MICROCHIP MCP131X, MCP132X Technical data

MCP131X/2X

1
2
3

5

4

MCP1317

1
2
3

5

4

MCP1318/18M/21

1
2
3

5

4

MCP1319/19M/22

1
2
3

5

4

MCP1316/16M/20

SOT-23-5

RST

RST

V

SS

MR

WDI

V

DD

V

DD

RST

V

SS

MR

WDI

V

SS

RST

WDI

V

DD

RST

V

SS

RST

MR

V

DD

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Noise Filter

Watchdog

MR

WDI

Note: Features available depend on the device

Voltage

Voltage Supervisor

Features

• Low supply current: 1 µA (typical),10 µA (max.)

• Precision monitoring trip point options:

- 2.9V and 4.6V (Standard Offerings)

- 2.0V to 4.7V in 100 mV increments,
(Contact the local Microchip Sales Office)

• Resets microcontroller in a power-l oss event

• Reset Delay Time Out Option:

- 1.4 ms, 30 ms, 200 ms, or 1.6s (typical)

• Watchdog Timer Input Time Out Options:

- 6.3 ms, 102 ms, 1.6s, or 25.6s (typical)

• Manual Reset (MR

• Single and Complementary Reset output(s)

• Reset Output Options:

- Push-Pull (active-high or active-low)

- Open-Drain (internal or external Pull-up)

• Temperature Range:

- -40°C to +85°C for trip points 2.0 to 2.4V and,

- -40°C to + 125°C for trip points > 2.5V

• Voltage Range: 1.0V to 5.5V

• Lead Free Packaging

) input (active-low)

Description

The MCP131X/2X are voltage supervisor devices
designed to keep a microcontroller in Reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. The table
below shows the available features for these devices.

Package Types

Block Diagram

Device Features

Device

MCP1316 Push-Pull — Low — — — Yes Yes
MCP1316M Open-Drain Internal Low — — — Yes Yes
MCP1317 Push-Pull — High — — — Yes Yes
MCP1318 Push-Pull — Low Push-Pull — High Yes No
MCP1318M Open-Drain Internal Low Push-Pull — High Yes No
MCP1319 Push-Pull — Low Push-Pull — High No Yes
MCP1319M Open-Drain Internal Low Push-Pull — High No Yes
MCP1320 Open-Drain External Low — — — Yes Yes
MCP1321 Open-Drain External Low Push-Pull — High Yes No
MCP1322 Open-Drain External Low Push-Pull — High No Yes

© 2007 Microchip Technology Inc. DS21985B-page 1

Type

Reset Output A Reset Output B

Pull-up

Resistor

Active

Level

Type

Pull-up

Resistor

Active

Level

WDI Input MR Input

MCP131X/2X

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings†

Supply Voltage (VDD to VSS). . . . . . . . . . . . . . . . . . . . . . 7.0V

Input current (V
Output current (RST
Voltage on all inputs and outputs, except Open-Drain RST

(with no internal pull-up resistor), w.r.t. V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.6V to (V

Voltage on Open-Drain RST
(with no internal pull-up resistor) w.r.t. V

Storage temperature. . . . . . . . . . . . . . . . . . .-65°C to +150°C

Ambient temp. with power applied . . . . . . . .-40°C to +125°C

Maximum Junction temp. with power applied . . . . . . . .150°C

Power Dissipation (T

5-Pin SOT-23A.......................................................240 mW

ESD protection on all pins..................................................≥ 4kV

) . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA

DD

) . . . . . . . . . . . . . . . . . . . . . . . . . .10 mA

≤ 70°C):

A

SS

. . -0.6V to 13.5V

SS

+ 1.0V)

DD

† Notice: Stresses above those listed under “Maximum Rat­ings” may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied. Expo­sure to maximum rating conditions for extended periods may
affect device reliability.

DC CHARACTERISTICS

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), T

Parameters Sym Min Typ Max Units Conditions

= -40°C to +125°C.

A

Operating Voltage Range V
Specified VDD Value to V

Low V

OUT

Operating Current: I

DD
DD

DD

1.0 — 5.5 V

1.0 — — V I

= 10 µA, V

RST

RST

— 5 10 µA Watchdog Timer Active
— 1 2 µA Watchdog Timer Inactive
—12µAVDD < V

TRIP

— 5 10 µA Reset Delay Timer Active

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.
3: Hyster ysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC

®

microcontroller applications that require the In-Cir­cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST pin can be above the maximum device operational voltage
(5.5V) is 100s. Current into the RST

pin should be limited to 2 mA. It is recommended that the device oper­ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.

5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; min imum ord er volume requ irement . Informati on avai labl e upo n reque st.

< 0.3V

DS21985B-page 2 © 2007 Microchip Technology Inc.

MCP131X/2X

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), T

Parameters Sym Min Typ Max Units Conditions

= -40°C to +125°C.

A

VDD Trip Point MCP13XX-20 V

(Note 6) 1.950 2.00 2.050 V TA = -40°C to +85°C (Note 2)

MCP13XX-21 2.069 2.10 2.132 V TA = +25°C (Note 1)

(Note 6) 2.048 2.10 2.153 V TA = -40°C to +85°C (Note 2)

MCP13XX-22 2.167 2.20 2.233 V TA = +25°C (Note 1)

(Note 6) 2.145 2.20 2.255 V TA = -40°C to +85°C (Note 2)

MCP13XX-23 2.266 2.30 2.335 V TA = +25°C (Note 1)

(Note 6) 2.243 2.30 2.358 V TA = -40°C to +85°C (Note 2)

MCP13XX-24 2.364 2.40 2.436 V TA = +25°C (Note 1)

(Note 6) 2.340 2.40 2.460 V TA = -40°C to +85°C (Note 2)

MCP13XX-25 2.463 2.50 2.538 V TA = +25°C (Note 1)

(Note 6) 2.438 2.50 2.563 V TA = -40°C to +125°C (Note 2)

MCP13XX-26 2.561 2.60 2.639 V TA = +25°C (Note 1)

(Note 6) 2.535 2.60 2.665 V TA = -40°C to +125°C (Note 2)

MCP13XX-27 2.660 2.70 2.741 V TA = +25°C (Note 1)

(Note 6) 2.633 2.70 2.768 V TA = -40°C to +125°C (Note 2)

MCP13XX-28 2.758 2.80 2.842 V TA = +25°C (Note 1)

(Note 6) 2.730 2.80 2.870 V TA = -40°C to +125°C (Note 2)

MCP13XX-29 2.857 2.90 2.944 V T

MCP13XX-30 2.955 3.00 3.045 V TA = +25°C (Note 1)

(Note 6) 2.925 3.00 3.075 V TA = -40°C to +125°C (Note 2)

MCP13XX-31 3.054 3.10 3.147 V TA = +25°C (Note 1)

(Note 6) 3.023 3.10 3.178 V TA = -40°C to +125°C (Note 2)

MCP13XX-32 3.152 3.20 3.248 V TA = +25°C (Note 1)

(Note 6) 3.120 3.20 3.280 V TA = -40°C to +125°C (Note 2)

MCP13XX-33 3.251 3.30 3.350 V TA = +25°C (Note 1)

(Note 6) 3.218 3.30 3.383 V TA = -40°C to +125°C (Note 2)

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.
3: Hyster ysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC

cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST
(5.5V) is 100s. Current into the RST
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.

5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; min imum ord er volume requ irement . Informati on avai labl e upo n reque st.

TRIP

1.970 2.00 2.030 V TA = +25°C (Note 1)

= +25°C (Note 1)

A

2.828 2.90 2.973 V TA = -40°C to +125°C (Note 2)

®

microcontroller applications that require the In-Cir-

pin can be above the maximum device operational voltage

pin should be limited to 2 mA. It is recommended that the device oper-

© 2007 Microchip Technology Inc. DS21985B-page 3

MCP131X/2X

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), T

Parameters Sym Min Typ Max Units Conditions

= -40°C to +125°C.

A

VDD Trip Point (Con’t) MCP13XX-34 V

TRIP

3.349 3.40 3.451 V TA = +25°C (Note 1)

(Note 6) 3.315 3.40 3.385 V TA = -40°C to +125°C (Note 2)

MCP13XX-35 3.448 3.50 3.553 V TA = +25°C (Note 1)

(Note 6) 3.413 3.50 3.588 V TA = -40°C to +125°C (Note 2)

MCP13XX-36 3.546 3.60 3.654 V TA = +25°C (Note 1)

(Note 6) 3.510 3.60 3.690 V TA = -40°C to +125°C (Note 2)

MCP13XX-37 3.645 3.70 3.756 V TA = +25°C (Note 1)

(Note 6) 3.608 3.70 3.793 V TA = -40°C to +125°C (Note 2)

MCP13XX-38 3.743 3.80 3.857 V TA = +25°C (Note 1)

(Note 6) 3.705 3.80 3.895 V TA = -40°C to +125°C (Note 2)

MCP13XX-39 3.842 3.90 3.959 V TA = +25°C (Note 1)

(Note 6) 3.803 3.90 3.998 V TA = -40°C to +125°C (Note 2)

MCP13XX-40 3.940 4.00 4.060 V TA = +25°C (Note 1)

(Note 6) 3.900 4.00 4.100 V TA = -40°C to +125°C (Note 2)

MCP13XX-41 4.039 4.10 4.162 V TA = +25°C (Note 1)

(Note 6) 3.998 4.10 4.203 V TA = -40°C to +125°C (Note 2)

MCP13XX-42 4.137 4.20 4.263 V TA = +25°C (Note 1)

(Note 6) 4.095 4.20 4.305 V TA = -40°C to +125°C (Note 2)

MCP13XX-43 4.236 4.30 4.365 V TA = +25°C (Note 1)

(Note 6) 4.193 4.30 4.408 V TA = -40°C to +125°C (Note 2)

MCP13XX-44 4.334 4.40 4.466 V TA = +25°C (Note 1)

(Note 6) 4.290 4.40 4.510 V TA = -40°C to +125°C (Note 2)

MCP13XX-45 4.433 4.50 4.568 V TA = +25°C (Note 1)

(Note 6) 4.388 4.50 4.613 V TA = -40°C to +125°C (Note 2)

MCP13XX-46 4.531 4.60 4.669 V T

4.485 4.60 4.715 V T

= +25°C (Note 1)

A

= -40°C to +125°C (Note 2)

A

MCP13XX-47 4.630 4.70 4.771 V TA = +25°C (Note 1)

(Note 6) 4.583 4.70 4.818 V TA = -40°C to +125°C (Note 2)

V

Trip Point Tempco

DD

T

TPCO

— ±40 — ppm/°C

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.
3: Hyster ysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC

®

microcontroller applications that require the In-Cir­cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST
(5.5V) is 100s. Current into the RST

pin can be above the maximum device operational voltage

pin should be limited to 2 mA. It is recommended that the device oper­ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.

