apply for the TA range of -40

OUT

Parameters Sym Min Typ Max Units Conditions

Input Characteristics

Input Voltage V Maximum Output Current I Shutdown Current I

IN_SHDN

Quiescent Current I

IN

OUT

Q

2.7 — 5.5 V Note 1

500 ——mANote 1

— 0.05 1 µA SHDN = GND —4560 µA SHDN = VIN, I

Shutdown/UVLO/Thermal Shutdown Characteristics

SHDN

, Logic Input Voltage Low V

SHDN

, Logic Input Voltage High V

SHDN, Input Leakage Current V

IL IH

L_SHND

——15 %VINVIN = 2.7V to 5.5V

45 ——%VINVIN = 2.7V to 5.5V

-1.0 ±0.1 1.0 µA VIN = 2.7V to 5.5V, SHDN =A

Undervoltage Lockout UVLO 2.40 2.55 2.70 VVIN Falling Undervoltage Lockout Hystere-

UVLO

— 200 — mV

HYS

sis Thermal Shutdown T Thermal Shutdown Hysteresis T

SHD-HYS

SHD

— 150 — °C Note 5, Note 6 —10— °CNote 5, Note 6

Output Characteristics

Adjustable Output Voltage

V

OUT

0.8 — 4.5 V Note 2

Range Reference Feedback Voltage V Feedback Input Bias Current I Note 1: The minimum V

has to meet two conditions: VIN ≥ 2.7V and VIN ≥ V

IN

FB

VFB

—0.8— V — -1.5 — nA

2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.

is the output voltage setting.

3: V

R

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load

regulation is tested over a load range of 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.

5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

temperature and the thermal resistance from junction to air (i.e. T allowable power dissipation causes the device to initiate thermal shutdown.

6: The internal MOSFET switches have an integral diode from the L

to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered too. Thermal protection is not able to limit the junction temperature for these cases.

7: The current limit threshold is a cycle-by-cycle current limit.

= CIN = 4.7 µF, L = 4.7 µH,

OUT

= 0 mA

OUT

+ 0.5V.

OUT

, TJ, θJA). Exceeding the maximum

A

pin to the VIN pin, and from the LX pin

X

o

C to +85

o

GND

C.

MCP1602

DC CHARACTERISTICS (CONTINUED)

Electrical Characteristics: Unless otherwise indicated, VIN = 3.6V, C

V

(ADJ) = 1.8V, I

OUT

= 100 mA, TA = +25°C. Boldface specifications apply for the TA range of -40

OUT

Parameters Sym Min Typ Max Units Conditions

Output Voltage Tolerance Fixed V Line Regulation V

Load Regulation V

Internal Oscillator Frequency F Start Up Time T R

P-Channel R

DSon

R

N-Channel R

DSon

L

Pin Leakage Current I

X

Positive Current Limit Threshold +I

LX(MAX)

OUT

LINE-

REG LOAD-

REG

OSC

SS

DSon-P

DSon-N

LX

-2.5 V

+2.5 % Note 3

R

—0.3—%/VVIN = VR + 1V to 5.5V,

—0.4— %VIN=VR+1.5V,

1.6 2.0 2.4 MHz —0.5— msTR= 10% to 90% — 450 — mΩ IP=100mA — 450 — mΩ IN= 100 mA

-1.0 ±0.01 1.0 µA SHDN =0V, VIN= 5.5V, LX=0V,

— 700 — mA Note 7

Power-Good (PG)

Voltage Range V

PG Threshold High V

PG Threshold Low V

PG Threshold Hysteresis V

TH_HYS

PG

TH_H

TH_L

1.0

1.2

—5.5

5.5

—9496 % of

89 92 — % of

—2—% of

PG Threshold Tempco ΔVTH/ΔT— 30 —ppm/°C PG Delay t

PG Active Time-out Period t

RPD

RPU

PG Output Voltage Low PG_V

Note 1: The minimum V

has to meet two conditions: VIN ≥ 2.7V and VIN ≥ V

IN

— 165 — µs V

140 262 560 ms V

——0.2 VV

OL

2: Reference Feedback Voltage Tolerance applies to adjustable output voltage setting.

is the output voltage setting.

3: V

R

4: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load

regulation is tested over a load range of 0.1 mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal regulation specification.

5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable

temperature and the thermal resistance from junction to air (i.e. T allowable power dissipation causes the device to initiate thermal shutdown.

6: The internal MOSFET switches have an integral diode from the L

to the GND pin. In cases where these diodes are forward-biased, the package power dissipation limits must be adhered too. Thermal protection is not able to limit the junction temperature for these cases.

7: The current limit threshold is a cycle-by-cycle current limit.

= CIN = 4.7 µF, L = 4.7 µH,

OUT

=100mA

I

OUT

I

= 100 mA to 500 mA, Note 1

LOAD

LX=5.5V

VTA= 0°C to +70°C

= -40°C to +85°C

T

A

VIN≤ 2.7V, I On Rising V

V

OUT

On Falling V

V

OUT

V

OUT

=(V

OUT

(V

- 100 mV)

TH_L

=(V

OUT

(V

I I

OUT

, TJ, θJA). Exceeding the maximum

A

pin to the VIN pin, and from the LX pin

X

+100mV), I

TH_H

OUT=VTH_L

= 1.2 mA, VIN>2.7V

PG

= 100 µA, 1.0 < VIN<2.7V

PG

+ 0.5V.

SINK

OUT

+ 100 mV) to

TH_H

-100mV) to

TH_L

-100mV,

= 100 µA

o

C to +85

SINK

o

=1.2mA

C.

