2004 Microchip Technology Inc. DS21796D-page 1
93AA76A/B/C, 93LC76A/B/C,
93C76A/B/C
Device Selection Table
Features
• Low-power CMOS technology
• ORG pin to select word size for ‘76C’ version
• 1024 x 8-bit organization ‘A’ devices (no ORG)
• 512 x 16-bit organization ‘B’ devices (no ORG)
• Program Enable pin to write-protect the entire
array (except on SOT-23 packages)
• Self-timed ERASE/WRITE cycles (including
auto-erase)
• Automatic ERAL before WRAL
• Power-on/off data protection circuitry
• Industry standard 3-wire serial I/O
• Device St a tus signal (READ Y/BUSY
)
• Sequential READ function
• 1,000,000 E/W cycles
• Data retention > 200 years
• Temperature ranges supported:
Pin Function Table
Description
The Microchip Technology Inc. 93X X7 6A/ B/C d evices
are 8K bit, low-voltage, serial Electrically Erasable
PROMs (EEPROM). Word-selectable devices such as
the 93XX76C are dependent upon external logic
levels driving the ORG pin to set word size. For
dedicated 8-bit communication, the 93XX76A devices
are available, while the 93XX76B devices provide
dedicated 16-bit communication, available on SOT-23
devices only. A Program Enable (PE) pin allows the
user to write-protect the entire memory array.
Advanced CMOS technology makes these devices
ideal for low-power, nonvolatile memory application s.
The 93XX Series is available in standard packages
including 8-lead PDIP and SOIC, and advanced
packaging including 8-lead MSOP, 6-lead SOT-23,
and 8-lead TSSOP. Pb-free (Pure Mat te Sn) finish is
also available.
Package Types (not to scale)
Part Number VCC Range ORG Pin PE Pin Word Size Temp Ranges Packages
93AA76A 1.8-5.5 No No 8-bit I OT
93AA76B 1.8- 5-5 No No 16-bit I OT
93LC76A 2.5-5.5 No No 8-bit I, E OT
93LC76B 2.5-5.5 No No 16-bit I, E OT
93C76A 4.5-5.5 No No 8-bit I, E OT
93C76B 4.5-5.5 No No 16-bit I, E OT
93AA76C 1.8-5.5 Yes Yes 8 or 16-bit I P, SN, ST, MS
93LC76C 2.5-5.5 Yes Yes 8 or 16-bit I, E P, SN, ST, MS
93C76C 4.5-5.5 Yes Yes 8 or 16-bit I, E P, SN, ST, MS
- Industrial (I) -40°C to +85°C
- Automotive (E) -40°C to +125°C
Name Function
CS Chip Select
CLK Serial Data Clock
DI Serial Data Input
DO Serial Data Output
V
SS Ground
PE Program Enable
ORG Memory Configuration
V
CC Power Supply
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
V
CC
PE
ORG
V
SS
PDIP/SO IC
(P, SN)
TSSOP/MSOP
CS
CLK
DI
DO
1
2
3
4
8
7
6
5
V
CC
PE
ORG
V
SS
(ST, MS
)
SOT-23
DO
V
SS
DI
1
2
3
6
5
4
V
CC
CS
CLK
(OT)
8K Microwire Compatible Serial EEPROM
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 2 2004 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings
(†)
VCC.............................................................................................................................................................................7.0V
All inputs and outputs w.r.t. V
SS ......................................................................................................... -0.6V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-40°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4kV
TABLE 1-1: DC CHARACTERISTICS
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rat ing on ly and funct ional operati on of th e dev ice at those or any oth er con dit ions abov e thos e
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
All parameters apply over the speci fied
ranges unless otherwise noted.
VCC = 1.8V to 5.5V
Industrial (I): T
A = -40°C to +85°C
Automotive (E): T
A = -40°C to +125°C
Param.
No.