5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; min imum ord er volume requ irement . Informati on avai labl e upo n reque st.

DS21985B-page 4 © 2007 Microchip Technology Inc.

MCP131X/2X

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), T

Parameters Sym Min Typ Max Units Conditions

= -40°C to +125°C.

A

Threshold Hysteresis MCP13XX-20 V
(Note 3) (Note 6) (Note 6) V TA = -40°C to +85°C

MCP13XX-21 0.021 — 0.126 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +85°C

MCP13XX-22 0.022 — 0.132 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +85°C

MCP13XX-23 0.023 — 0.138 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +85°C

MCP13XX-24 0.024 — 0.144 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +85°C

MCP13XX-25 0.025 — 0.150 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-26 0.026 — 0.156 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-27 0.027 — 0.162 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-28 0.028 — 0.168 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-29 0.029 — 0.174 V T

MCP13XX-30 0.030 — 0.180 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-31 0.031 — 0.186 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-32 0.032 — 0.192 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-33 0.033 — 0.198 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.
3: Hyster ysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC

cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST
(5.5V) is 100s. Current into the RST
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.

5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; min imum ord er volume requ irement . Informati on avai labl e upo n reque st.

HYS

0.020 — 0.120 V TA = +25°C (Note 3)

= +25°C (Note 3)

A

(Note 6) VTA = -40°C to +125°C

®

microcontroller applications that require the In-Cir-

pin can be above the maximum device operational voltage

pin should be limited to 2 mA. It is recommended that the device oper-

© 2007 Microchip Technology Inc. DS21985B-page 5

MCP131X/2X

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), T

Parameters Sym Min Typ Max Units Conditions

= -40°C to +125°C.

A

Threshold Hysteresis MCP13XX-34 V
(Continued) (Note 3) (Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-35 0.035 — 0.210 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-36 0.036 — 0.216 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-37 0.037 — 0.222 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-38 0.038 — 0.228 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-39 0.039 — 0.234 V TA = +25°C (Note 1)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-40 0.040 — 0.240 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-41 0.041 — 0.246 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-42 0.042 — 0.252 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-43 0.043 — 0.258 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-44 0.044 — 0.264 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-45 0.045 — 0.270 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

MCP13XX-46 0.046 — 0.276 V T

MCP13XX-47 0.047 — 0.282 V TA = +25°C (Note 3)

(Note 6) (Note 6) V TA = -40°C to +125°C

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.
3: Hyster ysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC

cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST
(5.5V) is 100s. Current into the RST
ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.

5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; min imum ord er volume requ irement . Informati on avai labl e upo n reque st.

HYS

0.034 — 0.204 V TA = +25°C (Note 3)

= +25°C (Note 3)

A

(Note 6) VT

®

microcontroller applications that require the In-Cir-

pin can be above the maximum device operational voltage

pin should be limited to 2 mA. It is recommended that the device oper-

= -40°C to +125°C

A

DS21985B-page 6 © 2007 Microchip Technology Inc.

MCP131X/2X

DC CHARACTERISTICS (CONTINUED)

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), T

Parameters Sym Min Typ Max Units Conditions

= -40°C to +125°C.

A

RST/RST Low-Level Output Voltage V

RST/RST High-Level Output Voltage V

OL

OH

(Push-Pull Outputs only) V

Input Low Voltage (MR

and WDI pins) VIL VSS —0.3VDD V

——0.3VI
——0.3VI

——0.3VI
——0.3VI

VDD –

—— VI

0.7
–

DD

0.7

—— VI

OL
OL

1.5V < V

OL
OL
OH

OH

= 50 µA, 1.0V ≤ V
= 100 µA,

≤ 2.5V

DD

= 2 mA, 2.5V < V
= 4 mA, VDD > 4.5V
= 2.5 mA, VDD ≥ 2.5V

= 500 µA, VDD ≥ 1.5V

Input High Voltage (MR and WDI pins) VIH 0.7VDD —VDD V
Open-Drain High Voltage on Output

(Note 4)

V

— — 13.5

ODH

(4)

V Open-Drain Output pin only,

= 3.0V, Time voltage >

V

DD

5.5V applied ≤ 100 s,
current into pin limited to 2 mA,
+25°C operation recom­mended

(Note 4, Note 5)

Input Leakage Current (MR
Open-Drain Output Leakage Current

(MCP1316M, MCP1318M,

and WDI) IIL ——±1µAVSS ≤ V

I

OD

—0.0031.0 µA

PIN

≤ V

DD

MCP1319M, MCP1320, MCP1321,
and MCP1322 only)

Pull-up Resistance MR

pin RPU —52—kΩ VDD = 5.5V

WDI pin — 52 — kΩ V

DD

= 5.5V

RST pin — 4.7 — kΩ VDD = 5.5V,

MCP131XM devices only
Input Pin Capacitance (MR
Output Pin Capacitive Loading

(RST and RST

)

and WDI) CI — 100 — pF

— — 50 pF This is the tester loading to

C

O

meet the AC timing specifica-

tions.

Note 1: Trip point is ±1.5% from typical value.

2: Trip point is ±2.5% from typical value.
3: Hyster ysis is minimum = 1%, maximum = 6% at +25°C.
4: This specification allows this device to be used in PIC

®

microcontroller applications that require the In-Cir­cuit Serial Programming™ (ICSP™) feature (see device-specific programming specifications for voltage
requirements). The total time that the RST
(5.5V) is 100s. Current into the RST

pin can be above the maximum device operational voltage

pin should be limited to 2 mA. It is recommended that the device oper­ational temperature be maintained between 0°C to +70°C (+25°C preferred). For additional information,
refer to Figure 2-35.

5: This parameter is established by characterization and is not 100% tested.
6: Custom ordered voltage trip point; min imum ord er volume requ irement . Informati on avai labl e upo n reque st.

DD

DD

≤ 1.5V

≤ 4.5V

© 2007 Microchip Technology Inc. DS21985B-page 7

MCP131X/2X

V

TRIPMAX

V

TRIPMIN

V

TRIP

1V

V

DD

V

TRIPAC

+ V

HYS

t

RST

RST

RST

tRR

t

RST

t

RPD

VDD < 1V is outside the device operating specification. The RST (or RST) output state is
unknown while V

DD

< 1V.

FIGURE 1-1: Device Voltage and Reset Pin Waveforms.

TABLE 1-1: DEVICE VOLTAGE AND RESET PIN TIMINGS

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), T

Parameters Sym Min Typ Max Units Conditions

Falling V

Trip Point Detected

DD

t

RPD

to RST or RST Active

VDD Rise Rate t
Reset active time

(MR

Rising Edge, POR/BOR

t

RST

Inactive, or WDT time out) to RST/

Inactive

RST

RST Rise Time after RST

Active

t

(Push-Pull Outputs only)

RST

Rise Time after RST Inactive

(Push-Pull Outputs only)

RST Fall Time after RST

RST

Fall Time after RST Active — 5 — µs For RST 90% to 10% of VDD,

Note 1: These parameters are for design guidance only and are not 100% tested.

Inactive t

2: Custom ordered Reset active time; minimum order volume requirement.
3: Designed to be independent of V

0.1 V/s (@ +25°C).

= -40°C to +125°C.

A

—650 — µsVDD ramped from

V

TRIPMAX

V

TRIPMIN

+ 250 mV down to

– 200 mV,
VDD falling @ 5 mV/µs,
CL = 50 pF (Note 1)

RR

Note 3

1.0 1.4 2.0 ms Note 2
20 30 40 ms Note 2

140 200 280 ms Standard Time Out

1120 1600 2240 ms Note 2

RT

— 5 — µs For RST 10% to 90% of VDD,

= 50 pF (Note 1)

C

L

—5 —µsFor RST 10% to 90% of VDD,

= 50 pF (Note 1)

C

L

FT

— 5 — µs For RST 90% to 10% of VDD,

CL = 50 pF (Note 1)

= 50 pF (Note 1)

C

L

rise rate. Device characterization was done with a rise rate as slow as

DD

DS21985B-page 8 © 2007 Microchip Technology Inc.

MR

RST

t

RST

t

MR

RST

t

MRD

t

NF

RST

RST

WDI (Note 1)

t

WP

t

WD

t

WD

t

RST

Note 1: The WDI pin was a weak pull-up resistor which is disabled after the 1st falling edge on the WDI pin.

FIGURE 1-2: MR and Reset Pin Waveforms.

MCP131X/2X

TABLE 1-2: MR

AND RESET PIN TIMINGS

Electrical Specifications: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1320, MCP1321, and MCP1322), TA = -40°C to +125°C.

Parameters Sym Min Typ Max Units Conditions

MR

Pulse Width t
MR Active to RST/RST Active t
MR

Input Noise filter t

MR

MRD

NF

1— —µs
—235 — nsVDD = 5.0V
—150 — nsVDD = 5.0V

Note 1: These parameters are for design guidance only and are not 100% tested.

FIGURE 1-3: WDI and Reset Pin Waveforms.

TABLE 1-3: WDI AND RESET PIN TIMINGS

Electrical Specifications: Unless otherwise indicated, all limits are specified for V

(only MCP1320, MCP1321, and MCP1322), T

= -40°C to +125°C.

A

Parameters Sym Min Typ Max Units Conditions

WDI Pulse Width t
Watchdog Time Out Period t

Note 1: Custom ordered WatchDog Timer time out; minimum order volume requirement.

© 2007 Microchip Technology Inc. DS21985B-page 9

50 — — ns

WP

4.3 6.3 9.3 ms Note 1

WD

71 102 153 ms Note 1

1.12 1.6 2.4 sec Standard Time Out

17.9 25.6 38.4 sec Note 1

= 1V to 5.5V, RPU = 100 kΩ

DD

MCP131X/2X

TEMPERATURE CHARACTERISTICS

Electrical Specifications: Unless otherwise noted, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ
(only MCP1316), T

Parameters Sym Min Typ Max Units Conditions

Temperature Ranges

Specified Temperature Range T
Specified Temperature Range T
Maximum Junction Temperature T
Storage Temperature Range T

Package Thermal Resistances

Thermal Resistance, 5L-SOT23 θ

= -40°C to +125°C.

A

JA

A
A

J

A

-40 — +85 °C MCP13XX-25 (or below)

-40 — +125 °C Except MCP13XX-25 (or below)
——+150°C

-65 — +150 °C

— 255.9 — °C/W

DS21985B-page 10 © 2007 Microchip Technology Inc.

