Microchip DSPIC33CH512MP506 User Manual

dsPIC33CH512MP506
Digital Power
Plug-In Module (PIM)
User’s Guide
2019 Microchip Technology Inc. DS50002853A
Note the following details of the code protection feature on Microchip devices:
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated.
Microchip received ISO/TS-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona; Gresham, Oregon and design centers in California and India. The Company’s quality system processes and procedures are for its PIC devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.
®
MCUs and dsPIC® DSCs, KEELOQ
®
code hopping
QUALITY MANAGEMENT S
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR, AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus, maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB, OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo, SuperFlash, tinyAVR, UNI/O, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company, EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS, mTouch, Precision Edge, and Quiet-Wire are registered trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial Programming, ICSP, INICnet, Inter-Chip Connectivity, JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi, motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O, SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total Endurance, TSHARC, USBCheck, VariSense, ViewSpan, WiperLock, Wireless DNA, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their respective companies.
© 2019, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-4364-3
DS50002853A-page 2 2019 Microchip Technology Inc.
dsPIC33CH512MP506 DIGITAL
POWER PIM USER’S GUIDE

Table of Contents

Preface ........................................................................................................................... 5
Chapter 1. Overview
1.1 Introduction ..................................................................................................... 9
1.2 Features ......................................................................................................... 9
1.2.1 Test Points ................................................................................................ 10
1.2.2 Electrical Characteristics ........................................................................... 10
1.2.3 Analog and Digital Signals ........................................................................ 11
1.2.4 dsPIC33CH512MP506 DP PIM – PCB Edge Connector .......................... 11
1.3 UART Communication .................................................................................. 12
1.4 Low-Frequency Bode Plot Measurements ................................................... 12
Appendix A. Board Layout and Schematics
A.1 Pinout ........................................................................................................... 15
A.2 Board Schematics ........................................................................................ 17
A.3 PCB Layout .................................................................................................. 19
Appendix B. Bill of Materials (BOM)
B.1 Bill of Materials ............................................................................................. 23
Appendix C. Characterization Data
C.1 Measurement Accuracy Impacts ................................................................. 27
C.1.1 High-Speed Analog Signal Tracking Considerations ................................ 27
C.1.2 Example .................................................................................................... 29
Worldwide Sales and Service .................................................................................... 34
2019 Microchip Technology Inc. DS50002853A-page 3
dsPIC33CH512MP506 Digital Power PIM User’s Guide
NOTES:
DS50002853A-page 4 2019 Microchip Technology Inc.
dsPIC33CH512MP506 DIGITAL
POWER PIM USER’S GUIDE

Preface

NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools and documentation are constantly evolving to meet customer needs, so some actual dialogs and/or tool descriptions may differ from those in this document. Please refer to our website (www.microchip.com) to obtain the latest documentation available.
Documents are identified with a “DS” number. This number is located on the bottom of each page, in front of the page number. The numbering convention for the DS number is “DSXXXXXXXXA”, where “XXXXXXXX” is the document number and “A” is the revision level of the document.
For the most up-to-date information on development tools, see the MPLAB Select the Help menu, and then Topics to open a list of available online help files.
®
IDE online help.

INTRODUCTION

This chapter contains general information that will be useful to know before using the dsPIC33CH512MP506 Digital Power Plug-In Module (PIM). Items discussed in this chapter include:
Document Layout
Conventions Used in this Guide
Recommended Reading
The Microchip Website
Product Change Notification Service
Customer Support
Document Revision History

DOCUMENT LAYOUT

This document provides an overview of the dsPIC33CH512MP506 Digital Power PIM. The document is organized as follows:
Chapter 1. “Overview” — This chapter introduces the dsPIC33CH512MP506
Digital Power PIM and provides a brief overview of its various features.
Appendix A. “Board Layout and Schematics”
schematics and the board layouts for the dsPIC33CH512MP506 Digital Power PIM.
Appendix B. “Bill of Materials (BOM)” — This appendix presents the Bill of
Materials for the dsPIC33CH512MP506 Digital Power PIM.
Appendix C. “Characterization Data” — This appendix provides
characterization data and guidance on sub-circuits of Digital Power PIM
— This appendix presents the
the ds
PIC33CH512MP506
.
2019 Microchip Technology Inc. DS50002853A-page 5
dsPIC33CH512MP506 Digital Power PIM User’s Guide

CONVENTIONS USED IN THIS GUIDE

This manual uses the following documentation conventions:
DOCUMENTATION CONVENTIONS
Description Represents Examples
Arial font:
Italic characters Referenced books MPLAB® IDE User’s Guide
Emphasized text ...is the only compiler...
Initial caps A window the Output window
A dialog the Settings dialog A menu selection select Enable Programmer
Quotes A field name in a window or
dialog
Underlined, italic text with right angle bracket
Bold characters A dialog button Click OK
N‘Rnnnn A number in verilog format,
Text in angle brackets < > A key on the keyboard Press <Enter>, <F1>
Courier New font:
Plain Courier New Sample source code #define START
Italic Courier New A variable argument file.o, where file can be
Square brackets [ ] Optional arguments mcc18 [options] file
Curly brackets and pipe character: { | }
Ellipses... Replaces repeated text var_name [,
A menu path File>Save
A tab Click the Power tab
where N is the total number of digits, R is the radix and n is a digit.
Filenames autoexec.bat File paths c:\mcc18\h Keywords _asm, _endasm, static Command-line options -Opa+, -Opa- Bit values 0, 1 Constants 0xFF, ‘A’
Choice of mutually exclusive arguments; an OR selection
Represents code supplied by user
“Save project before build”
4‘b0010, 2‘hF1
any valid filename
[options]
errorlevel {0|1}
var_name...]
void main (void) { ... }
DS50002853A-page 6 2019 Microchip Technology Inc.

RECOMMENDED READING

This user’s guide describes how to use the dsPIC33CH512MP506 Digital Power PIM. Other useful document(s) are listed below. The following Microchip document is available and recommended as a supplemental reference resource:
dsPIC33CH128MP508 Family Data Sheet” (DS70005319)
Refer to this document for detailed information on the dsPIC33CH Dual Core Digital Signal Controllers (DSCs). Reference information found in this data sheet includes:
- Device memory maps
- Device pinout and packaging details
- Device electrical specifications
- List of peripherals included on the devices

THE MICROCHIP WEBSITE

Microchip provides online support via our website at www.microchip.com. This website is used as a means to make files and information easily available to customers. Accessible by using your favorite Internet browser, the website contains the following information:
Product Support – Data sheets and errata, application notes and sample
programs, design resources, user’s guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQs), technical
support requests, online discussion groups, Microchip consultant program member listing
Business of Microchip – Product selector and ordering guides, latest Microchip
press releases, listing of seminars and events; and listings of Microchip sales offices, distributors and factory representatives
Preface

PRODUCT CHANGE NOTIFICATION SERVICE

Microchip’s customer notification service helps keep customers current on Microchip products. Subscribers will receive e-mail notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest.
To register, access the Microchip website at www.microchip.com, click on Product Change Notification and follow the registration instructions.
2019 Microchip Technology Inc. DS50002853A-page 7
dsPIC33CH512MP506 Digital Power PIM User’s Guide

CUSTOMER SUPPORT

Users of Microchip products can receive assistance through several channels:
• Distributor or Representative
• Local Sales Office
• Corporate Application Engineer (CAE)
• Embedded Solutions Engineer (ESE)
Customers should contact their distributor, representative or Embedded Solutions Engineer (ESE) for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in the back of this document.
Technical support is available through the website at:
http://www.microchip.com/support.

