MICROCHIP 25AA320, 25LC320, 25C320 Technical data

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25AA320/25LC320/25C320

32K SPI™ Bus Serial EEPROM

Device Selection Table

Part

Number

25AA320 1.8-5.5V 1 MHz I 25LC320 2.5-5.5V 2 MHz I,E

25C320 4.5-5.5V 3 MHz I,E

VCC

Range

Max. Clock

Frequency

Features:

• Low-power CMOS technology:

- Write current: 3 mA maximum

- Read current: 500 µA typical

- Standby current: 500 nA typical

• 4096 x 8 bit organization

• 32 byte page

• Write cycle time: 5 ms maximum

• Self-timed erase and write cycles

• Block write protection:

- Protect none, 1/4, 1/2 or all of array

• Built-in write protection:

- Power on/off data protection circuitry

- Write enable latch

- Write-protect pin

• Sequential read

• High reliability:

- Endurance: 1M E/W cycles

- Data retention: > 200 years

- ESD protection: > 4000V

• 8-pin PDIP, SOIC and TSSOP packages

• 14-lead TSSOP package

• Temperature ranges supported:

- Industrial (I): -40°Cto +85°C

- Automotive (E): -40°C to +125°C

Temp.

Ranges

Description:

The Microchip Technology Inc. 25AA320/25LC320/ 25C320 (25XX320 Erasable PROMs. The memory is accessed via a simple Serial Peripheral Interface (SPI™) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the dev ice is contro lled th rough a C hip Select (CS

) input.

Communication to the device can be paused via the hold pin (HOLD transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts.

) are 32 Kbit serial Electrically

). While the device is paused,

Block Diagram

SO CS

SCK

HOLD

Status

I/O Control

Logic

Memory

Control

Logic

VCC

VSS

XDEC

HV Generator

EEPROM

Array

Page

Latches

Y Decoder

Sense Amp. R/W Control

Package Types

PDIP, SOIC

VSS

*25XX320 is used in this document as a generic part number for the 25AA320/25LC320/25C320 devices.

 2004 Microchip Technology Inc. DS21227E-page 1

25XX320

VCC

HOLD SCK

HOLD

VCC

CS SO

1 2

3 4

TSSOP

25XX320

TSSOP

SCK

510

VSS

25XX320

HOLD

NC NC

SCK SI

25AA320/25LC320/25C320

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings

(†)

VCC.............................................................................................................................................................................7.0V

All inputs and outputs w.r.t. V

SS ........................................................................................................ -0.6V to VCC + 1.0V

Storage temperature .................................................................................................................................-65°C to 150°C

Ambient temperature under bias............................................................................................................... -40°C to 125°C

ESD protection on all pins..........................................................................................................................................4 kV

† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stres s ratin g only and func tional operati on of the devic e at thos e or any other co nditio ns abov e thos e indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an extended period of time may affect device reliability.

TABLE 1-1: DC CHARACTERISTICS

DC CHARACTERISTICS

Param.

No.

D1 V D2 VIH2 0.7 VCC VCC+1 V VCC< 2.7V (Note) D3 V D4 VIL2 -0.3 0.3 VCC VVCC < 2.7V (Note)

Sym. Characteristics Min. Max. Units Conditions

IH1 High-level input

voltage

IL1 Low-level input

voltage

D5 VOL Low-level output

Industrial (I): T Automotive (E):T

2.0 VCC+1 V VCC ≥ 2.7V (Note)

-0.3 0.8 V VCC ≥ 2.7V (Note)

—0.2VIOL = 1.0 mA, VCC < 2.5V

voltage

D6 V

OH High-level output

VCC -0.5 — V IOH = -400 µA

voltage D7 I D8 ILO O utp ut lea ka ge

LI Input leakage current — ±1 µACS = VCC, V IN = VSS TO VCC

—±1µACS = VCC, VOUT = VSS TO VCC

current D9 CINT Internal Capacitance

—7pFT (all inputs and outputs)

D10 I

CC Read Operating Current —

—

D11 I

CC Write —

—

D12 I

CCS Standby Current —

—

Note: This parameter is periodically sampled and not 100% tested.

A = -40°C to +85°C VCC = 1.8V to 5.5V A = -40°C to +125°C VCC = 2.5V to 5.5V

A = 25°C, CLK = 1.0 MHz,

CC = 5.0V (Note)

500

mAµAVCC = 5.5V; FCLK = 3.0MHz;

SO = Open

CC = 2.5V; FCLK = 2.0MHz;

V SO = Open

5 3

5 1

mAmAVCC = 5.5V

CC = 2.5V

µAµACS = VCC = 5.5V, Inputs tied to VCC or

V CS = VCC = 2.5V, Inputs tied to VCC or V

DS21227E-page 2  2004 Microchip Technology Inc.

25AA320/25LC320/25C320

TABLE 1-2: AC CHARACTERISTICS

AC CHARACTERISTICS

Param.

No.