MCP131X/2X

0

0.2

0.4

0.6

0.8

1

1.2

-100 -50 0 50 100 150
Temperature (°C)

I

DD

(µA)

1.0V 1.5V 2.0V

3.0V 4.3V 4.5V

4.8V 5.0V 5.5V

0

0.2

0.4

0.6

0.8

1

1.2

1.4

-100 -50 0 50 100 150
Temperature (°C)

I

DD

(µA)

1.0V 1.5V 2.5V

2.7V 3.2V 4.0V

4.5V 5.0V 5.5V

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

-100 -50 0 50 100 150
Temperature (°C)

I

DD

(µA)

1.0V 1.5V 1.8V

2.2V 2.5V 4.0V

4.5V 5.0V 5.5V

0

1

2

3

4

5

6

-100 -50 0 50 100 150
Temperature (°C)

Idd (µA)

4.8V 5.0V 5.5V

0

1

2

3

4

5

6

-100 -50 0 50 100 150
Temperature (°C)

I

DD

(µA)

3.2V 4.0V 4.5V 5.0V 5.5V

0

1

2

3

4

5

6

7

-100 -50 0 50 100 150
Temperature (°C)

I

DD

(µA)

2.2V 2.5V 4.0V 4.5V 5.0V 5.5V

2.0 TYPICAL PERFORMANCE CURVES

Note: The graphs and tables provided following this note are a statistical summary based on a limited number of

samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;
see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-1: IDD vs. Temperature (Reset Power-up Timer Inactive and Watchdog Timer Inactive) (MCP1318M-4.6).

FIGURE 2-2: I

vs. Temperature (Reset

DD

Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1319-2.9).

FIGURE 2-4: I

vs. Temperature (Reset

DD

Power-up Timer Active) (MCP1318M-4.6).

FIGURE 2-5: I

vs. Temperature (Reset

DD

Power-up Timer Active) (MCP1319-2.9).

FIGURE 2-3: I
Power-up Timer Inactive and Watchdog Timer
Inactive) (MCP1316-2.0).

© 2007 Microchip Technology Inc. DS21985B-page 11

vs. Temperature (Reset

DD

FIGURE 2-6: I

vs. Temperature (Reset

DD

Power-up Timer Active) (MCP1316-2.0).

MCP131X/2X

0

1

2

3

4

5

6

7

-100 -50 0 50 100 150
Temperature (°C)

I

DD

(µA)

4.8V 5.0V 5.5V

MCP1319 does not

have a Watchdog Timer

0

1

2

3

4

5

6

7

-100 -50 0 50 100 150
Temperature (°C)

I

DD

(µA)

2.2V 2.5V 4.0V 4.5V 5.0V 5.5V

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-7: IDD vs. Temperature (Watchdog Timer Active) (MCP1318M-4.6).

FIGURE 2-8: I

vs. Temperature

DD

(Watchdog Timer Active) (MCP1319-2.9).

FIGURE 2-9: I

DD

(Watchdog Timer Active) (MCP1316-2.0).

DS21985B-page 12 © 2007 Microchip Technology Inc.

vs. Temperature

MCP131X/2X

0

0.2

0.4

0.6

0.8

1

1.2

0.0 1.0 2.0 3.0 4.0 5.0 6.0
V

DD

(V)

I

DD

(µA)

-45°C

25°C

90°C

130°C

0

0.2

0.4

0.6

0.8

1

1.2

1.4

0.0 1.0 2.0 3.0 4.0 5.0 6.0
V

DD

(V)

I

DD

(µA)

-45°C

25°C

90°C

130°C

0

0.2

0.4

0.6

0.8

1

1.2

1.4

1.6

1.8

0.0 1.0 2.0 3.0 4.0 5.0 6.0
V

DD

(V)

I

DD

(µA)

-45°C

25°C

90°C

130°C

0

1

2

3

4

5

6

4.6 4.8 5.0 5.2 5.4 5.6
V

DD

(V)

I

DD

(µA)

-45°C 25°C 90°C 130°C

0

1

2

3

4

5

6

0.0 1.0 2.0 3.0 4.0 5.0 6.0
V

DD

(V)

I

DD

(µA)

-45°C 25°C 90°C 130°C

0

1

2

3

4

5

6

7

2.0 3.0 4.0 5.0 6.0

V

DD

(V)

I

DD

(µA)

-45°C 25°C 90°C 130°C

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-10: IDD vs. VDD (Reset Power- up Timer Inactive and Watchdog Timer Inactive) (MCP1318M-4.6).

FIGURE 2-11: I

vs. VDD (Reset Power-

DD

up Timer Inactive and Watchdog Timer Inactive)
(MCP1319-2.9).

FIGURE 2-13: I

vs. VDD (Reset Power-

DD

up Timer Active or Watchdog Timer Active)
(MCP1318M-4.6).

FIGURE 2-14: I

vs. VDD (Reset Power-

DD

up Timer Active or Watchdog Timer Active)
(MCP1319-2.9).

FIGURE 2-12: I
up Timer Inactive and Watchdog Timer Inactive)
(MCP1316-2.0).

© 2007 Microchip Technology Inc. DS21985B-page 13

vs. VDD (Reset Power-

DD

FIGURE 2-15: I

vs. VDD (Reset Power-

DD

up Timer Active or Watchdog Timer Active)
(MCP1316-2.0).

MCP131X/2X

4.550

4.600

4.650

4.700

4.750

4.800

-50 0 50 100 150
Temperature (°C)

V

TRIP

(V)

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

V

TRIP

Hyst (%)

V

HYST

V

TRIP

Down

V

TRIP

Up

2.880

2.900

2.920

2.940

2.960

2.980

3.000

3.020

-50 0 50 100 150

Temperature (°C)

V

TRIP

(V)

3.0

3.1

3.1

3.2

3.2

3.3

3.3

3.4

3.4

3.5

V

TRIP

Hyst (%)

V

HYST

V

TRIP

Down

V

TRIP

Up

1.990

2.000

2.010

2.020

2.030

2.040

2.050

-50 0 50 100 150
Temperature (°C)

V

TRIP

(V)

0.0

0.5

1.0

1.5

2.0

2.5

3.0

V

TRIP

Hyst (%)

V

HYST

V

TRIP

Down

V

TRIP

Up

0

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0.16

0.00 2.00 4.00 6.00 8.00 10.00
I

OL

(mA)

V

OL

(V)

1V 2V 3V 4.3V 4.5V 4.8V 5V 5.5V

0

0.02

0.04

0.06

0.08

0.1

0.12

0.14

0.16

0.00 2.00 4.00 6.00 8.00 10.00
I

OL

(mA)

V

OL

(V)

1V 2.5V 2.7V 3.2V 4V 4.5V 5V 5.5V

0

0.002

0.004

0.006

0.008

0.01

0.012

0.014

0.016

0.018

0.02

0.00 0.05 0.10 0.15 0.20 0.25
I

OL

(mA)

V

OL

(V)

1V

1.8V

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-16: V

TRIP

and V

Temperature (MCP1318M-4.6).

FIGURE 2-17: V

TRIP

and V

Temperature (MCP1319-2.9).

HYST

HYST

vs.

vs.

FIGURE 2-19: V
(MCP1318M-4.6).

FIGURE 2-20: V
(MCP1319-2.9).

vs. IOL

OL

vs. IOL

OL

FIGURE 2-18: V
Temperature (MCP1316-2.0).

DS21985B-page 14 © 2007 Microchip Technology Inc.

TRIP

and V

HYST

vs.

FIGURE 2-21: V
(MCP1316-2.0).

vs. IOL

OL

MCP131X/2X

0

0.02

0.04

0.06

0.08

0.1

0.12

0.14

-50 0 50 100 150
Temperature (°C)

V

OL

(V)

0.05 mA

0.1 mA

0.15 mA

0.2 mA

0

0.05

0.1

0.15

0.2

0.25

-50 0 50 100 150
Temperature (°C)

V

OL

(V)

0.05 mA

0.1 mA

0.15 mA

0.2 mA

0

0.002

0.004

0.006

0.008

0.01

0.012

0.014

0.016

-50 0 50 100 150
Temperature (°C)

V

OL

(V)

0.05 mA

0.1 mA

0.15 mA

0.2 mA

0

0.5

1

1.5

2

2.5

3

3.5

4

4.5

5

0.00 1.00 2.00 3.00 4.00 5.00 6.00
I

OH

(mA)

V

OH

(V)

1.5V

3V

4.5V

4.3V

2V

0

1

2

3

4

5

6

0.00 1.00 2.00 3.00 4.00 5.00 6.00
I

OH

(mA)

V

OH

(V)

1.5V

3.2V

2.7V

2.5V

5.5V
5V

4.5V
4V

0

1

2

3

4

5

6

0.00 1.00 2.00 3.00 4.00 5.00 6.00
I

OH

(mA)

V

OH

(V)

5.5V
5V

4.5V
4V

2.5V

2.2V

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

0 mA

FIGURE 2-22: VOL vs. Temperature
(MCP1318M-4.6 @ V

FIGURE 2-23: V
(MCP1319-2.9 @ V

= 4.5V).

DD

vs. Temperature

OL

= 2.7V).

DD

0 mA

FIGURE 2-25: V

OH

(MCP1318M-4.6 @ 25C).

FIGURE 2-26: V

OH

(MCP1319-2.9 @ 25C).

vs. IOH

vs. IOH

FIGURE 2-24: V
(MCP1316-2-0 @ V

© 2007 Microchip Technology Inc. DS21985B-page 15

DD

vs. Temperature

OL

= 1.8V).

0 mA

FIGURE 2-27: V

OH

(MCP1316-2.0 @ 25C).

vs. IOH

MCP131X/2X

0

50

100

150

200

250

300

350

-100 -50 0 50 100 150
Temperature (°C)

t

RPD

(µs)

5V

5.5V

0

50

100

150

200

250

300

350

400

450

-100 -50 0 50 100 150
Temperature (°C)

t

RPD

(µs)

3.2V 4V 4.5V 5V 5.5V

0

50

100

150

200

250

300

350

-100 -50 0 50 100 150
Temperature (°C)

t

RPD

(µs)

2.5V 4V 4.5V 5V 5.5V

190

195

200

205

210

215

220

225

230

-100 -50 0 50 100 150
Temperature (°C)

t

RPU

(ms)

4.8 V 5 V 5.5 V

200

205

210

215

220

225

230

235

240

245

250

-100 -50 0 50 100 150
Temperature (°C)

t

RPU

(ms)

3.2 V 4 V 4.5 V 5 V 5.5 V

200

205

210

215

220

225

230

235

240

245

250

-100 -50 0 50 100 150
Temperature (°C)

t

RPU

(ms)

2.5 V 4 V 4.5 V 5 V 5.5 V 2.2 V

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-28: t
(MCP1318M-4.6).

FIGURE 2-29: t
(MCP1319-2.9).

vs. Temperature

RPD

vs. Temperature

RPD

FIGURE 2-31: t
(MCP1318M-4.6).

FIGURE 2-32: t
(MCP1319-2.9).

vs. Temperature

RPU

vs. Temperature

RPU

FIGURE 2-30: t

RPD

(MCP1316-2.0).