MCP1602

TEMPERATURE SPECIFICATIONS

Electrical Specifications: Unless otherwise indicated, all limits are specified for: VIN+2.7Vto5.5V

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Operating Junction Temperature Range

Storage Temperature Range T Maximum Junction Temperature T

Package Thermal Resistances

Thermal Resistance, 8L-MSOP θ

Thermal Resistance, 8L-3x3 DFN θ

T

J

A J

JA

-40 — +125 °C Steady State

-65 — +150 °C — — +150 °C Transient

— 211 — °C/W Typical 4-layer Board with

Internal Ground Plane

— 60 — °C/W Typical 4-layer Board with

Internal Ground Plane and 2-Vias in Thermal Pad

MCP1602

30

35

40

45

50

55

60

-40 -25 -10 5 20 35 50 65 80 95 110 125

Ambient Temperature (

o

C)

Quiescent Current (µA)

V

OUT

= 1.8V

VIN = 5.5V

VIN = 3.6V

VIN = 4.2V

65

70

75

80

85

90

95

100

3.0 3.2 3.4 3.6 3.8 4.0 4.2

Input Voltage (V)

Efficiency (%)

V

OUT

= 1.2V

I

OUT

= 100 mA

I

OUT

= 500 mA

I

OUT

= 300 mA

70

75

80

85

90

95

100

3.0 3.2 3.4 3.6 3.8 4.0 4.2

Input Voltage (V)

Efficiency (%)

V

OUT

= 1.8V

I

OUT

= 100 mA

I

OUT

= 500 mA

I

OUT

= 300 mA

30

35

40

45

50

55

2.7 3.05 3.4 3.75 4.1 4.45 4.8 5.15 5.5

Input Voltage (V)

Quiescent Current (µA)

TA = +90°CTA = +25°C

TA = -40°C

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Output Current (mA)

Efficiency (%)

V

OUT

= 1.2V

VIN = 3.0V

VIN = 3.6V

VIN = 4.2V

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Output Current (mA)

Efficiency (%)

V

OUT

= 1.8V

VIN = 3.0V

VIN = 3.6V

VIN = 4.2V

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presente d may be outside the specified operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, VIN= SHDN =3.6V, C T

= +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.

A

OUT=CIN

FIGURE 2-1: IQ vs. Ambient Temperature.

= 4.7 µF, L = 4.7 µH, V

FIGURE 2-4: I

(ADJ) = 1.8V, I

OUT

vs. Input Voltage.

Q

LOAD

= 100 mA,

FIGURE 2-2: Efficiency vs. Input Voltage

= 1.2V).

(V

OUT

FIGURE 2-3: Efficiency vs. Input Voltage

= 1.8V).

(V

OUT

FIGURE 2-5: Efficiency vs. Output Load

= 1.2V).

(V

OUT

FIGURE 2-6: Efficiency vs. Output Load

= 1.8V).

(V

OUT

MCP1602

85.0

87.5

90.0

92.5

95.0

97.5

100.0

4.2 4.4 4.6 4.8 5.0 5.2 5.4

Input Voltage (V)

Efficiency (%)

V

OUT

= 3.3V

I

OUT

= 100 mA

I

OUT

= 500 mA

I

OUT

= 300 mA

200

220

240

260

280

300

320

340

-40 -25 -10 5 20 35 50 65 80 95 110 125

Ambient Temperature (°C)

PG Active Time-Out (ms)

0.812

0.816

0.820

0.824

0.828

0.832

-40

-25

-10

5

2035506580

95

110

125

Ambient Temperature (°C)

Feedback Voltage (V)

20

30

40

50

60

70

80

90

100

0.1 1 10 100 1000

Output Current (mA)

Efficiency (%)

V

OUT

= 3.3VVIN = 5.5V

VIN = 4.2V

88

89

90

91

92

93

94

95

96

-40 -25 -10 5 20 35 50 65 80 95 110 125

Ambient Temperature (°C)

PG Threshold (% of V

OUT

)

PG Threshold High

PG Threshold Low

1.81

1.82

1.83

1.84

1.85

0 50 100 150 200 250 300 350 400 450 500

Output Current (mA)

Output Voltage (V)

Typical Performance Curves (Continued)

Note: Unless otherwise indicated, VIN= SHDN =3.6V, C

T

= +25°C. Adjustable or fixed output voltage options can be used to generate the Typical Performance Characteristics.

A

OUT=CIN

= 4.7 µF, L = 4.7 µH, V

(ADJ) = 1.8V, I

OUT

LOAD

= 100 mA,

FIGURE 2-7: Efficiency vs. Input Voltage (V

= 3.3V).

OUT

FIGURE 2-8: PG Active Time-out vs. Ambient Temperature.

FIGURE 2-10: Efficiency vs. Output Load (V

= 3.3V).

OUT

FIGURE 2-11: PG Threshold Voltage vs. Ambient Temperature.

FIGURE 2-9: Feedback Voltage vs. Ambient Temperature.

FIGURE 2-12: Output Voltage vs. Load Current (V

OUT

= 1.8V).

MICROCHIP MCP1602 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

1.0 ELECTRICAL CHARACTERISTICS

2.0 TYPICAL PERFORMANCE CURVES

FIGURE 2-1: IQ vs. Ambient Temperature.

FIGURE 2-8: PG Active Time-out vs. Ambient Temperature.

FIGURE 2-11: PG Threshold Voltage vs. Ambient Temperature.

FIGURE 2-9: Feedback Voltage vs. Ambient Temperature.