DOCUMENT REVISION HISTORY

Revision A (April 2019)
This is the initial version of this document.
DS50002853A-page 8 2019 Microchip Technology Inc.

1.1 INTRODUCTION

The dsPIC33CH512MP506 Digital Power Plug-In Module (DP PIM) is a demonstration board that, in conjunction with different power boards, showcases the Microchip dsPIC33CH512MP506 16-Bit Digital Signal Controller (DSC) features. The DP PIM provides access to the dsPIC33CH512MP506 analog inputs, the Digital-to-Analog Converter (DAC) output, the Pulse-Width Modulation (PWM) outputs and the General Purpose Input and Output (GPIO) ports.
The series of Microchip DP PIMs feature different device families, from dsPIC33E to dsPIC33CK and dsPIC33CH. These devices have different CPU performance levels as well as peripheral features and functions. However, even if the features and perfor­mance levels are different, all DP PIMs have the same functional card edge connector pinout to support seamless migration between device families.

1.2 FEATURES

The dsPIC33CH512MP506 DP PIM has the following features, as shown in Figure 1-1.
dsPIC33CH512MP506 DIGITAL
POWER PIM USER’S GUIDE

Chapter 1. Overview

FIGURE 1-1: dsPIC33CH512MP506 DP PIM

1. Microchip dsPIC33CH512MP506 16-Bit DSC (64-pin TQFP package).
2. ICSP™ programming header for the Master core (6-pin, 2.54 mm header).
3. ICSP programming header for the Slave core (6-pin, 1.27 mm header – not populated).
Note: Both cores can be programmed and debugged through one ICSP interface.
4. On-board LDO with Power Good (PG) function.
5. Solder pad for ground connection.
6. Micro-USB connector.
7. MCP2221A USB to UART/I
8. Power indicator LED (Green).
9. User LED (Red).
10. Board edge connection interface for analog inputs/outputs.
11. Board edge connection interface for PWM outputs, digital peripherals and GPIO ports.
2
C serial converter.
2019 Microchip Technology Inc. DS50002853A-page 9
dsPIC33CH512MP506 Digital Power PIM User’s Guide
12. Analog input with op amp buffer via test point loop connector; can be used for Bode plot measurements.
13. Op amp buffer for Bode input.
14. Test point loop for DAC output.
15. Test point to access RD13 (also available on card edge connector pin 12).
16. Test point to access RD15 (also available on card edge connector pin 8).
17. Op amp buffers for medium speed ADC inputs.
18. MEMS oscillator.
Board dimensions are: 51 mm (length) x 38.5 mm (width).

1.2.1 Test Points

Ta bl e 1- 1 lists the test points available on the dsPIC33CH512MP506 DP PIM.
TABLE 1-1: TEST POINTS
Test Point Name Function/Description
TP1, TP2 Bode Measurement Signal Injection Point
TP3 RB2_DAC1_OUT: Digital-to-Analog Converter Output TP4 Test Point for Debugging: Access to RD13 through 270 Resistor
TP5 General Purpose Test Point Connected to RD15 along with LD2
(Red LED)

1.2.2 Electrical Characteristics

Ta bl e 1- 2 shows the electrical characteristics of the dsPIC33CH512MP506 DP PIM.
TABLE 1-2: ELECTRICAL CHARACTERISTICS
Parameter Value
Input Voltage Range 3.6 V
Current Consumption Minimum 82 mA, Typical 108 mA, Absolute Maximum 200 mA
Power Dissipation Minimum 295 mW, Typical 414 mW, Maximum 1100 mW
Operating Temperature Range -40°C to +85°C
Note: Typical Test Conditions: Ambient Temperature +25°C, Master core running at
90 MIPS, Slave core running at 100 MIPS, all peripherals powered but not enabled, power-on LED, LD1, active, no USB device or debugger connected.
DC to 10 VDC, Absolute Maximum 16 VDC
DS50002853A-page 10 2019 Microchip Technology Inc.
Overview

1.2.3 Analog and Digital Signals

The dsPIC33CH512MP506 DP PIM ensures good signal integrity and provides all signals needed to control a power train. These signals are divided into two main sections: Analog and Digital.
1. Analog Section
The analog section is located at the short segment of the edge connector. It consists of 17 signals, all referenced to the analog ground. These lines are split into the following subsections:
• High-Speed Comparator Inputs: RC filtered with corner frequency of 10 MHz and maximum signal rise/fall time of 33 ns. These lines are designed to be used with on-chip comparators for signal tracking tasks, such as peak, valley or zero-cross detections.
• High-Speed ADC Inputs: RC filtered with corner frequency of 2 MHz and maximum signal rise/fall time of 180 ns. These lines are connected to the Track-and-Hold (T&H) circuitry of the dedicated ADC inputs and to the Sample-and-Hold (S&H) circuitry of the shared ADC inputs.
• Medium Speed ADC Inputs: Buffered input lines, RC filtered with corner frequency of 1 MHz and maximum signal rise/fall time of 360 ns.
• Low-Speed ADC Inputs: RC filtered with corner frequency of 190 kHz and maximum signal rise/fall time of 1.8 µs.
• 12-Bit DAC Output with Optional On-Board RC Filtering.
Note: RC filtering and series resistance are needed for good signal integrity, and
for reducing EMI issues. Hence, the board can be used for development purposes under frequent plug-in/out cycles. This decoupling also increases robustness in case of accidental shorts and EMC issues.
2. Digital Section
The digital section is located at the long segment of the edge connector. It consists of 31 signals, all referenced to digital ground. These lines are split into four subsections:
• High-Speed PWM Outputs: Each line has a 75 series resistance.
• Medium Speed GPIO: Each line has a 270 series resistance.
• Programing/Debugging Lines: Each line has a 100 series resistance.
• Communication Lines (SPI): Each line has a 75 series resistance.
Note: The range of the digital I/Os allows access to other peripheral functions of
the populated DSC, such as communication interfaces like I Single-Edge Nibble Transmission (SENT), Controller Area Network (CAN), input capture, output compare, Combinatorial Logic Cells (CLC) and more. Please refer to the device data sheet for further information on available functions.
2
C, SPI, UART,

1.2.4 dsPIC33CH512MP506 DP PIM – PCB Edge Connector

The dsPIC33CH512MP506 DP PIM has an edge connector compatible with any application board that provides a mating socket.
The mating socket type is Samtec, Inc.: MECF-30-01-L-DV-WT.
2019 Microchip Technology Inc. DS50002853A-page 11
dsPIC33CH512MP506 Digital Power PIM User’s Guide

1.3 UART COMMUNICATION

The on-board USB to UART serial bridge enables easy serial connection to PCs. The USB port can provide power to the Digital Power PIM and allows the user to communicate with the dsPIC
The USB driver package and software tool support of the MCP2221A serial converter also offers free terminal software for I generic API drivers for custom software development. Please visit the MCP2221A product web page for more details (www.microchip.com).