Sym. Characteristic Min. Max. Units Conditions

CLK Clock Frequency —

Industrial (I): T Automotive (E): T

— —

CSS CS Setup Time 100

250 500

CSH CS Hold Time 150

250

475 4T 5T

CSD CS Disable Time 500 — ns — SU Data Setup Time 30

50 50

HD Data Hold Time 50

100

100 7T 8T 9T

R CLK Rise Time — 2 µs (Note 1)

F CLK Fall Time — 2 µs (Note 1) HI Clock High Time 150

230

475 10 T

LO Clock Low Time 150

230

475 11 T 12 T 13 T

CLD Clock Delay Time 50 — ns — CLE Clock Enable Time 50 — ns —

V Output Valid from

Clock Low

— —

— 14 T 15 T

HO Output Hold Time 0 — ns (Note 1) DIS Output Disable Time —

—

— 16 T

HS HOLD Setup Time 100

100 200

17 T

HH HOLD Hold Time 100

100 200

18 T

HZ HOLD Low to Output

High-Z

100 150 200

19 T

HV HOLD High to Output

Valid

100 150 200

20 T

WC Internal Write Cycle

—5ms—

Time

21 — Endurance 1M — E/W

Note 1: This parameter is periodically sampled and not 100% tested.

2: This parameter is not tested but established by characterization. For endurance estimates in a specific application,

please consult the Total Endurance™ Model which can be obtained from Microchip’s web site at: www.microchip.com.

A = -40°C to +85°C VCC = 1.8V to 5.5V A = -40°C to +125°C VCC = 2.5V to 5.5V

3 2 1

MHz MHz MHz

— — —

150 230

—

200 250

— —

— — —

Cycles

CC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V ns ns

ns ns ns

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

CC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

CC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V

CC = 2.5V to 5.5V CC = 1.8V to 5.5V

CC = 4.5V to 5.5V (Note 1)

CC = 2.5V to 5.5V (Note 1)

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V (Note 1)

CC = 2.5V to 5.5V (Note 1)

CC = 1.8V to 5.5V

VCC = 4.5V to 5.5V

CC = 2.5V to 5.5V

CC = 1.8V to 5.5V

(Note 2)

 2004 Microchip Technology Inc. DS21227E-page 3

25AA320/25LC320/25C320

FIGURE 1-1: HOLD TIMING

High-impedance

SCK

16 16 17

n+2 n+1 n n-1

1918

HOLD

n+2 n+1 n

FIGURE 1-2: SERIAL INPUT TIMING

Mode 1,1

Mode 0,0

SCK

MSB in

High-impedance

LSB in

n-1

don’t care

FIGURE 1-3: SERIAL OUTPUT TIMING

SCK

DS21227E-page 4  2004 Microchip Technology Inc.

MSB out

don’t care

Mode 1,1 Mode 0,0

ISB out

25AA320/25LC320/25C320

TABLE 1-3: AC TEST CONDITIONS FIGURE 1-4: AC TEST CIRCUIT

AC Waveform:

VLO = 0.2V —

HI = VCC - 0.2V (Note 1)

V VHI = 4.0V (Note 2)

Timing Measurement Reference Lev el

Input 0.5 V Output 0.5 VCC

Note 1: For VCC ≤ 4.0V

2: For V

CC > 4.0V

VCC

2.25 KΩ

1.8 KΩ

100 pF

 2004 Microchip Technology Inc. DS21227E-page 5

25AA320/25LC320/25C320

2.0 PIN DESCRIPTIONS

The descriptions of the pins are listed in Table 2-1.

TABLE 2-1: PIN FUNCTION TABLE

Name PDIP SOIC

CS SO 2 2 4 2 Serial Data Output NC — — — 3,4,5 Not Connected

WP Vss 4 4 6 7 Ground

SI 5 5 7 8 Serial Data Input

SCK 6 6 8 9 Serial Clock Input

NC — — — 10,11,12 Not Connected

HOLD

Vcc 8 8 2 14 Supply Voltage

1 1 3 1 Chip Select Input

3 3 5 6 Write-Protect Pin

7 7 1 13 Hold Input

8-pin

TSSOP

2.1 Chip Select (CS)

A low level on this pin selects the device. A high level deselects the device and forces it into Standby mode. However, a programming cycle which is already initiated or in progress will be completed, regardle ss of the CS input signal. If CS is brought high during a program cycle, the de vice wil l go into S t andb y mode as soon as the programming cycle is complete. When the device is deselected, SO goes to the high-impedance state, allowing multiple parts to share the same SPI bus. A lo w-to-high transiti on on CS sequence initiates an internal write cycle. After powerup, a low level on CS is r equ ired p r ior to any sequence being initiated.

after a valid write

2.2 Serial Output (SO)

The SO pin is used to transfer data out of the 25XX320. During a read cycle, data is shifted out on this pin after the falling edge of the serial clock.

2.3 Write-Protect (WP)

This pin is used in conjunction with the WPEN bit in the Status register to prohibit writes to the nonvolatile bits in the Status register. When WP is low and WPEN is high, writing to the no nvolatil e bits in the Status register is disabled. All other operations function normally. When WP nonvolatile bits in the Status register operate normally. If the WPEN bit is set, WP write sequence will disable writing to the Status register. If an internal write cycle has already begun, WP

is high, all functions, including writes to the

low during a Status register

going low will have no effect on the write.

14-lead TSSOP

The WP pin function is blocked when the WPEN bit in the St atus regi ster is low. This allo ws the use r to ins t al l the 25XX320 in a system with WP still be able to write to the Status register. The WP functions will be enabled when the WPEN bit is set high.