Symbol Parameter Min Typ Max Units Conditions
D1 V
IH1
V
IH2
High-level input volt ag e 2.0
0.7 VCC
——VCC +1
V
CC +1
VVV
CC ≥ 2.7V
V
CC < 2.7V
D2 V
IL1
V
IL2
Low-level input voltage -0.3
-0.3
—
—
0.8
0.2 VCC
VVVCC ≥ 2.7V
V
CC < 2.7V
D3 VOL1
V
OL2
Low-level output voltag e —
—
—
—
0.4
0.2
VVI
OL = 2.1 mA, VCC = 4.5V
I
OL = 100 µA, VCC = 2.5V
D4 VOH1
V
OH2
High-level output volt ag e 2.4
VCC - 0.2——
—
—
VVI
OH = -400 µA, VCC = 4.5V
I
OH = -100 µA, VCC = 2.5V
D5 I
LI Input leakage current — — ±1 µAVIN = VSS to VCC
D6 ILO Output leakage current — — ±1 µAVOUT = VSS to VCC
D7 CIN,
C
OUT
Pin capacitance (all inputs/
outputs)
——7pFVIN/VOUT = 0V (Note 1)
T
A = 25°C, FCLK = 1 MHz
D8 ICC write Write current —
—
—
500
3
—
mAµAFCLK = 3 MHz, VCC = 5.5V
F
CLK = 2 MHz, VCC = 2.5V
D9 I
CC read Read current —
—
—
—
—
100
1
500
—
mA
µA
µA
F
CLK = 3 MHz, VCC = 5.5V
F
CLK = 2 MHz, VCC = 3.0V
F
CLK = 2 MHz, VCC = 2.5V
D10 I
CCS Standby current —
—
—
—
1
5
µAµAI – Temp
E – Temp
CLK = Cs = 0V
ORG = DI = V
SS or VCC
(Note 2) (Note 3)
D11 VPOR VCC voltage detect
93AA76A/B/C, 93LC76A/B/C
93C76A/B/C
—
—
1.5V
3.8V
—
—
VV(Note 1)
Note 1: This parameter is periodically sampled and not 100% tested.
2: ORG pin not available on ‘A’ or ‘B’ versions.
3: READY/BUSY status must be cleared from DO, see Section 3.4 “Data Out (DO)”.
2004 Microchip Technology Inc. DS21796D-page 3
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
TABLE 1-2: AC CHARACTERISTICS
All parameters apply over the specified
ranges unless otherwise noted.
V
CC = 1.8V to 5.5V
Industrial (I): T
A = -40°C to +85°C
Automotive (E): T
A = -40°C to +125°C
Param.
No.
Symbol Parameter Min Max Units Conditions
A1 FCLK Clock frequency — 3
2
1
MHz
MHz
MHz
4.5V ≤ VCC < 5.5V
2.5V ≤ V
CC < 4.5V
1.8V ≤ V
CC < 2.5V
A2 TCKH Clock high time 200
250
450
—ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ V
CC < 4.5V
1.8V ≤ V
CC < 2.5V
A3 TCKL Clock low time 100
200
450
—ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ V
CC < 4.5V
1.8V ≤ V
CC < 2.5V
A4 TCSS Chip Select setup time 50
100
250
—ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ V
CC < 4.5V
1.8V ≤ V
CC < 2.5V
A5 TCSH Chip Select hold time 0 — ns 1.8V ≤ VCC < 5.5V
A6 T
CSL Chip Select low time 250 — ns 1.8V ≤ VCC < 5.5V
A7 TDIS Data input setup time 50
100
250
—ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ V
CC < 4.5V
1.8V ≤ V
CC < 2.5V
A8 TDIH Data input hold time 50
100
250
—ns
ns
ns
4.5V ≤ VCC < 5.5V
2.5V ≤ V
CC < 4.5V
1.8V ≤ V
CC < 2.5V
A9 TPD Data output delay time — 1 00
250
400
ns
ns
ns
4.5V ≤ VCC < 5.5V, CL = 100 pF
2.5V ≤ V
CC < 4.5V, CL = 100 pF
1.8V ≤ V
CC < 2.5V, CL = 100 pF
A10 TCZ Data output disable time — 100
200
nsns4.5V ≤ VCC < 5.5V, (Note 1)
1.8V ≤ V
CC < 4.5V, (Note 1)
A11 T
SV Status valid time — 200
300
500
ns
ns
ns
4.5V ≤ V
CC < 5.5V, CL = 100 pF
2.5V ≤ V
CC < 4.5V, CL = 100 pF
1.8V ≤ V
CC < 2.5V, CL = 100 pF
A12 T
WC Program cycle time — 5 ms Erase/Write mode (AA and LC
versions)
A13 T
WC — 2 ms Erase/Wr ite mode
(93C versions)
A14 T
EC — 6 ms ERAL mode, 4.5V ≤ VCC ≤ 5.5V
A15 TWL — 15 ms WRAL mode, 4.5V ≤ VCC ≤ 5.5V
A16 — Endurance 1M — cycles 25°C, V
CC = 5.0V, (Note 2)
Note 1: This parameter is periodically sampled and not 100% tested.
2: This application is not tested but ensured by characterization. For endurance estimates in a specific
application, please consult the Total Endurance™ Model which may be obtained from
www.microchip.com.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 4 2004 Microchip Technology Inc.
