MICROCHIP 24AA32A, 24LC32A Technical data

24AA32A/24LC32A
)
32K I2C™ Serial EEPROM
Device Selection Table
Part
Number
24AA32A 1.8-5.5 400kHz 24LC32A 2.5-5.5 400 kHz I, E
Note 1: 100 kHz for VCC <2.5V
VCC
Range
Max Clock Frequency
(1)
Temp
Ranges
I
Features
• Single supply with operation down to 1.8V
• Low-power CMOS technology
- 1 mA active current typical
-1µA standby current (max.) (I-temp)
• 2-wire serial interface bus, I
• Cascadable for up to eight devices
• Schmitt Trigger inputs for noise suppression
• Output slope control to eliminate ground bounce
• 100 kHz (<2.5V) and 400 kHz (≥2.5V) compatibility
• Self-timed write cycle (including auto-erase)
• Page write buffer for up to 32 bytes
• 2 ms typical write cycle time for page write
• Hardware write-protect for entire memory
• Can be operated as a serial ROM
• Factory programming (QTP) available
• ESD protection > 4,000V
• 1,000,000 erase/write cycles
• Data retention > 200 years
• 8-lead PDIP, SOIC, TSSOP and MSOP packages
• Standard and Pb-free finishes available
• Available temperature ranges:
- Industrial (I): -40°C to +85°C
- Automotive (E): -40°C to +125°C
2
C™ compatible
Description
The Microchip Technology Inc. 24AA32A/24LC32A (24XX32A*) is a 32 Kbit Electrically Erasable PROM. The device is organized as four blocks of 8K x 8-bit memory with a 2-wire serial interface. Low-voltage design permits operation down to 1.8V, with standby and active currents of only 1 µA and 1 mA, respectively. It has been developed for advanced, low­power applications such as personal communications or data acquisit ion. The 24XX32A also has a page wri te capability for up to 32 bytes of dat a. Function al address lines allow up to eight devices on the same bus, for up to 256 Kbits address space. The 24XX32A is available in the standard 8-pin PDIP, surface mount SOIC, TSSOP and MSOP packages.
Package Types
PDIP/SOIC/TSSOP/MSOP
A0 A1 A2
Vss
1 2 3 4
24XX32
8
Vcc
7
WP
6
SCL
5
SDA
ROTATED TSSOP
(24AA32AX/24LC32AX
24XX32X
WP Vcc
A0 A1
1 2 3 4
8 7 6 5
SCL SDA Vss A2
Block Diagram
A0
Control
Logic
I/O
SDA
I/O
A1WPA2
Memory Control
Logic
SCL
XDEC
HV Generator
EEPROM
Array
Page Latches
YDEC
Vcc
SS
V
*24XX32A is used in this document as a generic part number for the 24AA32A/24LC32A devices.
2003 Microchip Technology Inc. DS21713D-page 1
Sense Amp.
R/W Control
24AA32A/24LC32A

1.0 ELECTRICAL CHARACTERISTICS

Absolute Maximum Ratings
(†)
VCC.............................................................................................................................................................................6.5V
All inputs and outputs w.r.t. V
SS ......................................................................................................... -0.3V to VCC +1.0V
Storage temperature ...............................................................................................................................-65°C to +150°C
Ambient temperature with power applied................................................................................................-65°C to +125°C
ESD protection on all pins ......................................................................................................................................................≥ 4kV
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at those or any other conditions above those indica ted in the opera tional li stings of this sp ecification is not i mplied. Ex posure to maximum rating conditions for extended periods may affect device reliability.