2.4 Serial Input (SI)

The SI pin is used to transfer data into the device. It receives instructions, addresses, and data. Data is latched on the rising edge of the serial clock.

2.5 Serial Clock (SCK)

The SCK is used to synchronize the communication between a master and the 25XX320. Instructions, addresses, or data present on the SI pin are latched on the rising edge of t he c lo ck input, while data on the SO pin is updated after the falling edge of the clock input.

2.6 Hold (HOLD)

The HOLD pin is used to suspend transmission to the 25XX320 while in the middle of a seri al sequ ence wit hout having to re-transmit the entire sequence again. It must be held high any time this function is not being used. Once the device is selected and a serial sequence is underway, the HOLD low to pause further serial communication without resetting the serial sequence. The HOLD pin must be brought low while SCK is low, otherwise the HOLD function will not be invoked until the next SCK high-tolow transition. Th e 25XX320 must remain se lected d uring this sequence. The SI, SCK, and SO pins are in a high-impedance state during the time the device is paused and transitions on these p ins will be ignored. To resume serial communication, HOLD high while the SCK pin is low, otherwise serial communication will not resume. Lowering the HOLD line at any time will tri-state the SO line.

Description

pin grounded and

pin may be pulled

must be brought

DS21227E-page 6  2004 Microchip Technology Inc.

25AA320/25LC320/25C320

3.0 FUNCTIONAL DESCRIPTION

3.1 Principles Of Operation

The 25XX320 are 4096 byte Serial EEPROMs designed to interf ace di rec tly with the Serial Peripheral Interface (SPI) port of many of today’s popular microcontroller families, including Microchip’s PIC16C6X/7X microcontrollers. It may also interface with microcontroll ers that do not ha ve a built-in SPI port by using discrete I/O lines programmed properly with the software.

The 25XX320 conta ins an 8-bit instr uction regi ster . The device is accessed via the SI pin, with data being clocked in on the rising edge of SCK. The CS be low and the HOLD operation.

Table 3-1 contains a list of the possible instruction bytes and format for device operation. All instructions, addresses and data are transf erred MSB first, LSB last.

Data is sampled on the fir st rising edge of SCK after CS goes low. If the clock line is shared with other peripheral devices on the SPI bus, the user can assert the HOLD mode. After releasing the HOLD resume from the point when the HOLD

input and place the 25XX320 in ‘HOLD’

pin must be high fo r the entire

pin, operation will

3.2 Read Sequence

The device is selected by pulling CS low. The 8-bit READ instruction is transmitted to the 25XX320 followed by the 16- b it ad dr e s s, wi t h the fo ur MS Bs of t he address being don’t care bits. After the correct READ instruction and add res s a re s en t, the data stored in the memory at the selected address is shifted out on the SO pin. The data stored in the memory at the next address can be read sequentially by continuing to provide clock pulses . Th e in tern al a ddress pointer is automatically incremented to the next higher address after each byte of data is shifted out. When the highest address is reached (0FFFh), the address counter rolls over to address 0000h allowing the read cycle to be continued indefi nitely. The read operat ion is te rminated by raising the CS

pin (Figure 3-1).

pin must

was asserted.

3.3 Write Sequence

Prior to any attempt to write data to the 25XX320, the write enable latch must be set by issuing the WREN instruction (Figure3-4). This is done by setting CS and then clocking out the proper instruction into the 25XX320. After all eight bits of the instruction are transmitted, the CS write enable latch. If the write operation is initiated immediately after the WREN instruction without CS being brought high, the data will not be written to the array because the write e nable latc h will not hav e been properly set.

Once the write enable latch is set, the user may proceed by setting the CS instruction, followe d by the 16-bit address, with the four MSBs of the address being don’t ca re bits, and then the data to be writ ten. Up to 32 bytes of d ata ca n be sent to the 25XX320 before a write cycle is necessary. The only restriction is tha t al l of the byte s must reside in the same page. A page address begins with

0000 and ends with xxxx xxxx xxx1 1111.

xxx0

If the internal address counter reaches

xxx1

1111 and the clock continues, the counter will roll back to the first address of the page and overwrite any data in the page that may have been written.

For the data to be actually written to the array, the CS must be brought high after the least significant bit (D0) of the n brought high at any other time, the write operation will not be completed. Refer to Figure 3-2 and Figure 3-3 for more detailed illustrations on the byte write sequence and the page write sequence respectively. While the write is in progress, the Status register may be read to check the status of the WPEN, WIP, WEL, BP1 and BP0 bits (Figure 3-6). A read attempt of a memory array location will not be possible during a write cycle. When the write cycle is completed, the write enable latch is reset.

data byte has been clocked in. If CS is

must be brought high to set the

low, issuing a WRITE

xxxx xxxx

low

TABLE 3-1: INSTRUCTION SET

Instruction Name Instruction Format Description

READ WRITE WRDI WREN RDSR WRSR

 2004 Microchip Technology Inc. DS21227E-page 7

0000 0011 0000 0010 0000 0100 0000 0110 0000 0101 0000 0001

Read data from memory array beginning at selected address Write data to memory array beginning at selected address Reset the write enable latch (disable write operations) Set the write enable latch (enable write operations) Read Status register Write Status register

25AA320/25LC320/25C320

FIGURE 3-1: READ SEQUENCE

0 234567891011 21222324252627282930311

SCK

instruction 16-bit address

0100000115 14 13 12 210

High-impedance

FIGURE 3-2: BYTE WRITE SEQUENCE

91011 2122232425262728293031

SCK

0 23456718

instruction 16-bit address data byte

0000000115 14 13 12

High-impedance

FIGURE 3-3: PAGE WRITE SEQUENCE

0 23456718

SCK

data out

76543210

Twc

21076543210

9 1011 2122232425262728293031

instruction 16-bit addres s data byte 1

32 34 35 36 37 38 3933

SCK

data byte 2

DS21227E-page 8  2004 Microchip Technology Inc.

