Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949==
•Microchip products meet the specification contained in their particular Microchip Data Sheet.
•Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•Microchip is willing to work with the customer who is concerned about the integrity of their code.
•Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
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conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
QUALITY MANAGEMENT S
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
DS50002853A-page 4 2019 Microchip Technology Inc.
dsPIC33CH512MP506 DIGITAL
POWER PIM USER’S GUIDE
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and
documentation are constantly evolving to meet customer needs, so some actual dialogs
and/or tool descriptions may differ from those in this document. Please refer to our website
(www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each
page, in front of the page number. The numbering convention for the DS number is
“DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level
of the document.
For the most up-to-date information on development tools, see the MPLAB
Select the Help menu, and then Topics to open a list of available online help files.
®
IDE online help.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
dsPIC33CH512MP506 Digital Power Plug-In Module (PIM). Items discussed in this
chapter include:
• Document Layout
• Conventions Used in this Guide
• Recommended Reading
• The Microchip Website
• Product Change Notification Service
• Customer Support
• Document Revision History
DOCUMENT LAYOUT
This document provides an overview of the dsPIC33CH512MP506 Digital Power PIM.
The document is organized as follows:
• Chapter 1. “Overview” — This chapter introduces the dsPIC33CH512MP506
Digital Power PIM and provides a brief overview of its various features.
•
Appendix A. “Board Layout and Schematics”
schematics and the board layouts for the dsPIC33CH512MP506 Digital Power PIM.
• Appendix B. “Bill of Materials (BOM)” — This appendix presents the Bill of
Materials for the dsPIC33CH512MP506 Digital Power PIM.
• Appendix C. “Characterization Data” — This appendix provides
characterization data and guidance on sub-circuits of
Digital Power PIM
Choice of mutually exclusive
arguments; an OR selection
Represents code supplied by
user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options]
errorlevel {0|1}
var_name...]
void main (void)
{ ...
}
DS50002853A-page 6 2019 Microchip Technology Inc.
RECOMMENDED READING
This user’s guide describes how to use the dsPIC33CH512MP506 Digital Power PIM.
Other useful document(s) are listed below. The following Microchip document is
available and recommended as a supplemental reference resource:
• “dsPIC33CH128MP508 Family Data Sheet” (DS70005319)
Refer to this document for detailed information on the dsPIC33CH Dual Core
Digital Signal Controllers (DSCs). Reference information found in this data sheet
includes:
- Device memory maps
- Device pinout and packaging details
- Device electrical specifications
- List of peripherals included on the devices
THE MICROCHIP WEBSITE
Microchip provides online support via our website at www.microchip.com. This website
is used as a means to make files and information easily available to customers.
Accessible by using your favorite Internet browser, the website contains the following
information:
• Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents,
latest software releases and archived software
• General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program
member listing
• Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events; and listings of Microchip sales
offices, distributors and factory representatives
Preface
PRODUCT CHANGE NOTIFICATION SERVICE
Microchip’s customer notification service helps keep customers current on Microchip
products. Subscribers will receive e-mail notification whenever there are changes,
updates, revisions or errata related to a specified product family or development tool of
interest.
To register, access the Microchip website at www.microchip.com, click on Product Change Notification and follow the registration instructions.
Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Corporate Application Engineer (CAE)
• Embedded Solutions Engineer (ESE)
Customers should contact their distributor, representative or Embedded Solutions
Engineer (ESE) for support. Local sales offices are also available to help customers.
A listing of sales offices and locations is included in the back of this document.
Technical support is available through the website at:
http://www.microchip.com/support.
DOCUMENT REVISION HISTORY
Revision A (April 2019)
This is the initial version of this document.
DS50002853A-page 8 2019 Microchip Technology Inc.
1.1INTRODUCTION
The dsPIC33CH512MP506 Digital Power Plug-In Module (DP PIM) is a demonstration
board that, in conjunction with different power boards, showcases the Microchip
dsPIC33CH512MP506 16-Bit Digital Signal Controller (DSC) features. The DP PIM
provides access to the dsPIC33CH512MP506 analog inputs, the Digital-to-Analog
Converter (DAC) output, the Pulse-Width Modulation (PWM) outputs and the General
Purpose Input and Output (GPIO) ports.
