MICROCHIP HCS473 Technical data

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HCS473
Data Sheet
Code Hopping Encoder and Transponder
2002 Microchip Technology Inc. Preliminary DS40035C
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowl­edge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products.
Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical com­ponents in life support systems is not authorized except with express written approval by Microchip. No licenses are con­veyed, implicitly or otherwise, under any intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, K
EELOQ,
MPLAB, PIC, PICmicro, PICSTART and PRO MATE are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
FilterLab, microID, MXDEV, MXLAB, PICMASTER, SEEVAL and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.
dsPIC, dsPICDEM.net, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, microPort, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICC, PICDEM, PICDEM.net, rfPIC, Select Mode and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their respective companies.
© 2002, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved.
Printed on recycled paper.
Microchip received QS-9000 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona in July 1999 and Mountain View, California in March 2002. The Company’s quality system processes and procedures are QS-9000 compliant for its PICmicro devices, Serial EEPROMs, microperipherals, non-volatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001 certified.
®
8-bit MCUs, KEELOQ
®
code hopping
DS40035C - page ii Preliminary  2002 Microchip Technology Inc.
HCS473
KEELOQ® 3-Axis Transcoder
FEATURES
Encoder Security
• Read protected 64-bit encoder key
• 69-bit transmission length
• 60-bit, read protected seed for secure learning
• Programmable 32-bit serial number
• Non-volatile 16/20-bit synchronization counter
Encoder Operation
• 2.05V to 5.5V operation
• Four switch inputs – up to 15 functions codes
• PWM or Manchester modulation
• Selectable Baud Rate (416 - 5,000 bps)
• Transmissions include button queuing information
• PLL interface
Transponder Security
• 2 read protected 64-bit Challenge/Response keys
• Two IFF encryption algorithms
• 16/32-bit Challenge/Response
• Separate Vehicle ID and Token ID
• 2 vehicles supported
• CRC on all communication
Transponder Operation
Package Types
PDIP, SOIC
S0
S1
S2
S3/RFEN
VDDT
LCX
LCY
Block Diagram
Low
Voltage
Detector
S0
S1
Wake-up
Control
S2
S3/
RFEN
1
2
3
4
5
6
7
Internal
Oscillator
Control
HCS473
Logic
14
13
12
11
10
9
8
EEPROM
V
DD
LED
DATA
V
SS
V
SST
LCCOM
LCZ
RESET and
Power
Control
LED
Driver
Data
Output
V
DD
V
SS
LED
DATA
• Three sensitive transponder inputs
• Bi-directional transponder communication
• Transponder in/RF out operation
LCX
LCY
LCZ
3 Input Transponder
Circuitry
V
DDT
LCCOM
V
SST
• Anticollision of multiple transponders
• Intelligent damping for high Q-factor LC-circuits
• Low battery operation
• Passive proximity activation
• 64-bit secure user EEPROM
• Fast reaction time
Typical Applications
• Passive entry systems
• Automotive remote entry systems
• Automotive alarm systems
• Automotive immobilizers
Peripherals
• Low Voltage Detector
• On-board RC oscillator with ±10% variation
• Gate and garage openers
• Electronic door locks (Home/Office/Hotel)
• Burglar alarm systems
• Proximity access control
• Passive proximity authentication
2002 Microchip Technology Inc. Preliminary DS40035C-page 1
HCS473
Table of Contents
1.0 General Description ..................................................................................................................................................................... 3
2.0 Device Description ...................................................................................................................................................................... 5
3.0 Device Operation ....................................................................................................................................................................... 11
4.0 Programming Specification ....................................................................................................................................................... 37
5.0 Integrating the HCS473 Into A System ..................................................................................................................................... 39
6.0 Development Support................................................................................................................................................................. 43
7.0 Electrical Characteristics ........................................................................................................................................................... 49
8.0 Packaging Information................................................................................................................................................................ 57
INDEX .................................................................................................................................................................................................. 61
On-Line Support................................................................................................................................................................................... 62
Systems Information and Upgrade Hot Line ........................................................................................................................................ 62
Reader Response ................................................................................................................................................................................ 63
Product Identification System............................................................................................................................................................... 64
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DS40035C-page 2 Preliminary  2002 Microchip Technology Inc.
HCS473
1.0 GENERAL DESCRIPTION
The HCS473 combines the patented KEELOQ code hopping technology and bi-directional transponder challenge-and-response security into a single chip solution for logical and physical access control.
The three-input transponder interface allows the com­bination of three orthogonal transponder antennas, eliminating the directionality associated with traditional single antenna transponder systems.
When used as a code hopping encoder, the HCS473 is well suited to keyless entry systems; vehicle and garage door access in particular. The same HCS473 can also be used as a secure bi-directional transponder for contactless authentication. These capabilities make the HCS473 ideal for combined secure access control and identification applications, dramatically reducing the cost of hybrid transmitter/transponder solutions.
1.1 System Overview
1.1.1 KEY TERMS
The following is a list of key terms used throughout this data sheet. For additional information on terminology, please refer to the K (TB003).
AGC - Automatic Gain Control.
Anticollision - A scheme whereby transponders
in the same field can be addressed individually, preventing simultaneous response to a command (Section 3.2.1.4).
Button Status - Indicates what button input(s)
activated the transmission. Encompasses the 4 button status bits S3, S2, S1 and S0 (Figure 3-2).
Code Hopping - A method by which a code,
viewed externally to the system, appears to change unpredictably each time it is transmitted (Section 1.2.3).
Code word - A block of data that is repeatedly
transmitted upon button activation (Figure 3-2).
Crypto key - A unique and secret 64-bit number
used to encrypt and decrypt data. In a symmetri­cal block cipher such as the K the encryption and decryption keys are equal and will therefore be referred to generally as the crypto key.
Decoder - A device that decodes data received
from an encoder.
Decryption algorithm - A recipe whereby data
scrambled by an encryption algorithm can be unscrambled using the same crypto key.
Device Identifier - 16-bit value used to uniquely
select one of multiple transponders for communi­cation.
Encoder - A device that generates and encodes
data.
EELOQ introductory Technical Brief
EELOQ algorithm,
Encryption Algorithm - A recipe whereby data is scrambled using a crypto key. The data can only be interpreted by the respective decryption algo­rithm using the same crypto key.
IFF - Identify Friend or Foe, a classic authentica­tion method (Section 3.2.3.3).
Learn - Learning involves the receiver calculating the transmitter’s appropriate crypto key, decrypt­ing the received hopping code and storing the serial number, synchronization counter value and crypto key in EEPROM (Section 5.1). The
EELOQ product family facilitates several learning
K strategies to be implemented on the decoder. The following are examples of what can be done.
Simple Learning The receiver uses a fixed crypto key, common to all components of all systems by the same manu­facturer, to decrypt the received code word’s encrypted portion.
Normal Learning The receiver uses information transmitted during normal operation to derive the crypto key and decrypt the received code word’s encrypted por­tion.
Secure Learn The transmitter is activated through a special but­ton combination to transmit a stored 60-bit seed value used to derive the transmitter’s crypto key. The receiver uses this seed value to calculate the same crypto key and decrypt the received code word’s encrypted portion.
LF - Low Frequency. For HCS473 purposes, LF refers to a typical 125 kHz frequency.
Manufacturer’s code – A unique and secret 64­bit number used to generate unique encoder crypto keys. Each encoder is programmed with a crypto key that is a function of the manufacturer’s code. Each decoder is programmed with the man­ufacturer code itself.
Proximity Activation - A method whereby an encoder automatically initiates a transmission in response to detecting an inductive field (Section 3.1.1.2).
PKE - Passive Keyless Entry.
RKE - Remote Keyless Entry.
Transmission - A data stream consisting of repeating code words.
Transcoder - Device combining unidirectional transmitter capabilities with bi-directional authenti­cation capabilities.
Transponder - A transmitter-receiver activated for transmission by reception of a predetermined signal.
2002 Microchip Technology Inc. Preliminary DS40035C-page 3
HCS473
Transponder Reader (Reader, for short) - A device that authenticates a transponder using bi­directional communication.
Transport code - An access code, ‘password’ known only by the manufacturer, allowing write access to certain secure device memory areas (Section 3.2.3.2).
1.2 Encoder Overview
The HCS473 code hopping transcoder is designed specifically for passive entry systems; particularly vehi­cle access. The transcoder portion of a passive entry system is integrated into a fob, carried by the user and operated to gain access to a vehicle or restricted area. The HCS473 is meant to be a cost-effective yet secure solution to such systems, requiring very few external components (Figure 2-1).
1.2.1 LOW-END SYSTEM SECURITY
RISKS
Most low-end keyless entry transmitters are given a fixed identification code that is transmitted every time a button is pushed. The number of unique identification codes in a low-end system is usually a relatively small number. These shortcomings provide an opportunity for a sophisticated thief to create a device that ‘grabs’ a transmission and retransmits it later, or a device that quickly ‘scans’ all possible identification codes until the correct one is found.
1.2.2 HCS473 SECURITY
The HCS473, on the other hand, employs the KEELOQ code hopping technology coupled with a transmission length of 69 bits to virtually eliminate the use of code ‘grabbing’ or code ‘scanning’. The high security level of the HCS473 is based on the patented K ogy. A block cipher based on a block length of 32 bits and a key length of 64 bits is used. The algorithm obscures the information in such a way that even if the transmission’s pre-encrypted information differs by only one bit from that of the previous transmission, sta­tistically greater than 50 percent of the transmission’s encrypted result will change.
EELOQ
technol-
1.2.3 HCS473 HOPPING CODE
The 16-bit synchronization counter is the basis behind the transmitted code word changing for each transmis­sion; it increments each time a button is pressed.
Once the device detects a button press, it reads the button inputs and updates the synchronization counter. The synchronization counter and crypto key are input to the encryption algorithm and the output is 32 bits of encrypted information. This encrypted data will change with every button press, its value appearing externally to ‘randomly hop around’, hence it is referred to as the hopping portion of the code word. The 32-bit hopping code is combined with the button information and serial number to form the code word transmitted to the receiver. The code word format is explained in greater detail in Section 3.1.2.
1.3 Identify Friend or Foe (IFF) Overview
Validation of a transponder first involves an authenti­cating device sending a random challenge to the device. The transponder then replies with a calculated response that is a function of the received challenge and its stored crypto key. The authenticating device, transponder reader, performs the same calculation and compares it to the transponder’s response. If they match, the transponder is identified as valid and the transponder reader can take appropriate action.
The HCS473’s IFF response is generated using one of two possible crypto keys. The authenticating device precedes the challenge with a three bit field dictating which key to use in calculating the response.
The bi-directional communication path required for IFF is typically inductive for short range (<10cm) transpon­der applications with an inductive challenge and induc­tive response. Longer range (~1.5m) passive entry applications still transmit using the LF inductive path but the response is transmitted RF.
DS40035C-page 4 Preliminary  2002 Microchip Technology Inc.
HCS473
2.0 DEVICE DESCRIPTION
The HCS473 is designed for small package outline, cost-sensitive applications by minimizing the number of external components required for RKE and PKE appli­cations.
Figure 2-1 shows a typical 3-axis HCS473 RKE/PKE application.
• The switch inputs have internal pull-down resis­tors and integrated debouncing allowing a switch to be directly connected to the inputs.
The transponder circuitry requires only the addition of external LC-resonant circuits for inductive communica­tion capability.
• The open-drain LED output allows an external resistor for customization of LED brightness - and current consumption.
• The DATA output can be directly connected to the RF circuit or connected in conjunction with S3/ RFEN to a PLL.
2.1 Pinout Overview
A description of pinouts for the HCS473 can be found in Table 2-1.
TABLE 2-1: PINOUT SUMMARY
Pin Name
S0 1 Button input pin with Schmitt Trigger detector and internal pull-down resistor (Figure 2-3). S1 2 Button input pin with Schmitt Trigger detector and internal pull-down resistor (Figure 2-3). S2 3 Button input pin with Schmitt Trigger detector and internal pull-down resistor (Figure 2-3). S3/RFEN 4 Multi-purpose input/output pin (Figure 2-4).
DDT 5 Transponder supply voltage. Regulated voltage output for strong inductive field.
V LCX 6 Sensitive transponder input X (Figure 2-7). A strong signal on this pin is internally regulated
LCY 7 Sensitive transponder input Y (Figure 2-7) LCZ 8 Sensitive transponder input Z (Figure 2-7) LCCOM 9 Transponder bias output (Figure 2-7)
SST 10 Transponder ground reference, must be connected to VSS.
V
SS 11 Ground reference
V DATA 12 Transmission data output (Figure 2-5) LED 13 Open drain LED output (Figure 2-6)
DD 14 Positive supply voltage
V
Pin
Number
Description
• Button input pin with Schmitt Trigger detector and internal pull-down resistor.
• RFEN output driver.
and supplied on V
DD for low-battery operation/recharging.
2.2 LF Antenna Considerations
A typical magnetic low frequency sensor (receiving antenna) consists of a parallel inductor-capacitor circuit that is sensitive to an externally applied magnetic sig­nal. This LC circuit is tuned to resonate at the source signal's base frequency. The real-time voltage across the sensor represents the presence and strength of the surrounding magnetic field. By amplitude modulating the source's magnetic field, it is possible to transfer data over short distances. This communication approach is successfully used with distances up to 1.8 meters, depending on transmission strengths and sen­sor sensitivity. Two key factors that greatly affect com­munication range are:
1. Sensor tuning
2. A properly tuned sensor's relative sensitivity
2002 Microchip Technology Inc. Preliminary DS40035C-page 5
An LC antenna’s component values may be initially cal­culated using the following equation. “Initially” because there are many factors affecting component selection.
1
2π F
It is not this data sheet’s purpose to present in-depth details regarding LC antenna and their tuning. Please refer to “Low Frequency Magnetic Transmitter Design Application Note”, AN232, for appropriate LF antenna design details.
Note: Microchip also has a confidential Applica-
tion Note on Magnetic Sensors (AN832C). Contact Microchip for a Non-Disclosure Agreement in order to obtain this applica­tion note.
-----------
=
LC
HCS473
FIGURE 2-1: HCS473 3-AXIS
APPLICATION
DD
V
1µF 100nF
HCS473
Y
DDT
LCCOM
L
Z
V
LED
DATA
V
VSST
LCZ
680pF
DD
SS
Circuit
C
Z
S0
S1
S2
S3/RFEN
V
LCX
LCY
L
C
L
X
X
Note: The 680pF capacitor prevents device instability - self
C
Y
resonance.
FIGURE 2-3: S0/S1/S2 PIN DIAGRAM
S0, S1, S2 Inputs
RPD
RF
FIGURE 2-4: S3/RFEN PIN DIAGRAM
VDD
RFEN
PFET
NFET
S3 Input/ RFEN Output
RPD
FIGURE 2-2: HCS473 1-AXIS
APPLICATION
V
DD
1µF 100nF
HCS473
DDT
LCCOM
V
DD
LED
DATA
SS
V
VSST
LCZ
100
S0
S1
S2
S3/RFEN
V
LCX
LCY
L
C
X
X
100
660 pF
Circuit
RF
Note: RPD is disabled when driving RFEN.
FIGURE 2-5: DATA PIN DIAGRAM
VDD
PFET
NFET
DATA
RDATA
Note: RDATA is disabled when the DATA line is driven.
DATA OUT
Note: Connect unused LC antenna inputs to LCCOM
through a 100 resistor for proper bias conditions.
DS40035C-page 6 Preliminary  2002 Microchip Technology Inc.
HCS473
FIGURE 2-6: LED PIN DIAGRAM
VDD
Weak
LED
LED
Program
Mode
HV
Detect
FIGURE 2-7: LCCOM/LCX/LCY/LCZ/
VSST PIN DIAGRAM
LCX
only
LCX/LCY/ LCZ Inputs
100
RECTIFIER and
REGULATOR
AMP and DET
VSST
LC Input
2.3 Architectural Overview
2.3.1 WAKE-UP LOGIC
The HCS473 automatically goes into a low-power Standby mode once connected to a supply voltage. Power is supplied to the minimum circuitry required to detect a wake-up condition; button activation or LC sig­nal detection.
The HCS473 will wake from Low-power mode when a button input is pulled high or a signal is detected on a LC low frequency antenna input pin. Waking involves powering the main logic circuitry that controls device operation. The button and transponder inputs are then sampled to determine which input activated the device.
A button input activation places the device into Encoder mode. A signal detected on the transponder input places the device into Transponder mode. Encoder mode has priority over Transponder mode such that communication on the transponder input would be ignored or perhaps interrupted if it occurred simulta­neously to a button activation; ignored until the button input is released.
2.3.2 ENCODER INTERFACE
Using the four button inputs, up to 15 unique control codes may be transmitted.
Note: S3 may not be used as a button input if the
RFEN option is enabled.
LCCOM
100
10V
10V
R
DAMP
CURRENT
DAMP
CLAMP
BIAS
2002 Microchip Technology Inc. Preliminary DS40035C-page 7
HCS473
2.3.3 TRANSPONDER INTERFACE
The transponder interface on the HCS473 consists of the following:
• The internal transponder circuitry has separate power supply (V tions.
- The V
DDT pin supplies power to the transpon-
der circuitry and also outputs a regulated volt­age if the LCX antenna input is receiving a strong signal; transponder is placed in a strong LF field.
- The V
SST pin supplies the ground reference
to the transponder circuitry and must be con­nected to the V
• LF input amplifier and envelope detector to detect and shape the incoming low frequency excitation signal.