1.4 LOW-FREQUENCY BODE PLOT MEASUREMENTS

The dsPIC33CH512MP506 device, along with an additional on-board circuitry, allows Bode plot measurements to be performed without the need for an isolation transformer. The transformer might still be required if the injected signal tends to be at a very low frequency (for instance, in case of Power Factor Correction (PFC) applications).
Perform the following steps:
1. Solder the 150 resistor from position R74 to R94. Make sure that the
RD10_S1AN13_IN line is not driven by any other low-impedance source.
2. Run the power stage in Open-Loop mode with a fixed duty cycle.
3. Connect the Bode 100 AC output to TP1 and TP2. The on-board operational amplifier will add a V needed.
4. Connect RB2_DAC1_OUT to CH2 of the Bode 100.
5. Use the S1AN13 input to sample the signal from Bode 100 in every PWM cycle at Frequency Switching (f
6. Remove the V is needed).
7. Add sampled AC signal to the nominal duty cycle (PDCx) (action in firmware is needed).
8. Use a second dedicated ADC core input (ANx) to sample the output of the plant at FSW. The output can be:
• Output voltage.
• Average coil current sampled at T
9. Duty cycle input and plant output are converted into an analog signal using RB2_DAC1_OUT.
The measured transfer function is the plant (power stage and digital modulator), after scaling and ADC sampling, versus digital duty cycle input (PDCx).
DD/2 offset to regain a signal with no DC value (action in firmware
®
Digital Signal Controller (DSC).
2
C Master and Slave emulation, as well as
DD/2 (1.65V) offset. In this case, no injection transformer is
SW) (action in firmware is needed).
ON/2, where TON is the switch-on time.
Note: Due to run-time delays of Sample-and-Hold circuits and conversion time of
ADC and DAC, this measurement is only recommended for low-frequency measurements: a maximum two decades below sampling frequency.
DS50002853A-page 12 2019 Microchip Technology Inc.
Overview
Power Stage
PWM
V
OUT
VIN
Nominal
Duty RaƟo
Output
+
Signal InjecƟŽŶ
S1AN13
V/2
Remove Oīset
In
Bode 100
In
DAC1
Bode 100
Generator
V/2
50R
CH2
CH1
V
BODE
G = 2
VÃÖ =
V/2 + 2 x VÊ
Output
Power Stage
PWM
VOUT
V
IN
Compensator
Output
Bode 100
Generator
In
Bode 100
In
V/2
Signal
InjecƟŽn
ANx
V/2
Remove Oīset
Min/Max
Clamp
Reference
S1AN13
+
DAC1
50R
CH2
CH1
V
BODE
VÃÖ =
V/2 + 2 x VÊ
Output
Figure 1-2 and Figure 1-3 show examples of schemes of plant and closed-loop
measurements, respectively.

FIGURE 1-2: SCHEME OF PLANT MEASUREMENT

FIGURE 1-3: SCHEME OF CLOSED-LOOP MEASUREMENT

2019 Microchip Technology Inc. DS50002853A-page 13
dsPIC33CH512MP506 Digital Power PIM User’s Guide
NOTES:
DS50002853A-page 14 2019 Microchip Technology Inc.
dsPIC33CH512MP506 DIGITAL
POWER PIM USER’S GUIDE

Appendix A. Board Layout and Schematics

This appendix contains the pinout, the schematics and the board layouts for the dsPIC33CH512MP506 DP PIM.
Pinout
Board Schematics
PCB Layout

A.1 PINOUT

Pinout and electrical parameters are shown in Ta bl e A -1 .

TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS

Edge
Name
GND_A 1 20 Analog Ground
GND_A 2 20 Analog Ground
RB2_DAC1_OUT 3 33 DAC Output, Optional RC
RC7_AN15_IN 4 32 Analog Input, RC Filtered Fc = 190 kHz, tr = 1.8 µs
RC0_S1AN10_IN 5 13 Analog Input, RC Filtered F
RC2_S1ANA0_IN 6 23 Analog Input, RC Filtered Fc = 1 MHz, tr = 360 ns – Buffered
—7— —
RC3_S1CMP3B_IN 8 27 Analog Input, RC Filtered F
RD11_S1AN17_IN 9 30 Analog Input, RC Filtered Fc = 1 MHz, tr = 360 ns – Buffered
RC1_S1ANA1_IN 10 22 Analog Input, RC Filtered Fc = 1 MHz, tr = 360 ns – Buffered
RA2_S1AN16_IN 11 16 Analog Input, RC Filtered F
RA3_S1AN0_IN 12 17 Analog Input, RC Filtered F
RA1_AN1_IN 13 15 Analog Input, RC Filtered F
RA4_S1AN1_IN 14 18 Analog Input, RC Filtered F
RA0_AN0_IN 15 14 Analog Input, RC Filtered Fc = 1.9 MHz, tr = 180 ns
RD10_S1AN13_IN 16 31 Analog Input, RC Filtered F
RD12_S1AN14_IN 17 21 Analog Input, RC Filtered F
RC6_S1CMP1B_IN 18 24 Analog Input, RC Filtered Fc = 10 MHz, tr = 33 ns
—19— —
RB1_S1AN4_IN 20 29 Analog Input, RC Filtered F
Slot 21 Slot Slot Slot
Slot 22 Slot Slot Slot
—23— —
RC8_RP56_ASDA1 24 36 Digital General Purpose 75R Series Resistance
RB12_RP44 25 63 Digital General Purpose 270R Series Resistance
RD14 26 11 Digital General Purpose 270R Series Resistance
RB13_RP45 27 64 Digital General Purpose 270R Series Resistance
Connector
Pin
Device
Pin
Function/Description Remarks
560R Series Resistance
Filter
= 1 MHz, tr = 360 ns – Buffered
c
= 10 MHz, tr = 33 ns
c
= 190 kHz, tr = 1.8 µs
c
= 1.9 MHz, tr = 180 ns
c
= 1.9 MHz, tr = 180 ns
c
= 1.9 MHz, tr = 180 ns
c
= 190 kHz, tr = 1.8 µs
c
= 190 kHz, tr = 1.8 µs
c
= 190 kHz, tr = 1.8 µs
c
2019 Microchip Technology Inc. DS50002853A-page 15
dsPIC33CH512MP506 Digital Power PIM User’s Guide
TABLE A-1: PINOUT AND ELECTRICAL PARAMETERS (CONTINUED)
Edge
Name
RD9 28 38 Digital General Purpose 270R Series Resistance
—29— —
—30— —
RD6_S1PWM6H 31 43 PWM Output 75R Series Resistance
RC9_ASCL1 32 37 Digital General Purpose 75R Series Resistance
RD5_S1PWM6L 33 44 PWM Output 75R Series Resistance
RB11 34 62 Digital General Purpose 270R Series Resistance
RB14_S1RP46 35 1 Digital General Purpose 270R Series Resistance
RB10 36 61 Digital General Purpose 270R Series Resistance
RD4_S1PWM3H 37 54 PWM Output 75R Series Resistance
RB15_S1RP47 38 2 Digital General Purpose 270R Series Resistance
RD2_RP66 39 58 Digital General Purpose 270R Series Resistance
RC5_S1PWM2L 40 51 PWM Output 75R Series Resistance
RD3_S1PWM3L 41 55 PWM Output 75R Series Resistance
RC4_S1PWM2H 42 50 PWM Output 75R Series Resistance
RD1_S1PWM4H 43 59 PWM Output 75R Series Resistance
RD0_S1PWM4L 44 60 PWM Output 75R Series Resistance
RC10_S1PWM1H 45 52 PWM Output 75R Series Resistance
RC12_S1RC12 46 3 Digital General Purpose 270R Series Resistance
RC11_S1PWM1L 47 53 PWM Output 75R Series Resistance
RC13_RP61 48 4 Digital General Purpose 270R Series Resistance
MCLR_IN 49 7 Device Reset 100R Series Resistance
RD7 50 42 Digital General Purpose 270R Series Resistance
RB4_PGC2 51 35 Programing/Debugging 100R Series Resistance
RD8 52 39 Digital General Purpose 270R Series Resistance
RB6_SCL2 53 46 Digital General Purpose 75R Series Resistance
RD13 54 12 Digital General Purpose 270R Series Resistance
RB5_SDA2 55 45 Digital General Purpose 75R Series Resistance
RB3_PGD2 56 34 Programing/Debugging 100R Series Resistance
DD 57 LDO VDD Rail 6.3V max, 70 mA max
V
GND_D 58 9,26,40,56 Digital Ground
DD 59 LDO VDD Rail 6.3V max, 70 mA max
V
GND_D 60 9,26,40,56 Digital Ground
Connector
Pin
Device
Pin
Function/Description Remarks
DS50002853A-page 16 2019 Microchip Technology Inc.
2019 Microchip Technology Inc. DS50002853A-page 17
Designed with
Altium.com
5600 pF 0603 25V
C37
560 pF 0603 50V
C34
560 pF 0603 50V
C33
+3.3V
0.1uF 50V 0402
C17
GND_DGND_DGND_D
GND_D
GND_A GND_A
GND_A
GND_A
GND_A
GND_A
GND_A
1k 0402 1%
R76
5600 pF 0603 25V
C32
GND_A
100 pF 0603 50V
C39
GND_A
GND_D
75R
R37
TP3
75R
R36
75R
R44
75R
R43
75R
R32
75R
R33
75R
R46
GND_A
GND_D
75R
R35
270R
R50
270R
R51
75R
R34
5600 pF 0603 25V
C36
GND_A
GND_A
5600 pF 0603 25V
C41
GND_A
100 pF 0603 50V
C40
GND_A
GND_A
560 pF 0603 50V
C30
Fg = 500 kHz
GND_D
100R
R20
100R
R21
dsPIC33CH512MP506
V
DD
57
V
DD
41
V
DD
25
V
DD
10
V
SS
40
V
SS
26
V
SS
9
RD0
60
RD1
59
RD2
58
RD3
55
RD4
54
RD5
44
RD6
43
RD7
42
RD8
39
RD9
38
RD10
31
RD11
30
RD12
21
RD13
12
RD14
11
RD15
8
MCLR
7
V
SS
56
AV
DD
19
AV
SS
20
RA0
14
RA1
15
RA2
16
RA3
17
RA4
18
RB0
28
RB1
29
RB2
33
RB3
34
RB4
35
RB5
45
RB6
46
RB7
47
RB8
48
RB9
49
RC0
13
RC1
22
RC2
23
RC3
27
RC4
50
RC5
51
RC6
24
RC7
32
RC8
36
RC9
37
RC10
52
RC11
53
RC12
3
RC13
4
RC14
5
RC15
6
RB10
61
RB11
62
RB12
63
RB13
64
RB14
1
RB15
2
U3
560 pF 0603 50V
C31
GND_A
GND_A
75R
R45
100R
R25
100R
R24
75R
R22
75R
R23
270R
R49
270R
R48
5600 pF 0603 25V
C38
GND_A
75R
R41
75R
R40
RED 0603
LD2
12 34 56 78 910 1112 1314 1516 1718 1920
2324 2526 2728 2930 3132 3334 3536 3738 3940 4142 4344 4546 4748 4950 5152 5354 5556 5758 5960
Edge Card 60
J5
RB0_CLKI
+3.3V_OPA
GND_A
0.1 μF 50V 0402
C20
GND_A
VIN-
3
VIN+
1
V
OUT
4
Vss
2
V
DD
5
MCP6V91UT
U5
RB2_DAC1_OUT
RB2_DAC1_OUT RB2_DACOUT1
RB2_DACOUT1 RB3_PGD2 RB4_PGC2
+3.3V_A
RC0_S1AN10_IN
OPA_1_IN
RB3_PGD2
MCLR_IN RB4_PGC2 RB6_SCL2 RB5_SDA2
RC7_AN15_IN
RA3_S1AN0_IN
RD10_S1AN13_IN
RC2_S1ANA0_IN
RC1_S1ANA1_IN
RC8_RP56_ASDA1
RC2_S1ANA0
RC1_S1ANA1_IN
RC0_S1AN10_IN
RC7_AN15_IN
RD11_S1AN17_IN
OPA_1
+3.3V_OPA
RD15_LED
1k 0402 1%
R77
+3.3V_OPA
GND_A
0.1 μF 50V 0402
C21
GND_A
VIN-
3
VIN+
1
V
OUT
4
Vss
2
V
DD
5
MCP6V91UT
U6
OPA_2
+3.3V_OPA
1k 0402 1%
R78
+3.3V_OPA
GND_A
0.1 μF 50V 0402
C22
GND_A
VIN-
3
VIN+
1
V
OUT
4
Vss
2
V
DD
5
MCP6V91UT
U7
OPA_3
+3.3V_OPA
+3.3V_OPA
GND_A
0.1 μF 50V 0402
C23
GND_A
VIN-
3
VIN+
1
V
OUT
4
Vss
2
V
DD
5
MCP6V91UT
U8
OPA_4
+3.3V_OPA
1k 0402 1%
R79
OPA_1_IN
OPA_2_IN
OPA_3_IN
OPA_4_IN
OPA_2_IN
RD11_S1AN17_IN
OPA_3_INOPA_4_IN
150R 0603 1%
R75
150R 0603 1%
R60
150R 0603 1%
R63
150R 0603 1%
R64
150R 0603 1%
R71
150R 0603 1%
R61
150R 0603 1%
R62
150R 0603 1%
R69
150R 0603 1%
R70
5600 pF 25V 0603
C43
5600 pF 25V 0603
C44
150R 0603 1%
R72
10k 0402
0.5%
R95
49.9R 0805 1%
R90
GND_A
Vbode_max = 1 Vrms
TP LOOP Yellow
TP2
V
BODE
TP LOOP Black
TP1
49.9R
0603 1%
R93
GND_A
10k
0402 0.5%
R92
0.1 μF 50V 0402
C51
GND_A
10k
0402 0.5%
R91
3.3k 0402
0.5%
R96
VIN-
3
VIN+
1
V
OUT
4
Vss
2
V
DD
5
MCP6V91UT
U4
+3.3V_OPA
+3.3V_OPA
GND_A
0.1 μF 50V 0402
C24
GND_A
+3.3V_OPA
VB_inj = Vcc/2 – V
BODE
27R 0603 1%
R67
27R 0603 1%
R68
27R 0603 1%
R66
27R 0603 1%
R74
1 μF 10V 0402
C13
1 μF 10V 0402
C14
1 μF 10V 0402
C15
1 μF 10V 0402
C16
22pF 50V0402
C50
MCLR
+3.3V
MASTER Programing
GND_D
1
2
3
4
5
6
HDR-2.54 Male 1x6
J1
RB3_PGD2 RB4_PGC2
MCLR
+3.3V
GND_D
100R
0402 1%
R13
10k 0402 1%
R12
56 pF 50V 0402
C25
MCLR_IN
MCLR_IN
SDA2
SCL2
UART TX
UART RX
RC14_UART TX
RC15_UART RX
+3.3V
SLAVE Programing
GND_D
+3.3V
GND_D
1 2 3 4 5 6
HDR-1.27 Male 1x6 STAG
DNP
J2
10k 0402 1%
R14
100R
0402 1%
R15
RB7_S1MCLR1
RB8_S1PGD1 RB9_S1PGC1
MCLR_IN
RC7_AN15
RC0_S1AN10
RC3_S1CMP3B_IN
RC3_S1CMP3B_IN
RC3_S1CMP3B
RC1_S1ANA1
RC2_S1ANA0_IN
RA2_S1AN16_IN
RA2_S1AN16_IN
RA2_S1AN16
RA3_S1AN0_IN
RA3_S1AN0
RA1_AN1
RA1_AN1_IN
RA1_AN1_INRA4_S1AN1_IN
RA4_S1AN1_IN
RA4_S1AN1
RA0_AN0_IN
RA0_AN0_INRA0_AN0
RD10_S1AN13_IN
RD12_S1AN14_IN
RD12_S1AN14_IN
RC6_S1CMP1B
RC6_S1CMP1B_IN
RC6_S1CMP1B_IN RB1_S1AN4_IN
RB1_S1AN4
5600 pF 0603 25V
C35
GND_A
150R 0603 1%
R65
RB1_S1AN4_IN
RD10_S1AN13 RD11_S1AN17 RD12_S1AN14
5600 pF 0603 25V
C42
RC8_RP56_ASDA1
RB12_RP44
RB12_RP44
RD14
RD14
RB13_RP45
RB13_RP45
RD9
RD9
RD6_S1PWM6H
RD6_S1PWM6H
RD5_S1PWM6L
RD5_S1PWM6L
RC9_ASCL1
RC9_ASCL1
RB11
RB14_S1RP46
RB14_S1RP46
RB10
RB10 RB11
RD4_S1PWM3H
RD4_S1PWM3H
RD3_S1PWM3L
RD3_S1PWM3L
RB15_S1RP47
RB15_S1RP47
RD2_RP66
RD2_RP66
RC5_S1PWM2L
RC5_S1PWM2L
RC4_S1PWM2H
RC4_S1PWM2H
RD1_S1PWM4H
RD1_S1PWM4H
RD0_S1PWM4L
RD0_S1PWM4L
RC10_S1PWM1H
RC10_S1PWM1H RC11_S1PWM1L
RC11_S1PWM1L
RC12_S1RC12
RC12_S1RC12
RC13_RP61
RC13_RP61
RD7
RD7
RD8
RD8
RB6_SCL2
RB5_SDA2
RB6_SCL2
RB5_SDA2
RD13
RD13
RC15_UART RX
RC14_UART TX
RD15_LED
RB7_S1MCLR1 RB8_S1PGD1 RB9_S1PGC1
270R
R42
270R
R47
270R
R26
270R
R27
270R
R28
270R
R29
270R
R30
270R
R31
270R
R38
270R
R39
0.1 μF 50V 0402
C18
GND_D
+3.3V
75R 0402 1%
R11
RB0_CLKI
STB
1
GND
2
OUT
3
V
DD
4
8.000 MHz DSC6011JI2A-008.0000
Y1
0603 DNP
C45
560R 0603 1%
R80
GND_A
GND_A
+3.3V_OPA
+3.3V_OPA
150R 0603 1%
DNP
R94
Bode_Inj
Bode_Inj
56 pF 50V 0402
C26
R72 and R94 are alternate places for the same resistor. It forms an isolation switch for Bode 100 Signal Injection.
DB2S31000L
D4
DB2S31000L
D3
DB2S31000L
D6
DB2S31000L
D5
+VDD_EXT
3.3k 0402 1%
R81
270R -> RES2134
TP LOOP Yellow
TP4
TP LOOP Yellow
TP5