76543210

0000000115 14 13 12

41 42 43 46 47

data byte 3

76543210

21076543210

44 45

data byte n (32 max)

76543210

25AA320/25LC320/25C320

3.4 Write Enable (WREN) and Write Disable (WRDI)

The 25XX320 contains a write enable latch. See Table 3-3 for the Write-Protect Functionality Matrix. This latch must be set before any write operation w ill be completed internally. The WREN instruction will set the latch, and the WRDI will reset the latch.

FIGURE 3-4: WRITE ENABLE SEQUENCE

0 2345671

SCK

010000 01

High-impedance

The following is a list of conditions under which the write enable latch will be reset:

• Power-up

• WRDI instruction successfully executed

• WRSR instruction successfully executed

• WRITE instruction successfully executed

FIGURE 3-5: WRITE DISABLE SEQUENCE

0 2345671

SCK

010000 01

High-impedance

 2004 Microchip Technology Inc. DS21227E-page 9

25AA320/25LC320/25C320

3.5 Read Status Register Instruction (RDSR)

The Read Status Register instruction (RDSR) provides access to the Status register. The Status register may be read at any time, even during a write cycle. The Status register is formatted as follows:

76543 2 1 0

WPEN X X X BP1 BP0 WEL WIP

The Write-In-Process (WIP) bit indicates whether the 25XX320 is busy with a write operation. When set to a

1’, a write is in progress; when set to a ‘0’, no write is

‘ in progress. This bit is read-only.

The Wri te Enable Lat ch (WEL) bit indicat es the st atus of the write enable latch. When set to a ‘ allows writes to the array, when set to a ‘ prohibits writes to the array. The state of this bit can always be updated via the WREN or WRDI comma nds regardless of the state of write protection on the Status register. This bit is read-only.

The Block Protection (BP0 and BP1) bits indicate which blocks are currently write-protected. These bits are set by the user issuing the WRSR instruction. These bits are nonvolatile.

See Figure 3-6 for the RDSR timing sequence.

FIGURE 3-6: READ STATUS REGISTER TIMING SEQUENCE

0 2345671

SCK

instruction

9101112131415

1’, the latch 0’, the latch

High-impedance

11000000

data from Status register

7654 210

DS21227E-page 10  2004 Microchip Technology Inc.

25AA320/25LC320/25C320

3.6 Write Status Register Instruction (WRSR)

The Write S t atus Regis ter inst ruction (WRSR) all ows the user to select one of four levels of protection for the array by writing to the appropriate bits in the Status register. The array is divided up into four segments. The user has the ability to write-prote ct none, one , two, or all four of the segment s of th e array. The partitioning is controlled as shown in Table 3-2.

The Write-Protect Enable (WPEN) bit is a nonvolatile bit that is available as an enable bi t for the WP Write-Protect (WP (WPEN) bit in the Status register control the programmable hardware write-protect feature. Hardware write protection is enabled when WP WPEN bit is high. Hardw are write protec tion is disa bled when either the WP pin is high or the WPEN bit is low.

) pin and the Write-Protect Enable

pin is low and the

pin. The

When the chip is hardware write-protected, only writes to nonvolatile bits in the Status register are disabled. See T abl e 3-3 for a matrix of functionalit y on the WPEN bit.

See Figure 3-7 for the WRSR timing sequence.

TABLE 3-2: ARRAY PROTECTION

BP1 BP0

00 01

FIGURE 3-7: WRITE STATUS REGISTER TIMING SEQUENCE

Array Addresses

Write-Protected

none

upper 1/4

(0C00h - 0FFFh)

upper 1/2

(0800h - 0FFFh)

all

(0000h - 0FFFh)

SCK

0 2345671

9101112131415

instruction data to Status register

01000000

High-impedance

7654

210

 2004 Microchip Technology Inc. DS21227E-page 11

25AA320/25LC320/25C320

3.7 Data Protection

The following protection has been implemented to prevent in advertent writes to the array:

• The write enable latch is reset on power-up

•A WRITE ENABLE instruction must be issued to set the write enable latch

• After a byte write, page write or Status register write, the write enable latch is reset

must be set high after the proper number of

•CS clock cycles to start an internal write cycle

• Access to the array during an internal write cycle is ignored and programming is continued

3.8 Power-On State

The 25XX320 powers on in the following state:

• The device is in low-power Standby mode =1)

(CS

• The write enable latch is reset

• SO is in high-impedance state

• A low level on CS

is required to enter active state

TABLE 3-3: WRITE-PROTECT FUNCTIONALITY MATRIX

WPEN WP WEL Protected Blocks Unprotected Blocks Status Register

xx0 0x1 1 x

Low

High

1 1

Protected Protected Protected Protected Writable Writable Protected Writable Protected Protected Writable Writable

DS21227E-page 12  2004 Microchip Technology Inc.