• Three sensitive transponder inputs with over-volt­age protection (LCX, LCY, LCZ).
• Incoming LF energy rectification and regulation on the LCX input to supplement the supply voltage in low-battery transponder instances.
• 10V zener input protection from excessive antenna voltage resulting when proximate to very strong magnetic fields.
• LCCOM pin used to bias the transponder reso­nant circuits for best sensitivity.
• LF antenna clamping transistors for inductive responses back to the transponder reader. The antenna ends are shorted together, ‘clamped’, dissipating the oscillatory energy. The reader detects this as a momentary load on its excitation antenna.
• Damping transistors to increase LF communica­tion reliability when using high Q-factor LC anten­nae.
The LCCOM pin functions to bias the LCX, LCY, and LCZ AGC amplifier inputs. The amplifier gain control sets the optimum level of amplification in respect to the incoming signal strength. The signal then passes through an envelope detector before interpretation in the logic circuit.
A block diagram of the transponder circuit is shown in Figure 2-8.
DDT) and ground (VSST) connec-
SS pin.
FIGURE 2-8: HCS473 TRANSPONDER
CIRCUIT
LCX
LCY
LCZ
LCCOM
Rectifier/ Regulator
Noise
Filter
CCT
V
Signal In
Damp/Clamp
Control
2.3.4 INTERNAL EEPROM
The HCS473 has an on-board non-volatile EEPROM which is used to store:
• configuration options
- encryption keys
- serial number
- vehicle ID’s
- baud rates
- ... see Section 3.1.4 and Section 3.2.1
• 64 bits of user memory
• synchronization counter. All options are programmable during production, but
many of the security related options are programmable only during production and are further read protected.
The user area allows storage of general purpose infor­mation and is accessible only through the transponder communication path.
During every EEPROM write, the device ensures that the internal programming voltage is at an acceptable level prior to performing the EEPROM write.
DS40035C-page 8 Preliminary  2002 Microchip Technology Inc.
2.3.5 INTERNAL RC OSCILLATOR
The HCS473 runs on an internal RC oscillator. The internal oscillator may vary ±10% over the device’s rated voltage and temperature range for commercial temperature devices. A certain percentage of indus­trial temperature devices vary further on the slow side,
-20%, when used at higher voltages (V cold temperature. The LF and RF communication timing values are subject to these variations.
DD > 3.5V) and
2.3.6 LOW VOLTAGE DETECTOR
The HCS473’s battery voltage detector detects when the supply voltage drops below a predetermined value. The value is selected by the Low Voltage Trip Point Select (VLOWSEL) configuration option (Section 3.3).
The low voltage detector result is included in encoder transmissions (VLOW) allowing the receiver to indicate when the transmitter battery is low (Section 3.1.4.6).
The HCS473 also indicates a low battery condition by changing the LED operation (Section 3.1.5).
2.3.7 THE S3/RFEN PIN
HCS473
The S3/RFEN pin may be used as a button input or RF enable output to a compatible PLL. Select between S3 button input and RFEN functionality with the RFEN configuration option (Table 2-2).
TABLE 2-2: RFEN OPTION
RFEN Resulting S3/RFEN Configuration
0 S3 button input pin with Schmitt Trigger
detector and internal pull-down resistor.
1 RFEN output driver.
S3 may not be used as a button input if the RFEN option is enabled
2002 Microchip Technology Inc. Preliminary DS40035C-page 9
HCS473
NOTES:
DS40035C-page 10 Preliminary  2002 Microchip Technology Inc.
HCS473
3.0 DEVICE OPERATION
HCS473 operation depends on how the device is acti­vated. The device exits Low-power mode either when a switch input is pulled high or when a signal is detected on an LC antenna input pin. Once activated, the device determines the source of the activation and enters Encoder mode or Transponder mode.
A button input activation places the device into Encoder mode. A signal detected on the transponder input places the device into Transponder mode. Encoder mode has priority over Transponder mode such that communication on the transponder input would be ignored or perhaps interrupted if it occurred simulta­neously to a button activation; ignored until the button input is released.
3.1 Encoder mode
3.1.1 ENCODER ACTIVATION
3.1.1.1 Button Activation
The main way to enter Encoder mode is when the wake-up circuit detects a button input activation; button input transition from GND to V logic wakes and delays a nominal switch debounce time (T
DB) prior to sampling the button inputs. The but-
ton input states, cumulatively called the button status, determine whether the HCS473 transmits a code hop­ping or seed transmission.
The transmission begins a time T consists of a stream of code words transmitted as long as the switch input is held high or until a selectable TSEL timeout occurs (see Section 3.1.4.16 for TSEL options). A timeout returns the device to Low-power mode, protecting the battery in case a button is stuck.
Additional button activations during a transmission will immediately reset the HCS473, perhaps leaving the current code word incomplete. The device will start a new transmission which includes the updated button status value.
Buttons removed during a transmission will have no effect unless no buttons remain activated. If no button activations remain, the minimum number of complete code words will be completed (see Section 3.1.4.15 for MTX options) and the device will return to Low Power mode.
DD. The HCS473 control
PU after activation. It
3.1.2 TRANSMITTED CODE WORD
The HCS473 transmits a 69-bit code word in response to a button activation or proximity activation, Figure 3-
1. The code word content varies with the two unique transmission types; Hopping or Seed.
3.1.2.1 Hopping Code Word
Hopping code words are those transmitted during nor­mal operation. Each Hopping code word contains a preamble, header, 32 bits of encrypted data and up to 37 bits of fixed value data followed by a guard period before another code word begins.
• The 32 bits of Encrypted Data include button sta­tus bits, discrimination bits and the synchroniza­tion counter value. The inclusion/omission of overflow bits and size of both synchronization counter and discrimination bit fields vary with the CNTSEL option, Figure 3-2 and Section 3.1.4.5.
• The 37 bits of Fixed Code Data include queue bits (if enabled), CRC bits, low voltage status and serial number. The inclusion/omission of button status and size of the serial number field vary with the XSER option, Figure 3-2 and Section 3.1.4.3.
3.1.2.2 Seed Code Word
Seed code words are required when the system imple­ments secure key generation. Seed transmissions are activated when the button inputs match the value spec­ified by the seed button code configuration option (SDBT), Section 3.1.4.9.
Each Seed code word contains a preamble, header and up to 69 bits of fixed data followed by a guard period before another code word begins.
• The 69 bits of Fixed Code Data include queue bits (if enabled), CRC bits, low voltage status, but­ton status and the 60-bit seed value, Figure 3-2.
.
Note: For additional information on KEELOQ the-
ory and implementation, please refer to the KEELOQ introductory Technical Brief (TB003).
3.1.1.2 Proximity Activation
A second way to enter Encoder mode is if the proximity activation option (PXMA) is enabled and the wake-up circuit detects a wake-up sequence on an LC antenna input pin. This form of activation is called Proximity Activation as a code hopping transmission would be ini­tiated when the device was proximate to a LF field.
2002 Microchip Technology Inc. Preliminary DS40035C-page 11
HCS473
FIGURE 3-1: GENERAL CODE WORD FORMAT
Preamble
Header
FIGURE 3-2: CODE WORD ORGANIZATION
Hopping Code:
CRC
QUE
2 Bits
2 Bits
Q1 Q0 C1 C0
MSb
Hopping Code:
28-bit Serial Number (XSER = 0) 16-bit Synchronization Counter (CNTSEL=0) Button Queuing enabled (QUEN=1)
Fixed Code Portion (37 Bits)
VLOW
BUT
4 Bits
1-Bit
S2 S1 S0 S3
SER 1
12 MSb’s
SER 0
Least Sig16 Bits
32-bit Serial Number (XSER = 1) 20-bit Synchronization Counter (CNTSEL=1) Button Queuing disabled (QUEN=0)
Data Bits
Hopping Code Portion Message (32 Bits)
Counter
BUT
Overflow
4 Bits
S2 S1 S0 S3 OVR1 OVR0
2 Bits
DISCRIM
10 Bits
Guard
Time
Synchronization
Counter
16 Bits
15
LSb
69 Data bits
Transmitted LSb first.
0
Fixed Code Portion (35 Bits)
CRC
2 Bits
C1 C0
V
LOW
1-Bit
SER 1
Most Sig 16 Bits
MSb
Seed Code:
Fixed Code Portion (9 Bits) Seed Value (60 Bits)
QUE
CRC
2 Bits
2 Bits
Q1 Q0
C1 C0
Shaded 65 bits included in CRC calculation
Queuing enabled (QUE = 1)
LOW
V
BUT
1-Bit
4 Bits
111 1
SDVAL3
12 Most Sig Bits
SER 0
Least Sig 16 Bits
SDVAL2
16 Bits
BUT
4 Bits
S2 S1 S0 S3
S2 S1 S0 S3
Hopping Code Portion Message (32 Bits)
Synchronization
Synchronization
Counter
DISCRIM
8 Bits
20
Counter
20 Bits
67 Data bits
Transmitted LSb first.
SDVAL1
16 Bits
SDVAL0
16 Least Sig Bits
69 Data bits
Transmitted LSb first.
0
LSb
LSbMSb
DS40035C-page 12 Preliminary  2002 Microchip Technology Inc.
HCS473
3.1.3 CODE HOPPING MODULATION FORMAT
The data modulation format is selectable between Pulse Width Modulation (PWM) and Manchester using the modulation select (MSEL) configuration option.
Regardless of the modulation format, each code word contains a leading preamble and a synchronization header to wake the receiver and provide synchroniza­tion events for the receive routine. Each code word also contains a trailing guard time to separate code words.
The same code word repeats as long as the same input pins remain active, until a timeout occurs or a delayed seed transmission is activated.
The modulated data timing is typically referred to in multiples of a basic Timing Element (RFT because the DATA pin output is typically sent through a RF transmitter to the decoder or transponder reader.
E may be selected using the RF Transmission
RFT Baud Rate (RFBSL) configuration option (Section 3.1.4.13).
Manchester encoding further includes a leading data ‘1’ START pulse and closing 1 RFT
E STOP pulse around
each data block.
FIGURE 3-3: PWM TRANSMISSION FORMAT (MSEL = 0)
TOTAL TRANSMISSION:
Preamble Sync Encrypt Fixed Guard
1 CODE WORD
TETET
LOGIC "0"
LOGIC "1"
E). ‘RF’ TE
Preamble Sync Encrypt
E
Preamble
Header
Encrypted
Portion
CODE WORD
FIGURE 3-4: MANCHESTER TRANSMISSION FORMAT (MSEL = 1)
1 CODE WORD
TOTAL TRANSMISSION:
START bit
Preamble
Preamble Sync Encrypt Fixed Guard
LOGIC “0”
bit 0
bit 1
bit 2
LOGIC “1”
CODE WORD
Preamble Sync Encrypt
TE
T
E
Fixed Code
Portion
STOP bit
GuardHeader Encrypted Fixed Code
TimePortion Portion
Guard
Time
2002 Microchip Technology Inc. Preliminary DS40035C-page 13
HCS473
3.1.4 ENCODER MODE OPTIONS
The following HCS473 configuration options configure transmission characteristics of the information exiting the DATA pin:
• Modulation select (MSEL)
• Header select (HSEL)
• Extended serial number (XSER)
• Queue counter enable (QUEN)
• Counter select (CNTSEL)
• Low voltage trip point (VLOWSEL)
• PLL interface select (AFSK)
• RF enable output (RFEN)
• Seed button code (SDBT)
• Time before Seed (SDTM)
• Limited Seed (SDLM)
• Seed mode (SDMD)
• RF baud rate select (RFBSL)
• Guard time select (GSEL)
• Minimum code words (MTX)
• Timeout select (TSEL)
• Long preamble enable (LPRE)
• Long preamble length (LPRL)
• Preamble duty cycle (PRD) The following sections detail each configuration’s avail-
able options. All timing values specified are subject to the specified oscillator variation.
3.1.4.1 Modulation Format (MSEL)
The Modulation format option selects the modulation format for data output from the DATA pin; most often transmitted via RF.
MSEL options:
• Pulse Width Modulation (PWM), Figure 3-3
• Manchester Modulation, Figure 3-4
3.1.4.2 Header Select (HSEL)
The synchronization header is typically used by the receiver to adjust bit sampling appropriate to the trans­mitter’s current speed; as the transmitter’s RC oscilla­tor varies with temperature and voltage, so will the transmission’s timing.
HSEL options:
TE
•4 RF
• 10 RFTE
3.1.4.3 Extended Serial Number (XSER)
The Extended Serial Number option determines whether the HCS473 transmits a 28 or 32-bit serial number.
When configured for a 28-bit serial number, the Most Significant nibble of the 32 bits reserved for the serial number is replaced with a copy of the 4-bit button sta­tus, Figure 3-2.
XSER options:
• 28-bit serial number
• 32-bit serial number
3.1.4.4 Queue Counter (QUEN)
The QUE counter can be used to request secondary decoder functions using only a single transmitter but­ton. Typically a decoder must keep track of incoming transmissions to determine when a double button press occurs, perhaps an unlock all doors request. The QUE counter removes this burden from the decoder by counting multiple button presses and including the QUE counter value in the last two bits of the 69-bit code word, (Figure 3-2). If QUEN is disabled, the transmis­sion will consist only of 67 bits as the QUE bits field is not transmitted.
Que counter functionality is enabled with the QUEN configuration option. The 2-bit QUE counter is incre­mented each time an active button input is released for at least the Debounce Time (T (button pressed again) within the Queue Time (T Figure 3-5. The counter increments up from 0 to a max­imum of 3, returning to 0 only after a different button activation or after button activations spaced greater than the Queue Time (T
The current transmission aborts, after completing the minimum number of code words (Section 3.1.4.15), when the active button inputs are released. A button re­activation within the queue time (T new transmission (new synchronization counter, encrypted data) using the updated QUE value. Button combinations are queued the same as individual but­tons.
QUE) apart.
DB), then re-activated
QUE),
QUE) then initiates a
DS40035C-page 14 Preliminary  2002 Microchip Technology Inc.
FIGURE 3-5: QUE COUNTER TIMING DIAGRAM
HCS473
Button Input Sx
Code Words Transmitted
1st Button Press All Buttons Released 2nd Button Press
Transmission: QUE1:0 = 01
t TDB
QUE1:0 = 00 Synch CNT = X
2
TDB
3.1.4.5 Counter Select (CNTSEL)
The counter select option selects between a 16-bit or 20-bit counter. This option changes the way the 32-bit hopping portion is constructed, as indicated in Figure 3-2. The 16-bit counter format additionally includes two overflow bits for increasing the synchroni­zation counter range, see Section 3.1.7.
CNTSEL options:
• 16-bit synchronization counter
• 20-bit synchronization counter
3.1.4.6 Low Voltage Trip Point Select
(VLOWSEL)
The HCS473’s battery voltage detector detects when the supply voltage drops below a predetermined value. The value is selected by the Low Voltage Trip Point Select (VLOWSEL) configuration option (Table 3-6).
VLOWSEL options:
• 2.2V trip point
• 3.3V trip point
The low voltage detector result (VLOW) is included in Hopping code transmissions allowing the receiver to indicate when the transmitter battery is low (Figure 3-
2). The HCS473 also indicates a low battery condition
by changing the LED operation (Section 3.1.5). The HCS473 samples the internal low voltage detector
at the end of each code word’s first preamble bit. The transmitted VLOW status will be a ‘0’ as long as the low voltage detector indicates V low voltage trip point. VLOW will change to a ‘1’ if V drops below the selected low voltage trip point.
DD is above the selected
DD
Transmission:
Synch CNT = X+1
TDB t TQUE
2
3.1.4.7 PLL Interface Select (PLLSEL)
The S3/RFEN pin may be configured as an RF enable output to an RF PLL. The pin’s behavior is coordinated with the DATA pin to activate a typical PLL in either ASK or FSK mode.
The PLL Interface (PLLSEL) configuration option con­trols the output as shown for Encoder operation in Figure 3-6. Please refer to Section 3.2.8 for RFEN behavior during LF communication.
PLLSEL options:
• ASK PLL Setup
• FSK PLL Setup
3.1.4.8 RF Enable Output (RFEN)
The S3/RFEN pin of the HCS473 can be configured to function as an RF enable output signal. When enabled, the pin is driven high whenever data is transmitted through the DATA pin; the S3/RFEN pin can therefore not be used as an input in this configuration. The RF enable option bit functions in conjunction with the PLL interface select option, PLLSEL.
RFEN options:
• S3/RFEN pin functions as S3 switch input only
• S3/RFEN pin functions as RFEN output only
TABLE 3-1: VLOW STATUS BIT
VLOW Description
0 V 1 V
2002 Microchip Technology Inc. Preliminary DS40035C-page 15
DD is above selected trip voltage DD is below selected trip voltage
HCS473
FIGURE 3-6: ENCODER OPERATION: RF ENABLE/ASK/FSK OPTIONS
SWITCH
ASK:
FSK:
S3/RFEN
DATA
S3/RFEN
DATA
TPU
Code Word Code Word Code Word
T
PLL
Code Word Code Word Code Word
3.1.4.9 SEED Button Code (SDBT)
SDBT selects which switch input(s) activate a seed transmission. Seed transmissions are disabled by clearing all 4 bits. If a button combination is pressed that matches the 4-bit SDBT value, a seed code word is transmitted as configured by the SDTM, SDLM and SDMD options (see following sections).