DS21985B-page 16 © 2007 Microchip Technology Inc.

vs. Temperature

FIGURE 2-33: t
(MCP1316-2.0).

vs. Temperature

RPU

MCP131X/2X

0

500

1000

1500

2000

2500

3000

3500

0.001 0.01 0.1 1 10
Reset Threshold Over drive (V) V

TRIP

Min - V

Transient Duration (µs)

VRST=2.0V VRST=2.9V VRST=4.6V

2.0V

2.9V

0

0.002

0.004

0.006

0.008

0.01

0.012

-100 -50 0 50 100 150
Temperature (°C)

Open-Drain Leakage (µA)

2.2 V 2.5 V 4 V 4.5 V 5 V 5.5 V

MCP1318M does not

have a MR pin

0

50

100

150

200

250

300

350

-100 -50 0 50 100 150
Temperature (°C)

t

MRD

(ns)

3.2 V 4 V 4.5 V 5 V 5.5 V

0

50

100

150

200

250

300

350

400

450

-100 -50 0 50 100 150
Temperature (°C)

t

MRD

(ns)

2.2 V 2.5 V 4 V 4.5 V 5 V 5.5 V

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

DD

FIGURE 2-34: Transient Duration vs.
V

(min) – VDD.

TRIP

FIGURE 2-35: Open-Drain Leakage Current vs. Temperature (MCP1320-2.0).

FIGURE 2-37: MR

Low to Reset

Propagation Delay (MCP1319-2.9).

FIGURE 2-38: MR

Low to Reset

Propagation Delay (MCP1316-2.0).

FIGURE 2-36: MR
Propagation Delay (MCP1318M-4.6).

© 2007 Microchip Technology Inc. DS21985B-page 17

Low to Reset

MCP131X/2X

0

100

200

300

400

500

600

700

800

900

1000

-100 -50 0 50 100 150
Temperature (°C)

t

RPD

(µs)

5V to 0V

5V to 4.5V

0

50

100

150

200

250

-100 -50 0 50 100 150
Temperature (°C)

t

RPD

(µs)

5V to 2.7V

5V to 0V

V

TRIP

V

TRIP

Min - 0.2V

0

50

100

150

200

250

-100 -50 0 50 100 150

Temperature (°C)

t

RPD

(µs)

5V to 0V

5V to 1.8V

V

TRIP

V

TRIP

Min - 0.2V

0.12

0.125

0.13

0.135

0.14

0.145

-100 -50 0 50 100 150
Temperature (°C)

Normalized Reset Timeout

Period

MCP1318M-4.6

0.125

0.13

0.135

0.14

0.145

0.15

-100 -50 0 50 100 150
Temperature (°C)

Normalized Reset Timeout

Period

MCP1319-2.9

0.125

0.13

0.135

0.14

0.145

0.15

-100 -50 0 50 100 150
Temperature (°C)

Normalized Reset Timeout

Period

MCP1316-2.0

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-39: VDD Falling to Reset Propagation Delay vs. Temperature (MCP1318M-4.6).

Typ + 0.3V to

FIGURE 2-40: V

Falling to Reset

DD

Propagation Delay vs. Temperature (MCP1319-

2.9).

FIGURE 2-42: Normalized Reset Time Out Period vs. Temperature (MCP1318M-4.6).

FIGURE 2-43: Normalized Reset Time Out Period vs. Temperature (MCP1319-2.9).

Typ + 0.2V to

FIGURE 2-41: V
Propagation Delay vs. Temperature (MCP1316-

2.0).

DS21985B-page 18 © 2007 Microchip Technology Inc.

Falling to Reset

DD

FIGURE 2-44: Normalized Reset Time Out Period vs. Temperature (MCP1316-2.0).

MCP131X/2X

0.9

0.95

1

1.05

1.1

1.15

1.2

1.25

-100 -50 0 50 100 150
Temperature (°C)

Normalized Watchdog

Timeout Period

`

MCP1318M-4.6

MCP1319 does not

have a Watchdog Timer

0.9

0.95

1

1.05

1.1

1.15

1.2

1.25

-100 -50 0 50 100 150
Temperature (°C)

Normalized Watchdog

Timeout Period

`

MCP1316-2.0

0

100

200

300

400

500

600

0.001 0.01 0.1 1 10
Reset Threshold Overdrive (V) V

TRIP

Min - V

Transient Duration (µS)

VRST=2.0V VRST=2.9V VRST=4.6V

Note: Unless otherwise indicated, all limits are specified for VDD = 1V to 5.5V, RPU = 100 kΩ (only MCP1316;

see Figure 4-1), TA = -40°C to +125°C.

FIGURE 2-45: Normalized Watchdog Time Out Period vs. Temperature (MCP1318M-4.6).

FIGURE 2-48: Max VDD T ransient Duration vs. Reset Threshold Overdrive.

DD

FIGURE 2-46: Normalized Watchdog Time Out Period vs. Temperature (MCP1319-2.9).

FIGURE 2-47: Normalized Watchdog Time Out Period vs. Temperature (MCP1316-2.0).

© 2007 Microchip Technology Inc. DS21985B-page 19

FIGURE 2-49: “M” Part # Pull-up Characteristics (MCP1318M-4.6).

MCP131X/2X

3.0 PIN DESCRIPTION

The descriptions of the pins are listed in Table 3-1.

TABLE 3-1: PIN FUNCTION TABLE

Pin No.

SOT23-5

1 MCP1316M

MCP1318M
MCP1319M

MCP1320,
MCP1321,

MCP1322

MCP1316,
MCP1318,

MCP1319

Device Symbol

(1)

,

RST

(1)

,

(1)

,

Pin

Type

O Open-Drain Reset Output (active-low)

OPush-PullV

Buffer/

Driver

Type

Function

Goes active (Low) if one of these conditions occurs:

1. If V

falls below the selected Reset voltage

DD

threshold.

2. If the MR

pin is forced low.

3. If the WDI pin does not de tect an edge transition
within the minimum selected time out period.

4. During power-up.

Falling:

V

DD

Open-Drain = VDD > V
L = V

DD

< V

TRIP

TRIP

VDD Rising:

Open-Drain = V
L = VDD < V

Falling:

DD

H = V
L = VDD < V

DD

> V

TRIP

TRIP

TRIP

DD

+ V

> V

HYS

TRIP

+ V

HYS

Rising:

V

DD

H = VDD > V
L = VDD < V

TRIP

TRIP

+ V

+ V

HYS

HYS

MCP1317 RST O Push-Pull Reset Output (active-high)

Goes active (High) if one of these conditions occurs:

1. If V

falls below the selected Reset voltage

DD

threshold.

2. If the MR

pin is forced low.

3. If the WDI pin does not de tect an edge transition
within the minimum selected time out period.

4. During power-up.

Falling:

V

DD

H = V
L = V

V

DD

H = V
L = V

< V

DD

> V

DD

Rising:

< V

DD

> V

DD

TRIP

TRIP

TRIP

TRIP

+ V

+ V

HYS

HYS

2AllVSS— P The ground reference for the device.

Note 1: Open-Drain output with internal pull-up resistor.

DS21985B-page 20 © 2007 Microchip Technology Inc.

TABLE 3-1: PIN FUNCTION TABLE (CONTINUED)

Pin No.

SOT23-5

3 MCP1316,

Device Symbol

MR I ST Manual Reset input for a Reset switch.

Pin

Type

Buffer/

Driver

Type

MCP1316M,

MCP1317,

MCP1320

MCP1318,

RST O Push-Pull Reset Output (active-high)

MCP1318M,

MCP1319,

MCP1319M,

MCP1321,

MCP1322

MCP131X/2X

Function

This input allows a push button switch to be directly con­nected to the MCP131X/2X MR
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR pin.
L = Switch is depressed (shorted to ground). This forces

the RST/RST

pins Active.

H = Switch is open (internal pull-up resistor pulls signal

high). State of the RST/RST
other system conditions.

Goes active (High) if one of these conditions occurs:

1. If V

falls below the selected Reset voltage

DD

threshold.

2. If the MR

pin is forced low.

3. If the WDI pin does not detect an edge transition

within the minimum selected time out period.

4. During power-up.

pin, which can then be

pins determined by

4 MCP1316,

WDI I ST Watchdog Timer Input

MCP1316M,

MCP1317,
MCP1318,

MCP1318M,

MCP1320,

MCP1321

MCP1319,

MR

I ST Manual Reset input for a Reset switch.

MCP1319M,

MCP1322

5AllV

DD

— P The positive supply for the device.

Note 1: Open-Drain output with internal pull-up resistor.

Falling:

V

DD

H = VDD < V

DD

> V

L = V

TRIP

TRIP

VDD Rising:

DD

< V

H = V
L = VDD > V

TRIP

TRIP

+ V

+ V

HYS

HYS

The WDT period is specified at the time of device order.
The Standard WDT period is 1.6s typical.
An edge transition on the WDI pin resets the Watchdog
Timer counter (no time out). A Falling Edge is required to
start the WDT Timer.

This input allows a push button switch to be directly con­nected to the MCP131X/2X MR

pin, which can then be
used to force a system Reset. This input filters (ignores)
noise pulses that occur on the MR

pin.

L = Switch is depressed (shorted to ground). This forces

the RST/RST

pins Active.

H = Switch is open (internal pull-up resistor pulls signal

high). State of the RST/RST pins determined by
other system conditions.

© 2007 Microchip Technology Inc. DS21985B-page 21

MCP131X/2X

3.1 Ground Terminal (VSS)

VSS provides the negative reference for the analog
input voltage. Typically, the circuit ground is used.

3.2 Supply Voltage (VDD)

VDD can be used for power supply monitoring or a
voltage level that requires monitoring.

3.3 Reset Output (RST and RST)

There are four types of Reset output pins. These are:

1. Open-Drain active-low Reset, External pull-up
resistor required

2. Open-Drain active-low Reset, Internal pull-up
resistor

3. Push-Pull active-low Reset

4. Push-Pull active-high Reset

Some devices have both an active-low and active-high
Reset output.

3.3.1 ACTIVE-LOW (RST) - OPEN-DRAIN,

EXTERNAL PULL-UP RESISTOR

The RST open-drain output remains low while VDD is
below the Reset voltage threshold (V
device voltage (VDD) returns to a high level (V
V

), the device will remain in Reset for the Reset

HYS

delay timer (T

). After that time expires, the RST pin

RST

will float, and an external pull-up resistor is required to
bring the output to the high state.

). Once the

TRIP

TRIP

+

3.4 Manual Reset Input (MR)

The Manual Reset (MR) input pin allows a push button
switch to easily be connected to the system. When the
push button is depressed, it forces a system Reset.
This pin has circuitry that filters noise that may be
present on the MR

The MR

pin is active-low and has an internal pull-up

signal.

resistor.

3.5 Watchdog Input

In some systems, it is desirable to have an external
Watchdog Timer to monitor the operation of the sys­tem. This is done by requiring the embedded controller
to “pet” the Watchdog Timer within a predetermined
time frame (T
within this time frame, the MCP131X/2X will force the
Reset pin(s) active.