FIGURE 1-1 : SYNCHRONOUS DA TA TIMING
TABLE 1-3: INSTRUCTION SET FOR X 16 ORGANIZATION (93XX76B OR 93XX76C WITH ORG = 1)
TABLE 1-4: INSTRUCTION SET FOR X 8 ORGANIZATION (93XX76A OR 93XX76C WITH ORG = 0)
Instruction SB Opcode Address Data In Data Out
Req. CLK
Cycles
READ 1 10 X A8 A7 A6 A5 A4 A3 A2 A1 A0 — D15 – D0 29
EWEN 1 00 11XXXXXXXX — HIGH-Z 13
ERASE 1 11 X A8 A7 A6 A5 A4 A3 A2 A1 A0 — (RDY/BSY)13
ERAL 1 00 10XXXXXXXX — (RDY/BSY
)13
WRITE 1 01 X A8 A7 A6 A5 A4 A3 A2 A1 A0 D15 – D0 (RDY/BSY
)29
WRAL 1 00 01XXXXXXXXD15 – D0(RDY/BSY
)29
EWDS 1 00 00XXXXXXXX — HIGH-Z 13
Instruction SB Opcode Address Data In Data Out
Req. CLK
Cycles
READ 1 10 X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 — D7 – D0 22
EWEN 1 00 11XXXXXXXXX — HIGH-Z 14
ERASE 1 11 X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 — (RDY/BSY
)14
ERAL 1 00 10XXXXXXXXX — (RDY/BSY
)14
WRITE 1 01 X A9 A8 A7 A6 A5 A4 A3 A2 A1 A0 D7 – D0 (RDY/BSY
)22
WRAL 1 00 01XX XXXXXXXD7 – D0(RDY/BSY
)22
EWDS 1 00 00XXXXXXXXX — HIGH-Z 14
CS
V
IH
VIL
VIH
VIL
VIH
VIL
VOH
VOL
VOH
VOL
CLK
DI
DO
(READ)
DO
(PROGRAM)
T
CSS
TDIS
TCKH
TCKL
TDIH
TPD
TCSH
TPD
TCZ
STATUS VALID
TSV
TCZ
Note: TSV is relative to CS.
2004 Microchip Technology Inc. DS21796D-page 5
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.0 FUNCTIONAL DESCRIPTION
When the ORG* pin is connected to VCC, the (x16)
organization is selected. When it is connected to
ground, the (x8) organization is selected. Instructions,
addresses and write d ata a re clocke d into the D I pin on
the rising edge of the clock (CLK). The DO pin is
normally held in a HIGH-Z state except when reading
data from the device, or when checking the READY/
BUSY
status during a programming operation. The
READY/BUSY
status can be verified during an Erase/
Write operation by polli ng the DO pi n; DO low indicate s
that programming is still in progress, while DO high
indicates the de vi ce is rea dy. DO will ente r th e HI GH -Z
state on the falling edge of CS.
2.1 Start Condition
The Start bit is detected by the device if CS and DI are
both high with respect to the positive edge of CLK for
the first time.
Before a Start condition is detected, CS, CLK and DI
may change in any combination (except to that of a
Start condition), without resulting in any device
operation (READ, WRITE, ERASE, EWEN, EWDS,
ERAL or WRAL). As soon as CS is high, the device is
no longer in Standby mode.
An instruction following a Start condition will only be
executed if the requi red opcode, address and data bits
for any particular instruction are clocked in.
2.2 Data In/Data Out (DI/DO)
It is possible to connect the Data In and Data Out pins
together. However, with this configuration it is possible
for a “bus conflict” to occur during the “dummy zero”
that precedes the read operation, if A0 is a logic highlevel. Under such a condition the voltage level seen at
Data Out i s undefined a nd will d epend upon the relativ e
impedances of Data Out and the signal source driving
A0. The hi gher the current s ourcing capabilit y of the
driver, the higher the voltage at the Data Out pin. In
order to limit this current, a resistor should be
connected between DI and DO.
2.3 Data Protection
All modes of operation ar e inhibited when VCC is below
a typical voltage of 1.5V for ‘93AA’ and ‘93LC’ devices
or 3.8V for ‘93C’ devices.
The EWEN and EWDS commands give additional
protection against accidentally programming during
normal operation.
Note: For added protection, an EWDS command
should be performed after every write
operation.
After power-up, the device is automatically in the
EWDS mode. Therefore, an EWEN instruction must be
performed before the initial ERASE or WRITE instruction
can be executed.
Block Diagram
Memory
Array
Data Register
Mode
Decode
Logic
Clock
Register
Address
Decoder
Address
Counter
Output
Buffer
DO
DI
ORG*
CS
CLK
V
CC VSS
*ORG and PE inputs are not available on
PE*
A/B devices.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 6 2004 Microchip Technology Inc.
2.4 ERASE
The ERASE instruction forces all data bits of the
specified address to the logical ‘1’ state. The rising
edge of CLK before the last address bit initiates the
write cycle.
The DO pin indicates the READY/BUSY
status of the
device if CS is brought high after a minimum of 250 ns
low (T CSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been erased and
the device is ready for another instruction.