The binary bit order is S3-S2-S1-S0. For example, if you want the combination of S2 and S0 to activate a seed transmission, use SDBT=0101
2.
SDBT options:
• Seed is transmitted when SDBT flags match the button input flags
• SDBT = 0000
disables seed capability.
2
Note: Configuring S3/RFEN as RFEN (see
Section 3.1.4.8) prevents the use of S3 to trigger a seed transmission.
3.1.4.10 Time Before Seed (SDTM)
The time before seed option selects the delay from device activation until the seed code words are trans­mitted. If the delay is not zero, the HCS473 transmits hopping code words until the selected time, then trans­mits seed code words.
As code words are always completed, the seed code word begins the first code word after the specified time.
SDTM options:
• 0s - seed code words begin immediately
•0.8s
•1.6s
•3.2s
Code Word
Code Word
3.1.4.11 Limited Seed (SDLM)
The limited seed option may be used to disable seed transmission capability after a configurable number of transmitter activations; limiting a transmitter’s ability to be learned into a receiver. Specifically, seed transmis­sions are disabled when the synchronization counter’s LSB increments from 7Fh to 80h.
SDLM options:
• unlimited seed capability
• limited seed capability - counter value dependent
3.1.4.12 SEED Mode (SDMD)
The Seed mode option selects between User and Pro­duction seed modes. Production mode functions as a special time before seed case (SDTM).
With Production mode enabled, a seed button code activation triggers MTX hopping code words followed by MTX seed code words. Production mode functional­ity is disabled when the synchronization counter’s LSB increments from 7Fh to 80h.
SDMD options:
•User
• Production
3.1.4.13 RF Baud Rate Select (RFBSL)
The timing of code word data modulated on the DATA pin is referred to in multiples of a basic Timing Element RFT
E. ‘RF’ TE
sent through a RF transmitter to the decoder or tran­sponder reader.
E may be selected using the RF Baud Rate Select
RFT (RFBSL) configuration option. RF ject to the oscillator variation over temperature and voltage.
RFBSL options:
•100 µs RFT
•200 µs RFTE
•400 µs RFTE
•800 µs RFTE
because the DATA pin output is typically
TE accuracy is sub-
E
DS40035C-page 16 Preliminary  2002 Microchip Technology Inc.
HCS473
3.1.4.14 Guard Time Select (GSEL)
The guard time (TG) select option determines the time between consecutive code words when no data is transmitted. The guard time may be selected in conjuc­tion with the RF baud rate and preamble duty cycle to control time-averaged power output for transmitter cer­tification.
GSEL options:
TE
•3 RF
• 6.4 ms
•51.2 ms
• 102.4 ms
3.1.4.15 Minimum Code Words (MTX)
The Minimum Code Words (MTX) configuration option determines the minimum number of code words trans­mitted when a momentary switch input is taken high for more than T
MTX options:
•1 code word
•2 code words
•4 code words
•8 code words
PU, or when a proximity activation occurs.
3.1.4.18 Long Preamble Length (LPRL)
The long preamble length option selects the first code word’s preamble length when the long preamble option (LPRE) is enabled. Only the first code word begins with the long preamble, subsequent code words begin with the standard 16 high pulses preamble.
LPRL options:
•75 ms
• 100 ms
3.1.4.19 Preamble Duty Cycle (PRD)
The preamble duty cycle can be set to either 33% or 50% to limit the average power transmitted, Figure 3-7.
PRD options:
• 50% Duty Cycle
• 33% Duty Cycle
FIGURE 3-7: PREAMBLE FORMATS
50% Duty Cycle
33% Duty Cycle
TE TE
TE 2TE
3.1.4.16 Timeout Select (TSEL)
The HCS473’s Timeout function prevents battery drain should a switch input remain high (stuck button) longer than the selectable TSEL time. After the TSEL time, the device will return to Low-power mode.
The device will stop transmitting in Low-power mode but there will be leakage across the stuck button input’s internal pull-down resistor. The current draw will there­fore be higher than if no button were stuck.
TSEL options:
•4s
•8s
•16s
•32s
3.1.4.17 Long Preamble Enable (LPRE)
Enabling the Long Preamble configuration option extends the first code word’s preamble to a ‘long’ pre­amble time LPRL wake and bias before the data bits arrive. The longer preamble will be a square wave at the selected RFT Subsequent code words begin with the standard pre­amble length.
LPRE options:
• Standard 16 high pulse preamble
• Long preamble, duration defined by LPRL
; allowing the receiver more time to
3.1.5 LED OPERATION
The LED pin output varies depending on whether the device V below V
The LED pin will periodically be driven low as long as the device is transmitting and the battery is good. If the supply voltage drops below the specified V point, the LED pin will be driven low only once for any given device activation so long as the low battery con­dition remains (Figure 3-8). If the battery voltage recov­ers during the transmission, the LED will begin blinking again.
E.
DD is greater than VLOWSEL (a good battery) or
LOWSEL (a flat battery).
LOWSEL trip
2002 Microchip Technology Inc. Preliminary DS40035C-page 17
HCS473
FIGURE 3-8: LED OPERATION
SWITCH Sx
Code Word Code Word Code Word
TLEDON
TLEDON
LED
LED
-
-
DATA
VDD>VLOWSEL (good battery)
V
DD≤VLOWSEL
(flat battery)
3.1.6 CYCLE REDUNDANCY CHECK
(CRC)
The decoder can use the CRC bits to check the data integrity before processing begins. The CRC is calcu­lated on the previously transmitted bits (Figure 3-2), detecting all single bit and 66% of all double bit errors.
EQUATION 3-1: CRC CALCULATION
CRC 1[]
and
CRC 0[]
with
and Di
the nth transmission bit 0 n 64
n
n1+
n1+
CRC 1 0,[]00=
CRC 0[]nDin⊕=
CRC 0[]nDin⊕()CRC 1[]
=
n
3.1.7 COUNTER OVERFLOW BITS
(OVR1, OVR0)
The Counter Overflow Bits may be utilized to increase the 16-bit synchronization counter range from the nom­inal 65,535 to 131,070 or 196,605. The bits do not exist when the device is configured for 20-bit counter opera­tion.
The bits must be programmed during production as ‘1’s to be utilized. OVR0 is cleared the first time the syn­chronization counter wraps from FFFFh to 0000h. OVR1 is cleared the second time the synchronization counter wraps to zero. The two bits remain at ‘0’ after all subsequent counter wraps.
Note: See Section 4.0, Programming Specs, for
information on programming OVR bits.
TLEDOFF
3.1.8 DISCRIMINATION VALUE (DISC)
The Discrimination Value is typically used by the decoder in a post-decryption check. It may be any value, but in a typical system it will be programmed equal to the Least Significant bits of the serial number.
The discrimination bits are part of the information that form the encrypted portion of the transmission (Figure 3-2). After the receiver has decrypted a trans­mission, the discrimination bits are checked against the receiver’s stored value to verify that the decryption pro­cess was valid; appropriate decryption key was used. If the discrimination value was programmed as the LSb’s of the serial number then it may merely be compared to the respective bits of the received serial number.
The discrimination bit field size varies with the counter select (CNTSEL) option (Figure 3-2).
3.2 Transponder Mode
The HCS473’s Transponder mode allows it to function as a bi-directional communication transponder. Com­mands are received on the LC pins, responses may be returned on either the LC pins or DATA pin for short range LF or long range RF responses, respectively.
Transponder mode capabilities include:
• A bi-directional challenge and response sequence for IFF validation.
• Read selected EEPROM areas.
• Write selected EEPROM areas.
• Request a code hopping transmission.
• Proximity Activation of a code hopping transmis­sion.
• Address an individual transponder when multiple units are within the LF field; device selection for anticollision communication purposes.
DS40035C-page 18 Preliminary  2002 Microchip Technology Inc.
HCS473
3.2.1 TRANSPONDER OPTIONS
The following HCS473 configuration options influence the device behavior when in Transponder mode:
• Preamble length select (TPRLS)
• LF Demodulator (LFDEMOD)
• LF Baud rate select (LFBSL)
• Anticollision (ACOL)
• Proximity Activation (PXMA)
• Intelligent Damping (DAMP)
• LC response Enable (LCRSP)
• RF response Enable (RFRSP)
• Skip Field Acknowledge (SKIPACK) The following sections describe these options in detail.
3.2.1.1 Transponder Preamble Length Select (TPRLS)
Data responses through the DATA pin use the format determined by the Encoder mode options, with one exception/option to shorten the response time. The response’s preamble can be reduced to 4 high pulses by setting the transponder preamble length select option. This only affects the responses as a result of transponder communication (proximity activation trans­missions included), not responses resulting from but­ton input activations. The 4 high pulse short preamble will be at the same duty cycle defined by the preamble duty cycle Encoder mode option (PRD).
Note: The long preamble enable Encoder mode
option (LPRE) holds priority over the tran­sponder preamble length option.
The demodulated signal on the LED pin is accurate to within +/-10µs of the signal on the LC pins. The injected signal will have baud rate limitations based on the HCS473’s internal filter charge and discharge times, Section 3.2.6.
The filter times discussed in Section 3.2.6 will be easily seen in Demodulator mode. The internal filter delay may be isolated by communicating to the HCS473 inputting the digital signal into LCX and observing the signal plus internal filter delays on the LED pin.
LFDEMOD options:
• Disabled - device functions normally
• Enabled - device demodulates signal on LC pins, outputting digital result on the LED pin.
Note: Damping is disabled when in Demodulator
mode.
3.2.1.3 LF Baud Rate Select (LFBSL)
The LF Baud rate select option allows the user to adjust the basic pulse width element (LF sponder communication.
TE) used for tran-
LFBSL options:
• 100 µs LFTE
• 200 µs LFTE
• 400 µs LFTE
• 800 µs LFTE
All communication to and from the HCS473 through the LC transponder pins will use the selected LF acknowledges to LF communication, through the DATA pin, will also use the selected LF
TE.
TE. RF
TABLE 3-2: TRANSPONDER PREAMBLE
LENGTH SELECT (TPRLS)
TPLS LPRE Description
00Normal - 16 high pulses X1Long - LPRL determines length 10Short - 4 high pulses
3.2.1.2 LF Demodulator (LFDEMOD)
The HCS473 has a LF Demodulator mode useful for debugging antenna hardware.
Enabling LFDEMOD limits the device to demodulator only mode. After receiving an appropriate wake-up sequence, the device enters a loop demodulating the signal on the LC pins and outputting the resulting digital representation on the LED pin. The HCS473 remains in this mode until no edges are detected on the LC pins
DEMOD, upon which it will return to Low-power
for T mode; requiring another wake-up sequence to further demodulate data.
3.2.1.4 Anticollision (ACOL)
Multiple transponders in the same inductive field will simultaneously respond to inductive commands. Enabling anticollision prevents multiple HCS473 responses from 'colliding'. Hence the term ‘anticolli­sion.’
When anticollision (ACOL) is enabled, the first com­mand received after the device wakes must be either the SELECT TRANSPONDER or ANTICOLLISION OFFcommand before the HCS473 will respond to any other command.
The ANTICOLLISION OFF command may be used to temporarily bypass anticollision requirements for a sin­gle communication sequence. It allows communication with an anticollision enabled HCS473 if the VID and TID are not known (perhaps during a learning sequence). See Section 3.2.3.7 for further anticollision off details.
The SELECT TRANSPONDER command allows the addressing of and communication to an individual HCS473, regardless if multiple devices are in the field (Section 3.2.3.1).
2002 Microchip Technology Inc. Preliminary DS40035C-page 19
HCS473
The HCS473 anticollision method is that all devices trained to a given vehicle will have the same 12-bit vehicle identifier (VID); Most Significant 12 bits of the device identifier, Table 3-3. The device identifier of up to 16 transponders trained to access a given vehicle will differ only in the 4 LSb’s. These 4 bits are referred to as the token identifier (TID).
TABLE 3-3: DEVICE ID
16-bit Device ID (DEVID)
1514131211109876543210
VID TID
11109 8 7 6 5432103210
The vehicle ID associates the HCS473 with a given vehicle and the token ID makes it a uniquely address­able (selectable) 1 of 16 possible devices authorized to access the vehicle.
Two unique device identifiers are available allowing the HCS473 to be used with two different vehicles. The HCS473 responds if the presented VID and TID match either of the two programmed identifiers.
SELECT TRANSPONDER may still be performed on devices not configured to require anticollision; commu­nication can still be isolated to one of multiple devices in the field. Equally, the same devices will respond to all command sequences not preceded by the SELECT TRANSPONDER sequence.
3.2.1.6 Intelligent Damping (DAMP)
A high Q-factor LC antenna circuit connected to the HCS473 will continue to resonate after a strong LF field is removed, slowly decaying. The slow decay makes fast communication near the reader difficult as the resulting extended high time makes the following low time disappear.
The Intelligent damping option enables a pulsed, resis­tive short from the LC pins to LCCOM when the HCS473 is expecting the incoming LC signal level to go low. These pulses damp the antenna, dissipating reso­nant energy for a quicker decay time when the field is switched off.
The damping pulses are applied between the LCCOM pin and the individual LC pins, starting 1.2 LF detecting the bit’s rising edge and repeating until the LC input goes low. Damp pulse width is 6 µs, beginning every 44 µs as shown in Figure 3-9.
Note: Damping will not reduce the HCS473 inter-
nal LF analog filter discharge time, T (Section 3.2.6).
TE from
FILTF
FIGURE 3-9: INTELLIGENT DAMPING
No Damping With Damping
Field on LC pins
3.2.1.5 Proximity Activation (PXMA)
Enabling the Proximity Activation configuration option allows the HCS473 to transmit a hopping code trans­mission in response to detecting an appropriate wake­up pulse on an LC input pin.
The HCS473 sends a wake-up sequence Acknowl­edge in response to detecting the LF field (Figure 3-
11). The device then waits T edge followed by the normal T transponder command to begin. If no command is received, a code hopping transmission is generated and the minimum code words (set with MTX option) are transmitted. When the transmission completes, the HCS473 waits a T begin. If no command is received the device returns to SLEEP.
Proximity activations are not repeatedly activated when the device is in the presence of a continuous LF field (computer monitor, tv,...). The HCS473 must receive an appropriate wake-up sequence to activate each trans­mission.
The button status used in the proximity activated code hopping transmission clears the S0, S1, S2 and S3 but­ton status flags.
CMD window for a new command to
CMD for the LF field’s falling
CMD window waiting for a
LC Output
Level
Signal
TDAMP
Damping Pulses
3.2.1.7 Response Options (RFRSP, LCRSP)
HCS473 responses may optionally be returned on the DATA pin for long-range RF responses and/or LC pins for short-range LF responses (Table 3-4). Responses include both Acknowledge sequences and data responses.
The options controlling the response path are:
• LC response option (LCRSP)
• RF response option (RFRSP)
If both RF and LF responses are enabled, Acknowl­edge pulses will occur simultaneously on the DATA and LC pins; using the LF Figure 3-19). Data responses will not occur simulta­neously. The RF response on the DATA pin will occur first (following the designated Encoder mode format), immediately followed by the LF response on the LC pins (Figure 3-20).
TE baud rate (Figure 3-11,
DS40035C-page 20 Preliminary  2002 Microchip Technology Inc.
HCS473
TABLE 3-4: HCS473 RESPONSE OPTIONS
RFRSP LCRSP Description
00No response 01Response over the LC pins 10Response through the DATA pin 11Response through the DATA pin
first and then the LC pins
3.2.1.8 Skip Field Acknowledge (SKIPACK)
The initial Field Acknowledge sequence, occurring dur­ing the wake-up pulse, may be disabled by enabling the Skip Field Acknowledge configuration option (SKI­PACK=1). Omitting the ACK slightly minimizes a HCS473’s average communication current draw, but conversely will increase average authentication time as the wake-up pulse must then be the maximum start-up
SF
filter charge time, T
MAX
.
3.2.2 TRANSPONDER COMMUNICATION
Data to and from the HCS473 is always sent Least Sig­nificant bit first. The data length and modulation format vary with the particular command sequence and the transmission path.
3.2.2.1 LC Communication Format
Commands from the transponder reader to the HCS473 as well as the responses from the HCS473 over the low frequency path (LC pins) are Pulse Posi­tion Modulated (PPM) according to Figure 3-10.
Communication from the transponder reader to a HCS473 is via the reader amplitude shifting a 125kHz low frequency (LF) field.
LF responses back to the transponder reader are achieved by the HCS473 applying a low-resistance short from the LC pins to LCCOM (configuration option LCRSP enables LF talkback). This short across the antenna inputs is detected by the reader as a load on its 125kHz transmitting antenna.
See Section 5.4 for further details on inductive commu­nication principles.
FIGURE 3-10: LC PIN PULSE POSITION
MODULATION (PPM)
‘0’
125kHz
1LF
TE
1LF
TE
Digital
Representation
START or
previous bit
‘1’
125kHz
Digital
Representation
2LF
TE
1LF
TE
3.2.2.2 RF DATA Communication Format
The RF responses on the DATA pin vary with the infor­mation being returned.
• Acknowledge responses are based on the LF
• Data code words responses are based on the RF
TE, using the format determined by the
Encoder mode options, Section 3.1.4.
TE.
3.2.2.3 Wake-up Sequence
The transponder reader initiates each communication sequence by turning on the low frequency field, then waits for a HCS473 to Acknowledge the field.