The embedded controller “pets” the MCP131X/2X by
forcing an edge transition on the WDI pin. The WDT
Timer is activated by the first falling edge on the WDI
pin.

The standard offering devices have a typical Watchdog
Timer period (T
able Watchdog Timer periods.

). If the MCP131X/2X is not “petted”

WD

) of 1.6 s. Table 1-3 shows the avail-

WD

3.3.2 ACTIVE-LOW (RST) - OPEN-DRAIN,

INTERNAL PULL-UP RESISTOR

The RST open-drain output remains low while VDD is
below the Reset voltage threshold (V
device voltage (VDD) returns to a high level (V

), the device will remain in Reset for the Reset

V

HYS

delay timer (T

). After that time expires, the RST pin

RST

). Once the

TRIP

TRIP

+

will be pulled high by an internal pull-up resistor (typi­cally 4.7 kΩ).

3.3.3 ACTIVE-LOW (RST) - PUSH-PULL

The RST push-pull output remains low while VDD is
below the Reset voltage threshold (V
device voltage (V

), the device will remain in Reset for the Reset

V

HYS

delay timer (T

) returns to a high level (V

DD

). After that time expires, the RST pin

RST

). Once the

TRIP

TRIP

+

will be driven to the high state.

3.3.4 ACTIVE-HIGH (RST) - PUSH-PULL

The RST push-pull output remains high while VDD is
below the Reset voltage threshold (V
device voltage (V

), the device will remain in Reset for the Reset

V

HYS

delay timer (T

) returns to a high level (V

DD

). After that time expires, the RST pin

RST

will be driven to the low state.

). Once the

TRIP

TRIP

+

DS21985B-page 22 © 2007 Microchip Technology Inc.

MCP131X/2X

V

DD

V

DD

MCLR
(Reset input)
(active-low)

V

SS

PIC

®

Microcontroller

R

PU

(1)

Note 1: Resistor RPU may be required with the

MCP1320, MCP1321, or MCP1322 due
to the open-drain output.
Resistor R

PU

may not be required with
the MCP1316M, MCP1318M, or
MCP1319M due to the internal pull-up
resistor.
The MCP1316, MCP1317, MCP1318,
and MCP1319 do not require the
external pull-up resistor.

2: Not all devices offer the active-high

Reset output pin.

0.1
µF

MCP13XX

V

DD

RST

V

SS

RST

(2)

WDI

I/O

To system
device that
requires active­high resets

Push button
switch

MR

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Noise Filter

Watchdog

MR

WDI

Note: Features available depend on the device.

Voltage

4.0 OPERATIONAL DESCRIPTION

For many of today’s microcontroller applications, care
must be taken to prevent low-power conditions that can
cause many different system problems. The most
common causes are brown-out conditions, where the
system supply drops below the operating level momen­tarily. The second most common cause is when a
slowly decaying power supply causes the
microcontroller to begin executing instructions without
sufficient voltage to sustain volatile memory (RAM),
thus producing indeterminate results. Figure 4-1 shows
a typical application circuit.

The MCP131X/2X family is voltage supervisor devices
designed to keep a microcontroller in Reset until the
system voltage has reached and stabilized at the
proper level for reliable system operation. These
devices also operate as protection from brown-out
conditions when the system supply voltage drops
below a safe operating level.

Some MCP131X/2X family members include a Watch­dog Timer feature that after being enabled (by a falling
edge on the WDI pin), monitors the WDI pin for falling
edges. If an edge transition is not detected within the
expected timeframe, the MCP131X/2X devices will
force the Reset pin active. This is useful to ensure that
the embedded system’s Host Controller program is
operating as expected.

Some MCP131X/2X family members include a Manual
Reset feature that allows a push button switch to be
directly connected to the MCP131X/2X devices (on the
MR
the external control of the push button switch.

A superset block diagram is shown in Figure 4-2, with
device specific block diagrams shown in Figure 4-3
through Figure 4-12.

pin). This allows the system to easily be reset from

FIGURE 4-1: Typical Application Circuit.

© 2007 Microchip Technology Inc. DS21985B-page 23

FIGURE 4-2: Family Block Diagram

MCP131X/2X

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

Noise Filter

Watchdog

MR

WDI

Voltage

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

Noise Filter

Watchdog

MR

WDI

Voltage

V

DD

Comparator

+
–

Output

Driver

Reference

V

SS

RST

Noise Filter

Watchdog

MR

WDI

Voltage

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Watchdog

WDI

Voltage

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Watchdog

WDI

Voltage

4.0.1 DEVICE SPECIFIC BLOCK
DIAGRAMS

FIGURE 4-3: MCP1316 Block Diagram.

FIGURE 4-4: MCP1316M Block Diagram.

FIGURE 4-6: MCP1318 Block Diagram.

FIGURE 4-7: MCP1318M Block Diagram.

FIGURE 4-5: MCP1317 Block Diagram.

DS21985B-page 24 © 2007 Microchip Technology Inc.

MCP131X/2X

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Noise Filter

MR

Voltage

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Noise Filter

MR

Voltage

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

Noise Filter

Watchdog

MR

WDI

Voltage

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Watchdog

WDI

Voltage

V

DD

Comparator

+
–

Output

Driver

RST

Reference

V

SS

RST

Noise Filter

MR

Voltage

FIGURE 4-8: MCP1319 Block Diagram.

FIGURE 4-11: MCP1321 Block Diagram.

FIGURE 4-9: MCP1319M Block Diagram.

.

FIGURE 4-12: MCP1322 Block Diagram.

FIGURE 4-10: MCP1320 Block Diagram.

© 2007 Microchip Technology Inc. DS21985B-page 25

MCP131X/2X

4.1 Reset Voltage Trip Point (V

TRIP

)

Operation

The device’s Reset voltage trip point (V
when the device is ordered. As the voltage on the
device’s V

pin is above or below this selected trip

DD

point, the output of the Reset pin (RST/RST ) will be
forced to either the inactive or active state.

For the voltage trip point, there is a minimum trip voltage
(V

) and a maximum trip voltage (V

TRIPMIN

) is selected

TRIP

TRIPMAX

). The

The Reset pin (RST or RST
of the following occurs:

• The Manual Reset input (MR

• The Watchdog Timer times out
goes below the threshold

•V

DD

• During device power-up

After the device exits the Reset condition, the delay
circuitry will hold the RST and RST
appropriate Reset delay time (t

) will be forced active if any

) goes low

pins active until the
) has elapsed.

RST

voltage that the device “actually” trip s at will be referred
to as V

. The trip voltage is specified for the falling of

TRIP

the device VDD.
There is also a hysteresis (V

) on the trip point. This

HYS

is so that noise on the device voltage (VDD) does not
cause the Reset pin (RST/RST

) to “jitter” (change

between driving an active and inactive state).

TABLE 4-1: RESET PIN STATES

State of RST Pin when: State of RST

Device

VDD <

V

TRIP

V

HYS

TRIP

+

VDD <

V

TRIP

V

>

DD

V

MCP1316 LH——Push-pull
MCP1316M LH

(2)

— — Open-drain

MCP1317 ——H LPush-pull
MCP1318 LHHLPush-pull
MCP1318M LH

(2)

H L Open-drain

MCP1319 LHHLPush-pull
MCP1319M LH
MCP1320 LH
MCP1321 LH
MCP1322 LH

(2)

H L Open-drain

(1)

— — Open-drain

(1)

H L Open-drain

(1)

H L Open-drain

Note 1: Requires External Pull-up resistor.

2: Has Internal Pull-up resistor.
3: The RST pin output is always push-pull.

(3)

Pin when:

V

>

DD

V

HYS

V

TRIP

+

Ouput Driver

(2)

(2)

(2)
(1)
(1)
(1)

DS21985B-page 26 © 2007 Microchip Technology Inc.

MCP131X/2X

V

TRIPMAX

V

TRIPMIN

V

TRIP

1V

V

DD

V

TRIP

+ V

HYS

t

RST

RST

RST

VDD

V

TRIPMAX

V

TRIPMIN

V

TRIP

V

TRIP

V

TRIP

+ V

HYS

RST

1V

< 1V is outside the
device specifications

t

RPD

t

RST

t

RPD

t

RST

4.1.1 POWER-UP/RISING VDD

As the device VDD rises, the device’s Reset circuit will
remain active until the voltage rises above the “actual”
trip point (V

) plus the hysteresis (V

TRIP

Figure 4-13 shows a power-up sequence and the

waveform of the RST and RST

pins.

As the device powers up, the voltage will start below
the valid operating voltage of the device. At this volt­age, the Reset output value is not valid. Once the volt­age is above the minimum operating voltage (1V) and
below the selected V

, the Reset output will be

TRIP

active.
Once the device voltage rises above the “actual” trip

point (V
timer (t

) plus the hysteresis (V

TRIP

) starts. When the Reset delay timer times

RST

HYS

out, the Reset output (RST/RST) is driven inactive.

Note: While the Reset delay timer (t

active, additional system current is con­sumed.

).

HYS

), the Reset delay

) is

RST

4.1.2 POWER-DOWN/BROWN-OUTS

As the device powers-down/brown-outs, the voltage

) falls from a voltage above the devices trip point

(V

DD

(V

). The devices “actual” trip point voltage (V

TRIP

will be between the minimum trip point (V
the maximum trip point (V

TRIPMAX

). Once the device

TRIPMIN

TRIP

) and

voltage (VDD) goes below this voltage, the Reset pin(s)
will be forced to the active state. There is a hysteresis
on this trip point. This is so that noise on the device volt­age (V

) does not cause the Reset pin (RST/RST) to

DD

“jitter” (change between driving an active and inactive).

Figure 4-14 shows the waveform of the RST

pin as
determined by the VDD voltage, while Table 4-1 shows
the state of the RST pin.

4.1.2.1 Operation of RST pin with Internal

Pull-Up Resistor

Note: Only the MCP1316M, MCP1318M, and

MCP1319M devices have an open-drain
RST output pin with an internal pull-up
resistor.

The internal pull-up resistor has a typical value of

4.7 kΩ. The internal pull-up eliminates the need for an
external resistor.

To reduce the current consumption of the device, when
the RST

pin is driving low, the resistor is disconnected.

)

FIGURE 4-13: Reset pin Operation on a Power-up.

FIGURE 4-14: RST Operation as determined by the V

© 2007 Microchip Technology Inc. DS21985B-page 27

TRIP

and V

HYS

.

MCP131X/2X

V

TRIP

V

DD

RST

t

RST

Reset Delay
Timer Inactive

Reset
Delay
Timer
Inactive

Reset Delay

Timer Active

See Figures 2-12,

2-10 and 2-11

See Figures 2-15,

2-14 and 2-13

See Figures 2-12,

2-10 and 2-11

4.2 Reset Delay Timer (t

RST

)

The Reset delay timer ensures that the MCP131X/2X
device will “hold” the embedded system in Reset until
the system voltage has stabilized. There are several
time-out options to better meet the requirements of
different applications. These Reset delay timer time
outs are shown in Table 4-2. The S tandard offering time
out is typically 200 ms.