Note: Issuing a Start bit and then taking CS low
will clear the READY/BUSY
status from
DO.
FIGURE 2-1 : ERASE TI MI NG
CS
CLK
DI
DO
T
CSL
CHECK STATUS
1
1
1A
N
AN-1 AN-2
•••
A0
T
SV TCZ
BUSY READY
HIGH-Z
T
WC
HIGH-Z
2004 Microchip Technology Inc. DS21796D-page 7
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.5 ERASE ALL (ERAL)
The Erase Al l (ERAL) instruction will erase the entire
memory array to the logical ‘1’ state. The ERAL cycle is
identical to the ERASE cycle, except for the different
opcode. The ERAL cycle is completely self-timed. The
rising edge of CLK before the last data bit initiates the
write cycle. Clocking of the CLK pin is not necessary
after the device has entered the ERAL cycle.
The DO pin indicates the READY/BUSY
status of the
device, if CS is brough t high a fter a minimum of 250 n s
low (TCSL).
Note: Issuing a Start bit and then taking CS low
will clear the READY/BUSY
status from
DO.
V
CC must be ≥ 4.5V for proper operation of ERAL.
FIGURE 2-2 : ERAL TIMING
CS
CLK
DI
DO
T
CSL
CHECK STATUS
10010X
•••
X
T
SV TCZ
BUSY READY
HIGH-Z
T
EC
HIGH-Z
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 8 2004 Microchip Technology Inc.
2.6 ERASE/WRITE DISABLE And ENABLE (EWDS/EWEN)
The 93XX76A/B/C powers up in the ERASE/WRITE
Disable (EWDS) state. All programming modes must be
preceded by an ERASE/WRITE En able (EWEN) instruction. Once the EWEN instruction is executed, programming remains enabled until an EWDS instruction is
executed or V
CC is removed from the device.
To protect against accidental data disturbance, the
EWDS instruction can be used to disable all ERASE/
WRITE functions and should follow all programming
operations. Execution of a READ instruction is
independent of both the EWEN and EWDS instructions.
FIGURE 2-3: EWDS TIMING
FIGURE 2-4: EWEN TIMING
2.7 READ
The READ instruction outputs the serial data of the
addressed memory lo cation on the DO pin. A dummy
zero bit precedes the 8-bit (If O RG pin is low or A-V e rsion
devices) or 16-bit (If ORG pin is high or B-version
devices) output st rin g. The ou tput dat a bi t s will toggle on
the rising edge of the CLK and are stable after the specified time dela y (T
PD). Sequentia l read is po ssibl e when
CS is held high. The memory data will automatically cycle
to the next re gi ster and output seque nt ia ll y.
FIGURE 2-5 : READ TIMI N G
CS
CLK
DI
10
000X
•••
X
T
CSL
1X
CS
CLK
DI
00 1 1X
TCSL
•••
CS
CLK
DI
DO
110
An
•••
A0
HIGH-Z
0Dx
•••
D0 Dx
•••
D0
•••
Dx D0
2004 Microchip Technology Inc. DS21796D-page 9
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
2.8 WRITE
The WRITE instruction is followed by 8 bits (If ORG is
low or A-version device s) or 16 b its (If OR G pi n is hig h
or B-version devices) of data which are wr itten into th e
specified address. The self-timed auto-erase and
programming cycle is initiated by the rising edge of CLK
on the last data bit.
The DO pin indicates the READY/BUSY
status of the
device, if CS is brough t high a fter a minimum of 250 n s
low (T CSL). DO at logical ‘0’ indicates that programming
is still in progress. DO at logical ‘1’ indicates that the
register at the specified address has been written with
the data specified and the device is ready for another
instruction.
Note: Issuing a Start bit and then taking CS low
will clear the READY/BUSY
status from
DO.
FIGURE 2-6: WRITE TIMINGS
CS
CLK
DI
DO
1
0
1An
•••
A0 Dx
•••
D0
BUSY
READY
HIGH-Z
HIGH-Z
Twc
T
CSL
TCZ
TSV
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 10 2004 Microchip Technology Inc.
2.9 WRITE ALL (WRAL)
The Write All (WRAL) instruction will write the entire
memory array with the data specified in the command.
The self-timed auto-erase and programming cycle is
initiated by the rising edge of CLK on the last data bit.
Clocking of the CLK pin is not necessary after the
device has entered the WRAL cycle. The WRAL
command does include an automatic ERAL cycle for
the device. Therefore, the WRAL instruction does not
require an ERAL instruction but the chip must be in the
EWEN status.
The DO pin indicates the READY/BUSY
status of the
device if CS is brought high after a minimum of 250 ns
low (TCSL).
Note: Issuing a Start bit and then taking CS low
will clear the READY/BUSY
status from
DO.
VCC must be ≥ 4.5V for proper operation of WRAL.