A.2 BOARD SCHEMATICS

Figure A-1 and Figure A-2 show the board schematics.

FIGURE A-1: dsPIC33CH512MP506 DIGITAL POWER PIM SCHEMATIC REV. 1.0 (PAGE 1 OF 2)

Board Layout and Schematics
DS50002853A-page 18 2019 Microchip Technology Inc.
Designed with
Altium.com
10k 0402 1%
R1
270R
0402 1%
R4
270R
0402 1%
R5
+3.3V +3.3V
V
DD
16
GP0
1
GP1
2
RST
3
UART RX
4
UART TX
5
GP2
6
GP3
7
SDA
8
SCL
9
V
USB
10
D-
11
D+
12
Vss
13
EP
17
NC
14
NC
15
MCP2221-I/ML
U1
4.7k 0402 1%
R6
4.7k 0402 1%
R7
SDA2
SCL2
UART TX
UART RX
GND_D
+VDD_EXT
+3.3V
GND_DGND_D
3.6V . .6 V
MAX
from Edge Connector
+5V_USB
0.1 μF 50V 0402
C8
GND_D
3.3k 0402 1%
R8
GREEN 0603
LD1
V
IN
1
SHDN
3
GND
2
PWRGD
4
V
OUT
5
MCP1755/3.3V
U2
MCLR_IN
MCLR_IN
GND_A
0R 0603
R9
GND_D
0R 0603
R10
Shield
“Shield” = Bottom copper pour connection
+3.3V_A
GND_A
+3.3V_OPA
+3.3V
GND_A
1 μF 10V 0402
C6
0.47 μF
6.3V 0402
C7
10 μF 10V 0603
C9
10 μF 10V 0603
C10
10 μF 10V 0603
C11
10 μF 10V 0603
C12
600R 0402 900 mA
FB3
600R 0402 900 mA
FB5
600R 0402 900 mA
FB6
600R 0402 900 mA
FB7
GND_U
GND_U
SBR1A20T5
D2
1 2 3 4 50
DNGV5+ -D+DDI
Micro-AB Receptacle
USB2.0 MICRO-B FEMALE
J3
GND_S
+5V_USB
USB_N
USB_P
3
1
4
2
744230900
L1
WE CNSW
1
2
3
456
82400152
D1
GND_U
USB Port
0.1 μF 50V 0402
C3
47 pF 50V 0402
C1
47 pF 50V 0402
C2
GND_U GND_UGND_U
GND_U
600R 0402 900 mA
FB4
USB/UART-I2C Interface
600R 0402 900 mA
FB1
600R 0402 900 mA
FB2
4.7k
0402 1%
R0
15R
0402 1%
R2
15R
0402 1%
R3
0.1 μF 50V
0402
C0
5V from USB Connector