The Reset delay timer (t
age rises above the “actual” trip point (V
hysteresis (V

). When the Reset delay timer times

HYS

out, the Reset output pin (RST/RST

Note: While the Reset delay timer (t

) starts after the device volt-

RST

TRIP

) plus the

) is driven inactive.

RST

) is
active, additional system current is con­sumed.

TABLE 4-2: RESET DELAY TIMER

TIME OUTS

t

RST

(1)

Units

Min Typ Max

1.0 1.4 2.0 ms
20 30 40 ms

140 200 280 ms

1120 1.6 2.24 sec

↑↑

This is the mini­mum time that the
Reset delay timer

will “hold” the

Reset pin active

after VDD rises

above

+ V

V

TRIP

HYS

This is the maxi-

mum time that the

Reset delay timer

will “hold” the

Reset pin active

DD

rises

after V

above

+ V

V

TRIP

HYS

Note 1: Shaded rows are custom ordered time

outs.

Figure 4-15 illustrates when the Reset delay timer

(t

) is active or inactive.

RST

FIGURE 4-15: Reset Power-up Timer Waveform.

4.2.1 EFFECT OF TEMPERATURE ON
RESET POWER-UP TIMER (T

The Reset delay timer time out period (t
determines how long the device remains in the Reset
condition. This time out is affected by both the device

and temperature. Typical responses for different

V

DD

VDD values and temperatures are shown in Figures 2­33, 2-32 and 2-31.

RPU

)

RST

)

DS21985B-page 28 © 2007 Microchip Technology Inc.

MCP131X/2X

Time (µs)

0V

Supply Voltage

5V

V

TRIP(MIN)

- V

DD

t

TRANS

V

TRIP(MAX)

V

TRIP(MIN)

(Overdrive)

(Duration)

V

DD

MR

V

SS

RST

WDI

I/O

MCLR

+5V

MCP13XX

PIC® MCU

RST

V

IL

t

MR

RST

t

MRD

V

IH

t

RST

MR

The MR input typically ignores input pulses
of 100 ns.

4.3 Negative Going VDD Transients

The minimum pulse width (time) required to cause a
Reset may be an important criteria in the implementa­tion of a Power-on Reset (POR) circuit. This time is
referred to as transient duration. The MCP131X/2X
devices are designed to reject a level of negative-going
transients (glitches) on the power supply line.

Transient duration is the amount of time needed for
these supervisory devices to respond to a drop in V
The transient duration time (t
magnitude of V

– VDD (overdrive). Any combination

TRIP

) is dependant on the

TRAN

of duration and overdrive that lies under the durati on/
overdrive curve will not generate a Reset signal. Gen­erally speaking, the transient duration time decreases
with and increases in the V

– VDD voltage. Combi-

TRIP

nations of duration and overdrive that lies above the
duration/overdrive curve are detected as a brown-out
or power-down condition.

Figure 4-16 shows a typical transient duration vs.

Reset comparator overdrive, for which the MCP131X/
2X will not generate a Reset pulse. It shows that the far­ther below the trip point the transient pulse goes, the
duration of the pulse required to cause a Reset gets
shorter. Figure 4-16 shows the transient response
characteristics for the MCP131X/2X.

Transient immunity can be improved by adding a
bypass capacitor (typically 0.1 µF) as close as possible
to the V

pin of the MCP131X/2X device.

DD

DD

4.4 Manual Reset Input

The Manual Reset input pin (MR) allows the Reset pins
(RST/RST
The MR pin has circuitry to filter noise pulses that may
be present on the pin. Figure 4-17 shows a block dia-
gram for using the MCP131X/2X with a push button
switch. To minimize the required external components,
the MR

.

A mechanical push button or active logic signal can
drive the MR

Once MR
Reset delay time), the Reset output pins are forced
active. The Reset output pins will remain in their active
states for the Reset delay timer time out period (t

Figure 4-18 shows a waveform for the Manual Reset

switch input and the Reset pins output.

) to be manually forced to their active states.

input has an internal pull-up resistor.

input.

has been low for a time, t

(the Manual

MRD

RST

)

FIGURE 4-16: Example of Typical Transient Duration Waveform.

© 2007 Microchip Technology Inc. DS21985B-page 29

FIGURE 4-17: Push Button Reset and Watchdog Timer.

FIGURE 4-18: MR

Input – Push Button.

4.4.1 NOISE FILTER

The noise filter filters out noise spikes (glitches) on the
Manual Reset pin (MR
(typical) are filtered.

). Noise spikes less than 100 ns

MCP131X/2X

V

CC

GND

RST

WDI

MCLR

+5V

MCP13XX

0.1

10 kΩ

I/O

PIC

®

3-Terminal

Regulator

+5V

µF

MCU

(example:

MCP1700)

4.5 Watchdog Timer

The purpose of the Watchdog Timer (WDT) is to

Figure 4-19 shows a block diagram for using the

MCP131X/2X with a PIC

®

microcontroller (MCU) and

the Watchdog input.

increase system reliability. The Watchdog Timer fea­ture can be used to detect when the Host Controller ’s
program flow is not as expected. The Watchdog Timer
monitors for activity on the Watchdog Input pin (WDI).
The WDI pin is expected to be strobed within a given
time frame. When this time frame is exceeded, without
an edge transition on the WDI pin, the Reset pin is
driven active to reset the system. This stops the Host
Controller from continuing its erratic behavior (“run­away” code execution).

The Watchdog Timer is external to the main portion of
the control system and monitors the operation of the
system. This feature is enabled by a falling edge on the
WDI pin (after device POR). Monitoring is then done by
requiring the embedded controller to force an edge
transition (falling or rising) on the WDI pin (“pet the
Watchdog”) within a predetermined time frame (T

WD

If the MCP131X/2X does not detect an edge on the
WDI pin within the expected time frame, the MCP131X/
2X device will force the Reset pin active.

The Watchdog Timer is in the disabled state when:

• The Device Powers up

• A POR event occurred

• A WDT event occurred

• A Manual Reset (MR

) event occurred

When the Watchdog Timer is in the disabled state, the

).

TABLE 4-3: WATCHDOG TIMER

PERIODS

t

WDT

(1)

Units

Min Typ Max

4.3 6.3 9.3 ms
71 102 153 ms

1.12 1.6 2.4 sec

17.9 25.6 38.4 sec

↑↑

If the time between

WDI edges is less

than this, it

ensures that the

MCP131X/2X

never forces a

reset

If the time

between WDI

edges is greater

than this, it

ensures that the

MCP131X/2X

always forces a

reset

Note 1: Shaded rows are custom ordered Watch-

dog Timer Periods (t

) time outs. For

WDT

information on ordering devices with
these t

time outs, please contact your

WDT

local Microchip sales office. Minimum
purchase volumes are required.

WDI pin has an internal smart pull-up resistor enabled.
This pull-up resistor has a typical value of 52 kΩ. This
pull-up resistor holds the WDI signal in the high state,
until it is forced to another state.

After the embedded controller has initialized, if the
Watchdog Timer feature is to be used, then the embed­ded controller can force the WDI pin low (V

). This also

IL

enables the Watchdog Timer feature and disables the
WDI pull-up resistor. Disabling the pull-up resistor
reduces the device’s current consumption. The pull-up
resistor will remain disconnected until the device has a
power-on, a Reset event occurs, or after the WDT time
out.

Once the Watchdog Timer has been enabled, the Host
Contoller must force an edge transition (falling or rising)
on the WDI pin before the minimum Watchdog Timer
time out to ensure that the Watchdog Timer does not
force the Reset pins (RST/RST

) to the active state.

If an edge transition does not occur before the maxi­mum time out occurs, then the MCP131X/2X will force
the Reset pins to their active state.

The MCP131X/2X supports four time outs. The stan-

FIGURE 4-19: Watchdog Timer.

The software routine that strobes WDI is critical. The
code must be in a section of software that is executed
frequently enough so the time between edge transi­tions is less than the Watchdog time out period. One
common technique controls the Host Controllers I/O
line from two sections of the program. The software
might set the I/O line high while operating in the Fore­ground mode and set it low while in the Background or
Interrupt modes. If both modes do not execute cor­rectly, the Watchdog Timer issues reset pulses.

dard offering devices have a typical Watchdog Timer
period (T
Watchdog Timer periods. The t
function of the device voltage and temperature.

DS21985B-page 30 © 2007 Microchip Technology Inc.

) of 1.6 s. Table 4-3 shows the available

WDT

WDT

time out is a

MCP131X/2X

MCP131X/2X

V

DD

RST

V

SS

0.1 µF

RST

WDI
MR

V

DD

RST

V

SS

BATLOW

MCP131X/2X

+

––

V

DD

RST

V

SS

Power Good

MCP131X/2X

+

–

Pwr
Sply

MCP132X

V

DD

VDD/V

PP

V

DD

RST

MCLR
Reset input)
(Active-Low)

V

SS

V

SS

PIC

®

Microcontroller

R

PU

0.1 µF

1kΩ

5.0 APPLICATION INFORMATION

This section shows application related information that
may be useful for your particular design requirements.

5.1 Supply Monitor Noise Sensitivity

The MCP131X/2X devices are optimized for fast
response to negative-going changes in V
with an inordinate amount of electrical noise on V
(such as systems using relays) may require a 0.01 µF
or 0.1 µF bypass capacitor to reduce detection sensitiv­ity. This capacitor should be installed as close to the
MCP131X/2X as possible to keep the capacitor lead
length short.

FIGURE 5-1: Typical Application Circuit with Bypass Capacitor.

. Systems

DD

DD

5.3 Using in PIC® Microcontroller, ICSP™ Applications

Note: This operation can only be done using the

device with the Open-Drain RST
(MCP1320, MCP1321, and MCP1322).
Devices that have the internal pull-up
resistor are not recommended due to the
current path of the internal pull-up resistor.

Figure 5-4 shows the typical application circuit for using

the MCP132X for voltage superviory function when the
PIC microcontroller will be programmed via the In-Cir­cuit Serial Programming™ (ICSP™) feature. Additional
information is available in TB087, “Using Voltage

Supervisors with PIC
Implement In-Circuit Serial Programming™”,

DS91087.

Note: It is recommended that the current into the

RST pin be current limited by a 1 kΩ
resistor.

®

Microcontroller Systems which

pin

5.2 Conventional Voltage Monitoring

Figure 5-2 and Figure 5-3 show the MCP131X/2X in

conventional voltage monitoring applications.

FIGURE 5-2: Battery Voltage Monitor.

FIGURE 5-3: Power Good Monitor.