FIGURE 2-7 : WRAL TIMING
CS
CLK
DI
DO
HIGH-Z
1
0
0
01X
•••
X
Dx
•••
D0
HIGH-Z
BUSY
READY
T
WL
TCSL
TSV
TCZ
2004 Microchip Technology Inc. DS21796D-page 11
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
3.0 PIN DESCRIPTIONS
TABLE 3-1: PIN DESCRIPTIONS
3.1 Chip Select (CS)
A high level sel ects the device; a low lev el deselects
the device and fo rces it into S t andby mo de. Howev er , a
programming cycle wh ic h is al ready in progress will be
completed, regardless of the Chip Select (CS) input
signal. If CS is brou gh t l ow duri ng a p rogram cycle, the
device will go into Standby mode as soon as the
programming cycle is com pleted.
CS must be low for 250 ns minimum (T
CSL) between
consecutive instructions. If CS is low, the internal
control logic is held in a Reset status.
3.2 Serial Clock (CLK)
The Serial Clock is used to synchronize the communication between a master device and the 93XX series
device. Opcodes, address and data bits are clocked in
on the positive edge of C LK. Dat a bit s are also c locke d
out on the positive edge of CLK.
CLK can be stopped anywhere in the transmission
sequence (at high or low-level) and can be continued
anytime with respect to clock high time (T
CKH) and
clock low time (T
CKL). This gives the controlling master
freedom in preparing opcode, address and data.
CLK is a “don't care” if CS is l ow (devic e desele cted). If
CS is high, but the Start condition has not been
detected (DI = 0), any number of clock cycle s can be
received by the device without changing its status (i.e.,
waiting for a Start condition).
CLK cycles are not required during the self-timed
WRITE (i.e., auto ERASE/WRITE) cycle.
After detection of a S ta rt condition t he specified numb er
of clock cycles (respectively low to high transitions of
CLK) must be provided. These clock cycles are
required to clock in all required opcode, address and
data bits b efo re a n in struction is executed. CLK an d DI
then become don't care inputs waiting for a new Start
condition to be detected.
3.3 Data In (DI)
Data In (DI) is used to clock in a Start bit, opcode,
address and data synchronously with the CLK input.
3.4 Data Out (DO)
Data Out (DO) is use d in the Read m ode to outpu t data
synchronously with the CLK input (T
PD after the
positive edge of CLK).
This pin also provides READY/BUSY status informa-
tion during ERASE and WRITE cycles. READY/BUSY
status information is available on the DO pin if CS is
brought high after being low for minimum Chip Select
low time (TCSL) and an erase or write operation has
been initiated.
The Status signal is not available on DO, if CS is held
low during th e entire ERASE or W RITE cycle. In this
case, DO is in the HIGH-Z mode. If status is checked
after the ERASE/WRITE cycle, the d ata line will be hig h
to indicate the device is ready.
Note: Issuing a Start bit and then taking CS low
will clear the READY/BUSY
status from
DO.
3.5 Organization (ORG)
When the ORG pin i s connected to VCC or Logic HI, th e
(x16) memory organiza tion is sel ected. Whe n the ORG
pin is tied to VSS or Logic LO, the (x8) memory
organization is selected. For proper operation, ORG
must be tied to a valid logic level.
93XX76A devices are always x8 organization and
93XX76B devices are always x16 organization.
Name
SOIC/PDIP/MSOP/
TSSOP
SOT-23 Function
CS 1 5 Chip Select
CLK 2 4 Serial Clock
DI 3 3 Data In
DO 4 1 Data Out
V
SS 5 2 Ground
ORG 6 N/A Organization / 93XX76C
PE 7 N/A Program Enable
V
CC 86Power Supply
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 12 2004 Microchip Technology Inc.
3.6 Program Enable (PE)
This pin allows the user to enable or disable the ability
to write data to the memory array. If the PE pin is tied
to V
CC, the device can be programm ed. If the PE pin is
tied to V
SS, programming will be inhibited. PE is not
available on 93XX76A or 93XX76B. O n those devices,
programming is always enabled. This pin cannot be
floated, it must be tied to V
CC or VSS.
2004 Microchip Technology Inc. DS21796D-page 13
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
4.0 PACKAGING INFORMATION
4.1 Package Marking Information
Legend: XX...X Part number
T Temperature
Blank Commercial
I Industrial
E Extended
YY Year code (last 2 digits of calendar year) except TSSOP
and MSOP which use only the last 1 digit
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Note: Custom marking available.