FIGURE A-2: dsPIC33CH512MP506 DIGITAL POWER PIM SCHEMATIC REV. 1.0 (PAGE 2 OF 2)

dsPIC33CH512MP506 Digital Power PIM User’s Guide
Board Layout and Schematics
Top Silkscreen
Top Copper

A.3 PCB LAYOUT

The dsPIC33CH512MP506 DP PIM is a four-layer FR4, 1.55 mm, Plated-Through-Hole (PTH) PCB construction. Figure A-3 through Figure A-5 illustrate the PCB layers and Figure A-6 shows the assembly drawings of the dsPIC33CH512MP506 DP PIM.

FIGURE A-3: dsPIC33CH512MP506 DIGITAL POWER PIM TOP SILKSCREEN AND TOP COPPER

2019 Microchip Technology Inc. DS50002853A-page 19
dsPIC33CH512MP506 Digital Power PIM User’s Guide
Mid1 Inner Copper
Mid2 Inner Copper
FIGURE A-4: dsPIC33CH512MP506 DIGITAL POWER PIM MID1 AND MID2 INNER COPPER
(BOTTOM VIEW)
DS50002853A-page 20 2019 Microchip Technology Inc.
Board Layout and Schematics
Bottom Copper
Bottom Silkscreen
FIGURE A-5: dsPIC33CH512MP506 DIGITAL POWER PIM BOTTOM COPPER AND BOTTOM
SILKSCREEN (BOTTOM VIEW)
2019 Microchip Technology Inc. DS50002853A-page 21
dsPIC33CH512MP506 Digital Power PIM User’s Guide
Top Assembly
Bottom Assembly
1
5
0
0
1
1
1
2
3
4
0
0
6
1
1
2
1
1
2
2
1
2
2
3
2
1
2
1
1
3
3
2
1
3
1
1
2
1
2
2 1
21
1 2
21
12
2
2
2
1
12
21
21
21
12
1
2
2
1
2
32
2
1
2
1
2
30 29 28
2
1
2
2
1
1
2
26 25 24
2
1
2
22 21 20
2
1
2
2
1
18 17
1
2
1
1
5
4
3
9
8
7
13
12
11
16
15
2
1
2
1
2
1
1
1
1
2
2
2
2
2
2
1
2
1
2
1
2
1
2
2
1
1
1
2
1
1
2
2
2
1
2
2
1
1
12
2
3
2
1
2
1
1
2
12
2
4
1
1
2
2
1
2
1
1
2
1
1
1
1
3
2
2
2
1
5 7
12
2
2
11 13
12
12
17
1
49
1
23
535251
1
27
575655
1
29
616059
1
33
6463
2
37
14
10
6
2
1
39
1
2
2
2
2
43 45
1
2
1
2
1
2
49
2
1
2
1
53 55
5
2 1
21
4
12 11
1
2
59
1
43
12
3
10 9
1
2
1
1
2
4
5
5
5
4
4
2 1
5
4
1
1
2
121
2
1
1 1
21
2
1 121
2
48
46
45
44
42
41
40
38
37
36
2
34
33
2
31 27
1
3
1
2
2
1
212
1
23 19
1 2
1 1
1
2 2
2
1
2
22
1
2
2
2
2
1
1
1
1
1
1
1
2
1
22
16 5
14
13 8
7
122
6251
11 1
3
2
1
5
5
4
2 2
93
11
11
251915
5450
47
43
39
35
2
4
2
3531
6258
2 1
514741
2 2
1
2
1 1
1
1
1
57
1
2 1
2
15 6
23411
22 2
0
4
0
0
17
0
2
1
1
5
0
0
1
1
1
2
3
4
0
0
6
1
268121418242830343840444650545660 10 426 20 1636 3252 48 4258

FIGURE A-6: dsPIC33CH512MP506 DIGITAL POWER PIM TOP AND BOTTOM ASSEMBLY

DS50002853A-page 22 2019 Microchip Technology Inc.

Appendix B. Bill of Materials (BOM)

This appendix contains the Bill of Materials (BOM) for the dsPIC33CH512MP506 Digital Power PIM.
Bill of Materials