© 2007 Microchip Technology Inc. DS21985B-page 31

FIGURE 5-4: Typical Application Circuit
for PIC

®

Microcontroller with the ICSP™

Feature.

MCP131X/2X

Note: In this example, V

SOURCE

must be

greater than (V

TRIP

)

MCP131X/2X

V

DD

RST

V

SS

R

1

V

SOURCE

R

2

or RST

V

SOURCE

R

1

R1R2+

------------------- -

× V

TRIP

=

Where:

V

SOURCE

= Voltage to be monitored

V

TRIP

= Threshold Voltage setting

V

DD

RST

V

SS

MCP131X/2X

270Ω

MTP3055EL

V

DD

R

L

V

TRIP

5.4 Modifying The Trip Point, V

TRIP

Although the MCP131X/2X device has a fixed voltage
trip point (V

), it is sometimes necessary to make

TRIP

custom adjustments. This can be accomplished by
connecting an external resistor divider to the
MCP131X/2X V

pin. This causes the V

DD

SOURCE

volt­age to be at a higher voltage than when the MCP131X/
2X input equals its V

voltage (Figure 5-5).

TRIP

To maintain detector accuracy, the bleeder current
through the divider should be significantly higher than
the 10 µA maximum operating current required by the
MCP131X/2X. A reasonable value for this bleeder
current is 1 mA (100 times the 10 µA required by the
MCP131X/2X). For example, if V
desired trip point is 2.5V , the value of R

= 2V and the

TRIP

+ R2 is 2.5 kΩ

1

(2.5V/1 mA). The value of R1 + R2 can be rounded to
the nearest standard value and plugged into the equa­tion of Figure 5-5 to calculate values for R

and R2. 1%

1

tolerance resistors are recommended.

5.5 MOSFET Low-Drive Protection

Low operating power and small physical size make the
MCP131X/2X series ideal for many voltage detector
applications. Figure 5-6 shows a low-voltage gate drive
protection circuit that prevents overheating of the logic­level MOSFET due to insufficient gate voltage. When
the input signal is below the threshold of the MCP131X/
2X, its output grounds the gate of the MOSFET.

FIGURE 5-6: MOSFET Low-Drive Protection.

5.6 Low-Power Applications

FIGURE 5-5: Modify Trip-Point using External Resistor Divider.

DS21985B-page 32 © 2007 Microchip Technology Inc.

In some low-power applications, the longer that the
microcontroller (such as a PIC MCU) can be in the
“Sleep mode”, the lower the average system current
consumption will be.

The WDT feature can be used to “wake-up” the PIC MCU
at a regular interval to service the required tasks before
returning to sleep. This “wake-up” occurs after the PIC
MCU detects a MCLR

reset during Sleep mode (for mid-

range family; POR = ‘1’, BOR = ‘1’, TO = ‘1’, and PD = ‘1’).

MCP131X/2X

MCP13XX

V

DD

RST

GND

MCLR

GND

Buffered Reset
To Other System
Components

MCU

4.7 kΩ

Buffer

PIC

®

MCP13XX

V

DD

V

DD

R

1

100 kΩ

RST

GND

5.7 Controllers and Processors With Bidirectional I/O Pins

Some microcontrollers have bidirectional Reset pins.
Depending on the current drive capability of the control­ler pin, an indeterminate logic level may result if there
is a logic conflict. This can be avoided by adding a

4.7 kΩ resistor in series with the output of the

MCP131X/2X (Figure 5-7). If there are other compo­nents in the system that require a Reset signal, they
should be buffered so as not to load the Reset line. If
the other components are required to follow the Reset
I/O of the microcontroller, the buffer should be con­nected as shown with the solid line.

5.8 RESET Signal Integrity During Power-Down

The MCP131X/2X Reset output is valid to VDD = 1.0V.
Below this 1.0V, the output becomes an "open circuit"
and does not sink or source current. This means
CMOS logic inputs to the microcontroller will be floating
at an undetermined voltage. Most digital systems are
completely shut down well above this voltage.
However, in situations where the Reset signal must be
maintained valid to V
required.

For devices where the Reset signal is active-low, a pull­down resistor must be connected from the MCP131X/
2X Reset pin(s) to ground to discharge stray capaci­tances and hold the output low (Figure 5-8).

Similarly for devices where the Reset signal is active­high, a pull-up resistor to V
valid high Reset signal for V

This resistor value, though not critical, should be
chosen such that it does not appreciably load the Reset
pin(s) under normal operation (100 kΩ will be suitable
for most applications).

= 0V, external circuitry is

DD

is required to ensure a

DD

below 1.0V.

DD

FIGURE 5-7: Interfacing the MCP131X/ 2X Push-Pull outputs to a Bidirectional Reset I/O.

FIGURE 5-8: Ensuring a valid active-low
Reset pin output state as V

approaches 0V.

DD

© 2007 Microchip Technology Inc. DS21985B-page 33

MCP131X/2X

6.0 STANDARD DEVICE OFFERINGS

Table 7-1 shows the standard devices that are avail-

able and their respective configuration. The configura­tion includes the:

RST

TRIP

)

WDT

)

)

• Voltage Trip Point (V

• Reset Time Out (t

• Watchdog Time Out (t

Table 7-1 also shows the order number for that given

device configuration.

7.0 CUSTOM CONFIGURATIONS

Table 7-2 shows the codes that specify the desired

Reset time out (t

) for custom devices.

(t

WDT

The voltage trip point (V
digits of the desired typical trip point voltage. As an
example, if the desired V
V

of 2.7V, the code is 27.

TRIP

) and Watchdog Timer time out

RST

) is specified by the two

TRIP

selection has a typical

TRIP

TABLE 7-1: STANDARD VERSIONS

Device

MCP1316 2.90 140 200 1.12 1.6 MCP1316T-29LE/OT
MCP1316 4.60 140 200 1.12 1.6 MCP1316T-46LE/OT
MCP1316M 2.90 140 200 1.12 1.6 MCP1316MT-29LE/OT
MCP1316M 4.60 140 200 1.12 1.6 MCP1316MT-46LE/OT
MCP1317 2.90 140 200 1.12 1.6 MCP1317T-29LE/OT
MCP1317 4.60 140 200 1.12 1.6 MCP1317T-46LE/OT
MCP1318 2.90 140 200 1.12 1.6 MCP1318T-29LE/OT
MCP1318 4.60 140 200 1.12 1.6 MCP1318T-46LE/OT
MCP1318M 2.90 140 200 1.12 1.6 MCP1318MT-29LE/OT
MCP1318M 4.60 140 200 1.12 1.6 MCP1318MT-46LE/OT
MCP1319 2.90 140 200 — — MCP1319T-29LE/OT
MCP1319 4.60 140 200 — — MCP1319T-46LE/OT
MCP1319M 2.90 140 200 — — MCP1319MT-29LE/OT
MCP1319M 4.60 140 200 — — MCP1319MT-46LE/OT
MCP1320 2.90 140 200 1.12 1.6 MCP1320T-29LE/OT
MCP1320 4.60 140 200 1.12 1.6 MCP1320T-46LE/OT
MCP1321 2.90 140 200 1.12 1.6 MCP1321T-29LE/OT
MCP1321 4.60 140 200 1.12 1.6 MCP1321T-46LE/OT
MCP1322 2.90 140 200 — — MCP1322T-29LE/OT
MCP1322 4.60 140 200 — — MCP1322T-46LE/OT

Reset

Threshold (V)

Reset Time Out (ms) Watchdog Time Out (s)

Minimum Typical Minimum Typical Order Number

TABLE 7-2: DELAY TIME OUT ORDERING CODES

T ypical Delay Time (ms) T ypical Delay Time (ms)

Code Reset WDT Comment Code Reset WDT Comment

A 1.6 6.3 Note 1 J 200.0 6.3 Note 1
B 1.6 102.0 Note 1 K 200.0 102.0 Note 1
C 1.6 1600.0 Note 1 L 200.0 1600.0 Delay timings for standard

device offerings
D 1.6 25600.0 Note 1 M 200.0 25600.0 Note 1
E 30.0 6.3 Note 1 N 1600.0 6.3 Note 1
F 30.0 102.0 Note 1 P 1600.0 102.0 Note 1
G 30.0 1600.0 Note 1 Q 1600.0 1600.0 Note 1
H 30.0 25600.0 Note 1 R 1600.0 25600.0 Note 1

Note 1: This delay timing combination is not the standard offering. For information on ordering devices with these

delay times, contact your local Microchip sales office. Minimum purchase volumes are required.

DS21985B-page 34 © 2007 Microchip Technology Inc.

8.0 DEVELOPMENT TOOLS

8.1 Evaluation/Demonstration Boards

The SOT-23-5/6 Evaluation Board (VSUPEV2) can be
used to evaluate the characteristics of the MCP131X/
2X devices.

This blank PCB has footprints for:

• Pull-up Resistor

• Pull-down Resistor

• Loading Capacitor

• In-line Resistor
There is also a power supply filtering capacitor.
For evaluating the MCP131X/2X devices, the selected

device should be installed into the Option A footprint.

MCP131X/2X

FIGURE 1: SOT-23-5/6 Voltage
Supervisor Evaluation Board (VSUPEV2).

This board may be purchased directly from the
Microchip web site at www.microchip.com.

© 2007 Microchip Technology Inc. DS21985B-page 35

MCP131X/2X

5-Pin SOT-23

Part Number SOT-23

MCP1316T-29LE/OT QANN
MCP1316MT-29LE/OT QBNN
MCP1317T-29LE/OT QCNN
MCP1318T-29LE/OT QDNN
MCP1318MT-29LE/OT QENN
MCP1319T-29LE/OT QFNN
MCP1319MT-29LE/OT QGNN
MCP1320T-29LE/OT QHNN
MCP1321T-29LE/OT QJNN
MCP1322T-29LE/OT QKNN
MCP1316T-46LE/OT QLNN
MCP1316MT-46LE/OT QMNN
MCP1317T-46LE/OT QPNN
MCP1318T-46LE/OT QQNN
MCP1318MT-46LE/OT QRNN
MCP1319T-46LE/OT QSNN
MCP1319MT-46LE/OT QTNN
MCP1320T-46LE/OT QUNN
MCP1321T-46LE/OT QVNN
MCP1322T-46LE/OT QWNN

Example:

Legend: XX...X Customer-specific information

Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC designator for Matte Tin (Sn)
* This package is Pb-free. The Pb-free JEDEC designator ( )

can be found on the outer packaging for this package.

Note: In the event the full Microchip part number cannot be marked on one line, it will

be carried over to the next line, thus limiting the number of available
characters for customer-specific information.

XXNN QANN

9.0 PACKAGING INFORMATION

9.1 Package Marking Information

3

e

3

e

DS21985B-page 36 © 2007 Microchip Technology Inc.