The HCS473 enters Transponder Mode after detecting a signal on any LC low frequency antenna input pin that has remained high for at least the start-up filter time
SF, Table 7-5. The device then responds with a Field
T Acknowledge sequence indicating that it has detected the LF field, is in Transponder Mode and is ready to receive commands (Figure 3-11). The wake-up pulse’s falling edge must then occur within T the Field Acknowledge sequence.
The Field Acknowledge sequence may optionally be disabled by enabling the Skip Field ACK configuration option, Section 3.2.1.8.
In both cases, the first command bit must begin within
CMD of the wake-up pulse’s falling edge or the
T HCS473 will return to Low Power mode.
CMD of the end of
2002 Microchip Technology Inc. Preliminary DS40035C-page 21
HCS473
FINH should be appropriately adjusted to receive con-
3.2.2.4 Command Sequence
The transponder reader follows the HCS473’s Field Acknowledge by sending the desired 3-bit command, 3-bit option or address, associated data and CRC; each as required. LF commands are Pulse Position Modulated (PPM) as shown in Figure 3-10. The last bit (CRC bit) should be followed by leaving the field on for
FINH.
T
FIGURE 3-11: HCS473 TRANSPONDER WAKE-UP SEQUENCE
SKIPACK = 0 - Field Acknowledge sent when device wakes
T secutive commands or LF responses. See Section 3.2.4 and Section 3.2.5 for LF response and consecutive command considerations.
125kHz Field
(on LC pins)
Simultaneous LF
Acknowledge
(LFRSP=1)
TSF
Inductive
(LC)
3LFTE 3LFTE3LFTE 3LFTE
RF
Response
(DATA)
RF Acknowledge
(RFRSP=1)
SKIPACK = 1 - Field Acknowledge is not sent
Inductive
(LC)
TCMD
TSF
MAX
Command
bit0
bit1
TCMD
bit2
Command
bit0
bit1
TCMD
bit2
Communication from reader to HCS473
Communication from HCS473 to reader
DS40035C-page 22 Preliminary  2002 Microchip Technology Inc.
3.2.3 TRANSPONDER COMMANDS
TABLE 3-5: LIST OF AVAILABLE TRANSPONDER COMMANDS
Command Option Description
Select Transponder
(Section 3.2.3.1)
000
2
Present Transport Code
(Section 3.2.3.2)
001
2
Identify Friend or Foe (IFF)
(Section 3.2.3.3)
010
2
Read EEPROM
(1)
(Section 3.2.3.4)
100
2
Write EEPROM
(1) (2)
(Section 3.2.3.5)
101
2
Request Hopping Code
(Section 3.2.3.6)
110
2
- Select HCS473, used to isolate communication to a single HCS473
(1)
- Used to gain write access to the device EEPROM memory locations
(1)
000 001 010 011
000 001 010 011 100 101 110
111
000 001 010 011 100 101 110
111
(1)
32-bit IFF using the Transponder Key
2
16-bit IFF using the Transponder Key
2
32-bit IFF using the Encoder Key
2
16-bit IFF using the Encoder Key
2
Read 16-bit User EEPROM 0
2
Read 16-bit User EEPROM 1
2
Read 16-bit User EEPROM 2
2
Read 16-bit User EEPROM 3
2
Read Most Significant 16 bits of the Serial Number
2
Read Least Significant 16 bits of the Serial Number
2
Read 16-bit Device Identifier #1 (12-bit Vehicle ID #1 and 4-bit Token ID #1)
2
Read 16-bit Device Identifier #2 (12-bit Vehicle ID #2 and 4-bit Token ID #1)
2
Write 16-bit User EEPROM 0
2
Write 16-bit User EEPROM 1
2
Write 16-bit User EEPROM 2
2
Write 16-bit User EEPROM 3
2
Write Most Significant 16 bits of the Serial Number
2
Write Least Significant 16 bits of the Serial Number
2
Write 16-bit Device Identifier #1 (12-bit Vehicle ID #1 and 4-bit Token ID #1)
2
Write 16-bit Device Identifier #2 (12-bit Vehicle ID #2 and 4-bit Token ID #1)
2
- Request Hopping Code transmission
HCS473
Anticollision OFF
(Section 3.2.3.7)
111
2
- Temporarily bypass a HCS473’s anticollision requirements.
Note 1: Command must be preceded by successful Select Transponder or Anticollision Off sequence if anticolli-
sion is enabled.
2: A successful Present Transport Code sequence must first occur to gain write access.
2002 Microchip Technology Inc. Preliminary DS40035C-page 23
HCS473
3.2.3.1 SELECT TRANSPONDER
The SELECT TRANSPONDER sequence must imme­diately follow the HCS473 wake-up. A 12-bit Vehicle ID (VID) follows the 3-bit command. The 4-bit Token ID (TID) is sent by pulsing the field to identify which tran­sponder should respond.
The HCS473 counts each time the field is pulsed (6
TE period), the first pulse setting the counter equal to
LF
0. If the VID matched, the HCS473 will send an Acknowledge when the TID matches the counter. Any further TID pulses after the Acknowledge occurs will
Any HCS473 that did not match both the presented VID and TID will return to SLEEP, unselected, remaining that way until the next wake-up pulse occurs.
The next command must begin T Acknowledge. If the LC input is high a point T after the Acknowledge ends, the HCS473 will return to SLEEP, unselected, assuming the transponder reader is sending additional TID pulse(s) to select a different device. A device of any TID value may therefore be uniquely selected, regardless if a device with lower TID has already acknowledged.
deselect the device, putting it back to SLEEP - again requires a wake-up sequence to communicate.
FIGURE 3-12: TRANSPONDER SELECT SEQUENCE (RF RESPONSE EXAMPLE)
1-16
Pulses
TID
TID=0
TID=1 TID=2 TID=3
6 LF
TE
T
TSCMD
ACK
T
TSACK
5 LF
TE
T
TSCMD
Transponder Select ACK
Example for TID=’0011’
‘XXX’
CMD
Next
Command
bit0
bit1
bit2
Inductive In
(LC Pins)
RF Response
(DATA Pin)
T
SF
WAKE ACK
T
CMD
ACK
T
CMD
Command
‘0’
‘0’
LSb
T
CMD
‘0002’ CMD VID
12-Bit
‘0’
bit0
LSb
MSb
VID
bit1
12 bits
bit10
bit11
MSb
TSCMD after the
TSCMD
MIN
16-bit Device Identifier = [ 12-bit Vehicle ID ] [ 4-bit Token ID ]
bit5
bit6
bit7
bit8
bit9
bit10
bit11
bit12
bit13
bit14
bit15
MSb
DID
bit4
bit3
bit2
bit1
bit0
LSb
bit11
MSb
bit10
bit5
bit6
bit7
bit8
bit9
bit1
bit2
bit3
bit4
bit0
LSb
bit3
TIDVID
MSb
bit2
bit1
bit0
LSb
DS40035C-page 24 Preliminary  2002 Microchip Technology Inc.
HCS473
3.2.3.2 PRESENT TRANSPORT CODE
Prior to modifying the device EEPROM, the correct 32­bit transport code (password) must be presented to gain write access. This is done with the PRESENT TRANSPORT CODE command followed by the 32-bit transport code and CRC calculated on the 3-bit com­mand and 32 bits of data.
The HCS473 will return an Acknowledge if the trans­port code matches the value programmed in produc­tion; write access has been granted.
The next command (usually a write) must begin T
CMD
after the Acknowledge, Figure 3-13.
FIGURE 3-13: PRESENT TRANSPORT CODE SEQUENCE (RF RESPONSE EXAMPLE)
The present transport code sequence must precede a write sequence but not necessarily immediately. Per­haps all four user memory locations will be written and verified. The present transport code sequence must precede only the first write to gain write access. The system may then alternately write and read (verify) multiple memory locations. Write access remains until the next time the device returns to Low Power mode ­communication error or T
CMD time out without receiving
another command.
Wake Sequence
Previous Command
Inductive In
(LC Pins)
RF Response
(DATA Pin)
or
Response
T
SF
ACK
T
CMD
T
CMD
Command
T
CMD
‘0012’
32 bits
CMD TCODE
32-Bit
Transport
‘1’
‘0’
‘0’
bit0
bit1
MSb
LSb
LSb
bit30
bit31
MSb
T
TPACK
2 bits
CRC
CRC
CRC0
CRC1
LSb
MSb
Transport ACK
ACK
T
FINH
5 LF
T
WRITE Sequence
CMD
CMD ADR DATA
bit2
16-Bit
Write Data
bit0
bit1
bit14
bit15
Write
Command
‘1’
T
CMD
T
CMD
TE
Address
‘0’
‘1’
bit0
bit1
2002 Microchip Technology Inc. Preliminary DS40035C-page 25
HCS473
3.2.3.3 IFF CHALLENGE AND RESPONSE
The HCS473 can perform a 16-bit or 32-bit challenge and response (IFF) based on the K algorithm.
The transponder reader follows the 3-bit IFF command with one of four possible options indicating a 16 or 32­bit challenge and whether to use the encoder or tran­sponder crypto key to create the response (Table 3-5).
The 3-bit option is followed by the appropriate 16 or 32­bit challenge; typically a random number. The sequence ends with a CRC calculated over the com­mand, option and challenge bits, (Figure 3-14).
The HCS473 encrypts the challenge using the desig­nated crypto key and responds with a 32-bit result. The reader authenticates the response by decrypting it and verifying it matches the original challenge.
EELOQ encryption
If 16-bit IFF is selected, the 32-bit response consists of two copies of the 16-bit challenge.
RFRSP determines if the response will be transmitted on the DATA pin. If enabled, the response will follow the selected Encoder mode code hopping format with the hopping code replaced with the 32-bit response. The transmissions will contain a button code of ‘0000’.
LFRSP determines if the response will be transmitted on the LC pins. The LC pin response will be the 32-bit result, modulated PPM format.
If both RFRSP and LFRSP are enabled, the HCS473 will send the response on the DATA pin immediately fol­lowed by the PPM response on the LC pins. Refer to Section 3.2.1.7 for further response path details.
The next command must begin T response.
FIGURE 3-14: IFF SEQUENCE (RF RESPONSE EXAMPLE)
Wake Sequence
or
Previous Command
Response
T
‘0102’3 bits
CMD
CMD OPT CHAL
OptionCommand
16/32
bits
16/32-Bit
Challenge
2 bits
CRC
CRC
T
IFF
RESPONSE
TCMD
CMD after the
Optional Next
Command
Inductive In
(LC Pins)
RF Response
(DATA Pin)
T
SF
T
CMD
ACK
T
‘0’
LSb
CMD
‘1’
‘0’
MSb
bit0
LSb
bit1
bit2
MSb
LSb
bit0
bit1
CRC0
bit15/31
LSb
MSb
CRC1
MSb
LF must remain on if following
with consecutive command or if waiting for LF response
T
FINH
T
IFF
RF Response (RFRSP=1)
Preamble
Header
(32 bits)
IFF Response
Fixed Code
DS40035C-page 26 Preliminary  2002 Microchip Technology Inc.
HCS473
3.2.3.4 READ Command
The transponder reader follows the 3-bit READ com­mand with one of eight possible 3-bit address options indicating which 16-bit EEPROM word to retrieve (Table 3-5) and a 2-bit CRC calculated over the com­mand and address bits.
The HCS473 retrieves the data and returns the 16-bit response by creating a 32-bit value containing two cop­ies of the response (Figure 3-15).
RFRSP determines if the response will be transmitted on the DATA pin. If enabled, the response will follow the selected Encoder mode code hopping format with the hopping code replaced with the 32-bit response. The transmissions will contain a button code of ‘0000’.
LFRSP determines if the response will be transmitted on the LC pins. The LC pin response will be the 32-bit result, modulated PPM format.
If both RFRSP and LFRSP are enabled, the HCS473 will send the response on the DATA pin immediately fol­lowed by the PPM response on the LC pins. Refer to Section 3.2.1.7 for further response path details.
The following locations are available to read:
• The 64-bit general purpose user EEPROM.
• The 32-bit serial number. The serial number is also transmitted in each code hopping transmis­sion.
• The16-bit device identifiers #1 and #2.
The next command must begin T response.
FIGURE 3-15: READ SEQUENCE (RF RESPONSE EXAMPLE)
Wake Sequence
or
Previous Command
Response
T
‘1002’ 3 bits 2 bits
CMD
CMD ADR CRC
TREAD
AddressCommand
CRC
RESPONSE
TCMD
CMD after the read
Optional Next
Command
Next
Command
Inductive In
(LC Pins)
RF Response
(DATA Pin)
T
SF
T
CMD
ACK
‘0’
‘0’
‘1’
LSb
MSb
T
CMD
LSb
bit0
bit1
bit2
MSb
CRC0
LSb
CRC1
MSb
T
LF must remain on if following
with consecutive command or if waiting for LF response
T
FINH
READ
RF Response (RFRSP=1)
Preamble
Header
bit0
bit1
bit2
T
CMD
T
CMD
(32 bits)
Read Data
Fixed Code
2002 Microchip Technology Inc. Preliminary DS40035C-page 27
HCS473
3.2.3.5 WRITE Command
The transponder reader follows the 3-bit WRITE com­mand with one of eight possible 3-bit address options indicating which 16-bit EEPROM word to write to (Table 3-5) and a 2-bit CRC calculated over the com­mand, address and data bits.
The HCS473 will attempt to write the value into EEPROM, responding with an Acknowledge sequence if successful (Figure 3-15).
The following locations are available to write:
• The 64-bit general purpose user EEPROM.
• The 32-bit serial number.
• The16-bit Device Identifiers #1 and #2. A Transport Code, write access password, protects the
memory locations from undesired modification. The
cessful PRESENT TRANSPORT CODE sequence. Only a correct match with the transport code pro­grammed during production will allow write access to the memory locations.
The next command must begin T Acknowledge.
The PRESENT TRANSPORT CODE sequence must precede a WRITE sequence but not necessarily imme­diately. Perhaps all four user memory locations will be written and verified. The PRESENT TRANSPORT CODE sequence must precede only the first write. The system may then alternately write and read (verify) multiple memory locations. Write access status remains until the next time the device returns to sleep ­communication error or T command.
reader must precede the Write sequence with a suc-
FIGURE 3-16: WRITE SEQUENCE (RF RESPONSE EXAMPLE)
Previous Command
Sequence
T
CMD
‘1012’ 3 bits 16 bits CMD ADR DATA
AddressCommand
2 bits
CRC
16-Bit
Write Data
CRC
T
WRT
CMD after the write
CMD without receiving another
ACK
TCMD
Optional Next
Command
Next
Command
Previous Command
Inductive In (LC Pins)
RF Response
(DATA Pin)
Sequence
T
CMD
‘1’
LSb
T
CMD
‘0’
‘1’
MSb
bit0
LSb
bit1
bit2
MSb
bit0
LSb
bit1
bit14
bit15
MSb
CRC0
LSb
LF must remain on if following
CRC1
MSb
with consecutive command
or if waiting for LF response
T
FINH
T
WRT
5 LF
TE
Write ACK
T
CMD
bit0
T
CMD
bit1
bit2
DS40035C-page 28 Preliminary  2002 Microchip Technology Inc.
HCS473
3.2.3.6 REQUEST HOPPING CODE COMMAND
The REQUEST HOPPING CODE command tells the HCS473 to increment the synchronization counter and build the 32-bit code hopping portion of the encoder code word.
A delay of T the counter (updating EEPROM values) and encrypts the response.
RFRSP determines if the response will be transmitted on the DATA pin. If enabled, the response will be a sin­gle KEELOQ code hopping code word, based on
HOP occurs while the HCS473 increments
Encoder mode options. The code word will contain a button code of ‘0000
’, indicating the transmission did
2
not result from a button press. LFRSP determines if the response will be transmitted
on the LC pins. The LC pin response will be the 32-bit hopping portion of the code word, modulated PPM for­mat.
If both RFRSP and LFRSP are enabled, the HCS473 will send the response on the DATA pin immediately fol­lowed by the PPM response on the LC pins. Refer to Section 3.2.1.7 for further response path details.
The next command must begin T
CMD after the code
hopping response.
FIGURE 3-17: REQUEST HOPPING CODE SEQUENCE (RF RESPONSE EXAMPLE)
Wake Sequence
Previous Command
Response
Inductive In
(LC Pins)
RF Response (DATA Pin)
or
T
SF
ACK
T
T
CMD
CMD
Command
T
‘1102’2 bits CMD CRC
CRC
‘0’
‘1’
‘1’
CRC0
CRC1
LSb
CMD
LSb
MSb
MSb
T
FINH
T
HOP
THOP
RESPONSE
LF must remain on if following
with consecutive command or if waiting for LF response
RF Response (RFRSP=1)
TCMD
Optional Next
Command
T
CMD
Next
Command
bit0
bit1
T
CMD
bit2
Header
Preamble
(32 bits)
Hop Code
Fixed Code
2002 Microchip Technology Inc. Preliminary DS40035C-page 29
HCS473
3.2.3.7 ANTI-COLLISION OFF
Anticollision is enabled/disabled for a given device by the ACOL configuration option. The ANTICOLLISION OFF command may be used to temporarily bypass anticollision requirements for a single communication sequence. It allows communication to an anticollision enabled HCS473 if the VID and TID are not known (perhaps during a learning sequence).
The command must immediately follow the wake-up sequence, Figure 3-18. The HCS473 acknowledges the command receipt, then reacts to all commands
even if the anticollision (ACOL) configuration option is enabled and a SELECT TRANSPONDER sequence has not been performed.