4.0 PACKAGING INFORMATION

4.1 Package Marking Information

25AA320/25LC320/25C320

8-Lead PDIP (300 mil)

XXXXXXXX

XXXXXNNN

YYWW

8-Lead SOIC (150 mil)

XXXXXXXX

XXXXYYWW

NNN

8-Lead TSSOP

XXXX

XYWW

NNN

Example:

25LC320

/PNNN

YYWW

Example:

25LC320

I/SNYYWW

NNN

Example:

5LBX

IYWW

NNN

14-Lead TSSOP

XXXXXXXX

YYWW

NNN

Legend: XX...X Customer specific information*

Y Year code (last digit of calendar year) YY Year code (last 2 digits of calendar year) WW Week code (week of January 1 is week ‘01’) NNN Alphanumeric traceability code

Note: In the event the full Microchi p pa rt numbe r cannot be marke d on one li ne, it wi ll

be carried over to the next line thus limiti ng the number of available characters for customer specific information.

* Standard marking consists of Microchip part number, year code, week code, and traceability code. For

device markings beyond this, certain price adders apply. Please check with your Microchip Sales Office. For QTP devices, any special marking adders are included in QTP price.

Example:

25L32

YYWW

NNN

 2004 Microchip Technology Inc. DS21227E-page 13

25AA320/25LC320/25C320

8-Lead Plastic Dual In-line (P) – 300 mil (PDIP)

Number of Pins Pitch Top to Seating Plane A .140 .155 .170 3.56 3.94 4.32 Molded Package Thickness A2 .115 .130 .145 2.92 3.30 3.68 Base to Seating Plane A1 .015 0.38 Shoulder to Shoulder Width E .300 .313 .325 7.62 7.94 8.26 Molded Package Width E1 .240 .250 .260 6.10 6.35 6.60 Overall Length D .360 .373 .385 9.14 9.46 9.78 Tip to Seating Plane L .125 .130 .135 3.18 3.30 3.43 Lead Thickness Upper Lead Width B1 .045 .058 .070 1.14 1.46 1.78 Lower Lead Width B .014 .018 .022 0.36 0.46 0.56 Overall Row Spacing § eB .310 .370 .430 7.87 9.40 10.92 Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-001 Drawing No. C04-018

Dimension Limits MIN NOM MAX MIN NOM MAX

Units INCHES* MILLIMETERS

n p

α β

.008 .012 .015 0.20 0.29 0.38

.100 2.54

51015 51015 51015 51015

DS21227E-page 14  2004 Microchip Technology Inc.

25AA320/25LC320/25C320

8-Lead Plastic Small Outline (SN) – Narrow, 150 mil (SOIC)

Number of Pins Pitch

Standoff §

Foot Angle Lead Thickness

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side. JEDEC Equivalent: MS-012 Drawing No. C04-057

45°

n p

α β

048048

MILLIMETERSINCHES*Units

MAXNOMMINMAXNOMMINDimension Limits

1.27.050

1.751.551.35.069.061.053AOverall Height

1.551.421.32.061.056.052A2Molded Package Thickness

0.250.180.10.010.007.004

6.206.025.79.244.237.228EOverall Width

3.993.913.71.157.154.146E1Molded Package Width

5.004.904.80.197.193.189DOverall Length

0.510.380.25.020.015.010hChamfer Distance

0.760.620.48.030.025.019LFoot Length

0.250.230.20.010.009.008

0.510.420.33.020.017.013BLead Width 1512015120 1512015120

 2004 Microchip Technology Inc. DS21227E-page 15

25AA320/25LC320/25C320

8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

n p

α β

048048

Number of Pins Pitch

Standoff §

Foot Angle Lead Thickne ss

Mold Draft Angle Top Mold Draft Angle Bottom

* Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-086

MILLIMETERS*INCHESUnits

0.65.026

MAXNOMMINMAXNOMMINDimension Limits

1.10.043AOverall Height

0.950.900.85.037.035.033A2Molded Package Thickness

0.150.100.05.006.004.002

6.506.386.25.256.251.246EOverall Width

4.504.404.30.177.173.169E1M olded Package Width

3.103.002.90.122.118.114DMolded Package Length

0.700.600.50.028.024.020LFoot Length

0.200.150.09.008.006.004

0.300.250.19.012.010.007BLead Width 10501050 10501050

DS21227E-page 16  2004 Microchip Technology Inc.