B.1 BILL OF MATERIALS

Ta bl e B -1 shows the Bill of Materials for the dsPIC33CH512MP506.
dsPIC33CH512MP506 DIGITAL
POWER PIM USER’S GUIDE
TABLE B-1:
Qty Designator Description Manufacturer Manufacturer Part Number
11 C0, C3, C8, C17, C18,
C20, C21, C22, C23, C24, C51
2 C1, C2 Capacitor, Ceramic, 47 pF,
5 C6, C13, C14, C15, C16 Capacitor, Ceramic, 1 µF, 10V,
1 C7 Capacitor, Ceramic, 0.47 µF,
4 C9, C10, C11, C12 Capacitor, Ceramic, 10 µF,
2 C25, C26 Capacitor, Ceramic, 56 pF,
4 C30, C31, C33, C34 Capacitor, Ceramic, 560 pF, 50V,
9 C32, C35, C36, C37,
C38, C41, C42, C43, C44
2 C39, C40 Capacitor, Ceramic, 100 pF,
1 C50 Capacitor, HiQ, 22 pF, 50V, 5%,
1 D1 Diode, TVS Array, 82400152,
1 D2 Diode, Schottky, SBR1A20T5-7,
4 D3, D4, D5, D6 Diode, Schottky, DB2S31000L,
7 FB1, FB2, FB3, FB4,
FB5, FB6, FB7
1 J1 Connector Header-2.54, Male,
1 J3 Connector, USB 2.0, Micro-B,
dsPIC33CH512MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM)
Capacitor, Ceramic, 0.1 µF, 50V, 10%, X7R, SMD, 0402
50V, 5%, NP0, SMD, 0402
10%, X7S, SMD, 0402
6.3V, 10%, X5R, SMD, 0402
10V, 20%, X5R, SMD, 0603
50V, 5%, C0G, SMD, 0402
5%, C0G, NP0, SMD, 0603
Capacitor, Ceramic, 5600 pF, 25V, 5%, C0G, SMD, 0603
50V, 5%, NP0, SMD, 0603
NP0, 1.95 GHz, SMD, 0402
5V, USB 2.0, SMD, SOT-563
520 mV, 1A, 20V, SOD-523
470 mV, 200 mA, 30V, SMD, SOD-523
Ferrite, 600R at 100 MHz,
0.23R, 900 mA, SMD, 0402
1x6 Gold, 5.84 MH TH, Vertical
Female, TH/SMD, R/A
TDK Corporation C1005X7R1H104K050BB
®
Murata Electronics
TDK Corporation C1005X7S1A105K050BC
Murata Electronics GRM155R60J474KE19D
Samsung Group CL10A106MP8NNNC
TDK Corporation C1005C0G1H560J050BA
KEMET C0603C561J5GACTU
TDK Corporation C1608C0G1E562J080AA
AVX Corporation GMC10CG101J50NT
Johanson Technology Inc.
Wurth Elektronik 82400152
Diodes Incorporated
®
Panasonic
Murata Electronics BLM15PX601SN1D
FCI 68000-106HLF
FCI 10118194-0001LF
- ECG DB2S31000L
GRM1555C1H470JA01D
500R07S220JV4T
®
SBR1A20T5-7
2019 Microchip Technology Inc. DS50002853A-page 23
dsPIC33CH512MP506 Digital Power PIM User’s Guide
TABLE B - 1 :
Qty Designator Description Manufacturer Manufacturer Part Number
1 L1 Common-mode Choke, 90R,
1 LD1 Diode LED Green, 2V, 30 mA,
1 LD2 Diode LED Red, 1.8V, 40 mA,
3 R0, R6, R7 Resistor TKF, 4.7k, 5%, 1/10W,
3 R1, R12, R14 Resistor TKF, 10k, 1%, 1/10W,
2 R2, R3 Resistor TKF, 15R, 1%, 1/10W,
16 R4, R5, R26, R27, R28,
R29, R30, R31, R38, R39, R42, R47, R48, R49, R50, R51
2 R8, R81 Resistor TKF, 3.3k, 5%, 1/10W,
2 R9, R10 Resistor TKF, 0R, 1/10W,
15 R11, R22, R23, R32,
R33, R34, R35, R36, R37, R40, R41, R43, R44, R45, R46
6 R13, R15, R20, R21,
R24, R25
11 R60, R61, R62, R63,
R64, R65, R69, R70, R71, R72, R75
4 R66, R67, R68, R74 Resistor TKF, 27R, 1%, 1/10W,
4 R76, R77, R78, R79 Resistor TKF, 1k, 1%, 1/10W,
1 R80 Resistor TKF, 560R, 1%,
1 R90 Resistor TKF, 49.9R, 1%,
3 R91, R92, R95 Resistor TF, 10k, 0.5%, 1/16W,
1 R93 Resistor TKF, 49.9R, 1%,
1 R96 Resistor TKF, 3.3k, 0.5%,
1 TP1 Misc. Test Point, Multipurpose,
1 TP2 Misc. Test Point, PC, Mini,
1 TP3 Connector, Test Point, TAB,
dsPIC33CH512MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM) (CONTINUED)
Wurth Elektronik 744230900 100 MHz, 0.145R, 550 mA, SMD, 0603
®
, Inc. LTST-C190KGKT
RMCF0603FT150R
5001
5004
5019
35 mcd, Clear, SMD, 0603
10 mcd, Clear, SMD, 0603
SMD, 0402
SMD, 0402
SMD 0402
Resistor TKF, 270R, 5%, 1/10W, SMD 0402
SMD, 0402
SMD, 0603
Resistor TKF, 75R, 1%, 1/16W, SMD, 0402
Resistor TKF, 100R, 1%, 1/10W, SMD, 0402
Resistor TKF, 150R, 1%, 1/10W, SMD, 0603
SMD, 0603
SMD, 0402
1/10W, SMD, 0603
1/8W, SMD, 0805
SMD, 0402
1/10W, SMD, 0603
1/16W, SMD, 0402
Mini, Black
0.040", D, Yellow
Silver Mini, 3.8x2.03, SMD
Lite-On
Lite-On, Inc. LTST-C190KRKT
Panasonic® - ECG ERJ-2GEJ472X
Panasonic - ECG ERJ-2RKF1002X
Panasonic - ECG ERJ-2RKF15R0X
Panasonic - ECG ERJ-2GEJ271X
Panasonic - ECG ERJ-2GEJ332X
Yageo Corporation RC0603JR-070RL
Yageo Corporation RC0402FR-0775RL
Panasonic - ECG ERJ-2RKF1000X
Stackpole
Electronics, Inc.
Yageo Corporation RC0603FR-0727RL
Panasonic - ECG ERJ-2RKF1001X
Yageo Corporation RC0603FR-07560RL
Panasonic - ECG ERJ-6ENF49R9V
Susumu Co., LTD. RR0510P-103-D
Panasonic - ECG ERJ-3EKF49R9V
Panasonic - ECG ERA-2AED332X
Keystone Electronics
Corp.
Keystone Electronics
Corp.
Keystone Electronics
Corp.
DS50002853A-page 24 2019 Microchip Technology Inc.
Bill of Materials (BOM)
TABLE B-1:
Qty Designator Description Manufacturer Manufacturer Part Number
2 TP4, TP5 Misc. Test Point, PC, Mini,
1 U1 Microchip Interface, USB,
1 U2 Microchip Analog LDO, 3.3V,
1 U3 Microchip MCU, 16-Bit,
5 U4, U5, U6, U7, U8 Microchip Analog Op Amp,
1 Y1 Microchip Clock Oscillator,
dsPIC33CH512MP506 DIGITAL POWER PIM BILL OF MATERIALS (BOM) (CONTINUED)
0.040", D, Yellow
I2C/UART, MCP2221A-I/ML, QFN-16
MCP1755T-3302E/OT, SOT-23-5
180/200 MHz, 512/72 kB, 48/16 kB, dsPIC33CH512MP506-I/PT, TQFP-64
1-Ch, 10 MHz, MCP6V91UT-E/LTYCT-ND, SC-70-5
Single, 8.000 MHz, DSC6011JI2A-008.0000, VDFN-4
Keystone Electronics Corp.
Microchip Technology Inc.
Microchip Technology Inc.
Microchip Technology Inc.
Microchip Technology Inc.
Microchip Technology Inc.
5004
MCP2221A-I/ML
MCP1755T-3302E/OT
dsPIC33CH512MP506-I/PT
MCP6V91UT-E/LTY
DSC6011JI2A-008.0000
2019 Microchip Technology Inc. DS50002853A-page 25
dsPIC33CH512MP506 Digital Power PIM User’s Guide
NOTES:
DS50002853A-page 26 2019 Microchip Technology Inc.
dsPIC33CH512MP506 DIGITAL
f
c
1
2R
FiltCFilt

----------------------------------=
POWER PIM USER’S GUIDE

Appendix C. Characterization Data

This chapter provides some characterization data and further guidance on sub-circuits of this Digital Power PIM to allow engineers to gain a better understanding of technical limitations, as well as enable users to solve design trade-offs in additional circuits on custom boards, such as signal conditioning or auxiliary power supplies.
Note: The graphs and tables provided following this note are a statistical
summary based on a limited number of samples and are provided for informational purposes only. The performance characteristics listed herein are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified operating range (e.g., outside specified power supply range), and therefore, outside the warranted range.

