MICROCHIP ATA8352 User Manual

MICROCHIP CONFIDENTIAL

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ATA8352 Module Application Note

Introduction

This application note describes the ATA8352 module, which provides hardware setup guidance for the ATA8352
Ultra-Wide Band (UWB) device. The ATA8352 module is available in two versions:

1. A Demo version with a 48 MHz crystal used in the Demo kit

2. A TDoA version with an external clock and sync signal used in the TDoA kit

Additionally, this document provides the following:

• Current consumption data with the current profile operating in the Prover or the Verifier mode

• Bill of Material (BOM) for the module

Note:  The schematic, layout and BOM are provided in a zip folder.

© 2021 Microchip Technology Inc.

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Table of Contents

Introduction.....................................................................................................................................................1

1. Quick References....................................................................................................................................3

1.1. Reference Documentation............................................................................................................3

1.2. Acronyms and Abbreviations........................................................................................................3

2. ATA8352 Module.....................................................................................................................................4

2.1. Schematic.....................................................................................................................................4

2.2. Layout...........................................................................................................................................5

2.3. Pin Details.................................................................................................................................... 7

2.4. Bill of Material...............................................................................................................................8

3. Current Consumption Profile.................................................................................................................10

3.1. Supply Current Profile................................................................................................................ 10

3.2. Verifier Mode Current Consumption...........................................................................................10

3.3. Prover Mode Current Consumption............................................................................................11

4. RF Spectrum......................................................................................................................................... 13

5. Document Revision History...................................................................................................................14

The Microchip Website.................................................................................................................................15

Product Change Notification Service............................................................................................................15

Customer Support........................................................................................................................................ 15

Microchip Devices Code Protection Feature................................................................................................ 15

Legal Notice................................................................................................................................................. 16

Trademarks.................................................................................................................................................. 16

Quality Management System....................................................................................................................... 17

Worldwide Sales and Service.......................................................................................................................18

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1. Quick References

1.1 Reference Documentation

For further details, refer to the following:

1. ATA8352 User Guide V1.0

2. ATA8352 Datasheet V1.0

1.2 Acronyms and Abbreviations

Table 1-1. Acronyms and Abbreviations

Acronyms Abbreviations

ADC Analog-to-Digital Converter

ETSI European Telecommunications Standards Institute

FCC Federal Communications Commission

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Quick References

FLL Frequency Lock Loop

MCU Microcontroller Unit

PR Prover

RF Radio Frequency

SMA Sub Miniature version A

SSID Secure Session Identifier

SWD Serial Wire Debugger

TDoA Time Difference of Arrival

USB Universal Serial Bus

UWB Ultra-Wide Band

VR Verifier

XTAL External Crystal

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2. ATA8352 Module

The ATA8352 Module includes the following components to set up a UWB system, controlled by an external MCU
host using an SPI connection (see the following figure):

• ATA8352 Module UWB transceiver device

• 48 MHz crystal for Demo version or external clock supply for TDoA version

• SMA connector for a UWB antenna

The version V1.1 of the module does not include the following:

• UWB prefilter for the 6 GHz to 8.2 GHz band

• Integrated UWB antenna for the 6 GHz to 8.2 GHz band (Replacing the SMA connector)

Figure 2-1. ATA8352 Module (without SMA Connector)

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ATA8352 Module

2.1 Schematic

The following figure shows the overview of a schematic for the ATA8352 module. This module includes the following
components:

1. ATA8352 UWB device with BGA 33-pin package

2. SMA connector

3. 48 MHz crystal for Demo version or external clock circuitry for TDoA version

4. A 30 to 50Ω microstrip transformation line for the RFIO pin
Some components are marked as not mounted as they are not necessary for application use.

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Figure 2-2. ATA8352 Module Overview Schematic

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ATA8352 Module

2.2 Layout

The following figure shows the top layer of the ATA8352 module with the routing of the RF path and GND routing of
the ATA8352 device with the blocking capacitors. The structure connection between the PCB and SMA connector
contains a 30 to 50Ω convertor. The recommended guidelines are:

1. Use the same structure and follow the GND connection, as shown in the ATA8352 device layout and the
capacitors to achieve the required sensitivity level. The layout shown in the following figure is designed in such
a way to avoid loop connections for the power and ground supplies.