Example:
6-Lead SOT-23
8-Lead MSOP (150 mil)
Example:
XXXXXXT
YWWNNN
3L76I
2281L7
XXNN
4EL7
XXXXXNNN
XXXXXXXX
YYWW
8-Lead PDIP
8-Lead SOIC
XXXXYYWW
XXXXXXXX
NNN
XXXX
TYWW
8-Lead TSSOP
NNN
I/P 1L7
93LC76
0228
Example:
Example:
I/SN 0228
93LC76
1L7
1L7
L76
I228
Example:
MSOP 1st Line Marking Codes
Device
93AA76C
93LC76C
93C76C
std mark
3A76CT
3L76CT
3C76CT
Pb-free
mark
GA76CT
GL76CT
GC76CT
T = blank for commercial, “I” for Industrial,
“E” for Extended.
TSSOP 1st Line Marking Codes
Device
93AA76C
93LC76C
93C76C
std mark
A76C
L76C
C76C
Pb-free
mark
GADC
GLDC
GCDC
Temperature grade is marked on line 2.
SOT23 Marking Codes
Device
93AA76A
93AA76B
93LC76A
93LC76B
93C76A
93C76B
I-temp
4BNN
4LNN
4ENN
4PNN
4HNN
4TNN
E-temp
–
–
4FNN
4RNN
4JNN
4UNN
Pb-free topside mark is same; Pb-free
noted only on carton label.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 14 2004 Microchip Technology Inc.
8-Lead Plastic Micro Small Outline Package (MS) (MSOP)
D
A
A1
L
c
(F)
α
A2
E1
E
p
B
n 1
2
φ
β
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
.037 REFFFootprint (Reference)
exceed .010" (0.254mm) per side.
Notes:
Drawing No. C04-111
*Controlling Parameter
Mold Draft Angle Top
Mold Draft Angle Bottom
Foot Angle
Lead Width
Lead Thickness
β
α
c
B
φ
.003
.009
.006
.012
Dimension Limits
Overall Height
Molded Package Thickness
Molded Package Width
Overall Length
Foot Length
Standoff
Overall Width
Number of Pins
Pitch
A
L
E1
D
A1
E
A2
.016 .024
.118 BSC
.118 BSC
.000
.030
.193 TYP.
.033
MIN
p
n
Units
.026 BSC
NOM
8
INCHES
0.95 REF
-
-
.009
.016
0.08
0.22
0°
0.23
0.40
8°
MILLIMETERS*
0.65 BSC
0.85
3.00 BSC
3.00 BSC
0.60
4.90 BSC
.043
.031
.037
.006
0.40
0.00
0.75
MIN
MAX NOM
1.10
0.80
0.15
0.95
MAX
8
--
-
15°5° 15°5° -
JEDEC Equivalent: MO-187
0° - 8°
5°
5° -
15°
15°
--
-
-
2004 Microchip Technology Inc. DS21796D-page 15
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
6-Lead Plastic Small Outline Transistor (OT) (SOT-23)
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.500.430.35.020.017.014BLead Width
0.200.150.09.008.006.004
c
Lead Thickness
10501050
φ
Foot Angle
0.550.450.35.022.018.014LFoot Length
3.102.952.80.122.116.110DOverall Length
1.751.631.50.069.064.059
E1
Molded Package Width
3.002.802.60.118.110.102EOverall Width
0.150.080.00.006.003.000
A1
Standoff
1.301.100.90.051.043.035
A2
Molded Package Thickness
1.451.180.90.057.046.035AOverall Height
1.90.075
p1
Outside lead pitch (basic)
0.95.038
p
Pitch
66
n
Number of Pins
MAX
NOM
MINMAX
NOM
MINDimension Limits
MILLIMETERSINCHES*Units
1
D
B
n
E
E1
L
c
β
φ
α
A2
A
A1
p1
exceed .005" (0.127mm) per side.
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not
Notes:
JEITA (formerly EIAJ) equivalent: SC-74A
Drawing No. C04-120
*Controlling Parameter
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 16 2004 Microchip Technology Inc.
8-Lead Plastic Du8-Lead Plastic Small Outline (al In-line (P) – 300 mil (PDIP)
B1
B
A1
A
L
A2
p
α
E
eB
β
c
E1
n
D
1
2
Units INCHES* MILLIMETERS
Dimension Limits MIN NOM MAX MIN NOM MAX
Number of Pins
n
88
Pitch
p
.100 2.54
Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32
Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68
Base to Seating Plane A1 .015 0.38
Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26
Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60
Overall Length D .360 .373 .385 9.14 9.46 9.78
Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43
Lead Thickness
c
.008 .012 .015 0.20 0.29 0.38
Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78
Lower Lead Width B .014 .018 .022 0.36 0.46 0.56
Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92
Mold Draft Angle Top
α
51015 51015
Mold Draft Angle Bottom
β
51015 51015
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
JEDEC Equivalent: MS-001
Drawing No. C04-018
.010” (0.254mm) per side.