C.1 MEASUREMENT ACCURACY IMPACTS

C.1.1 High-Speed Analog Signal Tracking Considerations

Each of the four groups of the analog inputs, high-speed ADC, mid-speed ADC, low-speed ADC and high-speed comparator inputs have been equipped with RC low-pass filters to prevent corruption of sampling results, such as alias-frequencies being injected into a series of ADC sampling results, and to ensure proper operation of the high-speed comparators in noisy environments. These deliberate bandwidth limitations, however, may affect the accuracy of the ADC results when tracking high-speed signals.
C.1.1.1 FILTER BANDWIDTH IMPACTS
This section discusses the influence of the RC low-pass filter bandwidth limits versus the expected sampling error to allow designers to identify the maximum signal slew rate, which can be tracked with a certain known accuracy.
The cutoff frequency, f output signal magnitude is reduced by -3dB.
The first-order RC filter cutoff frequency is defined by Equation C-1.
EQUATION C-1:
When using high-speed ADCs with sampling times of 10 ns to 50 ns or less, tracking signal transients at this frequency will also show a 3 dB offset in ADC results in accordance to the damped signal gain. To allow a more accurate analysis of the tracking error, with regards to the transient frequency, we need to look at the total gain characteristic over frequency.
of an RC low-pass filter defines the frequency at which its
c,
2019 Microchip Technology Inc. DS50002853A-page 27
dsPIC33CH512MP506 Digital Power PIM User’s Guide
Hs
1
1
s
c
----- -
+
---------------=
c
2f
c
1
R
FiltCFilt
----------------------==
Hs
1
1sR
FiltCFilt
+
---------------------------------- -
=
First-Order RC Filter Transfer Function
R = 270, C = 560 pF
The transfer function of a first-order RC low-pass filter is defined by Equation C-2 through Equation C-4.
EQUATION C-2:
EQUATION C-3:
EQUATION C-4:
FIGURE C-1: FIRST-ORDER RC LOW-PASS FILTER TRANSFER FUNCTION
DS50002853A-page 28 2019 Microchip Technology Inc.
By plotting the frequency domain transfer function of the RC filter, it is shown that the output voltage of the RC filter network at the cutoff frequency, f amplitude, but also shifted in time. While the amplitude reduction is absolute, the phase delay may require a relocation of the ADC sample trigger to achieve accurate results.
As both magnitude and phase of the RC filter output signal do not change instantly, but over frequency with varying degree, the deviation from the unfiltered feedback signal, and thus, the related ADC result deviation, may have to be considered.
, is not only damped in
c
Characterization Data

C.1.2 Example

In order to demonstrate the impact of the on-board RC filtering, the following example shows the impact when tracking the average value of a 500 kHz at 50% duty cycle current feedback signal with minimum sampling error.
Let the average value be 500 mV and the peak-to-peak voltage 200 mV, following ideal current-to-voltage conversion. Figure C-2 shows the unfiltered ideal signal along with the waveforms obtained after this signal is passed through any of the on-board RC filters. Note that the filtering does not alter the average value along (ADC Input Voltage = 0.5) any of the filtered signals. The mid-points of each filtered AC signals, however, have been shifted in time with respect to the phase delay of the RC filter. When this phase delay is not properly considered, the ADC trigger may be displaced from the desired average point of the oversampled signal, resulting in a significant measurement error.
FIGURE C-2: UNFILTERED AND FILTERED TRIANGULAR WAVEFORMS
2019 Microchip Technology Inc. DS50002853A-page 29
dsPIC33CH512MP506 Digital Power PIM User’s Guide
R
FiltCFilt
=
V
OUT
t VINt 1e
t– 
=
Depending on the application, in order to obtain the average value with the required accuracy, a time delay in the sampling trigger of the ADC might need to be introduced. In our specific case, in order to take the sample with the best accuracy, the trigger should be offset by approximately 60, 135 and 390 ns, as shown in Figure C-3.
FIGURE C-3: SAMPLING TRIGGER PLACEMENT FOR BEST ACCURACY
C.1.2.1 STEP RESPONSE DELAY ESTIMATION
Deriving from Equation C-1, the time constant of the first-order RC filter is defined by
Equation C-5, which is generally used to characterize the response of a first-order RC
filter to a step input, as shown in Equation C-6.
EQUATION C-5:
EQUATION C-6:
DS50002853A-page 30 2019 Microchip Technology Inc.
Figure C-4 shows the calculated step responses of the on-board filters normalized to
t 100
V
OUT
t VINt
VINt
----------------------------------------
=
t 100 e
t– 
=
the input voltage.
FIGURE C-4: NORMALIZED STEP RESPONSE
Characterization Data
In case a sample is taken at the filter output time, t, after the step input was applied, the percentage error with respect to the settled value can be calculated by using
Equation C-7 and Equation C-8 (substituting Equation C-6).
EQUATION C-7:
EQUATION C-8:
2019 Microchip Technology Inc. DS50002853A-page 31
dsPIC33CH512MP506 Digital Power PIM User’s Guide
t
s
max
100
---------- -


ln=
Figure C-5 depicts the remaining percentage error with respect to the sampling time.
FIGURE C-5: NORMALIZED OUTPUT ERROR
On the other hand, if a maximum tolerable percentage error, advance, the earliest time the sample should be taken can be calculated by using
Equation C-9, which is obtained from Equation C-8 by expressing t.
EQUATION C-9:
Filter capacitors on the board are either 560 pF or 5600 pF, whereas the on-chip hold capacitance is around 5 pF. Due to the large ratio of the on-board versus on-chip capacities, and for the sake of simplicity, the loading effect of the Sample-and-Hold (S&H) circuitry has been neglected here.
, is defined in
max
DS50002853A-page 32 2019 Microchip Technology Inc.
Characterization Data
Legend:
CPIN = Input Capacitance VT = Threshold Voltage
RSS = Sampling Switch Resistance RIC = Interconnect Resistance
R
S = Source Resistance CHOLD = Sample-and-Hold Capacitance
ILEAKAGE = Leakage Current at the Pin
due to Various Junctions
Note 1: The C
PIN value depends on the device package and is not tested. The effect of
the C
PIN is negligible if RS 5 k.
Demanding applications, however, might need to consider the loading effect of the S&H capacitance as well. The electrical model shown in Figure C-6 can be used to make more elaborate calculations.
FIGURE C-6:
2019 Microchip Technology Inc. DS50002853A-page 33

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