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Figure 2-3. ATA8352 – Top Layer and Components

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ATA8352 Module

2. Place three vias below the ATA8352 device for the GND connection.

3. Place a short and straight connection for the RF path to the SMA connector and copy the 30 to 50Ω
conversion.
The following figure illustrates the module footprint.

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Figure 2-4. ATA8352 Module Footprint (dimension in mm)

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ATA8352 Module

2.3 Pin Details

The following table describes the ATA8352 module pin details. Refer to Figure 2-1 for the signal names.

Table 2-1. ATA8352 Module Pin Details

Name Description

ENA (Optional) Active high input to enable the DC/DC converter for 1.25V supply

GND GND connection

VDD_1V2 1.25V supply connection (use either external 1.25V supply or the on-module DCDC converter if

mounted. Do not use both supplies.)

GND GND connection

VDD_IO 3.3V IO supply connection

GND GND connection

MST-CLK 4 MHz master clock output from the ATA8352

N-RST Active low reset input signal for the ATA8352

SPI-CLK SPI clock input signal for the ATA8352

SPI-CE Active high SPI chip enable signal for the ATA8352

SPI-MISO SPI MISO input signal for the ATA8352

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...........continued

Name Description

SPI-MOSI SPI MOSl output signal from the ATA8352

GPO-4 GPO4 signal from the ATA8352

GPO-3 GPO3 signal from the ATA8352

GPO-2 GPO2 signal from the ATA8352

GPO-1 GPO1 signal from the ATA8352

GPO-0 GPO0 signal from the ATA8352

GND GND connection

IRQ Active high interrupt output from the ATA8352

48M 48 MHz input clock

RF SMA 50Ω antenna connector footprint

SYNC Synchronization input signal

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ATA8352 Module

2.4 Bill of Material

The following table provides the Bill of Material (BOM) for the ATA8352 module.

Table 2-2. ATA8352 Module BOM

Designator Description Quantity Value

C2 Ceramic capacitor, SMD 0402, X5R, 10V, 10% 1 1 µF

C4 Ceramic capacitor, SMD 0402, X7R, 16V, +/-10% (de19761) 1 1000 pF

C5 Ceramic capacitor, SMD 0201, C0G, 25V, +/-0.25pF 1 100 pF

C6 Ceramic Capacitor, KEMET CBR02C149B5GAC,

HF-Capacitor C0G / NP0, 1.4 pF, 50 V, HiQ-CBR, ± 0.1pF, 125 °C, SMD
0201

C6 (Alternative) Murata GCM0335C1E1R5CA16, AEC-Q200, HF-Capacitor C0G / NP0,

1.5 pF, 50 V, HiQ-CBR, ± 0.25pF, 125 °C, SMD 0201

C7 Ceramic capacitor, SMD 0402, X7R, 16V, +/-10% (de19761) 1 0.1 µF

C8 Ceramic capacitor, SMD 0201, C0G, 25V, +/-0.25pF 1 100 pF

C9 Ceramic capacitor, SMD 0402, X7R, 16V, +/-10% (de19761) 1 0.1 µF

C10 Ceramic capacitor, SMD 0402, X7R, 16V, +/-10% (de19761) 1 0.1 µF

C11 Ceramic capacitor, SMD 0201, C0G, 25V, +/-0.25pF 1 100 pF

C12 Ceramic capacitor, SMD 0201, C0G, 25V, +/-0.25pF 1 100 pF

1 1.4 pF

1 1.5 pF

C13 Ceramic capacitor, SMD 0201, C0G, 25V, +/-0.25pF 1 100 pF

C15 Ceramic capacitor, SMD 0201, C0G, 25V, +/-0.25pF 1 100 pF

C17 Ceramic capacitor, SMD 0402, X7R, 16V, +/-10% (de19761) 1 0.1 µF

C18 Ceramic capacitor, SMD 0201, C0G, 25V, +/-0.25pF 1 100 pF

C19 Ceramic capacitor, SMD 0402, X7R, 16V, +/-10% (de19761) 1 0.1 µF

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ATA8352 Module

...........continued

Designator Description Quantity Value

L2 Chip inductor, SMD 0402, Murata LQW15AN3N3B80D, Fixed Inductors

Rdc = 30 mOhms , 3.3nH, Ir = 2000mA +/-0.1nH

L3 (Optional) Johanson Technology L-14C56NJV4T Inductor RF, 0603,

56NH,

5%

R3 RES 2.2 KΩ, 1/20W, 5%, 0201 SMD 1 47k

R4 RES 2.2 KΩ, 1/20W, 5%, 0201 SMD 1 47k

R7 Thick film resistor, SMD 0201, 1/20W, 5% 1 0R

U1 UWB TRX 1 ATA8352

X2 CONN SMA Jack R/A 500 Ω Edge MNT high frequency 26.5 GHz 1 901-10512-3

XC1 SMD crystal ECX-2236 series, 48 MHz

Refer to crystal specification in ATA8352 datasheet.