25AA320/25LC320/25C320

14-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm (TSSOP)

Number of Pins Pitch

Molded Package Thickness

Foot Angle Lead Thickne ss

Mold Draft Angle Top Mold Draft Angle Bottom * Controlling Parameter

§ Significant Characteristic Notes:

Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .005” (0.127mm) per side. JEDEC Equivalent: MO-153 Drawing No. C04-087

n p

α β

MILLIMETERS*INCHESUnits

0.65.026

A2A1

MAXNOMMINMAXNOMMINDimension Limits

1414

1.10.043AOverall Height

0.950.900.85.037.035.033

0.150.100.05.006.004.002A1Standoff §

6.506.386.25.256.251.246EOverall Width

4.504.404.30.177.173.169E1M olded Package Width

5.105.004.90.201.197.193DMolded Package Length

0.700.600.50.028.024.020LFoot Length 840840

0.200.150.09.008.006.004

0.300.250.19.012.010.007BLead Width

10501050 10501050

 2004 Microchip Technology Inc. DS21227E-page 17

25AA320/25LC320/25C320

APPENDIX A: REVISION HISTORY

Revision D

Corrections to Section 1.0, Electrical Characteristics.

Revision E

Revise Endurance from 100K to 1M.

DS21227E-page 18  2004 Microchip Technology Inc.

25AA320/25LC320/25C320

ON-LINE SUPPORT

Microchip provides on-line support on the Microchip World Wide Web site.

The web site is used b y Mic rochip as a me ans to m ake files and information easily available to customers. To view the site, the use r must have access to the Intern et and a web browser, such as Netscape Internet Explorer. Files are also available for FTP download from our FTP site.

Connecting to the Microchip Internet Web Site

The Microchip web site is available at the following URL:

www.microchip.com

The file transfer site is available by using an FTP service to connect to:

ftp://ftp.microchip.com

The web site and file transfer site provide a variety of services. Users may download files for the latest Development Tools, Data Sheets, Application Notes, User's Guides, Articles and Sample Programs. A variety of Micr ochip specific bu siness informatio n is also available, including listings of Microchip sales offices, distributors and factory representatives. Other data available for consideration is:

• Latest Microchip Press Releases

• Technical Support Section with Frequently Asked Questions

• Design Tips

• Device Errata

• Job Postings

• Microchi p Consultant Pr ogram Member Listing

• Links to other useful web sites related to Microchip Products

• Conferences for p roducts, D evelopment Systems, technical information and more

• Listing of seminars and events

or Microsoft

SYSTEMS INFORMATION AND UPGRADE HOT LINE

The Systems Information and Upgrade Line provides system users a listing of the latest versions of all of Microchip's development systems software products.

Plus, this line provides information on how customers can receive the most c urrent upgrade kit s. The Hot Line Numbers are:

1-800-755-2345 for U.S. and most of Canada, and 1-480-792-7302 for the rest of the world.

042003

 2004 Microchip Technology Inc. DS21227E-page 19

25AA320/25LC320/25C320

READER RESPONSE

It is our intentio n to pro vi de you with the best documentation possible to ens ure suc c es sfu l u se of y ou r M ic roc hip product. If you wish to provid e your c omment s on org anizatio n, clarity, subject matter , and ways in w hich o ur document atio n can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.

Please list the following information, and use this outline to provide us with your comments about this document.

To: RE: Reader Response From:

Application (optional): Would you like a reply? Y N

Device: Literature Number: Questions:

1. What are the best features of this document?

2. How does this document meet your hardware and software development needs?

3. Do you find the organization of this document easy to follow? If not, why?

Technical Publications Manager

Name Company

Address City / State / ZIP / Country

Telephone: (_______) _________ - _________

Total Pages Sent ________

FAX: (______) _________ - _________

DS21227E25AA320/25LC320/25C320

4. What additions to the document do you think would enhance the structure and subject?

5. What deletions from the document could be made without affecting the overall usefulness?

6. Is there any incorrect or misleading information (what and where)?

7. How would you improve this document?

DS21227E-page 20  2004 Microchip Technology Inc.

25AA320/25LC320/25C320

PRODUCT IDENTIFICATION SYSTEM

To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.

PART NO. X /XX

Device

Range

Device: 25AA320: 32 Kbit 1.8V SPI Serial EEPROM

25AA320T: 32 Kbit 1.8V SPI Serial EEPROM

25AA320X 32-bit 1.8V SPI Serial EEPROM

25AA320XT 32-bit 1.8V SPI Serial EEPROM

25LC320: 32 Kbit 2.5V SPI Serial EEPROM 25LC320T: 32 Kbit 2.5V SPI Serial EEPROM

25LC320X 32-bit 2.5V SPI Serial EE PROM

25LC320XT 32-bit 2.5V SPI Serial EEPROM

25C320: 32 Kbit 5V SPI Serial EEPROM 25C320T: 32 Kbit 5V SPI Serial EEPROM

25C320X 32-bit 5V SPI Serial EEPROM

25C320XT 32-bit 5V SPI Serial EEPROM

PackageTemperature

(Tape and Reel)

in alternate pinout (ST only)

in alternate pinout Tape and Reel (ST only)

(Tape and Reel)

in alternate pinout (ST only)

in alternate pinout Tape and Reel (ST only)

(Tape and Reel)

in alternate pinout (ST only)

in alternate pinout Tape and Reel (ST only)

Examples: a) 25LC320-I/SN: Industrial Temp.,

SOIC package

b) 25LC320T-I/SN: Tape and Reel,

Industrial Temp., SOIC package

c) 25LC320-E/SN: Extended Temp.,

SOIC package

d) 25C320-I/SN: Industrial Temp.,

SOIC package

e) 25C320T-I/SN: Tape and Reel,

Industrial Temp., SOIC package

f) 25C320-I/ST: Industrial Temp.,

TSSOP package

g) 25C320-E/SN: Extended Temp.,

SOIC package

Temperature Range:

Package: P = Plastic DIP (300 mil body), 8-lead

I= -40°C to +85°C E= -40°C to +12 5 °C

SN = Plastic SOIC (150 mil body),

8-lead

ST = Plastic TSSOP (4.4 mm body),

8-lead

ST14 = Plastic TSSOP (4.4 mm body),

14-lead

Sales and Support

Data Sheets

Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recommended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:

1. Your local Microchip sales office

2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277

3. The Microchip Worldwide Site (www.microchip.com) Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.

New Customer Notification System

 2004 Microchip Technology Inc. DS21227E-page 21

25AA320/25LC320/25C320

NOTES:

DS21227E-page 22  2004 Microchip Technology Inc.

Note the following details of the code protection feature on Microchip devices:

• Microchip products meet the specification contained in their particular Microchip Data Sheet.

• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the intended manner and under normal conditions.

• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Most likely, the person doing so is engaged in theft of intellectual property.

• Microchip is willing to work with the customer who is concerned about the integrity of their code.

• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not mean that we are guaranteeing the product as “unbreakable.”

Code protection is constantly evolving. We at Microchip are com mitted to continuously improving the code protect ion f eatures of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digit al Mill ennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.

Information contained in this publication regarding device applications and the like is intended through suggestion only and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. No representation or warranty is given and no liability is assumed by Microchip Technology Incorporated with respect to the accuracy or use of such information, or infringement of patents or other intellectual property rights arising from such use or otherwise. Use of Microchip’s products as critical components in life support systems is not authorized except with express written approval by Microchip. No licenses are conveyed, implicitly or otherwise, under any intellectual property rights.

Trademarks

The Microchip name and logo, the Microchip logo, Accuron, dsPIC, K

EELOQ, microID, MPLAB, PIC, PICmicro, PICSTART,

PRO MATE, PowerSmart, rfPIC, and SmartShunt are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

AmpLab, FilterLab, MXDEV, MXLAB, PICMASTER, SEEVAL, SmartSensor and The Embedded Control Solutions Company are registered trademarks of Microchip Technology Incorporated in the U.S.A.

Analog-for-the-Digital Age, Application Maestro, dsPICDEM, dsPICDEM.net, dsPICworks, ECAN, ECONOMONITOR, FanSense, FlexROM, fuzzyLAB, In-Circuit Serial Programming, ICSP, ICEPIC, Migratable Memory, MPASM, MPLIB, MPLINK, MPSIM, PICkit, PICDEM, PICDEM.net, PICLAB, PICtail, PowerCal, PowerInfo, PowerMate, PowerTool, rfLAB, rfPICDEM, Select Mode, Smart Serial, SmartTel and Total Endurance are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries.

SQTP is a service mark of Microchip T echnology Incorporated in the U.S.A.

All other trademarks mentioned herein are property of their respective companies.

Printed on recycled paper.

Microchip received ISO/TS-16949:2002 quality system certification for its worldwide headquarters, design and wafer fabrication facilities in Chandler and Tempe, Arizona and Mountain View, California in October 2003. The Company’s quality system processes and procedures are for its PICmicro devices, Serial EEPROMs, microperipherals, nonvolatile memory and analog products. In addition, Microchip’s quality system for the design and manufacture of development systems is ISO 9001:2000 certified.

8-bit MCUs, KEELOQ

code hopping

 2004 Microchip Technology Inc. DS21227E-page 23

WORLDWIDE SALES AND SERVICE

AMERICAS

Corporate Office

2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-72 00 Fax: 480-792-7277 Technical Support: 480-792-7627 Web Address: www.microchip.com

Atlanta

3780 Mansell Road, Suite 130 Alpharetta, GA 30022 Tel: 770-640- 003 4 Fax: 770-640-0307

Boston

2 Lan Drive, Suite 120 Westford, MA 01886 Tel: 978-692- 384 8 Fax: 978-692-3821

Chicago

333 Pierce Road, Suite 180 Itasca, IL 60143 Tel: 630-285- 007 1 Fax: 630-285-0075

Dallas

16200 Addison Road, Suite 255 Addison Plaza Addison, TX 75001 Tel: 972-818- 742 3 Fax: 972-818-2924

Detroit

Tri-Atria Office Building 32255 Northwestern Highway, Suite 190 Farmington Hills, MI 48334 Tel: 248-538- 225 0 Fax: 248-538-2260

Kokomo

2767 S. Albright Road Kokomo, IN 46902 Tel: 765-864- 836 0 Fax: 765-864-8387

Los Angeles

25950 Acero St., Suite 200 Mission Viejo, CA 92691 Tel: 949-462- 952 3 Fax: 949-462-9608

San Jose

1300 Terra Bella Avenue Mountain View, CA 94043 Tel: 650-215- 144 4 Fax: 650-961-0286

Toronto

6285 Northam Drive, Suite 108 Mississauga, Ontario L4V 1X5, Cana da Tel: 905-673- 069 9 Fax: 905-673-6509

ASIA/PACIFIC

Australia

Microchip Technology Australia Pty Ltd Unit 32 41 Rawson Street Epping 2121, NSW Sydney, Australia Tel: 61-2-986 8-6 73 3 Fax: 61-2-9868-6755