The next command must begin T Acknowledge.
The HCS473 remains in this anticollision off state until the next time the device returns to SLEEP - communi­cation error or T
CMD without receiving another com-
mand. Multiple commands may therefore be sent without sending the ANTICOLLISION OFF command prior to each command.
FIGURE 3-18: ANTICOLLISION OFF SEQUENCE (RF RESPONSE EXAMPLE)
Inductive In
(LC Pins)
RF Response
(DATA Pin)
WAKE ACK
T
SF
ACK
T
CMD
T
CMD
Command
LSb
T
CMD
‘1112’2 bits CMD CRC
CRC
‘1’
‘1’
‘1’
CRC0
LSb
MSb
T
AOACK
ACOL Off ACK
CRC1
T
MSb
5 LF
ACK
FINH
TE
TCMD
T
CMD
‘XXX’
CMD
Next
Command
bit0
bit1
T
CMD
bit2
CMD after the
Next
Command
3.2.4 LF RESPONSE CONSIDERATIONS
As LF responses are transmitted by the HCS473 plac­ing a short across the LC antenna inputs, dissipating the antenna resonance, the transponder reader must still be sending the 125 kHz field for LF responses to work. The low frequency field on-time (T
FINH) must
therefore be approriately adjusted to receive an LF Acknowledge sequence or LF data response, Figure 3­19 and Figure 3-20.
3.2.5 CONSECUTIVE COMMAND CONSIDERATIONS
Transponder commands may consecutively follow one another to minimize communication time as the wake­up sequence, device selection, anticollision off and transport code presentation need not be repeated for every command.
Consideration must be given to how long the transpon­der reader keeps the LF signal on after the last data bit’s rising edge (T
• will be followed by another command sequence
• will result in a LF response
FINH) when a command sequence...
The reason is that the HCS473’s analog LF antenna input circuitry will return to Low-power mode when the 125 kHz field remains absent; requiring a new wake-up sequence to continue communication.
The HCS473’s analog section will never return to Low­power mode during any T
CMD window waiting for an LC
input communication edge, so long as the LF signal existed up to the beginning of the T
CMD window.
Please refer to Figure 3-19 and Figure 3-20 for exam­ples on adjusting T
FINH for consecutive commands and
LF responses.
3.2.6 LF COMMUNICATION ANALOG DELAYS
LF communication edge delays result from the HCS473’s internal analog circuit as well as the external LC resonant antennas, Figure 3-21.
The rising and falling edge delays inherent to the HCS473’s internal filtering are known and specified in
FILTR
Tab l e 7 - 5, T
and TFILTF
The cumulative rising and falling edge delays inherent to both the series LC transmitting antenna and parallel LC receiving antennas are design dependent, not a HCS473 specification.
.
DS40035C-page 30 Preliminary  2002 Microchip Technology Inc.
HCS473
Table 7-5 timing values are compensated only for HCS473 internal filter delays. The transponder reader designer must compensate communication timing accordingly for the cumulative antenna delays.
Use LF Demodulator mode to see the effects of the internal filters and the LC antennae, Section 3.2.1.2.
It must be clearly understood that the HCS473 core does not see the LF field immediately upon the base station turning it on, nor does it immediately detect its removal. If the internal analog delay and cumulative antenna delays are greater than a given low time, the HCS473 will obviously never “see” the low.
FIGURE 3-19: LF ACK RESPONSE ADJUSTMENTS (LFRSP=1)
Transponder Select Sequence
Command
12-Bit
VID
Inductive
(LC Pins)
LSb
LSb
MSb
T
CMD
RF Response
(DATA Pin)
Present Transport Code Sequence
Command
32-Bit
Transport
TID=0
MSb
6 LF
CRC
TID=1 TID=2
TE
Simultaneous
LF ACK
Simultaneous
LF ACK
T
TSACK
T
TSCMD
5 LF
Transponder Select ACK
TE
Next
Command
Next
Command
Inductive (LC Pins)
LSb
T
CMD
LSb
MSb
RF Response
(DATA Pin)
Write Sequence
Inductive
(LC Pins)
LSb
MSb
T
CMD
RF Response
(DATA Pin)
Anticollision Off Sequence
Command
Inductive (LC Pins)
RF Response
(DATA Pin)
LSb
T
CMD
AddressCommand
LSb
MSb
CRC
LSb
T
AOACK
LSb
MSb
MSb
T
TPACK
Transport ACK
16-Bit
Write Data
LSb
MSb
Simultaneous
LF ACK
T
FINH
MSb
5 LF
TE
ACOL Off ACK
T
5 LF
T
FINH
CMD
TE
MSb
T
CMD
CRC
LSb
MSb
Next
Command
T
CMD
T
CMD
T
WRT
Simultaneous
LF ACK
T
FINH
5 LF
TE
Write ACK
T
CMD
Next
Command
T
CMD
2002 Microchip Technology Inc. Preliminary DS40035C-page 31
HCS473
FIGURE 3-20: LF DATA RESPONSE ADJUSTMENTS (LFRSP=1)
IFF, Read and Request Hop
CRC
Inductive
(LC Pins)
RF Response (RFRSP=1)
RF Response
(DATA Pin)
Header
Preamble
(32 bits)
Response
FIGURE 3-21: LF COMMUNICATION ANALOG DELAYS
Digital Representation
of Communication from
Transponder Reader
Resulting 125 kHz on
Transponder Reader
Antenna (TX)
Bit ‘1’, 200 µs LF
600
TE
µs
32-Bit LF Response (LFRSP=1)
LSb
1 LF
TE
(37 bits)
Fixed Code
Bit ‘0’, 200 µs LF
400
Next
Command
T
MSb
T
FINH
T
CMD
TE
µs
CMD
Resulting 125 kHz on
Transponder Card
Antenna (RX)
T
ANTR
Resulting digital signal
processed by
after analog filter
HCS473,
T
FILTR
3.2.7 RECEIVE STABILITY ­CALCULATING COMMUNICATION
TE
The HCS473’s internal oscillator may vary ±10% over the device’s rated voltage and temperature range for commercial temperature devices. A certain percentage of industrial temperature devices vary further on the slow side, -20%, when used at higher voltages (V
3.5V) and cold temperature. When the internal oscilla-
tor varies, both its transmitted T
E and expected TE
when receiving will vary. The HCS473 receive capability is ensured over a ±10%
oscillator variance, with receive capability no longer robust as oscillator variance approaches ±15%. Indus­trial devices operating at V
DD voltages greater than
3.5V (and cold temperature) are therefore not guaran-
teed to be able to properly receive when communicated to using an exact T
E. When designing for these specific
operating conditions, the system designer must imple­ment a method to adjust communication timing to the speed of the HCS473.
DD >
600
T
ANTF
T
FILTF
µs
400
µs
Communication reliability with the transponder may be improved by the transponder reader calculating the HCS473’s T
E from the Field Acknowledge sequence
and using this exact time element in communication to and in reception routines from the transponder.
Always begin and end the time measurement on rising edges. Whether LF or RF, the falling edge decay rates may vary but the rising edge relationships should remain consistent. A common T would be to time an 8T
E sequence from the first Field
E calculation method
Acknowledge, then divide the value down to determine the single T
E value. An 8 TE measurement will give
good resolution and may be easily right-shifted (divide by 2) three times for the math portion of the calculation (Figure 3-22).
DS40035C-page 32 Preliminary  2002 Microchip Technology Inc.
FIGURE 3-22: Calculating Communication TE
SKIPACK = 0 - Field Acknowledge sent when device wakes
HCS473
125 kHz Field
(on LC pins)
Inductive
(LC)
RF
Response
(DATA)
Communication from reader to HCS473
Communication from HCS473 to reader
Simultaneous LF
Acknowledge
TSF
(LFRSP=1)
8LFTE
3LFTE 3LFTE3LFTE 3LFTE
8LF
TE
RF Acknowledge
(RFRSP=1)
TCMD
3.2.8 RFEN DURING LF COMMUNICATION (Figure 3-23)
3.2.8.1 Wake-up Sequence
The wake-up Acknowledge sequence has the shortest, but fixed, PLL setup time, 1LF
TE.
3.2.8.2 Transponder Select Sequence
PLL setup occurs on the rising edge of the first VID bit in anticipation of the TID Acknowledge. The setup time before the ACK begins is therefore a function of...
• LF baud rate
• VID value
• TID value
Command
bit0
bit1
bit2
TCMD
3.2.8.4 Data Response Sequences Concluding with CRC
Command sequences ending with CRC bits and expecting data response (code hopping word) have a similar PLL setup sequence. This includes “IFF”, “Read” and “Request Hopping Code”.
PLL setup occurs on the rising edge of the first CRC bit in anticipation of the data transmission. The setup time is therefore a function of...
• LF baud rate
• CRC value
• Response time: T
IFF, TREAD, THOP.
3.2.8.3 ACK Response Sequences Concluding with CRC
Command sequences ending with CRC bits and expecting an Acknowledge response have a similar PLL setup sequence. This includes “Present Transport Code”, “Write” and “Anticollision Off”.
PLL setup occurs on the rising edge of the first CRC bit in anticipation of the Acknowledge. The setup time is therefore a function of...
• LF baud rate
• CRC value
• Response time: T
2002 Microchip Technology Inc. Preliminary DS40035C-page 33
TPACK, TWRT, TAOACK.
HCS473
FIGURE 3-23: RFEN BEHAVIOR DURING LF COMMUNICATION
Wake-up Sequence
TSF
TCMD
Command
Inductive In (LC)
1 LF
TE
ASK
RF (DATA)
PLL (RFEN)
FSK
RF (DATA)
PLL (RFEN)
Transponder Select Sequence
TID=012-Bit VID TID=1 TID=2 TID=3
Inductive In (LC)
ASK
RF (DATA)
PLL (RFEN)
FSK
RF (DATA)
PLL (RFEN)
ACK Response Sequences Concluding with CRC
- Present Transport Code
- Write
- Anticollision Off
CRC
1 LF
TE
TCMD
Next
Command
1 LF
TE
Command
Inductive In (LC)
ASK
Response
Time
RF (DATA)
PLL (RFEN)
FSK
RF (DATA)
PLL (RFEN)
Data Response Sequences Concluding with CRC
- IFF
- Read
- Request Hopping Code
CRC
Inductive In (LC)
ASK
Response
Time
RF (DATA)
PLL (RFEN)
FSK
RF (DATA)
PLL (RFEN)
1 LF
TE
Command
DS40035C-page 34 Preliminary  2002 Microchip Technology Inc.
3.3 CONFIGURATION SUMMARY
TABLE 3-6: CONFIGURATION SUMMARY
HCS473
Symbol Address: Bits Description
(1)
Reference
Section
USR 0 00: 16 bits User EEPROM Area 3.2.3.4, USR 1 02: 16 bits User EEPROM Area
3.2.3.5
USR 2 04: 16 bits User EEPROM Area USR 3 06: 16 bits User EEPROM Area SER 08: 32 bits Encoder Serial Number DEVID 1 0C: 16 bits Device Identifier #1 - Vehicle/Token ID Number #1 3.2.1.4 DEVID 2 0E: 16 bits Device Identifier #2 - Vehicle/Token ID Number #2 IFF KEY 10: 64 bits IFF Key 3.2.3.3 COUNT 18: 64 bits Encoder Synchronization Counter and Checksum 1.2.3 KEY 20: 64 bits Encoder Key SEED 28: 60 bits Encoder Seed Value 3.1.2.2 TCODE 30: 32 bits Transport Code 3.2.3.2 DISC 34: 10 bits Encoder Discrimination Value 3.1.8 RFEN 36: 7-------RF Enable Pin 0 - S3 1 - RF Enable 3.1.4.8 PLLSEL 36: -6------PLL Interface Select 0 - ASK 1 - FSK 3.1.4.7 VLOWSEL 36: --5-----Low Voltage Trip Point Select
0 - 2.2V 1 - 3.3V 3.1.4.6
(2)
CNTSEL 36: ---4----Counter Select 0 - 16 bits 1 - 20 bits 3.1.4.5 QUEN 36: ----3---Queue Counter Enable 0 - Disable 1 - Enable 3.1.4.4 XSER 36: -----2--Extended Serial Number 0 - 28 bits 1 - 32 bits 3.1.4.3 HSEL 36: ------1-Header Select
(1)
0 - 4 TE 1 - 10 TE 3.1.4.2 MSEL 36: -------0Modulation Format 0 - PWM 1 - Manchester 3.1.4.1 SDMD 37: 7-------Seed Mode 0 - User 1 - Production 3.1.4.12 SDLM 37: -6------Limited Seed 0 - Unlimited 1 - Limited 3.1.4.11 SDTM 37: --54----Time Before Seed code word
(1)
Value Time (s) 3.1.4.10
00 01 10
11
2
2
2
2
0.0
0.8
1.6
3.2 SDBT 37: ----3210Seed Button Code Bit order = S3-S2-S1-S0 3.1.4.9 TSEL 38: 76------Timeout Select
(1)
Value Time (s) 3.1.4.16
00 01 10
11
2
2
2
2
4
8 16 32
MTX 38: --54----Minimum Code Words Value Value 3.1.4.15
00 01 10
11
2
2
2
2
1
2
4
8
2002 Microchip Technology Inc. Preliminary DS40035C-page 35
HCS473
TABLE 3-6: CONFIGURATION SUMMARY
Symbol Address: Bits Description
GSEL 38: ----32--Guard Time Select
RFBSL 38: ------10RF Transmission Baud Rate
Select
(1)
(1)
(1)
Value Time (ms) 3.1.4.14
00 01 10 11
2
2
2
2
0.0
6.4
51.2
102.4
Value TE (µs) 3.1.4.13
00 01 10 11
2
2
2
2
100 200 400 800
Reference
Section
LFDEMOD 39: 7-------LF Demodulator 0 - Normal 1 - Demod 3.2.1.2 TPLS 39: ----3---Transponder Preamble Length 0 - Normal 1 - Short 3.2.1.1 PRD 39: -----2--Preamble Duty Cycle LPRL 39: ------1-Long Preamble Length
(1)
(1)
0 - 33% 1 - 50% 3.1.4.19
0 - 75ms 1 - 100ms 3.1.4.18
LPRE 39: -------0Long Preamble Enable 0 - Disable 1 - Enable 3.1.4.17 SKIPACK 3A: 7-------Skip First ACK 0 - Disable 1 - Enable 3.2.1.8 RFRSP 3A: -6------RF Response 0 - Disable 1 - Enable 3.2.1.7 LCRSP 3A: --5-----LC Response 0 - Disable 1 - Enable 3.2.1.7 DAMP 3A: ---4----Intelligent LC Damping 0 - Disable 1 - Enable 3.2.1.6 PXMA 3A: ----3---Proximity Activation 0 - Disable 1 - Enable 3.2.1.5 ACOL 3A: -----2--Anticollision 0 - Disable 1 - Enable 3.2.1.4 LFBSL 3A: ------10LF Transmission Baud Rate
Select
(1)
Value TE (µs) 3.2.1.3
00 01 10 11
2
2
2
2
100 200 400 800
END 3F 01011010 Unused, always set = 5A
Note 1: All Timing values vary ±10%. Industrial temperature devices operating at cold and 3.5V < V
DD < 5.5V vary
+10%, -20%.
2: Voltage thresholds should be ±250 mV for the low voltage range and ±400 mV for the high voltage range.
DS40035C-page 36 Preliminary  2002 Microchip Technology Inc.
4.0 PROGRAMMING SPECIFICATION
The HCS473 programming specification is extensively covered in document DS41163 and will not be dupli­cated here.
HCS473
2002 Microchip Technology Inc. Preliminary DS40035C-page 37
HCS473
NOTES:
DS40035C-page 38 Preliminary  2002 Microchip Technology Inc.
HCS473
5.0 INTEGRATING THE HCS473 INTO A SYSTEM
Use of the HCS473 in a system requires a compatible decoder. This decoder is typically a microcontroller with a low frequency coil antenna and radio frequency receiver. Example firmware routines that accept and decrypt K tion Notes and the K
5.1 Training the Receiver
In order for a transmitter to be used with a decoder, the transmitter must first be ‘learned’. When a decoder learns a transmitter, it is suggested that the decoder stores the serial number and current synchronization value in EEPROM. Some learning strategies have been patented and care must be taken not to infringe on them. The decoder must keep track of these values for every transmitter that is learned (see Figure 5-1).
The maximum number of transmitters that can be learned is limited only by the available EEPROM memory. The decoder must also store the manufac­turer’s code in order to learn a transmitter. This value will not change in a typical system, so it is usually stored as part of the microcontroller ROM code. Storing the manufacturer’s code as part of the ROM code improves security by keeping it off the external bus to the EEPROM.
EELOQ transmissions can be found in Applica-
EELOQ license disk.
FIGURE 5-1: TYPICAL LEARN
SEQUENCE
Enter Learn
Mode
Wait for Reception
of a Valid Code & Seed
Generate Key
Use Generated Key
to Decrypt
Compare Discrimination
Value with Fixed Value
Equal
?
Yes
Wait for Reception
of Second Valid Code
(Optional)
Counters
Sequential
?