1 3.3 nH

1 BLM11B050A

1 48 MHz

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3. Current Consumption Profile

This chapter provides the ATA8352 module's current consumption profiles of the Prover and Verifier modes. The
measurement conditions are:

• t

• VDDIO = 3.0V

Note:  The data sheet defines the electrical characteristics of the ATA8352 module's RF and IO pins. The 3.3V IO
supply provides voltage to the DC/DC converter on the module.

3.1 Supply Current Profile

The supply current profile for a complete Verifier operation including power-up, initialization, calibration of the Verifier
offset mode with Prover response and power-down is shown in Figure 3-1, Figure 3-2 and Figure 3-3. The figures
show the analog signals, VDD_CORE (supply voltage for the core), IDD_CORE (supply current for the core) at 1.25V
and IDD_SUP at 3.3V (supply domain), and the digital signals, N_RST, 1V2_ENA, SPI_CE, IRQ and Controller state
signals. The complete sequence of operations requires ~7.6 ms. The measurement was performed with the
evaluation kit using a SAMC21 MCU with 48 MHz clock and an SPI communication with an 8 MHz clock frequency.
The supply current (IDD_SUP) includes the current for the VDD_IO domain and the current for a DC/DC converter to
supply the VDD_CORE domain (the DC/DC converter used for the measurement is TPS62244-Q1 with a 1.25V
output voltage).

Following is the sequence operation:

1. The DC/DC is switched On at -7.1 ms when the signal, 1V2_ENA, is set to high and, after 1 ms, release the

2. Switch On the crystal oscillator at -5.8 ms.

3. Load the device registers.

4. Initialize the PLL at -3.7 ms and the calibration of the FLL RX at -3.2 ms.

5. Set the RF RX and TX frequencies at -1.7 ms, and enter the READY mode at -1.0 ms.

= 25°C

ambient

N_RST signal.

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Current Consumption Profile

3.2 Verifier Mode Current Consumption

The Verifier mode, VRo, is started with the transmission state and the controller state at 1101 (for details, refer to the
ATA8352 User Manual). See the following figure. The turnaround phases follow this and receive a locked state at

0110. The IRQ signal is activated when the receive is complete and the registers are read. Enable the reset signal
(N_RST) to start the power-down sequence and disable the DC/DC converter.

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Figure 3-1. Current Profile for Verifier Operation

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Current Consumption Profile

The following figure (zoomed in from -2.0 to 2.0 ms) shows the Verifier operation in VRo mode.

Figure 3-2. Current Profile for the Verifier Mode VRo

3.3 Prover Mode Current Consumption

When starting the Prover mode, the device switches to the RX mode to search for a preamble.

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Current Consumption Profile

The following figure shows the Prover mode, PRo, where the initialization occurs similarly to the sequence in Figure

3-2. The Prover is operating in the Receiver Search mode as the controller state at 0101 indicates. When a valid

preamble and sync word are received, the Receiver Locked mode is entered as the controller state at 0110 shows.

When the data telegram is received, the turnaround sequence is executed and the Prover transmits the telegram, as
the controller state at 1101 shows. This sequence is completed with an IRQ and the activation of the Prover mode,
PRo, for the next data telegram.

Figure 3-3. Current Profile for the Prover Mode PRo

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4. RF Spectrum

The following figure shows the RF spectrum for the ATA8352 module for the composite signal (with low and high
modulation switched on).

Note:  The RF filter is not used in the current version of the module, that is, the spectrum shown is the RF output
signal of the device with the default settings, fTX at 6.52 GHz.

Figure 4-1. RF Spectrum for Composite Signal

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RF Spectrum

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5. Document Revision History

Revision Date Section Description

A 01/2021 Document Initial Revision

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Document Revision History

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