China - Beijing

Unit 706B Wan Tai Bei Hai Bldg. No. 6 Chaoyangmen Bei Str. Beijing, 100027, China Tel: 86-10-85 282 10 0 Fax: 86-10-85282104

China - Chengdu

Rm. 2401-2402, 24th Floor, Ming Xing Financial Tower No. 88 TIDU Street Chengdu 610016, China Tel: 86-28-86 766 20 0 Fax: 86-28-86766599

China - Fuzhou

Unit 28F, World Trade Plaza No. 71 Wusi Road Fuzhou 350001, China Tel: 86-591-7 503 50 6 Fax: 86-591-7503521

China - Hong Kong SAR

Unit 901-6, Tower 2, Metroplaza 223 Hing Fong Road Kwai Fong, N.T., Hong Kong Tel: 852-2401 -12 00 Fax: 852-2401-3431

China - Shanghai

Room 701, Bldg. B Far East International Plaza No. 317 Xian Xia Road Shanghai, 200051 Tel: 86-21-62 75- 57 00 Fax: 86-21-6275-5060

China - Shenzhen

Rm. 1812, 18/F, Building A, United Plaza No. 5022 Binhe Road, Futian District Shenzhen 518033, China Tel: 86-755-8 290 13 80 Fax: 86-755-8295-1393

China - Shunde

Room 401, Hongjian Building, No. 2 Fengxiangnan Road, Ronggui Town, Shunde District, Foshan City, Guangdong 528303, China Tel: 86-757-28395507 Fax: 86-757-28395571

China - Qingdao

Rm. B505A, Fullhope Plaza, No. 12 Hong Kong Central Rd. Qingdao 266071, China Tel: 86-532-5027355 Fax: 86-532-5027205

India

Divyasree Chambers 1 Floor, Wing A (A3/A4) No. 11, O’Shaugnessey Road Bangalore, 560 025, India Tel: 91-80-22 290 06 1 Fax: 91- 80 -22 29 006 2

Japan

Yusen Shin Yokohama Building 10F 3-17-2, Shin Yokohama, Kohoku-ku, Yokohama, Kanagawa, 222-0033, Japan Tel: 81-45-47 1- 616 6 Fax: 81-4 5-4 71 -6122

Korea

168-1, Youngbo Bldg. 3 Floor Samsung-Dong, Kangnam-Ku Seoul, Korea 135-882 Tel: 82-2-554-7200 Fax: 82-2-558-5932 or 82-2-558-5934

Singapore

200 Middle Road #07-02 Prime Centre Singapore, 188980 Tel: 65-6334-8870 Fax: 65-6334-8850

Taiwan

Kaohsiung Branch 30F - 1 No. 8 Min Chuan 2nd Road Kaohsiung 806, Taiwan Tel: 886-7-536-4816 Fax: 886-7-536-4817

Taiwan

Taiwan Branch 11F-3, No. 207 Tung Hua North Road Taipei, 105, Taiwan Tel: 886-2-2717-7175 Fax: 886-2-2545-0139

Taiwan

Taiwan Branch 13F-3, No. 295, Sec. 2, Kung Fu Road Hsinchu City 300, Taiwan Tel: 886-3-572-9526 Fax: 886-3-572-6459

EUROPE

Austria

Durisolstrasse 2 A-4600 Wels Austria Tel: 43-7242-2244-399 Fax: 43-7242-2244-393

Denmark

Regus Business Centre Lautrup hoj 1-3 Ballerup DK-2750 Denmark Tel: 45-4420-9895 Fax: 45-4420-9910

France

Parc d’Activite du Moulin de Massy 43 Rue du Saule Trapu Batiment A - ler Etage 91300 Massy, France Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79

Germany

Steinheilstrasse 10 D-85737 Ismaning, Germany Tel: 49-89-627-144-0 Fax: 49-89-627-144-44

Italy

Via Salvatore Quasimodo, 12 20025 Legnano (MI) Milan, Italy Tel: 39-0331-742611 Fax: 39-0331-466781

Netherlands

Waegenburghtplein 4 NL-5152 JR, Drunen, Netherlands Tel: 31-416-690399 Fax: 31-416-690340

United Kingdom

505 Eskdale Road Winnersh Triangle Wokingham Berkshir e, England RG41 5T U Tel: 44-118-921-5869 Fax: 44-118-921-5820

07/12/04

DS21227E-page 24  2004 Microchip Technology Inc.

MICROCHIP 25AA320, 25LC320, 25C320 Technical data

Specifications and Main Features

Frequently Asked Questions

User Manual

1.0 ELECTRICAL CHARACTERISTICS

2.0 PIN DESCRIPTIONS

3.0 FUNCTIONAL DESCRIPTION

TABLE 3-1: INSTRUCTION SET

TABLE 3-3: WRITE-PROTECT FUNCTIONALITY MATRIX

4.0 PACKAGING INFORMATION

ON-LINE SUPPORT

SYSTEMS INFORMATION AND UPGRADE HOT LINE

READER RESPONSE

PRODUCT IDENTIFICATION SYSTEM

Trademarks

WORLDWIDE SALES AND SERVICE