Yes
Learn Successful Store:
Serial Number
Encoder Key
Synchronization Counter
No
No
Learn
Unsuccessful
Exit
5.2 Decoder Operation
In a typical decoder operation (Figure 5-2), the key generation on the decoder side is performed by taking the serial number from a transmission and combining that with the manufacturer’s code to create the same secret key that was used by the transmitter. Once the secret key is obtained, the rest of the transmission can be decrypted. The decoder waits for a transmission and immediately can check the serial number to determine if it is a learned transmitter. If it is, the encrypted portion of the transmission is decrypted using the stored key. It uses the discrimination bits to determine if the decryption was valid. If everything up to this point is valid, the synchronization value is evaluated.
2002 Microchip Technology Inc. Preliminary DS40035C-page 39
HCS473
FIGURE 5-2: TYPICAL DECODER
OPERATION
Start
No
Transmission
Received
?
Yes
No
Decrypt Transmission
No
No
No
Does
Serial Number
Match
?
Yes
Is
Decryption
Vali d
?
Yes
Is
Counter
Within 16
?
No
Is
Counter
Within 32K
?
Yes
Execute
Command
and
Update
Counter
counter had just gotten out of the single operation ‘win­dow’. Since it is now back in sync, the new synchroni­zation value is stored and the command executed.
If a transmitter has somehow gotten out of the double operation window, the transmitter will not work and must be relearned. Since the entire window rotates after each valid transmission, codes that have been used are part of the ‘blocked’ (32K) codes and are no longer valid. This eliminates the possibility of grabbing a previous code and retransmitting to gain entry.
Note: The synchronization method described in
this section is only a typical implementation and because it is usually implemented in firmware, it can be altered to fit the needs of a particular system
FIGURE 5-3: SYNCHRONIZATION
WINDOW (16-BIT COUNTER)
Entire Window rotates to eliminate use of previously used codes
Blocked
(32K Codes)
Double Operation (32K Codes)
Current Position
Single Operation Window (16 Codes)
Yes
Save Counter
in Temp Location
5.3 Synchronization with Decoder
The technology features a sophisticated synchronization technique (Figure 5-3) which does not require the calculation and storage of future codes. If the stored counter value for that particular transmitter and the counter value that was just decrypted are within a window of 16 codes, the counter is stored and the command is executed. If the counter value was not within the single operation window, but is within the double operation window of 32K codes (when using a 16-bit counter), the transmitted synchronization value is stored in temporary location and it goes back to wait­ing for another transmission.
When the next valid transmission is received, it will check the new value with the one in temporary storage. If the two values are sequential, it is assumed that the
5.4 Inductive Communication
Communication between a base station and a HCS473 transponder occurs via magnetic coupling between the transponder coil and base station coil. The base station coil forms part of a series RLC circuit. The base station communicates to the transponder by switching the 125 kHz signal to the series RLC circuit on and off. Thus, the base station magnetic field is switched on and off. The transponder coil is connected in parallel with a res­onating capacitor (125 kHz) and the HCS473.
When the transponder is brought into the base station magnetic field, it magnetically couples with this field and draws energy from it. This loading effect can be observed as a decrease in voltage across the base sta­tion resonating capacitor. The K communicates to the base station by “shorting out” its parallel LC circuit. This detunes the transponder and removes the load, which is observed as an increase in voltage across the base station resonating capacitor. The base station capacitor voltage is the input to the base station AM demodulator circuit. The demodulator extracts the transponder data for further processing by the base station software.
EELOQ transponder
DS40035C-page 40 Preliminary  2002 Microchip Technology Inc.
HCS473
5.5 Transponder Design
You must initially decide if a ferrite core or an air core antenna will be used. There are advantages and disad­vantages to using each. One advantage of using a fer­rite core is that the coil can have a larger inductance for a given volume. Volume will usually be the primary con­straint as it will need to fit into a:
• key fob
• credit card
• other small package.
First step: choose the transponder coil external dimen­sions because packaging places large constraints on antenna design.
Second step: properties of the core, coil windings, as well as the equivalent load placed across the coil must be determined. Calculations from the first two steps will fix the initial coil specification. The initial coil specifica­tion includes:
• Minimum number of wire turns on the coil
• Wire diameter
• Wire resistance
• Coil inductance
• Required resonating capacitor.
Note: The exact number of turns may be
tweaked such that a standard value reso­nant capacitor may be used.
Build the initial coil and take appropriate measure­ments to determine the coil quality factor. The data gathered to this point may then be used to calculate an Optimum Coil Specification.
It is not this data sheet’s purpose to present in-depth details regarding LC antennae and their tuning. Please refer to “Low Frequency Magnetic Transmitter Design Application Note”, AN232, for appropriate LF antenna design details.
Note: Microchip also has a confidential Applica-
tion Note on Magnetic Sensors (AN832C). Contact Microchip for a Non-Disclosure Agreement in order to obtain this applica­tion note.
5.6 Security Considerations
The strength of this security is based on keeping a secret inside the transmitter that can be verified by encrypted transmissions to a trained receiver. The transmitter's secret is the manufacturer's key, not the encryption algorithm. If that key is compromised, then a smart transceiver can:
• capture any serial number
• create a valid code word
• trick all receivers trained with that serial number.
The key cannot be read from the EEPROM without costly die probing, but it can be calculated by brute force decryption attacks on transmitted code words. The cost for these attacks should exceed what you would want to protect.
To protect the security of other receivers with the same manufacturer's code, you need to use the random seed for secure learn. It is a second secret that is unique for each transmitter. It’s transmission on a special button press combination can be disabled if the receiver has another way to find it, or is limited to the first 127 trans­missions for the receiver to learn it. This way it is very unlikely to ever be captured. Now if a manufacturer's key is compromised, new transmitters can be created. But without the unique seed, they must be relearned by the receiver. In the same way, if the transmissions are decrypted by brute force on a computer, the random seed hides the manufacturer's key and prevents more than one transmitter from being compromised.
The length of the code word at these baud rates makes brute force attacks that guess the hopping code require years to perform. To make the receiver less susceptible to this attack, make sure that you test all the bits in the decrypted code for the correct value. Do not just test low counter bits for sync and the bit for the button input of interest.
The main benefit of hopping codes is to prevent the retransmission of captured code words. This works very well for code words that the receiver decodes. Its weakness is if a code is captured when the receiver misses it, the code may trick the receiver once if it is used before the next valid transmission. To make the receiver more secure it could increment the counter on questionable code word receptions. To make the trans­mitter more secure it could use separate buttons for lock and unlock functions. Another way would be to require two different buttons in sequence to gain access.
There are other ways to make K secure, but these are all trade-offs. You need to find a balance between:
• Security
• Design effort
• Usability (particularly in failure modes). For example, if a button sticks or someone plays with
it, the counter should not end up in the blocked code window, rendering the transmitter useless or requiring the receiver to relearn the transmitter.
EELOQ systems more
2002 Microchip Technology Inc. Preliminary DS40035C-page 41
HCS473
NOTES:
DS40035C-page 42 Preliminary  2002 Microchip Technology Inc.
HCS473
6.0 DEVELOPMENT SUPPORT
The PICmicro® microcontrollers are supported with a full range of hardware and software development tools:
• Integrated Development Environment
- MPLAB
• Assemblers/Compilers/Linkers
-MPASM
- MPLAB C17 and MPLAB C18 C Compilers
-MPLINK MPLIB
• Simulators
- MPLAB SIM Software Simulator
• Emulators
- MPLAB ICE 2000 In-Circuit Emulator
- ICEPIC™ In-Circuit Emulator
• In-Circuit Debugger
- MPLAB ICD
• Device Programmers
-PRO MATE
- PICSTART Programmer
• Low Cost Demonstration Boards
- PICDEM
- PICDEM 2 Demonstration Board
- PICDEM
- PICDEM
-K
6.1 MPLAB Integrated Development
The MPLAB IDE software brings an ease of software development previously unseen in the 8-bit microcon­troller market. The MPLAB IDE is a Windows application that contains:
• An interface to debugging tools
- simulator
- programmer (sold separately)
- emulator (sold separately)
- in-circuit debugger (sold separately)
• A full-featured editor
• A project manager
• Customizable toolbar and key mapping
• A status bar
• On-line help
®
IDE Software
TM
Assembler
TM
Object Linker/
TM
Object Librarian
®
II Universal Device Programmer
®
Plus Entry-Level Development
TM
1 Demonstration Board
3 Demonstration Board 17 Demonstration Board
®
EELOQ
Demonstration Board
Environment Software
®
-based
The MPLAB IDE allows you to:
• Edit your source files (either assembly or ‘C’)
• One touch assemble (or compile) and download to PICmicro emulator and simulator tools (auto­matically updates all project information)
• Debug using:
- source files
- absolute listing file
- machine code
The ability to use MPLAB IDE with multiple debugging tools allows users to easily switch from the cost­effective simulator to a full-featured emulator with minimal retraining.
6.2 MPASM Assembler
The MPASM assembler is a full-featured universal macro assembler for all PICmicro MCU’s.
The MPASM assembler has a command line interface and a Windows shell. It can be used as a stand-alone application on a Windows 3.x or greater system, or it can be used through MPLAB IDE. The MPASM assem­bler generates relocatable object files for the MPLINK object linker, Intel
®
standard HEX files, MAP files to detail memory usage and symbol reference, an abso­lute LST file that contains source lines and generated machine code, and a COD file for debugging.
The MPASM assembler features include:
• Integration into MPLAB IDE projects.
• User-defined macros to streamline assembly
code.
• Conditional assembly for multi-purpose source
files.
• Directives that allow complete control over the
assembly process.
6.3 MPLAB C17 and MPLAB C18
C Compilers
The MPLAB C17 and MPLAB C18 Code Development Systems are complete ANSI ‘C’ compilers for Microchip’s PIC17CXXX and PIC18CXXX family of microcontrollers, respectively. These compilers provide powerful integration capabilities and ease of use not found with other compilers.
For easier source level debugging, the compilers pro­vide symbol information that is compatible with the MPLAB IDE memory display.
2002 Microchip Technology Inc. Preliminary DS40035C-page 43
HCS473
6.4 MPLINK Object Linker/ MPLIB Object Librarian
The MPLINK object linker combines relocatable objects created by the MPASM assembler and the MPLAB C17 and MPLAB C18 C compilers. It can also link relocatable objects from pre-compiled libraries, using directives from a linker script.
The MPLIB object librarian is a librarian for pre­compiled code to be used with the MPLINK object linker. When a routine from a library is called from another source file, only the modules that contain that routine will be linked in with the application. This allows large libraries to be used efficiently in many different applications. The MPLIB object librarian manages the creation and modification of library files.
The MPLINK object linker features include:
• Integration with MPASM assembler and MPLAB
C17 and MPLAB C18 C compilers.
• Allows all memory areas to be defined as sections
to provide link-time flexibility.
The MPLIB object librarian features include:
• Easier linking because single libraries can be
included instead of many smaller files.
• Helps keep code maintainable by grouping
related modules together.
• Allows libraries to be created and modules to be
added, listed, replaced, deleted or extracted.
6.5 MPLAB SIM Software Simulator
The MPLAB SIM software simulator allows code devel­opment in a PC-hosted environment by simulating the PICmicro series microcontrollers on an instruction level. On any given instruction, the data areas can be examined or modified and stimuli can be applied from a file, or user-defined key press, to any of the pins. The execution can be performed in single step, execute until break, or Trace mode.
The MPLAB SIM simulator fully supports symbolic debug­ging using the MPLAB C17 and the MPLAB C18 C com­pilers and the MPASM assembler. The software simulator offers the flexibility to develop and debug code outside of the laboratory environment, making it an excellent multi­project software development tool.
6.6 MPLAB ICE High Performance Universal In-Circuit Emulator with MPLAB IDE
The MPLAB ICE universal in-circuit emulator is intended to provide the product development engineer with a complete microcontroller design tool set for PICmicro microcontrollers (MCUs). Software control of the MPLAB ICE in-circuit emulator is provided by the MPLAB Integrated Development Environment (IDE), which allows editing, building, downloading and source debugging from a single environment.
The MPLAB ICE 2000 is a full-featured emulator sys­tem with enhanced trace, trigger and data monitoring features. Interchangeable processor modules allow the system to be easily reconfigured for emulation of differ­ent processors. The universal architecture of the MPLAB ICE in-circuit emulator allows expansion to support new PICmicro microcontrollers.
The MPLAB ICE in-circuit emulator system has been designed as a real-time emulation system, with advanced features that are generally found on more expensive development tools. The PC platform and Microsoft make these features available to you, the end user.
®
Windows environment were chosen to best
6.7 ICEPIC In-Circuit Emulator
The ICEPIC low cost, in-circuit emulator is a solution for the Microchip Technology PIC16C5X, PIC16C6X, PIC16C7X and PIC16CXXX families of 8-bit One­Time-Programmable (OTP) microcontrollers. The mod­ular system can support different subsets of PIC16C5X or PIC16CXXX products through the use of inter­changeable personality modules, or daughter boards. The emulator is capable of emulating without target application circuitry being present.
DS40035C-page 44 Preliminary  2002 Microchip Technology Inc.
HCS473
6.8 MPLAB ICD In-Circuit Debugger
Microchip's In-Circuit Debugger, MPLAB ICD, is a pow­erful, low cost, run-time development tool. This tool is based on the FLASH PICmicro MCUs and can be used to develop for this and other PICmicro microcontrollers. The MPLAB ICD utilizes the in-circuit debugging capa­bility built into the FLASH devices. This feature, along with Microchip's In-Circuit Serial Programming col, offers cost-effective in-circuit FLASH debugging from the graphical user interface of the MPLAB Integrated Development Environment. This enables a designer to develop and debug source code by watch­ing variables, single-stepping and setting break points. Running at full speed enables testing hardware in real­time.
TM
proto-
6.9 PRO MATE II Universal Device Programmer
The PRO MATE II universal device programmer is a full-featured programmer, capable of operating in Stand-alone mode, as well as PC-hosted mode. The PRO MATE II device programmer is CE compliant.
The PRO MATE II device programmer has program­mable V programmed memory at V imum reliability. It has an LCD display for instructions and error messages, keys to enter commands and a modular detachable socket assembly to support various package types. In Stand-alone mode, the PRO MATE II device programmer can read, verify, or program PICmicro devices. It can also set code protection in this mode.
DD and VPP supplies, which allow it to verify
DD min and VDD max for max-
6.10 PICSTART Plus Entry Level Development Programmer
The PICSTART Plus development programmer is an easy-to-use, low cost, prototype programmer. It con­nects to the PC via a COM (RS-232) port. MPLAB Integrated Development Environment software makes using the programmer simple and efficient.
The PICSTART Plus development programmer sup­ports all PICmicro devices with up to 40 pins. Larger pin count devices, such as the PIC16C92X and PIC17C76X, may be supported with an adapter socket. The PICSTART Plus development programmer is CE compliant.
6.11 PICDEM 1 Low Cost PICmicro Demonstration Board
The PICDEM 1 demonstration board is a simple board which demonstrates the capabilities of several of Microchip’s microcontrollers. The microcontrollers sup­ported are: PIC16C5X (PIC16C54 to PIC16C58A), PIC16C61, PIC16C62X, PIC16C71, PIC16C8X, PIC17C42, PIC17C43 and PIC17C44. All necessary hardware and software is included to run basic demo programs. The user can program the sample microcon­trollers provided with the PICDEM 1 demonstration board on a PRO MATE II device programmer, or a PICSTART Plus development programmer, and easily test firmware. The user can also connect the PICDEM 1 demonstration board to the MPLAB ICE in­circuit emulator and download the firmware to the emu­lator for testing. A prototype area is available for the user to build some additional hardware and connect it to the microcontroller socket(s). Some of the features include an RS-232 interface, a potentiometer for simu­lated analog input, push button switches and eight LEDs connected to PORTB.
6.12 PICDEM 2 Low Cost PIC16CXX Demonstration Board
The PICDEM 2 demonstration board is a simple dem­onstration board that supports the PIC16C62, PIC16C64, PIC16C65, PIC16C73 and PIC16C74 microcontrollers. All the necessary hardware and soft­ware is included to run the basic demonstration pro­grams. The user can program the sample microcontrollers provided with the PICDEM 2 demon­stration board on a PRO MATE II device programmer, or a PICSTART Plus development programmer, and easily test firmware. The MPLAB ICE in-circuit emula­tor may also be used with the PICDEM 2 demonstration board to test firmware. A prototype area has been pro­vided to the user for adding additional hardware and connecting it to the microcontroller socket(s). Some of the features include a RS-232 interface, push button switches, a potentiometer for simulated analog input, a serial EEPROM to demonstrate usage of the I and separate headers for connection to an LCD module and a keypad.
2
CTM bus
2002 Microchip Technology Inc. Preliminary DS40035C-page 45
HCS473
6.13 PICDEM 3 Low Cost PIC16CXXX Demonstration Board
The PICDEM 3 demonstration board is a simple dem­onstration board that supports the PIC16C923 and PIC16C924 in the PLCC package. It will also support future 44-pin PLCC microcontrollers with an LCD Mod­ule. All the necessary hardware and software is included to run the basic demonstration programs. The user can program the sample microcontrollers pro­vided with the PICDEM 3 demonstration board on a PRO MATE II device programmer, or a PICSTART Plus development programmer with an adapter socket, and easily test firmware. The MPLAB ICE in-circuit emula­tor may also be used with the PICDEM 3 demonstration board to test firmware. A prototype area has been pro­vided to the user for adding hardware and connecting it to the microcontroller socket(s). Some of the features include a RS-232 interface, push button switches, a potentiometer for simulated analog input, a thermistor and separate headers for connection to an external LCD module and a keypad. Also provided on the PICDEM 3 demonstration board is a LCD panel, with 4 commons and 12 segments, that is capable of display­ing time, temperature and day of the week. The PICDEM 3 demonstration board provides an additional RS-232 interface and Windows software for showing the demultiplexed LCD signals on a PC. A simple serial interface allows the user to construct a hardware demultiplexer for the LCD signals.