TABLE 1-1: DC CHARACTERISTICS

CC = +1.8V to +5.5V
V
DC CHARACTERISTICS
Param.
No.
D1 V
Symbol Characteristic Min Typ Max Units Conditions
IH WP, SCL and SDA pins ———
D2 High-level input voltage 0.7 VCC ——V D3 VIL Low-level input voltage 0.3 VCC V— D4 V
HYS Hysteresis of Schmitt
Trigger inputs D5 V D6 I
OL Low-level output voltage 0.40 V IOL = 3.0 mA, VCC = 2.5V
LI Input leakage current ——±1µAVIN =.1V to VCC
D7 ILO Output leakage current ——±1µAVOUT =.1V to VCC D8 CIN,
C
OUT
Pin capacitance
(all inputs/outpu t s) D9 ICC write Operating current —0.13mAVCC = 5.5V, SCL = 400 kHz D10 ICC read 0.05 1 mA — D11 I
CCS Standby current
Note 1: This parameter is periodically sampled and not 100% tested.
2: Typical measurements taken at room temperature.
Industrial (I): T Automotive (E): T
A = -40°C to +85°C A = -40°C to +125°C
0.05 VCC ——V(Note 1)
——10pFVCC = 5.0V (Note 1)
T
A = 25°C, FCLK = 1 MHz
0.01 —
1 5
µAµAIndustrial
Automotive SDA = SCL = V WP = VSS
CC
DS21713D-page 2 2003 Microchip Technology Inc.
24AA32A/24LC32A
TABLE 1-2: AC CHARACTERISTICS
CC = +1.8V to +5.5V
V
AC CHARACTERISTICS
Param.
No.
1F
Symbol Characteristic Min Max Units Conditions
CLK Clock frequency
2 THIGH Clock high time 600
3TLOW Clock low time 1300
4T
R SDA and SCL rise time
(Note 1)
5TF SDA and SCL fall time 300 ns (Note 1) 6T
HD:STA Start condition hold time 600
7TSU:STA Start condition setup time 600
8THD:DAT Data input hold time 0 ns (Note 2) 9TSU:DAT Data input setup time 100
10 TSU:STO Stop condition setup time 600
11 T
AA Output valid from clock
(Note 2)
12 TBUF Bus free time: Time the bus
must be free before a new transmissi on can start
13 T
OF Output fall time from VIH
minimum to V
IL maximum
14 TSP Input filter spike suppression
(SDA and SCL pins)
15 T
WC Write cycle time (byte or
page) 16 Endurance 1M cycles 25°C, (Note 4) Note 1: Not 100% tested. C
B = total capacitance of one bus line in pF.
2: As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region
(minimum 300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
3: The combined T
SP and VHYS specificat io ns are due to new Schm it t Trigger inputs which provide improved
noise spike suppression. This eliminates the need for a
4: This parameter is not tested but ensured by character ization. For enduranc e estimates in a specific
application, please consult the Total Endurance™ Model which can be obtained on Microchip’s web site: www.microchip.com.
Industrial (I): T Automotive (E): T
4000
4700
— —
4000
4700
250
4000
— —
1300 4700
20+0.1C
B
A = -40°C to +85°C A = -40°C to +125°C
400
kHz 2.5V VCC 5.5V
100
ns 2.5V VCC 5.5V
— —
ns 2.5V VCC 5.5V
300
ns 2.5V VCC 5.5V
1000
ns 2.5V VCC 5.5V
— —
ns 2.5V VCC 5.5V
ns 2.5V VCC 5.5V
— —
ns 2.5V VCC 5.5V
900
ns 2.5V VCC 5.5V
3500
ns 2.5V VCC 5.5V
250
ns 2.5V V
250
1.8V V
1.8V V
1.8V V
1.8V V
1.8V V
1.8V V
1.8V V
1.8V V
1.8V V
1.8V V
1.8V V
—50ns(Notes 1 and 3)
—5ms
TI specification for standard operation.
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC < 2.5V (24AA32A)
CC 5.5V CC < 2.5V (24AA32A)
2003 Microchip Technology Inc. DS21713D-page 3
24AA32A/24LC32A
FIGURE 1-1: BUS TIMING DATA
SCL
SDA
IN
SDA
OUT
5
3
7
6
14
2
FIGURE 1-2: BUS TIMING START/STOP
SCL
7
SDA
6
4
8
9
11
D4
10
12
10
Start Stop
DS21713D-page 4 2003 Microchip Technology Inc.
24AA32A/24LC32A
)

2.0 FUNCTIONAL DESCRIPTION

The 24XX32A supports a bidirectional, 2-wire bus and data transmission protocol. A device that sends data onto the bus i s defined as t ransmitter, while a de vice receiving data is defined as a receiver. The bus has to be controlled by a master device which generates the serial clock (SCL), controls the bus access and gener­ates the Start and Stop conditions, while the 24XX32A works as slave. Both master and slave can operate as transmitter or receiver, but the master device deter­mines which mode is activ ated.