MCP131X/2X

/HDG3ODVWLF6PDOO2XWOLQH7UDQVLVWRU27>627@

1RWHV

 'LPHQVLRQV'DQG(GRQRWLQFOXGHPROGIODVKRUSURWUXVLRQV0ROGIODVKRUSURWUXVLRQVVKDOOQRWH[FHHGPPSHUVLGH
 'LPHQVLRQLQJDQGWROHUDQFLQJSHU$60(<0

%6& %DVLF'LPHQVLRQ7KHRUHWLFDOO\H[DFWYDOXHVKRZQZLWKRXWWROHUDQFHV

1RWH )RUWKHPRVWFXUUHQWSDFNDJHGUDZLQJVSOHDVHVHHWKH0LFURFKLS3DFNDJLQJ6SHFLILFDWLRQORFDWHGDW

KWWSZZZPLFURFKLSFRPSDFNDJLQJ

8QLWV 0,//,0(7(56

'LPHQVLRQ/LPLWV 0,1 120 0$;

1XPEHURI3LQV 1 

/HDG3LWFK H %6&

2XWVLGH/HDG3LWFK H %6&

2YHUDOO+HLJKW $  ± 

0ROGHG3DFNDJH7KLFNQHVV $  ± 

6WDQGRII $  ± 

2YHUDOO:LGWK (  ± 

0ROGHG3DFNDJH:LGWK (  ± 

2YHUDOO/HQJWK '  ± 

)RRW/HQJWK /  ± 

)RRWSULQW /  ± 

)RRW$QJOH   ± 

/HDG7KLFNQHVV F  ± 

/HDG:LGWK E  ± 

φ

N

b

E

E1

D

1

2

3

e

e1

A

A1

A2

c

L

L1

0LFURFKLS 7HFKQRORJ\ 'UDZLQJ &%

© 2007 Microchip Technology Inc. DS21985B-page 37

MCP131X/2X

Top

Cover

Tape

K

0

P

W

B

0

A

0

User Direction of Feed

P, Pitch

Standard Reel Component Orientation

Reverse Reel Component Orientation

W, Width
of Carrier

Tape

Pin 1

Pin 1

Device
Marking

9.2 Product Tape and Reel Specifications

FIGURE 9-1: EMBOSSED CARRIER DIMENSIONS (8 MM TAPE ONLY)

TABLE 1: CARRIER TAPE/CAVITY DIMENSIONS

Case

Outline

Package

Type

Carrier

Dimensions

W

mmPmm

mm

Dimensions

A0

Cavity

B0

mm

K0

mm

Output

Quantity

Units

OT SOT-23 3L 8 4 3.2 3.2 1.4 3000 180

FIGURE 9-2: 5-LEAD SOT-23 DEVICE TAPE AND REEL SPECIFICATIONS

Reel

Diameter in

mm

DS21985B-page 38 © 2007 Microchip Technology Inc.

APPENDIX A: REVISION HISTORY

Revision B (October 2007)

• Clarified that devices with a Voltage Trip Point
≤ 2.4V are tested from -40°C to + 85°C. Devices
with a Voltage Trip Point ≥ 2.5V are tested from

°C to +125°C.

-40

Revision A (November 2005)

• Original Release of this Document.

MCP131X/2X

© 2007 Microchip Technology Inc. DS21985B-page 39

MCP131X/2X

NOTES:

DS21985B-page 40 © 2007 Microchip Technology Inc.

MCP131X/2X

Device: MCP1316T: MicroPower Voltage Detector

(Tape and Reel)

MCP1316MT: MicroPower Voltage Detector

(Tape and Reel)

MCP1317T: MicroPower Voltage Detector

(Tape and Reel)

MCP1318T: MicroPower Voltage Detector

(Tape and Reel)

MCP1318MT: MicroPower Voltage Detector

(Tape and Reel)

MCP1319T: MicroPower Voltage Detector

(Tape and Reel)

MCP1319MT: MicroPower Voltage Detector

(Tape and Reel)

MCP1320T: MicroPower Voltage Detector

(Tape and Reel)

MCP1321T: MicroPower Voltage Detector

(Tape and Reel)

MCP1322T: MicroPower Voltage Detector

(Tape and Reel)

V

TRIP

Options:

(Note 1)

29 = 2.90V
46 = 4.60V

Time Out Options:
(Note 1)

L=t

RST

= 200 ms (typ),

t

WDT

= 1.6 s (typ)

Temperature Range: I = -40°C to +85°C

(Only for trip points 2.0V to 2.4V)

E = -40°C to +125°C

(For trip point ≥ 2.5V)

Package: OT = SOT-23, 5-lead

Note 1: Custom ordered voltage trip points and time outs available. Please

contact your local Microchip sales office for additional information.
Minimum purchase volumes are required.

PART NO. XX X

Temperature

V

TRIP

Options

Device

Examples:

a) MCP1316T-29LE/OT: 5-Lead SOT-23-5
b) MCP1316T-46LE/OT: 5-Lead SOT-23-5
c) MCP1316MT-29LE/OT: 5-Lead SOT-23-5
d) MCP1316MT-46LE/OT: 5-Lead SOT-23-5

a) MCP1317T-29LE/OT: 5-Lead SOT-23-5
b) MCP1317T-46LE/OT: 5-Lead SOT-23-5

a) MCP1318T-29LE/OT: 5-Lead SOT-23-5
b) MCP1318MT-29LE/OT: 5-Lead SOT-23-5
c) MCP1318T-46LE/OT: 5-Lead SOT-23-5
d) MCP1318MT-46LE/OT: 5-Lead SOT-23-5

a) MCP1319T-29LE/OT: 5-Lead SOT-23-5
b) MCP1318MT-29LE/OT: 5-Lead SOT-23-5
c) MCP1319T-46LE/OT: 5-Lead SOT-23-5
d) MCP1318MT-46LE/OT: 5-Lead SOT-23-5

a) MCP1320T-29LE/OT: 5-Lead SOT-23-5
b) MCP1320T-46LE/OT: 5-Lead SOT-23-5

a) MCP1321T-29LE/OT: 5-Lead SOT-23-5
b) MCP1321T-46LE/OT: 5-Lead SOT-23-5

a) MCP1322T-29LE/OT: 5-Lead SOT-23-5
b) MCP1322T-46LE/OT: 5-Lead SOT-23-5

Range

X

X

Package

X

Tape/Reel

Option

/

X

Time Out

Options

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

© 2007 Microchip Technology Inc. DS21985B-page 41

MCP131X/2X

NOTES:

DS21985B-page 42 © 2007 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify
and hold harmless Microchip from any and all damages,
claims, suits, or expenses resulting from such use. No
licenses are conveyed, implicitly or otherwise, under any
Microchip intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K

EELOQ, KEELOQ logo, microID, MPLAB, PIC,

PICmicro, PICSTART, PRO MATE, rfPIC and SmartShunt are
registered trademarks of Microchip Technology Incorporated
in the U.S.A. and other countries.

AmpLab, FilterLab, Linear Active Thermistor, Migratable
Memory, MXDEV, MXLAB, SEEVAL, SmartSensor and The
Embedded Control Solutions Company are registered
trademarks of Microchip Technology Incorporated in the
U.S.A.

Analog-for-the-Digital Age, Application Maestro, CodeGuard,
dsPICDEM, dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, FlexROM, fuzzyLAB,
In-Circuit Serial Programming, ICSP, ICEPIC, Mindi, MiWi,
MPASM, MPLAB Certified logo, MPLIB, MPLINK, PICkit,
PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal,
PowerInfo, PowerMate, PowerTool, REAL ICE, rfLAB, Select
Mode, Smart Serial, SmartTel, Total Endurance, UNI/O,
WiperLock and ZENA are trademarks of Microchip
Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.

All other trademarks mentioned herein are property of their
respective companies.

© 2007, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
T empe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the desig n
and manufacture of development systems is ISO 9001:2000 certified.

®

MCUs and dsPIC® DSCs, KEELOQ

®

code hopping

© 2007 Microchip Technology Inc. DS21985B-page 43

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: [phone]
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Technical Support:
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Fax: [phone]

Detroit

Farmington Hills, MI
Tel: [phone]
Fax: [phone]

Kokomo

Kokomo, IN
Tel: [phone]
Fax: [phone]

Los Angeles

Mission Viejo, CA
Tel: [phone]
Fax: [phone]

Santa Clara

Santa Clara, CA
Tel: [phone]
Fax: [phone]

Toronto

Mississauga, Ontario,
Canada
Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

Asia Pacific Office

Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: [phone]
Fax: [phone]

Australia - Sydney

Tel: [phone]
Fax: [phone]

China - Beijing

Tel: [phone]
Fax: [phone]

China - Chengdu

Tel: [phone]
Fax: [phone]

China - Fuzhou

Tel: [phone]
Fax: [phone]

China - Hong Kong SAR

Tel: [phone]
Fax: [phone]

China - Nanjing

Tel: [phone]
Fax: [phone]

China - Qingdao

Tel: [phone]
Fax: [phone]

China - Shanghai

Tel: [phone]
Fax: [phone]

China - Shenyang

Tel: [phone]
Fax: [phone]

China - Shenzhen

Tel: [phone]
Fax: [phone]

China - Shunde

Tel: [phone]
Fax: [phone]

China - Wuhan

Tel: [phone]
Fax: [phone]

China - Xian

Tel: [phone]
Fax: [phone]

ASIA/PACIFIC

India - Bangalore

Tel: [phone]
Fax: [phone]

India - New Delhi

Tel: [phone]
Fax: [phone]

India - Pune

Tel: [phone]
Fax: [phone]

Japan - Yokohama

Tel: [phone]
Fax: [phone]

Korea - Daegu

Tel: [phone]
Fax: [phone]

Korea - Seoul

Tel: [phone]
Fax: [phone] or
82-2-558-5934

Malaysia - Kuala Lumpur

Tel: [phone]
Fax: [phone]

Malaysia - Penang

Tel: [phone]
Fax: [phone]

Philippines - Manila

Tel: [phone]
Fax: [phone]

Singapore

Tel: [phone]
Fax: [phone]

Taiwan - Hsin Chu

Tel: [phone]
Fax: [phone]

Taiwan - Kaohsiung

Tel: [phone]
Fax: [phone]

Taiwan - Taipei

Tel: [phone]
Fax: [phone]

Thailand - Bangkok

Tel: [phone]
Fax: [phone]

EUROPE

Austria - Wels

Tel: [phone]
Fax: [phone]

Denmark - Copenhagen

Tel: [phone]
Fax: [phone]

France - Paris

Tel: [phone]
Fax: [phone]

Germany - Munich

Tel: [phone]
Fax: [phone]

Italy - Milan

Tel: [phone]
Fax: [phone]

Netherlands - Drunen

Tel: [phone]
Fax: [phone]

Spain - Madrid

Tel: [phone]
Fax: [phone]

UK - Wokingham

Tel: [phone]
Fax: [phone]

10/05/07

DS21985B-page 44 © 2007 Microchip Technology Inc.