6.14 PICDEM 17 Demonstration Board
The PICDEM 17 demonstration board is an evaluation board that demonstrates the capabilities of several Microchip microcontrollers, including PIC17C752, PIC17C756A, PIC17C762 and PIC17C766. All neces­sary hardware is included to run basic demo programs, which are supplied on a 3.5-inch disk. A programmed sample is included and the user may erase it and program it with the other sample programs using the PRO MATE II device programmer, or the PICSTART Plus development programmer, and easily debug and test the sample code. In addition, the PICDEM 17 dem­onstration board supports downloading of programs to and executing out of external FLASH memory on board. The PICDEM 17 demonstration board is also usable with the MPLAB ICE in-circuit emulator, or the PICMASTER emulator and all of the sample programs can be run and modified using either emulator. Addition­ally, a generous prototype area is available for user hardware.
6.15 KEELOQ Evaluation and Programming Tools
KEELOQ evaluation and programming tools support Microchip’s HCS Secure Data Products. The HCS eval­uation kit includes a LCD display to show changing codes, a decoder to decode transmissions and a pro­gramming interface to program test transmitters.
DS40035C-page 46 Preliminary  2002 Microchip Technology Inc.
TABLE 6-1: DEVELOPMENT TOOLS FROM MICROCHIP
HCS473
MCP2510
MCRFXXX
HCSXXX
93CXX
25CXX/ 24CXX/
PIC18FXXX
PIC18CXX2
PIC17C7XX
PIC17C4X
PIC16C9XX
PIC16F8XX
PIC16C8X





ICD In-Circuit Debugger (DV164001) with PIC16C62, 63, 64, 65, 72, 73, 74, 76, 77.
®
PIC16C7XX
PIC16C7X
PIC16F62X
PIC16CXXX
PIC16C6X
PIC16C5X
PIC14000
PIC12CXXX

Integrated
®
  
Object Linker
Assembler/
C17 C Compiler
C18 C Compiler
TM
TM
®
®
®
 
*
**
*
 
  
In-Circuit Emulator
ICE In-Circuit Emulator
TM
ICD In-Circuit
®
 
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**
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II
Plus Entry Level
®
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1 Demonstration
2 Demonstration
TM
TM
3 Demonstration
14A Demonstration
TM
TM
17 Demonstration
TM
Programmer’s Kit
Evaluation Kit
Transponder Kit
TM
®
®
TM
TM
Developer’s Kit
TM
EELOQ
EELOQ
Development Environment
MPLAB
MPLAB
MPLAB
MPASM
MPLINK
MPLAB
Software Tools
ICEPIC
Emulators
Debugger
MPLAB
PICSTART
Development Programmer
Debugger
PICDEM
Universal Device Programmer
PRO MATE
Programmers
Board
PICDEM
Board
PICDEM
BoardPICDEM
BoardPICDEM
BoardK
K
microID
Developer’s Kit
125 kHz Anticollision microID
Developer’s Kit
125 kHz microID
Demo Boards and Eval Kits
MCP2510 CAN Developer’s Kit
13.56 MHz Anticollision
microID
* Contact the Microchip Technology Inc. web site at www.microchip.com for information on how to use the MPLAB
2002 Microchip Technology Inc. Preliminary DS40035C-page 47
Development tool is available on select devices.
** Contact Microchip Technology Inc. for availability date.
HCS473
NOTES:
DS40035C-page 48 Preliminary  2002 Microchip Technology Inc.
HCS473
7.0 ELECTRICAL CHARACTERISTICS
7.1 Absolute Maximum Ratings
Ambient temperature under bias.......................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................... -65°C to +150°C
Voltage on V Voltage on LED Voltage on all other pins w/respect to V Total power dissipation Maximum current out of V Maximum current into V Input clamp current, I Output clamp current, I
Maximum output current sunk by any Output pin.................................................................................................25 mA
Maximum output current sourced by any Output pin ...........................................................................................25 mA
Note 1: Power dissipation is calculated as follows: P
DD w/respect to VSS .......................................................................................................... -0.3V to +7.5V
w/respect to VSS .............................................................................................................-0.3V to +11V
SS .......................................................................................-0.3V to VDD+0.3V
(1)
..................................................................................................................................500 mW
SS pin ........................................................................................................................100 mA
DD pin ...........................................................................................................................100 mA
IK (VI < 0 or VI > VDD)....................................................................................................... ±20 mA
OK (Vo < 0 or Vo >VDD).................................................................................................. ±20 mA
DIS=VDD x {IDD - Â IOH} + Â {(VDD-VOH) x IOH} + Â(VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.
2002 Microchip Technology Inc. Preliminary DS40035C-page 49
HCS473
TABLE 7-1: DC CHARACTERISTICS: HCS473
DC Characteristics
All pins except power supply pins
Param
No.
D001 V
D003 V
Sym Characteristic Min Typ† Max Units Conditions
DD Supply Voltage 2.05
POR VDD Start Voltage to ensure
internal Power-on Reset sig­nal
D004 SV
DD VDD Rise Rate to ensure
internal Power-on Reset sig­nal
D005 V
BOR Brown-out Reset Voltage —1.92V
DD Supply Current
I
(2)
D010 D010B
D021A ISS Shutdown Current —0.11.0µAVDD = 5.5V
DD Transponder Current
I
D022 4.2 8 µAV
D022A 3.5 6 µAV
IL Input Low Voltage
V
Input Pins
D030 With TTL Buffer Vss 0.8 V 4.5V ≤ V
D030A Vss 0.15V
D031 With Schmitt Trigger Buffer Vss 0.2V
IH Input High Voltage
V
Input Pins
D040
With TTL Buffer 2.0
D040A
D041 With Schmitt Trigger Buffer 0.8 V
TOL Input Threshold Voltage
V
D053 V
LOW detect tolerance +250 mV VLOWSEL = 2.2V
IL Input Leakage Current
I
D060 Input Pins ±1 µA Vss ≤ V
D061 LED
VOL Output Low Voltage
D080 Output Pins 0.6 V I
V
OH Output High Voltage
D090 Output Pins V
D091 LED
Standard Operating Conditions (unless otherwise stated)
Operating Temperature 0°C ≤ T
(2)
—V
—5.5 V
SS V Cold RESET
A +70°C (Commercial)
-20°C T
A +85°C (Industrial)
0.05* ——V/ms
—1.05mAFOSC = 4 MHz, VDD = 5.5V
——2.0mAF
OSC = 4 MHz, VDD = 3.5V
DD = VDDT = 5.5V, no LC
signals
DD = VDDT = 3.0V, no LC
signals
7.5 25 µAV
DD = VDDT = 3V, Active LC
signals
D
V Otherwise
D
DD V
(0.25
DD+0.8)
V
DD —VDD V
——+
V
DD
VDD
VV4.5V VDD 5.5V
Otherwise
400 mV VLOWSEL = 3.3V
PIN VDD, Pin at Hi-
impedance, no pull-downs enabled
——±5 µAVss ≤ VPIN ≤ VDD
OL = 8.5 mA, VDD = 4.5V
DD-0.7 V IOH = -3.0 mA, VDD = 4.5V
1.5 V IOH = -0.5 mA, VDD = 4.5V
DD 5.5V
(3)
(3)
DS40035C-page 50 Preliminary  2002 Microchip Technology Inc.
HCS473
TABLE 7-1: DC CHARACTERISTICS: HCS473 (CONTINUED)
DC Characteristics
All pins except power supply pins
Param
No.
Sym Characteristic Min Typ† Max Units Conditions
RPD Internal Pull-down Resistance
D100 S0 - S3 40 75 100 K If enabled
Data EEPROM Memory
D120 E
D121 V
D122 T
D Endurance 200K 1000K E/W 25°C at 5V
DRW VDD for Read/Write 2.05 5.5 V
DEW Erase/Write Cycle Time
* These parameters are characterized but not tested.
"Typ" column data is at 5.0V, 25°C unless otherwise stated. These parameters are for design guidance only and are
not tested.
Note 1: The supply current is mainly a function of the operating voltage and frequency. Other factors such as I/O pin load-
ing and switching rate, oscillator type, internal code execution pattern, and temperature also have an impact on the current consumption.
2: Should operate down to V 3: The test conditions for all I
= VDD; WDT enabled/disabled as specified. The power-down/shutdown current in SLEEP mode does not
MCLR
BOR but not tested below 2.0V.
DD measurements in active Operation mode are: all I/O pins tristated, pulled to VDD.
depend on the oscillator frequency. Power-down current is measured with the part in SLEEP mode, with all I/O pins in hi-impedance state and tied to V enabled. This current should be added to the base I
Standard Operating Conditions (unless otherwise stated)
Operating Temperature 0°C ≤ T
(1)
DD or VSS. The current is the additional current consumed when the WDT is
—410ms
DD or IPD measurement.
A +70°C (Commercial)
-20°C T
A +85°C (Industrial)
TABLE 7-2: TRANSPONDER CHARACTERISTICS
DC Characteristics
All pins except power supply pins
Symbol Symbol Min Typ
V
lcc DDTV LC induced output voltage 3.5 V 10 V < VLCC, IDD = 2 mA
V
C Carrier frequency 125 kHz
f
LCS LC Input Sensitivity
V
V
LCC LCCOM Output Voltage 600 mV ILCCOM = 0 mA
LC input clamp voltage 10 V ILC < 1mA
Note: These parameters are characterizied but not tested.
Standard Operating Conditions (unless otherwise stated)
Operating Temperature 0°C ≤ T
-20°C T
2.05V < V
DD < 5.5V
(1)
15 18
Max Unit Conditions
30 35
A +70°C (Commercial)
A +85°C (Industrial)
mVRMS VDD = 5.5V
DD = 3.0V
V
2002 Microchip Technology Inc. Preliminary DS40035C-page 51
HCS473
(1)
(1)
TABLE 7-3: AC CHARACTERISTICS, FOSC = 4 MHz
F
OSC = 4 MHz
AC Characteristics
The min and max values below are due to HCS473 algorithm tolerances, not variations due to supply voltage and temperature.
Symbol Min Typ Max Description
General HCS473 Timing
TDB 10 ms Debounce Time
QUE 2s Que Window
T
PU 10.9 ms Power-up Delay Time (includes button debounce)
T
PLL 19 ms Encoder Mode PLL activation to first code word
T
T
LEDON 100 ms LED ON Time
LEDOFF 500 ms LED OFF Time
T
Communication from Transponder Reader to HCS473
TCMD 1LFTE+100 µs 10.2 ms
TSCMD 1LFTE+100 µs 10.2 ms Delay from Transponder Select ACK to next command
T
FINH 100 µs 1LFTE Time to leave LF on after last data bit’s rising edge
T
Response from HCS473 to Transponder Reader
TSF 1ms+1LFTE 3.5ms+1LFTE 10ms+1LFTE Delay to wake-up Acknowledge sequence
T
TSACK
1LFTE+16 µs
TE-11 µs
1LF
TPACK 157 µs 179 µs 212 µs Delay to Transport Code Acknowledge
T
WRT 4 ms 10 ms Delay to Write Acknowledge
T
T
AOACK 67 µs89µs 122 µs Delay to anticollision off Acknowledge
IFF 5.64ms Delay to IFF response - RF or LF response
T
READ 205 µs 227 µs 260 µs Delay to read response - RF or LF response
T
HOP 19 ms Delay to hopping code response - RF or LF response
T
DAMP 1.2 LFTE Delay from detecting LC rising edge to first damp pulse
T
T
DEMOD 16.4 ms Demodulator mode window looking for edge on LC pin
1LF
1 LF
TE+30 µs
TE
1LFTE+44 µs
TE+11 µs
1LF
Delay from TID pulse rising edge to TID Acknowledge TID = 0 TID > 0
Timing Element TE
TE
90 180 360 720
100 200 400 800
110 220 440 880
E or LFTE
RFT RFBSL = LFBSL = 00 RFBSL = LFBSL = 01 RFBSL = LFBSL = 10 RFBSL = LFBSL = 11
2
2
2
2
Analog delays
TFILTR —15µs HCS473 analog LF filter charge time
FILTF —70µs HCS473 analog LF filter discharge time
T
T
ANTR Hardware design dependent Cumulative LF antenna delay when field is turned on
ANTF Hardware design dependent Cumulative LF antenna delay when field is turned off
T
Note 1: F
OSC = 4 MHz may be centered at the designer’s choice of supply voltage (VDD) and temperature.
TE is based on the HCS473’s timing, not the timing of the transponder reader. Therefore LFTE is subject to HCS473
2: LF
oscillator variation.
T
FILTR
3: Response timing accounts for
but not for
must compensate communication accordingly for
T
ANTR
T
ANTR
or T
and
ANTF
, as they are design dependent. The system designer
T
ANTF
.
4: Timing parameters are characterized but not tested.
DS40035C-page 52 Preliminary  2002 Microchip Technology Inc.
HCS473
TABLE 7-4: AC CHARACTERISTICS, Commercial Temperature Devices
AC Characteristics
Symbol Min
Typ
(1)
Tamb = 0°C to 70°C, 2.05V < V F
OSC = 4 MHz ±10%
Max Description
General HCS473 Timing
TDB 9 ms 10 ms 11 ms Debounce Time
T
QUE 1.8s 2s 2.2s Que Window
PU 9.81 ms 10.9 ms 12 ms Power-up Delay Time (includes button debounce)
T
PLL 17.1 ms 19 ms 20.9 ms Encoder Mode PLL activation to first code word
T
LEDON 90 ms 100 ms 110 ms LED ON Time
T
T
LEDOFF 450 ms 500 ms 550 ms LED OFF Time
Communication from Transponder Reader to HCS473
TCMD 1.1 LFTE+100 µs 9.18 ms
TSCMD 1.1 LFTE+100 µs 9.18 ms Delay from Transponder Select ACK to next command
T
FINH 100 µs1LFTE Time to leave LF on after last data bit’s rising edge
T
Response from HCS473 to Transponder Reader
TSF 1ms+.9LFTE 3.5 ms+1 LFTE 10 ms+1. 1LFTE Delay to wake-up Acknowledge sequence
TSACK
T
.9 LFTE+14 µs
TE-12 µs
.9 LF
TPACK 141 µs 179 µs 234 µs Delay to Transport Code Acknowledge
T
WRT 4 ms 10ms Delay to Write Acknowledge
T
AOACK 60 µs89µs 135 µs Delay to anticollision off Acknowledge
T
T
IFF 5.07 ms 5.64 ms 6.2 ms Delay to IFF response - RF or LF response
READ 184 µs 227 µs 286 µs Delay to read response - RF or LF response
T
HOP 17.1 ms 19 ms 20.9 ms Delay to hopping code response - RF or LF response
T
DAMP 1.08 LFTE 1.2 LFTE 1.32 LFTE Delay from detecting LC rising edge to first damp pulse
T
DEMOD 14.76 ms 16.4 ms 18 ms Demodulator mode window looking for edge on LC pin
T
1LF
TE+30 µs
TE
1LF
1.1 LFTE+49 µs
TE+12 µs
1.1 LF
Delay from TID pulse rising edge to TID acknowledge TID = 0 TID > 0
Timing Element TE
TE
90 180 360 720
100 200 400 800
110 220 440 880
E or LFTE
RFT RFBSL = LFBSL = 00 RFBSL = LFBSL = 01 RFBSL = LFBSL = 10 RFBSL = LFBSL = 11
Analog delays
TFILTR —15µs HCS473 analog LF filter charge time
FILTF —70µs HCS473 analog LF filter discharge time
T
ANTR Hardware design dependent Cumulative LF antenna delay when field is turned on
T
T
ANTF Hardware design dependent Cumulative LF antenna delay when field is turned off
Note 1: Fosc = 4 MHz. F
TE is based on the HCS473’s timing, not the timing of the transponder reader. Therefore LFTE is subject to HCS473
2: LF
oscillator variation.
3: Response timing accounts for
must compensate communication accordingly for
4: Timing parameters are characterized but not tested.
OSC = 4 MHz may be centered at the designer’s choice of supply voltage (VDD) and temperature.
T
FILTR
but not for
T
ANTR
T
ANTR
or T
and
ANTF
, as they are design dependent. The system designer
T
ANTF
DD < 5.5V
2
2
2
2
.