3.0 BUS CHARACTERISTICS

The following bus protocol has been defined:
• Data transfer may be initiated only when the bus is not busy.
• During data transfer, the data line must remain stable wheneve r the c lock lin e is high . Changes i n the data line while the clock line is high will be interpreted as a Start or Stop condition.
Accordingly, the following bus conditions have been defined (Figure 3-1).
3.1 Bus not Busy (A)
Both data and clock lines remain high.
3.2 Start Data Transfer (B)
A high-to-low transition of the SDA line while the clock (SCL) is high determines a Start condition. All com­mands must be preceded by a Start condition.
3.3 Stop Data Transf er (C)
A low-to-high transition of the SDA line while the clock (SCL) is high determines a Stop condition. All opera­tions must be ended with a Stop condition.
3.4 Data Valid (D)
The state of the data line represents valid data when, after a Start condition, the data line is stable for the duration of the high period of the clock signal.
The data on the line must be changed during the low period of the clock signal. There is one clock pulse per bit of data.
Each data transfer is initiated with a S tart condition and terminated with a Stop condition. The number of data bytes transferred between Start and Stop conditions is determined by the master device and is, theoretically unlimited, (althoug h only the la st thirty two by tes will be stored when doing a write operation). When an over­write does occur it will replace data in a first-in first-out (FIFO) fashion.
3.5 Acknowledge
Each receiving device, when addressed, is obliged to generate an acknowledge after the reception of each byte. The ma ster devi ce m ust gener at e an ex tr a cloc k pulse which is associated with this Acknowledge bit.
Note: The 24XX32A does not generate any
Acknowledge bits if an internal programming cycle is in progress.
The device that acknowledges, has to pull down the SDA line during the Acknowl edge cloc k pulse in s uch a way that the SDA line is stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. During reads, a master must signal an end of data to the sla ve by no t gene rating a n Ack nowl edge b it on the last byte that has be en c loc ke d ou t of th e sl av e. In this case, the slave (24XX32A) will leave the data line high to enable the master to generate the Stop condition.
FIGURE 3-1: DAT A TRANSFER SEQUENCE ON THE SERIAL BUS
SCL
SDA
2003 Microchip Technology Inc. DS21713D-page 5
(A) (B) (D) (D) (A
START
CONDITION
ADDRESS OR
ACKNOWLEDGE
VALID
DATA
ALLOWED
TO CHANGE
(C)
STOP
CONDITION
24AA32A/24LC32A
it
3.6 Device Addressing
A control byte is the first byte received following the Start condition from the master device (Figure 3-2). The control byte co nsi sts of a four-bit control cod e. For the 24XX32A, this is set as ‘1010’ binary for read and write operations. The ne xt th ree bits of the control byte are the Chi p Sel ect bits ( A2, A 1, A 0). T he Chip Sele ct bits allow the use of up to eight 24XX32A devices on the same bus and are used to select which device is accessed. The Chip Select bits in the control byte must correspond to the logic lev els on the corresp onding A2, A1, and A0 pins for the device to respond. These bits are in effect the three Most Significant bits of the word address.
The last bit of the control byte defines the operation to be performed. When set to a ‘1’, a read op eration is selected. When set to a zero, a write operation is selected. The next two bytes received define the address of the first data byte (Figure 3-3). Because only A1 1 to A0 are use d, the upper four ad dress bits are don’t care bits. The upper address bits are transferred first, followed by the less significant bits.
Following the Start condition, the 24XX32A monitors the SDA bus checking the device type identifier being transmitted and, upon receiving a ‘1010’ code and appropriate device s elect b its , the s lave d evice outputs an Acknowledge si gnal on the SD A line. Dependi ng on the state of the R/W or write operation.
bit, the 24XX32A will selec t a read
FIGURE 3-2: CONTROL BYTE FORMAT
Read/Write Bit
Control Code
1 0 1 0 A2 A1 A0SACK
Slave Address
Start Bi t
Chip Select
Bits
R/W
Acknowledge Bit
3.7 Contiguous Addressing Across Multiple Devices
The Chip Select bits A2, A1, A0 can be used to expand the contiguous address space for up to 256K bits by adding up to eight 24XX32A's on the same bus. In this case, software can use A0 of the control byte address bit A12, A1 as address bit A13, and A2 as address bit A14. It is not possible to sequentially read across device boundaries.
as
FIGURE 3-3: ADDRES S SEQUENCE BI T ASSIGN MENTS
CONTROL BYTE ADDRESS HIGH BYTE ADDRESS LOW BYTE
1010
CONTROL
CODE
A2A1A
CHIP
SELECT
BITS
R/W XXXX
0
A11A10A
9
A
8
A
••••••
7
X = Don’t Care B
A 0
DS21713D-page 6 2003 Microchip Technology Inc.
24AA32A/24LC32A