The series of Microchip DP PIMs feature different device families, from dsPIC33E to
dsPIC33CK and dsPIC33CH. These devices have different CPU performance levels as
well as peripheral features and functions. However, even if the features and performance levels are different, all DP PIMs have the same functional card edge connector
pinout to support seamless migration between device families.
1.2FEATURES
The dsPIC33CH512MP506 DP PIM has the following features, as shown in Figure 1-1.
12. Analog input with op amp buffer via test point loop connector; can be used for
Bode plot measurements.
13. Op amp buffer for Bode input.
14. Test point loop for DAC output.
15. Test point to access RD13 (also available on card edge connector pin 12).
16. Test point to access RD15 (also available on card edge connector pin 8).
17. Op amp buffers for medium speed ADC inputs.
18. MEMS oscillator.
Board dimensions are: 51 mm (length) x 38.5 mm (width).
1.2.1Test Points
Ta bl e 1- 1 lists the test points available on the dsPIC33CH512MP506 DP PIM.
TABLE 1-1:TEST POINTS
Test Point NameFunction/Description
TP1, TP2Bode Measurement Signal Injection Point
TP3RB2_DAC1_OUT: Digital-to-Analog Converter Output
TP4Test Point for Debugging: Access to RD13 through 270 Resistor
TP5General Purpose Test Point Connected to RD15 along with LD2
(Red LED)
1.2.2Electrical Characteristics
Ta bl e 1- 2 shows the electrical characteristics of the dsPIC33CH512MP506 DP PIM.
TABLE 1-2:ELECTRICAL CHARACTERISTICS
ParameterValue
Input Voltage Range3.6 V
Current ConsumptionMinimum 82 mA, Typical 108 mA, Absolute Maximum 200 mA
Power DissipationMinimum 295 mW, Typical 414 mW, Maximum 1100 mW
Operating Temperature Range-40°C to +85°C
Note:Typical Test Conditions: Ambient Temperature +25°C, Master core running at
90 MIPS, Slave core running at 100 MIPS, all peripherals powered but not enabled,
power-on LED, LD1, active, no USB device or debugger connected.
DC to 10 VDC, Absolute Maximum 16 VDC
DS50002853A-page 10 2019 Microchip Technology Inc.
Overview
1.2.3Analog and Digital Signals
The dsPIC33CH512MP506 DP PIM ensures good signal integrity and provides all
signals needed to control a power train. These signals are divided into two main
sections: Analog and Digital.
1. Analog Section
The analog section is located at the short segment of the edge connector.
It consists of 17 signals, all referenced to the analog ground. These lines are split
into the following subsections:
• High-Speed Comparator Inputs: RC filtered with corner frequency of 10 MHz
and maximum signal rise/fall time of 33 ns. These lines are designed to be
used with on-chip comparators for signal tracking tasks, such as peak, valley
or zero-cross detections.
• High-Speed ADC Inputs: RC filtered with corner frequency of 2 MHz and
maximum signal rise/fall time of 180 ns. These lines are connected to the
Track-and-Hold (T&H) circuitry of the dedicated ADC inputs and to the
Sample-and-Hold (S&H) circuitry of the shared ADC inputs.
• Medium Speed ADC Inputs: Buffered input lines, RC filtered with corner
frequency of 1 MHz and maximum signal rise/fall time of 360 ns.
• Low-Speed ADC Inputs: RC filtered with corner frequency of 190 kHz and
maximum signal rise/fall time of 1.8 µs.
• 12-Bit DAC Output with Optional On-Board RC Filtering.
Note:RC filtering and series resistance are needed for good signal integrity, and
for reducing EMI issues. Hence, the board can be used for development
purposes under frequent plug-in/out cycles. This decoupling also increases
robustness in case of accidental shorts and EMC issues.
2. Digital Section
The digital section is located at the long segment of the edge connector.
It consists of 31 signals, all referenced to digital ground. These lines are split into
four subsections:
• High-Speed PWM Outputs: Each line has a 75 series resistance.
• Medium Speed GPIO: Each line has a 270 series resistance.
• Programing/Debugging Lines: Each line has a 100 series resistance.
• Communication Lines (SPI): Each line has a 75 series resistance.
Note:The range of the digital I/Os allows access to other peripheral functions of
the populated DSC, such as communication interfaces like I
Single-Edge Nibble Transmission (SENT), Controller Area Network (CAN),
input capture, output compare, Combinatorial Logic Cells (CLC) and more.
Please refer to the device data sheet for further information on available
functions.