§ Significant Characteristic
2004 Microchip Technology Inc. DS21796D-page 17
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)
Foot Angle
φ
048048
1512015120
β
Mold Draft Angle Bottom
1512015120
α
Mold Draft Angle Top
0.510.420.33.020.017.013BLead Width
0.250.230.20.010.009.008
c
Lead Thickness
0.760.620.48.030.025.019LFoot Length
0.510.380.25.020.015.010hChamfer Distance
5.004.904.80.197.193.189DOverall Length
3.993.913.71.157.154.146E1Molded Package Width
6.206.025.79.244.237.228EOverall Width
0.250.180.10.010.007.004
A1
Standoff §
1.551.421.32.061.056.052A2Molded Package Thickness
1.751.551.35.069.061.053AOverall Height
1.27.050
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERSINCHES*Units
2
1
D
n
p
B
E
E1
h
L
β
c
45°
φ
A2
α
A
A1
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.010” (0.254mm) per side.
JEDEC Equivalent: MS-012
Drawing No. C04-057
§ Significant Characteristic
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 18 2004 Microchip Technology Inc.
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)
10501050
β
Mold Draft Angle Bottom
10501050
α
Mold Draft Angle Top
0.300.250.19.012.010.007BLead Width
0.200.150.09.008.006.004
c
Lead Thickne ss
0.700.600.50.028.024.020LFoot Length
3.103.002.90.122.118.114DMolded Package Length
4.504.404.30.177.173.169E1Molded Package Width
6.506.386.25.256.251.246EOverall Width
0.150.100.05.006.004.002
A1
Standoff §
0.950.900.85.037.035.033A2Molded Package Thickness
1.10.043AOverall Height
0.65.026
p
Pitch
88
n
Number of Pins
MAXNOMMINMAXNOMMINDimension Limits
MILLIMETERS*INCHESUnits
α
A2
A
A1
L
c
β
φ
1
2
D
n
p
B
E
E1
Foot Angle
φ
048048
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed
.005” (0.127mm) per side.
JEDEC Equivalent: MO-153
Drawing No. C04-086
§ Significant Characteristic
2004 Microchip Technology Inc. DS21796D-page 19
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
APPENDIX A: REVISION HISTORY
Revision C
Corrections to Section 1.0, Electrical Characteristics.
Section 4.1, 6-Lead SOT-23 package to OT.
Revision D
Corrections to Devi ce Select ion Tabl e, Table 1-1, Table
1-2, Section 2.4, Section 2.5, Section 2.8 and Section
2.9. Added note to Figure 2-7.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 20 2004 Microchip Technology Inc.
NOTES:
2004 Microchip Technology Inc. DS21796D-page 21
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
ON-LINE SUPPORT
Microchip provides on-line support on the Microchip
World Wide Web site.
The web site is used b y Mic rochip as a me ans to m ake
files and information easily available to customers. To
view the site, the use r must have access to the Intern et
and a web browser, such as Netscape
®
or Microsoft
®
Internet Explorer. Files are also available for FTP
download from our FTP site.
Connecting to the Microchip Internet
Web Site
The Microchip web site is available at the following
URL:
www.microchip.com
The file transfer site is available by using an FTP
service to connect to:
ftp://ftp.microchip.com
The web site and file transfer site provide a variety of
services. Users may download files for the latest
Development Tools, Data Sheets, Application Notes,
User's Guides, Articles and Sample Programs. A vari-
ety of Micr ochip specific bu siness informatio n is also
available, including listings of Microchip sales offices,
distributors and factory representatives. Other data
available for consideration is:
• Latest Microchip Press Releases
• Technical Support Section with Frequently Asked
Questions
• Design Tips
• Device Errata
• Job Postings
• Microchip Consultant Program Member Listing
• Links to other useful web sites related to
Microchip Products
• Conferences for p roducts, D evelopment Systems,
technical information and more
• Listing of seminars and events
SYSTEMS INFORMATION AND
UPGRADE HOT LINE
The Systems Information and Upgrade Line provides
system users a listing of the latest versions of all of
Microchip's development systems software products.
Plus, this line provides information on how customers
can receive the most c urrent upgra de kit s.The Hot Lin e
Numbers are:
1-800-755-2345 for U.S. and most of Canada, and
1-480-792-7302 for the rest of the world.
042003
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 22 2004 Microchip Technology Inc.
READER RESPONSE
It is our intentio n to pro vi de you with the best documentation possible to ens ure suc c es sfu l u se of y ou r M ic roc hip product. If you wish to provid e your c omment s on org anizatio n, clarity, subject matter, and ways in w hich o ur docum entatio n
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
Please list the following information, and use this outline to provide us with your comments about this document.