4.0 WRITE OPERATIONS

4.1 Byte Write
Following the Start condition from the master, the control code (4 bits), the Chip Select (3 bits), and the R/W bit (which is a lo gic low) ar e clo cke d on to t he b us by the master transmitter. This indicates to the addressed slave r eceiver that the add ress high byte will follow once it has ge nerated an Acknowle dge bit during the ni nth cloc k cycle. Therefor e, the n ext byte transmitted by the master is the high-order byte of the word address and will be written into the address pointer of the 24XX32A. The next byte is the Least Significant Address Byte. After receiving another Acknowledge signal from the 24XX32A, the master device will transmit the data word to be written into the addressed memory loc ation. The 24XX3 2A acknowl­edges again and the master generates a Stop condition. This init iates the internal write cycle and, during this time, the 24XX32A will not generate Acknowledge signals (Figure 4-1). If an attempt is made to write to the array with the WP pin held high, the device will acknowledge the command but no write cycle will occur. No data will be writte n and the device will immediately accept a new command. After a byte Write command, the internal address counter will point to the address location following the one that was just written.
4.2 Page Write
The write control byte, word address and the first data byte are transmitted to the 24XX32A in the same way as in a byte write. However, instead of generating a Stop co ndition, th e master tra nsmits up to 31 add itional bytes whic h are tempor arily stored in the on-chip page buffer and will be written into memory once the master has transmitted a Stop condition. Upon receipt of each word, the five lower-address pointer bits are internally increment ed by ‘ 1’. If the master should transmit more than 32 bytes prior to gene rating the S top condition, th e address counter will roll over and the previously received data will be overwri tten. As w ith the by te writ e operation, once the Stop condition is received, an internal write cycle w ill begin (Figure4-2). If an attempt is made to write to th e array with the WP pin held hig h, the device will ac knowledge the command but no w ri te cycle will occur, no data will be written and the device will immediately accept a new command.
Note: Page write operatio ns are lim ited to wri ting
bytes within a single physical page, regardless of the number of bytes actually being written. Physical page boundaries start at addresses that are integer multiples of the page buf fer size (or ‘page size’) and, end at addresses that are integer multiples of [page size - 1]. If a Page Write command attempts to write across a physical page boundary, the result is that the data wraps around to the beginning of the current page (overwriting data previously stored there), instead of being written to the next p age as might be expected. It is therefore necessary for the application software to prevent page write operations that would attempt to cross a page boundary.
4.3 Write-Protection
The WP pin a llows t he user to wri te-prot ect the entire array (0000-0FFFF) when the pin is tied to V to V
SS or left floating, the write protection is disabled.
The WP pin is sampled at the Stop bit for every write command (Figure 3-1) Toggling the WP pin after the Stop bi t wil l hav e no ef fe ct on t he ex ecutio n o f the wr ite cycle.
2003 Microchip Technology Inc. DS21713D-page 7
CC. If tied
24AA32A/24LC32A

FIGURE 4-1: BYTE WRITE

BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY X = don’t care bit

FIGURE 4-2: PAGE WRITE

S
T BUS ACTIVITY MASTER
SDA LINE
BUS ACTIVITY X = don’t care bit
CONTROL
A
R
T
S10 10 0
S T
CONTROL
A R T
S1010 0
BYTE
A2A1A
0
A C K
BYTE
A
A1A
2
0
ADDRESS
HIGH BYTE
XXX
X
ADDRESS
HIGH BYTE
XXX
A C K
A C K
ADDRESS LOW BYTE
X
A C K
ADDRESS LOW BYTE DATA BYTE 0
A C K
S
DATA
A C K
DA TA BYTE 31
A C K
T O P
P
A C K
S T O P
P
A C K
DS21713D-page 8 2003 Microchip Technology Inc.
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