2002 Microchip Technology Inc. Preliminary DS40035C-page 53
HCS473
TABLE 7-5: AC CHARACTERISTICS, Industrial Temperature Devices
AC Characteristics
Symbol Min Typ
(1)
Tamb = -20°C to 85°C, 2.05V < V F
OSC = 4 MHz ±10%
Max Description
(4)
DD 3.5V unless stated otherwise
General HCS473 Timing
T
DB 9 ms
9 ms
TQUE 1.8s
1.8s
TPU 9.81 ms
9.81 ms
TPLL 17.1 ms
17.1 ms
TLEDON 90 ms
90 ms
TLEDOFF 450 ms
450 ms
10 ms 10 ms
2s 2s
10.9 ms
10.9 ms 19 ms
19 ms
100 ms 100 ms
500 ms 500 ms
11 m s 12 ms
2.2s
2.4s
12 ms
13.08 ms
20.9 ms
22.8 ms 110 m s
120 ms 550 ms
600 ms
Debounce Time
3.5V < V
DD < 5.5V
Que Window
3.5V < V
DD < 5.5V
Power-up Delay Time (includes button debounce)
3.5V < V
DD < 5.5V
Encoder Mode PLL activation to first code word
3.5V < V
DD < 5.5V
LED ON Time
3.5V < V
DD < 5.5V
LED OFF Time
3.5V < V
DD < 5.5V
(4)
(4)
(4)
(4)
(4)
(4)
Communication from Transponder Reader to HCS473
CMD 1.1 LFTE+100 µs
T
TE+100 µs
1.2 LF
TTSCMD 1.1 LFTE+100 µs
TE+100 µs
1.2 LF
— —
— —
9.18 ms
9.18 ms 3.5V < VDD < 5.5V
9.18 ms
9.18 ms
Delay from Transponder Select ACK to next command
3.5V < VDD < 5.5V
(4)
(4)
TFINH 100 µs1LFTE Time to leave LF on after last data bit’s rising edge
Response from HCS473 to Transponder Reader
SF 1ms+.9LFTE
T
1ms+.9LFTE
TTSACK
.9 LFTE+14 µs
TE+14 µs
.9 LF
.9 LFTE-10 µs .9 LF
TE-10 µs
TTPACK 141 µs
141 µs
3.5 ms+1 LFTE
3.5 ms+1 LFTE
1LF
TE+30 µs TE+30 µs
1LF
TE
1 LF 1 LFTE
179 µs 179 µs
10 ms+1.1 LFTE 10 ms+1.2 LFTE
1.1 LF
TE+49 µs TE+53 µs
1.2 LF
1.1 LFTE+12 µs
1.2 LF
TE+13.2 µs
234 µs 255 µs
Delay to wake-up ACK
Delay from TID pulse rising edge to TID Acknowledge TID = 0
3.5V < V
DD < 5.5V
TID > 0
3.5V < VDD < 5.5V Delay to Transport Code Acknowledge
3.5V < V
DD < 5.5V
(4)
(4)
(4)
(4)
TWRT 4 ms 10 ms Delay to Write Acknowledge
AOACK 60 µs
T
60 µs
TIFF 5.07 ms
5.07 ms
TREAD 184 µs
184 µs
THOP 17.1 ms
17.1 ms
TDAMP 1.08 LFTE
1.08 LFTE
TDEMOD 14.76 ms
14.76 ms
89 µs 89 µs
5.64 ms
5.64 ms 227 µs
227 µs
19 ms 19 ms
1.2 LFTE
1.2 LFTE
16.4 ms
16.4 ms
135 µs 147 µs
6.2 ms
6.8 ms 286 µs
312 µs
20.9 ms
22.8 ms
1.32 LFTE
1.44 LFTE 18 ms
19.7 ms
Delay to anticollision off Acknowledge
3.5V < V
DD < 5.5V
Delay to IFF response - RF or LF response
3.5V < V
DD < 5.5V
Delay to read response - RF or LF response
3.5V < V
DD < 5.5V
Delay to hopping code response - RF or LF response
3.5V < V
DD < 5.5V
Delay from detecting LC rising edge to first damp pulse
3.5V < V
DD < 5.5V
Demodulator mode window looking for edge on LC pin
3.5V < V
DD < 5.5V
(4)
(4)
(4)
(4)
(4)
(4)
Timing Element TE
TE
90 180 360 720
100 200 400 800
110 220 440 880
E or LFTE
RFT RFBSL = LFBSL = 00 RFBSL = LFBSL = 01 RFBSL = LFBSL = 10 RFBSL = LFBSL = 11
2
2
2
2
DS40035C-page 54 Preliminary  2002 Microchip Technology Inc.
HCS473
Analog delays
FILTR —15µs HCS473 analog LF filter charge time
T
FILTF —70µs HCS473 analog LF filter discharge time
T
ANTR Hardware design dependent Cumulative LF antenna delay when field is turned on
T
ANTF Hardware design dependent Cumulative LF antenna delay when field is turned off
T Note 1: Fosc = 4 MHz. F
ture.
TE is based on the HCS473’s timing, not the timing of the transponder reader. Therefore LFTE is subject to
2: LF
HCS473 oscillator variation.
3: Response timing accounts for
designer must compensate communication accordingly for
4: Min and Max values modified for FOSC = 4 MHz + 10%, -20%. Timing parameters are characterized but not
tested. Very Important: Refer to Section 3.2.7 for communication requirements when using an Industrial tem­perature device at 3.5V < V
OSC = 4 MHz may be centered at the designer’s choice of supply voltage (VDD) and tempera-
T
FILTR
but not for
DD < 5.5V.
T
ANTR
or T
ANTF
, as they are design dependent. The system
T
ANTR
and
T
ANTF
.
2002 Microchip Technology Inc. Preliminary DS40035C-page 55
HCS473
NOTES:
DS40035C-page 56 Preliminary  2002 Microchip Technology Inc.
8.0 PACKAGING INFORMATION
8.1 Package Marking Information
HCS473
14-Lead PDIP (300 mil)
XXXXXXXXXXXXXX XXXXXXXXXXXXXX
YYWWNNN
14-Lead SOIC (150 mil)
XXXXXXXXXXX XXXXXXXXXXX
YYWWNNN
Example
HCS473
XXXXXXXXXXXXXX
9904NNN
Example
HCS473
XXXXXXXXXXX
9904NNN
Legend: XX...X Customer specific information*
YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code
Note: In the event the full Microchip part number cannot be marked on one line, it
will be carried over to the next line thus limiting the number of available char­acters for customer specific information.
* Standard marking consists of Microchip part number, year code, week code, facility code, mask rev#,
and assembly code. For marking beyond this, certain price adders apply. Please check with your Microchip Sales Office. For SQTP devices, any special marking adders are included in SQTP price.
2002 Microchip Technology Inc. Preliminary DS40035C-page 57
HCS473
14-Lead Plastic Dual In-line (P) – 300 mil (PDIP)
E1
D
2
n
E
β
eB
Number of Pins Pitch Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .740 .750 .760 18.80 19.05 19.30 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness Upper Lead Width Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter
§ Significant Characteristic Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254 mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-005
1
A
c
A1
Dimension Limits MIN NOM MAX MIN NOM MAX
Units INCHES* MILLIMETERS
n p
A2
c
B1
eB
α
β
.115 .130 .145 2.92 3.30 3.68
.008 .012 .015 0.20 0.29 0.38 .045 .058 .070 1.14 1.46 1.78
.310 .370 .430 7.87 9.40 10.92
5 10 15 5 10 15 5 10 15 5 10 15
B1
B
14 14
.100 2.54
α
A2
L
p
DS40035C-page 58 Preliminary  2002 Microchip Technology Inc.
14-Lead Plastic Small Outline (SL) – Narrow, 150 mil (SOIC)
E
E1
p
D
2
B
n
1
HCS473
α
MILLIMETERSINCHES*Units
1.27.050
A2
h
A
φ
L
n p
φ
c
α
β
A1
048048
45°
c
β
Number of Pins Pitch
Molded Package Thickness
Foot Angle Lead Thickness
Mold Draft Angle Top Mold Draft Angle Bottom
* Controlling Parameter
§ Significant Characteristic
Notes: Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254 mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-065
A2
MAXNOMMINMAXNOMMINDimension Limits
1414
1.751.551.35.069.061.053AOverall Height
1.551.421.32.061.056.052
0.250.180.10.010.007.004A1Standoff§
6.205.995.79.244.236.228EOverall Width
3.993.903.81.157.154.150E1Molded Package Width
8.818.698.56.347.342.337DOverall Length
0.510.380.25.020.015.010hChamfer Distance
1.270.840.41.050.033.016LFoot Length
0.250.230.20.010.009.008
0.510.420.36.020.017.014BLead Width 1512015120 1512015120
2002 Microchip Technology Inc. Preliminary DS40035C-page 59
HCS473
NOTES:
DS40035C-page 60 Preliminary  2002 Microchip Technology Inc.
HCS473
INDEX
A
AC Characteristics ..............................................................52
Anti-Collision Off .................................................................30
Assembler
MPASM Assembler..................................................... 43
C
CODE HOPPING COMMAND ('110') ................................. 29
Code Hopping Modulation Format ...................................... 13
Configuration Summary ......................................................35
Consecutive Command Considerations.............................. 30
Counter Overflow Bits (OVR1, OVR0) ................................ 18
Cycle Redundancy Check (CRC) ....................................... 18
D
DATA .................................................................................... 6
DC Characteristics .............................................................. 50
Development Support .........................................................43
Device Description ................................................................ 5
Device Operation ................................................................11
Discrimination Value (DISC) ............................................... 18
E
Electrical Characteristics
Absolute Maximum Ratings ........................................ 49
Encoder Activation .............................................................. 11
Encoder Interface.................................................................. 7
Encoder Mode Options .......................................................14
Encoder Operation................................................................ 1
Encoder Security................................................................... 1
Errata ....................................................................................2
G
General Description ..............................................................3
H
HCS473 Hopping Code ........................................................ 4
HCS473 Security .................................................................. 4
HCS473 Transponder Start Sequence ...............................22
I
ICEPIC In-Circuit Emulator .................................................44
IFF Challenge and Response .............................................26
Integrating the HCS473 Into A System ............................... 39
Internal RC Oscillator............................................................ 9
MPLAB ICE High Performance Universal In-Circuit Emulator
with MPLAB IDE ................................................................. 44
MPLAB Integrated Development Environment Software.... 43
MPLINK Object Linker/MPLIB Object Librarian.................. 44
P
Packaging Information........................................................ 57
Peripherals ........................................................................... 1
PICDEM 1 Low Cost PICmicro Demonstration Board ........ 45
PICDEM 17 Demonstration Board...................................... 46
PICDEM 2 Low Cost PIC16CXX Demonstration Board ..... 45
PICDEM 3 Low Cost PIC16CXXX Demonstration Board... 46
PICSTART Plus Entry Level Development Programmer.... 45
Present Transport Code ..................................................... 25
PRO MATE II Universal Device Programmer ..................... 45
Product Identification System ............................................. 64
Programming Specification................................................. 37
R
Read Sequence.................................................................. 27
Receive Stability - Calculating Communiction .................... 32
Request Hopping Code Command..................................... 29
RFEN During LF Communication ....................................... 33
S
S0 ......................................................................................... 6
s3.......................................................................................... 6
Select Transponder ............................................................ 24
Software Simulator (MPLAB SIM) ...................................... 44
T
Transmitted Code Word...................................................... 11
Transponder Characteristics............................................... 51
Transponder Commands.................................................... 23
Transponder Communication ............................................. 21
Transponder Interface .......................................................... 8
Transponder Mode ............................................................. 18
Transponder Operation......................................................... 1
Transponder Options.......................................................... 19
Transponder Security ........................................................... 1
Typical Applications.............................................................. 1
W
Wake-Up Logic ..................................................................... 7
WWW, On-Line Support ....................................................... 2
K
KEELOQ Evaluation and Programming Tools .................... 46
Key Terms............................................................................. 3
L
lccom..................................................................................... 7
LED ....................................................................................... 7
LED Operation ....................................................................17
LF Communication Analog Delays...................................... 30
LF Response Considerations.............................................. 30
Low Voltage Detector............................................................ 9
Low-End System Security Risks ........................................... 4
M
MPLAB C17 and MPLAB C18 C Compilers........................ 43
MPLAB ICD In-Circuit Debugger ........................................ 45
2002 Microchip Technology Inc. Preliminary DS40035C-page 61
HCS473
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip World Wide Web site.
The web site is used by Microchip as a means to make files and information easily available to customers. To view the site, the user must have access to the Internet and a web browser, such as Netscape Internet Explorer. Files are also available for FTP download from our FTP site.
Connecting to the Microchip Internet Web Site
The Microchip web site is available at the following URL:
www.microchip.com
The file transfer site is available by using an FTP ser­vice to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A vari­ety of Microchip specific business information is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to Microchip Products
• Conferences for products, Development Systems, technical information and more
• Listing of seminars and events
®
or Microsoft
SYSTEMS INFORMATION AND UPGRADE HOT LINE
The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products.
®
Plus, this line provides information on how customers can receive the most current upgrade kits.The Hot Line Numbers are:
1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world.
092002
DS40035C-page 62 Preliminary  2002 Microchip Technology Inc.
HCS473
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod­uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To :
RE: Reader Response
From:
Application (optional):
Would you like a reply? Y N
Device:
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
Technical Publications Manager
Name Company
Address City / State / ZIP / Country
Telephone: (_______) _________ - _________
HCS473
Literature Number:
Total Pages Sent ________
FAX: (______) _________ - _________
DS40035C
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2002 Microchip Technology Inc. Preliminary DS40035C-page 63
HCS473
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X /XX XXX
Device
Range
Device HCS473
PatternPackageTemperature
Examples:
a) To be supplied.
Temperature Range - = 0°C to +70°C
Package P = PDIP
Pattern QTP, SQTP, ROM Code (factory specified) or
* JW Devices are UV erasable and can be programmed to any device configuration. JW Devices meet the electrical requirement of each oscillator type.
I = -20°C to +85°C
SL = SOIC
Special Requirements . Blank for OTP and Windowed devices.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom­mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
DS40035C-page64 Preliminary  2002 Microchip Technology Inc.
NOTES:
HCS473
2002 Microchip Technology Inc. Preliminary DS40035C-page 65
WORLDWIDE SALES AND SERVICE
AMERICAS
Corporate Office
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: http://www.microchip.com
Rocky Mountain
2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7966 Fax: 480-792-4338
Atlanta
500 Sugar Mill Road, Suite 200B Atlanta, GA 30350 Tel: 770-640-0034 Fax: 770-640-0307
Boston
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Chicago
333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285-0071 Fax: 630-285-0075
Dallas
4570 Westgrove Drive, Suite 160 Addison, TX 75001 Tel: 972-818-7423 Fax: 972-818-2924
Detroit
Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538-2250 Fax: 248-538-2260
Kokomo
2767 S. Albright Road Kokomo, Indiana 46902 Tel: 765-864-8360 Fax: 765-864-8387
Los Angeles
18201 Von Karman, Suite 1090 Irvine, CA 92612 Tel: 949-263-1888 Fax: 949-263-1338
San Jose
Microchip Technology Inc. 2107 North First Street, Suite 590 San Jose, CA 95131 Tel: 408-436-7950 Fax: 408-436-7955
Tor ont o
6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Canada Tel: 905-673-0699 Fax: 905-673-6509
ASIA/PACIFIC
Australia
Microchip Technology Australia Pty Ltd Suite 22, 41 Rawson Street Epping 2121, NSW Australia Tel: 61-2-9868-6733 Fax: 61-2-9868-6755
China - Beijing
Microchip Technology Consulting (Shanghai) Co., Ltd., Beijing Liaison Office Unit 915 Bei Hai Wan Tai Bldg. No. 6 Chaoyangmen Beidajie Beijing, 100027, No. China Tel: 86-10-85282100 Fax: 86-10-85282104
China - Chengdu
Microchip Technology Consulting (Shanghai) Co., Ltd., Chengdu Liaison Office Rm. 2401, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86766200 Fax: 86-28-86766599
China - Fuzhou
Microchip Technology Consulting (Shanghai) Co., Ltd., Fuzhou Liaison Office Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7503506 Fax: 86-591-7503521
China - Shanghai
Microchip Technology Consulting (Shanghai) Co., Ltd. Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-6275-5700 Fax: 86-21-6275-5060
China - Shenzhen
Microchip Technology Consulting (Shanghai) Co., Ltd., Shenzhen Liaison Office Rm. 1315, 13/F, Shenzhen Kerry Centre, Renminnan Lu Shenzhen 518001, China Tel: 86-755-82350361 Fax: 86-755-82366086
China - Hong Kong SAR
Microchip Technology Hongkong Ltd. Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401-1200 Fax: 852-2401-3431
India
Microchip Technology Inc. India Liaison Office Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-2290061 Fax: 91-80-2290062
Japan
Microchip Technology Japan K.K. Benex S-1 6F 3-18-20, Shinyokohama Kohoku-Ku, Yokohama-shi Kanagawa, 222-0033, Japan Tel: 81-45-471- 6166 Fax: 81-45-471-6122
Korea
Microchip Technology Korea 168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5934
Singapore
Microchip Technology Singapore Pte Ltd. 200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850
Tai wan
Microchip Technology (Barbados) Inc., Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139
EUROPE
Austria
Microchip Technology Austria GmbH Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393
Denmark
Microchip Technology Nordic ApS Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45 4420 9895 Fax: 45 4420 9910
France
Microchip Technology SARL Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79
Germany
Microchip Technology GmbH Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144 0 Fax: 49-89-627-144-44
Italy
Microchip Technology SRL Centro Direzionale Colleoni Palazzo Taurus 1 V. Le Colleoni 1 20041 Agrate Brianza Milan, Italy Tel: 39-039-65791-1 Fax: 39-039-6899883
United Kingdom
Microchip Ltd. 505 Eskdale Road Winnersh Triangle Wokingham Berkshire, England RG41 5TU Tel: 44 118 921 5869 Fax: 44-118 921-5820
10/18/02
DS40035C-page 66 Preliminary  2002 Microchip Technology Inc.
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