To:
Technical Publications Manager
RE: Reader Response
Total Pages Sent ________
From:
Name
Company
Address
City / State / ZIP / Country
Telephone: (_______) _________ - _________
Application (optional):
Would you like a reply? Y N
Device: Literature Number:
Questions:
FAX: (______) _________ - _________
DS21796D93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
1. What are the best featur es of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
2004 Microchip Technology Inc. DS21796D-page 23
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
Sales and Support
Device 93AA76A: 8K 1.8V Microwire Serial EEPROM (x8)
93AA76B: 8K 1.8V Microwire Serial EEPROM (x16)
93AA76C: 8K 1.8V Microwire Serial EEPROM w/ORG
93LC76A: 8K 2.5V Microwire Serial EEPROM (x8)
93LC76B: 8K 2.5V Microwire Serial EEPROM (x16)
93LC76C: 8K 2.5V Microwire Serial EEPROM w/ORG
93C76A: 8K 5.0V Microwire Serial EEPROM (x8)
93C76B: 8K 5.0V Microwire Serial EEPROM (x16)
93C76C: 8K 5.0V Microwire Serial EEPROM w/ORG
Tape & Reel: Blank = Standard pinout
T = Tape & Reel
Temperature Range I = -40°C to +85°C
E = -40°C to +125°C
Package MS = Plastic MSOP (Micro Small outline, 8-lead)
OT = SOT-23, 6-lead (Tape & Reel only)
P = Plastic DIP (300 mil body), 8-lead
SN = Plastic SOIC (150 mil body), 8-lead
ST = TSSOP, 8-lead
Lead Finish: Blank = Standard 63% / 37% SnPb
G = Pb-free (Matte Tin - Pure Sn)
Examples:
a) 93AA76C-I/MS: 8K, 1024x8 or 51 2x16 Serial
EEPROM, MSOP package, 1.8V
b) 93AA76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 1.8V
c) 93AA76CT-I/MS: 8K, 1024x8 or 512x 16 S erial
EEPROM, MSOP package, tape and reel, 1.8V
a) 93LC76C-I/MS: 8K, 1024x8 or 512x1 6 Serial
EEPROM, MSOP package, 2.5V
b) 93LC76BT-I/OT: 8K, 512x16 Serial EEPROM,
SOT-23 package, tape and reel, 2.5V
c) 93LC76CXT-I/SNG: 8K, 1024x8 or 512x16
Serial EEPROM, SOIC package, Industrial
temperature, tape and reel, Pb-free finish, 2.5V
a) 93C76C-I/MS: 8K, 1024x8 or 512x16 Serial
EEPROM, MSOP package, 5.0V
b) 93C76AT-I/OT: 8K, 1024x8 Serial EEPROM,
SOT-23 package, tape and reel, 5.0V
PART NO. X
/XX
Package
Temperature
Range
Device
X
Lead Finish
X
Tape & Reel
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences
and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of
the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
93AA76A/B/C, 93LC76A/B/C, 93C76A/B/C
DS21796D-page 24 2004 Microchip Technology Inc.
NOTES:
2004 Microchip Technology Inc. DS21796D-page 25
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical
components in life support systems is not authorized except
with express written approval by Microchip. No licenses are
conveyed, implicitly or otherwise, under any intellectual
property rights.
Trademarks
The Microchip name and logo, the Microchip logo, Accuron,
dsPIC, K
EELOQ, MPLAB, PIC, PICmic ro, PI C START,
PRO MATE and PowerSmart are registered trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
AmpLab, FilterLab, microID, MXDEV, MXLAB, PICMASTER,
SEEVAL, SmartShunt and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Application Maestro, dsPICDEM, dsPICDEM.net,
dsPICworks, ECAN, ECONOMONITOR, FanSense,
FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP,
ICEPIC, microPort, Migratable Memory, MPASM, MPLIB,
MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICtail,
PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPIC,
Select Mode, SmartSensor, SmartTel and Total Endurance
are trademarks of Microchip Technology Incorporated in the
U.S.A. and other countries.
Serialized Quick Turn Programming (SQTP) is a service mark
of Microchip Technology Incorporated in the U.S.A.
All other trademarks mentioned herein are property of their
respective companies.
© 2004, Microchip Technology Incorporated, Printed in the
U.S.A., All Rights Reserved.
Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip's Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously impro ving the cod e protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip re cei v ed I S O/T S - 16 949 : 20 02 qu ality system certif i cat i o n for
its worldwide headquarters, design and wafer fabrication facilities in
Chandler and Tempe, Arizona and Mountain View, California in October
2003. The Com pany’s quality sy stem proces ses and pro cedures are for
its PICmicro
®
8-bit MCUs, KEELOQ
®
code hopping devices, Serial
EEPROMs, microperipherals, nonvolatile memory and analog
products. In addition, Microchip’s quality system for the design and
manufacture of development systems is ISO 9001:2000 certified.
DS21796D-page 26 2004 Microchip Technology Inc.
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